Integrated electronic component

Abstract

Disclosed in the present application is an integrated electronic component. The integrated electronic component comprises an extension area, the extension area is used for connecting an electrical device and a film power supply, and the extension area comprises an extension frame and an electrical connection layer.

Description

Integrated electronic component TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to an integrated electronic component. BACKGROUND

[0002] Printed thin film batteries have good flexibility and can be easily integrated with some flexible electronic devices without affecting the normal use of the flexible electronic devices. Among many integration methods, the most commonly used method is to directly print the thin film battery on the surface of the flexible electronic device, which can reduce the thickness of the integrated flexible electronic device and can be more convenient to use.

[0003] However, in the process of printing the thin film battery to the electronic component, the connection of one electrode of the electronic component and the thin film battery can be directly printed, but the connection of the other electrode is often difficult. TECHNICAL PROBLEM

[0004] In order to overcome the shortcomings of the prior art, the present application provides an integrated electronic component to improve the connection convenience of the electric appliance and the thin film power supply without affecting the flexibility and performance. TECHNICAL SOLUTION

[0005] The technical scheme adopted to solve the technical problem is:

[0006] An integrated electronic component includes an expansion area for connecting an electric appliance and a thin film power supply, and the expansion area includes an expansion frame and an electrical connection layer.

[0007] As a further improvement of the above technical scheme, the electrical connection layer includes a first electrical connection layer and a second electrical connection layer, the first electrical connection layer is electrically connected with one tab of the electric appliance, and the second electrical connection layer is electrically connected with one tab of the thin film power supply; the first electrical connection layer and the second electrical connection layer are in electrical contact with each other or through a conductive bridge layer to realize electrical contact.

[0008] As a further improvement of the above technical scheme, the electrical contact is realized through a conductive medium.

[0009] As a further improvement of the above technical scheme, the electrical contact is realized through a concave-convex fitting structure, and the concave-convex fitting structure is composed of a current collecting electrode layer or an active material layer.

[0010] As a further improvement of the above technical scheme, the first electrical connection layer adopts a printed conductive layer or a pre-positioned conductive layer, and the second electrical connection layer adopts a printed conductive layer or a pre-positioned conductive layer.

[0011] The printed conductive layer is configured as a printed conductive ink, and the preset conductive layer is configured as an etched metal foil.

[0012] As a further improvement of the above technical solution, the expansion frame comprises an expansion bottom frame and an expansion top frame, and the expansion bottom frame and the expansion top frame are in a concave-convex fitting structure.

[0013] As a further improvement of the above technical solution, the expansion frame is in a closed structure, the electrical contact is achieved by atmospheric pressure, and at least one of the electrical appliance and the thin-film power supply is flexible.

[0014] As a further improvement of the above technical solution, the atmospheric pressure is achieved by preset negative pressure in the expansion frame.

[0015] As a further improvement of the above technical solution, the expansion frame is filled with a volatile solvent, and the volatile solvent is volatilized to reduce the space in the expansion frame to achieve the atmospheric pressure.

[0016] As a further improvement of the above technical solution, the expansion frame is filled with an electrolyte, and the first electrical connection layer and the second electrical connection layer and / or the conductive bridge layer are provided with an active material, and the active material reacts with the electrolyte to consume the solvent of the electrolyte to achieve the atmospheric pressure. Advantages

[0017] The application has the advantages that: an expansion area is arranged in the integrated electronic component, the expansion area is used to connect an electrical appliance and a thin-film power supply, the expansion area comprises an expansion frame and an electrical connection layer, the electrical connection layer is used to electrically connect the electrical appliance and the thin-film power supply, and the expansion frame is used to reinforce the overall structure of the expansion area. In this way, on the one hand, the electrical connection layer that can transmit electrical connection is arranged in the integrated electronic component, the electrical appliance and the thin-film power supply are electrically connected through the electrical connection layer, the connection convenience of the electronic component and the thin-film power supply is improved without affecting the flexibility and performance. On the other hand, the expansion frame is arranged in the expansion area, the area or strength of the connection between the electrical appliance and the thin-film power supply is increased through the arrangement of the expansion frame, the structural stability of the expansion area is improved, the connection reliability of the electrical appliance and the thin-film power supply is improved, and the use stability of the integrated electronic component is improved. On the other hand, compared with the connection mode of using conductive glue or rivets, the expansion frame and the electrical connection layer are arranged in the application, the expansion frame bears mechanical strain, and the electrical connection layer bears electrical connection. In this way, the functions of force bearing and electrical conduction are separated, the flexibility of the integrated electronic component is not affected, the connection strength of the thin-film power supply and the electrical appliance is strengthened, and the diversity of the connection mode of electrical connection and mechanical connection is increased. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without any creative effort.

