Heat-conducting system

Abstract

The invention relates to a heat-conducting system for dissipating heat from electrical components subject to power loss. Furthermore, the invention relates to a power semiconductor unit and a power converter comprising such a heat-conducting system. The heat-conducting system has a heat-absorbing portion (12) provided for thermally conductive connection to an electrical component (2) from which heat is to be dissipated, a heat-emitting portion (14) having surface area-enlarging means, and a heat-transfer portion (13) between the heat-absorbing portion (12) and the heat-emitting portion (14). The heat-conducting system (1) is designed for operation of a two-phase cooling facility.

Description

[0001] 202411933 Foreign version Fair copy

[0002] 1

[0003] thermal conductivity system

[0004] The invention relates to a thermal conductivity system for dissipating heat from electrically dissipated components. Furthermore, the invention relates to a power semiconductor unit and a power converter incorporating such a thermal conductivity system.

[0005] State of the art

[0006] The performance and lifespan of electronic components, especially power electronic components such as MOSFETs and IGBTs, as well as the performance and lifespan of electrical machines such as motors and electric motors, or catalysts in which chemical processes take place, depend significantly on their heat dissipation and the temperatures to which they are exposed. The heat flow from the heat source to the cooler often has to be conducted across various barriers such as base plates, substrates, and thermal interface materials. Besides cooling effectiveness, cooling efficiency also plays a crucial role. The time required for the necessary heat dissipation determines the cooling method. Currently, high heat flows are generally handled by liquid cooling, while low heat flows can still be adequately dissipated by air cooling.

[0007] However, implementing cooling is very complex depending on the application. Effective cooling in electronic components, especially in power electronics, currently requires the use of expensive thermally conductive ceramics such as aluminum nitride as insulating layers. The use of complex heat sinks and the incorporation of heat spreader plates affect the component size and the manufacturing process. This leads to high costs due to the multitude of different components and materials. In particular, the use of expensive metals, especially copper, in large quantities, and the manufacturing processes themselves increase the technical complexity and costs.

[0008] It is known that thermal conductivity systems are used to transfer heat from the component to the actual heat sink, or to improve heat distribution or dynamic thermal behavior. Thermal conductivity systems are frequently used in confined spaces to ensure greater compactness of assemblies and / or specific arrangements of the components to be cooled.

[0009] Due to the structural requirements for air cooling, double-sided cooling of electrical components is usually difficult to implement in practice. Heat sinks, as described in 202411933 Foreign Version Fair Copy

[0010] 2

[0011] Air cooling systems currently do not offer sufficient performance to efficiently dissipate the generated heat. Furthermore, structural and technical challenges, such as thermal resistance, have not yet been adequately addressed, further impairing cooling efficiency.

[0012] Common heat transfer systems include, in particular, heat pipes. The term "heat pipes" encompasses so-called heat pipes, especially pulsating heat pipes, but also two-phase thermosiphons. Alternative heat transfer systems can include vapor chambers. These types of heat transfer systems are also typically flanged to a heat sink. To increase efficiency, expensive copper pipes are currently the preferred material.

[0013] Consequently, it is technically necessary to propose an improved solution that avoids the disadvantages known from the prior art. In particular, the proposed solution should enable efficient and structurally flexible heat dissipation from power-losing electrical components.

[0014] The problem directed to a cooling device is solved by the features of independent claim 1. Furthermore, the problem directed to an electrical component and an electrical part is solved by the features of claims 13 and 14. Claim 15 also specifies a manufacturing method for a cooling device. Advantages and embodiments of the invention, which can be used individually or in combination, are the subject of the dependent claims. The dependent claims list further advantageous measures that can be combined arbitrarily to achieve further advantages.

[0015] Description of the invention

[0016] The heat conduction system according to the invention comprises at least one heat absorption section, which is provided for a thermally conductive connection to an electrical component to be cooled, at least one heat emission section, which has at least one surface area-enlarging means, and at least one heat transport section between the heat absorption section and the heat emission section, wherein the heat conduction system is configured for operation of a two-phase cooling system by providing a continuous hydraulic connection between the at least one heat emission section, the at least one heat transport section, and the at least one heat absorption section. 202411933 Foreign version Fair copy

[0017] 3

[0018] The heat conduction system according to the invention thus achieves a decoupling of the heat source and the heat sink. This decoupling advantageously allows heat absorption at the location to be cooled to be achieved efficiently and with reduced installation dimensions, while simultaneously enabling efficient heat dissipation to the environment, virtually independent of structural dimensional limitations.

