Lifting device and lifting method

Abstract

[Problem] To contribute to a reduction in the number of components and to space saving, and to enable stable and smooth raising and lowering of a moving member. [Solution] This lifting device for raising and lowering a moving member that is vertically movable in a processing chamber in which a substrate is processed under reduced pressure includes: a cylindrical part; a pressure receiving part movable along a central axis direction of the cylindrical part by receiving gas pressure in the cylindrical part; a connection part for connecting the pressure receiving part and the moving member; a first expansion and contraction part disposed on one side in the central axis direction relative to the pressure receiving part in the cylindrical part and expandable and contractible in the central axis direction in accordance with the movement of the pressure receiving part; and a second expansion and contraction part disposed on the other side in the central axis direction relative to the pressure receiving part in the cylindrical part and expandable and contractible in the central axis direction in accordance with the movement of the pressure receiving part. When the gas pressure in at least one of a first space between the cylindrical part and the first expansion and contraction part and a second space between the cylindrical part and the second expansion and contraction part is adjusted, the pressure receiving part moves along the central axis direction of the cylindrical part to raise and lower the moving member together with the connection part.

Description

Lifting device and lifting method

[0001] The present disclosure relates to a lifting device and a lifting method.

[0002] Substrate processing apparatuses that perform substrate processing such as etching and deposition on substrates are known. Examples of such substrate processing apparatuses include an apparatus that includes a plurality of lift pins that are movable up and down relative to a support (mounting table) that supports a substrate to be processed, and a cylinder that serves as a drive unit for moving each lift pin up and down (see, for example, Patent Document 1). In this substrate processing apparatus, the substrate can be raised and lowered on the support by the vertical movement of each lift pin.

[0003] Special Publication No. 2023-515063

[0004] The technology disclosed herein contributes to reducing the number of components and saving space, and also enables stable and smooth lifting and lowering of moving members.

[0005] One aspect of the technology according to the present disclosure is an elevating device that elevates a moving member that is movable in a vertical direction within a processing chamber in which a substrate is processed under reduced pressure, the elevating device comprising: a cylindrical portion; a pressure receiving portion that is disposed within the cylindrical portion and that is movable along a central axis of the cylindrical portion by receiving gas pressure within the cylindrical portion; a connecting portion that connects the pressure receiving portion and the moving member; and a connecting portion that is disposed within the cylindrical portion on one side of the pressure receiving portion in the central axis direction, that is cylindrical, the inside of which is in communication with the processing chamber, and that moves along the central axis as the pressure receiving portion moves. The pressure receiving part is provided with a first expandable / contractible part, and a second expandable / contractible part that is arranged on the other side of the central axis direction relative to the pressure receiving part within the cylindrical part, is cylindrical, its inside is connected to the processing chamber, and is expandable / contractible in the central axis direction as the pressure receiving part moves, and the pressure receiving part moves along the central axis direction by adjusting the pressure of gas in at least one of a first space between the cylindrical part and the first expandable / contractible part and a second space between the cylindrical part and the second expandable / contractible part, thereby raising and lowering the moving member together with the connecting part.

[0006] According to the present disclosure, it is possible to reduce the number of components and save space, and also to enable stable and smooth raising and lowering of the moving member.

[0007] Fig. 1 is a vertical sectional perspective view showing an example of a substrate processing apparatus; Fig. 2 is a vertical sectional view showing an example of a lifting device (lifter pins in a raised state) provided in the substrate processing apparatus; Fig. 3 is a vertical sectional perspective view showing an example of a lifting device (lifter pins in a lowered state) provided in the substrate processing apparatus; and Fig. 4 is a vertical sectional perspective view showing an example of a conventional lifting device.