[0019] Fig. 1 is a structural schematic diagram of an embodiment of a thin film battery in an integrated electronic component with a co-planar structure;

[0020] Fig. 2 is a structural schematic diagram of another embodiment of a thin film battery in an integrated electronic component with a co-planar structure;

[0021] Fig. 3 is a structural schematic diagram of a first embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0022] Fig. 4 is a structural schematic diagram of a second embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0023] Fig. 5 is a structural schematic diagram of a third embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0024] Fig. 6 is a partial sectional view of an embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0025] Fig. 7 is a partial sectional view of another embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0026] Fig. 8 is a structural schematic diagram of a fourth embodiment of a thin film battery in an integrated electronic component with a sandwich structure;

[0027] Fig. 9 is a structural schematic diagram of a fifth embodiment of a thin film battery in an integrated electronic component with a sandwich structure.

[0028] Reference signs: 100, expansion area; 110, expansion frame; 111, expansion bottom frame; 112, expansion top frame; 120, electrical connection layer; 121, first electrical connection layer; 122, second electrical connection layer; 131, expansion conductive layer; 132, conductive layer; 133, conductive bridge layer;

[0029] 200, electric appliance; 210, tab one; 220, tab two;

[0030] 300, thin film power supply; 311, first tab; 312, second tab; 321, first electrode layer; 322, second electrode layer; 331, first substrate; 332, second substrate;

[0031] 411 first active material; 412 second active material; 413 conductive medium.

[0032] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

[0033] Embodiments of the present application

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work are within the protection scope of the present application.

[0035] It should be noted that all the directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directionality indications also change accordingly.

[0036] In addition, the description of “first”, “second” and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first”, “second” can explicitly or implicitly include at least one of the features. In addition, “and / or” throughout the text includes three solutions, for example, A and / or B includes A technical solution, B technical solution, and A and B simultaneously meet the technical solution; in addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of a person of ordinary skill in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0037] The printed thin film battery has good flexibility, can be easily integrated with some flexible electronic devices, and does not affect the normal use of the flexible electronic device. Among many integration methods, the most commonly used is to directly print the thin film battery on the surface of the flexible electronic device, which can reduce the thickness of the integrated flexible electronic device and can be more convenient to use.

[0038] However, in the process of printing the thin film battery to the electronic component, there is a problem that one electrode of the electronic component and the thin film battery can be directly printed and connected, and the connection of the other electrode is often difficult.

[0039] Generally, thin film batteries can be roughly divided into two types: co-planar structure and sandwich structure. For thin film batteries of sandwich structure, since the tabs of a single sandwich structure printed thin film battery are in different planes, after a single sandwich structure battery is printed on a flexible electronic device, only one tab of the thin film battery is directly connected to the electronic device, and the other tab needs to be connected to the electronic device by other means.

[0040] Currently, the commonly used method is to use rivets or conductive tapes to connect the tabs of the independently printed thin film batteries to the flexible electronic device. Riveting has good stability, but the thick rivets will affect the flexibility of the battery. Although the conductive tape can connect the tabs of the thin film battery to the terminals of the flexible device, the flexible device integrated with the thin film battery often needs to be bent, curved and the like when applied, and the conductive tape may fall off due to this, thereby causing connection failure.

[0041] For thin film batteries of co-planar structure, the electronic device and one tab of the co-planar battery may be far apart, or the electronic device and one tab of the co-planar battery need strong mechanical properties to adapt to repeated bending. At this time, one tab of the electronic device can be connected with the co-planar battery, and the other tab may need to be connected after long-term back and forth bending, or even may not be connected due to the long distance between them, and long-distance connection will affect the mechanical properties.

