Optical module

Abstract

Disclosed in the present utility model is an optical module, comprising: a first housing; a second housing; a circuit board; an electronic element; a photoelectric element; and a heat sink; the first housing and the second housing are connectedly fixed to one another, and a cavity for accommodating the circuit board, the electronic element, and the photoelectric element is formed between the first housing and the second housing; the heat sink is fixed to the first housing, a first protruding block is formed on the heat sink, the first housing is provided with an opening, the first protruding block passes through the opening and is accommodated in the cavity, and at least portions of the electronic element and the photoelectric element are heat conductingly connected to the first protruding block. In the optical module provided in the present application, heat generated by the electronic element and the photoelectric element is directly transferred, by means of the first protruding block, to a heat dissipation structure for heat dissipation, thereby eliminating an interface between the heat sink and the heat-generating elements, and improving the heat dissipation effect.

Description

Optical module

[0001] The present application claims priority to the Chinese patent application No. 202421950815.1, filed on August 13, 2024, and entitled "Optical module", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The utility model relates to optical communication technical field, especially optical module. BACKGROUND

[0003] With the continuous iteration and upgrading of optical communication technology, the speed of optical communication products is continuously improved, and high speed will bring power consumption and heat dissipation problems. In addition to solving the problem of heat dissipation through the core material of the chip, the structure can also solve the problem of heat dissipation.

[0004] In the conventional technology, the traditional optical module relies on a metal shell to conduct the heat of the internal chip to the system heat sink, and the heat is dissipated through the system heat sink. Limited by the preparation process and use scene, the shell is generally a die-cast zinc alloy, which has poor thermal conductivity. It is difficult to use high thermal conductivity aluminum alloy to prepare a complex shell. Similarly, other high thermal conductivity materials are not only difficult to prepare, but also have too high density, which will cause the weight of the entire product to exceed the standard. SUMMARY

[0005] The utility model aims at providing an optical module to solve the technical problem of poor heat dissipation performance of the heat sink of the conventional optical module.

[0006] To achieve the above-mentioned purpose, the utility model provides an optical module, which comprises a first shell, a second shell, a circuit board, electronic components, optoelectronic components and a heat sink.

[0007] The first shell and the second shell are connected and fixed together, and a cavity for accommodating the circuit board, electronic components and optoelectronic components is formed between the first shell and the second shell.

[0008] The heat sink is fixed on the first shell, a first protrusion is formed on the heat sink, the first shell has an opening, the first protrusion is accommodated in the cavity through the opening, and at least part of the electronic components and optoelectronic components are in thermal conductive connection with the first protrusion.

[0009] Further, the heat sink comprises a bearing structure and a heat dissipation structure arranged on the bearing structure, the bearing structure has opposite first and second surfaces, the heat dissipation structure is arranged on the first surface, the first protrusion is located on the second surface and protrudes from the second surface, and the second surface is connected with the first shell.

[0010] Further, the bearing structure comprises a protruding ring screw hole; the first shell further comprises a fixing hole and a bolt, the fixing hole corresponds to the protruding ring screw hole, and the bolt is connected to the protruding ring screw hole through the fixing hole, so that the bearing structure is fixedly connected to the first shell.

[0011] Further, the outer edge of the protruding ring screw hole protrudes from the second surface, and the inner hole of the protruding ring screw hole is a blind hole.

[0012] Further, the first shell comprises opposite third and fourth surfaces, the third surface is attached to the second surface, and the fourth surface faces the second shell.

[0013] The fixing hole on the first shell is a stepped hole, the protruding ring screw hole is at least partially arranged in the fixing hole, and the bolt and the inner hole of the protruding ring screw hole are connected to tightly attach the third surface to the second surface.

[0014] Further, the first shell has a thickness direction along the connecting direction of the third and fourth surfaces; the third surface of the first shell is provided with a first groove matched with the bearing structure; in the thickness direction, the groove bottom of the first groove is lower than the second surface; an electromagnetic shielding medium or a sealing medium is arranged between the first groove and the bearing structure to realize the sealed connection of the heat sink and the first shell through the electromagnetic shielding medium or the sealing medium.

