Reactively deformable implantable component

The implantable component with a shape memory inlay circuit adjusts its shape during implantation to conform to the cochlea, addressing the challenge of inserting medical devices like cochlear implants by minimizing contact and damage.

WO2026027965A1PCT designated stage Publication Date: 2026-02-05COCHLEAR LIMITED
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Patent Information

Application Number
PCT/IB2025/056006
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-30
Filing Date
2025-06-11
Publication Date
2026-02-05

AI Technical Summary

Technical Problem

Implantation of medical devices, such as cochlear implants, is challenging due to the difficulty in conforming the shape of the stimulating assembly to the spiral shape of the cochlea while minimizing contact with the cochlear walls, which can damage the structure and functionality.

Method used

An implantable component with an elongate carrier member and a shape memory inlay circuit that adjusts its shape through controlled current flow, allowing selective connection and disconnection of components to conform to the cochlear shape during implantation.

Benefits of technology

Facilitates the insertion of the stimulating assembly into the cochlea by iteratively adjusting its shape to match the cochlear structure, reducing the risk of damage and improving the implantation process.

✦ Generated by Eureka AI based on patent content.

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Abstract

Presented herein are techniques related to implanting an implantable component in a recipient. The implantable component includes a carrier member in which a circuit is disposed. Changing the shape of the carrier member, such as during implantation in the recipient, drives relative movement between a first part and a second part of the circuit to change a connection between the first part and the second part. The change in connection between the first part and the second part is configured to adjust current flow directed through the circuit to further change the shape of the carrier member.
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Description

REACTIVEUY DEFORMABEE IMPLANTABLE COMPONENTBACKGROUNDTechnical Field[oooi] The present disclosure relates generally to an implantable component, such as a stimulating assembly, configured for reactive deformation.Related Art

[0002] Medical devices have provided a wide range of therapeutic benefits to recipients over recent decades. Medical devices can include internal or implantable components / devices, external or wearable components / devices, or combinations thereof (e.g., a device having an external component communicating with an implantable component). Medical devices, such as traditional hearing aids, partially or fully-implantable hearing prostheses (e.g., bone conduction devices, mechanical stimulators, cochlear implants, etc.), pacemakers, defibrillators, functional electrical stimulation devices, and other medical devices have been successful in performing lifesaving and / or lifestyle enhancement functions and / or recipient monitoring for a number of years.

[0003] The types of medical devices and the ranges of functions performed thereby have increased over the years. For example, many medical devices, sometimes referred to as “implantable medical devices,” now often include one or more instruments, apparatus, sensors, processors, controllers or other functional mechanical or electrical components that are permanently or temporarily implanted in a recipient. These functional devices are typically used to diagnose, prevent, monitor, treat, or manage a disease / injury or symptom thereof, or to investigate, replace or modify the anatomy or a physiological process. Many of these functional devices utilize power and / or data received from external devices that are part of, or operate in conjunction with, implantable components.SUMMARY

[0004] In one aspect, an implantable component is provided. The implantable component comprises an elongate carrier member configured to be inserted into a body cavity of a recipient and an elongate shape memory inlay circuit disposed in the elongate carrier member. A change in shape of the elongate carrier member is configured to drive relative movement between at least one first part and at least one second part of the elongate shape memory inlay circuit to cause the at least one first part and the at least one second part to selectively connect to anddisconnect from one another. Additionally, a change in connection between the at least one first part and the at least one second part with one another is configured to further change the shape of the elongate carrier member.

[0005] In another aspect, a method is provided. The method comprises inserting an implantable component in a body cavity of a recipient, the implantable component including a carrier member and a shape memory inlay activation circuit embedded in the carrier member, changing a shape of the carrier member during insertion of the implantable component in the body cavity to drive relative movement between a first component and a second component of the shape memory inlay activation circuit, and transitioning the shape memory inlay activation circuit between a first configuration and a second configuration in response to the relative movement between the first component and the second component. The first component and the second component are electrically coupled to one another in the first configuration, the first component and the second component are electrically decoupled from one another in the second configuration, and a transition of the shape memory inlay activation circuit between the first configuration and the second configuration further changes the shape of the carrier member.

[0006] In yet another aspect, an implantable component is provided. The implantable component comprises an elongate carrier member configured to be inserted into a body cavity of a recipient and an electrically-activated shape memory circuit that includes a power source, at least one drive wire disposed in the elongate carrier member and electrically connected to the power source, and at least one elongate shape memory inlay disposed in the elongate carrier member. The electrically-activated shape memory circuit is configured to, in response to a change in shape of the elongate carrier member, transition between an open configuration in which the at least one elongate shape memory inlay and the at least one drive wire are electrically separated and a closed configuration in which the at least one elongate shape memory inlay and the at least one drive wire are electrically connected, and transition of the electrically-activated shape memory circuit between the open configuration and the closed configuration further changes the shape of the elongate carrier member.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present disclosure are described herein in conjunction with the accompanying drawings, in which:

[0008] FIG. 1A is a schematic diagram illustrating a cochlear implant system with which aspects of the techniques presented herein can be implemented;

[0009] FIG. IB is a side view of a recipient wearing a sound processing unit of the cochlear implant system of FIG. 1A;[ooio] FIG. 1C is a schematic view of components of the cochlear implant system of FIG. 1 A;[ooii] FIG. ID is a perspective view of the cochlear implant system of FIG. 1 A;

[0012] FIG. 2 is a side view of a stimulating assembly of the cochlear implant system of FIG. 1A;

[0013] FIG. 3A is a schematic diagram of another stimulating assembly, in accordance with certain embodiments presented herein;

[0014] FIG. 3B is a schematic diagram of the stimulating assembly of FIG. 3A;

[0015] FIG. 3C is a schematic diagram of the stimulating assembly of FIG. 3 A;

[0016] FIG. 3D is a cross-sectional view of the stimulating assembly of FIG. 3A;

[0017] FIG. 4A is a schematic diagram of another stimulating assembly, in accordance with certain embodiments presented herein;

[0018] FIG. 4B is a schematic diagram of the cochlear implant system of FIG. 4A;

[0019] FIG. 5 is a schematic diagram of another stimulating assembly, in accordance with certain embodiments presented herein;

[0020] FIG. 6A, 6B, 6C, 6D, 6E, 6F, 6G, and 6H are schematic diagrams of a stimulating assembly, in accordance with certain embodiments presented herein;

[0021] FIG. 7 is a schematic diagram of another stimulating assembly, in accordance with certain embodiments presented herein;

[0022] FIG. 8 is a flowchart of a method for performing techniques presented herein;

[0023] FIG. 9 is a flowchart of another method for performing techniques presented herein;

[0024] FIG. 10 is a flowchart of another method for performing techniques presented herein;

[0025] FIG. 11A is a schematic diagram of a portion of another stimulating assembly, in accordance with certain embodiments presented herein;

[0026] FIG. 1 IB is a schematic diagram of the stimulating assembly of FIG. 11 A;

[0027] FIG. 12 is a flowchart of a method for performing techniques presented herein; and

[0028] FIG. 13 is a schematic diagram illustrating a computing device configured to perform aspects techniques presented herein.DETAILED DESCRIPTION

[0029] Presented herein are techniques for facilitating implantation of an implantable component, such as a stimulating assembly, into body cavity (e.g., cochlea) of a recipient. The stimulating assembly includes an elongate carrier member and an shape memory circuit embedded in the elongate carrier member. During implantation of the implantable component, parts / portions of the implantable component are connected and disconnected to adjust current flow through the shape memory circuit, which in turn causes a change a shape of the carrier member (e.g., to facilitate / promote implantation in the body cavity of the recipient).

[0030] There are a number of different types of devices in / with which embodiments of the present disclosure may be implemented. Merely for ease of description, the techniques presented herein are primarily described with reference to a specific device in the form of a cochlear implant system. However, it is to be appreciated that the techniques presented herein may also be partially or fully implemented by any of a number of different types of devices, including consumer electronic device (e.g., mobile phones), wearable devices (e.g., smartwatches), hearing devices, implantable medical devices, consumer electronic devices, etc. As used herein, the term “hearing device” is to be broadly construed as any device that acts on an acoustical perception of an individual, including to improve perception of sound signals, to reduce perception of sound signals, etc. In particular, a hearing device can deliver sound signals to a user in any form, including in the form of acoustical stimulation, mechanical stimulation, electrical stimulation, etc., and / or can operate to suppress all or some sound signals. As such, a hearing device can be a device for use by a hearing-impaired person (e.g., hearing aids, middle ear auditory prostheses, bone conduction devices, direct acoustic stimulators, electro-acoustic hearing prostheses, auditory brainstem stimulators, bimodal hearing prostheses, bilateral hearing prostheses, dedicated tinnitus therapy devices, tinnitus therapy device systems, combinations or variations thereof, etc.), a device for use by a person with normal hearing (e.g., consumer devices that provide audio streaming, consumerheadphones, earphones, and other listening devices), a hearing protection device, etc. In other examples, the techniques presented herein can be implemented by, or used in conjunction with, various implantable medical devices, such as visual devices (i.e., bionic eyes), sensors, pacemakers, drug delivery systems, defibrillators, functional electrical stimulation devices, catheters, seizure devices (e.g., devices for monitoring and / or treating epileptic events), sleep apnea devices, electroporation devices, etc.

[0031] FIGs. 1A-1D illustrate an example cochlear implant system 102 with which aspects of the techniques presented herein can be implemented. The cochlear implant system 102 comprises an external component 104 that is configured to be directly or indirectly attached to the body of the user, and an intemal / implantable component 112 that is configured to be implanted in or worn on the head of the user. In the examples of FIGs. 1A-1D, the implantable component 112 is sometimes referred to as a “cochlear implant.” FIG. 1A illustrates the cochlear implant 112 implanted in the head 154 of a user, while FIG. IB is a schematic drawing of the external component 104 worn on the head 154 of the user. FIG. 1C is another schematic view of the cochlear implant system 102, while FIG. ID illustrates further details of the cochlear implant system 102. For ease of description, FIGs. 1A-1D will generally be described together.

[0032] In the examples of FIGs. 1A-1D, the external component 104 comprises a sound processing unit 106, an external coil 108, and generally, a magnet fixed relative to the external coil 108. The cochlear implant 112 includes an implantable coil 114, an implant body 134, and an elongate stimulating assembly 116 configured to be implanted in the user’s cochlea. In the example of FIG. 1A, the sound processing unit 106 is an off-the-ear (OTE) sound processing unit, sometimes referred to herein as an OTE component, that is configured to send data and power to the implantable component 112. In general, an OTE sound processing unit is a component having a generally cylindrically shaped housing 111 and which is configured to be magnetically coupled to the user’s head 154 (e.g., includes an integrated external magnet 150 configured to be magnetically coupled to an intemal / implantable magnet 152 in the implantable component 112). The OTE sound processing unit 106 also includes an integrated external (headpiece) coil 108 (the external coil 108) that is configured to be inductively coupled to the implantable coil 114.

[0033] It is to be appreciated that the OTE sound processing unit 106 is merely illustrative of the external devices that could operate with implantable component 112. For example, in the example illustrated in FIG. ID, the external component 104 comprises a behind-the-ear (BTE)sound processing unit configured to be attached to, and worn adjacent to, the recipient’s ear. A BTE sound processing unit comprises a housing that is shaped to be worn on the outer ear of the user. In certain examples, the BTE is connected to a separate external coil assembly via a cable, where the external coil assembly is configured to be magnetically and inductively coupled to the implantable coil 114, while in other embodiments the BTE includes a coil disposed in or on the housing worn on the outer ear of the user. It is also to be appreciated that alternative external components could be located in the user’s ear canal, worn on the body, etc.

