Optical module heat dissipation device and optical module heat dissipation method

Abstract

An optical module heat dissipation device and method. The device comprises: a circuit board; mounting cages, used for mounting optical modules, wherein a plurality of mounting cages are provided, the plurality of mounting cages are provided on the circuit board, the optical modules are inserted into the mounting cages so as to be connected to the circuit board, and a first opening is provided on the side of each mounting cage distant from the circuit board; and a cold plate, provided on the sides of the mounting cages provided with the first openings, wherein the cold plate comprises a housing and a liquid cooling channel provided inside the housing, second openings are provided on the side of the housing close to the mounting cages, the second openings are arranged corresponding to the plurality of first openings, a flexible inner film is provided in the housing, the flexible inner film is at least provided at a position between the liquid cooling channel and the second openings, and the flexible inner film is in direct and / or indirect contact with the plurality of optical modules by means of the second openings and the first openings.

Description

Optical module heat dissipation device and optical module heat dissipation method Cross-reference to related applications

[0001] This disclosure claims priority to Chinese patent application No. 202411225140.9, filed on September 2, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical module heat dissipation technology, and in particular to an optical module heat dissipation device; this disclosure also relates to an optical module heat dissipation method, an optical module heat dissipation device manufacturing method, an optical module heat dissipation device manufacturing equipment, and a computing device. Background Technology

[0003] An optical module is a photoelectric conversion module that includes a transmitter and a receiver. The transmitter converts electrical signals into optical signals and transmits them via optical fiber; the receiver converts the optical signals received via optical fiber back into electrical signals. When the power consumption of a single optical module increases to 50W, air cooling is insufficient to solve the heat dissipation problem, and liquid cooling is required to ensure effective heat dissipation.

[0004] In existing technologies, each optical module can be equipped with an independent cold plate, but this method is very expensive and has a high risk of leakage. Moreover, this complex installation method is difficult to popularize. Alternatively, a single cold plate can be used to dissipate heat from multiple optical modules at the same time. However, due to the difference in assembly height between the optical modules, at least some optical modules will have a large gap with the cold plate, resulting in poor heat dissipation. Summary of the Invention

[0005] In view of this, the present disclosure provides a heat dissipation device and a heat dissipation method for optical modules to solve the problem of poor heat dissipation caused by the difference in assembly height of optical modules in the prior art.

[0006] According to a first aspect of the present disclosure, a heat dissipation device for an optical module is provided, comprising: a circuit board; a mounting cage for mounting an optical module; a plurality of mounting cages are disposed on the circuit board; the optical module is configured to be inserted into the mounting cage for connection with the circuit board; a first opening is provided on the side of the mounting cage away from the circuit board; a cold plate is disposed on the side of the mounting cage with the first opening; the cold plate includes a housing and a liquid cooling channel disposed inside the housing; a second opening is provided on the side of the housing adjacent to the mounting cage, the second opening being configured to correspond to the plurality of first openings; a flexible inner membrane is disposed in the housing, the flexible inner membrane being disposed at least between the liquid cooling channel and the second opening; the flexible inner membrane is configured to directly and / or indirectly contact the plurality of optical modules through the second opening and the first opening.

[0007] In one embodiment of this disclosure, the flexible inner membrane is configured to expand under the hydraulic pressure of the liquid in the liquid cooling channel to extend out of the second opening, and is configured to extend into the first opening to directly contact the optical module located within the mounting cage.

[0008] In one embodiment of this disclosure, when the mounting cage is empty, the flexible inner membrane expands to the minimum depth into the first opening, which is denoted as the first depth; after the optical module is inserted into the mounting cage, the flexible inner membrane expands to the maximum depth into the first opening, which is denoted as the second depth; the first depth is greater than the second depth.

[0009] In one embodiment of this disclosure, during the process of inserting the optical module into the mounting cage, the flexible inner membrane is configured to shrink under the compression of the optical module.

[0010] In one embodiment of this disclosure, a thermally conductive boss is further included, the thermally conductive boss being configured to be movably connected to the side of the housing adjacent to the mounting cage; one end of the thermally conductive boss is configured to always abut against the flexible inner membrane, and the other end is configured to extend into the first opening to abut against the optical module located within the mounting cage.

[0011] In one embodiment of this disclosure, when the mounting cage is empty, the minimum depth to which the heat-conducting protrusion extends into the first opening is denoted as the third depth; after the optical module is inserted into the mounting cage, the maximum depth to which the heat-conducting protrusion extends into the first opening is denoted as the fourth depth; the third depth is greater than the fourth depth.

[0012] In one embodiment of this disclosure, during the process of inserting the optical module into the mounting cage, the thermally conductive protrusion is configured to move in the direction of extending into the second opening under the squeezing action of the optical module, and the flexible inner membrane is configured to deform under the squeezing action of the thermally conductive protrusion.

[0013] In one embodiment of this disclosure, the mounting cage includes a connector for mounting the optical module; the heat-conducting boss has a guide ramp on the side facing the connector; during the process of the optical module being inserted into the mounting cage, the optical module is configured to cooperate with the guide ramp to press the heat-conducting boss in the direction of extending into the second opening.

[0014] In one embodiment of this disclosure, the liquid cooling channel is a flat cavity structure located within the housing, or the liquid cooling channel is constructed as a pipe that is laid out in a circuitous manner within the housing.

[0015] In one embodiment of this disclosure, the liquid cooling channel includes an inlet and an outlet, which are configured to be connected by a circulation pipeline disposed outside the cold plate; a drive pump is disposed on the circulation pipeline, and under the action of the drive pump, liquid is configured to flow back from the outlet to the inlet through the circulation pipeline.

[0016] In one embodiment of this disclosure, the direction perpendicular to the cold plate is denoted as the X-axis direction; the maximum deformation of the flexible inner membrane in the X-axis direction is greater than 1 mm; and the maximum height difference of the plurality of optical modules located in the mounting cage in the X-axis direction is less than 0.3 mm.

[0017] In one embodiment of this disclosure, multiple second openings are provided, and the multiple second openings are respectively provided corresponding to multiple first openings.

