Button assembly and electronic device

Abstract

Embodiments of the present application relate to the technical field of buttons, and provide a button assembly and an electronic device. The button assembly comprises a button body, a circuit board, and sensors. The circuit board is located on one side of the button body and is connected to the button body. The sensors are located on the side of the circuit board away from the button body and are electrically connected to the circuit board. The sensors include at least two types of sensors selected from capacitance sensors, a gravity sensor and a pressure sensor. When the sensors include capacitance sensors, there are multiple capacitance sensors, and the multiple capacitance sensors are spaced apart. By means of the configuration, the button assembly can be operated by means of at least two of the following three approaches: a finger slides on the button body in multiple directions, the finger taps the button body, and the finger presses the button body, thereby improving the flexibility and ease of operation for the button assembly.

Description

Key assembly and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410430773.7, filed on April 10, 2024, and entitled “Key assembly and electronic device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application provide a key assembly and an electronic device, relating to the technical field of keys. BACKGROUND

[0003] Electronic devices usually include keys, and setting functions such as volume adjustment, power on / off, and restart can be achieved by pressing the keys. In the related art, the keys cannot be operated in a manner other than pressing, which affects the operation flexibility of the keys. SUMMARY

[0004] Embodiments of the present application provide a key assembly and an electronic device, which can improve the operation flexibility of the key assembly.

[0005] In one aspect, embodiments of the present application provide a key assembly. The key assembly includes a key body, a circuit board, and a sensor. The circuit board is located on one side of the key body and connected to the key body. The sensor is located on the side of the circuit board away from the key body and electrically connected to the circuit board. The sensor includes at least two of a capacitive sensor, a gravity sensor, and a pressure sensor. When the sensor includes a capacitive sensor, the number of capacitive sensors is multiple, and the multiple capacitive sensors are arranged at intervals.

[0006] In embodiments of the present application, the circuit board is connected to the key body, for example, directly connected or indirectly connected, and the sensor is located on the side of the circuit board away from the key body and electrically connected to the circuit board, so that the user can be sensed by the sensor when operating the key body. The sensor converts the sensing signals (such as capacitance, gravity acceleration, and pressure, etc.) into electrical signals (such as current or voltage, etc.), and sends the electrical signals to the mainboard of the electronic device through the circuit board. The processor (such as CPU) of the electronic device is electrically connected to the mainboard, so as to control other components of the electronic device according to the received electrical signals, so that the electronic device can realize the setting functions in response to the user's operation of the key body.

[0007] It can be understood that when the sensor includes multiple capacitive sensors arranged at intervals, the key assembly can be operated by using the multi-directional sliding of the finger on the key body. When the sensor includes a gravity sensor, the key assembly can be operated by tapping the key body. When the sensor includes a pressure sensor, the key assembly can be operated by pressing the key body.

[0008] In this way, the sensor includes at least two of the capacitive sensor, the gravity sensor and the pressure sensor, and the plurality of capacitive sensors are arranged at intervals when the sensor includes the capacitive sensor, so that the key assembly can be operated in at least two of the three ways of multi-directional sliding, tapping and pressing the key body by the finger, so that the electronic device can implement the set function, and the flexibility and convenience in operating the key assembly are improved.

[0009] In some possible implementation manners, the key body includes a main structure extending along a first direction and having a first surface and a second surface oppositely arranged along a second direction. The first direction intersects the second direction. The circuit board includes a first circuit board and a connecting plate, the first circuit board is arranged opposite to the second surface, and the connecting plate is electrically connected to the first circuit board. The sensor includes a plurality of capacitive sensors, at least two capacitive sensors of the plurality of capacitive sensors are arranged in an array, and the plurality of capacitive sensors are located on a side of the first circuit board away from the second surface and electrically connected to the first circuit board. It can be understood that, the capacitive sensors are arranged on the side of the first circuit board away from the second surface and electrically connected to the first circuit board, so that the capacitive sensors can sense the capacitance formed between the finger and the first circuit board. The at least two capacitive sensors of the plurality of capacitive sensors are arranged in an array, so that the at least two capacitive sensors can be located at different positions on the side of the first circuit board away from the second surface, thereby being capable of sensing the capacitance formed between the finger and the first circuit board at different positions. In this way, the key assembly can be operated by the finger sliding along the first direction and a third direction (intersecting the plane in which the first direction and the second direction lie) on the first surface, and the flexibility and convenience in operating the key assembly are improved.

[0010] In some possible implementation manners, the main structure includes a protruding portion and an extending portion, and the protruding portion is connected to the extending portion. The width of the protruding portion along a third direction is greater than the width of the extending portion along the third direction. The third direction intersects the plane in which the first direction and the second direction lie. The at least two capacitive sensors of the plurality of capacitive sensors are arranged at intervals along the extension direction of the edge of the protruding portion. In this way, the width of the main structure along the third direction can be increased, and the area of the first surface can be increased, so that the finger of the user can slide along a ring-shaped track on the first surface. The at least two capacitive sensors of the plurality of capacitive sensors are arranged at intervals along the extension direction of the edge of the protruding portion, so that the capacitive sensors can sense the capacitance formed between the finger and the first circuit board at different positions when the finger slides along the ring-shaped path, thereby the key assembly can be operated by the finger sliding along the ring-shaped path on the first surface, and the flexibility and convenience in operating the key assembly are improved.

[0011] In some possible implementation manners, the protruding portion has a first side wall surface and a second side wall surface oppositely arranged along the third direction. At least one of the first side wall surface and the second side wall surface is curved away from the other. In this way, the width of the protruding portion along the third direction can be greater than the width of the extending portion along the third direction, so that the user's finger can slide along the annular track on the first surface, improving the flexibility and convenience in operating the key assembly.

[0012] In some possible implementation manners, the number of the extending portions is two, and the two extending portions are located on two sides of the protruding portion along the first direction and connected to the protruding portion respectively. In this way, the protruding portion can be located between the two extending portions, improving the structural regularity and aesthetic appearance of the main body structure.

[0013] In some possible implementation manners, the key assembly includes a first adhesive layer, and the first circuit board is adhered to the second surface through the first adhesive layer. In this way, the key body, the first circuit board and the capacitive sensor can be integrated as a whole, so that they can be assembled with the frame of the electronic device together without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0014] In some possible implementation manners, the key body further includes a bending structure located on the side of the second surface along the second direction and connected to the main body structure. The circuit board further includes a second circuit board oppositely arranged with the surface of the bending structure away from the main body structure. The connecting plate is electrically connected to the second circuit board. The sensor includes a gravity sensor located on the side of the second circuit board away from the bending structure and electrically connected to the second circuit board. In this way, the vibration caused by knocking the main body structure can be transmitted to the gravity sensor electrically connected to the second circuit board through the bending structure, shortening the transmission path of the vibration and improving the accuracy of the gravity acceleration sensed by the gravity sensor, thereby improving the reliability in operating the key assembly by using the knocking manner. Moreover, the mutual influence between the second circuit board and the first circuit board can be reduced.

[0015] In some possible implementation manners, the number of the bending structures is two, and the two bending structures are arranged at intervals along the first direction. The second circuit board includes two first sub-circuit boards electrically connected, and the two first sub-circuit boards are respectively arranged opposite to surfaces of the two bending structures away from the main body structure. The number of the gravity sensors is two, and the two gravity sensors are respectively located on sides of the two first sub-circuit boards away from the bending structures. In this way, the two gravity sensors can be arranged at intervals along the first direction. When the main body structure is tapped, the vibration can be transmitted to the two gravity sensors arranged at intervals through the two bending structures, the two gravity sensors arranged at intervals respectively sense the gravity acceleration caused by the tapping, and convert the gravity acceleration into an electrical signal and send the electrical signal to the main board, thereby improving the reliability when the key assembly is operated in the tapping manner.

[0016] In some possible implementation manners, the first circuit board is located between the two bending structures. In this way, the space occupied by the key assembly along the second direction can be reduced, thereby facilitating the miniaturization of the key assembly.

[0017] In some possible implementation manners, the bending structure includes a first sub-bending structure and a second sub-bending structure, and the first sub-bending structure is connected to the second sub-bending structure. An end of the first sub-bending structure away from the second sub-bending structure is connected to the main body structure. The first sub-bending structure extends along the second direction, and the second sub-bending structure extends away from the main body structure along the first direction. The second circuit board is arranged opposite to a surface of the second sub-bending structure away from the main body structure. In this way, the vibration caused by the tapping can be transmitted to the gravity sensor electrically connected to the second circuit board through the bending structure, so that the key assembly can be operated in the tapping manner. Moreover, the bending structure extends away from the main body structure along the first direction, so that the mutual influence between the second circuit board and the first circuit board can be reduced.

