Electronic device

Abstract

This electronic device includes: a housing in which first heat dissipation fins are disposed on an outer surface thereof; a substrate arranged in the housing; and a first electronic component connected to the substrate and disposed in the housing, wherein concave grooves are disposed in the inner surface of the housing, and protrusions are disposed in a region of the outer surface of the housing, the region vertically overlapping the region where the grooves are formed, and at least a portion of the first electronic component is coupled to the grooves, and the first heat dissipation fins have a shape protruding from the surfaces of the protrusions.

Description

electronic devices

[0001] This embodiment relates to an electronic device.

[0002]

[0003] Recent power electronics technology demands high power and high power density. To achieve this, high power must be achieved by selectively configuring higher-power components to achieve higher efficiency while minimizing heat loss in miniaturized products.

[0004] Additionally, each component must be positioned to maximize space efficiency, while simultaneously considering factors such as insulation distances and power paths between components. In particular, seismic resistance and cooling performance are also important design factors, and they must be optimized to achieve high power density.

[0005] Examples of electronic components embedded within electronic devices include inductors for inductance and transformers for voltage conversion. These components are placed within a housing that forms the exterior of the electronic device. Electronic components generate heat when operated. This heat can overload individual electronic components, disrupting their function and potentially leading to malfunctions. Therefore, a structure or means for dissipating heat from components within electronic devices is required.

[0006]

[0007] The present invention has been proposed to improve the above-mentioned problems, and provides an electronic device capable of compactly combining electronic components in a space within a housing and improving heat dissipation efficiency.

[0008]

[0009] An electronic device according to the present embodiment comprises: a housing having a first heat dissipation fin arranged on an outer surface; a substrate arranged within the housing; and a first electronic component connected to the substrate and arranged within the housing, wherein a concave groove is arranged on an inner surface of the housing, and a protrusion is arranged in an area of ​​the outer surface of the housing that overlaps a region formed in the groove in a vertical direction, and at least a portion of the first electronic component is coupled to the groove, and the first heat dissipation fin has a shape protruding from a surface of the protrusion.

[0010] A second electronic component may be disposed on the surface of the substrate, and a second heat dissipation fin may be disposed on the outer surface of the housing so as to overlap the second electronic component in a vertical direction.

[0011] The outer surface of the housing includes a first surface and a second surface that are stepped in the vertical direction, and the second heat dissipation fin can be arranged on the first surface, and the first heat dissipation fin can be arranged on the second surface.

[0012] The above electronic component can overlap at least a portion of the first surface in a horizontal direction.

[0013] The first heat dissipation fin and the second heat dissipation fin are each disposed on the lower surface of the housing, and the vertical length of the first heat dissipation fin may be shorter than the vertical length of the second heat dissipation fin.

[0014] The first heat dissipation fin may be disposed on the lower surface of the housing, the groove may be disposed adjacent to one side of the housing, and the housing may include a third heat dissipation fin protruding from the one side.

[0015] The first heat dissipation fin and the second heat dissipation fin have a plate shape having a longitudinal direction in the second direction, and the first heat dissipation fin and the second heat dissipation fin are each provided in multiple numbers and can be arranged to be spaced apart from each other along the first direction perpendicular to the second direction.

[0016] It may include a fan disposed on one side of the first heat dissipation fin and the second heat dissipation fin to discharge air in the second direction.

[0017] The spacing between the first heat dissipation fin and the second heat dissipation fin may be greater than the spacing between the plurality of first heat dissipation fins or the spacing between the plurality of second heat dissipation fins.

[0018] The fan may overlap at least a portion of the area between the first heat dissipation fin and the second heat dissipation fin in the second direction.

[0019]

[0020] This embodiment has the advantage of allowing the driving heat of the electronic component to be easily radiated to the outside through the heat dissipation fin due to the vertical overlapping structure between the heat dissipation fin and the electronic component.

[0021] In addition, due to the horizontal overlapping structure between the electronic components and the plurality of heat dissipation fins, the heat generated by each of the plurality of electronic components through the arrangement area of ​​the heat dissipation fins can be dissipated in various directions.

[0022] In addition, since the vertical height of the space within the housing for arranging the electronic components can be reduced by the embedded structure of the electronic components within the housing, there is an advantage in that it is easy to miniaturize the electronic device.

[0023]

[0024] FIG. 1 is a perspective view showing the exterior of an electronic device according to a first embodiment of the present invention.

[0025] Figure 2 is a plan view showing the upper surface of an electronic device according to the first embodiment of the present invention.

[0026] Figure 3 is an exploded perspective view of an electronic device according to a first embodiment of the present invention.

[0027] Figure 4 is a drawing showing Figure 3 from a different angle.

[0028] FIGS. 5 to 10 are drawings showing the arrangement structure of electronic components in a housing according to the first embodiment of the present invention from various angles.

[0029] Fig. 11 is a drawing showing a modified example of the protrusion arrangement structure according to the first embodiment of the present invention.

[0030] Figure 12 is a perspective view showing the appearance of an electronic device according to a second embodiment of the present invention.

