Circuit board

Abstract

This circuit board comprises: a core layer; a first build-up layer disposed on one surface of the core layer; a second build-up layer disposed on the other surface of the core layer; a patterned portion disposed on the first build-up layer or the second build-up layer; and a magnetic body disposed on the first build-up layer or the second build-up layer so as to overlap the patterned portion in a vertical direction, wherein the core layer includes first and second via holes overlapping in a horizontal direction and first and second surfaces, each connected at both ends to the first and second via holes, and the patterned portion, the magnetic body, the first surface, and the second surface overlap in the vertical direction.

Description

circuit board

[0001] This embodiment relates to a circuit board.

[0002]

[0003] Recently, electronic product technology has been moving toward multifunctionality and high-speed operation, and to respond to this trend, semiconductor chip manufacturing technology is also developing at a rapid pace.

[0004] In particular, the thickness of circuit boards applied for miniaturization of finished electronic products is also decreasing, and technologies related to multilayer circuit boards that configure more circuit layers within a circuit board of the same thickness are being actively researched.

[0005] A circuit board is a substrate made by printing a circuit line pattern with a conductive material, such as copper, onto an electrically insulating substrate. It is a general term for a board immediately before electronic components are mounted. To densely mount numerous electronic components on a flat surface, the mounting locations of each component are determined, and the circuit patterns connecting the components are printed and secured onto the flat surface.

[0006] A circuit board includes a plurality of insulating layers arranged vertically. The plurality of insulating layers can be electrically connected by wiring layers arranged on their respective surfaces and via electrodes connecting different wiring layers.

[0007] Electronic components are placed on circuit boards. As the capacity of electronic components increases for higher efficiency and multifunctionality, their size also increases. This, in turn, presents challenges in securing space for component placement on the circuit board.

[0008]

[0009] The present embodiment provides a circuit board that can secure a wider space for component placement and improve production efficiency by arranging an inductor inside the circuit board.

[0010]

[0011] A circuit board according to the present embodiment includes a core layer; a first build-up layer disposed on one surface of the core layer; a second build-up layer disposed on the other surface of the core layer; a pattern portion disposed on the first build-up layer or the second build-up layer; and a magnetic body disposed to vertically overlap with the pattern portion in the first build-up layer or the second build-up layer, wherein the core layer includes a first via hole and a second via hole that horizontally overlap, and a first surface and a second surface having both ends connected to the first via hole and the second via hole, and the pattern portion, the magnetic body, the first surface, and the second surface vertically overlap.

[0012] The above core layer may be a glass substrate.

[0013] The magnetic body may be arranged on the first build-up layer, and the pattern portion may be arranged on the second build-up layer.

[0014] The first build-up layer includes a first insulating layer and a second insulating layer arranged in a vertical direction, the pattern portion is arranged between the first insulating layer and the second insulating layer, and the magnetic body can be arranged on an upper surface of the second insulating layer.

[0015] The above pattern portion may include a plurality of metal lines spaced apart in a horizontal direction and wires connecting the plurality of metal lines, and the second insulating layer may include a cavity through which the wires penetrate.

[0016] A protective layer disposed on the first build-up layer may be included, and the protective layer may include a through hole in which the wire and the magnetic body are disposed.

[0017] It may include a molding part arranged within the above through hole and in which the magnetic body and the wire are embedded.

[0018] The upper surface of the above molding part may be positioned higher than the upper surface of the above protective layer.

[0019] The first via hole and the second via hole may each include an upper region whose width gradually decreases toward the second build-up layer, and a lower region disposed below the upper region and whose width gradually increases toward the second build-up layer.

[0020] The second build-up layer includes a third insulating layer and a fourth insulating layer arranged in a vertical direction, the pattern portion is arranged between the third insulating layer and the fourth insulating layer, and the magnetic body can be arranged on the first surface.

[0021]

[0022] According to this embodiment, the inductor is placed in an embedded form within the circuit board, thereby securing a wider space for placing the inductor and enabling implementation of a large-capacity inductor.