[0018] In some possible implementation manners, the key assembly further includes a second adhesive layer, and the second circuit board is adhered to the surface of the second sub-bending structure away from the main body structure through the second adhesive layer. In this way, the key body, the second circuit board, and the gravity sensor can be integrated as a whole, so that the three components can be assembled with the frame of the electronic device together without being assembled separately, thereby improving the assembly efficiency and reducing the assembly cost.

[0019] In some possible implementation manners, the key assembly further includes a support structure located on a side of the first circuit board away from the main body structure along the second direction. The support structure is connected to the key body. In this way, the support structure can support the key body, the circuit board, the sensor, and the like. Moreover, the support structure is connected to the key body, the circuit board is bonded to the key body (the main body structure or the bent structure), and the sensor is electrically connected to the circuit board, so that the support structure, the circuit board, and the sensor can be integrated as a whole, which can be connected to the frame together without being connected to the frame separately, thereby improving the convenience of assembling the key assembly and the frame together, improving the assembly efficiency, and reducing the assembly cost.

[0020] In some possible implementation manners, the support structure includes a support plate and a support piece. The support plate extends along the first direction, and the support piece is located on a side of the support plate close to the first circuit board and connected to the support plate. The support piece and the support plate enclose the clamping groove. The second sub-bent structure, the second circuit board, and the gravity sensor are clamped in the clamping groove along at least part of the third direction. The third direction intersects the plane in which the first direction and the second direction lie. In this way, the clamping groove can limit the second sub-bent structure, the second circuit board (the first sub-circuit board), and the gravity sensor, reduce the risk of the second sub-bent structure, the second circuit board (the first sub-circuit board), and the gravity sensor deviating from the support structure when the main body structure is knocked or pressed, and improve the reliability of the key assembly.

[0021] In some possible implementation manners, the support piece includes a side wall and a bottom wall. The side wall is arranged opposite to the support plate. One end of the bottom wall is connected to the side wall, and the other end of the bottom wall is connected to the support plate. In this way, the support plate and the support piece can enclose the clamping groove.

[0022] In some possible implementation manners, the side wall comprises a first bending portion, the first bending portion is arranged opposite to the gravity sensor, and the first bending portion bends towards the support plate; or, the support plate comprises a second bending portion, the second bending portion is arranged opposite to the gravity sensor, and the second bending portion bends towards the side wall. It can be understood that, the first bending portion is arranged opposite to the gravity sensor and extends towards the support plate, so that the first bending portion can limit the gravity sensor, the second sub-bending structure and the second circuit board (the first sub-circuit board), thereby reducing the risk that the gravity sensor, the second sub-bending structure and the second circuit board (the first sub-circuit board) fall out of the clamping groove when the key body is knocked or pressed, and improving the reliability of the key assembly. The second bending portion is arranged opposite to the gravity sensor and extends towards the side wall, so that the second bending portion can limit the gravity sensor, the second sub-bending structure and the second circuit board (the first sub-circuit board), thereby reducing the risk that the gravity sensor, the second sub-bending structure and the second circuit board (the first sub-circuit board) fall out of the clamping groove when the key body is knocked or pressed, and improving the reliability of the key assembly.

[0023] In some possible implementation manners, the circuit board further comprises a third circuit board, the third circuit board is located on a side of the first circuit board away from the main body structure along the second direction. The third circuit board is electrically connected with the connecting plate. The sensor comprises a pressure sensor, the pressure sensor is located on a side of the third circuit board away from the first circuit board and is electrically connected with the third circuit board. In this way, when the key body and the main body structure are mechanically deformed by being pressed, the main body structure can apply pressure to the pressure sensor, so that the key assembly can be operated in the manner of being pressed.

[0024] In some possible implementation manners, the third circuit board is arranged opposite to a surface of the support plate away from the first circuit board. It can be understood that, when the main body structure of the key body is mechanically deformed by being pressed, the support plate can be squeezed to be mechanically deformed. The third circuit board is arranged opposite to the surface of the support plate away from the first circuit board, and the pressure sensor is electrically connected with the third circuit board away from the support plate (the first circuit board), so that the pressure sensor can sense the pressure caused by the mechanical deformation of the support plate and convert the pressure into an electrical signal to be sent to the mainboard of the electronic device, thereby enabling the key assembly to be operated in the manner of being pressed.

[0025] In some possible implementation manners, the key assembly further comprises a third adhesive layer, the third circuit board is adhered to the surface of the support plate away from the first circuit board through the third adhesive layer. In this way, the key body, the support structure, the third circuit board and the pressure sensor can be integrated as a whole, so that the four components can be assembled together with the frame of the electronic device without being assembled separately, thereby improving the assembly efficiency and reducing the assembly cost.

[0026] In some possible implementation manners, the key assembly further includes a sealing member surrounding the main body structure. In this way, the sealing member can seal the through hole on the frame, so as to reduce the risk of water or impurities entering the accommodation space through the through hole, and improve the reliability of the electronic device.

[0027] In another aspect, the embodiments of the present application provide an electronic device. The electronic device includes a housing and a key assembly as described above. The housing includes a frame, and the frame is provided with a through hole. The key body part of the key assembly is embedded in the through hole.

[0028] The electronic device provided by the embodiments of the present application includes the key assembly as described above, and therefore has all the beneficial effects described above, which will not be repeated here. In addition, the key body part is embedded in the through hole, so that the key body can be partially exposed, thereby improving the convenience when operating the key assembly.

[0029] In some possible implementation manners, the electronic device further includes a mainboard, and the key assembly includes a circuit board, and the connecting plate of the circuit board is electrically connected to the mainboard. In this way, an electrical signal can be sent to the mainboard by operating the key assembly. The processor (for example, a CPU) of the electronic device is electrically connected to the mainboard, so that other components of the electronic device can be controlled according to the received electrical signal, so that the electronic device can realize a set function in response to the operation of the key assembly by the user.

[0030] In some possible implementation manners, the key assembly further includes a support structure, and the support structure includes a support plate connected to the frame of the electronic device. In this way, the support plate can fix the key body, the circuit board and the sensor on the frame, so as to reduce the risk of the key body, the circuit board and the sensor shaking relative to the frame, and improve the reliability of the key assembly. BRIEF DESCRIPTION OF DRAWINGS

[0031] FIG. 1 is a structural schematic diagram of an electronic device provided by some embodiments of the present application;

[0032] FIG. 2 is a schematic diagram of the positional relationship between a frame and a key assembly provided by some embodiments of the present application;

[0033] FIG. 3 is a structural schematic diagram of a frame provided by some embodiments of the present application;

[0034] FIG. 4 is a top view of a key assembly provided by some embodiments of the present application;

[0035] FIG. 5 is a sectional view of the key assembly in FIG. 4 along the direction of A-A;

[0036] FIG. 6 is a structural schematic diagram of a key assembly provided by some embodiments of the present application;

[0037] Fig. 7 is an exploded schematic view of a key assembly according to some embodiments of the present application;

[0038] Fig. 8 is a schematic view of the positional relationship between a capacitive sensor and a circuit board according to some embodiments of the present application;

[0039] Fig. 9 is a schematic view of the positional relationship between a capacitive sensor, a circuit board and a key body according to some embodiments of the present application;

[0040] Fig. 10 is a schematic view of the positional relationship between a pressure sensor, a circuit board and a key body according to some embodiments of the present application;

[0041] Fig. 11 is a schematic view of the structure of a main body according to some embodiments of the present application;

[0042] Fig. 12 is a schematic view of the structure of a main body according to some other embodiments of the present application;

[0043] Fig. 13 is a schematic view of a cross-section of Fig. 6 along the direction of B-B;

[0044] Fig. 14 is a schematic view of the structure of a circuit board according to some embodiments of the present application;

[0045] Fig. 15 is a schematic view of a cross-section of Fig. 6 along the direction of C-C;

[0046] Fig. 16 is a schematic view of the structure of a support structure according to some embodiments of the present application;

[0047] Fig. 17 is a schematic view of the structure of a key assembly according to some other embodiments of the present application. DETAILED DESCRIPTION

[0048] The technical solutions in some embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present application.

