Pump apparatus for semiconductor cleaning

Abstract

The present invention relates to a pump apparatus for semiconductor cleaning, the apparatus comprising: a bellows driving unit; a valve unit connected to the bellows driving unit for controlling entry and exit of fluid; a suction unit connected to the valve unit for introducing the fluid; a discharge unit connected to the valve unit for discharging the fluid; a cover unit surrounding the discharge unit; and a dew condensation reduction unit formed in the cover unit for alleviating dew condensation and freezing formed in the discharge unit.

Description

Pumping device for semiconductor cleaning

[0001] The present invention relates to a pump device for semiconductor cleaning, and more particularly, to a pump device for semiconductor cleaning that prevents condensation or freezing of a silencer connected to a pump used to supply a chemical solution to semiconductor equipment.

[0002] Generally, contaminants such as particles, organic contaminants, and metallic contaminants remaining on the substrate surface significantly affect the characteristics and production yield of semiconductor devices. Therefore, the cleaning process, which removes various contaminants attached to the substrate surface, is crucial in the semiconductor manufacturing process. Substrate cleaning processes are implemented before and after each unit process in semiconductor manufacturing.

[0003] To clean a substrate, a chemical solution, such as a chemical, is supplied to the substrate. The pump used in the chemical solution supply device can be a bellows-type pump that uses air pressure. Because these pumps generate a lot of exhaust noise, a silencer is typically installed in the exhaust section.

[0004] The surface of a silencer is formed with numerous holes. Furthermore, to ensure proper operation, the silencer has specifications, such as material, thickness, and the size and number of holes. Air injected into the pump passes through the silencer and exits through numerous holes. As the air exits the holes, it expands adiabatically, absorbing surrounding heat. This cooling of the silencer surface causes condensation or freezing. This phenomenon blocks the holes in the silencer, hindering air discharge. This can lead to malfunctions in the silencer and process defects. Therefore, there is a need for improvement.

[0005] The background technology of the present invention is published in Korean Patent Publication No. 2023-0142232 (published on October 11, 2023, title of the invention: Tube, pump including same, and chemical supply device).

[0006] The present invention has been devised to improve the above-mentioned problems, and its purpose is to provide a semiconductor cleaning pump device that prevents condensation or freezing of a silencer connected to a pump used to supply a chemical solution to semiconductor equipment.

[0007] A semiconductor cleaning pump device according to the present invention comprises: a bellows driving unit; a valve unit connected to the bellows driving unit to control fluid inflow and outflow; a suction unit connected to the valve unit to introduce fluid; a discharge unit connected to the valve unit to discharge fluid; a cover unit covering the discharge unit; and a condensation reduction unit formed on the cover unit to prevent condensation and freezing formed on the discharge unit.

[0008] The above discharge unit may include a discharge adapter unit connected to the valve unit; and a discharge soundproof unit connected to the discharge adapter unit and reducing noise while discharging fluid.

[0009] The cover part may include a first cover part that is coupled to the valve part and surrounds the discharge part; and a second cover part that is coupled to the lower surface of the first cover part and covers the lower portion of the discharge part.

[0010] The above condensation reduction unit may include a plurality of first holes formed in the first cover unit and discharging fluid.

[0011] The above condensation reduction portion may include a second hole portion formed in the second cover portion.

[0012] The above condensation reduction unit may include a plurality of first holes formed in the first cover portion and discharging fluid; and a second hole formed in the second cover portion.

[0013] The size of the above first hole is larger than the size of the above second hole.

[0014] The area of ​​the plurality of first holes may be 10% to 35% of the side area of ​​the cover portion.

[0015] The semiconductor cleaning pump device according to the present invention may further include: an anti-condensation part covering the cover part;

[0016] The above condensation prevention part may include a Gore-Tex material.

[0017] The semiconductor cleaning pump device according to the present invention has a cover that surrounds a discharge portion that suppresses noise during a fluid discharge process, and a condensation reduction portion formed in the cover portion allows fluid to pass through, thereby suppressing condensation due to cooling of the discharge portion surface.

[0018] FIG. 1 is a schematic drawing showing a semiconductor cleaning pump device according to one embodiment of the present invention.

[0019] Figure 2 is a drawing schematically showing an exhaust section according to one embodiment of the present invention.

[0020] Figure 3 is a drawing schematically showing a cover part according to one embodiment of the present invention.

[0021] Figure 4 is a drawing schematically showing a state in which a condensation reduction part according to the present invention is formed in the first cover part.

[0022] FIG. 5 is a drawing schematically showing a first embodiment in which a condensation reduction part according to the present invention is formed on a second cover part.

