Pressure detection device and thin-film pressure sensor assembly

Abstract

A pressure detection device, comprising a force-receiving layer and a thin-film pressure sensor assembly provided in an accommodating cavity. The accommodating cavity is formed in the force-receiving layer; the thin-film pressure sensor assembly comprises an inner layer, a thin-film pressure sensor, and a force transfer member; a support plane is formed on the inner layer; a support side of the thin-film pressure sensor is arranged on the support plane of the inner layer; and the force transfer member is arranged between the thin-film pressure sensor and the force-receiving layer. By using a thin-film pressure sensor as a pressure sensor, the pressure detection device of the present invention can sensitively sense and detect a pressing force applied thereto.

Description

Pressure detection device and thin-film pressure sensor assembly Technical Field

[0001] This invention relates to the field of pressure detection technology, and more specifically, to a pressure detection device. The invention further relates to a thin-film pressure sensor assembly. Background Technology

[0002] Pressure detection devices are commonly used to detect pressure on solid surfaces. The pressure sensor is the core component of this device, converting physical pressure signals into electrical signals, which are then output through a signal output circuit. Pressure sensors can be categorized based on their measurement principles and structural characteristics, including strain gauge pressure sensors, piezoelectric pressure sensors, capacitive pressure sensors, piezoresistive pressure sensors, and inductive pressure sensors. Thin-film pressure sensors, fabricated using modern thin-film processing technology, are either piezoelectric or piezoresistive and are widely used for pressure detection in medical equipment, home appliances, and machinery manufacturing. Summary of the Invention

[0003] The main advantage of this invention is that it provides a pressure detection device that uses a thin-film pressure sensor as its pressure sensor, so as to be able to sensitively sense the pressure applied to it.

[0004] According to an embodiment of the present invention, the present invention provides a pressure detection device, which includes:

[0005] The load-bearing layer forms a cavity; and

[0006] A thin-film pressure sensing assembly disposed within the receiving cavity, wherein the thin-film pressure sensing assembly includes an inner layer, a thin-film pressure sensor, and a force transmitter, wherein the inner layer forms a support plane, the support side of the thin-film pressure sensor is placed on the support plane of the inner layer, and wherein the force transmitter is disposed between the thin-film pressure sensor and the force-bearing layer.

[0007] The above and other advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

[0008] The above and other advantages and features of the present invention will be fully apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0009] Figure 1 is a perspective view of a pressure detection device according to a first embodiment of the present invention.

[0010] Figure 2 is another perspective view of a pressure detection device according to a first embodiment of the present invention, wherein the force-bearing layer of the pressure detection device shown in the figure has been removed.

[0011] Figure 3 is another perspective view of the pressure detection device according to the first embodiment of the present invention, wherein the force-bearing layer and pre-compression component of the pressure detection device shown in the figure are removed.

[0012] Figure 4 is a cross-sectional schematic diagram of a pressure detection device according to a first embodiment of the present invention.

[0013] Figure 5 is another cross-sectional schematic diagram of the pressure detection device according to the first embodiment of the present invention.

[0014] Figure 6 shows an optional embodiment of the pressure detection device according to the first embodiment of the present invention.

[0015] Figure 7 shows an optional embodiment of the thin-film pressure sensor assembly of the pressure detection device according to the first embodiment of the present invention.

[0016] Figure 8 shows another alternative embodiment of the thin-film pressure sensor assembly of the pressure detection device according to the first embodiment of the present invention.

[0017] Figure 9 shows another alternative embodiment of the thin-film pressure sensor assembly of the pressure detection device according to the first embodiment of the present invention.

[0018] Figure 10 shows another alternative implementation of the thin-film pressure sensor assembly of the pressure detection device according to the first embodiment of the present invention.

[0019] Figure 11 is a flowchart of a method for manufacturing a pressure detection device according to a first embodiment of the present invention.

[0020] Figure 12A is a cross-sectional schematic diagram of a pressure detection device according to a second embodiment of the present invention.

[0021] Figure 12B is a partially enlarged schematic diagram of a pressure detection device according to a second embodiment of the present invention.

