X-ray imaging detection module and mounting fixture therefor and mounting method therefor

Abstract

An X-ray imaging detection module and a mounting fixture therefor and a mounting method therefor. The detection module comprises a circuit substrate (1), photodiodes (2), a scintillator (3) and metal wires (4) which are stacked sequentially. An X-ray is perpendicular to the detection module and is irradiated from one side of the metal wires (4). A plurality of photodiodes (2) are arranged in an array on the circuit substrate (1) to form a photodiode (2) matrix. The scintillator (3) completely covers all the photodiodes (2). A plurality of metal wires (4) are arranged in an array on the scintillator (3) to cover odd-numbered columns or even-numbered columns or odd-numbered rows or even-numbered rows of the photodiode (2) matrix. The photodiodes (2) form the photodiode (2) matrix on the circuit substrate (1), the scintillator (3) covers the photodiodes (2), and the metal wires (4) are arranged in the array on the scintillator (3) and filter out low-energy ray signals at positions covered by the metal wires (4), so that a high-and-low energy interleaved X-ray imaging detection module is formed, and a dual-energy image can be obtained, thereby improving the material discrimination capability of the image, and providing the advantages such as facilitating processing and manufacturing.

Description

An X-ray imaging detection module, mounting tool and mounting method thereof TECHNICAL FIELD

[0001] The present application relates to X-ray imaging detection, and in particular to an X-ray imaging detection module, mounting tool and mounting method thereof. BACKGROUND

[0002] A common X-ray multi-row imaging detection module structure applied to an industrial inspection system is shown in FIG. 1 and FIG. 2. In the above-mentioned X-ray detection system, an X-ray source and an imaging detection module are mounted on a rack. After X-rays emitted by the X-ray source penetrate a target to be inspected, the X-rays are received by the imaging detection module. A collimator near the imaging detection module absorbs most scattered X-rays, and X-rays carrying information of the target to be inspected are absorbed by a scintillator on the imaging detection module. The scintillator converts the X-rays into optical signals, which are absorbed by photodiodes below and converted into charge signals. The charge signals are then converted into voltage signals or digital signals by charge processing chips on a circuit board (which can be an FR4 board, a ceramic substrate or other forms of substrate material) and sent to a data acquisition and processing system. The system then reconstructs an image of the target to be inspected and ultimately completes the inspection task. The number of pixels in the Z direction is usually referred to as the number of rows, which is greater than or equal to 2. The number of pixels in the X direction is usually referred to as the number of channels, which is greater than or equal to 2.

[0003] A basic structure of a conventional dual-energy imaging detection module is shown in FIG. 3. An array of photodiodes is arranged on both sides of a substrate, and then two different scintillators are bonded to the surfaces of the array of photodiodes. The first scintillator is usually used to absorb low-energy X-rays, and the second scintillator is usually used to absorb high-energy X-rays. A filter is used to absorb low-energy stray X-rays remaining after the X-rays pass through the low-energy scintillator. The filter can be embedded inside the substrate or attached to the surface of the PCB. After the X-rays are converted into current charge signals, the lead pads or electrode balls on the array of photodiodes are connected to the lead pads or electrode pads on the substrate. The signals are then introduced into charge processing chips or circuits through lead lines on the substrate, quantified as digital signals, and then reconstructed into colored images containing material information of the target to be inspected through image processing algorithms.

[0004] X-ray imaging detection modules in the industrial field, especially for applications involving fine structures of the target to be inspected, generally require small pixels of the imaging detection module, usually less than 0.6mm*0.6mm. If the above-mentioned dual-energy imaging detection module structure is applied, there are strict requirements for the assembly and alignment of the low-energy and high-energy imaging detection modules. Otherwise, during X imaging, excessive crosstalk may occur, resulting in unclear images.

[0005] After retrieval, the application publication number CN115993373A discloses an X-ray imaging device, a filtering structure and a manufacturing method thereof, specifically discloses: the X-ray imaging device comprises: a filtering structure, which filters X-rays passing through a detected target to obtain measured X-rays; an imaging detection module, which detects the measured X-rays to obtain an image signal of the detected target; and a processing module, which processes the image signal to obtain an image of the detected target, the filtering structure is divided into at least a first array and a second array, the first array and the second array respectively attenuate X-rays to different degrees, so that the image of the detected target is at least a dual-energy image. But the prior art is difficult to manufacture.

