System for venting leaked gases

Abstract

A system for venting leaked gases comprises a substrate comprising at least one electronic component in fluid communication with a pressurized gases flow path and one or more vent hole. The one or more vent hole provides a vent path through the substrate for leaked gases from the pressurized gases flow path.

Description

[0001] SYSTEM FOR VENTING LEAKED GASES

[0002] Technical Field

[0003] [1] The present disclosure relates to a system for venting leaked gases. It relates particularly but not exclusively to a system providing a leak path for gases leaked from a pressurized gases flow path.

[0004] Background of Invention

[0005] [2] Patients with diminished respiratory function or risk of diminished respiratory function can benefit from high flow respiratory support. Patients may lose respiratory function during anaesthesia, or sedation, or more generally during certain medical procedures. Prior to a medical procedure a patient may be pre-oxygenated by a medical professional to provide a reservoir of oxygen saturation, and this pre-oxygenation is generally carried out with a bag and a face mask. Once under general anaesthesia, patients must be intubated to ventilate the patient. In some cases, intubation is often completed in under 60 seconds, but in other cases, particularly if the patient's airway is difficult to traverse (for example, due to cancer, severe injury, obesity or spasm of the neck muscles), intubation may take significantly longer. While pre-oxygenation provides a buffer against declines in oxygen saturation, for long intubation procedures, it is necessary to interrupt the intubation process and reapply the face mask to increase the patient's oxygen saturation to adequate levels. The interruption of the intubation process may happen several times for difficult intubation processes, which is time consuming and can potentially put the patient at risk. After approximately three attempts at intubation the medical procedure will be abandoned.

[0006] [3] Other situations where a patient may experience diminished respiratory function that could benefit from delivery of high flow respiratory support include where the patients experience respiratory disorders, as are frequently encountered in Intensive Care Units (ICUs).

[0007] [4] In many cases, provision of respiratory support may involve introduction of oxygen to a gases flow provided to the patient. Oxygen may be blended with air and / or other respiratory gases at a concentration intended to achieve clinical objectives. Systems used to provide respiratory support to a patient may include a flow source such as a blower, conduits and connectors for providing the gases flow to a patient interface, and sensors and other electronic components to ensure that gases provided to the patient meet the properties required by the clinician, while also meeting required safety limits. Leakage of oxygen rich gases may provide a fire risk in some situations.

[0008] [5] The present disclosure relates to systems for improving upon one or more respiratory support systems such as by improving oxygen management and / or improving safety.

[0009] [6] A reference herein to a patent document or any other matter identified as prior art, is not to be taken as an admission that the document or other matter was known or that the information it contains was part of the common general knowledge as at the priority date of any of the provisional claims.

[0010] Summary of Invention

[0011] [7] Viewed from a first aspect, the present disclosure provides a system for venting leaked gases, the system comprising: a substrate comprising: at least one electronic component in fluid communication with a pressurized gases flow path; and one or more vent hole; wherein the one or more vent hole provides a vent path through the substrate for leaked gases from the pressurized gases flow path.

[0012] [8] In some embodiments, the venting of leaked gases is passive.

[0013] [9] In some embodiments, part of the at least one electronic component is located within the pressurized gases flow path.

[0014]

[0010] In some embodiments, upon failure of a feature normally confining gases within the pressurized gases flow path, leaked gases travel via the one or more vent hole away from the pressurized gases flow path. A feature normally confining gases within the pressurized gases flow path may be a component selected from a group comprising: an electronic component on the substrate; a seal separating flow in the pressurized gases flow path from the substrate; and a seal in the pressurized gases flow path.

[0011] In some embodiments, the at least one electronic component normally confining gases within the pressurized gases flow path comprises a sensor such as a pressure sensor, flow sensor, temperature sensor, humidity sensor or a gas composition sensor. In some embodiments, the at least one electronic component comprises a differential pressure sensor.

[0015]

[0012] In some embodiments, the substrate comprises only electronic components having low power requirements.

[0016]

[0013] In some embodiments, a device defines the pressurized gases flow path. The device may comprise a pneumatic device.

[0017]

[0014] In some embodiments, the device comprises a recess configured to cooperate with at least part of the substrate to define a gases channel. The gases channel may comprise a chamber. In some embodiments, the one or more vent hole provides a vent path from the gases channel.

[0018]

[0015] In some embodiments, a vent path comprising the one or more vent hole through the substrate provides a lower resistance to flow than an alternative vent path formed between the substrate and the device.

[0019]

[0016] In some embodiments, a sealing member may provide a substantial seal between mating surfaces of the device and the substrate. The sealing member may comprise a gasket. The sealing member may comprise a compliant material applied to at least one of the substrate and the device. The sealing member may be shaped to correspond with a perimeter of the recess.

[0020]

[0017] In some embodiments, the recess and the substrate cooperate such that a surface of the substrate sits flush with at least part of the device.

[0021]

[0018] In some embodiments, one or more device ports in the device may comprise a restriction in a flow path between the pressurized gases flow path and an electronic component on the substrate.

[0019] In some embodiments, one or more electronic components on the substrate are located to align with and be at least partially received within one or more device ports of the device.

[0022]

[0020] In some embodiments, one or more electronic components on the substrate are in fluid communication with one or more device ports of the device.

[0023]

[0021] In some embodiments, the system comprises a housing containing the device and the substrate. The housing may comprise one or more gases outlets for exit of gases in the housing. The one or more gases outlets in the housing may be located near the one or more vent hole, or vice versa.

[0024]

[0022] In some embodiments, the system may comprise at least one venting conduit defining a flow channel from each of the one or more vent hole to outside the housing. The venting conduit may vent leaked gases to outside the housing near the one or more gases outlets.

[0025]

[0023] In some embodiments, the housing comprises an active system for venting gases, and leaked gases join a flow of actively vented gases to exit the housing.

[0026]

[0024] In some embodiments, the system mitigates accumulation of oxygenated gases proximal to higher-powered electronic components within the housing.

[0027]

[0025] In some embodiments, the system mitigates accumulation of gases within the housing above 25% oxygen concentration.

[0028]

[0026] In some embodiments, the system provides passive direction of leaked gases across a pressure gradient.

[0029]

[0027] In some embodiments, the system comprises a pressure sensor configured to monitor pressure in the gases channel, wherein an increase in pressure in the gases channel is indicative of a gases leak from the pressurized gases flow path. The pressure sensor may mounted on the substrate. The pressure sensor may comprise a differential pressure sensor or an absolute pressure sensor.

[0028] In some embodiments, the system comprises a gas concentration sensor configured to monitor gas concentration in the gases channel, wherein an increase in gas concentration in the gases channel is indicative of a gases leak from the pressurized gases flow path. The gas concentration sensor may be mounted on the substrate.

[0030]

[0029] In some embodiments, the system comprises an occlusion mechanism for occluding flow through the one or more vent hole for determining the presence of a gases leak from pressurized gases flow path. The occlusion mechanism may be selected from a group comprising: a plug; a switch; a valve; and an operator's finger or hand.

[0031]

[0030] In some embodiments, the system comprises a valve, such as a pressure responsive valve, operable to control flow from the gases channel, wherein the valve is configured to increase flow from the gases channel with increasing pressure within the gases channel. In some embodiments, the valve is normally open. The valve may be operable to control flow through the one or more vent hole. In some embodiments, the valve may be a pneumatic valve. In some embodiments, the valve is operable to occlude flow through the one or more vent hole to determine the presence of a gases leak from the pressurized gases flow path.

[0032]

[0031] In some embodiments, the pressure sensor and / or the gas concentration sensor may provide a signal for use by a user interface device to present an audible, visible or tactile indication of monitored pressure within the gases channel.

[0033]

[0032] In some embodiments, the pressure sensor and / or the gas concentration sensor may provide a signal for use by a user interface device to activate an audible, visible or tactile alert when the monitored pressure increases.

[0034]

[0033] In some embodiments, the substrate comprises a printed circuit board (PCB).

[0035]

[0034] In some embodiments, the substrate may be provided in an apparatus comprising a separate second substrate, such as a PCB, comprising electronic components having higher power requirements. The second substrate may be located in the apparatus away from the substrate comprising components having low power requirements. The second substrate may be oriented orthogonally with the substrate comprising components having low power requirements.

[0035] Viewed from a second aspect, the present disclosure provides a device providing a pressurized gases flow path, incorporating the system for venting leaked gases according to the first aspect.

[0036]

[0036] Viewed from a third aspect, the present disclosure provides an apparatus for respiratory support, comprising: a device defining one or more pressurized gases flow paths; a system for venting leaked gases according to the first aspect; and a housing containing the device and the system.

[0037]

[0037] In some embodiments, the apparatus may comprise a flow generator for generating one or more pressurized gases flow paths in the device.

[0038]

[0038] Viewed from a fourth aspect, the present disclosure provides a system for mitigating accumulation of leaked gases between a housing, and a device inside the housing, the device configured to generate a pressurized flow of gases, the system comprising: a substrate comprising at least one electronic component; wherein part of the at least one electronic component is located in fluid communication with a pressurized gases flow path of the device; and wherein the substrate comprises one or more vent holes providing a vent path for leaked gases from the pressurized gases flow path.

[0039] It is to be understood that each of the various aspects described herein may incorporate one or more features, modifications and alternatives described in the context of one or more other aspects and may include one or more features, modifications and alternatives of any of the embodiments described below, as appropriate. For efficiency, such features, modifications and alternatives have not been repetitiously disclosed for each and every aspect although one of skill in the art will appreciate that such combinations of features, modifications and alternatives disclosed for some aspects and embodiments apply similarly for other aspects and embodiments and are within the scope of and form part of the subject matter of this disclosure.

