Integrated circuit module with releasably attached laser package

Abstract

A module includes a photonic integrated circuit (PIC) including one or more waveguides for guiding optical signals; an electronic integrated circuit (EIC) stacked on the PIC and electrically connected to the PIC; a laser package including a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly including one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC.

Description

[0001] PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0002] Attorney Docket No. 56403-0014W01

[0003] INTEGRATED CIRCUIT MODULE WITH RELEASABLY ATTACHED LASER PACKAGE

[0004] CLAIM OF PRIORITY

[0005] 5 This application claims priority under 35 USC §119(e) to U.S. Patent Application Serial No. 63 / 682,750, filed on August 13, 2024, and U.S. Patent Application Serial No. 63 / 683,189, filed on August 14, 2024, the entire contents of which are hereby incorporated by reference.

[0006] BACKGROUND

[0007] Silicon photonic devices utilize silicon as an optical medium. Because silicon is used as a substrate for most integrated circuits, silicon photonic devices can be hybrid devices that integrate both optical and electronic components onto a single microchip.

[0008] SUMMARY

[0009] 15 Assemblies including both electronic integrated circuits (EICs) and photonic integrated circuits (PICs) face a variety of challenges including challenges related to the demanding reliabilities of pigtailed optical components, e.g., laser diodes (LD) and fiber connections, and / or challenges related to the reliability of optical components like lasers and fibers. Typically, an output connector end including a Fiber Array Unit (FAU) of a front panel pluggable pigtailed laser is actively aligned and epoxy bonded / attached to a PIC residing on a motherboard inside a rack. The LD and / or the optical components linking them with the PIC may fail over time due to various reasons such as, e.g., laser diode facet degradations, epoxy joint failures and epoxy darkspot evolution (burning) due to the high optical powers being transmitted. Furthermore, pigtailed optical fiber connections connecting the laser to the PIC and providing connections out of the

[0010] 25 PIC to a different transceiver can degrade over time primarily due to the thermal / mechanical stresses and adhesive degradations over time. As such, it is often necessary to replace the laser assemblies and / or the other optical components that are epoxy attached to the PIC. Unfortunately, this task is inherently destructive, and the entire assembly composed of the PIC, EIC, and the other associated optical components connected to the PIC such as the LD package

[0011] 30 are scrapped. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0012] Attorney Docket No. 56403-0014W01

[0013] Further, a laser coupled to / integrated with the PIC can fail over time, and an optical fiber connecting the laser to the PIC that provides connections out of the PIC to a different transceiver can degrade over time. To address the reliability risks associated with epoxy glued fiber assemblies to PIC, a component connecting the PIC to the optical fiber, can be placed in the front

[0014] 5 plane of the assembly allowing the optical fiber to be replaced. While this addresses the risk of degradation of the optical fiber, the reliability risk associated with integrated lasers remain.

[0015] The present disclosure provides a module including a releasably attached, i.e., detachable, laser package so that the laser itself can be both integrated onto the module and easily replaced should the laser in the laser package fail. Further, the laser package can be shaped and arranged

[0016] 10 to be compatible with a fiber connection, e.g., for outputting the modulated signals from the PIC to an optical fiber exterior to the module. The described modules can provide an optical path between a laser and a PIC that is advantageously free of optical fibers, thus reducing the complexity and improving the reliability of the modules.

[0017] The details of one or more embodiments of the subject matter of this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages of the subject matter will become apparent from the description, the drawings, and the claims.

[0018] BRIEF DESCRIPTION OF THE DRAWINGS

[0019] 20 FIG. l is a schematic of an example of a module including an electronic integrated circuit (EIC), a photonic integrated circuit (PIC), a connector assembly, and a laser package.

[0020] FIG. 2A is a top-down view of the module FIG. 1 with a fiber package.

[0021] FIG. 2B is a side view of the module of FIG. 1, and FIG. 2C is a close-up of substrates within FIG. 2B.

[0022] 25 FIG. 2D is a schematic of another example of a module including an EIC, a PIC, a connector assembly, a laser package, a spacer, and a printed circuit board (PCB).

[0023] FIG. 3 depicts an example of a device with multiple modules.

[0024] FIG. 4 depicts another example of a device with multiple modules including optical fibers.

[0025] 30 FIG. 5A depicts an example of a device with multiple connector assemblies. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0026] Attorney Docket No. 56403-0014W01

[0027] FIGS. 5B, 5C, 5D, 5E, 5F, 5G, and 5H are detailed views of the assemblies and subcomponents thereof from FIG. 5A.

[0028] FIGS. 6A and 6B are cross-sectional views of the laser and fiber packages, respectively, from FIG. 5A.

[0029] 5 FIG. 7 depicts cross-sectional views of the device of FIG. 5 A along lines I-F and Il-Il’.

[0030] FIG. 8A depicts an example of a connector assembly. FIGS. 8B, 8D, and 8E depict examples of devices including the connector assembly of FIG. 8 A. FIG. 8C depicts a device including another example of a connector assembly.

[0031] FIGS. 8F and 8G each depict respective portions of a different optical element.

[0032] 10 FIG. 9A depicts a planar view of a device including one connector assembly.

[0033] FIG. 9B depicts a planar view of a device including two connector assemblies.

[0034] FIG. 9C depicts a cross-sectional view of a device including a laser coupled to two laser connector subassemblies. FIG. 9D depicts a planar view of the device of FIG. 9C.

[0035] Like reference numbers and designations in the various drawings indicate like elements.

[0036] DETAILED DESCRIPTION

[0037] With reference to FIG. 1, a module 100 includes an electronic integrated circuit (EIC) 102, a photonic integrated circuit (PIC) 104, a substrate 106, a connector assembly 108, and a laser package 116. The EIC 102 is stacked on top of the PIC 104, e.g., stacked on an upper

[0038] 20 surface 104a of the PIC 104 along a Z direction. The substrate 106 supports the PIC 104, e.g., a lower surface 104b of the PIC faces the substrate 106. The EIC 102 partially overlaps the upper surface 104a of the PIC 104, exposing part of the surface where the connector assembly 108 is attached.

[0039] As will be explained with more detail below, the connector assembly 108 optically

[0040] 25 couples the laser package 116 to the PIC 104 to provide input optical signals for the PIC 104, as well as out-couples output signals from the PIC 104 to an exterior fiber. The connector assembly 108 and laser package 116 provide a robust, fiber-free optical coupling between the laser package 116 and the PIC 104 in a form factor that allows easy replacement of the laser package 116 in the module 100.

[0041] 30 The EIC 102 and the PIC 104 are each composed of a semiconductor die. The PIC 104 includes one or more waveguides 105 for guiding optical signals to or from transceiver PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0042] Attorney Docket No. 56403-0014W01 components in the PIC 104, an output port from the laser package 116, and / or another port, e.g., for sending optical signals out of the PIC or receiving optical signals from another source. In some implementations, the substrate 106 is a multi-chip package substrate, a printed circuit board (PCB), an embedded multi-die interconnect bridge (EMIB), or on an interposer integrated

[0043] 5 wafer level (Chip on Wafer on Substrate CoWoS), e.g., with circuits programmed according to hardware description language (HDL).