[0015] Further, the fourth surface is provided with a second groove surrounding the opening; in the thickness direction, the groove bottom of the second groove is lower than the fourth surface.

[0016] An electromagnetic shielding medium or a sealing medium is arranged between the second groove and the first protrusion to realize the sealed connection of the heat sink and the first shell through the electromagnetic shielding medium or the sealing medium.

[0017] Further, the first shell has a length direction consistent with the longitudinal direction of the first shell and a width direction perpendicular to the length direction.

[0018] The heat dissipation structure comprises a plurality of heat dissipation fins and a cover plate, the heat dissipation fins are located on one side surface of the cover plate and extend on the cover plate along the length direction; in the width direction, the plurality of heat dissipation fins are arranged at intervals, and adjacent two heat dissipation fins form a heat dissipation channel with the cover plate.

[0019] Further, the first shell has a length direction consistent with the longitudinal direction of the first shell.

[0020] The first protrusion is arranged close to the center position of the third surface.

[0021] The convex ring screw hole is located on both sides of the first convex block in the length direction.

[0022] Further, the first convex block comprises a plurality of first convex blocks which are arranged at intervals along the length direction.

[0023] Further, at least one second convex block protruding from the first convex block is further formed on the first convex block, and at least part of the electronic elements and optoelectronic elements are in heat-conducting connection with the second convex block.

[0024] Further, the optical module further comprises a heat dissipation block for heat-conducting connection with at least part of the electronic elements and optoelectronic elements.

[0025] The first convex block further has an abutting structure for abutting with the heat dissipation block.

[0026] Further, the abutting structure is a groove with an inclined surface, the inclined surface abuts with the heat dissipation block, and an adhesive medium is filled between the inclined surface and the heat dissipation block.

[0027] Through one of the above embodiments or multiple embodiments in the utility model, at least the following technical effects can be achieved: the optical module provided by the application is in heat-conducting connection with at least part of the electronic elements and optoelectronic elements through the first convex block on the heat dissipation device. The first convex block is accommodated in the cavity through the opening, and heat is directly transmitted to the heat dissipation structure through the first convex block for heat dissipation, without the need of transmitting heat to the heat dissipation structure through the first shell, so that the interface between the heat dissipation device and the heating elements is reduced, and the heat dissipation effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] The technical scheme and other beneficial effects of the application will be apparent through the following detailed description of the specific embodiments of the application in combination with the drawings.

[0029] Fig. 1 is a structural schematic diagram of an optical module provided by an embodiment of the application;

[0030] Fig. 2 is an exploded schematic diagram of Fig. 1;

[0031] Fig. 3 is a schematic diagram of a perspective structure of a heat dissipation device provided by an embodiment of the application;

[0032] Fig. 4 is a schematic diagram of a perspective structure of a heat dissipation device provided by an embodiment of the application;

[0033] Fig. 5 is a schematic diagram of a structure of a heat dissipation device provided by an embodiment of the application;

[0034] Fig. 6 is a schematic diagram of a structure of a first shell from a third surface provided by an embodiment of the application;

[0035] Fig. 7 is a structural schematic view of the first shell from a fourth surface and a structural schematic view of the heat sink from a second surface according to an embodiment of the present application.

[0036] The components in the drawings are identified as follows:

[0037] 10, first shell; 20, second shell; 30, heat sink; 40, circuit board; 50, optoelectronic element; 60, electronic element; 101, third surface; 102, fourth surface; 103, opening; 104, first recess; 105, second recess; 106, fixing hole; 107, bolt; 300, bearing structure; 301, first surface; 302, second surface; 303, first protrusion; 304, second protrusion; 305, protruding ring screw hole; 306, abutting structure; 307, heat dissipation structure; 3071, heat dissipation fin; 3072, cover plate. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative work fall within the scope of protection of the present application.

[0039] A kind of optical module provided by the present application will be described below in conjunction with the drawings.

