Method for manufacturing multilayer electronic component and unit sheet

Abstract

A multilayer electronic component according to one embodiment of the present invention comprises a first external electrode, a second external electrode and a plurality of unit sheets disposed between the first external electrode and the second external electrode, wherein each of the unit sheets comprises a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, and the thickness ratio of the nickel (Ni) electrode layer to the barium titanate (BaTiO3) dielectric layer is 1:1 to 1:300.

Description

Method for manufacturing laminated electronic components and unit sheets

[0001] An embodiment of the present invention relates to a method for manufacturing a laminated electronic component and a unit sheet for the electronic component.

[0002] Semiconductor packages are used in various fields such as automobiles, communications, and computers, and typically include printed circuit boards (PCBs), semiconductor chips placed on the PCB, and electronic components placed on the PCB. Electronic components may include resistors, inductors, and capacitors, for example. A capacitor is a device that stores and supplies electricity, blocking direct current and allowing only alternating current to flow, thereby ensuring a constant current flow. Capacitors are also known as condensers or capacitors. With the advancement of semiconductor packaging, demand for high-performance, highly reliable, and ultra-small capacitors is increasing. The basic structure of a capacitor consists of two electrode plates facing each other with a dielectric material between them. The amount of charge accumulated can vary depending on factors such as the spacing and area of ​​the electrode plates and the material of the dielectric.

[0003] MLCC (Multilayer ceramic capacitor) is a type of ceramic capacitor that uses a ceramic material as a dielectric. It is formed by stacking multiple electrode layers and multiple dielectric layers, and the more layers there are, the larger the capacity of the MLCC can be.

[0004] The unit sheet included in an MLCC includes internal electrodes and dielectric layers. Currently, manufacturing a single unit sheet requires a complex process, which is both time-consuming and costly. Specifically, the main ingredient, barium titanate ceramic powder, must first be manufactured, then additives added, a slurry prepared, the dielectric layer cast, and finally, the internal electrode layer printed. This multi-step process involves:

[0005] Furthermore, the high-temperature sintering process can degrade the performance of MLCCs. For example, oxygen vacancies can form during high-temperature sintering in a reducing atmosphere, and differences in the properties of the dielectric and electrode layers (Ni) can reduce capacitor coverage. Furthermore, MLCC performance can be degraded due to deterioration caused by external electric fields or Joule heating.

[0006] Therefore, there is a need for the development of a method for manufacturing unit sheets that can improve the performance reduction of MLCCs due to deterioration occurring during the high-temperature sintering process, enable thinning of internal electrodes, and shorten the manufacturing process to reduce costs and time.

[0007] The technical problem to be achieved by the present invention is to provide a small-sized and high-capacity laminated electronic component.

[0008] The technical problem to be achieved by the present invention is to provide a method for manufacturing a unit sheet including a dielectric layer and an internal electrode using an alloy plating process.

[0009] The technical problem to be achieved by the present invention is to provide a method for manufacturing an MLCC unit sheet that can reduce cost and time by shortening the manufacturing process and improve performance reduction due to high-temperature sintering.

[0010] A laminated electronic component according to one embodiment of the present invention includes a first external electrode, a second external electrode, and a plurality of unit sheets disposed between the first external electrode and the second external electrode, wherein the unit sheets include a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, and a thickness ratio of the nickel (Ni) electrode layer and the barium titanate (BaTiO3) dielectric layer is in a range of 1:1 to 1:300.

[0011] The thickness of the nickel (Ni) electrode layer may be in the range of 0.1 µm to 3 µm, and the thickness of the barium titanate (BaTiO3) dielectric layer may be in the range of 3 µm to 30 µm.

[0012] The thickness of the above nickel (Ni) electrode layer may be in the range of 0.1 ㎛ to 1 ㎛.

[0013] The porosity of the above nickel (Ni) electrode layer may be 1% or less.

[0014] The above unit sheet may range from 2 to 500 layers.