[0034] Although the cochlear implant system 102 includes the sound processing unit 106 and the cochlear implant 112, as described below, the cochlear implant 112 can operate independently from the sound processing unit 106, for at least a period, to stimulate the user. For example, the cochlear implant 112 can operate in a first general mode, sometimes referred to as an “external hearing mode,” in which the sound processing unit 106 captures sound signals which are then used as the basis for delivering stimulation signals to the user. The cochlear implant 112 can also operate in a second general mode, sometimes referred as an “invisible hearing” mode, in which the sound processing unit 106 is unable to provide sound signals to the cochlear implant 112 (e.g., the sound processing unit 106 is not present, the sound processing unit 106 is powered-off, the sound processing unit 106 is malfunctioning, etc.). As such, in the invisible hearing mode, the cochlear implant 112 captures sound signals itself via implantable sound sensors and then uses those sound signals as the basis for delivering stimulation signals to the user. It is to be appreciated that reference to the external hearing mode and the invisible hearing mode is merely illustrative and that the cochlear implant 112 could also operate in alternative modes.

[0035] In FIGs. 1A and 1C, the cochlear implant system 102 is shown with an external device 110, configured to implement aspects of the techniques presented. The external device 1 10 is a computing device, such as a personal computer (e.g., laptop, desktop, tablet), a mobile phone (e.g., smartphone), a remote control unit, etc. The external device 110 and the cochlear implant system 102 (e.g., sound processing unit 106 or the cochlear implant 112) wirelessly communicate via a bi-directional communication link 126. The bi-directional communication link 126 may comprise, for example, a short-range communication, such as Bluetooth link, Bluetooth Low Energy (BLE) link, a proprietary link, etc.

[0036] Turning to the example of FIG. ID, the sound processing unit 106 of the external component 104 also comprises one or more input devices 118 configured to capture and / or receive input signals (e.g., sound or data signals) at the sound processing unit 106. The one ormore input devices 118 include, for example, one or more sound input devices (e.g., one or more external microphones, audio input ports, telecoils, etc.), one or more auxiliary input devices (e.g., audio ports, such as a Direct Audio Input (DAI), data ports, such as a Universal Serial Bus (USB) port, cable port, etc.), and a short-range wireless transmitter / receiver (wireless transceiver) (e.g., for communication with the external device 110), each located in, on or near the sound processing unit 106. However, it is to be appreciated that the one or more input devices 118 may include additional types of input devices and / or less input devices (e.g., the short-range wireless transceiver and / or one or more auxiliary input devices could be omitted).

[0037] The sound processing unit 106 also includes, for example, at least one power source (e.g., a battery), a radio-frequency (RF) transceiver, and a processing module. The processing module can comprise, for example, one or more processors and a memory device (memory) that includes sound processing logic. The memory device may comprise any one or more of: Non-Volatile Memory (NVM), Ferroelectric Random Access Memory (FRAM), read only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. The one or more processors are, for example, microprocessors or microcontrollers that execute instructions for the sound processing logic stored in memory device.

[0038] Returning to the example of FIG. ID, the implantable component 112 comprises an implant body (main module) 134, a lead region 136, and the stimulating assembly 116, all configured to be implanted under the skin (tissue) of the user. The implant body 134 generally comprises a hermetically-sealed housing 138 that includes, in certain examples, at least one power source (e.g., one or more batteries, one or more capacitors, etc.), in which RF interface circuitry and a stimulator unit are disposed. The implant body 134 also includes the intemal / implantable coil 114 that is generally external to the housing 138, but which is connected to the RF interface circuitry via a hermetic feedthrough.

[0039] The stimulating assembly 116 is configured to be at least partially implanted in the user’s cochlea 137. The stimulating assembly 116 includes a plurality of longitudinally spaced intra-cochlear electrical stimulating contacts (electrodes) 144 that collectively form a contact array (electrode array) 128 for delivery of electrical stimulation (current) to the recipient’s cochlea 137. The stimulating assembly 116 extends through a body cavity in the recipient’s cochlea (e.g., cochleostomy 132, the round window 135, etc.) and has a proximal endconnected to the stimulator unit via the lead region 136 and a hermetic feedthrough. The lead region 136 includes a plurality of conductors (wires) that electrically couple the electrodes 144 to the stimulator unit. The implantable component 112 also includes an electrode outside of the cochlea 137, sometimes referred to as an extra-cochlear electrode (ECE). As described further below, the stimulating assembly 116 includes a longitudinally-elastic shape memory inlay (not shown in FIG. ID) disposed in the carrier member.

[0040] As noted, the cochlear implant system 102 includes the external coil 108 and the implantable coil 114. The coils 108, 114 are typically wire antenna coils each comprised of multiple turns of electrically insulated single-strand or multi-strand platinum or gold wire. The external magnet 150 (not shown in FIG. ID) is fixed relative to the external coil 108 and the intemal / implantable magnet 152 (not shown in FIG. ID) is fixed relative to the implantable coil 114. The external magnet 150 and the intemal / implantable magnet 152 fixed relative to the external coil 108 and the intemal / implantable coil 114, respectively, facilitate the operational alignment of the external coil 108 with the implantable coil 114. This operational alignment of the coils enables the external component 104 to transmit data and power to the implantable component 112 via a closely-coupled wireless link formed between the external coil 108 and the implantable coil 114. In certain examples, the closely-coupled wireless link is an RF link. However, various other types of energy transfer, such as infrared (IR), electromagnetic, capacitive and inductive transfer, may be used to transfer the power and / or data from an external component to an implantable component and, as such, FIG. ID illustrates only one example arrangement.

[0041] As noted above, the sound processing unit 106 includes the processing module. The processing module is configured to process the received input audio signals (received at one or more of the input devices 118, such as the sound input devices) and convert the received input audio signals into output control signals for use in stimulating a first ear of a recipient or user (i.e., the processing module is configured to perform sound processing on input signals received at the sound processing unit 106). Stated differently, the one or more processors (e.g., processing element(s) implementing firmware, software, etc.) in the processing module are configured to execute sound processing logic in memory to convert the received input audio signals into output control signals (stimulation signals) that represent electrical stimulation for delivery to the recipient. In FIG. ID, according to an example embodiment, output control signals (stimulation signals) are provided to an RF transceiver, which transcutaneously transfers the output control signals (e.g., in an encoded manner) to the implantable component112 via the external coil 108 and the implantable coil 114. That is, the output control signals (stimulation signals) are received at the RF interface circuitry via the implantable coil 114 and provided to the stimulator unit. The stimulator unit is configured to utilize the output control signals to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea 137 via one or more of the stimulating contacts 144. In this way, the cochlear implant system 102 electrically stimulates the user’s auditory nerve cells, bypassing absent or defective hair cells that normally transduce acoustic vibrations into neural activity, in a manner that causes the recipient to perceive one or more components of the input audio signals (the received sound signals).

[0042] As noted, the processing module in the sound processing unit 106 generates the output control signals. In an alternative embodiment, the sound processing unit 106 can send less processed information (e.g., audio data) to the implantable component 112, and the sound processing operations (e.g., conversion of input sounds to output control signals) can be performed by a processor within the implantable component 112. In further embodiments (e.g., to operate in the invisible hearing mode), the cochlear implant 112 can include a plurality of implantable sound sensors that collectively form a sensor array configured to detect / capture input sound signals. The sound sensors provide the input sound signals to a processing module of the cochlear implant 112 to convert the input sound signals into output control signals for use in stimulating the first ear of a recipient or user (i.e., the processing module of the cochlear implant 112 is configured to perform sound processing operations). The stimulator unit is configured to utilize the output control signals to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea, thereby bypassing the absent or defective hair cells that normally transduce acoustic vibrations into neural activity.

[0043] FIG. 2 is a side view of an embodiment of the stimulating assembly 116 having a shape memory circuit 210, in accordance with certain embodiments presented herein. In the example, the stimulating assembly 116 is shown in a curved configuration (e.g., a shape after implantation into a recipient’s body cavity, such as the cochlea).

[0044] In this example, the stimulating assembly 116 includes an extra-cochlear or proximal region 240 and an intra-cochlear region 242. The intra-cochlear region 242 is configured to be implanted in the recipient’s cochlea. The stimulating assembly 116 also comprises an elongate carrier member 244 along which the electrodes 144 are disposed to form the contact array 128. Each electrode 144 is connected to one or more wires 246 that extend through an elongate length of the carrier member 244. The one or more wires 246 each have a proximal endconnected to a stimulator / receiver unit. In operation, stimulating electrical signals travel through the one or more wires 246 to cause the electrodes to provide electrical stimulation to the recipient. In some embodiments, the stimulating assembly 116 includes a body 254 in which the one or more wires 246 are embedded. For example, the body 254 is silicone or another biocompatible material molded over the one or more wires 246. Thus, flexure of the body 254 causes corresponding flexure of the one or more wires 246 embedded therein.

[0045] The stimulating assembly 116 is configured to adopt the curved configuration during and / or after implantation into the recipient’s cochlea. The stimulating assembly 116 may extend towards an apical end of the cochlea, referred to as cochlea apex. In certain circumstances, the stimulating assembly 116 may be inserted into the cochlea via a cochleostomy. In other circumstances, a cochleostomy may be formed through round window, oval window, the promontory or through an apical turn of the cochlea. In the curved configuration, the intra-cochlear region 242 extends in a generally spiral shape, and a portion of the electrodes 144 of the electrode array 128 is located within the spiral. The arrangement of the portion of the electrode array 128 in the spiral maintains positioning against the cochlea of the recipient to enable stimulation of cells of the cochlea via the electrode array 128. As described further below, the stimulating assembly 116 includes an inlay in accordance with embodiments presented herein.

[0046] It is desirable for the stimulating assembly 116 to be selectively curved to conform to the shape of the cochlea while minimizing contact with the walls of the cochlea. As such, in this example, the stimulating assembly 116 includes a shape memory circuit 210 that uses current flow through the stimulating assembly 116 to control curving of the stimulating assembly 116. As described further below, a shape memory circuit, such as shape memory circuit 210, comprises a shape memory inlay 208 and one or more conductors (wires) 246 electrically connecting the shape memory inlay 208 to a power source 256. The power source 256 is configured to deliver current to the shape memory inlay 208 via the wires 246 and, in turn, change a shape of the stimulating assembly 116. As an example, the stimulating assembly 116 is pre-curved (e.g., molded) into the selected curved shape and then straightened for insertion / implantation into a recipient (e.g., via a stylet, sheath, etc.). Thus, during insertion, the stimulating assembly 116 is urged to return to its pre-curved shape, such as a shape corresponding to a cochlea spiral, via the shape memory circuit 210. That is, the shape memory circuit 210 uses the current delivered by the power source 256 to selectively bend to the shape of the cochlea.

[0047] Further details of shape memory circuits in accordance with embodiments presented herein, such as shape memory circuit 210, are provided below. However, in general, shape memory circuits presented herein include components that are configured to connect and disconnect with one another to enable and interrupt, respectively, current flow through one or more shape memory inlays. These change in so called “electrical connection status,” which controls whether or not current flows through the shape memory inlays, in turn controls changes in a shape of the carrier member (e.g., the curved shape of the stimulating assembly). For example, a shape memory inlay in accordance with embodiments presented herein is configured to change shape (e.g., deform toward a pre-curved shape) upon an increase in temperature in the inlay above a threshold temperature, but is configured to maintain a present shape when the temperature of the inlay is below the threshold temperature. In the embodiments presented herein, the current flow is used to increase the temperature of the one or more inlays, thereby urging the stimulating assembly toward the pre-curved shape via deformation of the one or more inlays in response to the temperature increase. In some implementations, the carrier member is maintained in a straight configuration, such as via a stiffening element, to help initial insertion of the stimulating assembly into the cochlea. During insertion of the stimulating assembly into the cochlea, the carrier member initially changes shape (e.g., via contact with the cochlea, via adjustment of a stiffening element) to initiate movement between the components of the shape memory circuit to cause the change in electrical connection status between the components. The change in electrical connection status between the components then further changes the shape of the elongate carrier by adjusting current flow through the one or more shape memory inlays. The components can recurrently connect to and disconnect from one another to iteratively curve the stimulating assembly and help conform the stimulating assembly into the shape of the cochlea. By initiating a change in electrical connection status between the components via changing the shape of the carrier member, the stimulating assembly curls toward the pre-curved shape more reactively and can be more suitably arranged to correspond to the shape of the cochlea, such as in comparison to having a surgeon or other user manually change the shape of the stimulating assembly (e.g., via a user input) during implantation.