[0040] Referring to Figs. 1-7, the present application provides an optical module. The optical module includes a first shell 10, a second shell 20, a heat sink 30, and a circuit board 40, an optoelectronic element 50 and an electronic element 60 disposed in the cavity enclosed by the first shell 10 and the second shell 20.

[0041] Specifically, when the first shell 10 and the second shell 20 are fixedly connected together, a cavity is formed inside, which can be used to place the circuit board 40, the optoelectronic element 50, the electronic element 60, etc.

[0042] The heat sink 30 is fixed on the first shell 10 from outside the cavity, the heat sink 30 has a first protrusion 303 formed thereon, the first shell 10 has an opening 103, the first protrusion 303 is accommodated in the cavity through the opening 103, and at least part of the electronic element 60 and the optoelectronic element 50 are in thermal conductive connection with the first protrusion 303. In other embodiments, the heat sink 30 can also be fixed on the first shell 10 from inside the cavity.

[0043] The distance between the first housing 10 and the circuit board 40, the photoelectric element 50 and the electronic element 60 is smaller than the distance between the second housing 20 and the circuit board 40, the photoelectric element 50 and the electronic element 60, so as to facilitate the heat conduction connection between the photoelectric element 50 or the electronic element 60 and the first housing 10. For the convenience of description, the photoelectric element 50 or the electronic element 60 which is in heat conduction connection with the first housing 10 will be collectively referred to as a heat generating element hereinafter. Since the first housing 10 and the heat sink 30 are fixed together, the first housing 10 is a more major heat dissipation surface than the second housing 20. The heat generated by the heat generating element is conducted from the inside to the outside through the heat sink 30 fixed to the first housing 10, so as to be dissipated.

[0044] For the convenience of description, it is defined that the first housing 10 has a length direction X consistent with the longitudinal direction of the first housing 10, a width direction Y perpendicular to the length direction, and a thickness direction Z along the direction connecting the third surface 101 and the fourth surface 102. The heat sink 30 includes a bearing structure 300 and a heat dissipation structure 307 provided on the bearing structure 300. The bearing structure 300 has opposite first and second surfaces 301 and 302. The heat dissipation structure 307 is provided on the first surface 301. The first protrusion 303 is located on the second surface 302 and protrudes from the second surface 302, and the second surface 302 is connected to the first housing 10. In this embodiment, the first protrusion 303 on the second surface 302 passes through the opening 103, directly conducts the heat generated by the heat generating element to the heat dissipation structure 307 of the first surface 301, and the heat generated by the heat generating element does not need to be transmitted through the first housing 10, thereby reducing the interface between the heat sink 30 and the heat generating element and improving the heat dissipation effect. A heat dissipation paste or pad can be provided between the heat generating element and the first protrusion 303 to absorb tolerances and enhance heat dissipation.

[0045] The first protrusion 303 can be a structure capable of covering the area where all the heat generating elements are located, and the orthographic projection of the first protrusion 303 in the thickness direction Z can be close to the center position of the third surface 101, so that one first protrusion 303 can be in thermal conductive connection with at least part of the heat generating elements. A plurality of first protrusions 303 can also be provided according to the positions of the heat generating elements for the consideration of limited internal space of the cavity. For example, the electronic element 60 and the optoelectronic element 50 are in thermal conductive connection with the same first protrusion 303, or the electronic element 60 and the optoelectronic element 50 are in thermal conductive connection with one first protrusion 303 respectively. In the embodiment, two first protrusions 303 are provided on the second surface 302 according to the positions of the heat generating elements in the cavity. In other embodiments of the present application, when a plurality of first protrusions 303 are provided, the plurality of first protrusions 303 are arranged at intervals along the length direction X, and the openings 103 corresponding to the first protrusions 303 are also arranged at intervals along the length direction X. It should be noted that the orthographic projection of the first protrusion 303 in the thickness direction Z can coincide with the area where the heat generating elements are located, which can be partially coincident or completely coincident.