[0040] Brief Description of Drawings

[0041]

[0039] The invention will now be described in greater detail with reference to the accompanying drawings in which like features are represented by like numerals. It is to be understood that the embodiments shown are examples only and are not to be taken as limiting the scope of the invention as defined in the provisional claims appended hereto.

[0042]

[0040] Fig. 1 is a schematic diagram of an example of a respiratory support system for providing respiratory gases to a patient.

[0043]

[0041] Fig. 2 is a schematic drawing showing components of a system for delivery of respiratory gases.

[0044]

[0042] Fig. 3 is a front perspective view of a device configured to provide a pressurized gases flow path according to an embodiment of the disclosure.

[0045]

[0043] Fig. 4 is a perspective view of the device of Fig 3 with sensors and a connector for a gases conduit, according to an embodiment of the disclosure.

[0046]

[0044] Fig. 5 is a front perspective view of the device of Figs 3 and 4 from below, showing two PCBs according to an embodiment of the disclosure.

[0047]

[0045] Fig. 6 is a front perspective view of a component of the device showing pressurized gas flow paths.

[0048]

[0046] Fig. 7 is a rear perspective view of the component in Fig. 6.

[0049]

[0047] Fig. 8 is a front perspective view of the device of Figs 3 to 5 from below, showing a PCB with a vent insert according to an embodiment of the disclosure.

[0050]

[0048] Fig. 9 is an exploded view of the lower portion of Fig. 5, showing the PCB, venting conduit and fasteners detached from the device component shown in Figs 6 and 7.

[0051]

[0049] Fig. 10 is a perspective view of the PCB of Fig. 9.

[0052]

[0050] Fig. 11 shows the device of Figs 8 to 10 inside part of a housing.

[0053]

[0051] Fig. 12 is a front perspective view of the device of Figs 3 to 5 from below, showing a PCB with a venting conduit according to an embodiment of the disclosure.

[0054]

[0052] Fig. 13 is an exploded view of the lower portion of Fig. 12, showing the PCB, venting conduit and fasteners detached from the device component shown in Figs 12.

[0053] Fig. 14 is a perspective view of the PCB of Fig. 13.

[0055]

[0054] Fig. 15 shows the device of Figs 12 to 14 inside part of a housing.

[0056]

[0055] Fig. 16 shows a recess formed in an underside of a device and a sealing member.

[0057]

[0056] Fig. 17 is a top view of a substrate with a sealing member.

[0058]

[0057] Fig. 18 is a schematic cross sectional view of a system for venting leaked gases comprising a pressure sensor for use in determining presence of a pressurized gases leak, according to an embodiment of the disclosure.

[0059]

[0058] Fig. 19 is a graph representing changes in chamber pressure values over time when flow through the vent hole is occluded and unoccluded, in the presence of leaked gases from the pressurized gases flow path.

[0060]

[0059] Fig. 20 is a schematic cross sectional view of a system for venting leaked gases comprising a pressure sensor and a valve for use in determining presence of a pressurized gases leak, according to an embodiment of the disclosure.

[0061]

[0060] Figs 21 and 22 show a gas dispersing blower for active venting of gases within a housing of the device, showing a path of least resistance and a guided flow path, respectively.

[0062]

[0061] Figs 23 to 25 show an air intake for a gas dispersing blower according to an embodiment of the disclosure, with a removable filter and removable cover.

[0063]

[0062] Fig 26 shows an apparatus for providing respiratory gases incorporating a system for venting leaked gases, showing the housing, air intake and air outlet.

[0064] Detailed Description

[0065]

[0063] Embodiments of the disclosure are discussed herein by reference to the drawings which are not to scale and are intended merely to assist with explanation of the invention.

[0066]

[0064] In anaesthetic procedures in which high flow respiratory support is provided, high flow gases can contain oxygen (02) levels higher than ambient air (21%). Anaesthetic procedures may include sedation procedures during which the patient may be spontaneously breathing and general anaesthetic procedures in which the patient is or is becoming apnoeic i.e. not spontaneously breathing. In general anaesthesia procedures 100% 02 can be delivered to the patient during pre-oxygenation to build an 02 reservoir (acting as a buffer) in the patient's lungs and blood before anaesthetic induction, and before intubation (while the patient may be apnoeic) to maintain blood 02 saturation levels or prevent / reduce a decrease in blood 02 saturation levels.

[0067]

[0065] Flow rates during anaesthetic procedures can be as high as 70 L / min or in some cases 90 L / min during apnoeic oxygenation. The combination of high flow rates and high 02 concentration required to deliver the respiratory support in this context require a system that can reliably, accurately and safely control the delivery of high gas flows and / or high 02 concentration to patients.

[0068]

[0066] In this specification, the gas delivered by a flow source including in an anaesthetic procedure could include, without limitation, oxygen, carbon dioxide, nitrogen, helium, and anaesthetic agents, to name a few, or mixtures of these or other breathable gases for respiratory support and / or ventilation. Where reference is made to a particular gas herein, it will be appreciated that it is by way of example only and the description can apply to any gas - not just that referenced.

[0069]

[0067] It is to be understood that the flow of respiratory gases provided to the patient may be humidified or non-humidified.

[0070]

[0068] Without limitation, some indicative values of flow rates for the respiratory gas provided by a flow source for respiratory support be as follows.

[0071]

[0069] In some configurations, the respiratory support may comprise delivery of gases to a patient at a flow rate of greater than 0 liters per minute (greater than 0 LPM or L / min). In some configurations, the respiratory support includes delivery of gases to a patient at a flow rate of about 5 or 10 LPM to about 150 LPM, or about 10 LPM to about 120 LPM, or about 15 LPM to about 95 LPM, or about 20 LPM to about 90 LPM, or about 20 LPM to about 70 LPM, or about 25 LPM to about 85 LPM, or about 30 LPM to about 80 LPM, or about 35 LPM to about 75 LPM, or about 40 LPM to about 70 LPM, or about 45 LPM to about 65 LPM, or about 50 LPM to about 60 LPM, or about above 0 LPM to about 10 LPM. For example, according to various embodiments and configurations described herein, a flow rate of gases provided to a patient, may comprise, but is not limited to, flows of at least about greater than 0 LPM, about 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150 LPM, or more, and useful ranges may be selected to be any of these values (for example, about 20 LPM to about 90 LPM, about 15 LPM to about 70 LPM, about 20 LPM to about 70 LPM, about 40 LPM to about 70 LPM, about 40 LPM to about 80 LPM, about 50 LPM to about 80 LPM, about 60 LPM to about 80 LPM, about 70 LPM to about 100 LPM, about 70 LPM to about 80 LPM).

[0072]

[0070] Flow rates for premature / infants / paediatrics (with body mass in the range of about 1 to about 30 kg) can be different. The flow rate can be set to about 0.4 L / min / kg to about 8 L / min / kg with a minimum of about 0.5 L / min and a maximum of about 70 L / min. For patients under 2 kg maximum flow rate may be set to 8 L / min. Oscillating flow may be set to 0.05-2 L / min / kg with a preferred range of 0.1-1 L / min / kg and another preferred range of 0.2- 0.8 L / min / kg.

[0073]

[0071] In some embodiments, the flow rates disclosed herein may generate a flushing effect in the patient's airway such that the anatomical dead space of the upper airways is flushed by the incoming gas flows. This can create a reservoir of fresh gas, and / or minimize the gas concentration of carbon dioxide, nitrogen, etc. which may help to improve CO2 clearance and / or reduce the buildup of CO2. Incoming gas flows with higher than ambient amount of oxygen may expedite the time required to replace gases, e.g. carbon dioxide, nitrogen, etc. in the patient's lungs and / or increase the patient's blood oxygen saturation levels.

[0074]

[0072] Gases delivered may comprise a percentage of oxygen. In some configurations, the percentage of oxygen in the gases delivered may be about 15% to about 100%, 20% to about 100%, or about 30% to about 100%, or about 40% to about 100%, or about 50% to about 100%, or about 60% to about 100%, or about 70% to about 100%, or about 80% to about 100%, or about 90% to about 100%, or about 100%, or 100%.

[0075]

[0073] Fig. 1 is a schematic diagram of an example of a respiratory system 1 for providing respiratory gases to a patient. System 1 comprises a flow source 3 such as an inwall source of 02, an 02 tank, a blower, a flow therapy apparatus, or any other source of 02 or other gas or combination thereof. In some embodiments, the flow source 3 comprises a flow modulator and in some embodiments, the flow modulator comprises a flow generator such as a blower that provides gases flow comprising a mix of air and 02 at high flow rates as controlled by a controller 4. Respiratory gases from flow source 3 may travel via a first conduit 17 and an inlet 9 to a humidification chamber 6 of humidifier 7 where the gases may be conditioned to a predetermined temperature and / or humidity.

[0076]

[0074] The humidifier 7 is configured to condition the gases to a pre-determined temperature and / or humidity before delivery to the patient. The flow of respiratory gases provided to the patient may be humidified or, in certain implementations, non-humidified. The humidifier 7 may also include a humidification base unit. In an example, the humidification base unit comprises a heating element operable to heat a humidification fluid in the humidification chamber 6, for example via a conductive base in the chamber 6. The first conduit 17 may provide a conduit for delivering dry flow of gases to the humidifier 7. The first conduit 17 may be coupled with the humidification chamber 6 of the humidifier 7 as shown. Alternatively, the humidifier 7 may be a single component (not shown) and exclude the separate humidification chamber 6 and / or base unit. The humidifier 7 may be configured to condition the gas provided by the flow source 3 to a required temperature and / or humidity. The required temperature and / or humidity may be determined according to the respiratory support being delivered and may be selected by a user or operator e.g. using controller 4, to be suitable for the respiratory support to be provided. In some examples, humidifier 7 may be integrated into or form part of the flow source 3.