[0008] An embodiment of the technology according to the present disclosure will be described below with reference to the drawings. However, the configurations described in the following embodiments are merely examples, and the present disclosure is not limited to these configurations. For example, each component included in this configuration can be replaced with any component that can perform the same function. Also, any component may be added. FIG. 1 is a vertical cross-sectional perspective view showing an example of a substrate processing apparatus. For convenience of explanation, the upper side in FIG. 1 (and similarly in FIGS. 2 to 4) will be referred to as "upper" (or "upper"), and the lower side will be referred to as "lower" (or "lower").

[0009] The substrate processing apparatus 10 shown in FIG. 1 is an apparatus used, for example, in the manufacture of semiconductors. The substrate processing apparatus 10 includes a processing chamber 11 in which a wafer (substrate) W is processed under reduced pressure, a stage 12 on which the wafer W is placed, and a lifter 13 as a moving member that can move up and down relative to the stage 12. The processing chamber 11 is box-shaped and includes a ceiling 111 at its upper end, a bottom 112 at its lower end, and a sidewall 113 connecting the ceiling 111 and the bottom 112. In this embodiment, a processing gas is supplied into the processing chamber 11. The processing chamber 11 is then placed in a reduced pressure (vacuum state), and a thin film is formed on the wafer W using plasma. The sidewall 113 is also provided with an inlet / outlet 114 through which the wafer W is loaded and unloaded by a transfer arm (not shown).

[0010] A mounting unit 12 and a lifter unit 13 are disposed within the processing chamber 11. The mounting unit 12 includes a disk-shaped disk portion 121 and a support portion 122 that supports the disk portion 121. The upper surface of the disk portion 121 serves as a mounting surface on which a wafer W is placed. The support portion 122 connects and fixes the center of the lower surface of the disk portion 121 to the bottom 112 of the processing chamber 11. The lifter unit 13 includes a disk-shaped disk portion (lifter base) 131 and a plurality of lifter pins 132 supported on the disk portion 131. The disk portion 131 is disposed below the disk portion 121 of the mounting unit 12 and concentrically with the disk portion 121. The plurality of lifter pins 132 are disposed at equal intervals along the circumferential direction of the disk portion 131. The number of lifter pins 132 is preferably, for example, three, but is not limited to this. Each lifter pin 132 penetrates the disk portion 121 of the mounting portion 12 and can be in a protruding state (the state shown in FIG. 1 ) protruding from the mounting portion 12 or a retracted state. This lifter portion 13 is used to load and unload a wafer W into and from the processing chamber 11. When loading a wafer W into the processing chamber 11, each lifter pin 132 is placed in the protruding state, and the wafer W from the transfer arm can be temporarily supported on each lifter pin 132 in the protruding state. The lifter pins 132 then descend while supporting the wafer W until they are retracted. This allows thin film formation processing on the wafer W on the mounting portion 12. When unloading the wafer W from the processing chamber 11 after the thin film formation processing, each lifter pin 132 is placed in the protruding state again, and the wafer W is temporarily supported on each lifter pin 132 in the protruding state. This allows the transfer arm to unload the wafer W.

[0011] Fig. 2 is a vertical cross-sectional view showing an example of a lifting device (lifter pins raised) provided in a substrate processing apparatus. Fig. 3 is a vertical cross-sectional view showing an example of a lifting device (lifter pins lowered) provided in a substrate processing apparatus. The substrate processing apparatus 10 includes a lifting device 1 as a drive source for vertically moving, i.e., raising and lowering, a lifter unit 13. This lifting device 1 is used in a method for raising and lowering a moving member (lifter unit 13). As shown in Figs. 2 and 3 , the lifting device 1 includes a cylindrical portion 2, a pressure-receiving portion 3, a sliding portion 4, a connecting portion 5, a first expandable portion (first bellows) 6A, a second expandable portion (second bellows) 6B, and a guide portion 7.

