Inspection system and component mounting system

Abstract

This inspection system comprises: a substrate inspection device positioned on the downstream side of a plurality of work devices in the conveying direction along a substrate-conveying path, said substrate inspection device inspecting the status of an inspection portion of a mounting substrate conveyed to the inspection position; and a substrate detection unit attached to a substrate outlet of the work device, said substrate detection unit outputting a substrate detection signal when the mounting substrate conveyed out from the substrate outlet has been detected. The substrate inspection device includes a calculation unit and a display unit. Based on the work time when one mounting substrate is produced in the work device to which the substrate detection unit is attached, the calculation unit calculates the standby time predicted as the time from the end of the inspection for the one mounting substrate performed at the inspection position until the subsequent mounting substrate following the one mounting substrate is carried into the inspection position. The display unit displays the standby time calculated by the calculation unit.

Description

Inspection and component placement systems

[0001] The present invention relates to an inspection system that inspects a mounting board on which components are mounted, and a component mounting system including the same.

[0002] In component mounting lines that produce mounted boards where components are mounted on a board, a board inspection device is installed to inspect the condition of the inspection area of ​​the mounted board, such as the components. The board inspection device references board data in which inspection area information regarding the inspection area is set, and automatically performs a primary judgment of the quality of the inspection area based on an image of the mounted board. For mounted boards where the condition of the inspection area is judged to be poor in this primary judgment, an operator visually judges the quality of the inspection area based on the image.

[0003] Patent Document 1 discloses a technique for displaying on a display unit the waiting time for inspection until a substrate arrives at a visual inspection device serving as a substrate inspection device. By displaying the waiting time of the substrate inspection device on the display unit, an operator can preferably make a secondary judgment while checking the waiting time displayed on the display unit.

[0004] However, in the technology disclosed in Patent Document 1, the waiting time of the board inspection device is calculated based on the time it takes for the board to be transported by a conveyor in a reflow furnace located upstream of the board inspection device and the time it takes for the board to be transported by a conveyor between the board inspection device and the reflow furnace. In this case, if production of mounted boards on the component mounting line is temporarily stopped, the display unit may not be able to display an accurate waiting time based on the production status of the mounted boards. As a result, the operator cannot effectively use the waiting time of the board inspection device to perform tasks such as secondary evaluation.

[0005] Japanese Patent Application Laid-Open No. 2018-157122

[0006] An object of the present invention is to provide an inspection system and a component mounting system that are capable of displaying an accurate waiting time on a board inspection device in accordance with the production status of mounted boards on a component mounting line.

[0007] According to one aspect of the present invention, an inspection system inspects mounted boards in a component mounting line in which a plurality of operating devices that perform operations for producing mounted boards, each having components mounted thereon, are arranged on a board transport path along which the boards are transported in a transport direction. The inspection system includes a board inspection device that is arranged downstream of the operating devices on the board transport path in the transport direction and that inspects the condition of an inspection portion indicating an inspection target on the mounted board that has been transported to a predetermined inspection position, and a board detection unit that is attached to a board outlet that is located at the downstream end of the transport direction of any of the operating devices and that outputs a board detection signal when it detects the mounted board being transported through the board outlet. The board inspection device includes a calculation unit that calculates, based on the operation time required to produce one mounted board by the operating device to which the board detection unit is attached, a predicted wait time that is the time from when inspection of one mounted board at the inspection position is completed until the next mounted board following the one mounted board is transported to the inspection position, and a display unit that displays the wait time.

[0008] A component mounting system according to another aspect of the present invention includes a component mounting line arranged on a board transport path that transports the board in a transport direction, and a plurality of work devices that perform work to produce a mounted board having components mounted on the board; and the above-mentioned inspection system that inspects the mounted board on the component mounting line.

[0009] FIG. 1 is a diagram showing the configuration of a component mounting system to which an inspection system according to an embodiment of the present invention is applied. FIG. 2 is a block diagram showing the configuration of the inspection system. FIG. 3 is a cross-sectional view showing a measurement unit of a board inspection device provided in the inspection system. FIG. 4 is a diagram explaining the processing content of a processing unit of the board inspection device, and is a flowchart showing the flow of board data creation processing executed by the processing unit. FIG. 5 is a diagram explaining the processing content of a processing unit of the board inspection device, and is a flowchart showing the flow of inspection processing executed by the processing unit. FIG. 6 is a diagram explaining the processing content of a processing unit of the board inspection device, and is a flowchart showing the flow of waiting time calculation processing executed by the processing unit. FIG. 7 is a diagram schematically showing an inspection screen displayed by a display unit of the board inspection device. FIG. 8 is a diagram schematically showing an editing screen displayed by a display unit of the board inspection device.

[0010] An inspection system and a component mounting system according to an embodiment of the present invention will be described below with reference to the drawings. The inspection system according to this embodiment is applied to a component mounting system that produces mounted boards, such as printed circuit boards, on which components are mounted, and is a system for inspecting the mounted boards. The mounted board is a product in which electronic components, such as chip components such as chip resistors and chip capacitors, ball bump components, and packaged components such as ICs, power supply-related components such as capacitors and transformers, connectors, heat sinks, etc., are mounted on a printed circuit board on which a circuit pattern is printed.

[0011] [Overall Configuration of Component Mounting System] Figure 1 is a diagram showing the configuration of a component mounting system MS to which an inspection system IS according to this embodiment is applied. The component mounting system MS includes a component mounting line ML and an inspection system IS. The component mounting line ML produces a plurality of mounted boards B2 in lots, each having components mounted on a board B1. The inspection system IS sequentially inspects the plurality of mounted boards B2 produced in lots on the component mounting line ML.

[0012] The component mounting line ML is a line on which multiple operating devices 1, reflow ovens 2, and board inspection devices 3 are arranged to perform operations for producing mounted boards B2 in which components are mounted on boards B1. The multiple operating devices 1 include a printing device 11, a print inspection device 12, and a mounting device 13. On the component mounting line ML, the printing device 11, print inspection device 12, mounting device 13, reflow ovens 2, and board inspection devices 3 are arranged in tandem from the upstream side to the downstream side of the transport direction TD on a board transport path TP that transports the board B1 in the transport direction TD. A loader LD that loads the board B1 into the printing device 11 is arranged at the upstream end of the component mounting line ML, and an unloader ULD that removes the produced mounted board B2 from the board inspection device 3 is arranged at the downstream end.

[0013] The printing device 11 prints solder paste such as cream solder on the board B1, for example, by screen printing. The printing device 11 has a printing unit 11U. The printing unit 11U captures an image of the board B1 and prints the solder paste on the board B1 while recognizing a fiducial (FID) mark on the board B1, the size of the board B1, and the like, based on the captured image.

[0014] The print inspection device 12 inspects whether the position, amount, and height of the solder paste printed on the board B1 are appropriate. The print inspection device 12 has an inspection unit 12U. The inspection unit 12U captures an image of the board B1 on which the solder paste has been printed, and inspects the position, amount, etc. of the solder paste on the board B1 while recognizing the FID mark on the board B1, the size of the board B1, etc. based on the captured image.

[0015] The mounting device 13 mounts components on a board B1 printed with solder paste to produce a mounted board B2. The mounting device 13 has a mounting unit 13U. The mounting unit 13U captures images of the board B1 and components, and mounts the components on the board B1 while recognizing the FID marks on the board B1, the size of the board B1, the shape of the components, and the like based on the captured images. The component mounting line ML shown in FIG. 1 shows an example in which three mounting devices 13 are arranged in series. That is, on the component mounting line ML, a first mounting device 13A, a second mounting device 13B, and a third mounting device 13C are arranged in tandem from the upstream side.