[0042] In view of this, the application provides an integrated electronic device.

[0043] Please refer to FIGS. 1-8, in the embodiment of the application, the integrated electronic device includes an expansion area 100, an electrical device 200 and a thin film power supply 300. The expansion area 100 is used to connect the electrical device 200 and the thin film power supply 300. The electrical device 200 can be a resistor, a capacitor, etc., and the specific type of the electrical device 200 is not limited herein. The thin film power supply 300 can be a single thin film battery, or a battery pack composed of multiple thin film batteries connected in series or parallel, and the number of thin film batteries can be determined according to the required current or voltage of the integrated electronic device.

[0044] The electric appliance 200 is provided with two positive and negative tabs, and the thin film power supply 300 is provided with two positive and negative tabs. When the thin film power supply 300 is electrically connected with the electric appliance 200, the positive tab of the electric appliance 200 is electrically connected with the positive tab of the thin film power supply 300, and the negative tab of the electric appliance 200 is electrically connected with the negative tab of the thin film power supply 300, so as to realize the electrical connection between the electric appliance 200 and the thin film power supply 300. For the convenience of description, it is defined that the electric appliance 200 is provided with a tab one 210 and a tab two 220, and the thin film power supply 300 is provided with a first tab 311 and a second tab 312. When the thin film power supply 300 is electrically connected with the electric appliance 200, one tab in the thin film power supply 300 can be directly electrically connected with the electric appliance 200, that is, the tab one 210 is directly electrically connected with the first tab 311. When the other tab in the thin film power supply 300 cannot be directly connected with the electric appliance 200 or the part of the connection has higher requirements on mechanical properties, at this time, the tab two 220 can be electrically connected with the second tab 312 through the expansion area 100 to achieve the use purpose.

[0045] Here, the polarity of the tab one 210, the tab two 220, the first tab 311 and the second tab 312 is not limited, as long as the polarity of the tab one 210 and the tab two 220 is opposite, and the polarity of the tab one 210 and the first tab 311 is the same.

[0046] In an embodiment, the thin film power supply 300 and the electric appliance 200 share a substrate, at this time, the thin film power supply 300 can be directly printed and connected to the electric appliance 200. In this way, the connection of the electric appliance 200 and the thin film power supply 300 is more simple and fast, and is also beneficial to the assembly efficiency of integrated electronic components.

[0047] Please refer to FIG. 1 to FIG. 4, specifically, the expansion area 100 includes an expansion frame 110 and an electrical connection layer 120. The expansion area 100 is provided with the expansion frame 110 along the circumference thereof, and the electrical connection layer 120 is located inside the expansion frame 110. The electrical connection layer 120 is used for electrically connecting the electric appliance 200 and the thin film power supply 300, and the expansion frame 110 is used for reinforcing the overall structure of the expansion area 100.

[0048] When the electric appliance 200 is electrically connected with the thin film power supply 300, the tab two 220 is electrically connected with the second tab 312 through the electrical connection layer 120. In this way, the expansion area 100 which can transmit electrical connection is arranged in the integrated electronic components, one side of the electrical connection layer 120 is electrically connected with the tab two 220, and the other side is electrically connected with the second tab 312, so as to realize the electrical connection between the tab two 220 and the second tab 312, and realize the electrical connection between the electric appliance 200 and the thin film power supply 300. Without affecting the flexibility and performance, the connection convenience between the electric appliance 200 and the thin film power supply 300 is improved.

[0049] Compared with the mode of using only conductive glue connection, the application improves the structural stability of the expansion area 100 by setting the expansion frame 110 and the electrical connection layer 120, and increases the area or strength of the connection between the electrical appliance 200 and the thin film power supply 300 by setting the expansion frame 110, thereby improving the connection reliability of the electrical appliance 200 and the thin film power supply 300 and improving the use stability of the integrated electronic components. Compared with the mode of using only conductive glue or rivets for connection, the application sets the expansion frame 110 and the electrical connection layer 120, wherein the expansion frame 110 bears the mechanical strain, and the electrical connection layer 120 bears the electrical connection between the first tab 220 and the second tab 312. In this way, the functions of force bearing and electrical conduction are separated, which does not affect the flexibility of the integrated electronic components, strengthens the connection strength of the thin film power supply 300 and the electrical appliance 200, and increases the diversity of the connection mode of electrical connection and mechanical connection.