[0023] In addition, since the inductor can be implemented in the process of forming a plurality of wiring sections and via sections, there is an advantage of improving production efficiency by reducing assembly man-hours.

[0024]

[0025] Figure 1 is a cross-sectional view of a circuit board according to a first embodiment of the present invention.

[0026] Figure 2 is a cross-sectional view of a pattern portion according to the first embodiment of the present invention.

[0027] Figure 3 is a cross-sectional view of a circuit board according to a second embodiment of the present invention.

[0028] Figure 4 is a plan view of a pattern portion according to a second embodiment of the present invention.

[0029] FIG. 5 is a drawing for explaining the arrangement structure of a pattern portion, a magnetic body, and a wire according to a second embodiment of the present invention.

[0030]

[0031] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0033] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0034] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as "A and / or at least one (or more) of B, C," it may include one or more of all combinations that can be combined with A, B, and C.

[0035] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0036] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0037] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0038] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Also, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0039] Additionally, the expression that configuration A is positioned between configurations B and C should also include the meaning that configuration A is positioned so that it overlaps configurations B and C at least partially in the horizontal and / or vertical directions.

[0040] Expressions referring to directions include horizontal directions, vertical directions, and include a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. These are referred to as a first horizontal direction (X-axis), a second horizontal direction (Y-axis), and a vertical direction (Z-axis) according to the Cartesian coordinate system, and the meaning of overlapping along the horizontal direction should also include the meaning of overlapping along the first horizontal direction and / or overlapping along the second horizontal direction.

[0041] FIG. 1 is a cross-sectional view of a circuit board according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of a pattern portion according to the first embodiment of the present invention.

[0042] Referring to FIGS. 1 and 2, a circuit board (10) according to an embodiment of the present invention may include a core layer (110), a first build-up layer (121, 122), a second build-up layer (123, 124), a plurality of wiring portions, a plurality of via portions, a pattern portion (150), and a magnetic body (160).

[0043] The core layer (110), the first build-up layer (121, 122), and the second build-up layer (123, 124) may be arranged along the vertical direction. With the core layer (110) as the center, the first build-up layer (121, 122) may be arranged on one side of the core layer (110), and the second build-up layer (123, 124) may be arranged on the other side of the core layer (110) opposite to the one side.

[0044] The core layer (110) may be a member forming the basis of the circuit board (10). The core layer (110) may be a glass substrate. The material of the core layer (110) may include at least one selected from the group consisting of glass, resin, and plastic. Due to the material properties of the core layer (110), the circuit board (10) has the advantages of flatness control, via hole formation, signal characteristics, and ease of large-area fabrication.

[0045] The material of the core layer (110) described above is exemplary, and alternatively, the core layer (110) may be a prepreg (PPG) with embedded glass fibers.

[0046] The core layer (110) has a first length in the vertical direction, and the first length may be longer than the vertical lengths of each of the first build-up layers (121, 122) and the second build-up layers (123, 124). Accordingly, the bending characteristics of the circuit board (10) may be improved.

[0047] The core layer (110) may include a via hole (111). The via hole (111) may have a shape that penetrates from one surface to the other surface of the core layer (110). A first via electrode (141), which will be described later, may be arranged in the via hole (111). The via hole (111) may include an upper region (112) having a shape in which a horizontal width gradually decreases from one surface to the other surface of the core layer (110), and a lower region (113) having a shape in which a horizontal width gradually increases from the lower end of the upper region (112) to the other surface of the core layer (110). The upper region (112) and the lower region (113) may be arranged in a vertical direction. The upper region (112) and the lower region (113) may be connected to each other. Due to the upper region (112) and the lower region (113), the via hole (111) can have an hourglass-shaped cross-section.

[0048] A plurality of via holes (111) may be provided. The plurality of via holes (111) may be arranged to be spaced apart from each other along the horizontal direction of the core layer (110). In this case, two via holes (111) formed to have a shorter horizontal distance than other via holes (111) may be named a first via hole (116) and a second via hole (117), respectively. The first via hole (116) and the second via hole (117) may be arranged closer to the center than the edge of the core layer (110).