[0016] The multiple operation devices 1, which are made up of the printing device 11, print inspection device 12, first mounting device 13A, second mounting device 13B, and third mounting device 13C, are classified based on the operation time WT required to produce one mounting board B2 into a specific operation device 1A with the longest operation time WT, an upstream operation device 1B arranged upstream of the specific operation device 1A in the transport direction TD, and a downstream operation device 1C arranged downstream of the specific operation device 1A in the transport direction TD. In the example shown in Figure 1, the second mounting device 13B is selected as the specific operation device 1A, the printing device 11, print inspection device 12, and first mounting device 13A are selected as upstream operation devices 1B, and the third mounting device 13C is selected as the downstream operation device 1C.

[0017] The work time WT of the printing device 11 is represented by the time required for the printing unit 11U to print solder paste on one board B1, and can be calculated in advance before the production of the mounted board B2 based on information such as the operating speed and operating distance of the printing unit 11U. The work time WT of the print inspection device 12 is represented by the time required for the inspection unit 12U to inspect the position and amount of solder paste on one board B1, and can be calculated in advance before the production of the mounted board B2 based on information such as the operating speed and operating distance of the inspection unit 12U. The work time WT of the mounting device 13 is represented by the time required for the mounting unit 13U to mount all components on one board B1, and can be calculated in advance before the production of the mounted board B2 based on information such as the operating speed and operating distance of the mounting unit 13U.

[0018] The reflow furnace 2 heats the mounting board B2 produced based on the work of each of the work devices 1, namely the printing device 11, the print inspection device 12, and the mounting device 13, to melt the solder and fix the components to the board B1.

[0019] The board inspection device 3 is provided in the inspection system IS, and inspects the mounted board B2 produced in the component mounting line ML.

[0020] [Overall Configuration of Inspection System] The inspection system IS will be described with reference to Fig. 2 in addition to Fig. 1. Fig. 2 is a block diagram showing the configuration of the inspection system IS. The inspection system IS is a system that sequentially inspects a plurality of mounted boards B2 produced in lots on a component mounting line ML. The inspection system IS includes a board inspection device 3, a board detection unit 7, and a judgment terminal 8.

[0021] The board inspection device 3 is disposed on the board transport path TP of the component mounting line ML, downstream in the transport direction TD from the multiple working devices 1. The board inspection device 3 inspects the condition of multiple inspection sites A, which indicate inspection targets such as components, on a mounted board B2 that has been carried into a preset inspection position P2. The board inspection device 3 is a primary inspection device that automatically makes a primary judgment as to whether the condition of each inspection site A on the mounted board B2 is good or bad. Details of the board inspection device 3 will be described later.

[0022] The board detection unit 7 is a sensor attached to a board discharge port located at the downstream end of one of the plurality of working devices 1 in the transport direction TD, and detects the mounting board B2. The board detection unit 7 outputs a board detection signal SG1 when it detects the mounting board B2 being discharged from the board discharge port of the working device 1.

[0023] The board detection unit 7 has a specific detection unit 71 attached to the board discharge port of the specific operation apparatus 1A on the board transport path TP, and a downstream detection unit 72 attached to the board discharge port of the downstream operation apparatus 1C on the board transport path TP. The specific detection unit 71 outputs a specific detection signal SG2 as the board detection signal SG1 when it detects the mounting board B2 being discharged from the board discharge port of the specific operation apparatus 1A. The downstream detection unit 72 outputs a downstream detection signal SG3 as the board detection signal SG1 when it detects the mounting board B2 being discharged from the board discharge port of the downstream operation apparatus 1C.

[0024] The inspection system IS is provided with a repair station, which serves as a workplace where an operator OP visually inspects a mounted board B2 whose inspection area A has been determined to be defective in the primary judgment by the board inspection device 3 to determine whether the board is a good product or a defective product. The judgment terminal 8 is disposed in the repair station. The judgment terminal 8 is configured as, for example, a personal computer, and is operated by the operator OP.

[0025] The judgment terminal 8 displays a board image of the mounting board B2 for which the condition of the inspection portion A has been judged to be poor in the primary judgment by the board inspection device 3. The operator OP visually checks the board image displayed on the judgment terminal 8 and makes a secondary judgment to finally determine whether the condition of the inspection portion A is poor as judged in the primary judgment by the board inspection device 3, or whether the primary judgment was an overjudgment and the condition of the inspection portion A should be judged to be good. The judgment terminal 8 outputs the result of the secondary judgment to the board inspection device 3 in response to an operation by the operator OP.

[0026] [Detailed Configuration of Board Inspection Apparatus] The board inspection apparatus 3 inspects the condition of the inspection portion A, such as each component, of the mounted board B2 that has been placed on the conveyor 52 and carried to a preset inspection position P2. The board inspection apparatus 3 may have an inspection acceptance position P1, which is capable of holding a predetermined number of mounted boards B2, set upstream in the transport direction TD from the inspection position P2. In the example shown in FIG. 2 , a buffer conveyor 53, which is capable of holding a predetermined number of mounted boards B2, is disposed at the inspection acceptance position P1. The buffer conveyor 53 transports the held mounted boards B2 one by one to the conveyor 52, at which the inspection position P2 is set. The inspection acceptance position P1 may also be set upstream of the inspection position P2 on the conveyor 52.

[0027] In order to inspect the state of each inspection portion A on the mounting board B2 carried into the inspection position P2, the board inspection device 3 acquires shape data of each inspection portion A and generates shape information for each inspection portion A based on the shape data. The board inspection device 3 inspects the state of each inspection portion A based on the generated shape information.

[0028] The board inspection device 3 includes a measurement unit 4 and a processing unit 6. The measurement unit 4 is a unit that acquires shape data D1 of each inspection portion A on the mounting board B2. The measurement unit 4 is movable above the mounting board B2 by a movement mechanism 51. The processing unit 6 performs processing to analyze the shape data D1 acquired by the measurement unit 4, and also performs processing to control the operation of the measurement unit 4.

[0029] <Regarding the Measurement Unit> The measurement unit 4 will be described with reference to FIG. 3 in addition to FIG. 2. FIG. 3 is a cross-sectional view showing the measurement unit 4 provided in the board inspection apparatus 3. The measurement unit 4 is configured to be able to acquire two-dimensional data D2 and three-dimensional data D3 of each inspection portion A on the mounting board B2 as shape data D1. The measurement unit 4 includes a first measurement unit 41 that acquires the two-dimensional data D2 and a second measurement unit 42 that acquires the three-dimensional data D3 by a phase shift method.

[0030] The measurement unit 4 includes a first camera 40. The first camera 40 is shared by the first measurement unit 41 and the second measurement unit 42. The first camera 40 includes a camera body 401 and a lens barrel 402. The camera body 401 includes an image sensor 403 that captures images. The image sensor 403 is a sensor in which pixels made of photoelectric conversion elements are arranged in a matrix. The image sensor 403 may be, for example, a CMOS sensor. The lens barrel 402 includes multiple optical lenses that form an optical image of the mounting substrate B2 as the target on the light receiving surface of the image sensor 403. A half mirror 404 that forms the measurement optical path of the first measurement unit 41 is disposed on the optical path within the lens barrel 402.

