Glass package

Abstract

This glass package comprises: a plurality of rectangular plate-like glass substrates; and a packaging material that is for packaging the glass substrates by arranging, in a state in which each of the glass substrates is erected vertically, the glass substrates in a row at intervals in the plate thickness direction of each of the glass substrates. The packaging material has four L-shaped pads that hold four corners of each of the glass substrates, and a plurality of bands that bind the glass substrates together with the four L-shaped pads. Each of the L-shaped pads has grooves into which the peripheries of the glass substrates are inserted. Each of the glass substrates has through-holes that penetrate the glass substrate in the plate thickness direction. In each edge of the glass substrate, the ratio (D / L) of the interval D between adjacent two of the L-shaped pads to the length L of each edge is not less than 5% but less than 50%. The tension F of each of the bands is 5-40 N.

Description

Glass packaging

[0001] The present disclosure relates to glass packages.

[0002] Packaging materials for FPD glass substrates have four L-shaped pads that hold the four corners of a rectangular glass substrate, and multiple bands that bind the multiple glass substrates together with the four L-shaped pads (see, for example, Patent Documents 1, 2, and 3). FPD glass substrates do not have through-holes. In contrast, glass substrates with through-holes are sometimes used as interposers or packaging substrates (see, for example, Patent Documents 4 and 5).

[0003] Japanese Patent Publication No. 2001-348081 Japanese Patent Publication No. 2003-160165 Japanese Patent Publication No. 2007-022660 Japanese Patent Publication No. 2017-061401 Japanese Patent Publication No. 2023-113866

[0004] Glass substrates with through holes have lower rigidity and strength than glass substrates without through holes. If the tension of the band is too strong, the glass substrate will bend, resulting in cracking or a decrease in strength of the glass substrate. The decrease in strength of the glass substrate occurs when the glass substrate is scratched. Furthermore, if the tension of the band is too strong, the L-shaped pad will be deformed or damaged. On the other hand, if the tension of the band is too weak, the glass substrate will sway relative to the L-shaped pad during transportation. As a result, for example, the glass substrate may come out of the groove of the L-shaped pad, causing contact between the glass substrates and cracking of the glass substrate. Furthermore, the L-shaped pad will wear out, generating dust.

[0005] One embodiment of the present disclosure provides a technique for properly packaging a glass substrate having a through hole.

[0006] A glass package according to one embodiment of the present disclosure includes a plurality of rectangular glass substrates and a packaging material for packaging the glass substrates in a line with the glass substrates standing vertically and spaced apart in the thickness direction of the glass substrates. The packaging material includes four L-shaped pads for holding the four corners of each glass substrate and a plurality of bands for binding the glass substrates together with the four L-shaped pads. Each L-shaped pad has a groove into which the periphery of the glass substrate is inserted. Each glass substrate has a through-hole penetrating the glass substrate in the thickness direction. On each side of each glass substrate, the ratio (D / L) of the distance D between two adjacent L-shaped pads to the length L of the side is 5% or more and less than 50%. The tension F of each band is 5 N or more and 40 N or less.

[0007] According to an embodiment of the present disclosure, a glass substrate having a through hole can be appropriately packaged.

[0008] Fig. 1 is a perspective view showing a glass package according to one embodiment. Fig. 2 is a perspective view showing an example of an L-shaped pad. Fig. 3 is a cross-sectional view showing an example of a glass substrate. Fig. 4 is a diagram showing an example of various parameters representing the binding state of the glass package.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are denoted by the same reference numerals, and their description may be omitted. In the specification, the symbol "to" indicating a range of values ​​means that the values ​​before and after it are included as the lower and upper limits. The range of values ​​includes the range rounded up or down.

[0010] A glass package 1 according to one embodiment will be described with reference to Fig. 1. The glass package 1 includes a plurality of rectangular glass substrates 10 and a packaging material 20 for packaging the glass substrates 10 by arranging them vertically in a line with intervals in the thickness direction of the glass substrates 10. The thickness direction of each glass substrate 10 is horizontal. The packaging material 20 includes four L-shaped pads 30 for holding the four corners of each glass substrate 10 and a plurality (e.g., two) bands 40 for binding the glass substrates 10 together with the four L-shaped pads 30.

