MEMS micro-valve and micro pump

Abstract

A micro pump, comprising a silicon wafer (2), a first sealing sheet (1) and a second sealing sheet (3). A plurality of grooves that meet an equal-width condition are etched on a second face of the silicon wafer (2) to form a moving body (22), an annular rib (23), and a first valve body (26) of an outlet valve (4), such that better etching uniformity can be achieved within a shorter etching process time, thus improving product yield while reducing process costs, and also preventing excessive liquid from accumulating in the outlet valve and affecting normal use in low-temperature environments, prolonging the service life. A MEMS micro-valve, which is arranged in a fluid channel, comprises a valve body (7, 10), a valve seat (8) and a cantilever beam (9). When the valve body (7, 10) covers the valve seat (8), the fluid channel is closed; when the valve body (7, 10) is separated from the valve seat (8), the fluid channel is open. The cantilever beam (9) is connected between the valve body (7, 10) and an inner wall of the fluid channel to provide support for the valve body (7, 10). A separation space is provided between the cantilever beam (9) and / or the valve body (7, 10) and an object to reduce the contact area with the object and reduce microscopic force effects, thereby making the micro-valve easier to open.

Description

MEMS micro valve and micro pump

[0001] The present disclosure claims priority to four Chinese patent applications, application number CN202410688233.9 filed on May 30, 2024, application number 2024112356260 filed on September 4, 2024, application number 202411673680.3 filed on November 21, 2024, and application number 202421125341.7 filed on May 22, 2024, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of micro system, in particular to a MEMS micro valve and micro pump. BACKGROUND

[0003] Micro-Electro-Mechanical System (MEMS) is a kind of industrial technology that combines microelectronics technology and mechanical engineering together, which refers to a high-tech device with a size of several millimeters or even smaller. Micro pump is an actuator designed and manufactured by using micro-electro-mechanical system (MEMS) technology, which can realize fluid delivery and control in a small scale. Its pumping accuracy, rate and other indicators are very suitable for the injection of slow-release or micro-amount of drugs such as insulin, anesthetics and analgesics.

[0004] The current micro pump has the following disadvantages due to the shortcomings in structural design: the size of a single micro pump is large, which leads to that only a small number of micro pumps can be arranged on the wafer of raw materials for producing micro pumps, the wafer utilization rate is low, and the processing cost of micro pumps is high; it is difficult to ensure that the grooves at different positions obtain substantially the same depth at the same time during etching of the silicon layer of the micro pump, which leads to a low product yield of the micro pump; the cavity of the outlet valve of the micro pump accumulates a large amount of liquid, which expands due to freezing when the micro pump is used in a low-temperature environment (below 0℃), thereby damaging the outlet structure and leading to failure of the micro pump. Therefore, it is necessary to improve the micro pump to solve at least one of the above problems.

[0005]

Import valve 803 background technology

[0006] MEMS micro pump is an actuator designed and manufactured by using micro-electro-mechanical system (MEMS) technology, which can realize fluid delivery and control in a small scale. Its pumping accuracy, rate and other indicators are very suitable for the injection of slow-release or micro-amount of drugs such as insulin, anesthetics and analgesics.

[0007] The main principle of the MEMS micropump is to use the movement of the pump membrane to cause the volume change of the pump cavity, so that the pressure difference between the inside and outside of the chamber is generated, and the valve is opened and closed relying on the pressure difference to realize the pumping of the fluid. Therefore, the normal opening and closing of the valve in the micropump is one of the key indicators to ensure the work of the micropump.

[0008] The Chinese patent documents “CN118728715A” and “CN118775225A” disclose corresponding MEMS micropumps, but the inlet valve disclosed in the above two patent documents may not be normally opened. The present disclosure improves on this basis.

[0009]

Outlet valve 260 background technology

[0010] A pump is a device for conveying liquid. Compared with traditional mechanical pumps, MEMS micropumps made based on MEMS technology have smaller volume, lower cost, higher precision and reliability, and can realize the injection of insulin, anesthetics, analgesics and other slow-release or micro-liquid medicines, and are a micro-liquid injection solution.

[0011] The main principle of the MEMS micropump is to use the movement of the pump membrane to cause the volume change of the pump cavity, so that the pressure difference between the inside and outside of the chamber is generated, and the valve is opened and closed relying on the pressure difference to realize the pumping of the fluid. The frequency of the pump membrane movement corresponds to the pumping rate; when the micropump pumps at a higher frequency, the valve opening and closing response speed of the inlet valve and the outlet valve needs to be faster to ensure the rapid suction and outflow of the fluid and realize a higher pumping rate.

[0012] The structure of the Chinese patent document “CN1324238C” has a large difference in the size of the etching area during the manufacturing process, resulting in high etching cost. If a moving body connected to the pump membrane, a ring-shaped muscle at the edge of the pump membrane, and a back valve body on the back surface of the outlet valve are left on the back surface (lower surface) of the silicon layer, the swing amplitude of the outlet valve will be limited, and the micropump cannot realize high-frequency pumping.

[0013]

Component 417 background technology

[0014] A micropump is a device for transferring liquid by contraction or expansion of a pump body, which comprises a pump body and a substrate. The pump body has an outlet and an inlet. The substrate has a liquid inlet channel for communicating with the inlet and a liquid outlet channel for communicating with the outlet. The outlet of the liquid inlet channel is connected with a liquid inlet connector, and the outlet of the liquid outlet channel is connected with a liquid outlet connector.

[0015] In the prior art, the inlet of the pump body is connected with the liquid inlet channel by glue sealing, and the outlet of the pump body is connected with the liquid outlet channel by glue sealing.

[0016] The glue expands and shrinks with the change of the external temperature, which causes the separation of the bonding surface (the bonding surface includes the bonding surface of the glue and the outlet, the bonding surface of the glue and the liquid inlet channel, the bonding surface of the glue and the inlet, and the bonding surface of the glue and the liquid outlet channel) of the glue and the sealed structure (the sealed structure is the inlet and the liquid inlet channel, the outlet and the liquid outlet channel), which causes the sealing failure and leakage.

[0017] Therefore, how to improve the sealing reliability of the inlet and the liquid inlet joint of the pump body and the outlet and the liquid outlet joint of the pump body has become a technical problem to be solved by those skilled in the art.

[0018] It should be understood that any patent, publication, or other disclosure material, in whole or in part, that is mentioned herein, to the extent allowed by law, is incorporated herein by reference only for the information specifically and explicitly set forth in such incorporated material and not for any other purposes or effects such as supplying any common general knowledge in the art or otherwise. Therefore, to the extent necessary, the disclosure specifically set forth herein supersedes any disclosure incorporated herein by reference in its entirety. Any material, or portion thereof, that is said to be incorporated by reference into this document, but which conflicts with existing definitions, statements, or other disclosure material set forth herein is only incorporated into this document as specifically limited to those portions of the material that do not conflict with existing definitions, statements, or other disclosure material set forth herein.

[0019] DISCLOSURE

[0020] The present disclosure provides a micropump, comprising:

[0021] A silicon wafer having opposite first and second surfaces, the first surface being provided with a first groove for forming a pump cavity, the silicon wafer being provided with an inlet valve, a moving body and an outlet valve, the inlet valve, the moving body and the outlet valve being connected to the silicon wafer through a silicon wafer membrane respectively, the inlet valve being used to introduce fluid into the pump cavity, the outlet valve being used to introduce fluid in the pump cavity, the moving body being used to drive the opening or closing of the inlet valve and the outlet valve, the outlet valve being a first valve body located at a part of the second surface;

[0022] A first closure sheet fixed to the first surface of the silicon wafer, covering the first groove to form a pump cavity;

[0023] A second closure sheet fixed to the second surface of the silicon wafer,

[0024] The first valve body and the moving body can reciprocate between the first closure sheet and the second closure sheet,

[0025] An annular rib is further provided between the silicon wafer and the moving body, the annular rib being connected to the silicon wafer membrane between the silicon wafer and the moving body,

[0026] The second surface is provided with a plurality of grooves, including a first groove between the annular rib and the silicon wafer, a second groove between the annular rib and the moving body, and a third groove between the first valve body and the silicon wafer, the widths of the first groove, the second groove and the third groove being equal to each other.

[0027] The micro-pump of the present disclosure can achieve better etching uniformity in a shorter etching process time through reasonable structural design, thereby reducing process cost, improving product yield, avoiding the accumulation of more liquid in the outlet valve to affect normal use in a low-temperature environment, and improving service life.

[0028] Another aspect of the present disclosure is to provide a micro-pump, comprising a silicon wafer, a first sealing piece and a second sealing piece, the silicon wafer having opposite first and second surfaces, the first surface being etched with a first groove for forming a pump cavity, and the second surface being etched with a plurality of grooves for forming a moving body, an annular rib and a first valve body, the annular rib surrounding the moving body and being connected to a pump membrane around the moving body, and the first valve body being connected to a valve membrane of an outlet valve. The first sealing piece is fixed to the first surface of the silicon wafer, covering the first groove to form the pump cavity. The second sealing piece is fixed to the second surface of the silicon wafer, and the second sealing piece is provided with a connecting port for connecting a driver at a position corresponding to the moving body.

[0029] The MEMS micro-pump of the present disclosure forms a pump membrane, an inlet valve body and an outlet valve body on a silicon layer by etching grooves on a silicon layer. In such a structure, only grooves need to be etched, the etching area is reduced, and the etching cost is reduced. The part of the outlet valve body facing the second sealing layer (which can be referred to as the back valve body) is thinned, or the part of the second sealing layer corresponding to the outlet valve body is thinned, or a through hole is provided in the part of the second sealing layer corresponding to the outlet valve body to form a larger liquid outlet cavity. The outlet valve body can swing in the liquid outlet cavity to a larger extent, thereby avoiding the flow channel being blocked due to excessive swinging of the outlet valve body. Therefore, the problems of reducing etching cost and avoiding liquid outlet blockage during high-frequency pumping are solved at the same time.

[0030] The micro-pump provided by the present disclosure has the following beneficial effects:

[0031] The micro-pump provided by the present disclosure has the following beneficial effects:

[0032] The first closed piece covers the first recess of the first surface of the silicon wafer to form the pump cavity, and the second surface of the silicon wafer is etched with a plurality of grooves for forming the moving body, the annular muscle and the first valve body of the outlet valve. The annular muscle surrounds the moving body and is connected to the pump membrane around the moving body, and the first valve body is connected to the valve membrane of the outlet valve. These grooves satisfy the equal-width condition, so that the depth obtained at the same time when etching these grooves at different positions is generally the same, ensuring the uniformity of etching, thereby facilitating the improvement of the product yield of the micro-pump. At the same time, the first valve body is formed on the second surface of the silicon wafer, that is, on the side of the outlet valve facing away from the pump cavity, and the first valve body is connected to the valve membrane of the outlet valve, thereby filling part of the traditional cavity of the outlet valve. In this way, the outlet valve avoids forming a larger cavity to accumulate more liquid, thereby reducing the risk of liquid freezing and expanding to damage the outlet structure when the micro-pump is used in a low-temperature environment (below 0℃), and facilitating the improvement of the service life of the micro-pump. Moreover, compared with the traditional micro-pump, since the annular muscle occupies part of the traditional cavity on the side of the pump membrane facing away from the pump cavity, and the first valve body occupies part of the traditional cavity on the side of the valve membrane of the outlet valve facing away from the pump cavity, the amount of material that needs to be etched and removed from the silicon wafer is reduced, which is beneficial to shorten the etching process time and thereby reduce the process cost.

[0033] Due to the use of the above technical solutions, the present disclosure has the following advantages compared with the prior art:

[0034] The MEMS micro-valve and micro-pump of the present disclosure, the inventor found that in micro-nano scale, the surface area to volume ratio of microstructure increases, which is very easy to be affected by surface effect, and adsorption is one of the most common surface effects. MEMS micro-pump is a typical micro-nano device, and the micro-valve structure therein has a large surface area to volume ratio and a very smooth surface. When the micro-valve structure has a small gap, the adsorption surface effect is easy to occur, so that the valve body cannot be effectively opened. Adsorption surface effect is usually caused by micro-forces such as capillary force, electrostatic force, and van der Waals force. In the present disclosure, a separation space is provided between the cantilever beam and the object (related structure on the micro-pump) and between the valve body and the object (valve seat) to reduce the contact area with the object and reduce the micro-forces, so that the micro-valve is easier to open.

[0035] The present disclosure relates to a MEMS micro-valve arranged in a fluid channel for controlling the closing and opening of the fluid channel, solving the technical problem that the valve body cannot be opened, comprising a valve body, a valve seat and a cantilever beam, the fluid channel is closed when the valve body covers the valve seat, and the fluid channel is opened when the valve body is separated from the valve seat, the cantilever beam is connected between the valve body and the inner wall of the fluid channel to play a supporting role on the valve body, and a separation space is provided between the cantilever beam and / or the valve body and the object to reduce the contact area with the object. A MEMS micro-pump is also provided, comprising a pump cavity capable of changing volume, the pump cavity having a liquid inlet fluid channel and a liquid outlet fluid channel, and the aforementioned MEMS micro-valve is used as a one-way valve of the liquid inlet fluid channel and the liquid outlet fluid channel. A separation space is provided between the cantilever beam and the object (related structure on the micro-pump) and between the valve body and the object (valve seat) to reduce the contact area with the object and reduce the micro-forces, so that the micro-valve is easier to open.