[0015] An adhesive bonding sheet may further be included between the plurality of unit sheets, and the adhesive bonding sheet may include at least one thermosetting resin selected from polyurethane, polyimide, silicone resin, and epoxy resin.

[0016] A method for manufacturing a unit sheet according to one embodiment of the present invention may include the steps of providing an electrolyte containing barium (Ba) ions and titanium (Ti) ions; immersing a nickel (Ni) sheet in the electrolyte; plating a barium-titanium alloy on the nickel (Ni) sheet; and oxidizing the plated barium-titanium alloy to form a barium titanate (BaTiO3) dielectric layer.

[0017] The above electrolyte may further contain one or more metal ions selected from calcium (Ca) or zirconium (Zr).

[0018] The above nickel (Ni) sheet may further include a carrier film on the lower side, and the carrier film may be a polymer film selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and polyethylene naphthalate (PEN).

[0019] The above plating can be performed by electroplating.

[0020] In the manufacturing method of the above unit sheet, a step of patterning using a mask and a step of removing the carrier film and the mask may be further included after the step of forming a barium titanate (BaTiO3) dielectric layer.

[0021] In the method for manufacturing the above unit sheet, the thickness of the nickel (Ni) sheet may be in the range of 0.1 µm to 3 µm, and the thickness of the dielectric layer may be in the range of 3 µm to 30 µm.

[0022] In the method for manufacturing the above unit sheet, the thickness of the nickel (Ni) sheet may be in the range of 0.1 µm to 1 µm.

[0023] According to an embodiment of the present invention, a method for manufacturing an MLCC unit sheet that can improve performance reduction due to deterioration occurring during a high-temperature sintering process by forming a dielectric layer by an alloy plating method, and can reduce cost and time by shortening the manufacturing process, and a high-capacity small electronic component such as a laminated capacitor including a unit sheet that can thin the internal electrode and has an increased effective area can be provided.

[0024] Fig. 1 is a perspective view of a laminated electronic component according to an embodiment.

[0025] Fig. 2 is a cross-sectional view of an electronic component according to an embodiment.

[0026] Fig. 3 is a top view of the dielectric and internal electrodes of an electronic component according to an embodiment.

[0027] Figure 4 is a flowchart showing a method for manufacturing a unit sheet according to an embodiment.

[0028] Figure 5 is a schematic diagram showing a process for manufacturing a unit sheet using an alloy plating method according to an embodiment.

[0029] Fig. 6 is a cross-sectional view showing the interlayer bonding state of the laminated unit sheets according to Example (a) and Comparative Example (b).

[0030] Fig. 7 is a cross-sectional view of a laminated electronic component manufactured by laminating unit sheets manufactured according to an embodiment and then pressing them.

[0031] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0033] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0034] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0035] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0036] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0037] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0038] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0039] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0040] Hereinafter, embodiments will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or corresponding components are given the same reference numbers, and redundant descriptions thereof will be omitted.

[0041] Fig. 1 is a perspective view of an electronic component according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of an electronic component according to an embodiment of the present invention, and Fig. 3 is a top view of a dielectric and internal electrodes of an electronic component according to an embodiment of the present invention. In this specification, an electronic component according to an embodiment of the present invention may mean an MLCC (multilayer ceramic capacitor).

[0042] Referring to FIGS. 1 to 3, an electronic component (100) according to one embodiment of the present invention includes a first external electrode (110), a second external electrode (120), an internal electrode (130), and a dielectric (140).

[0043] A pair of first external electrodes (110) and second external electrodes (120) are arranged to face each other. In this specification, the direction from the first external electrode (110) to the second external electrode (120) is referred to as a first direction. The first external electrode (110) and the second external electrode (120) may include a metal. For example, the first external electrode (110) and the second external electrode (120) may include at least one of nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), and a silver-palladium (Ag-Pd) alloy, but are not limited thereto.