[0011] Each band 40 is strip-shaped. The material of each band 40 is not particularly limited, but may be, for example, synthetic resin. The synthetic resin may be, for example, cellophane or polypropylene. Each band 40 is bent into a square frame shape along the four L-shaped pads 30. The width of each band 40 is preferably 12 mm to 25 mm. The thickness of each band 40 is preferably 0.01 mm to 0.60 mm.

[0012] An example of an L-shaped pad 30 will be described with reference to Figure 2. The L-shaped pad 30 has a horizontal plate 31 and a vertical plate 32, and has a plurality of horizontal grooves 34 and a plurality of vertical grooves 35 spaced apart along a boundary line 33 between the horizontal plate 31 and the vertical plate 32. The horizontal groove 34 is formed in the horizontal plate 31, and the vertical groove 35 is formed in the vertical plate 32. The horizontal groove 34 and the vertical groove 35 are connected at the boundary line 33. The periphery of the glass substrate 10 is inserted into the horizontal groove 34 and the vertical groove 35.

[0013] Although not shown, the L-shaped pad 30 may have a groove into which the band 40 is inserted. The presence of a groove into which the band 40 is inserted can prevent the band 40 from shifting laterally after binding. The groove into which the band 40 is inserted is formed in at least one (preferably both) of the horizontal plate 31 and the vertical plate 32. The groove into which the band 40 is inserted and the groove into which the glass substrate 10 is inserted (e.g., the horizontal groove 34 and the vertical groove 35) are formed on surfaces facing opposite each other.

[0014] The groove into which the band 40 is inserted is formed so that the circumferential length of the band 40 is the shortest distance. This prevents the band 40 from loosening after binding. If there were no groove into which the band 40 is inserted, a worker or a work robot might put the band 40 at an angle. In this case, if the band 40 shifts sideways during transportation, the binding by the band 40 would come undone, causing the glass substrate 10 to move.

[0015] Even if there is no pre-existing groove for inserting the band 40, if the worker or work robot squeezes the band 40 tightly when fastening it, the L-shaped pad 30 will elastically deform and a groove will be formed. This groove can also prevent the band 40 from shifting sideways. However, if a pre-existing groove is present, it is easier for the worker or work robot to perform the packaging work so that the circumference of the band 40 is the shortest distance, improving workability.

[0016] The material of the L-shaped pad 30 is not particularly limited, but is preferably a foamed resin. The foamed resin is, for example, polyethylene. If the material of the L-shaped pad 30 is a foamed resin, the following effects (1) to (4) can be obtained. (1) Scratches on the glass substrate 10 caused by contact with the L-shaped pad 30 can be suppressed. (2) Vibrations of the glass substrate 10 during transportation can be suppressed. (3) Impact can be absorbed. (4) The glass substrate 10 can be held in place by the elastic restoring force of the resin. Even if the material of the L-shaped pad 30 is a foamed resin, wear on the L-shaped pad 30 can be suppressed and dust generation from the L-shaped pad 30 can be suppressed as long as the requirements (A) and (B) described below are met.

[0017] If the glass substrate 10 is contaminated by dust generated from the L-shaped pad 30, the yield of semiconductor devices manufactured using the glass substrate 10 will decrease. Therefore, the technology of the present disclosure is particularly effective when the glass substrate 10 is a glass substrate for semiconductors. The glass substrate for semiconductors is, for example, an interposer or a packaging substrate.

[0018] An example of a glass substrate 10 will be described with reference to Figure 3. The glass substrate 10 has a first main surface 11 and a second main surface 12 facing opposite to the first main surface 11. The first main surface 11 and the second main surface 12 have a rectangular shape. Note that a rectangle includes a square. A rectangle also includes a shape with rounded corners. A wiring layer 21 is to be formed on the first main surface 11, and a wiring layer 22 is to be formed on the second main surface 12.

[0019] The glass substrate 10 has higher rigidity than a resin substrate. Therefore, warpage can be reduced even when the areas of the first main surface 11 and the second main surface 12 are large. It is preferable that the length of each of the long sides of the first main surface 11 and the second main surface 12 is 400 mm to 880 mm, and the length of each of the short sides is 300 mm to 680 mm.