[0031] The first measurement unit 41 includes a coaxial illumination unit 411 and a multi-directional illumination unit 412 as illumination systems, and a camera body 401 as an imaging system. The coaxial illumination unit 411 irradiates a mounting board B2 as an object with coaxial illumination light. The coaxial illumination unit 411 includes an LED light-emitting unit and is attached to the side surface of the lens barrel 402. The coaxial illumination light emitted from the coaxial illumination unit 411 is reflected by the half mirror 404 and irradiated onto the mounting board B2 along the imaging optical axis of the first camera 40. The reflected light from the mounting board B2 enters the camera body 401 through the lens barrel 402 and is received by the imaging sensor 403.

[0032] The multi-directional illumination unit 412 includes an upper illumination unit 414, a middle illumination unit 415, and a lower illumination unit 416, all of which are composed of LED light-emitting units. The upper illumination unit 414 is attached to the lower end of the first camera 40 and irradiates the mounting board B2 with upper illumination light at an illumination angle close to the vertical direction. The upper illumination light is, for example, white light or a combination of white light and infrared light. Reflected light of the upper illumination light along the imaging optical axis is also received by the imaging sensor 403.

[0033] The middle-level illumination unit 415 irradiates the mounting board B2 with middle-level illumination light at an illumination angle that is more tilted relative to the vertical direction than the upper-level illumination light. The middle-level illumination light is, for example, white light. A dome reflector 4131 with a hemispherical reflective surface is attached to the lower end of the first camera 40. The middle-level illumination unit 415 is disposed facing upward, and the middle-level illumination light is reflected by the dome reflector 4131 and irradiated onto the mounting board B2.

[0034] The lower illumination unit 416 irradiates the mounting substrate B2 with lower illumination light at an illumination angle that is more tilted relative to the vertical direction than the middle illumination light. The lower illumination light is, for example, white light. A holding dish 4132 having a larger diameter than the dome reflector 4131 is attached to the lower end of the dome reflector 4131. The lower illumination unit 416 is attached to the holding dish 4132 at a predetermined inclination. Reflected light of the middle illumination light and lower illumination light along the imaging optical axis is also received by the imaging sensor 403.

[0035] The camera body 401 of the first camera 40 functions as a camera that captures a two-dimensional image of the mounting board B2 in the first measurement unit 41, which acquires the two-dimensional data D2. When the first measurement unit 41 acquires the two-dimensional data D2, one or more of the coaxial illumination unit 411, the upper illumination unit 414, the middle illumination unit 415, and the lower illumination unit 416 are selected. By enabling the coaxial illumination light, the upper illumination light, the middle illumination light, and the lower illumination light to be emitted, the mounting board B2 can be illuminated from multiple angles. This allows the first measurement unit 41 to acquire two-dimensional data D2 represented by a clear two-dimensional image of the mounting board B2 as the target.

[0036] The second measurement unit 42 includes a plurality of projectors 421 as an illumination system and a camera body 401 as an imaging system. The projectors 421 are arranged at a predetermined inclination around the imaging optical axis of the first camera 40. In other words, the projection axes of the projectors 421 are inclined at a predetermined angle with respect to the imaging optical axis. For example, four or eight projectors 421 are arranged at equal distances and evenly spaced intervals in the circumferential direction surrounding the imaging optical axis.

[0037] The second measurement unit 42 employs the phase shift method and captures images while changing the phase of light irradiating the mounting substrate B2 as an object, thereby acquiring three-dimensional data D3 of the surface of the mounting substrate B2. The projector 421 irradiates the mounting substrate B2 with patterned light, such as a sine wave pattern or a stripe pattern. Reflected light of the patterned light along the imaging optical axis is incident on the first camera 40. The imaging sensor 403 of the camera body 401 receives the reflected light.

[0038] The projector 421 projects patterned light with different phases per field of view, for example, four times. The first camera 40 captures an image each time the patterned light is projected. The second measurement unit 42 analyzes the phase change resulting from the surface shape of the mounting board B2 based on the brightness change in the four acquired images. Then, based on the analysis results, the second measurement unit 42 acquires three-dimensional data D3, such as the height of the component serving as the inspection site A on the mounting board B2.

[0039] <Regarding the Processing Unit> The processing unit 6 is composed of a processor that operates by loading a predetermined program. The processing unit 6 performs an inspection process to inspect the state of each inspection portion A on the mounting board B2 by analyzing the shape data D1, including the two-dimensional data D2 and three-dimensional data D3, acquired by the measurement unit 4, and also performs a process to control the operation of the measurement unit 4. Furthermore, the processing unit 6 performs a process to calculate a waiting time ST, which is the waiting time for the inspection process for each mounting board B2 that is sequentially carried into the inspection position P2 of the board inspection device 3. The processing unit 6 also performs a process to control the display unit 68 and operation unit 69 provided in the board inspection device 3.

[0040] The display unit 68 is a display that displays various information and data. The operation unit 69 is composed of a keyboard, a mouse, or a touch panel provided on the display unit 68. The operation unit 69 accepts input operations of various commands by an operator OP.

[0041] The processing unit 6 functionally includes an axis processing unit 61 , an imaging processing unit 62 , a calculation unit 63 , a measurement processing unit 64 , a storage unit 65 , a communication processing unit 66 , and an overall processing unit 67 .

[0042] (Overall Processing Unit) The overall processing unit 67 performs processing to comprehensively control the operations of the axis processing unit 61 , the image capturing processing unit 62 , the calculation unit 63 , the measurement processing unit 64 , the storage unit 65 , the communication processing unit 66 , the display unit 68 , and the operation unit 69 .

[0043] (Communication Processing Unit) The communication processing unit 66 is an interface circuit that connects the board inspection device 3 and the board detection unit 7 so that data communication is possible. The communication processing unit 66 receives the board detection signal SG1 output from the board detection unit 7. In other words, the communication processing unit 66 receives the specific detection signal SG2 output from the specific detection unit 71, and also receives the downstream detection signal SG3 output from the downstream detection unit 72.

[0044] The communication processing unit 66 also connects the board inspection device 3 and the judgment terminal 8 so as to enable data communication between them. The communication processing unit 66 transmits to the judgment terminal 8 board images of the mounting board B2, which are images indicated by the shape data D1 acquired by the measurement unit 4 and for which the state of the inspection portion A has been judged to be defective by the measurement processing unit 64 described below, and receives the results of the secondary judgment output from the judgment terminal 8.

[0045] Furthermore, the communication processing unit 66 connects the board inspection device 3 and each operation device 1 on the component mounting line ML so that data communication is possible. The communication processing unit 66 receives information from each operation device 1, such as the operation time WT of each operation device 1, the remaining production quantity NP of mounting boards B2, and temporary suspension information PJ that is output when production of mounting boards B2 is temporarily suspended at each operation device 1.

[0046] (Storage Unit) The storage unit 65 stores various data, setting values, and the like required for the operation of the board inspection device 3. For example, the storage unit 65 stores board data BD. The board data BD contains information regarding the shape and position of the inspection portion A of each component on the mounting board B2. If design data for the mounting board B2 that specifies the shape and position of the components exists, the design data may be stored in the storage unit 65.

[0047] (Axis Processing Unit) The axis processing unit 61 controls the movement mechanism 51 to move the measurement unit 4. The movement mechanism 51 has an X-axis drive motor, a Y-axis drive motor, and a Z-axis drive motor for moving the measurement unit 4. The axis processing unit 61 controls these drive motors to move the measurement unit 4 to a position above each inspection site A on the mounting board B2.

[0048] (Image capture processing unit) The image capture processing unit 62 controls the first measurement unit 41 and the second measurement unit 42 mounted on the measurement unit 4 to acquire shape data D1 including two-dimensional data D2 and three-dimensional data D3 of each inspection area A on the mounting board B2.