[0046] The heat dissipation structure 307 includes a plurality of heat dissipation fins 3071 and a cover plate 3072. The heat dissipation fins 3071 are located on one side surface of the cover plate 3072 and extend on the cover plate 3072 along the length direction X. The plurality of heat dissipation fins 3071 are arranged at intervals along the width direction Y. Adjacent two heat dissipation fins 3071 and the cover plate 3072 together form a heat dissipation channel. The light module dissipates the heat conducted by the first protrusion 303 through the heat dissipation structure 307. The heat dissipation structure 307 and the bearing structure 300 can be integrally formed, or can be separately manufactured and then assembled together. In the embodiment, the heat dissipation structure 307 is in the form of a combination of the heat dissipation fins 3071 and the cover plate 3072. In other embodiments, the heat dissipation structure 307 can be only the longitudinal heat dissipation fins 3071 or the heat dissipation columns, heat dissipation plates, etc. formed on the bearing structure 300. It should be noted that the heat dissipation structure 307 can also be removed, and only the bearing structure 300 is used for heat dissipation.

[0047] In some embodiments of the present application, the second surface 302 further has a boss screw hole 305. The outer edge of the boss screw hole 305 protrudes from the second surface 302, but the inner hole of the boss screw hole 305 does not penetrate to the first surface 301, that is, the inner hole of the boss screw hole 305 is a blind hole. In this way, the part between the first surface 301 and the second surface 302 of the bearing structure 300 can form a screw hole for fixing without being particularly thick, and the bearing structure 300 can be well fitted with the first shell 10, reducing or even eliminating the gap between the two. Accordingly, the first shell 10 has a fixing hole 106 and a bolt 107. In the thickness direction Z, the center position of the fixing hole 106 coincides with the center position of the boss screw hole 305. The fixing hole 106 is a stepped hole. The boss screw hole 305 is at least partially disposed in the fixing hole 106.

[0048] Further, the bolt 107 is threadedly connected through the fixing hole 106 and the inner hole of the boss screw hole 305. The bolt 107, the fixing hole 106, and the boss screw hole 305 achieve fixed connection between the first shell 10 and the heat sink 30. In addition, the boss screw hole 305 can also be in thermal conductive connection with the heat generating element, further improving the heat dissipation effect. The boss screw hole 305 can be directly attached to the heat generating element through a heat dissipation pad, thereby ensuring good heat dissipation. The bolt 107, the fixing hole 106, and the boss screw hole 305 can be provided in multiple groups, further improving the sealing, fixing effect, and also improving the heat dissipation effect. In the length direction X, multiple boss screw holes 305 are located on both sides of the first protrusion 303, and multiple fixing holes 106 are located on both sides of the opening 103.

[0049] In some embodiments of the present application, the first shell 10 includes opposite third and fourth surfaces 101 and 102. The third surface 101 is attached to the second surface 302, and the fourth surface 102 faces the second shell 20 (in other embodiments, when the heat sink 30 is fixed on the first shell 10 from the cavity, the fourth surface is attached to the first surface, and the positions of the boss screw hole and the fixing hole are adjusted accordingly.). The third surface 101 has a first recess 104 adapted to the edge of the bearing structure 300, and the first recess 104 surrounds the opening 103 and the fixing hole 106. The first recess 104 is an annular groove, and in the thickness direction, the groove bottom of the first recess 104 is slightly lower than the third surface 101, and the orthographic projection position of the edge of the bearing structure 300 corresponds to the groove bottom position of the first recess 104. The side wall of the first recess 104 is formed by the side wall of the first shell 10. An electromagnetic shielding medium or a sealing medium is arranged between the first recess 104 and the bearing structure 300, so as to achieve sealed connection between the heat sink 30 and the first shell 10 through the electromagnetic shielding medium or the sealing medium.

