Deposition mask for OLED pixel deposition

Abstract

A deposition mask according to an embodiment comprises: a metal plate including one surface and the other surface opposite to the one surface, and including a plurality of through-holes passing through the one surface and the other surface; and a filling member disposed on the inner surface of a first through-hole among the plurality of through-holes in the metal plate, wherein the first through-hole includes: a first small surface hole formed in the one surface of the metal plate; and a first large surface hole formed in the other surface of the metal plate and communicating with the first small surface hole through a communication part, the metal plate includes a first groove provided in the inner surface of the first through-hole, the filling member includes a first filling member disposed in the first groove, and the inner surface of the first through-hole includes a first inner surface formed of the metal plate and a second inner surface formed of the first filling member.

Description

Deposition mask for OLED pixel deposition

[0001] The embodiment relates to a deposition mask for OLED pixel deposition.

[0002] Display devices are applied and used in a variety of devices. For example, display devices are used in small devices such as smartphones and tablet PCs. Display devices are also used in large devices such as TVs, monitors, and public displays (PDs).

[0003] Recently, demand for high-resolution displays, such as UHD (Ultra High Definition) or QDD (Quad High Definition), with resolutions exceeding 500 PPI (Pixels Per Inch), has been increasing. Consequently, interest in technologies that deliver low power and high resolution is growing.

[0004] Commonly used display devices can be categorized into LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode) depending on their driving method. OLED is a display device driven by organic materials. OLED does not require a separate light source. The organic material itself serves as the light source. Therefore, OLED can be operated with low power consumption.

[0005] In OLEDs, the organic material contained in the light-emitting layer is deposited on a substrate using a deposition mask. The organic material is deposited in a deposition pattern corresponding to the aperture pattern formed in the deposition mask. Accordingly, the deposition pattern can function as a pixel.

[0006] Typically, a deposition mask is manufactured from a metal plate made of an Invar alloy containing iron (Fe) and nickel (Ni). Through holes are formed through one surface and the other surface of the metal plate. These through holes can be formed at positions corresponding to pixel patterns. Accordingly, organic materials, such as red, green, and blue, can pass through the through holes of the metal plate and be deposited on the substrate. Consequently, a pixel pattern can be formed on the substrate.

[0007] A deposition mask includes a small hole formed on one surface of a metal plate and a large hole formed on the other surface of the metal plate. The through holes are connected by a connecting portion connecting the small hole and the large hole. An organic substance is sprayed in the direction in which the through holes of the deposition mask are located. The organic substance is deposited on a deposition substrate using the large hole as an inlet and the small hole as an outlet. Specifically, a plurality of strip-shaped deposition masks are arranged on the deposition substrate. The organic substance moves toward the small hole through the large hole of the plurality of deposition masks.

[0008] Meanwhile, the above-described deposition mask may have defects in the process of forming a through hole, or may have defects due to defects in the raw material (e.g., Invar alloy).

[0009] Here, defects include defects in an area with a through hole and defects in an area without a through hole. For example, defects in an area with a through hole include a groove-like defect on the inside of the through hole (e.g., the inside surface of at least one of a facing hole, a small hole, and a connecting portion). Furthermore, defects in an area without a through hole include a groove-like defect on one or the other surface of the fine metal mask due to a defect in the raw material.

[0010] In this case, if a defect such as the one described above occurs, the deposition efficiency in the organic material deposition process may be reduced. Alternatively, discoloration may occur due to adjacent pixels being connected to each other, resulting in a decrease in yield.

[0011] The embodiment provides a deposition mask for OLED pixel deposition with improved deposition efficiency.

[0012] Additionally, the embodiment provides a deposition mask for OLED pixel deposition that enables repair of a defective area.

[0013] The technical tasks to be achieved in the proposed embodiment are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the proposed embodiment belongs from the description below.

[0014] A deposition mask according to an embodiment comprises: a metal plate including one surface and an opposite surface to the one surface, and including a plurality of through holes penetrating the one surface and the opposite surface; and a filling member disposed on an inner surface of a first through hole among the plurality of through holes of the metal plate, wherein the first through hole includes a first small-surface hole formed on the one surface of the metal plate and a first opposing surface hole formed on the other surface of the metal plate and communicating with the first small-surface hole through a communication portion, the metal plate including a first groove provided on an inner surface of the first through hole, the filling member including a first filling member disposed within the first groove, and an inner surface of the first through hole including a first inner surface formed of the metal plate and a second inner surface formed of the first filling member.

[0015] Additionally, the first groove is provided in at least one of the first small hole, the first large hole, and the communication portion.

[0016] In addition, the first groove is provided in the communication portion, and the first inner side includes a first portion connected to the one side, spaced apart from the communication portion, and corresponding to the inner side of the first small-faced hole, and a second portion connected to the other side, spaced apart from the communication portion, and corresponding to the inner side of the first large-faced hole, and the second inner side is provided between the first portion and the second portion.

[0017] Additionally, the second inner side is not connected to the one side and the other side of the metal plate.

[0018] In addition, the first groove is provided in the first small hole and the communication portion, and the second inner surface is connected to the one surface of the metal plate.

[0019] Additionally, the first groove extends from the inner surface of the first through hole and is further provided on at least a portion of the one surface of the metal plate.

[0020] In addition, the first groove is provided in the first facing hole, the first inner side includes a first portion connected to the first side and the communicating portion and corresponding to the inner side of the first facing hole, and a second portion connected to the other side and spaced apart from the communicating portion and corresponding to the inner side of the first facing hole, and the second inner side is provided between the first portion and the second portion.

[0021] Additionally, the metal plate further includes a second groove provided on the one surface and not connected to the inner surface of the plurality of through holes, and the filling member includes a second filling member disposed within the second groove.

[0022] In addition, the deposition mask further includes a rib provided between two adjacent through holes among the plurality of through holes, the metal plate further includes a third groove provided in the rib, the filling member further includes a third filling member arranged in the third groove, and each of the two adjacent through holes includes an inner surface formed of the third filling member and connected to each other.

[0023] In addition, the deposition mask further includes an island portion provided between two adjacent through holes among the plurality of through holes and corresponding to the other surface of the metal plate, the metal plate further includes a fourth groove provided in the island portion, and the filling member further includes a fourth filling member disposed within the fourth groove.

[0024] Additionally, the filling member includes a metal material different from the metal material constituting the metal plate.

[0025] In addition, the metal plate is an alloy containing at least two metal materials,

[0026] The above filling member includes at least one of the two metal materials.

[0027] In addition, each of the metal plate and the filling member is an alloy containing nickel and iron, and in the metal plate, the nickel content is less than the iron content, and in the filling member, the nickel content is greater than the iron content.