[0049] (Measurement Processing Unit) The measurement processing unit 64 performs a board data creation process to create board data BD, and also performs an inspection process to perform a primary determination of the quality of the state of each inspection portion A on the mounting board B2. First, the board data creation process of the measurement processing unit 64 will be described with reference to the flowchart of FIG.

[0050] The measurement processing unit 64 performs a board data creation process prior to the inspection process of inspecting each inspection portion A of the mounting board B2 in conjunction with the production of the mounting board B2 by each working device 1 in the component mounting line ML. The measurement processing unit 64 converts, for example, board data for the mounting device used in the mounting device 13 into data for the board inspection device (step a1), and causes the measurement unit 4 to acquire an overall image of the prototype board via the imaging processing unit 62 (step a2). The prototype board is a board prototyped by the mounting device 13 before the production of the mounting board B2, and is a board on which components are mounted in the same manner as the mounting board B2. The measurement processing unit 64 sets information about the FID marks of the board in the board data BD based on the overall image of the prototype board (step a3).

[0051] Next, the measurement processing unit 64 causes the measurement unit 4 to acquire shape data D1, including two-dimensional data D2 and three-dimensional data D3 for each field of view of the prototype board, via the imaging processing unit 62 (step a4). Then, the measurement processing unit 64 sets inspection portion information BD1 in the board data BD based on the shape data D1 of the prototype board (step a5), and sets inspection item information BD2 and detection method information BD3 in the board data BD in association with the inspection portion information BD1 (step a6). The inspection portion information BD1 is information including the shape and position of each inspection portion A on the mounting board B2. The inspection item information BD2 is information indicating the inspection item of the inspection portion A. The detection method information BD3 is information indicating the detection method for the inspection item indicated in the inspection item information BD2. In the example shown in Figure 4, the inspection area A indicated by the inspection area information BD1 is a component, the inspection items indicated by the inspection item information BD2 are component position, component height, lead protrusion, and lead lift, etc., and the detection methods indicated by the detection method information BD3 are two-dimensional data analysis and three-dimensional data analysis.

[0052] When the measurement processing unit 64 has completed setting the inspection portion information BD1, the inspection item information BD2, and the detection technique information BD3 for the board data BD, the measurement processing unit 64 temporarily ends the board data creation process.

[0053] The measurement processing unit 64 performs an inspection process in which, while referencing the board data BD created in the board data creation process, it performs an initial judgment to determine whether the state of each inspection portion A on the mounting board B2 is good or bad. A mounting board B2 whose inspection portion A is determined to be bad in the initial judgment by the measurement processing unit 64 may be determined to be good in a secondary judgment by the operator OP using the judgment terminal 8. In this case, the operator OP may edit the inspection portion information BD1 set in the board data BD, considering that the board data BD may be inappropriate. Once the inspection portion information BD1 of the board data BD has been edited in this way, the measurement processing unit 64 fine-tunes the board data BD in accordance with the editing of the inspection portion information BD1 (step a7). Details of fine-tuning the board data BD will be described later.

[0054] Next, the inspection process of the measurement processing unit 64 will be described with reference to the flowchart of Fig. 5. The measurement processing unit 64 performs an inspection process to inspect the state of each inspection portion A of the mounting board B2 carried into the inspection position P2 in conjunction with the production of a plurality of mounting boards B2 in lots by each working device 1 in the component mounting line ML.

[0055] The measurement processing unit 64 causes the measurement unit 4 to acquire shape data D1, including two-dimensional data D2 and three-dimensional data D3, of the mounting board B2 carried into the inspection position P2 via the imaging processing unit 62 (step b1). Subsequently, the measurement processing unit 64 references the board data BD (step b2) and generates shape information DA of each inspection portion A on the mounting board B2 while comparing the inspection portion information BD1 set in the board data BD with the shape data D1 acquired by the measurement unit 4 (step b3). The measurement processing unit 64 then inspects the state of each inspection portion A based on the generated shape information DA (step b4).

[0056] A mounted board B2 for which the measurement processing unit 64 has determined that the condition of the inspection portion A is good is carried out from the board inspection device 3 based on the operation of the unloader ULD. On the other hand, a mounted board B2 for which the measurement processing unit 64 has determined that the condition of the inspection portion A is bad is stopped at the inspection position P2 at least until the next mounted board B2 is carried into the inspection position P2, and then is carried out from the board inspection device 3 based on the operation of the unloader ULD. If the measurement processing unit 64 has determined that the condition of the inspection portion A is bad, the communication processing unit 66 transmits a board image indicated by the shape data D1 acquired by the measurement unit 4 to the judgment terminal 8.

[0057] The operator OP visually checks the board image displayed on the judgment terminal 8 and makes a secondary judgment to finally determine whether the condition of the inspection portion A is poor as determined by the primary judgment by the measurement processing portion 64, or whether the primary judgment by the measurement processing portion 64 was an overjudgment and the condition of the inspection portion A should be determined to be good. Furthermore, if the primary judgment by the measurement processing portion 64 is an overjudgment, the operator OP assumes that the board data BD referenced by the measurement processing portion 64 in the primary judgment may be inappropriate, and edits the inspection portion information BD1 set in the board data BD and performs tuning of the board data BD. The operator OP needs to perform the secondary judgment and tune the board data BD so as not to reduce the productivity of the multiple mounted boards B2 produced in lots on the component mounting line ML.

[0058] (Calculation Unit) The calculation unit 63 performs a wait time calculation process to calculate a wait time ST, which is the wait time for the measurement processing unit 64 to perform the inspection process on each of the mounted boards B2 that are sequentially carried into the inspection position P2. The wait time ST is time that can be effectively used to perform secondary judgment and tuning of the board data BD without reducing the productivity of the mounted boards B2 on the component mounting line ML. The wait time calculation process of the calculation unit 63 will be described with reference to FIG. 6 .

[0059] The calculation unit 63 acquires the board detection signal SG1 output from the board detection unit 7 via the communication processing unit 66 (step c1), and calculates the waiting time ST based on the operation time WT of the maintenance device 1 to which the board detection unit 7 is attached (step c2). The waiting time ST is the predicted time from when the measurement processing unit 64 finishes inspecting one mounting board B2 at the inspection position P2 until the next mounting board B2 following the one mounting board B2 is carried into the inspection position P2. This waiting time ST is the waiting time for the inspection process by the measurement processing unit 64. Because the waiting time ST is calculated based on the operation time WT of the maintenance device 1 to which the board detection unit 7 is attached, it is an accurate waiting time for inspection of the mounting board B2 by the maintenance device 1 depending on the production status of the mounting board B2.

[0060] In this embodiment, the calculation unit 63 calculates the waiting time ST based on the working time WT of the specific work apparatus 1A to which the specific detection unit 71 is attached. Specifically, the calculation unit 63 calculates the waiting time ST by subtracting the inspection time IT, which indicates the time required for the measurement processing unit 64 to inspect one mounting board B2, from the working time WT of the specific work apparatus 1A. That is, the calculation unit 63 calculates the waiting time ST according to the following formula (1). Waiting time ST = working time WT - inspection time IT (1)

[0061] In this way, the calculation unit 63 calculates the waiting time ST based on the longest working time WT among the working times WT of the multiple working devices 1. In this case, the waiting time ST calculated by the calculation unit 63 becomes a more accurate waiting time for inspection depending on the production status of the mounting board B2 by the specific working device 1A that has the longest working time WT.