[0031] Figure 13 is an exploded perspective view of an electronic device according to a second embodiment of the present invention.

[0032] Figure 14 is a drawing showing Figure 13 from a different angle.

[0033] Fig. 15 is a perspective view showing the lower surface of a housing according to a second embodiment of the present invention.

[0034] Fig. 16 is a plan view showing the lower surface of a housing according to a second embodiment of the present invention.

[0035] FIGS. 17 to 21 are drawings showing the arrangement structure of electronic components from various angles to explain the heat dissipation structure of an electronic device according to a second embodiment of the present invention.

[0036]

[0037] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0038] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0039] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0040] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and / or at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0041] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0042] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0043] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0044] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0045] An electronic device according to the present embodiment includes a housing and electronic components arranged within the housing, and may include an electronic control unit, a converter, a pump and oil pump control unit, a charger, and the like. However, this is exemplary, and the electronic device may include various devices including at least one electronic component arranged within the housing.

[0046] FIG. 1 is a perspective view showing the exterior of an electronic device according to a first embodiment of the present invention, FIG. 2 is a plan view showing the upper surface of an electronic device according to the first embodiment of the present invention, FIG. 3 is an exploded perspective view of an electronic device according to the first embodiment of the present invention, FIG. 4 is a view showing FIG. 3 from a different angle, and FIGS. 5 to 10 are views showing the arrangement structure of electronic components in a housing according to the first embodiment of the present invention from various angles.

[0047] Referring to FIGS. 1 to 10, an electronic device (10) according to a first embodiment of the present invention may include a housing (100), a cover (200), a substrate (300), and electronic components (310, 330).

[0048] A housing (100) may form the outer shape of an electronic device (10). A space (102) for accommodating electronic components and a substrate (300) may be arranged within the housing (100). For example, the housing (100) includes a lower plate (110) and a side plate (120) that protrudes upward from an edge of the lower plate (110), and the space (102) may be partitioned from other areas by the upper surface of the lower plate (110) and the inner surface of the side plate (120). The housing (100) may be formed in a box shape with an open upper surface. The housing (100) may have a rectangular cross-sectional shape. When a cover (200) is coupled to the housing (100), the upper surface of the space (102) may be covered.

[0049] A groove (130) may be arranged on the inner surface of the housing (100) to which a first electronic component (310) to be described later is coupled. The groove (130) may have a shape that is more concave than other areas from the inner surface of the housing (100). As illustrated in FIG. 3, the groove (130) may have a shape that is more concave downward than other areas from the upper surface of the lower plate (110). When a plurality of first electronic components (310) are provided, a plurality of grooves (130) may be provided corresponding to the number of first electronic components (310) and may be arranged to be spaced apart from each other in the horizontal direction. Here, the horizontal direction may mean the first direction (X) or the second direction (Y) to be described later.

[0050] A plurality of grooves (130) in which a plurality of first electronic components (310) are arranged may be arranged closer to the edge of the housing (100) than the center of the housing (100). The plurality of grooves (130) may be arranged adjacent to the side plate (120). As described above, the housing (100) may have a rectangular cross-sectional shape. For example, the housing (100) may include a plurality of long sides and a plurality of short sides that are opposite to each other. In this case, the plurality of grooves (130) may be arranged adjacent to the side plate (120) arranged in an area forming a short side of the housing (100). At least one of the plurality of grooves (130) may also be arranged adjacent to the side plate (120) forming a long side of the housing (100).

[0051] A protrusion (135, see FIG. 7) may be arranged in an area corresponding to the arrangement area of ​​the groove (130) on the outer surface of the housing (100). The protrusion (135) may have a shape that protrudes more than other areas from the outer surface of the housing (100). As illustrated in FIG. 7, the protrusion (135) may have a shape that protrudes downward more than other areas from the lower surface of the lower plate (110). Accordingly, the lower surface of the housing (100) may include a plurality of surfaces that are stepped in the vertical direction. For example, the lower surface of the housing (100) may include a first surface (137) and a second surface that is stepped downward with respect to the first surface (137). The second surface may be the lower surface of the protrusion (135). At least a portion of the space within the groove (130), which is the arrangement area of ​​the first electronic component (310), may be arranged to overlap horizontally with the first surface (137).

[0052] A coupling surface (112) to which a second electronic component (330) to be described later is coupled may be arranged on the inner surface of the housing (100). The coupling surface (112) may be arranged on the lower plate (110). When a plurality of second electronic components (330) are provided, a plurality of coupling surfaces (112) may be provided corresponding to the number of second electronic components (330) and may be arranged in a horizontal direction. The coupling surface (112) may have a shape that is stepped upwards compared to other areas of the upper surface of the lower plate (110), but alternatively, it may be arranged to form the same plane as other areas of the upper surface of the lower plate (110).

[0053] A heat dissipation fin (140) may be arranged on the outer surface of the housing (100). The heat dissipation fin (140) may have a shape that protrudes outward from the outer surface of the housing (100) more than other areas. Heat dissipation can be facilitated by increasing the surface area of ​​the housing (100) through the heat dissipation fin (140).