[0018] According to a second aspect of the present disclosure, a method for heat dissipation of an optical module is provided, applied to the optical module heat dissipation device provided in the first aspect of the present disclosure, comprising: absorbing heat generated by the optical module located in the mounting cage through the cold plate, and conducting the heat to a liquid contained in the liquid cooling channel; and dissipating the heat by utilizing the flow of the liquid.

[0019] According to a third aspect of the present disclosure, a method for manufacturing an optical module heat dissipation device is provided, for manufacturing the optical module heat dissipation device provided in the first aspect of the present disclosure, comprising: obtaining a circuit board, a mounting cage, and a cold plate; injecting cooling liquid into the liquid cooling channel of the cold plate until the expansion amount of the flexible inner membrane extending out of the second opening under hydraulic action reaches a predetermined expansion amount, thereby obtaining a target cold plate; fixing a plurality of mounting cages onto the circuit board, and fixing the target cold plate on the side of the mounting cage having a first opening, wherein the depth to which the flexible inner membrane extends into the first opening reaches a predetermined depth.

[0020] According to a fourth aspect of the present disclosure, an optical module heat dissipation device manufacturing apparatus is provided for manufacturing the optical module heat dissipation device provided in the first aspect of the present disclosure, comprising: a device acquisition module configured to acquire a circuit board, a mounting cage, and a cold plate; a liquid injection module configured to inject cooling liquid into the liquid cooling channel of the cold plate until the expansion amount of the flexible inner membrane extending out of the second opening under hydraulic action reaches a predetermined expansion amount, thereby obtaining a target cold plate; and a connection module configured to fix a plurality of mounting cages on the circuit board and fix the target cold plate on the side of the mounting cage having the first opening, thereby obtaining the optical module heat dissipation device, wherein the flexible inner membrane extends into the first opening to a predetermined depth.

[0021] According to a fifth aspect of the present disclosure, a computing device is provided, comprising: a plurality of optical modules; and a heat dissipation device for the optical modules provided in the first aspect of the present disclosure.

[0022] One embodiment of this disclosure provides a heat dissipation device for optical modules, including a circuit board, a mounting cage, and a cold plate. The cold plate has a flexible inner membrane that can directly or indirectly contact multiple optical modules through a second opening on the outer shell of the cold plate and a first opening on the mounting cage. The optical modules within the mounting cage have varying mounting heights. When optical modules of different heights contact the cold plate for heat dissipation, the flexible inner membrane absorbs the height difference between the optical modules. Compared to traditional heat dissipation solutions, this disclosure uses a single cold plate to simultaneously cool multiple optical modules of different heights, thereby saving heat dissipation costs. Furthermore, the flexible inner membrane can directly or indirectly contact the optical modules without gaps, thus improving the heat dissipation effect. Attached Figure Description

[0023] Figure 1 is a schematic diagram of the overall structure of a heat dissipation device for an optical module provided in an embodiment of the present disclosure;

[0024] Figure 2 is a partially exploded structural diagram of a heat dissipation device for an optical module provided in an embodiment of the present disclosure.

[0025] Figure 3 is an anatomical view of a heat dissipation device for an optical module provided in an embodiment of the present disclosure;

[0026] Figure 4 is a cross-sectional view of a heat dissipation device for an optical module provided in an embodiment of this disclosure;

[0027] Figure 5 is a partially enlarged cross-sectional view of a heat dissipation device for an optical module provided in an embodiment of the present disclosure;

[0028] Figure 6 is an anatomical view of another optical module heat dissipation device provided in an embodiment of the present disclosure;

[0029] Figure 7 is a cross-sectional view of another optical module heat dissipation device provided in an embodiment of the present disclosure;

[0030] Figure 8 is a partially enlarged cross-sectional view of another optical module heat dissipation device provided in an embodiment of the present disclosure;

[0031] Figure 9 is an anatomical view of another optical module heat dissipation device provided in an embodiment of the present disclosure;

[0032] Figure 10 is a flowchart of a heat dissipation method for an optical module provided in an embodiment of the present disclosure;

[0033] Figure 11 is a flowchart of a method for manufacturing a heat dissipation device for an optical module according to an embodiment of the present disclosure;

[0034] Figure 12 is a schematic diagram of the structure of a manufacturing equipment for a heat dissipation device for an optical module provided in an embodiment of the present disclosure;

[0035] Figure 13 is a structural block diagram of a computing device provided in an embodiment of the present disclosure.

[0036] The one-to-one correspondence between the component names and reference numerals in Figures 1 to 13 is as follows:

[0037] 1. Optical module; 2. Mounting cage; 21. First opening; 22. Plug-in interface; 3. Circuit board; 4. Cold plate; 41. Housing; 42. Liquid cooling channel; 421. Liquid inlet; 422. Liquid outlet; 43. Second opening; 44. Flexible inner membrane; 5. Thermally conductive boss; 51. Guide slope; 6. Circulation pipeline; 61. Drive pump. Detailed Implementation

[0038] Numerous specific details are set forth in the following description to provide a full understanding of this disclosure. However, this disclosure can be implemented in many other ways than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this disclosure. Therefore, this disclosure is not limited to the specific implementations disclosed below.

[0039] The terminology used in one or more embodiments of this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this disclosure. The singular forms “a,” “the,” and “the” as used in one or more embodiments of this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this disclosure refers to and includes any or all possible combinations of one or more associated listed items.

[0040] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this disclosure, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this disclosure, and similarly, second may also be referred to as first. Depending on the context, the word “if” as used herein may be interpreted as “when”, “in response to a determination”, or “when…”.

[0041] It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this disclosure.

[0042] Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0043] In this article, terms such as "up," "down," "front," "back," "left," and "right" are used only to indicate the relative positional relationship between related parts, rather than to define the absolute position of these related parts.

[0044] First, the terms and concepts involved in one or more embodiments of this disclosure will be explained.

[0045] An optical module is an integrated module used to convert optical signals into and out of electrical signals. For example, an optical module may include optoelectronic devices, functional circuits, and optical interfaces. The optoelectronic devices may include a transmitter and a receiver. Simply put, an optical module can convert electrical signals into optical signals at the transmitter and transmit them through optical fibers, while the receiver can convert the optical signals transmitted through the optical fiber back into electrical signals.