[0062] In this embodiment, a predetermined number of mounting boards B2 can be held at an inspection acceptance position P1 upstream of the inspection position P2 in the transport direction TD. In this case, the calculation unit 63 calculates an allowable waiting time PST, which is allowed as the maximum time to wait for inspection, based on the number NH1 of mounting boards B2 that can be held at the inspection acceptance position P1 and the waiting time ST, taking into account the number NH1 that can be held.

[0063] Specifically, the calculation unit 63 calculates the current allowable number NH of mounting boards B2 held at the inspection acceptance position P1 by subtracting the current number NH2 of mounting boards B2 held at the inspection acceptance position P1 from the current number NH1 of mounting boards B2 that can be held at the inspection acceptance position P1 (step c3). That is, the calculation unit 63 calculates the current allowable number NH of mounting boards B2 held at the inspection acceptance position P1 according to the following formula (2): Allowable number NH of mounting boards B2=Maximum number NH1-Number of mounting boards B2 held at the inspection acceptance position P1 (step c3).

[0064] Next, the calculation unit 63 calculates the holding number zero time ZT, which is predicted as the time until the holding number NH2 of mounting boards B2 at the inspection acceptance position P1 becomes zero, by multiplying the inspection time IT of the measurement processing unit 64 by the current holding number NH2 of mounting boards B2 at the inspection acceptance position P1 (step c4). That is, the calculation unit 63 calculates the holding number zero time ZT according to the following formula (3). Holding number zero time ZT = inspection time IT × holding number NH2 (3)

[0065] Next, the calculation unit 63 calculates a production end time PET predicted as the time until production of the mounting board B2 on the component mounting line ML is completed by multiplying the waiting time ST calculated according to the above formula (1) by the remaining production quantity NP of the mounting board B2 on the component mounting line ML acquired via the communication processing unit 66 (step c5). That is, the calculation unit 63 calculates the production end time PET according to the following formula (4): Production end time PET = waiting time ST × remaining production quantity NP (4)

[0066] Next, the calculation unit 63 determines whether the production end time PET calculated according to the above formula (4) is longer than the retention number zero time ZT calculated according to the above formula (3) (step c6).

[0067] If the production end time PET is longer than the holding number zero time ZT (YES in step c6), the calculation unit 63 sets the production end time PET as the allowable waiting time PST (step c7). In this case, the calculation unit 63 sets the value obtained by multiplying the waiting time ST calculated according to the above formula (1) by the remaining production number NP as the allowable waiting time PST. On the other hand, if the production end time PET is shorter than the holding number zero time ZT (NO in step c6), the calculation unit 63 sets the value obtained by multiplying the waiting time ST calculated according to the above formula (1) by the allowable holding number NH calculated according to the above formula (2) as the allowable waiting time PST (step c8).

[0068] As described above, the calculation unit 63 can calculate the allowable waiting time PST, which is the maximum time allowed for waiting for inspection by the measurement processing unit 64, taking into account the number NH1 of mounting boards B2 that can be held at the inspection receiving position P1.

[0069] 7 during inspection of the state of each inspection portion A on the mounting board B2 by the inspection process of the measurement processing unit 64. The inspection screen ISS is a display screen on which, for example, a wait time display area ISA1, an entire image display area ISA2, a view image display area ISA3, an inspection information display area ISA4, an edit command area ISA5, an inspection start command area ISA6, and an inspection stop command area ISA7 are set.

[0070] The display unit 68 displays, in the entire image display area ISA2 and the view image display area ISA3 on the inspection screen ISS, an image indicated by the shape data D1 acquired by the measurement unit 4 regarding the mounting board B2 that is the target of inspection processing by the measurement processing unit 64. Furthermore, the display unit 68 displays, in the inspection information display area ISA4 on the inspection screen ISS, inspection information including the inspection time IT and the like relating to the status of the inspection processing by the measurement processing unit 64.

[0071] An examination start command area ISA6 set on the examination screen ISS of the display unit 68 is an area that accepts the input operation of an examination start command for starting the examination process of the measurement processing unit 64. Furthermore, an examination stop command area ISA7 set on the examination screen ISS of the display unit 68 is an area that accepts the input operation of an examination stop command for temporarily stopping the examination process of the measurement processing unit 64. Using the operation unit 69, the operator OP can input an examination start command into the examination start command area ISA6 and can also input an examination stop command into the examination stop command area ISA7.

[0072] Furthermore, the display unit 68 displays the waiting time ST and the permissible waiting time PST calculated by the calculation unit 63 in a waiting time display area ISA1 on the inspection screen ISS. At this time, the display unit 68 may display a plurality of waiting times ST corresponding to each of the plurality of mounting boards B2, for the waiting time ST as the time to wait for inspection corresponding to one mounting board B2 in the measurement processing unit 64. In the example shown in Fig. 7, the display unit 68 displays three waiting times ST, NEXT1, 2, and 3, corresponding to each of the three mounting boards B2.

[0073] In the board inspection device 3, the measurement processing unit 64 sequentially inspects the condition of each inspection portion A of the mounting board B2 carried into the inspection position P2 during the inspection process in conjunction with the production of multiple mounting boards B2 in lots by multiple operating devices 1 on the component mounting line ML. Furthermore, in the board inspection device 3, the calculation unit 63 calculates the waiting time ST for inspection, and the display unit 68 displays the waiting time ST. The calculation unit 63 calculates the waiting time ST based on the working time WT of the operating device 1 having the board detection unit 7 attached to the board exit. In this case, the waiting time ST calculated by the calculation unit 63 is an accurate waiting time for inspection depending on the production status of the mounting boards B2 by the operating device 1. This allows the display unit 68 to display the accurate waiting time ST depending on the production status of the mounting boards B2 by the operating device 1. For example, by checking the waiting time ST displayed on the display unit 68, the operator OP can effectively use the waiting time ST to perform tasks such as secondary judgment using the judgment terminal 8 and tuning the board data BD referenced in the inspection process of the measurement processing unit 64, without reducing the productivity of the mounted board B2 on the component mounting line ML.

[0074] In this embodiment, the calculation unit 63 calculates the waiting time ST based on the working time WT of the specific work apparatus 1A to which the specific detection unit 71 is attached. In this case, the waiting time ST calculated by the calculation unit 63 becomes a more accurate waiting time for inspection depending on the production status of the mounting board B2 by the specific work apparatus 1A that has the longest working time WT among the multiple work apparatuses 1. This allows the display unit 68 to display a more accurate waiting time ST depending on the production status of the mounting board B2 by the specific work apparatus 1A.

[0075] Furthermore, the display unit 68 can display not only the waiting time ST as the inspection waiting time corresponding to one mounting board B2, but also the allowable waiting time PST that is allowable in consideration of the number NH1 of mounting boards B2 that can be held at the inspection receiving position P1. For example, the operator OP can perform tasks such as secondary judgment using the judgment terminal 8 and tuning the board data BD that is referenced in the inspection processing of the measurement processing unit 64, while checking the waiting time ST displayed on the display unit 68 and the longer allowable waiting time PST.

[0076] Furthermore, the edit command area ISA5 set on the inspection screen ISS of the display unit 68 is an area that accepts an input operation of a data edit command to edit the inspection portion information BD1 in the substrate data BD that is referenced in the inspection process of the measurement processing unit 64. In this case, when the operator OP determines that the waiting time ST or the permissible waiting time PST displayed in the waiting time display area ISA1 of the inspection screen ISS on the display unit 68 can be effectively used to tune the substrate data BD by editing the inspection portion information BD1 in the substrate data BD, the operator OP can use the operation unit 69 to input a data edit command into the edit command area ISA5.

