Electronic device having component arrangement structure comprising PCB

Abstract

According to embodiments of the present disclosure, an electronic device is provided, the electronic device comprising: a PCB; a first component disposed on a first surface of the PCB; and a second component disposed on a second surface of the PCB facing in the opposite direction to the first surface, wherein the PCB comprises an opening formed between the first component and the second component, and the first component comprises a protrusion formed to face the second component and be inserted into the opening of the PCB.

Description

Electronic device including a component layout structure including a PCB

[0001] The present disclosure relates to an electronic device including a component layout structure including a printed circuit board (PCB).

[0002] An electronic device may include a PCB and a plurality of components arranged on the PCB.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] As electronic devices become slimmer, it can become difficult to place multiple components within them.

[0005] Embodiments of the present disclosure provide an electronic device including a component arrangement structure including a PCB that can secure space efficiency in a limited internal space within the electronic device when arranging a plurality of components on the PCB.

[0006] Various embodiments of the present disclosure are provided to address or at least alleviate the above-mentioned problems.

[0007] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0008] According to embodiments of the present disclosure, an electronic device is provided, comprising: a PCB; a first component disposed on a first side of the PCB; and a second component disposed on a second side of the PCB facing in an opposite direction to the first side; the PCB includes an opening formed between the first component and the second component; and the first component includes a protrusion configured to be inserted into the opening of the PCB and to face the second component.

[0009] An electronic device including a component arrangement structure including a PCB according to embodiments of the present disclosure can improve the degree of freedom in component design and slimness of the electronic device by enabling a plurality of components to be arranged space-efficiently with respect to the PCB.

[0010] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0011] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0013] FIG. 2 is a drawing showing appearances of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0014] FIG. 3 is a drawing showing appearances of a foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0015] FIG. 4 is a cross-sectional view of a foldable electronic device in an unfolded state taken along line D-D' of FIG. 2 according to various embodiments of the present disclosure.

[0016] FIG. 5 is a diagram illustrating a portion of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0017] FIG. 6 is a diagram illustrating a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0018] FIG. 7 is a diagram illustrating a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0019] FIG. 8 is a diagram illustrating a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0020] FIG. 9 is an exploded perspective view of a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0021] FIG. 10 is a cross-sectional view of a portion of a foldable electronic device taken along line F-F' of FIG. 6 according to various embodiments of the present disclosure.

[0022] FIG. 11 is a cross-sectional view of a portion of a foldable electronic device taken along line G-G' of FIG. 6, according to various embodiments of the present disclosure.

[0023] FIG. 12 is a perspective view of a portion of a foldable electronic device according to various embodiments of the present disclosure.

[0024] Hereinafter, various embodiments of the present disclosure are described in more detail with reference to the attached drawings.

[0025] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present disclosure.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). The electronic device (101) may communicate with the external electronic device (104) via the server (108). The electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and / or an antenna module (197). In various embodiments of the present disclosure, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry. For example, a sensor module (176), a camera module (180), or an antenna module (197) may be implemented embedded in one component (e.g., a display module (160)).

[0027] The processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used herein, including in the claims, may include various processing circuits, including at least one processor, wherein one or more of the at least one processor may be configured to individually and / or collectively perform the various functions described herein. When the terms "processor," "at least one processor," and "one or more processors" as used herein are described as being configured to perform a number of functions, these terms encompass, for example, without limitation, situations where one processor performs some of the recited functions and other processor(s) perform other of the recited functions, and situations where a single processor may perform all of the recited functions. Furthermore, the at least one processor may include a combination of processors that perform the various recited / disclosed functions, for example, in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions. The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. As at least part of the data processing or operations, the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134).The processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121). Additionally or alternatively, the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0028] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. The auxiliary processor (123) (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to various embodiments of the present disclosure, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

[0029] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The various data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) and / or a non-volatile memory (134).

[0030] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), and / or an application (146).

[0031] The input module (150) can receive commands or data to be used in other components of the electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0032] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0033] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. The display module (160) may include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).

[0034] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. The audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (101).

[0035] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. The sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the external electronic device (102)). The interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). The connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0038] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. The haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0039] The camera module (180) can capture still images and videos. The camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0040] The power management module (188) can manage power supplied to or consumed by the electronic device (101). The power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0041] A battery (189) may power at least one component of the electronic device (101). The battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0042] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication. The communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module is a first network (198) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a legacy cellular network, 5G (5 thThe wireless communication module (192) can communicate with an external electronic device (104) via a wide area network (e.g., a LAN or WAN), a next generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196) to identify or authenticate the electronic device (101) within a communication network, such as a first network (198) or a second network (199).

[0043] The wireless communication module (192) is 4G (4 thThe wireless communication module (192) can support 5G networks and next-generation communication technologies after the 5G network, such as new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (i.e., enhanced mobile broadband (eMBB)), minimizing terminal power and connecting multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to various embodiments of the present disclosure, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0044] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). The antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0045] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a PCB, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the PCB and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the PCB and capable of transmitting or receiving signals in the designated high-frequency band.

[0046] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0047] Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be of the same or a different type of device as the electronic device (101). All or part of the operations executed by the electronic device (101) may be executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute the function or at least a part of the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result, either as is or by further processing, as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be utilized, for example. The electronic device (101) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In another embodiment of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to various embodiments of the present disclosure, an external electronic device (104) or server (108) may be included in a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] Electronic devices according to various embodiments of the present disclosure may take various forms. Electronic devices may include portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, electronic devices are not limited to the aforementioned devices.

[0049] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.

[0050] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0051] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0052] The methods according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)) or may be provided through an application store (e.g., PLAYSTORE). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0053] Each component (e.g., a module or a program) of the above-described components may comprise one or more entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration. The operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0054] In the present disclosure, “disposed on XX” can be understood as disposed adjacent to XX, disposed in substantial contact with XX, or coupled to XX.

[0055] In the present disclosure, “located on XX” may be understood as being located adjacent to XX, positioned in substantial contact with XX, or coupled to XX.

[0056] In the present disclosure, when the term "substantially" is used to define a structural part (structure or structural element), the expression including the term "substantially" is understood or interpreted as a technical characteristic produced within the technical tolerances of the method used to manufacture it. Furthermore, the expression "including" means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art would know how to achieve that tolerance.

[0057] The “comparative examples” mentioned in this disclosure are provided only for comparison with embodiments of this disclosure and do not have prior status with respect to various embodiments of this disclosure.

[0058] FIG. 2 is a diagram illustrating shapes of a foldable electronic device (2) in an unfolded state (also referred to as an unfolding state or a flat state) according to various embodiments of the present disclosure. FIG. 3 is a diagram illustrating shapes of a foldable electronic device (2) in a folded state (also referred to as a folding state) according to various embodiments of the present disclosure. FIG. 4 is a cross-sectional view of a foldable electronic device (2) in an unfolded state taken along line D-D' of FIG. 2 according to various embodiments of the present disclosure.

[0059] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 2, 3, and 4. All combinations of the features described below with respect to FIGS. 2, 3, and 4 may be considered to be encompassed by the present disclosure as specific examples.

[0060] Referring to FIGS. 2, 3, and 4, the foldable electronic device (2) may include a foldable housing (20) and a first display module (25). In various embodiments, the foldable electronic device (2) may be the electronic device (101) of FIG. 1.

[0061] According to various embodiments, the unfolded state and the folded state of the foldable electronic device (2) may be provided (or formed) by the foldable housing (20). The "unfolded state of the foldable electronic device (2)" and the "unfolded state of the foldable housing (20)" described in the present disclosure may be understood as the same. The "folded state of the foldable electronic device (2)" and the "folded state of the foldable housing (20)" described in the present disclosure may be understood as the same.

[0062] According to various embodiments, the foldable housing (20) may include a first housing (also referred to as a first housing portion or a first housing structure) (21), a second housing (also referred to as a second housing portion or a second housing structure) (22), a hinge cover (23), and / or a hinge portion (24). The first housing (21) and the second housing (22) may be rotatably connected via the hinge portion (24). The first housing (21) and the second housing (22) may be rotatable relative to each other with respect to the hinge portion (24). The hinge portion (also referred to as a hinge structure, a hinge module, or a hinge assembly) (24) may include, for example, one or more hinges (e.g., a first hinge (241), a second hinge (242), and / or a third hinge (243)).

[0063] According to various embodiments, a first display module (also referred to as a first display) (25) may be disposed in a foldable housing (20). The first display module (25) may include, for example, a flexible display module (also referred to as a flexible display) or a foldable display module (also referred to as a foldable display) that can be deformed in response to a transition between an unfolded state and a folded state of the foldable electronic device (2).

[0064] According to various embodiments, the first display module (25) may include a display area (250). The display area (250) may include an active area or a screen area capable of displaying an image based on an electrical signal. The display area (250) may include a first display area (251) corresponding to the first housing (21), a second display area (252) corresponding to the second housing (22), and a third display area (253) corresponding to the hinge portion (24). The third display area (253) may extend the first display area (251) and the second display area (252).

[0065] According to various embodiments, the first display area (251) may be disposed in the first housing (21). The shape of the first display area (251) may be maintained by support of the first housing (21). For example, the first display area (251) may be supported by the first housing (21) and provided (or formed) to be substantially flat. The second display area (252) may be disposed in the second housing (22). The shape of the second display area (252) may be maintained by support of the second housing (22). For example, the second display area (252) may be supported by the second housing (22) and provided (or formed) to be substantially flat. The third display area (253) may be positioned corresponding to the hinge portion (24). When the foldable electronic device (2) switches between an unfolded state and a folded state, the third display area (253) can be deformed corresponding to the relative position between the first display area (251) and the second display area (252). In the unfolded state of the foldable electronic device (2), the third display area (253) can be arranged substantially flat. In the folded state of the foldable electronic device (2), the third display area (253) can be arranged in a bent form. The unfolded state of the foldable electronic device (2) can be understood as a state in which the third display area (253) is arranged flat. The folded state of the foldable electronic device (2) can be understood as a state in which the third display area (253) is arranged in a bent form. In the present disclosure, when the term "substantially" is used to limit or define a structural member, the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.Additionally, the expression "including" implies that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve that tolerance.

[0066] According to various embodiments, in the unfolded state of the foldable electronic device (2), the first display area (251) and the second display area (252) may form an angle of about 180 degrees, and the display area (250) may be provided (or arranged) in a substantially flat form. In the context of the present disclosure, the flat form means that the display area (250) is extended into a two-dimensional plane. The substantially flat form allows a deviation of 5 degrees compared to the flat form. Due to the relative positions between the first display area (251) arranged in the first housing (21) and the second display area (252) arranged in the second housing (22) in the unfolded state of the foldable electronic device (2), the third display area (253) may be arranged flat. In the unfolded state of the foldable electronic device (2), the third display area (253) can be pulled from both sides by the first display area (251) and the second display area (252), and the pulling force can be provided so as to reduce damage to the third display area (253) while placing the third display area (253) flat. The third display area (253) can be provided (or formed) with an extended width so as to be placed flat while reducing stress when pulled by the first display area (251) and the second display area (252) in the unfolded state of the foldable electronic device (2).

[0067] According to various embodiments, in the unfolded state of the foldable electronic device (2), the hinge portion (24) can support the third display area (253) of the first display module (25) substantially flat. The hinge portion (24) can, for example, support the third display area (253) so that the third display area (253) can be placed flat without sagging or with reduced sagging in the unfolded state of the foldable electronic device (2), thereby reducing a crease phenomenon.

[0068] According to various embodiments, the display area (250) of the first display module (25) may substantially provide (or form) the front surface of the exterior of the foldable electronic device (2). The front surface of the foldable electronic device (2) may include a first front surface area provided (or formed) by the first display area (251), a second front surface area provided (or formed) by the second display area (252), and a third front surface area provided (or formed) by the third display area (253). The illustrated coordinate axis of the foldable electronic device (2) is illustrated, for example, with reference to the first housing (21), and a direction parallel to the positive direction of the z-coordinate axis may be defined or interpreted as a direction in which the substantially flat first front surface area faces. For example, the first front surface area provided (or formed) by the first display area (251) may be substantially parallel to the xy plane. In the unfolded state of the foldable electronic device (2), the front surface of the foldable electronic device (2) can be provided (or formed) as a substantially flat surface.

[0069] According to various embodiments, the foldable electronic device (2) may be implemented in an infolding manner in which the display area (250) of the first display module (25) (or the front surface of the foldable electronic device (2) where the display area (250) is visually visible) can be folded inward. FIG. 3 illustrates a fully folded state of the foldable electronic device (2) in which the first housing (21) and the second housing (22) are positioned so that they no longer come close to each other. In the fully folded state of the foldable electronic device (2), the first display area (251) and the second display area (252) (or the first front surface area and the second front surface area) may face each other. For example, in a fully folded state of the foldable electronic device (2), the angle between the first housing (21) and the second housing (22) (or, the angle between the first display area (251) and the second display area (252), or the angle between the first front area and the second front area) may be from about 0 degrees to about 10 degrees. In a fully folded state of the foldable electronic device (2), the display area (250) of the first display module (25) may be substantially invisible. Although not illustrated separately, the foldable electronic device (2) may be arranged in an intermediate state between the unfolded state and the fully folded state. For example, in an intermediate state of the foldable electronic device (2) in which the angle between the first housing (21) and the second housing (22) is greater than a certain angle, the foldable electronic device (2) may be configured to provide a user environment in which a user can utilize the display area (250). Hereinafter, the “folded state of the foldable electronic device (2)” of the present disclosure may be understood as a completely folded state.