[0048] It should be noted that techniques discussed herein can be implemented for any of a number of different implantable components. That is, reactive curling of an implantable component (e.g., in response to contact with a wall of a body structure) can be provided for implantation of the implantable component in another body cavity of a recipient. Moreover,the shape of the implantable component can change, such as extend, compress, bend, in any suitable manner using the techniques discussed herein to conform to the shape of the body cavity.

[0049] FIGs. 3A, 3B, and 3C are a series of schematic diagrams illustrating implantation of an embodiment of a stimulating assembly 316 in a cochlea 137 of a recipient using a shape memory circuit 310, in accordance with embodiments presented herein. Briefly, the cochlea 137 is a conical spiral structure comprising three parallel fluid-filled canals or ducts, the tympanic canal (or scala tympani), the vestibular canal (or scala vestibuli), and the median canal (or scala media). The cochlea 137 spirals and terminates at a cochlea apex 164. Perilymph fluid fdls the tympanic canal and the vestibular canal, collectively referred to as canals 170, whereas endolymph fdls the median canal. Sound entering a recipient’s auricle (not shown) causes pressure changes in the cochlea 137 to travel through the fluid-filled canals 170. An adjacent tectorial membrane moves in response to the pressure variations in the canals 170, and small relative movement of the tectorial membrane are sufficient to cause hair cells in the endolymph to move, thereby causing the creation of a voltage pulse or action potential which travels along an associated nerve fiber. The nerve fibers connect the hair cells with spiral ganglion cells to relay impulses to auditory areas of the brain (not shown) for processing.

[0050] The place along the cochlea 137 where maximum excitation of the hair cells occurs determines the perception of pitch and loudness. Due to this anatomical arrangement, the cochlea 137 has characteristically been referred to as being “tonotopically mapped.” In particular, regions of the cochlea 137 toward a basal region 166 are responsive to high frequency signals, whereas regions of the cochlea 137 toward an apical region 168 are responsive to low frequency signals. In general, the basal region 166 is the portion of the cochlea 137 located closest to the stapes (not shown) and extends to approximately the first turn of the cochlea 137 (i.e., the region of the cochlea 137 between the cochlea openings, including the round and oval windows, the first cochlea turn). The apical region 168 is the portion of the cochlea 137 in proximity to the cochlea apex 164 and is generally the last / fmal (i.e., most apical) 360 degrees of the cochlea 137 and encompasses the cochlea areas tonotopically associated with frequencies below 1000Hz.

[0051] The stimulating assembly 316 is inserted into the canals 170 to extend from the basal region 166 to the apical region 168. The stimulating assembly 316 delivers stimulation signals within a predetermined frequency range to a region of the cochlea 137 that is most sensitive to that particular frequency range to exploit the tonotopical properties of the cochlea 137. Thatis, the stimulating assembly 316 delivers stimulation signals at a greater frequency at portions adjacent to the basal region 166 and at lower frequency at portions adjacent to the apical region 168.

[0052] Insertion of the stimulating assembly 316 into the cochlea 137 can be a burdensome, complicated, and tedious task. For example, it is difficult to adjust the stimulating assembly 316 to conform to the spiral shape of the cochlea 137, especially while trying to avoid or limit contact between the stimulating assembly 316 and an outer wall 172 and / or an inner wall 174 (e.g., a modiolus wall) of the cochlea 137 to preserve the structure and functionality of the cochlea 137. Indeed, it can be challenging to determine (e.g., visually observe) the placement of the stimulating assembly 316 within the cochlea 137. Therefore, it can correspondingly be challenging to determine the extent / location in which the shape of the stimulating assembly 316 is to be adjusted to conform to the cochlea 137. For this reason, embodiments of the present disclosure are directed to techniques to selectively and iteratively adjust the shape of the stimulating assembly 316 to facilitate insertion of the stimulating assembly 316 into the cochlea 137.

[0053] The stimulating assembly 316 includes an elongate carrier member 304 configured to be inserted into the cochlea 137, such as via an opening 306 (e.g., a cochleostomy, a round window). Disposed in the carrier member 304 is the shape memory circuit 310, which includes an elongate shape memory inlay 308. The shape memory inlay 308 is embedded within, and extends along, the carrier member 304. The shape memory inlay 308 is composed of a shape memory material, such as a shape-memory alloy, that changes shape (e.g., deforms) upon a temperature increase. As an example, the shape memory inlay 308 is configured to curl upon a temperature increase above a threshold temperature that is greater than a body temperature of the recipient. Moreover, the shape memory inlay 308 is configured to maintain its present shape while its temperature is below the threshold temperature.

[0054] The shape memory circuit 310 is configured to control current flow through the shape memory inlay 308. For example, the shape memory circuit 310 includes at least one conductor / wire 314 (e.g., a drive wire) that is electrically coupled to the power source 256, which is a part of or electrically coupled to the shape memory circuit 310 and is configured to provide current to the shape memory circuit 310. The power source 256 can be the same power source that provides stimulation signals for use in stimulating the cochlea (e.g., after implantation of the stimulating assembly 316 in the recipient is completed) or a separate powersource (e.g., dedicated to provide current flow during implantation of the stimulating assembly 316 and not after implantation of the stimulating assembly 316 has been completed).

[0055] In operation, current flow through the shape memory inlay 308 increases a temperature of the shape memory inlay 308 (e.g., above the threshold temperature), thereby causing the shape memory inlay 308 to change (e.g., curl). Thus, the shape memory circuit 310 electrically activates the shape memory aspect of the shape memory inlay 308.

[0056] As shown in FIG. 3A, shape memory inlay 308 (e.g., having a temperature below the threshold temperature) holds the carrier member 304 is in a straight configuration 312. For example, the straight configuration of the carrier member 304 enables the stimulating assembly 316 to be inserted into the opening 306 of the cochlea 137. Also as shown in FIG. 3A, the shape memory circuit 310 includes electrically conductive posts 317 that extend from the wire 314 toward the shape memory inlay 308. In the straight configuration 312, the posts 317 and the shape memory inlay 308 are physically separated from one another (i.e., there is a gap 318 between each post 317 and the shape memory inlay 308). Consequently, in FIG, 3A, the illustrated shape memory circuit 310 is in an “open” configuration 319 in which the wire 314 is electrically decoupled from the shape memory inlay 308, thereby interrupting current flow (e.g., from the power source 256) through the shape memory inlay 308 (e.g., a configuration that does not permit current flow through the shape memory inlay 308).

[0057] In certain embodiments presented herein, as the stimulating assembly 316 is inserted into the cochlea 137, the carrier member 304 contacts the outer wall 172. The contact between the carrier member 304 and the outer wall 172 can, in turn, cause at least one of the posts 317 to physically connect with the shape memory inlay 308, thereby electrically coupling the shape memory inlay 308 to the wire 314 and enabling current flow through the shape memory inlay 308. As a result of this current flow, the temperature of the shape memory inlay 308 increases to cause at least a portion of the shape memory inlay 308 to change shape (e.g., curl and move away from the outer wall 172). That is, the wire 314 is delivers current through the shape memory inlay 308 to cause a change in shape of the shape memory inlay 308. When at least one of the posts 317 is in contact with the shape memory inlay 308, the shape memory circuit 310 is referred to as being in a “closed” configuration (e.g., a configuration that permits current flow through the shape memory inlay 308).

[0058] FIG. 3B is a schematic diagram of the stimulating assembly 316 in which the carrier member 304 is in a partially curved configuration 350. By way of example, a first post 317Ais placed in contact with a first inlay portion 308 A to electrically couple the shape memory inlay 308 and the wire 314 to one another, thereby transitioning the shape memory circuit 310 to a closed configuration 351. As a result, current flow through the first inlay portion 308A is enabled to cause the first inlay portion 308A to curl, such as relative to a second inlay portion 308B immediately adjacent to the first inlay portion 308A.

[0059] In some embodiments, sufficient curling of the first inlay portion 308 A relative to the second inlay portion 308B decouples the first inlay portion 308A from the second inlay portion 308B. For example, the first inlay portion 308A and the second inlay portion 308B include sections 352 that overlap with one another along the carrier member 304. Curling of the first inlay portion 308A and the second inlay portion 308B relative to one another (e.g., as a result of current flow through the shape memory inlay 308) moves the sections 352 away from one another. In the illustrated embodiment, the shape memory inlay 308 is deformed such that the sections 352 are decoupled from one another to decouple the first inlay portion 308A from the second inlay portion 308B. However, the carrier member 304 remains in contact with the outer wall 172 such that the shape memory inlay 308 is deformed to place a second post 317B in contact with the second inlay portion 308B. Thus, at least a portion of the shape memory circuit 310 remains in the closed configuration 351 such that current can flow through the shape memory circuit 310 and to the second inlay portion 308B via the second post 317B. However, because the first inlay portion 308A is decoupled from the second inlay portion 308B, current does not flow between the first inlay portion 308A and the second inlay portion 308B. Therefore, in the illustrated closed configuration 351 (e.g., a partially closed configuration), current flows through the second inlay portion 308B and not through the first inlay portion 308 A (e.g., even though the first post 317A remains in contact with the first inlay portion 308A). Consequently, continued curling of the first inlay portion 308A is inhibited, while curling of the second inlay portion 308B is enabled.

[0060] In this way, different portions (e.g., the first inlay portion 308A, the second inlay portion 308B) can be iteratively curled by selectively electrically coupling to and decoupling from one another. As such, curling of the shape memory inlay 308 can be better effectuated based on positioning of the stimulating assembly 316 within the cochlea 137. For instance, continued curling of the second inlay portion 308B toward the inner wall 174 (e.g., to cause the shape memory inlay 308 to fold into itself or to impinge against the inner wall 174 instead of to extend along the curvature of the cochlea 137) that otherwise can occur as a result of constant current flow through all portions of the shape memory inlay 308 is avoided. However,in additional or alternative embodiments, the shape memory inlay 308 can be suitably curled using any other suitable technique. As an example, the shape memory inlay 308 can include a contiguous piece (e.g., without inlay portions that decouple upon curving) configured to curl more gradually to enable the stimulating assembly 316 to be further inserted into the cochlea 137 before the shape memory inlay 308 can impinge against the inner wall 174 or fold into itself.

[0061] Moreover, the first inlay portion 308A can be electrically coupled to the shape memory circuit 310 again in some embodiments. For instance, sufficient contact of the carrier member 304 against the outer wall 172 again can deform the carrier member 304 in a manner that causes the first inlay portion 308A and the second inlay portion 308B to contact one another and to the respective posts 317, thereby enabling current flow through each of the inlay portions. As such, the first inlay portion 308A and the second inlay portion 308B can be recurrently coupled to one another and to the wire 314 to repeatedly transition the shape memory circuit 310 between the open configuration and the closed configuration 351 to curl more suitably (e.g., in response to contact with the outer wall 172). In this way, the shape memory inlay 308 continues to curl (e.g., as a result of current flow through the power source 256) to cause the carrier member 304 to conform to the shape of the cochlea 137 as the carrier member 304 is inserted herein and contact between the carrier member 304 and the outer wall 172 is limited to avoid damaging the cochlea 137.

[0062] In some embodiments, as noted above, contact between the carrier member 304 and the outer wall 172 physically deforms the carrier member 304 to drive movement of the posts 317 and the shape memory inlay 308 toward one another. Thus, electrical coupling of the shape memory inlay 308 to the wire 314 is initiated by deformation of the carrier member 304 without having to operate a separate (e.g., dedicated) component to simplify the arrangement of the stimulating assembly 316. In alternative embodiments, the stimulating assembly 316 includes a sensor 320 (e.g., representative of one or more sensors) configured to cause transition the shape memory circuit 310 between open and closed configurations, or vice versa. The sensor 320 can be configured to, for example, detect a proximity of the outer wall 172 to the carrier member 304, detect a force imparted by the outer wall 172 onto the carrier member 304, detect deformation of the carrier member 304 caused by impingement against the outer wall 172, etc., and subsequently output a signal indicative thereof.