[0028] Additionally, the metal plate is an alloy containing nickel and iron, and the filling member contains nickel.

[0029] Additionally, the surface roughness value or reflectance of the first inner surface is different from the surface roughness value or reflectance of the second inner surface.

[0030] Additionally, the difference between the potential value of the filling member and the potential value of the metal plate is 2 eV or less.

[0031] The deposition mask of the embodiment includes a metal plate having a through hole. At this time, the metal plate may include at least one groove. The groove may be provided in at least one area of ​​an inner surface of a through hole of the metal plate, one surface of the metal plate, the other surface of the metal plate, a lead between a plurality of through holes, and an island portion between a plurality of through holes. The groove may act as a factor causing a product defect of the deposition mask. Therefore, the embodiment may include a filling member that fills the groove. That is, the embodiment fills the groove with the filling member so that the deposition mask is repaired.

[0032] Therefore, the embodiment can resolve deposition defects that may occur due to the groove, thereby improving deposition quality. Furthermore, the embodiment can enable the reuse of deposition masks that would otherwise be discarded due to defects, thereby further improving product satisfaction and / or user satisfaction.

[0033] At this time, the filling member may be made of an alloy containing the same metal material as the alloy constituting the metal plate, and the content of each metal material of the alloy constituting the filling member may be different from the content of each metal material of the alloy constituting the metal plate.

[0034] That is, the filling member may be formed of a nickel-iron alloy containing nickel and iron. At this time, the nickel content and iron content in the nickel-iron alloy constituting the filling member may be different from the nickel content and iron content in the iron-nickel alloy constituting the metal plate. Preferably, the iron content in the iron-nickel alloy constituting the metal plate is higher than the nickel content. Alternatively, the iron content in the nickel-iron alloy constituting the filling member is lower than the nickel content. Through this, the embodiment allows the filling member to include the same metal material as at least one of the metal materials constituting the metal plate. Therefore, when repairing a groove by filling it using the filling member, the embodiment can further improve the adhesion between the filling member and the metal plate. Therefore, the embodiment can solve the problem of the repaired filling member separating from the metal plate, and can further improve product reliability accordingly. Furthermore, the embodiment can further improve the adhesion between the metal plate and the filling member by providing the filling member with a nickel-iron alloy having a higher nickel content than the iron content, which has a relatively high adhesion to the metal plate.

[0035] Additionally, the filler material may contain only nickel. When the filler material contains only nickel, the process cost in the repair process can be reduced, and the adhesion between the filler material and the metal plate can be improved.

[0036] Furthermore, the embodiment can adjust the potential value of the filling member and the potential value of the metal plate to a similar level. For example, the difference between the potential value of the filling member and the potential value of the metal plate of the embodiment can be 2 eV or less. For example, the potential value of the filling member can be ±2 eV of the difference between the potential value of the metal plate. Through this, the embodiment can make the filling member and the metal plate have similar potential values. At this time, the deposition mask can be cleaned through electrolytic cleaning. In addition, if the difference between the potential values ​​of the filling member and the metal plate is large, the cleaning power may be reduced due to the difference in the potential values ​​in the cleaning process. In contrast, the embodiment can improve the cleaning power in the cleaning process by making the difference between the potential values ​​of the filling member and the metal plate ±2 eV.

[0037] Therefore, the surface roughness value of the filling member may be different from the surface roughness value of the metal plate. In this case, a groove may be provided on the inner surface of the through hole, and the filling member may be provided to fill the groove on the inner surface of the through hole.

[0038] Accordingly, the inner surface of the through hole may include a first portion formed of a metal plate and a second portion positioned on the first portion and formed of a filling member. In addition, the first portion and the second portion of the inner surface of the through hole may have different surface roughness values. For example, the reason why the first portion and the second portion of the inner surface of the through hole have different surface roughness values ​​may be because the metal material forming the metal plate and the metal material forming the filling member have different properties. Alternatively, the surface roughness value of the metal plate and the surface roughness value of the filling member may be formed in different ways. Preferably, the surface roughness value of the first portion of the inner surface of the through hole may be greater than the surface roughness value of the second portion. For example, the surface roughness value of the portion formed of the filling member may be less than the surface roughness value of the portion formed of the metal plate. At this time, if the surface roughness value of the part repaired through the filling member is greater than the surface roughness value of the part composed of the metal plate, the deposition quality may be deteriorated by the inner surface of the filling member having a relatively large surface roughness value, and the deposition resolution may be deteriorated accordingly. Therefore, the embodiment makes it possible to prevent the deposition quality of the repaired part from being deteriorated by making the surface roughness value of the second part of the inner surface of the through hole composed of the filling member smaller than the surface roughness value of the first part of the inner surface of the through hole composed of the metal plate, and thereby further improve the deposition resolution.

[0039] In addition, the reflectivity of the first part of the inner surface of the through hole may be different from the reflectivity of the second part of the inner surface of the through hole. That is, the reflectivity of the first part of the inner surface of the through hole formed of a metal plate may be different from the reflectivity of the second part of the inner surface of the through hole formed of a filling member. Accordingly, the embodiment can enable easy confirmation of the repaired portion through the difference in reflectivity between the first part and the second part of the inner surface of the through hole. Accordingly, the embodiment can easily conduct inspection of the deposition pattern deposited in the repaired portion, and can easily select an area where a deposition defect may occur accordingly.

[0040] Figure 1 is a drawing for explaining the bonding relationship between a deposition mask and a frame according to an embodiment.

[0041] FIG. 2 is a cross-sectional view showing an organic material deposition device including a deposition mask according to an embodiment.

[0042] FIG. 3 is a drawing illustrating a deposition mask according to an embodiment being tensioned to be placed on a mask frame.

[0043] FIG. 4 is a drawing illustrating the formation of multiple deposition patterns on a substrate through multiple through holes of a deposition mask.

[0044] FIG. 5 is a drawing showing a plan view of a deposition mask according to an embodiment.

[0045] FIG. 6 is a drawing showing a plan view of an effective portion of a deposition mask according to one embodiment.

[0046] FIG. 7a is a drawing showing a deposition mask in a defective state according to the first embodiment.

[0047] FIG. 7b is a drawing showing a repaired deposition mask according to the first embodiment.

[0048] FIG. 8 is a drawing showing a repaired deposition mask according to the second embodiment.

[0049] FIG. 9 is a drawing showing a repaired deposition mask according to the third embodiment.

[0050] FIG. 10 is a drawing showing a repaired deposition mask according to the fourth embodiment.

[0051] Fig. 11 is a drawing showing a repaired deposition mask according to the fifth embodiment.