[0012] The tubular portion 2 has a cylindrical (cylindrical) body portion 21, a sealing portion 22 that seals the upper opening of the body portion 21, and a sealing portion 23 that seals the lower opening of the body portion. The body portion 21 is oriented such that its central axis O21 is aligned in the vertical direction. The sealing portion 22 is provided with a flow path 221 through which the gas GS1 passes. One end of the flow path 221 is a first outer opening (first opening) 222 that opens to the outside of the tubular portion 2, and the other end is a first inner opening 223 that opens to the inside of the tubular portion 2. A joint is connected to the first outer opening 222. The sealing portion 23 is provided with a flow path 231 through which the gas GS2 passes. One end of the flow path 231 is a second outer opening (second opening) 232 that opens to the outside of the tubular portion 2, and the other end is a second inner opening 233 that opens to the inside of the tubular portion 2. A joint is connected to the second outer opening 232. The constituent material of the cylindrical portion 2 is not particularly limited, and for example, stainless steel such as SUS316 can be used. A seal material 26 is disposed between the body portion 21 and the sealing portion 22, and a seal material 27 is disposed between the body portion 21 and the sealing portion 23. The gases GS1 and GS2 may each be, for example, air or an inert gas.

[0013] The pressure-receiving portion 3 is disk-shaped with an outer diameter smaller than the inner diameter of the cylindrical portion 2, and is disposed inside the cylindrical portion 2 concentrically with the cylindrical portion 2. When the pressure-receiving portion 3 receives the pressure of gas GS1 within the cylindrical portion 2, it can move downward along the central axis O2 (see FIG. 3). When the pressure-receiving portion 3 receives the pressure of gas GS2 within the cylindrical portion 2, it can move upward along the central axis O2 (see FIG. 2). A flange portion 31 is formed on the outer periphery of the pressure-receiving portion 3 along the circumferential direction. A sliding portion 4 is provided on this flange portion 31.

[0014] The sliding portion 4 is a ring-shaped elastic member arranged concentrically with the cylindrical portion 2. The sliding portion 4 is compressed between the outer periphery of the pressure-receiving portion 3 and the inner periphery of the cylindrical portion 2. As a result, the sliding portion 4 slides against the inner periphery of the cylindrical portion 2 as the pressure-receiving portion 3 moves. The sliding portion 4 also divides the interior of the cylindrical portion 2 into a space above the pressure-receiving portion 3 (first space SP1) and a space below the pressure-receiving portion 3 (second space SP2). In other words, the sliding portion 4 separates the first space SP1 from the second space SP2. This prevents the gas GS1 and the gas GS2 from passing between the first space SP1 and the second space SP2. Note that the cross-sectional shape of the sliding portion 4 is "Y"-shaped in the configurations shown in FIGS. 2 and 3 , but is not limited thereto. Furthermore, there are no particular limitations on the elastic material that constitutes the sliding portion 4, and various rubber materials such as nitrile rubber and fluororubber can be used. Nitrile rubber is preferable when the substrate processing apparatus 10 performs processing at room temperature, and fluororubber is preferable when the substrate processing apparatus 10 performs processing at high temperature.

[0015] The connecting portion 5 extends along the central axis O2 and has a cylindrical (columnar) shape concentrically arranged with the cylindrical portion 2. The connecting portion 5 connects the pressure-receiving portion 3 and the disk portion 131 of the lifter portion 13. The outer diameter of the connecting portion 5 is smaller than the outer diameter of the pressure-receiving portion 3. While the connecting portion 5 is integrally formed with the center of the pressure-receiving portion 3, this is not limited thereto. For example, the connecting portion 5 may be formed separately from the pressure-receiving portion 3. The constituent materials of the connecting portion 5 and the pressure-receiving portion 3 are not particularly limited. For example, the same material as the constituent material of the cylindrical portion 2 can be used. As shown in FIG. 1 , the connecting portion 5 is connected to a portion of the disk portion 131 of the lifter portion 13 that is eccentric from the center. In this embodiment, the lifting device 1 is configured to cantilever the lifter portion 13 and lift the lifter portion 13. Furthermore, a through-hole 224 through which the connecting portion 5 passes is formed in the sealing portion 22 of the cylindrical portion 2, and a through-hole 234 is also formed in the sealing portion 23 on the opposite side to the sealing portion 22.