[0077]

[0075] Humidified and / or warmed respiratory gases exit humidifier 7 via outlet 11 to which is coupled an inspiratory conduit 101 which delivers the conditioned respiratory gases to the patient 16 via patient interface 5. For delivery of high flows using system 1, the patient interface 5 may be a non-sealing interface such as a non-sealing nasal cannula. In other embodiments, patient interface 5 may be a sealing interface, such as a nasal mask, full face mask or nasal pillows. In some embodiments, humidified gases in the inspiratory conduit 101 may be heated by a heating element 119 provided to or in the inspiratory conduit. In some embodiments, an optional filter 13 may be provided to filter the gases provided to the patient 16. Optional filter 13 may also be provided to prevent contamination for example, of the humidification chamber and the inspiratory conduit in the event of reverse flow from the patient.

[0078]

[0076] Controller 4 includes or is in operative communication with a user device such as an input-output interface (I / O interface) 20. The I / O interface 20 may be configured to receive user inputs according to the respiratory support to be provided to the patient. In some examples, the I / O interface 20 may in turn communicate to the user by a screen or audible means such as a speaker, such as when one or more alarm conditions have been met or to display values corresponding to characteristics of the gases being provided to the patient. The controller 4 has a processor and comprises or is in operative communication with one or more memory components configured to cause the processor to execute instructions for controlling the flow of respiratory gases according to one or more protocols stored in the memory.

[0079]

[0077] In some embodiments, a user provides to the I / O interface 20 the respiratory support requirements such as gases composition (e.g. 02 concentration), flow rate and / or pressure to be delivered to the patient's airways. The controller 4 then computes the control signals required for operation of components of the system to deliver that flow rate, pressure and / or 02 concentration by controlling the flow source 3, and / or various components within the system to modulate the flow of gases. Controller 4 may receive a plurality of sensor inputs that are used by the controller to determine the control signals. In some embodiments, the I / O interface 20 displays one or more control parameters of the system, or measured characteristics of the gases for example flow rate of gases, pressure (e.g. gases, patient, system, etc.), temperature, gas concentration e.g. 02 concentration etc., which may be received from one or more input, for example controller 4 and / or sensors.

[0080]

[0078] In some embodiments, the present disclosure has utility in providing a device or system comprised of mechanical, electrical and electronic components arranged to provide a flow of gases that delivers the required respiratory support safely, and / or efficiently.

[0081]

[0079] Fig. 2 is a schematic drawing showing components of a device 100 for providing respiratory gases. The device 100 comprises an 02 flow path 200, air flow path 300 and a mixed gases flow path 400. 02 flow path 200 is in fluid communication with an 02 supply 210 which may be a high pressure 02 supply. For example, the high-pressure gasses supply from the wall of a hospital. Device 100 is representative of flow source 3 of Fig. 1. In an example, the flow source 3 may also include 02 supply 210. The flow rate of gases in the 02 flow path 200 may be controlled by a proportional valve 212 which is operatively coupled with controller 4.

[0082]

[0080] Air flow path 300 may have a blower 310 which draws air from air intake 314 and is operatively coupled with controller 4. The flow rate of gases in the air flow path 300 may be generated by the blower 310 under the control of controller 4. The blower 310 draws air from the surroundings for example, room air when generating flows. Alternatively or additionally, air flow path 300 may connect to an air supply, which may be a high pressure air supply. For example, compressed air supply from the hospital wall. The flow rate of gases in the air flow path 300 may be controlled by a proportional valve in a similar manner to proportional valve 212 controlling the flow rate of gases in the 02 flow path.

[0083]

[0081] Air from air intake 314 may be filtered by air filter 316 to remove particulates. Similarly, a filter 216 may be provided to filter small particles (e.g. <100 urn) from the 02 supply 210. This filter may be placed inside an 02 connector that is coupled with the inlet of the 02 supply 210. The filter may be placed in the 02 flow path 200 within the device 100 such as downstream of a high pressure oxygen coupling providing oxygen to the device. This may prevent small particles from entering components such as the proportional valve 212. 02 may be mixed with air downstream of blower 310 to form a mixed gas flow in mixed gas flow path 400 which is delivered as a flow of respiratory gases to the patient.

[0084]

[0082] Various sensors may be provided such as 02 pressure sensor 214 which is configured to sense 02 pressure in the 02 flow path (e.g. to determine that there is a flow of 02 entering the 02 flow path), 02 flow sensor 218 which is configured to sense flow rate in the 02 flow path 200, air flow sensor 318 which is configured to sense flow rate in the air flow path 300, and mixed gas flow sensor 418 which is configured to sense flow rate in the mixed gas flow path 400 which is delivered to the patient. Additionally, one or more gauge pressure sensors 414 may be provided in the mixed gas flow path 400 and one or more ambient pressure sensors 114 may be provided to sense ambient air pressure. The gauge pressure sensor(s) 414 may take reference from one or more ambient pressure sensors 114 to measure the pressure in the mixed gas flow path 400. The flow rate and pressure of mixed gases in the mixed gas flow path 400 may be controlled by operation of the blower 310 and / or proportional valve 212. Mixing of gases from the 02 flow path 200 and air flow path 300 occurs in a mixing chamber 500 shown in broken lines in Fig. 2.

[0085]

[0083] Device 100 may be provided in a housing 900 which may further comprise a gas dispersing blower 650 to improve safe operation of the device as will be described in further detail below. Not shown in the schematic layout of Fig. 2 is the electrical input to the device 100 which supplies each of the electrically powered components. Electrical input to the device 100 may be by an IEC connector of the type known to persons skilled in the art.

[0086]

[0084] Components of the device 100 that direct flow of gases within the device may, in some examples, comprise a substantially sealed pneumatic component such as a pneumatic "block" 700 as shown in Figs 3 to 9. As shown in the schematic drawing of Fig. 2, the 02 flow path 200 and the air flow path 300 are represented as parallel flow paths. Relevantly, when the schematic representation of device 100 of Fig. 2 is manifested in a mechanical device 100 such as the pneumatic block 700, it may also be desirable in some embodiments, for the 02 flow path 200 and the mixed gas flow path 400 to be arranged in the device such that at least part of those physical flow paths are arranged in a parallel configuration.

[0087]

[0085] In some embodiments, it may be desirable to deliver respiratory gases containing a high concentration of 02 such as 100% 02. In such a scenario, the user may enter this 02 concentration set point into I / O interface 20. The controller 4 then controls proportional valve 212 to open sufficiently (e.g. by increasing supply current) to allow enough 02 into the flow of respiratory gases to meet the 02 concentration set point.

[0088]

[0086] In another scenario, the user may set the concentration of 02 as 100% and select a desired flow rate of gases to be delivered to the patient using the I / O interface 20. In this scenario, the desired flow rate of gases is the flow rate of 02. The desired flow rate may be selected from a range of flow rates available to the user via the I / O interface 20. The proportional valve 212 in the 02 flow path 200 may open sufficiently to meet the selected flow rate of gases to be delivered to the patient. In some examples, such as when the selected flow parameters comprise 100% 02 at a high flow rate, the blower 310 in the air flow path 300 may operate to provide enough forward flow and / or pressure to limit or prevent 02 from the 02 flow path 200 from flowing upstream in the air flow path 300 and exiting via the air intake 314.

[0089]

[0087] In some embodiments, it may be desirable to deliver respiratory gases containing a concentration of 02 greater than 21% and less than 100%. The user may select a desired concentration of 02 and select a desired flow rate of gases to be delivered to the patient using the I / O interface 20. In this case, the controller 4 may control operation of the proportional valve 212 and the blower 310 such that their combined performance operate is to achieve the selected 02 concentration and flow rate of gases.

[0090]

[0088] In some embodiments, the flow path schematic of Fig. 2 may be materialized within a device such as a pneumatic "block" 700, an example of which is shown in the Figures. In some embodiments, pneumatic block 700 may comprise of one, two, three or more pneumatic block components having bores therein which define gases flow paths. However that need not be the case. In some examples, the flow path schematic of Fig. 2 may be materialized within a device comprising flow paths defined by one or more conduits which are fluidly coupled with components e.g. according to the schematic of Fig. 2. The device may comprise a plastic, metal, ceramic, polymer or composite material housing or base which retains the conduits and components in their required position. In some examples, the device may be contained within a housing as described below.

[0091]

[0089] The device 700 defines flow paths for 02, air and mixed gases. In some examples, the device 700 may be designed with specific fluid entrances and exits that control flow of gases within the device, such as in a pneumatic block described in commonly owned International Patent Publication No. WO2023 / 119240, the entire contents of which are hereby incorporated herein by this reference. However it is to be understood that the flow paths described herein need not be materialized in a pneumatic block; in some embodiments the flow paths or parts thereof may be materialized by conduits and connectors arranged to provide the functionality of the respiratory devices as described herein, as would be understood by one of skill in the art. However, provision of aspects of the respiratory system using a device such as a pneumatic block comprised of cooperating block components as described herein may provide several advantages which, in addition to control of flow of gases, may also include a compact form factor and safety features such as a system for venting leaked gases as will be described below.