[0049] Unless otherwise required by the context, the term “comprises” is to be interpreted as open, inclusive, meaning “including, but not limited to”. In the description of the specification, the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “example”, “specific example” or “some examples” are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the present application. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0050] The terms "first", "second", etc. are used only for the purpose of description and are not to be interpreted as indicating or implying relative importance or a specific number of technical features indicated. Thus, features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0051] In describing some embodiments, "electrically connected" and its derivatives can be used. The term "electrically connected" should be interpreted broadly, for example, "electrically connected" can be direct electrical connection or indirect electrical connection through other devices.

[0052] As used herein, "equal" includes the stated case and a case similar to the stated case, the similar case being within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e., limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may, for example, be a difference between the two of less than or equal to 5% of either.

[0053] FIG. 1 is a structural schematic diagram of an electronic device provided by some embodiments of the present application. FIG. 2 is a schematic diagram of the positional relationship of a frame and a key assembly provided by some embodiments of the present application. FIG. 3 is a structural schematic diagram of a frame provided by some embodiments of the present application.

[0054] As shown in FIG. 1, embodiments of the present application provide an electronic device 200. The electronic device 200 can be a mobile portable terminal device, such as a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, etc. Embodiments of the present application do not further limit the type of the electronic device 200.

[0055] In some examples, as shown in FIG. 1, the electronic device 200 includes a housing 201 and a load (not shown in the figure), the housing 201 is capable of enclosing a containing space, and the load is located in the containing space enclosed by the housing 201.

[0056] For example, the housing 201 includes a front frame, a middle frame, and a back shell, the middle frame includes a frame 2011 and a middle plate 2012. The middle plate 2012 is a flat plate structure, which is the skeleton of the electronic device 200 and plays a supporting role. It can be understood that, in order to simplify the structure of the drawing, FIG. 2 and FIG. 3 only show a part of the middle plate 2012.

[0057] The frame 2011 is annular, and the frame 2011 can surround the middle plate 2012 and be connected to the middle plate 2012. The front frame is connected to one side edge of the frame 2011, and the rear shell is connected to a side edge of the frame 2011 away from the front frame. The front frame, the frame 2011, and the rear shell surround a receiving space. It can be understood that the middle plate 2012 is located in the receiving space surrounded by the front frame, the frame 2011, and the rear shell.

[0058] The load can be a central processing unit (CPU), a graphics processing unit (GPU), a microcontroller unit (MCU), or the like. Alternatively, the load can be a display panel, a camera assembly, or the like. The load can be located in the receiving space surrounded by the front frame and the middle plate 2012, or the load can be located in the receiving space surrounded by the rear shell and the middle plate 2012. The electronic device 200 can include multiple loads, and the types and locations of the multiple loads can be the same or different.

[0059] In some examples, the electronic device 200 further includes a main board (not shown in the figures), which can be a printed circuit board (PCB). The multiple loads are electrically connected to the main board, so that the electronic device 200 can work normally.

[0060] FIG. 4 is a top view of a key assembly according to some embodiments of the present application. FIG. 5 is a sectional view of the key assembly of FIG. 4 along the A-A direction.

[0061] In some examples, as shown in FIGS. 2, 4, and 5, the electronic device 200 further includes a key assembly 100, which includes a circuit board 120. The circuit board 120 of the key assembly 100 is electrically connected to the main board.

[0062] It can be understood that the circuit board 120 of the key assembly 100 is electrically connected to the main board, and an electrical signal can be sent to the main board by operating the key assembly 100. The processor (e.g., CPU) of the electronic device 200 is electrically connected to the main board, so that the processor can control other components of the electronic device 200 according to the received electrical signal, so that the electronic device 200 can implement a set function in response to the user's operation of the key assembly 100.

[0063] For example, the circuit board 120 can include at least one of a flexible printed circuit (FPC) and a PCB.

[0064] In some possible cases, as shown in FIG. 4 and FIG. 5, the circuit board 120 includes a first sub-portion 120a and a second sub-portion 120b arranged at intervals. The key assembly 100 can further include a switch device 160. The switch device 160 includes a first spring piece 161, a second spring piece 162, and an elastic piece 163.

[0065] The first spring piece 161 is electrically connected with the first sub-portion 120a. For example, the first spring piece 161 can be electrically connected with the first sub-portion 120a by welding. The second spring piece 162 is electrically connected with the second sub-portion 120b. For example, the second spring piece 162 can be electrically connected with the second sub-portion 120b by welding. The second spring piece 162 includes a contact portion 162a extending to a side of the first sub-portion 120a close to the first spring piece 161, and arranged at intervals with the first sub-portion 120a.

[0066] The elastic piece 163 is located at a side of the contact portion 162a away from the first sub-portion 120a, and arranged at intervals with the contact portion 162a. It can be understood that, when the elastic piece 163 is pressed, the elastic piece 163 can be elastically deformed to press the contact portion 162a, so that the contact portion 162a can be in electrical contact with the first sub-portion 120a, that is, the second spring piece 162 can be electrically connected with the first spring piece 161, and the electrical signal can be transmitted between the second spring piece 162 and the first spring piece 161, so that the electronic device 200 can realize the set function (for example, volume adjustment or switching on / off, etc.).

[0067] When the pressing of the elastic piece 163 is stopped, the elastic piece 163 restores under the action of the elastic force and cannot continue to press the contact portion 162a, the contact portion 162a is separated from the first sub-portion 120a, that is, the second spring piece 162 is disconnected from the first spring piece 161, and the electrical signal cannot be transmitted between the first spring piece 161 and the second spring piece 162, so that the electronic device 200 cannot realize the set function.

[0068] With the above arrangement, the key assembly 100 can only be operated by pressing, which affects the operation flexibility of the key assembly 100.

[0069] FIG. 6 is a structural schematic diagram of a key assembly provided by some embodiments of the present application. FIG. 7 is an exploded schematic diagram of a key assembly provided by some embodiments of the present application. FIG. 8 is a schematic diagram of the positional relationship between a capacitive sensor and a circuit board provided by some embodiments of the present application. FIG. 9 is a schematic diagram of the positional relationship among a capacitive sensor, a circuit board, and a key body provided by some embodiments of the present application. FIG. 10 is a schematic diagram of the positional relationship among a pressure sensor, a circuit board, and a key body provided by some embodiments of the present application.

[0070] Based on this, the embodiment of the present application provides a key assembly 100. In some examples, as shown in FIGS. 6 and 7, the key assembly 100 includes a key body 110, a circuit board 120, and a sensor 130.

[0071] For example, the key body 110 can extend along a first direction X. The key body 110 can be an appearance piece, and a user sends an electrical signal to a mainboard by operating the key body 110. The key body 110 can be a non-conductive material, such as glass, plastic, glass fiber, etc. It can be understood that the embodiment of the present application does not make further limitation on the material of the key body 110.

[0072] In some examples, as shown in FIGS. 6 and 7, the circuit board 120 is located on one side of the key body 110 and connected with the key body 110. For example, the circuit board 120 can be located on one side of the key body 110 along a second direction Y and connected with the key body 110. The circuit board 120 and the key body 110 can be directly connected or indirectly connected through other components. The second direction Y intersects the first direction X. For example, the second direction Y can be perpendicular to the first direction X.

[0073] In some examples, the sensor 130 is located on a side of the circuit board 120 away from the key body 110 and electrically connected with the circuit board 120.

[0074] For example, the side of the circuit board 120 away from the key body 110 can be provided with a solder pad, and the sensor 130 is welded with the solder pad, so that the sensor 130 can be located on the side of the circuit board 120 away from the key body 110 and electrically connected with the circuit board 120. In some examples, the number of the sensor 130 can be multiple, and the multiple sensors 130 can be arranged at intervals on the side of the circuit board 120 away from the key body 110 and respectively electrically connected with the circuit board 120.

[0075] It can be understood that arranging the sensor 130 on the side of the circuit board 120 away from the key body 110 can avoid affecting the connection between the key body 110 and the circuit board 120. The circuit board 120 is connected with the key body 110, and the sensor 130 is located on the side of the circuit board 120 away from the key body 110 and electrically connected with the circuit board 120, so that the user can be sensed by the sensor 130 when operating the key body 110.

[0076] The sensor 130 can convert the sensing signal (e.g. capacitance, gravity acceleration, and pressure, etc.) into an electric signal (e.g. current or voltage, etc.), and can send the electric signal to the mainboard through the circuit board 120. The processor (e.g. CPU) controls other components of the electronic device 200 according to the received electric signal, so that the electronic device 200 can realize the set function in response to the user's operation on the key body 110.

[0077] In some examples, the sensor 130 includes at least two of the capacitor sensor 131, the gravity sensor 132, and the pressure sensor 133. As shown in FIG. 8, when the sensor 130 includes the capacitor sensor 131, the number of the capacitor sensor 131 is multiple, and the multiple capacitor sensors 131 are arranged at intervals.