[0063] In certain embodiments, the sensor 320 is communicatively coupled to a control system 322, and the control system 322 is configured to receive the signal output by the sensor 320.In response, the control system 322 is configured to instruct an actuator 324 to drive movement of the posts 317 and the shape memory inlay 308 toward one another (e.g., by deforming the carrier member 304) to electrically couple the shape memory inlay 308 and the wire 314 to one another. In this manner, the control system 322 initiates electrical coupling of the shape memory inlay 308 to the wire 314, such as to more readily and reactively cause the shape memory inlay 308 to curl away from the outer wall 172 and avoid substantial / prolonged contact between the carrier member 304 and the outer wall 172 to preserve the structure of the cochlea 137. In either case, contact between the carrier member 304 and the outer wall 172 causes the shape memory inlay 308 and the shape memory circuit 310 to electrically couple to one another to enable current flow through the shape memory inlay 308.

[0064] In certain embodiments, the sensor 320 is configured to determine another parameter to facilitate desirable curling of the stimulating assembly 316. For example, the sensor 320 is configured to monitor a parameter indicative of positioning of the carrier member 304 within the canals 170, such as submersion of the carrier member 304 within the perilymph or other body fluid. Thus, the data provided by the sensor 320 ensures that curling of the stimulating assembly 316 occurs while the stimulating assembly 316 is inserted into the cochlea 137 and therefore in contact with body fluid of the recipient. As such, curling of the stimulating assembly 316 outside of the cochlea 137 (e.g., in which the stimulating assembly 316 is not in contact with body fluid) can be avoided to maintain the stimulating assembly 316 in the straight configuration 312 before the stimulating assembly 316 is inserted into the cochlea 137, thereby facilitating initial insertion of the stimulating assembly 316 (e.g., through the opening 306).

[0065] FIG. 3C is a schematic diagram of the stimulating assembly 316 fully inserted into the cochlea 137 (e.g., in a fully curved configuration) from the basal region 166 to the apical region 168. In particular, the stimulating assembly 316 is positioned such that the carrier member 304 extends along the inner wall 174. The positioning of the stimulating assembly 316 against the inner wall 174 enables the stimulating assembly 316 to deliver stimulation signals that stimulate the auditory nerve cells to enable the recipient to perceive sound. Additionally, in some embodiments, fully inserting the stimulating assembly 316 into the cochlea 137, and therefore sufficiently curling the shape memory inlay 308 along the cochlea 137, decouples the posts 317 from the shape memory inlay 308, thereby electrically decoupling the shape memory inlay 308 and the wire 314 from one another and transitioning the shape memory circuit 310 to the open configuration 319 to prevent current flow that otherwise can undesirably cause the shape memory inlay 308 to curl further into the cochlea 137.

[0066] FIG. 3D is a cross-sectional view of the stimulating assembly 316 taken along lines C- C of FIG. 3A. The illustrated stimulating assembly 316 is in the straight configuration 312 configuration such that the shape memory circuit 310 is in the open configuration 319 in which the post 317 is decoupled from the shape memory inlay 308. The shape memory circuit 310 includes a bundle 370 of wires 314 that are electrically coupled to one another and to the post 317 for directing current therethrough. Additionally, the shape memory circuit 310 includes an electrode 372 electrically coupled to the wires 314. By way of example, the wires 314 conduct current to the electrode 372 for delivery of stimulation signals. The electrode 372 is positioned at an outer surface 374 of the carrier member 304.

[0067] As discussed, deformation of the carrier member 304 can move the shape memory inlay 308 and the posts 317 toward one another to electrically couple the shape memory inlay 308 and the wires 314 to one another. In some embodiments, the post 317 is also decoupled from the wires 314 in the straight configuration 312. In such embodiments, deformation of the carrier member 304 can move the post 317 and the wires 314 toward one another to electrically couple the post 317 and the wires 314 to one another. In further embodiments, the stimulating assembly 316 does not include the post 317, and deformation of the carrier member 304 can move the shape memory inlay 308 and the wires 314 toward one another such that direct contact between the shape memory inlay 308 and the wires 314 electrically couples the shape memory inlay 308 and the wires 314 to one another. Further still, in some embodiments, the wires 314 are also composed of a shape memory material. For instance, current flow through the wires 314 increases a temperature of the wires 314 and causes the wires 314 to deform correspondingly with respect to the shape memory inlay 308. In this way, each of the wires 314 and the shape memory inlay 308 can help deform the carrier member 304 in response to current flow therethrough.

[0068] FIGs. 4A and 4B are schematic diagrams of an embodiment of a stimulating assembly 416 that includes components to prevent excessive curling of the stimulating assembly 416. The stimulating assembly 416 includes an elongate carrier member 404 in which a first inlay 408, a first wire 414, and first posts 417 extending from the first wire 414 are embedded to form a first circuit 410. These various elements can all operate similar to corresponding elements described with reference to FIGs. 3A-3C (e.g., electrical coupling of the first inlay 408 to the first wire 414 via the first posts 417 enables current flow through the first inlay 408, thereby causing the first inlay 408 to curl to cause corresponding curling of the carrier member 404).

[0069] In the example of FIGs. 4A and 4B, the stimulating assembly 416 also includes a second inlay 418, a second wire 424, and second posts 426 extending from the second wire 424 embedded within the carrier member 404 to form a second circuit 420. Certain deformation of the carrier member 404 electrically couples the second inlay 418 and the second wire 424 to one another. As a result, current flows through the second inlay 418. Current flow through the second inlay 418 and the second wire 424 interrupts current flow through the first inlay 408 and the first wire 414. As an example, a closed configuration of the second circuit 420 diverts current from flowing through the first circuit 410, regardless of the configuration of the first circuit 410. As another example, while the second circuit 420 is in its closed configuration, the first circuit 410 is transitioned to its first configuration. In either case, electrical coupling of the second inlay 418 to the second wire 424 interrupts current flow through the first inlay 408. The selective and individual flow of current to the inlays 408, 418 can facilitate desirable curling of the stimulating assembly 416.

[0070] Referring specifically to FIG. 4B, the stimulating assembly 416 is shown in an arrangement in which the carrier member 404 is in contact with the inner wall 174 of the cochlea 137 (e.g., as a result of excessive curling of the first inlay 408). Contact of the carrier member 404 with the inner wall 174 causes the second wire 424 to electrically couple to the second inlay 418 via the second posts 426, such as via data from a sensor and / or via physical deformation of the carrier member 404. Consequently, current from the power source 256 flows through the second circuit 420 and the second inlay 418 instead of through the first circuit 410 and the first inlay 408. In certain embodiments, the first inlay 408 and the first circuit 410 can also decouple from one another (e.g., via a physical deformation of the carrier member 404, via instructions from a control system) in response to contact of the carrier member 404 with the inner wall 174.

[0071] The lack of current flow through the first inlay 408 inhibits further curling of the first inlay 408 into the inner wall 174. In some embodiments, a current shape (e.g., a partially curled shape) of the first inlay 408 is maintained to correspondingly maintain the shape of the carrier member 404 while current flow through the first inlay 408 is interrupted. Thus, the stimulating assembly 416 can be further inserted into the cochlea 137 to move the carrier member 404 away from the inner wall 174, thereby preventing or limiting contact between the stimulating assembly 416 and the inner wall 174 to prevent damage to the cochlea 137.

[0072] In additional or alternative embodiments, the second inlay 418 is also composed of a shape memory material and can therefore change shape in response to a temperature increase.By way of example, current flow through the second inlay 418 increases the temperature of the second inlay 418 to cause the second inlay 418 to curl away from the inner wall 174. In this manner, the carrier member 404 is moved away from the inner wall 174 via the electrical coupling of the second wire 424 to the second inlay 418 (e .g . , without having to manually move the stimulating assembly 416, such as by inserting further within the cochlea 137). In further embodiments, the carrier member 404 and / or the first inlay 408 is urged toward the straight configuration absent a current flow through the first inlay 408. As an example, the carrier member 404 and / or the first inlay 408 are pre-formed to be straight and therefore are urged toward straightening absent curling provided by the first inlay 408 in response to a current flow. In any case, directing current flow through the second circuit 420 instead of through the first circuit 410 urges the carrier member 404 and / or the first inlay 408 from the inner wall 174 to avoid prolonged contact between the carrier member 404 and the inner wall 174.

[0073] In some embodiments, positioning of the carrier member 404 away from the inner wall 174 electrically decouples the second inlay 418 and the second circuit 420 from one another. Thus, the second inlay 418 and the second wire 424 can be recurrently electrically coupled to and decoupled from one another as the stimulating assembly 416 is inserted into the cochlea 137 to repeatedly transition the first circuit 410 between an open configuration and a closed configuration to adjust the shape of the stimulating assembly 416 more suitably (e.g., based on contact with the walls 172, 174).

[0074] FIG. 5 is a schematic diagram of an embodiment of a stimulating assembly 516 that includes a carrier member 504 in which an inlay 508 and multiple wires 514 are embedded to form a respective shape memory circuit 510. Each wire 514 is configured to receive current from the power source 256 and to direct current flow to a different portion of the inlay 508. As an example, first posts 516A extend from a first wire 514A toward a first inlay portion 508A (e.g., an apical portion) of the inlay 508, second posts 516B extend from a second wire 514B toward a second inlay portion 508B (e.g., a middle portion) of the inlay 508, and third posts 516C extend from a third wire 514C toward a third inlay portion 508C (e.g., a basal portion). By controlling current flow to different portions of the inlay 508, the shape memory circuits 510 can control curling of the inlay 508 more acutely.

[0075] For example, in the illustrated embodiment, the first wire 514A is electrically coupled to the first inlay portion 508A via the first posts 516A to close a first shape memory circuit 510A. Thus, the first shape memory circuit 510A directs current flow through the first inlay portion 508A to cause the first inlay portion 508A to curl. Additionally, the second wire 514Bis electrically coupled to the second inlay portion 508B via the second posts 516B to close a second shape memory circuit 51 OB, thereby enabling current flow through the second inlay portion 508B to cause the second inlay portion 508B to curl. However, the third posts 516C are offset from the third inlay portion 508C to open a third shape memory circuit 5 IOC. As such, the third inlay portion 508C is not electrically coupled to the third wire 514C. For this reason, current flow through the third inlay portion 508C is interrupted to prevent curling of the third inlay portion 508C. Therefore, the shape of the third inlay portion 508C does not substantially change while the first inlay portion 508A and the second inlay portion 508B are curling. However, substantial curling of the carrier member 504, such as caused by sufficiently curling of the first inlay portion 508A and / or of the second inlay portion 508B, can electrically couple the third inlay portion 508C and the third wire 514C to one another to close the third shape memory circuit 510C, thereby enabling current flow through the third inlay portion 508C to cause the third inlay portion 508C to curl.

[0076] In this way, the different portions of the inlay 508 are selectively, such as iteratively, curled. That is, instead of using a single shape memory circuit that directs current through an entirety of the inlay 508, separate shape memory circuits are used to provide current to different portions of the inlay 508 such that select portions of the inlay 508 can be curled (e.g., while other portions of the inlay 508 remain straight or are not actively curling). Selectively curling the different portions of the inlay 508 can help better control the amount and / or location of curling of the inlay 508 to readily conform to any particularly shaped cochlea 137. Although the illustrated stimulating assembly 516 includes three shape memory circuits 510 configured to control current flow to a corresponding quantity of portions of the inlay 508, the stimulating assembly 516 can include any suitable quantity of shape memory circuits 510 (e.g., each having a separate wire) in additional or alternative embodiments. Such circuits 510 can control current flow to respective portions of the inlay 508, or a subset of the shape memory circuits 510 can control current flow to the same portion of the inlay 508. Moreover, each portion of the inlay 508 can include the same or different quantity of electrodes (e.g., two electrodes, three electrodes, four or more electrodes). Indeed, the shape memory circuits 510 can be arranged in any suitable manner to control current flow through the inlay 508 to curl the inlay 508 in a desirable way.