[0046] Mounting Cage: A hollow metal cage used to mount optical modules; it is the outer shell structure that constrains the installation of optical modules. The mounting cage forms the interface on the switch for inserting optical modules. For a typical 4RU switch, a single device has 128 optical modules, each inserted into its corresponding mounting cage. During the insertion process, some assembly differences may occur, resulting in a certain height difference between the optical modules on a single layer.

[0047] Cold plate: Also known as liquid-cooled plate or water-cooled plate, it is a device used to dissipate heat from optical modules. It achieves heat dissipation by introducing water or other cooling media into the system, which absorbs and carries away heat from the device.

[0048] AI clusters are increasingly demanding higher bandwidth, leading to higher transmission rates for optical modules: 100G optical modules consume 4.5W, 200G 6.5W, 400G 10W, 800G 16W, 1.6T 32W, and 3.2T 50W. When the power consumption of a single module reaches 50W, air cooling is insufficient to address the heat dissipation issue, necessitating liquid cooling to ensure effective heat dissipation. Existing heat dissipation technologies suffer from high cost, complex installation, high risk of leakage, and poor heat dissipation performance.

[0049] To address the aforementioned issues, this disclosure presents a design for a cold plate, thereby providing a novel optical module heat dissipation device. Furthermore, this disclosure also relates to an optical module heat dissipation method, a manufacturing method for an optical module heat dissipation device, manufacturing equipment for an optical module heat dissipation device, and a computing device, which will be described in detail in the following embodiments.

[0050] Example 1.

[0051] Referring to Figures 1 and 2, this embodiment provides a heat dissipation device for an optical module, including: a circuit board 3, a mounting cage 2, and a cold plate 4. The mounting cage 2 is used to mount the optical module 1. As shown in Figure 1, multiple mounting cages 2 are provided, and these multiple mounting cages 2 are disposed on the circuit board 3. Each mounting cage 2 can mount one optical module 1. The dimensions of each mounting cage 2 can be the same, thus allowing for the mounting of optical modules 1 of the same size. Furthermore, the identical dimensions of the mounting cages 2 ensure that their upper surfaces remain substantially flush, thereby facilitating the simultaneous heat dissipation of multiple optical modules 1 using a single cold plate 4.

[0052] As shown in Figure 2, the optical module 1 is configured to be inserted into the mounting cage 2 for connection to the circuit board 3. In one specific embodiment of this disclosure, the mounting cage 2 includes a connector 22 for mounting the optical module 1. The user can insert the optical module 1 into the mounting cage 2 through the connector 22, thereby connecting it to the circuit board 3 below. Under the constraint of the mounting cage 2, the optical module 1 can only be inserted into or removed from the mounting cage 2 through the connector 22, and will not move in any other direction relative to the mounting cage 2. In practical applications, both the circuit board 3 and the mounting cage 2 can be located inside the switch, with the connector 22 being the port exposed outside the switch housing, thus facilitating the user's insertion and removal of the optical module 1.

[0053] As shown in Figure 2, the mounting cage 2 has a first opening 21 on the side away from the circuit board 3, and the cold plate 4 is located on the side of the mounting cage 2 with the first opening 21. Referring to the view direction of Figure 2, the side of the mounting cage 2 with the first opening 21 is referred to as the upper side. It should be noted that this disclosure only limits the cold plate 4 to be located on the upper side of the mounting cage 2, and does not limit its specific fixing method. For example, the cold plate 4 can be directly fixed to the mounting cage 2 by a connector, or it can be fixed to the circuit board 3 by a bracket structure, or it can be fixed to other structures inside the switch.

[0054] The upper surface of the optical module 1 located inside the mounting cage 2 is lower than the upper surface of the mounting cage 2. For traditional rigid liquid-cooled plates, although the upper surface of the optical module 1 can be exposed through the first opening 21 and is not obstructed by the metal structure of the mounting cage 2, a certain gap still exists between the optical module 1 and the cold plate 4, making it difficult for the optical module 1 to directly contact the cold plate 4 for heat dissipation. To solve this problem, the structure of the cold plate 4 is designed in this embodiment.

[0055] Specifically, referring to FIG3, the cold plate 4 includes a housing 41 and a liquid cooling channel 42 disposed inside the housing 41. The liquid cooling channel 42 contains a liquid cooling medium, such as water. In a specific embodiment of this disclosure, referring to FIGS. 1 and 3, the liquid cooling channel 42 includes an inlet 421 and an outlet 422, which are configured to communicate through a circulation pipe 6 disposed outside the cold plate 4. A drive pump 61 is disposed on the circulation pipe 6, and under the action of the drive pump 61, liquid is configured to flow back from the outlet 422 to the inlet 421 through the circulation pipe 6.

[0056] Liquid flows from inlet 421 to outlet 422 in the liquid cooling channel 42, thereby carrying away the heat generated by the optical module 1 at the location it passes through. After the liquid flows out of the cold plate 4 from the outlet 422, it flows and cools down in the circulation pipe 6 under the action of the drive pump 61. When the liquid flows back to the inlet 421, the temperature of the liquid has dropped to a predetermined temperature, so it can re-enter the cold plate 4 to dissipate heat from the optical module 1. This disclosure, by setting up the circulation pipe 6, enables the recycling of the cooling medium, thereby reducing the cost of heat dissipation and improving the environmental friendliness of the cold plate 4.

[0057] In one embodiment of this disclosure, the liquid cooling channel 42 is a flat cavity structure located within the outer casing 41. This maximizes the heat dissipation area of ​​the entire cold plate 4, resulting in excellent heat dissipation. Furthermore, the flat cavity structure defined in this embodiment simplifies the internal structure of the cold plate 4, minimizing the risk of cooling medium leakage. Referring to the view direction of FIG3, in this embodiment, the liquid inlet 421 and the liquid outlet 422 can be two through holes respectively located on the right and left sides of the outer casing 41. Liquid flows into the liquid cooling channel 42 from the right-side liquid inlet 421 and flows to the left until it exits from the liquid outlet 422 and enters the circulation pipe 6.