[0020] The glass material of the glass substrate 10 is not particularly limited, but may be, for example, alkali-free glass, quartz glass, or photosensitive glass. The glass material of the glass substrate 10 has an average linear expansion coefficient of 0.5×10 at 5° C. to 200° C. －６ / ℃~13.0×10 －６ / ° C. If the average linear expansion coefficient is within the above range, peeling of the wiring layers 21 and 22 can be suppressed.

[0021] The thickness T of the glass substrate 10 is, for example, 0.2 mm to 2.0 mm. The smaller the thickness T, the easier it is to process the through holes 13. Furthermore, the smaller the thickness T, the thinner the semiconductor device can be. The thickness T is preferably 0.5 mm to 1.5 mm, and more preferably 0.6 mm to 1.2 mm.

[0022] 3 , the glass substrate 10 has a through hole 13 between the first main surface 11 and the second main surface 12. The through hole 13 penetrates the glass substrate 10 in the thickness direction. A through electrode that electrically connects the wiring layer 21 and the wiring layer 22 is to be embedded in the through hole 13.

[0023] At least one through hole 13 may be a dummy hole in which a through electrode is not to be embedded. The dummy hole is formed for the purpose of reducing the weight of the glass substrate 10 or preventing warping of the glass substrate 10. A hole in which a through electrode is to be embedded may be referred to as an electrode hole hereinafter to distinguish it from a dummy hole.

[0024] In this embodiment, the through holes 13 are straight holes as shown in Fig. 3. A straight hole has a constant diameter regardless of the depth from the first main surface 11 or the second main surface 12. The through holes 13 may also be tapered holes. The diameter of a tapered hole decreases as the depth from the first main surface 11 or the second main surface 12 increases.

[0025] Although not shown, through hole 13 may have a constriction midway, with two tapered holes sandwiched between the constriction. One tapered hole has a smaller diameter as its depth from first main surface 11 increases. The other tapered hole has a smaller diameter as its depth from second main surface 12 increases. Furthermore, through hole 13 may be a hole that combines a tapered hole and a straight hole.

[0026] The opening of the through hole 13 is preferably circular in both the first main surface 11 and the second main surface 12. The opening diameter d1 of the through hole 13 in the first main surface 11 and the opening diameter d2 of the through hole 13 in the second main surface 12 are preferably the same. Note that d1 and d2 may be different.

[0027] The opening diameter d1 of the through holes 13 in the first main surface 11 is, for example, 10 μm to 300 μm. The opening diameter d1 is preferably 20 μm to 200 μm, and more preferably 50 μm to 150 μm. Through holes 13 with different opening diameters d1 may be mixed in the first main surface 11.

[0028] Similarly, the opening diameter d2 of the through holes 13 in the second main surface 12 is, for example, 10 μm to 300 μm. The opening diameter d2 is preferably 20 μm to 200 μm, and more preferably 50 μm to 150 μm. Through holes 13 with different opening diameters d2 may be mixed in the second main surface 12.

[0029] The ratio of the opening area of ​​the through holes 13 in the first main surface 11 to the total area of ​​the first main surface 11 is, for example, 0.001% to 90%, preferably 0.07% to 80%, and more preferably 0.75% to 40%. Here, the total area of ​​the first main surface 11 includes both the areas where there are no through holes 13 and the areas where there are through holes 13. In other words, the total area of ​​the first main surface 11 includes the opening area of ​​the through holes 13 in the first main surface 11.

[0030] Similarly, the ratio of the opening area of ​​the through holes 13 in the second main surface 12 to the total area of ​​the second main surface 12 is, for example, 0.001% to 90%, preferably 0.07% to 80%, and more preferably 0.75% to 40%. Here, the total area of ​​the second main surface 12 includes both the areas where there are no through holes 13 and the areas where there are through holes 13. In other words, the total area of ​​the second main surface 12 includes the opening area of ​​the through holes 13 in the second main surface 12.

[0031] The number and arrangement of the through holes 13 are not particularly limited. Although the through holes 13 are arranged in a matrix in FIG. 1 , they may be arranged in a staggered pattern or randomly. The number and arrangement of the through holes 13, particularly the number and arrangement of the electrode holes, are appropriately selected depending on the wiring patterns of the wiring layers 21 and 22, etc.