[0016] The first expandable section 6A is disposed within the cylindrical section 2 above (one side of) the pressure-receiving section 3 in the direction of the central axis O2, and the second expandable section 6B is disposed within the cylindrical section 2 below (the other side of) the pressure-receiving section 3 in the direction of the central axis O2. That is, the first expandable section 6A and the second expandable section 6B are disposed in the direction of the central axis O21 via the pressure-receiving section 3. The first expandable section 6A and the second expandable section 6B are each composed of a cylindrical member and are disposed concentrically with the cylindrical section 2. A flange section 61A is formed on the upper part of the outer periphery of the first expandable section 6A along the circumferential direction. The flange section 61A is connected to the sealing section 22 of the cylindrical section 2, for example, by welding. A seal material 28 is disposed between the flange section 61A and the sealing section 22. A lower section 62A of the first expandable section 6A is connected to the pressure-receiving section 3, for example, by welding. Meanwhile, a flange portion 61B is formed along the circumferential direction at the lower portion of the outer periphery of the second expandable portion 6B. The flange portion 61B is connected to the sealing portion 23 of the tubular portion 2 by, for example, welding. A sealant 29 is disposed between the flange portion 61B and the sealing portion 23. An upper portion 62B of the second expandable portion 6B is connected to the pressure-receiving portion 3 by, for example, welding.

[0017] The pressure-receiving unit 3 has a communication portion 32 that connects the inside of the first expandable unit 6A with the inside of the second expandable unit 6B. In this embodiment, the communication portion 32 is configured with a plurality of through holes 321 that penetrate the pressure-receiving unit 3 in the vertical direction (thickness direction). The inside of the first expandable unit 6A is connected to the inside of the processing chamber 11, and the inside of the second expandable unit 6B is connected to the inside of the processing chamber 11 via the communication portion 32 and the first expandable unit 6A. This communication allows, for example, air inside the first expandable unit 6A and the second expandable unit 6B and the processing chamber 11 to be exhausted to the outside.

[0018] The first and second expandable sections 6A and 6B are each bellows-shaped. This allows the first and second expandable sections 6A and 6B to expand and contract along the central axis O21 in response to the movement of the pressure-receiving section 3. As shown in FIG. 2 , when the pressure-receiving section 3 moves upward, the first expandable section 6A contracts and the second expandable section 6B expands. On the other hand, as shown in FIG. 3 , when the pressure-receiving section 3 moves downward, the first expandable section 6A expands and the second expandable section 6B contracts. In this way, the first and second expandable sections 6A and 6B can expand and contract in response to the movement of the pressure-receiving section 3. The first and second expandable sections 6A and 6B are made of the same metal material. While this metal material is not particularly limited, it is preferable to use a flexible metal material such as Hastelloy. This allows the first and second expandable sections 6A and 6B to easily expand and contract.

[0019] In the lifting device 1, a first space SP1 is defined by the body 21 and sealing portion 22 of the cylindrical portion 2, the first expandable portion 6A, the pressure-receiving portion 3, and the sliding portion 4, and a second space SP2 is defined by the body 21 and sealing portion 23 of the cylindrical portion 2, the second expandable portion 6B, the pressure-receiving portion 3, and the sliding portion 4. Both the first space SP1 and the second space SP2 are sealed spaces.

[0020] The guide portion 7 is a portion that guides the pressure-receiving portion 3 when the pressure-receiving portion 3 moves in the up and down direction. The guide portion 7 has a first sliding portion 71 disposed in the first space SP1, a second sliding portion 72 disposed in the second space SP2, and a support portion 73 that supports the first sliding portion 71 and the second sliding portion 72 relative to the pressure-receiving portion 3. The first sliding portion 71 and the second sliding portion 72 are each annular (ring-shaped) members that are disposed concentrically with the cylindrical portion 2.