[0052] Fig. 12 is a drawing showing a repaired deposition mask according to the sixth embodiment.

[0053] Fig. 13 is a drawing showing a repaired deposition mask according to the seventh embodiment.

[0054] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and one or more of the components between the embodiments can be selectively combined or substituted within the scope of the technical idea of ​​the present invention. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can be interpreted in consideration of the contextual meaning of the related technology.

[0055] In addition, the terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “and (and) at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0056] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0057] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0058] Additionally, when described as being formed or disposed "above or below" each component, above or below includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components.

[0059] Additionally, when expressed as “upper or lower,” it can include the meaning of not only the upward direction but also the downward direction based on one component.

[0060]

[0061] The deposition mask described below enables the deposition of organic materials such as red, green, and blue on a deposition substrate. For example, the deposition mask described below may be a fine metal mask (FMM) capable of forming RGB pixel patterns on a deposition substrate. Alternatively, the deposition mask described below may be an open mask.

[0062]

[0063] A deposition mask according to an embodiment is described with reference to the drawings below.

[0064] FIG. 1 is a drawing for explaining the coupling relationship between a deposition mask and a frame according to an embodiment, FIG. 2 is a cross-sectional view showing an organic material deposition device including a deposition mask according to an embodiment, and FIG. 3 is a drawing illustrating a deposition mask (100) according to an embodiment being tensioned to be placed on a mask frame (200). In addition, FIG. 4 is a drawing illustrating a plurality of deposition patterns being formed on a substrate (300) through a plurality of through holes of the deposition mask (100).

[0065] Referring to FIGS. 1 to 4, the organic material deposition device may include a deposition mask (100), a mask frame (200), a substrate (300), an organic material deposition vessel (400), and a vacuum chamber (500).

[0066] The deposition mask (100) may include a metal. For example, the deposition mask (100) may be an alloy. Preferably, the deposition mask (100) may be an Invar alloy including iron (Fe) and nickel (Ni).

[0067] The deposition mask (100) may include a plurality of through holes (TH) in an effective area for deposition. The deposition mask (100) may be a substrate for a deposition mask including a plurality of through holes (TH). In this case, the through holes may be formed to correspond to a deposition pattern to be formed on the substrate. The deposition mask (100) may include an ineffective area other than an effective area including a deposition region.

[0068] The mask frame (200) may include an opening (205). A plurality of through holes (TH) of the deposition mask (100) may be arranged on an area corresponding to the opening (205) of the mask frame (200). Accordingly, an organic material supplied to the organic material deposition container (400) may be deposited on the substrate (300). The deposition mask (100) may be arranged and fixed on the mask frame (200). For example, the deposition mask (100) may be tensioned with a constant tensile force and fixed on the mask frame (200) by welding.

[0069] That is, the mask frame (200) includes a plurality of frames (201, 202, 203, 204) surrounding the opening (205). The plurality of frames (20, 202, 203, 204) may be connected to each other. The mask frame (200) includes a first frame (201) and a second frame (202) facing each other in the X direction and extending along the Y direction, and includes a third frame (203) and a fourth frame (204) facing each other in the Y direction and extending along the X direction. The first frame (201), the second frame (202), the third frame (203), and the fourth frame (204) may be rectangular frames that are connected to each other. The mask frame (200) may be manufactured from a material that is less deformed when the mask (130) is welded, for example, a metal with high rigidity.

[0070] The deposition mask (100) can be tensioned in opposite directions at the edges disposed at the outermost ends of the deposition mask (100). In the longitudinal direction of the deposition mask (100), one end of the deposition mask (100) and the other end opposite to the one end can be pulled in opposite directions. Therefore, the tension direction of the deposition mask (100), the X-axis direction, and the longitudinal direction of the deposition mask can all be in the same direction.

[0071] One end and the other end of the deposition mask (100) may be arranged parallel to each other while facing each other. The one end of the deposition mask (100) may be any one of the ends forming the four side surfaces arranged at the outermost portion of the deposition mask (100). For example, the deposition mask (100) may be tensioned with a tensile force of about 0.1 kgf to about 2 kgf. In detail, the deposition mask may be tensioned with a tensile force of 0.4 kgf to about 1.5 kgf and fixed on the mask frame (200). Accordingly, the stress of the deposition mask (100) may be reduced. However, the embodiment is not limited thereto, and the deposition mask (100) may be tensioned with various tensile forces capable of reducing the stress of the deposition mask and fixed on the mask frame (200).

[0072] Next, the deposition mask (100) can be fixed to the mask frame (200) by welding the ineffective portion of the deposition mask (100). Next, a portion of the deposition mask (100) positioned outside the mask frame (200) can be removed by cutting or the like.

[0073] The substrate (300) may be a substrate used in the manufacture of a display device. For example, the substrate (300) may be a substrate (300) for organic material deposition for an OLED pixel pattern. Red, green, and blue organic material patterns may be formed on the substrate (300) to form pixels, which are the three primary colors of light. That is, an RGB pattern may be formed on the substrate (300).

[0074] The organic deposition vessel (400) may be a crucible. An organic material may be placed inside the crucible. The organic deposition vessel (400) may be moved within the vacuum chamber (500). That is, the organic deposition vessel (400) may be moved in the Y-axis direction within the vacuum chamber (500). That is, the organic deposition vessel (400) may be moved in the width direction of the deposition mask (100) within the vacuum chamber (500). That is, the organic deposition vessel (400) may be moved in a direction perpendicular to the tensile direction of the deposition mask (100) within the vacuum chamber (500).

[0075] As a heat source and / or current is supplied to the crucible, which is an organic material deposition vessel (400) within a vacuum chamber (500), an organic material can be deposited on a substrate (100).

[0076]

[0077] Referring to FIG. 4, the deposition mask (100) may include one side (101) and the other side (102) opposite to the one side.

[0078] The deposition mask (100) may include a through hole (TH). For example, a small hole (V1) may be provided on one surface (101) of the deposition mask (100), and a large hole (V2) may be provided on the other surface (102) of the deposition mask (100). For example, a plurality of small holes (V1) and a plurality of large holes (V2) may be provided on each of the one surface (101) and the other surface (102) of the deposition mask (100). In addition, the through holes (TH) of the deposition mask (100) may be connected by a connecting portion (CA) connecting the boundaries of the small holes (V1) and the large holes (V2).

