Component mounting machine

Abstract

This component mounting machine includes: a first supply unit to which a first component having a first size is supplied; a second supply unit to which a second component having a second size different from the first size is supplied; a plurality of first nozzles capable of picking up the first component; a plurality of second nozzles capable of picking up the second component; a mounting head that holds the plurality of first nozzles and the plurality of second nozzles; and a control device. At least one first nozzle among the plurality of first nozzles is disposed between two adjacent second nozzles among the plurality of second nozzles. The control device is capable of executing a first pickup process of picking up the first component by at least one first nozzle disposed between two adjacent second nozzles; a second pickup process of picking up the second component by two adjacent second nozzles before or after execution of the first pickup process; and a mounting process of mounting the first component and the second component on a substrate after the execution of the first pickup process and the second pickup process.

Description

Component Mounting Machine

[0001] The technology disclosed in this specification relates to a component mounter, and more particularly to a component mounter that mounts a plurality of components of different sizes onto a board.

[0002] The component mounter of Patent Document 1, when picking up electronic components sequentially with two or more suction nozzles, determines whether the electronic component to be picked up will interfere with other electronic components, and if it determines that two electronic components will interfere with each other, offsets the pickup position where the suction nozzle picks up the electronic component in a direction (toward the outer diameter of the nozzle head) that avoids component interference, thereby preventing electronic components of different sizes from interfering with each other when being picked up.

[0003] JP 2008-71941 A

[0004] In a mounter that mounts components of different sizes, a first component having a first size is typically supplied to a first supply unit, and a second component having a second size is supplied to a second supply unit. In such a mounter, a mounting head is provided with a plurality of first nozzles capable of picking up a first component and a plurality of second nozzles capable of picking up a second component. A first component is picked up by each of the plurality of first nozzles, and a second component is picked up by each of the plurality of second nozzles, and the picked-up first and second components are then mounted on a board. In conventional mounters, the order in which components are picked up by the plurality of nozzles is determined by the arrangement order of the plurality of nozzles held by the mounting head. Therefore, if a first nozzle is positioned between two adjacent second nozzles, the second component is first picked up by one of the two adjacent second nozzles, and then the first component is picked up by the first nozzle positioned between the two adjacent second nozzles, and then the second component is picked up by the other of the two adjacent second nozzles. Therefore, in conventional mounters, the mounting head holding the nozzle for picking up components moves from the second supply unit to the first supply unit after picking up one second component, and then moves back from the first supply unit to the second supply unit after picking up one first component. When the mounting head moves between the first and second supply units in this manner, the movement distance of the mounting head during component pick-up increases, reducing the production efficiency of the mounter. This specification provides a technology that can improve the production efficiency of mounters compared to conventional technology when mounting first and second components of different sizes on a board.

[0005] The technology disclosed herein is embodied in a component mounter that mounts multiple components on a board. The component mounter includes a first supply unit that supplies first components having a first size, a second supply unit that supplies second components having a second size different from the first size, a plurality of first nozzles capable of picking up the first components supplied to the first supply unit, a plurality of second nozzles capable of picking up the second components supplied to the second supply unit, a mounting head that holds the plurality of first nozzles and the plurality of second nozzles, and a control device. At least one of the plurality of first nozzles is disposed between two adjacent second nozzles of the plurality of second nozzles. The control device is capable of executing a first suction process for suctioning the first component onto the at least one first nozzle disposed between the two adjacent second nozzles, a second suction process for suctioning the second component onto the two adjacent second nozzles before or after the first suction process is executed, and a mounting process for mounting the first component picked up by the first suction process and the second component picked up by the second suction process onto the board after the first suction process and the second suction process are executed.

[0006] In the component mounter described above, the second pickup process is performed before or after the first pickup process, and the mounting process is performed after the first and second pickup processes. That is, the second component is picked up by two adjacent second nozzles, and the first component is picked up by the first nozzle located between the two adjacent second nozzles before or after that. This reduces the number of times the mounting head moves between the first and second supply units compared to conventional techniques. This shortens the movement distance of the mounting head, thereby improving production efficiency compared to conventional techniques.