[0058] In another embodiment of this disclosure, the liquid cooling channel 42 is constructed as a convoluted pipeline laid within the outer casing 41. Specifically, the pipeline can be laid in various ways, such as S-shaped, bow-shaped, or U-shaped, and this disclosure does not impose any specific limitations on this. This embodiment can lay the pipeline only at the position corresponding to the optical module 1, thereby reducing the waste of cooling capacity. Moreover, the convoluted pipeline can pass through the same optical module 1 multiple times, thereby further improving the heat dissipation effect. In addition, the flat cavity structure of the previous embodiment may cause a small amount of liquid located at the corners of the cold plate 4 to have difficulty flowing to the liquid outlet 422, resulting in uneven temperature at different positions of the cold plate 4; this embodiment restricts the flow direction of the liquid through the pipeline, and there are no dead corners where liquid accumulates in the cold plate 4, thereby improving the temperature uniformity of the cold plate 4.

[0059] As shown in Figure 3, a second opening 43 is provided on the side of the outer shell 41 adjacent to the mounting cage 2. The second opening 43 is configured to correspond to multiple first openings 21. A flexible inner membrane 44 is provided in the outer shell 41, and the flexible inner membrane 44 is at least located between the liquid cooling channel 42 and the second opening 43. The flexible inner membrane 44 is configured to directly and / or indirectly contact multiple optical modules 1 through the second opening 43 and the first openings 21. Specifically, the flexible inner membrane 44 can be made of a sealing flexible material with good thermal conductivity. The flexible inner membrane 44 can be directly attached to the optical module 1, thereby achieving direct contact with the optical module 1; other thermally conductive structures can also be provided between the flexible inner membrane 44 and the optical module 1, such as a thermally conductive protrusion 5 structure, thereby achieving indirect contact with the optical module 1; the flexible inner membrane 44 can also partially directly contact the optical module 1 and partially indirectly contact the optical module 1. All three contact methods can effectively achieve heat exchange, thereby enabling heat dissipation of the optical module 1 through the flexible inner membrane 44.

[0060] Without external force, the flexible inner membrane 44 is configured to expand to extend beyond the second opening 43 under the hydraulic pressure of the liquid in the liquid-cooled channel 42. The hydraulic pressure causes the flexible inner membrane 44 to deform. In areas shielded by the outer shell 41, the expanded flexible inner membrane 44 can fit tightly against the inner wall of the outer shell 41; and in locations where the second opening 43 is provided, the flexible inner membrane 44 can expand to extend beyond the second opening 43. Since the second opening 43 is correspondingly provided to the first opening 21, the flexible inner membrane 44 can directly and / or indirectly contact multiple optical modules 1 through the second opening 43 and the first opening 21.

[0061] In one specific embodiment of this disclosure, multiple second openings 43 may be provided, each corresponding to a plurality of first openings 21. The flexible inner membrane 44 can expand outward from each of the multiple second openings 43 to a position that directly and / or indirectly contacts the plurality of optical modules 1. In another specific embodiment of this disclosure, only one second opening 43 may be provided, which can cover the plurality of first openings 21, thus simultaneously corresponding to the plurality of first openings 21. The flexible inner membrane 44 can expand outward from one second opening 43 and simultaneously directly and / or indirectly contact the plurality of optical modules 1.

[0062] There are certain differences in the assembly height among the various optical modules 1 within the mounting cage 2. When optical modules 1 of different heights contact the cold plate 4 for heat dissipation, the flexible inner membrane 44 can absorb the height difference between the various optical modules 1. Compared with traditional heat dissipation solutions, this disclosure uses a single cold plate 4 to simultaneously cool multiple optical modules 1 of different heights, thereby saving heat dissipation costs. In addition, the flexible inner membrane 44 can directly and / or indirectly contact the optical modules 1 without any gap between them, thus improving the heat dissipation effect.

[0063] In one embodiment of this disclosure, referring to FIG4, the flexible inner membrane 44 is configured to extend into the first opening 21 to directly contact the optical module 1 located within the mounting cage 2. As mentioned above, the upper surface of the optical module 1 located within the mounting cage 2 is lower than the upper surface of the mounting cage 2, and a conventional rigid cold plate cannot directly contact the upper surface of the optical module 1. In this embodiment, the flexible inner membrane 44 expands under hydraulic pressure to extend out of the second opening 43. Since the cold plate 4 is tightly disposed with the mounting cage 2, the expanded flexible inner membrane 44 can extend into the interior of the first opening 21, thereby directly contacting the upper surface of the optical module 1. This improves the heat dissipation effect of the optical module 1. By employing a deformable flexible inner membrane 44, this disclosure achieves direct bonding between the cold plate 4 and the optical module 1, preventing loss of heat dissipation performance, thereby supporting heat dissipation of higher power optical modules 1. Furthermore, compared with heat dissipation through contact between the outer shell 41 of the cold plate 4 or the outer wall of the cold pipe and the optical module 1, the ultra-thin flexible inner membrane 44 can maximize the heat dissipation effect.

[0064] In one embodiment of this disclosure, when the mounting cage 2 is empty, the minimum depth to which the flexible inner membrane 44 expands into the first opening 21 is denoted as the first depth. Specifically, in its natural state, due to the possible differences in elasticity at various locations of the flexible inner membrane 44, and the possible different hydraulic pressures generated by the liquid flowing in the liquid cooling channel 42, the amount by which the flexible inner membrane 44 expands out from different second openings 43 may vary, thus causing the depth to which it extends into the first opening 21 to also vary. The minimum of these depths is denoted as the first depth.

[0065] After the optical module 1 is inserted into the mounting cage 2, the flexible inner membrane 44 expands to the maximum depth into the first opening 21, which is denoted as the second depth. Specifically, after the optical module 1 is inserted into the mounting cage 2, the optical module 1 will push the flexible inner membrane 44 upward. Due to the certain assembly differences in the height of each optical module 1, the flexible inner membrane 44 in contact with the optical module 1 with the shortest upper surface has the maximum depth into the first opening 21, which is denoted as the second depth.

[0066] The first depth is greater than the second depth. This means that even if the light module 1 has the shortest installation height, when the flexible inner membrane 44 is inserted into the shallowest part of the first opening 21 under its natural state, it can still push upwards against this portion of the flexible inner membrane 44. By limiting the first depth to be greater than the second depth, this disclosure ensures that each light module 1 inserted into the mounting cage 2 can push upwards against the flexible inner membrane 44, thereby ensuring that the flexible inner membrane 44 can directly contact the upper surface of each light module 1, thus improving heat dissipation.