[0019] The design of the heat transfer system with a continuous hydraulic connection for operating a two-phase cooling system offers several advantages, including the following: Unlike single-phase cooling systems, which use a refrigerant, whether gaseous or liquid (e.g., air or water), to dissipate heat through simple conduction and convection, two-phase cooling utilizes the phase change of a refrigerant from liquid to gaseous and vice versa to transport heat. The refrigerant begins in a liquid state. It absorbs heat from a heat source. In this context, a heat source could be, for example, an electrical component, an electronic component, particularly a power semiconductor module, or a processor. Upon absorbing the heat, the refrigerant reaches its boiling point and begins to evaporate.This phase change from liquid to gaseous requires a considerable amount of energy, the enthalpy of vaporization, which means that large amounts of heat can be efficiently transferred to the heat absorption section of the heat transfer system. The gaseous coolant is then passed to a condenser, where it releases the absorbed heat to the surroundings. This heat transfer process is preferably assisted by at least one surface-enhancing agent or a fan. The coolant cools down and condenses back into a liquid before being returned to the cycle to restart the process. In particular, the heat transfer system according to the invention contains a cooling medium that is partially gaseous and partially liquid.

[0020] This phase change allows two-phase cooling to dissipate more heat per unit volume of coolant than conventional single-phase systems. This makes the method particularly effective for applications requiring high heat dissipation, such as in electrical components, especially in power electronics. Furthermore, this form of cooling has the advantage of being passive, meaning the process can operate without pumps or moving parts, which increases reliability and reduces maintenance. And due to its high efficiency, very compact cooling systems can be implemented. 202411933 Foreign version Fair copy

[0021] 4

[0022] A surface-enlarging means can be a single thermally bonded fin or lamella, or a surface structure of a different shape, which, for example, is soldered onto the heat pipe or produced as a surface feature of the heat pipe using additive manufacturing. It can also be a thermally bonded heat sink. A surface-enlarging measure of the heat dissipation section can also be generated by the geometric shaping of the hydraulic section itself. The electrical component to be cooled is preferably a power electronic component, in particular a power module. A power module is, for example, an electronic assembly that integrates various power semiconductors such as IGBTs, MOSFETs, or diodes, and often additional components such as control and protection circuits, in a single package.IGBTs, or Insulated Gate Bipolar Transistors, are a type of power semiconductor device that combines the high input impedance and fast switching speed of a MOSFET with the high current and low saturation voltage capability of a bipolar transistor. MOSFETs are metal-oxide-semiconductor field-effect transistors characterized by high switching speeds and the ability to operate with very low input currents.

[0023] A power module is therefore an electronic component used to control and convert electrical energy in various applications.

[0024] Power modules are used in fields such as drive technology, renewable energies, power supplies, industrial plants, and electric vehicles. Integrating multiple components into a single module can increase efficiency, reduce space requirements, and improve reliability. Power modules are therefore essential components in power electronics.

[0025] The heat conduction system according to the invention comprises, in one embodiment, at least one further heat absorption section, which is provided for a thermally conductive connection to another electrical component to be cooled, with at least one further heat transport section between the further heat absorption section and the heat dissipation section. This has the advantage that the heat dissipation section only needs to be designed for a reduced temperature to be dissipated and does not need to be optimized for highly efficient heat dissipation. This advantageously results in material and space savings. Instead of being designed for twice the power, in the embodiment of the heat conduction system according to the invention with two components to be cooled, a design for lower temperatures is sufficient, in particular for a maximum of 60% of the combined power of the two components, or for a maximum of 70% of the combined power of the two.

[0026] 5

[0027] Components or for a maximum of 80% of the combined power of the two components. This can be advantageous for inverters with low output frequencies.

[0028] The thermal conductivity system according to the invention is configured in one embodiment as a vapor chamber. A vapor chamber is a cooling device frequently used in electronics and in applications where particularly efficient heat dissipation is required, and where conventional cooling methods such as simple thermal paste and heat sinks may not be sufficient. The vapor chamber utilizes the principles of phase change and thermal conduction to transport heat from a hot spot to a cooler spot.

[0029] A vapor chamber consists of a shallow, hermetically sealed chamber containing a small amount of a working fluid, such as water or alcohol, and a capillary structure, typically a wicking material. When heat is transferred to the vapor chamber at a point, for example, an electronic component, the working fluid at that point evaporates. The evaporation process absorbs heat, causing the heated component to cool. The resulting vapor spreads rapidly within the chamber, moving towards cooler areas. In these cooler areas, the vapor condenses back into a liquid, releasing the absorbed heat, for example, to a heat sink. The condensed liquid is then transported back to the hotter areas of the chamber by capillary action or gravity, where the cycle begins anew.Vapor chambers are therefore particularly efficient because they can distribute heat quickly and evenly over a large area.