[0079] In addition, the inner surface of the through hole (TH) of the deposition mask (100) may include a first inner surface (ES1) within a small-faced hole (V1). The inner surface of the through hole (TH) of the deposition mask (100) may include a second inner surface (ES2) within a large-faced hole (V2). The through hole (TH) may be formed by the first inner surface (ES1) within the small-faced hole (V1) and the second inner surface (ES2) within the large-faced hole (V2) being in communication with each other. For example, the first inner surface (ES1) within one small-faced hole (V1) and the second inner surface (ES2) within one large-faced hole (V2) may be in communication with each other to form the inner surface of one through hole (TH).

[0080] The width of the facing hole (V2) may be greater than the width of the small hole (V1). In this case, the width of the small hole (V1) may be measured on one side (101) of the deposition mask (100), and the width of the facing hole (V2) may be measured on the other side (102) of the deposition mask (100).

[0081] The small hole (V1) may be arranged toward the substrate (300). The small hole (V1) may be arranged close to the substrate (300). Accordingly, the small hole (V1) may have a shape corresponding to the deposition material, i.e., the deposition pattern (DP).

[0082] The facing hole (V2) can be positioned toward the organic material deposition container (400). Accordingly, the facing hole (V2) can accommodate the organic material supplied from the organic material deposition container (400) over a wide width, and a fine pattern can be quickly formed on the substrate (300) through the small hole (V1) having a smaller width than the facing hole (V2).

[0083]

[0084] Fig. 5 is a drawing showing a plan view of a deposition mask (100) according to an embodiment. With reference to Fig. 5, the deposition mask (100) will be described in more detail.

[0085] Referring to FIG. 5, a deposition mask (100) according to an embodiment may include a deposition area (DA) and a non-deposition area (NDA).

[0086] The deposition area (DA) may be a region for forming a deposition pattern. The deposition area (DA) may include a pattern area and a non-pattern area. The pattern area may refer to a region in which a through hole (TH) is formed. In addition, the non-pattern area may refer to a region in which a through hole (TH) is not formed. For example, the deposition area (DA) may be a region provided with a small hole (V1), a large hole (V2), a through hole (TH), and an island portion (IS).

[0087] Additionally, a single deposition mask (100) may include a plurality of deposition areas (DA). For example, the deposition area (DA) of the embodiment may include a plurality of effective areas (AA1, AA2, AA3) capable of forming a plurality of deposition patterns. For example, the pattern area of ​​the deposition area (DA) may include a plurality of effective areas (AA1, AA2, AA3).

[0088] The plurality of effective portions (AA1, AA2, AA3) may include a first effective portion (AA1), a second effective portion (AA2), and a third effective portion (AA3). Here, one deposition area (DA) may be any one of the first effective portion (AA1), the second effective portion (AA2), and the third effective portion (AA3).

[0089] In the case of a small display device such as a smartphone, any one effective portion of a plurality of deposition regions included in a deposition mask (100) may be used to form a single display device. Accordingly, a single deposition mask (100) may include a plurality of effective portions, thereby enabling the simultaneous formation of multiple display devices. Accordingly, the deposition mask (100) according to the embodiment may improve process efficiency.

[0090] In contrast, in the case of a large display device such as a television, multiple effective portions included in a single deposition mask (100) may be part of forming a single display device. In this case, the multiple effective portions may be for preventing deformation due to the load of the mask.

[0091] The deposition area (DA) may include a plurality of separation areas (IA1, IA2) included in one deposition mask (100). The separation areas (IA1, IA2) may be arranged between adjacent effective areas. The separation areas (IA1, IA2) may be separation areas between the plurality of effective areas. For example, the first separation area (IA1) may be arranged between the first effective area (AA1) and the second effective area (AA2). In addition, the second separation area (IA2) may be arranged between the second effective area (AA2) and the third effective area (AA3). That is, adjacent effective areas can be distinguished from each other by the separation areas (IA1, IA2), and one deposition mask (100) can support a plurality of effective areas.

[0092] The deposition mask (100) may include a non-deposition area (NDA) provided on both longitudinal sides of the deposition area (DA). For example, the deposition mask (100) according to the embodiment may include a non-deposition area (NDA) on both horizontal sides of the deposition area (DA). The non-deposition area (NDA) of the deposition mask (100) may be an area that does not participate in deposition. The non-deposition area (NDA) may include a frame fixing area (FA1, FA2) for fixing the deposition mask (100) to a mask frame (200). In addition, the non-deposition area (NDA) may include a half-etching portion (HF1, HF2).

[0093] The half-etched portion (HF1, HF2) may also be formed in the frame fixing area (FA1, FA2) and / or the peripheral area of ​​the frame fixing area (FA1, FA2). Accordingly, the stress of the deposition mask (100) that occurs when fixing the deposition mask (100) to the mask frame (200) and / or when depositing an organic material after fixing the deposition mask (100) to the mask frame (200) can be uniformly distributed. Accordingly, the deposition mask (100) can be maintained to have uniform through holes.

[0094] The non-deposition area (NDA) may include a frame fixing area (FA1, FA2) for fixing the deposition mask (100) to the mask frame (200). The fixing area (FA1, FA2) may be an area fixed to the mask frame (200) by welding.

[0095] The deposition mask (100) may include a plurality of effective portions (AA1, AA2, AA3) spaced apart in the length direction and an ineffective portion (UA) excluding the effective portions (AA1, AA2, AA3). In detail, the deposition area (DA) of the deposition mask (100) may include a plurality of effective portions (AA1, AA2, AA3) and an ineffective portion (UA) excluding the effective portions (AA).

[0096] The effective portions (AA1, AA2, AA3) may include a plurality of small holes (V1) formed on one surface of the deposition mask (100), a plurality of large holes (V2) formed on the other surface opposite to the one surface, and a through hole (TH) formed by a connecting portion (CA) connecting the boundaries of the small holes (V1) and the large holes (V2).

[0097] Additionally, the effective portions (AA1, AA2, AA3) may include an island portion (IS) supporting between a plurality of through holes (TH).

[0098] An island portion (IS) may be located between adjacent through holes (TH) among a plurality of through holes (TH). That is, an area other than the through holes (TH) in the effective area (AA1, AA2, AA3) of the deposition mask (100) may be an island portion (IS).

[0099] The island portion (IS) may refer to an unetched portion on one surface (101) or the other surface (102) of the effective portion of the deposition mask. In detail, the island portion (IS) may be an unetched area between through holes (TH) on the other surface (102) where the facing hole (V2) of the effective portion of the deposition mask (100) is formed. Accordingly, the island portion (IS) may be arranged parallel to one surface (101) of the deposition mask (100). In detail, the upper surface of the island portion (IS) may be arranged parallel to the one surface (101).

[0100] The island portion (IS) may have different widths in the longitudinal direction (W1) and in the horizontal direction. That is, the island portion (IS) may have a width in the longitudinal direction (W1) that is greater than the width in the horizontal direction (W2).