[0006] Therefore, how to design an X-ray imaging detection module which is convenient to manufacture is a technical problem to be solved. SUMMARY

[0007] The purpose of the present application is to overcome the manufacturing difficulties of the prior art and provide an X-ray imaging detection module, its installation tooling and installation method.

[0008] The purpose of the present application can be achieved by the following technical solutions:

[0009] In the first aspect of the present application, an X-ray imaging detection module is provided, which comprises a circuit substrate, a photodiode, a scintillator and a metal wire arranged in sequence, the X-ray is perpendicular to the detection module and irradiates from the side of the metal wire; the photodiode is arranged in an array on the circuit substrate to form a photodiode matrix; the scintillator completely covers all the photodiodes; the metal wire is arranged in an array on the scintillator to cover the odd columns or even columns or odd rows or even rows of the photodiode matrix.

[0010] As a preferred technical solution, the diameter of the metal wire is greater than or equal to the side length of the photodiode, and the metal wire covers the photodiode in the vertical direction, thereby forming a photodiode group containing the metal wire and a photodiode group not containing the metal wire.

[0011] As a preferred technical solution, the density of the metal wire is greater than 7.2g / cm 3 .

[0012] As a preferred technical solution, the metal wire is a copper wire, a brass wire, a tin wire or a gold wire.

[0013] As a preferred technical solution, the material of the circuit substrate is glass fiber or ceramic, and the material of the scintillator is gadolinium oxysulfide, gadolinium gallium aluminum garnet or cesium iodide.

[0014] As a preferred technical solution, the circuit substrate and the scintillator are rectangular, and the photodiode is square.

[0015] The second aspect of the present application provides a mounting tool for an X-ray imaging detection module, comprising two positioning blocks, which are respectively placed on both sides of the extension direction of the metal wires; recesses parallel to each other are formed on the positioning blocks, the number of the recesses is greater than or equal to the number of the metal wires, the width of the recesses is equal to the width of the metal wires, and the distance between the recesses is equal to the distance between adjacent odd columns or even columns or odd rows or even rows of the photodiode matrix.

[0016] As a preferred technical solution, the depth of the recesses is greater than or equal to the radius of the metal wires, and the distance between the bottom surface of the recesses and the bottom surface of the positioning block is less than or equal to the thickness of the stacked circuit substrate, photodiode and scintillator.

[0017] As a preferred technical solution, the barrier wall between the recesses is provided with a chamfer.

[0018] The third aspect of the present application provides a mounting method using the mounting tool, which specifically comprises the following steps:

[0019] Step S1, sequentially stacking the circuit substrate, photodiode and scintillator;

[0020] Step S2, arranging the positioning tool on both sides of the stacked circuit substrate, photodiode and scintillator;

[0021] Step S3, clamping the two ends of the plurality of metal wires into the recesses of the positioning tool;

[0022] Step S4, straightening the metal wires by the tension device;

[0023] Step S5, fixing the metal wires on the surface of the scintillator, removing the positioning tool and the excess metal wires.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] 1) In the present application, the photodiode forms a photodiode matrix on the circuit substrate, the scintillator covers the photodiode, and the metal wire array is arranged on the scintillator, covering the odd columns or even columns or odd rows or even rows of the photodiode matrix. The metal wire filters out the low-energy ray signal of the position it covers, thereby forming an X-ray imaging detection module with high and low energy intervals, which can obtain dual-energy images and improve the material resolution and recognition accuracy of the images; the structure is simple and convenient for processing and manufacturing.