[0044] The module 100 also includes a processor 110 electrically connected to the EIC 102. Through silicon vias (TSVs) 112, e.g., either in the PIC 104 or in another die between the EIC 102 and the substrate 106 disposed adjacent to the PIC 104, provide electrical connections

[0045] 10 between the EIC 102 and the processor 110. Additional layers with patterned electrically conducting layers (e.g., one or more redistribution layers) can be included to provide these electrical connections. In some implementations where the TSVs 112 are part of a separate die, the EIC 102 can be stacked on top of both the PIC 104 and the TSVs 112.

[0046] The processor 110 and the PIC 104 are bonded to the substrate 106 using an array of solder balls 114a, and the EIC 102 is bonded to the PIC 104 using another array of solder balls 114b. For example, the solder balls can have a pitch of tens of microns, e.g., 60 pm or less, 55 pm or less, 50 pm or less, or 40 pm or less. The size of the solder balls can be on the order of one’s of microns. The solder balls 114a provide an electrical connection between the substrate 106 and the PIC 104, the processor 110, and the TSVs 112. The solder balls 114b provide an

[0047] 20 electrical connection between the EIC 102 and the PIC 104 and TSVs 112.

[0048] With reference to FIGS. 2A and 2B, the connector assembly 108 includes a fiber connector subassembly 108a and a laser connector subassembly 108b. Each of the laser and fiber connector subassemblies 108a and 108b include multiple optical components for guiding optical signals to or from the PIC 104. FIG. 2A is a top-down view (the X-Y plane) of the module 100

[0049] 25 along with a fiber package, and FIG. 2B is a side view (the X-Z plane) of the module 100.

[0050] The fiber connector subassembly 108a is configured to out-couple output optical signals from the PIC 104, e.g., from an output port 104c of the PIC 104, to an exterior fiber 120 exterior to the module 100. The fiber connector subassembly 108a includes an upper substrate 122a, e.g., a light block, and a lower substrate 122b (depicted in FIG. 2C), a receptacle 124, a split sleeve

[0051] 30 126, and a fiber stub 128. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0052] Attorney Docket No. 56403-0014W01

[0053] Additionally, FIGS. 2A and 2B depict a fiber package 118, e.g., a pluggable PIC connector, which optically connects module 100 to another module by a fiber 120. The fiber stub 128 is shaped to receive a ferrule 130, which surrounds an end of an exterior fiber 120. The split sleeve 126 holds the ferrule 130 in place so that the exterior fiber 120 remains stationary when

[0054] 5 plugged into the fiber connector subassembly 108a. The receptacle 124 is disposed on an upper surface of the substrate 122a. When inserted into a cavity surrounded by the sleeve 126, the ferrule 130 and exterior fiber 120 are “plugged” into the fiber connector subassembly 108a, and the exterior fiber 120 is aligned with the output port 104c.

[0055] The laser connector subassembly 108b is coupled to the PIC 104 at an input port 104d.

[0056] 10 Similarly to the laser connector subassembly 108a, the laser connector subassembly 108b includes upper and lower and lower substrates 122c and 122d. Each of the input and output ports 104c and 104d, respectively, can simply be locations on the lower substrates 122b and 122d where light either enters or exits the respective lower substrate.

[0057] The path 145 of optical signals traveling into the PIC 104 is represented by the dotted line with an arrow in FIG. 2B. The optical path of light traveling both into and out of the substrates will be explained more in reference to FIG. 2C.

[0058] The laser connector subassembly 108b includes a receptacle 132 sized and shaped to receive the laser package 116. The laser package 116 includes a laser 134, a thermoelectric cooler (TEC) 136, a heat sink 138, and a flexible board cable (FBC) 140 for electrical power

[0059] 20 connection, which is connected to the substrate 106. The laser 134 can be a semiconductor laser, e g., a III-V semiconductor laser diode. For example, the wavelength range of the optical signals generated by the laser 134 can be 0.4 pm - 2 pm or more, with powers in a range of tens of mW to kW.

[0060] The FBC 140 is bonded to the substrate 106, e g., through wire bonding, to provide

[0061] 25 electric power for operating the laser 134. The TEC 136 cools the laser 134 to prevent unwanted heat from distorting optical components. For example, the TEC 136 can include a cool side and a hot side, with alternating legs of first and second metal types connected by conductive plates between the hot and cool sides. The heat sink 138 absorbs heat generated by the laser 134 and releases the absorbed heat through a ridged surface with high surface area.

[0062] 30 A cavity 142 within the receptacle 132 is sized and shaped to receive an output port 134a of the laser 134 and is aligned with the output port 134a. In other words, the two optical PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0063] Attorney Docket No. 56403-0014W01 components overlap along a direction. For example, the cavity 142 and the output port 134a of the laser 134 overlap along the Z direction, and a line extending along the X direction could intersect both cavity 142 and the output port 134a.

[0064] The pump laser package 116 is constructed as a subassembly with the internal optics

[0065] 5 coupling the light to the output port 134a. In some implementations, the output port 134a includes a lens or spot-size corrector, which can increase the tolerance for passive alignment of the laser 134 relative to the laser connector subassembly 108b. Optionally, an optical element 127, such as a lens or spot-size corrector is disposed within the cavity 142, e.g., between the output port 134a of the laser 134 and the input port 104d of the upper substrate 122c. In some

[0066] 10 cases, the receptacle 132 includes a mating stub sized and shaped to receive the output port 134a. The cavity 142 can be sized such that the output port 134a makes physical contact with the receptacle. The laser package 116 is force loaded and firmly held through a latching mechanism inside the spring actions into the receptacle. Thus, the cavity 142 is an input port of the laser connector subassembly 108b.

[0067] As a result, a laser signal generated by the laser 134 can travel from the laser package 116, through the laser connector subassembly 108b, and reach the input port 104d of the PIC 104. Further, the laser package 116 can “plug” in and out of the laser connector subassembly 108b, e.g., be releasably attached. Advantageously, the FBC 140 being flexible allows for movement of the laser package 116 if the laser package 116 is removed from the modules 100,

[0068] 20 e.g., to replace the laser 134. Further, an optical path of the optical signals from the laser package 116 to the PIC 104 is advantageously free of optical fibers, i.e., an unconfined optical path between the output port 134a of laser 134 and the input port 104d of the PIC 104. The receptable 132 stabilizes the connection between the laser connector subassembly 108b and the PIC 104, but the receptable 132 is not a part of the optical path between the laser 134 and the PIC 104.

[0069] 25 In some implementations, the upper substrate 122c and the receptable 132 are a part of the laser package 116 rather than a part of the laser connector subassembly 108b. This way, when the laser package 116 is releasably de-attached, the upper substrate 122c and the receptable 132 move with the rest of the laser package 116.

[0070] In some implementations, the laser package 116 includes an isolator 144 to block any

[0071] 30 backpropagating light. In other words, the isolator 144 prevents output optical signals from the PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0072] Attorney Docket No. 56403-0014W01

[0073] PIC from entering the laser 134. For example, the output port 134a of the laser 134 can include an isolator.