[0030] Alternatively, the heat transfer system according to the invention is designed as a two-phase thermosiphon. A two-phase thermosiphon is a thermal management system that also utilizes the phase changes from liquid to vapor and back to liquid to efficiently transport and dissipate heat, thus utilizing the latent heat transferred during phase changes. The two-phase thermosiphon has liquid and vapor channels as connecting elements between the evaporator and condenser, through which the liquid and vapor circulate between the evaporator and condenser. A liquid with a suitable boiling point is used as the working medium.

[0031] The two-phase thermosiphon is primarily used in electronics cooling, especially in computers for cooling processors, but also in solar thermal energy, in solar collectors for more efficient heat transfer.

[0032] In the embodiments described above, the heat conduction system therefore comprises at least one pipe or channel with several capillaries, with a porous structure or 202411933 Foreign version Fair copy

[0033] 6

[0034] Capillary structure. Due to the guaranteed highly efficient heat dissipation, these designs are suitable for decoupling the heat source and heat sink. Relatively long distances, in particular heat transport sections of approximately 1 m, can be achieved.

[0035] In a particularly advantageous embodiment of the invention, the heat conduction system comprises a heat pipe or is designed as a heat pipe. It is particularly preferred that it comprises a pulsating heat pipe or is designed as a pulsating heat pipe.

[0036] In the operation of a pulsating heat pipe (PHP), also known as an oscillating heat pipe, a porous structure is not required. The inside of the pipe can also be smooth. In a pulsating heat pipe, heat transfer also occurs via a fluid, with some of the fluid present in gaseous form within the pipe. Due to the heat input, the fluid in the pipe begins to move back and forth. This pulsation gives the heat pipe its name. The return flow of the fluid to the heat source, where the cooling effect occurs through evaporation, is achieved through alternating boiling and condensation processes, aided by the geometry of the pipe that forms the channel. The dimensions, especially the cross-section of the channel, are chosen so that the effect of gravity is less than the surface tension, allowing the fluid to spread within the channel even against gravity.In other words, the geometry is designed in such a way that the effect of surface tension dominates over gravity. Therefore, a porous structure is no longer required for the pulsating heat pipe; instead, capillary action takes effect due to the geometry itself.

[0037] In particular, the internal cross-section of a PHP (heat transfer membrane) exhibits a minimal expansion in the range of 0.5 mm to 5 mm. This has the advantage, among others, that the shape of the PHP can be adjusted without damaging or interrupting a capillary or porous structure. The flexibility of the PHP allows for even better or further decoupling of the heat source from the heat sink. For example, several PHP channels can be formed in an extruded profile, as is known, for instance, from WO 2022 / 128474 A1.

[0038] The use of a heat pump, when appropriately designed, can be particularly advantageous not only for heat dissipation but also for homogenizing the temperature of different modules. This makes it easier, for example, to connect certain types of semiconductor devices, such as bipolar transistors, in parallel.

[0039] All two-phase cooling systems have the advantage of being significantly lighter due to reduced material thickness through fluid-based, convective heat spreading instead of heat conduction. There is no need for wide, pressed heat sink fins. 202411933 Foreign version Fair copy

[0040] 7

[0041] This also results in advantageous material savings compared to conventional solutions. The reduction in required material and the lower weight therefore also reduce the carbon footprint.

[0042] In a further advantageous embodiment of the heat conduction system according to the invention, the heat transport section has a minimum length of 0.1 m, 0.5 m or 1 m. In particular, the heat transport section has a minimum length of 0.2 m, 0.3 m, 0.4 m, 0.6 m, 0.7 m, 0.8 m, or 0.9 m.

[0043] With a minimum heat transfer section length of 0.1 m or 0.2 m, heat conduction systems for the vertical integration of assemblies can be preferably implemented, ensuring effective heat dissipation without increasing the assembly's overall height. With a minimum length of 0.3 m, 0.4 m, or 0.5 m, heat conduction systems can be implemented, in particular, for dissipating heat from a large number of electronic components, especially those in complex arrangements. With a minimum heat transfer section length of 0.6 m, 0.7 m, 0.8 m, 0.9 m, or 1 m, heat conduction systems can be implemented for dissipating heat from a large number of electronic components on both sides of the components, or for dissipating heat from larger components such as coil windings. Furthermore, applications are conceivable for heat dissipation from control cabinets or drive systems.