[0070] According to various embodiments, when the foldable electronic device (2) is viewed in an unfolded state, the display area (250) of the first display module (25) may be provided (or formed) in a symmetrical shape with respect to a center line (A) of the foldable electronic device (2). The center line (A) of the foldable electronic device (2) may correspond to the middle of a width of the third display area (253) extending from a first boundary between the first display area (251) and the third display area (253) to a second boundary between the second display area (251) and the third display area (253) when the foldable electronic device (2) is viewed in an unfolded state. The positive and negative directions of the x-coordinate axis may be, for example, substantially perpendicular to the center line (A), and the positive and negative directions of the y-coordinate axis may be substantially parallel to the center line (A). In various embodiments, the center line (A) of the foldable electronic device (2) may be configured as a “folding axis” of the foldable housing (20) or the foldable electronic device (2). The folding axis may be substantially provided (or formed) by the hinge portion (24). The third display area (253) arranged in a bent shape in the folded state of the foldable electronic device (2) may be provided (or formed) in a substantially symmetrical shape with respect to the center line (A) of the foldable electronic device (2), but is not limited thereto.

[0071] According to various embodiments, the first housing (21) may include a first frame (also referred to as a first frame structure or a first framework) (211), and a first cover (also referred to as a first rear cover, a first rear plate, a first back cover, or a first back plate) (212) disposed on (or coupled to) the first frame (211). The combination of the first frame (211) and the first cover (212) may provide (or form) a first rear area and a first side area of ​​an exterior of the foldable electronic device (2). The first frame (211) may provide (or form) at least a portion of the first side area of ​​the foldable electronic device (2). The first cover (212) may provide (or form) at least a portion of the first rear area of ​​the foldable electronic device (2). The first rear area may be oriented in the opposite direction to the first front area of ​​the foldable electronic device (2) provided (or formed) by the first display area (251) of the first display module (25).

[0072] According to various embodiments, the first frame (211) may include a first side (also referred to as a first side member, a first side structure, or a first side bezel structure) (2112). The first side (2112) may surround at least a portion of the space between the first display area (251) and the first cover (212), and may provide (or form) at least a portion of the first side area of ​​the exterior of the foldable electronic device (2).

[0073] According to various embodiments, the first frame (211) may include a first support plate (also referred to as a first support member, a first support structure, a first support portion, or a first bracket) (2111) extending from or connected to the first side (2112). The first support plate (2111) may be a structural element positioned inside the foldable electronic device (2) corresponding to the first housing (21).

[0074] According to various embodiments, the first frame (211) may be provided (or formed) as an integrated or single structure (e.g., a single continuous structure or a complete structure) including a first support plate (2111) and a first side (2112).

[0075] According to various embodiments, the first frame (211) may be provided as a combination of a conductive body (or metal body) (not shown separately) including one or more conductive portions and a non-conductive body (or non-metal body) (not shown separately) including one or more non-conductive portions.

[0076] According to various embodiments, the first support plate (2111) may be positioned at least partially between the first display area (251) and the first cover (212). The first display area (251) may be disposed on the first support plate (2111), and the first support plate (2111) may support the first display area (251).

[0077] According to various embodiments, a plurality of electrical components, such as at least one PCB (e.g., the first PCB (41) and the third PCB (43) of FIG. 5) and a first battery (e.g., the first battery (51) of FIG. 5), may be at least partially disposed or coupled to the first support plate (2111) of the first frame (211) between the first frame (211) and the first cover (212).

[0078] According to various embodiments, electrical components (or electronic components), or various members related to electrical components, may be disposed or coupled to the first frame (211) or the first support plate (2111), or may be supported by the first frame (211) or the first support plate (2111). The first support plate (2111) may include, for example, a first support surface (2111A) and a third support surface (2111B). The first support surface (2111A) may be substantially oriented toward the first display area (251) of the first display module (25). The third support surface (2111B) may be positioned on the opposite side from the first support surface (2111A). The third support surface (2111B) may be substantially oriented toward the first cover (212). Electrical components (or electronic parts), or various members related to electrical components, may be arranged or coupled to the first support surface (2111A) and / or the third support surface (2111B), or may be supported by the first support surface (2111A) and / or the third support surface (2111B).

[0079] According to various embodiments, the second housing (22) may include a second frame (also referred to as a second frame structure or a second framework) (221) and / or a second cover (also referred to as a second rear cover, a second rear plate, a second back cover, or a second back plate) (222) disposed on the second frame (221). The combination of the second frame (221) and the second cover (222) may provide (or form) a second rear area and a second side area of ​​the exterior of the foldable electronic device (2). The second frame (221) may provide (or form) at least a portion of the second side area of ​​the foldable electronic device (2). The second cover (222) may provide (or form) at least a portion of the second rear area of ​​the foldable electronic device (2). The second rear area may be oriented in an opposite direction to the second front area of ​​the foldable electronic device (2) provided (or formed) by the second display area (252).

[0080] According to various embodiments, the second frame (221) may include a second side (also referred to as a second side member, a second side structure, or a second side bezel structure) (2212). The second side (2212) may surround at least a portion of the space between the second display area (252) and the second cover (222), and may provide (or form) at least a portion of the second side area of ​​the exterior of the foldable electronic device (2).

[0081] According to various embodiments, the second frame (221) may include a second support plate (also referred to as a second support member, a second support structure, a second support portion, or a second bracket) (2211) extending from or connected to the second side (2212). The second support plate (2211) may be a structural element positioned inside the foldable electronic device (2) corresponding to the second housing (22).

[0082] According to various embodiments, the second frame (221) may be provided as an integral or single structure (e.g., a single continuous structure or a complete structure) comprising a second support plate (2211) and a second side (2212).

[0083] According to various embodiments, the second frame (221) may be provided as a combination of a conductive body (or metal body) (not shown separately) including one or more conductive portions and a non-conductive body (or non-metal body) (not shown separately) including one or more non-conductive portions.

[0084] According to various embodiments, the second support plate (2211) may be positioned at least partially between the second display area (252) and the second cover (222). The second display area (252) may be disposed on the second support plate (2211), and the second support plate (2211) may support the second display area (252).

[0085] According to various embodiments, a plurality of electrical components, such as at least one PCB (e.g., the second PCB (42) and the fourth PCB (44) of FIG. 5) and a second battery (e.g., the second battery (52) of FIG. 5), may be at least partially disposed or coupled to the second support plate (2211) of the second frame (221) between the second frame (221) and the second cover (222).

[0086] According to various embodiments, electrical components (or electronic components), or various members related to electrical components, may be disposed or coupled to the second frame (221) or the second support plate (2211), or may be supported by the second frame (221) or the second support plate (2211). The second support plate (2211) may include, for example, a second support surface (2211A) and a fourth support surface (2211B). The second support surface (2211A) may be substantially oriented toward the second display area (252) of the first display module (25). The fourth support surface (2211B) may be positioned opposite the second support surface (2211A). The fourth support surface (2211B) may be substantially oriented toward the second cover (222). Electrical components (or electronic parts), or various members related to electrical components, may be arranged or coupled to the second support surface (2211A) and / or the fourth support surface (2211B), or may be supported by the second support surface (2211A) and / or the fourth support surface (2211B).

[0087] According to various embodiments, the first side (2112) of the first frame (211) may include a first side portion (B1), a third side portion (B3), a fifth side portion (B5), and / or a seventh side portion (B7). The first side portion (B1) may extend in a direction perpendicular to a center line (A) of the foldable electronic device (2) (e.g., a direction parallel to the x-coordinate axis). The third side portion (B3) may be spaced apart from the first side portion (B1) in a direction parallel to the center line (A) of the foldable electronic device (2) (e.g., a direction parallel to the y-coordinate axis) and may be substantially parallel to the first side portion (B1). The fifth side portion (B5) may extend or connect one end of the first side portion (B1) and one end of the third side portion (B3). The seventh side portion (B7) may extend or connect the other end of the first side portion (B1) and the other end of the third side portion (B3). The fifth side portion (B5) and the seventh side portion (B7) may extend in a direction parallel to the center line (A) of the foldable electronic device (2) and may be substantially parallel to each other. The seventh side portion (B7) may be positioned closer to the center line (A) of the foldable electronic device (2) than the fifth side portion (B5). The first corner (C1) from which the first side portion (B1) and the fifth side portion (B5) extend or connect, and / or the second corner (C2) from which the third side portion (B3) and the fifth side portion (B5) extend or connect, may be provided (or formed) in a smooth curved shape.

[0088] According to various embodiments, when viewed from above the first cover (212) (which may be understood as “when viewed in a direction orthogonal to the first cover (212)”) (e.g., when viewed in the positive direction of the z-coordinate axis), the first side portion (B1), the third side portion (B3), the fifth side portion (B5), and the seventh side portion (B7) may surround the first cover (212).

[0089] According to various embodiments, the second side (2212) of the second frame (221) may include a second side portion (B2), a fourth side portion (B4), a sixth side portion (B6), and / or an eighth side portion (B8). The second side portion (B2) may extend in a direction perpendicular to the center line (A) of the foldable electronic device (2). The fourth side portion (B4) may be spaced apart from the second side portion (B2) in a direction parallel to the center line (A) of the foldable electronic device (2) and may be substantially parallel to the second side portion (B2). The sixth side portion (B6) may extend or connect one end of the second side portion (B2) and one end of the fourth side portion (B4). The eighth side portion (B8) may extend or connect the other end of the second side portion (B2) and the other end of the fourth side portion (B4). The sixth side portion (B6) and the eighth side portion (B8) may extend in a direction parallel to the center line (A) of the foldable electronic device (2) and may be substantially parallel to each other. The eighth side portion (B8) may be positioned closer to the center line (A) of the foldable electronic device (2) than the sixth side portion (B6). The third corner (C3) from which the second side portion (B2) and the sixth side portion (B6) extend or connect, and / or the fourth corner (C4) from which the fourth side portion (B4) and the sixth side portion (B6) extend or connect, may be provided (or formed) in a smooth curved shape.

[0090] According to various embodiments, when viewed from above the second cover (222) (which may be understood as “when viewed in a direction perpendicular to the second cover (222)”) (e.g., when viewed in the positive direction of the z-axis in an unfolded state of the foldable electronic device (2)), the second side portion (B2), the fourth side portion (B4), the sixth side portion (B6), and the eighth side portion (B8) may surround the second cover (222).

[0091] According to various embodiments, in the folded state of the foldable electronic device (2), the first side (2112) of the first frame (211) and the second side (2212) of the second frame (221) can be aligned and overlapped. In the folded state of the foldable electronic device (2), the first side portion (B1) and the second side portion (B2) can be aligned and overlapped. In the folded state of the foldable electronic device (2), the third side portion (B3) and the fourth side portion (B4) can be aligned and overlapped. In the folded state of the foldable electronic device (2), the fifth side portion (B5) and the sixth side portion (B6) can be aligned and overlapped.

[0092] According to various embodiments, the first side portion (B1), the third side portion (B3), and the fifth side portion (B5) may be one-side bezels (or first screen bezels) surrounding one area of ​​the first display module (25) based on the center line (A) of the foldable electronic device (2). The second side portion (B2), the fourth side portion (B4), and the sixth side portion (B6) may be the other-side bezels (or second screen bezels) surrounding the other area of ​​the first display module (25) based on the center line (A) of the foldable electronic device (2). The seventh side portion (B7) and the eighth side portion (B8) may be positioned on opposite sides of the third display area (253). When viewed from above on the front of the foldable electronic device (2) in an unfolded state, the seventh side portion (B7) and the eighth side portion (B8) may not be visible.

[0093] According to various embodiments, the hinge cover (also called hinge housing) (23) may be connected to one or more hinges included in the hinge portion (24) (e.g., a first hinge (241), a second hinge (242), and a third hinge (243)).

[0094] According to various embodiments, when the foldable electronic device (2) is converted from an unfolded state to a folded state, a gap between the first frame (211) and the second frame (221) connected through the hinge portion (24) may open on the opposite side of the third display area (253) due to a change in the relative position between the first frame (211) and the second frame (221) and a change in the state of the hinge portion (24) coupled with the hinge cover (23). The hinge cover (23) may be exposed to the outside through the opened gap. For example, in the folded state of the foldable electronic device (2), the hinge cover (23) may be exposed to the outside through the opened gap between the seventh side portion (B7) of the first frame (211) and the eighth side portion (B8) of the second frame (221). The width of the gap between the seventh side portion (B7) of the first frame (211) and the eighth side portion (B8) of the second frame (221) may vary depending on the angle between the first frame (211) and the second frame (221). The hinge cover (23) may be more exposed to the outside in the folded state of the foldable electronic device (2) than in the intermediate state of the foldable electronic device (2). In the folded state of the foldable electronic device (2), the hinge cover (23) may become a part of the exterior that covers the inside of the foldable electronic device (2). In the folded state of the foldable electronic device (2), the side of the foldable electronic device (2) may include a first side area provided by a first side (2112) of a first frame (211), a second side area provided by a second side (2212) of a second frame (221), and a third side area provided by a hinge cover (23).

[0095] According to various embodiments, when the foldable electronic device (2) is switched from a folded state to an unfolded state, a gap between the first frame (211) and the second frame (221) on the opposite side of the third display area (253) may be closed due to a change in the relative position between the first frame (211) and the second frame (221) connected through the hinge portion (24) and a change in the state of the hinge portion (24) coupled with the hinge cover (23). For example, in the unfolded state of the foldable electronic device (2), a gap between the seventh side portion (B7) of the first frame (211) and the eighth side portion (B8) of the second frame (221) may be closed, and the hinge cover (23) may not be exposed to the outside.

[0096] According to various embodiments, the foldable electronic device (2) may include a second display module (26) (also referred to as a second display). The second display module (26) may be positioned between the second cover (222) and the second support plate (2211) of the second frame (221). The second display module (26) may be disposed or coupled to the second cover (222) and / or the second support plate (2211). A display area of ​​the second display module (26) may be visually visible through the second cover (222). The foldable electronic device (2) may be configured to display an image through the second display module (26) instead of the first display module (25) in a folded state.