[0054] The heat dissipation fin (140) may have a shape that protrudes downward from the lower surface of the lower plate (110). As illustrated in FIGS. 1 and 2, the heat dissipation fin (140) may have a plate shape. The heat dissipation fin (140) may be provided in plurality and arranged along a first direction (X). Each of the plurality of heat dissipation fins (140) may have a length direction in a second direction (Y) perpendicular to the first direction (X). The heat dissipation fin (140) may be arranged to overlap with the electronic components (310, 330) in the vertical direction. For example, the heat dissipation fin (140) may include a first heat dissipation fin (144) that overlaps with the first electronic component (310) in the vertical direction, and a second heat dissipation fin (142) that overlaps with the second electronic component (330) in the vertical direction. The first heat dissipation fin (144) and the second heat dissipation fin (142) can be arranged along the first direction (X).

[0055] As described above, a protrusion (135) may be arranged in an area corresponding to the formation area of ​​the groove (130) in which the first electronic component (310) is arranged on the lower surface of the housing (100). Accordingly, some of the heat dissipation fins (140) may be arranged to overlap with the protrusion (135). In this case, the formation area of ​​the heat dissipation fin (140) that overlaps with the protrusion (135) may have a shape that protrudes from the outer surface of the protrusion (135). Specifically, in the case of the first heat dissipation fin (144) that overlaps with the first electronic component (310) in the vertical direction, one area may have a shape that protrudes downward from the lower surface of the protrusion (135), and another area may be connected to the side surface of the protrusion (135) that protrudes from the lower surface of the lower plate (110). Accordingly, the surface area of ​​the protrusion (135) may increase through the first heat dissipation fin (144).

[0056] The vertical length of the first heat dissipation fin (144) protruding from the lower surface of the protrusion (135) may be shorter than the vertical length of the second heat dissipation fin (142) protruding from the first surface (137) of the housing (100). The lower surface of the first heat dissipation fin (144) may form the same plane as the lower surface of the second heat dissipation fin (142).

[0057] As illustrated in FIG. 4, a fan mounting space (119) may be arranged on the outer surface of the housing (100) facing one end of the heat dissipation fin (140). A fan (450, see FIG. 3) to be described later is arranged in the fan mounting space (119), and the fan (450) can generate air in a second direction (Y) toward the heat dissipation fin (140). In addition, the first direction (X) interval (147, see FIG. 1) between the first heat dissipation fin (144) and the second heat dissipation fin (142) is formed to be longer than the first direction (X) interval between the plurality of first heat dissipation fins (144) and the plurality of second heat dissipation fins (142), so that air is introduced through the fan (450) into the interval between the first heat dissipation fins (144) and the second heat dissipation fins (142), thereby increasing heat dissipation efficiency. The first direction (X) gap between the first heat dissipation fin (144) and the second heat dissipation fin (142) can be named an air inlet.

[0058] A third heat dissipation fin (150) may be arranged on a side surface of the housing (100). The third heat dissipation fin (150) may have a shape that protrudes from the side surface of the housing (100) in a first direction (X). The third heat dissipation fin (150) may be provided in multiple numbers and arranged along the second direction (Y). The side surface of the housing (100) on which the third heat dissipation fin (150) is arranged may be a side adjacent to an arrangement area of ​​a plurality of grooves (130). Accordingly, the third heat dissipation fin (150) may be arranged to overlap the first electronic component (310) along the first direction (X). When the first electronic component (310) is combined within the home (130), the first electronic component (310) can dissipate heat through multiple paths through the first heat dissipation fin (144) that overlaps in the vertical direction and the third heat dissipation fin (150) that overlaps in the first direction (X).

[0059] An electronic device (10) may include a cover (200). The cover (200) may be coupled to a housing (100). By coupling the cover (200), the upper surface of the space (102) within the housing (100) may be covered. The cover (200) may include a plate-shaped body and a rib (210, see FIG. 4) protruding from the lower end of the body. The ribs (210) may be provided in plurality and arranged along the edge of the body. A rib groove (105) into which the ribs (210) are coupled may be arranged on a side surface of the housing (100), so that coupling of the cover (200) to the housing (100) may be guided by coupling the ribs (210) and the rib groove (105).

[0060] An inner cover (250) may be placed on the lower surface of the cover (200). The inner cover (250) may be placed on the housing (100). The inner cover (250) includes a plurality of holes (252), and heat in the space (102) within the housing (100) may be discharged to the outside through the plurality of holes (252).

[0061] The electronic device (10) may include a substrate (300). The substrate (300) may be a printed circuit board (PCB). The substrate (300) is formed in a plate shape, and a plurality of elements for driving the electronic device (10) may be arranged on the upper or lower surface. The substrate (300) may be arranged in a space (102) within the housing (100).

[0062] The substrate (300) may be electrically connected to electronic components (310, 330). The electronic components (310, 330) may include a first electronic component (310) and a second electronic component (330). The first electronic component (310) may include an inductor for obtaining inductance or a transformer for voltage conversion. The first electronic component (310) may include a core and a coil wound on an outer surface of the core. The coil may extend to the outer side of the core and be electrically connected to the substrate (300). The second electronic component (330) may include a FET element. The second electronic component (330) may be mounted on the lower surface of the substrate (300) facing the lower plate (110). The first electronic component (310) and the second electronic component (330) can each generate heat by driving. The first electronic component (310) and the second electronic component (330) can each be provided in multiples.