[0077] In the embodiments discussed above, curling of a stimulating assembly can be performed reactively (e.g., based on contact with the various walls 172, 174 of the cochlea 137), such as with no or minimal user input manually provided by a user (e.g., a surgeon).Thus, an ease of implanting the stimulating assembly in the recipient can be improved. For example, the stimulating assembly can curl and suitably conform to the shape of the cochlea without the user having to constantly monitor or estimate the positioning of the cochlear implant system relative to the cochlea.

[0078] FIG. 6A-6H are a series of schematic diagrams illustrating an embodiment of a stimulating assembly 616 that includes a stiffening element 618 in form of a stylet for insertion into a body cavity, such as a recipient’s cochlea. For ease of illustration, the body cavity into which the stimulating assembly is inserted (e.g., the recipient’s cochlea) is not shown in FIG. 6A-6H. However, it would be appreciated that the stimulating assembly 616 would be progressively inserted into the body cavity as each step is executed.

[0079] In the example of FIG. 6A-6H, the stimulating assembly 616 includes an elongate carrier member 604 in which shape memory circuit 610 and the stiffening element (stylet in this example) 618. The stiffening element 618 is removably disposed within the carrier member 604. The shape memory circuit 610 comprises an elongate inlay 608, a wire 614, and primary posts 617 extending from the wire 614.

[0080] FIG. 6A shows the stimulating assembly 616 in a straight configuration / arrangement, where the stiffening element 618 is configured to maintain the shape of at least a portion of the carrier member 604 (e.g., the stiffening element 618 extends through at least a portion of the carrier member 604 and is configured to prevent deformation of the portion of the carrier member 604 through which the stiffening element 618 extends). For example, the carrier member 604 is urged to curl (e.g., by pre-formed shaping of the carrier member 604, by a force imparted by the inlay 608), such as to maintain contact of the first inlay portion 608A with a first primary post 617A, but the stiffening element 618 exerts a force that prevents the carrier member 604 from curling. That is, the stiffening element 618 resists a force imparted by the urge of the carrier member 604 to curl.

[0081] In the illustrated embodiment, the stiffening element 618 extends beyond a first inlay portion 608A (e.g., an apical portion) of the inlay 608 and therefore is configured to prevent curling of substantially an entirety of the carrier member 604. As such, the stiffening element 618 maintains the carrier member 604 in a straight configuration 612. For instance, the inlay 608 is composed of a shape memory material and is configured to curl in response to a temperature increase. In addition, the stiffening element 618 is conductive and is configured to direct current flow from the power source 256. As an example, auxiliary posts 620 extendfrom the inlay 608 toward the stiffening element 618, and the stiffening element 618 is configured to direct current flow to the inlay 608 via the auxiliary posts 620, and the inlay 608 directs current to the wire 614 via the primary posts 617. In some embodiments, while the stiffening element 618 extends beyond the first inlay portion 608A, the stiffening element 618 is coupled to a first auxiliary post 620A and is therefore electrically coupled to the inlay 608. As such, current flows through the first inlay portion 608A to urge the first inlay portion 608A to curl.

[0082] However, as shown in FIG. 6A, because the stiffening element 618 extends beyond the first inlay portion 608A, the stiffening element 618 prevents the carrier member 604 from deforming, thereby preventing the first inlay portion 608A from curling the carrier member 604. As such, even though current flows through the first inlay portion 608A while the stiffening element 618 is electrically coupled to the first auxiliary post 620A, the extension of the stiffening element 618 past the first inlay portion 608A prevents the first inlay portion 608A from curling the carrier member 604. In alternative embodiments, while the stiffening element 618 extends beyond the first inlay portion 608 A, the stiffening element 618 is not electrically coupled to the inlay 608 (e.g., the stiffening element 618 is not coupled to the first auxiliary post 620A, the first inlay portion 608A is not coupled to the first primary post 617A). Therefore, in such embodiments, current does not flow through the 608A while the stiffening element 618 extends beyond the first inlay portion 608A. Instead, each of the stiffening element 618 and the inlay 608 retains the stimulating assembly 616 in the straight configuration 612. As such, the stiffening element 618 can be smaller (e.g., thinner) and / or less stiff (e.g., more flexible), in comparison to a system in which the inlay does not straighten the cochlear implant system, and still retain the stimulating assembly 616 in the straight configuration 612.

[0083] In either case, the extension of the stiffening element 618 within the carrier member 604 can be adjusted, such as based on feedback indicative of a positioning of the stimulating assembly 616 (e.g., an angle of insertion of the stimulating assembly 616 in the cochlea 137, a curvature of the stimulating assembly 616 relative to the cochlea 137). By way of example, the stiffening element 618 is a stylet that a user can manually pull out of the carrier member 604. Such movement of the stiffening element 618 reduces or removes the force imparted by the stiffening element 618 onto a portion of the carrier member 604. As a result, the portion of the carrier member 604 is able to curl.

[0084] FIG. 6B is a schematic diagram of the stimulating assembly 616 in which the stiffening element 618 is partially withdrawn from the carrier member 604. As a result, the stiffeningelement 618 no longer extends beyond the first inlay portion 608A, and the first inlay portion 608 A is able to curl. In the illustrated embodiment, the stiffening element 618 is electrically coupled to the first auxiliary post 620A and the first inlay portion 608A is electrically coupled to first primary post 617A to close the circuit 610. Thus, current flows from the stiffening element 618, through the first inlay portion 608A, and the first primary post 617A and drives the first inlay portion 608A to curl. By using both an urge to curl (e.g., passively curl) provided by the carrier member 604 and deformation of the first inlay portion 608A (e.g., to actively curl) provided by current flow through the first inlay portion 608A to promote curling of the stimulating assembly 616, there is less dependence on the urge to curl of the carrier member 604 having to overcome a stiffness of the inlay 608 to enable the stimulating assembly 616 to curl. In other words, properties of the carrier member 604 and of the inlay 608 impart forces that work in conjunction with one another to curl the stimulating assembly 616 (e.g., instead of to counteract one another, which could otherwise limit curling of the stimulating assembly 616). For this reason, a smaller (e.g., thinner) carrier member 604 can be utilized and / or the urging of the carrier member 604 to curl (e.g., by providing a particularly pre-formed shape) can be reduced, thereby simplifying implementation of the stimulating assembly 616.

[0085] FIG. 6C is a schematic diagram of the stimulating assembly 616 in which the first inlay portion 608A is partially curled. For instance, maintaining the position of the stiffening element 618 to electrically couple and terminate adj acent to the first auxiliary post 620A retains the circuit 610 in a closed configuration that enables current to continue flowing through the first inlay portion 608A to cause the first inlay portion 608A to curl (e.g., to extend along the spiral of the cochlea).

[0086] The first auxiliary post 620A extends from a second inlay portion 608B (e.g., a middle portion) immediately adjacent to the first inlay portion 608A. In particular, the first inlay portion 608A and the second inlay portion 608B include sections 652 that overlap with one another. In the illustrated embodiment, the sections 652 are in contact with one another to electrically couple the first inlay portion 608A and the second inlay portion 608B to one another. As such, current can flow from the stiffening element 618, through the first auxiliary post 620A, along a part of the second inlay portion 608B, and then through an entirety of the first inlay portion 608A to cause the first inlay portion 608A to curl. However, current flow through the part of the second inlay portion 608B may not be sufficient to increase the second inlay portion 608B to a sufficiently high temperature that would cause the second inlay portion 608B to curl. Additionally or alternatively, the extension of the stiffening element 618 tocouple to the first auxiliary post 620A prevents curling of the carrier member 604 caused by an urging of the second inlay portion 608B to curl (e.g., as caused by current flow through the part of the second inlay portion 608B). In either case, the carrier member 604 remains substantially straight at the second inlay portion 608B.

[0087] FIG. 6D is a schematic diagram of the stimulating assembly 616 in which the first inlay portion 608A has curled such that the overlapping sections 652 of the first inlay portion 608A and of the second inlay portion 608B are no longer in contact with one another, thereby at least partially opening the circuit 610. For example, curling of the first inlay portion 608A relative to the second inlay portion 608B moves the sections 652 away from one another. Consequently, the first inlay portion 608A and the second inlay portion 608B are no longer electrically coupled to one another. That is, current flow through the first inlay portion 608 A is interrupted, and curling of the first inlay portion 608A is suspended.

[0088] Curling of the first inlay portion 608A can also cause a portion of the second inlay portion 608B to curl, such as toward a second primary post 617B extending from the wire 614, and sufficient curling of the first inlay portion 608A can move the second inlay portion 608B into contact with the second primary post 617B. Thus, current can flow through the stiffening element 618, through the first auxiliary post 620A, through a part of the second inlay portion 608B, through the second primary post 617B, and to the wire 614. However, the current flow through the part of the second inlay portion 608B may not sufficiently increase the temperature of the second inlay portion 608B and / or the stiffening element 618 prevents curling of the carrier member 604 to prevent curling of the second inlay portion 608B.

[0089] FIG. 6E is a schematic diagram of the stimulating assembly 616. In the illustrated embodiment, the stiffening element 618 has been further withdrawn from the carrier member 604 and therefore no longer extends along a substantial portion of the second inlay portion 608B. Instead, the stiffening element 618 is electrically coupled to a second auxiliary post 620B that extends from a third inlay portion 608C (e.g., a basal portion) immediately adjacent to the second inlay portion 608B and in contact with the second inlay portion 608B via overlapping sections 652. As a result, the circuit 610 is partially closed to enable current flow from the stiffening element 618, through the second auxiliary post 620B, through a part of the third inlay portion 608C, through an entirety of the second primary post 617B, and to the wire 614. Such current flow through the second inlay portion 608B, as well as withdrawal of the stiffening element 618 to terminate adjacent to the second auxiliary post 620B, enables the second inlay portion 608B to curl and correspondingly cause the carrier member 604 to curl atthe second inlay portion 608B. However, the first inlay portion 608A and the second inlay portion 608B remain electrically decoupled from one another to prevent current flow through the first inlay portion 608A, correspondingly preventing the first inlay portion 608A from curling.

[0090] FIG. 6F is a schematic diagram of the stimulating assembly 616 in which the second inlay portion 608B is partially curled. As an example, maintaining the position of the stiffening element 618 to electrically couple and terminate adjacent to the second auxiliary post 620B maintains the circuit 610 in a partially closed configuration that enables current flow through a part of the third inlay portion 608C and through an entirety of the second inlay portion 608B to cause the second inlay portion 608B to curl (e.g., to extend further along the spiral of the cochlea). However, because the stiffening element 618 extends along a substantial part of the third inlay portion 608C and / or because current flow through the third inlay portion 608C does not sufficiently increase the temperature of the third inlay portion 608C, the third inlay portion 608C does not curl.

[0091] FIG. 6G is a schematic diagram of the stimulating assembly 616 in which the second inlay portion 608B has curled such that the overlapping sections 652 of the second inlay portion 608B and of the third inlay portion 608C are no longer in contact with one another, thereby further opening a portion of the circuit 610. As such, the second inlay portion 608B and the third inlay portion 608C are no longer electrically coupled to one another to interrupt current flow through the second inlay portion 608B and therefore suspend curling of the second inlay portion 608B. Curling of the second inlay portion 608B can also cause a portion of the third inlay portion 608C to curl, such as toward a third primary post 617C.

[0092] FIG. 6H is a schematic diagram of the stimulating assembly 616 in which the stiffening element 618 has been further withdrawn from the carrier member 604 and no longer extends along a substantial portion of the third inlay portion 608C. Instead, the stiffening element 618 is electrically coupled to a third auxiliary post 620C that extends from the third inlay portion 608C. Thus, the circuit 610 remains partially closed to enable current flow from the stiffening element 618, through the third auxiliary post 620C, through the third inlay portion 608C, through the third primary post 617C, and to the wire 614. As such, the third inlay portion 608C continues to curl.