[0049] The core layer (110) may include a first surface (118) and a second surface (119) which are connected at both ends to a first via hole (116) and a second via hole (117). The first surface (118) and the second surface (119) may overlap in a vertical direction. The first surface (118) may form a part of the upper surface of the core layer (110). The second surface (119) may form a part of the lower surface of the core layer (110).

[0050] The first build-up layer (121, 122) may be disposed on one surface of the core layer (110). The first build-up layer (121, 122) may be disposed on the upper surface of the core layer (110). The first build-up layer (121, 122) may include a plurality of insulating layers disposed in a vertical direction. The plurality of insulating layers may include a first insulating layer (121) and a second insulating layer (122). The first insulating layer (121) may be disposed on the upper surface of the core layer (110). The second insulating layer (122) may be disposed on the upper surface of the first insulating layer (121).

[0051] In this embodiment, the first build-up layer (121, 122) is described as including two insulating layers as an example, but this is not limiting, and the first build-up layer (121, 122) may include one insulating layer or three or more insulating layers. The first insulating layer (121) and the second insulating layer (122) may each have a second length in the vertical direction, and the second length may be shorter than the first length of the core layer (110).

[0052] The second build-up layer (123, 124) may be disposed on the other surface of the core layer (110). The second build-up layer (123, 124) may be disposed on the lower surface of the core layer (110). The second build-up layer (123, 124) may include a plurality of insulating layers disposed in a vertical direction. The plurality of insulating layers may include a third insulating layer (123) and a fourth insulating layer (124). The third insulating layer (123) may be disposed on the lower surface of the core layer (110). The fourth insulating layer (124) may be disposed on the lower surface of the third insulating layer (123).

[0053] In this embodiment, the second build-up layer (123, 124) is described as including two insulating layers as an example, but this is not limited thereto, and the second build-up layer (123, 124) may include one insulating layer or three or more insulating layers. In this case, the number of insulating layers constituting the second build-up layer (123, 124) may be the same as the number of insulating layers constituting the first build-up layer (121, 122). The third insulating layer (123) and the second insulating layer (124) may each have a second length in the vertical direction, and the second length may be shorter than the first length of the core layer (110).

[0054] The first to fourth insulating layers (121, 122, 123, 124) may each be any insulator, such as photocurable and / or thermosetting. As the thermosetting insulator, an insulator in which inorganic and / or organic fillers are dispersed in a resin, such as ABF (Ajinomoto Build-up Film), a product released by Ajinomoto Co., Ltd., may be used, and a prepreg (PPG) including glass fibers in a resin may be used. In addition, the resin described above may be, for example, an epoxy resin, a bismaleimide triazine resin (BT resin), a phenol resin, etc., and the inorganic and / or organic fillers may be provided with a material such as silica or plastic. When an insulating resin is used as a core, a reinforcing material provided with glass fibers or aramid fibers may be included. When the first to fourth insulating layers (121, 122, 123, 124) are photocurable insulators, the first to fourth insulating layers (121, 122, 123, 124) may each be a PID (Photo Imageable Dielectric).

[0055] The materials of the first to fourth insulating layers (121, 122, 123, 124) described above are exemplary, and some of the multiple insulating layers may be implemented with materials different from those of other parts.

[0056] The circuit board (10) may include a circuit pattern. The circuit board (10) may have a plurality of wiring portions and a plurality of via portions arranged thereon.

[0057] A plurality of wiring portions may be arranged on the surface of the core layer (110) and the plurality of insulating layers, respectively. Here, the meaning of being arranged on the surface may also include the meaning that at least a portion of the plurality of wiring portions are embedded in the core layer (110) or the plurality of insulating layers, respectively, and are exposed to the outside from the surface.