[0050] In an embodiment, the thin film power supply 300 includes a plurality of thin film batteries connected in series or in parallel to provide a larger current or voltage for the integrated electronic components to meet the use of the integrated electronic components. In the case of series connection, the first tab 311 is led out of the first thin film battery, and the second tab 312 is led out of the last thin film battery, the first tab 311 is electrically connected with the first tab 210 of the electrical appliance 200, and the second tab 312 is electrically connected with the second tab 220 of the electrical appliance 200 through the electrical connection layer 120. In the case of parallel connection, the first tab 311 and the second tab 312 are led out of the first thin film battery, the first tab 311 is electrically connected with the first tab 210 of the electrical appliance 200, and the second tab 312 is electrically connected with the second tab 220 of the electrical appliance 200 through the electrical connection layer 120.

[0051] Generally, the thin film battery includes a first electrode layer 321, a second electrode layer 322, a first current collector layer (not shown), a second current collector layer (not shown), a first substrate 331, and a second substrate 332, the first current collector layer is provided with the first tab 311, and the second current collector layer is provided with the second tab 312. The thin film battery can be a sandwich structure or a coplanar structure. That is, the thin film power supply 300 can be a coplanar structure or a sandwich structure.

[0052] Please refer to FIG. 1 and FIG. 2, when the thin film power supply 300 is configured as a coplanar structure, the first substrate 331 is provided with a first current collector layer and a second current collector layer arranged at intervals, the first current collector layer is provided with a first electrode tab 311 and a first electrode layer 321, the first electrode tab 311 has the same extension direction as the first current collector layer, the second current collector layer is provided with a second electrode tab 312 and a second electrode layer 322, the second electrode tab 312 has the same extension direction as the second current collector layer, the second substrate 332 is used as a cover plate and is located on the side of the first electrode layer 321 and the second electrode layer 322 away from the first substrate 331. At this time, the thin film battery can be provided with a diaphragm, the diaphragm is provided with an electrolyte, the diaphragm is located above the first electrode layer 321 and the second electrode layer 322, and the second substrate 332 is between the first electrode layer 321 and the second electrode layer 322. When the electrolyte is a gel electrolyte, the diaphragm can not be provided at this time, and the gel electrolyte can be directly coated on the electrode layer.

[0053] Please refer to FIG. 3 and FIG. 4, when the thin film power supply 300 is configured as a sandwich structure, the thin film power supply 300 further includes a diaphragm (not shown) provided with an electrolyte, one side of the diaphragm is sequentially provided with a first electrode layer 321, a first current collector layer and a first substrate 331, and the other side of the diaphragm is sequentially provided with a second electrode layer 322, a second current collector layer and a second substrate 332. The first current collector layer is provided with a first electrode tab 311, the first electrode tab 311 has the same extension direction as the first current collector layer, the second current collector layer is provided with a second electrode tab 312, the second electrode tab 312 has the same extension direction as the second current collector layer, and the first electrode tab 311 and the second electrode tab 312 are used for electrical connection with the external electrical device 200, so as to realize the electrical connection between the thin film power supply 300 and the electrical device 200. In this way, because the thin film battery is a sandwich structure, the first current collector layer and the second current collector layer are located on different planes along the thickness direction of the thin film battery, so the first electrode tab 311 and the second electrode tab 312 are not on the same plane, and therefore there is a problem of difficulty in connecting the electrical device 200 and the thin film power supply 300.