[0097] According to various embodiments, the foldable electronic device (2) may include a first camera module (301), a second camera module (302), a third camera module (303), a fourth camera module (304), and / or a fifth camera module (305). The first camera module (301), the second camera module (302), the third camera module (303), the fourth camera module (304), or the fifth camera module (305) may include a camera including one or more lenses, image sensor(s), and / or an image signal processor (ISP).

[0098] According to various embodiments, the first camera module (301), the second camera module (302), and the third camera module (303) may be accommodated in the first housing (21) corresponding to the first cover (212) (or the first rear area of ​​the foldable electronic device (2)). For example, the first cover (212) may include a first camera hole (or a first light-transmitting area) corresponding to the first camera module (301), a second camera hole (or a second light-transmitting area) corresponding to the second camera module (302), and / or a third camera hole (or a third light-transmitting area) corresponding to the third camera module (303). The positions or numbers of the camera modules accommodated in the first housing (21) corresponding to the first cover (212) are not limited to the illustrated examples.

[0099] According to various embodiments, the first camera module (301), the second camera module (302), or the third camera module (303) may include, but is not limited to, a wide-angle camera, a telephoto camera, a color camera, a black and white camera, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera).

[0100] According to various embodiments, the first camera module (301), the second camera module (302), and the third camera module (303) may have different properties (e.g., angle of view) or functions.

[0101] According to various embodiments, the first camera module (301), the second camera module (302), or the third camera module (303) may provide different angles of view (or lenses having different angles of view). The foldable electronic device (2) may be configured to selectively use the angles of view of the first camera module (301), the second camera module (302), or the third camera module (303) based on a user's selection regarding the angle of view.

[0102] According to various embodiments, the fourth camera module (304) may be accommodated in the first housing (21) corresponding to the first front area of ​​the foldable electronic device (2).

[0103] According to various embodiments, the fourth camera module (304) may overlap the first display area (251) of the first display module (25) when viewed from above the first front area of ​​the foldable electronic device (2). The fourth camera module (304) may be positioned on the back surface of the first display area (251) or below the first display area (251). When viewed from the outside of the foldable electronic device (2), the fourth camera module (304), or the position of the fourth camera module (304), may be substantially not visually distinguishable (or exposed). The fourth camera module (304) may include, for example, a hidden display rear camera (e.g., an under display camera (UDC)). External light may pass through the first display module (25) to reach the fourth camera module (304).

[0104] According to various embodiments, although not shown separately, the fourth camera module (304) may be accommodated in the second housing (22) corresponding to the second front area of ​​the foldable electronic device (2).

[0105] According to various embodiments, although not shown separately, an additional camera module (not shown separately) may be accommodated in the second housing (22) corresponding to the second front area of ​​the foldable electronic device (2).

[0106] According to various embodiments, the fifth camera module (305) may be accommodated in the second housing (22) corresponding to the second cover (222) (or the second rear area of ​​the foldable electronic device (2)).

[0107] According to various embodiments, the fifth camera module (305) may be positioned in alignment with or at least partially inserted into an opening provided in the second display module (26). External light may pass through the opening provided in the second cover (222) and the second display module (26) to reach the fifth camera module (305). The opening of the second display module (26) aligned with or overlapping the fifth camera module (305) may be a through hole. In various embodiments, the opening of the second display module (26) aligned with or overlapping the fifth camera module (305) may be provided as a notch (not separately illustrated).

[0108] According to various embodiments, the fifth camera module (305) may overlap the second display module (26) when viewed from above the second rear area of ​​the foldable electronic device (2). The fifth camera module (305) may be positioned on the back surface of the second display module (26) or below the second display module (26). When viewed from the outside of the foldable electronic device (2), the fifth camera module (305), or the position of the fifth camera module (305), may be substantially not visually distinguishable (or exposed). The fifth camera module (305) may include, for example, a hidden display rear camera (e.g., UDC). External light may pass through the second cover (222) and the second display module (26) to reach the fifth camera module (305).

[0109] According to various embodiments, the first camera module (301), the second camera module (302), the third camera module (303), the fourth camera module (304), or the fifth camera module (305) may be configured to operate as at least a portion of the sensor module. For example, the IR camera module may operate as at least a portion of the sensor module.

[0110] According to various embodiments, the foldable electronic device (2) may include a light-emitting module (306). The light-emitting module (306) may be accommodated in the first housing (21) corresponding to the first cover (212) (or the first rear area of ​​the foldable electronic device (2)). The first cover (212) may include a flash hole (or a fourth light-transmitting area) corresponding to the light-emitting module (306). The light-emitting module (306) may include, for example, an LED or a xenon lamp, but is not limited thereto. The light-emitting module (306) may include a light source for the first camera module (301), the second camera module (302), and / or the third camera module (303).

[0111] According to various embodiments, the foldable electronic device (2) may include a first sensor module (307). The first sensor module (307) may be accommodated in a foldable housing (20) corresponding to the front surface of the foldable electronic device (2).

[0112] According to various embodiments, the first sensor module (307) may include an optical sensor module. The optical sensor module may include, for example, a proximity sensor module or a light sensor module.

[0113] According to various embodiments, the first sensor module (307) may overlap the first display area (251) of the first display module (25) when viewed from above the first front area of ​​the foldable electronic device (2). The first sensor module (307) may be positioned on the back surface of the first display area (251) or below the first display area (251). When viewed from the outside of the foldable electronic device (2), the first sensor module (307) or the position of the first sensor module (307) may be substantially not visually distinguishable (or exposed). External light may pass through the first display module (25) to reach the first sensor module (307).

[0114] According to various embodiments, the foldable electronic device (2) may include a second sensor module (308). The second sensor module (308) may be accommodated in a foldable housing (20) corresponding to the rear surface of the foldable electronic device (2).

[0115] According to various embodiments, the second sensor module (308) may include an optical sensor module. The optical sensor module may include, for example, a proximity sensor module, a light sensor module, or a radar sensor module.

[0116] According to various embodiments, the second sensor module (308) may overlap the display area of ​​the second display module (25) when viewed from above the second rear area of ​​the foldable electronic device (2). The second sensor module (308) may be positioned on the back surface of the display area of ​​the second display module (25), or below the display area of ​​the second display module (25). When viewed from the outside of the foldable electronic device (2), the second sensor module (308), or the position of the second sensor module (308), may be substantially not visually distinguishable (or exposed). External light may pass through the second cover (222) and the second display module (26) to reach the second sensor module (308).

[0117] According to various embodiments, the foldable electronic device (2) may further include various other sensor modules (e.g., a biometric sensor module) (not shown separately).

[0118] According to various embodiments, the foldable electronic device (2) may include a first audio input module (not shown separately), a second audio input module (not shown separately), a third audio input module (not shown separately), and / or a fourth audio input module (not shown separately). The first audio input module may include a first microphone (also referred to as a first microphone) (not shown separately). The first microphone may be accommodated in the first housing (21) corresponding to, for example, a first microphone hole (H11) included in the first side portion (B1) of the first side (2112). The second audio input module may include a second microphone (also referred to as a second microphone) (not shown separately). The second microphone may be accommodated in the first housing (21), for example, corresponding to the second microphone hole (H12) included in the first side portion (B1) of the first side (2112). The third sound input module may include a third microphone (also referred to as a third microphone) (not shown separately). The third microphone may be accommodated in the first housing (21), for example, corresponding to the third microphone hole (H13) included in the third side portion (B3) of the first side (2112). The fourth sound input module may include a fourth microphone (also referred to as a fourth microphone) (not shown separately). The fourth microphone may be accommodated in the second housing (22), for example, corresponding to the fourth microphone hole (H14) included in the second side portion (B2) of the second side (2212). The position or number of microphones and microphone holes corresponding to the microphones are not limited to the examples shown.

[0119] According to various embodiments, the foldable electronic device (2) may include a first audio output module (e.g., the first speaker module (71) of FIG. 5), a second audio output module (e.g., the second speaker module (72) of FIG. 6), and / or a third audio output module (not shown separately). The first audio output module may include a first speaker (e.g., the first speaker (712) of FIG. 5). The first speaker may be accommodated in the second housing (22) corresponding to a first speaker hole (H21) included in the second side portion (B2) of the second side (2212), for example. The second audio output module may include a second speaker (e.g., the second speaker (722) of FIG. 5). The second speaker may be accommodated in the second housing (22), for example, corresponding to the second speaker hole (H22) included in the fourth side portion (B4) of the second side (2212). The first speaker or the second speaker may be a speaker for multimedia playback or recording playback. The position or number of the speaker for multimedia playback or recording playback and the speaker holes corresponding to the speaker are not limited to the illustrated examples. The third audio output module may include a third speaker (not illustrated separately). The third speaker may be accommodated in the second housing (22), for example, corresponding to the third speaker hole (H23) provided between the second cover (222) and the second side portion (B2) of the second side (2212). The third speaker may include a call receiver. The location or number of the call receiver and the speaker holes corresponding to the call receiver (also called receiver holes) are not limited to the examples shown.

[0120] According to various embodiments, the foldable electronic device (2) may include a key input module. The key input module may include, for example, a first key (also referred to as a first side key) (309) and / or a second key (also referred to as a second side key) (310). The key input module may include a key signal generating unit (not shown separately). The first key (309) may be positioned in a first key hole included in a fifth side portion (B5) of the first side (2112), and the second key (310) may be positioned in a second key hole included in the fifth side portion (B5) of the first side (2112). The key signal generation unit may be configured to generate a first key signal in response to a press or touch on the first key (309), and a second key signal in response to a press or touch on the second key (310). The location or number of key input modules is not limited to the illustrated example.

[0121] According to various embodiments, the foldable electronic device (2) may include a first connection terminal (also referred to as a first connector or a first interface terminal) (311). The first connection terminal (311) may be accommodated in the first housing (21) in correspondence with a first connection terminal hole (e.g., a first connector hole) included in a third side portion (B3) of the first side (2112), for example. The foldable electronic device (2) may transmit and / or receive power and / or data to and from an external electronic device electrically connected to the first connection terminal (311). The first connection terminal (311) may include, for example, a USB connector or an HDMI connector. The positions of the first connection terminal (311) and the first connection terminal hole corresponding to the first connection terminal (311) are not limited to the illustrated example.

[0122] According to various embodiments, the foldable electronic device (2) may include a second connection terminal (also referred to as a second connector or a second interface terminal) (312). The second connection terminal (312) may be accommodated in the second housing (22) in correspondence with a second connection terminal hole (e.g., a second connector hole) included in, for example, a sixth side portion (B6) of the second side (2212). An external storage medium such as a secure digital memory (SD) card, a SIM card, or a universal SIM (USIM) card may be connected to the second connection terminal (312). The positions of the second connection terminal (312) and the second connection terminal hole corresponding to the second connection terminal (312) are not limited to the illustrated example.

[0123] The foldable electronic device (2) may further include various components depending on its provision form. These components are subject to various modifications in accordance with the convergence trend of the foldable electronic device (2), and therefore cannot be all enumerated. However, components equivalent to the aforementioned components may be additionally included in the foldable electronic device (2). In various embodiments, depending on the provision form, certain components may be excluded from the aforementioned components or replaced with other components.

[0124] FIG. 5 is a drawing showing a portion of a foldable electronic device (2) in an unfolded state according to various embodiments of the present disclosure.

[0125] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 5. All combinations of the features described below in connection with FIG. 5 may be considered to be encompassed by the present disclosure as specific examples.

[0126] Referring to FIG. 5, the foldable electronic device (2) may include a first PCB (41), a third PCB (43), and a first battery (51) arranged or coupled to a first support plate (2111) of a first frame (211). The first PCB (41), the third PCB (43), and the first battery (51) may be positioned between the first support plate (2111) and the first cover (212) (see FIG. 2). When viewed from above the first cover (212) (see FIG. 2), the first PCB (41) may be positioned closer to the first side portion (B1) of the first frame (211) than the third PCB (43). When viewed from above the first cover (212) (see FIG. 2), the third PCB (43) may be positioned closer to the third side portion (B3) of the first frame (211) than the first PCB (41). When viewed from above the first cover (212) (see FIG. 2), the first battery (51) may be positioned between the first PCB (41) and the third PCB (43). In the present disclosure, “disposed on XX (upper)” may be understood as being positioned adjacent to XX, positioned in substantial contact with XX, or coupled to XX.

[0127] According to various embodiments, the foldable electronic device (2) may include a first flexible printed circuit board (FPCB) (61) and a second FPCB (62) electrically connecting a first PCB (41) and a third PCB (43). The first FPCB (61) and the second FPCB (62) may be disposed across a space between a first battery (51) and a first cover (212) (see FIG. 2). The first FPCB (61) and the second FPCB (62) may be disposed across the first battery (51) and may be disposed or coupled to the first battery (51). When viewed from above the first cover (212) (see FIG. 2), the first FPCB (61) and the second FPCB (62) may overlap the first battery (51). The number or position of the FPCBs electrically connecting the first PCB (41) and the third PCB (43) is not limited to the illustrated example.