[0022] Figure 12C is another partially enlarged schematic diagram of the pressure detection device according to the second embodiment of the present invention.

[0023] Figure 13A shows an optional embodiment of the pre-pressure device of the pressure detection device according to the second embodiment of the present invention.

[0024] Figure 13B shows another optional embodiment of the pre-pressure device of the pressure detection device according to the second embodiment of the present invention.

[0025] Figure 13C shows another optional embodiment of the pre-pressure device of the pressure detection device according to the second embodiment of the present invention.

[0026] Figure 13D shows another optional embodiment of the pre-pressure device of the pressure detection device according to the second embodiment of the present invention.

[0027] Figure 14 shows an optional embodiment of the pressure detection device according to the second embodiment of the present invention.

[0028] Figure 15A is a perspective view of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0029] Figure 15B is a schematic diagram of the assembly of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0030] Figure 16 is a cross-sectional schematic diagram of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0031] Figure 17 is a perspective view of the printed circuit board of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0032] Figure 18 is a cross-sectional schematic diagram of the printed circuit board of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0033] Figure 19 is a perspective view of the conductive element of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0034] Figure 20 is a flowchart of a method for manufacturing a thin-film pressure sensor assembly of a pressure detection device according to a second embodiment of the present invention.

[0035] Figure 21 shows an optional implementation of the printed circuit board of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0036] Figures 22A and 22B show optional embodiments of the conductive element of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0037] Figure 23 shows an optional implementation of the thin-film pressure sensor assembly of the pressure detection device according to the second embodiment of the present invention.

[0038] Figure 24 shows an optional implementation of a method for manufacturing a thin-film pressure sensor assembly of a pressure detection device according to a second embodiment of the present invention. Detailed Implementation

[0039] The following description is provided to enable those skilled in the art to implement the invention. Other obvious substitutions, modifications, and variations will arise for those skilled in the art. Therefore, the scope of protection of this invention should not be limited to the exemplary embodiments described herein.

[0040] Those skilled in the art will understand that, unless specifically indicated herein, the term "a" should be understood as "at least one" or "one or more," meaning that in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple.

[0041] Those skilled in the art should understand that, unless specifically indicated herein, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., refer to the orientation or position based on the accompanying drawings, and are merely for the convenience of describing the invention, and do not indicate or imply that the devices or elements involved must have a specific orientation or position. Therefore, the above terms should not be construed as limiting the invention.

[0042] As shown in Figures 1 to 5, a pressure detection device according to a first embodiment of the present invention is illustrated, comprising a thin-film pressure sensor assembly 100 and a force-receiving layer 200. The thin-film pressure sensor assembly 100 is disposed within a receiving cavity 210 of the force-receiving layer 200. The thin-film pressure sensor assembly 100 includes an inner layer 10, a thin-film pressure sensor 20, and a force transmission element 31. The inner layer 10 forms a support plane 101, and the support side 201 of the thin-film pressure sensor 20 is placed on the support plane 101 of the inner layer 10. The force transmission element 31 is disposed between the thin-film pressure sensor 20 and the force-receiving layer 200 to transmit pressure applied to the force-receiving layer 200 toward the sensing side 202 of the thin-film pressure sensor 20 to the sensing side 202 of the thin-film pressure sensor 20. Further, the force transmission member 31 forms a pressure-applying plane 3101, which is positioned directly opposite and placed on the sensing side 202 of the thin-film pressure sensor 20, thereby transmitting the pressure applied to the force-bearing layer 200 towards the sensing side 202 of the thin-film pressure sensor 20 as evenly as possible. Preferably, the force transmission member 31 is close to the sensing side 202 of the thin-film pressure sensor 20. It is understood that the inner layer 10 is made of a rigid material to provide support. Preferably, the dimension of the side of the force transmission member 31 opposite to the pressure-applying plane 3101 is not smaller than the dimension of the pressure-applying plane 3101, so as to better transmit the pressure applied to the force-bearing layer 200 towards the sensing side 202 of the thin-film pressure sensor 20. Preferably, the inner layer 10 of the pressure detection device according to the first embodiment of the present invention has an inner cavity, and other components or parts, such as batteries or circuit boards for fixing signal processing modules, can be placed in the inner cavity of the inner layer 10.