[0044] The inner electrode (130) is disposed between the first outer electrode (110) and the second outer electrode (120). The inner electrode (130) may include a plurality of first inner electrode layers (131) that are electrically connected to the first outer electrode (110) and sequentially stacked, and a plurality of second inner electrode layers (132) that are electrically connected to the second outer electrode (120) and sequentially stacked. The number of the plurality of first inner electrode layers (131) and the plurality of second inner electrode layers (132) included in one electronic component (100) may be tens, hundreds, or thousands, respectively.

[0045] A plurality of first internal electrode layers (131) and a plurality of second internal electrode layers (132) may be alternately arranged and spaced apart from each other. For example, a second internal electrode layer (132A) may be arranged and spaced apart from each other on a first internal electrode layer (131A), a first internal electrode layer (131B) may be arranged and spaced apart from each other on a second internal electrode layer (132A), and a second internal electrode layer (132B) may be arranged and spaced apart from each other on a first internal electrode layer (131B).

[0046] The stacking direction of the plurality of first internal electrode layers (131) and the plurality of second internal electrode layers (132) may be perpendicular to the first direction. In this specification, the stacking direction of the plurality of first internal electrode layers (131) and the plurality of second internal electrode layers (132) may be referred to as the second direction.

[0047] According to an embodiment of the present invention, as the thickness of each of the plurality of first internal electrode layers (131) and the plurality of second internal electrode layers (132) becomes thinner, the number of layers can increase, and the capacity of the electronic component (100) can increase.

[0048] The dielectric (140) is disposed between the first external electrode (110) and the second external electrode (120). The dielectric (140) may be disposed within a spaced area between the first external electrode (110) and the second external electrode (120) and between the plurality of first internal electrode layers (131) and the plurality of second internal electrode layers (132). For example, the dielectric (140) may include a plurality of dielectric layers (141, 142, 143), and may have a structure in which the first internal electrode layer (131A), the dielectric layer (141), the second internal electrode layer (132A), the dielectric layer (142), the first internal electrode layer (131B), the dielectric layer (143), and the second internal electrode layer (132B) are sequentially stacked along the second direction.

[0049] According to an embodiment of the present invention, a laminated electronic component may include a first external electrode, a second external electrode, and a plurality of unit sheets disposed between the first external electrode and the second external electrode.

[0050] The above unit sheet includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer.

[0051] In the above unit sheet, the thickness ratio of the nickel (Ni) electrode layer and the dielectric layer may be in the range of 1:1 to 1:300.

[0052] Figure 4 is a flowchart showing a method for manufacturing a unit sheet according to an embodiment.

[0053] Referring to FIG. 4, a method for manufacturing a unit sheet for electronic components includes a step (S401) of providing an electrolyte containing barium (Ba) ions and titanium (Ti) ions; a step (S402) of immersing a nickel (Ni) sheet in the electrolyte; a step (S403) of plating a barium-titanium alloy on the nickel (Ni) sheet; and a step (S404) of oxidizing the plated barium-titanium alloy to form a barium titanate (BaTiO3) dielectric layer.

[0054] The embodiment may further include a step of patterning using a mask (S405) and a step of removing a carrier film and the mask (S406) after the step of forming a barium titanate (BaTiO3) dielectric layer (S404).

[0055] Figure 5 is a schematic diagram showing a process for manufacturing a unit sheet using an alloy plating method according to an embodiment.

[0056] As shown in (a) of Fig. 5, an electrolyte containing barium (Ba) ions and titanium (Ti) ions is prepared. The electrolyte basically contains Ba and Ti to form a barium titanate (BaTiO3) layer, which is the basic material of the dielectric layer, and various other metal elements can be added to improve performance.

[0057] For example, an electrolyte containing Ca and Zr can be used to form CaZrO3, a dielectric material with little temperature influence. Meanwhile, the electrolyte can be prepared by dissolving a metal salt such as Ba(CH3COOH)2, taking solubility into consideration.

[0058] As shown in (b) of Fig. 5, a nickel (Ni) sheet is immersed in an electrolyte containing barium (Ba) ions and titanium (Ti) ions.

[0059] In this way, nickel (Ni) can be used as a representative plating layer, but it can also be replaced with other metal materials to improve the performance of the capacitor chip or facilitate the process.