[0032] The through-hole 13 may be formed by a general method, but in this embodiment, it is formed by ablation. In ablation, glass is locally evaporated or sublimated at the point of irradiation with the laser beam, and the glass is locally removed. Compared to drilling, this method can suppress the occurrence of defects. Defects include, for example, fractures or cracks.

[0033] The light source for the ablation process may be either a CW (Continuous Wave) laser or a pulsed laser, but is preferably a pulsed laser. ２ The pulsed laser may be a femtosecond laser or a picosecond laser.

[0034] The through-hole 13 may be formed by a general method as described above. For example, the through-hole 13 may be formed by drilling, etching, or blasting. Laser processing and etching may be combined. Laser processing forms a modified portion by modifying a portion of the glass substrate, and etching preferentially etches the modified portion.

[0035] Annealing may be performed after the through-holes 13 are formed. The annealing is a process in which the glass substrate 10 is heated to remove residual stress from the glass substrate 10.

[0036] An example of various parameters representing the binding state of the glass package 1 will be described with reference to Fig. 4. In Fig. 4, L1 indicates the length of the vertical side of the glass substrate 10, L2 indicates the length of the horizontal side of the glass substrate 10, D1 indicates the distance between two adjacent L-shaped pads 30 on the vertical side of the glass substrate 10, and D2 indicates the distance between two adjacent L-shaped pads 30 on the horizontal side of the glass substrate 10.

[0037] A vertical side is a side that is arranged vertically. A horizontal side is a side that is arranged horizontally. In FIG. 4, L1 is shorter than L2, but L1 may be longer than L2 or they may be the same. Also, in FIG. 4, the two D1s are the same but may be different. Similarly, in FIG. 4, the two D2s are the same but may be different.

[0038] In Figure 4, S is the amount of slack when the center of the upper edge of the band 40 bent into a square frame shape along the four L-shaped pads 30 is lifted with a force of 10 N. The magnitude of the force is measured, for example, with a force gauge 50. Note that the weight of the glass packaging body 1 exceeds a weight equivalent to 10 N (approximately 1 kg), and the glass packaging body 1 does not lift off the installation surface. The amount of slack S is measured after the glass packaging body 1 is manufactured.

[0039] The slack amount S of the band 40 represents the tension F of the band 40. While the slack amount S is measured after the glass packaging body 1 is fabricated, the tension F is measured when the glass packaging body 1 is fabricated (more specifically, when the band 40 is fixed). For example, while measuring the tension of the band 40 with a force gauge attached to one end of the band 40, the band 40 may be bent into a square frame shape and the other end of the band 40 may be fixed to the one end of the band 40. Therefore, the tension F is measured when the slack amount S is zero. The greater the tension F, the smaller the slack amount S.

[0040] When the slack amount S of the band 40 is 15 mm or more, the tension F of the band 40 is not too strong, and bending of the glass substrate 10 can be suppressed, thereby suppressing cracking or a decrease in strength of the glass substrate 10. A decrease in strength of the glass substrate 10 occurs when the glass substrate 10 is scratched. In addition, deformation or damage to the L-shaped pad 30 can be suppressed. The slack amount S of the band 40 is preferably 15 mm or more, more preferably 20 mm or more, and even more preferably 30 mm or more.

[0041] Furthermore, when the slack amount S of the band 40 is 100 mm or less, the tension F of the band 40 is not too weak, and the glass substrate 10 can be prevented from shaking relative to the L-shaped pad 30 during transportation. As a result, for example, the glass substrate 10 can be prevented from coming off the grooves (horizontal grooves 34 or vertical grooves 35) of the L-shaped pad 30, contact between glass substrates 10 can be prevented, and cracking of the glass substrate 10 can be prevented. Furthermore, wear of the L-shaped pad 30 can be prevented, and dust generation from the L-shaped pad 30 can be prevented. The slack amount S of the band 40 is preferably 100 mm or less, more preferably 80 mm or less, and even more preferably 60 mm or less.