[0128] According to various embodiments, the foldable electronic device (2) may include a camera bracket (300) disposed or coupled to a first support plate (2111) of a first frame (211). The camera bracket (300) may be positioned between the first support plate (2111) and the first cover (212) (see FIG. 2). When viewed from above the first cover (212) (see FIG. 2), the camera bracket (300) may be positioned closer to the first side portion (B1) of the first frame (211) than to the first battery (51). The first camera module (301) may include a first camera (3011) and a first camera FPCB (not shown separately) extending from the first camera (3011). The first camera (3011) may be disposed and coupled to the camera bracket (300). When viewed from above the first cover (212) (see FIG. 2), the first camera (3011) may not overlap the first PCB (41). The first camera (3011) may be electrically connected to the first PCB (41) via the first camera FPCB. The second camera module (302) may include a second camera (3021) and a second camera FPCB (not shown separately) extending from the second camera (3021). The second camera (3021) may be positioned and coupled to the camera bracket (300). When viewed from above the first cover (212) (see FIG. 2), the second camera (3021) may not overlap the first PCB (41). The second camera (3021) may be electrically connected to the first PCB (41) via the second camera FPCB. The third camera module (303) may include a third camera (3031) and a third camera FPCB (not shown) extending from the third camera (3031). The third camera (3031) may be placed and coupled to the camera bracket (300).When viewed from above the first cover (212) (see FIG. 2), the third camera (3031) may not overlap the first PCB (41). The third camera (3031) may be electrically connected to the first PCB (41) via the third camera FPCB.

[0129] According to various embodiments, the foldable electronic device (2) may include a fourth camera module (304). The fourth camera module (304) may include a fourth camera (3041) and a fourth camera FPCB (3042) extending from the fourth camera (3041). The fourth camera (3041) may be disposed or coupled to the first support plate (2111) between the first support plate (2111) and the first cover (212) (see FIG. 2). When viewed from above the first cover (212) (see FIG. 2), the fourth camera (3041) may not overlap the first PCB (41). The fourth camera (3041) may be electrically connected to the first PCB (41) through the fourth camera FPCB (3042).

[0130] According to various embodiments, the foldable electronic device (2) may include a second PCB (42), a fourth PCB (44), and a second battery (52) disposed or coupled to a second support plate (2211) of a second frame (221). The second PCB (42), the fourth PCB (44), and the second battery (52) may be positioned between the second support plate (2211) and the second cover (222) (see FIG. 2). At least a portion of the second PCB (42), at least a portion of the fourth PCB (44), and / or at least a portion of the second battery (52) may be positioned between the second display module (26) (or a display area of ​​the second display module (26)) (see FIG. 2) and the second support plate (2211). When viewed from above the second cover (222) (see FIG. 2), the second PCB (42) may be positioned closer to the second side portion (B2) of the second frame (221) than the fourth PCB (44). When viewed from above the second cover (222) (see FIG. 2), the fourth PCB (44) may be positioned closer to the fourth side portion (B4) of the second frame (221) than the second PCB (42). When viewed from above the second cover (222) (see FIG. 2), the second battery (52) may be positioned between the second PCB (42) and the fourth PCB (44).

[0131] According to various embodiments, the foldable electronic device (2) may include a third FPCB (63) electrically connecting the second PCB (42) and the fourth PCB (44). The third FPCB (63) may be disposed across a space between the second battery (52) and the second cover (222) (see FIG. 2). The third FPCB (63) may be disposed across the second battery (52) and may be disposed or coupled to the second battery (52). When viewed from above the second cover (222) (see FIG. 2), the third FPCB (63) may overlap the second battery (52). The number or position of the FPCBs electrically connecting the second PCB (42) and the fourth PCB (44) is not limited to the illustrated example.

[0132] According to various embodiments, the foldable electronic device (2) may include a fourth FPCB (64) electrically connecting the first PCB (41) and the second PCB (42). The fourth FPCB (64) may pass through a first hole (H31) formed in a first support plate (2111) of the first frame (211) and a second hole (H32) formed in a second support plate (2211) of the second frame (221). The fourth FPCB (64) may be arranged across the hinge portion (24) (see FIG. 2). In various embodiments, when viewed from above the second cover (222) (see FIG. 2), the fourth FPCB (64) may include a portion (hereinafter referred to as a battery overlapping portion) (641) overlapping the second battery (52), and the battery overlapping portion (641) of the fourth FPCB (64) may be placed or coupled to the second battery (52).

[0133] According to various embodiments, the foldable electronic device (2) may include a fifth camera module (305). The fifth camera module (305) may include a fifth camera (3051) and a fifth camera FPCB (3052) extending from the fifth camera (3051). The fifth camera (3051) may be disposed or coupled to the second support plate (2211) between the second support plate (2211) and the second cover (222) (see FIG. 2). When viewed from above the second cover (222) (see FIG. 2), the fifth camera (3051) may not overlap the second PCB (42). The fifth camera (3051) may be electrically connected to the second PCB (42) through the fifth camera FPCB (3052).

[0134] According to various embodiments, the foldable electronic device (2) may include a first speaker module (also referred to as a first speaker assembly) (71). The first speaker module (71) (e.g., also referred to as a first component (71)) may be accommodated in a second housing (22). When viewed from above the second cover (222) (see FIG. 2), the first speaker module (71) may be positioned between the second battery (52) and the second side portion (B2) of the second frame (221). The first speaker module (71) may include a first speaker housing (711), a first speaker (712), and a first speaker FPCB (713).

[0135] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may be positioned between the second support plate (2211) and the second cover (222) of the second frame (221). The first speaker housing (711) may be positioned between the second support plate (2211) and the second display module (26) (or the display area of ​​the second display module (26)) (see FIGS. 2 and 4).

[0136] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may include a first sound wave output port (7114). When the first speaker (712) outputs an audio signal received through the first speaker FPCB (713), sound waves generated by vibration of a diaphragm (not shown separately) of the first speaker (712) may be propagated in the air within the internal space of the first speaker housing (711) and output to the outside of the first speaker housing (711) through the first sound wave output port (7114) of the first speaker housing (711). The first sound wave output port (7114) of the first speaker housing (711) is arranged to correspond to the first speaker hole (H21) (see FIG. 2) of the second frame (221), and sound waves generated by the first speaker (712) can be output to the outside of the foldable electronic device (2) through the first sound wave output port (7114) of the first speaker housing (711) and the first speaker hole (H21) (see FIG. 2) of the second frame (221).

[0137] According to various embodiments, the first speaker module (71) may include a first sound-transmitting member (not separately illustrated). The sound-transmitting member may be disposed or coupled to the first speaker housing (711) so as to be disposed in the first sound-wave output port (7114) of the first speaker housing (711). Sound waves generated by the first speaker (712) may be output to the outside of the foldable electronic device (2) through the first sound-transmitting member. The first sound-transmitting member may include, for example, a porous member or a mesh member, but is not limited thereto. The first sound-transmitting member may reduce or prevent external foreign substances, such as dust or moisture, from entering the interior of the first speaker module (71) through the first sound-wave output port (7114).

[0138] According to various embodiments, the first speaker module (71) may include a first elastic member (not separately illustrated). The first elastic member may be disposed or coupled to the first speaker housing (711). The first elastic member may be coupled to the first sound-transmitting member and may support the first sound-transmitting member. The first elastic member may be provided (or formed) in an annular (or loop-shaped) shape, for example, including an opening corresponding to the first sound-wave output port (7114) of the first speaker housing (711). The first elastic member may be resiliently disposed between the first speaker housing (711) and the second frame (221). The first elastic member may reduce or prevent sound waves generated by the first speaker (712) from leaking between the first speaker housing (711) and the second frame (221). Preferably, the first elastic member can reduce or prevent external foreign substances, such as dust or moisture, from entering the interior of the first speaker module (71) through the space between the first speaker housing (711) and the second frame (221). The first elastic member may include, for example, sponge or rubber, but is not limited thereto.

[0139] According to various embodiments, the first speaker (712) may be disposed within the first speaker housing (711). The first speaker (712) may be configured to convert an audio signal into a sound wave. The first speaker (712) may include, for example, a magnetic circuit, a coil structure, and a diaphragm, although not separately illustrated. The magnetic circuit may form a fixed magnetic field (also referred to as a permanent magnetic field). The coil structure may include a coil support member (e.g., a coil former) and a coil wound around the coil support member. When an audio signal in the form of a current (e.g., an alternating current) flows through the coil structure, a magnetic force may be generated that is induced toward a central axis around which the coil is wound. Due to the interaction between the induced magnetic force and the fixed magnetic field, the coil structure may move in the direction of the central axis, and the diaphragm connected to the coil structure may vibrate air due to the movement of the coil structure.

[0140] According to various embodiments, the first speaker FPCB (713) can electrically connect the first speaker (712) and the second PCB (42). The first speaker FPCB (713) can pass through a hole (not shown separately) formed in the first speaker housing (711), and a portion of the first speaker FPCB (713) can be positioned outside the first speaker housing (711) for electrical connection with the second PCB (42). The first speaker FPCB (713) can be replaced with another electrical connection member, such as a cable.

[0141] According to various embodiments, the foldable electronic device (2) may include a second speaker module (also referred to as a second speaker assembly) (72). The second speaker module (72) may be accommodated in the second housing (22). The second speaker module (72) may be positioned between the second battery (52) and the fourth side portion (B4) of the second frame (221) when viewed from above the second cover (222) (see FIG. 2). The second speaker module (72) may be provided (or formed) in a form that includes at least some of the components of the first speaker module (71). The second speaker module (72) may include, for example, a second speaker housing (721) (e.g., the first speaker housing (711)), a second speaker (722) (e.g., the first speaker (712)), and a second speaker FPCB (723) (e.g., the first speaker FPCB (713)). The second speaker module (72) may include, for example, a second sound-transmitting member (e.g., the first sound-transmitting member) and a second elastic member (e.g., the first elastic member).

[0142] FIG. 6 is a diagram illustrating a portion of a foldable electronic device (2) according to various embodiments of the present disclosure. FIG. 7 is a diagram illustrating a portion of a foldable electronic device (2) according to various embodiments of the present disclosure. FIG. 8 is a diagram illustrating a portion of a foldable electronic device (2) according to various embodiments of the present disclosure. FIG. 9 is an exploded perspective view of a portion of a foldable electronic device (2) according to various embodiments of the present disclosure.

[0143] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 6, 7, 8, and 9. All combinations of the features described below with respect to FIGS. 6, 7, 8, and 9 may be considered to be encompassed by the present disclosure as specific examples.

[0144] Referring to FIGS. 6, 7, 8, and 9, the foldable electronic device (2) may include a second PCB (42), a third FPCB (63), and / or a fourth FPCB (64). The foldable electronic device (2) may include a fifth camera module (305). The foldable electronic device (2) may include a first speaker module (71). The foldable electronic device (2) may include a socket (e.g., the second connection terminal (312) of FIG. 2) (9). To facilitate understanding of the present disclosure, the first direction (①) is defined as a direction in which the sixth side portion (B6) (see FIG. 5) and the eighth side portion (B8) (see FIG. 5) of the second frame (221) are spaced apart from each other (e.g., a direction parallel to the x-coordinate axis). The first direction (①) may be perpendicular to the center line (A) (e.g., folding axis) of the foldable electronic device (2) (see FIG. 5). To facilitate understanding of the present disclosure, the second direction (②) is defined as the direction (e.g., parallel to the y-coordinate axis) in which the second side portion (B2) (see FIG. 5) and the fourth side portion (B4) (see FIG. 5) of the second frame (221) are spaced apart from each other. The second direction (②) may be parallel to the center line (A) (e.g., folding axis) of the foldable electronic device (2) (see FIG. 5).

[0145] According to various embodiments, the second PCB (42) may include a first side (42A) and a second side (42B). The first side (42A) and the second side (42B) may face in different directions. The first side (42A) of the second PCB (42) may face the second display module (26) (see FIG. 2) (or the second cover (222) of FIG. 2). The first side (42A) may be substantially parallel to the second display module (26) of FIG. 2 or the second cover (222) of FIG. 2. The second side (42B) of the second PCB (42) may face the second support plate (2211) of the second frame (221) (see FIG. 5) (or the second display area (252) of the first display module (25) of FIG. 2). The second surface (42B) may be substantially parallel to the second display area (252) of the first display module (25) of FIG. 2. At least a portion of the second surface (42B) may face the second support plate (2211). At least a portion of the second surface (42B) may be supported by the second support plate (2211) (see FIG. 5) or may be disposed or coupled to the second support plate (2211).

[0146] According to various embodiments, the first FPCB connector (81), the second FPCB connector (82), the third FPCB connector (83), and / or the fourth FPCB connector (84) may be disposed on the second PCB (42). The first FPCB connector (81), the second FPCB connector (82), the third FPCB connector (83), and the fourth FPCB connector (84) may be disposed (e.g., mounted or surface mounted) on the first side (42A) of the second PCB (42). The first FPCB connector (81) may be electrically connected to the first speaker FPCB (713) of the first speaker module (71). The second FPCB connector (82) may be electrically connected to the third FPCB (63). The third FPCB connector (83) and the fourth FPCB connector (84) can be electrically connected to the fourth FPCB (64).

[0147] According to various embodiments, a first counterpart FPCB connector (not shown separately) electrically connected to the first FPCB connector (81) may be disposed (e.g., mounted or surface mounted) on a first end (also referred to as a first end area) (EP1) included in a first speaker FPCB (713) of the first speaker module (71). When viewed from above the first surface (42A) of the second PCB (42), the first end (EP1) of the first speaker FPCB (713) may overlap with the second PCB (42). “When viewed from above the first surface (42A) of the second PCB (42)” may be understood as “when viewed in a direction perpendicular to the first surface (42A) of the second PCB (42)”, “when viewed from above the second cover (222) (see FIG. 2)”, or “when viewed in a direction perpendicular to the second cover (222)”. The first FPCB connector (81) and the first corresponding FPCB connector may be arranged between the first surface (42A) of the second PCB (42) and the first end (EP1) of the first speaker FPCB (713).