[0093] The embodiment and curling mechanism of the stimulating assembly 616 helps gradually and iteratively curl the stimulating assembly 616. For example, the stiffeningelement 618 is selectively adjusted (e.g., by a user) to initiate some deformation of the carrier member 604. The positioning of the stiffening element 618 also closes a portion of the circuit 610 to enable current flow through a portion of the inlay 608 to cause the portion to curl, further deforming the carrier member 604. Additionally, to prevent excessive deformation of the carrier member 604, sufficient curling of the portion of the inlay 608 interrupts current flow therethrough to open the portion of the circuit 610. As a result, curling of the portion of the inlay 608 is suspended. However, the sufficient curling of the portion of the inlay 608 also closes another portion of the circuit 610 to enable current flow through a subsequent portion of the inlay 608 to enable curling of the subsequent portion. In this manner, portions the inlay 608 are recurrently connected to and disconnected from the wire 614 to adjust the configuration of the circuit 610 and successively curl the portions of the inlay 608 while the stiffening element 618 is adjusted to avoid excessive curling any one portion of the inlay 608, thereby helping conform the stimulating assembly 616 to a shape of the cochlea. Although the illustrated inlay 608 includes three separate inlay portions through which current can be successively directed, the inlay 608 can include any suitable quantity of portions, including one contiguous portion extending substantially along an entirety of the inlay 608, to control the curling of the stimulating assembly 616.

[0094] FIG. 7 is a schematic diagram of an embodiment of a stimulating assembly 716, which includes a similar curling mechanism as that of the stimulating assembly 616. In particular, the stimulating assembly 716 includes an elongate carrier member 704 with a shape memory circuit 710, which includes an inlay 708, a wire 714, and posts 717 extending from the wire. The stimulating assembly 716 includes a stiffening element 718 in the form of a sheath disposed around a portion of the elongate carrier member 704. The stiffening element 718 is configured to maintain a shape of a portion of the carrier member 704, such as by preventing deformation of a portion of the carrier member 704 along which the stiffening element 718 extends.

[0095] In operation, the stiffening element 718 can be withdrawn to reduce its extension along the carrier member 704. Such adjustment of the stiffening element 718 can help successively curl the inlay 708. For instance, the wire 714 is configured to receive current flow (e.g., from the power source 256). As the stiffening element 718 is withdrawn, portions of the carrier member 704 sequentially deform to cause corresponding portions of the inlay 708 to sequentially electrically couple to and decouple from the wire 714. Consequently, similar to functionality provided by withdrawing the stiffening element 718 from the carrier member 704,adjusting the stiffening element 718 enables the portions of the inlay 708 to curl (e.g., successively curl) without causing excessive curling of any one portion of the inlay 708 to help conform the stimulating assembly 716 to a shape of the cochlea.

[0096] Although embodiments of the present disclosure primarily discuss directing current flow through an inlay to cause the inlay to curl via a temperature increase, in alternative embodiments, current flow is directed through the inlay to cause the inlay to straighten via a temperature increase and a lack of current flow through the inlay reduces the temperature of the inlay to cause the inlay to curl. For example, the inlay and the wire are initially electrically coupled to one another to close the circuit and maintain the carrier member in the straight configuration for insertion into the cochlea, and the carrier member is deformed during insertion into the cochlea (e.g., via contact with a wall of the cochlea, via withdrawal of a stiffening element) to move the inlay and the wire relative to one another, thereby electrically decoupling the inlay and the wire from one another. Electrically decoupling the inlay and the wire from one another opens the circuit to interrupt current flow through the inlay, thereby causing the temperature of the inlay to decrease. Consequently, the inlay curls and causes the carrier member to further curl. In such embodiments, the inlay and the wire can be electrically coupled to one another again (e.g., in response to deformation of the carrier caused by sufficient curling of the carrier member and / or contact of the carrier member with a wall of the cochlea) to close the circuit and urge the inlay and the wire to straighten. In any case, deformation of the carrier member changes a connection between the inlay and the wire to transition the circuit between an open configuration and a closed configuration, which then causes the carrier member to further deform.

[0097] Each of FIGs. 8-10 discussed below illustrates a respective method related to implanting a cochlear implant system, such as any of the cochlear implant systems 102, 302 discussed herein. It should be noted that any of the methods can be performed differently than depicted. For example, an additional operation can be performed, and / or any of the depicted operations can be performed differently, not performed, and / or performed in a different order. It should also be noted that the operations of the respective methods can be performed in any suitable manner with respect to one another, such as sequentially (e.g., in response to one another) and / or concurrently (e.g., in parallel).

[0098] FIG. 8 is a flowchart of an embodiment of a method 800 for implanting a cochlear implant system in a recipient. At block 802, an implantable component of the cochlear implant system is inserted into a body cavity (e.g., a cochleostomy, a round window) of the recipient.The implantable component includes a carrier member and an electrical circuit embedded in the carrier member. Insertion of the implantable component in the body cavity initiates implantation of the cochlear implant system in the cochlea.

[0099] At block 804, a shape of the carrier member is changed during insertion of the implantable component in the body cavity. Changing the shape of the carrier member also drives relative movement between a first part and a second part of the implantable component. At block 806, an electrical circuit is opened and closed (e.g., transitioned between an open configuration and a closed configuration) as a result of the relative movement between the first part and the second part. For example, contact between the first part and the second part electrically couples the first part and the second part to one another to close the electrical circuit, whereas separation of the first part from the second part electrically decouples the first part and the second part from one another to open the electrical circuit.[ooioo] At block 808, the shape of the carrier member is further changed as a result of opening and closing the electrical circuit. For example, current flow through the electrical circuit activates a shape memory inlay to deform, which correspondingly causes deformation of the carrier member. Deformation of the carrier member can cause the implantable component to conform to a shape of the cochlea and therefore facilitate implantation of the cochlear implant system in the cochlea. That is, by initiating deformation of the carrier member to automatically and reactively cause further changes in shape of the carrier member, the shape of the carrier member can be better adjusted to conform to the shape of the cochlea, such as in comparison to a user manually controlling opening and closing of the electrical circuit (e.g., based on a potentially inaccurately estimated or assumed placement of the carrier member in the cochlea).[ooioi] Certain steps of the method 800 can be repeated during implantation of the cochlear implant system in the cochlea. For example, the shape of the carrier member initially changes to couple the first part and the second part to one another, but further changing of the shape of the carrier member (e.g., resulting from current flow through the first part and the second part) decouples the first part and the second part from one another. However, the shape of the carrier member can then be changed again to couple the first part and the second part to one another again. In this manner, the first part and the second part can be repeatedly moved relative to one another to adjust the coupling between the first part and the second part, thereby also recurrently opening and closing the electrical circuit. As a result, the shape of the carrier member can be iteratively and selectively changed to conform to the shape of the cochlea more suitably.

[0102] FIG. 9 is a flowchart of an embodiment of a method 850 for implanting a cochlear implant system in a recipient. As an example, the method 850 is a particular implementation of the method 800. At block 852, an implantable component of the cochlear implant system is placed in contact with a cochlea (e.g., an outer wall of the cochlea) of the recipient. As a result, a shape of the carrier member of the implantable component is changed. In some embodiments, a sensor is used to detect the contact of the implantable component with the cochlea, and the shape of the carrier member is changed based on the contact detected by the sensor. In additional or alternative embodiments, contacting the implantable component with the cochlea imparts a force that physically deforms the carrier member to change the shape of the carrier member.

[0103] At block 854, current flow between a wire and an inlay of the implantable component is adjusted in response to the change in the shape of the carrier member. For instance, changing the shape of the carrier member opens or closes an electrical circuit to adjust the current flow between the wire and the inlay. Adjusting the current flow between the wire and the inlay can further impact the shape of the carrier member, such as by helping the carrier member conform to the shape of the cochlea to facilitate implantation of the cochlear implant system in the recipient.

[0104] In certain embodiments, changing the shape of the carrier member enables current flow through the wire and the inlay. The inlay is a shape memory inlay configured to deform, such as curl, in response to a temperature increase caused by current flow therethrough. Deformation of the inlay then imparts a force onto the carrier member to further change the shape of the carrier member. Thus, initially changing the shape of the carrier member by contacting the implantable component with the cochlea enables current flow through the inlay to further change the shape of the carrier member.

[0105] It should be noted that current flow between the wire and the inlay can be interrupted in response to a sufficient change in the shape of the carrier member. As an example, the deformation of the inlay moves a first portion of the inlay relative to a second portion of the inlay, and sufficient deformation of the inlay (e.g., causing the sufficient change in the shape of the carrier member) decouples the first portion of the inlay and the second portion of the inlay from one another. Consequently, current flow through the first portion of the inlay and / or through the second portion of the inlay is interrupted, which can prevent a change in shape of the corresponding portion of the inlay. As another example, sufficient deformation of the inlay causes the implantable component to contact the cochlea (e.g., an inner wall of the cochlea).Such contact of the implantable component with the cochlea then interrupts current flow between the wire and the inlay to avoid further contact of the implantable component with the cochlea. For instance, such contact of the implantable component with the cochlea closes an additional electrical circuit (e.g., by physically moving components of the additional electrical circuit into electrical contact with one another, by detection via the sensor and corresponding actuation to close the additional electrical circuit), to cause current to flow through the additional electrical circuit instead of through the wire and the inlay. In either case, the interrupted current flow between the wire and the inlay can enable the shape of the carrier member to change more gradually and selectively, thereby enabling the cochlear implant system to better conform to the shape of the cochlea (e.g., to avoid constant contact with the wall of the cochlea).

[0106] FIG. 10 is a flowchart of an embodiment of a method 900 for implanting a cochlear implant system in a recipient. As an example, the method 900 is another particular implementation of the method 800. At block 902, a stiffening element is coupled to a carrier member of an implantable component of the cochlear implant system to maintain the carrier member and an inlay embedded in the carrier member in a straight configuration. As an example, the stiffening element is a stylet that extends into the carrier member. As another example, the stiffening element is a sheath that surrounds (e.g., captures) the carrier member. In either case, the stiffening element imparts a force to prevent the carrier member and the inlay from deforming (e.g., curling).

[0107] At block 904, the stiffening element is decoupled (e.g., withdrawn, removed) from the carrier member, such as manually by a user, to cause the carrier member and / or the inlay to deform. For example, decoupling the stiffening element from the carrier member reduces or removes the force imparted by the stiffening element, thereby enabling the carrier member and / or the inlay to deform. By way of example, the carrier member and / or the inlay are preformed to have a curved configuration and are urged to transition from the straight configuration toward the curved configuration. Thus, absent a force (e.g., imparted by the stiffening element) maintaining the carrier member and the inlay in the straight configuration, the carrier member and / or the inlay begin to deform.

[0108] At block 906, current is directed between the inlay and the wire to change the shape of the inlay. Specifically, the inlay includes a shape memory inlay configured to deform in response to a temperature increase caused by current flow therethrough. Deformation of the inlay caused by current flow then further deforms the carrier member. In some embodiments,initial deformation of the carrier member and / or the inlay caused by decoupling the stiffening element from the carrier member moves the inlay relative to and into contact with the wire to electrically couple the inlay and the wire to one another to enable current flow between the inlay and the wire. Additionally or alternatively, the inlay and the wire are electrically coupled to one another while the stiffening element is coupled to the carrier member, but the stiffening element prevents the carrier member and / or the inlay from deforming, even while current is directed between the inlay and the wire.

[0109] At block 908, the inlay and the wire are electrically decoupled from one another in response to changing the shape of the inlay. For instance, deformation of the inlay causes a portion of the inlay to move away from the wire, and sufficient deformation of the inlay causes the portion of the inlay to physically separate from the wire, thereby electrically decoupling the inlay from the wire. While the inlay and the wire are decoupled from one another, current flow between the inlay and the wire is interrupted to prevent deformation of the inlay and therefore corresponding deformation of the carrier member.[oono] Certain operations of the method 900 can be repeatedly performed. For instance, the stiffening element is sequentially decoupled from various portions of the carrier member to enable deformation of such portions of the carrier member. That is, the stiffening element is decoupled from part of the carrier member to enable deformation of a first portion of the inlay, and current is directed between the first portion of the inlay and the wire to change the shape of the first portion of the inlay until the first portion of the inlay is electrically decoupled from the wire. The stiffening element is then further decoupled from another part of the carrier member to enable deformation of a second portion of the inlay, and current is directed between the second portion of the inlay and the wire to change the shape of the second portion of the inlay until the second portion of the inlay is electrically decoupled from the wire. As a result, portions of the inlay are iteratively deformed to facilitate gradually transitioning the cochlear implant system to conform to the cochlea (e.g., as the cochlear implant system is inserted further into the cochlea).[ooni] Although embodiments of the present disclosure are directed to deforming a cochlear implant system to conform to a shape of a cochlea, it should be noted that the techniques discussed herein can be used in any suitable implementation to provide desirable implantation of a cochlear implant system in the cochlea. For example, current flow can also be used to adjust the arrangement of electrodes relative to auditory nerve cells of the recipient, such as toalign electrodes that each transmit signals having a respective frequency with the auditory nerve cells that are most sensitive to the corresponding, respective frequency.