[0042] The glass package 1 preferably satisfies the following requirement (A): (A) On each side of each glass substrate 10, the ratios (D1 / L1) and (D2 / L2) of the distances D1 and D2 between two adjacent L-shaped pads 30 to the lengths L1 and L2 of the respective sides are 5% or more and less than 50%. The larger (D1 / L1) and (D2 / L2) are, the smaller the contact area between the glass substrate 10 and the L-shaped pads 30 is.

[0043] When (D1 / L1) and (D2 / L2) are 5% or more, the spacing between two adjacent L-shaped pads 30 on each side of the glass substrate 10 is not too narrow, preventing contact between the L-shaped pads 30 and reducing dust generation from the L-shaped pads 30. Contact between the L-shaped pads 30 hinders elastic deformation of the L-shaped pads 30 when secured with the band 40, preventing sufficient elastic restoring force and causing the glass substrate 10 to move during transportation. Reducing contact between the L-shaped pads 30 prevents the glass substrate 10 from coming off the grooves (horizontal grooves 34 or vertical grooves 35) of the L-shaped pads 30 during transportation. Furthermore, when (D1 / L1) and (D2 / L2) are 5% or more, the number of glass substrates 10 and whether or not any glass substrates 10 have fallen off the grooves of the L-shaped pads 30 can be confirmed after packaging. (D1 / L1) and (D2 / L2) are preferably 5% or more, more preferably 20% or more, and even more preferably 30% or more.

[0044] When (D1 / L1) and (D2 / L2) are less than 50%, the contact area between the glass substrate 10 and the L-shaped pad 30 is not too small, which prevents the glass substrate 10 from coming off the groove (horizontal groove 34 or vertical groove 35) of the L-shaped pad 30 during transportation, which prevents contact between the glass substrates 10 and prevents cracking of the glass substrate 10. Furthermore, the L-shaped pad 30 is not too small relative to the glass substrate 10, which prevents stress concentration on the L-shaped pad 30 and prevents deformation of the L-shaped pad 30. (D1 / L1) and (D2 / L2) are preferably less than 50%, more preferably 45% or less, and even more preferably 40% or less.

[0045] It is preferable that the glass package 1 satisfies the following requirement (B): (B) The tension F of each band 40 is 5N or more and 40N or less.

[0046] When the tension F is 5 N or more, the tension F is not too weak and can prevent the glass substrate 10 from shaking relative to the L-shaped pad 30 during transportation. As a result, for example, the glass substrate 10 can be prevented from coming off the grooves (horizontal grooves 34 or vertical grooves 35) of the L-shaped pad 30, contact between glass substrates 10 can be prevented, and cracking of the glass substrate 10 can be prevented. Furthermore, wear of the L-shaped pad 30 can be prevented, and dust generation from the L-shaped pad 30 can be prevented. The tension F is preferably 5 N or more, more preferably 10 N or more, and even more preferably 20 N or more.

[0047] When the tension F is 40 N or less, the tension F is not too strong, and it is possible to suppress bending of the glass substrate 10 and to suppress cracking or a decrease in strength of the glass substrate 10. A decrease in strength of the glass substrate 10 occurs when the glass substrate 10 is scratched. It is also possible to suppress deformation or damage to the L-shaped pad 30. The tension F is preferably 40 N or less, more preferably 35 N or less, and even more preferably 30 N or less.

[0048] [Examples] Experimental data will be described below. In Examples 1 to 10, glass packages were produced under the same conditions except for the conditions shown in Table 1, and the glass packages were evaluated. Examples 1 to 6 are Examples, and Examples 7 to 10 are Comparative Examples.

[0049] The glass packages of Examples 1 to 10 were prepared by arranging 22 rectangular glass substrates (L1: 510 mm, L2: 515 mm, T: 1.0 mm, glass material: alkali-free glass) vertically in a row with intervals between them and packaging them in packaging material. The packages were packed by arranging the 22 glass substrates in a row with intervals between them in the thickness direction of each glass substrate. The thickness direction of each glass substrate was horizontal. Each glass substrate had 1 million through holes (d1 and d2: 100 μm). The through holes were formed by penetrating each glass substrate in the thickness direction of each glass substrate. The material of the L-shaped pad was a foamed resin (specifically, polyethylene).