[0078] It can be understood that the sensor 130 can include the capacitor sensor 131 and the gravity sensor 132, or the sensor 130 can include the capacitor sensor 131 and the pressure sensor 133, or the sensor 130 can include the gravity sensor 132 and the pressure sensor 133, or the sensor 130 can include the capacitor sensor 131, the gravity sensor 132, and the pressure sensor 133.

[0079] When the sensor 130 includes the gravity sensor 132, the number of the gravity sensor 132 can be one or more. When the sensor 130 includes the pressure sensor 133, the number of the pressure sensor 133 can be one or more. When the sensor 130 includes the capacitor sensor 131, the gravity sensor 132, and the pressure sensor 133, the number of the capacitor sensor 131, the gravity sensor 132, and the pressure sensor 133 can be the same or different.

[0080] As shown in FIG. 9, when the user's finger touches the key body 110, the capacitance is formed between the finger and the circuit board 120. When the sensor 130 includes the capacitor sensor 131, the capacitor sensor 131 can sense the capacitance formed between the finger and the circuit board 120, and convert the capacitance into other electric signals and send to the mainboard.

[0081] As shown in FIG. 8, the number of the capacitor sensor 131 is multiple, and the multiple capacitor sensors 131 are arranged at intervals, so that the capacitor sensors 131 at different positions can sense the capacitance formed between the finger and the circuit board 120 at different positions. The processor (e.g. CPU) can determine the sliding direction and the sliding path of the finger on the key body 110 according to the electric signal change of each capacitor sensor 131, so as to control other components of the electronic device 200 according to the sliding direction and the sliding path of the finger on the key body 110, so that the electronic device 200 can realize the set function in response to the sliding operation of the user's finger.

[0082] That is, when the sensor 130 includes a plurality of capacitive sensors 131 arranged at intervals, the key assembly 100 can be operated in a manner of multi-directional sliding of a finger on the key body 110, so that the electronic device 200 can implement a set function. It can be understood that the set function implemented by the electronic device 200 is different when the sliding direction and sliding path of the finger on the key body 110 are different. For example, the sliding operation can implement page turning when browsing an electronic book and a webpage, adjusting a focal length when taking a photo, adjusting an ISO (International Standards Organization), and adjusting a filter, and the like. Alternatively, the sliding operation can also control an AI (artificial intelligence) software. Embodiments of the present application do not further limit the set function corresponding to the sliding operation.

[0083] When the user taps the key body 110, the key body 110 can apply a gravitational acceleration in different directions (a first direction X, a second direction Y, and a third direction Z intersecting the plane in which the first direction X and the second direction Y lie) to the circuit board 120. When the sensor 130 includes a gravitational sensor 132, the gravitational sensor 132 can sense the gravitational acceleration in different directions and convert the gravitational acceleration into an electrical signal and send the electrical signal to the mainboard. The magnitude of the gravitational acceleration is different when the tapping force is different, and the gravitational sensor 132 can send different electrical signals to the mainboard according to the magnitude of the gravitational acceleration.

[0084] The processor (for example, a CPU) can determine the tapping force and the number of taps and the like according to the electrical signal sent by the gravitational sensor 132, so as to control other components of the electronic device 200 according to the tapping force and the number of taps and the like, so that the electronic device 200 can implement a set function in response to the tapping operation.

[0085] That is, when the sensor 130 includes a gravitational sensor 132, the key assembly 100 can be operated in a manner of tapping the key body 110, so that the electronic device 200 can implement a set function. It can be understood that the set function implemented by the electronic device 200 is different when the tapping force and the number of taps are different. For example, tapping once can answer a phone, and tapping twice can hang up a phone. Embodiments of the present application do not further limit the set function corresponding to the tapping operation.

[0086] As shown in FIG. 10, when the user presses the key body 110, the key body 110 can be mechanically deformed, so as to press the circuit board 120. When the sensor 130 comprises a pressure sensor 133, the pressure sensor 133 can sense the pressure received by the circuit board 120, that is, the mechanical deformation of the key body 110. The pressure sensor 133 converts the pressure into an electric signal and sends the electric signal to the mainboard. When the pressing force is different, the deformation degree of the key body 110 is different, the pressure received by the circuit board 120 is different, and the electric signal sent by the pressure sensor 133 to the mainboard is different. For example, the pressure sensor 133 can be a resistance pressure sensor, and when the pressure is different, the resistance of the pressure sensor 133 is different, so as to send different electric signals to the circuit board.

[0087] The processor (for example, CPU) can determine the pressing force and the pressing times according to the electric signal sent by the pressure sensor 133, so as to control other components of the electronic device 200 according to the pressing force and the pressing times, so that the electronic device 200 can realize the set function in response to the pressing operation.

[0088] That is, when the sensor 130 comprises the pressure sensor 133, the key assembly 100 can be operated by pressing the key body 110, so that the electronic device 200 can realize the set function. It can be understood that when the pressing force and the pressing times are different, the set function realized by the electronic device 200 is different. For example, when the pressing force is small, the focusing function during photographing can be realized, and when the pressing force is large, the photographing function can be realized. The embodiment of the present application does not make further limitation on the set function corresponding to the pressing operation.

[0089] In the embodiment of the present application, the circuit board 120 is connected with the key body 110, for example, directly connected or indirectly connected, the sensor 130 is located on the side of the circuit board 120 away from the key body 110 and electrically connected with the circuit board 120, so that the user can be sensed by the sensor 130 when operating the key body 110. The sensor 130 converts the sensing signal (for example, capacitance, gravity acceleration and pressure) into an electric signal (for example, current or voltage), and sends the electric signal to the mainboard of the electronic device 200 through the circuit board 120. The processor (for example, CPU) of the electronic device 200 is electrically connected with the mainboard, so as to control other components of the electronic device 200 according to the received electric signal, so that the electronic device 200 can realize the set function in response to the operation of the user on the key body 110.

[0090] It can be understood that when the sensor 130 includes a plurality of capacitive sensors 131 arranged at intervals, the key assembly 100 can be operated in a manner of multi-directional sliding of a finger on the key body 110. When the sensor 130 includes the gravity sensor 132, the key assembly 100 can be operated in a manner of tapping the key body 110. When the sensor 130 includes the pressure sensor 133, the key assembly 100 can be operated in a manner of pressing the key body 110.

[0091] In this way, the sensor 130 is arranged to include at least two of the capacitive sensor 131, the gravity sensor 132 and the pressure sensor 133, and the plurality of capacitive sensors 131 are arranged at intervals when the sensor 130 includes the capacitive sensor 131, so that the key assembly 100 can be operated in at least two of the three manners of multi-directional sliding of a finger on the key body 110, tapping the key body 110 and pressing the key body 110, so that the electronic device 200 can implement a set function, and the flexibility and convenience in operating the key assembly 100 are improved.

[0092] In some examples, the frame 2011 is provided with a through hole G (see FIG. 3), and the key body 110 of the key assembly 100 is partially embedded in the through hole G. In this way, the key body 110 can be partially exposed, and the convenience in operating the key assembly 100 is improved.

[0093] In examples, the key assembly 100 in which the key body 110 is partially embedded in the through hole G can be referred to as a side key. The electronic device 200 can include one side key or a plurality of side keys. The shapes and operation manners of the plurality of side keys can be the same or different. When the electronic device 200 includes a plurality of side keys, a plurality of through holes G arranged at intervals can be provided on the frame 2011. The key body 110 of one side key is partially embedded in one through hole G, so that the key bodies 110 of the plurality of side keys can be arranged at intervals.

[0094] FIG. 11 is a structural schematic diagram of a body structure provided in some embodiments of the present application. FIG. 12 is a structural schematic diagram of a body structure provided in some other embodiments of the present application. FIG. 13 is a sectional schematic diagram of FIG. 6 along the direction of B-B.

[0095] In some examples, as shown in FIGS. 11 and 12, the key body 110 includes a body structure 111 extending along a first direction X and having a first surface P1 and a second surface P2 oppositely arranged along a second direction Y. The first surface P1 and the second surface P2 can be smooth planes. The first surface P1 can be an ellipse, a rounded rectangle or other asymmetric shape. The shape of the first surface P1 can be the same as or different from the shape of the second surface P2.