[0007] 1 is a schematic plan view of a component mounter according to a first embodiment; an enlarged view of the range indicated by line II in FIG. 1; a flowchart of the mounting process according to the first embodiment; a plan view showing the movement trajectory of a mounting head in the mounting process according to the first embodiment; and a plan view showing the movement trajectory of a mounting head in the mounting process according to a second embodiment.

[0008] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0009] (Feature 1) In the component mounter described above, in the first suction process, each of the plurality of first nozzles may pick up the first component while the mounting head is positioned relative to the first supply unit, and in the second suction process, each of the plurality of second nozzles may pick up the second component while the mounting head is positioned relative to the second supply unit.

[0010] With this configuration, the first component is picked up by all of the first nozzles in the first suction process, and the second component is picked up by all of the second nozzles in the second suction process. Therefore, the mounting head does not move back and forth between the first supply unit and the second supply unit, and the movement distance of the mounting head can be further shortened.

[0011] (Feature 2) In the component mounter described above, the control device may further execute a pickup order setting process that sets a pickup order of the first pickup process and the second pickup process, and a mounting order setting process that sets a mounting order in which each of the plurality of first components picked up in the first pickup process and each of the plurality of second components picked up in the second pickup process will be mounted on the board. In this case, the mounting order set in the mounting order setting process may be set arbitrarily regardless of the pickup order set in the pickup order setting process.

[0012] In a configuration in which the mounting order is determined by the pickup order, components are mounted on the board in order of pickup, starting with the first component. In this case, for example, if the mounting positions of multiple first components consecutively picked up in the first pickup process are located far apart on the board, even if the mounting position of a second component is adjacent to the mounting position of the first component just mounted, the mounting head passes the mounting position of the second component and moves to the mounting position of another first component to mount the first component. In this case, the movement distance of the mounting head is extended. With this configuration, the mounting order can be set arbitrarily regardless of the pickup order. For example, if there is a mounting position for a second component adjacent to the mounting position of one first component, after mounting one first component, the second component can be mounted before mounting the other first component. This can shorten the movement distance of the mounting head.

[0013] (Feature 3) In the mounter described above, the second size may be larger than the first size. In this case, the distance between the two second components picked up by the two adjacent second nozzles may be smaller than the second size.

[0014] In this configuration, there is no space between two second components picked up by two adjacent second nozzles. Therefore, even if another second nozzle is placed between two adjacent second nozzles, that second nozzle cannot pick up the second component. By placing a first nozzle between two adjacent second nozzles and picking up a first component that is smaller than the second component, the number of components that can be picked up can be increased without increasing the size of the placement head. This allows the placement head to travel a shorter distance than, for example, a configuration in which only the second component is picked up and mounted, and then only the first component is picked up and mounted.

[0015] (Feature 4) In the component mounter described above, the mounting head may hold the plurality of first nozzles and the plurality of second nozzles arranged on the same circumference.

[0016] With this configuration, the size of the nozzle holding surface of the mounting head can be made smaller than, for example, a configuration in which the mounting head holds a plurality of first nozzles and a plurality of second nozzles that are arranged in a straight line.

[0017] (Feature 5) The above-described component mounter may further include an imaging device capable of capturing bottom images of each of the first components picked up by the plurality of first nozzles and each of the second components picked up by the plurality of second nozzles from below. In this case, the control device may further perform an acquisition process of moving the mounting head above the imaging device after performing the first pickup process and the second pickup process, and acquiring the bottom image by the imaging device, and an inspection process of inspecting the states of the first components and the second components based on the bottom image acquired by the acquisition process.