[0043] As shown in Figures 4 and 5, the thin-film pressure sensor assembly 100 of the pressure detection device according to the first embodiment of the present invention further includes a pre-pressure member 32, wherein the pre-pressure member 32 is disposed between the force-receiving layer 200 and the force transmission member 31, and wherein the pre-pressure member 32 is configured to apply a preset pressure toward the sensing side 202 of the thin-film pressure sensor 20 on the force transmission member 31. Accordingly, the preset pressure applied by the pre-pressure member 32 toward the sensing side 202 of the thin-film pressure sensor 20 to the force transmission member 31 is transmitted to the sensing side 202 of the thin-film pressure sensor 20 through the force transmission member 31, forming a preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20. Therefore, the force transmission member 31 and the pre-pressure member 32 of the thin-film pressure sensor assembly 100 form a pre-pressure device 30. It is worth noting that the preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20 generated by the pre-pressure device 30 is a constant preset pressure. In other words, the preset pressure generated by the pre-pressure device 30 and applied to the sensing side 202 of the thin-film pressure sensor 20 may change due to material aging of the pre-pressure member 32, but should always exist. Accordingly, the preset pressure generated by the pre-pressure device 30 and applied to the sensing side 202 of the thin-film pressure sensor 20 has an appropriate magnitude, which should be not less than the lower detection limit of the thin-film pressure sensor 20 and less than the upper detection limit of the thin-film pressure sensor 20. Those skilled in the art will understand that the inner layer 10 and the force transmission member 31 of the thin-film pressure sensor assembly 100 of the first embodiment of the present invention both have appropriate rigidity to transmit force to the sensing side 202 of the thin-film pressure sensor 20. Those skilled in the art will understand that the inner layer 10 and the force transmission member 31 are respectively made of appropriate materials, and the rigidity of the inner layer 10 is stronger than that of the force transmission member 31. Preferably, the preset pressure applied by the pre-pressure device 30 to the sensing side 202 of the thin-film pressure sensor 20 originates at least partially from the pre-pressure member 32. For example, the pre-compression member 32 can be fitted onto the force transmission member 31 via an interference fit. Alternatively, the pre-compression member 32 can be injection molded onto the force transmission member 31 so that it can be bound to the force transmission member 31 after cooling. Optionally, the preset pressure generated by the pre-compression device 30 and applied to the sensing side 202 of the thin-film pressure sensor 20 originates at least in part from the pressure pre-applied to the outer side 321 (or the side away from the force transmission member 31) of the pre-compression member 32 of the pre-compression device 30, and is transmitted to the sensing side 202 of the thin-film pressure sensor 20 via the pre-compression member 32 and the force transmission member 31 of the pre-compression device 30.For example, the preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20 via the pre-pressure device 30 may partially originate from the pressure applied by the force-receiving layer 200 to the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30. Therefore, the preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20 via the pre-pressure device 30 may also partially or entirely originate from the force-receiving layer 200.

[0044] Generally, thin-film pressure sensors always have a detection lower limit (or sensing lower limit). When the pressure applied to the sensing side of the thin-film pressure sensor is less than the detection lower limit, the sensor will have difficulty detecting the pressure. For example, if the detection lower limit of a certain thin-film pressure sensor is 5 g / cm³... 2 At this time, this type of thin-film pressure sensor will have difficulty detecting pressures less than 5 g / cm applied to the sensing side of the thin-film pressure sensor. 2 The detection limit varies depending on the type of membrane pressure sensor. Different types of membrane pressure sensors may have the same or different detection limits. However, even membrane pressure sensors of the same type may have different detection limits. When using membrane pressure sensors to detect pressure, the existence of the detection limit leads to poor product consistency, requiring individual product calibration, which increases production costs.