[0021] There are two support portions 73. Each support portion 73 can be used to support both the first sliding portion 71 and the second sliding portion 72 by being inverted upside down. Hereinafter, the support portion 73 for supporting the first sliding portion 71 may be referred to as the "support portion 73A," and the support portion 73 for supporting the second sliding portion 72 may be referred to as the "support portion 73B." The support portion 73 includes a first annular portion 74 that is annular and arranged concentrically with the cylindrical portion 2, a second annular portion 75 that is spaced from the first annular portion 74 along the central axis O21 and is also annular and arranged concentrically with the cylindrical portion 2, and a connecting portion 76 that connects the first annular portion 74 and the second annular portion 75. A groove 741 is formed in the outer periphery of the first annular portion 74 along the circumferential direction. The first sliding portion 71 fits into the groove 741 of the support portion 73A. This prevents the first sliding portion 71 from coming off the support portion 73A. The second sliding portion 72 fits into the groove 741 of the support portion 73B. This prevents the second sliding portion 72 from coming off the support portion 73B. The second annular portion 75 of the support portion 73A is fixed to the upper surface of the pressure-receiving portion 3. The second annular portion 75 sandwiches the sliding portion 4 between itself and the flange portion 31 of the pressure-receiving portion 3. This prevents the sliding portion 4 from coming off the pressure-receiving portion 3. Meanwhile, the second annular portion 75 of the support portion 73B is fixed to the lower surface of the pressure-receiving portion 3. The connecting portion 76 is composed of a plurality of columnar portions 761 extending along the central axis O2. These columnar portions 761 are arranged at equal angular intervals around the central axis O21. The number of columnar portions 761 is preferably, for example, eight, but is not limited to this.

[0022] In the guide portion 7, when the pressure-receiving portion 3 moves up and down, the first sliding portion 71 slides against the inner periphery of the cylindrical portion 2, and the second sliding portion 72 also slides against the inner periphery of the cylindrical portion 2. This allows the pressure-receiving portion 3 to move up and down stably. In the guide portion 7, it is preferable to space the first sliding portion 71 and the second sliding portion 72 as far apart as possible. This allows the pressure-receiving portion 3 to move up and down more stably. As shown in FIG. 2 , when the pressure-receiving portion 3 moves upward, the first annular portion 74 of the support portion 73A abuts against the sealing portion 22 of the cylindrical portion 2. This restricts the upward movement limit of the pressure-receiving portion 3, thereby preventing the lifter pins 132 from protruding excessively and stably supporting the wafer W on the lifter pins 132. In this way, the support portion 73A functions as a restricting portion that restricts the upward movement limit of the pressure-receiving portion 3. On the other hand, the support portion 73B can restrict the downward movement limit of the pressure receiving portion 3.

[0023] The constituent materials of the first sliding portion 71 and the second sliding portion 72 are not particularly limited, and various thermoplastic elastomers such as polyether ether ketone (PEEK) can be used, for example. This allows the first sliding portion 71 and the second sliding portion 72 to slide smoothly and suppresses wear during sliding, i.e., provides high slidability and wear resistance. The constituent material of the support portion 73 is also not particularly limited, and for example, metal materials such as aluminum and stainless steel, or resin materials can be used.

[0024] The operation of the lifting device 1 configured as described above, i.e., the lifting and lowering of the lifter section 13 by the lifting device 1, will now be described. When lifting the lifter section 13, as shown in FIG. 2, gas GS2 is supplied to the second space SP2 of the lifting device 1. This supply of gas GS2 increases the pressure in the second space SP2, making it higher than the pressure in the first space SP1. This allows the pressure-receiving section 3 to move upward along the central axis O2, i.e., in the direction of arrow α. This movement in the direction of arrow α allows the pressure-receiving section 3 to lift the lifter section 13 together with the connecting section 5. Furthermore, as the pressure-receiving section 3 moves in the direction of arrow α, gas GS1 is discharged from the first space SP1. This allows the lifter section 13 to rise stably and smoothly.