[0074] With reference to FIG. 2D, in some implementations, a module 100a can include additional components, e.g., to increase mechanical robustness of the module. For example, the

[0075] 5 module 100a can include a circuit board (PCB) 101 supporting the substrate 106 and a spacer 164. The laser package 116 includes the spacer 164, which is disposed between the laser package 116 and the PCB 101. Such a spacer can support the laser package 116, which overhangs the connector assembly 108 (i.e., a two-dimensional footprint of the connector assembly 108 along the Z direction partially overlaps a two-dimensional footprint of the laser package 116), which

[0076] 10 can lead to stresses at the interface of the laser package 116 and the connector assembly 108 that increase the chance of mechanical failure. By supporting the laser package 116, a spacer can reduce such stresses. The PIC 104 partially overlaps the connector assembly 108. In some implementations, another spacer can be positioned between the lower substrates 122b and 122d and the substrate 106, e.g., to support the connector assembly 108 and reduce mechanical stresses. Although FIG. 2D depicts the laser package 116 including the spacer 164, the fiber package 118 can also include a spacer, or the same spacer can support each of the laser and fiber packages 116 and 118. In some implementations, the substrate 106, the EIC 102, the PIC 104, processor 110, and upper and lower substrates 122c and 122d form a Chip-on-Wafer-on- Substrate (CoWoS) assembly 170, marked by the dotted line in FIG. 2D.

[0077] 20 As an example, the path of an output optical signal from the PIC traveling through the fiber connector subassembly 108a is depicted in FIG. 2C. An edge of the PIC 104 (not pictured in FIG. 2C for convenience) fits into an indent 150, e.g., a rectangular groove, of the lower substrate 122b. An edge of the PIC 104 fits against a face 157 of the groove, providing an optical coupling between the output port 104c of the PIC and the lower substrate 122b. In other words,

[0078] 25 the PIC 104 and the fiber connector subassembly 108a are edge-coupled. The other face 125 of indent 150 contacts the top surface of the PIC. The subassembly 108a includes a pair of reflective surfaces 152a and 152b, which are facets of a pair of grooves 154a and 154b, respectively.

[0079] A first portion 147a of the optical path, which is represented by the dotted line with the

[0080] 30 direction indicated by the arrow, begins where an optical signal is transmitted from output port PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0081] Attorney Docket No. 56403-0014W01

[0082] 104c. In the first portion 147a of the optical path, the optical signal travels along a horizontal direction, e.g., the X direction.

[0083] The second portion 147b of the optical path 145b continues with reflection from the reflective surface 152a, which is angled (e.g., at 45°) relative to the first portion 147a, thus

[0084] 5 redirecting the optical path upward, e.g., along the Z direction, toward the upper substrate 122a. The second portion 147b also includes passing through the interface 161 between the upper and lower substrates 122a and 122b. In this example, the optical signal in the second portion 147b of the optical path is nominally normally incident incidence on the upper substrate 122a, so the direction of travel does not change for the optical signal. However, if the angle of incidence was

[0085] 10 not normal and the upper and lower substrates are composed of different materials, the direction of light could change at the interface 161, and the relative alignment of the two reflective surfaces 152a and 152b can be adjusted to account for any refraction.

[0086] After encountering the second reflective surface 152b, which folds the optical path back to a horizontal direction, a third portion 147c of the optical path, terminates at a face 156 of the upper substrate 122a. The third portion 147c can be aligned with the fiber stub 128, e.g., at roughly the same height along the Z direction and location along the Y direction. When the fiber package 118 is coupled to the fiber connector subassembly 108a, the optical signal in-couples into the exterior fiber 120 through the fiber stub 128.

[0087] In this example, the first and second reflective surfaces 152a and 152b of the grooves

[0088] 20 154a and 154b are generally parallel to each other and overlap each other along the vertical direction (Z direction), e.g., a line parallel to the Z direction can pass through both the first and second reflective surfaces 152a and 152b. Accordingly, the second portion 147b of the optical path is generally vertical. The grooves 154a and 154b have a generally triangular cross-sectional shape in FIG. 2C, but other cross-sectional shapes are possible.

[0089] The receptacle 124 (not pictured in FIG. 2C for convenience) rests on a surface 158 of the upper substrate 122a, which is formed in an indent 160, e.g., a rectangular groove defined by the surface of the face 156 and the surface 158. The height H of the indent 160 can be selected so that the optical path exits the upper substrate 122a at the same height as the fiber stub 128 when the receptacle rests on the surface 158. In some implementations, the height H is in the range of

[0090] 30 0.1 mm to 5 mm. As to other dimensions, in some examples, the height of the EIC 102 (z- direction) can be 0.5 mm to 1 mm (e.g., 0.5 mm to 0.76 mm). The height of PIC 104 can be 0.1 PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0091] Attorney Docket No. 56403-0014W01 mm to 1 mm (e.g., 0.1 mm to 0.5 mm). Substrate height can be 0.1 mm to 2.5 mm and its width can be 35 mm to 150 mm. The widths of EIC 102 and PIC 104 can be 5 mm to 25 mm.

[0092] With reference to FIG. 2C, the lower substrate 122b is passively placed onto the PIC using a suitable technique, e.g., precision pick and place referencing to fiducials and / or

[0093] 5 mechanical engagement using etched features on the PIC. Both upper and lower substrates 122a and 122b contain light collimation / focusing optics that are molded / shaped / etched onto the beam deflecting mirrors 152a and 152b. Subsequently, the upper substrate is placed using either an active alignment technique or passive placement using the same techniques as described above. This expanded beam configuration allows for a large lateral placement error between the light

[0094] 10 bending substrates and thus allowing for passive assembly.

[0095] In some implementations, the reflective surfaces 152a and 152b are metal-coated mirrors. Alternatively, reflection can be provided by total internal reflection. The reflective surfaces 152a and 152b can be planar or can be curved (e.g., optically powered). For example, in some cases, one or both of the reflective surfaces can collimate and / or focus light as the optical signal enters the exterior fiber 120. For example, a portion 152c of each of the reflective surfaces 152a and 152b can have a convex curvature, which collimates an incoming light beam and focuses the light beam at the location of the five first of 128. Curved surfaces can be spherical or aspheric. The portion 152c can be aligned with either output port 104c of the PIC 104.

[0096] In this example, the reflective surfaces 152a and 152b are faces of grooves 154a and 154b

[0097] 20 in the lower and upper substrates 122b and 122a, respectively. In certain implementations, a reflective surface can be provided as a surface of a ridge instead. For example, substrates 122a and 122b can be ground down to the dashed lines 162.

[0098] In some implementations, the reflective surfaces 152a and 152b are formed such that optical axes of the respective aspheric mirror are angled at about 45° relative to the incoming

[0099] 25 light, so that the light is rotated 90° upon reflection, e.g., following the path of a periscope with two 90° turns.