[0058] The plurality of wiring portions may include a first wiring portion (131) disposed on the upper surface of the core layer (110), a second wiring portion (132) disposed on the upper surface of the first insulating layer (121), a third wiring portion (133) disposed on the upper surface of the second insulating layer (122), a fourth wiring portion (134) disposed on the lower surface of the core layer (110), a fifth wiring portion (139) disposed on the lower surface of the third insulating layer (123), and a sixth wiring portion (135) disposed on the lower surface of the fourth insulating layer (124). The third wiring portion (133) disposed on the upper surface of the first build-up layer (121, 122) may be referred to as a first pad portion. The sixth wiring section (135) placed on the lower surface of the second build-up layer (123, 124) can be called the second pad section.

[0059] The via portion may be a metal material placed in a via hole formed in a core layer (110) or a plurality of insulating layers to connect a plurality of pad portions facing each other in a vertical direction. Here, the via hole may have a shape that vertically penetrates the core layer (110) or each of the plurality of insulating layers.

[0060] The via portion may include a first via portion (141) penetrating the core layer (110), a second via portion (144) penetrating the first insulating layer (121), a third via portion (145) penetrating the second insulating layer (122), a fourth via portion (146) penetrating the third insulating layer (123), and a fifth via portion (147) penetrating the fourth insulating layer (124).

[0061] The first via portion (141) may be arranged within the via hole (111) of the core layer (110). The first via portion (141) may be arranged on the inner wall of the via hole (111). The first via portion (141) may electrically connect the first wiring portion (131) and the fourth wiring portion (134). A filling material may be filled within the via hole (111) of the core layer (110), and in this case, a cavity may be formed in the center of the first via portion (141) for filling the filling material. Accordingly, the bonding state of the first via portion (141) may be firmly maintained within the via hole (111).

[0062] In accordance with the shape of the via hole (111), the first via portion (141) may include an upper via portion (112) disposed on the inner wall of the upper region (112) of the via hole (111), and a lower via portion (113) disposed on the inner wall of the lower region (113) of the via hole (111). The upper via portion (112) may have a shape in which the horizontal width gradually decreases as it goes downward. The lower via portion (113) may have a shape in which the horizontal width gradually increases as it goes downward. The upper end of the upper via portion (112) may be connected to the first wiring portion (131). The lower end of the lower via portion (113) may be connected to the fourth wiring portion (134).

[0063] The second via portion (144) can electrically connect the first wiring portion (131) and the second wiring portion (132). The third via portion (145) can electrically connect the second wiring portion (132) and the third wiring portion (133). The second via portion (144) and the third via portion (145) can have a shape in which the horizontal width becomes smaller as they go downward.

[0064] Some of the plurality of fourth vias (146) may electrically connect the fourth wiring portion (134) and the fifth wiring portion (139). Others of the plurality of fourth vias (146) may electrically connect the fourth wiring portion (134) and the pattern portion (150) to be described later. The fifth via portion (147) may electrically connect the fifth wiring portion (139) and the sixth wiring portion (135). Some of the plurality of fifth vias (147) may electrically connect the pattern portion (150) and the sixth wiring portion (135). The fourth via portion (146) and the fifth via portion (147) may have a shape in which the horizontal width increases as they go downward.

[0065] A protective layer may be disposed on the surface of the circuit board (10). The protective layer may include an upper protective layer (191) disposed on the upper surface of the first build-up layer (121, 122), and a lower protective layer (192) disposed on the lower surface of the second build-up layer (123, 124). The upper protective layer (191) and the lower protective layer (192) may each perform a function of preventing short circuits between solders due to low wettability with solder when a semiconductor element is disposed on the surface of the circuit board (10) using a material such as solder. A photocurable insulating material may be used for the upper protective layer (191) and the lower protective layer (192). For example, a solder resist or a PID (Photo Imageable Dielectric) may be used for the upper protective layer (191) and the lower protective layer (192).

[0066] The circuit board (10) may include an inductor. The inductor may be embedded within the circuit board (10). The inductor may be implemented in an embedded form within the circuit board (10). The inductor may be a solenoid-type inductor.

[0067] The inductor may include a pattern portion (150) and a magnetic material (160).