[0044] The minimum length therefore has a beneficial effect with regard to various applications, especially vertical integration. It ensures local decoupling of the heat source and heat sink. The proposed minimum lengths of the heat transfer sections can be achieved particularly effectively using a pulsating heat pipe. Being able to bridge large distances between the heat source and sink opens up new design freedoms and very simple and cost-effective implementations of multi-sided air cooling, as well as the simultaneous heat dissipation of multiple electronic modules.

[0045] In a further advantageous embodiment of the heat conduction system according to the invention, the at least one heat absorption section, the heat transport section, and the heat emission section are designed without joints. And in a particularly advantageous embodiment of the invention, the heat conduction system according to the invention is designed in an elongated shape, wherein the heat absorption section, heat transport section, and heat emission section are arranged along this elongated shape and merge seamlessly, in particular without joints. The heat conduction system is therefore preferably designed in a tube, strand, or channel form. For example, the heat conduction system can be implemented as extruded PHPs. Such suitable extruded profiles can be purchased as supplier components. 202411933 Foreign version Fair copy

[0046] 8

[0047] In a further advantageous embodiment of the heat conduction system with pulsating heat pipe described above, the heat transport section has at least one shape adaptation to the electrical system to be cooled. By eliminating porous or capillary structures, the heat conduction system now presented is particularly suitable for adaptation to component sizes and shapes by means of bends and steps. Commercially available extruded profiles are very suitable for this purpose. These can also be folded into a predefined shape fully automatically. In addition, the materials are preferably selected such that they are solderable, for example, especially for the thermal connection to the heat source, but also for the connection of, for example, cooling fins.

[0048] In a further advantageous embodiment of the heat conduction system described above according to the invention, the heat dissipation section is designed as a heat sink. This means that the heat dissipation section has a particularly large surface area. The increased surface area of ​​a heat sink enables effective heat dissipation to the ambient air. This occurs primarily through convection and thermal radiation and can be supported by additional fans. In advantageous applications, for example, a fan is used to increase the airflow over the heat sink and thus further improve heat dissipation, as the heated air is thereby removed more quickly and replaced by cooler air.

[0049] The efficiency of a heat sink depends on several factors, including the material, shape and size, air circulation, and the amount of heat that needs to be dissipated. In a particularly advantageous embodiment of the heat conduction system described above, with a heat sink design for the heat dissipation section, the heat sink has cooling fins. Cooling fins can also include cooling lamellae or fins, or other geometries that increase the surface area. Designing the heat dissipation section with cooling fins has the advantage, among others, of reducing the volume of the solid-to-air interface.

[0050] In a further particularly advantageous embodiment of the heat conduction system described above, with a heat sink design for the heat dissipation section, the heat dissipation section has curved, alternately curved, meandering, or U-shaped sections. Such heat sink shapes are known, for example, from WO 2022 / 128474 A1 for PHPs. (By 202411933 Foreign version Fair copy)

[0051] 9. By using these shapes, the length of the heat dissipation section is increased, thus improving heat dissipation to the environment.

[0052] Such shaped sections can be produced particularly advantageously using PHPs (heat transfer profiles). Extruded profiles are especially suitable as PHP base bodies. These can incorporate copper or be made entirely of copper for high-performance applications. For example, the heat transfer system can incorporate or be made of aluminum. This represents a more cost-effective option. It has been shown that seamless heat transfer systems made of aluminum extrusions exhibit up to five times higher thermal conductivity than solid copper. Furthermore, such extrusions can be manufactured fully automatically. Alternatively, other materials can be used, such as those suitable for additive manufacturing.

[0053] Preferably, all sections of the heat transfer system are made from the same material, for example, using an extruded profile as described above. In the heat-absorbing section, the heat transfer system is directly connected to the electronics and thermally bonded. The heat-conducting section then extends out of the electrical device. Finally, the heat-dissipating section simultaneously acts as a heat sink. This works with one heat source as well as with multiple heat sources. The proposed heat transfer system easily achieves heat transfer distances of over one meter.

[0054] The electrical component according to the invention is arranged with a thermal conductivity system according to one of the embodiments described above, wherein the electrical component is thermally connected to the thermal conductivity system. In particular, a power semiconductor module is provided as the electrical component.

[0055] The electrical component according to the invention therefore has the advantage of being efficiently cooled by means of the local decoupling of heat absorption from heat dissipation, while simultaneously requiring less installation. Heat dissipation to the environment can occur efficiently at virtually any location and even at multiple locations, and the electrical component can be integrated very flexibly with a minimized overall height.

[0056] The electrical device according to the invention, in particular a power converter, comprises a heat dissipation system according to one of the embodiments described above or an electrical component according to the invention. The electrical device according to the invention is in particular a power converter.