[0063] Each of the plurality of first electronic components (310) may be coupled to the groove (130). As illustrated in FIG. 7, when the first electronic components (310) are coupled within the groove (130), at least a portion of the first electronic components (310) may be arranged to overlap with the first surface (137) of the lower surface of the housing (100) in the first direction (X). The first electronic components (310) may be arranged to overlap with the first heat dissipation fins (144) in the vertical direction. At least a portion of the first electronic components (310) may be arranged to overlap with the second heat dissipation fins (142) in the horizontal direction. At least a portion of the first electronic components (310) may be arranged to overlap with the third heat dissipation fins (150) in the first direction (X). Accordingly, the heat generated by the operation of the first electronic component (310) can be distributed in the up-down direction and the first direction (X) through the first heat dissipation fin (144) and the third heat dissipation fin (150), thereby improving heat dissipation efficiency.

[0064] When the first electronic component (310) is coupled to the home (130), a first electronic component cover (320) can be coupled to the lower plate (110) to cover the upper surface of the first electronic component (310). The first electronic component cover (320) includes a hole through which the coil of the first electronic component (310) passes, and the coil of the first electronic component (310) can pass through the hole of the first electronic component cover (320) to be connected to the substrate (300). Through the first electronic component cover (320), electrical noise generation between the first electronic component (310) and other electronic components can be minimized.

[0065] The second electronic component (330) may be mounted on the lower surface of the substrate (300). The second electronic component (330) may be placed on the bonding surface (112) of the housing (100). A heat dissipation pad (340) may be placed between the bonding surface (112) and the second electronic component (330). The heat dissipation pad (340) is made of a material with excellent thermal conductivity, so that heat generated by the operation of the second electronic component (330) can be easily conducted to the housing (100).

[0066] The second electronic component (330) may be arranged to overlap the heat dissipation fin (140) in the vertical direction. The second electronic component (330) may be arranged to overlap the second heat dissipation fin (142) in the vertical direction. Accordingly, heat generated by the operation of the second electronic component (330) may be easily dissipated through the heat dissipation pad (340) and the second heat dissipation fin (142) of the housing (100).

[0067] The electronic device (10) may include a fan (450). The fan (450) may be disposed on the lower surface of the housing (100), which is the placement area of ​​the heat dissipation fins (140). The fan (450) may be disposed in the fan mounting space (119). The fan (450) may be disposed to face the heat dissipation fins (140) in a second direction (Y). The fan (450) may discharge air toward the heat dissipation fins (140) in the second direction (Y). A plurality of fans (450) may be provided and disposed along the first direction (X). As illustrated in FIG. 8, at least a portion of the air discharged from the fan (450) flows into the gap (147) between the first heat dissipation fin (144) and the second heat dissipation fin (142), thereby easily dissipating heat conducted to the first heat dissipation fin (144) or the second heat dissipation fin (142). In addition, due to the embedded structure of the first electronic component (310) in the groove (130), at least a portion of the first electronic component (310) can be arranged to overlap the fan (450) in the second direction (Y), and thus, the heat dissipation efficiency can be improved due to the structure arranged on the flow path of the air generated from the fan (450).

[0068] The electronic device (10) may include a lower cover (410, 430). The lower cover (410, 430) may be coupled to the lower surface of the housing (100). By coupling the lower cover (410, 430), the arrangement area of ​​the heat dissipation fin (140) may be covered. In FIGS. 1 and 2, the electronic device (10) is illustrated without the lower cover (410, 430). The lower cover (410, 430) may include a lower plate (410) and a plurality of side plates (430) arranged on both sides of the lower plate (410). One of the plurality of side plates (430) may be formed integrally with the lower plate (410), and the other may be detachably coupled to the lower plate (410). A fan (450) is coupled to one of the plurality of side plates (430), and the side plate (430) to which the fan (450) is coupled may be provided with a hole for introducing air into the fan (450). The lower plate (410) may be arranged to overlap the heat dissipation fins (140) in the vertical direction. By coupling the lower covers (410, 430), the air discharged from the fan (450) is not emitted to the outside, but is guided to the area between the plurality of heat dissipation fins (140), thereby improving heat dissipation efficiency.

[0069] Meanwhile, based on the arrangement area of ​​the plurality of heat dissipation fins (140), a partition (149, see FIG. 1) having a shape protruding downward from the lower surface of the housing (100) is arranged on both edges in the first direction (X), thereby preventing heat generated from the fan (450) from being dissipated to an area other than the set area. The vertical length of the partition (149) may be longer than the vertical length of the heat dissipation fins (140), and a lower plate (410) may be coupled between the plurality of partitions (149).