[0148] According to various embodiments, a second corresponding FPCB connector (not shown separately) electrically connected to the second FPCB connector (82) may be disposed (e.g., mounted or surface mounted) on a second end (also referred to as a second end area) (EP2) of the third FPCB (63). When viewed from above the first side (42A) of the second PCB (42), the second end (EP2) of the third FPCB (63) may overlap the second PCB (42). The second FPCB connector (82) and the second corresponding FPCB connector may be disposed between the first side (42A) of the second PCB (42) and the second end (EP2) of the third FPCB (63).

[0149] According to various embodiments, a third corresponding FPCB connector (not shown separately) electrically connected to the third FPCB connector (83) may be disposed (e.g., mounted or surface mounted) on a third end (also referred to as a third end area) (EP3) of the fourth FPCB (64). A fourth corresponding FPCB connector (not shown separately) electrically connected to the fourth FPCB connector (84) may be disposed (e.g., mounted or surface mounted) on a fourth end (also referred to as a fourth end area) (EP4) of the fourth FPCB (64). When viewed from above the first surface (42A) of the second PCB (42), the third end (EP3) and the fourth end (EP4) of the fourth FPCB (64) may overlap with the second PCB (42). The third FPCB connector (83) and the third corresponding FPCB connector may be arranged between the first side (42A) of the second PCB (42) and the third end (EP3) of the fourth FPCB (64). The fourth FPCB connector (84) and the fourth corresponding FPCB connector may be arranged between the first side (42A) of the second PCB (42) and the fourth end (EP4) of the fourth FPCB (64). The fourth FPCB (64) may be provided (or formed) in a form extending from the battery overlapping portion (641) to the third end (EP3) and the fourth end (EP4), respectively.

[0150] According to various embodiments, when viewed from above the first side (42A) of the second PCB (42), the first end (EP1) of the first speaker FPCB (713) may be positioned closer to the sixth side portion (B6) (see FIG. 5) of the second frame (221) in the first direction (①) than the second end (EP2) of the third FPCB (63), the third end (EP3) of the fourth FPCB (64), and the fourth end (EP4) of the fourth FPCB (64).

[0151] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the second end (EP2) of the third FPCB (63), the third end (EP3) of the fourth FPCB (64), and the fourth end (EP4) of the fourth FPCB (64) may be arranged in the first direction (①). The fourth end (EP4) of the fourth FPCB (64) may be positioned closer to the eighth side portion (B8) (see FIG. 5) of the second frame (221) in the first direction (①) than the first end (EP1) of the first speaker FPCB (713), the second end (EP2) of the third FPCB (63), and the third end (EP3) of the fourth FPCB (64). When viewed from above the first side (42A) of the second PCB (42), the third end (EP3) of the fourth FPCB (64) can be positioned between the second end (EP2) of the third FPCB (63) and the fourth end (EP4) of the fourth FPCB (64). An end group in which the second end (EP2) of the third FPCB (63), the third end (EP3) of the fourth FPCB (64), and the fourth end (EP4) of the fourth FPCB (64) are gathered can be provided.

[0152] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the end group including the second end (EP2), the third end (EP3), and the fourth end (EP4) may be positioned closer to the second battery (52) (see FIG. 5) in the second direction (②) relative to the first end (EP1) of the first speaker FPCB (713).

[0153] According to various embodiments, the fifth camera module (305) may include a fifth camera (3051) and a fifth camera FPCB (3052) extending from the fifth camera (3051). The fifth camera (3051) may be electrically connected to the second PCB (42) through the fifth camera FPCB (3052). When viewed from above on the first side (42A) of the second PCB (42), the fifth camera (3051) may not overlap with the second PCB (42). When viewed from above on the first side (42A) of the second PCB (42), the fifth camera (3051) may not overlap with the first speaker module (71).

[0154] According to various embodiments, when viewed from above the first side (42A) of the second PCB (42), the fifth camera (3051) of the fifth camera module (305) may be positioned closer to the second side portion (B2) (see FIG. 5) of the second frame (221) in the second direction (②) than the first end (EP1) of the first speaker FPCB (713) and the end group (e.g., the second end (EP2), the third end (EP3), and the fourth end (EP4)) of the plurality of FPCBs (e.g., the third FPCB (63) and the fourth FPCB (64)). When viewed from above on the first side (42A) of the second PCB (42), the fifth camera (3051) and the end group (e.g., the second end (EP2), the third end (EP3), and the fourth end (EP4)) can be positioned spaced apart from each other in the second direction (②).

[0155] According to various embodiments, when viewed from above the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may not overlap with the second PCB (42).

[0156] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned further from the sixth side portion (B6) (see FIG. 5) of the second frame (221) than the first end portion (EP1) of the first speaker FPCB (713) in the first direction (①). When viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned closer to the sixth side portion (B6) (see FIG. 5) of the second frame (221) than the fifth camera (3051) of the fifth camera module (305) in the first direction (①).

[0157] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned closer to the second side portion (B2) (see FIG. 5) of the second frame (221) than the first end portion (EP1) of the first speaker FPCB (713) in the second direction (②). When viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned further from the second side portion (B2) (see FIG. 5) of the second frame (221) than the fifth camera (3051) of the fifth camera module (305) in the second direction (②).

[0158] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned closer to the sixth side portion (B6) (see FIG. 5) of the second frame (221) than the terminal group (e.g., the second end (EP2), the third end (EP3), and the fourth end (EP4)) in the first direction (①). When viewed from above on the first side (42A) of the second PCB (42), the first speaker (712) of the first speaker module (71) may be positioned closer to the second side portion (B2) (see FIG. 5) of the second frame (221) than the terminal group (e.g., the second end (EP2), the third end (EP3), and the fourth end (EP4)) in the second direction (②).

[0159] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the first speaker housing (711) of the first speaker module (71) may be configured to accommodate the first speaker (712) while not overlapping the first end (EP1) of the first speaker FPCB (713), the terminal group (e.g., the second end (EP2), the third end (EP3), and the fourth end (EP4)), and the fifth camera (3051) of the fifth camera module (305).

[0160] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may include a first portion (7111) and a second portion (7112) extending from the first portion (7111). When viewed from above the first side (42A) of the second PCB (42), the first portion (7111) of the first speaker housing (711) may not overlap the second PCB (42). The first portion (7111) of the first speaker housing (711) may be positioned between the second support plate (2211) (see FIG. 5) and the second cover (222) (see FIG. 2), and may be disposed or coupled (e.g., attached) to the second support plate (2211), or may be supported by the second support plate (2211). A first portion (7111) of the first speaker housing (711) may be positioned between a second support plate (2211) (see FIG. 5) and a second display module (26) (or a display area of ​​the second display module (26)) (see FIG. 2), and may be arranged or coupled (e.g., attached) to the second support plate (2211) or supported by the second support plate (2211). When viewed from above the first side (42A) of the second PCB (42), a second portion (7112) of the first speaker housing (711) may extend from the first portion (7111) so as to overlap with the second PCB (42). The second part (7112) of the first speaker housing (711) may be positioned between the second PCB (42) and the second cover (222) (see FIG. 2), and may be placed or coupled (e.g., attached) to the first surface (42A) of the second PCB (42), or may be supported by the first surface (42A) of the second PCB (42).The second portion (7112) of the first speaker housing (711) may be positioned between the second PCB (42) and the second display module (26) (or the display area of ​​the second display module (26)) (see FIG. 2), and may be arranged or coupled (e.g., attached) to the first surface (42A) of the second PCB (42) or supported by the first surface (42A) of the second PCB (42). In various embodiments, the second portion (7112) of the first speaker housing (711) may have a thickness thinner than the first portion (7111).

[0161] According to various embodiments, the second portion (7112) of the first speaker housing (711) may be disposed on the first surface (42A) of the second PCB (42) in an unattached state (also referred to as an uncoupled state) with respect to the second PCB (42).

[0162] According to various embodiments, the second portion (7112) of the first speaker housing (711) may be disposed on the first surface (42A) of the second PCB (42) in an attached state (also referred to as a coupled state) with respect to the second PCB (42). For example, the second portion (7112) of the first speaker housing (711) may be coupled (e.g., attached) to the second PCB (42) via an adhesive member (e.g., double-sided tape) (or adhesive member) disposed between the second portion (7112) and the first surface (42A) of the second PCB (42).

[0163] According to various embodiments, the first speaker (712) may be accommodated in the first portion (7111) of the first speaker housing (711).

[0164] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may include a sound wave passage (7113). The first speaker housing (711) may include, for example, an inner wall (also referred to as a passage inner surface) of the passage forming the sound wave passage (7113). Sound waves generated by vibration of a diaphragm (not shown separately) of the first speaker (712) may propagate in the air within the sound wave passage (7113) and be output outside the first speaker housing (711) through the first sound wave output port (7114). The sound wave passage (7113) may guide the sound waves generated by the first speaker (712) to proceed to the first sound wave output port (7114). The sound wave passage (7113) can be implemented so that sound waves generated by the first speaker (712) can proceed to the first sound wave output port (7114) without leakage.

[0165] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may include a resonance space (or an enclosure providing a resonance space) for the first speaker (712). The resonance space is configured to improve the quality of sound waves output through the first speaker (712). The resonance space may, for example, enrich mid-bass sounds. In various embodiments, the resonance space may be separated from the sound wave passage (7113). In various embodiments, the first portion (7111) and the second portion (7112) of the first speaker housing (711) may provide the resonance space.

[0166] According to various embodiments, the first speaker housing (711) of the first speaker module (71) may include an air vent (not separately illustrated). The air vent may be configured to allow air to flow between the interior of the first speaker housing (711) (e.g., a resonance space) and the exterior of the first speaker housing (711). The air vent may improve the quality of sound output through the first speaker (712). The air vent may enable rich sound transmission through the first speaker (712). The air vent may, for example, enrich mid-bass sounds. In various embodiments, the first speaker module (71) may include an air permeable member (not separately illustrated) disposed in the air vent. The air permeable member may reduce or prevent external foreign substances, such as dust or moisture, from entering the interior space of the first speaker housing (711) through the air vent. The air permeable member may include, but is not limited to, a porous member or a mesh member, for example.

[0167] According to various embodiments, a socket (e.g., a second connection terminal (312) of FIG. 2) (9) may be disposed on a second surface (42B) of a second PCB (42). The socket (9) (also referred to as, for example, a second component (9)) may be surface-mounted on the second surface (42B) of the second PCB (42). The socket (9) may be, for example, of an on-board type. In various embodiments, the socket (9) may be configured to be able to connect an external storage medium (not shown separately) such as an SD card, a SIM card, or a USIM card. The external storage medium may be connected to the socket (9) through a second connection terminal hole formed in a sixth side portion (B6) of the second frame (221) (see FIG. 2). In various embodiments, the external storage medium may be disposed on a tray (not shown separately). When a tray on which an external storage medium is placed is inserted into a socket (9), the external storage medium can be electrically connected to a second PCB (42) through the socket (9).

[0168] According to various embodiments, the socket (9) may include a non-metallic support member (91), a plurality of terminals (not shown separately) disposed on the non-metallic support member (91), and a metal cover (92) coupled with the non-metallic support member (91). The non-metallic support member (91) may include a slot that can guide insertion of an external storage medium. In various embodiments, the slot may be provided (or formed) by a combination of the non-metallic support member (91) and the metal cover (92). The plurality of terminals may be electrically connected to a plurality of counterpart terminals of an external storage medium inserted into the slot. The metal cover (92) may be configured to reduce or prevent electromagnetic interference (e.g., electromagnetic interference (EMI)) to the socket (9) and the external storage medium inserted into the slot. The metal cover (92) may include, for example, a shield can. The socket (9) may include a third side (9A) (e.g., a socket back side) (see FIG. 7). The third side (9A) may face the second side (42B) of the second PCB (42) and may be substantially parallel to the second side (42B). The third side (9A) may be provided (or formed) at least in part by a non-metallic support member (91). The third side (9A) may be provided (or formed) by a combination of the non-metallic support member (91) and the metal cover (92). The socket (9) may include a fourth side (9B) (e.g., a socket front side) (see FIGS. 8 and 9). The fourth side (9B) may face in an opposite direction to the third side (9A) and in the same direction as the second side (42B) of the second PCB (42). The fourth side (9B) may be positioned apart from the second side (42B) of the second PCB (42). When viewed from above the second side (42B) of the second PCB (42), the third side (9A) and the fourth side (9B) may overlap. The fourth side (9B) may be provided (or formed) at least in part by a metal cover (92).The fourth side (9B) can be provided (or formed) by a combination of a non-metallic support member (91) and a metal cover (92).

[0169] According to various embodiments, the socket (9) may include a pin hole (not separately illustrated) into which a pin (also called a tray separation pin or tray ejector pin) is inserted to separate a tray supporting an external storage medium from the socket (9). When the pin is inserted into the pin hole, the tray (320) supporting the external storage medium is pushed out from the socket (9) by the force caused by the insertion of the pin and may protrude with respect to the sixth side portion (B6) (see FIG. 2) of the first frame (211). The tray protruding with respect to the sixth side portion (B6) (see FIG. 2) may be pulled out from the foldable electronic device (2). The socket (9) may include an actuator (not separately illustrated) configured to move the tray by using the force transmitted from the pin inserted through the pin hole.

[0170] According to various embodiments, the second PCB (42) may include a plurality of conductive pads (also referred to as lands) (421) arranged on the second surface (42B). The socket (9) may be electrically and physically coupled to the second PCB (42) through a conductive adhesive material (or conductive bonding material), such as solder, arranged between the plurality of terminals of the socket (9) and the plurality of conductive pads (421) of the second PCB (42). An external storage medium connected to the socket (9) may be electrically connected to a corresponding electronic component arranged on the second PCB (42) through a plurality of first conductive pads among the plurality of conductive pads (421). An external storage medium connected to the socket (9) can be electrically connected to a ground area (not shown separately) included in the second PCB (42) via at least one second conductive pad among a plurality of conductive pads (421). A metal cover (92) of the socket (9) can be electrically connected to a ground area included in the second PCB (42) via at least one third conductive pad among a plurality of conductive pads (421).