[0026] 2) The present application uses metal wires with a density greater than 7.2 g / cm 3 , which can effectively isolate low-energy X-rays; the rectangular circuit substrate and scintillator and the square photodiode facilitate the arrangement of the photodiodes;

[0027] 3) The installation tool of the present application can realize convenient fixation of the metal wire, and solves the problem of difficult manufacturing of the detection module due to small size. BRIEF DESCRIPTION OF DRAWINGS

[0028] Fig. 1 is a front view of a structure of an existing X-ray multi-row imaging detection module;

[0029] Fig. 2 is a top view of a structure of an existing X-ray multi-row imaging detection module;

[0030] Fig. 3 is a schematic view of a structure of an existing dual-energy imaging detection module;

[0031] Fig. 4 is a front view of an X-ray imaging detection module according to the present application;

[0032] Fig. 5 is a top view of an X-ray imaging detection module according to the present application;

[0033] Fig. 6 is a schematic view of a cooperation structure of an X-ray imaging detection module and an installation tool according to the present application;

[0034] Fig. 7 is a sectional view of a cooperation structure of an X-ray imaging detection module and an installation tool according to the present application;

[0035] Reference signs in the drawings:

[0036] 1, circuit substrate, 2, photodiode, 3, scintillator, 4, metal wire, 5, positioning block, 50, groove, 51, barrier wall, 52, chamfer. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the protection scope of the present application.

[0038] Embodiment 1

[0039] As shown in Figs. 4 and 5, the present application provides an X-ray imaging detection module, which comprises a circuit substrate 1, a photodiode 2, a scintillator 3 and a metal wire 4.

[0040] The circuit substrate 1 is used to provide support and signal communication functions, and is a glass fiber plate or a ceramic plate, which is rectangular in shape and is located at the bottom layer of the detection module.

[0041] The photoelectric diode 2 is square with a side length less than 0.6 mm, and a plurality of photoelectric diodes 2 are arranged in an array on the circuit substrate 1 to form a photoelectric diode 2 matrix, m photoelectric diodes 2 are arranged in the X direction, and n photoelectric diodes 2 are arranged in the Z direction.

[0042] The scintillator 3 is made of gadolinium oxysulfide (GOS), gadolinium gallium garnet (GGAG) or cesium iodide (CsI), and is rectangular to completely cover the photoelectric diode 2.

[0043] The metal wire 4 has a density greater than 7.2 g / cm 3 In order to effectively isolate low-energy X-rays, the metal wire 4 can be made of red copper wire, brass wire, tin wire or gold wire. A plurality of metal wires 4 are arranged in an array on the scintillator 3 to cover the odd columns or even columns or odd rows or even rows of the photoelectric diode 2 matrix. By using the metal wire 4, a filter for low-energy X-rays is formed above the covered row or column of the scintillator 3, and the remaining rows or columns form a slit for X-rays. If the metal wire 4 covers the even rows, the odd rows can obtain high-energy X-ray information passing through the detected object, and the even rows can obtain the sum of high-energy and low-energy X-ray information passing through the detected object. By image algorithm reconstruction, the corresponding dual-energy X-ray image can be obtained. The metal wire 4 is used instead of a metal sheet because it is very difficult to manufacture a metal sheet with a width less than 0.6 mm and then attach it to the surface of the scintillator 3 in a straight line, especially for applications with a spacing between rows less than 0.6 mm.

[0044] Embodiment 2

[0045] As shown in FIGS. 6 and 7, the present application provides a mounting tool for an X-ray imaging detection module, which includes two positioning blocks 5. When in use, the two positioning blocks 5 are placed on both sides of the metal wire 4 in the extension direction.

[0046] The positioning block 5 is a cube with a plurality of parallel grooves 50 formed therein. The number of grooves 50 is greater than or equal to the number of metal wires 4, the width of the groove 50 is equal to the width of the metal wire 4, and the distance between the grooves 50 is equal to the distance between adjacent odd columns or even columns or odd rows or even rows of the photoelectric diode 2 matrix, so as to achieve accurate positioning of the metal wire 4.

[0047] The depth of the groove 50 is greater than or equal to the radius of the metal wire 4 to ensure stable placement and accurate positioning of the metal wire 4. The distance between the bottom surface of the groove 50 and the bottom surface of the positioning block 5 is less than or equal to the thickness of the stacked circuit substrate 1, photoelectric diode 2 and scintillator 3, so as to prevent the metal wire 4 from contacting the bottom surface of the groove 50 while still not contacting the surface of the scintillator 3, causing inaccurate positioning.

[0048] The barrier wall 51 between the grooves 50 is provided with a chamfer 52, so as to facilitate the insertion of the metal wire 4 into the groove 50.