[0092]

[0090] In some embodiments, the pneumatic block 700 comprises three (or more) cooperating components as illustrated in Figs 3 and 4, comprising first block 710, second block 720 and third block 730. In some embodiments, the first component 710 provides a mounting surface to which the other block components may be configured to be mounted or attached. Thus, first component 710 may be regarded as providing a substantially rigid back plate. Ideally the block components are machined such as by milling, drilling, or using other machining techniques to form one or more cavities to accommodate the blower and to define the mixing chamber 500, and to form the bores which cooperate to define the 02 flow path 200, the air flow path 300 and the mixed gas flow path 400. In some embodiments, the block components are also fabricated to accommodate one or more sensors as will be explained herein. While the pneumatic block components 710, 720 and 730 are described as being milled to form the requisite cavities and bores, it is to be understood that where these block components are metallic, other metal fabrication techniques may be adopted. It is to be understood, however, that the material structure of the components need not be metallic, and one or more of the block components may comprise polymeric, ceramic or other materials or combinations of materials that may be manufactured using injection moulding or other fabrication techniques to perform the function required of the pneumatic block components. These components may, but need not, be solid block components.

[0093]

[0091] In some embodiments, cavities comprise open channels or recesses that may be configured to cooperate with a corresponding cavity in an opposing block component (e.g. the first block component 710 and the third block component 730) to define a space for receiving the blower, and which may also define the mixing chamber 500. In contrast, through bores may be regarded as closed tunnels extending through a block component having a single entrance and exit, where the tunnel defines a flow path for gas within the device. Since a through bore is a tunnel formed within the block component, there is no place within the tunnel where gases can leak. In some embodiments, the pneumatic block assembly 700 further comprises one or more sensor cavities. Fig. 4 shows the pneumatic block of Fig. 3 further showing additional components including 02 flow sensor 218, air flow sensor 318 and mixed gas flow sensor 418 in addition provision for a part of the blower 310 to protrude through opening 738.

[0094]

[0092] In some embodiments a substrate comprising a printed circuit board (PCB) 760 may be attached such as screwed, press-fit or otherwise attached to the pneumatic block 700. In some embodiments, the PCB 760 is attached to the bottom of the second block component 720. PCB 760 provides electronic components, such as e.g. processors and circuitry, configured to control operation of one or more flow path sensors, such as pressure sensors 114, 214, 414, as well as accommodating the pressure sensors themselves. The electronic components may be mounted directly on or through or indirectly coupled with the PCB such as by wiring or "harnessing" i.e. without being directly mounted on or through the PCB. At least one electronic component is located between the PCB and the pressurized gases flow path, such as in a chamber or intermediate zone. The PCB together with the components may be referred to as a PCB or PCB Assembly (PCBA). The flow path sensors are in fluid communication with the gases flow path from which they are to make sensor readings. In some examples, one or more of the sensors receive a flow of gases from the gases flow path by a tap or side line that provides a side flow of gases from the main gases flow path for the purpose of sensing a property of the gases in the flow path. In such an arrangement, the sensor itself need not be located in the gases flow path. In other examples, part of the sensor may be located in the gases flow path. In such an arrangement, a seal may be provided around the sensor to reduce the risk of gases leaking around the sensor.

[0095]

[0093] PCB 760 may also provide processors and circuitry configured to power and / or control operation of other electronic components of the device, including the blower 310, sensors 218, 318, 418 and proportional valve 212 although in some embodiments this functionality may be provided by processors and circuitry provided on a separate, larger PCB which may in some instances house the ambient pressure sensor 114. In examples where both higher power and lower power components are provided on a single substrate comprising a PCB, the vent hole through the substrate is located away from the higher power components. In some cases, one or more pressure sensors (such as 02 pressure sensor / s 214, mixed gas pressure sensor / s 414) or one or more temperature sensors may be provided on the PCB 760 and are in fluid communication with the pressurized gases flow paths defined in the second component 720 to sense pressure in the relevant flow paths. It is to be understood that other similar sensors may be accommodated on the PCB if there is enough available space on the PCB.

[0096]

[0094] To reduce the risk of gas leakage, one or more gaskets, seals or O-rings may be provided between the pressure sensors and / or flow sensors and the device 700, e.g. at second component 720 in some examples. In some embodiments, one or more pressure sensors 214 and / or one or more flow sensors 218 may be provided to measure oxygen pressure and / or flow rate. These parameters may be used e.g. to determine if an oxygen supply 210 has been connected to the oxygen inlet 712. There may be a pressure sensor 414 in the mixed gas flow path 400. In some embodiments, there may be two pressure sensors in the mixed gas flow path 400, one of which may be redundant and provided as a backup sensor in the event that the first mixed gas pressure sensor fails. In some embodiments where there are two or more pressure sensors, one pressure sensor may operate over a different pressure range from another pressure sensor, for example one sensor providing accurate sensing at high pressures and another sensor providing accurate sensing at low pressures.

[0097]

[0095] An 02 inlet 712 may be provided at the rear of the block 700 and may comprise or couple with an 02 conduit coupling such as a Diameter Index Safety System (DISS) type connection of standard CGA V-5:2019 although other connection types may be used depending on system requirements. The 02 inlet 712 receives 02 from 02 supply 210. In some embodiments, the 02 inlet 712 may be arranged to receive the coupling for an 02 supply conduit when inserted with a force applied perpendicular to the rear face of the first component 710 of block 700. This arrangement may allow for the user to easily insert the 02 supply coupling into the 02 inlet 712. An 02 pressure sensor 214 may be provided to sense pressure of gas from the 02 source 210. In some embodiments, the 02 pressure sensor 214 may be mounted on PCB 760 and sense pressure of the oxygen entering the 02 inlet 712 (e.g. upstream of the proportional valve when provided). Seals, gaskets or O-rings may be provided to reduce risk of gas leakage where the pressure sensor 214 is provided in the 02 flow path 200. Flow sensors or other similar sensors may be positioned in the same, or substantially similar positions as the pressure sensor / s 214 described above.

[0096] The device may be provided with a housing 900 forming an outer casing. The housing may be moulded from a polymer (for example polycarbonate) and / or formed from another material. In some cases, the device contained within housing 900 may be operable to supply up to 100% 02 to a patient via outlet connector 800. However, a leak from any flow path within the device may cause 02 to flow or accumulate inside the housing. In addition to the flow generating device, the housing 900 may contain various electrical equipment. Owing to the potential for flows to contain a high concentration of 02, in the event of a gas leak from the device, gases coming into contact with the electrical equipment may present a risk of fire.

[0098]

[0097] Some examples of the present disclosure provide various features and advantages that may mitigate the risk of fire attributable to potential ignition of 02 containing gas. For example, the housing material may provide flame retardancy, such that in the event of a fire, the housing may self-extinguish the fire. Alternatively or additionally, the pressurized gas generating device within the housing may be arranged relative to vent openings to ambient air (i.e. outside the housing) such that gases escaping from the device in the unlikely event of a leak can vent easily to outside the housing.

[0099]

[0098] Alternatively or additionally, electronic components within the housing may be separated such that components consuming higher power, such as a blower or I / O interface, are located distally from, or on a separate substrate (e.g. PCB) to components, such as pressure and flow sensors, that consume lower power. These lower power components may comprise sensors which require fluid communication with an oxygen rich gas gases flow path. For an additional layer of safety against such components being in fluid communication with oxygen rich gases and / or contributing to gases leak e.g. due to mechanical and / or sealing failure, the PCB or part of the PCB comprising these components may be located in closer proximity to one or more vents openings to ambient air. Thus, if oxygen contacts the lower power components, e.g. due to a gases leak, the risk of fire may be lower than if there were higher power components located on the same PCB and / or reduced venting to ambient air outside the housing. Fig. 5 provides one example of separate PCBs provided with the device 700, wherein PCB 760 houses lower power components and PCB 780 houses higher power components. In the example shown, the orientation of PCB 760 and PCB 780 is such that they are arranged orthogonally to achieve a compact form factor, although that need not be the case.

[0100]

[0099] In some embodiments it may be desirable to provide one or more other measures to prevent or reduce accumulation of 02 within the housing. This may be achieved, in some embodiments, by use of a system for venting leaked gases comprising a substrate comprising an electronic component in fluid communication with a pressurized gases flow path and one or more vent hole as shown in Figs. 8 and 9.

[0101]

[0100] According to embodiments of the present disclosure, a system for venting leaked gases comprises a substrate such as a PCB, having at least one electronic component in fluid communication with a pressurized gases flow path and one or more vent hole in the substrate. The pressurized gases flow path may be provided by a device taking any suitable form. In some examples, the device may comprise one or more channels that may be e.g. machined or molded in a solid material to define one or more pressurized gases flow paths, or part thereof. In some examples, the device may comprise one or more conduits which define one or more pressurized gases flow paths or part thereof. In an example, the pressurized gases flow path may be provided by a device, such as a pneumatic device of the kind described above. Figs 6 and 7 are front and rear views respectively of a component 720 of such a device, defining an oxygen flow path 200, air flow path 300 and mixed gases flow path 400. In this arrangement, one or both of the oxygen flow path 200 and the mixed gases flow path 400 may be pressurized gases flow paths from which gas may leak as described below. Figs 6 and 7 omit the substrate for clarity however this is shown, together with the component 720, in Figs 8 and 9.