[0018] With this configuration, the distance traveled by the mounting head can be made shorter than, for example, a configuration in which a first component is picked up, the condition of the first component is inspected, and then the first component is mounted on a board, and then a second component is picked up, the condition of the second component is inspected, and then the second component is mounted on a board.

[0019] (Feature 6) In the component mounter described above, the first size may be smaller than the second size. In this case, a semiconductor wafer may be placed in the first supply unit, and the first components may include a plurality of die components produced by dicing the semiconductor wafer.

[0020] The semiconductor wafers are arranged relatively far away from the other supply units, and this configuration reduces the number of times the mounting head has to move between the semiconductor wafers and the other supply units.

[0021] (Feature 7) In the above-described component mounter, the component mounter may further include a tape feeder having a carrier tape that accommodates the plurality of second components. In this case, the second supply unit may include the tape feeder.

[0022] The semiconductor wafer and the tape feeder are disposed relatively far apart, and this configuration reduces the number of times the mounting head moves between the semiconductor wafer and the tape feeder.

[0023] (Feature 8) In the mounter described above, the first supply unit may include a tray on which the first components are placed. In this case, the mounter may further include a tape feeder having a carrier tape that accommodates the plurality of second components, and the second supply unit may include the tape feeder.

[0024] The tray and the tape feeder are disposed relatively far apart, and this configuration reduces the number of times the mounting head has to move between the tray and the tape feeder.

[0025] First Embodiment A component mounter 10 according to a first embodiment will be described with reference to the drawings. The component mounter 10 is a device that mounts a die component 4F and a chip component 4S on a substrate 2. The component mounter 10 is also referred to as an electronic component mounting device or a chip mounter. The die component 4F is, for example, a plate-shaped component formed from single crystal silicon. The chip component 4S is a so-called SMD (short for Surface Mount Device). The substrate 2 is a circuit board. Typically, the component mounter 10 is installed alongside other devices such as a solder printer and a substrate inspection machine, forming a continuous mounting line.

[0026] 1 is a plan view showing a schematic configuration of a component mounter 10. The component mounter 10 includes an XY robot 11, a head unit 16, a board conveyor 18, an imaging device 19, a first supply unit 20F, a second supply unit 20S, and a control device 40.

[0027] The XY robot 11 is positioned above the substrate 2 and is a device that moves the head unit 16. The XY robot 11 includes a pair of Y-axis sliders 12 that extend along the Y direction and a pair of X-axis sliders 14 that extend along the X direction. The head unit 16 is held by the X-axis sliders 14. The XY robot 11 moves the head unit 16 in the Y direction along the pair of Y-axis sliders 12 and in the X direction along the X-axis sliders 14. The XY robot 11 moves the head unit 16 between, for example, above the first supply unit 20F and the second supply unit 20S and above the substrate 2.

[0028] The head unit 16 includes a mounting head 30. The mounting head 30 has a cylindrical shape that extends downward (i.e., toward the back of the paper in FIG. 1). The mounting head 30 detachably holds a plurality of nozzles (e.g., 24 nozzles). The mounting head 30 can move the nozzles along the Z axis (i.e., toward the back of the paper in FIG. 1), for example, to move the nozzles toward and away from the substrate 2. The detailed structure of the mounting head 30 will be described later with reference to FIG. 2.

[0029] The board conveyor 18 includes, for example, a belt conveyor, and is a device that carries in, positions, and carries out the board 2. The board conveyor 18 supports the board 2 from below. The board conveyor 18 carries out the board 2 in the X direction (i.e., to the right on the paper surface of FIG. 1 ).

[0030] Each of the supply units 20F, 20S supplies a plurality of components to the mounting head 30. Each of the supply units 20F, 20S is located at the end on the -Y direction side (i.e., the lower side of the paper in FIG. 1) of the component mounter 10. Although not shown in the figure, for example, a smart loader located on the -Y direction side of the component mounter 10 supplies new components to each of the supply units 20F, 20S.