[0101] The deposition mask (100) may include an inactive area (UA) positioned outside the active area (AA1, AA2, AA3). The inactive area (UA) may include an outer area (OA1, OA2, OA3) surrounding the outer area of ​​the active area (AA1, AA2, AA3).

[0102]

[0103] FIG. 6 is a drawing showing a plan view of an effective portion of a deposition mask (100) according to one embodiment.

[0104] Referring to FIG. 6, the deposition mask (100) may include a plurality of through holes (TH). At this time, as illustrated in FIG. 6, the through holes (TH) may be arranged in a row along the direction, but is not limited thereto. For example, the through holes (TH) may be arranged in an alternating direction. Hereinafter, an embodiment in which a plurality of through holes (TH) are arranged in a row along the vertical or horizontal axis will be described.

[0105] The deposition mask (100) may include a plurality of through holes (TH). At this time, the plurality of through holes (TH) may have a circular shape. In detail, the through holes (TH) may have a horizontal diameter (Cx) and a vertical diameter (Cy) value, and the horizontal diameter (Cx) and the vertical diameter (Cy) values ​​of the through holes (TH) may correspond to each other.

[0106] The through holes (TH) may be arranged in a row along the direction. For example, the through holes (TH) may be arranged in a row along the longitudinal axis and the transverse axis. Specifically, the first through hole (TH1) and the second through hole (TH2) may be arranged in a row along the transverse axis, and the third through hole (TH1) and the fourth through hole (TH4) may be arranged in a row along the longitudinal axis.

[0107] Additionally, the first through hole (TH1) and the third through hole (TH3) can be arranged in a row on the longitudinal axis, and the second through hole (TH2) and the fourth through hole (TH4) can be arranged in a row on the transverse axis.

[0108] That is, when the through holes (TH) are arranged in a row along the longitudinal and transverse axes, an island (IS) can be located between two diagonally adjacent through holes (TH) that intersect both the longitudinal and transverse axes. That is, an island (IS) can be located between two adjacent through holes (TH) that are located diagonally from each other.

[0109] For example, an island portion (IS) may be arranged between the first through hole (TH1) and the fourth through hole (TH4). In addition, an island portion (IS) may be arranged between the second through hole (TH2) and the third through hole (TH3). The island portions (IS) may be positioned in an inclination direction of about +45 degrees or about -45 degrees with respect to a horizontal axis crossing two adjacent through holes. Here, an inclination direction of about ±45 degrees may refer to a diagonal direction between the horizontal axis and the vertical axis, and the diagonal inclination angle may be measured on the same plane of the horizontal axis and the vertical axis.

[0110] Additionally, the deposition mask (100) may include ribs (RB1, RB2) provided between the through holes (TH). For example, one second rib (RB2) may be provided between a first through hole (TH1) and a second through hole (TH2) that are horizontally adjacent to each other. Additionally, another first rib (RB1) may be provided between a first through hole (TH1) and a third through hole (TH3) that are vertically adjacent to each other.

[0111] The first rib (RB1) is arranged to extend in the longitudinal direction on the deposition mask (100). The first rib (RB1) is positioned in the longitudinal direction between a plurality of through holes arranged in the width direction on the deposition mask (100). The first rib (RB1) connects between a plurality of island portions (IS) arranged in the longitudinal direction on the deposition mask (100).

[0112] The second rib (RB2) is arranged to extend in the width direction on the deposition mask (100). The second rib (RB2) is formed in the width direction between a plurality of through holes arranged in the length direction on the deposition mask (100). The second rib (RB2) connects between a plurality of islands (IS) arranged in the width direction on the deposition mask (100).

[0113]

[0114] Meanwhile, the deposition mask (100) as described above may be provided with a groove corresponding to an area formed larger than the target size of a plurality of through holes. The groove may refer to an expanded area of ​​a specific through hole with an expanded size among the plurality of through holes of the deposition mask (100). For example, the groove may be provided on the inner surface of the through hole (TH) of the deposition mask (100), and may be provided concavely in a direction away from the through hole (TH) from the inner surface of the through hole (TH). In addition, the groove may be formed at a location other than the inner surface of the through hole (TH).

[0115] If the deposition mask (100) is provided with grooves as described above, the deposition quality may deteriorate, resulting in product defects. In this case, the deposition mask (100) provided with grooves may not be used for deposition and may be discarded.

[0116] The embodiment allows the groove provided in the deposition mask (100) to be filled with a metal material so that it can be repaired.

[0117] Hereinafter, a defective deposition mask (100A) having a groove according to an embodiment and a repaired deposition mask (100) by filling the groove of the deposition mask (100) with a metal material will be described.

[0118] Fig. 7a is a drawing showing a defective deposition mask according to the first embodiment, and Fig. 7b is a drawing showing a repaired deposition mask according to the first embodiment. Figs. 7a and 7b are cross-sectional views taken along the AA' direction of Fig. 6 in a defective area having a first groove.

[0119] Referring to FIGS. 7a and 7b, the deposition mask (100) of the first embodiment may include a metal plate (110).

[0120] The metal plate (110) may be a basic member that serves as a basis for manufacturing a deposition mask (100). The metal plate (110) may include nickel (Ni). Specifically, the metal plate (110) may include iron (Fe) and nickel (Ni). More specifically, the metal plate (110) may include iron (Fe), nickel (Ni), oxygen (O), and chromium (Cr). In addition, the metal plate (110) may be invar that further includes at least one element from among a small amount of carbon (C), silicon (Si), sulfur (S), phosphorus (P), manganese (Mn), titanium (Ti), cobalt (Co), copper (Cu), silver (Ag), vanadium (V), niobium (Nb), indium (In), and antimony (Sb). Invar is an alloy including iron and nickel and is a low thermal expansion alloy with a thermal expansion coefficient close to 0. That is, since Invar has a very small coefficient of thermal expansion, it is used in precision parts such as masks and precision devices. Accordingly, a deposition mask manufactured using a metal plate (110) can have improved reliability, can prevent deformation, and can also have an extended lifespan.

[0121] The metal plate (110) may contain iron in a range of about 60 wt% to about 65 wt%. Additionally, the metal plate (110) may contain nickel in a range of about 35 wt% to about 40 wt%. Specifically, the metal plate (110) may be provided as an alloy containing a certain content of nickel and iron, and the content of iron in the above-described alloy may be higher than the content of nickel. Through this, when manufacturing a deposition mask (100) using the metal plate (110), through holes (TH) having a uniform size and spacing can be formed. Accordingly, the deposition quality of the deposition mask (100) can be improved.