[0068] The pattern portion (150) may be arranged in the first build-up layer (121, 122) or the second build-up layer (123, 124). The pattern portion (150) and the magnetic body (160) may be arranged to face each other in a vertical direction with respect to the core layer (110).

[0069] Hereinafter, an example will be described in which the pattern portion (150) is placed on the second build-up layer (123, 124) and the magnetic body (160) is placed close to the first build-up layer (121, 122).

[0070] The pattern portion (150) may be disposed between the third insulating layer (123) and the fourth insulating layer (124). The pattern portion (150) may be disposed on the lower surface of the third insulating layer (123). The pattern portion (150) may be disposed on the upper surface of the fourth insulating layer (124). The pattern portion (150) may be disposed to overlap the fifth wiring portion (192) in the horizontal direction. The horizontal length of the pattern portion (150) may be formed longer than the horizontal length of the fifth wiring portion (192). The pattern portion (150) may be electrically connected to the fourth wiring portion (134) through the fourth via portion (146). The pattern portion (150) may be electrically connected to the sixth wiring portion (135) through the fifth via portion (147).

[0071] As illustrated in FIG. 2, the pattern portion (150) may include a first end portion (151) forming one end, a second end portion (152) facing the first end portion (151) and forming the other end, and a connecting pattern (155) connecting the first end portion (151) and the second end portion (152).

[0072] The first end (151) and the second end (152) may be electrically connected to the fourth wiring portion (134) via the fourth via portion (146), respectively. The connection pattern (155) may be formed in a zigzag shape. The connection pattern (155) may include a plurality of lines and bend portions arranged between adjacent lines. Accordingly, the area vertically overlapping with the magnetic body (160) may be increased.

[0073] The pattern portion (150) may be arranged to vertically overlap the first surface (118) and the second surface (119) of the core layer (110). The pattern portion (150) may be arranged between the first via hole (116) and the second via hole (117) of the core layer (110). One end of the pattern portion (150) may be arranged to vertically overlap at least a portion of the first via hole (116). The other end of the pattern portion (150) may be arranged to vertically overlap at least a portion of the second via hole (117). Accordingly, by adjusting the horizontal distance between the first via hole (116) and the second via hole (117), the arrangement space of the inductor within the circuit board (10) can be guided, thereby increasing the degree of freedom in design and facilitating the production process. In addition, there is an advantage in that the signal transmission length can be minimized through the first via portion (141) placed in the first via hole (116) and the second via hole (117).

[0074] The magnetic body (160) may be placed between the first build-up layer (121, 122) and the core layer (110). The magnetic body (160) may be placed on the upper surface of the core layer (110) or the lower surface of the first insulating layer (121). The magnetic body (160) may be placed on the first surface (118). Alternatively, the magnetic body (160) may be placed between the upper surface of the first insulating layer (121) and the lower surface of the second insulating layer (122).

[0075] The magnetic body (160) may include a ferromagnetic material. The magnetic body (160) may include at least one material selected from the group consisting of a NiFe alloy, a NiCr alloy, and a CoP alloy. The magnetic body (160) may electromagnetically interact with the pattern portion (150). Accordingly, an inductor may be implemented.

[0076] The magnetic body (160) may be arranged to overlap vertically with the pattern portion (150). The magnetic body (160) may be arranged on the core layer (110). The magnetic body (160) may be arranged to overlap vertically with the first surface (118) and the second surface (119) of the core layer (110).

[0077] The magnetic body (160) can be formed on the core layer (110) through dry or wet plating.

[0078] A magnetic coupling portion (165) may be arranged on the upper surface of the core layer (110) to secure a placement area of ​​the magnetic body (160). The magnetic coupling portion (165) may be a metal pattern plated on the core layer (110). The magnetic coupling portion (165) may have a predetermined thickness in the vertical direction and may form a plating area of ​​the magnetic body (160) on the surface of the core layer (110) or the insulating layer. The magnetic coupling portion (165) may be made of the same material as the first wiring portion (131). The magnetic coupling portion (165) may be arranged to overlap with the first wiring portion (131) in the horizontal direction. The horizontal length of the magnetic coupling portion (165) may be longer than the horizontal length of the magnetic body (160). The magnetic coupling portion (165) or the pattern portion (150) may be arranged to overlap with the magnetic body in the vertical direction. The process of forming a magnetic body (160) can be made easier through the magnetic body bonding portion (165).