[0031] The first supply unit 20F supplies die components 4F to the mounting head 30. The first supply unit 20F includes a semiconductor wafer 21 and a dicing sheet 23 to which the semiconductor wafer 21 is attached. The semiconductor wafer 21 has an extremely thin, circular disk shape. The first supply unit 20F dices one semiconductor wafer 21 attached to the dicing sheet 23 to produce die components 4F. In a modified example, die components 4F diced externally may be supplied to the first supply unit 20F of the component mounter 10.

[0032] The second supply unit 20S includes a plurality of tape feeders 22 and a feeder holding unit 28. Each of the plurality of tape feeders 22 includes a reel 24. The reel 24 is formed of a wound carrier tape 26. The carrier tape 26 accommodates a plurality of chip components 4S. The tape feeder 22 pushes out the carrier tape 26 in the +Y direction while rotating the reel 24. This causes the chip components 4S to be supplied to the end of the tape feeder 22. The feeder holding unit 28 detachably holds each of the plurality of tape feeders 22.

[0033] The imaging device 19 is positioned adjacent to the board 2 in the -Y direction. The imaging device 19 is a camera with a lens positioned facing upward. The imaging device 19 captures bottom images of the components 4F and 4S that are sucked onto the nozzles of the mounting head 30 from below.

[0034] The control device 40 controls each part of the mounter 10. The control device 40 is configured to be able to communicate with, for example, the XY robot 11, the head unit 16, the mounting head 30, the board conveyor 18, and the imaging device 19. The control device 40 includes a CPU 42 and a memory 44. The memory 44 is configured with a volatile memory and a non-volatile memory. The memory 44 stores a program P1. The program P1 is, for example, a program for mounting die components 4F and chip components 4S on the board 2. The CPU 42 executes various processes in accordance with the program P1. In this embodiment, the program P1 is pre-stored in the memory 44 before shipping the mounter 10. In a modified example, the program P1 may be installed in the memory 44 later, for example, from an external server.

[0035] The detailed structure of the mounting head 30 will be described with reference to FIG. 2 . For ease of understanding, in FIG. 2 , nozzles are indicated by dashed lines, and components picked up by the nozzles are indicated by solid lines. The mounting head 30 holds a plurality of first nozzles 31 and a plurality of second nozzles 32. The mounting head 30 of this embodiment is configured to be able to hold 12 first nozzles 31 and 12 second nozzles 32. In other words, the mounting head 30 is configured to be able to hold 24 nozzles. Note that the number of nozzles that the mounting head 30 can hold is not limited to 24, and may be, for example, 12 or 20.

[0036] The nozzles 31 and 32 are alternately arranged on the same circumference on the underside of the mounting head 30. That is, a first nozzle 31 is arranged between two adjacent second nozzles 32. While FIG. 2 illustrates six of the 24 nozzles, the remaining nozzles are arranged in a similar manner. Because the nozzles 31 and 32 are arranged on the same circumference, the size of the underside of the mounting head 30 can be reduced compared to, for example, a configuration in which the nozzles 31 and 32 are arranged in a straight line. Each of the nozzles 31 and 32 has a cylindrical shape extending downward from the mounting head 30. A vacuum pump (not shown) of the mounter 10 generates negative pressure in the internal space of each nozzle 31 and 32, causing components to be sucked onto the lower ends of the nozzles 31 and 32. The nozzles 31 and 32 have different sizes. As shown in FIG. 2, the diameter of the first nozzle 31 is smaller than the diameter of the second nozzle 32.

[0037] The first nozzle 31 is configured to be able to pick up the die component 4F. The second nozzle 32 is configured to be able to pick up the chip component 4S. Therefore, as shown in FIG. 2, the mounting head 30 picks up the die component 4F and the chip component 4S alternately. The die component 4F has a substantially square shape with a side length of L1. The chip component 4S has a substantially square shape with a side length of L2. As shown in FIG. 2, the length L1 of the die component 4F is shorter than the length L2 of the chip component 4S. In other words, the size of the die component 4F is smaller than the size of the chip component 4S.