[0045] To address the aforementioned problems with thin-film pressure sensors, the thin-film pressure sensor assembly 100 of the pressure detection device according to the first embodiment of the present invention applies a preset pressure greater than the detection lower limit of the thin-film pressure sensor 20 to the sensing side 202 of the thin-film pressure sensor 20 via the pre-pressure device 30. When a user uses the thin-film pressure sensor assembly 100 to detect the pressure applied to a product using the thin-film pressure sensor assembly 100, it is only necessary to pre-detect the preset pressure applied to the thin-film pressure sensor 20 before detection. Then, using this pressure as the dynamic zero value of the thin-film pressure sensor assembly 100, the magnitude of the pressure applied to the product using the thin-film pressure sensor assembly 100 that is lower than the detection lower limit of the thin-film pressure sensor 20 can be detected (the actual force is obtained by subtracting the dynamic zero value from the detected pressure). Furthermore, since the actual pressure applied to the thin-film pressure sensor 20 is significantly higher than its detection lower limit, the detection result will be more accurate. In other words, the dynamic zero value of the thin-film pressure sensor assembly 100 is the result of detecting the pressure on the sensing side 202 of the thin-film pressure sensor 20 of the thin-film pressure sensor assembly 100 before detecting the pressure applied to the product using the thin-film pressure sensor assembly 100. Therefore, the dynamic zero value of the thin-film pressure sensor assembly 100 also changes when the environment changes. For example, when the temperature of the product using the thin-film pressure sensor assembly 100 decreases, the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100 may shrink, causing the dynamic zero value of the thin-film pressure sensor assembly 100 to increase. Alternatively, when the product using the thin-film pressure sensor assembly 100 has been used for a long time, the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100 may age, causing the dynamic zero value of the thin-film pressure sensor assembly 100 to decrease. However, since the dynamic zero value of the thin-film pressure sensor assembly 100 is the real-time detection of the pressure on the sensing side 202 of the thin-film pressure sensor 20 of the thin-film pressure sensor assembly 100 before detecting the pressure applied to the product using the thin-film pressure sensor assembly 100, the dynamic zero value of the thin-film pressure sensor assembly 100 changes accordingly with changes in the environment. However, the change in the dynamic zero value of the thin-film pressure sensor assembly 100 does not affect the actual force detection result of the thin-film pressure sensor assembly 100. Finally, since the dynamic zero value of the thin-film pressure sensor assembly 100 is detected in real time, and its change does not affect the pressure detection result of the thin-film pressure sensor assembly 100, the pressure detection device product using the thin-film pressure sensor assembly 100 does not need to be calibrated separately at the factory.

[0046] As shown in Figures 4 and 5, preferably, the force-receiving layer 200 of the pressure detection device according to the first embodiment of the present invention is integrally formed on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, so that the pressure applied to the force-receiving layer 200 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100 is better transmitted to the sensing side 202 of the thin-film pressure sensor 20 through the pre-pressure member 32 and the force transmission member 31, and can be sensed and detected by the thin-film pressure sensor assembly 100. Further, the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100 can isolate the thin-film pressure sensor 20 from the force-receiving layer 200 disposed on the outer side 321 of the pre-pressure member 32, thereby allowing the force-receiving layer 200 to be integrally formed on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30 by injection molding. Due to the isolation effect of the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100, during the injection molding of the force-bearing layer 200, the injection molding material, such as silicone, will not leak into the thin-film pressure sensor 20 and damage it. Optionally, the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100 can isolate the thin-film pressure sensor 20 from the force-transmitting member 31 disposed on the outer side 321 of the pre-pressure member 32 by covering the force-transmitting member 31 from the outside. Optionally, the pre-pressure member 32 of the pre-pressure device 30 is made of silicone. It is worth noting that when the force-bearing layer 200 is integrally formed on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, by controlling the forming of the force-bearing layer 200, the force-bearing layer 200 can also be contracted and bound to the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, so that the force-bearing layer 200 generates at least part of the preset pressure transmitted to the sensing side 202 of the thin film pressure sensor 20 via the pre-pressure device 30.