[0096] In some examples, the main body structure 111 has the same shape as the shape of the through hole G, and the main body structure 111 is embedded in the through hole G. It can be understood that when the main body structure 111 is embedded in the through hole G, the first surface P1 can be exposed, and the user's fingers can slide, tap or press on the first surface P1 in multiple directions to operate the key assembly 100, so that the electronic device 200 can realize the set function.

[0097] In some examples, as shown in FIG. 13, the circuit board 120 includes a first circuit board 121 and a connecting plate 124, the first circuit board 121 is arranged opposite to the second surface P2, and the connecting plate 124 is electrically connected with the first circuit board 121.

[0098] The first circuit board 121 can be an FPC or a PCB. The shape of the first circuit board 121 can be the same as the shape of the second surface P2. The first surface P1 is arranged opposite to the second surface P2, and the first circuit board 121 is arranged opposite to the second surface P2, so that when the finger touches the first surface P1, the finger can form a capacitance with the first circuit board 121.

[0099] For example, the first circuit board 121 and the connecting plate 124 can be an integrated structure, or the first circuit board 121 and the connecting plate 124 can be electrically connected by a cable or the like. In some examples, the connecting plate 124 of the circuit board 120 is electrically connected with the mainboard.

[0100] It can be understood that the connecting plate 124 is electrically connected with the first circuit board 121 and the mainboard, so that the first circuit board 121 can be electrically connected with the mainboard through the connecting plate 124. For example, the connecting plate 124 can be an FPC, so that the connecting plate 124 can be bent to reduce the mutual restriction of the first circuit board 121 and the mainboard in position, and improve the convenience of the electrical connection between the first circuit board 121 and the mainboard.

[0101] In some examples, as shown in FIG. 8, the sensor 130 includes a plurality of capacitive sensors 131, the plurality of capacitive sensors 131 are located on the side of the first circuit board 121 away from the second surface P2 and are electrically connected with the first circuit board 121. At least two capacitive sensors 131 in the plurality of capacitive sensors 131 are arranged in an array.

[0102] It can be understood that at least two capacitive sensors 131 in the plurality of capacitive sensors 131 are arranged in an array, that is, the plurality of capacitive sensors 131 can be arranged in an array, or as shown in FIG. 8, a part (two, three or more) of the plurality of capacitive sensors 131 are arranged in an array. For example, at least two capacitive sensors 131 in the plurality of capacitive sensors 131 can be arranged in an array along the first direction X and the third direction Z.

[0103] In some examples, the first circuit board 121 is provided with an array of first pads on a side away from the second surface P2, and at least two of the plurality of capacitive sensors 131 are soldered to the first pads, so that the at least two of the plurality of capacitive sensors 131 can be arranged in an array.

[0104] It can be understood that the capacitive sensors 131 are arranged on the side of the first circuit board 121 away from the second surface P2 and electrically connected to the first circuit board 121, so that the capacitive sensors 131 can sense the capacitance formed between the fingers and the first circuit board 121. In addition, the at least two of the plurality of capacitive sensors 131 are arranged in an array, so that the at least two of the capacitive sensors 131 can be located at different positions on the side of the first circuit board 121 away from the second surface P2, thereby being able to sense the capacitance formed between the fingers and the first circuit board 121 at different positions. In this way, the sliding of the fingers on the first surface P1 in the first direction X and the third direction Z can both operate the key assembly 100, improving the flexibility and convenience when operating the key assembly 100.

[0105] In some examples, as shown in FIG. 13, the key assembly 100 includes a first adhesive layer 101, and the first circuit board 121 is adhered to the second surface P2 through the first adhesive layer 101.

[0106] In examples, after the capacitive sensors 131 are electrically connected to the first circuit board 121, the surface of the first circuit board 121 away from the capacitive sensors 131 can be adhered to the second surface P2 through the first adhesive layer 101, so that the key body 110, the first circuit board 121 and the capacitive sensors 131 can form an integral whole, thereby the three can be assembled together with the frame 2011 of the electronic device 200, without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0107] In some examples, as shown in FIGS. 11 and 12, the main body structure 111 includes a protruding portion 111a and an extending portion 111b, and the protruding portion 111a is connected to the extending portion 111b. It can be understood that the extending portion 111b is located on one side of the protruding portion 111a along the first direction X and is connected to the protruding portion 111a. In examples, the protruding portion 111a and the extending portion 111b can be an integral structure to improve the connection reliability therebetween.

[0108] The width of the protruding portion 111a along the third direction Z is greater than the width of the extending portion 111b along the third direction Z. The third direction Z intersects the plane in which the first direction X and the second direction Y lie. In examples, the third direction Z is perpendicular to the plane in which the first direction X and the second direction Y lie.

[0109] It can be understood that the width of the protrusion 111a along the third direction Z at different positions along the first direction X can be the same or different. The width of the extension 111b along the third direction Z at different positions along the first direction X can be the same or different. The width of the protrusion 111a along the third direction Z at any position along the first direction X is greater than the width of the extension 111b along the third direction Z at any position along the first direction X.

[0110] In some examples, as shown in FIG. 8, at least two of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a.

[0111] At least two of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a, that is, all of the plurality of capacitive sensors 131 can be arranged along the extension direction of the edge of the protrusion 111a, or, as shown in FIG. 8, part (two, three or more) of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a.

[0112] It can be understood that the main body structure 111 includes the protrusion 111a, which can increase the width of the main body structure 111 along the third direction Z, increase the area of the first surface P1, so that the user's finger can slide along a circular track on the first surface P1. At least two of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a, so that the capacitive sensor 131 can sense the capacitance formed between the first circuit board 121 at different positions when the finger slides along the circular path, so that the finger slides along the circular path on the first surface P1 can be used to operate the key assembly 100, and the flexibility and convenience in operating the key assembly 100 are improved. For example, sliding the finger along the circular path on the first surface P1 can adjust the focal length, ISO, filter and the like when taking a picture.

[0113] For example, as shown in FIG. 8, part (two, three or more) of the plurality of capacitive sensors 131 are arranged in an array, and the other part (two, three or more) of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a, so that the finger slides along the first direction X, the third direction Z or the circular track on the first surface P1 can operate the key assembly 100, and the flexibility and convenience of operating the key assembly 100 are improved.

[0114] In some examples, as shown in FIGS. 11 and 12, the protruding portion 111a has a first side wall surface M1 and a second side wall surface M2 oppositely arranged along the third direction Z. At least one of the first side wall surface M1 and the second side wall surface M2 is curved away from the other.

[0115] In some examples, as shown in FIGS. 11 and 12, the protruding portion 111a has a first side wall surface M1 and a second side wall surface M2 oppositely arranged along the third direction Z. At least one of the first side wall surface M1 and the second side wall surface M2 is curved away from the other.

[0116] It can be understood that, by arranging at least one of the first side wall surface M1 and the second side wall surface M2 to be curved away from the other, the width of the protruding portion 111a along the third direction Z can be greater than the width of the extending portion 1111b along the third direction Z, so that the user’s finger can slide along the annular track on the first surface P1, improving the flexibility and convenience in operating the key assembly 100.

[0117] In some examples, the first side wall surface M1 is curved away from the second side wall surface M2. The second side wall surface M2 is curved away from the first side wall surface M1. In this way, the structural regularity of the protruding portion 111a can be improved.

[0118] In some examples, as shown in FIGS. 11 and 12, the number of the extending portions 111b is two, and the two extending portions 111b are located on both sides of the protruding portion 111a along the first direction X and connected to the protruding portion 111a respectively.

[0119] In this way, the protruding portion 111a can be located between the two extending portions 111b, improving the structural regularity and aesthetics of the main body structure 111.

[0120] In some examples, as shown in FIGS. 11 and 12, the key body 110 further comprises a bending structure 112. The bending structure 112 is located on the side where the second surface P2 is located along the second direction Y and connected to the main body structure 111. In some examples, the bending structure 112 and the main body structure 111 can be an integrally formed structure to improve the connection reliability therebetween. The bending structure 112 can be bent and extended away from the main body structure 111 along the first direction X.

[0121] FIG. 14 is a structural schematic diagram of a circuit board according to some examples of the present application. FIG. 15 is a sectional schematic diagram of FIG. 6 along the direction C-C.

[0122] In some examples, as shown in FIG. 14 and FIG. 15, the circuit board 120 further comprises a second circuit board 122, which is arranged opposite to the surface of the bending structure 112 away from the main body structure 111. The connecting plate 124 is electrically connected with the second circuit board 122. It can be understood that the connecting plate 124 is electrically connected with the main board, so that the second circuit board 122 can be electrically connected with the main board through the connecting plate 124.