[0102]

[0101] Fig. 8 is a perspective front view of the device of Figs 3 to 5 from below, showing a substrate in the form of PCB 760. The substrate may be attached to the device 700 by use of fasteners 762. As shown in the exploded view of Fig. 9, PCB 760 may comprise one or more electronic components such as sensors, capacitors, resistors and the like. In some examples, it may be preferred that components provided on the PCB consist only of low power components such as components consuming less than about 1500 mA or less than about 1000 mA or less than about 500 mA or less than about 250mA. In some examples, the PCB may further comprise a fuse which limits the current to about 1500 mA or about 1000 mA or about 500 mA or about 250mA. The electronic components may comprise sensors such as e.g. pressure, flow, temperature, humidity and / or gas composition sensors to name a few. In some embodiments, the sensors may be arranged on a common surface, such as the substrate or PCB 760.

[0103]

[0102] In the example shown, the electronic components comprise pressure sensors 114, 214, 414 which are mounted on a common surface, comprising the substrate 760. The sensors may be arranged in fluid communication with the flow paths 300, 200, 400 to sense characteristics such as pressure, flow, temperature, humidity and / or gas composition in the ambient air, oxygen and mixed gas flow paths respectively. One or more pressure sensors may be differential pressure sensors. This means they are in fluid communication with ambient air and the device cavity for which the pressure measurement is being obtained.

[0104]

[0103] In some examples, a pressure sensor may be an oxygen pressure sensor 214 in fluid communication with the 02 flow path 200. Two pressure sensors may be mixed gases pressure sensors 114, 414 in fluid communication with the mixed gases flow path 400.

[0105]

[0104] In some examples, the oxygen pressure sensor 214 and / or mixed gas pressure sensors 114, 414 may be differential pressure sensors. The differential pressure sensors may utilize the at least one vent hole 764 to obtain a reading of atmospheric or ambient pressure. In some examples, the at least one pressure sensor may be electronic or electro-mechanical which may not require fluid communication with the atmosphere. In other examples, pressure sensor 114 may be provided in fluid communication with the mixed gases flow path such that pressure sensors 114 and 414 sense pressure in the mixed gases flow path, providing redundancy in the event that one of the pressure sensors fails.

[0106]

[0105] In the example shown in Figs 8 and 9, a pressurized gas flow path comprises gases from the 02 flow path 200. A pressurized gases flow path may also comprise a mixed gases flow path 400. For example, pressurized gases flow may be a flow of gases with a pressure higher than atmospheric pressure. For example, at sea level this is greater than latm. In the 02 flow path 200 the pressurized gases flow may have pressure between lOOkPa to 700kPa.

[0107]

[0106] As shown in Fig. 10, vent hole 764 is located in the substrate 760 in close proximity to, such as beneath, the 02 pressure sensor 214, being an electronic component which is arranged in fluid communication with the pressurized gases flow path. This arrangement may be beneficial in the event that there is an uncontrolled leak of 02 arising from e.g. mechanical failure of the pressure sensor 214 and / or a feature such as a seal that normally isolates the pressurized gases in flow path 200 within the device 700 from surrounding air. One example of such a seal may be around the electronic component (e.g. seal 755 in Fig. 14), or a seal elsewhere in the pressurized flow path.

[0108]

[0107] In the event of a leak the vent hole 764 provides a lower resistance to flow for the leaked pressurized gases such that the leaked gases travel preferentially though the vent hole to a region of lower pressure, rather than trying to escape e.g. around the edges of substrate 760. It is to be noted that additional vent holes may be provided. Additional vent holes may provide e.g. a vent path through the substrate for leaked gases arising from failure of features or components in a different pressurized gas flow path such as mixed gas pressure sensor 414. Additional vent holes may provide e.g. two or more lower resistance to flow vent paths for gases leaked from a single pressurized gases flow path. Owing to the lower resistance to flow provided by the one or more vent holes 764, the system for venting leaked gases is passive, unlike the active system for venting gases described with reference to the gas dispersing blower 650 below. Furthermore, the low resistance to flow provided by the one or more vent holes 764 means that a seal is not required between the substrate and the device, since the resistance to flow between the substrate and the device is relatively higher than the resistance to flow through the one or more vent holes. In some examples comprising a single vent hole, a (hydraulic) diameter of the vent hole of about 2-20 mm, such as about 2-10 mm or about 3-6 mm may achieve a sufficiently low resistance to flow although it is to be understood that a vent hole diameter greater than 20 mm may be provided.

[0109]

[0108] In some examples, the device 700 providing the pressurized gases flow path may comprise a recess 725 configured to cooperate with at least part of the substrate 760 as shown in the exploded view of Figs 9 and 13, to define a gases channel. One or more vent holes 764 provided in the substrate 760 provide a vent path from the gases channel, e.g. to outside the device 700. In the embodiment shown, the gases channel forms a chamber 727 when substrate 760 is attached to the device 700. While not essential to performance of the invention, chamber 727 provides an intermediate zone for leaked gases to accumulate. An advantage of a chamber or intermediate zone for leaked gases to accumulate arises due to the ability to vent gases from a plurality of leak sources through a single vent hole. For example, leak sources from failure of different electronic components such as flow sensors provided on the substrate, as well as leak sources from failure of seals or other features in different pressurized gases flow paths. In examples not providing a chamber or intermediate zone, a separate vent hole may be provided as a dedicated leak path for each electronic component provided on the substrate and / or each pressurized gases flow path, from which a gas leak may occur. As will be discussed below, location of a further sensor in chamber 727 may provide other advantages such as in leak detection. In the event of a component failure giving rise to leaked pressurized gases e.g. from the oxygen flow path 200 or mixed gas flow path 400 entering the gases channel (with or without chamber 727), the one or more vent holes 764 provide a vent path out of the device 700, and away from the electronic components on the substrate 760. The vent paths arising from the one or more vent holes provide a lower resistance to flow than alternative vent paths that may exist between the substrate 760 and the device 700, such as around the substrate.

[0110]

[0109] The embodiment illustrated in Figs 8 to 11 shows the vent hole 764 with an insert 768. The insert 768 may extend the leak path to direct the leaked gases further away from the substrate 760. In some examples, the insert may provide a convenient means for connecting a venting conduit 766, described below, to the substrate 760. However an insert 768 need not be provided, and a vent hole 764 in the substrate 760 without the insert may in some embodiments provide a low resistance to flow vent path for leaked gases to travel away from the device 700 and the electronic components on the substrate 760.

[0111]

[0110] In embodiments comprising a vent hole 764 with or without an insert 768 as shown in Figures 8, 9 and 10 the system may comprise a housing which contains the device 700 and the substrate 760. Figure 11 shows the device 700 and rear portion of the housing 900. The device 700 may be assembled in a housing 900 with the system for venting leaked gases comprising the substrate 760, vent hole 764 and optional insert 768 located such that they provide a vent path for leaked gases from the pressurized gases flow path to exit toward gases outlet 930. From here, leaked gases can exit the housing 900 into ambient air, for example through gases outlets 930 in the housing. Thus in some embodiments, the system for venting leaked gases may be considered part of a respiratory support system comprising the housing 900 containing the device 700 and the substrate 760 as described in the examples herein. In some embodiments, the housing may also comprise an active system for venting gases as described below, and leaked gases from the passive venting flow path can join a flow of actively dispersed gases from the active system, to exit the housing.

[0112]

[0111] In some embodiments, the system for venting leaked gases may comprise one or more venting conduits 766. A venting conduit 766 may be provided to define a flow channel from a vent hole 764 to air outside the housing 900. A venting conduit may be coupled with the substrate at the vent hole 764 with or without an insert 768. Figs 12 and 13 provide an example. Similar to Figs 8 and 9, a pressurized gas flow path may comprise gases from the 02 flow path 200. As shown in Fig. 14, vent hole 764 is located in the substrate 760 in close proximity to, such as beneath, the 02 pressure sensor 214, being an electronic component which is arranged in fluid communication with the pressurized gases flow path. In addition, a venting conduit 766 is provided. The venting conduit 766 may be integrally formed with the substrate 760 or coupled with the substrate e.g. directly or using an insert 768, so as to provide a channel for leaked gases to be directed further away from the device 700 and the electronic components on the substrate 760. In some embodiments, venting conduit 766 spans a distance between the vent hole 764 in the substrate 760 and the exterior of housing 900, such that leaked gases are directed to ambient air outside the housing. This may provide an additional level of safety since there is no reliance on circulation of air around the device 700 for the leaked gas to be removed from the housing 900. Thus, a venting conduit 766 may be advantageous in embodiments where no active system is provided to circulate or disperse gases from inside the housing 900 to the outside through gases outlets such as outlets 930, or in scenarios where such a system exists but experiences operational failure. In some embodiments, venting conduit 766 may be made from or include a flexible and / or compliant material that may reduce transfer of external forces to the substrate, which may otherwise damage the substrate. Such external forces may arise from dropping the device or other high impact forces.

[0113]

[0112] Furthermore, venting conduit 766 has openings at both ends. At one end the venting conduit 766 is in fluid communication with the vent hole 764 in the substrate 760. At its other end, the venting conduit 766 ends at or protrudes through the housing 900 so that it is in fluid communication with atmosphere or ambient air outside the housing. Owing to this arrangement, pressure sensors 114, 214 and 414 are always exposed to atmospheric pressure or the pressure of the surroundings at the exterior of the housing 900. This may be advantageous when an active system for venting of gases inside the housing 900 is operational. An active venting system may cause pressure fluctuations within the housing. With the venting conduit 766 in place, pressure sensors 114, 214 and 414 are exposed to atmospheric pressure at all times mitigating the effects of pressure fluctuations caused by the active system on pressure sensor performance.