[0054] In the present application, further, the electrical connection layer 120 includes a first electrical connection layer 121 and a second electrical connection layer 122; the first electrical connection layer 121 and the second electrical connection layer 122 are in electrical contact with each other or realize electrical contact through a conductive bridge layer 133. In this way, when one electrode tab of the electrical device 200 is electrically connected to the first electrical connection layer 121 and one electrode tab of the thin film power supply 300 is electrically connected to the second electrical connection layer 122, the electrical device 200 can be electrically connected to the thin film power supply 300 through the expansion area 100.

[0055] When the thin-film power supply 300 is configured as a co-planar structure, the first electrical connection layer 121 is arranged on the portion of the first substrate 331 extending to the extended area 100, and the first electrical connection layer 121 includes the second tab 220 (see FIG. 1), but the design is not limited thereto. For example, as shown in FIG. 2, the first electrical connection layer 121 can further include a conductive portion (extended conductive layer 131) and a non-conductive portion (if any) extending from the second tab 220. The second electrical connection layer 122 is also arranged on the portion of the first substrate 331 extending to the extended area 100, that is, the first electrical connection layer 121 and the second electrical connection layer 122 are co-planar. The second electrical connection layer 122 includes the second tab 312, but the design is not limited thereto. In other embodiments, the second electrical connection layer 122 can further include a conductive portion (not shown) and a non-conductive portion (if any) extending from the second tab 312. Meanwhile, the portion of the second substrate 332 extending to the extended area 100 is provided with a conductive bridge layer 133 (see FIGS. 1 and 2); thus, when the second substrate 332 covers the first substrate 331, the second tab 220 and / or the extended conductive layer 131 can be electrically connected to the second tab 312 through the conductive bridge layer 133.

[0056] When the thin-film power supply 300 is configured as a co-planar structure, the first electrical connection layer 121 is arranged on the portion of the first substrate 331 extending to the extended area 100, and the first electrical connection layer 121 includes the second tab 220 (see FIG. 1), but the design is not limited thereto. For example, as shown in FIG. 2, the first electrical connection layer 121 can further include a conductive portion (extended conductive layer 131) and a non-conductive portion (if any) extending from the second tab 220. The second electrical connection layer 122 is also arranged on the portion of the first substrate 331 extending to the extended area 100, that is, the first electrical connection layer 121 and the second electrical connection layer 122 are co-planar. The second electrical connection layer 122 includes the second tab 312, but the design is not limited thereto. In other embodiments, the second electrical connection layer 122 can further include a conductive portion (not shown) and a non-conductive portion (if any) extending from the second tab 312. Meanwhile, the portion of the second substrate 332 extending to the extended area 100 is provided with a conductive bridge layer 133 (see FIGS. 1 and 2); thus, when the second substrate 332 covers the first substrate 331, the second tab 220 and / or the extended conductive layer 131 can be electrically connected to the second tab 312 through the conductive bridge layer 133.

[0057] In summary, the technical solution of the present application can enable the thin-film battery in a sandwich structure to be electrically connected to the electrical device 200 through the electrical connection layer 120, thereby solving the problem of difficult connection of the second tab 220 and the second tab 312 due to the non-coplanar structure, or avoiding the back-and-forth bending connection of the second tab 220 in the co-planar structure of the thin-film battery, and further avoiding the connection failure of the second tab 220 without affecting the flexibility of the integrated electronic device, thereby ensuring the connection reliability between the electrical device 200 and the thin-film power supply 300 and ensuring the reliability of the integrated electronic device.

[0058] In one embodiment, referring to FIG. 9, the expansion area 100 is arranged outside the thin-film power supply 300, and the expansion area 100 surrounds the thin-film power supply 300. In this arrangement, the peripheral area of the thin-film power supply 300 is used as the expansion area 100, and the space is reasonably used without compromising the capacity of the battery body of the thin-film power supply 300. In addition, since the expansion area 100 surrounds the thin-film power supply 300 in this embodiment, the expansion area 100 can also function as a protective layer for the thin-film power supply 300. When the thin-film power supply 300 leaks electrolyte, the expansion area 100 can absorb the leaked electrolyte. At this time, the electrical contact between the electric appliance 200 and the thin-film power supply 300 is achieved through the concave-convex fitting structure described below.