[0079] Meanwhile, an avoidance portion (134a), which is an area where the fourth wiring portion (134) is not arranged, may be arranged on the second surface (119) of the core layer (110). Accordingly, in a structure where the magnetic body (160) and the pattern portion (150) are vertically overlapped, electrical noise generated by the fourth wiring portion (134) can be minimized.

[0080] According to the above structure, the inductor can be placed in an embedded form within the circuit board, thereby securing a wider space for placing the inductor, and there is an advantage in that a large-capacity inductor can be implemented.

[0081] In addition, since the inductor can be implemented in the process of forming a plurality of wiring sections and via sections, there is an advantage of improving production efficiency by reducing assembly man-hours.

[0082] Below, a circuit board according to a second embodiment of the present invention will be described.

[0083] FIG. 3 is a cross-sectional view of a circuit board according to a second embodiment of the present invention, FIG. 4 is a plan view of a pattern portion according to a second embodiment of the present invention, and FIG. 5 is a drawing for explaining the arrangement structure of a pattern portion, a magnetic body, and a wire according to a second embodiment of the present invention.

[0084] In this embodiment, other parts are the same as in the first embodiment, but there are differences in the arrangement positions of the pattern portion and the magnetic body, and the shape of the connection pattern within the pattern portion. Therefore, below, only the characteristic parts of this embodiment will be described, and the description according to the first embodiment will be referred to for the remaining parts. The same drawing reference numerals are given to components having the same function and structure as the circuit board according to the first embodiment and are described.

[0085] Referring to FIGS. 3 to 5, a circuit board (20) according to a second embodiment of the present invention may include a core layer (110), a first build-up layer (121, 122), a second build-up layer (123, 124), a plurality of wiring portions, a plurality of via portions, a pattern portion (250), a magnetic body (260), and a molding portion (280).

[0086] The pattern portion (250) may be arranged in the first build-up layer (121, 122) or the second build-up layer (123, 124). In the present embodiment, the pattern portion (250) and the magnetic body (260) may be arranged together in either the first build-up layer (121, 122) or the second build-up layer (123, 124). Hereinafter, an example in which the pattern portion (250) and the magnetic body (260) are arranged in the first build-up layer (121, 122) will be described.

[0087] The pattern portion (250) may be disposed between the first insulating layer (121) and the second insulating layer (122). The pattern portion (250) may be disposed on the upper surface of the first insulating layer (121). The pattern portion (250) may be disposed on the lower surface of the second insulating layer (122). The pattern portion (250) may be disposed to overlap the second wiring portion (132) in the horizontal direction. The horizontal length of the pattern portion (250) may be formed to be longer than the horizontal length of the second wiring portion (132). The pattern portion (250) may be electrically connected to the first wiring portion (131) through the second via portion (144). The pattern portion (250) may be electrically connected to the third wiring portion (133) through the third via portion (145).

[0088] As illustrated in FIG. 4, the pattern portion (250) may include a first end portion (251) forming one end, a second end portion (252) facing the first end portion (251) and forming the other end, and a plurality of metal lines (253) arranged between the first end portion (251) and the second end portion (252).

[0089] The first end (251) and the second end (252) can be electrically connected to the first wiring part (!31) through the second via part (144), or can be electrically connected to the third wiring part (133) through the third via part (145).

[0090] A plurality of metal lines (253) may be arranged to be spaced apart from each other in the horizontal direction. The plurality of metal lines (253) may be arranged in a diagonal direction with respect to a line connecting the first end (251) and the second end (252) in the horizontal direction. A coupling portion (254, 255) for coupling a wire (270) to be described later may be arranged at both ends of each of the plurality of metal lines (253). Accordingly, the wire (270) may be coupled at both ends to the coupling portion (254) of one of the two adjacent metal lines (253) and the coupling portion (255) of the other metal line (253), thereby electrically connecting the two metal lines (253) spaced apart from each other in the horizontal direction.