[0025] On the other hand, when the lifter portion 13 is lowered, as shown in FIG. 3 , gas GS1 is supplied to the first space SP1 of the lifting device 1. This supply of gas GS1 increases the pressure in the first space SP1, making it higher than the pressure in the second space SP2. This allows the pressure-receiving portion 3 to move downward along the central axis O2, i.e., in the direction of arrow β. This movement in the direction of arrow β allows the pressure-receiving portion 3 to lower the lifter portion 13 together with the connecting portion 5. Furthermore, as the pressure-receiving portion 3 moves in the direction of arrow β, gas GS2 is discharged from the second space SP2. This allows the lifter portion 13 to lower stably and smoothly. In this way, in the lifting device 1, the pressure in at least one of the first space SP1 and the second space SP2 is adjusted. This allows the pressure-receiving portion 3 to move along the central axis O2, allowing the lifter portion 13 to be raised and lowered stably and smoothly.

[0026] Furthermore, when the lifting device 1 is operated, if the gas pressure in the first space SP1 and the second space SP2 is lower than the gas pressure in the first and second expandable sections 6A and 6B when the lifter section 13 is raised or lowered, buckling may occur in the bellows-shaped first and second expandable sections 6A and 6B. Therefore, it is preferable that the gas pressure in the first and second spaces SP1 and SP2 is higher than the gas pressure in the first and second expandable sections 6A and 6B when the lifter section 13 is raised or lowered. This prevents buckling in the first and second expandable sections 6A and 6B, thereby extending the life of the first and second expandable sections 6A and 6B. This pressure relationship, combined with the stable up-and-down movement of the pressure-receiving section 3 due to the guide section 7, further contributes to extending the life of the first and second expandable sections 6A and 6B.

[0027] Furthermore, the sliding part 4 and the first sliding part 71 and second sliding part 72 of the guide part 7 are all disposed in a space that is cut off from communication with the processing chamber 11. This allows a lubricant to be applied to each sliding part. It is preferable that the lubricant is prevented from being mixed into the processing chamber 11. Furthermore, the lifting device 1 can also stop the pressure-receiving part 3 at an intermediate position between the position shown in FIG. 2 and the position shown in FIG. 3 by adjusting the pressure in the first space SP1 and the second space SP2.

[0028] Next, a comparison between the lifting device 1 and a conventional lifting device 300 will be described. FIG. 4 is a vertical cross-sectional perspective view showing an example of a conventional lifting device. As shown in FIG. 4, the lifting device 300 includes an air cylinder 302, a linear slide 308, and a bracket 312 to which the air cylinder 302 and the linear slide 308 are fixed. The lifting device 300 also includes a slide carriage 310 that moves up and down by the linear slide 308 in response to operation of the air cylinder 302. The lifting device 300 also includes a ball joint 306 that connects the shaft 302a of the air cylinder 302 to the slide carriage 310, and a bellows 316 that is disposed and fixed between the eaves portion 312a of the bracket 312 and the slide carriage 310. A lifter pin 314 is fixed to the slide carriage 310 and extends through the bellows 316 into a processing chamber (not shown). The lifter pins 314 can be in a protruding state or a retracted state in accordance with the up and down movement of the slide carriage 310. The bellows 316 also expands and contracts between the eaves portion 312a of the bracket 312 and the slide carriage 310 in accordance with the up and down movement of the slide carriage 310.