[0036] The micro pump provided by the embodiments of the present disclosure comprises a pump body, an actuator, a first substrate and a second substrate, further comprises a first sealing gasket and a second sealing gasket, the first sealing gasket is pressed on the pump body through the first substrate to realize the sealing of the inlet and the liquid inlet channel, and the second sealing gasket is pressed on the pump body through the second substrate to realize the sealing of the outlet and the liquid outlet channel. The micro pump disclosed by the present disclosure realizes the compression sealing of the inlet and the liquid inlet channel of the pump body through the first sealing gasket, realizes the compression sealing of the outlet and the liquid outlet channel of the pump body through the second sealing gasket, the first sealing gasket and the second sealing gasket are independent sealing members, and there is no fixed connection relationship between the sealing structure and the sealing structure. When the thermal expansion and cold contraction caused by the influence of the environmental temperature, only the first sealing gasket and the second sealing gasket deform by themselves, and the connection relationship between the first sealing gasket and the second sealing gasket and the sealing structure is not affected, thereby improving the reliability of the sealing. The first sealing gasket and the second sealing gasket will deform when being compressed and sealed. When the environmental temperature decreases, the shrinkage of the first sealing gasket and the second sealing gasket decreases, when the environmental temperature increases, the first sealing gasket and the second sealing gasket expand, and the first sealing gasket and the second sealing gasket are more closely attached to the sealed structure, and the sealing effect is better. The present disclosure discloses a micro pump, comprising a pump body, an actuator, a first substrate, a second substrate, a first sealing gasket and a second sealing gasket, the first sealing gasket is used to realize the sealing of the inlet and the liquid inlet channel, the second sealing gasket is used to realize the sealing of the outlet and the liquid outlet channel, the first sealing gasket and the second sealing gasket are independent sealing members, and there is no fixed connection relationship between the sealing structure and the sealing structure. When the thermal expansion and cold contraction caused by the influence of the environmental temperature, only the first sealing gasket and the second sealing gasket deform by themselves, and the connection relationship between the first sealing gasket and the second sealing gasket and the sealing structure is not affected, thereby improving the reliability of the sealing. The first sealing gasket and the second sealing gasket will deform when being compressed and sealed. When the environmental temperature decreases, the shrinkage of the first sealing gasket and the second sealing gasket decreases, when the environmental temperature increases, the first sealing gasket and the second sealing gasket expand, and the first sealing gasket and the second sealing gasket are more closely attached to the sealed structure, and the sealing effect is better. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0038] Fig. A1 is a schematic diagram of the micro pump after longitudinal section according to the first embodiment of the present disclosure;

[0039] Fig. A2 is a cross-sectional view of A-A in Fig. 1;

[0040] Fig. A3 is a cross-sectional view of the micro pump after longitudinal section according to the first embodiment of the present disclosure;

[0041] Figure A4 is a B-B sectional view of Figure 3;

[0042] Figure A5 is a partial schematic view of the micro-pump after being cut transversely according to an embodiment of the present disclosure;

[0043] Figure A6 is a schematic view of a first structural form of the annular muscle;

[0044] Figure A7 is a schematic view of a second structural form of the annular muscle;

[0045] Figure A8 is a schematic view of a third structural form of the annular muscle;

[0046] Figure A9 is a schematic view of a fourth structural form of the annular muscle;

[0047] Figure A10 is a schematic view of a fifth structural form of the annular muscle;

[0048] Figure A11 is a schematic view of a first structural form of the first valve body;

[0049] Figure A12 is a schematic view of a second structural form of the first valve body;

[0050] Figure A13 is a schematic view of a third structural form of the first valve body;

[0051] Figure A14 is a schematic view of a fourth structural form of the first valve body;

[0052] Figure A15 is a schematic view of a fifth structural form of the first valve body.

[0053] Some specific embodiments of the present disclosure will be described in detail below with reference to Figures B1-B17 in an exemplary and non-limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the drawings:

[0054] Figure B1 is an exploded view of a MEMS micro-pump in the prior art, which can be seen in Chinese patent “CN118775225A, Application No. CN202411235626.0”, the entire contents of which are incorporated by reference into the present disclosure, with reference to Figures C1-C10 and related descriptions;

[0055] Figure B2 is an A-A sectional view of Figure B1;

[0056] Figure B3 is a structural sectional view of Figure B1;

[0057] Figure B4 is a B-B sectional view of Figure B3;

[0058] Figure B5 is an enlarged view of C in Figure B3;

[0059] Figure B6 is a structural diagram of embodiment 1 of the present disclosure, corresponding to Figure B5;

[0060] Figure B7 is a top view of the inlet valve body;

[0061] Figure B8 is an enlarged view of G in Figure B6;

[0062] Figure B9 is a bottom view of the inlet valve body;

[0063] Figure B10 is a bottom view of the inlet valve body of embodiment 2, in comparison with Figure B9;

[0064] Figure B11 is a structural diagram of embodiment 3, in comparison with Figure B6;

[0065] Figure B12 is a top view of the inlet valve body of embodiment 3;

[0066] Figure B13 is a bottom view of the inlet valve body of embodiment 4, in comparison with Figure B9;

[0067] Figure B14 is a structural diagram of embodiment 5, in comparison with Figure B8;

[0068] Figure B15 is a schematic diagram of the cantilevered beam extension formed as the valve is used in the embodiment 1 scenario;

[0069] Figure B16 is a structural diagram of embodiment 5, in comparison with Figure B6;

[0070] Figure B17 is a top view of the inlet valve body of embodiment 5, in comparison with Figure B7;

[0071] Some specific embodiments of the present disclosure will be described in detail below with reference to the attached drawings. The same reference numbers in the drawings indicate the same or similar components or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

[0072] Figure C1 is a schematic diagram of a structure on which improvements to the MEMS micropump of the present disclosure are based;

[0073] Figure C2 is a cross-sectional view of A-A of Figure C1;

[0074] Figure C3 is an enlarged view of B of Figure C1;

[0075] Figure C4 is an enlarged view of C of Figure C1;

[0076] Figure C5 is a structural cross-sectional view of embodiment 1;

[0077] Figure C6 is a cross-sectional view of D-D of Figure C5;

[0078] Figure C7 is a structural cross-sectional view of embodiment 2;

[0079] Figure C8 is a cross-sectional view of E-E of Figure C7;

[0080] Figure C9 is a sectional view of the structure of Example 3;

[0081] Figure C10 is a sectional view taken along F-F of Figure C9;

[0082] Some embodiments of the present disclosure will be described in detail with reference to the drawings, wherein like reference numerals represent like elements, and wherein the various elements are not necessarily to scale. The following detailed description is merely exemplary and is intended to provide a full and enabling description of one or more examples of the present disclosure and contemplated embodiments. Many modifications and variations to the described embodiments will be apparent to those of ordinary skill in the art, which would never depart from the spirit and scope of the description. Therefore, the scope of the present disclosure is intended to cover all such modifications and variations.

[0083] Figure Dl is a perspective view of a micro-pump according to one embodiment of the present disclosure;

[0084] Figure D2 is a perspective view of a micro-pump according to one embodiment of the present disclosure;

[0085] Figure D3 is a perspective view of a micro-pump according to one embodiment of the present disclosure;

[0086] Figure D4a is a perspective view of a micro-pump according to one embodiment of the present disclosure;

[0087] Figure D4b is a sectional view taken along A-A of Figure D4a;

[0088] Figure D5 is a sectional view taken along B-B of Figure Dl;

[0089] Figure D6 is an enlarged view of a portion of the fluid path of a micro-pump according to one embodiment of the present disclosure;

[0090] Figure D7 is a perspective view of a ring connector and fastener of a micro-pump according to one embodiment of the present disclosure;

[0091] Figure D8 is an exploded view of a micro-pump according to one embodiment of the present disclosure;

[0092] Figure D9 is a perspective view of a micro-pump according to one embodiment of the present disclosure;

[0093] Figure DlOa is a perspective view of a micro-pump according to another embodiment of the present disclosure;

[0094] Figure DlOb is a perspective view of a micro-pump according to another embodiment of the present disclosure;

[0095] Figure Dl l is a sectional view of a micro-pump according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0096] The present disclosure will be further described in details with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are merely used to explain the related application, but not to limit the application. The described embodiments are only a part of the embodiments of the present disclosure, not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0097] It should be noted that, for the convenience of description, only the parts related to the application are shown in the drawings. The embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict, as long as the combined technical features are not contradictory. All feasible feature combinations are the technical content explicitly described herein. Any one of the multiple features contained in the same sentence can be applied independently, and does not have to be applied together with other features.

[0098] As shown in the present disclosure and claims, unless the context clearly indicates otherwise, the words "one", "an", "a", and / or "the" do not mean to specify a single number, but also include a plurality, that is, "one", "an", "a", and / or "the" should be understood as including one or at least one, and the singular form of the element or component also includes the plural form. Generally, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements. The element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, product or device comprising the element.

[0099] In the description of the embodiments of the present disclosure, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" herein is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present disclosure, "multiple" means two or more than two.

[0100] Unless otherwise specified, when a feature is referred to as "fixed", "connected" to another feature, it can be directly fixed, connected to the other feature, or indirectly fixed, connected to the other feature. In addition, the up, down, left, right and other descriptions used in the present disclosure are only relative to the relative positions of the components of the present disclosure in the drawings.

[0101] It is further to be understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not represent a specific order or importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present disclosure.

[0102] In Figures A1-A15, the following are marked:

[0103] 1, first closure piece; 2, silicon wafer; 3, second closure piece; 4, outlet valve; 11, liquid outlet; 20, first groove; 21, inlet valve; 210, inlet valve body; 101, inlet valve membrane; 22, moving body; 23, annular rib; 24, pump membrane; 25, central flow channel; 26, first valve body; 27, valve membrane; 28, second valve body; 29, first through hole; 31, first anti-bonding part; 32, liquid inlet; 33, connecting port; 34, second anti-bonding part; 41, first groove; 42, second groove; 43, third groove; 44, fourth groove; a, inlet flow channel; b, pump cavity; c, connecting flow channel; d, outlet flow channel.

[0104] Referring to Figures A1-A4, the first embodiment of the present disclosure provides a micropump, comprising a silicon wafer 2, a first closure piece 1 and a second closure piece 3, wherein the silicon wafer 2 has opposite first and second faces, the first face is provided with a first groove 20 for forming a pump cavity, and the second face is provided with a plurality of grooves. In this embodiment, the first groove 20 and the grooves of the silicon wafer 2 are obtained by etching the silicon wafer 2, and the residual part at the bottom of the grooves forms a silicon wafer membrane. The silicon wafer is provided with an inlet valve 21, a moving body 22 and an outlet valve 4. Further, the inlet valve 21, the moving body 22 and the outlet valve 4 are connected to the silicon wafer 2 through the silicon wafer membrane (including the inlet valve membrane 101 at the corresponding position of the inlet valve 21, the valve membrane 27 at the corresponding position of the outlet valve 4, and the pump membrane 24 at the corresponding position of the moving body 22). The inlet valve 21 is used to introduce fluid into the pump cavity, the outlet valve 4 is used to introduce fluid in the pump cavity, and the moving body 22 is used to drive the opening or closing of the inlet valve 21 and the outlet valve 4. The part of the outlet valve 4 located on the second face is a first valve body 26, and the outlet valve further comprises a second valve body 28 located on the first face. The second valve body 28 of the outlet valve located on the side of the pump cavity b is a valve body for switching, and the first valve body 26 is arranged on the other side of the outlet valve 4 to fill part of the cavity of the conventional outlet valve 4. In this way, the outlet valve 4 is avoided to form a larger cavity to accumulate more liquid, thereby reducing the risk of liquid freezing and expanding to damage the outlet structure when the micropump is used in a low temperature environment (below 0℃), and is beneficial to improve the service life of the micropump.

[0105] The first sealing sheet 1 is fixed to the first surface of the silicon sheet 2 and covers the first groove to form a pump cavity; the second sealing sheet 3 is fixed to the second surface of the silicon sheet 2. The first valve body 26 and the moving body 22 can reciprocate between the first sealing sheet 1 and the second sealing sheet 2. The annular rib 23 is further arranged between the silicon sheet 2 and the moving body 22, and the annular rib 23 is connected to the silicon sheet 2 and the moving body 22 through the silicon sheet membrane respectively. Since the annular rib 23 occupies part of the conventional cavity on the side of the pump membrane 24 away from the pump cavity b, and the first valve body 26 occupies part of the conventional cavity on the side of the valve membrane 27 of the outlet valve 4 away from the pump cavity b, the amount of material that needs to be etched away from the silicon sheet 2 is reduced, which is conducive to shortening the etching process time and thus reducing the process cost.

[0106] The plurality of grooves include the first groove 41 between the annular rib 23 and the silicon sheet 2, the second groove 42 between the annular rib 23 and the moving body 22, and the third groove 43 between the first valve body 26 and the silicon sheet 2, and the width of the first groove 41, the width of the second groove 42 and the width of the third groove 43 are equal to each other. Further, in a more preferred embodiment, the portion of the second surface where the inlet valve 21 is located is the inlet valve body 210, which is connected to the silicon sheet 2 through a plurality of spaced inlet valve membranes 101, at this time the inlet valve membrane 101 is equivalent to a cantilever beam supporting the inlet valve body 210; the plurality of grooves further include a fourth groove 44 arranged between the inlet valve body 210 and the silicon sheet 2, and the width of the fourth groove 44 is equal to the width of the first groove 41. The equal width of these grooves means that the widths of the grooves at different positions are equal or approximately equal (difference 0-10 microns, ±10%), that is, although the positions of the grooves are different, the widths are generally consistent. In the etching process of the silicon sheet 2, the widths (dimensions perpendicular to the thickness direction of the silicon sheet 2) of the grooves are set to be equal to each other, which can ensure that the depths (dimensions in the thickness direction of the silicon sheet 2) of the etched grooves are generally the same, and the uniformity of etching is easy to be guaranteed, thereby being conducive to improving the product yield of the micropump.

[0107] Specifically, the first surface is etched with a first groove 20 for forming the pump cavity b, and the second surface is etched with a plurality of grooves for forming the moving body 22, the annular muscle 23 and the first valve body 26 of the outlet valve 4, which meet the equal-width condition, i.e. the grooves are distributed around the moving body 22, the annular muscle 23 and the first valve body 26, and are formed as spatial structures after etching and removing part of the material on the second surface of the silicon wafer 2. The grooves meet the equal-width condition, which means that the widths of the grooves at different positions are equal or approximately equal (difference 0-10 microns, ±10%), i.e. the widths of the grooves are generally consistent although the positions are different. Specifically, the annular muscle 23 surrounds the moving body 22 and is connected to the pump membrane 24 around the moving body 22, and the first valve body 26 is connected to the valve membrane 27 of the outlet valve. The pump membrane 24 is the thin film part between the moving body 22 and the surrounding fixed body for realizing elastic deformation, and the fixed body refers to the part of the silicon wafer 2 that remains stationary and is fixed together with the cover wafer through anodic bonding (Bonding). The valve membrane 27 is the thin film part between the second valve body 28 of the outlet valve and the surrounding fixed body for realizing elastic deformation, and the second valve body 28 is the valve body of the outlet valve located on the side of the pump cavity b. The first cover wafer 1, the silicon wafer 2 and the second cover wafer 3 are stacked, the first cover wafer 1 is fixed to the first surface of the silicon wafer 2, and the first groove 20 is covered to form the pump cavity b. The second cover wafer 3 is fixed to the second surface of the silicon wafer 2, and the second cover wafer 3 is provided with a connecting port 33 for connecting a driver (not shown in the figure) at the position corresponding to the moving body 22. The driver is the power source of the micropump, and the driver drives the reciprocating movement of the moving body 22 of the micropump to realize the pressure change of the pump cavity b, and is connected with the inlet valve 21 and the outlet valve 4 to guide the flow of liquid.