[0100] Although FIG. 2C only depicts upper and lower substrates 122a and 122b of the fiber connector subassembly 108a, the upper and lower substrate 122c and 122d can have a similar shape and arrangement. The previous descriptions of the shapes of each of the upper and lower

[0101] 30 substrates 122a and 122b can also apply to upper and lower substrates 122c and 122d, e.g., having grooves and cavities that results in the periscope optical path for the laser connector PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0102] Attorney Docket No. 56403-0014W01 subassembly 108b. Accordingly, the PIC 104 can also be edge-coupled to the laser connector subassembly 108b. Thus, the disclosed devices integrate a releasably-attached laser for incoupling optical signals into to an integrated-circuit module, which is also coupled to a fiber connection for out-coupling modulated optical signals.

[0103] 5 Generally, the upper and lower substrates 122a-122d are composed of a transparent material, e.g., transparent to wavelengths of optical signals generated by the semiconductor laser 134, such as glass. Each of the upper and lower substrates 122a-122d can be composed of the same material. More generally, different materials (e.g., having the same or different refractive indices) can be used.

[0104] 10 Beam collimation between any two removable surfaces can facilitate passively removable / detachable connection of the components with repeatable low loss performance. In this example, that collimation happens between the upper and lower substrates. If the reflective surfaces 152a and 152b were focusing surfaces, passive connection could be a challenge. The lower substrate 122b can allow for wafer level PIC testing since the lower substrate 122b directs the light up in a collimated fashion from the edge where the lower substrate 122b is inaccessible at the wafer level. There can be a lower substrate attached to a test wand that is able to address the light in / out of each PIC. In that way, the PIC 104 can be tested at the wafer level.

[0105] The connector assembly 108 is shaped such that part of the upper substrates 122a and 122c overhang the EIC 102, e.g., the upper substrates 122a and 122c vertically overlap the EIC

[0106] 20 102. In this case, a silicon carrier wafer can be disposed between the EIC 102 and the upper substrates 122a and 122c. Other implementations are possible. For example, the connector assembly 108 can overlap, at least partially, a top surface of the EIC 102 in addition or alternatively to overlapping the PIC 104.

[0107] The fiber connector subassembly 108a and the laser connector subassembly 108b can be

[0108] 25 disposed at the same height, e.g., lower surfaces and / or upper surfaces of the fiber and laser connector subassemblies 108a and 108b can have the same value along the Z direction. For this reason, only one connector subassembly is visible in a side view, e.g., only laser connector subassembly 108b is depicted in the side view in FIG. 2B. The fiber and laser connector subassemblies 108a and 108b are spaced apart from each other in a horizontal direction, e.g., the

[0109] 30 Y direction. In some implementations, there is a gap between the fiber and laser connector subassemblies 108a and 108b. In some implementations, there is no gap between the fiber and PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0110] Attorney Docket No. 56403-0014W01 laser connector subassemblies 108a and 108b, e.g., the fiber and laser connector subassemblies 108a and 108b contact each other or are integrated as a single continuous piece of substrate. In some implementations, the laser and fiber can be integrated with a single connector.

[0111] With reference to FIG. 3, a device 300 includes a processor 302 and eight modules 304

[0112] 5 supported by a multichip package substrate 301. Each of the eight modules 304 can be the modules 100 as described above. For example, each module 304 includes an input / output (I / O) component 305, which can include an EIC 102 and a PIC 104. Each module 304 can further include a connector assembly 308, which can be similar to the connector assembly 108 described above, and a laser package 306, which can be similar to the laser package 116 described above.

[0113] 10 Each of the laser packages 306 is releasably attached to the connector assembly 308 and connected to a power source 310. Optical fibers 312 are coupled to the connector assembly 108 to receive out-coupled optical signals from the PIC of the VO component 305. Additional optical fibers 315 also provide optical connections to other off-package components, e.g., via a termination at a standard fiber connector, e.g., an MPO / SN type connector.

[0114] Although device 300 is depicted as including eight modules 304, other numbers of modules are possible. For example, the device can include 2, 4, 8, 16, or more modules.

[0115] Although fibers are not necessary to connect the disclosed connector assembly to the disclosed modules or the disclosed laser package, in some implementations, a device can include optical fibers to make these connections. As an example, and with reference to FIG. 4, a device

[0116] 20 400 includes a processor 402 and four subsystems 404 supported by a substrate 401. Each subsystem 404 includes a module 405, a connector assembly 408, and a laser package 410. The module 405 can be similar to the modules 100 described above, except that the connector assembly 408 is external to the module 405 and connected to the module 405 through an optical fiber 406. Further, the connector assembly 408 can be similar to the connector assembly 108

[0117] 25 described above, and the laser package 410 can be similar to the laser package 116 described above.

[0118] Additional examples of devices and systems are possible. For example, FIG. 5A depicts an example of a device 500 including a substrate 501 supporting an interposer 505, which supports a processor 502 and four pairs of assemblies 504. Each assembly 504 includes a module

[0119] 30 503, a connection assembly 508, a laser package 516, and fiber package 518. The assemblies 504 are arranged around the processor 502. In some implementations, the assemblies 504 are equally PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0120] Attorney Docket No. 56403-0014W01 spaced around the processor 502, e.g., every 90° and / or on a different side of the processor 502. The processor 502 can be similar to processor 110, interposer 505 can be similar to substrate 106, and module 503 can include one or more integrated circuits, e.g., PICs and EICs.

[0121] Connection assembly 508 can include a fiber connector subassembly, e.g., fiber connector

[0122] 5 subassembly 108a, and a laser connector subassembly, e.g., laser connector subassembly 108b. The laser package 516 can be similar to laser package 116, and fiber package 118 can be similar to fiber package 118.

[0123] With reference to FIG. 5B, each assembly 504 includes the module 503, which can include one or more of each of PICs and EICs. The fiber connector subassembly 508a is coupled

[0124] 10 to the fiber package 518, and the laser connector subassembly 508b is coupled to the laser package 516. The module 503 can have a width Wl, e.g., measured along the Y direction, of 8.2 mm, and length LI, e.g., measured along the X direction, of 24 mm. More generally, these dimensions can vary in other examples. For instance, LI can be in a range from 2 mm to 25 mm.

[0125] FIG. 5C depicts an exploded view of the fiber package 518 and upper and lower substrates 522a and 522b next to the laser package 516. The upper and lower substrates 522a- 522d can be similar to the upper and lower substrates 122a-122d, respectively. The upper substrate 522a is disposed on the lower substrate 522b and optically couples the module 503 to a receptacle 524, which can be similar to receptacle 124. The receptacle 524 includes a cavity sized and configured to receive a ferrule 530, which is connected to a fiber 520. The ferrule 530

[0126] 20 can be similar to ferrule 130, and the fiber 520 can be similar to fiber 120.