[0171] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the edge of the second PCB (42) may include a first edge (E) adjacent to the first speaker (712) of the first speaker module (71) and a second edge other than the first edge (E). The first edge (E) may be, for example, a straight line parallel to the first direction (①) when viewed from above on the first side (42A) of the second PCB (42), but is not limited thereto. In various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the socket (9) may not protrude with respect to the first edge (E) of the second PCB (42), but is not limited thereto.

[0172] According to various embodiments, when viewed from above the first side (42A) of the second PCB (42), the second portion (7112) of the first speaker housing (711) may overlap the socket (9).

[0173] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the second PCB (42) may include a first opening (1000) (see FIGS. 7 and 9) overlapping the socket (9). The first opening (1000) may be configured such that a portion of the third side (9A) of the socket (9) is not covered by the second PCB (42). The first opening (1000) and a portion of the third side (9A) of the socket (9) corresponding to the first opening (1000) may provide (or form) a fine-shaped recess in the direction in which the first side (42A) of the second PCB (42) faces. The socket (9) may not be inserted into the first opening (1000) of the second PCB (42). The third side (9A) of the socket (9) may not be inserted into the first opening (1000) of the second PCB (42).

[0174] According to various embodiments, the first opening (1000) of the second PCB (42) may be a notch formed in the first edge (E) of the second PCB (42). The first opening (1000) is not limited to a notch, and may be implemented as an opening such as a hole (e.g., a through hole) located inside the edge of the second PCB (42) when viewed from above the first side (42A) of the second PCB (42).

[0175] According to various embodiments, the first opening (1000) of the second PCB (42) may be configured so as not to have a substantial influence (e.g., electrical influence and structural influence) on the second PCB (42) and the socket (9). The first opening (1000) of the second PCB (42) may be provided (or formed) in a non-conductive area where electrical elements or conductive elements of the second PCB (42) are not arranged (or included). The first opening (1000) of the second PCB (42) may be provided (or formed) to avoid, for example, a plurality of conductive pads (421) arranged on the second surface (42B) of the second PCB (42) for surface-mounting the socket (9), and / or wiring (e.g., conductive lines as electrical paths) included in the second PCB (42). The first opening (1000) of the second PCB (42) may be formed, for example, in a non-ground area of ​​the second PCB (42) that does not include a ground area. At a level where performance for electrical elements such as a socket (9) can be secured, a portion of the ground area included in the second PCB (42) may be removed for the first opening (1000) of the second PCB (42).

[0176] According to various embodiments, when viewed from above the first side (42A) of the second PCB (42), about 2 / 3 or more of the first opening (1000) of the second PCB (42) may overlap with the third side (9A) of the socket (9), but is not limited thereto.

[0177] According to various embodiments, when viewed from above on the first side (42A) of the second PCB (42), the first opening (1000) of the second PCB (42) may overlap with the second portion (7112) of the first speaker housing (711). When viewed from above on the first side (42A) of the second PCB (42), a portion of the second portion (7112) of the first speaker housing (711) overlaps with the first opening (1000), which is an empty space; however, the first opening (1000) may be defined as a component of the second PCB (42), and a portion of the second portion (7112) of the first speaker housing (711) corresponding to the first opening (1000) may be understood to overlap with the second PCB (42).

[0178] According to various embodiments, the second portion (7112) of the first speaker housing (711) may be disposed on the second side (42B) of the second PCB (42), and a portion of the second portion (7112) may be positioned in the first opening (1000) of the second PCB (42). The second portion (7112) may include, for example, a protrusion (e.g., the protrusion (1200) of FIGS. 10 and 11) configured to be inserted into the first opening (1000) of the second PCB (42). The protrusion of the second portion (7112) may expand the internal space (e.g., the resonance space) of the first speaker housing (711) compared to a comparative example in which the protrusion and the first opening (1000) of the second PCB (42) are omitted. In various embodiments, the resonance space of the first speaker housing (711) may be expanded by the protrusion of the second portion (7112), thereby improving the quality of sound waves output through the first speaker (712) compared to a comparative example in which the protrusion and the first opening (1000) of the second PCB (42) are omitted. The protrusion of the second portion (7112) may, for example, enrich the mid-low range sound compared to a comparative example in which the protrusion and the first opening (1000) of the second PCB (42) are omitted.

[0179] According to various embodiments, positioning the protrusion (e.g., the protrusion (1200) of FIGS. 10 and 11) of the second part (7112) of the first speaker housing (711) in the first opening (1000) of the second PCB (42) can secure a resonance space of the first speaker module (71) while reducing space constraints due to the expansion of the size of the second battery (52) while expanding the size of the second battery (52) in the second direction (②).

[0180] According to various embodiments, the protrusion (e.g., the protrusion (1200) of FIGS. 10 and 11) may be understood as being included in the first portion (7111) of the first speaker housing (711), in which case the first opening (1000) is defined as a separate component from the second PCB (42), and the second PCB (42) may be understood as an object having a substantially volume.

[0181] FIG. 10 is a cross-sectional view of a portion of a foldable electronic device (2) taken along line F-F' of FIG. 6 according to various embodiments of the present disclosure. FIG. 11 is a cross-sectional view of a portion of a foldable electronic device (2) taken along line G-G' of FIG. 6 according to various embodiments of the present disclosure. FIG. 12 is a perspective view of a portion of a foldable electronic device (2) according to various embodiments of the present disclosure.

[0182] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 10, 11, and 12. All combinations of the features described below with respect to FIGS. 10, 11, and 12 may be considered to be encompassed by the present disclosure as specific examples.

[0183] Referring to FIGS. 10, 11, and 12, the foldable electronic device (2) may include a second support plate (2211). The foldable electronic device (2) may include a first display module (25) and / or a second display module (26). The foldable electronic device (2) may include a second cover (222). The foldable electronic device (2) may include a second PCB (42), a first speaker module (71), and / or a socket (9).

[0184] According to various embodiments, the second display area (252) of the first display module (25) may be placed or coupled to the second support plate (2211).

[0185] According to various embodiments, the second display module (26) may be positioned between the second cover (222) and the second support plate (2211). The second display module (26) may be placed or coupled to the second cover (222).

[0186] According to various embodiments, the second PCB (42) may be positioned between the second display module (26) and the second support plate (2211). The second PCB (42) may be positioned or coupled to the second support plate (2211).

[0187] According to various embodiments, the first speaker module (71) may include a first speaker housing (711) and a first speaker (712) positioned within the first speaker housing (711). The first speaker housing (711) may include a first portion (7111) and a second portion (7112) extending from the first portion (7111). When viewed from above the first side (42A) of the second PCB (42), the first portion (7111) of the first speaker housing (711) may not overlap the second PCB (42). The first portion (7111) of the first speaker housing (711) may be positioned between the second support plate (2211) and the second cover (222), and may be disposed or coupled to the second support plate (2211). The first portion (7111) of the first speaker housing (711) may be coupled to the second support plate (2211) by, for example, mechanical fastening, such as screw fastening, or bonding. The first portion (7111) of the first speaker housing (711) may be positioned between the second support plate (2211) and the second display module (26) (or a display area of ​​the second display module (26)), and may be disposed or coupled (e.g., attached) to the second support plate (2211) or supported by the second support plate (2211). When viewed from above the first side (42A) of the second PCB (42), the second portion (7112) of the first speaker housing (711) may extend from the first portion (7111) of the first speaker housing (711) so as to overlap the second PCB (42). The second portion (7112) of the first speaker housing (711) may be positioned between the second PCB (42) and the second cover (222) (see FIG. 2), and may be arranged or coupled (e.g., attached) to the first side (42A) of the second PCB (42), or may be supported by the first side (42A) of the second PCB (42).The second part (7112) of the first speaker housing (711) may be positioned between the second PCB (42) and the second display module (26) (or the display area of ​​the second display module (26)), and may be disposed on the first side (42A) of the second PCB (42) or supported by the first side (42A) of the second PCB (42).

[0188] According to various embodiments, the first speaker housing (711) may be coupled to the second support plate (2211) via a mechanical fastening (not shown separately), such as a screw fastening or a snap-fit ​​fastening. The snap-fit ​​fastening is, for example, a fastening structure that resiliently couples interlocking elements of the first speaker housing (711) (e.g., a non-metallic frame (1010) of the first speaker housing (711)) and the second support plate (2211). For example, the second support plate (2211) may include a hook structure (1121), and the first speaker housing (711) may include a hook fastening portion (1122) corresponding to the hook structure (1121).

[0189] According to various embodiments, the first speaker (712) may be accommodated in the first portion (7111) of the first speaker housing (711).

[0190] According to various embodiments, the first speaker housing (711) may include a non-metallic frame (also referred to as a non-metallic support member) (1010), a first metal plate (1021), a second metal plate (1022), and / or a third metal plate (1023). The non-metallic frame (1010) may be a basic structure designed to withstand a load. The first metal plate (1021), the second metal plate (1022), and the third metal plate (1023) may be disposed or coupled to the non-metallic frame (1010). The exterior of the first speaker housing (711) may be provided (or formed) by a combination of the non-metallic frame (1010), the first metal plate (1021), the second metal plate (1022), and the third metal plate (1023). The position or number of metal plates placed on the non-metal frame (1010) is not limited to the illustrated example.

[0191] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may be positioned at least partially between the second display module (26) and the first speaker (712). When viewed from above the second cover (222), the first metal plate (1021) may overlap the first speaker (712). When viewed from above the second cover (222), the first metal plate (1021) may overlap the first speaker (712).

[0192] According to various embodiments, the non-metallic frame (1010) of the first speaker housing (711) may include a second opening. A first metal plate (1021) may be positioned or coupled to the non-metallic frame (1010) to block the second opening. The first metal plate (1021) may reduce or prevent sound waves generated by the first speaker (712) from leaking out of the first speaker housing (711) through the second opening of the non-metallic frame (1010). The second opening may allow the combination of the non-metallic frame (1010) and the first metal plate (1021) to have a slim structure. The first metal plate (1021) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker housing (711). The first metal plate (1021) may be a thin plate for slimming the first speaker module (71), and may also have strength (e.g., vibration-proof strength) that can reduce vibrations from sound waves generated from the first speaker (712) and ensure durability. In various embodiments, the second opening of the non-metal frame (1010) corresponding to the first metal plate (1021) may be omitted.

[0193] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) can reduce or prevent electromagnetic interference (EMI) to the first speaker (712). The first metal plate (1021) can reduce or prevent magnetic force from the first speaker (712) from being transmitted or moved to the outside of the first speaker module (71). The first metal plate (1021) can include an electromagnetic shielding material or an electromagnetic absorbing material.

[0194] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) can reduce or prevent electromagnetic influence (e.g., electromagnetic interference (EMI)) of the first speaker (712) on the second display module (26). Preferably, the first metal plate (1021) can reduce or prevent performance degradation of the second display module (26) due to the first speaker (712). The first metal plate (1021) can reduce or prevent the magnetic force of the first speaker (712) from being transmitted or moved to the second display module (26).

[0195] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may be at least partially disposed between an electromagnetic induction panel (not shown separately) included or disposed in the second display module (26) and the first speaker (712). When viewed from above the second cover (222), the first metal plate (1021) may overlap the electromagnetic induction panel and the first speaker (712). The first metal plate (1021) may reduce or prevent electromagnetic influence (e.g., EMI) of the first speaker (712) on the electromagnetic induction panel. The first metal plate (1021) may reduce or prevent a magnetic force from the first speaker (712) from being transmitted or moved to the electromagnetic induction panel, thereby reducing or preventing a degradation in the performance of the electromagnetic induction panel.

[0196] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may include various metal materials capable of shielding magnetic force. The first metal plate (1021) may include, for example, SPCC (steel plate cold commercial), but is not limited thereto.

[0197] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may be electrically connected to a ground area (not shown separately) included in the second PCB (42) and may be understood as part of the ground structure of the foldable electronic device (2).

[0198] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may be electrically connected to a metal sheet (also referred to as a metal layer) (e.g., a copper sheet) (not shown separately) of an electromagnetic shielding material that provides (or forms) a back surface of the second display module (26), and may be understood as a part of the ground structure of the foldable electronic device (2). The first metal plate (1021) may be electrically connected to the metal sheet through a conductive adhesive member or a flexible conductive member disposed between the first metal plate (1021) and the metal sheet.

[0199] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may be in an electrically floating state. The first metal plate (1021) may be electrically and physically isolated from surrounding conductors, such as, for example, the second metal plate (1022) and the third metal plate (1023).

[0200] According to various embodiments, the first metal plate (1021) of the first speaker housing (711) may extend from the first portion (7111) of the first speaker housing (711) to the second portion (7112). When viewed from above the second cover (222), the first metal plate (1021) may overlap the second PCB (42) in the second portion (7112) of the first speaker housing (711). When viewed from above the second cover (222), the first metal plate (1021) may overlap the first speaker (712) in the first portion (7111) of the first speaker housing (711). When viewed from above the second cover (222), the first metal plate (1021) can overlap with the socket (9) arranged on the second side (42B) of the second PCB (42) in the second part (7112) of the first speaker housing (711).