[0108] It should be noted that in the etching process of the silicon wafer 2, the depth of the etched trench refers to the dimension in the thickness direction of the silicon wafer 2, and the width of the trench refers to the dimension in the direction perpendicular to the thickness direction of the silicon wafer 2. The annular rib 23 is connected to the pump membrane 24 around the moving body 22 and can move with the pump membrane 24. Similarly, the first valve body 26 of the outlet valve is connected to the valve membrane 27 around the second valve body 28 and can move with the valve membrane 27. Since the trenches forming the moving body 22, the annular rib 23 and the first valve body 26 of the outlet valve satisfy the equal-width condition, the uniformity of etching is easy to be guaranteed, that is, when etching the trenches at different positions, the depth obtained at the same time is generally the same, thereby facilitating the improvement of the product yield of the micropump. In addition, the second valve body 28 of the outlet valve on the side of the pump cavity b is a valve body for switching, and the first valve body 26 is arranged on the other side of the outlet valve to fill part of the traditional cavity of the outlet valve. In this way, the outlet valve avoids forming a larger cavity to accumulate more liquid, thereby reducing the risk of liquid freezing and expanding to damage the outlet structure when the micropump is used in a low-temperature environment (below 0°C), and facilitating the improvement of the service life of the micropump. Moreover, compared with the traditional micropump, since the annular rib 23 occupies part of the traditional cavity on the side of the pump membrane 24 away from the pump cavity b, and the first valve body 26 occupies part of the traditional cavity on the side of the valve membrane 27 of the outlet valve away from the pump cavity b, the amount of material that needs to be etched and removed from the silicon wafer 2 is reduced, which is conducive to shortening the etching process time and thereby reducing the process cost. Referring to FIG. A1, the annular rib 23 is thinned so that the annular rib 23 does not contact the second sealing sheet 3 to prevent bonding.

[0109] In a preferred embodiment, the silicon wafer 2 is provided with a first through hole 29 at a position other than the first recess 20, and the second surface of the silicon wafer 2 is etched with a second recess (as shown in FIG. A2, corresponding to the lower side of the valve membrane 27 and / or the first valve body 26) for connecting the first through hole 29 and the outlet valve 4, i.e. the second sealing piece 3 covers the second recess to form a connecting flow channel c connecting the first through hole 29 and the outlet valve. The first sealing piece 1 is provided with a liquid outlet 11 corresponding to the position of the first through hole 29, and the second sealing piece 3 is provided with a liquid inlet 32 corresponding to the position of the inlet valve 21. As shown in FIGS. A3 and A4, when the micropump is in operation, the driving force provided by the driver is transmitted to the moving body 22 through the connecting port 33, the driver pulls the moving body 22, i.e. the moving body 22 moves to the side of the connecting port 33 under the action of the driving force, so that the volume of the pump cavity b increases and the internal pressure of the pump cavity b decreases, the inlet valve 21 is opened under the driving of the pressure difference, i.e. the valve body of the inlet valve 21 moves to the side of the pump cavity b to make the liquid inlet 32 communicate with the inlet flow channel a, and the fluid flows from the inlet flow channel a, while the outlet valve remains in a closed state; the driver pushes the pump membrane 24, i.e. the moving body 22 moves to the side of the pump cavity b under the action of the driving force, so that the volume of the pump cavity b decreases and the internal pressure of the pump cavity b increases, the outlet valve is opened under the action of the pressure difference, i.e. the valve body of the outlet valve moves to the side of the connecting flow channel c to make the pump cavity b communicate with the central flow channel 25, and the liquid flows out of the central flow channel 25 of the outlet valve, while the inlet valve 21 is compressed and in a closed state. After the liquid flows out of the central flow channel 25 of the outlet valve, it successively passes through the connecting flow channel c and the first through hole 29, and finally reaches the liquid outlet 11. The driver repeatedly pushes and pulls the moving body 22, thereby realizing the pumping of the fluid, i.e. the fluid is pumped from the liquid inlet 32 to the liquid outlet 11.

[0110] As shown in FIG. A1, the liquid outlet 11 is provided on the first sealing piece 1, and the liquid inlet 32 is provided on the second sealing piece 3, forming a structure in which the inlet and outlet are on different sides, i.e. the liquid inlet 32 and the liquid outlet 11 are located on different sides of the micropump, which avoids arranging the large-volume inlet pipeline, the driver and the outlet pipeline on the same side of the micropump, thereby facilitating the reduction of the size of the micropump, because if the inlet pipeline, the driver and the outlet pipeline are arranged on the same side of the micropump, they must be kept at a certain distance, which will result in the micropump needing a larger size to accommodate the inlet pipeline, the driver and the outlet pipeline on the same side. It is easy to understand that after reducing the size of the micropump, more number of micropumps can be arranged on the wafer of raw materials for producing the micropump, thereby making the utilization rate of the wafer higher, which is conducive to reducing the cost of batch production of the micropump, and can realize the reduction of the volume of the entire assembly by 30%. In the present embodiment, the technical solution of installing the inlet pipeline, the driver and the outlet pipeline can adopt the existing technology or be assembled according to the scheme of the embodiments related to FIGS. D1-D7 in the present disclosure.

[0111] As shown in FIG. A5, the second embodiment of the present disclosure provides a micropump, which is different from the first embodiment shown in FIG. A1 and FIG. A2 in that the second embodiment sets the liquid outlet on the second sealing sheet 3, i.e. the second sealing sheet 3 is provided with the liquid outlet at the position corresponding to the central flow channel 25 of the outlet valve, and the flow direction of the liquid is shown by the dotted arrow in FIG. A5 when pumping the liquid, i.e. the liquid flows out from the pump cavity b through the outlet flow channel d. In the second embodiment, similar to the first embodiment, the setting of the first valve body 26 avoids the outlet valve from forming a larger cavity to accumulate more liquid, thus reducing the risk of liquid freezing and expanding to damage the outlet structure when the micropump is used in a low-temperature environment (below 0°C), and is beneficial to improve the service life of the micropump. Moreover, compared with the traditional micropump, since the first valve body 26 occupies part of the traditional cavity of the outlet valve 4, the amount of material that needs to be etched away from the silicon wafer 2 is reduced, the etching process time can be relatively reduced, and thus the process cost is reduced.

[0112] In specific practical applications, the first sealing sheet 1 and the second sealing sheet 3 can be provided as glass sheets, and of course, the sealing sheets can also be provided as other materials, for example, provided as silicon wafers. As shown in FIG. A1, since the inlet valve 21 is a movable part, in order to prevent the silicon wafer 2 from being bonded to the second sealing sheet 3 when being bonded to the second sealing sheet 3, the second sealing sheet 3 can be provided with a first anti-bonding part 31 at the position corresponding to the inlet valve 21. Similarly, the side of the second sealing sheet 3 facing the silicon wafer 2 can be provided with a second anti-bonding part 34 around the connecting port 33 to avoid the movable body 22 and the annular rib 23 from being bonded to the second sealing sheet 3. In this embodiment, a feasible bonding connection is an anode bonding. Under the action of high temperature and an external electric field, sodium ions (Na+) in the first sealing sheet 1 of glass material migrate to the cathode, forming a sodium ion depletion layer at the interface, resulting in a negative charge on the surface of the glass. At this time, the surface of the silicon wafer 2 is positively charged, and the glass as a sealing sheet is in close contact with the silicon wafer 2 through electrostatic attraction. Oxygen ions (O-) cross the interface under the driving of the electric field and react with silicon to form silicon dioxide (SiO2) covalent bond, realizing chemical bonding at the atomic layer. This process does not require an intermediate layer material, and a reliable connection is directly formed. By designing a metal layer with a specific shape as an anti-bonding part (including the first anti-bonding part 31 and the second anti-bonding part 34, etc.) on the second sealing sheet 3, the second sealing sheet 3 and the silicon wafer 2 cannot be in direct contact, and a local barrier layer is formed to prevent the movable part on the silicon wafer 2 from being connected and fixed to the second sealing sheet 3 during the bonding process, affecting the normal activity of the pump body. In this embodiment, the materials of the first anti-bonding part 31 and the second anti-bonding part 34 are metal materials.

[0113] The structure of the ring-shaped ribs 23 can be variously selected. In some embodiments, referring to FIGS. A6-A10, the ring-shaped ribs 23 include a plurality of discontinuous bodies 231 spaced around the moving body 22, and the gaps between the discontinuous bodies 231 have a width equal to the width of the first grooves 41, so as to maintain the uniformity of the etching depth of the silicon wafer.

[0114] For example, the ring-shaped ribs 23 can be provided in a single-ring structure as shown in FIG. A6, a double-ring structure as shown in FIG. A7, or a discontinuous structure as shown in FIG. A8. When the ring-shaped ribs 23 are in a double-ring structure, the discontinuous bodies 231 are two concentric rings. The ring-shaped ribs 23 include a first ring and a second ring concentrically arranged around the moving body 22, and the gap between the first ring and the second ring and the grooves between the ring-shaped ribs 23 and the moving body 22 satisfy the equal-width condition, so as to ensure the uniformity of the etching. Similarly, when the ring-shaped ribs 23 are in a discontinuous structure, the discontinuous bodies 231 include a plurality of irregular shapes (one embodiment shown in FIG. A8), circular columns (one embodiment shown in FIG. A9), or square columns (one embodiment shown in FIG. A10) spaced around the moving body 22. Specifically, the ring-shaped ribs 23 can include a plurality of discontinuous bodies 231 spaced around the moving body 22, and the gap between the discontinuous bodies and the grooves between the ring-shaped ribs 23 and the moving body 22 satisfy the equal-width condition. In addition, when the ring-shaped ribs 23 are in a discontinuous structure, the ring-shaped ribs 23 can also be provided in a dot-matrix structure, including a plurality of circular columns (the embodiment shown in FIG. A9) or square columns (the embodiment shown in FIG. A10) arranged in a dot-matrix, and the gaps between different columns and the grooves between the ring-shaped ribs 23 and the moving body 22 satisfy the equal-width condition.

[0115] Similar to the structure of the annular ribs 23, the first valve body 26 can have various structures. Referring to FIGS. A12-A15, the first valve body 26 can also include a plurality of spaced apart discontinuous bodies 231, and the gap between the discontinuous bodies 231 has a width equal to the width of the first groove, so as to control the strength of the first valve body 26 and the valve opening pressure. Meanwhile, the alternative can reduce the adsorption of the first valve body 26 and the anti-bonding part due to the gas-liquid molecular interaction by adjusting the adsorption area of the sealing ring, reducing the intermolecular force, and ensuring that the first valve body 26 can be smoothly opened while maintaining the sealing of the first valve body 26. For example, the first valve body 26 can be provided as a single ring structure as shown in FIG. A11, a double ring structure as shown in FIG. A12, or a non-continuous structure as shown in FIG. A13. When the first valve body 26 is a double ring structure, the discontinuous bodies 231 are two concentric rings. The first valve body 26 includes a third ring and a fourth ring arranged concentrically around the center flow channel 25 of the outlet valve, and the gap between the third ring and the fourth ring satisfies the equal-width condition with the groove between the annular ribs 23 and the moving body 22, so as to ensure the uniformity of etching. In the embodiment shown in FIG. A13, the first valve body 26 includes a ring body and a plurality of discontinuous bodies 231 spaced apart around the center flow channel 25 of the outlet valve, and the gap between the discontinuous bodies 231 satisfies the equal-width condition with the groove between the discontinuous bodies 321 and the ring body. In addition, when the first valve body 26 is a non-continuous structure, the first valve body 26 can also be provided as a dot matrix structure, including a plurality of dot matrix distributed circular columns (the embodiment shown in FIG. A14) or square columns (the embodiment shown in FIG. A15).

[0116] The foregoing embodiments are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. The inlet valve 21 and the outlet valve 4 in the foregoing embodiments can adopt the technical solutions in the prior art, or can individually or collectively adopt the related improvements involved in the subsequent embodiments of the disclosure.

[0117] The foregoing description of the disclosed embodiments enables a person skilled in the art to implement or use the disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the disclosure. Therefore, the disclosure will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0118] It should be understood that, although in the optimal embodiment the width of all the grooves etched in the second surface is uniform or substantially uniform, in some alternative embodiments, only part of the grooves have uniform or substantially uniform width, which also falls within the protection scope of the present disclosure. For example, in the various embodiments of the ring-shaped rib 23 as shown in Figures A7-A10, the focus is to set the width of the grooves inside the ring-shaped rib 23 to be uniform or substantially uniform, which can ensure the consistency of the structural strength of the corresponding parts of the ring-shaped rib 23. For another example, in the three regions of the inlet valve, the moving body, and the outlet valve, the grooves in some two regions (for example, the inlet valve and the moving body, or the inlet valve and the outlet valve, or the moving body and the outlet valve) maintain uniform or substantially uniform width.

[0119] Now the micro-pump involving the improved inlet valve will be described in conjunction with Figures B1-B17, and it should be understood that the structure of the improved inlet valve is also applicable to the corresponding micro-pump of Figures A1-A15. Unless otherwise specified, the figures in this section are described in conjunction with one or more of Figures B1-B17. In which, the reference signs of Figures B1-B17 are explained as follows:

[0120] 1, silicon layer; 2, first sealing layer; 3, second sealing layer; 4, pump cavity; 41, pump cavity extension; 5, inlet fluid channel; 6, outlet fluid channel; 7, inlet valve body; 71, protruding part; 8, inlet valve seat; 9, cantilever beam; 91, cantilever beam extension; 10, outlet valve body; 11, separation space; 111, circular etching groove; 112, block etching groove; 88, moving body.

[0121] The outlet valve and / or the inlet valve in the micro-pump is a MEMS micro-valve, the first sealing sheet (i.e. the first sealing layer 2), the silicon sheet (i.e. the silicon layer 1), and the second sealing sheet (i.e. the second sealing layer 3) jointly form a fluid channel, the MEMS micro-valve arranged in the fluid channel and used for controlling the closing and opening of the fluid channel comprises a valve body (the inlet valve body 7 or the outlet valve body 10; refer to Figure A1, the inlet valve body 210 of the inlet 21 or the first valve body 26 of the outlet valve 4), a valve seat 8 (the valve seat 8 of the inlet valve is located in the second sealing layer 3, or the first sealing layer 2 of the outlet valve), and a cantilever beam 9 (also refer to Figure A1, which can be multiple cantilever beams 9 arranged at intervals in the inlet valve, or can be a complete valve membrane 27 similar to the outlet valve 4), the cantilever beam 9 is connected between the valve body and the inner wall of the fluid channel to support the valve body, the valve body is arranged opposite to the valve seat 8, the fluid channel is closed when the valve body abuts against the valve seat, and the fluid channel is opened when the valve body is separated from the valve seat; wherein,

[0122] The cantilever beam 9 and / or the valve body is provided with a separation space between the valve body and the object to reduce the contact area with the object. The object of an element in the present disclosure refers to the element which is arranged opposite to or close to the element, and in the use of the micropump, the element and the corresponding object are in contact or have the tendency to be in contact at a certain time. The adsorption phenomenon is easy to occur when the element is in contact with the object, and the phenomenon is a comprehensive performance of the corresponding fluid channel being delayed to open or unable to open. The foregoing adsorption surface effect is usually caused by micro forces such as capillary force, electrostatic force, van der Waals force and the like.