[0127] FIG. 5D depicts an exploded view of the laser package 516 and upper and lower substrates 522c and 522d next to the fiber package 518. The upper substrate 522c is disposed on the lower substrate 522d and optically couples the module 503 to a receptacle 532, which can be similar to receptacle 132. The receptacle 532 includes a cavity sized and configured to receive an

[0128] 25 input port 534a of a laser (visible in FIGS. 5E and 5F). The receptacle 532 can be similar to receptacle 132, and the output port 534a can be similar to output port 134a of laser 134. In FIGS. 5B and 5C, the receptable 532 and output port 534a of the laser 534 can be sized and shaped in a mating configuration to stabilize the connection. A heat sink 538 can cover a surface of the laser, which is connected to an FBC 540. The heat sink 538 can be similar to heat sink 138, and the

[0129] 30 FBC 540 can be similar to FBC 140. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0130] Attorney Docket No. 56403-0014W01

[0131] FIG. 5E depicts a perspective view of the laser package 516, and FIG. 5F depicts a cross- sectional view of the laser package 516. The laser package 516 includes a laser 534 with output port 534a. One or more TECs 536 are disposed between the laser 534 and the heatsink 538. An FBC 540 provides electrical power to the laser 534. The laser 534 can have a length L2 along the

[0132] 5 X direction of about 12 mm and a width W2 of about 4 mm along the Y direction. The combined height Hl, e.g., as measured along the Z axis, of the laser 534, the TEC 536, and the heat sink 538 can be about 5 mm.

[0133] FIG. 5G depicts a close-up, perspective view of ferrule 530 and fiber 520, and FIG. 5H depicts a close-up, cross-sectional view of ferrule 530 and fiber 520. The ferrule 530 can have a

[0134] 10 width W3 of about 3 mm and a height H2 of about 6.5 mm.

[0135] With reference to FIGS. 6A and 6B, in some devices, a module 600 includes a PIC 104e stacked on an EIC 102a, and the connector assemblies contact the PIC 104e, which is disposed above the EIC 102a relative to a substrate 106a supporting the module. FIG. 6A is a first crosssection of the module 600 including the laser package 116, and FIG. 6B a second cross-section of the module 600 including the fiber package 118. Description of repeated elements in module 600 from device 500 will be omitted for brevity.

[0136] FIG. 7 depicts cross-sectional views of the device 500 of FIG. 5 A along lines I-F and Illi’. In this example, the module 503 includes only PIC-type integrated circuits, e.g., the module 503 does not include an EIC, either between the PIC and interposer or above the PIC. In the

[0137] 20 cross-section along line I-I”, the laser package 516 is visible, and fiber package 518 is not visible. In some implementations, a printed circuit board (PCB) 101a supports one or more PICs 104f, one or more laser packages, and one or more fiber packages.

[0138] Although previous examples have included connector assemblies including upper and lower substrates 522a-122d, other implementations are possible. With reference to FIG. 8A,

[0139] 25 module 800 includes a PIC 104 coupled to a laser 134b via a connector assembly including optical elements 153a and 153b. Each of optical elements 153a and 153b respectively include a reflective surface 155a and 155b, e.g., a three-dimensional (3D)-printed mirror, and a microlens 127a and 127b. The output optical signal, e.g., a laser beam, of a laser 134b propagates through the optical element 153a in a generally horizontal direction, e.g., along the X direction, toward

[0140] 30 the reflective surface 155a, which is angled relative to the direction of propagation. For example, PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0141] Attorney Docket No. 56403-0014W01 the plane of reflective surface 155a is perpendicular to the XZ plane and is angled 45° relative to either of the X or Z axes in FIG. 8A.

[0142] The reflective surface 155a redirects the laser beam toward the microlens 127a, which out-couples the laser beam into free space 173 between microlenses 127a and 127b. The

[0143] 5 microlens 127a reduces the beam size of the laser beam before the laser beam in-couples into optical element 153b. After passing through the microlens 127b, the laser beam continues to propagate along a generally vertical direction, e.g., along the Z axis. The reflective surface 155b of the optical element 155b reflects the laser beam toward the PIC 104 in a generally horizontal direction, as the reflective surface 155b is also angled. For example, the reflective surfaces 155a

[0144] 10 and 155b can be generally parallel to each other and overlap each other along the Z direction. Although the optical components in module 800 differ from those of FIG. 2C, the laser beam in FIG. 8A also follows a generally periscopic path. The shape of optical elements 153a and 153b will be explained with more detail with reference to FIG. 8F.

[0145] The optical elements 153a and 153b can be used in various devices. FIG. 8B depicts a device 800b including a PIC 104h, the laser 134b, and the connector assembly of FIG. 8 A, e.g., including optical elements 153a and 153b. Laser beam 159 out-couples from a waveguide 163a of the laser 134b and into optical element 153a. For example, the waveguide 163a can include a IILV type semiconductor material. After passing through optical elements 153a and 153b, the laser beam in-couples into a waveguide 163b of the PIC 104h. Waveguide 163b is embedded

[0146] 20 within the PIC 104h and aligned with the laser beam as the laser beam out-couples from optical element 153b, and waveguide 163a is embedded within laser 134b and aligned with the laser beam 159 as the laser beam in-couples into optical element 153a. Generally, the waveguides can be formed from any suitable optical material, including an inorganic glass, a crystalline material, or a polymer. In some examples, the waveguides are composed of Si or SiN. The waveguides

[0147] 25 can be patterned waveguides.

[0148] In some implementations, the laser 134b includes a semiconductor optical amplifier (SO A), and the device 800b includes a fiber 169 optically coupled to the waveguide 163a. The fiber 169 allows the device 800b to optically connect to another SOA.

[0149] FIG. 8C depicts another device 800c including a PIC 104g, the laser 134b, the optical

[0150] 30 element 153a of FIG. 8A, and an optical element 153c mounted on an upper surface 104gl of the PIC 104g. As will be explained with more detail with reference to FIG. 8G, optical element 153c PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0151] Attorney Docket No. 56403-0014W01 has a different shape compared to optical element 153b, which is mounted on a side surface 104hl of PIC 104h. Optical element 153c includes a microlens 127c, which directs the laser beam 159 toward the PIC 104g. The laser beam passes through an upper portion of the PIC 104g before encountering an input grating 165, which in-couples the laser beam 159 into a waveguide

[0152] 5 163c. In this example, the input grating 165 is reflective and disposed on a lower surface of the waveguide 163 c, but a transmissive input grating 165 disposed on an upper surface of waveguide 163c is also possible. In some implementations, the input grating 165 is configured to cause the laser beam to travel via total internal reflection (TIR) through the waveguide 163b.

[0153] With reference to FIG. 8D, in some implementations, a device 800d includes multiple

[0154] 10 components including a PIC 104h, along with dies 104i and 104j (e.g., additional PICs, interposers, or other semiconductor devices). Device 800d is substantially similar to device 800b, with the exceptions that device 800d further includes two additional dies and does not include a fiber 169. PIC 104h is substantially in the same position and has a similar composition in both FIGS. 8B and 8D. Repeated description is omitted.

[0155] A first additional die 104i is located directly beneath the optical element 153b, and a second die 104j is located directly beneath the laser 134b. There is a trench 171 between PIC 104h and die 104j, e.g., above die 104i, above which the connector assembly including optical elements 153a and 153b, is positioned.