[0050] The fourth surface 102 has a second groove 105 around the opening 103. The second groove 105 is a stepped surface, in the thickness direction, the groove bottom of the second groove 105 is slightly lower than the fourth surface 102, and the sidewall of the second groove 105 is composed of the sidewall of the first shell 10 and the sidewall of the first bump 303. An electromagnetic shielding medium or a sealing medium is arranged between the second groove 105 and the first bump 303, so as to realize the sealed connection between the heat sink 30 and the first shell 10 through the electromagnetic shielding medium or the sealing medium.

[0051] The first groove 104 and the second groove 105 in the optical module provided by the embodiment of the present application are used for accommodating an electromagnetic shielding medium or a sealing medium, so as to realize the double sealing between the heat sink 30 and the first shell 10 through the electromagnetic shielding medium or the sealing medium, and avoid the problem of poor sealing caused by assembly error. In addition, the electromagnetic shielding medium can not only realize sealing, but also provide electromagnetic shielding for the optical module.

[0052] Specifically, the size and position of the first groove 104 are matched with the size and position of the bearing structure 300, the electromagnetic shielding medium or the sealing medium is coated in the first groove 104, and the sealed connection between the third surface 101 and the second surface 302 is realized. The second groove 105 is arranged at the edge of the opening 103, the electromagnetic shielding medium or the sealing medium is coated in the second groove 105, and the sealing is realized.

[0053] In some other embodiments of the present application, at least one second bump 304 is further formed on the first bump 303 along the thickness direction Z. At least part of the electronic elements 60 and the optoelectronic elements 50 are in heat conduction connection with the second bump 304. The distance between the second bump 304 and the heat generating element is smaller than the distance between the first bump 303 and the heat generating element, and the heat dissipation effect is further improved.

[0054] In some embodiments of the present application, the material of the heat sink 30 is one of aluminum alloy or copper alloy. The material of the first shell 10 is one of zinc alloy, copper alloy or aluminum alloy. The material of the heat sink 30 and the material of the first shell 10 can be the same or different, and the present application does not limit this.

[0055] In order to avoid the problem of overweight of the optical module, the material of the first shell 10 can be zinc alloy with relatively low thermal conductivity, and the material of the heat sink 30 can be magnesium aluminum alloy with relatively high thermal conductivity, or other materials.

[0056] In some other embodiments of the present application, a heat dissipation block is further arranged between the heat dissipation device 30 and the heat generating element. Correspondingly, the first protrusion 303 of the heat dissipation device 30 is further provided with an abutting structure 306. The abutting structure 306 is in heat conduction connection with the heat dissipation block, so that the heat dissipation block is in heat conduction connection with the heat generating element. The heat dissipation block is arranged separately from the heat dissipation device 30, which increases the flexibility of the design.

[0057] The heat dissipation block can be made of a material with a higher heat conductivity coefficient, and the size, number and position of the heat dissipation block are determined according to the size, number and position of the optoelectronic component. The heat dissipation is achieved by the heat dissipation block and the heat dissipation device 30.

[0058] The abutting structure 306 can be a groove or a protrusion. The abutting structure 306 is a groove with an inclined surface, and the groove wall of the groove is a plurality of inclined surfaces with a certain angle with the second surface 302. When the abutting structure 306 is connected with the heat dissipation block, the inclined surface and the heat dissipation block are filled with an adhesive medium, which fixes the two together. The adhesive medium can be a structural adhesive or a sealant. The abutting structure 306 is used to fix the heat dissipation block to avoid displacement and looseness of the heat dissipation block during application, and to improve the stability of the heat conduction connection between the heat dissipation block and the heat generating element.

[0059] In addition, the abutting structure 306 can also be a trapezoidal or triangular protrusion with an inclined surface. The inclined surface faces the heat dissipation block and abuts against the heat dissipation block, and the heat dissipation block is fixed by filling an adhesive medium between the inclined surface and the heat dissipation block.