[0123] The MEMS micropump as shown in FIGS. B1 to B4 comprises a silicon layer 1, a first closed layer 2, and a second closed layer 3. The material of the first closed layer 2 and the second closed layer 3 can be glass. The first closed layer 2 and the second closed layer 3 are encapsulated on the upper and lower surfaces of the silicon layer 1.

[0124] The pump cavity 4 is etched on the silicon layer 1. The inlet and outlet of the pump cavity 4 are respectively provided with a liquid inlet fluid channel 5 and a liquid outlet fluid channel 6 formed by etching, and the liquid inlet fluid channel 5 and the liquid outlet fluid channel 6 are respectively provided with an inlet valve body 7 and an outlet valve body 10. The inlet valve and the outlet valve are both one-way valves, and the moving body 88 is driven to reciprocate by the actuator, so as to change the volume of the pump cavity 4 to pump the fluid.

[0125] The inlet valve body 7 is connected (so-called connection is formed by not etching) with the corresponding part of the silicon layer 1 through the cantilever beam 9. The cantilever beam 9 provides support for the inlet valve body 7, and supports the inlet valve body 7 to be located in the liquid inlet fluid channel 5. The liquid inlet fluid channel 5 passes through the second closed layer 3, then extends to the periphery of the inlet valve body 7, and finally communicates with the pump cavity 4. The part of the second closed layer 3 facing the inlet valve body 7 forms an inlet valve seat 8, and in this example, the inlet valve seat 8 protrudes from the upper surface of the second closed layer 3.

[0126] It can be said that the inlet valve body 7 and the inlet valve seat 8 are both arranged in the liquid inlet fluid channel 5. The inlet valve seat 8 is annular, and during pumping, the fluid passes through the gap between the inlet valve body 7 and the inlet valve seat 8, reaches the periphery of the inlet valve body 7, and then flows into the pump cavity 4. When the inlet valve body 7 covers the inlet valve seat 8 (when the volume of the pump cavity 4 is reduced, the pressure in the pump cavity 4 increases, and the inlet valve body 7 is driven to act), the gap between the inlet valve body 7 and the inlet valve seat 8 is eliminated, and the liquid inlet fluid channel 5 is closed; when the inlet valve body 7 is away from the inlet valve seat 8 (when the volume of the pump cavity 4 is increased, the pressure in the pump cavity 4 is reduced, and the inlet valve body 7 is driven to act), the gap between the inlet valve body 7 and the inlet valve seat 8 is opened, and the liquid inlet fluid channel 5 is opened. Therefore, the cooperation of the inlet valve body 7 and the inlet valve seat 8 controls the closing and opening of the liquid inlet fluid channel 5.

[0127] As shown in FIG. B5, the gap at D (i.e., the cantilever beam 9 and its object, the silicon layer 1) and E (the inlet valve body 7 and its object, the valve seat 8) is prone to adsorption, which affects the function of the inlet valve body 7 and causes the inlet valve body 7 to fail to open. The cantilever beam 9 and its object (the part indicated by F) are prone to adsorption due to the gap, which makes the cantilever beam 9 difficult to swing upward, which can be referred to as the inlet valve cantilever beam adsorption phenomenon. The inlet valve body 7 and its object (the valve seat 8) are prone to adsorption due to the gap, which makes the inlet valve body 7 difficult to separate from the valve seat 8, which can be referred to as the valve body adsorption phenomenon. These phenomena are collectively manifested as the inlet fluid passage 5 being delayed in opening or failing to open. The aforementioned adsorption surface effect is usually caused by micro forces such as capillary force, electrostatic force, and van der Waals force.

[0128] Embodiment B1

[0129] To solve this problem, two measures are adopted in this embodiment.

[0130] Measure one, as shown in FIG. B6 and FIG. B7, etching the inlet fluid passage 5 to extend the part of the inlet fluid passage 5 below the cantilever beam 9 away from the inlet valve body 7, occupying the space of the object below the cantilever beam 9, the extended part forming a separation space 11, reducing the gap length between the cantilever beam 9 and its object, and thus reducing the micro force of adsorption between the cantilever beam 9 and the object. As shown in FIG. 7B, the main body of the inlet fluid passage 5 is cylindrical, and the separation space 11 is recessed away from the inlet valve body 7, reducing the potential contact space between the cantilever beam 9 and the object.

[0131] Measure two, as shown in FIG. B8, etching a micro groove on the end surface of the inlet valve body 7 facing the inlet valve seat 8, which is the separation space 11, reducing the contact area between the inlet valve body 7 and the inlet valve seat 8, and thus reducing the adsorption micro force between the inlet valve body 7 and the inlet valve seat 8, making it easier for the inlet valve body 7 to separate from the inlet valve seat 8. When the inlet valve body 7 is in contact with the inlet valve seat 8, the micro groove is not connected to the inlet fluid passage 5.

[0132] The shape of the micro groove etched on the end surface of the inlet valve body 7 is shown in FIG. B9, which is two discontinuous circular etching grooves 111, and the inner and outer circles are staggered to improve the sealing and uniformity. The etched micro groove in this embodiment is discontinuous, and in other embodiments it can also be continuous, such as one or two annular micro grooves.

[0133] The above-mentioned measure one and measure two can be implemented simultaneously, or one of them can be implemented. Those skilled in the art should know that even if only one of the following two measures is adopted, although the optimal effect cannot be achieved, there is still sufficient progress compared to the prior art, and it still belongs to the protection scope of the present disclosure.

[0134] Although the first measure or the second measure mentioned in this example is used for the inlet valve body 7, any one or all of the first measure or the second measure can also be used for the outlet valve body in other structures of MEMS micropumps.

[0135] Embodiment B2

[0136] As shown in Figure B10, corresponding to the first measure mentioned above, a protrusion 71 can be formed on the inlet valve body 7 below the cantilever beam 9 by extending the inlet fluid channel 5 towards the cantilever beam 9 in comparison with the structure shown in Figure B9 (Figure B10 is the upside-down view of Figure B6). The protrusion 71 can be accommodated in the separation space 11 shown in Figure B7. The protrusion 71 reduces the situation that the cavity is partially enlarged due to the extension of the etching area of the inlet fluid channel 5, which is beneficial to the flow of liquid and avoids the vortex caused by the partial enlargement of the cavity of the inlet fluid channel 5 after the extension of the etching area of the inlet fluid channel 5.

[0137] Embodiment B3

[0138] As shown in Figures B11 and B12, a hole is etched in the object below the cantilever beam 9 in this example, which forms the separation space 11. The hole can be etched upwards from the lower surface of the silicon layer 1. The hole also reduces the size of the gap between the cantilever beam 9 and the object, thereby reducing the size of the adsorption microscopic force between the cantilever beam 9 and the object.

[0139] Embodiment B4

[0140] As shown in Figure B13, unlike the embodiment B1 shown in Figure B9, the microgroove shape etched on the end surface of the inlet valve body 7 is discontinuously distributed block etching grooves 112, and the inner and outer rings are staggered to improve the sealing and uniformity.

[0141] Embodiment B5

[0142] As shown in Figure B14, unlike the embodiment B1 shown in Figure B8, the separation space 11 is a microgroove etched on the inlet valve seat 8, rather than etched on the end surface of the inlet valve body 7. Similarly, the microgroove shape can also be circular or block-shaped as shown in Figures B9 and B13. Based on similar ideas, a microgroove can also be etched on the lower surface of the cantilever beam 9.

[0143] Embodiment B6

[0144] As shown in the structure of Figure B15, which is a structure diagram of the embodiment B1 shown in Figure B7 after being put into use, due to the arrangement of the separation space 11, the swing rate of the cantilever beam 9 is accelerated when the valve is opened, and the gap below the cantilever beam 9 is extended to the cantilever beam extension 91 in Figure B15, so that the actual working length of the cantilever beam 9 is extended to include the cantilever beam extension 91, that is, the effective length of the cantilever beam 9 is lengthened. While the cantilever beam 9 at the edge of the pump cavity 4 (the two cantilever beams 9 on the right side in Figure B15) is limited by the material of the edge silicon layer 1, the effective movement length is unchanged, and the left end boundary of the cantilever beam 9 is limited to the H line. Therefore, during the opening of the valve, the problem of unbalanced movement of the cantilever beam 9 occurs. The present example can solve this problem.

[0145] As shown in Figures B16 and B17, the edge portion of the pump cavity 4 in the silicon layer 1 is etched to remove the J portion above the periphery of the end of the cantilever beam 9 in Figure B16 to form a pump cavity extension area 41, and to increase the etching gap below the cantilever beam 9 at this position to form an extended release space (the etching gap can also not be increased and be naturally extended during work, like the other two cantilever beams 9). In this way, the actual working length of the cantilever beam 9 at this position is lengthened, which is equivalent to the other two cantilever beams 9, as shown in Figure B17.

[0146] In the foregoing embodiments, for the problem of adsorption of the inlet valve cantilever beam 9, the etching area of the original inlet fluid passage 5 is extended along the cantilever beam 9 to increase the length of the suspended portion of the inlet valve cantilever beam 9, thereby reducing the contact area of the inlet valve cantilever beam 9 with the structure below the cantilever beam 9, reducing the effect of micro forces, and solving the problem of adsorption of the cantilever beam 9. For the problem of adsorption of the inlet valve body 7, a shallow etching is formed on the inlet valve body 7 at the position where the inlet valve body 7 contacts the bottom glass to form a micro groove, thereby reducing the contact area of the inlet valve body 7 with the inlet valve seat 8, reducing the effect of micro forces, and solving the problem of adsorption of the inlet valve body 7. Finally, the inlet valve body 7 is easily opened, and the performance of the MEMS micropump is more stable.

[0147] The above embodiments are only for illustrating the technical concept and characteristics of the present disclosure, and the purpose is to enable those skilled in the art to understand the content of the present disclosure and implement it, and cannot limit the protection scope of the present disclosure. Any equivalent changes or modifications made according to the spirit and essence of the present disclosure shall be covered within the protection scope of the present disclosure.

[0148] The micro-pump involving the improved outlet valve will now be described in conjunction with Figures C1-C10. It should be understood that the structure of the improved inlet valve is also applicable to the corresponding micro-pumps of Figures A1-A15 and B1-B17. Unless otherwise specified, the figures in this section are described in conjunction with one or more of Figures C1-C10. The technical solutions of the present disclosure will be described clearly and completely in conjunction with Figures C1-C10. It is obvious that the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present disclosure. In Figures C1-C10, the reference signs are explained as follows:

[0149] 1, silicon layer; 11, first surface; 12, second surface; 13, first recess; 14, pump membrane; 15, inlet valve body; 16, outlet valve body; 161, central flow channel; 162, pressing portion; 17, groove; 18, moving body; 19, annular rib; 110, second recess; 111, third recess; 2, first sealing layer; 21, liquid outlet flow channel; 3, second sealing layer; 31, driving channel; 32, liquid inlet flow channel; 33, through hole; 4, pump cavity; 5, liquid outlet cavity; 6, first anti-bonding portion; 7, sealing gasket; 8, second anti-bonding portion.

[0150] As shown in Figure C1, the MEMS micro-pump comprises a silicon layer 1, a first sealing layer 2, and a second sealing layer 3. The silicon layer 1 has a first surface 11 and a second surface 12 opposite to each other, and the first sealing layer 2 and the second sealing layer 3 cover the first surface 11 and the second surface 12, respectively. The materials of the first sealing layer 2 and the second sealing layer 3 can be glass.

[0151] The first surface 11 of the silicon layer 1 is etched with a first recess 13. After being covered by the first sealing layer 2, the first recess 13 forms a pump cavity 4. The first surface 11 is also etched with a second recess 110 and a third recess 111. The second recess 110 and the third recess 111 are both in communication with the first recess 13.

[0152] The second surface 12 is etched with a plurality of grooves 17. The plurality of grooves 17 thin the specific parts of the second surface 12, thereby forming a pump membrane 14, an inlet valve body 15, and an outlet valve body 16. Similar to the embodiment A1, in this embodiment, the widths of the grooves 17 corresponding to different pump membranes 14 are the same.

[0153] As shown in Fig. C3, the inlet valve body 15 is formed by thinning the silicon layer 1 by a groove 17. The edge of the inlet valve body 15 is connected to the silicon layer 1, and is connected to the silicon layer 1 by at least one thin film formed by the groove 17. The inlet valve body 15 is substantially cylindrical and can swing up and down under the action of fluid pressure. The second sealing layer 3 is provided with a liquid inlet channel 32. The inlet valve body 15 covers the upper end opening of the liquid inlet channel 32. The fluid in the liquid inlet channel 32 can push the inlet valve body 15 to move upwards, open the upper end opening of the liquid inlet channel 32, and make the fluid flow into the groove 17 around the inlet valve body 15. The groove 17 is at least partially through in the thickness direction to communicate with the third groove 111, and the fluid can enter the third groove 111. The liquid inlet channel 32 serves as a valve seat for the inlet valve body 15. When the inlet valve body 15 abuts against the corresponding second sealing layer 3, the liquid inlet channel 32 is closed. The inlet valve body 15 is a one-way valve. The third groove 111 provides space for the movement of the inlet valve body 15.

[0154] Similar to the embodiment A1, the surface of the second sealing layer 3 facing the silicon layer 1 is further provided with a first anti-bonding part 6 surrounding the inner end opening of the liquid inlet channel 32, preventing the inlet valve body 15 from bonding (sticking) with the second sealing layer 3. The first anti-bonding part 6 protrudes from the surface.

[0155] The lower edge of the inlet valve body 15 has a protrusion facing the second sealing layer 3.

[0156] As shown in Fig. C4, the outlet valve body 16 is formed by thinning the silicon layer 1 by a groove 17. The upper end of the outlet valve body 16 is a pressing part 162 for pressing against the upper first sealing layer 2 (see Fig. C1). The outlet valve body 16 is provided with a central flow channel 161 in the center, which is vertically through and opens at the pressing part 162. If the pressing part 162 presses against the upper first sealing layer 2, the central flow channel 161 is closed. The upper end of the central flow channel 161 has a portion with increased diameter. The edge of the outlet valve body 16 is formed by a thin film structure by thinning the silicon layer 1 by the groove 17, which can allow the outlet valve body 16 to swing up and down.