[0070] The electronic device (10) may include a side cover (440). The side cover (440) may be coupled to a side of the housing (100) in which the third heat dissipation fins (150) are arranged. The side cover (440) may include a plurality of heat dissipation holes. Air generated from the fan (450) may pass through the lower surface of the housing (100), be guided to the area where the third heat dissipation fins (150) are arranged, and may be discharged to the outside through the heat dissipation holes of the side cover (440).

[0071] According to an embodiment, there is an advantage in that the driving heat of the electronic component can be easily radiated to the outside through the cooling fin due to the vertical overlapping structure between the cooling fin and the electronic component. In addition, as illustrated in Fig. 9, due to the vertical and horizontal overlapping structure between the electronic component and the plurality of cooling fins, the driving heat of each of the plurality of electronic components can be radiated in various directions through the arrangement area of ​​the cooling fins. In addition, since the vertical height of the space within the housing for arranging the electronic component can be reduced due to the embedded structure of the electronic component within the housing, there is an advantage in that the electronic device can be easily miniaturized.

[0072] Meanwhile, in this embodiment, a structure in which a part of the first electronic component (310) is embedded through a groove (130) in the housing (100) is illustrated as an example, but this is not limited thereto, and as illustrated in FIG. 11, the groove for arranging the first electronic component (310) may be implemented through an inner space of a protrusion (135) protruding downward from the lower surface of the housing (100). That is, the vertical length of the protrusion (135) may be the same as the vertical length of the first electronic component (310) or the vertical length of the heat dissipation fin (140). In this case, the lower surface of the protrusion (135) may form the same plane as the lower surface of the heat dissipation fin (140), and the protrusion (135) and the heat dissipation fin (140) may be arranged to overlap in the horizontal direction.

[0073] An electronic device according to a second embodiment of the present invention will be described.

[0074] FIG. 12 is a perspective view showing the exterior of an electronic device according to a second embodiment of the present invention, FIG. 13 is an exploded perspective view of an electronic device according to a second embodiment of the present invention, FIG. 14 is a view showing FIG. 13 from a different angle, FIG. 15 is a perspective view showing the lower surface of a housing according to a second embodiment of the present invention, FIG. 16 is a plan view showing the lower surface of a housing according to a second embodiment of the present invention, and FIGS. 17 to 21 are views showing the arrangement structure of electronic components from various angles to explain the heat dissipation structure of an electronic device according to a second embodiment of the present invention.

[0075] This embodiment is identical to the first embodiment in other respects, with the only difference being the arrangement of the heat dissipation fins and protrusions. Therefore, the following will describe the characteristic features of this embodiment, and the description of the first embodiment will be used for the remaining portions.

[0076] Referring to FIGS. 12 to 21, an electronic device (20) according to a second embodiment of the present invention may include a housing (1100), a cover (1200), a substrate (1300), and electronic components (1310, 1330).

[0077] The housing (1100) can form the outer shape of the electronic device (20). A space (1102) for accommodating electronic components and a substrate (1300) can be arranged within the housing (1100). For example, the housing (1100) includes a bottom plate (1110) and a side plate (1120) that protrudes upward from an edge of the bottom plate (1110), and the space (1102) can be partitioned from other areas by the upper surface of the bottom plate (1110) and the inner surface of the side plate (1120). The housing (1100) can be formed in a box shape with an open upper surface. The housing (1100) can have a rectangular cross-sectional shape. When the cover (1200) is coupled to the housing (1100), the upper surface of the space (1102) can be covered.

[0078] A groove (1130) may be arranged on the inner surface of the housing (1100) to which a first electronic component (1310) to be described later is coupled. The groove (1130) may have a shape that is more concave than other areas from the inner surface of the housing (1100). As illustrated in FIG. 14, the groove (1130) may have a shape that is concave downward from the upper surface of the lower plate (1110) than other areas. When a plurality of first electronic components (1310) are provided, a plurality of grooves (1130) may be provided corresponding to the number of first electronic components (1310) and may be arranged to be spaced apart from each other in the horizontal direction. Here, the horizontal direction may mean the first direction (X) or the second direction (Y) to be described later.

[0079] A plurality of grooves (1130) in which a plurality of first electronic components (1310) are arranged may be arranged closer to the edge of the housing (1100) than the center of the housing (1100). The plurality of grooves (1130) may be arranged adjacent to the side plate (1120). As described above, the housing (1100) may have a rectangular cross-sectional shape. For example, the housing (1100) may include a plurality of long sides and a plurality of short sides that are opposite to each other. In this case, the plurality of grooves (1130) may be arranged adjacent to the side plate (1120) arranged in an area forming a short side of the housing (1100) or the side plate (1120) arranged in an area forming a long side of the housing (1100).

[0080] A protrusion (1135, see FIG. 16) may be placed in an area corresponding to the arrangement area of ​​the groove (1130) on the outer surface of the housing (1100). The protrusion (1135) may have a shape that protrudes more than other areas from the outer surface of the housing (1100). As illustrated in FIG. 16, the protrusion (1135) may have a shape that protrudes downward more than other areas from the lower surface of the lower plate (1110). Accordingly, the lower surface of the housing (1100) may include a plurality of surfaces that are stepped in the vertical direction. For example, as illustrated in FIG. 17, the lower surface of the housing (1100) may include a first surface (1137) and a second surface that is stepped downward with respect to the first surface (1137). The second surface may be the lower surface of the protrusion (1135). The space within the home (1130), which is the placement area of ​​the first electronic component (1310), can be arranged so that at least a portion thereof overlaps horizontally with the first surface (1137).