[0112] FIG. 1 1A is a schematic diagram of a stimulating assembly 1016 configured to be implanted in a cochlea 1037 of a recipient. The stimulating assembly 1016 includes electrodes 1004 that are each configured to transmit signals having respective frequencies (e.g., a respective frequency range). For example, a first electrode 1004A is configured to transmit signals having first frequencies, a second electrode 1004B is configured to transmit signals having second frequencies, and a third electrode 1004C is configured to transmit signals having third frequencies. The electrodes 1004 are spaced apart by respective inlays 1006 to align each electrode 1004 with a respective group of auditory nerve cells 1008 (e.g., neurons) to be stimulated by the signals transmitted from the electrodes 1004.

[0113] In the illustrated arrangement, the first electrode 1004A is aligned with a first group of auditory nerve cells 1008 A, the second electrode 1004B is aligned with a second group of auditory nerve cells 1008B, and the third electrode 1004C is aligned with a third group of auditory nerve cells 1008C. However, it is desirable for an auditory nerve cell 1010 of the third group of auditory nerve cells 1008C to be stimulated by the second electrode 1004B, instead of by the third electrode 1004C, and for a fourth group of auditory nerve cells 1008D to be stimulated by the third electrode 1004C. By way of example, the auditory nerve cell 1010 is more sensitive to the second frequencies of the signals transmitted by the second electrode 1004B than the third frequencies of the signals transmitted by the third electrode 1004C, and the fourth group of auditory nerve cells 1008D is sensitive to the third frequencies of the signals transmitted by the third electrode 1004C. For this reason, it is desirable to move the second electrode 1004B and the third electrode 1004C relative to the auditory nerve cells 1008.

[0114] FIG. 1 IB is a schematic diagram of the stimulating assembly 1016 in which the second electrode 1004B and the third electrode 1004C have been moved as compared to the arrangement illustrated in FIG. 11A. In particular, the second electrode 1004B has been moved in a direction 1050 to align with the auditory nerve cell 1010, and the third electrode 1004C has been moved in the direction 1050 to align with the fourth group of auditory nerve cells 1008D. As such, the second electrode 1004B can transmit signals to stimulate the auditory nerve cell 1010 (e.g., as well as some of the other auditory nerve cells 1008 of the second group of auditory nerve cells 1008B), and the third electrode 1004C is able to transmit signals to stimulate the fourth group of auditory nerve cells 1008D (e.g., rather than the third group of auditory nerve cells 1008C). In this manner, the auditory nerve cells 1008 are more suitablystimulated by the stimulating assembly 1016, such as based on the frequencies to which each of the auditory nerve cells 1008 are sensitive, as tonotopically mapped along the cochlea 1037.

[0115] To move the electrodes 1004 relative to one another, current flow is selectively directed through the inlays 1006, such as using a wire 1048. In particular, each inlay 1006 is a shape memory inlay configured to deform (e.g., axially extend) in response to a temperature increase. Directing current flow through one of the inlays 1006 increases the temperature of the inlay 1006, thereby causing the inlay 1006 to deform and correspondingly drive movement of the electrodes 1004 relative to one another and adjust a distance between a pair of adjacent electrodes 1004. As an example, to move the second electrode 1004B in the direction 1050 away from the first electrode 1004A (e.g., to align with the auditory nerve cell 1010), current flow is directed through a first inlay 1006A extending between the first electrode 1004A and the second electrode 1004B. Consequently, the first inlay 1006A axially extends (e.g., along the direction 1050) to drive movement of the second electrode 1004B away from the first electrode 1004A and into alignment with the auditory nerve cell 1010. As another example, to move the third electrode 1004C in the direction 1050 away from the second electrode 1004B, current flow is directed through a second inlay 1006B extending between the second electrode 1004B and the third electrode 1004C. As a result, the second inlay 1006B axially extends (e.g., along the direction 1050) to drive movement of the third electrode 1004C away from the second electrode 1004B and into alignment with the fourth group of auditory nerve cells 1008D. In this manner, current flow can be selectively directed to the inlays 1006 to move the electrodes 1004 into a desirable alignment (e.g., in the arrangement illustrated in FIG. 1 IB) even after the stimulating assembly 1016 has been initially implanted in the recipient (e.g., in the arrangement illustrated in FIG. 11A).

[0116] The stimulating assembly 1016 includes a sensor 1052 (e.g., representative of multiple sensors) configured to determine a parameter indicative of the position of the electrodes (e.g., relative to the auditory nerve cells 1008). As an example, the parameter determined by the sensor 1052 includes a bend radius along different portions of the stimulating assembly 1016. For instance, an optical fiber is used to measure the bend radius. As another example, the sensor 1052 is a strain gauge, and the parameter determined by the sensor 1052 includes a deformation at multiple portions along the stimulating assembly 1016. As a further example, the parameter determined by the sensor 1052 includes an electrical property (e.g., conductivity) that indicates the deformation at multiple portions along the stimulating assembly 1016. Still further, the parameter determined by the sensor 1052 includes optical imaging, such asfluoroscopy. In any case, the parameter determined by the sensor 1052 indicates a positioning of the stimulating assembly 1016, such as caused by deformation / bending. A control system 1054 can then utilize the parameter to determine the position of the electrodes 1004 relative to the auditory nerve cells 1008 and further determine whether the position of the electrodes 1004 are to be adjusted. In some embodiments, the control system 1054 is configured to control current flow to the inlays 1006 (e.g., by utilizing an actuator 1056 to adjust relative movement between the inlays 1006 and the wire 1048 to adjust an electrical connection between the inlays 1006 and the wire 1048) to adjust the position of the electrodes 1004 accordingly.

[0117] In certain embodiments, current flow from a single power source (not shown) can be directed to multiple inlays 1006 to deform multiple inlays 1006. As an example, an electrical circuit (not shown) is configured to direct the current flow toward the inlays 1006, and the electrical circuit includes switches or other components that can adjust to enable or interrupt individual current flows to each inlay 1006. For instance, the electrical circuit can enable current flow from the power source to the first inlay 1006A while interrupting current flow from the same power source to the second inlay 1006B. In additional or alternative embodiments, separate power sources are used to direct current flow to separate inlays 1006. For example, a first power source is dedicated to directing current flow to the first inlay 1006A, whereas a second power source is dedicated to directing current flow to the second inlay 1006B . In such embodiments, operation of one of the power sources can be suspended to interrupt current flow to one of the inlays 1006 without affecting current flow to another of the inlays 1006. In either case, current flow to each inlays 1006 is selectively enabled to acutely adjust the positioning of each electrode 1004 and better align each individual electrode 1004 to corresponding auditory nerve cells 1008.

[0118] Furthermore, although the present disclosure primarily discusses the inlays 1006 axially extending in response to receipt of current flow, in additional or alternative embodiments, the inlays 1006 are configured to axially compress in response to receipt of current flow. That is, the inlays 1006 are configured to move the electrodes 1004 toward one another in response to receipt of current flow.

[0119] FIG. 12 is a flowchart of an embodiment of a method 1100 for implanting a cochlear implant system, such as any of the cochlear implant systems 102, 302 discussed herein. It should be noted that the method 1100 can be performed differently than depicted. For example, an additional operation can be performed, and / or any of the depicted operations can be performed differently, not performed, and / or performed in a different order. The cochlearimplant system includes an implantable component configured to be implanted in a cochlea of a recipient. The implantable component includes electrodes that are each configured to transmit stimulation signals, and the electrodes are separated from one another by respective inlays. Each inlay is a shape memory inlay configured to deform, such as axially extend / compress, in response to a temperature increase.

[0120] At block 1102, a first part and second part of the implantable component are selectively connected to and disconnected from one another. Such connection and disconnection of the first part and the second part with respect to one another adjusts current flow to the inlays. For example, connecting the first part and the second part to one another electrically couples the inlay to a power source to enable current flow to the inlay, whereas disconnecting the first part and the second part from one another electrically decouples the inlay from a power source to interrupt current flow to the inlay.

[0121] At block 1104, current is directed to an inlay to align an electrode with auditory nerve cells for stimulation. For instance, current flow through the inlay increases a temperature of the inlay to cause the inlay to deform (e.g., extend). Deformation of the inlay then drives the electrode to move relative to the auditory nerve cells, such as to align with auditory nerve cells that are more sensitive to the frequency of the signals transmitted by the electrode. Thus, the electrode can better stimulate the auditory nerve cells. By way of example, the electrode can be moved even after the cochlear implant system has been implanted in the recipient (e.g., to conform to the shape of the cochlea). Thus, the position of the electrode can be better adjusted via current flow.

[0122] The method 1100 can be repeated to adjust the position of additional electrodes. For instance, other parts of the implantable component can be connected to and disconnected from one another to adjust current flow to other inlays, thereby moving additional electrodes. Indeed, current flow can be selectively directed to each inlay to move each electrode more acutely to a suitable position for stimulating the auditory nerve cells.

[0123] FIG. 13 is a block diagram illustrating one example arrangement for a computing device 1150 (e.g., the control system 322) configured to perform one or more operations in accordance with certain embodiments presented herein. As shown in FIG. 13, in its most basic configuration, the computing device 1150 includes at least one processing unit 183 and a memory 184. The processing unit 183 includes one or more hardware or software processors (e.g., Central Processing Units) that can obtain and execute instructions. The processing unit183 can communicate with and control the performance of other components of the computing device 1150. The memory 184 is one or more software or hardware-based computer-readable storage media operable to store information accessible by the processing unit 183. The memory184 can store, among other things, instructions executable by the processing unit 183 to implement applications or cause performance of operations described herein, as well as other data. The memory 184 can be volatile memory (e.g., RAM), non-volatile memory (e.g., ROM), or combinations thereof. The memory 184 can include transitory memory or non-transitory memory. The memory 184 can also include one or more removable or non-removable storage devices. In examples, the memory 184 can include RAM, ROM) EEPROM (Electronically- Erasable Programmable Read-Only Memory), flash memory, optical disc storage, magnetic storage, solid state storage, or any other memory media usable to store information for later access. By way of example, and not limitation, the memory 184 can include wired media, such as a wired network or direct-wired connection, and wireless media, such as acoustic, RF, infrared, other wireless media, or combinations thereof. In certain embodiments, the memory 184 comprises logic 195 that, when executed, enables the processing unit 183 to perform aspects of the techniques presented.

[0124] In the illustrated example of FIG. 13, the computing device 1150 further includes a network adapter 186, one or more input devices 187, and one or more output devices 188. The computing device 1150 can include other components, such as a system bus, component interfaces, a graphics system, a power source (e.g., a battery), among other components. The network adapter 186 is a component of the computing device 1150 that provides network access (e.g., access to at least one network 189). The network adapter 186 can provide wired or wireless network access and can support one or more of a variety of communication technologies and protocols, such as Ethernet, cellular, Bluetooth, near-field communication, and RF, among others. The network adapter 186 can include one or more antennas and associated components configured for wireless communication according to one or more wireless communication technologies and protocols. The one or more input devices 187 are devices over which the computing device 1150 receives input from a user. The one or more input devices 187 can include physically-actuatable user-interface elements (e.g., buttons, switches, or dials), a keypad, keyboard, mouse, touchscreen, and voice input devices, among other input devices that can accept user input. The one or more output devices 188 are devices by which the computing device 1150 is able to provide output to a user. The output devices 188 can include a display 190 (e.g., a liquid crystal display (LCD)) and one or more speakers191, among other output devices for presentation of visual or audible information to the recipient, a clinician, an audiologist, or other user.