[0059] In this application, further, the electrical contact is achieved through the conductive medium 413. In one embodiment, for the sandwich structure thin-film battery, referring to FIG. 5, the electrical contact between the first electrical connection layer 121 and the second electrical connection layer 122 is achieved through the conductive medium 413. In another embodiment, for the coplanar structure thin-film battery, the electrical contact between the first electrical connection layer 121 and the second electrical connection layer 122 and the conductive bridge layer 133 is achieved through the conductive medium 413.

[0060] In one embodiment, the conductive medium 413 is preferably a sticky material, i.e., the conductive medium 413 uses a conductive substance with adhesive properties. This can further improve the stability and reliability of the electrical contact, and thus improve the stability and reliability of the electrical connection between the electric appliance 200 and the thin-film power supply 300, and improve the reliability of the integrated electronic components. When the conductive medium 413 is a sticky material, conductive adhesive, conductive tape, etc. can be used. However, the design is not limited to this, and in other embodiments, the conductive medium 413 can also use carbon paste, metal paste, etc., as long as the electrical contact can be achieved.

[0061] Please refer to Fig. 6, further, the electrical contact is achieved by the concave-convex fitting structure, so as to improve the connection tightness and reliability between the two, thereby reducing the failure risk of the connection between the electrical appliance 200 and the thin film power supplier 300, and also reducing the contact resistance between the electrical appliance 200 and the thin film power supplier 300. In an embodiment, the concave-convex fitting structure is composed of the current collector layer, that is, the current collector layers of the two requiring electrical contact are embedded and engaged with each other. In another embodiment, the concave-convex fitting structure is composed of the current collector layer, and an active material layer which is not conductive is arranged in the gap of the concave-convex fitting structure, and the thickness of the active material layer does not exceed the thickness of the concave-convex fitting structure, so that the current collector layers of the two requiring electrical contact are embedded and engaged with each other. In still another embodiment, the concave-convex fitting structure is composed of the active material layer which is conductive, that is, the active material layers of the two requiring electrical contact are embedded and engaged with each other, so that the current collector layers of the two requiring electrical contact can be electrically connected through the active material layer.

[0062] It is worth mentioning that the part of the tab extending out mentioned above can include a conductive part and a non-conductive part, wherein the conductive part refers to the current collector layer, or the current collector layer and the active material layer which is conductive, and the non-conductive part refers to the active material layer which is not conductive.

[0063] Specifically, the concave-convex fitting structure can be a interdigital structure or a fitting structure, and the shape of the cross section can be triangular, arc-shaped, special-shaped, etc., and the specific structure of the concave-convex fitting structure is not limited here.

[0064] Further, the first electrical connection layer 121 adopts a printed conductive layer or a pre-set conductive layer, and the second electrical connection layer 122 adopts a printed conductive layer or a pre-set conductive layer. Among them, the printed conductive layer is configured as a printed conductive ink, and the pre-set conductive layer is configured as an etched metal foil; it can be understood that both the printing process and the etching process can realize batch production of products, that is, it is conducive to improving the production efficiency of products. It is worth mentioning that when the first electrical connection layer 121 and / or the second electrical connection layer 122 is configured as an etched metal foil, since it adopts a metal material with low resistivity, it can further reduce the internal resistance of the expansion area 100. Further, for the embodiment provided with the conductive bridge layer 133, the conductive bridge layer 133 also adopts a printed conductive layer or a pre-set conductive layer.

[0065] Please refer to Fig. 7, further, the expansion frame 110 comprises an expansion bottom frame 111 and an expansion top frame 112, the expansion bottom frame 111 and the expansion top frame 112 are concave-convex fitting structures. Specifically, the expansion bottom frame 111 is arranged at the part of the first base 331 extending to the expansion area 100, and the expansion top frame 112 is arranged at the part of the second base 332 extending to the expansion area 100. When the second base 332 and the first base 331 are overlapped, the expansion bottom frame 111 and the expansion top frame 112 are concave-convex fitted to improve the connection tightness between the expansion bottom frame 111 and the expansion top frame 112, thereby improving the structural stability of the expansion area 100.