[0114]

[0113] Thus, embodiments providing a venting conduit 766 may be advantageous in the event that there is an uncontrolled leak of 02 arising from e.g. mechanical failure of the pressure sensor 214 (or another sensor in fluid communication with the pressurized gases flow path) and / or a feature such as a seal that normally isolates the pressurized gases in flow path 200 within the device 700 and prevents gases leaks. One example of such a seal may be around the electronic component (e.g. seal 755 in Fig. 14), or a seal elsewhere in fluid communication with the pressurized gases flow path. In the event of such a failure, the vent hole 764 is in fluid communication with venting conduit 766 which provides a lower resistance to flow for the leaked pressurized gases such that the leaked gases travel preferentially though the vent hole and the venting conduit to a region of lower pressure outside the housing 900, rather than trying to escape e.g. around the edges of substrate 760. It is to be noted that additional vent holes and associated venting conduits may be provided e.g. to provide a vent path through the substrate and out of the housing for leaked gases arising from failure of features or components in a different pressurized gas flow path such as mixed gas pressure sensor 414, or to provide two or more lower resistance to flow vent paths to outside the housing for gases leaked from a single pressurized gases flow path. In a manner similar to the examples described with reference to Figs 8 to 11, owing to the lower resistance to flow provided by the one or more vent holes 764 and conduits 766, the system for venting leaked gases as disclosed particularly with reference to Figs 5 to 20 is passive, unlike the active system for venting gases comprising a gas dispersing blower 650 as discussed in relation to Figs 21 to 25 below.

[0115]

[0114] In some examples, one or more electronic components may be located on the substrate 760 to align with and be at least partially received within one or more device ports on the device 700. In some examples, a device port may align with and form part of the pressurized flow path as illustrated in Fig 16 and 17 which show an underside of the device 700, and the top (device side retaining side) of the substrate 760, respectively. Such ports may be manufactured or machined into the device 700 so as to provide access to flow paths within the device. In some examples, the flow paths may comprise one or both of a pressurized oxygen gas flow path and a pressurized mixed gas flow path, and electronic components such as sensors may be in fluid communication with one or both of these flow paths. In some examples, device ports 712, 713 and 711 may receive oxygen, mixed gas and air pressure sensors 214, 414 and 114 respectively although that need not be the case. In other examples it may not be necessary to measure air pressure. Instead, it may be beneficial to utilize the pressure sensor 114 as a second mixed gas pressure sensor to provide redundancy in case pressure sensor 414 fails. In this case, both pressure sensors 114 and 414 would be in fluid communication with the mixed gases flow path 400 such as in Fig. 17, where pressure sensors 114 and 114 are arranged to sense pressure from flows on opposing sides of the mixed gases flow path 400. This may be beneficial to protect the patient from being exposed to higher airway pressures than are required, such as in the event of a malfunction in the device and failure of one of the pressure sensors in the mixed gases flow path. At least one vent hole 764 is provided in the PCB 760 but is obscured from view in Fig. 17 by pressure sensor 214.

[0116]

[0115] In some examples, a sealing member 770 may be provided between mating surfaces of the device 700 and the substrate 760. A sealing member may comprise e.g. a gasket, O-ring or other sealing component, such as a compliant material applied to at least one of the substrate 760 and the device 700. The sealing member 770 may be provided on one or both of the mating surfaces. For example, a sealing member 770a may be provided on the mating surface of device 700. Alternatively or additionally, a sealing member 770b may be provided on the mating surface of substrate 760. In some examples, the sealing member 770 may be shaped to correspond with a perimeter of the recess 725 and cooperate such that the outward facing surface of the substrate 760 sits flush with at least part of the device 700. It is to be understood however, that even in the absence of a sealing member 770 the low resistance to flow provided by the vent hole (optionally with vent insert 766 and / or optionally with a venting conduit 768), provides a preferential vent path for leaked gases to travel away from the device. Also shown in Figs 16 and 17 are fastener holes 761 which are provided to receive fasteners 762. It is to be understood however that fasteners need not be utilized. In some examples the substrate 760 may be applied to the device 700 by use of an adhesive or clips in which case holes 761 may be omitted. In some examples, the adhesive may provide the dual purpose of attaching the substrate with the device, as well as providing a sealing member between them.

[0117]

[0116] Referring now to Fig. 18, a schematic cross sectional view of aspects of the system for venting leaked gases of the present disclosure is provided, including device 700 providing a pressurized (e.g. oxygen) gases flow path 200.

[0118]

[0117] An electronic component such as a pressure sensor 214 may be mounted on the substrate 760 comprising a PCB and in some examples may be located within a device port 722 of the device 700 so as to monitor pressures within the pressurized gases flow path 200. Thus, a component comprising a sensor may be located such that the sensor or part thereof is physically located within a bore or conduit defining at least part of the pressurized gases flow path, as opposed to receiving a flow of gases e.g. via a side tap. A seal 755 may isolate the high pressure gases within the pressurized gases flow path in the device 700. A sealing member 770 may be provided between mating surfaces of the device 700 and the substrate 760 although as described above, this feature may be omitted including in embodiments providing for leak detection or testing. In various embodiments (not limited to those relating to leak testing), a constriction 723 may be provided between the pressurized gases flow path 200 and the electronic component 214. The constriction may have a resistance to flow such that the flow rate of leaked gases is lower than the flow rate of gases in the pressurized gases flow path, for example the resistance to flow may be such that the flow rate of leaked gases is between about 20% and 30% of the flow rate of gases in the pressurized gases flow path from which the gases are leaked. The resistance to flow may be determined to achieve a reduction in flow rate that limits the likelihood of oxygen concentration exceeding about 24% or about 25% inside the device housing. In some examples, the constriction 723 may allow a leakage flow rate of e.g. 20 LPM or 18 LPM or 16 LPM or 14 LPM when the flow rate of pressurized gases in flow path 200 is e.g. 70 LPM. Limiting the leakage flow rate may enhance device safety in an 02 rich environment by reducing the risk of fire.

[0118] In the event of mechanical failure of the electronic component 214 or the seal

[0119] 755, leaked gases from pressurized flow path 200 may accumulate in the chamber 727, and exit through vent hole 764. In some embodiments, chamber 727 may be defined by a recess in the device 700 and / or the substrate 760. However that need not be the case and the chamber may be provided by e.g. a walled body defining a chamber between a portion of the device 700 from which gases may leak from a pressurized gases flow path, and the substrate 760. The walled portion may be a separate component that cooperates with the device and the substrate, or it may comprise an extension or skirt portion of the device. In some examples, the walled body may form part of a box that is applied over the device 700 to define the chamber between the device and the substrate. In some examples, the device may comprise a pneumatic block formed from e.g. metal such as aluminium, or ceramic, polymer, or composite material / s in which bores are machined or moulded defining one or more flow paths for pressurized gases, which may be in fluid communication with one or more electronic components on the substrate. In some examples, the device 700 may comprise a one or more tubes that are fluidical ly coupled to provide one or more pressurized gases flow paths which are in fluid communication with one or more electronic components on the substrate. Vent hole 764 in the substrate 760 provides a vent path for leaked pressurized gases out of the chamber 727, due to the low resistance to flow presented by the vent hole. In some examples, more than one vent hole may be provided.

[0120]

[0119] A pressure sensor 714 may be provided to monitor gas pressure in the chamber 727. The pressure sensor 714 may be mounted on the substrate 760. Pressures monitored by pressure sensor 714 may be used to determine the presence of a leak. Pressure sensor 714 may comprise a differential pressure sensor or an absolute pressure sensor since, as will be explained, a relative increase in pressure may be used to determine the presence of a leak and absolute or relative values are not required. Determination of or testing for leak may be made e.g. during service or maintenance as will now be explained. Although explained in relation to an example in which a vent hole 764 is provided without a venting conduit 766 or a vent insert 768, it is to be understood that examples of the system for venting leaked gases which provide leak detection will apply similarly for examples in which a vent insert and / or a venting conduit are provided.

[0120] During operation of the device 700 in the absence of a pressurized gas leak, the vent hole 764 maintains pressure within the chamber 727 at ambient pressure. Thus, in the absence of a pressurized gases leak, values obtained from pressure sensor 714 will remain substantially stable, and may correspond with ambient pressure values. The vent hole 764 may be sized such that in the event of a substantial leak, such as a leak from a pressurized gases flow path containing gases at very high flow rates, the vent hole is unable to maintain pressure within the chamber 727 at ambient pressure and pressure within chamber 727 may increase as may be detected by pressure sensor 714. Thus, an increase in pressure measured by pressure sensor 714 would be indicative of a gases leak from the pressurized gases flow path.

[0121]

[0121] Alternatively or additionally, a gas concentration sensor may be provided in the chamber 727 to monitor gas concentration. In examples containing a pressurized oxygen flow path an oxygen sensor 715 may be provided to monitor oxygen concentration in the chamber 727. The oxygen sensor 715 may be mounted on the substrate 760. Oxygen concentration monitored by an oxygen sensor 715 may be used to determine the presence of a leak from a pressurized oxygen gases flow path. Similarly, a gas concentration sensor for a different gas may be used to determine the presence of a leak from a pressurized gases flow path containing the different gas. A relative increase in oxygen concentration may be used to determine the presence of a leak; absolute or relative values are not required. Determination or testing for leak may be made e.g. during service or maintenance as will now be explained. Although explained in relation to an example in which a vent hole 764 is provided without a venting conduit 766 or a vent insert 768, it is to be understood that examples of the ventilation system providing leak detection will apply similarly for examples in which a vent insert and / or a venting conduit are provided.