[0029] In the lifting device 300 configured as described above, the inside of the bellows 316 is in communication with the processing chamber but is isolated from the outside. Therefore, when the processing chamber is particularly depressurized, the shaft 302a of the air cylinder 302 is pulled upward and moves along with the slide carriage 310. To counteract this pulling movement of the shaft 302a, it is necessary to increase the thrust (holding force) of the air cylinder 302. To increase the thrust, the lifting device 300 requires, for example, increasing the size of the air cylinder 302 or adding auxiliary members to increase the thrust, which results in a complex overall structure, making it difficult to simplify the overall structure. This problem (issue) with the lifting device 300 is hereinafter referred to as "Problem 1."

[0030] Furthermore, in the lifting device 300, the gap (clearance) between the lifter pins 314 and the insertion holes 312b through which the lifter pins 314 pass is very small. It is also preferable to prevent buckling of the bellows 316. Therefore, it is necessary to prevent the lifter pins 314 from ascending or descending at an angle, even to a small extent. The central axis of the lifter pins 314 and the central axis of the shaft 302a of the air cylinder 302 that raises and lowers the lifter pins 314 are not coaxial. In this positional relationship, in order to prevent the lifter pins 314 from ascending or descending at an angle, even to a small extent, the slide carriage 310 must be made more rigid or a reinforcing member must be added to reinforce the slide carriage 310, resulting in a complex overall structure. Hereinafter, this problem (issue) with the lifting device 300 will be referred to as "Problem 2."

[0031] It is clear that, compared to the lifting device 300, the lifting device 1 solves problems 1 and 2 through the above-described configuration. Therefore, this configuration can reduce the number of components of the lifting device 1 and contribute to space saving in the installation area where the lifting device 1 is installed. Reducing the number of components also makes it possible to reduce the weight of the lifting device 1 and reduce manufacturing costs.

[0032] Although preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and various modifications and alterations are possible within the scope of the present disclosure. Furthermore, in the above embodiment, the lifting device 1 lifts and lowers the lifter portion 13 by cantilevering the lifter portion 13. However, this is not limited thereto. For example, the lifter portion 13 may be supported at multiple locations (e.g., by double-sided support) to lift and lower the lifter portion 13. Furthermore, the moving member moved up and down by the lifting device 1 is the lifter portion 13 (lifter pins 132) in the above embodiment, but is not limited thereto. For example, the moving member may be the placement portion 12 depending on the configuration of the substrate processing apparatus 10. Furthermore, in the present embodiment, the processing object processed by the substrate processing apparatus 10 is a wafer W. However, this is not limited thereto. For example, the moving member may be a glass substrate depending on the configuration of the substrate processing apparatus 10.

[0033] This application claims priority based on Japanese Patent Application No. 2024-115607, filed on July 19, 2024, the entire contents of which are incorporated herein by reference.

[0034] REFERENCE SIGNS LIST 1 lifting device 2 cylindrical portion 3 pressure receiving portion 5 connecting portion 6A first expansion portion 6B second expansion portion 11 processing chamber 132 lifter pin GS1 gas GS2 gas O21 central axis SP1 first space SP2 second space W wafer

Claims

1. An elevating device for raising and lowering a movable member movable in a vertical direction within a processing chamber in which a substrate is processed under reduced pressure, comprising: a cylindrical section; a pressure-receiving section disposed within the cylindrical section and movable along the central axis of the cylindrical section by receiving gas pressure within the cylindrical section; a connecting section connecting the pressure-receiving section and the movable member; a first expandable section disposed within the cylindrical section on one side of the pressure-receiving section in the central axis direction, the first expandable section being cylindrical and communicating with the processing chamber at its inside, and expandable along the central axis as the pressure-receiving section moves; and a second expandable section disposed within the cylindrical section on the other side of the pressure-receiving section in the central axis direction, the second expandable section being cylindrical and communicating with the processing chamber at its inside, and expandable along the central axis as the pressure-receiving section moves. An elevator device in which the pressure-receiving portion moves along the central axis direction by adjusting the gas pressure in at least one of a first space between the tubular portion and the first telescopic portion and a second space between the tubular portion and the second telescopic portion, thereby raising and lowering the moving member together with the connecting portion.