[0060] The above nickel (Ni) sheet may include a carrier film thereon, and the carrier film may be a polymer film selected from, for example, one or more of polyethylene terephthalate (PET), polyimide (PI), and polyethylene naphthalate (PEN), but is not limited thereto, and may be replaced with other polymer materials to improve the ease of a roll-to-roll process or a patterning process.

[0061] Next, as shown in Fig. 5(c), a step of plating a barium-titanium alloy on a nickel (Ni) sheet is performed. The plating method can be wet plating using an aqueous solution, and an example is electroplating using electricity. Electroless plating (chemical plating) is also possible, but electroplating can produce a good film quality.

[0062] After the above plating process, as shown in (d) of Fig. 5, when a barium-titanium alloy (Ba-Ti alloy) is formed on a nickel (Ni) sheet through electroplating, it is oxidized to manufacture a BaTiO3 dielectric layer (S403). The oxidation method of the barium-titanium alloy can be a thermal oxidation method in which oxidation is performed through heat treatment under an oxidizing atmosphere. Although an electrooxidation method is also possible, applying a thermal oxidation method has the advantage of being able to obtain a film of superior quality.

[0063] After the above oxidation process, a first etching process is performed to pattern the PET layer and nickel (Ni) layer, which are carrier films, using a mask, as shown in (e) of Fig. 5. The mask can be applied to the PET film through methods such as deposition and compression.

[0064] After the above patterning process, as shown in (f) of Fig. 5, a secondary etching process is performed to remove the mask and carrier film. When removing the PET layer, which is the mask and carrier film, the nickel (Ni) layer and the dielectric layer (BaTiO3) should not be affected. For process ease, two or more etching solutions may be used, or two or more steps of the process may be applied. In the above process, a unit sheet including one nickel (Ni) layer and one BaTiO3 dielectric layer is manufactured.

[0065] According to an embodiment of the present invention, a unit sheet formed by performing an oxidation process after plating a barium-titanium alloy to form a dielectric layer is characterized in that it can include a thin nickel (Ni) electrode layer. Specifically, the thickness of the nickel (Ni) sheet, i.e., the nickel (Ni) front layer in the unit sheet can be in the range of 0.5 to 3 μm, and is more preferably 1 μm or less.

[0066] Additionally, the thickness of the dielectric layer (BaTiO3) in the unit sheet according to the embodiment may be in the range of 3 µm to 30 µm.

[0067] After manufacturing the unit sheets, as shown in (g) of Fig. 5, the unit sheets are laminated to form external electrodes and manufacture a laminated electronic component, i.e., an MLCC chip. The number of unit sheets can be adjusted depending on the performance of the target chip and can include, for example, 2 to 500 layers.

[0068] According to an embodiment, a compression process may be added for densification after laminating the unit sheets. Specifically, one or more processes selected from a thermal compression process, a bonding sheet adhesion process, or a high-pressure compression process may be further included to strengthen the bonding strength between the unit sheets.

[0069] Additionally, the external electrode can use one or more metals selected from Cu, Sn, and Ni, and two or more types can be mixed and used depending on the target application of the chip.

[0070] According to an embodiment of the present invention, when a laminated electronic component is manufactured using an alloy plating method, the manufacturing process can be improved and the performance of the electronic component can be enhanced.

[0071] Typically, the MLCC manufacturing process involves several steps: raw material synthesis, raw material mixing, dielectric layer coating, internal electrode printing, lamination, pressing, cutting, heat treatment (sintering), polishing, external electrode formation, external electrode heat treatment, plating, sorting, and packaging.

[0072] According to an embodiment of the present invention, the process for manufacturing one unit sheet (one dielectric layer and one internal electrode layer) can be shortened, and thus the entire manufacturing process can be simplified, thereby reducing the time and cost required for manufacturing.