[0157] The pump membrane 14, the inlet valve body 15 and the outlet valve body 16 are formed simultaneously by the structure of the groove 17, greatly reducing the etching area and the etching cost.

[0158] The lower end of the outlet valve body 16 is thinned, so that the lower surface of the outlet valve body 16 and the second sealing layer 3 opposite thereto form a liquid outlet cavity 5. In this embodiment, the initial thickness of the silicon layer 1 is 300-400 microns, and the height of the liquid outlet cavity is 5-35 microns. The liquid outlet cavity 5 is in communication with the liquid outlet channel 21 shown in Fig. Cl, so that liquid can be discharged. The outlet valve body 16 is a one-way valve, and the first sealing layer 2 acts as a valve seat of the outlet valve body 16. If the outlet valve body 16 abuts against the corresponding valve seat, the outlet valve is closed, and the central flow channel 161 is closed at this time.

[0159] The outer periphery of the pressing portion 162 is the second groove 110. The liquid accumulated in the second groove 110 can generate high pressure, push the outlet valve body 16 downward, separate the pressing portion 162 from the first sealing layer 2 above (see Fig. Cl), open the central flow channel 161, and make the fluid flow into the central flow channel 161, the liquid outlet cavity 5 and the liquid outlet channel 21 (see Fig. C2) in sequence and then flow out.

[0160] As shown in Fig. Cl, the pump membrane 14 around the moving body 18 is formed by thinning the silicon layer 1 by a groove 17. The pump membrane 14 is generally circular, and the edge thereof is a thin film formed by thinning the silicon layer 1 by the groove 17, while the middle part of the pump membrane 14 is not etched, forming the moving body 18 connected with the pump membrane 14. The moving body 18 is driven by a pump membrane driver (not shown) to drive the pump membrane 14 up and down, so as to change the volume of the pump cavity 4. The moving body 18 is not connected with the second sealing layer 3. The surface edge part of the moving body 18 facing the second sealing layer 3 has a ring-shaped protrusion.

[0161] The second sealing layer 3 is provided with a driving channel 31 corresponding to the part of the pump membrane 14. The driving channel 31 is for the pump membrane driver (not shown) to extend into. The span of the moving body 18 exceeds the opening of the driving channel 31, so that the moving body 18 can be placed on the surface of the second sealing layer 3 at the edge of the driving channel 31, limit the stroke of the moving body 18, and be conducive to controlling the single pumping volume.

[0162] As in the embodiment Al, the outer periphery of the moving body 18 is also provided with a ring-shaped rib 19 by the groove 17. The inner and outer circles of the ring-shaped rib 19 are both provided with the groove 17. In this embodiment, the ring-shaped rib 19 is thinned, so that the ring-shaped rib 19 does not contact the second sealing layer 3, preventing bonding. In order to further prevent bonding, a second anti-bonding portion 8 is also arranged on the upper surface of the second sealing layer 3, facing the ring-shaped rib 19. The ring-shaped rib 19 is provided with the groove 17 on both sides, and the two rings of the groove 17 can make the pump membrane 14 have a larger stroke. Of course, the ring-shaped rib 19 can also be removed by etching, and at this time, the pump membrane 14 can also have a larger stroke. The ring-shaped rib 19 is left for the purpose of reducing etching time and improving production speed.

[0163] As shown in Fig. C4, under such structure, the swing range of the outlet valve body 16 will be enlarged when high frequency pumping, and the outlet valve body 16 will sometimes be in contact with the second sealing layer 3, so that the liquid outlet cavity 5 is eliminated, and the fluid in the center flow channel 161 cannot flow out, affecting the pumping. The following embodiments are dedicated to solving this problem.

[0164] Embodiment C1

[0165] As shown in Fig. C5 and Fig. C6, in this embodiment, the outlet valve body 16 is further thinned, so that the volume of the liquid outlet cavity 5 is increased, allowing the outlet valve body 16 to have a larger swing range. Thus, the problem of liquid outlet blockage during high frequency pumping is solved. In this embodiment, the thickness of the further thinned lower end of the outlet valve body 16 accounts for 0.2%-8.5% of the initial thickness of the silicon layer 1 (1-25 microns in this embodiment), and at this time, the height of the formed liquid outlet cavity 5 is sufficient for the up and down swing of the outlet valve body 16, which reaches 1.5-20% of the initial silicon wafer thickness. Specifically, in some embodiments, the outlet valve body 16 is further thinned by 1-25 microns, and at this time, the height of the liquid outlet cavity is between 6-60 microns.

[0166] Embodiment C2

[0167] As shown in Fig. C7 and Fig. C8, in this embodiment, the second sealing layer 3 is thinned at the portion corresponding to the outlet valve body 16, so that the liquid outlet cavity 5 extends into the second sealing layer 3, and the volume of the liquid outlet cavity 5 is increased, allowing the outlet valve body 16 to have a larger swing range.

[0168] In this embodiment, the outlet valve body 16 can be thinned to form the liquid outlet cavity 5 as in the structure of Fig. C1, or not thinned as shown in Fig. C7, and when not thinned, the liquid outlet cavity 5 is entirely formed in the second sealing layer 3.

[0169] Embodiment C3

[0170] As shown in Fig. C9 and Fig. C10, in this embodiment, the second sealing layer 3 is provided with a through hole 33 corresponding to the outlet valve body 16. The through hole 33 penetrates the second sealing layer 3. The lower end of the through hole 33 is opened and capped with a sealing gasket 7.

[0171] In this embodiment, the outlet valve body 16 can be thinned or not thinned.

[0172] The above embodiments are only for illustrating the technical concept and characteristics of the present disclosure, and the purpose is to enable those skilled in the art to understand the content of the present disclosure and implement it, and cannot limit the protection scope of the present disclosure. Any equivalent changes or modifications made according to the spirit and essence of the present disclosure shall be covered within the protection scope of the present disclosure.

[0173] The schemes of the actuator driving the micropump will be described in combination with Figs. D1-D7. It should be understood that the technical schemes in the following embodiments can use the micropump in the prior art or one or more corresponding micropumps described in Figs. A1-A15, B1-B17 and C1-C10. Unless otherwise specified, the drawings in this section are described in combination with one or more of Figs. D1-D7. In the drawings, 1 is a pump body; 2 is an actuator; 3 is a first base plate; 4 is a second base plate; 5 is an inlet flow channel; 6 is a first sealing gasket; 7 is an outlet flow channel; 8 is a second sealing gasket; 9 is an inlet connector; 10 is an outlet connector; 11 is a ring-shaped connector; 12 is a fastener; 13 is a pressure sensor; and 14 is a pressure measuring flow channel.

[0174] Referring to Figs. D1-D7, the embodiment discloses a micropump, which comprises a pump body 1, an actuator 2, a first base plate 3 and a second base plate 4. The pump body 1 in the embodiment can use the micropump in the prior art or one or more corresponding micropumps described in Figs. A1-A15, B1-B17 and C1-C10.

[0175] The pump body 1 has an inlet and an outlet.

[0176] The actuator 2 is connected with the pump body 1 and is used to drive the pump body 1 to contract or expand. When one or more corresponding micropumps described in Figs. A1-A15, B1-B17 and C1-C10 are used, the actuator 2 is connected with the moving body (22 in A1, 88 in B1 and 18 in C1) in the micropump to drive the pump body 1.

[0177] The first base plate 3 is provided with an inlet flow channel 5, one end of the inlet flow channel 5 is communicated with the inlet, and the other end of the inlet flow channel 5 is communicated with an inlet connector 9.

[0178] The second base plate 4 is provided with an outlet flow channel 7, one end of the outlet flow channel 7 is communicated with the outlet, and the other end of the outlet flow channel 7 is communicated with an outlet connector 10.

[0179] The micropump disclosed in the scheme further comprises a first sealing gasket 6 and a second sealing gasket 8. The first sealing gasket 6 is pressed on the pump body 1 through the first base plate 3 and is used to seal the inlet and the inlet flow channel 5. The second sealing gasket 8 is pressed on the pump body 1 through the second base plate 4 and is used to seal the outlet and the outlet flow channel 7. The first sealing gasket 6 and the second sealing gasket 8 are made of silicone or rubber and can be plastically deformed to achieve sealing.

[0180] The micro pump disclosed by the present disclosure realizes the compression sealing of the inlet of the pump body 1 and the liquid inlet channel 5 through the first sealing gasket 6, realizes the compression sealing of the outlet of the pump body 1 and the liquid outlet channel 7 through the second sealing gasket 8, and compared with the prior art that realizes the sealing of the inlet and the outlet and the liquid channel through glue, the first sealing gasket 6 and the second sealing gasket 8 are independent sealing pieces, and there is no inseparable fixed connection relationship between the first sealing gasket 6 and the second sealing gasket 8 and the sealed structure, and when thermal expansion and contraction occur under the influence of the ambient temperature, only the first sealing gasket 6 and the second sealing gasket 8 deform, so there is no problem of affecting the inseparable fixed connection relationship between the first sealing gasket 6 and the second sealing gasket 8 and the sealed structure, thereby improving the reliability of the sealing.

[0181] Furthermore, the first sealing gasket 6 and the second sealing gasket 8 will deform when compression sealing is performed, so that when the ambient temperature of the first sealing gasket 6 and the second sealing gasket 8 decreases, the shrinkage of the first sealing gasket 6 and the second sealing gasket 8 will also decrease, so as to ensure the sealing of the inlet and the liquid inlet channel 5 and the sealing of the outlet and the liquid outlet channel 7, and when the ambient temperature of the first sealing gasket 6 and the second sealing gasket 8 increases, the first sealing gasket 6 and the second sealing gasket 8 expand, the first sealing gasket 6 and the second sealing gasket 8 are more closely attached to the sealed structure, and the sealing effect is better.

[0182] Since the hole diameter of the inlet and the outlet of the pump body 1 of the micro pump is less than 0.5 mm, and the area for applying glue around the holes of the inlet and the outlet is also very small, it is very difficult to seal through glue, in the present embodiment, the width and the length of the first sealing gasket 6 and the second sealing gasket 8 cover the entire corresponding surface of the pump body 1, and only the openings corresponding to the inlet and the outlet are arranged on the whole flat gasket, the sealing of the inlet and the outlet is realized through the first sealing gasket 6 and the second sealing gasket 8 arranged in a large area, which can not only ensure the sealing effect, but also reduce the sealing difficulty during installation.

[0183] The first sealing gasket 6 and the second sealing gasket 8 are flexible gaskets or flexible sealing rings (such as rubber or silicone), the first sealing gasket 6 is provided with a first through hole corresponding to the position of the inlet and being in communication, and the second sealing gasket 8 is provided with a second through hole corresponding to the position of the outlet and being in communication, which does not affect the flow of the liquid on the basis of ensuring the sealing.

[0184] In addition, compared with the form of sealing through glue, the aging speed of the first sealing gasket 6 and the second sealing gasket 8 is slower than that of the glue, and accordingly, the service life of the first sealing gasket 6 and the second sealing gasket 8 is long, which can reduce the maintenance frequency of the micro pump to a certain extent.

[0185] The first sealing gasket 6 in the scheme is located between the first base plate 3 and the pump body 1, and the first base plate 3 is located between the pump body 1 and the actuator 2. As shown in FIG. D8, the distance between the connection position of the actuator 2 and the pump body 1 and the connection position of the inlet flow channel 5 and the outlet (i.e. the liquid inlet) of the pump body 1 is small. In order to reduce the size limitation of the high precision requirement of the first sealing gasket 6 during installation, while ensuring the reliability of the sealing of the first sealing gasket 6, the first sealing gasket 6 in the scheme can cover the plane where the pump body 1 is located, or the first sealing gasket 6 can cover the outlet of the pump body 1 and the connection position of the actuator 2 and the pump body 1. It should be noted that, referring to FIG. D8, the third through hole 61 for connecting the actuator 2 and the pump body 1 and the fourth through hole 62 for forming the inlet flow channel 5 need to be provided on the first sealing gasket 6.

[0186] The actuation mode of the pump body 1 can be various, such as piezoelectric, electrostatic, electromagnetic and thermal drive, etc., to realize the volume change of the pump body 1.

[0187] The actuator 2 in the scheme is taken as a piezoelectric ceramic for illustration.

[0188] As shown in FIG. D8, the piezoelectric ceramic, the first base plate 3, the pump body 1 and the second base plate 4 are arranged in sequence, and the piezoelectric ceramic is connected with the pump body 1 through the first base plate 3.

[0189] The first base plate 3 and the second base plate 4 are connected by chemical bonding or physical fastening (such as bolt fastening, refer to FIG. D9), and the second base plate 4 has a mounting groove 41 for mounting the first base plate 3, and the side of the second base plate 4 opposite to the mounting groove 41 is connected with the actuator 2. As shown in the embodiment of FIG. D3, the second base plate 4 has a protrusion 42 for supporting the actuator 2, and the actuator 2 and the protrusion are located in the annular connector 11.

[0190] As shown in FIG. D1-D3 and FIG. D7, the tail end of the piezoelectric ceramic is connected with the second base plate 4 through the annular connector 11, and the annular connector 11 is sleeved on the piezoelectric ceramic and the second base plate 4 (or the tail end of the piezoelectric ceramic and the second base plate 4 are located in the annular connector 11). The position where the annular connector 11 cooperates with the second base plate 4 is provided with an opening, and the size of the outer periphery of the annular connector 11 is adjusted through the opening, so that the force acting on the piezoelectric ceramic and the second base plate 4 by the annular connector 11 can be adjusted. The annular connector 11 is provided with a fixing hole on both sides of the opening, and the annular connector 11 is fastened and connected with the second base plate 4 through the fastener 12 cooperating with the fixing hole.

[0191] The piezoelectric ceramic is connected with the second substrate 4 through the annular connecting piece 11, instead of the conventional piezoelectric ceramic connected with the second substrate 4 through adhesive connection, that is, the mechanical connection is used instead of the adhesive connection, the piezoelectric ceramic is fixed on the second substrate 4 through the fastener matched with the annular connecting piece 11, the annular connecting piece 11 provides a pressing force to the piezoelectric ceramic, effectively preventing the tail of the piezoelectric ceramic from being warped, when the piezoelectric ceramic is driven by voltage to work and a force below 50N is applied, the tail of the piezoelectric ceramic remains stable, effectively reducing the energy loss in the transmission process caused by the glue fixing the tail end of the piezoelectric ceramic, the transmission efficiency is improved from the original 40% to more than 63%, the transmission efficiency is improved, and the stability and reliability of the connection between the piezoelectric ceramic and the second substrate 4 are improved.