[0122] The metal plate (110) includes one surface and the other surface. A small hole (V1) may be formed on one surface of the metal plate (110), and a facing hole (V2) may be formed on the other surface of the metal plate (110). At this time, the small hole (V1) and the facing hole (V2) may be connected to each other in a boundary region, thereby forming a through hole (TH). For example, the through hole (TH) may include a small hole (V1) formed on one surface of the metal plate (110), and a facing hole (V2) formed on the other surface of the metal plate (110) and connected to the small hole (V1).

[0123] At this time, the metal plate (110) may include a first groove (R1). The first groove (R1) may refer to a defective area having a size larger than the target size in the through hole (TH). For example, at least one through hole (TH) among the plurality of through holes (TH) may include a defective area having a size larger than the sizes of other through holes. In addition, the above-described defective area may refer to a first groove (R1) that is provided in a concave manner inwardly on the inner surface of the through hole (TH) as illustrated in FIG. 7A.

[0124] The first groove (R1) may be provided on the inner surface of the through hole (TH). The first groove (R1) may be provided in a boundary area between the inner surface of the small hole (V1) of the through hole (TH) and the inner surface of the facing hole (V2). For example, the first groove (R1) may be located at a communicating portion where the small hole (V1) and the facing hole (V2) are in communication. For example, the first groove (R1) may be a portion where a part of the inner surface of the small hole (V1) and a part of the inner surface of the facing hole (V2) are recessed inwardly, which are connected to each other.

[0125] In addition, the embodiment may include a first filling member (120a) that fills the first groove (R1) described above. The first filling member (120a) may be positioned within the first groove (R1), thereby allowing the width of the through hole (TH) at the location where the first groove (R1) is provided to have a target width.

[0126] The first filling member (120a) may include a metal material. For example, the first filling member (120a) may be formed of a metal material having different properties from the metal material constituting the metal plate (110). Here, the above-described properties may refer to at least one of a surface roughness value, reflectivity, and a potential value.

[0127] For example, the first filling member (120a) may be made of an alloy including the same metal material as the alloy constituting the metal plate (110), and the content of each metal material of the alloy constituting the first filling member (120a) may be different from the content of each metal material of the alloy constituting the metal plate (110).

[0128] For example, the first filling member (120a) may be formed of a nickel-iron alloy including nickel and iron. At this time, the nickel content and iron content in the nickel-iron alloy constituting the first filling member (120a) may be different from the nickel content and iron content in the iron-nickel alloy constituting the metal plate (110). Preferably, the iron content in the iron-nickel alloy constituting the metal plate (110) is higher than the nickel content. Alternatively, the iron content in the nickel-iron alloy constituting the first filling member (120a) is lower than the nickel content. Through this, the embodiment allows the first filling member (120a) to include the same metal material as at least one of the metal materials constituting the metal plate (110). Therefore, in the embodiment, when repair is performed by filling the first groove (R1) using the first filling member (120a), the adhesion between the first filling member (120a) and the metal plate (110) can be further improved. Therefore, the embodiment can solve the problem of the repaired first filling member (120a) being separated from the metal plate (110), and thus, product reliability can be further improved. Furthermore, the embodiment can further improve the adhesion between the metal plate (110) and the first filling member (120a) by providing the first filling member (120a) with a nickel-iron alloy in which the nickel content, which has a relatively high adhesion to the metal plate (110), is higher than the iron content.

[0129] As another example, the first filling member (120a) may contain only nickel. Furthermore, when the first filling member (120a) contains only nickel, the process cost in the repair process can be reduced, and the adhesion between the first filling member (120a) and the metal plate (110) can be improved.

[0130] Furthermore, the embodiment can adjust the potential value of the first filling member (120a) and the potential value of the metal plate (110) to a similar level. For example, the difference value between the potential value of the first filling member (120a) of the embodiment and the potential value of the metal plate (110) may be 2 eV or less. For example, the potential value of the first filling member (120a) may be ±2 eV of the difference value of the potential value of the metal plate (110). Through this, the embodiment can make the first filling member (120a) and the metal plate (110) have similar potential values. At this time, the deposition mask (100) can be cleaned through electrolytic cleaning. In addition, when the difference between the potential values ​​of the first filling member (120a) and the metal plate (110) is large, the cleaning power may be reduced due to the difference in potential values ​​in the cleaning process. In contrast, the embodiment can improve the cleaning power in the cleaning process by making the difference between the potential values ​​of the first filling member (120a) and the metal plate (110) be ±2 eV.

[0131] Accordingly, the surface roughness value of the first filling member (120a) may be different from the surface roughness value of the metal plate (110).

[0132] The inner surface of the through hole (TH) includes the inner surface (ES1) of the small hole (V1) and the inner surface (ES2) of the large hole (V2).

[0133] The inner surface (ES1) of the small hole (V1) may include a first portion (ES1-1) formed of a metal plate (110) and a second portion (ES1-2) positioned on the first portion (ES1-1) and formed of a first filling member (120a). At this time, the second portion (ES1-2) of the inner surface (ES1) of the small hole (V1) may be positioned higher than the first portion (ES1-1). For example, the second portion (ES1-2) of the inner surface (ES1) of the small hole (V1) may not be connected to one side and the other side of the metal plate (110). This is because the first groove (R1) is positioned at a communicating portion where the small hole (V1) and the facing hole (V2) communicate.

[0134] At this time, the first part (ES1-1) and the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) may have different surface roughness values. For example, the reason why the first part (ES1-1) and the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) have different surface roughness values ​​may be because the metal material constituting the metal plate (110) and the metal material constituting the first filling member (120a) have different properties. Alternatively, it may be because the small hole (V1) in the metal plate (110) and the small hole (V1) in the first filling member (120a) are formed in different ways. For example, the first part (ES1-1) of the inner surface (ES1) of the small hole (V1) may be a part formed by removing the metal plate (110) by etching, and the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) may be a part formed by processing the first filling member (120a) with a laser.

[0135] Specifically, the first filling member (120a) in the example can be formed in the following manner.

[0136] 1) The first filling member (120a) is primarily formed in the first groove (R1) through plating, deposition, or coating.

[0137] 2) The first filling member (120a) formed above is processed with a laser so that the through hole (TH) has the target size.

[0138] Accordingly, the first part (ES1-1) of the inner surface (ES1) of the small hole (V1) may be an etched surface, and the second part (ES1-2) may be a laser-processed surface, and accordingly, they may have different surface roughness values.

[0139] However, the embodiment is not limited thereto, and the above 2) process can have a target size by removing the first filling member (120a) that is primarily formed by etching. At this time, the metal material constituting the first filling member (120a) and the metal material constituting the metal plate (110) may be different from each other, and accordingly, the first part (ES1-1) and the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) may have different surface roughness values.