[0050] Three types of bands, A, B, and C, were prepared. Band A was used in Examples 1 and 2. Band A was cellophane tape manufactured by Nitto Denko Corporation (model number: No. 29, width: 18 mm, thickness: 0.05 mm). Band B was used in Examples 3 and 4. Band B was a resin binding tape manufactured by Nirei Kogyo Co., Ltd. (model number: MC18W, width: 18 mm, thickness: 0.03 mm, base material: biaxially oriented polypropylene). Band C was used in Examples 5 to 10. Band C was a PP (polypropylene) band for packaging machines manufactured by Tsukasa Chemical Industry Co., Ltd. (model number: LB-15.5, width: 15.5 mm, thickness: 0.58 mm).

[0051] Table 1 shows the conditions and evaluations for Examples 1 to 10.

[0052]

[0053] In Table 1, the meanings of "good" and "bad" are as follows. <L-shaped pad deformation> Good: After the band binding between the L-shaped pad and the glass substrate was released, the deformation amount (plastic deformation amount) of the groove in the L-shaped pad was 3 mm or less. Bad: After the band binding between the L-shaped pad and the glass substrate was released, the deformation amount (plastic deformation amount) of the groove in the L-shaped pad exceeded 3 mm. <L-shaped pad dust generation> Good: After the glass package was transported and tested as described below, particles due to wear of the L-shaped pad did not adhere to the glass substrate after the band binding between the L-shaped pad and the glass substrate was released. Bad: After the glass package was transported and tested as described below, particles due to wear of the L-shaped pad adhered to the glass substrate after the band binding between the L-shaped pad and the glass substrate was released. <Glass substrate deflection> Good: When the L-shaped pad and the glass substrate were bound by the band, the glass substrates did not come into contact with each other due to deflection of the glass substrate. X: When the L-shaped pad and glass substrates are bound by a band, the glass substrates come into contact with each other due to bending of the glass substrates. <Glass substrate detachment> ◯: After the following transportation test of the glass package, the glass substrates do not come out of the grooves of the L-shaped pad, and the glass substrates do not come into contact with each other. X: After the following transportation test of the glass package, the glass substrates come out of the grooves of the L-shaped pad, and the glass substrates come into contact with each other. <Transportation test> The glass package was subjected to a random vibration test in the vertical direction for one hour using a vibration tester (manufactured by IMV, m120 / MA1) in accordance with JIS Z0232:2004. The vibration conditions were an acceleration power spectral density of 5.92 (m / s) under conditions simulating a general transportation environment (mainly roads) as described in Annex Table A.1 of the same standard. ２ The environmental temperature was 25°C ± 2°C and the humidity was 50% ± 5%.

[0054] Unlike Examples 7 to 10, Examples 1 to 6 were evaluated as "good" in all evaluation items because (A) (D1 / L1) and (D2 / L2) were 5% or more and less than 50% and (B) the tension F was 5 N or more and 40 N or less.

[0055] The glass packaging body according to the present disclosure has been described above, but the present disclosure is not limited to the above-described embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0056] This application claims priority based on Japanese Patent Application No. 2024-047584 filed with the Japan Patent Office on March 25, 2024, the entire contents of which are incorporated herein by reference.

[0057] REFERENCE SIGNS LIST 1 glass package 10 glass substrate 20 packaging material 30 L-shaped pad 40 band

Claims

1. A glass package comprising a plurality of rectangular glass substrates and a packaging material for packaging the glass substrates in a line with the glass substrates standing vertically and spaced apart in the thickness direction of the glass substrates, wherein the packaging material has four L-shaped pads for holding the four corners of each of the glass substrates and a plurality of bands for binding the glass substrates together with the four L-shaped pads, each L-shaped pad having a groove into which the periphery of the glass substrate is inserted, and each glass substrate has a through-hole penetrating the glass substrate in the thickness direction, and the ratio (D / L) of the distance D between two adjacent L-shaped pads to the length L of each side of each of the glass substrates is 5% or more and less than 50%, and the tension F of each band is 5N or more and 40N or less.

2. The glass package according to claim 1, wherein the thickness of each of the glass substrates is 0.2 mm to 2.0 mm.

3. The glass package according to claim 1 or 2, wherein the L-shaped pad is made of a foamed resin.

4. The glass package according to claim 1 or 2, wherein each of the glass substrates is for semiconductor use.

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