[0038] Furthermore, the distance D1 between chip components 4S picked up by two adjacent second nozzles 32 is smaller than the length L2 of the chip components 4S. In other words, there is no space between two adjacent picked-up chip components 4S for the chip components 4S to interpose. As mentioned above, the mounting head 30 is configured to hold 24 nozzles. However, because the length L2 of one side of the chip components 4S is too long, if the mounting head 30 holds 24 second nozzles 32, these 24 second nozzles 32 cannot pick up chip components 4S simultaneously. In this embodiment, by holding the first nozzle 31 between two adjacent second nozzles 32, the first nozzle 31 can pick up die components 4F, which are smaller than the chip components 4S. This allows the number of components that can be picked up simultaneously to be increased without increasing the size of the mounting head 30. This allows the movement distance of the mounting head 30 to be shorter than in a configuration in which, for example, the second nozzle 32 picks up only the chip component 4S, mounts the chip component 4S on the substrate 2, and then the first nozzle 31 picks up only the die component 4F and mounts the die component 4F on the substrate 2.

[0039] The mounting process executed by the CPU 42 of the control device 40 will be described with reference to Figures 3 and 4. The CPU 42 starts the mounting process of Figure 3 in response to receiving job information from a higher-level management device. The job information includes, for example, the mounting positions, number of components to be mounted, pickup order, and mounting sequence of the die components 4F and chip components 4S. Note that the XY robot 11 is not shown in Figure 4 to make the diagram easier to understand.

[0040] In S2, the CPU 42 causes the XY robot 11 to move the mounting head 30 to above the first supply unit 20F.

[0041] In S4, the CPU 42 positions the mounting head 30 above the first supply unit 20F and causes each of the first nozzles 31 to suck the die component 4F. As a result, the die component 4F is held at the lower end of each of the first nozzles 31.

[0042] In S10, the CPU 42 causes the XY robot 11 to move the mounting head 30 from above the first supply unit 20F to above the second supply unit 20S (route R1 in FIG. 4).

[0043] In S12, the CPU 42 positions the mounting head 30 above the second supply unit 20S and causes each of the second nozzles 32 to pick up a chip component 4S. As a result, the chip component 4S is held at the lower end of each of the second nozzles 32.

[0044] In this manner, in this embodiment, the CPU 42 causes each of the first nozzles 31 to pick up a die component 4F in S4, and then causes each of the second nozzles 32 to pick up a chip component 4S in S12. Therefore, the mounting head 30 does not need to return to the first supply unit 20F after moving from the first supply unit 20F to the second supply unit 20S. This allows the movement distance of the mounting head 30 to be shortened.

[0045] In S14, the CPU 42 controls the XY robot 11 to move the mounting head 30 to above the imaging device 19 (route R2 in FIG. 4).

[0046] In S20, the CPU 42 transmits an image capturing instruction to the image capturing device 19. As a result, the image capturing device 19 captures bottom surface images of the die component 4F sucked by the first nozzle 31 and the chip component 4S sucked by the second nozzle 32 from below.

[0047] In S22 , the CPU 42 receives the captured bottom image from the imaging device 19 .

[0048] In S30, the CPU 42 determines whether the suction state between the die component 4F picked up in S4 and the chip component 4S picked up in S12 is good based on the bottom surface image received from the imaging device 19 in S22. The CPU 42 determines, for example, whether foreign matter is attached to the bottom surfaces of the die component 4F and the chip component 4S. The CPU 42 also compares the bottom surface image received in S22 with an image showing an ideal suction state previously stored in the memory 44 to determine whether the suction postures of the die component 4F and the chip component 4S deviate beyond a predetermined range. If the suction state between the die component 4F and the chip component 4S is good (YES in S30), the CPU 42 proceeds to S32. On the other hand, if, for example, foreign matter is attached to the bottom surface of the die component 4F (NO in S30), the CPU 42 proceeds to S40. Thus, in this embodiment, after picking up the die component 4F in S4 and picking up the chip component 4S in S12, the suction state is determined based on the bottom surface image captured by the imaging device 19. This allows the movement distance of the mounting head 30 to be shorter than in a configuration in which, for example, after the die component 4F is adsorbed in S4, the adsorption state of the die component 4F is determined by the imaging device 19, and then after the chip component 4S is adsorbed in S12, the adsorption state of the chip component 4S is determined by the imaging device 19.