[0140] Preferably, the surface roughness value of the first portion (ES1-1) of the inner surface (ES1) of the small hole (V1) may be greater than the surface roughness value of the second portion (ES1-2). For example, the surface roughness value of the portion formed by the first filling member (120a) may be less than the surface roughness value of the portion formed by the metal plate (110). In this case, when the surface roughness value of the portion repaired through the first filling member (120a) is greater than the surface roughness value of the portion formed by the metal plate (110), the deposition quality may be deteriorated by the inner surface of the first filling member (120a) having a relatively large surface roughness value, and thus the deposition resolution may be deteriorated. Accordingly, the embodiment makes it possible to prevent the surface roughness value of the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) composed of the first filling member (120a) smaller than the surface roughness value of the first part (ES1-1) of the inner surface (ES1) of the small hole (V1) composed of the metal plate (110), thereby preventing the deposition quality in the repaired portion from being deteriorated, and thereby further improving the deposition resolution.

[0141] In addition, the reflectivity of the first part (ES1-1) of the inner surface (ES1) of the small hole (V1) may be different from the reflectivity of the second part (ES1-2) of the inner surface (ES1) of the small hole (V1). That is, the reflectivity of the first part (ES1-1) of the inner surface (ES1) of the small hole (V1) formed of the metal plate (110) may be different from the reflectivity of the second part (ES1-2) of the inner surface (ES1) of the small hole (V1) formed of the first filling member (120a). Accordingly, the embodiment can enable easy confirmation of the repaired portion through the difference in reflectivity between the first part (ES1-1) and the second part (ES1-2) of the inner surface (ES1) of the small hole (V1). Accordingly, the embodiment can easily proceed with inspection of the deposition pattern deposited in the repaired portion, and can easily select an area where a deposition defect may occur.

[0142] Accordingly, the inner surface (ES2) of the facing hole (V2) of the through hole (TH) may include a first portion (ES2-1) formed of a metal plate (110) and a second portion (ES2-2) positioned below the first portion (ES2-1) and formed of a first filling member (120a). At this time, the second portion (ES2-2) of the inner surface (ES2) of the facing hole (V2) may be positioned lower than the first portion (ES2-1). For example, the second portion (ES2-2) of the inner surface (ES2) of the facing hole (V2) may not be connected to one surface and the other surface of the metal plate (110). This is because the first groove (R1) is positioned at a communicating portion where the facing hole (V1) and the facing hole (V2) communicate.

[0143] At this time, the first part (ES2-1) and the second part (ES2-2) of the inner surface (ES2) of the facing hole (V2) may have different surface roughness values. For example, the reason why the first part (ES2-1) and the second part (ES2-2) of the inner surface (ES2) of the facing hole (V2) have different surface roughness values ​​has already been explained in the description of the inner surface (ES1) of the small-surface hole (V1) above, and a detailed explanation thereof is omitted.

[0144] Additionally, the first part (ES2-1) and the second part (ES2-2) of the inner surface (ES2) of the facing hole (V2) may have different reflectivities.

[0145] Additionally, the first part (ES2-1) and the second part (ES2-2) of the inner surface (ES2) of the facing hole (V2) may have different potential values, and the difference between their potential values ​​may be 2 eV or less.

[0146] Hereinafter, a groove and a filling member according to another embodiment will be described. At this time, the characteristics of the filling member have already been described through the first filling member (120a), and hence, the description will be based on the positions where the groove and filling member can be provided.

[0147] FIG. 8 is a drawing showing a repaired deposition mask according to a second embodiment, FIG. 9 is a drawing showing a repaired deposition mask according to a third embodiment, FIG. 10 is a drawing showing a repaired deposition mask according to a fourth embodiment, FIG. 11 is a drawing showing a repaired deposition mask according to a fifth embodiment, FIG. 12 is a drawing showing a repaired deposition mask according to a sixth embodiment, and FIG. 13 is a drawing showing a repaired deposition mask according to a seventh embodiment.

[0148] Referring to FIG. 8, a deposition mask (100B) according to the second embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (THb) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0149] At this time, the deposition mask (100B) of the second embodiment may be provided with a second groove (not shown) in the small hole (V1). At this time, the second groove may be provided in the boundary area between the lower end of the small hole (V1) and one surface of the metal plate (110).

[0150] And, a second filling member (120b) may be provided to fill the second groove.

[0151] At this time, the inner surface (ES2) of the facing hole (V2) of the through hole (THb) may be composed only of a metal plate (110). Alternatively, the inner surface (ES1b) of the small-faced hole (V1) of the through hole (THb) may include a first portion (ES1-1b) composed of a metal plate (110) and a second portion (ES1-2b) composed of a second filling member (120b). Furthermore, one surface of the deposition mask (100B) may include a first portion composed of a metal plate (110) and a second portion composed of a second filling member (120b).

[0152] Referring to FIG. 9, a deposition mask (100C) according to the third embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (THc) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0153] At this time, the deposition mask (100C) of the third embodiment may be provided with a third groove (not shown) in the small hole (V1). At this time, the third groove may be located between the lower end of the small hole (V1) and the communication portion, and may not be connected to one surface of the metal plate (110).

[0154] And, a third filling member (120c) can be provided to fill the third groove.

[0155] At this time, the inner surface (ES2) of the facing hole (V2) of the through hole (THc) may be composed only of a metal plate (110). Differently, the inner surface (ES1c) of the small hole (V1) of the through hole (THc) may include a first portion (ES1-1c) composed of a metal plate (110) and a second portion (ES1-2c) composed of a third filling member (120c). At this time, the second portion (ES1-2c) of the inner surface (ES1c) of the small hole (V1) may be provided between the lower end of the inner surface (ES1c) of the small hole (V1) and the communicating portion, and accordingly, the first portion (ES1-1c) of the inner surface (ES1c) of the small hole (V1) may be provided to surround the second portion (ES1-2c).

[0156] Referring to FIG. 10, a deposition mask (100D) according to the fourth embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (THd) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0157] At this time, the deposition mask (100D) of the fourth embodiment may be provided with a fourth groove (not shown) in the facing hole (V2). At this time, the fourth groove may be located between the upper end of the facing hole (V2) and the communication portion, and may not be connected to the other surface of the metal plate (110).

[0158] And, the fourth filling member (120d) can be provided to fill the fourth groove.