[0067] Specifically, during the insertion of the optical module 1 into the mounting cage 2, the flexible inner membrane 44 is configured to shrink under the compression of the optical module 1. For example, the insertion depth of the flexible inner membrane 44 extending through a certain first opening 21 is 0.5 mm, and the distance between its lowest point and the circuit board 3 is 8.2 mm. When an optical module 1 with a height of 8.5 mm is inserted into the mounting cage 2, the optical module 1 will compress the flexible inner membrane 44 upwards, thereby reducing the depth of the flexible inner membrane 44 extending into the first opening 21 to 0.2 mm. In this way, when the optical module 1 is installed in place, the flexible inner membrane 44 can remain tightly attached to the upper surface of the optical module 1 under hydraulic pressure, thus ensuring the heat dissipation effect.

[0068] Referring to Figure 5, the two optical modules 1 assembled in the two mounting cages 2 have a height difference, with the optical module 1 on the right being taller. When these two optical modules 1 are inserted, the optical module 1 on the right can compress the flexible inner membrane 44 to a higher position, meaning the flexible inner membrane 44 extends into the first opening 21 to a smaller depth; while the optical module 1 on the left can compress the flexible inner membrane 44 to a lower position, meaning the flexible inner membrane 44 extends into the first opening 21 to a greater depth. Regardless of the height of the inserted optical module 1, the flexible inner membrane 44 can always adhere tightly to the upper surface of the optical module 1, thus absorbing the height difference between the optical modules 1 through the flexible inner membrane 44.

[0069] In one specific embodiment of this disclosure, as shown in FIG3, the direction perpendicular to the cold plate is denoted as the X-axis direction. The maximum deformation of the flexible inner membrane 44 in the X-axis direction is greater than 1 mm, and the maximum height difference of the multiple optical modules 1 located in the mounting cage 2 in the X-axis direction is less than 0.3 mm. This ensures that the deformation of the flexible inner membrane 44 is sufficient to absorb the maximum height difference of the multiple optical modules 1, so that a single cold plate 4 can simultaneously dissipate heat for multiple optical modules 1, and each optical module 1 can make good contact with the flexible inner membrane 44.

[0070] Example 2.

[0071] This embodiment also provides a heat dissipation device for an optical module. The only difference from Embodiment 1 is that the optical module 1 and the flexible inner membrane 44 are no longer in direct contact, but indirect contact. The other structures of the heat dissipation device for the optical module are exactly the same as those in Embodiment 1, and will not be described again here.

[0072] Referring to Figures 6 and 7, the optical module heat dissipation device also includes a heat-conducting boss 5. The heat-conducting boss 5 is configured to be movably connected to the side of the housing 41 adjacent to the mounting cage 2. For example, a slot can be opened on the side wall of the housing 41 at the second opening 43, and the heat-conducting boss 5 can be movably connected in the slot. A limiting structure can also be provided above the heat-conducting boss 5. The limiting structure can be located between the inner wall of the housing 41 and the flexible inner membrane 44, thereby suspending the heat-conducting boss 5 movably at the position of the second opening 43 through the limiting structure. Alternatively, the heat-conducting boss 5 can be fixed to the flexible inner membrane 44 at the position corresponding to the second opening 43, thereby driving the heat-conducting boss 5 to move through the deformation of the flexible inner membrane 44. One end of the heat-conducting boss 5 is configured to always abut against the flexible inner membrane 44, and the other end is configured to extend into the first opening 21 to abut against the optical module 1 located in the mounting cage 2. The heat-conducting boss 5 can be a metal block with good thermal conductivity, and its size is smaller than the first opening 21 and the second opening 43. Multiple heat-conducting protrusions 5 are provided, and each heat-conducting protrusion 5 can be movably connected to a position in a plurality of second openings 43. Referring to the view direction of Figure 7, the flexible inner membrane 44 is always in contact with the upper end face of the heat-conducting protrusion 5 under hydraulic action; the lower end face of the heat-conducting protrusion 5 can extend into the first opening 21 and abut against the optical module 1, thereby indirectly conducting the heat generated by the optical module 1 to the flexible inner membrane 44 through the heat-conducting protrusion 5, and dissipating the heat through the liquid in the liquid cooling channel 42.

[0073] In one embodiment of this disclosure, when the mounting cage 2 is empty, the minimum depth to which the heat-conducting boss 5 extends into the first opening 21 is denoted as the third depth. Specifically, in the natural state, due to certain assembly differences between the heat-conducting bosses 5, the amount by which each heat-conducting boss 5 extends from different second openings 43 may differ, and thus the depth to which it extends into the first opening 21 may also differ. The minimum of these depths is denoted as the first depth.

[0074] After the optical module 1 is inserted into the mounting cage 2, the maximum depth to which the heat-conducting protrusion 5 extends into the first opening 21 is recorded as the fourth depth. Specifically, after the optical module 1 is inserted into the mounting cage 2, the optical module 1 will push the heat-conducting protrusion 5 upward. Due to the certain assembly differences in the height of each optical module 1, the heat-conducting protrusion 5 in contact with the shortest optical module 1 on the upper end has a maximum depth to which it extends into the first opening 21, which is recorded as the second depth.

[0075] The third depth is greater than the fourth depth. This means that even if the light-conducting protrusion 5, which is the shallowest part of the first opening 21, is inserted into the first opening 21 in its natural state, the corresponding optical module 1, which has the lowest assembly height, can still push the light-conducting protrusion 5 upwards. By limiting the third depth to be greater than the fourth depth, this disclosure ensures that each optical module 1 inserted into the mounting cage 2 can push the light-conducting protrusion 5 upwards, thereby ensuring that the light-conducting protrusion 5 can tightly abut against the upper surface of each optical module 1, thus improving the heat dissipation effect.