[0057] The electrical device according to the invention has the particular advantage of being cooled very efficiently by means of the local decoupling of heat absorption from heat dissipation, and can, for example, also have heat dissipation sections on multiple sides. 202411933 Foreign version Fair copy

[0058] 10

[0059] In the manufacturing process according to the invention for a heat conduction system according to one of the embodiments described above, a heat conductor, in particular an extruded profile, is folded into a shape corresponding to the external form of an electrical component to be cooled and / or an arrangement of at least one electrical component to be cooled. In particular, the extruded profile is free of joints.

[0060] Character description

[0061] The invention will now be described in more detail with reference to the embodiments illustrated in the figures. In the embodiments and figures, identical or similarly functioning elements may be designated with the same reference numerals. The depicted elements and their relative sizes are not necessarily to be considered as being to scale; rather, individual elements may be shown larger for clarity and / or better understanding.

[0062] Features, properties, and advantages of the present invention are explained in the following description with reference to the accompanying figures. These schematically illustrate:

[0063] Figure 1 shows an electronic module (2) mounted on a pulsating heat pipe (PHP) as a heat conduction system (1), which dissipates the heat from the electronic module (2) and simultaneously forms a heat sink (4),

[0064] Figure 2 shows a double-sided heat dissipation of an electronic module (2) using a folded PHP as a heat conduction system (1),

[0065] Figure 3 shows an arrangement of a folded heat conduction system (1) with several electronic modules (2),

[0066] Figure 4 shows a connection of a housed electronic module (2) and other components (25) to a PHP as a heat conduction system (1),

[0067] Figure 5 shows a PHP as a heat conduction system (1) adapted in its shape to the heights of the other components (25),

[0068] Figure 6 shows a connection of an enclosed electronic module (2) to a PHP in a device housing (62),

[0069] Figure 7 shows a connection of electronic modules (2) on both sides of a PHP as a heat conduction system (1),

[0070] Figure 8 shows an alternative design of a heat sink (4) by shaping the heat conduction system (1), 202411933 Foreign version Fair copy

[0071] 11

[0072] Figure 9 shows another alternative embodiment of a heat sink (4) by means of shaping the heat conduction system (1),

[0073] Figure 10 shows another embodiment of the heat conduction system (1) in combination with an electrical component (2),

[0074] Figure 11 shows another embodiment of the heat conduction system (1) in combination with an alternative electrical component (2),

[0075] Figure 12 shows an embodiment of the heat conduction system (1) in combination with an electrical component (2) in a device housing (62),

[0076] Figure 13 shows a thermal connection of non-planar outer surfaces of an electrical component (2), such as a choke winding, to a shape-adapted PHP as a heat conduction system (1),

[0077] Figure 14 shows a thermal connection of non-planar or parallel arranged power loss components (2),

[0078] Figure 15 shows another connection of non-planarly arranged electronic modules (2) to a freely designed PHP as a heat conduction system (1) and heat sink (4),

[0079] Figure 16 shows another double-sided connection of electronic modules (2) to a freely designed PHP as a heat conduction system (1) and heat sink (4),

[0080] Figure 17 shows an alternative double-sided connection of electronic modules (2) to a freely designed PHP as a thermal conductivity system (1) and heat sink (4), ...

[0081] Figure 18 shows a thermal connection of concentrically arranged electronic modules (2) to a freely designed PHP as a heat conduction system (1) and heat sink (4).

[0082] Although the invention has been further illustrated and described by means of preferred embodiments, the invention is not limited by the disclosed examples. Variations thereof can be derived by a person skilled in the art without departing from the scope of protection of the invention as defined by the claims.

[0083] All figures 1 to 14 show schematic side views of variants of the proposed heat conduction system 1.

[0084] Figure 1 shows an electrical component 2 to be cooled. This can be understood to be an electronic module 2, in particular a power module 2. In particular, the electrical component 2 shown in Figure 1 has a substrate 21, for example a printed circuit board 21, on which is an electrically conductive layer 22, for example a copper layer 22, and on which are arranged three electrical components 23, for example semiconductor chips 23. The substrate 21 is particularly suitable for thermal connection to the heat absorption section 12 of the thermal conductivity system 1, i.e. it is electrically

[0085] 12 insulating but with good thermal conductivity. Mechanical supports 6 for mounting the electronic module 2 on the heat conduction system 1 may also be provided.

[0086] The heat absorption section 12 is connected, in particular without joints, to the heat conduction section 13. This section can cover a heat conduction distance of over 1 m. The advantage of the particularly long heat transport section 13 is that the heat absorption at the heat source and the heat dissipation to the environment are spatially decoupled from each other.