[0156] In some implementations, the laser beam is evanescently in-coupled into a PIC. For

[0157] 20 example, referring to FIG. 8E, the junction between optic 153b and the PIC 104k is configured to evanescently couple laser beam 159 into the waveguide 163b. In this example, the connector assembly includes first and second optics 153a and 153b for guiding the laser beam 159 from the waveguide 163a of the laser 134b into a waveguide 167, e.g., a polymer waveguide deposited or assembled on top of the PIC 104k. The waveguide 163b of the PIC 104k and the waveguide 167

[0158] 25 can be close enough to have evanescent coupling. For example, although the electric field of the laser beam 159 in waveguide 167 can exponentially decay as an evanescent wave, the waveguide 163b can be located close enough to waveguide 167 such that the laser beam 159 can out-couple from waveguide 167 and in-couple into waveguide 163b. In the example depicted in FIG. 8E, the waveguides 167 and 163b are spaced apart from each other along the vertical direction. In some

[0159] 30 implementations, the waveguides 167 and 163b contact each other. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0160] Attorney Docket No. 56403-0014W01

[0161] FIG. 8F depicts optic 153a, but the following description can also apply to optic 153b, since these two components can have the same geometry (with one corresponding to an 180° rotation of the other around the Y axis). However, in some implementations, the optics 153a and 153b can have different geometries and different proportions.

[0162] 5 In this example, optic 153a has a shape composed of multiple portions 172a, 172b, 172c, and 172d. A lens portion 172a corresponds to either microlens 127a or 127b. In the XZ plane of FIG. 8F, the cross-section of the lens portion 172a is a segment of the circle, e.g., an arc plus a line. The lens portion 172a has a first boundary 174a, e.g., the piano surface of the microlens, that contacts a first rectangular portion 172b.

[0163] 10 The first rectangular portion 172b is a rectangular prism with a rectangular cross-section in the XZ plane of FIG. 8F. A first surface of the first rectangular portion 172b contacts the lens portion 172a at the first boundary 174a, and a second surface of the first rectangular portion 172b contacts a triangular portion 172c at a second boundary 174b.

[0164] The triangular portion 172c is a triangular prism with a triangular cross-section in the XZ plane of FIG. 8F. A first surface of the triangular portion 172c contacts the first rectangular portion 172a at the second boundary 174b, and a second surface of the triangular portion 172c contacts a second rectangular portion 172d at a third boundary 174c. A third surface 175 of the triangular portion can be coated to be reflective at an operative wavelength of the laser. The second rectangular portion 172d is a rectangular prism with a rectangular cross-section in the XZ

[0165] 20 plane of FIG. 8F. The second rectangular portion 172d contacts the triangular portion 172c at the third boundary 174c.

[0166] With reference to FIG. 8G, optic 153c of FIG. 8C includes multiple portions 172e, 172f, and 172g. A lens portion 172e corresponds to microlens 127c. In the XZ plane of FIG. 8G, the cross-section of the lens portion 172e is a segment of a circle. The lens portion 172e has a first

[0167] 25 boundary 174d, e.g., the piano surface of the microlens, that contacts a first rectangular portion 172f.

[0168] The first rectangular portion 172f is a rectangular prism with a rectangular cross-section in the XZ plane of FIG. 8G. A first surface of the first rectangular portion 172f contacts the lens portion 172e at the first boundary 174d, and a second surface of the first rectangular portion 172f

[0169] 30 contacts a second rectangular portion 172g at a second boundary 174e. The first rectangular portion 172f has a first width W1 along the horizontal direction, e.g., the X axis, which is about PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0170] Attorney Docket No. 56403-0014W01 as wide as the lens portion 172e. The second rectangular portion 172g has a second width W2 along the horizontal direction that is greater than the first width W 1.

[0171] Although each of optics 153a, 153b, and 153c are depicted as multiple portions having boundaries, each of optic 153a, 153b, and 153c can be formed of a single, continuous material,

[0172] 5 e.g., glass or a polymer.

[0173] The connector assemblies may be used in a variety of configurations to connect arrays of PICs and laser and fiber assemblies. For example, FIG. 9A depicts a planar view of a device 900a including one connector assembly 153, e.g., the combination of optics 153a and 153b, between PIC 104m and laser 134c. In device 900a, the cross-sectional view along line III-III”

[0174] 10 can be similar to any of the cross-sectional views in FIGS. 8A, 8B, or 8E.

[0175] In some implementations, there are multiple connector assemblies between a single PIC and a laser. With reference to FIG. 9B, device 900b includes two connector assemblies 153 between PIC 104n and laser 134d. The two connector assemblies are latterly spaced apart from each other along a horizontal direction perpendicular to the propagation direction of the laser beams, e.g., along the Y direction. A gap 901 separates the two connector assemblies 153. The cross-sectional view along line IV-IV’ could be similar to any of the cross-sectional views in FIGS. 8A, 8B, or 8E. Further, additional connector assemblies, spaced apart from each other along a direction into the page, could be added between the devices in FIGS. 8C and 8D.

[0176] In some implementations, the laser can have one or more optical elements on opposite

[0177] 20 ends for out-coupling optical signals, and the PIC can have one or more optical elements on opposite ends for in-coupling optical signals. For example, FIG. 9C depicts a cross-sectional view of a device 900c along line V-V”, and FIG. 9D depicts a planar view of the device 900c. The device 900c includes a laser 134e and PICs 104o and 104p. The laser 134e has four output ports, with each output port optically coupled to an optical element 153a on opposite sides 902a

[0178] 25 and 902b of the laser 134e. Although not depicted in FIGS. 9C and 9D, in some implementations, optical elements 153a can be arranged on adjacent sides of the laser 134e, e.g., on sides 902a and 902c.

[0179] Each of the PICs 104o and 104p include four input ports, each input port optically coupled to an optical element 153b on opposite sides of the PIC, e.g., opposite sides 904a and

[0180] 30 904b. Although not depicted in FIGS. 9C and 9D, in some implementations, optical elements 153b can be disposed on adjacent sides of the PICs, e.g., sides 904a and 904c, as well. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0181] Attorney Docket No. 56403-0014W01

[0182] Although the configuration of the connector assemblies between PICs and lasers has been described in reference to connector assemblies including the optics 153a, 153b, and 153c, connector assemblies including the upper and lower substrates 122a-122d are also possible.

[0183] In addition to the embodiments of the attached claims and the embodiments described

[0184] 5 above, additional embodiments are disclosed in the following numbered paragraphs.

[0185] 1. A module including: a photonic integrated circuit (PIC) including one or more waveguides for guiding optical signals; an electronic integrated circuit (EIC) stacked on the PIC and electrically connected to the PIC; a laser package including a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly including one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC, wherein an unconfined optical path connects an output port of the laser package to an input port of the PIC.

[0186] 2. The module of paragraph 1, wherein the connector assembly includes a laser

[0187] 15 connector subassembly and a fiber connector subassembly, each of the laser and fiber connector subassemblies including a pair of substrates.

[0188] 3. The module of paragraph 2, wherein each pair of substrates include a periscope lens.

[0189] 4. The module of paragraph 2 or paragraph 3, wherein each of the substrates include a surface with a groove, an interior surface of the groove being configured to reflect the optical signals during operation of the module.

[0190] 5. The module of paragraph 4, wherein the reflective surface of the groove is an aspheric mirror.