[0123] The second circuit board 122 and the connecting plate 124 can be an integrally formed structure, or the second circuit board 122 and the connecting plate 124 can also be electrically connected through a cable or the like. For example, the connecting plate 124 can be an FPC, so that the connecting plate 124 can be bent to reduce the mutual restriction in position between the second circuit board 122 and the main board, and improve the convenience of the electrical connection between the second circuit board 122 and the main board. The second circuit board 122 can be an FPC or a PCB.

[0124] In some examples, as shown in FIG. 14, the second circuit board 122 and the first circuit board 121 can be electrically connected with the same connecting plate 124, and electrically connected with the main board through the same connecting plate 124. In other examples, the second circuit board 122 and the first circuit board 121 can also be electrically connected with different connecting plates 124 respectively, and electrically connected with the main board through different connecting plates 124.

[0125] In some examples, the sensor 130 comprises a gravity sensor 132, which is located on the side of the second circuit board 122 away from the bending structure 112 and is electrically connected with the second circuit board 122.

[0126] The side of the second circuit board 122 away from the bending structure 112 can be provided with a second pad, and the gravity sensor 132 is welded with the second pad, so that the gravity sensor 132 can be located on the side of the second circuit board 122 away from the bending structure 112 and be electrically connected with the second circuit board 122.

[0127] It can be understood that when the user taps the main body structure 111, the main body structure 111 will vibrate, thereby driving the bending structure 112 to vibrate. The vibration can be transmitted to the gravity sensor 132 electrically connected with the second circuit board 122. The gravity sensor 132 senses the gravitational acceleration caused by the vibration and converts the gravitational acceleration into an electrical signal and sends it to the main board, so that the electronic device 200 can realize the set function.

[0128] That is, the second circuit board 122 is arranged opposite to the surface of the bending structure 112 away from the main body structure 111, so that the vibration caused by knocking the main body structure 111 can be transmitted to the gravity sensor 132 electrically connected to the second circuit board 122 through the bending structure 112, shortening the transmission path of the vibration and improving the accuracy of the gravity acceleration sensed by the gravity sensor 132, thereby improving the reliability when the key assembly 100 is operated in the knocking manner. Moreover, the mutual influence between the second circuit board 122 and the first circuit board 121 can be reduced.

[0129] In some examples, as shown in FIGS. 11 and 12, the number of bending structures 112 is two, and the two bending structures 112 are arranged at intervals along the first direction X. For example, the two bending structures 112 can be located at two ends of the main body structure 111 along the first direction X and connected to the end portions of the main body structure 111, respectively.

[0130] As shown in FIG. 14, the second circuit board 122 includes two first sub-circuit boards 1221 electrically connected, and the two first sub-circuit boards 1221 are arranged opposite to the surface of the two bending structures 112 away from the main body structure 111, respectively. For example, the second circuit board 122 further includes a second sub-circuit board 1222, and the two first sub-circuit boards 1221 are electrically connected through the second sub-circuit board 1222. The second sub-circuit board 1222 and the two first sub-circuit boards 1221 can be an integral structure. The number of gravity sensors 132 is two, and the two gravity sensors 132 are located away from the bending structures 112 on the side of the two first sub-circuit boards 1221, respectively.

[0131] In this way, the two gravity sensors 132 can be arranged at intervals along the first direction X. When the main body structure 111 is knocked, the vibration can be transmitted to the two gravity sensors 132 arranged at intervals through the two bending structures 112, and the two gravity sensors 132 arranged at intervals respectively sense the gravity acceleration caused by the knocking and convert the gravity acceleration into an electrical signal and send it to the main board, thereby improving the reliability when the key assembly 100 is operated in the knocking manner.

[0132] In some examples, the first circuit board 121 is located between the two bending structures 112.

[0133] In this way, the occupation space of the key assembly 100 along the second direction Y can be reduced, which is beneficial to the miniaturization of the key assembly 100.

[0134] In some examples, as shown in FIGS. 11 and 12, the bending structure 112 includes a first sub-bending structure 1121 and a second sub-bending structure 1122, and the first sub-bending structure 1121 is connected with the second sub-bending structure 1122. An end of the first sub-bending structure 1121 away from the second sub-bending structure 1122 is connected with the main body structure 111. The first sub-bending structure 1121 extends along the second direction Y, and the second sub-bending structure 1122 extends away from the main body structure 111 along the first direction X. The second circuit board 122 (a first sub-circuit board 1221) is arranged opposite to a surface of the second sub-bending structure 1122 away from the main body structure 111.

[0135] The bending structure 112 can be an integrally formed structure, so as to improve the connection reliability between the first sub-bending structure 1121 and the second sub-bending structure 112. The first sub-bending structure 1121 extends along the second direction Y, and the second sub-bending structure 1122 extends away from the main body structure 111 along the first direction X, so that the bending structure 112 can bend and extend away from the main body structure 111 along the first direction X.

[0136] The second circuit board 122 (the first sub-circuit board 1221) is arranged opposite to the surface of the second sub-bending structure 1122 away from the main body structure 111, so that the vibration caused by the knocking can be transmitted to the gravity sensor 132 electrically connected with the second circuit board 122 through the bending structure 112, thereby enabling the knocking to operate the key assembly 100. Moreover, the bending structure 112 bends and extends away from the main body structure 111 along the first direction X, so as to reduce the mutual influence between the second circuit board 122 and the first circuit board 121.

[0137] In some examples, the key assembly 100 further includes a second adhesive layer 102 (see FIG. 7), and the second circuit board 122 (the first sub-circuit board 1221) is adhered to the surface of the second sub-bending structure 1122 away from the main body structure 111 through the second adhesive layer 102.

[0138] In some examples, the second circuit board 122 (the first sub-circuit board 1221) can be adhered to the surface of the second sub-bending structure 1122 away from the main body structure 111 through the second adhesive layer 102 after the gravity sensor 132 is electrically connected with the second circuit board 122, so that the key body 110, the second circuit board 122 and the gravity sensor 132 can be integrated as a whole, thereby enabling the three to be assembled together with the frame 2011 of the electronic device 200 without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0139] FIG. 16 is a structural schematic view of a support structure provided in some embodiments of the present application.

[0140] In some examples, as shown in FIGS. 6 and 7, the key assembly 100 further includes a support structure 140 located on a side of the first circuit board 121 away from the main body structure 111 along the second direction Y. The support structure 140 is connected to the key body 110. For example, the support structure 140 can be connected to the bent structure 112 of the key body 110. For example, the support structure 140 can be connected to the bent structure 112 by clamping.

[0141] It can be understood that the support structure 140 can support the key body 110, the circuit board 120, and the sensor 130. For example, the support structure 140 can be made of stainless steel, or the support structure 140 can be made of other metal or non-metal materials. The embodiments of the present application do not further limit the material of the support structure 140.

[0142] In addition, the support structure 140 is connected to the key body 110, the circuit board 120 is bonded to the key body 110 (the main body structure 111 or the bent structure 112), and the sensor 130 is electrically connected to the circuit board 120, so that the support structure 140, the circuit board 120, and the sensor 130 can be an integral whole, which can be connected to the frame 2011 together, without being connected to the frame 2011 respectively, thereby improving the convenience of assembling the key assembly 100 and the frame 2011 together, improving the assembly efficiency, and reducing the assembly cost.

[0143] In some examples, as shown in FIGS. 15 and 16, the support structure 140 includes a support plate 141 and a support piece 142. The support plate 141 extends along the first direction X.

[0144] For example, as shown in FIG. 16, the support plate 141 includes a support body 1411 and a connecting portion 1412. The number of the connecting portion 1412 is two, and the two connecting portions 1412 are located on both sides of the support body 1411 along the first direction X and are connected to the support body 1411, respectively. For example, the support plate 141 can be an integrally formed structure to improve the connection reliability between the connecting portion 1412 and the support body 1411.

[0145] As shown in FIG. 16, the two ends of the support body 1411 are bent and extended along the second direction Y. The connecting portion 1412 includes a first sub-structure 1412a and a second sub-structure 1412b, and the first sub-structure 1412a and the second sub-structure 1412b are connected. The end of the first sub-structure 1412a away from the second sub-structure 1412b is connected to the end of the support body 1411. Among them, the second sub-structure 1412b is closer to the first circuit board 121 relative to the first sub-structure 1412a.

[0146] In some examples, the support plate 141 is connected to the frame 2011 of the electronic device 200.