[0049] In S40, the CPU 42 executes a correction process. The correction process is, for example, a process of discarding the currently picked-up die component 4F and chip component 4S in a waste box (not shown) and then picking up the die component 4F and chip component 4S again. After completing the process of S40, the CPU 42 executes the processes of S14 to S30 again and inspects the pick-up state of the corrected die component 4F and chip component 4S. The CPU 42 repeats the processes of S14 to S30 until it is determined that the pick-up state is good.

[0050] In S32, the CPU 42 causes the XY robot 11 to move the mounting head 30 to above the mounting position of the board 2 (route R3 in FIG. 4).

[0051] In S50, the CPU 42 determines whether the job information received from the management device includes flag information. The flag information is an instruction to change the mounting order to the pickup order. If the job information does not include flag information (NO in S50), the CPU 42 proceeds to S52. If the job information includes flag information (YES in S50), the CPU 42 proceeds to S54.

[0052] In S52, the CPU 42 mounts the die component 4F and the chip component 4S in the same mounting order as the pickup order. That is, regardless of the respective mounting positions of the die component 4F and the chip component 4S, the CPU 42 first mounts each of the die components 4F in the corresponding mounting position on the board 2, and then mounts each of the chip components 4S in the corresponding mounting position. When the processing of S52 ends, the CPU 42 ends the processing of FIG. 3.

[0053] Meanwhile, in S54, the CPU 42 mounts the die component 4F and the chip component 4S according to a mounting order different from the pickup order. For example, the CPU 42 mounts the die component 4F and the chip component 4S consecutively at nearby mounting positions. That is, in this embodiment, the mounting order can be set arbitrarily regardless of the pickup order. Therefore, for example, in a configuration in which the distance between the mounting positions of multiple die components 4F is longer than the distance between the mounting positions of the die component 4F and the mounting position of the chip component 4S, the movement distance of the mounting head 30 can be shortened. When the processing of S54 is completed, the CPU 42 ends the processing of FIG. 3.

[0054] (Effects of the Present Example) For example, a comparative example is assumed in which a die component 4F and a chip component 4S are separately picked up and mounted. In this comparative example, the CPU 42 picks up a die component 4F with each of the first nozzles 31, and then moves the mounting head 30 above the imaging device 19 (route R4 in FIG. 4 ). Furthermore, the CPU 42 determines the pick-up state of the die component 4F, and then moves the mounting head 30 above the mounting position on the board 2 (route R3). Furthermore, the CPU 42 moves the mounting head 30 from the mounting position to above the second supply unit 20S (route R5). Next, the CPU 42 picks up a chip component 4S with each of the second nozzles 32, and then moves the mounting head 30 from the second supply unit 20S to above the imaging device 19 (route R2). After determining the pick-up state of the chip component 4S, the CPU 42 again moves the mounting head 30 above the mounting position on the board 2. As described above, the mounter of the comparative example mounts die components 4F and chip components 4S on the board 2. In contrast, in the present embodiment, the mounting head 30 moves from the first supply unit 20F to the second supply unit 20S (route R1), from the second supply unit 20S to the imaging device 19 (route R2), and from the imaging device 19 to the mounting position on the board 2 (route R3). That is, in the present embodiment, the movement distance of the mounting head 30 can be shortened compared to the comparative example described above. This improves the production efficiency of the mounter 10. Furthermore, as shown in FIG. 4 , the first supply unit 20F, which supplies the die components 4F, is located away from the second supply unit 20S, which supplies the chip components 4S, in the X direction. This increases the movement distance between the supply units 20F and 20S. For example, in a configuration in which the die components 4F and the chip components 4S are alternately picked up, the mounting head 30 must move back and forth between the supply units 20F and 20S. In this embodiment, after the die component 4F is picked up by the first supply unit 20F, the unit moves to the second supply unit 20S, where the chip component 4S is picked up, thereby reducing the number of movements between the supply units 20F and 20S, which are located apart.