[0191] 6. The module of paragraph 4, wherein each pair of substrates includes an upper

[0192] 25 substrate and a lower substrate, wherein the groove of the upper substrate vertically overlaps the groove of the lower substrate, and wherein the groove of the upper substrate is parallel to the groove of the lower substrate.

[0193] 7. The module of any of paragraphs 3 - 6, wherein each pair of substrates includes a first substrate including an indented portion contacting an edge of the PIC. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0194] Attorney Docket No. 56403-0014W01

[0195] 8. The module of any of paragraphs 3 - 7, wherein the laser connector subassembly includes a receptacle into which a cavity extends, the cavity sized and shaped to receive the output port of the semiconductor laser.

[0196] 9. The module of paragraph 8, wherein the pair of substrates of the laser connector

[0197] 5 subassembly includes an upper substrate having an indented portion on which the receptacle of the laser connector subassembly is disposed.

[0198] 10. The module of any of the preceding paragraphs, wherein the connector assembly includes a fiber connector subassembly including a fiber stub configured to receive an exterior fiber and couple output optical signals from the PIC to the exterior fiber.

[0199] 10 11. The module of any of the preceding paragraphs, wherein the connector assembly includes one or more optical elements arranged to receive the optical signals from the semiconductor laser and direct the optical signals to an input port of the PIC, an output port of the semiconductor laser being aligned with an input port of the connector assembly.

[0200] 12. The module of any of the preceding paragraphs, wherein the laser package includes an isolator configured to reduce transmission of output optical signals from the PIC into the semiconductor laser.

[0201] 13. The module of any of the preceding paragraphs, wherein the laser package includes a thermoelectric cooler configured to cool the semiconductor laser.

[0202] 14. The module of any of the preceding paragraphs, wherein the connector assembly

[0203] 20 overhangs the PIC.

[0204] 15. The module of any of the preceding paragraphs, wherein the laser package overhangs the connector assembly.

[0205] 16. The module of any of the preceding paragraphs, wherein the laser package includes a flexible cable that is coupled to a power source and configured to provide electrical

[0206] 25 power to the semiconductor laser.

[0207] 17. The module of any of the preceding paragraphs, further including a processor electrically coupled to the PIC, the EIC, or both.

[0208] 18. The module of any of the preceding paragraphs, further including solder bumps disposed between the EIC and PIC bonding the EIC to the PIC.

[0209] 30 19. The module of any of the preceding paragraphs, wherein the PIC includes through silicon vias (TSVs) electrically connecting the EIC to a substrate supporting the PIC. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0210] Attorney Docket No. 56403-0014W01

[0211] 20. The module of paragraph 1, wherein the one or more optical elements include a first optical element and a second optical element, wherein at least one of the first and second optical elements includes: a microlens; a first portion having a rectangular prism shape and having a first surface contacting a planar surface of the microlens; a second portion having a

[0212] 5 triangular prism shape and having a first surface contacting the first surface of the first portion and a second, exposed surface; and a third portion having a rectangular prism shape and having a first surface contacting a third surface of the second portion.

[0213] 21. The module of paragraph 20, wherein a second surface of the third portion contacts either the PIC or the laser package.

[0214] 10 22. The module of paragraph 20, wherein the first optical element is optically coupled to the laser package, and the second optical element includes: a second microlens; a fourth portion having a rectangular prism shape and having a first surface contacting a planar surface of the microlens; and a fifth portion having a rectangular prism shape and having a first surface contacting a second surface of the fourth portion, wherein a width of the fifth portion is greater than a width of the fourth portion.

[0215] 23. The module of paragraph 22, wherein the PIC includes a waveguide including an input coupling grating configured to in-couple the optical signals from the laser package after the optical signals propagate through the second optical element.

[0216] 24. The module of paragraph 20, wherein the PIC includes a first waveguide aligned

[0217] 20 with the first optical element, and the semiconductor laser includes a second waveguide aligned with the second optical element.

[0218] 25. The module of paragraph 24, wherein the second waveguide is optically coupled to an external fiber.

[0219] 26. The module of paragraph 20, further including a second PIC disposed below the

[0220] 25 connector assembly and a third PIC disposed below the laser package.

[0221] 27. The module of paragraph 20, further including a first waveguide disposed on a surface of the PIC, wherein the one or more optical elements include a first optical element disposed on an edge of the PIC, wherein the first waveguide is aligned with the first optical element, wherein PIC includes a second waveguide, the spacing between the first and second

[0222] 30 waveguides being sufficiently small to allow evanescent coupling of light between the first and second waveguides during operation of the module. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0223] Attorney Docket No. 56403-0014W01

[0224] 28. The module of paragraph 1, wherein the connector assembly is a first connector assembly, and the module further includes a second connector assembly laterally spaced apart from the first connector assembly.

[0225] 29. The module of paragraph 1, wherein the one or more optical elements include a

[0226] 5 first optical element disposed on a first side of the laser package and a second optical element disposed on the second side of the laser package opposite the first side.

[0227] 30. The module of paragraph 1, wherein the one or more optical elements include a first optical element disposed on a first side of the PIC and a second optical element disposed on the second side of the PIC opposite the first side

[0228] 10 31. A system including: a plurality of modules, each module being a module of any of the preceding paragraphs; a processor electrically coupled to each of the plurality of modules; one or more power sources coupled to each connector assembly of each module of the four or more modules; a multichip package substrate supporting the processor and the plurality of modules; and a plurality of fibers, each fiber being respectively coupled to a corresponding connector assembly of a corresponding one of the plurality modules, the plurality of fibers optically coupling each of the plurality of modules to one or more respective external components.

[0229] 32. A system of I / O modules, wherein each I / O module is the module of any of the preceding paragraphs, the connector assembly being compatible with advanced packaging

[0230] 20 integration.

[0231] 33. The system of paragraph 32, wherein the advanced packaging integration is selected from the group consisting of wafer level silicon interposer integration (CoWoS), wafer level fan out packages (FoWLP), panel level packages, glass interposer, elevated fan out bridge, and embedded interconnect bridge.

[0232] 25 34. A module including: a photonic integrated circuit (PIC) including one or more waveguides for guiding optical signals; a laser package including a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly including one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides

[0233] 30 in the PIC. PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0234] Attorney Docket No. 56403-0014W01

[0235] 35. A module including: an electronic integrated circuit (EIC); a photonic integrated circuit (PIC) stacked on and electrically connected to the EIC, the PIC including one or more waveguides for guiding optical signals; a laser package including a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the

[0236] 5 connector assembly including one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC.

[0237] 36. The module of any of paragraphs 1, 34, or 35, further including: a substrate; and a spacer disposed on a surface of the substrate and supporting the PIC.

[0238] 10 While this specification contains many specific implementation details, these should not be construed as limitations on the scope of what is being claimed, which is defined by the claims themselves, but rather as descriptions of features that may be specific to particular embodiments of particular inventions. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially be claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claim may be directed to a subcombination or variation of a

[0239] 20 subcombination.

[0240] Similarly, while operations are depicted in the drawings and recited in the claims in a particular order, this by itself should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel

[0241] 25 processing may be advantageous. Moreover, the separation of various system modules and components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0242] 30 Particular embodiments of the subject matter have been described. Other embodiments are within the scope of the following claims. For example, the actions recited in the claims can PCT / US25 / 41879 13 August 2025 (13.08.2025)

[0243] Attorney Docket No. 56403-0014W01 be performed in a different order and still achieve desirable results. As one example, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results.