[0192] The annular connecting piece 11 is made of elastic material (metal spring in the embodiment), after the annular connecting piece 11 is opened through the opening, the annular connecting piece 11 can be retracted under the action of its own restoring force, so that the opening returns to the original size. The shape of the annular connecting piece 11 is adapted to the overall shape of the piezoelectric ceramic and the second substrate 4, preferably, the circumferential size of the annular connecting piece 11 is smaller than the circumferential size of the whole of the piezoelectric ceramic and the second substrate 4, so that after the annular connecting piece 11 is sleeved on the whole of the piezoelectric ceramic and the second substrate 4, the annular connecting piece 11 can apply a circumferential locking force to the piezoelectric ceramic and the second substrate 4 under the action of its own restoring force.

[0193] During installation, first, the annular connecting piece 11 is sleeved on the piezoelectric ceramic and the second substrate 4, and the annular connecting piece 11 can realize preliminary connection with the piezoelectric ceramic and the second substrate 4 under the action of its own restoring force, and then the fastener 12 fixes the annular connecting piece 11 on the second substrate 4 through the fixing hole.

[0194] The fixing holes of the annular connecting piece 11 located on both sides of the opening are semicircular holes, and the two semicircular holes located on both sides of the opening form a circular hole, and the fastener is connected with the second substrate 4 through the circular hole, and the fastener presses the annular connecting piece 11 on the second substrate 4.

[0195] Referring to FIG. D9, the fixing holes of the annular connecting piece 11 located on both sides of the opening are circular holes, and the fixing holes located on both sides of the opening are not communicated with each other, and the user can select appropriate fixing holes for the annular connecting piece 11 according to the needs, at this time, the fastener 12 corresponding to the two fixing holes can be used to realize the connection. As shown in FIGS. D10a and D10b, the fixing holes of the annular connecting piece 11 located on both sides of the opening are semicircular holes, and the fixing holes located on both sides of the opening are communicated with each other at the fixing position, at this time, one fastener 12 can be used to realize the connection.

[0196] The annular connecting piece 11 is fixedly connected with the second base plate 4 through the fastener 12, which improves the stability of the annular connecting piece 11 in fixing the piezoelectric ceramic. The fastener is preferably a screw (Fig. D10b) or a stud (Fig. D10a). The advantage of using a screw is that the screw can be screwed into the second base plate 4 without the need to pre-drill a hole in the second base plate 4, so that no hole-to-hole alignment is required when connecting the annular connecting piece 11 with the second base plate 4.

[0197] It should be noted here that the tail of the piezoelectric ceramic is the position where the piezoelectric ceramic is not connected with the pump body 1. Referring to Fig. D2, the tail of the piezoelectric ceramic can be mounted with a conversion circuit board, and the bottom of the conversion circuit board has a metal electrode contact as an external circuit interface of the micropump.

[0198] As shown in Figs. D4a-b, D7, 10a and 10b, the side of the second base plate 4 connected with the annular connecting piece 11 is provided with a limiting groove 43, and the annular connecting piece 11 is provided with a limiting boss 110 matched with the limiting groove 43. When the annular connecting piece 11 is connected with the whole composed of the actuator 2 and the second base plate 4, the annular connecting piece 11 is sleeved from the end of the second base plate 4, and the limiting boss 110 is opposite to the limiting groove 43.

[0199] The limiting groove 43 plays a limiting role on the limiting boss 110, and can also play an indicating role on the assembly direction of the annular connecting piece 11. After assembly, the limiting boss 110 is located in the limiting groove 43, and the groove wall of the limiting groove 43 applies a pushing force to the limiting boss 110 located on both sides of the opening, so as to move the limiting boss 110 in the direction of the opening, thereby playing a role of tightening the annular connecting piece 11 and reducing the connection difficulty of the annular connecting piece 11 with the second base plate 4.

[0200] The limiting boss can be formed by bending on both sides of the opening of the annular connecting piece 11, or can be a boss type structure separately provided on both sides of the opening of the annular connecting piece 11.

[0201] The first base plate 3 is located on the side of the pump body 1 where the inlet is arranged, and the second base plate 4 is located on the side of the pump body 1 where the outlet is arranged. As shown in Figs. D4a-b, the inlet and outlet of the pump body 1 are arranged on the two sides of the pump body 1, respectively, and correspondingly, the first base plate 3 and the second base plate 4 are also located on the two sides of the pump body 1, respectively, and the pump body 1 is located between the first base plate 3 and the second base plate 4.

[0202] In order to improve the stability of the pump body 1 mounted on the first base plate 3, the first mounting groove 31 is formed on the first base plate 3, the first mounting groove 31 is matched with the shape of the pump body 1, the pump body 1 is embedded in the first mounting groove 31, and the first mounting groove 31 limits the pump body 1 to ensure the communication and sealing of the pump body 1 with the liquid inlet channel.

[0203] The first sealing gasket 6 is located at the bottom of the first mounting groove 31 and between the pump body 1 and the bottom of the first mounting groove 31. Preferably, the shape (i.e. the external contour) of the first sealing gasket 6 is adapted to the shape (i.e. the internal contour of the bottom) of the first mounting groove 31.

[0204] To further improve the stability of the installation of the pump body 1 on the second substrate 4, the present disclosure provides that the second substrate 4 is provided with a second mounting groove 44, which is adapted to the shape of the pump body 1, the pump body 1 is embedded on the second substrate 4 through the second mounting groove 44, the second mounting groove 44 limits the pump body 1, and ensures the communication and sealing of the pump body 1 and the liquid outlet channel.

[0205] The second sealing gasket 8 is located at the bottom of the second mounting groove and between the pump body 1 and the bottom of the second mounting groove.

[0206] The micro-pump disclosed in the present scheme can only have the first mounting groove 31 on the first substrate 3, in which case the second mounting groove 44 on the second substrate 4 is not provided; or only the second mounting groove 44 on the second substrate 4 is provided, in which case the first mounting groove 31 is not provided. Preferably, the first mounting groove 31 is provided on the first substrate 3, and the second mounting groove 44 is provided on the second substrate 4.

[0207] In the embodiment in which only the first mounting groove 31 is provided on the first substrate 3, the first mounting groove 31 has a depth not less than the thickness of the pump body 1 along the direction perpendicular to the bottom of the first mounting groove 31, so as to completely install the pump body 1 in the first mounting groove 31. Similarly, in the embodiment in which only the second mounting groove 44 is provided on the second substrate 4, the second mounting groove 44 has a depth not less than the thickness of the pump body 1 along the direction perpendicular to the bottom of the second mounting groove 44, so as to completely install the pump body 1 in the second mounting groove 44.

[0208] In the embodiment in which the first mounting groove is provided on the first substrate 3 and the second mounting groove is provided on the second substrate 4, the depth of the first mounting groove 31 is greater than the depth of the second mounting groove 44, or the depth of the first mounting groove 31 is less than the depth of the second mounting groove 44, as shown in the scheme of FIG. D4a-b, and both are less than the thickness of the pump body 1 along the direction perpendicular to the bottom of the first mounting groove, which is easier to assemble.

[0209] The micro-pump disclosed in the present disclosure further comprises a pressure sensor 13 for detecting the fluid pressure of the liquid outlet channel 7.

[0210] As shown in FIG. D4a-b, the pressure sensor 13 is mounted on the second substrate 4, and the second substrate 4 is provided with a pressure measuring channel 14 in communication with the liquid outlet channel 7, and the pressure measuring channel 14 is in communication with the pressure sensor 13.

[0211] The liquid outlet flow channel 7 includes a first flow channel 71, a second flow channel 72 and a third flow channel 73 which are in communication with each other. The first end of the first flow channel 71 is in communication with the liquid outlet connector 10. The second end of the first flow channel 71 is in communication with the first end of the second flow channel 72. The second end of the second flow channel 72 is in communication with the first end of the third flow channel 73. The second end of the third flow channel 73 is in communication with the outlet of the pump body 1. As shown in FIGS. D4a-b and D5, the first flow channel 71 and the third flow channel 73 are located at the two ends of the second flow channel 72, respectively. The first flow channel 71, the second flow channel 72 and the third flow channel 73 are perpendicular to each other. The first flow channel 71 and the second flow channel 72 are opened along the horizontal plane in which the second substrate 4 is located.

[0212] The pressure measurement flow channel 14 is in communication with the second flow channel 72 and parallel to the first flow channel 71. The pressure measurement flow channel 14 is close to the side of the second flow channel 72 which is in communication with the third flow channel 73.

[0213] The cross-sectional area of the first flow channel 71 is the same as that of the pressure measurement flow channel 14 (in this embodiment, the cross-sectional area is the same as that of a circular hole). The positions of the first flow channel 71 and the pressure measurement flow channel 14 are at the same height (the same height makes it difficult for air bubbles to be generated at the two positions of the pressure measurement flow channel 14 and the first flow channel 71). The cross-sectional area of the second flow channel 72 is the same as that of the third flow channel 73. The cross-sectional area of the second flow channel 72 and the third flow channel 73 is greater than that of the first flow channel 71.

[0214] Referring to FIG. D11, the liquid inlet flow channel 5 includes a fourth flow channel 51 which is in communication with the inlet of the pump body 1 and a fifth flow channel 52 which is used for introducing liquid. The fifth flow channel 52 is opened along the horizontal plane in which the first substrate 3 is located. The fifth flow channel 52 is parallel to the first flow channel 71.

[0215] The inlet of the fifth flow channel 52 and the outlet of the first flow channel 71 are located at the two sides of the length direction of the first substrate 3 or the second substrate 4, respectively. The outlet of the pressure measurement flow channel 14 and the outlet of the first flow channel 71 are located at the same side of the second substrate 4.

[0216] Referring to FIG. D8, a third mounting groove (not shown in the figure) is opened on the second substrate 4. The third mounting groove is in communication with the pressure measurement flow channel 14. The third mounting groove is used for achieving the embedded connection of the pressure sensor 13 and the second substrate 4. In some embodiments of the present disclosure, the pressure sensor 13 and the pressure measurement flow channel 14 are sealed by a third sealing gasket 131. The third sealing gasket 131 is located between the pressure sensor 13 and the groove wall of the third mounting groove.

[0217] In the present scheme, the pressure sensor 13 is pressed in the third mounting groove through the pressure sensor circuit board 15. The pressure sensor circuit board 15 is tightly connected with the second substrate 4. The pressure sensor circuit board 15 has a metal electrode contact which is used as an external circuit interface of the micropump.

[0218] The connection of the pressure sensor 13 to the second substrate 4 is not limited to being pressed by the pressure sensor circuit board 15, and the use of glue can be avoided. Of course, the pressure sensor 13 can also be directly connected to the third mounting groove to adapt to the needs of different application scenarios.

[0219] The thickness of the second substrate 4 is greater than the thickness of the first substrate 3 to accommodate the installation of the pressure sensor 13. The second substrate 4 serves as a support structure, and the first substrate 3 serves as a cover plate. The strength of the first substrate 3 can be lower than that of the second substrate 4.

[0220] As shown in FIGS. D8 and D4b, the first substrate 3 and the second substrate 4 are connected by insertion. Specifically, the side of the second substrate 4 that cooperates with the pump body 1 is provided with a guide convex ring 46, and the first substrate 3 is provided with a guide groove 33 that cooperates with the guide convex ring 46. The first substrate 3 and the second substrate 4 are connected by insertion through the cooperation of the guide convex ring 46 and the guide groove 33, facilitating quick positioning and installation.

[0221] As shown in FIGS. D4a-b, the guide convex ring 46 is formed along the slot of the first mounting groove 31, and the slot wall of the guide groove 33 is L-shaped and is formed along the slot of the second mounting groove 44.

[0222] The connection mode of the first substrate 3 and the second substrate 4 is not limited to insertion, and can also be screw fastening or clamping.

[0223] As shown in FIGS. D1 and D3, the liquid inlet connector 9 and the liquid outlet connector 10 can be needle-shaped metal tubes.

[0224] The liquid inlet connector 9 pierces the sealing rubber plug of a product used in cooperation with the micro-pump disclosed in the present scheme, so that the external liquid path is sealingly connected to the liquid inlet flow channel 5. Similarly, the liquid outlet connector 10 pierces the sealing rubber plug of a product used in cooperation with the micro-pump disclosed in the present scheme, so that the external liquid path is sealingly connected to the liquid outlet flow channel 7. This design can reduce the risk of cracking and leakage of glue in the sealing design of a small aperture or size, improve the reliability of the sealing, and reduce the risk of cracking and leakage of glue in the sealing design of a small aperture or size.

[0225] The present disclosure will now be described in conjunction with various examples described below and various combinations of these examples.

[0226] 1. One example provides a micro-pump, comprising:

[0227] A silicon wafer has opposite first and second faces. The first face is etched with a first groove for forming a pump cavity. The second face is etched with a plurality of grooves for forming a moving body, an annular muscle, and a first valve body that satisfies an equal-width condition. The annular muscle surrounds the moving body and is connected to a pump membrane around the moving body. The first valve body is connected to a valve membrane of the outlet valve.

[0228] a first cover plate fixed on the first surface of the silicon wafer, covering the first groove to form a pump cavity;

[0229] a second cover plate fixed on the second surface of the silicon wafer, the second cover plate being provided with a connecting port for connecting a driver at a position corresponding to the moving body.

[0230] 2. The micropump according to example 1, wherein the silicon wafer is provided with a first through hole at a position other than the first groove, the second surface is etched with a second groove for connecting the first through hole and the outlet valve, the first cover plate is provided with a liquid outlet through the first through hole at a position corresponding to the first through hole, and the second cover plate is provided with a liquid inlet at a position corresponding to the inlet valve.

[0231] 3. The micropump according to any one of the preceding examples, wherein the annular rib comprises a plurality of intermittent bodies spaced around the moving body, and the gap between the intermittent bodies and the groove between the annular rib and the moving body satisfy the equal-width condition.

[0232] The micropump according to any one of the preceding aspects, wherein the annular rib is a double-ring structure comprising a first ring and a second ring concentrically arranged around the moving body, and the gap between the first ring and the second ring and the groove between the annular rib and the moving body satisfy the equal-width condition.

[0233] 4. The micropump according to any one of the preceding examples, wherein the first valve body is a double-ring structure comprising a third ring and a fourth ring concentrically arranged around the central flow passage of the outlet valve, and the gap between the third ring and the fourth ring and the groove between the annular rib and the moving body satisfy the equal-width condition.

[0234] 5. The micropump according to any one of the preceding examples, wherein the annular rib is a dot-matrix structure comprising a plurality of dot-matrix distributed circular columns or square columns.

[0235] 6. The micropump according to any one of the preceding examples, wherein the first valve body is a dot-matrix structure comprising a plurality of dot-matrix distributed circular columns or square columns.

[0236] 7. The micropump according to any one of the preceding examples, wherein the first cover plate and / or the second cover plate is a glass plate or a silicon wafer.