[0081] A plurality of protrusions (1135) may be provided corresponding to the number of first electronic components (1310). The plurality of protrusions (1135) may be arranged to be spaced apart from each other in the first direction (X) or the second direction (Y). The lower surface of the lower plate (1110) may be arranged between the plurality of protrusions (1135).

[0082] A coupling surface (1112) to which a second electronic component (1330) to be described later is coupled may be arranged on the inner surface of the housing (1100). The coupling surface (1112) may be arranged on the lower plate (1110). When a plurality of second electronic components (1330) are provided, a plurality of coupling surfaces (1112) may be provided corresponding to the number of second electronic components (1330) and may be arranged in a horizontal direction. The coupling surface (1112) may have a shape that is stepped upwards compared to other areas of the upper surface of the lower plate (1110), but alternatively, it may be arranged to form the same plane as other areas of the upper surface of the lower plate (1110).

[0083] A heat dissipation fin (1140) may be arranged on the outer surface of the housing (1100). The heat dissipation fin (1140) may have a shape that protrudes outward from the outer surface of the housing (1100) more than other areas. Heat dissipation can be more easily achieved by increasing the surface area of ​​the housing (1100) through the heat dissipation fin (1140). The area where the heat dissipation fin (1140) is arranged on the surface of the housing (1100) may be named a heat dissipation area (1600, see FIG. 15), and partitions (1149) that divide the heat dissipation area (1600) and the external area of ​​the electronic device (20) may be arranged at both ends of the heat dissipation area (1600) in the second direction (Y). The heat dissipation area (1600) may be arranged between a plurality of partitions (1149).

[0084] The compartment (1149) may include a through hole (1149a) penetrating from one side to the other side. Air may flow into the heat dissipation area (1600) through the through hole (1149a).

[0085] The heat dissipation fin (1140) may have a shape that protrudes downward from the lower surface of the lower plate (1110). As illustrated in FIGS. 15 to 17, the heat dissipation fin (1140) may have a plate shape. The heat dissipation fin (1140) may be provided in multiple numbers and arranged along the second direction (Y). Each of the heat dissipation fins (1140) may have a length direction in the first direction (X).

[0086] The heat dissipation fin (1140) may be arranged to overlap with the electronic components (1310, 1330) in a vertical direction. For example, the heat dissipation fin (1140) may include a first heat dissipation fin (1144) that overlaps with the first electronic component (1310) in a vertical direction, and a second heat dissipation fin (1142) that overlaps with the second electronic component (1330) in a vertical direction.

[0087] The first heat dissipation fin (1144) may be arranged to overlap with the protrusion (1135). The first heat dissipation fin (1144) may have a shape that protrudes outward from the outer surface of the protrusion (1135). Based on a single protrusion (1135), the first heat dissipation fin (1144) may be provided in plurality and arranged to be spaced apart from each other along the second direction (Y). The first heat dissipation fin (1144) may have a shape that protrudes downward from the lower surface of the protrusion (1135). The first heat dissipation fin (1144) may have a shape that protrudes horizontally from the side surface of the protrusion (1135). Among the areas of the first heat dissipation fins (1144), an area protruding downward from the lower surface of the protrusion (1135) may be referred to as a first portion (1144a, see FIG. 15), and an area protruding horizontally from the side surface of the protrusion (1135) may be referred to as a second portion (1144b). Since a plurality of protrusions (1135) are provided, the spacing between the first heat dissipation fins (1144) arranged at the ends of each of two adjacent protrusions (1135) may be greater than the spacing between the plurality of first heat dissipation fins (1144) arranged on a single protrusion (1135).

[0088] In other words, a heat dissipation area through a plurality of first heat dissipation fins (1144) arranged based on one protrusion (1135) may be named a first area (1620). The second direction (Y) spacing between the plurality of first heat dissipation fins (1144) arranged in the first area (1620) may be greater than the second direction (Y) spacing between the plurality of first areas (1620). The second direction (Y) spacing between the plurality of first heat dissipation fins (1144) arranged in the first area (1620) may be greater than the first direction (X) spacing between the plurality of first areas (1620). Accordingly, a flow path (1710, see FIG. 16) through which air flows may be formed between the mutually opposing side surfaces of the plurality of adjacent protrusions (1135).

[0089] The second heat dissipation fin (1142) may have a shape that protrudes downward from the lower surface of the lower plate (1110). The second heat dissipation fin (1142) may be arranged to overlap the second electronic component (1330) in the vertical direction. The heat dissipation area through the second heat dissipation fin (1142) may be named a second region (1610). The second region (1610) may be arranged to be spaced apart from the first region (1620) in the first direction ((X)) or the second direction (Y).