[0122]

[0122] During operation of the device 700 in the absence of a pressurized oxygen gas leak, the vent hole 764 maintains oxygen concentration within the chamber 727 at ambient levels e.g. approximately 21% oxygen concentration for room air in many environments. Thus, in the absence of a pressurized oxygen gas leak, values obtained from oxygen sensor 715 will correspond with ambient oxygen concentration values. The vent hole 764 may be sized such that in the event of a substantial leak, such as a leak from a pressurized oxygen gas flow path containing gases at very high flow rates (e.g. exceeding 70 LPM or exceeding 20 LPM or exceeding 40LPM), the vent hole is unable to maintain oxygen concentration at ambient levels and oxygen concentration within cavity 727 may increase as may be detected by oxygen sensor 715. Thus, an increase in oxygen measured by oxygen sensor 715 would be indicative of a gases leak from the pressurized oxygen gas flow path.

[0123]

[0123] In some cases, it may be desirable to intentionally occlude flow through the vent hole 764 to determine if there is a gases leak from the pressurized gases flow path. During operation of the device 700 in the absence of a pressurized gas leak, the chamber 727 remains at ambient pressure (and / or oxygen concentration) including while flow through the vent hole 764 is occluded since the gas inside the chamber is static with substantially no gas entering or leaving. However in the event of a leak, e.g. due to mechanical failure of the electronic component 214 or the seal 755, leaked gases from pressurized flow path 200 may accumulate in the chamber 727. While vent hole 764 is occluded, the accumulated gases in chamber 727 give rise to an increase in pressure measurable by pressure sensor, and / or an increase in oxygen concentration in the case of a pressurized oxygen gas leak. The graph in Fig. 19 represents changes in pressure values over time as measured by pressure sensor 714, when flow through the vent hole 764 is occluded and in the presence of leaked gases from the pressurized gases flow path. P0 represents ambient pressure. At Tl, vent hole 764 is occluded, e.g. by application of a user's finger, hand, a plug or otherwise covering over the vent hole or a vent insert 768 or venting conduit 766. This may be achieved relatively easily in embodiments where a venting conduit 766 provides a vent path to outside the housing 900 (see Fig. 15). When flow through the vent hole 764 is occluded in the presence of a leak, pressurized gases accumulate in the chamber 727 and at T2, pressure sensor 714 registers an increase in chamber pressure to Pl. When the occlusion is removed at T3, accumulated gases exit the chamber 727 via the vent hole 764 (and optional vent insert 768 and / or venting conduit 766) to ambient air and pressure within the chamber 727 returns to ambient air pressure (P0) after time T4. Thus, if pressure sensor 714 detects an increase in pressure during operation of the device 700 while flow through the vent hole 764 is occluded, a leak has been detected. The process of occluding and reopening flow through the vent hole 764 may be repeated two or more times to establish certainty about leak detection. Changes in gas concentration values over time would follow a similar pattern to Fig. 19.

[0124] The schematic of figure 19 is an example only. In some cases, once the vent hole 764 is occluded, the pressure may continue to increase until the occlusion is removed. That is, the pressure may continue to rise between T2 and T3. In other cases, once the vent hole 764 is occluded, the pressure may rise and stabilize around a specific range as shown in Figure 19. This may be because a leak establishes between the substrate 760 and the surroundings exterior to the housing 900, particularly if there is no sealing member 770.

[0124]

[0125] Occlusion of flow through the vent hole 764 to test for presence of a leak from the pressurized gases flow path may be undertaken by a technician during scheduled maintenance (e.g. twice yearly) or when repairing or troubleshooting operational issues outside of scheduled maintenance. In some examples, the controller 4 may provide a leak detection function which guides a user e.g. via I / O interface 20, to occlude the vent hole 764 or venting conduit 768, as part of a leak testing procedure. In some examples, leak detection may be undertaken in an automated or semi-automated manner, e.g. using a switch or plug to occlude the vent hole 764, under the control of controller 4. In some examples, such a switch may be operated by controller 4 during a testing protocol in which the controller operates the device 700 to generate a pressurized flow of gas with the switch or plug occluding flow in the vent hole. The protocol may operate the switch or plug to perform one or more close-open or open-close cycles and monitor pressure values from pressure sensor 714 and / or gas concentration sensor 715 to determine if there is an increase in chamber pressure and / or gas concentration e.g. above ambient. The pressure sensor 714 and / or gas concentration sensor 715 may be in operative communication with controller 4 such that detection of a pressure or gas concentration increase inside chamber 727 causes controller 4 to present one or more visible and / or audible and / or tactile indications, such as alerts, to be presented on the I / O interface 20. In some examples, the controller 4 may cause an indication of the pressure and / or gas concentration inside the chamber 727, such as high, very high, or an absolute or relative value, to be presented on the I / O interface 20 which may assist to gauge the size of the leak. In some examples, the controller 4 may cause a fault event to be logged in a memory device which is in operative communication with the controller 4.

[0125]

[0126] In some examples, a valve 728 may be provided to control flow through the vent hole 764, as illustrated in Fig. 20. The valve 728 may be "normally open" such that during normal operation of the device 700, valve 728 provides a low resistance to flow vent path for leaked pressurized gases such that, in the event of a mechanical failure of the electronic component 214, or the seal 755, leaked gases from pressurized gases flow path 200 may accumulate in the chamber 727 and exit past the valve 728 and through vent hole 764. In some examples, valve 728 may comprise a pressure responsive (i.e. pneumatic) valve, wherein the size of the valve opening in vent hole 764 increases with increasing pressure in the chamber 727. Thus in the presence of a leak, increasing pressure within the chamber 727 is met with a larger vent path to ensure the resistance to flow for leaked gases to exit remains sufficiently low. This may be explained with reference to the schematic illustration of Fig. 20, where valve 728 lifts in response to an increase in pressure in chamber 727, to increase the size of the vent path in vent hole 764 through which gases can escape. This may enhance operation of the safety feature provided by the system. The valve may comprise a pneumatic valve such as a directional valve, a proportional valve, or a passive mechanical pneumatic valve. A pneumatic valve may provide a rapid, such as almost instantaneous, response to increasing pressures in chamber 727. In other examples, an electronic valve such as an electronic pressure relief valve or solenoid, may be provided although such valves require electronic control e.g. by controller 4, in order to respond to an increase in pressure determined by pressure sensor 714 and / or an increase in gas concentration determined by gas concentration pressure sensor 715, and increase the valve opening.

[0126]

[0127] To test for the presence of a leak of pressurized gases from the pressurized gases flow path, the valve 728 may be intentionally closed thereby occluding flow through vent hole 764 in a manner similar to occlusion of flow in the vent hole 764 as described with reference to Figs 18 and 19. When valve 728 is closed, there is no vent path to atmosphere through vent hole 764. During operation in the absence of a leak, pressure values measured by pressure sensor 714 and gas concentration sensors measured by gas concentration sensor 715 will remain constant, e.g. at ambient values. However, in the presence of a leak while the valve 728 is closed, leaked gases will accumulate within the chamber 727. As shown in Fig. 19, pressure sensor 714 will register an increase in chamber pressure from P0 at TO to Pl at T2. When valve 728 is reopened at T3, gases within the chamber 727 will exit via the vent hole 764 such that pressure values within the chamber 727 will recover to P0 after T4. Similarly to examples not providing a valve 728, changes in gas concentration values over time would follow a similar pattern to Fig. 19.

[0127]

[0128] Closure of valve 728 may be performed manually, or electronically. Testing for leaks from the pressurized gases flow path may be undertaken by a technician during scheduled maintenance (e.g. twice yearly) or when repairing or troubleshooting operational issues outside of scheduled maintenance. In some examples, the controller 4 may provide a leak detection function which guides a user e.g. via I / O interface 20, to close the valve 728, as part of a leak testing procedure. In some examples, leak detection may be undertaken in an automated or semi-automated manner. In some examples, valve 728 may be controlled by controller 4 during a testing protocol in which the controller operates the device 700 to generate a pressurized flow of gas with the valve 728 closed. The protocol may operate valve 728 to perform one or more close-open or open-close cycles. The pressure sensor 714 may be in operative communication with controller 4 such that detection of a pressure and / or gas concentration increase inside chamber 727 (causes controller 4 to present one or more visible and / or audible and / or tactile indications, such as alerts, to be presented on the I / O interface 20. In some examples, the controller 4 may cause an indication of the pressure and / or gas concentration inside the chamber 727, such as high, very high, or an absolute or relative value, to be presented on the I / O interface 20 which may assist to gauge the size of the leak. In some examples, the controller 4 may cause a fault event to be logged in a memory device which is in operative communication with the controller 4. It is to be understood that more than one valve 728 may be provided, e.g. in examples comprising more than one vent hole 764 wherein a separate valve would be provided for controlling flow through each vent hole. These may be operated manually, or in an automated or semiautomated manner under control of controller 4.

[0128]

[0129] Examples of the system for venting leaked gases disclosed herein may provide a safety measure for management of leaked pressurized gases, such as oxygen, which may present a risk in some respiratory support systems. An advantage of the system for venting leaked gases according to the present disclosure is that it is passive, requiring no additional powered components to provide a safe vent path in the event of a gases leak. However, in some cases it may be desirable to combine a passive system as disclosed herein with an active system for venting gases comprising a gas dispersing blower, as described below.

[0130] An active system for venting gases comprising a gas dispersing blower may be desirable to prevent accumulation of leaked gases such as oxygen within the housing 900, such as between the device 700 and the housing. This may be achieved, in some embodiments, by use of a gas dispersing fan or blower 650 as shown in Figs 21 and 22 which is distinct from the blower 310 generating the pressurized gas flow. An active system for venting gases comprising a gas dispersing fan or blower 650 may be provided in addition to a system for venting leaked gases as described in relation to Figs 1 to 20.