[0047] As shown in Figures 4 and 5, the thin-film pressure sensor assembly 100 of the pressure detection device according to the first embodiment of the present invention further includes a signal transmission circuit 111, wherein the signal transmission circuit 111 is used to transmit the thin-film pressure sensor 20 to the signal processing module 112 of the pressure detection device of the present invention. Preferably, the signal transmission circuit 111 is covered by the pre-compression member 32. Further, the signal transmission circuit 111 is disposed in the electrical connection area 12 of the inner layer 10, wherein the pre-compression member 32 is disposed outside the electrical connection area 12 of the inner layer 10 to cover the signal transmission circuit 111 of the thin-film pressure sensor 20.

[0048] As shown in Figures 3 to 5, preferably, in the pressure detection device according to the first embodiment of the present invention, the inner layer 10 of the thin-film pressure sensor assembly 100 forms a groove 103, wherein a support plane 101 is formed at the bottom 1031 of the groove 103, wherein the thin-film pressure sensor 20 is disposed within the groove 103, and the force transmission member 31 is partially disposed within the groove 103. Accordingly, the support plane 101 is formed at the bottom 1031 of the groove 103, so that the thin-film pressure sensor 20 is entirely disposed within the groove 103, which can protect the thin-film pressure sensor 20. Further, the force transmission member 31 is partially disposed within the groove 103, thereby partially protruding from the groove 103, so that the force transmission member 31 transmits the preset pressure generated (or transmitted) by the pre-pressing member 32 and the external pressing pressure received by the pre-pressing member 32 to the thin-film pressure sensor 20. The force transmission element 31 is partially disposed within the groove 103, which facilitates its positioning. As shown in Figures 3 to 5, the groove 103 further extends to the electrical connection area 12 of the inner layer 10, and the signal transmission circuit 111 is disposed within the groove 103 located in the electrical connection area 12, so that both the thin-film pressure sensor 20 and the signal transmission circuit 111 are securely disposed within the groove 103. Preferably, the pre-compression element 32 covers the entire groove 103 from the outside.

[0049] Figures 6 and 7 illustrate a specific example of a thin-film pressure sensor assembly 100 of a pressure detection device according to a first embodiment of the present invention. The thin-film pressure sensor assembly 100C has a force transmission element 31C further having an outer edge 311C, wherein the outer edge 311C forms a convex arcuate surface 3110C, wherein the arcuate surface 3110C extends outward and upward from the periphery 3102C of the pressure application plane 3101C. Preferably, the size of the pressure application plane 3101C of the force transmission element 31C of the pre-pressure device 30C of the thin-film pressure sensor assembly 100C is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20, and the pressure application plane 3101C of the force transmission element 31C is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin-film pressure sensor 20. The size of the pressure-applying surface 3101C of the force transmission element 31C is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20, and the pressure-applying surface 3101C of the force transmission element 31C is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin-film pressure sensor 20. This ensures that the external force applied to the corresponding part of the thin-film pressure sensor assembly 100C is transmitted to the thin-film pressure sensor 20 and is promptly and sensitively detected by the sensing side 202 of the thin-film pressure sensor 20. It is worth noting that when the outer edge 311C forms an edge, the sharp edge pressing on the sensing side 202 of the thin-film pressure sensor 20 for a long time can easily damage the sensing side 202 of the thin-film pressure sensor 20. Therefore, the arcuate surface 3110C of the outer edge 311C extends outward and upward from the periphery 3102C of the pressure-applying plane 3101C, and the pressure-applying plane 3101C of the force transmission member 31C is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin film pressure sensor 20. This can prevent the preset pressure from pressing on the force transmission member 31C for a long time, causing the force transmission member 31C to press on the sensing side 202 of the thin film pressure sensor 20 for a long time, thus damaging the sensing side 202 of the thin film pressure sensor 20.