[0023] Figure 6 is a drawing schematically showing a second embodiment in which a condensation reduction part according to the present invention is formed on a second cover part.

[0024] Figure 7 is a drawing schematically showing a third embodiment in which a condensation reduction part according to the present invention is formed on a second cover part.

[0025] Figure 8 is a drawing schematically showing a state in which a condensation reduction part according to the present invention is formed in the first cover part and the second cover part.

[0026] Figure 9 shows the results of a test to determine whether condensation or freezing occurs depending on the area of ​​the first hole compared to the side area of ​​the cover portion according to one embodiment of the present invention.

[0027] Fig. 10 is a drawing schematically showing a condensation prevention unit according to one embodiment of the present invention.

[0028] Hereinafter, embodiments of a semiconductor cleaning pump device according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions in the present invention and may vary depending on the intentions or practices of the user or operator. Therefore, the definitions of these terms should be based on the contents throughout this specification.

[0029] FIG. 1 is a schematic diagram of a semiconductor cleaning pump device according to one embodiment of the present invention. Referring to FIG. 1, a semiconductor cleaning pump device (1) according to one embodiment of the present invention includes a bellows drive unit (10), a valve unit (20), a suction unit (30), a discharge unit (40), a cover unit (50), and a condensation reduction unit (60).

[0030] The bellows drive unit (10) generates air pressure in a pleated shape, and the valve unit (20) is connected to the bellows drive unit (10) to control the inflow and outflow of fluid. For example, the valve units (20) may be arranged on each side of the bellows drive unit (10). The valve unit (20) may be capable of changing the fluid path in three directions.

[0031] The suction part (30) is connected to the valve part (20) so that fluid can be introduced, and the discharge part (40) is connected to the valve part (20) so that fluid can be discharged. For example, when the valve part (20) connects the bellows drive part (10) and the suction part (30), the fluid introduced from the suction part (30) can move to the bellows drive part (10) so that air pressure can be generated. When the valve part (20) connects the bellows drive part (10) and the discharge part (40), the fluid discharged from the bellows drive part (10) can be discharged into the atmosphere.

[0032] A valve unit (20) is arranged on each of the left and right sides of the bellows drive unit (10), and a suction unit (30) and a discharge unit (40) can be connected to each valve unit (20). Then, when the bellows drive unit (10) is pressurized by fluid inflow through the suction unit (30) from the left, fluid is discharged through the discharge unit (40) arranged on the right side of the bellows drive unit (10). Conversely, when the bellows drive unit (10) is pressurized by fluid inflow through the suction unit (30) from the right, fluid is discharged through the discharge unit (40) arranged on the left side of the bellows drive unit (10).

[0033] The cover part (50) surrounds the discharge part (40). For example, the cover part (50) may be made of a resin material. The cover part (50) can prevent the discharge part (40) from being directly exposed to the atmosphere.

[0034] The condensation reduction unit (60) is formed in the cover unit (50) and can prevent condensation and freezing from forming in the discharge unit (40). For example, the condensation reduction unit (60) can function as a passage for passing fluid. A plurality of condensation reduction units (60) can be evenly formed around the entire circumference of the cover unit (50).

[0035] Fig. 2 is a schematic diagram illustrating an exhaust unit according to one embodiment of the present invention. Referring to Fig. 2, an exhaust unit (40) according to one embodiment of the present invention may include an exhaust adapter unit (41) and an exhaust soundproof unit (42).

[0036] The discharge adapter part (41) can be connected to the valve part (20). For example, the discharge adapter part (41) can include a first adapter part (411) that is inserted into the discharge port part (29) formed in the valve part (20) to guide the fluid, a second adapter part (412) that extends downward from the first adapter part (411) to guide the fluid, and a third adapter part (413) that is formed at the lower portion of the second adapter part (412).

[0037] The exhaust soundproofing part (42) is connected to the exhaust adapter part (41) and can reduce noise while discharging fluid. For example, the exhaust soundproofing part (42) can be inserted into the third adapter part (413) and have multiple holes formed therein for discharging fluid in all directions. The exhaust soundproofing part (42) can suppress noise generated during the process of discharging fluid.

[0038] The exhaust adapter part (41) can be manufactured in various shapes to connect the valve part (20) and the exhaust soundproof part (42) having various processing capacities. That is, the first adapter part (411) can be designed to have a size corresponding to the exhaust port part (29) of the selected valve part (20). In addition, the third port part (419) formed at the lower part of the third adapter part (413) can also be designed to have a size corresponding to the noise connection part (421) of the selected exhaust soundproof part (42).