[0076] Specifically, during the process of inserting the optical module 1 into the mounting cage 2, the heat-conducting protrusion 5 is configured to extend into the second opening 43 under the squeezing action of the optical module 1, and the flexible inner membrane 44 is configured to deform under the squeezing action of the heat-conducting protrusion 5. In its natural state, the flexible inner membrane 44 can maintain a basically undeformed state under the support of the upper surface of the heat-conducting protrusion 5; while after the optical module 1 lifts the heat-conducting protrusion 5, the upper end of the heat-conducting protrusion 5 will drive the flexible inner membrane 44 to extend into the second opening 43 together, thereby adaptively adjusting according to the height of the optical module 1. Alternatively, under natural conditions, the flexible inner membrane 44 undergoes a certain deformation. For example, the flexible inner membrane 44 can expand to extend beyond the second opening 43, allowing the heat-conducting protrusion 5 below it to extend sufficiently into the first opening 21. After the optical module 1 lifts the heat-conducting protrusion 5, the upper end of the heat-conducting protrusion 5 will cause the flexible inner membrane 44 to deform. For example, the flexible inner membrane 44 can deform to a state with a small expansion, or to a state that is basically flush, or to a state that retracts back into the second opening 43. When the optical module 1 is installed in place, the flexible inner membrane 44 can continuously adhere tightly to the heat-conducting protrusion 5 under hydraulic pressure, and press the heat-conducting protrusion 5 tightly onto the optical module 1, thereby ensuring the heat dissipation effect.

[0077] Referring to Figure 8, the two optical modules 1 assembled in the two mounting cages 2 have a height difference, with the left optical module 1 being taller. When these two optical modules 1 are inserted, the left optical module 1 can lift the heat-conducting protrusion 5 to a higher position, thereby squeezing the flexible inner membrane 44 to a higher position, which means that the flexible inner membrane 44 extends into the second opening 43 to a greater depth; while the right optical module 1 can lift the heat-conducting protrusion 5 to a lower position, thereby squeezing the flexible inner membrane 44 to a lower position, which means that the flexible inner membrane 44 extends into the second opening 43 to a lesser depth. Regardless of the height of the inserted optical module 1, the heat-conducting protrusion 5 can always be tightly attached to the upper surface of the optical module 1, realizing the absorption of the height difference between the optical modules 1 through the flexible inner membrane 44.

[0078] In one embodiment of this disclosure, as shown in FIG9, a guide ramp 51 is provided on the side of the heat-conducting protrusion 5 facing the insertion interface 22. During the process of inserting the optical module 1 into the mounting cage 2, the optical module 1 is configured to cooperate with the guide ramp 51 to press the heat-conducting protrusion 5 in the direction of extending into the second opening 43. Referring to the view direction of FIG9, the insertion interface 22 is located on the left side of the mounting cage 2, and the optical module 1 is inserted into the mounting cage 2 to the right; the guide ramp 51 is inclinedly located on the left side of the heat-conducting protrusion 5. During the insertion of the optical module 1, the optical module 1 will apply a rightward force to the guide ramp 51. The guide ramp 51 can decompose this force into an upward component force, thereby causing the heat-conducting protrusion 5 to move upward until the heat-conducting protrusion 5 moves to the point where its lower end face abuts against the upper end face of the optical module 1.

[0079] Example 3.

[0080] This embodiment provides a heat dissipation method for an optical module, which can be applied to the optical module heat dissipation devices provided in Embodiments 1 and 2. Figure 10 shows a flowchart of a heat dissipation method for an optical module provided in one embodiment of this disclosure. As shown in Figure 10, the heat dissipation method for the optical module may include the following steps S1002 to S1004.

[0081] S1002: The heat generated by the optical module 1 located in the mounting cage 2 is absorbed by the cold plate 4 and transferred to the liquid contained in the liquid cooling channel 42.

[0082] S1004: Heat is dissipated by utilizing the flow of liquid.

[0083] Specifically, the liquid cooling channel 42 in the cold plate 4 contains a liquid cooling medium such as water. The liquid flows from the inlet 421 to the outlet 422 in the liquid cooling channel 42, thereby absorbing the heat generated by the optical module 1 and conducting the heat into the liquid; the liquid flows out of the cold plate 4 from the outlet 422, thereby transferring the heat to the outside of the cold plate 4 and dissipating the heat.

[0084] In one embodiment of this disclosure, the liquid cooling channel 42 is a flat cavity structure located within the outer casing 41. This maximizes the heat dissipation area of ​​the entire cold plate 4, resulting in excellent heat dissipation and facilitating heat dissipation. Furthermore, the flat cavity structure defined in this embodiment greatly simplifies the internal structure of the cold plate 4, minimizing the risk of cooling medium leakage.

[0085] In another embodiment of this disclosure, the liquid cooling channel 42 is configured as a conduit laid in a circuitous manner within the housing 41. This embodiment allows the conduit to be laid only at the location corresponding to the optical module 1, thereby reducing heat waste and facilitating targeted absorption of the heat generated by the optical module 1. The circuitous conduit can pass through the same optical module 1 multiple times, further enhancing heat conduction. Furthermore, this embodiment restricts the flow of liquid through the conduit, eliminating dead zones where liquid can accumulate within the cold plate 4, thus improving the temperature uniformity of the cold plate 4.

[0086] Example 4.

[0087] This embodiment provides a method for manufacturing an optical module heat dissipation device, which can be used to manufacture the optical module heat dissipation devices provided in Embodiment 1 and Embodiment 2. Figure 11 shows a flowchart of a method for manufacturing an optical module heat dissipation device according to an embodiment of this disclosure. As shown in Figure 11, the method for manufacturing the optical module heat dissipation device may include the following steps S1102 to S1106.

[0088] S1102: Obtain circuit board 3, mounting cage 2 and cold plate 4.

[0089] Specifically, multiple mounting cages 2 of the same size can be obtained, which can then be used to mount optical modules 1 of the same size. The mounting cage 2 has a first opening 21 to facilitate heat dissipation between the optical module 1 inside the mounting cage 2 and the cold plate 4. Furthermore, the specific structure of the cold plate 4 is as described in Embodiment 1 or Embodiment 2. The cold plate 4 should include a flexible inner membrane 44, and the outer shell 41 of the cold plate 4 should have multiple second openings 43 corresponding to the first opening 21.

[0090] S1104: Inject cooling liquid into the liquid cooling channel 42 of the cold plate 4 until the expansion amount of the flexible inner membrane 44 extending out of the second opening 43 under hydraulic action reaches the predetermined expansion amount, and obtain the target cold plate 4.