[0237] 8. A MEMS microvalve is provided to solve the technical problem of microvalve not opening, the MEMS microvalve is arranged in a fluid channel for controlling the closing and opening of the fluid channel, comprising a valve body, a valve seat and a cantilever beam, the fluid channel is closed when the valve body covers the valve seat, the fluid channel is opened when the valve body separates from the valve seat, the cantilever beam is connected between the valve body and the inner wall of the fluid channel to play a supporting role on the valve body, a separation space is arranged between the cantilever beam and / or the valve body and the object to reduce the contact area with the object.

[0238] 9. The microvalve according to example 8, wherein the separation space corresponding to the cantilever beam is formed by the fluid channel extending into the side of the cantilever beam facing the object.

[0239] 10. The MEMS microvalve according to any one of examples 8 or 9, the valve body extends along with the fluid channel to the side of the cantilever beam facing the object.

[0240] 11. The microvalve (i.e. MEMS microvalve, same below) according to any one of the preceding examples, the separation space corresponding to the cantilever beam is formed by a hole etched in the cantilever beam facing the object.

[0241] 12. The microvalve according to any one of the preceding examples, the separation space corresponding to the cantilever beam is formed by a hole etched in the cantilever beam.

[0242] 13. The microvalve according to any one of the preceding examples, the separation space corresponding to the valve body is etched on the end face of the valve body.

[0243] 14. The microvalve according to any one of the preceding examples, the separation space corresponding to the valve body is etched on the valve seat.

[0244] 15. The microvalve according to any one of the preceding examples, the separation space corresponding to the valve body is continuous or discontinuous.

[0245] 16. The microvalve according to any one of the preceding examples, the contact area between the valve body and the valve seat is annular, the separation space is arranged on the valve body and / or the valve seat, and the separation space is one or more annular shapes.

[0246] 17. A MEMS micropump is provided to solve the technical problem of microvalve not opening, comprising a pump cavity capable of changing volume, the pump cavity has a liquid inlet fluid channel and a liquid outlet fluid channel, and the MEMS microvalve according to any one of the preceding examples is used as a one-way valve of the liquid inlet fluid channel and / or the liquid outlet fluid channel.

[0247] 18. The MEMS micropump of claim 17, wherein the cantilever beam end peripheral at the pump cavity edge is etched with a pump cavity extension on a side opposite to the cantilever beam object.

[0248] 19. The MEMS micropump of claim 17, wherein the MEMS micropump is configured to reduce etching cost and avoid the outlet valve body being blocked due to excessive deformation during high frequency pumping, and the MEMS micropump comprises:

[0249] a silicon layer having opposite first and second faces, the first face being etched with a first recess for forming a pump cavity, and the second face being etched with grooves for forming a pump membrane, an inlet valve body, and an outlet valve body, the grooves around the inlet valve body being at least partially through to the first recess for introducing fluid, and the outlet valve body having a central flow passage through the silicon layer thickness for discharging fluid, the central flow passage being in communication with the first recess;

[0250] a first encapsulation layer connected to the first face for covering the first recess to form the pump cavity;

[0251] a second encapsulation layer connected to the second face, the second encapsulation layer having a driving passage for connecting a pump membrane driver at a position corresponding to the pump membrane;

[0252] at least one of the outlet valve body and the second encapsulation layer being thinned at a portion facing each other to form a liquid outlet cavity of the outlet valve body.

[0253] 20. The MEMS micropump of any one of the preceding claims, wherein the second encapsulation layer has a liquid inlet flow passage through the second encapsulation layer thickness, the first encapsulation layer has a liquid outlet flow passage through the first encapsulation layer thickness, the inlet valve body covers an inner end opening of the liquid inlet flow passage, and the liquid outlet flow passage is in communication with the liquid outlet cavity.

[0254] 21. The MEMS micropump of any one of the preceding claims, wherein the second encapsulation layer has a first anti-bonding portion protruding from a surface of the second encapsulation layer and surrounding the inner end opening of the liquid inlet flow passage.

[0255] 22. The MEMS micropump of any one of the preceding claims, wherein a pump membrane edge is thinned by the grooves to a thin film shape, a pump membrane central portion is not etched and formed as a moving body connected to the pump membrane, and the moving body is not connected to the second encapsulation layer.

[0256] 23. The MEMS micropump of any one of the preceding claims, wherein a span of the moving body exceeds an inner end opening of the driving passage.

[0257] 24. The MEMS micropump according to any of the preceding examples, wherein the pump membrane edge is provided with a ring of annular ribs formed by the grooves on both sides.

[0258] 25. The MEMS micropump according to any of the preceding examples, wherein the second cover layer is provided with a second anti-bonding portion around the opening of the drive channel inner end facing the surface of the silicon layer.

[0259] 26. The MEMS micropump according to any of the preceding examples, wherein the outlet valve body surface facing the first cover layer is not etched to form a pressing portion pressing against the first cover layer, the central flow passage is opened in the pressing portion, the pressing portion is etched to form a second groove communicating with the first groove, and the second groove is covered by the first cover layer.

[0260] 27. The MEMS micropump according to any of the preceding examples, wherein the first surface is further etched with a third groove communicating with the first groove, the third groove corresponds to the inlet valve body and provides space for the movement of the inlet valve body, and the third groove is covered by the first cover layer.

[0261] 28. The present example provides a MEMS micropump, comprising:

[0262] a silicon layer having opposite first and second surfaces, the first surface is etched with a first groove for forming a pump cavity, and the second surface is etched with grooves for forming a pump membrane, an inlet valve body, and an outlet valve body, the grooves around the periphery of the inlet valve body at least partially penetrate into the first groove to introduce fluid, and the outlet valve body is provided with a central flow passage penetrating along the thickness direction of the silicon layer, the central flow passage communicates with the first groove to discharge fluid;

[0263] a first cover layer connected to the first surface and covering the first groove to form a pump cavity;

[0264] a second cover layer connected to the second surface, the second cover layer is provided with a drive channel for connecting a pump membrane driver corresponding to the position of the pump membrane;

[0265] the second cover layer is provided with a through hole penetrating the portion facing the outlet valve body, and the surface of the second cover layer facing away from the outlet valve body is provided with a sealing gasket covering the through hole.

[0266] 29. The present example provides a micropump to improve the sealing reliability of the inlet of the pump body and the liquid inlet connector, and the outlet of the pump body and the liquid outlet connector, the micropump comprising a pump body, an actuator, a first substrate, and a second substrate,

[0267] The pump body has an inlet and an outlet, and the pump body is connected with the actuator;

[0268] The first substrate is provided with an inlet flow channel, a first end of the inlet flow channel is communicated with the inlet, and the other end of the inlet flow channel is provided with an inlet joint;

[0269] The first sealing gasket is provided with a first through hole corresponding to and communicated with the position of the inlet, and the first sealing gasket is pressed on the pump body through the first substrate to realize the sealing of the inlet and the inlet flow channel;

[0270] The second substrate is provided with an outlet flow channel, one end of the outlet flow channel is communicated with the outlet, and the other end of the outlet flow channel is provided with an outlet joint;

[0271] The second sealing gasket is provided with a second through hole corresponding to and communicated with the position of the outlet, and the second sealing gasket is pressed on the pump body through the second substrate to realize the sealing of the outlet and the outlet flow channel.

[0272] 30. The micropump according to any one of the preceding examples, wherein a tail end of the actuator is fastened to the second substrate through an annular connecting piece,

[0273] The tail end of the actuator and the second substrate are located in the annular connecting piece, and an opening is arranged at a position where the annular connecting piece cooperates with the second substrate, so that the outer circumference of the annular connecting piece is adjustable to adjust the locking force applied by the annular connecting piece on the actuator and the second substrate.

[0274] 31. The micropump according to any one of the preceding examples, wherein the annular connecting piece is provided with a fixing hole on both sides of the opening, and the annular connecting piece is connected with the second substrate through a fastener matched with the fixing hole; and / or,

[0275] The side of the second substrate connected with the annular connecting piece is provided with a limiting groove, the annular connecting piece is provided with a limiting boss matched with the limiting groove, and the limiting boss is provided with the opening and the fixing hole.

[0276] 32. The micropump according to any one of the preceding examples, wherein the first substrate is provided with a first mounting groove for mounting the pump body, and the first sealing gasket is arranged between the pump body and the bottom of the first mounting groove.

[0277] 33. The micropump according to any one of the preceding examples, wherein the second substrate is provided with a second mounting groove, the pump body is embedded in the second substrate through the second mounting groove, and the second sealing gasket is arranged between the pump body and the bottom of the second mounting groove.

[0278] 34. The micropump according to any one of the preceding examples, further comprising a pressure sensor for detecting fluid pressure of the inlet flow channel.

[0279] The second substrate is provided with a pressure measuring flow channel in communication with the outlet flow channel, and the pressure sensor is in communication with the pressure measuring flow channel.

[0280] 35. The micropump according to any one of the preceding examples, the second substrate is provided with a third mounting groove in communication with the pressure measuring flow channel for mounting the pressure sensor, and a third sealing gasket is provided between the pressure sensor and the bottom of the third mounting groove for sealing the pressure sensor and the pressure measuring flow channel.

[0281] The pressure sensor is pressed in the third mounting groove by a pressure sensor circuit board, and the pressure sensor circuit board is connected to the second substrate.

[0282] 36. The micropump according to any one of the preceding examples, the first sealing gasket is shaped to fit the side of the pump body where the inlet is formed; and / or,

[0283] The second sealing gasket is shaped to fit the side of the pump body where the outlet is formed.

[0284] 37. The micropump according to any one of the preceding examples, the side of the second substrate that cooperates with the pump body is provided with a guide convex ring,

[0285] The first substrate is provided with a guide concave groove that cooperates with the guide convex ring, and the first substrate and the second substrate are connected by plug-in connection through the guide convex ring and the guide concave groove.

[0286] 38. The micropump according to any one of the preceding examples, the inlet connector and the outlet connector are both needle-shaped metal tubes.

[0287] 39. A micropump, comprising:

[0288] a silicon wafer having opposite first and second faces, the first face being provided with a first recess for forming a pump cavity, the silicon wafer being provided with an inlet valve, a moving body, and an outlet valve, the inlet valve, the moving body, and the outlet valve being connected to the silicon wafer by silicon wafer membranes respectively, the inlet valve being used to introduce fluid into the pump cavity, the outlet valve being used to introduce fluid in the pump cavity out, and the moving body being used to drive the opening or closing of the inlet valve and the outlet valve, the outlet valve being a first valve body located at part of the second face;

[0289] a first closure sheet fixed to the first face of the silicon wafer to cover the first recess to form the pump cavity;

[0290] a second closure sheet fixed to the second face of the silicon wafer.

[0291] the first valve body and the moving body are reciprocally movable between the first closure plate and the second closure plate,

[0292] a ring-shaped rib is further provided between the silicon wafer and the moving body, the ring-shaped rib is connected to the silicon wafer and the moving body through a silicon wafer film,

[0293] the second surface is provided with a plurality of grooves, the plurality of grooves comprises a first groove between the ring-shaped rib and the silicon wafer, a second groove between the ring-shaped rib and the moving body, and a third groove between the first valve body and the silicon wafer, the width of the first groove, the width of the second groove and the width of the third groove are equal to each other.

[0294] 40. The micropump of any one of examples 39, wherein the portion of the second surface where the inlet valve is located is an inlet valve body, the plurality of grooves further comprises a fourth groove between the inlet valve body and the silicon wafer, the width of the fourth groove is equal to the width of the first groove.

[0295] 41. The micropump of any one of examples 39 or 40, wherein the ring-shaped rib comprises a plurality of discontinuous bodies spaced around the moving body, the width of the gap between the discontinuous bodies is equal to the width of the first groove.

[0296] 42. The micropump of any one of examples 39-41, wherein the first valve body comprises a plurality of discontinuous bodies spaced apart, the width of the gap between the discontinuous bodies is equal to the width of the first groove.

[0297] 43. The micropump of any one of examples 41 or 42, wherein the discontinuous bodies are two concentric rings.

[0298] 44. The micropump of any one of examples 41-43, wherein the discontinuous bodies comprise a plurality of dot-matrix distributed circular columns or square columns.

[0299] 45. The micropump of any one of examples 1-8, 19-44, wherein the outlet valve and / or the inlet valve is a MEMS microvalve, the first closure plate, the silicon wafer and the second closure plate jointly form a fluid channel, the MEMS microvalve provided in the fluid channel and used to control the closing and opening of the fluid channel comprises a valve body, a valve seat and a cantilever beam, the cantilever beam is connected between the valve body and the inner wall of the fluid channel to support the valve body, the valve body is oppositely arranged with the valve seat, the fluid channel is closed when the valve body abuts against the valve seat, and the fluid channel is opened when the valve body is separated from the valve seat; wherein,

[0300] The cantilever beam and / or the valve body is provided with a separation space between the cantilever beam and the object to reduce the contact area with the object.

[0301] 46. The micropump of example 45, the object of the cantilever beam is the inner wall of the fluid channel opposite to the lower side of the cantilever beam, and the separation space is provided in the first object.

[0302] 47. The micropump of any preceding example, at least one of the outlet valve body and the second sealing layer is thinned to form a liquid outlet cavity of the outlet valve body.

[0303] 48. The micropump of example 47, the height of the liquid outlet cavity is between 6-60 microns.

[0304] 49. A micropump, comprising a pump body, an actuator, a first substrate and a second substrate, the pump body is the micropump of any one of examples 1-28, 39-47,

[0305] the pump body has an inlet and an outlet, and the pump body is connected with the actuator;

[0306] a liquid inlet channel is provided in the first substrate, a first end of the liquid inlet channel is in communication with the inlet, and the other end of the liquid inlet channel is provided with a liquid inlet connector;

[0307] a first gasket has a first through hole corresponding to and in communication with the position of the inlet, and the first gasket is pressed on the pump body through the first substrate to achieve the sealing of the inlet and the liquid inlet channel;

[0308] a liquid outlet channel is provided in the second substrate, one end of the liquid outlet channel is in communication with the outlet, and the other end of the liquid outlet channel is provided with a liquid outlet connector;

[0309] a second gasket has a second through hole corresponding to and in communication with the position of the outlet, and the second gasket is pressed on the pump body through the second substrate to achieve the sealing of the outlet and the liquid outlet channel.

[0310] The above description is only the preferred embodiment of the present disclosure and the explanation of the applied technical principles, and is not used to limit the present disclosure. For those skilled in the art, the present disclosure can have various changes and variations. The scope of the application involved in the present disclosure is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above application concept. For example, the above features are replaced with the technical features disclosed in the present disclosure (but not limited to) having similar functions to form technical solutions.