2. A lifting device as described in claim 1, further comprising a sliding portion provided between the pressure receiving portion and the cylindrical portion, which separates the first space from the second space, and which slides against the inner periphery of the cylindrical portion as the pressure receiving portion moves.

3. The lifting device according to claim 2, wherein the sliding portion is a ring-shaped member arranged concentrically with the cylindrical portion.

4. The lifting device according to claim 1, further comprising a guide portion for guiding the pressure receiving portion when the pressure receiving portion moves.

5. The lifting device described in claim 4, wherein the guide portion has a first sliding portion that is disposed within the first space and slides against the inner periphery of the cylindrical portion as the pressure-receiving portion moves, a second sliding portion that is disposed within the second space and slides against the inner periphery of the cylindrical portion as the pressure-receiving portion moves, and a support portion that supports the first sliding portion and the second sliding portion relative to the pressure-receiving portion.

6. The lifting device according to claim 5, wherein the first sliding portion and the second sliding portion are each ring-shaped and arranged concentrically with the cylindrical portion.

7. The lifting device according to claim 5, wherein the support portion functions as a restricting portion that restricts the movement limit of the pressure receiving portion.

8. The lifting device according to claim 1, wherein the first telescopic section and the second telescopic section are each arranged concentrically with the cylindrical section.

9. The lifting device according to claim 1, wherein the pressure of the gas in the first space and the second space when the moving member is raised or lowered is higher than the pressure of the gas in the first extension section and the second extension section.

10. The lifting device according to claim 1, wherein the pressure-receiving portion is a disk-shaped portion arranged concentrically with the cylindrical portion.

11. The lifting device according to claim 1, wherein the pressure-receiving section has a communication section that connects the inside of the first telescopic section with the inside of the second telescopic section.

12. The lifting device described in claim 1, wherein the cylindrical portion has a first opening through which gas is supplied to and discharged from the first space, and a second opening through which gas is supplied to and discharged from the second space.

13. The lifting device according to claim 1, wherein the connecting portion is a columnar portion extending along the central axis and arranged concentrically with the cylindrical portion.

14. The lifting device according to claim 1, wherein the substrate is a wafer, the processing chamber is provided with a mounting section on which the wafer is placed, and a plurality of lifter pins that can take a protruding state in which they protrude from the mounting section to temporarily support the wafer, and a retracted state in which they are retracted from the protruding state, and the lifting device is used to raise and lower each of the lifter pins, with each of the lifter pins serving as the moving member.

15. The lifting device according to claim 1, wherein the substrate is a wafer, a mounting section on which the wafer is placed is provided inside the processing chamber, and the lifting device is used to lift and lower the mounting section, using the mounting section as the moving member.

16. A method for raising and lowering a movable member that can move up and down in a processing chamber in which a substrate is processed under reduced pressure, comprising: a cylindrical section; a pressure-receiving section that is disposed within the cylindrical section and that is movable along the central axis of the cylindrical section by receiving gas pressure within the cylindrical section; a connecting section that connects the pressure-receiving section and the movable member; a first expandable section that is disposed within the cylindrical section on one side of the pressure-receiving section in the central axis direction, is cylindrical, its inside communicates with the processing chamber, and is expandable along the central axis direction as the pressure-receiving section moves; and a second expandable section that is disposed within the cylindrical section on the other side of the pressure-receiving section in the central axis direction, is cylindrical, its inside communicates with the processing chamber, and is expandable along the central axis direction as the pressure-receiving section moves. In the lifting device, the pressure of the gas in at least one of the first space between the tubular portion and the first telescopic portion and the second space between the tubular portion and the second telescopic portion is adjusted to move the pressure-receiving portion along the central axis direction, thereby lifting and lowering the moving member together with the connecting portion.

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