[0091] The pattern portion (250) may be arranged between the first via hole (116) and the second via hole (117) of the core layer (110). One end of the pattern portion (250) may be arranged so that at least a portion thereof vertically overlaps with the first via hole (116). The other end of the pattern portion (250) may be arranged so that at least a portion thereof vertically overlaps with the second via hole (117). Accordingly, by adjusting the horizontal distance between the first via hole (116) and the second via hole (117), the arrangement space of the inductor within the circuit board (20) can be guided, thereby increasing the degree of freedom in design and facilitating the production process.

[0092] The magnetic body (260) may be placed on the first build-up layer (121, 122). The magnetic body (260) may be placed on the upper surface of the second insulating layer (122).

[0093] The magnetic body (260) may include a ferromagnetic material. The magnetic body (260) may include at least one material selected from the group consisting of a NiFe alloy, a NiCr alloy, and a CoP alloy. The magnetic body (260) may electromagnetically interact with the pattern portion (250). Accordingly, an inductor may be implemented.

[0094] The magnetic body (260) can be arranged to overlap with the pattern portion (250) in a vertical direction. The magnetic body (260) can be formed on the first build-up layer (121, 122) through dry or wet plating.

[0095]

[0096] *82 A magnetic coupling portion (265) may be arranged on the upper surface of the first build-up layer (121, 122) to secure a placement area of ​​the magnetic body (260). The magnetic coupling portion (265) may be a metal pattern plated on the core layer (110). The magnetic coupling portion (265) may be made of the same material as the third wiring portion (133). The magnetic coupling portion (265) may be arranged to overlap horizontally with the third wiring portion (133). The horizontal length of the magnetic coupling portion (265) may be longer than the horizontal length of the magnetic body (260). The magnetic coupling portion (265) may be arranged to overlap vertically with the pattern portion (250). The process of forming the magnetic body (260) may be more easily performed through the magnetic coupling portion (265).

[0097] The wire (270) may be arranged to connect two adjacent metal lines (253). In order to secure a space for arranging the wire (270), the second insulating layer (122) may include a cavity formed in a vertical direction. Based on a single wire (270), the second insulating layer (122) may include a first cavity (226) and a second cavity (227). The first cavity (226) and the second cavity (227) may be arranged to be spaced apart from each other in the horizontal direction. The first cavity (226) may be arranged to vertically overlap with a joining portion (254) of one metal line (253). The second cavity (227) may be arranged to vertically overlap with a joining portion (255) of another metal line (253). Accordingly, due to the structure in which the joining portions (254, 255) of the metal line (253) are exposed through the first cavity (226) and the second cavity (227), the wire (270) can be joined. As illustrated in Fig. 5, the wire (270) can be provided in multiple numbers corresponding to the number of metal lines (253).

[0098] Meanwhile, when forming a plurality of cavities (226, 227) in the second insulating layer (122), a magnetic material (260) can be placed between the plurality of cavities (226, 227).

[0099] A protective layer (191) may be disposed on the upper surface of the first build-up layer (121, 122). In this case, in order to secure a space for disposing the magnetic body (260), a through hole (295) may be disposed in an area of ​​the protective layer (191) that vertically overlaps the magnetic body (260) and the pattern portion (250). The protective layer (191) may not be disposed in an area where the through hole (295) is formed. The magnetic body (260) and the wire (270) may be exposed to the upper side of the circuit board (20) through the through hole (295). In this case, the uppermost end of the wire (270) may be disposed above the upper surface of the protective layer (191).