[0087] Upon reaching the heat sink, particularly the ambient air, the heat dissipation section 14 follows, which is shown in Figure 1 as a heat sink 4 with cooling fins 41. The cooling fins 41 increase the surface area of ​​the heat sink 4 through which heat is dissipated to the environment. Heat dissipation can be further improved by a fan.

[0088] If the ratio of heating surface to condenser is large, additional heating elements can be provided. If the distance between the heating surface and the condenser is large, it can be advantageous to provide additional heating along the intermediate path to increase the temperature at the condenser. If the temperature difference between the hot and cold sides is too great, the flow is no longer efficient.

[0089] Figure 2 shows a double-sided heat dissipation system for an electronic module 2 using a folded PHP as a heat conduction system 1. The electronic module 2 consists of two opposing substrates 21, each with an electrically conductive coating 22 and various components 23. The substrates 21 form the top and bottom surfaces of the electronic module 2 and are both thermally connected to the same heat conduction system 1. This system therefore has two heat absorption sections 12. A heat transport section 13 connects to each of the heat absorption sections 12. Both heat transport sections 13 connect to the heat dissipation section 14 on both sides. This section is designed as a heat sink 4 with cooling fins 41. Figure 2 also shows that the heat conduction system 1 is foldable. The heat transport sections 13 partially curve around several corners to reach the heat sink 4.

[0090] Finally, Figure 3 shows an arrangement of a folded heat conduction system 1 with several electronic modules 2. Similar to the variant in Figure 2, the heat conduction system 1 has a heat transport section 13 on both sides of the heat dissipation section 14. However, these heat transport sections do not terminate on both sides of an electronic module 2, but rather thermally connect two separate electronic modules 2. The electronic modules 2 shown in turn have substrates 21, each with an electrically conductive coating 22.

[0091] 13 different components 23. Here the structural advantage of the long heat conduction paths is already made clear.

[0092] In two-phase cooling systems, a coolant, for example water, is located in the heat transfer system 1. In the liquid phase, the coolant absorbs heat from the heat source 2, for example a power module 2, in the heat absorption section 12. By absorbing this heat, the coolant reaches its boiling point and begins to evaporate. The now gaseous coolant is directed to the heat sink, the heat dissipation section 14. In two-phase cooling systems, the heat dissipation section 14 is called the condenser. There, the absorbed heat is released to the environment. The coolant cools down and condenses back into a liquid before being returned to the cycle to begin the process again in the heat absorption section 12. The cooling medium in the heat transfer system 1 therefore exists partly in a gaseous and partly in a liquid phase.

[0093] Figure 4 shows a thermal connection of a housed electronic module 2 and further components 25 to a PHP as a heat conduction system 1. The electronic components 23 can themselves also be housed.

[0094] A packaged chip, for example, is an integrated circuit that is housed in a protective package. This package protects the sensitive semiconductor chip inside from mechanical damage, moisture, and other environmental influences. The package also contains connections, pins, or pads that allow the chip to be integrated into electronic circuits and connected to other components. There are various types of chip packages. The choice of package depends on several factors, such as the application, space requirements, and electrical specifications. A packaged chip is therefore, in particular, an integrated circuit that is housed in a protective package to ensure its functionality and reliability.

[0095] Furthermore, Figure 4 shows additional electrical components 25. These can be, for example, capacitors. With regard to the thermal conductivity system 1, Figure 4 is similar to the variant shown in Figure 3. However, a printed circuit board 61 is also shown, on which electronic modules 2, further components, and capacitors 25 are mounted on both sides, and which printed circuit board 61 is mechanically connected to the thermal conductivity system 1 via brackets 6. The thermal connection is made directly to the heat sources 2 / 25. This embodiment illustrates the advantage that several modules 2 can be cooled simultaneously via the same thermal conductivity system. 202411933 Foreign version Fair copy

[0096] 14

[0097] Figure 5 shows a PHP as a heat conduction system 1, its shape adapted to the heights of the other components 25. The heat transport section 13 passes through a stage 15.

[0098] Figure 6 shows a thermal connection of an enclosed electronic module 2 to a PHP, similar to Figure 4, wherein the entire assembly to be cooled, consisting of electronic modules 2 and other components 25, is located in a device housing 62. The heat absorption sections 12 extend within this housing 62, the heat transfer sections 13 transport the heat out of the housing 62, and the heat dissipation occurs outside the housing 63 via the heat sink 4. This design illustrates the advantage for vertical integration.