[0039] FIG. 3 is a schematic diagram of a cover part according to one embodiment of the present invention. Referring to FIG. 3, a cover part (50) according to one embodiment of the present invention may include a first cover part (51) and a second cover part (52). The first cover part (51) and the second cover part (52) may be formed integrally. Alternatively, the second cover part (52) may be assembled to the first cover part (51).

[0040] The first cover part (51) may be coupled to the valve part (20) and formed to surround the discharge part (40). For example, the first cover part (51) may have a cylindrical shape with both upper and lower sides open. The upper part of the first cover part (51) may be in close contact with the outer side of the valve part (20). The first cover part (51) may be coupled to the lower part of the valve part (20) by means of a bolt assembly or a separate fixing means. A seal may be added between the first cover part (51) and the valve part (20) to maintain airtightness.

[0041] The second cover part (52) can be joined to the lower surface of the first cover part (51) to cover the lower portion of the discharge part (40). For example, the second cover part (52) can cover the lower open area of ​​the first cover part (51). The upper surface of the second cover part (52) can be in close contact with the lower surface of the discharge soundproof part (42). In addition, the upper surface of the second cover part (52) can be spaced apart from the lower surface of the discharge soundproof part (42).

[0042] Fig. 4 is a schematic diagram showing a state in which a condensation reduction unit according to the present invention is formed in a first cover unit. Referring to Fig. 4, a condensation reduction unit (60) according to the present invention may include a first hole (61). A plurality of first holes (61) may be formed in the first cover unit (51) to discharge fluid. For example, a plurality of first holes (61) may be arranged in a vertical direction and a plurality of first holes (61) may be arranged in a circumferential direction.

[0043] FIG. 5 is a schematic diagram showing a first embodiment in which a condensation reduction unit according to the present invention is formed on a second cover part, FIG. 6 is a schematic diagram showing a second embodiment in which a condensation reduction unit according to the present invention is formed on a second cover part, and FIG. 7 is a schematic diagram showing a third embodiment in which a condensation reduction unit according to the present invention is formed on a second cover part. Referring to FIGS. 5 to 7, the condensation reduction unit (60) according to the present invention may include a second hole (62). A plurality of second holes (62) may be formed in the second cover (52) to discharge fluid. For example, the second holes (62) may be formed in a circumferential direction so as to be spaced equally in a plurality. The six second holes (62) may be arranged circumferentially at the edge of the second cover part (52) made of a single layer (see FIG. 5), may be arranged crosswise in the circumferential direction of the second cover part (52) made of two layers (see FIG. 6), or may be arranged circumferentially at a step formed in the second cover part (52) (see FIG. 7). The cross-sectional area of ​​the second holes (62) may be 0.5% to 1.5% of the cross-sectional area of ​​the cover part (50).

[0044] Fig. 8 is a drawing schematically showing a state in which a condensation reduction unit according to the present invention is formed in a first cover unit and a second cover unit. Referring to Fig. 8, a condensation reduction unit (60) according to the present invention may include a first hole unit (61) and a second hole unit (62). That is, a first hole unit (61) may be formed in a first cover unit (51), and a second hole unit (62) may be formed in a second cover unit (52). Since the shape and structure of the first hole unit (61) and the second hole unit (62) are the same as described above, a detailed description thereof will be omitted.

[0045] The size of the first hole (61) is larger than the size of the second hole (62). For example, the inner diameter of each of the first holes (61) can be designed to be larger than the inner diameter of each of the second holes (62).

[0046] FIG. 9 is a result of testing whether condensation or freezing occurs according to the area of ​​the first hole relative to the side surface area of ​​the cover portion according to one embodiment of the present invention. Referring to FIG. 9, the sum of the areas of the plurality of first holes (61) may be 10% to 35% of the side surface area of ​​the cover portion (50). The side surface area of ​​the cover portion (50) may be the surface area of ​​a cylinder corresponding to the area when the first cover portion (51) is unfolded. As a result of the test, when the total area of ​​the first hole portion (61) relative to the side surface area of ​​the cover portion (50) is 5%, condensation or freezing occurs on the surface of the discharge portion (40). In addition, when the total area of ​​the first hole portion (61) relative to the side surface area of ​​the cover portion (50) is 40%, condensation or freezing occurs on the surface of the discharge portion (40). On the other hand, when the total area of ​​the first hole (61) is 10% to 35% of the side area of ​​the cover (50), condensation or freezing does not occur on the surface of the discharge portion (40).