[0055] The correspondence in this embodiment is as follows: the die component 4F is an example of a "first component," and the chip component 4S is an example of a "second component." The length L1 is an example of a "first size," and the length L2 is an example of a "second size."

[0056] The process of S4 is an example of a "first pick-up process", and the process of S12 is an example of a "second pick-up process". The processes of S52 and S54 are examples of a "mounting process". The process of S54 is an example of a "mounting order setting process". The process of S22 is an example of an "acquisition process". The process of S30 is an example of an "inspection process".

[0057] Second Embodiment A component mounter 100 of a second embodiment will be described with reference to FIG. 5 . The component mounter 100 of this embodiment includes a first supply unit 120F instead of the first supply unit 20F of the first embodiment described above, but otherwise has the same configuration. As shown in FIG. 5 , the first supply unit 120F of this embodiment includes a tray 121 instead of a semiconductor wafer 21. The tray 121 has a substantially square shape in a plan view and accommodates an array of multiple chip components 104F. The chip components 104F are a different type of component from the chip components 4S accommodated in the tape feeder 22 and are smaller in size than the chip components 4S. As with the first embodiment described above, in the mounting process of this embodiment, the CPU 42 moves the mounting head 30 above the first supply unit 120F and uses the first nozzle 31 to pick up the chip components 104F. Thereafter, the CPU 42 moves the mounting head 30 above the second supply unit 20S (route R1 in FIG. 5), picks up the chip component 4S using the second nozzle 32, and then moves the mounting head 30 above the mounting position on the board 2 via above the imaging device 19 (route R2, R3). This shortens the movement distance of the mounting head 30. In this embodiment, the chip component 104F is an example of the "first component."

[0058] A note about the component mounter described in the embodiment will be described below. In the mounting process of Fig. 3, the CPU 42 may execute the processes of S10 and S12 before executing the processes of S2 and S4. That is, in this modification, the second pickup process may be executed before the first pickup process.

[0059] The mounting head 30 may hold, for example, two first nozzles 31 between two adjacent second nozzles 32. In this modification, for example, a mounting head 30 capable of holding 24 nozzles may be able to hold 16 first nozzles 31 and 8 second nozzles 32.

[0060] The CPU 42 does not have to execute the process of S50 in Fig. 3. In this modification, the mounting order of the die component 4F and the chip component 4S does not have to be arbitrarily set regardless of the pickup order.

[0061] The distance D1 between the chip components 4S picked up by two adjacent second nozzles 32 may be greater than the length L1 of the chip components 4S.

[0062] The mounting head 30 does not have to hold the first nozzles 31 and the second nozzles 32 arranged on the same circumference. The mounting head 30 may hold the first nozzles 31 and the second nozzles 32 arranged along the periphery of a rectangle or a triangle, for example.

[0063] The mounter 10 does not need to be equipped with the imaging device 19. In this modification, the CPU 42 does not need to execute the processes of S14 to S40 in the mounting process of Fig. 3. In this modification, the "acquisition process" and the "inspection process" can be omitted.

[0064] The mounter 10 of the first embodiment may be provided with the first supply unit 120F of the second embodiment instead of the second supply unit 20S. In this modification, the first supply unit 120F is an example of a "second supply unit." In a further modification, the first supply unit 20F may be a bulk feeder that randomly stores a plurality of chip components in a container instead of the semiconductor wafers 21.