[0090] The through hole (1149a) of the partition (1149) may be arranged to overlap horizontally with the horizontal separation area between the first region (1620) and the second region (1610). For example, as illustrated in FIG. 15, the through hole (1149a) may be arranged to overlap with the first direction (X) separation area between the first region (1620) and the second region (1610) in the second direction (Y). Accordingly, outside air may be introduced into the area between the plurality of heat dissipation fins (1140) through the through hole (1149a), thereby increasing heat dissipation efficiency.

[0091] The lower surface of the first heat dissipation fin (1144) and the lower surface of the second heat dissipation fin (1142) may form the same plane. Accordingly, the vertical length of the first heat dissipation fin (1144) protruding from the lower surface of the protrusion (1135) may be shorter than the vertical length of the second heat dissipation fin (1142).

[0092] As illustrated in FIGS. 14 and 15, a fan (1450) may be placed in the heat dissipation area (1600). The fan (1450) may be coupled to the heat dissipation area (1600) via a bracket (1460) coupled to the lower surface of the lower plate (1110). The fan (1450) may be placed to overlap the first area (1620) and the second area (1610) in the first direction (X). The fan (1450) may discharge air into the heat dissipation area (1600). As illustrated in FIG. 15, air discharged from the fan (1450) may sequentially pass through the second area (1610) and the first area (1620). In this case, air flow may be smoothly achieved through the separation spaces between the plurality of second areas (1610) and the separation spaces between the plurality of first areas (1620). As illustrated in FIG. 16, the second region (1610) is arranged to overlap with the region between the plurality of first regions (1620) in the first direction (X), and air passing between the plurality of second heat dissipation fins (1142) in the second region (1610) can be discharged to the outside of the heat dissipation region (1600) through the plurality of first heat dissipation fins (1144) or between the plurality of first regions (1620).

[0093] Meanwhile, between the plurality of heat dissipation fins (1140), between the first region (1620) and the second region (1610), a reinforcing member (1149, see FIG. 15) that interconnects the plurality of heat dissipation fins (1140) is arranged, so that the strength of each of the plurality of heat dissipation fins (1140) can be reinforced.

[0094] The description of the cover (1200) and inner cover (1250) within the electronic device (20) according to the present embodiment will refer to the description of the cover (200) and inner cover (250) within the electronic device (10) according to the first embodiment.

[0095] The electronic device (20) may include a substrate (1300). The substrate (1300) may be a printed circuit board (PCB). The substrate (1300) is formed in a plate shape, and a plurality of elements for driving the electronic device (20) may be arranged on the upper or lower surface. The substrate (1300) may be arranged in a space (1102) within the housing (1100).

[0096] The substrate (1300) may be electrically connected to electronic components (1310, 1330). The electronic components (1310, 1330) may include a first electronic component (1310) and a second electronic component (1330). The first electronic component (1310) may include an inductor for obtaining inductance or a transformer for voltage conversion. The first electronic component (1310) may include a core and a coil wound on an outer surface of the core. The coil may extend to the outer surface of the core and be electrically connected to the substrate (1300). The second electronic component (1330) may include a FET element. The second electronic component (1330) may be mounted on the lower surface of the substrate (1300) facing the lower plate (1110). The first electronic component (1310) and the second electronic component (1330) can each generate heat by driving. The first electronic component (1310) and the second electronic component (1330) can each be provided in multiples.

[0097] Each of the plurality of first electronic components (1310) may be coupled to a groove (1130). As illustrated in FIG. 18, when the first electronic components (1310) are coupled within the groove (1130), at least a portion of the first electronic components (1310) may be arranged to overlap with the first surface (1137) of the lower surface of the housing (1100) in the first direction (X). The first electronic components (1310) may be arranged to overlap with the first heat dissipation fins (1144) in the vertical direction. At least a portion of the first electronic components (1310) may be arranged to overlap with the second heat dissipation fins (1142) in the horizontal direction. Accordingly, heat generated by the operation of the first electronic components (1310) may be distributed in the vertical direction through the first heat dissipation fins (1144), thereby improving heat dissipation efficiency. In addition, as described above, since the first heat dissipation fin (1144) has a shape in which at least a portion thereof protrudes horizontally from the side of each protrusion (1135), heat generated by the operation of the first electronic component (1130) can also be dispersed horizontally.

[0098] When the first electronic component (1310) is coupled to the home (1130), a first electronic component cover (1320) can be coupled to the lower plate (1110) to cover the upper surface of the first electronic component (1310). The first electronic component cover (1320) includes a hole through which the coil of the first electronic component (1310) passes, and the coil of the first electronic component (1310) can pass through the hole of the first electronic component cover (1320) to be connected to the substrate (1300). Through the first electronic component cover (1320), electrical noise generation between the first electronic component (1310) and other electronic components can be minimized.

[0099] The second electronic component (1330) may be mounted on the lower surface of the substrate (1300). The second electronic component (1330) may be placed on the bonding surface (1112) of the housing (1100). A heat dissipation pad (1340) may be placed between the bonding surface (1112) and the second electronic component (1330). The heat dissipation pad (1340) is made of a material with excellent thermal conductivity, so that heat generated by the operation of the second electronic component (1330) can be easily conducted to the housing (1100).