[0047] Fig. 10 is a drawing schematically showing a condensation prevention unit according to an embodiment of the present invention. Referring to Fig. 10, a semiconductor cleaning pump device (1) according to an embodiment of the present invention may further include a condensation prevention unit (70). The condensation prevention unit (70) may be formed to surround the cover unit (50). The condensation prevention unit (70) may be manufactured to include a Gore-Tex material. For example, the condensation prevention unit (70) may have a container shape with an open upper side, and may be in close contact with the first cover unit (51) and the second cover unit (52) to perform a heat retention function. The condensation prevention unit (70) may have holes formed corresponding to the first hole unit (61) and the second hole unit (62). The condensation prevention unit (70) may be attached to the first cover unit (51) and the second cover unit (52). The condensation prevention unit (70) can be maintained in a state of being mounted on the first cover unit (51) by a separate clamp. An elastic material is added to the condensation prevention unit (70), and when the condensation prevention unit (70) is stretched and inserted into the cover unit (50), the condensation reduction unit (60) can be tightly attached to the cover unit (50).

[0048] The assembly and operation of a semiconductor cleaning pump device according to one embodiment of the present invention having the above structure are described as follows.

[0049] A valve part (20) is connected to each side of the bellows drive part (10), and a suction part (30) and a discharge part (40) are connected to each valve part (20). Each discharge part (40) includes a discharge adapter part (41) connected to the valve part (20), and a discharge soundproof part (42) connected to the discharge adapter part (41) to discharge fluid and suppress noise.

[0050] A condensation reduction portion (60) is formed in the cover portion (50), and a condensation prevention portion (70) is additionally arranged on the outside of the cover portion (50).

[0051] In the above-described state, when the fluid introduced through the suction portion (30) arranged on the left side of the bellows drive portion (10) is supplied to the bellows drive portion (10) through the valve portion (20), the fluid is discharged to the discharge portion (40) through the valve portion (20) arranged on the right side of the bellows drive portion (10).

[0052] At this time, the fluid that has escaped through the exhaust soundproofing part (42) of the exhaust part (40) absorbs the surrounding heat while expanding in an insulating manner, and the surface of the exhaust soundproofing part (42) is cooled, which may cause condensation or freezing.

[0053] However, if the cover part (50) covers the discharge part (40), the condensation reduction part (60) is formed in the cover part (50) to allow the fluid to pass through, and the condensation prevention part (70) additionally covers the outside of the cover part (50), surface cooling of the discharge soundproof part (42) is prevented.

[0054] A semiconductor cleaning pump device (1) according to one embodiment of the present invention has a cover part (50) that surrounds a discharge part (40) that suppresses noise during a fluid discharge process, and a condensation reduction part (60) formed in the cover part (50) allows fluid to pass through, thereby suppressing condensation due to cooling of the surface of the discharge part (40).

[0055] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible. Accordingly, the true technical protection scope of the present invention should be defined by the following claims.

Claims

1. Bellows drive unit; A valve part connected to the above bellows driving part to control the inflow and outflow of fluid; A suction part connected to the above valve part to introduce fluid; A discharge portion connected to the above valve portion to discharge fluid; A cover portion surrounding the above discharge portion; and A semiconductor cleaning pump device characterized by including a condensation reduction unit formed in the cover unit to prevent condensation and freezing formed in the discharge unit.

2. In paragraph 1, the discharge unit A discharge adapter part connected to the above valve part; and A semiconductor cleaning pump device characterized by including a discharge soundproofing part connected to the discharge adapter part and reducing noise while discharging fluid.

3. In the first paragraph, the cover part A first cover part coupled to the valve part and surrounding the discharge part; and A semiconductor cleaning pump device characterized by including a second cover part coupled to the lower surface of the first cover part and covering the lower portion of the discharge part.

4. In the third paragraph, the condensation reduction unit A semiconductor cleaning pump device characterized by including a plurality of first holes formed in the first cover portion and discharging fluid.

5. In the third paragraph, the condensation reduction unit A semiconductor cleaning pump device characterized by including a second hole formed in the second cover portion.

6. In the third paragraph, the condensation reduction unit A plurality of first holes formed in the first cover portion to discharge fluid; and A semiconductor cleaning pump device characterized by including a second hole formed in the second cover portion.

7. In paragraph 6, A semiconductor cleaning pump device, characterized in that the size of the first hole is larger than the size of the second hole.

8. In paragraph 6, A semiconductor cleaning pump device, characterized in that the area of ​​the plurality of first holes is 10% to 35% of the side area of ​​the cover part.

9. In paragraph 1, A semiconductor cleaning pump device further comprising an anti-condensation part covering the cover part.

10. In paragraph 9, A semiconductor cleaning pump device characterized in that the above condensation prevention part includes a Gore-Tex material.

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