[0050] Figure 8 shows another specific example of the thin-film pressure sensor assembly 100 of the pressure detection device according to the first embodiment of the present invention. The thin-film pressure sensor assembly 100D has a larger size for the pressure-applying plane 3101D of the force transmission member 31D of the pre-pressure device 30D than for the sensing side 202 of the thin-film pressure sensor 20. The sensing side 202 of the thin-film pressure sensor 20 is integrally overlapped and placed inside the outer edge 311D of the pressure-applying plane 3101D of the force transmission member 31D. This is to prevent the preset pressure from pressing on the force transmission member 31D for a long time, causing the edge of the outer edge 311D of the force transmission member 31D to press on the sensing side 202 of the thin-film pressure sensor 20 for a long time, thus damaging the sensing side 202 of the thin-film pressure sensor 20.

[0051] Figure 9 of the accompanying drawings shows another specific example of the thin-film pressure sensor assembly 100B of the pressure detection device according to the first embodiment of the present invention. The thin-film pressure sensor assembly 100B includes an inner layer 10, a thin-film pressure sensor 20, and a pre-compression member 30B. The inner layer 10 forms a support plane 101. The pre-compression member 30B includes a force transmission part 31B and a pressure generating part 32B. The pressure generating part 32B and the force transmission part 31B are integrally formed, and the force transmission part 31B extends from the inner side 322B of the pressure generating part 32B. The support side 201 of the thin-film pressure sensor 20 is disposed in the inner layer 10. The force transmission part 31B is disposed between the thin-film pressure sensor 20 and the pressure generating part 32B, wherein the force transmission part 31B forms a pressure applying surface 3101B, and the pressure applying surface 3101B is disposed facing the sensing side 202 of the thin-film pressure sensor 20. The pre-pressure member 30B is configured to generate a pressure toward the sensing side 202 of the thin-film pressure sensor 20, which is applied to the sensing side 202 of the thin-film pressure sensor 20 through the force transmission part 31B, thereby enabling the pre-pressure member 30B to generate a preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20. Further, the pre-pressure member 30B is configured to isolate the thin-film pressure sensor 20 from the force-bearing layer 200 disposed on the outer side 321B of the pressure generating part 32B.

[0052] As shown in Figure 9, the thin-film pressure sensor assembly 100B of the pressure detection device according to the first embodiment of the present invention further includes a force-bearing layer 200, wherein the force-bearing layer 200 is integrally formed on the outer side 321B of the pressure generating portion 32B of the pre-compression member 30B. It can be understood that the pre-compression member 30B of the thin-film pressure sensor assembly 100B can isolate the thin-film pressure sensor 20 from the force-bearing layer 200 disposed on the outer side 321B of the pressure generating portion 32B, thereby allowing the force-bearing layer 200 to be integrally formed on the outer side 321B of the pressure generating portion 32B by injection molding. Due to the isolation effect of the pre-compression member 30B of the thin-film pressure sensor assembly 100B, during the injection molding of the force-bearing layer 200, the injection molding material, such as silicone, will not leak into the thin-film pressure sensor 20 and damage the circuitry of the thin-film pressure sensor 20.

[0053] As shown in Figure 9 of the accompanying drawings, in the pressure detection device of the first embodiment of the present invention, the size of the pressure-applying plane 3101B of the force transmission part 31B of the pre-pressure member 30B of the thin-film pressure sensor assembly 100B is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20. The force transmission part 31B further has an outer edge 311B, wherein the outer edge 311B forms an outwardly convex arcuate surface 3110B, wherein the arcuate surface 3110B extends outward and upward from the periphery 3102B of the pressure-applying plane 3101B. Furthermore, the size of the pressure-applying plane 3101B of the force transmission part 31B is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20, and the pressure-applying plane 3101B of the force transmission part 31B is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin-film pressure sensor 20, to ensure that the external force applied to the thin-film pressure sensor assembly 100B is transmitted to the thin-film pressure sensor 20 and is promptly and sensitively detected by the sensing side 202 of the thin-film pressure sensor 20. Furthermore, the arcuate surface 3110B of the outer edge 311B extends outward and upward from the periphery 3102B of the pressure-applying plane 3101B, and the pressure-applying plane 3101B of the force transmission member 31B is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin film pressure sensor 20. This can prevent the preset pressure from pressing on the force transmission part 31B for a long time, causing the force transmission part 31B to press on the sensing side 202 of the thin film pressure sensor 20 for a long time, thus damaging the sensing side 202 of the thin film pressure sensor 20.