[0065] The technical elements described in this specification or drawings exhibit technical utility either alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technologies illustrated in this specification or drawings simultaneously achieve multiple objectives, and achieving one of those objectives is itself technically useful.

[0066] For example, this specification also discloses a technical idea in which "the component mounter according to claim 1" is changed to "the component mounter according to any one of claims 1 to 3" in claim 4. Similarly, the technical idea in which "the component mounter according to claim 1" is changed to "the component mounter according to any one of claims 1 to 4" in claim 5, the technical idea in which "the component mounter according to claim 1" is changed to "the component mounter according to any one of claims 1 to 5" in claim 6, the technical idea in which "the component mounter according to claim 1" is changed to "the component mounter according to any one of claims 1 to 6" in claim 7, and the technical idea in which "the component mounter according to claim 1" is changed to "the component mounter according to any one of claims 1 to 8" in claim 9 are also disclosed.

Claims

1. A component mounter that mounts a plurality of components on a board, comprising: a first supply unit that supplies first components having a first size; a second supply unit that supplies second components having a second size different from the first size; a plurality of first nozzles that can pick up the first components supplied to the first supply unit; a plurality of second nozzles that can pick up the second components supplied to the second supply unit; a mounting head that holds the plurality of first nozzles and the plurality of second nozzles; and a control device, wherein at least one first nozzle of the plurality of first nozzles is positioned between two adjacent second nozzles of the plurality of second nozzles, and the control device performs a first pickup process that causes the at least one first nozzle that is positioned between the two adjacent second nozzles to pick up the first component; and a second pickup process that causes the two adjacent second nozzles to pick up the second component before or after execution of the first pickup process. a mounting process of mounting, on the board, the first component picked up by the first pickup process and the second component picked up by the second pickup process, after the first pickup process and the second pickup process have been executed.

2. A component mounter as described in claim 1, wherein, in the first suction process, each of the plurality of first nozzles picks up the first component while the mounting head is positioned relative to the first supply unit, and, in the second suction process, each of the plurality of second nozzles picks up the second component while the mounting head is positioned relative to the second supply unit.

3. The component mounter according to claim 2, wherein the control device is further capable of executing: a pickup order setting process for setting the pickup order of the first pickup process and the second pickup process; and a mounting order setting process for setting the mounting order in which each of the plurality of first components picked up in the first pickup process and each of the plurality of second components picked up in the second pickup process will be mounted on the board; and the mounting order set in the mounting order setting process can be set arbitrarily regardless of the pickup order set in the pickup order setting process.

4. The component mounter according to claim 1, wherein the second size is larger than the first size, and the distance between the two second components picked up by the two adjacent second nozzles is smaller than the second size.

5. The component mounter according to claim 1, wherein the mounting head holds the plurality of first nozzles and the plurality of second nozzles arranged on the same circumference.

6. The component mounter according to claim 1, further comprising an imaging device capable of capturing bottom images of each of the first components picked up by the plurality of first nozzles and each of the second components picked up by the plurality of second nozzles from below, and the control device is further capable of executing: an acquisition process in which, after the first pickup process and the second pickup process have been performed, the mounting head is moved above the imaging device and the bottom image is acquired by the imaging device; and an inspection process in which the state of the first component and the second component is inspected based on the bottom image acquired by the acquisition process.

7. The component mounter according to claim 1, wherein the first size is smaller than the second size, a semiconductor wafer is placed in the first supply unit, and the first components include a plurality of die components produced by dicing the semiconductor wafer.

8. The component mounter according to claim 7, further comprising a tape feeder having a carrier tape that accommodates a plurality of the second components, and the second supply unit includes the tape feeder.

9. A component mounter according to claim 1, wherein the first supply unit includes a tray on which the first components are placed, the component mounter further includes a tape feeder having a carrier tape that accommodates a plurality of the second components, and the second supply unit includes the tape feeder.

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