[0147] In some examples, the second substructure 1412b is provided with a threaded hole D, as shown in FIG. 13 and FIG. 15. The key assembly 100 comprises a connecting bolt 105, which can pass through the connecting threaded hole D and be connected with the frame 2011, so that the support plate 141 can be connected with the frame 2011 of the electronic device 200. It can be understood that the support structure 140 (including the support plate 141 and the support piece 142) is located in the accommodating space surrounded by the shell 201.

[0148] In some examples, the number of connecting threaded holes D can be two, and the two connecting threaded holes D are located on both sides of the key body 110 along the first direction X, so as to avoid affecting the key body 110 by the connecting bolt 105.

[0149] The support plate 141 is connected with the frame 2011, so that the 1141 can fix the key body 110, the circuit board 120 and the sensor 130 on the frame 2011, reduce the risk of shaking of the key body 110, the circuit board 120 and the sensor 130 relative to the frame 2011, and improve the reliability of the key assembly 100.

[0150] It can be understood that during the processing process, there can be an error between the size of the through hole G of the frame 2011, the key body 110 and the support structure 140 and the set size, which can be referred to as a tolerance. If the tolerance is within the set tolerance range, the product size is qualified. In some examples, the frame 2011, the key body 110 and the support structure 140 with the tolerance at the upper limit of the tolerance range are assembled, and the frame 2011, the key body 110 and the support structure 140 with the tolerance at the lower limit of the tolerance range are assembled, so as to improve the yield after assembly.

[0151] In some examples, as shown in FIG. 15 and FIG. 16, the support piece 142 is located on the side of the support plate 141 close to the first circuit board 121 and is connected with the support plate 141. The support piece 142 and the support plate 141 surround a clamping groove Q. The second sub-bending structure 1122, the second circuit board 122 (the first sub-circuit board 1221) and the gravity sensor 132 along at least part of the third direction Z are clamped in the clamping groove Q.

[0152] In this way, the clamping groove Q can limit the second sub-bending structure 1122, the second circuit board 122 (the first sub-circuit board 1221) and the gravity sensor 132, reduce the risk of deviation of the second sub-bending structure 1122, the second circuit board 122 (the first sub-circuit board 1221) and the gravity sensor 132 relative to the support structure 140 when the main body structure 111 is knocked or pressed, and improve the reliability of the key assembly 100.

[0153] In some examples, as shown in FIG. 16, the number of the supports 142 is two, and the two supports 142 are spaced apart along the first direction X. The two supports 142 can respectively surround the support plate 141 to form the clamping grooves Q, and one second sub-bending structure 1122, one second circuit board 122 and one gravity sensor 133 are located in one clamping groove Q.

[0154] In some examples, the key assembly 100 includes a fourth adhesive layer 104 (see FIG. 7), the first circuit board 121 is located between the two supports 142, and the side of the first circuit board 121 close to the capacitive sensor 131 is adhered to the surface of the side of the support plate 141 close to the first circuit board 121 through the fourth adhesive layer 104, so as to improve the convenience of assembly between the first circuit board 121 and the support plate 141. In addition, the key body 110, the circuit board 120, the sensor 130 and the support structure 140 can be integrated as a whole, so as to improve the convenience of assembly of the key assembly 100 and the frame 2011.

[0155] In some examples, as shown in FIG. 15, the support 142 includes a side wall 1421 and a bottom wall 1422, the side wall 1421 is arranged opposite to the support plate 141, and one end of the bottom wall 1422 is connected to the side wall 1421 and the other end is connected to the support plate 141. In this way, the support 142 can surround the support plate 141 to form the clamping groove Q.

[0156] In some examples, as shown in FIG. 15, the side wall 1421 includes a first bending portion 1423, the first bending portion 1423 is arranged opposite to the gravity sensor 133, and the first bending portion 1423 is bent towards the support plate 141.

[0157] It can be understood that the first bending portion 1423 is arranged opposite to the gravity sensor 133 and is bent and extends towards the support plate 141, so that the first bending portion 1423 can limit the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122, reduce the risk of the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122 falling out of the clamping groove Q when the key body 110 is tapped or pressed, and improve the reliability of the key assembly 100.

[0158] In some examples, the side wall 1421 can be S-shaped or approximately S-shaped. Alternatively, the side wall 1421 can also be other shapes. The embodiments of the present application do not make further limitation on the shape of the side wall 1421.

[0159] In some examples, the support plate 141 includes a second bending portion (not shown in the figure), the second bending portion is arranged opposite to the gravity sensor 133, and the second bending portion is bent towards the side wall 1421.

[0160] It can be understood that the second bending part is arranged opposite to the gravity sensor 133 and extends in a direction close to the side wall 1421, so that the second bending part can limit the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122, reduce the risk of the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122 falling out of the clamping groove Q when the key body 110 is knocked or pressed, and improve the reliability of the key assembly 100.

[0161] In some examples, the side wall 1421 includes the first bending part 1423, and the support plate 141 does not include the second bending part. In other examples, the side wall 1421 does not include the first bending part 1423, and the support plate 141 includes the second bending part. In yet other examples, the side wall 1421 includes the first bending part 1423, and the support plate 141 includes the second bending part.

[0162] FIG. 17 is a structural schematic diagram of a key assembly provided by some embodiments of the present application.

[0163] In some examples, as shown in FIGS. 14 and 17, the circuit board 120 further includes a third circuit board 123, which is located on a side of the first circuit board 121 away from the main body structure 111 along the second direction Y. The connecting plate 124 is electrically connected with the third circuit board 123.

[0164] The third circuit board 123 can be an FPC or a PCB. For example, the third circuit board 123 can be located between the first circuit board 121 and the support structure 140, or the third circuit board 123 can also be located on a side of the support structure 140 away from the first circuit board 121. In some examples, the number of the connecting plates 124 is one, and the first circuit board 121, the second circuit board 122 and the third circuit board 123 are electrically connected with the main plate through one connecting plate 124. In other examples, the number of the connecting plates 124 is multiple, and the first circuit board 121, the second circuit board 122 and the third circuit board 124 are electrically connected with the main plate through at least two connecting plates 124.

[0165] In some examples, as shown in FIG. 17, the sensor 130 includes a pressure sensor 133, which is located on a side of the third circuit board 123 away from the first circuit board 121 and is electrically connected with the third circuit board 123.

[0166] The number of pressure sensors 133 can be one or more. When the number of pressure sensors 133 is more than one, the plurality of pressure sensors 133 are arranged at intervals on the side of the third circuit board 123 away from the first circuit board 121. For example, the side of the third circuit board 123 away from the first circuit board 121 is provided with a third pad, and the pressure sensor 133 is welded to the third pad, so that the pressure sensor 133 can be located on the side of the third circuit board 123 away from the first circuit board 121 and electrically connected to the third circuit board 123.

[0167] The third circuit board 123 is arranged on the side of the first circuit board 121 away from the main body structure 111 along the second direction Y, and the pressure sensor 133 is arranged on the side of the third circuit board 123 away from the first circuit board 121 and electrically connected to the third circuit board 123, so that when the main body structure 111 is mechanically deformed by pressing the key body 110, the main body structure 111 can apply pressure to the pressure sensor 133, thereby enabling the key assembly 100 to be operated by the manner of pressing the key body 110.

[0168] In some examples, the third circuit board 123 is arranged opposite to the surface of the support plate 141 on the side away from the first circuit board 121.

[0169] It can be understood that when the main body structure 111 is pressed, the main body structure 111 is mechanically deformed, which can press the support plate 141, so that the support plate 141 is mechanically deformed. The third circuit board 123 is arranged opposite to the surface of the support plate 141 on the side away from the first circuit board 121, and the pressure sensor 133 is electrically connected to the third circuit board 123 on the side away from the support plate 141 (the first circuit board 121), so that the pressure sensor 133 can sense the pressure caused by the mechanical deformation of the support plate 141 and convert the pressure into an electrical signal and send it to the mainboard, thereby enabling the key assembly 100 to be operated by the manner of pressing the key body 110.

[0170] In some examples, the key assembly 100 further comprises a third adhesive layer 103 (see FIG. 7). The third circuit board 123 is adhered to the surface of the support plate 141 on the side away from the first circuit board 121 by the third adhesive layer 103.

[0171] For example, after the pressure sensor 133 is electrically connected to the third circuit board 123, the surface of the third circuit board 123 on the side away from the pressure sensor 133 can be adhered to the surface of the support plate 141 on the side away from the first circuit board 121 by the third adhesive layer 103, so that the key body 110, the support structure 140, the third circuit board 123 and the pressure sensor 133 can be integrated as a whole, thereby the four can be assembled together with the frame 2011 of the electronic device 200, without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0172] In some examples, as shown in FIGS. 6 and 7, the key assembly 100 further comprises a sealing member 150 surrounding the main body structure 111.