[0077] When a data editing command is input in response to an input operation into the editing command area ISA5 on the inspection screen ISS, the display unit 68 displays the editing screen ES shown in FIG. 8 after the measurement processing unit 64 has finished inspecting one mounting board B2. While the display unit 68 is displaying the editing screen ES, the inspection process by the measurement processing unit 64 is temporarily stopped. The editing screen ES is a screen that allows editing of the inspection portion information BD1 in the board data BD. The editing screen ES is a display screen in which, for example, a waiting time display area ESA1, an inspection portion information display area ESA2, an inspection item information display area ESA3, an inspection portion image display area ESA4, an image adjustment command area ESA5, and an editing input area ESA6 are set.

[0078] The display unit 68 displays, in an inspection portion image display area ESA4 on the editing screen ES, an image of the inspection portion A indicated by the shape data D1 acquired by the measurement unit 4, for the inspection portion A on the mounting board B2 that is the target of inspection processing by the measurement processing unit 64. An image adjustment command area ESA5 set on the editing screen ES of the display unit 68 is an area that accepts an input operation of an image adjustment command that adjusts the display mode of the image of the inspection portion A displayed in the inspection portion image display area ESA4. The operator OP can input an image adjustment command into the image adjustment command area ESA5 using the operation unit 69.

[0079] Furthermore, the display unit 68 displays the waiting time ST and the permissible waiting time PST calculated by the calculation unit 63 in a waiting time display area ESA1 on the editing screen ES. At this time, the display unit 68 may display a plurality of waiting times ST corresponding to the plurality of mounting boards B2, respectively, for the waiting time ST as the inspection waiting time corresponding to one mounting board B2 in the measurement processing unit 64. In the example shown in Fig. 8, the display unit 68 displays three waiting times ST, NEXT1, 2, and 3, corresponding to the three mounting boards B2, respectively.

[0080] Furthermore, the display unit 68 displays the inspection portion information BD1 set in the board data BD in an inspection portion information display area ESA2 on the editing screen ES. Furthermore, the display unit 68 displays the inspection item information BD2 set in the board data BD in an inspection item information display area ESA3 on the editing screen ES. An edit input area ESA6 set on the editing screen ES of the display unit 68 is an area that accepts input operations for editing the inspection portion information BD1 in the board data BD. In this case, the operator OP can tune the substrate data BD by editing the inspection part information BD1 of the substrate data BD based on input operations to the editing input area ESA6 while checking the waiting time ST or the allowable waiting time PST displayed in the waiting time display area ESA1 on the editing screen ES of the display unit 68 and referring to the inspection part information BD1 displayed in the inspection part information display area ESA2, the inspection item information BD2 displayed in the inspection item information display area ESA3, the image of the inspection part A displayed in the inspection part image display area ESA4, etc.

[0081] In the board inspection apparatus 3, when a data editing command is input to the editing command area ISA5 on the inspection screen ISS of the display unit 68, the measurement unit 4 may stop above the inspection portion A on one mounting board B2 after the measurement processing unit 64 has finished inspecting that mounting board B2. In this case, the display unit 68 can suitably display, in the inspection portion image display area ESA4 of the editing screen ES that is displayed in response to the input of the data editing command to the editing command area ISA5 on the inspection screen ISS, an image of the inspection portion A indicated by the shape data D1 acquired by the measurement unit 4. In this case, the operator OP can efficiently edit the inspection portion information BD1 of the board data BD while checking the image of the inspection portion A displayed on the editing screen ES of the display unit 68.

[0082] When the operator OP finishes editing the inspection portion information BD1 of the substrate data BD, the display unit 68 switches the display from the editing screen ES to the inspection screen ISS. With the display of the display unit 68 switched to the inspection screen ISS, the operator OP can input an inspection start command into the inspection start command area ISA6 on the inspection screen ISS. When the inspection start command is input into the inspection start command area ISA6 on the inspection screen ISS, the measurement processing unit 64 resumes the inspection process while referring to the substrate data BD after editing the inspection portion information BD1.

[0083] In the present embodiment, the calculation unit 63 may monitor, via the communication processing unit 66, whether each of the multiple operation apparatuses 1 outputs temporary stop information PJ that temporarily stops the production of the mounting boards B2 in lots. When the communication processing unit 66 acquires temporary stop information PJ output from the upstream operation apparatus 1B after the specific detection unit 71 attached to the specific operation apparatus 1A outputs a specific detection signal SG2 for one mounting board B2, the calculation unit 63 sequentially extends the standby time ST in accordance with the elapsed time of the temporary stop of the upstream operation apparatus 1B, as shown in FIG. 6 . That is, when the temporary stop information PJ is output from the upstream operation apparatus 1B, the calculation unit 63 sequentially extends the standby time ST in accordance with the elapsed time of the temporary stop of the upstream operation apparatus 1B until the specific detection signal SG2 for the next mounting board B2 is output from the specific detection unit 71.

[0084] When the specific detection unit 71 attached to the specific operation apparatus 1A outputs a specific detection signal SG2 for one mounting board B2 and then the upstream operation apparatus 1B outputs temporary stop information PJ, it is assumed that the timing of the next mounting board B2 following the first mounting board B2 being transported to the inspection position P2 will be delayed due to the temporary stop of the upstream operation apparatus 1B. Therefore, the calculation unit 63 gradually extends the waiting time ST calculated based on the operation time WT of the specific operation apparatus 1A in accordance with the elapsed time of the temporary stop of the upstream operation apparatus 1B. In this case, the display unit 68 can display the waiting time ST gradually extended in accordance with the elapsed time of the temporary stop of the upstream operation apparatus 1B. For example, the operator OP can perform tasks such as secondary evaluation using the evaluation terminal 8 or tuning the board data BD while checking the gradually extended waiting time ST displayed on the display unit 68.

[0085] Furthermore, when the communication processing unit 66 acquires temporary stop information PJ output from the downstream work apparatus 1C after the specific detection signal SG2 is output from the specific detection unit 71 attached to the specific work apparatus 1A, the calculation unit 63 successively extends the standby time ST in accordance with the elapsed time of the temporary stop of the downstream work apparatus 1C. In other words, when temporary stop information PJ is output from the downstream work apparatus 1C, the calculation unit 63 successively extends the standby time ST in accordance with the elapsed time of the temporary stop of the downstream work apparatus 1C until the downstream detection signal SG3 is output from the downstream detection unit 72 attached to the downstream work apparatus 1C.

[0086] If the downstream working apparatus 1C outputs temporary stop information PJ after the specific detection unit 71 attached to the specific working apparatus 1A outputs the specific detection signal SG2, it is expected that the timing of the mounting board B2 carried out from the specific working apparatus 1A to be transported to the inspection position P2 will be delayed due to the temporary stop of the downstream working apparatus 1C. Therefore, the calculation unit 63 calculates the waiting time ST based on the working time WT of the specific working apparatus 1A and gradually extends it in accordance with the elapsed time of the temporary stop of the downstream working apparatus 1C until the downstream detection unit 72 attached to the downstream working apparatus 1C outputs the downstream detection signal SG3. In this case, the display unit 68 can display the waiting time ST gradually extended in accordance with the elapsed time of the temporary stop of the downstream working apparatus 1C. For example, the operator OP can perform tasks such as secondary evaluation using the evaluation terminal 8 or tuning the board data BD while checking the gradually extended waiting time ST displayed on the display unit 68.