[0054] Figure 10 of the accompanying drawings shows another specific example of the thin-film pressure sensor assembly 100A of the pressure detection device according to the first embodiment of the present invention. The thin-film pressure sensor assembly 100A includes an inner layer 10, a thin-film pressure sensor 20, and a pre-pressure device 30A. The inner layer 10 forms a support plane 101, and the pre-pressure device 30A includes a force transmission element 31A and a pre-pressure element 32A. The support side 201 of the thin-film pressure sensor 20 is disposed on the support plane 101 of the inner layer 10. The force transmission element 31A... A pre-pressure device 30A is disposed between the thin-film pressure sensor 20 and the pre-pressure member 32A, wherein the force transmission member 31A forms a pressure-applying plane 3101A, and the pressure-applying plane 3101A is disposed facing the sensing side 202 of the thin-film pressure sensor 20. The pre-pressure member 32A is configured to generate a pressure applied to the force transmission member 31A towards the sensing side 202 of the thin-film pressure sensor 20, thereby enabling the pre-pressure device 30A to generate a preset pressure applied to the sensing side 202 of the thin-film pressure sensor 20. Further, the pre-pressure member 32A is configured to isolate the thin-film pressure sensor 20 from the force-receiving layer 200 disposed on the outer side 321A of the pre-pressure member 32A.

[0055] As shown in Figure 10, the pre-pressure device 30A of the thin-film pressure sensor assembly 100A of the pressure detection device according to the first embodiment of the present invention further includes a force-bearing layer 200, wherein the force-bearing layer 200 is integrally formed on the outer side 321A of the pre-pressure member 32A of the pre-pressure device 30A. It can be understood that the pre-pressure member 32A of the pre-pressure device 30A of the thin-film pressure sensor assembly 100A can isolate the thin-film pressure sensor 20 from the force-bearing layer 200 disposed on the outer side 321A of the pre-pressure member 32A, thereby allowing the force-bearing layer 200 to be integrally formed on the outer side 321A of the pre-pressure member 32A of the pre-pressure device 30A by injection molding. Due to the isolation effect of the pre-pressure member 32A of the pre-pressure device 30A of the thin-film pressure sensor assembly 100, during the injection molding of the force-bearing layer 200, the injection molding material, such as silicone, will not leak into the thin-film pressure sensor 20 and damage the signal transmission circuit 111 of the thin-film pressure sensor 20.

[0056] As shown in Figure 10, in the pressure detection device of the first embodiment of the present invention, the size of the pressure-applying plane 3101A of the force-transmitting member 31A of the pre-pressure device 30A of the thin-film pressure sensor assembly 100A is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20, and the pressure-applying plane 3101A of the force-transmitting member 31A is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin-film pressure sensor 20. The force-transmitting member 31A further has an outer edge 311A, wherein the outer edge 311A ​​forms an outwardly convex arcuate surface 3110A, wherein the arcuate surface 3110A extends outward and upward from the periphery 3102A of the pressure-applying plane 3101A. Furthermore, the size of the pressure-applying plane 3101A of the force transmission member 31A is smaller than the size of the sensing side 202 of the thin-film pressure sensor 20, and the pressure-applying plane 3101A of the force transmission member 31A is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin-film pressure sensor 20, to ensure that the external force applied to the thin-film pressure sensor assembly 20 is transmitted to the thin-film pressure sensor 20 and is promptly and sensitively detected by the sensing side 202 of the thin-film pressure sensor 20. Furthermore, the arcuate surface 3110A of the outer edge 311A ​​extends outward and upward from the periphery 3102A of the pressure-applying plane 3101A, and the pressure-applying plane 3101A of the force transmission member 31A is integrally overlapped and placed inside the periphery 2021 of the sensing side 202 of the thin film pressure sensor 20. This can prevent the preset pressure from pressing on the force transmission member 31A for a long time, causing the force transmission member 31A to press on the sensing side 202 of the thin film pressure sensor 20 for a long time, thus damaging the sensing side 202 of the thin film pressure sensor 20.