[0073] In addition, the MLCC manufactured according to the embodiment has improved coverage and thus an increased effective area. Referring to Fig. 6, the interlayer bonding state of the unit sheets according to the comparative example (a) and the embodiment (b) can be confirmed. Fig. 6 (a) is a cross-sectional view showing the interlayer bonding state of the comparative example in which the unit sheets are manufactured by a conventional sintering method and then laminated, and Fig. 6 (b) is a cross-sectional view showing the interlayer bonding state of the embodiment in which the unit sheets are manufactured by an alloy plating method and then laminated.

[0074] The conventional MLCC manufacturing process required high-temperature sintering at temperatures exceeding 1,000°C to densify particles. This high-temperature sintering process created pores and discontinuities in the internal electrodes, reducing coverage. This reduced coverage reduced the effective area for capacitance, thereby reducing chip capacity.

[0075] On the other hand, when applying the alloy plating method according to the embodiment, the sintering process can be omitted, thereby improving coverage and preventing capacity reduction. Specifically, when a dielectric layer is formed on a nickel electrode layer using the alloy plating method according to the embodiment of the present invention, the porosity of the nickel (Ni) electrode layer can be 1% or less.

[0076] Furthermore, manufacturing MLCCs using an alloy plating method, depending on the embodiment, can reduce chip performance degradation. Conventional MLCC manufacturing processes require high-temperature sintering in a reducing atmosphere to prevent oxidation of the nickel electrode. This high-temperature sintering process creates oxygen vacancies in the dielectric layer, a major cause of MLCC performance degradation. However, applying an alloy plating method eliminates the sintering process, thereby preventing the formation of oxygen vacancies and reducing chip performance degradation.

[0077] In addition, by manufacturing a unit sheet using an alloy plating method according to an embodiment, it is possible to realize a thin layering of the internal electrode and dielectric layer. The thickness of the BaTiO3 dielectric layer in the unit sheet of the laminated electronic component varies depending on the specifications of the MLCC model, and can range from about 3㎛ to 30㎛. The thickness of the nickel (Ni) electrode layer and the BaTiO3 dielectric layer are designed differently depending on the specifications of the MLCC chip, such as the size, capacity, and rated voltage.

[0078] Conventional MLCC manufacturing processes have difficulty printing internal electrodes smaller than 1 μm because they produce internal electrodes by printing nickel (Ni) paste. Conventionally, when manufacturing unit sheets, the electrode thickness typically ranges from 0.5 μm to 3 μm, and the dielectric layer thickness ranges from 3 μm to 30 μm. Therefore, in unit sheets manufactured using conventional processes, the thickness ratio of the nickel (Ni) electrode layer to the BaTiO3 dielectric layer ranged from 1:1 to 1:60.

[0079] On the other hand, when manufacturing a unit sheet using an alloy plating method according to an embodiment, the thickness of the nickel (Ni) electrode layer can be implemented in the range of 0.1 ㎛ to 3 ㎛, and the thickness of the dielectric layer can be in the range of 3 ㎛ to 30 ㎛, so the ratio of the nickel (Ni) electrode layer:BaTiO3 dielectric layer can be in the range of 1:1 to 1:300.

[0080] The embodiment of the present invention has the advantage of being able to manufacture a laminated electronic component including a thin-layered nickel internal electrode because it is easy to manufacture the nickel layer with a thickness of 1 ㎛ or less.

[0081] Meanwhile, in order to manufacture MLCC, unit sheets (one layer of BaTiO3 dielectric + one layer of nickel (Ni) electrode) must be laminated in several to several tens of layers. In the conventional manufacturing process, strong bonding between layers is achieved through a firing process after pressing, whereas in the alloy plating manufacturing method according to the embodiment of the present invention, the firing process is omitted, so the bonding between layers may be relatively weak. Therefore, in order to prevent delamination due to weakened bonding strength, processes such as thermal compression, laminating adhesive bonding sheets, or repeated high-pressure pressing can be added to strengthen the bonding strength between layers.

[0082] When adding a thermocompression bonding process, the thermocompression process must be performed within a temperature and pressure range that does not damage the electrode and dielectric layers. Furthermore, adhesive bonding sheets that can be used to strengthen the interlayer bonding between unit sheets include, but are not limited to, polymer sheets such as polyurethane and polyimide. Furthermore, the high-pressure compression process can be performed by repeatedly applying pressure at room temperature.