[0087] 2, the inspection system IS may further include a portable terminal device 9 capable of wireless communication with the substrate inspection apparatus 3. The portable terminal device 9 is a terminal device carried by the operator OP.

[0088] Then, in the substrate inspection device 3, the communication processing unit 66 connects to the portable terminal device 9 so as to be able to communicate wirelessly, and transmits support information SJ including the waiting time ST and the allowable waiting time PST to the portable terminal device 9. In this case, the operator OP can confirm the waiting time ST and the allowable waiting time PST for waiting for inspection in the substrate inspection device 3 by checking the support information SJ displayed on the portable terminal device 9.

[0089] [Modified Embodiments] Although the embodiments of the present invention have been described above, the present invention is not limited to these, and the following modified embodiments are possible, for example.

[0090] In the above embodiment, the substrate detector 7 is configured to include the specific detector 71 and the downstream detector 72, but the substrate detector 7 may be configured with only the specific detector 71.

[0091] Furthermore, in the above embodiment, the buffer conveyor 53 is arranged at the inspection receiving position P1 upstream of the inspection position P2 in the substrate inspection device 3, but the buffer conveyor 53 may be omitted.

[0092] In addition, in the above embodiment, a configuration was described in which the measurement processing unit 64 in the substrate inspection device 3 performs substrate data creation processing to create substrate data BD, but the measurement processing unit 64 may also be configured to acquire substrate data BD created by an external device separate and independent from the substrate inspection device 3.

[0093] [Inventions Included in the Above-Described Embodiments] The above-described embodiments include inventions having the following configurations.

[0094] According to one aspect of the present invention, an inspection system inspects mounted boards in a component mounting line in which a plurality of operating devices that perform operations for producing mounted boards, each having components mounted thereon, are arranged on a board transport path along which the boards are transported in a transport direction. The inspection system includes a board inspection device that is arranged downstream of the operating devices on the board transport path in the transport direction and that inspects the condition of an inspection portion indicating an inspection target on the mounted board that has been transported to a predetermined inspection position, and a board detection unit that is attached to a board outlet that is located at the downstream end of the transport direction of any of the operating devices and that outputs a board detection signal when it detects the mounted board being transported through the board outlet. The board inspection device includes a calculation unit that calculates, based on the operation time required to produce one mounted board by the operating device to which the board detection unit is attached, a predicted wait time that is the time from when inspection of one mounted board at the inspection position is completed until the next mounted board following the one mounted board is transported to the inspection position, and a display unit that displays the wait time.

[0095] According to this inspection system, the board inspection device inspects the condition of the inspection portion of a mounted board carried into an inspection position in conjunction with the production of mounted boards by multiple operating devices on a component mounting line. In the board inspection device, a calculation unit calculates a waiting time for inspection, and a display unit displays the waiting time. The calculation unit calculates the waiting time based on the operating time of an operating device having a board detection unit attached to the board exit. In this case, the waiting time calculated by the calculation unit is an accurate waiting time for inspection depending on the production status of mounted boards by the operating device. This allows the display unit to display an accurate waiting time depending on the production status of mounted boards by the operating device. For example, by checking the waiting time displayed on the display unit, an operator can effectively use the waiting time to perform tasks such as secondary evaluation without reducing the productivity of mounted boards on the component mounting line.

[0096] In the above-described inspection system, the plurality of work devices may include a specific work device with the longest work time, the substrate detection unit may be attached to the substrate discharge port of the specific work device, and the calculation unit may calculate the waiting time based on the work time of the specific work device.

[0097] In this aspect, the calculation unit calculates the waiting time based on the longest operation time among the operation times of the plurality of operation devices. In this case, the waiting time calculated by the calculation unit becomes a more accurate waiting time for inspection depending on the production status of the mounting boards by the specific operation device with the longest operation time.

[0098] In the above inspection system, the calculation unit may monitor whether each of the plurality of operating devices outputs temporary stop information for temporarily stopping the production of the mounting boards, and when the temporary stop information is output from an upstream operating device that is located upstream in the transport direction relative to the specific operating device after the board detection signal for one of the mounting boards is output from the board detection unit, the calculation unit may successively extend the standby time in accordance with the elapsed time of the temporary stop of the upstream operating device until the board detection signal for the next mounting board is output from the board detection unit. In this case, the display unit displays the standby time that is successively extended by the calculation unit.

[0099] In this aspect, if a board detection signal for a mounting board is output from a board detection unit attached to a specific mounting apparatus and then temporary suspension information is output from an upstream processing apparatus, it is expected that the timing of the next mounting board following the first mounting board being transported to the inspection position will be delayed due to the temporary suspension of the upstream processing apparatus. Therefore, the calculation unit sequentially extends the waiting time calculated based on the operation time of the specific processing apparatus in accordance with the elapsed time of the temporary suspension of the upstream processing apparatus. In this case, the display unit can display the waiting time that is sequentially extended in accordance with the elapsed time of the temporary suspension of the upstream processing apparatus. For example, an operator can perform tasks such as secondary evaluation while checking the sequentially extended waiting time displayed on the display unit.

[0100] In the above-described inspection system, the plurality of operating devices may include a specific operating device having the longest operating time. In this case, the board detection unit may include a specific detection unit attached to the board discharge port of the specific operating device and outputting a specific detection signal as the board detection signal, and a downstream detection unit attached to the board discharge port of a downstream operating device disposed downstream of the specific operating device in the transport direction and outputting a downstream detection signal as the board detection signal. The calculation unit may monitor whether each of the plurality of operating devices outputs pause information for temporarily suspending the production of the mounted boards, calculate the waiting time based on the operating time of the specific operating device, and, if the pause information is output from the downstream operating device after the specific detection signal is output from the specific detection unit, sequentially extend the waiting time in accordance with the elapsed time of the pause of the downstream operating device until the downstream detection signal is output from the downstream detection unit. In this case, the display unit displays the waiting time sequentially extended by the calculation unit.

[0101] In this aspect, if temporary stop information is output from the downstream operating apparatus after a specific detection signal is output from a specific detection unit attached to the specific operating apparatus, it is expected that the timing of the mounting board carried out from the specific operating apparatus to be carried into the inspection position will be delayed due to the temporary stop of the downstream operating apparatus. Therefore, the calculation unit sequentially extends the waiting time calculated based on the operation time of the specific operating apparatus until the downstream detection signal is output from the downstream detection unit attached to the downstream operating apparatus, in accordance with the elapsed time of the temporary stop of the downstream operating apparatus. In this case, the display unit can display the waiting time that is sequentially extended in accordance with the elapsed time of the temporary stop of the downstream operating apparatus. For example, an operator can perform work such as secondary evaluation while checking the sequentially extended waiting time displayed on the display unit.

[0102] In the above inspection system, the board inspection device may set an inspection acceptance position capable of holding a predetermined number of the mounted boards, upstream of the inspection position in the transport direction. In this case, the calculation unit may calculate an allowable waiting time based on the number of the mounted boards that can be held at the inspection acceptance position, taking into account the number that can be held, and the display unit may display the allowable waiting time in addition to the waiting time.

[0103] In this aspect, a predetermined number of mounting boards can be held at the inspection acceptance position upstream of the inspection position. The calculation unit calculates an allowable waiting time as an inspection waiting time, taking into account the number of mounting boards that can be held at the inspection acceptance position. In this case, the display unit can display not only the waiting time for inspection corresponding to one mounting board, but also the allowable waiting time that is allowable taking into account the number of mounting boards that can be held at the inspection acceptance position. For example, an operator can perform work such as secondary judgment while checking the waiting time displayed on the display unit and a longer allowable waiting time.