[0091] Specifically, the amount of liquid injected into the liquid cooling channel 42 should not be too much, otherwise the flexible inner membrane 44 will expand to its maximum extent and lose its elasticity. The amount of liquid injected into the liquid cooling channel 42 should also not be too little, otherwise insufficient hydraulic pressure will result in the flexible inner membrane 44 failing to expand to directly or indirectly contact the optical module 1, which is detrimental to heat dissipation. When the expansion amount of the flexible inner membrane 44 extending beyond the second opening 43 under hydraulic pressure reaches the predetermined expansion amount, it means that the current liquid injection amount is appropriate, ensuring both sufficient hydraulic pressure and sufficient deformation space for the flexible inner membrane 44 to absorb the height difference of the optical module 1.

[0092] S1106: Fix multiple mounting cages 2 onto the circuit board 3, and fix the target cold plate 4 onto the side of the mounting cage 2 with the first opening 21, wherein the flexible inner membrane 44 extends into the first opening 21 to a predetermined depth.

[0093] Specifically, multiple mounting cages 2 can be sequentially soldered onto the circuit board 3, and the insertion interfaces 22 of the multiple mounting cages 2 in the same row should be in a basically flush position. The target cold plate 4 is fixed to the side of the mounting cage 2 with the first opening 21. Specifically, the cold plate 4 can be directly fixed to the mounting cage 2 via connectors, or fixed to the circuit board 3 via a bracket structure, or fixed to other structures inside the switch. Multiple second openings 43 on the target cold plate 4 correspond sequentially to multiple first openings 21, and the flexible inner membrane 44 can extend into the first opening 21. The depth to which the flexible inner membrane 44 extends into the first opening 21 should not be too shallow, otherwise the optical module 1 inserted into the mounting cage 2 will not be able to press against the flexible inner membrane 44, resulting in poor heat dissipation. When the flexible inner membrane 44 extends into the first opening 21 to a predetermined depth, it means that the current installation position is appropriate, and even if the optical module 1 is the shortest in assembly height, the optical module 1 can still push the flexible inner membrane 44 upwards. This ensures that the flexible inner membrane 44 can directly contact the upper surface of each optical module 1, improving the heat dissipation effect.

[0094] Example 5.

[0095] This embodiment provides an optical module heat dissipation device manufacturing equipment, which can be used to manufacture the optical module heat dissipation devices provided in Embodiments 1 and 2, and can also be used to execute the optical module heat dissipation device manufacturing method provided in Embodiment 4. Figure 12 shows a schematic diagram of the structure of an optical module heat dissipation device manufacturing equipment provided in one embodiment of this disclosure. As shown in Figure 12, the optical module heat dissipation device manufacturing equipment may include a device acquisition module 1202, a liquid injection module 1204, and a connection module 1206.

[0096] The component acquisition module 1202 is configured to acquire the circuit board 3, the mounting cage 2, and the cold plate 4. Specifically, the component acquisition module 1202 may include equipment and methods capable of acquiring the circuit board 3, the mounting cage 2, and the cold plate 4, such as a robotic arm, a sorting line, or manual sorting.

[0097] The liquid injection module 1204 is configured to inject cooling liquid into the liquid cooling channel 42 of the cold plate 4 until the expansion of the flexible inner membrane 44 beyond the second opening 43 under hydraulic pressure reaches a predetermined expansion amount, thereby obtaining the target cold plate 4. Specifically, the liquid injection module 1204 may include equipment and methods capable of injecting cooling liquid into the liquid cooling channel 42 of the cold plate 4, such as liquid filling equipment, liquid injection production line, and manual liquid injection.

[0098] The connection module 1206 is configured to fix multiple mounting cages 2 onto the circuit board 3 and fix the target cold plate 4 onto the side of the mounting cage 2 with the first opening 21, thereby obtaining a heat dissipation device for the optical module. The flexible inner membrane 44 extends into the first opening 21 to a predetermined depth. Specifically, the connection module 1206 may include welding equipment, splicing equipment, assembly lines, or other equipment and methods capable of connection and fixation.

[0099] It should be noted that the technical solution of the optical module heat dissipation device manufacturing equipment and the technical solution of the optical module heat dissipation device manufacturing method in Embodiment 4 belong to the same concept. For details not described in detail in the technical solution of the optical module heat dissipation device manufacturing equipment, please refer to the description of the technical solution of the optical module heat dissipation device manufacturing method.

[0100] Example 6.

[0101] This embodiment provides a computing device. Figure 13 shows a structural block diagram of a computing device provided in one embodiment of this disclosure. The components of the computing device 1300 include, but are not limited to, multiple optical modules 1, and the optical module heat dissipation device provided in Embodiment 1 and Embodiment 2.

[0102] In one embodiment of this disclosure, components of the computing device 1300 may be connected to each other, for example, via a bus, with other components not shown in FIG13. It should be understood that the computing device block diagram shown in FIG13 is for illustrative purposes only and is not intended to limit the scope of this disclosure. Those skilled in the art may add or replace other components as needed.

[0103] The computing device 1300 can be any type of stationary or mobile computing device, including routers, switches (e.g., LAN switches, network core switches, aggregation switches, Layer 3 switches, wireless switches, industrial switches, etc.), mobile computers or mobile computing devices (e.g., tablet computers, personal digital assistants, laptop computers, notebook computers, netbooks, etc.), mobile phones (e.g., smartphones), wearable computing devices (e.g., smartwatches, smart glasses, etc.) or other types of mobile devices, or stationary computing devices such as desktop computers or PCs. The computing device 1300 can also be a mobile or stationary server.

[0104] Taking the computing device 1300 as an example, the switch includes an optical module heat dissipation device, specifically including a circuit board 3, a cold plate 4, and multiple mounting cages 2 mounted on the circuit board 3. The insertion interfaces 22 of the multiple mounting cages 2 are exposed outside the switch housing. Multiple optical modules 1 can be inserted into the mounting cages 2 through the insertion interfaces 22, thereby connecting to the circuit board 3 for information transmission through the switch. Assembly errors exist during the insertion process, resulting in differences in the assembly height of the various optical modules 1 within the mounting cages 2. When optical modules 1 of different heights contact the cold plate 4 for heat dissipation, the flexible inner membrane 44 can absorb the height difference between the various optical modules 1. Compared with traditional heat dissipation solutions, this disclosure uses a single cold plate 4 to simultaneously cool multiple optical modules 1 of different heights, thereby saving heat dissipation costs. Furthermore, the flexible inner membrane 44 can directly and / or indirectly contact the optical modules 1 without gaps, thus improving the heat dissipation effect and enhancing the heat dissipation performance of the switch.