[0049] Embodiment 3

[0050] The application provides a mounting method of an X-ray imaging detection module, and specifically as follows.

[0051] The circuit substrate 1, the photodiode 2 and the scintillator 3 are sequentially stacked and mounted, the photodiodes 2 are arranged in an array on the circuit substrate 1 at a certain interval, forming a photodiode 2 matrix, and the scintillator 3 completely covers all the photodiodes 2; the two positioning blocks 5 of the positioning tool are arranged on both sides of the stacked circuit substrate 1, photodiode 2 and scintillator 3; the two ends of the plurality of metal wires 4 are clamped into the grooves 50 of the positioning tool, so as to position the metal wires 4 at correct positions on the surface of the scintillator 3; the tension device clamps the two ends of the metal wires 4 to straighten the metal wires 4; the metal wires 4 are fixed on the surface of the scintillator 3, and can be fixed by using glue; the positioning tool is removed, and the excess metal wires 4 at both ends of the X-ray imaging detection module are removed.

[0052] The above merely describes the specific embodiments of the application, but the protection scope of the application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the application, and these modifications or replacements should be covered in the protection scope of the application. Therefore, the protection scope of the application should be subject to the protection scope of the claims.

Claims

1. An X-ray imaging detection module, characterized in that, The X-ray is irradiated from the side of the metal wire (4) perpendicularly to the detection module; the photodiode (2) is multiple, arranged in an array on the circuit substrate (1), forming a photodiode (2) matrix; the scintillator (3) completely covers all the photodiodes (2); the metal wire (4) is multiple, arranged in an array on the scintillator (3), covering the odd columns or even columns or odd rows or even rows of the photodiode (2) matrix.

2. The X-ray imaging detection module of claim 1, wherein, The diameter of the metal wire (4) is greater than or equal to the side length of the photodiode (2), and the metal wire (4) is spaced in the vertical direction to cover the photodiode (2), thereby forming a photodiode group containing the metal wire (4) and a photodiode group not containing the metal wire.

3. The X-ray imaging detection module of claim 1, wherein, The metal wire (4) has a density greater than 7.2 g / cm 3 .

4. The X-ray imaging detection module of claim 3, wherein, The metal wire (4) is a red copper wire or a brass wire or a tin wire or a gold wire.

5. The X-ray imaging detection module of claim 1, wherein, The circuit substrate (1) is made of glass fiber or ceramic, and the scintillator (3) is made of gadolinium oxysulfide or gadolinium gallium aluminum garnet or cesium iodide.

6. The X-ray imaging detection module of claim 1, wherein, The circuit substrate (1) and the scintillator (3) are both rectangular, and the photodiode (2) is square.

7. A mounting tool for the X-ray imaging detection module of claim 1, characterized in that, Two positioning blocks (5) are arranged on both sides of the extension direction of the metal wire (4); the positioning block (5) is provided with recesses (50) parallel to each other, the number of the recesses (50) is greater than or equal to the number of the metal wire (4), the width of the recess (50) is equal to the width of the metal wire (4), and the distance between the recesses (50) is equal to the distance between adjacent odd columns or even columns or odd rows or even rows of the photodiode (2) matrix.

8. The installation tool of claim 7, wherein, The depth of the recess (50) is greater than or equal to the radius of the metal wire (4), and the distance between the bottom surface of the recess (50) and the bottom surface of the positioning block (5) is less than or equal to the thickness of the stacked circuit substrate (1), photodiode (2) and scintillator (3).

9. The installation tool of claim 7, wherein, The barrier (51) between the recesses (50) is provided with a chamfer (52).

10. A method of installing the installation tool of claim 7, wherein, Specifically comprising the following steps: Step S1, sequentially stacking the circuit substrate (1), the photodiode (2) and the scintillator (3); Step S2, arranging the positioning tool on both sides of the stacked circuit substrate (1), photodiode (2) and scintillator (3); Step S3, clamping the two ends of the multiple metal wires (4) into the recesses (50) of the positioning tool; Step S4, straightening the metal wire (4) by the tension device; Step S5, fixing the metal wire (4) on the surface of the scintillator (3), removing the positioning tool and removing the excess metal wire (4).

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