[0173] In examples, the sealing member 150 can be a sealing ring. In some examples, an injection moding liquid silicone rubber (LIM) can be formed around the main body structure 111 as the sealing member 150. In other examples, an O ring can be sleeved on the main body structure 111 as the sealing member 150.

[0174] It can be understood that, when the main body structure 111 is embedded in the through hole G of the frame 2011, the sealing member 150 is located in the space surrounded by the shell 201 and in contact with the inner wall surface of the frame 2011, so that the sealing member 150 can seal the through hole G, reduce the risk of water or impurities entering the accommodation space through the through hole G, and improve the reliability of the electronic device 200.

[0175] In summary, the embodiments of the present application have at least the following beneficial effects:

[0176] In the embodiments of the present application, the circuit board 120 is connected to the key body 110, for example, directly connected or indirectly connected, and the sensor 130 is located on the side of the circuit board 120 away from the key body 110 and is electrically connected to the circuit board 120, so that the user can be sensed by the sensor 130 when operating the key body 110. The sensor 130 converts the sensing signal (such as capacitance, gravity acceleration and pressure, etc.) into an electrical signal (such as current or voltage, etc.), and sends the electrical signal to the mainboard of the electronic device 200 through the circuit board 120. The processor (such as CPU) of the electronic device 200 is electrically connected to the mainboard, so as to control other components of the electronic device 200 according to the received electrical signal, so that the electronic device 200 can respond to the operation of the key body 110 by the user to realize the set function.

[0177] It can be understood that, when the sensor 130 comprises a plurality of capacitance sensors 131 arranged at intervals, the key assembly 100 can be operated by using the multi-directional sliding of the finger on the key body 110. When the sensor 130 comprises a gravity sensor 132, the key assembly 100 can be operated by tapping the key body 110. When the sensor 130 comprises a pressure sensor 133, the key assembly 100 can be operated by pressing the key body 110.

[0178] In this way, the sensor 130 is provided with at least two of the capacitive sensor 131, the gravity sensor 132 and the pressure sensor 133, and when the sensor 130 includes the capacitive sensor 131, the plurality of capacitive sensors 131 are arranged at intervals, so that the key assembly 100 can be operated in at least two of the three ways of multidirectional sliding, tapping and pressing the key body 110 by a finger, so that the electronic device 200 can implement a set function, and the flexibility and convenience in operating the key assembly 100 are improved.

[0179] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art who thinks of changes or replacements within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A key assembly, characterized in that: include: Button body; a circuit board, located on one side of the key body and connected to the key body; and A sensor is located on a side of the circuit board away from the button body and is electrically connected to the circuit board; the sensor includes at least two of a capacitive sensor, a gravity sensor, and a pressure sensor; wherein, when the sensor includes the capacitive sensor, the number of the capacitive sensors is multiple, and the multiple capacitive sensors are arranged at intervals.

2. The key assembly according to claim 1, wherein: The button body includes a main structure, the main structure extends along a first direction and has a first surface and a second surface arranged opposite to each other along a second direction; the first direction intersects the second direction; The circuit board includes a first circuit board and a connecting board, the first circuit board is arranged opposite to the second surface, and the connecting board is electrically connected to the first circuit board; The sensor includes a plurality of capacitive sensors, which are located on a side of the first circuit board away from the second surface and electrically connected to the first circuit board; at least two of the plurality of capacitive sensors are arranged in an array.

3. The key assembly according to claim 2, characterized in that: The main structure includes a protruding portion and an extending portion, wherein the protruding portion is connected to the extending portion; the width of the protruding portion along the third direction is greater than the width of the extending portion along the third direction; the third direction intersects with the plane where the first direction and the second direction are located; At least two of the plurality of capacitance sensors are spaced apart from each other along an extending direction of the edge of the protruding portion.

4. The key assembly according to claim 3, characterized in that: The protrusion has a first side wall surface and a second side wall surface that are opposite to each other along a third direction; at least one of the first side wall surface and the second side wall surface is bent in a direction away from the other.

5. The key assembly according to claim 3 or 4, characterized in that: There are two extending portions, and the two extending portions are located on both sides of the protruding portion along the first direction and are respectively connected to the protruding portion.

6. The key assembly according to any one of claims 2 to 5, characterized in that: It also includes a first adhesive layer, and the first circuit board is bonded to the second surface through the first adhesive layer.

7. The key assembly according to any one of claims 2 to 6, characterized in that: The button body further includes a bending structure, which is located on the side where the second surface is located along the second direction and is connected to the main structure; The circuit board further includes a second circuit board, which is arranged opposite to a surface of the bending structure away from the main structure; the connecting plate is electrically connected to the second circuit board; The sensor includes a gravity sensor, which is located on a side of the second circuit board away from the bending structure and is electrically connected to the second circuit board.

8. The key assembly according to claim 7, characterized in that: There are two bending structures, and the two bending structures are arranged at intervals along the first direction; the second circuit board includes two electrically connected first sub-circuit boards, and the two first sub-circuit boards are respectively arranged opposite to the surfaces of the two bending structures on the side away from the main structure; there are two gravity sensors, and the two gravity sensors are respectively located on the side of the two first sub-circuit boards away from the bending structures.

9. The key assembly according to claim 8, characterized in that: The first circuit board is located between the two bending structures.

10. The key assembly according to any one of claims 7 to 9, characterized in that: The bending structure includes a first sub-bending structure and a second sub-bending structure, wherein the first sub-bending structure is connected to the second sub-bending structure; an end of the first sub-bending structure away from the second sub-bending structure is connected to the main structure; the first sub-bending structure extends along the second direction, and the second sub-bending structure extends along the first direction away from the main structure; The second circuit board is disposed opposite to a surface of the second sub-bending structure away from the main structure.

11. The key assembly according to claim 10, characterized in that: It also includes a second adhesive layer, and the second circuit board is bonded to the surface of the second sub-bending structure away from the main structure through the second adhesive layer.

12. The key assembly according to claim 10 or 11, characterized in that: Also includes: a supporting structure, the supporting structure being located along the second direction on a side of the first circuit board away from the main structure; The supporting structure is connected to the button body.

13. The key assembly according to claim 12, wherein: The support structure includes a support plate and a support member; the support plate extends along the first direction, the support member is located on a side of the support plate close to the first circuit board and is connected to the support plate; the support member and the support plate are surrounded by a clamping groove; At least a portion of the second sub-bending structure along the third direction, at least a portion of the second circuit board along the third direction, and the gravity sensor are clamped in the clamping groove; The third direction intersects a plane where the first direction and the second direction lie.

14. The key assembly according to claim 13, wherein: The support member includes a side wall and a bottom wall, wherein the side wall is arranged opposite to the support plate; one end of the bottom wall is connected to the side wall, and the other end is connected to the support plate.

15. The key assembly according to claim 14, characterized in that: The side wall includes a first bending portion, the first bending portion is arranged opposite to the gravity sensor, and the first bending portion is bent in a direction close to the support plate; or, The support plate includes a second bending portion, the second bending portion is arranged opposite to the gravity sensor, and the second bending portion is bent in a direction close to the side wall.

16. The key assembly according to any one of claims 13 to 15, characterized in that: The circuit board further includes a third circuit board, the third circuit board being located on a side of the first circuit board away from the main structure along the second direction; the connecting plate is electrically connected to the third circuit board; The sensor includes a pressure sensor, which is located on a side of the third circuit board away from the first circuit board and is electrically connected to the third circuit board.

17. The key assembly according to claim 16, wherein: The third circuit board is arranged opposite to a surface of the support plate away from the first circuit board.

18. The key assembly according to claim 17, wherein: It also includes a third adhesive layer; the third circuit board is bonded to the surface of the support plate away from the first circuit board through the third adhesive layer.

19. The key assembly according to any one of claims 2 to 18, characterized in that: Also included is a sealing member, which surrounds the main structure.

20. An electronic device, characterized in that: include: A housing, the housing comprising a frame, the frame being provided with a through hole; The key assembly according to any one of claims 1 to 19, wherein the key body of the key assembly is partially embedded in the through hole.

21. The electronic device according to claim 20, characterized in that It also includes a main board, the key assembly includes a circuit board, and the connecting plate of the circuit board is electrically connected to the main board.

22. The electronic device according to claim 20 or 21, characterized in that: The button assembly further includes a supporting structure, which includes a supporting plate, and the supporting plate is connected to the frame of the electronic device.

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