[0125] It is to be appreciated that the arrangement for the computing device 1150 shown in FIG. 13 is merely illustrative and that aspects of the techniques presented herein can be implemented at a number of different types of systems / devices including any combination of hardware, software, and / or firmware configured to perform the functions described herein. For example, the computing device 1150 can be a personal computer (e.g., a desktop or laptop computer), a hand-held device (e.g., a tablet computer), a mobile device (e.g., a smartphone), a surgical system, and / or any other electronic device having the capabilities to perform the associated operations described elsewhere herein.

[0126] As should be appreciated, while particular uses of the technology have been illustrated and discussed above, the disclosed technology can be used with a variety of devices in accordance with many examples of the technology. The above discussion is not meant to suggest that the disclosed technology is only suitable for implementation within systems akin to that illustrated in the figures. In general, additional configurations can be used to practice the processes and systems herein and / or some aspects described can be excluded without departing from the processes and systems disclosed herein.

[0127] This disclosure described some aspects of the present technology with reference to the accompanying drawings, in which only some of the possible aspects were shown. Other aspects can, however, be embodied in many different forms and should not be construed as limited to the aspects set forth herein. Rather, these aspects were provided so that this disclosure was thorough and complete and fully conveyed the scope of the possible aspects to those skilled in the art.

[0128] As should be appreciated, the various aspects (e.g., portions, components, etc.) described with respect to the figures herein are not intended to limit the systems and processes to the particular aspects described. Accordingly, additional configurations can be used to practice the methods and systems herein and / or some aspects described can be excluded without departing from the methods and systems disclosed herein.

[0129] According to certain aspects, systems and non-transitory computer readable storage media are provided. The systems are configured with hardware configured to execute operations analogous to the methods of the present disclosure. The one or more non-transitory computer readable storage media comprise instructions that, when executed by one or moreprocessors, cause the one or more processors to execute operations analogous to the methods of the present disclosure.

[0130] Similarly, where steps of a process are disclosed, those steps are described for purposes of illustrating the present methods and systems and are not intended to limit the disclosure to a particular sequence of steps. For example, the steps can be performed in differing order, two or more steps can be performed concurrently, additional steps can be performed, and disclosed steps can be excluded without departing from the present disclosure. Further, the disclosed processes can be repeated.

[0131] Although specific aspects were described herein, the scope of the technology is not limited to those specific aspects. One skilled in the art will recognize other aspects or improvements that are within the scope of the present technology. Therefore, the specific structure, acts, or media are disclosed only as illustrative aspects. The scope of the technology is defined by the following claims and any equivalents therein.

[0132] It is also to be appreciated that the embodiments presented herein are not mutually exclusive and that the various embodiments may be combined with another in any of a number of different manners.

Claims

CLAIMSWhat is claimed is:

1. An implantable component, comprising: an elongate carrier member configured to be inserted into a body cavity of a recipient; and an elongate shape memory inlay circuit disposed in the elongate carrier member, wherein a change in shape of the elongate carrier member is configured to drive relative movement between at least one first part and at least one second part of the elongate shape memory inlay circuit to cause the at least one first part and the at least one second part to selectively connect to and disconnect from one another, and wherein a change in connection between the at least one first part and the at least one second part with one another is configured to further change the shape of the elongate carrier member.

2. The implantable component of claim 1, wherein the at least one second part is connected to a power source, and wherein connection of the at least one second part with the at least one first part results in a current flow through the at least one first part that increases a temperature of the at least one first part to cause the at least one first part to further change the shape of the elongate carrier member.

3. The implantable component of claim 2, wherein the at least one first part is a shape memory inlay and the at least one second part is a wire.

4. The implantable component of claim 2, wherein the at least one first part is a shape memory inlay and the at least one second part is another shape memory inlay.

5. The implantable component of claim 2, wherein the at least one first part comprises a plurality of partially-overlapping shape memory inlays.

6. The implantable component of claim 1, 2, 3, 4, or 5, wherein contact between the elongate carrier member and a wall of the body cavity is configured to connect the at least one first part and the at least one second part to one another to further change the shape of theelongate carrier member, and a sufficient change in the shape of the elongate carrier member is configured to disconnect the at least one first part and the at least one second part from one another.

7. The implantable component of claim 1, 2, 3, 4, or 5, wherein the elongate carrier member initially has a straight configuration, and wherein the at least one first part and the at least one second part are physically separated from one another while the elongate carrier member is in the straight configuration.

8. The implantable component of claim 7, further comprising: a stiffening element disposed in or on the elongate carrier member to maintain the elongate carrier member in the straight configuration and configured to be withdrawn from the elongate carrier member during insertion into the body cavity to change the shape of the elongate carrier member, wherein the at least one first part and the at least one second part are configured to be connected together in response to the change in the shape of the elongate carrier member caused by withdrawal of the stiffening element from the elongate carrier member, and the at least one first part and the at least one second part are configured to be disconnected from one another in response to a sufficient change in the shape of the elongate carrier member.

9. The implantable component of claim 8, wherein the stiffening element is a stylet configured to be disposed in the elongate carrier member.

10. The implantable component of claim 8, wherein the stiffening element is a sheath configured to be disposed on the elongate carrier member.

11. The implantable component of claim 1, 2, 3, 4, or 5, further comprising: a plurality of electrodes; and a shape memory inlay positioned between adjacent electrodes of the plurality of electrodes, wherein the shape memory inlay is configured to receive current and axially extend or compress in response to the current to adjust a distance between the adjacent electrodes.

12. A method, comprising:inserting an implantable component in a body cavity of a recipient, wherein the implantable component comprises a carrier member and a shape memory inlay activation circuit embedded in the carrier member; changing a shape of the carrier member during insertion of the implantable component in the body cavity to drive relative movement between a first component and a second component of the shape memory inlay activation circuit; and transitioning the shape memory inlay activation circuit between a first configuration and a second configuration in response to the relative movement between the first component and the second component, wherein the first component and the second component are electrically coupled to one another in the first configuration, the first component and the second component are electrically decoupled from one another in the second configuration, and a transition of the shape memory inlay activation circuit between the first configuration and the second configuration further changes the shape of the carrier member.

13. The method of claim 12, comprising transmitting current between the first component and the second component in the first configuration of the shape memory inlay activation circuit resulting from electrically coupling the first component and the second component to one another to increase a temperature of the first component to change a shape of the first component.

14. The method of claim 12, further comprising: determining contact between the implantable component and body fluid of the recipient; and interrupting current flow between the first component and the second component in response to determining the implantable component is not in contact with body fluid.

15. The method of claim 12, 13, or 14, wherein the implantable component comprises a sensor configured to determine contact between the implantable component and a wall of a body structure of the recipient, and the shape memory inlay activation circuit is configured to transition between the first configuration and the second configuration based on data transmitted by the sensor.

16. The method of claim 15, wherein the shape memory inlay activation circuit is transitioned to the first configuration based on the data indicating the implantable component is in contact with the wall of the body structure of the recipient.

17. The method of claim 15, wherein the shape memory inlay activation circuit is transitioned to the second configuration based on the data indicating the implantable component is not in contact with the wall of the body structure of the recipient.

18. The method of claim 12, 13, or 14, wherein the implantable component comprises an additional circuit, changing the shape of the carrier member during insertion of the implantable component in the body cavity drives relative movement between a third component and a fourth component of the additional circuit, the method further comprises transitioning the additional circuit between a third configuration and a fourth configuration in response to the relative movement between the third component and the fourth component, the third component and the fourth component are electrically coupled to one another in the third configuration to interrupt current flow between the first component and the second component of the shape memory inlay activation circuit, and the third component and the fourth component are electrically decoupled from one another in the fourth configuration to direct current flow between the first component and the second component of the shape memory inlay activation circuit.

19. The method of claim 18, comprising transitioning the additional circuit to the third configuration while the shape memory inlay activation circuit is in the first configuration.

20. The method of claim 12, 13, or 14, wherein the first component is positioned between a pair of electrode contacts of a plurality of electrode contacts, and changing the shape of the carrier member adjusts a distance between the pair of electrode contacts.

21. The method of claim 12, 13, or 14, wherein the implantable component comprises an additional shape memory inlay activation circuit, changing the shape of the carrier member during insertion of the implantable component in the body cavity drives relative movement between a third component and a fourth component of the additional shape memory inlay activation circuit, the method further comprises transitioning the additional shape memory inlay activation circuit between a third configuration and a fourth configuration, the thirdcomponent and the fourth component are electrically coupled to one another in the third configuration, the third component and the fourth component are electrically decoupled from one another in the fourth configuration, and a transition of the additional shape memory inlay activation circuit between the third configuration and the fourth configuration further changes the shape of the carrier member.

22. The method of claim 21, wherein the shape memory inlay activation circuit is transitioned to the first configuration while the additional shape memory inlay activation circuit is in the fourth configuration.

23. The method of claim 12, 13, or 14, further comprising: coupling a stiffening element to the carrier member to maintain the carrier member in a straight configuration; and decoupling the stiffening element from at least a portion of the carrier member to transition the shape memory inlay activation circuit to the first configuration.

24. The method of claim 23, further comprising: transmitting current between the stiffening element, the first component, and the second component while the shape memory inlay activation circuit is in the first configuration to change a shape of the first component and of the carrier member.

25. An implantable component, comprising: an elongate carrier member configured to be inserted into a body cavity of a recipient; and an electrically-activated shape memory circuit comprising: a power source; at least one drive wire disposed in the elongate carrier member and electrically connected to the power source; and at least one elongate shape memory inlay disposed in the elongate carrier member, wherein the electrically-activated shape memory circuit is configured to, in response to a change in shape of the elongate carrier member, transition between an open configuration in which the at least one elongate shape memory inlay and the at least one drive wire are electrically separated and a closed configuration in which the at least one elongate shapememory inlay and the at least one drive wire are electrically connected, and transition of the electrically-activated shape memory circuit between the open configuration and the closed configuration further changes the shape of the elongate carrier member.

26. The implantable component of claim 25, further comprising a sensor configured to determine contact between the elongate carrier member and a wall of a body structure of the recipient, and the electrically-activated shape memory circuit is configured to transition between the open configuration and the closed configuration based on data transmitted by the sensor.

27. The implantable component of claim 26, wherein the electrically-activated shape memory circuit is configured to transition to the open configuration based on the data transmitted by the sensor indicating the elongate carrier member is in contact with the wall of the body structure, and the electrically-activated shape memory circuit is configured to transition to the closed configuration based on the data transmitted by the sensor indicating the elongate carrier member is not in contact with the wall of the body structure.

28. The implantable component of claim 25, 26, or 27, further comprising: an additional circuit configured to transition between an additional open configuration and an additional closed configuration, wherein the additional circuit is configured to interrupt current flow between the at least one elongate shape memory inlay and the at least one drive wire in the additional closed configuration.

29. The implantable component of claim 25, 26, or 27, further comprising: a stiffening element disposed in or on the elongate carrier member to maintain the elongate carrier member in a straight configuration and configured to be withdrawn from the elongate carrier member during insertion into the body cavity to change the shape of the elongate carrier member.

30. The implantable component of claim 29, wherein the electrically-activated shape memory circuit is configured to transition to the closed configuration in response to the change in the shape of the elongate carrier member caused by withdrawal of the stiffening element from the elongate carrier member.

31. The implantable component of claim 30, wherein the stiffening element is configured to transmit current from the power source to the at least one drive wire and the at least one elongate shape memory inlay while the electrically-activated shape memory circuit is in the closed configuration.

32. The implantable component of claim 25, 26, or 27, further comprising: a sensor configured to determine contact between the elongate carrier member and body fluid of the recipient, wherein the electrically-activated shape memory circuit is configured to transition to the open configuration based on data from the sensor indicating the elongate carrier member is not in contact with body fluid.