[0099] Figure 7 shows a thermal connection of electronic modules 2 on both sides of a PHP (heat transfer module) as a heat transfer system 1, structurally a combination of the variants shown in Figures 2 and 3. The heat transfer system 1 connects two electronic modules 2 to each side of the heat transfer channel 2 at two different locations. It should be noted that a side view is always shown. The heat transfer system 1 can comprise several heat transfer channels, each configured for two-phase cooling. These multiple channels can be arranged side by side. The heat transfer system 1 can therefore extend horizontally perpendicular to the plane of the image. In particular, the heat transfer system is formed by means of an extruded profile.

[0100] Figure 8 shows an alternative embodiment of a heat sink 4 by means of shaping the heat conduction system 1. The structure initially corresponds to the embodiment in Figure 3 on the heat absorption side. However, the shape of the heat sink 4 is now created, alternatively or additionally to the cooling fins, by enlarging the heat dissipation section 14. Figure 8 shows several folds of the heat conduction system 13 / 14.

[0101] Figure 9 shows another alternative embodiment of a heat sink 4 by means of a shaping of the heat conduction system 1, comparable to Figure 8, with differently oriented folds. Figures 10 to 12 show further embodiments of the heat conduction system 1, in particular in combination with alternative electrical components 2 / 25.

[0102] Figure 10 shows an embodiment of the heat conduction system 1 in combination with two electrical components 2 and capacitors 25, which have very different sizes and are arranged in a distributed manner. The depicted heat conduction system 1 achieves over 202411933 Foreign version Fair copy

[0103] 15 several steps and corners 15 all these components 2 / 25 with the heat conductors 13 located on both sides of the heat emission section 14. One of the heat conduction sections 13 has two heat absorption sections 12 in a row.

[0104] Finally, Figure 11 shows an embodiment of the heat conduction system 1 with two heat dissipation sections 14. Starting at the bottom of the illustration with a first heat absorption section 12 along the underside of a first component 2 / 25, a first heat transport section 13 leads to a first heat dissipation section 14 on the side of the component 2 / 25. The heat conduction has a right-angled bend on both sides of the heat dissipation section 14. Above the second component 2 / 25, which is arranged sandwich-like above the first component 2 / 25, the heat conduction again acts as a heat absorption section 12, for which purpose it is thermally connected to the top side of the second component 2 / 25. The heat conduction system 1 then has a second heat dissipation section 14 on the other side of the sandwich-like component arrangement. This variant allows for improved two-sided fan cooling.

[0105] Figure 12 shows another embodiment of the heat conduction system 1 in combination with an electrical component 2 in a device housing 62. For this purpose, a connector 63, for example a spring for pressing, a screw or a solder, is provided to structurally connect the heat conduction system 1 to the housing 62.

[0106] Finally, Figure 13 shows a thermal connection of a non-planar outer surface of an electrical component 2. This can, for example, be an inductor winding. The heat conduction system 1 is preferably implemented by means of a shape-adapted PHP, which can bend 16 around the inductor winding.

[0107] Figure 14 shows a thermal connection of non-planar or parallel heat loss components 2. The heat transfer sections 13 between four thermally connected components 2 each have a 120° bend 16. Thus, all components 2 can be connected in series to the heat conduction system 1. Figure 14 also shows a variant in which the heat conduction system has a heat dissipation section 14 at both ends.

[0108] Finally, Figures 15 to 18 show various design examples 15 / 16 for heat conduction and heat dissipation areas 13 / 14. Such shapeability can advantageously be achieved using pulsating heat pipes. Suitable for this purpose are PHPs with a minimal 202411933 Foreign version Fair copy

[0109] 16

[0110] Channel expansion ranges from 0.5 mm to 5 mm. A further advantage of the PHP is that, with appropriate design, in addition to heat dissipation 14, temperature homogenization between different modules 2 can be achieved. This makes it easier to connect certain types of semiconductor components 2 in parallel.

[0111] Figure 15 shows a thermal connection of non-planarly arranged electronic modules 2 to a freely designed PHP as a heat conduction system 1 and heat sink 4. Figures 16 and 17 show further variants of a two-sided connection of electronic modules 2 to a freely designed PHP as a heat conduction system 1 and heat sink 4. The electronic modules (2) can represent power semiconductor assemblies or printed circuit boards with power semiconductors.

[0112] Finally, Figure 18 shows a thermal connection of concentrically arranged electronic modules 2 to a freely designed PHP as a heat conduction system 1 and heat sink 4. Such configurations are preferably implemented using heat conduction systems 1 in tubular, extruded, or channel form. The configurations shown in Figures 15 to 18 are particularly preferably implemented using extruded PHPs, especially made of aluminum. These exhibit five times the thermal conductivity of, for example, solid copper heat conduction systems. Furthermore, extruded profiles can be purchased from suppliers and are fully automated for folding and soldering.