[0060] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0061] The above describes in detail the optical module provided by the embodiments of the present application. The principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the technical solutions and the core ideas of the present application; those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module characterized by comprising: The application relates to a heat dissipation device, which comprises a first shell, a second shell, a circuit board, electronic components, photoelectric components and a heat dissipation device. The first shell and the second shell are fixedly connected together, and a cavity for accommodating the circuit board, the electronic components and the photoelectric components is formed between the first shell and the second shell. The heat dissipation device is fixed on the first shell, a first protrusion is formed on the heat dissipation device, the first shell is provided with an opening, the first protrusion is accommodated in the cavity through the opening, and at least part of the electronic components and the photoelectric components are in heat conduction connection with the first protrusion.

2. The optical module of claim 1, wherein, The heat dissipation device comprises a bearing structure and a heat dissipation structure arranged on the bearing structure, the bearing structure is provided with opposite first and second surfaces, the heat dissipation structure is arranged on the first surface, the first protrusion is located on the second surface and protrudes from the second surface, and the second surface is in close connection with the first shell.

3. The optical module of claim 2, wherein, The bearing structure comprises a protruding ring screw hole; the first shell is further provided with a fixing hole and a bolt, the fixing hole corresponds to the protruding ring screw hole, and the bolt is connected with the protruding ring screw hole through the fixing hole, so that the bearing structure is fixedly connected with the first shell.

4. The optical module of claim 3, wherein, The outer edge of the protruding ring screw hole protrudes from the second surface, and the inner hole of the protruding ring screw hole is a blind hole.

5. The optical module of claim 4, wherein, The first shell comprises opposite third and fourth surfaces, the third surface is in close contact with the second surface, and the fourth surface faces the second shell; The fixing hole in the first shell is a stepped hole, the protruding ring screw hole is at least partially arranged in the fixing hole, and the bolt and the inner hole of the protruding ring screw hole are connected to make the third surface closely contact with the second surface.

6. The optical module of claim 5, wherein, The first shell has a thickness direction along the connecting direction of the third and fourth surfaces; a first groove matched with the bearing structure is arranged on the third surface of the first shell; in the thickness direction, the groove bottom of the first groove is lower than the second surface; an electromagnetic shielding medium or a sealing medium is arranged between the first groove and the bearing structure, so that the heat dissipation device is sealingly connected with the first shell through the electromagnetic shielding medium or the sealing medium.

7. The optical module according to claim 5 or 6, wherein A second groove surrounding the opening is arranged on the fourth surface; in the thickness direction, the groove bottom of the second groove is lower than the fourth surface; An electromagnetic shielding medium or a sealing medium is arranged between the second groove and the first protrusion, so that the heat dissipation device is sealingly connected with the first shell through the electromagnetic shielding medium or the sealing medium.

8. The optical module of claim 2, wherein, The first shell has a length direction consistent with the longitudinal direction of the first shell and a width direction perpendicular to the length direction; The heat dissipation structure comprises a plurality of heat dissipation fins and a cover plate, the heat dissipation fins are located on one side surface of the cover plate and extend on the cover plate along the length direction; in the width direction, the plurality of heat dissipation fins are arranged at intervals, and adjacent two heat dissipation fins and the cover plate form a heat dissipation channel.

9. The optical module of claim 5, wherein, The first shell has a length direction consistent with the longitudinal direction of the first shell; The first protrusion is arranged close to the center position of the third surface; The convex ring screw hole is located on both sides of the first convex block in the length direction.

10. The optical module of claim 9, wherein, The first convex block comprises a plurality of first convex blocks which are arranged at intervals along the length direction.

11. The optical module of claim 1, wherein, At least one second convex block protruding from the first convex block is further formed on the first convex block, and at least part of the electronic elements and optoelectronic elements are in heat-conducting connection with the second convex block.

12. The optical module of claim 1, wherein, The optical module further comprises a heat dissipation block for heat-conducting connection with at least part of the electronic elements and optoelectronic elements. The first convex block further has an abutting structure for abutting with the heat dissipation block.

13. The optical module of claim 12, wherein, The abutting structure is a groove with an inclined surface, the inclined surface abuts with the heat dissipation block, and an adhesive medium is filled between the inclined surface and the heat dissipation block.

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