[0244] What is claimed is:

Claims

Attorney Docket No. 56403-0014W01CLAIMS1. A modul e compri sing : a photonic integrated circuit (PIC) comprising one or more waveguides for guiding optical signals; an electronic integrated circuit (EIC) stacked on the PIC and electrically connected to the PIC; a laser package comprising a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly comprising one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC, wherein an unconfined optical path connects an output port of the laser package to an input port of the PIC.

2. The module of claim 1, wherein the connector assembly comprises a laser connector subassembly and a fiber connector subassembly, each of the laser and fiber connector subassemblies comprising a pair of substrates.

3. The module of claim 2, wherein each pair of substrates comprise a periscope lens.

4. The module of claim 2 or claim 3, wherein each of the substrates comprise a surface with a groove, an interior surface of the groove being configured to reflect the optical signals during operation of the module.

5. The module of claim 4, wherein the reflective surface of the groove is an aspheric mirror.

6. The module of claim 4, wherein each pair of substrates comprises an upper substrate and a lower substrate, wherein the groove of the upper substrate vertically overlaps the groove of the lower substrate, and wherein the groove of the upper substrate is parallel to the groove of the lower substrate.Attorney Docket No. 56403-0014W017. The module of any of claims 3 - 6, wherein each pair of substrates comprises a first substrate comprising an indented portion contacting an edge of the PIC.

8. The module of any of claims 3 - 7, wherein the laser connector subassembly comprises a receptacle into which a cavity extends, the cavity sized and shaped to receive the output port of the semiconductor laser.

9. The module of claim 8, wherein the pair of substrates of the laser connector subassembly comprises an upper substrate having an indented portion on which the receptacle of the laser connector subassembly is disposed.

10. The module of any of the preceding claims, wherein the connector assembly comprises a fiber connector subassembly comprising a fiber stub configured to receive an exterior fiber and couple output optical signals from the PIC to the exterior fiber.

11. The module of any of the preceding claims, wherein the connector assembly comprises one or more optical elements arranged to receive the optical signals from the semiconductor laser and direct the optical signals to an input port of the PIC, an output port of the semiconductor laser being aligned with an input port of the connector assembly.

12. The module of any of the preceding claims, wherein the laser package comprises an isolator configured to reduce transmission of output optical signals from the PIC into the semiconductor laser.

13. The module of any of the preceding claims, wherein the laser package comprises a thermoelectric cooler configured to cool the semiconductor laser.

14. The module of any of the preceding claims, wherein the connector assembly overhangs the PIC.Attorney Docket No. 56403-0014W0115. The module of any of the preceding claims, wherein the laser package overhangs the connector assembly.

16. The module of any of the preceding claims, wherein the laser package comprises a flexible cable that is coupled to a power source and configured to provide electrical power to the semiconductor laser.

17. The module of any of the preceding claims, further comprising a processor electrically coupled to the PIC, the EIC, or both.

18. The module of any of the preceding claims, further comprising solder bumps disposed between the EIC and PIC bonding the EIC to the PIC.

19. The module of any of the preceding claims, wherein the PIC comprises through silicon vias (TSVs) electrically connecting the EIC to a substrate supporting the PIC.

20. The module of claim 1, wherein the one or more optical elements comprise a first optical element and a second optical element, wherein at least one of the first and second optical elements comprises: a microlens; a first portion having a rectangular prism shape and having a first surface contacting a planar surface of the microlens; a second portion having a triangular prism shape and having a first surface contacting the first surface of the first portion and a second, exposed surface; and a third portion having a rectangular prism shape and having a first surface contacting a third surface of the second portion.

21. The module of claim 20, wherein a second surface of the third portion contacts either the PIC or the laser package.Attorney Docket No. 56403-0014W0122. The module of claim 20, wherein the first optical element is optically coupled to the laser package, and the second optical element comprises: a second microlens; a fourth portion having a rectangular prism shape and having a first surface contacting a planar surface of the microlens; and a fifth portion having a rectangular prism shape and having a first surface contacting a second surface of the fourth portion, wherein a width of the fifth portion is greater than a width of the fourth portion.

23. The module of claim 22, wherein the PIC comprises a waveguide comprising an input coupling grating configured to in-couple the optical signals from the laser package after the optical signals propagate through the second optical element.

24. The module of claim 20, wherein the PIC comprises a first waveguide aligned with the first optical element, and the semiconductor laser comprises a second waveguide aligned with the second optical element.

25. The module of claim 24, wherein the second waveguide is optically coupled to an external fiber.

26. The module of claim 20, further comprising a second PIC disposed below the connector assembly and a third PIC disposed below the laser package.

27. The module of claim 20, further comprising a first waveguide disposed on a surface of the PIC, wherein the one or more optical elements comprise a first optical element disposed on an edge of the PIC, wherein the first waveguide is aligned with the first optical element, wherein PIC comprises a second waveguide, the spacing between the first and second waveguides being sufficiently small to allow evanescent coupling of light between the first andAttorney Docket No. 56403-0014W01 second waveguides during operation of the module.

28. The module of claim 1, wherein the connector assembly is a first connector assembly, and the module further comprises a second connector assembly laterally spaced apart from the first connector assembly.

29. The module of claim 1, wherein the one or more optical elements comprise a first optical element disposed on a first side of the laser package and a second optical element disposed on the second side of the laser package opposite the first side.

30. The module of claim 1, wherein the one or more optical elements comprise a first optical element disposed on a first side of the PIC and a second optical element disposed on the second side of the PIC opposite the first side31. A system comprising: a plurality of modules, each module being a module of any of the preceding claims; a processor electrically coupled to each of the plurality of modules; one or more power sources coupled to each connector assembly of each module of the four or more modules; a multichip package substrate supporting the processor and the plurality of modules; and a plurality of fibers, each fiber being respectively coupled to a corresponding connector assembly of a corresponding one of the plurality modules, the plurality of fibers optically coupling each of the plurality of modules to one or more respective external components.

32. A system of I / O modules, wherein each I / O module is the module of any of the preceding claims, the connector assembly being compatible with advanced packaging integration.

33. The system of claim 32, wherein the advanced packaging integration is selected from the group consisting of wafer level silicon interposer integration (CoWoS), wafer level fan outAttorney Docket No. 56403-0014W01 packages (FoWLP), panel level packages, glass interposer, elevated fan out bridge, and embedded interconnect bridge.

34. A module comprising: a photonic integrated circuit (PIC) comprising one or more waveguides for guiding optical signals; a laser package comprising a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly comprising one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC.

35. A module comprising: an electronic integrated circuit (EIC); a photonic integrated circuit (PIC) stacked on and electrically connected to the EIC, the PIC comprising one or more waveguides for guiding optical signals; a laser package comprising a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly comprising one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC.

36. The module of any of claims 1, 34, or 35, further comprising: a substrate; and a spacer disposed on a surface of the substrate and supporting the PIC.

Images