[0113] Furthermore, the examples shown illustrate how the large heat conduction paths between heat source and sink contribute to new design freedoms.

[0114] 202411933 Foreign version Fair copy

[0115] 17

[0116] Reference symbol:

[0117] 1. Heat conduction system, e.g., heat pipe

[0118] 12 Heat absorption section

[0119] 13 Heat transfer section

[0120] 14 Heat dissipation section

[0121] 15th stage in the heat conduction system, e.g. for adapting to component heights

[0122] 16 Curved section in the heat conduction system, e.g. to adapt to component shape

[0123] 2 electrical components, electronic modules, to be cooled, in particular

[0124] Performance module

[0125] 21 Substrate, e.g. base plate of a power module

[0126] 22 Electrically conductive layer, e.g. copper layer

[0127] 23 electrical component, e.g. chip

[0128] 24 Housings, e.g. chip packaging or module housings,

[0129] 25 electrical components, e.g. capacitors

[0130] 26 Mounting bracket, especially screw

[0131] 27 Electrical component to be cooled, e.g. choke winding

[0132] 4 heat sinks

[0133] 41 cooling fins

[0134] 6 brackets

[0135] 61 Substrate, e.g. printed circuit board

[0136] 62 Enclosures, e.g. device enclosures

[0137] 63 connectors, e.g. spring for pressing, screw, solder, etc.

Claims

202411933 Foreign version Fair copy 18 Patent claims 1. Heat conduction system (1), comprising at least one heat absorption section (12) which is provided for a thermally conductive connection to an electrical component (2) to be cooled, comprising at least one heat emission section (14) which has at least one surface area-enlarging means, and comprising at least one heat transport section (13) between heat absorption section (12) and heat emission section (14), wherein the heat conduction system (1) is configured for operation of a two-phase cooling system by providing a continuous hydraulic connection between the at least one heat emission section (14), the at least one heat transport section (13) and the at least one heat absorption section (12), wherein the heat transport section (13) has a minimum length of 0.1 m.

2. Heat conduction system (1) according to claim 1, wherein the heat transport section (13) has a minimum length of 0.5 m or 1 m.

3. Heat conduction system (1) according to claim 1, with at least one further heat absorption section (12) which is provided for a thermally conductive connection to a further electrical component (2) to be cooled, with at least one further heat transport section (13) between the further heat absorption section (12) and the heat emission section (14).

4. Heat conduction system (1) according to claim 1 or 2, which is designed as a vapor chamber.

5. Heat conduction system according to claim 1, 2 or 3, wherein the heat transport section (13) has at least one shape adaptation to an electrical system (15 / 16) to be cooled or an electrical component (2) to be cooled.

6. Heat conduction system (1) according to one of claims 1 to 3 or 5, comprising a two-phase thermosiphon.

7. Heat conduction system (1) according to one of claims 1 to 3 or 5, comprising a heat pipe, in particular a pulsating heat pipe. 202411933 Foreign version Fair copy 19 8. Heat conduction system (1) according to one of the preceding claims, wherein the at least one heat absorption section (12), heat transport section (13) and heat emission section (14) are designed without joints.

9. Heat conduction system (1) according to one of the preceding claims, which is designed in an elongated shape, wherein the heat absorption section (12), heat transport section (13) and heat emission section (14) are arranged along this elongated shape and merge into one another, in particular merge into one another without joints.

10. Heat conduction system (1) according to one of the preceding claims, wherein the heat dissipation section (14) forms a heat sink (4) by means of the at least one surface-enlarging means.

11. Heat conduction system (1) according to claim 10, wherein the heat sink (4) has cooling fins (41).

12. Heat conduction system (1) according to claim 10 or 11, wherein the heat dissipation section (14) has curved, mutually curved, meandering or U-shaped sections.

13. Electrical component (2), in particular a power semiconductor module, arranged with a heat conduction system (1) according to one of claims 1 to 12, wherein the electrical component (2) is thermally connected to the heat conduction system (1).

14. Electrical device, in particular power converter, with a heat conduction system (1) according to one of claims 1 to 12 or with an electrical component (2), in particular a power semiconductor module, according to claim 13.

15. Manufacturing method for a heat conduction system (1) according to one of claims 1 to 12, in which a heat conductor, in particular an extruded profile, is folded into a shape corresponding to an external shape of an electrical component (2) to be cooled and / or an arrangement of at least one electrical component (2) to be cooled.

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