[0066] Further, the thin film battery further comprises a sealing frame (not shown), which is used to reinforce the structure of the thin film battery and prevent electrolyte leakage, so that the structure of the thin film battery is more stable. In an embodiment, part of the frame of the expansion frame 110 can constitute part of the frame of the sealing frame, that is, the expansion frame 110 and the sealing frame are integrally arranged in the overlapping part. In this way, it is beneficial to the miniaturization of the thin film power supply 300 and the expansion area 100, does not affect the capacity of the thin film power supply 300, and is also beneficial to the processing efficiency of integrated electronic components. In an embodiment, the expansion frame 110 adopts a glue frame or a hot-pressing sealing frame, and optionally, the expansion frame 110 and the sealing frame are made of the same material. In this way, the expansion frame 110 and the sealing frame can be completed by a unified production step.

[0067] Further, the expansion frame 110 is a closed structure, and the electrical contact is achieved by atmospheric pressure bonding to make the electrical contact more tight, thereby improving the electrical connection stability between the electrical appliance 200 and the thin film power supply 300. It is worth mentioning that in the scheme of achieving electrical contact by atmospheric pressure bonding, at least one of the electrical appliance 200 and the thin film power supply 300 is flexible, such as in this application, a flexible thin film power supply 300 is adopted, so that it can be widely used in various electrical appliances.

[0068] In an embodiment, the atmospheric pressure bonding is achieved by pre-setting negative pressure in the expansion frame 110. Specifically, during the assembly of the integrated electronic components, the space in the expansion frame 110 of the expansion area 100 is subjected to vacuumizing operation, so that the expansion frame 110 is in a negative pressure environment, thereby under the action of atmospheric pressure, the two parts that need to be electrically contacted in the expansion frame 110 are close to each other and tightly contact.

[0069] In another embodiment, the expansion frame 110 is filled with a volatile solvent, which is evaporated to reduce the space in the expansion frame 110 to achieve the atmospheric pressure bonding. Specifically, the volatile solvent can diffuse and evaporate through the portion of the first substrate 331 and / or the second substrate 332 extending into the expansion area 100. When the volatile solvent is evaporated, the space in the expansion frame 110 is reduced, so that the two components in the expansion frame 110 that need to be electrically connected are brought close to and in tight contact with each other under the action of atmospheric pressure. The volatile solvent can be, but is not limited to, water, a PVDF solution (polyvinylidene fluoride solution), NMP (N-methyl pyrrolidone), ethanol, etc., and the type of the volatile solvent is not limited herein.

[0070] In yet another embodiment, the expansion frame 110 is filled with an electrolyte, and the first electrical connection layer 121 and / or the second electrical connection layer 122 and / or the conductive bridge layer 133 is provided with an active material, which reacts with the electrolyte to consume the solvent of the electrolyte to achieve the atmospheric pressure bonding. It can be understood that when the solvent of the electrolyte is consumed, the space in the expansion frame 110 is reduced, so that the two components in the expansion frame 110 that need to be electrically connected are brought close to and in tight contact with each other under the action of atmospheric pressure. It is worth mentioning that in this embodiment, the portion of the first substrate 331 and / or the second substrate 332 extending into the expansion area 100 allows the solvent to evaporate through this portion, so as to further consume the solvent by evaporation.

[0071] Without loss of generality, taking the thin-film power supply 300 in a sandwich structure as an example, referring to FIG. 8, a first active material 411 is provided on the expansion conductive layer 131, and a second active material 412 is provided on the conductive layer 132; thus, after the expansion frame 110 is filled with an electrolyte, an oxidation-reduction reaction of a battery occurs between the first active material 411, the second active material 412 and the electrolyte, so as to consume the solvent in the electrolyte, and the expansion conductive layer 131 and the conductive layer 132 achieve electrical contact under the atmospheric pressure bonding. In an embodiment, the thin-film power supply 300 can be configured as a water-based battery, such as a water-based zinc ion battery, a water-based sodium ion battery, a water-based aluminum ion battery, a water-based magnesium ion battery, a water-based nickel-zinc battery, a water-based nickel-bismuth battery, etc. When the oxidation-reduction reaction of the battery occurs in the expansion frame 110, water is consumed. The specific type of the thin-film power supply 300 is not limited herein.