[0083] FIG. 7 is a cross-sectional view of an MLCC manufactured by a compression method by stacking unit sheets manufactured by an alloy plating method according to an embodiment of the present invention. Referring to FIG. 7, the boundary between BaTiO3 of the MLCC manufactured according to the embodiment can be confirmed. When a plurality of unit sheets manufactured by a conventional method are subjected to a sintering process, the boundary between BaTiO3 is not clear. However, when a dielectric is manufactured by stacking unit sheets including a BaTiO3 dielectric layer formed by oxidizing a BaTi alloy on a nickel (Ni) sheet according to an embodiment of the present invention, a compression process is required, and thus the boundary between the BaTiO3 dielectric layers may appear. Specifically, in the process of compressing the unit sheets including the BaTiO3 dielectric layer formed by oxidizing a BaTi alloy and the unit sheets, the BaTiO3 dielectric layer formed on the upper portion of the nickel (Ni) sheet is pressed to fill the empty space on the side of the nickel (Ni) sheet. Since the nickel (Ni) sheet used in the present invention is thin, the empty space on the side of the sheet is also thin, and BaTiO3 can fill the empty space through the compression process. Therefore, as shown in Fig. 7, it can be confirmed that the MLCC manufactured according to the embodiment of the present invention is a MLCC manufactured by the compression method through the boundary line between the BaTiO3 dielectric layers. In this way, by using the alloy plating method according to the embodiment of the present invention, the manufacturing process of the unit sheet can be shortened, thereby reducing the manufacturing cost and time of the MLCC, and the performance reduction of the MLCC due to high-temperature sintering can be improved.

[0084] Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below.

Claims

1. First external electrode, a second external electrode, and comprising a plurality of unit sheets arranged between the first external electrode and the second external electrode, The above unit sheet includes a nickel (Ni) electrode layer and a barium titanate (BaTiO3) dielectric layer formed on the nickel (Ni) electrode layer, A laminated electronic component having a thickness ratio of the nickel (Ni) electrode layer and the barium titanate (BaTiO3) dielectric layer in a range of 1:1 to 1:

300.

2. In paragraph 1, The thickness of the above nickel (Ni) electrode layer is in the range of 0.1 ㎛ to 3 ㎛, A laminated electronic component having a thickness of the above barium titanate (BaTiO3) dielectric layer in the range of 3 ㎛ to 30 ㎛.

3. In paragraph 1, A laminated electronic component having a porosity of the nickel (Ni) electrode layer of 1% or less.

4. In paragraph 1, A laminated electronic component further comprising an adhesive bonding sheet between the plurality of unit sheets.

5. A step of providing an electrolyte containing barium (Ba) ions and titanium (Ti) ions; A step of immersing a nickel (Ni) sheet in the above electrolyte; A step of plating a barium-titanium alloy on the nickel (Ni) sheet; and A method for manufacturing a unit sheet, comprising a step of forming a barium titanate (BaTiO3) dielectric layer by oxidizing the above-mentioned plated barium-titanium alloy.

6. In paragraph 5, A method for manufacturing a unit sheet wherein the electrolyte further comprises one or more metal ions selected from calcium or zirconium.

7. In paragraph 5, A method for manufacturing a unit sheet further comprising a carrier film on the lower portion of the nickel (Ni) sheet.

8. In paragraph 5, A method for manufacturing a unit sheet in which the above plating is performed by electroplating.

9. In paragraph 5, A method for manufacturing a unit sheet further comprising a step of patterning using a mask and a step of removing a carrier film and a mask after the step of forming the barium titanate (BaTiO3) dielectric layer.

10. In paragraph 5, The thickness of the above nickel (Ni) sheet is in the range of 0.1㎛ to 3㎛, A method for manufacturing a unit sheet in which the thickness of the dielectric layer is in the range of 3 ㎛ to 30 ㎛.

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