[0104] In the above-described inspection system, the board inspection apparatus may further include a measurement unit that is movable above the mounted board carried into the inspection position and that acquires shape data of the inspection portion on the mounted board, and a measurement processing unit that references board data in which inspection portion information related to the inspection portion is set, generates shape information of the inspection portion by comparing the inspection portion information with the shape data, and inspects a state of the inspection portion based on the shape information. The display unit may display an inspection screen that has an edit command area that accepts an input operation of a data edit command to edit the inspection portion information in the board data during inspection of the state of the inspection portion by the measurement processing unit, and when the data edit command is input in response to an input operation in the edit command area on the inspection screen, display an edit screen that allows editing of the inspection portion information in the board data after inspection by the measurement processing unit is completed, and display the waiting time on both the inspection screen and the edit screen.

[0105] In this aspect, the display unit displays an inspection screen while the measurement processing unit is inspecting the state of the inspection portion. This inspection screen has an edit command area for accepting input of a data edit command for editing the inspection portion information of the substrate data, and also displays a waiting time. In this case, when the operator determines that the waiting time displayed on the inspection screen of the display unit can be effectively used for tuning the substrate data, he or she can input a data edit command into the edit command area.

[0106] When a data editing command is input in response to an input operation into an editing command area on the inspection screen, the display unit displays an editing screen after the inspection by the measurement processing unit is completed. This editing screen allows editing of the inspection portion information of the board data and displays the waiting time. In this case, the operator can tune the board data by editing the inspection portion information of the board data while checking the waiting time displayed on the editing screen of the display unit.

[0107] In the above-described inspection system, when the data editing command is input to the editing command area on the inspection screen, the measurement unit may stop above the inspection portion on the mounting board after the inspection by the measurement processing unit is completed.

[0108] In this aspect, when a data editing command is input to the editing command area on the inspection screen of the display unit, the measurement unit stops above the inspection portion on the mounting board. In this case, it is possible to display an image of the inspection portion represented by the shape data acquired by the measurement unit on the editing screen displayed by the display unit in response to the input of the data editing command. In this case, the operator can efficiently edit the inspection portion information of the board data while checking the image of the inspection portion displayed on the editing screen of the display unit.

[0109] The inspection system may further include a portable terminal device capable of wireless communication with the substrate inspection device, and the substrate inspection device may further include a communication processing unit wirelessly connected to the portable terminal device and configured to transmit information including the standby time to the portable terminal device.

[0110] In this aspect, the substrate inspection device can transmit information including the waiting time to the mobile terminal device via the communication processing unit, and in this case, the operator can check the waiting time for inspection in the substrate inspection device by checking the information displayed on the mobile terminal device.

[0111] A component mounting system according to another aspect of the present invention includes a component mounting line arranged on a board transport path that transports the board in a transport direction, and a plurality of work devices that perform work to produce a mounted board having components mounted on the board; and the above-mentioned inspection system that inspects the mounted board on the component mounting line.

[0112] As described above, according to the present invention, it is possible to provide an inspection system and a component mounting system that are capable of displaying an accurate waiting time on a board inspection device in accordance with the production status of mounted boards on a component mounting line.

Claims

1. An inspection system for inspecting mounted boards in a component mounting line where a plurality of operating devices that perform operations for producing mounted boards, each having components mounted thereon, are arranged on a board transport path that transports the board in a transport direction, the inspection system comprising: a board inspection device that is arranged downstream in the transport direction from the plurality of operating devices on the board transport path and inspects the state of an inspection portion that indicates an inspection target, on the mounted board that has been transported to a predetermined inspection position; and a board detection unit that is attached to a board discharge port that is located at the downstream end in the transport direction of any of the plurality of operating devices and outputs a board detection signal when it detects the mounted board being transported from the board discharge port, the board inspection device including: a calculation unit that calculates a predicted wait time as the time from when inspection of one of the mounted boards at the inspection position is completed until the next mounted board following the one mounted board is transported to the inspection position, based on the operation time when one of the mounted boards is produced by the operating device to which the board detection unit is attached; and a display unit that displays the wait time.

2. The inspection system of claim 1, wherein the plurality of work devices include a specific work device with the longest work time, the board detection unit is attached to the board discharge port of the specific work device, and the calculation unit calculates the waiting time based on the work time of the specific work device.

3. The inspection system according to claim 2, wherein the calculation unit monitors whether pause information for temporarily suspending production of the mounting boards is output from each of the plurality of working devices, and when the pause information is output from an upstream working device that is arranged upstream in the conveying direction relative to the specific working device after the board detection signal for one of the mounting boards is output from the board detection unit, the calculation unit successively extends the waiting time in accordance with the elapsed time of the temporary suspension of the upstream working device until the board detection signal for the next mounting board is output from the board detection unit, and the display unit displays the waiting time that is successively extended by the calculation unit.

4. An inspection system as described in claim 1, wherein the plurality of working devices includes a specific working device whose working time is the longest, the board detection unit includes: a specific detection unit attached to the board discharge port of the specific working device, and outputs a specific detection signal as the board detection signal; and a downstream detection unit attached to the board discharge port of a downstream working device located downstream in the transport direction from the specific working device, and outputs a downstream detection signal as the board detection signal, the calculation unit monitors whether each of the plurality of working devices has output pause information to temporarily suspend production of the mounted boards, calculates the wait time based on the working time of the specific working device, and when the pause information is output from the downstream working device after the specific detection signal is output from the specific detection unit, successively extends the wait time in accordance with the elapsed time of the temporary suspension of the downstream working device until the downstream detection signal is output from the downstream detection unit, and the display unit displays the wait time that is successively extended by the calculation unit.

5. The inspection system according to claim 1, wherein the board inspection device has an inspection acceptance position that is capable of holding a predetermined number of the mounted boards set upstream of the inspection position in the transport direction, the calculation unit calculates an allowable waiting time based on the number of mounted boards that can be held at the inspection acceptance position and taking into account said number, and the display unit displays the allowable waiting time in addition to the waiting time.

6. The substrate inspection device further includes: a measurement unit that is movable above the mounted substrate that has been brought into the inspection position, and that acquires shape data of the inspection portion on the mounted substrate; and a measurement processing unit that references substrate data in which inspection portion information related to the inspection portion has been set, generates shape information of the inspection portion by comparing the inspection portion information with the shape data, and inspects the state of the inspection portion based on the shape information; and the display unit displays, during inspection of the state of the inspection portion by the measurement processing unit, an inspection screen in which an edit command area is set that accepts input operations of data edit commands to edit the inspection portion information in the substrate data, when the data edit command is input in response to input operations in the edit command area on the inspection screen, displays an edit screen that allows editing of the inspection portion information in the substrate data after inspection by the measurement processing unit is completed, and causes the waiting time to be displayed on both the inspection screen and the edit screen.

7. The inspection system according to claim 6, wherein the measurement unit stops above the inspection portion on the mounting board after the inspection by the measurement processing unit is completed when the data editing command is input to the editing command area on the inspection screen.

8. The inspection system according to claim 1, further comprising a portable terminal device capable of wireless communication with the substrate inspection device, wherein the substrate inspection device further comprises a communication processing unit that is wirelessly connected to the portable terminal device and transmits information including the standby time to the portable terminal device.

9. A component mounting system comprising: a component mounting line arranged on a board transport path that transports boards in a transport direction, and a plurality of work devices that perform work to produce mounted boards having components mounted on the boards; and an inspection system according to any one of claims 1 to 8 that inspects the mounted boards on the component mounting line.

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