[0100] In order to protect the wire (270) and the magnetic body (260) from external impact, a molding part (280) may be arranged on the upper surface of the circuit board (20). The molding part (280) is arranged in the through hole (295), and the wire (270) and the magnetic body (260) may be embedded by the molding part (280). In this case, as illustrated in FIG. 5, the wire (270) and the magnetic body (260) embedded in the molding part (280) may have a contact area with each other. Accordingly, a support structure for the wire (270) within the molding part (280) may be implemented through the magnetic body (260). The magnetic body (260) may be wrapped by the wire (2770) within the molding part (280).

[0101] Considering the vertical height of the wire (270), the upper surface of the molding portion (280) may protrude upwards from the upper surface of the protective layer (191). That is, the vertical thickness of the molding portion (280) may be thicker than the vertical thickness of the protective layer (191). The molding portion (280) may also be filled in the first cavity (226) and the second cavity (227).

[0102] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present invention.

[0103] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

[0104] Meanwhile, when a circuit board having the characteristics of the invention described above is used in IT devices such as smartphones, server computers, TVs, or home appliances, it can stably perform functions such as signal transmission or power supply. For example, when a circuit board having the characteristics of the invention performs a semiconductor package function, it can safely protect semiconductor chips from external moisture or contaminants, and can solve problems such as leakage current or electrical shorts between terminals, or electrical open circuits in terminals supplying semiconductor chips. Furthermore, when it performs a signal transmission function, it can solve noise problems. Through this, the circuit board having the characteristics of the invention described above can maintain the stable function of IT devices or home appliances, thereby enabling the entire product and the circuit board to which the invention is applied to achieve functional integration or technical interoperability with each other.

[0105] When a circuit board having the characteristics of the invention described above is used in a transportation device such as a vehicle, it can solve the problem of signal distortion transmitted to the transportation device, safely protect the semiconductor chip controlling the transportation device from external sources, and solve the problem of leakage current or electrical short circuit between terminals, or electrical open of the terminal supplying the semiconductor chip, thereby further improving the stability of the transportation device. Accordingly, the transportation device and the circuit board to which the present invention is applied can achieve functional integration or technical interoperability with each other.

Claims

1. Core layer; A first build-up layer disposed on one surface of the core layer; A second build-up layer disposed on the other surface of the core layer; A pattern portion arranged on the first build-up layer or the second build-up layer; and Including a magnetic material arranged to overlap with the pattern portion in a vertical direction in the first build-up layer or the second build-up layer, The core layer includes a first via hole and a second via hole that overlap in a horizontal direction, and a first surface and a second surface having both ends connected to the first via hole and the second via hole, A circuit board in which the pattern portion, the magnetic body, the first surface, and the second surface overlap in a vertical direction.

2. In paragraph 1, The above core layer is a circuit board made of glass.

3. In paragraph 1, The above magnetic material is arranged on the first build-up layer, The above pattern portion is a circuit board arranged on the second build-up layer.

4. In paragraph 1, The first build-up layer includes a first insulating layer and a second insulating layer arranged in a vertical direction, The above pattern portion is disposed between the first insulating layer and the second insulating layer, A circuit board in which the magnetic body is placed on the upper surface of the second insulating layer.

5. In paragraph 4, The above pattern portion includes a plurality of metal lines spaced apart in a horizontal direction and wires connecting the plurality of metal lines, A circuit board in which the second insulating layer includes a cavity through which the wire penetrates.

6. In paragraph 5, Including a protective layer disposed on the first build-up layer, The protective layer is a circuit board including a through hole in which the wire and the magnetic material are arranged.

7. In paragraph 6, A circuit board including a molding part disposed within the above through hole and in which the magnetic body and the wire are embedded.

8. In paragraph 7, A circuit board in which the upper surface of the molding portion is positioned higher than the upper surface of the protective layer.

9. In paragraph 1, A circuit board in which the first via hole and the second via hole each include an upper region whose width gradually decreases toward the second build-up layer, and a lower region disposed below the upper region and whose width gradually increases toward the second build-up layer.

10. In paragraph 1, The second build-up layer includes a third insulating layer and a fourth insulating layer arranged in a vertical direction, The above pattern portion is disposed between the third insulating layer and the fourth insulating layer, A circuit board in which the magnetic body is arranged on the first surface.

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