Claims

1. A micropump, characterized by The application relates to a MEMS microvalve, comprising: a silicon wafer with opposite first and second surfaces, the first surface being etched with a first groove for forming a pump cavity, and the second surface being etched with a plurality of grooves for forming a moving body, an annular ring and a first valve body of an outlet valve, the annular ring surrounding the moving body and being connected to a pump membrane around the moving body, and the first valve body being connected to a valve membrane of the outlet valve; a first closure wafer fixed to the first surface of the silicon wafer and covering the first groove to form the pump cavity; a second closure wafer fixed to the second surface of the silicon wafer, the second closure wafer being provided with a connecting port for connecting a driver at a position corresponding to the moving body.

2. The micropump according to claim 1, characterized in that The silicon wafer is provided with a first through hole at a position outside the first groove, the second surface is etched with a second groove for connecting the first through hole and the outlet valve, the first closure wafer is provided with a liquid outlet port penetrating the first through hole at a position corresponding to the first through hole, and the second closure wafer is provided with a liquid inlet port at a position corresponding to the inlet valve.

3. The micropump of claim 1, wherein, The annular ring comprises a plurality of intermittent bodies spaced around the moving body, and the gap between the intermittent bodies and the groove between the annular ring and the moving body satisfy the equal-width condition.

4. The micropump of claim 1, wherein, The annular ring is a double-ring structure comprising a first ring and a second ring concentrically arranged around the moving body, and the gap between the first ring and the second ring and the groove between the annular ring and the moving body satisfy the equal-width condition.

5. The micropump of claim 1, wherein, The first valve body is a double-ring structure comprising a third ring and a fourth ring concentrically arranged around a central flow channel of the outlet valve, and the gap between the third ring and the fourth ring and the groove between the annular ring and the moving body satisfy the equal-width condition.

6. The micropump of claim 1, wherein, The annular ring is a dot-matrix structure comprising a plurality of dot-matrix distributed circular columns or square columns.

7. The micropump of claim 1, wherein, The first valve body is a dot-matrix structure comprising a plurality of dot-matrix distributed circular columns or square columns.

8. The micropump according to any one of claims 1 to 7, characterized in that The first closure wafer and / or the second closure wafer is a glass wafer or a silicon wafer.

9. A MEMS microvalve, arranged in a fluid channel, for controlling the closing and opening of the fluid channel, comprising a valve body, a valve seat and a cantilever beam, the fluid channel being closed when the valve body covers the valve seat, the fluid channel being opened when the valve body separates from the valve seat, the cantilever beam being connected between the valve body and the inner wall of the fluid channel to play a supporting role on the valve body, characterized in that: A separation space is arranged between the cantilever beam and the object to reduce the contact area with the object.

10. The MEMS microvalve of claim 9, wherein: The separation space corresponding to the cantilever beam is formed by the fluid channel extending to the side of the cantilever beam facing the object.

11. The MEMS microvalve of claim 10, wherein: The valve body extends to the side of the cantilever beam facing the object along the fluid channel.

12. The MEMS microvalve of claim 9, wherein: The separation space corresponding to the cantilever beam is formed by a hole etched in the object or the cantilever beam.

13. The MEMS microvalve of claim 9, wherein: The separation space corresponding to the valve body is etched on the end surface of the valve body.

14. The MEMS microvalve of claim 9, wherein: The separation space corresponding to the valve body is etched on the valve seat.

15. The MEMS microvalve of claim 9, wherein: The separation space corresponding to the valve body is continuous or intermittent.

16. The MEMS microvalve of claim 9, wherein: The contact area between the valve body and the valve seat is annular, and the separation space is arranged on the valve body and / or the valve seat, and the separation space is in the shape of one or more annular rings.

17. A micropump comprising a pump chamber capable of changing volume, said pump chamber having an inlet fluid passage and an outlet fluid passage, characterized in that, The MEMS microvalve of any one of claims 1 to 9 is used as a one-way valve of the liquid inlet fluid channel and / or the liquid outlet fluid channel.

18. The micropump of claim 17, wherein: A pump cavity extension is etched on the periphery of the end of the cantilever beam at the edge of the pump cavity and away from the side of the cantilever beam facing the object.

19. A micropump characterized by The application relates to a MEMS microvalve, comprising: a silicon layer having opposite first and second faces, the first face etched with a first recess for forming a pump cavity, the second face etched with a groove for forming a pump membrane, an inlet valve body and an outlet valve body, the groove around the periphery of the inlet valve body at least partially penetrating into the first recess for introducing fluid, the outlet valve body having a central flow passage penetrating along the thickness of the silicon layer, the central flow passage communicating with the first recess for discharging fluid; a first closure layer attached to the first face, covering the first recess to form the pump cavity; a second closure layer attached to the second face, the second closure layer having a drive passage for connecting a pump membrane driver at a position corresponding to the pump membrane; at least one of the outlet valve body and the second closure layer being thinned at a portion facing each other to form a liquid outlet cavity of the outlet valve body.

20. The micropump of claim 19, wherein: a liquid inlet flow passage penetrating along the thickness of the second closure layer is formed in the second closure layer, a liquid outlet flow passage penetrating along the thickness of the first closure layer is formed in the first closure layer, the inlet valve body covering an inner end opening of the liquid inlet flow passage, the liquid outlet flow passage communicating with the liquid outlet cavity.

21. The micropump of claim 20, wherein: a first anti-bonding portion protruding from the surface of the second closure layer and surrounding the inner end opening of the liquid inlet flow passage is provided on the surface of the second closure layer facing the silicon layer.

22. The micropump of claim 19, wherein: an edge of the pump membrane is thinned by the groove to a membrane shape, a central portion of the pump membrane is not etched and formed as a moving body connected with the pump membrane, the moving body is not connected with the second closure layer.

23. The micropump of claim 22, wherein: a span of the moving body exceeds an inner end opening of the drive passage.

24. The micropump of claim 19, wherein: the edge of the pump membrane is provided with an annular rib formed by the groove on both sides.

25. The micropump of claim 19, wherein: a second anti-bonding portion surrounding the inner end opening of the drive passage is provided on the surface of the second closure layer facing the silicon layer.

26. The micropump of claim 19, wherein: a surface of the outlet valve body facing the first closure layer is not etched to form a pressing portion pressing against the first closure layer, the central flow passage opens in the pressing portion, a periphery of the pressing portion is etched to form a second recess communicating with the first recess, the second recess is covered by the first closure layer.

27. The micropump of claim 19, wherein: the first face is further etched with a third recess communicating with the first recess, the third recess corresponding to the inlet valve body provides a space for movement of the inlet valve body, the third recess is covered by the first closure layer.

28. A micropump characterized by comprising: a silicon layer having opposite first and second faces, the first face etched with a first recess for forming a pump cavity, the second face etched with a groove for forming a pump membrane, an inlet valve body and an outlet valve body, the groove around the periphery of the inlet valve body at least partially penetrating into the first recess for introducing fluid, the outlet valve body having a central flow passage penetrating along the thickness of the silicon layer, the central flow passage communicating with the first recess for discharging fluid; a first closure layer attached to the first face, covering the first recess to form the pump cavity; a second closure layer attached to the second face, the second closure layer having a drive passage for connecting a pump membrane driver at a position corresponding to the pump membrane; The second sealing layer is provided with a through hole on the side facing the part of the outlet valve body, and a sealing gasket is arranged on the surface of the second sealing layer facing away from the outlet valve body, covering the through hole.

29. A micropump characterized by The pump body, the actuator, the first base plate and the second base plate, The pump body has an inlet and an outlet, and the pump body is connected with the actuator; The first base plate is provided with a liquid inlet channel, the first end of the liquid inlet channel is communicated with the inlet, and the other end of the liquid inlet channel is provided with a liquid inlet connector; The first sealing gasket is provided with a first through hole corresponding to the position of the inlet and communicated with the inlet, and the first sealing gasket is pressed on the pump body through the first base plate to realize the sealing of the inlet and the liquid inlet channel; The second base plate is provided with a liquid outlet channel, one end of the liquid outlet channel is communicated with the outlet, and the other end of the liquid outlet channel is provided with a liquid outlet connector; The second sealing gasket is provided with a second through hole corresponding to the position of the outlet and communicated with the outlet, and the second sealing gasket is pressed on the pump body through the second base plate to realize the sealing of the outlet and the liquid outlet channel.

30. The micropump of claim 29, wherein, The tail end of the actuator is fastened to the second base plate through an annular connecting piece, The tail end of the actuator and the second base plate are located in the annular connecting piece, and the position where the annular connecting piece cooperates with the second base plate is provided with an opening, so that the size of the outer periphery of the annular connecting piece can be adjusted to adjust the locking force applied by the annular connecting piece on the actuator and the second base plate.

31. The micropump of claim 30, wherein, The annular connecting piece is provided with a fixing hole on both sides of the opening, and the annular connecting piece is connected with the second base plate through a fastener matched with the fixing hole; and / or, The side of the second base plate connected with the annular connecting piece is provided with a limiting groove, and the annular connecting piece is provided with a limiting boss matched with the limiting groove, and the limiting boss is provided with the opening and the fixing hole.

32. The micropump of claim 29, wherein, The first base plate is provided with a first mounting groove for mounting the pump body, and the first sealing gasket is arranged between the pump body and the groove bottom of the first mounting groove.

33. The micropump according to claim 29 or 32, characterized in that The second base plate is provided with a second mounting groove, and the pump body is embedded in the second base plate through the second mounting groove, and the second sealing gasket is arranged between the pump body and the groove bottom of the second mounting groove.

34. The micropump of claim 29, wherein, A pressure sensor is further arranged for detecting the fluid pressure of the liquid outlet channel, The second base plate is provided with a pressure measuring flow channel communicated with the liquid outlet channel, and the pressure sensor is communicated with the pressure measuring flow channel.

35. The micropump of claim 34, wherein, The second base plate is provided with a third mounting groove communicated with the pressure measuring flow channel, for mounting the pressure sensor, and a third sealing gasket is arranged between the pressure sensor and the groove bottom of the third mounting groove, and the third sealing gasket is used for sealing the pressure sensor and the pressure measuring flow channel, The pressure sensor is pressed in the third mounting groove through a pressure sensor circuit board, and the pressure sensor circuit board is connected with the second base plate.

36. The micropump of claim 29, wherein, The first sealing gasket is matched in shape with the side of the pump body where the inlet is arranged; and / or, The second sealing gasket is matched in shape with the side of the pump body where the outlet is arranged.

37. The micropump of claim 29, wherein, The second substrate is provided with a guide convex ring on the side matched with the pump body, The first substrate is provided with a guide concave groove matched with the guide convex ring, and the first substrate and the second substrate are connected by the guide convex ring and the guide concave groove.

38. The micropump of claim 29, wherein, The inlet connector and the outlet connector are needle-shaped metal tubes.

39. A micropump comprising: a silicon wafer having opposite first and second faces, the first face being provided with a first groove for forming a pump cavity, the silicon wafer being provided with an inlet valve, a moving body and an outlet valve, the inlet valve, the moving body and the outlet valve being connected to the silicon wafer by silicon wafer membranes, the inlet valve being used to introduce fluid into the pump cavity, the outlet valve being used to discharge fluid from the pump cavity, and the moving body being used to drive the opening and closing of the inlet valve and the outlet valve, the outlet valve being a first valve body on the second face; a first cover plate fixed to the first face of the silicon wafer and covering the first groove to form the pump cavity; a second cover plate fixed to the second face of the silicon wafer, the first valve body and the moving body being capable of reciprocating between the first cover plate and the second cover plate, characterized in that the silicon wafer and the moving body are further provided with an annular rib connected to the silicon wafer and the moving body by silicon wafer membranes, the second face is provided with a plurality of grooves, including a first groove between the annular rib and the silicon wafer, a second groove between the annular rib and the moving body, and a third groove between the first valve body and the silicon wafer, the widths of the first groove, the second groove and the third groove being equal to each other.

40. The micropump of claim 39, wherein, the inlet valve being an inlet valve body on the second face, the plurality of grooves further including a fourth groove between the inlet valve body and the silicon wafer, the width of the fourth groove being equal to the width of the first groove.

41. The micropump according to claim 39 or 40, characterized in that the annular rib including a plurality of spaced apart intermittent bodies surrounding the moving body, the widths of the gaps between the intermittent bodies being equal to the width of the first groove.

42. The micropump according to any of claims 39-41, wherein the first valve body including a plurality of spaced apart intermittent bodies, the widths of the gaps between the intermittent bodies being equal to the width of the first groove.

43. The micropump according to claim 41 or 42, characterized in that the intermittent bodies being two concentric rings.

44. The micropump according to any of claims 41-43, wherein, the spaced apart bodies including a plurality of dot matrix distributed circular columns or square columns.

45. The micropump of any of claims 1-8, 19-44, wherein, the outlet valve and / or the inlet valve being a MEMS micro valve, the first cover plate, the silicon wafer and the second cover plate forming a fluid channel, the MEMS micro valve disposed in the fluid channel and used to control the closing and opening of the fluid channel including a valve body, a valve seat and a cantilever beam, the cantilever beam being connected between the valve body and the inner wall of the fluid channel to support the valve body, the valve body being oppositely disposed with the valve seat, the fluid channel being closed when the valve body abuts against the valve seat, and the fluid channel being opened when the valve body is separated from the valve seat; and the cantilever beam and / or the valve body being provided with a separation space between the cantilever beam and / or the valve body and an object to reduce the contact area with the object.

46. The micropump of claim 45, wherein, The inner wall of the opposite fluid passage under the cantilever beam is the object of the cantilever beam, and the separation space is arranged in the first object.

47. The micropump of any preceding claim, wherein, At least one of the outlet valve body and the second sealing layer is thinned to form a liquid outlet cavity of the outlet valve body.

48. The micropump of claim 47, wherein, The height of the liquid outlet cavity is 6-60 microns.

49. A micropump characterized by The micro-pump comprises a pump body, an actuator, a first substrate and a second substrate, wherein the pump body is the micro-pump according to any one of claims 1-28 and 39-48, The pump body has an inlet and an outlet, and the pump body is connected with the actuator; The first substrate is provided with a liquid inlet channel, the first end of the liquid inlet channel is communicated with the inlet, and the other end of the liquid inlet channel is provided with a liquid inlet connector; The first sealing gasket has a first through hole corresponding to the position of the inlet and communicated with the inlet, and the first sealing gasket is pressed on the pump body through the first substrate to realize the sealing of the inlet and the liquid inlet channel; The second substrate is provided with a liquid outlet channel, one end of the liquid outlet channel is communicated with the outlet, and the other end of the liquid outlet channel is provided with a liquid outlet connector; The second sealing gasket has a second through hole corresponding to the position of the outlet and communicated with the outlet, and the second sealing gasket is pressed on the pump body through the second substrate to realize the sealing of the outlet and the liquid outlet channel.

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