[0129]

[0131] Referring to Figs 21 and 22, ambient air may be drawn into the housing 900 to the gas dispersing blower 650 through air intake 923. An example of air intake 923 is shown in more detail in Figs 23 to 25 and may comprise a separate removable filter 926 with a removable filter cover 927. The filter 926 may cover a recess 928 in the housing 900 which receives the filter 926. The filter cover 927 may be a snap-fit or press-fit, screwed or otherwise fastened in position in a manner which enables removal (e.g. by levering off with a flat screwdriver head or other tool) to give access to the filter 926 for cleaning, replacement and the like. Ideally, air drawn in through air intake 923 is drawn into the housing 900 by the gas dispersing blower 650 and may be dispersed within the housing to minimize dead space. This may reduce or prevent oxygen accumulation in the housing.

[0130]

[0132] Flow within the housing may take a path of least resistance as exemplified by the arrows in Fig. 21. However, the flow inside the housing may be directed e.g. to minimize oxygen accumulation. Fig. 22 shows an alternative flow path for air entering intake 923, wherein the flow is directed substantially across the width of the device before it travels downward to the air outlet 930. Flows closer to the gas dispersing blower 650 may travel with a faster velocity, with the air flow slowing as it travels toward air outlet 930. One or more baffles may be provided to direct flow within the housing, as described in commonly owned International Patent Publication No. WO2023 / 119240, the entire contents of which are hereby incorporated herein by this reference.

[0131]

[0133] Providing active venting of gases around device 700 inside the housing 900 may reduce accumulation of oxygen and may provide a further beneficial effect of thermal regulation by removing heat from inside the housing. This may further improve efficiency of operation and reduce the risk of components in the device overheating.

[0134] Figure 26 provides a perspective view from below of an apparatus incorporating a system for venting leaked gases according to an embodiment of the present disclosure, showing the gases outlet 930 through which gases may exit the housing 900, and venting conduit 766 providing a vent path for leaked gases as described above.

[0132]

[0135] Embodiments of the system for venting leaked gases described herein provide a safety mechanism which may mitigate risks arising from accumulation of oxygen rich gases. This may be useful in respiratory support systems in which active venting or dispersal of gases inside the housing is either absent or not operational.

[0133]

[0136] While it is to be understood that the system for venting leaked gases of the present disclosure has been described in the context of mitigating risk arising from leaked pressurized gases comprising oxygen and in the context of respiratory support systems, it is to be understood that applications of the presently disclosed system are not limited to this use case, and the system may be deployed in any device or apparatus that generates or pressurizes flammable gases or other gases that present a risk in higher concentrations. While active systems comprising gas dispersing blowers and alike are known, the present invention provides a useful alternative which provides passive venting of leaked gases, consuming no power. Furthermore, formation of the vent hole in the substrate on which electronic components mounted does not increase the footprint or form factor of the device adds minimal manufacturing complexity and cost.

[0134]

[0137] According to some examples disclosed herein, the system for venting leaked gases may mitigate accumulation of oxygenated gases proximal to higher-powered electronic components within the housing, such as those electronic components that may be mounted on a substrate such as PCB 780. In some examples may mitigate accumulation of gases within the housing above about 25% or above about 24% oxygen concentration. This may be achieved in some examples, by providing passive direction of leaked gases across a pressure gradient toward an ambient environment. This may be combined in some examples by active venting of gases out of a device housing using a gas dispersing blower as described below.

[0135]

[0138] It is to be understood that various modifications, additions and / or alternatives may be made to the parts previously described without departing from the ambit of the present disclosure as defined in the provisional claims appended hereto.

[0139] The disclosure may also be said broadly to consist in the parts, elements and features referred to or indicated in the specification of the application, individually or collectively, in any or all combinations of two or more of said parts, elements or features. Where, in the foregoing description reference has been made to integers or components having known equivalents thereof, those integers are herein incorporated as if individually set forth. Similarly, where in the foregoing description reference has been made to features or elements of a particular aspect or embodiment, it is to be understood that those features or elements are herein incorporated as if expressly disclosed in combination with other aspects or embodiments for which a skilled addressee would appreciate those features or elements to be compatible.

[0136]

[0140] Where any or all of the terms "comprise", "comprises", "comprised" or "comprising" are used in this specification (including the provisional claims) they are to be interpreted as specifying the presence of the stated features, integers, steps or components, but not precluding the presence of one or more other features, integers, steps or components or group thereof.

[0137]

[0141] Future patent applications may be filed on the basis of or claiming priority from the present application. It is to be understood that the following provisional claims are provided by way of example only, and are not intended to limit the scope of what may be claimed in any such future application. Features may be added to or omitted from the provisional claims at a later date so as to further define or re-define the invention or inventions.

Claims

Claims1. A system for venting leaked gases, the system comprising: a substrate comprising: at least one electronic component in fluid communication with a pressurized gases flow path; and one or more vent hole; wherein the one or more vent hole provides a vent path through the substrate for leaked gases from the pressurized gases flow path.

2. The system of claim 1, wherein the venting of leaked gases is passive.

3. The system of claim 1 or claim 2, wherein part of the at least one electronic component is located within the pressurized gases flow path.

4. The system of any one of claims 1 to 3, wherein upon failure of a feature normally confining gases within the pressurized gases flow path, leaked gases travel via the one or more vent hole away from the pressurized gases flow path.

5. The system according to claim 4, wherein the feature normally confining gases within the pressurized gases flow path comprises a component selected from a group comprising: an electronic component on the substrate; a seal separating flow in the pressurized gases flow path from the substrate; and a seal in the pressurized gases flow path.

6. The system according to any one of the preceding claims, wherein the at least one electronic component comprises a sensor such as a pressure sensor, flow sensor, temperature sensor, humidity sensor or a gas composition sensor.

7. The system according to any one for the preceding claims, wherein the substrate comprises only electronic components having low power requirements.

8. The system according to ay one of the preceding claims, wherein the at least one electronic component comprises a differential pressure sensor.

9. The system according to any one of the preceding claims, wherein a device defines the pressurized gases flow path, and optionally wherein the device is a pneumatic device.

10. The system according to claim 9, wherein the device comprises a recess configured to cooperate with at least part of the substrate to define a gases channel.

11. The system according to claim 10 wherein the gases channel comprises a chamber.

12. The system according to claim 10 or claim 11, wherein the one or more vent hole provides a vent path from the gases channel.

13. The system according to any one of claims 9 to 12, wherein a vent path comprising the one or more vent hole through the substrate provides a lower resistance to flow than an alternative vent path formed between the substrate and the device.

14. The system according to any one of claims 10 to 13, comprising a sealing member providing a substantial seal between mating surfaces of the device and the substrate.

15. The system according to claim 14, wherein the sealing member comprises a gasket.

16. The system according to any one of claims 10 to 15, wherein the recess and the substrate cooperate such that a surface of the substrate sits flush with at least part of the device.

17. The system according to any one of claims 9 to 16, wherein one or more electronic components on the substrate are located to align with and be at least partially received within one or more device ports of the device.

18. The system according to any one of claims 9 to 17, wherein one or more electronic components on the substrate are in fluid communication with one or more device ports of the device.

19. The system according to any one of claims 9 to 18, wherein the system comprises a housing containing the device and the substrate.

20. The system according to claim 19, wherein the housing comprises one or more gases outlets for exit of gases in the housing.

21. The ventilation system according to claim 19 o claim 20, wherein the one or more gases outlets in the housing are located near the one or more vent hole.

22. The system of any one of claims 19 to 21, comprising at least one venting conduit, defining a flow channel from each of the one or more vent hole to outside the housing.

23. The system of claim 22, wherein the venting conduit vents leaked gases to outside the housing near the one or more gases outlets.

24. The system of any one of claims 19 to 23, wherein the housing comprises an active system for venting gases, and leaked gases join a flow of actively vented gases to exit the housing.

25. The system according to any one of claims 19 to 24, wherein the system mitigates accumulation of oxygenated gases proximal to higher-powered electronic components within the housing.

26. The system according to any one of the preceding claims, wherein the system mitigates accumulation of gases within the housing above 25% oxygen concentration.

27. The system according to any one of claims 10 to 26, comprising a pressure sensor configured to monitor pressure in the gases channel, wherein an increase in pressure in the gases channel is indicative of a gases leak from the pressurized gases flow path.

28. The system according to any one of claims 10 to 27, comprising a gas concentration sensor configured to monitor gas concentration in the gases channel, wherein an increase in gas concentration in the gases channel is indicative of a gases leak from the pressurized gases flow path.

29. The system according to any one of the preceding claims, wherein the substrate comprises a printed circuit board.

30. The system according to any one of the preceding claims, wherein the substrate is provided in an apparatus comprising a separate second substrate, such as a printed circuit board, comprising electronic components having higher power requirements.

31. The system according to claim 30, wherein the second substrate is located in the apparatus away from the substrate comprising components having low power requirements.

32. An apparatus for respiratory support, comprising:- a device defining one or more pressurized gases flow paths; - a system for venting leaked gases according to any one of claims 1 to 31; and- a housing containing the device and the system.

33. The apparatus according to claim 32, comprising a flow generator for generating one or more pressurized gases flow paths in the device.

34. A system for mitigating accumulation of leaked gases between a housing, and a device inside the housing, the device configured to generate a pressurized flow of gases, the system comprising: a substrate comprising at least one electronic component; wherein part of the at least one electronic component is located in fluid communication with a pressurized gases flow path of the device; and wherein the substrate comprises one or more vent holes providing a vent path for leaked gases from the pressurized gases flow path.

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