[0105] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this disclosure is not limited to the described order of actions, because according to this disclosure, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this disclosure.

[0106] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0107] The preferred embodiments disclosed above are merely illustrative of this disclosure. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this disclosure. These embodiments are selected and specifically described in this disclosure to better explain the principles and practical applications of this disclosure, thereby enabling those skilled in the art to better understand and utilize this disclosure. This disclosure is limited only by the claims and their full scope and equivalents.

Claims

1. A heat dissipation device for an optical module, wherein, include: Circuit board; Mounting cages are provided for mounting optical modules; multiple mounting cages are provided and multiple mounting cages are provided on the circuit board; the optical module is configured to be inserted into the mounting cage to connect with the circuit board; a first opening is provided on the side of the mounting cage away from the circuit board; A cold plate is disposed on the side of the mounting cage where a first opening is provided; the cold plate includes a shell and a liquid cooling channel disposed inside the shell; a second opening is provided on the side of the shell adjacent to the mounting cage, and the second opening is configured to correspond to a plurality of the first openings; The outer shell is provided with a flexible inner membrane, which is at least located between the liquid cooling channel and the second opening; The flexible inner membrane is configured to directly and / or indirectly contact the plurality of optical modules through the second opening and the first opening.

2. The optical module heat dissipation device as described in claim 1, wherein, The flexible inner membrane is configured to expand under the hydraulic pressure of the liquid in the liquid cooling channel to extend out of the second opening, and is also configured to extend into the first opening to directly contact the optical module located in the mounting cage.

3. The optical module heat dissipation device as described in claim 2, wherein, When the mounting cage is empty, the minimum depth to which the flexible inner membrane expands into the first opening is recorded as the first depth; after the optical module is inserted into the mounting cage, the maximum depth to which the flexible inner membrane expands into the first opening is recorded as the second depth; the first depth is greater than the second depth.

4. The optical module heat dissipation device as described in claim 3, wherein, During the process of inserting the optical module into the mounting cage, the flexible inner membrane is configured to shrink under the compression of the optical module.

5. The optical module heat dissipation device as described in claim 1, wherein, It also includes a thermally conductive boss configured to be movably connected to the side of the housing adjacent to the mounting cage; one end of the thermally conductive boss is configured to always abut against the flexible inner membrane, and the other end is configured to extend into the first opening to abut against the optical module located inside the mounting cage.

6. The optical module heat dissipation device as described in claim 5, wherein, When the mounting cage is empty, the minimum depth to which the heat-conducting protrusion extends into the first opening is recorded as the third depth; after the optical module is inserted into the mounting cage, the maximum depth to which the heat-conducting protrusion extends into the first opening is recorded as the fourth depth; the third depth is greater than the fourth depth.

7. The optical module heat dissipation device as described in claim 6, wherein, During the process of inserting the optical module into the mounting cage, the heat-conducting protrusion is configured to move in the direction of extending into the second opening under the squeezing action of the optical module, and the flexible inner membrane is configured to deform under the squeezing action of the heat-conducting protrusion.

8. The optical module heat dissipation device as described in claim 7, wherein, The mounting cage includes an interface for mounting the optical module; the heat-conducting boss has a guide ramp on the side facing the interface; during the process of the optical module being inserted into the mounting cage, the optical module is configured to cooperate with the guide ramp to press the heat-conducting boss in the direction of extending into the second opening.

9. The optical module heat dissipation device as described in claim 1, wherein, The liquid cooling channel is a flat cavity structure located inside the outer shell, or the liquid cooling channel is constructed as a pipeline laid in a circuitous manner inside the outer shell.

10. The optical module heat dissipation device as described in claim 1, wherein, The liquid cooling channel includes an inlet and an outlet, which are connected by a circulation pipe located outside the cold plate. A drive pump is installed on the circulation pipe, and under the action of the drive pump, the liquid is configured to flow back from the outlet to the inlet through the circulation pipe.

11. The optical module heat dissipation device as described in claim 1, wherein, The direction perpendicular to the cold plate is denoted as the X-axis direction; the maximum deformation of the flexible inner membrane in the X-axis direction is greater than 1 mm; The maximum height difference of the multiple optical modules located within the mounting cage in the X-axis direction is less than 0.3 mm.

12. The optical module heat dissipation device as described in claim 1, wherein, The second opening is provided in multiple ways, and each of the multiple second openings corresponds to a multiple of the first openings.

13. A method for heat dissipation of an optical module, applied to the optical module heat dissipation device as described in any one of claims 1 to 12, wherein, include: The heat generated by the optical module located in the mounting cage is absorbed by the cold plate and conducted to the liquid contained in the liquid cooling channel; The heat is dissipated by utilizing the flow of the liquid.

14. A method for manufacturing an optical module heat dissipation device, used to manufacture the optical module heat dissipation device as described in any one of claims 1 to 12, wherein, include: Acquire circuit boards, mounting cages, and cold plates; Cooling liquid is injected into the liquid cooling channel of the cold plate until the expansion of the flexible inner membrane extending out of the second opening under hydraulic pressure reaches the predetermined expansion amount, thus obtaining the target cold plate; Multiple mounting cages are fixed to the circuit board, and the target cold plate is fixed to the side of the mounting cage with the first opening, wherein the flexible inner membrane extends into the first opening to a predetermined depth.

15. A manufacturing apparatus for an optical module heat dissipation device, used to manufacture the optical module heat dissipation device as described in any one of claims 1 to 12, wherein, include: The component acquisition module is configured to acquire circuit boards, mounting cages, and cold plates; The liquid injection module is configured to inject cooling liquid into the liquid cooling channel of the cold plate until the expansion of the flexible inner membrane extending out of the second opening under hydraulic action reaches the predetermined expansion amount, thereby obtaining the target cold plate. The connection module is configured to fix multiple mounting cages onto a circuit board and fix a target cold plate onto the side of the mounting cage with a first opening, thereby obtaining a heat dissipation device for an optical module, wherein the flexible inner membrane extends into the first opening to a predetermined depth.

16. A computing device, wherein, include: Multiple optical modules; The optical module heat dissipation device as described in any one of claims 1 to 12.

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