[0100] The second electronic component (1330) may be arranged to overlap the heat dissipation fin (1140) in the vertical direction. The second electronic component (1330) may be arranged to overlap the second heat dissipation fin (1142) in the vertical direction. Accordingly, heat generated by the operation of the second electronic component (1330) may be easily dissipated through the heat dissipation pad (1340) and the second heat dissipation fin (1142) of the housing (1100).

[0101] The electronic device (20) may include a fan (1450). The fan (1450) may be disposed on the lower surface of the housing (1100), which is an area where the heat dissipation fins (1140) are disposed. The fan (1450) may be disposed to face the heat dissipation fins (1140) in a first direction (X). The fan (1450) may discharge air toward the heat dissipation fins (1140) in the first direction (X). The fans (1450) may be provided in multiple numbers and disposed along the second direction (Y). As illustrated in FIG. 19, air discharged from the fan (1450) may pass through a second area (1610), which is an area where the second heat dissipation fins (1142) are disposed, and a first area (1620), which is an area where the first heat dissipation fins (1144) are disposed. Accordingly, heat dissipation efficiency can be improved due to the structure placed on the flow path of air generated from the fan (1450).

[0102] The electronic device (20) may include a lower cover (1410, 1440, see FIG. 13). The lower cover (1410, 1440) may be coupled to the lower surface of the housing (100). By coupling the lower covers (1410, 1440), the lower surface of the heat dissipation area (1600), which is the arrangement area of ​​the heat dissipation fins (1140), may be covered. The lower covers (1410, 1440) may include a plurality of lower plates (1420, 1440) and side plates (1430). The side plate (1430) may be formed as one body with one of the plurality of lower plates (1420, 1440). A plurality of lower plates (1420, 1440) are arranged to cover the lower surface of the heat dissipation area (1600), and a side plate (1430) can be coupled to a side surface of the housing (1100) to cover a side surface of the protrusion (1135) or an area between the plurality of protrusions (1135). At least one of the lower plates (1420, 1440) or the side plate (1430) includes a hole for discharging air passing through the heat dissipation area (1600) to the outside, and air discharged from the fan (1450) can sequentially pass through the second area (1610) and the first area (1620) and be discharged to the outside.

[0103] According to an embodiment, there is an advantage in that the driving heat of the electronic component can be easily radiated to the outside through the cooling fin due to the vertical overlapping structure between the cooling fin and the electronic component. In addition, due to the vertical and horizontal overlapping structures between the electronic component and the plurality of cooling fins, the driving heat of each of the plurality of electronic components can be radiated in various directions through the arrangement area of ​​the cooling fins. In particular, compared to the first embodiment, there is an advantage in that the air can flow smoothly because an air flow path is formed through the horizontal separation space between the plurality of protrusions, and heat can also be radiated through the side surfaces of each of the plurality of protrusions.

[0104] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0105] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A housing having a first heat dissipation fin arranged on the outer surface; a substrate placed within the housing; and A first electronic component connected to the substrate and arranged within the housing, A concave groove is arranged on the inner surface of the above housing, A protrusion is arranged in an area of ​​the outer surface of the housing that overlaps the groove formation area in the vertical direction, At least a portion of the above first electronic component is coupled to the groove, An electronic device in which the first heat dissipation fin has a shape protruding from the surface of the protrusion.

2. In paragraph 1, Including a second electronic component arranged on the surface of the above substrate, An electronic device having a second heat dissipation fin arranged on the outer surface of the housing and overlapping the second electronic component in a vertical direction.

3. In paragraph 2, The outer surface of the housing includes a first surface and a second surface that are stepped in the vertical direction, The above second heat dissipation fin is arranged on the first surface, The above first heat dissipation fin is an electronic device arranged on the second surface.

4. In paragraph 3, The above electronic component is an electronic device in which at least a portion of the first surface overlaps horizontally.

5. In paragraph 3, The first heat dissipation fin and the second heat dissipation fin are each disposed on the lower surface of the housing, An electronic device in which the vertical length of the first heat dissipation fin is shorter than the vertical length of the second heat dissipation fin.

6. In paragraph 1, The above first heat dissipation fin is arranged on the lower surface of the housing, The above home is arranged adjacent to one side of the above housing, An electronic device in which the housing includes a third heat dissipation fin protruding from the one side.

7. In paragraph 2, The above first heat dissipation fin and the above second heat dissipation fin have a plate shape having a length direction in the second direction, An electronic device in which the first heat dissipation fin and the second heat dissipation fin are each provided in multiple numbers and arranged spaced apart along a first direction perpendicular to the second direction.

8. In paragraph 7, An electronic device including a fan disposed on one side of the first heat dissipation fin and the second heat dissipation fin and discharging air in the second direction.

9. In paragraph 8, An electronic device in which the distance between the first heat dissipation fin and the second heat dissipation fin is greater than the distance between the plurality of first heat dissipation fins or the distance between the plurality of second heat dissipation fins.

10. In paragraph 9, The above fan is an electronic device in which at least a portion overlaps the area between the first heat dissipation fin and the second heat dissipation fin in the second direction.

Images