[0201] According to various embodiments, the first metal plate (1021) may include a first planar portion (1101) that is substantially parallel to the second cover (222) or the second PCB (42). When viewed from above the second cover (222), the first planar portion (1101) of the first metal plate (1021) may extend from a first region (11011) located in a first portion (7111) of the first speaker housing (711) to a second region (11012) located in a second portion (7112) of the first speaker housing (711). When viewed from above the second cover (222), the first area (11011) of the first flat portion (1101) can overlap with the first speaker (712) in the first part (7111) of the first speaker housing (711). When viewed from above the second cover (222), the second area (11012) of the first flat portion (1101) can overlap with the socket (9) arranged on the second surface (42B) of the second PCB (42) in the second part (7112) of the first speaker housing (711).

[0202] According to various embodiments, the second metal plate (1022) of the first speaker housing (711) may be placed or coupled to the non-metal frame (1010) so as to face the first side (42A) of the second PCB (42) and so as to face the third side (9A) of the socket (9) through the first opening (1000) of the second PCB (42).

[0203] According to various embodiments, the non-metallic frame (1010) of the first speaker housing (711) may include a third opening. A second metal plate (1022) may be positioned or coupled to the non-metallic frame (1010) to block the third opening. Preferably, the second metal plate (1022) may reduce or prevent sound waves generated by the first speaker (712) from leaking out of the first speaker housing (711) through the third opening of the non-metallic frame (1010). The third opening may allow the combination of the non-metallic frame (1010) and the second metal plate (1022) to have a slim structure. The second metal plate (1022) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker housing (711). The second metal plate (1022) may be a thin plate for slimming the first speaker module (71), and may have strength (e.g., vibration-proof strength) that can reduce vibrations from sound waves generated from the first speaker (712) and ensure durability. In various embodiments, the third opening of the non-metal frame (1010) corresponding to the second metal plate (1022) may be omitted. In various embodiments, the non-metal frame (1010) may be provided (or formed) in an expanded form with respect to the omission of the second metal plate (1022) and the third opening.

[0204] According to various embodiments, the second metal plate (1022) of the first speaker housing (711) can reduce or prevent electromagnetic interference (EMI) to the first speaker (712). The second metal plate (1022) can reduce or prevent magnetic force from the first speaker (712) from being transmitted or moved outside of the first speaker module (71). The second metal plate (1022) can include an electromagnetic shielding material or an electromagnetic absorbing material.

[0205] According to various embodiments, the second metal plate (1022) of the first speaker housing (711) can reduce or prevent electromagnetic influence (e.g., electromagnetic interference (EMI)) of the first speaker (712) on the second PCB (42) or electrical elements (e.g., the socket (9)) disposed on the second PCB (42). The second metal plate (1022) can reduce or prevent the magnetic force of the first speaker (712) from being transmitted or moved to the second PCB (42) or electrical elements disposed on the second PCB (42). The second metal plate (1022) can include various metallic materials capable of shielding the magnetic force. The second metal plate (1022) can include, but is not limited to, SPCC, for example.

[0206] According to various embodiments, the second metal plate (1022) of the first speaker housing (711) may be electrically connected to a ground area (not shown separately) included in the second PCB (42) and may be understood as part of the ground structure of the foldable electronic device (2).

[0207] According to various embodiments, the second metal plate (1022) of the first speaker housing (711) may be in an electrically floating state.

[0208] According to various embodiments, the second metal plate (1022) may include a first partial plate area (10221) facing the first side (42A) of the second PCB (42), and a second partial plate area (10222) configured to face the third side (9A) of the socket (9) through the first opening (1000) of the second PCB (42). The first partial plate area (10221) of the second metal plate (1022) may be positioned between the first metal plate (1021) and the second PCB (42). When viewed from above the second cover (222), the first metal plate (1021) (e.g., the first flat portion (1101) of the first metal plate (1021)) may overlap the first partial plate area (10221) of the second metal plate (1022). The first partial plate area (10221) of the second metal plate (1022) may include, for example, a second flat portion (1102) that is parallel to the first flat portion (1101) of the first metal plate (1021). The second partial plate area (10222) of the second metal plate (1022) may be positioned between the first metal plate (1021) and the socket (9). When viewed from above the second cover (222), the first metal plate (1021) (e.g., the first planar portion (1101) of the first metal plate (1021)) may overlap the second partial plate area (10222) of the second metal plate (1022). The second partial plate area (10222) of the second metal plate (1022) may include, for example, a third planar portion (1103) that is parallel to the first planar portion (1101) of the first metal plate (1021).In various embodiments, in the direction in which the second side (42B) of the second PCB (42) faces, the third planar portion (1103) of the second metal plate (1022) may be spaced further from the first planar portion (1101) of the first metal plate (1021) than the second planar portion (1102) of the second metal plate (1022). The second metal plate (1022) may include a bending portion (BP) extending the second planar portion (1102) and the third planar portion (1103).

[0209] According to various embodiments, the third planar portion (1103) of the second metal plate (1022) may be in physical contact with a third surface (9A) of a socket (9) disposed (e.g., surface-mounted) on a second surface (42B) of the second PCB (42) through the first opening (1000) of the second PCB (42). The third surface (9A) of the socket (9) may support the third planar portion (1103) of the second metal plate (1022).

[0210] According to various embodiments, the third planar portion (1103) of the second metal plate (1022) may be placed on the first surface (42A) of the second PCB (42) in an unattached state (also referred to as an uncoupled state) with respect to the second PCB (42).

[0211] According to various embodiments, the third planar portion (1103) of the second metal plate (1022) may be disposed on the first surface (42A) of the second PCB (42) in an attached state (also referred to as a bonded state) with respect to the second PCB (42). For example, the third planar portion (1103) of the second metal plate (1022) may be coupled (e.g., attached) to the second PCB (42) via an adhesive member (e.g., a double-sided tape) (or an adhesive member) disposed between the second portion (7112) and the first surface (42A) of the second PCB (42).

[0212] According to various embodiments, the third planar portion (1103) of the second metal plate (1022) may be inserted into the first opening (1000) of the second PCB (42) and may be physically spaced apart from (e.g., not in contact with) the third surface (9A) of the socket (9) disposed (e.g., surface-mounted) on the second surface (42B) of the second PCB (42).

[0213] According to various embodiments, the third metal plate (1023) of the first speaker housing (711) may be positioned at least partially between the second support plate (2211) and the first speaker (712). When viewed from above the second cover (222), the third metal plate (1023) may overlap the first speaker (712). When viewed from above the second cover (222), the third metal plate (1023) may overlap the first speaker (712).

[0214] According to various embodiments, the non-metallic frame (1010) of the first speaker housing (711) may include a fourth opening. A third metal plate (1023) may be positioned or coupled to the non-metallic frame (1010) to block the fourth opening. Preferably, the third metal plate (1023) may reduce or prevent sound waves generated by the first speaker (712) from leaking out of the first speaker housing (711) through the fourth opening of the non-metallic frame (1010). The third opening may allow the combination of the non-metallic frame (1010) and the third metal plate (1023) to have a slim structure. The third metal plate (1023) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker housing (711). In various embodiments, the fourth opening of the non-metallic frame (1010) corresponding to the third metal plate (1023) may be omitted. In various embodiments, the non-metallic frame (1010) may be provided (or formed) in an expanded form with respect to the omission of the third metal plate (1023) and the fourth opening.

[0215] According to various embodiments, the third metal plate (1023) of the first speaker housing (711) can reduce or prevent electromagnetic interference (EMI) to the first speaker (712). The third metal plate (1023) can reduce or prevent magnetic force from the first speaker (712) from being transmitted or moved outside the first speaker module (71). The third metal plate (1023) can include an electromagnetic shielding material or an electromagnetic absorbing material. In various embodiments, the third metal plate (1023) can include various metallic materials capable of shielding magnetic force. The third metal plate (1023) can include, for example, but is not limited to, SPCC.

[0216] According to various embodiments, the third metal plate (1023) of the first speaker housing (711) may be electrically connected to a ground area (not shown separately) included in the second PCB (42) and may be understood as part of the ground structure of the foldable electronic device (2).

[0217] According to various embodiments, the third metal plate (1023) of the first speaker housing (711) may be in an electrically floating state.

[0218] According to various embodiments, the third metal plate (1023) of the first speaker housing (711) may be positioned on the first portion (7111) of the first speaker housing (711). When viewed from above the second cover (222), the third metal plate (1023) may overlap the first metal plate (1021) and the first speaker (712) in the first portion (7111) of the first speaker housing (711).

[0219] According to various embodiments, the diaphragm (not shown separately) of the first speaker (712) may face the third metal plate (1023) of the first speaker housing (711). The first speaker (712) may generate sound toward the third metal plate (1023). The third metal plate (1023) may be a thin plate for slimming the first speaker module (71), but may also have a strength that can reduce vibrations for sound waves generated from the first speaker (712) and ensure durability.

[0220] According to various embodiments, in the direction in which the second side (42B) of the second PCB (42) faces, the second flat portion (1102) of the first partial plate area (10221) of the second metal plate (1022) may be spaced apart from the first flat portion (1101) of the first metal plate (1021) by a first distance (D1). The first speaker housing (711) may have a first gap of a first thickness (e.g., a thickness corresponding to the first distance (D1)) between the first flat portion (1101) of the first metal plate (1021) and the second flat portion (1102) of the first partial plate area (10221) of the second metal plate (1022) in the second portion (7112).

[0221] According to various embodiments, in the direction in which the second side (42B) of the second PCB (42) faces, the third planar portion (1103) of the second partial plate area (10222) of the second metal plate (1022) may be spaced apart from the first planar portion (1101) of the first metal plate (1021) by a second distance (D2). The first speaker housing (711) may have a second gap of a second thickness (e.g., a thickness corresponding to the second distance (D2)) between the first planar portion (1101) of the first metal plate (1021) and the third planar portion (1103) of the second partial plate area (10222) of the second metal plate (1022) in the second portion (7112). A second distance (D2) at which the third flat portion (1103) of the second partial plate area (10222) of the second metal plate (1022) in the second part (7112) of the first speaker housing (711) is spaced apart from the first flat portion (1101) of the first metal plate (1021) may be greater than a first distance (D1) at which the second flat portion (1102) of the first partial plate area (10221) of the second metal plate (1022) in the second part (7112) of the first speaker housing (711) is spaced apart from the first flat portion (1101) of the first metal plate (1021).

[0222] According to various embodiments, the second partial plate area (10222) of the second metal plate (1022) of the first speaker housing (711) may have a protrusion (1200) protruding with respect to the first partial plate area (10221) of the second metal plate (1022) to be inserted into the first opening (1000) of the second PCB (42). The protrusion (1200) of the second metal plate (1022) may include a bending portion (BP) between the first partial plate area (10221) and the second partial plate area (10222), and a third flat portion (1103) configured to face the third side (9A) of the socket (9) through the first opening (1000) of the second PCB (42). The protrusion (1200) of the second metal plate (1022) can expand the internal space (e.g., resonance space) of the first speaker housing (711) compared to the comparative example in which the protrusion (1200) and the first opening (1000) of the second PCB (42) are omitted. Preferably, the resonance space of the first speaker housing (711) is expanded by the protrusion (1200) of the second metal plate (1022), so that the quality of sound waves output through the first speaker (712) can be improved compared to the comparative example in which the protrusion (1200) and the first opening (1000) of the second PCB (42) are omitted. The protrusion (1200) of the second metal plate (1022) can enrich the low-mid sound, for example, compared to a comparative example in which the protrusion (1200) and the first opening (1000) of the second PCB (42) are omitted.

[0223] According to various embodiments, the protrusion (1200) of the second metal plate (1022) can expand the resonance space by, for example, about 0.03 cubic centimeters (cc) compared to the comparative example in which the protrusion (1200) and the first opening (1000) of the second PCB (42) are omitted. For example, in the comparative example in which the protrusion (1200) and the first opening (1000) of the second PCB (42) are omitted, the resonance space of the first speaker housing (711) can be about 0.37 cc. The first speaker housing (711) according to the present disclosure can have, for example, a resonance space of about 0.40 cc compared to the comparative example by adding the expanded resonance space due to the protrusion (1200) of the second metal plate (1022).

[0224] According to various embodiments, the second metal plate (1022) may be omitted, and the non-metal frame (1010) may be extended to replace the second metal plate (1022).

[0225] According to various embodiments, although not shown separately, an integral or single plate may be provided (or formed) to replace the second metal plate (1022) and the third metal plate (1023).

[0226] According to various embodiments, the third metal plate (1023) may be spaced apart from the first flat portion (1101) of the first metal plate (1021) by a third distance (D3) in the direction in which the second side (42B) of the second PCB (42) faces. The first speaker housing (711) may have a third gap of a third thickness (e.g., a thickness corresponding to the third distance (D3)) between the first metal plate (1021) and the third metal plate (1023) in the first portion (7111). A third distance (D3) at which the third metal plate (1023) in the first part (7111) of the first speaker housing (711) is spaced from the first flat portion (1101) of the first metal plate (1021) may be greater than a second distance (D2) at which the third flat portion (1103) of the second part plate area (10222) of the second metal plate (1022) in the second part (7112) of the first speaker housing (711) is spaced from the first flat portion (1101) of the first metal plate (1021).

[0227] According to various embodiments, the first speaker module (71) may be understood as a “first component”, and the socket (9) may be understood as a “second component.” The first component may be various and is not limited to the first speaker module (71). The first component may be at least partially disposed on a PCB (e.g., the second PCB (42)). The first component may include a first electrical element. The first electrical element may be, for example, one of a plurality of components included in the electronic device (101) of FIG. 1, but is not limited thereto. The first component may further include a first structural element (e.g., a support member) that supports the first electrical element or is coupled with the first electrical element. The second component may be various and is not limited to the socket (9). In various embodiments, the first component may be surface-mounted on a PCB (e.g., the second PCB (42)). The second component may include a second electrical element. The second electrical element may be, for example, one of the plurality of components included in the electronic device (101) of FIG. 1, but is not limited thereto. The second component may further include a second structural element (e.g., a support member) that supports or is coupled to the second electrical element. The second PCB (42) is not limited by the present disclosure.