[0072] Further, the first active material 411 is provided in the same polarity as the first electrode layer 321, and the second active material 412 is provided in the same polarity as the second electrode layer 322.

[0073] Specifically, the first active material 411 is arranged on the extended conductive layer 131, and the second active material 412 is arranged on the conductive layer 132. In an embodiment, the first active material 411 has the same polarity as the first electrode layer 321, and the second active material 412 has the same polarity as the second electrode layer 322. In this way, when the first electrode layer 321 is coated on the first current collector layer, the first active material 411 can be simultaneously coated in the extended conductive layer 131; when the second electrode layer 322 is coated on the second current collector layer, the second active material 412 can be simultaneously coated in the conductive layer 132. In this way, compared with the polarity of the first active material 411 being different from that of the second electrode layer 322, the polarity of the second active material 412 is different from that of the second electrode layer 322, without increasing the production steps, reducing the connection steps of the electrical appliance 200 and the thin film power supply 300, and making the processing of integrated electronic components more time-saving and labor-saving, which is conducive to the processing efficiency of integrated electronic components.

[0074] Of course, in other embodiments, the polarity of the first active material 411 and the second electrode layer 322 can also be different, and correspondingly, the polarity of the second active material 412 and the second electrode layer 322 is also different, and the polarity of the first active material 411 and the second electrode layer 322 is not limited herein.

[0075] The above description is only an optional embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure transformation made by using the content of the present application specification and drawings, or directly / indirectly applied to other related technical fields, is included in the patent protection scope of the present application.

Claims

1. An integrated electronic component, wherein: The device comprises an expansion area (100), wherein the expansion area (100) is configured to connect an electrical appliance (200) and a thin film power supply (300), and the expansion area (100) comprises an expansion frame (110) and an electrical connection layer (120).

2. The integrated electronic component according to claim 1, wherein: The electrical connection layer (120) includes a first electrical connection layer (121) and a second electrical connection layer (122), wherein the first electrical connection layer (121) is electrically connected to a tab of the electrical appliance (200), and the second electrical connection layer (122) is electrically connected to a tab of the thin film power supply (300); the first electrical connection layer (121) and the second electrical connection layer (122) are electrically in contact with each other or are electrically in contact through a conductive bridge layer (133).

3. The integrated electronic component according to claim 2, wherein: The electrical contact is achieved via a conductive medium (413).

4. The integrated electronic component according to claim 2, wherein: The electrical contact is achieved through a concave-convex mosaic structure, which is composed of a collector layer or an active material layer.

5. The integrated electronic component according to claim 2, wherein: The first electrical connection layer (121) is a printed conductive layer or a pre-set conductive layer, and the second electrical connection layer (122) is a printed conductive layer or a pre-set conductive layer; The printed conductive layer is configured as printed conductive ink, and the pre-set conductive layer is configured as an etched metal foil.

6. The integrated electronic component according to claim 1, wherein: The expansion frame (110) comprises an expansion bottom frame (111) and an expansion top frame (112), and the expansion bottom frame (111) and the expansion top frame (112) are concave-convex interlocking structures.

7. The integrated electronic component according to claim 2, wherein: The expansion frame (110) is a closed structure, the electrical contact is achieved through atmospheric pressure, and at least one of the electrical appliance (200) and the thin film power supply (300) is configured to be flexible.

8. The integrated electronic component according to claim 7, wherein: The atmospheric pressure is achieved by presetting negative pressure in the expansion frame (110).

9. The integrated electronic component according to claim 7, wherein: The expansion frame (110) is filled with a volatile solvent, and the volatile solvent evaporates, which is configured to reduce the space in the expansion frame (110) to achieve the atmospheric pressure closing.

10. The integrated electronic component according to claim 7, wherein: The expansion frame (110) is filled with an electrolyte, and the first electrical connection layer (121), the second electrical connection layer (122) and / or the conductive bridge layer (133) are provided with an active material, and the active material reacts with the electrolyte and is configured to consume the solvent of the electrolyte to achieve the atmospheric pressure bonding.

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