[0159] At this time, the inner surface (ES1) of the small hole (V1) of the through hole (THd) may be composed only of a metal plate (110). Differently, the inner surface (ES2d) of the facing hole (V2) of the through hole (THd) may include a first portion (ES2-1d) composed of a metal plate (110) and a second portion (ES2-2d) composed of a fourth filling member (120d). At this time, the second portion (ES2-2d) of the inner surface (ES2d) of the facing hole (V2) may be provided between the upper end of the inner surface (ES2d) of the facing hole (V2) and the communicating portion, and accordingly, the first portion (ES2-1d) of the inner surface (ES2d) of the facing hole (V2) may be provided to surround the second portion (ES2-2d).

[0160] Referring to FIG. 11, a deposition mask (100E) according to the fifth embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (THe) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0161] At this time, the deposition mask (100E) of the fifth embodiment may be provided with a fifth groove (not shown) in the facing hole (V2). At this time, the fifth groove may be provided between a plurality of adjacent facing holes. For example, the fifth groove may be located in a rib provided between a plurality of facing holes. In addition, the fifth filling member (120e) may be provided in a rib located between a plurality of adjacent facing holes.

[0162] Referring to FIG. 12, a deposition mask (100F) according to the sixth embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (TH) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0163] At this time, the deposition mask (100F) of the sixth embodiment may be provided with a sixth groove provided on one surface of the metal plate (110). At this time, the sixth groove may not overlap with the small hole (V1) of the through hole (TH) in the vertical direction. In addition, the sixth filling member (120f) may be provided to fill the sixth groove provided on one surface of the metal plate (110). Accordingly, one surface of the deposition mask may include a portion formed of the metal plate (110) and a portion provided with the sixth filling member (120f).

[0164] Meanwhile, although not illustrated in the drawing, the deposition mask may further include a groove provided in the island portion. In this case, the groove provided in the island portion may be filled with a separate filling member. Accordingly, the island portion of the deposition mask may include a portion formed of a metal plate (110) and a portion formed of the filling member provided in the above-described island portion.

[0165] Referring to FIG. 13, a deposition mask (100G) according to the seventh embodiment includes a metal plate (110). In addition, the metal plate (110) may include a through hole (TH) through which a small hole (V1) formed on one surface and a large hole (V2) formed on the other surface communicate.

[0166] At this time, the deposition mask (100G) of the seventh embodiment may include a seventh groove formed in a portion of the small hole (V1), the communication portion, and the large hole (V2).

[0167] That is, the vertical length from one surface of the metal plate (110) to the connecting portion has a range of 2 μm to 8 μm. Accordingly, when the first groove in Fig. 7a is formed, the first groove may extend from the inner surface of the small hole (V1) and may also be provided on one surface of the metal plate (110). In this case, the seventh filling member (120g) may be provided to fill the seventh groove.

[0168] At this time, the inner surface (ES1) of the small-surface hole (V1) of the through hole (TH) may include only an area provided with the seventh filling member (120g). That is, the seventh filling member (120g) may constitute the inner surface (ES1) of the small-surface hole (V1) and at least a portion of one surface of the deposition mask (100G). That is, one surface of the deposition mask (100G) may include a portion formed of a metal plate (110) and a portion extended from the inner surface (ES1) of the small-surface hole (V1) and formed of the seventh filling member (120g). In addition, the inner surface (ES2) of the large-surface hole (V2) may include a portion (ES2-1) formed of a metal plate (110) and a portion (ES2-2) connected from the inner surface (ES1) of the small-surface hole (V1) and formed of the seventh filling member (120g).

[0169] Accordingly, in the area where the seventh groove is provided, the seventh filling member (120g) may form the inner surface (ES1) of the small hole (V1) and at least a portion of one surface of the deposition mask (100G) connected thereto. Accordingly, the embodiment can enable the seventh filling member (120g) to be filled more stably within the seventh groove.

[0170]

[0171] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as falling within the scope of the present invention.

[0172] In addition, although the above description focuses on embodiments, these are merely examples and do not limit the present invention. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention defined in the appended claims.

Claims

1. A metal plate including one side and a second side opposite to the first side, and including a plurality of through holes penetrating the first side and the second side; and Including a filling member arranged on the inner surface of the first through hole among the plurality of through holes of the metal plate, The first through hole includes a first small hole formed on one surface of the metal plate, and a first facing hole formed on the other surface of the metal plate and communicating with the first small hole through a communicating portion. The above metal plate includes a first groove provided on the inner surface of the first through hole, The above filling member includes a first filling member disposed within the first groove, A deposition mask, wherein the inner surface of the first through hole includes a first inner surface formed of the metal plate, and a second inner surface formed of the first filling member.

2. In paragraph 1, A deposition mask, wherein the first groove is provided in at least one of the first small-surface hole, the first large-surface hole, and the communication portion.

3. In paragraph 2, The above first home is provided in the above communication part, The first inner side includes a first portion connected to the first surface, spaced apart from the communication portion, and corresponding to the inner side of the first small-faced hole, and a second portion connected to the other surface, spaced apart from the communication portion, and corresponding to the inner side of the first large-faced hole. The above second inner surface is a deposition mask provided between the first part and the second part.

4. In paragraph 3, A deposition mask, wherein the second inner surface is not connected to the one surface and the other surface of the metal plate.

5. In paragraph 2, The above first home is provided in the above first small hole and the above communication part, A deposition mask, wherein the second inner surface is connected to the first surface of the metal plate.

6. In paragraph 5, A deposition mask, wherein the first groove extends from the inner surface of the first through hole and is further provided on at least a portion of the one surface of the metal plate.

7. In paragraph 2, The above first home is provided in the above first facing hole, The first inner side includes a first portion connected to the first side and the communicating portion and corresponding to the inner side of the first small-faced hole, and a second portion connected to the other side and spaced apart from the communicating portion and corresponding to the inner side of the first large-faced hole. The above second inner surface is a deposition mask provided between the first part and the second part.

8. In paragraph 1, The metal plate further includes a second groove provided on the one surface and not connected to the inner surface of the plurality of through holes, A deposition mask, wherein the filling member comprises a second filling member disposed within the second groove.

9. In paragraph 1, Further comprising a rib provided between two adjacent through holes among the plurality of through holes, The above metal plate further includes a third groove provided in the above rib, The above filling member further includes a third filling member disposed within the third groove, A deposition mask, wherein each of the two adjacent through holes comprises an inner surface formed of the third filling member and connected to each other.

10. In paragraph 1, Further comprising an island portion provided between two adjacent through holes among the plurality of through holes and corresponding to the other surface of the metal plate, The above metal plate further includes a fourth groove provided in the above island portion, A deposition mask, wherein the filling member further includes a fourth filling member disposed within the fourth groove.

Images