[0228] According to various embodiments, a portion of the second component may be inserted into the first opening (1000) of the second PCB (42). A portion of the first component inserted into the first opening (1000) of the second PCB (42) may face a portion of the second component inserted into the first opening (1000) of the second PCB (42).

[0229] According to various embodiments, an opening of the PCB (e.g., a first opening (1000) of a second PCB (42)) may be utilized as a space where an FPCB is positioned.

[0230] According to various embodiments, an opening in a PCB (e.g., a first opening (1000) of a second PCB (42)) may be utilized as a space where a conductive member, such as a conductive gasket, is positioned in an electrical path (e.g., a power supply line) between an antenna radiator and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1), or an electrical path (e.g., a ground line) between an antenna radiator and a ground region of the second PCB (42).

[0231] According to various embodiments, the opening of the PCB (e.g., the first opening (1000) of the second PCB (42)) may be utilized as an empty space for weight reduction. The opening of the PCB may be utilized for various other purposes.

[0232] According to various embodiments, although not shown separately, the technical features of the present disclosure can be applied to electronic devices of other external shapes (e.g., a bar type electronic device, a plate type electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device) that are not limited to a foldable electronic device (2).

[0233] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (2)) includes a PCB (e.g., a second PCB (42)), a first component (e.g., a first speaker module (71)), and a second component (e.g., a socket (9)). The first component is disposed on a first side of the PCB (e.g., the first side (42A)). The second component is disposed on a second side of the PCB (e.g., the second side (42B)) facing in an opposite direction from the first side. The PCB includes an opening (e.g., the first opening (1000)) formed between the first component and the second component. The first component includes a protrusion (e.g., the protrusion (1200)) configured to be inserted into the opening of the PCB and to face the second component.

[0234] According to various embodiments of the present disclosure, the second component (e.g., the socket (9)) may include a third surface (e.g., a third surface (9A)) that faces a second surface (e.g., a second surface (42B)) of a PCB (e.g., a second PCB (42)). A protrusion (e.g., a protrusion (1200)) of the first component (e.g., the first speaker module (71)) may face a portion of the third surface of the second component through an opening (e.g., a first opening (1000)) of the PCB. When viewed from above the first surface (e.g., the first surface (42A)) of the PCB, about 2 / 3 or more of the opening of the PCB may overlap the third surface of the second component.

[0235] According to various embodiments of the present disclosure, a first component (e.g., a first speaker module (71)) may be disposed on a first surface (e.g., a first surface (42A)) of a PCB (e.g., a second PCB (42)) in an unattached state with respect to the PCB. A second component (e.g., a socket (9)) may be surface-mounted on a second surface (e.g., a second surface (42B)) of the PCB.

[0236] According to various embodiments of the present disclosure, a first component (e.g., a first speaker module (71)) may be disposed on a first surface (e.g., a first surface (42A)) of a PCB (e.g., a second PCB (42)) while being attached to the PCB. A second component (e.g., a socket (9)) may be surface-mounted on a second surface (e.g., a second surface (42B)) of the PCB.

[0237] According to various embodiments of the present disclosure, an opening (e.g., a first opening (1000)) of a PCB (e.g., a second PCB (42)) may include a notch formed at an edge (e.g., a first edge (E)) of the PCB when viewed from above a first side (e.g., a first side (42A)) of the PCB.

[0238] According to various embodiments of the present disclosure, an opening (e.g., a first opening (1000)) of a PCB (e.g., a second PCB (42)) may include a hole positioned inside an edge of the PCB when viewed from above a first side (e.g., a first side (42A)) of the PCB.

[0239] According to various embodiments of the present disclosure, a first component (e.g., a first speaker module (71)) may extend from a first portion (e.g., a first portion (7111)) that does not overlap the PCB (e.g., a first surface (42A)) when viewed from above a first surface (e.g., a first surface (42A)) of a PCB (e.g., a second PCB (42)) to a second portion (e.g., a second portion (7112)) that overlaps the PCB. The second portion (7112) of the first component may include a protrusion (e.g., a protrusion (1200)) inserted into an opening (e.g., a first opening (1000)) of the PCB.

[0240] According to various embodiments of the present disclosure, the first component may include a speaker module (e.g., a first speaker module (71)) including a speaker housing (e.g., a first speaker housing (711)) and a speaker (e.g., a first speaker (712)) positioned within the speaker housing. A portion of the speaker housing may include a protrusion (e.g., a protrusion (1200)) inserted into an opening (e.g., a first opening (1000)) of a PCB (e.g., a second PCB (42)).

[0241] According to various embodiments of the present disclosure, a speaker housing (e.g., a first speaker housing (711)) may extend from a first portion (e.g., the first portion (7111)) that does not overlap the PCB (e.g., the first portion (42A)) when viewed from above a first surface (e.g., the first surface (42A)) of a PCB (e.g., a second PCB (42)) to a second portion (e.g., the second portion (7112)) that overlaps the PCB. A speaker (e.g., the first speaker (712)) may be positioned within the first portion of the speaker housing. The first portion and the second portion of the speaker housing may form a resonance space for the speaker. The second portion of the speaker housing may include a protrusion (e.g., a protrusion (1200)) inserted into an opening (e.g., the first opening (1000)) of the second PCB.

[0242] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (2)) may further include a battery (e.g., a second battery (52)) positioned within the electronic device. When viewed from above a first side (e.g., a first side (42A)) of a PCB (e.g., a second PCB (42)), a second portion (e.g., a second portion (7112)) of a speaker housing (e.g., a first speaker housing (711)) may be positioned between the speaker (e.g., the first speaker (712)) and the battery.

[0243] According to various embodiments of the present disclosure, a speaker housing (e.g., a first speaker housing (711)) may include a metal plate (e.g., a second metal plate (1022)) that forms at least a portion of a protrusion (e.g., a protrusion (1200)) inserted into an opening (e.g., a first opening (1000)) of a PCB (e.g., a second PCB (42)). The metal plate may be configured to define a portion of a resonant space of the speaker housing.

[0244] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (2)) may further include a display module (e.g., a second display module (26)) and a support plate (e.g., a second support plate (2211)). A PCB (e.g., a second PCB (42)) and a speaker module (e.g., a first speaker module (71)) may be positioned between the display module and the support plate. A first side (e.g., a first side (42A)) of the PCB may face the display module. A second side (e.g., a second side (42B)) of the PCB may face the support plate.

[0245] According to various embodiments of the present disclosure, a speaker housing (e.g., a first speaker housing (711)) may include a first metal plate (e.g., a first metal plate (1021)) and a second metal plate (e.g., a second metal plate (1022)). The first metal plate may include a first planar portion (e.g., a first planar portion (1101)) extending from a first area (e.g., a first area (11011)) that does not overlap the PCB to a second area (e.g., a second area (11012)) that overlaps the PCB, when viewed from above a first surface (e.g., a first surface (42A)) of a PCB (e.g., a second PCB (42)). The second metal plate may include a first partial plate area (e.g., a first partial plate area (10221)) and a second partial plate area (e.g., a second partial plate area (10222)). The first partial plate area may include a second planar portion (e.g., a second planar portion (1102)) positioned between the second area of ​​the first metal plate and the first side of the PCB and facing the first side of the PCB. The second partial plate area may include a third planar portion (e.g., a third planar portion (1103)) extending from the first partial plate area and facing the second component (e.g., the socket (9)) through an opening (e.g., the first opening (1000)) of the PCB. A speaker (e.g., the first speaker (712)) may be positioned within the speaker housing so as to overlap the first area of ​​the first planar portion when viewed from above the first side of the PCB. The first planar portion, the second planar portion, and the third planar portion can define a resonant space of the speaker housing. A second distance (e.g., a second distance (D2)) by which the third planar portion is spaced from a second region of the first planar portion can be greater than a first distance (e.g., a first distance (D1)) by which the second planar portion is spaced from a second region of the first planar portion.

[0246] According to various embodiments of the present disclosure, the second component may include a socket (e.g., socket (9)) configured to allow a SIM card to be connected.

[0247] According to various embodiments of the present disclosure, an opening (e.g., a first opening (1000)) of a PCB (e.g., a second PCB (42)) can be formed in a non-ground area of ​​the PCB.

[0248] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, the scope of various embodiments of the present disclosure should be construed as including modified or altered forms in addition to the embodiments disclosed herein. Additionally, it will be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. In particular, it is emphasized that while the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, some of these embodiments are connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. That is, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

1. In an electronic device (2), printed circuit board (PCB) (42); A first component (71) placed on the first surface (42A) of the above PCB (42); and A second component (9) is disposed on a second surface (42B) of the PCB (42) facing in the opposite direction to the first surface (42A), The above PCB (42) includes an opening (1000) formed between the first part (71) and the second part (9), and An electronic device wherein the first component (71) further includes a protrusion (1200) configured to be inserted into the opening (1000) of the PCB (42) and to face the second component (9).

2. In paragraph 1, The second component (9) includes a third surface (9A) facing the second surface (42B) of the PCB (42), The protrusion (1200) of the first component (71) faces a part of the third surface (9A) of the second component (9) through the opening (1000) of the PCB (42), and An electronic device in which, when viewed from above the first side (42A) of the PCB (42), more than about 2 / 3 of the opening (1000) of the PCB (42) overlaps with the third side (9A) of the second component (9).

3. In paragraph 1 or 2, The above first component (71) is placed on the first surface (42A) of the PCB (42) in an unattached state with respect to the PCB (42), and The above second component (9) is an electronic device surface-mounted on the second surface (42B) of the above PCB (42).

4. In paragraphs 1 to 3, The above first component (71) is placed on the first surface (42A) of the PCB (42) in a state of being attached to the PCB (42), and The above second component (9) is an electronic device surface-mounted on the second surface (42B) of the above PCB (42).

5. In paragraphs 1 to 4, An electronic device in which the opening (1000) of the PCB (42) includes a notch formed at an edge of the PCB (42) when viewed from above the first surface (42A) of the PCB (42).

6. In paragraphs 1 to 5, An electronic device in which the opening (1000) of the PCB (42) includes a hole located inside the edge of the PCB (42) when viewed from above the first surface (42A) of the PCB (42).

7. In paragraphs 1 to 6, The first part (71) extends from a first part (7111) that does not overlap the PCB (42) to a second part (7112) that overlaps the PCB (42) when viewed from above the first surface (42A) of the PCB (42), and An electronic device in which the second part (7112) of the first component (71) includes the protrusion (1200) inserted into the opening (1000) of the PCB (42).

8. In paragraphs 1 to 7, The above first component (71) includes a speaker module including a speaker housing (711) and a speaker (712) positioned within the speaker housing (711), An electronic device in which a portion of the speaker housing (711) includes the protrusion (1200) inserted into the opening (1000) of the PCB (42).

9. In paragraph 8, The speaker housing (711) extends from a first portion (7111) that does not overlap the PCB (42) to a second portion (7112) that overlaps the PCB (42) when viewed from above the first surface (42A) of the PCB (42). The above speaker (712) is positioned within the first part (7111) of the above speaker housing (711), The first part (7111) and the second part (7112) of the speaker housing (711) form a resonance space for the speaker (712), and An electronic device in which the second part (7112) of the speaker housing (711) includes the protrusion (1200) inserted into the opening (1000) of the PCB (42).

10. In paragraph 9, Further comprising a battery (52) located within the electronic device (2), An electronic device in which the second part (7112) of the speaker housing (711) is positioned between the speaker (712) and the battery (52, 189) when viewed from above the first side (42A) of the PCB (42).

11. In paragraph 9 or 10, The above speaker housing (711) includes a metal plate (1022) that forms at least a portion of a protrusion (1200) inserted into the opening (1000) of the PCB (42), An electronic device in which the metal plate (1022) is configured to define a portion of the resonant space of the speaker housing (711).

12. In paragraphs 9 to 11, Further comprising a display module (26, 160) and a support plate (2211), The above PCB (42) and the speaker module (71) are positioned between the display module (26, 160) and the support plate (2211), The first side (42A) of the PCB (42) faces the display module (26, 160), and An electronic device in which the second side (42B) of the above PCB (42) faces the support plate (2211).

13. In paragraphs 8 to 12, The above speaker housing (711) includes a first metal plate (1021) and a second metal plate (1022), The first metal plate (1021) includes a first flat portion (1101) extending from a first area (11011) that does not overlap with the PCB (42) to a second area (11012) that overlaps with the PCB (42) when viewed from above the first surface (42A) of the PCB (42), The above second metal plate (1022) is A first partial plate area (10221) positioned between the second area (11012) of the first metal plate (1021) and the first surface (42A) of the PCB (42), and including a second flat portion (1102) facing the first surface (42A) of the PCB (42), and A second portion plate area (10222) extending from the first portion plate area (10221) and including a third flat portion (1103) facing the second component (9) through the opening (1000) of the PCB (42), The above speaker (712) is positioned within the speaker housing (711) so as to overlap with the first area (11011) of the first flat portion (1101) when viewed from above the first surface (42A) of the PCB (42), The first planar portion (1101), the second planar portion (1102), and the third planar portion (1103) define the resonance space of the speaker housing (711), and An electronic device in which the second distance (D2) by which the third plane portion (1103) is spaced from the second area (11012) of the first plane portion (1101) is greater than the first distance (D1) by which the second plane portion (1102) is spaced from the second area (11012) of the first plane portion (1101).

14. In paragraphs 1 to 13, The second component (9) is an electronic device including a socket configured to allow a SIM (subscriber identity module) card to be connected.

15. In paragraphs 1 to 14, The opening (1000) of the above PCB (42) is an electronic device formed in a non-ground area of ​​the above PCB (42).

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