[0057] As shown in Figure 10, in the pressure detection device of the first embodiment of the present invention, the top end 312A of the force transmission member 31A of the pre-pressure device 30A of the thin film pressure sensor assembly 100A forms an outward protrusion 3121A, wherein the shape and size of the outward protrusion 3121A are configured to adapt to the inner side 322A of the pre-pressure member 32A of the pre-pressure device 30A, so that the force transmission member 31A and the pre-pressure member 32A of the pre-pressure device 30A can fit tightly together.

[0058] As shown in Figure 11 of the accompanying drawings, according to the first embodiment of the present invention, the present invention further provides a pressure detection method, which includes the following steps: First, the support side of the thin-film pressure sensor of the thin-film pressure sensor assembly is disposed on the support plane, and a preset pressure is applied to the sensing side of the thin-film pressure sensor of the thin-film pressure sensor assembly, wherein the preset pressure is greater than the detection lower limit of the thin-film pressure sensor; before detecting the external force on the thin-film pressure sensor assembly, the magnitude of the pressure on the sensing side of the thin-film pressure sensor of the thin-film pressure sensor assembly is detected, and the magnitude of the detected pressure is used as the dynamic zero value of the thin-film pressure sensor assembly; finally, after the thin-film pressure sensor assembly is subjected to an external force, the magnitude of the force on the sensing side of the thin-film pressure sensor is detected again, and the magnitude of the external force on the thin-film pressure sensor assembly is calculated based on the dynamic zero value. Preferably, the preset pressure applied to the sensing side of the thin-film pressure sensor of the thin-film pressure sensor assembly is a constant preset pressure. In other words, the preset pressure applied to the sensing side of the thin-film pressure sensor should always exist. Furthermore, the preset pressure applied to the sensing side of the thin-film pressure sensor should be greater than the lower detection limit of the thin-film pressure sensor and less than the upper detection limit of the thin-film pressure sensor.

[0059] Referring to Figures 12A to 12C and 15A to 19 of the accompanying drawings, a pressure detection device according to a second embodiment of the present invention is illustrated, comprising a thin-film pressure sensor assembly 100M and a force-receiving layer 200M, wherein the thin-film pressure sensor assembly 100M is disposed within a receiving cavity 210M of the force-receiving layer 200M, wherein the thin-film pressure sensor assembly 100M includes a printed circuit board 10M, at least two conductive elements 20M, a pressure-sensing layer 30M, an insulating layer 40M, and a force-transmitting element 31, wherein the printed circuit board 10M forms a predetermined surface 101M and at least one vent 102M, wherein the at least two conductive elements 201M... M is disposed on the preset surface 101M, the pressure sensing layer 30M is attached to the preset surface 101M, the insulating layer 40M is disposed on the outer side 301M of the pressure sensing layer 30M, the at least one vent 102M extends from the preset surface 101M, wherein the at least two conductive elements 20M are disposed spaced apart from each other, and the at least two conductive elements 20M are respectively and at least partially covered by the pressure sensing layer 30M, wherein the force transmitting element 31 is disposed between the insulating layer 40M and the force receiving layer 200M for transmitting the pressure applied to the force receiving layer 200M toward the pressure sensing layer 30M. Preferably, the printed circuit board 10M is a rigid circuit board. Preferably, at least one vent 102M is disposed between the two conductive elements 20M of the at least two conductive elements 20M. Preferably, the at least two conductive elements 20M protrude outward from the preset surface 101M in a direction perpendicular to the preset surface 101M. Further, the force transmitting element 31 forms a pressure-applying plane 3101, and the pressure-applying plane 3101 is positioned opposite and placed on the pressure-sensing layer 30M, thereby transmitting the pressure applied to the force-receiving layer 200M towards the pressure-sensing layer 30M as evenly as possible. Preferably, the force transmitting element 31 is close to the insulating layer 40M. Preferably, the dimension of the side of the force transmitting element 31 opposite to the pressure-applying plane 3101 is not smaller than the dimension of the pressure-applying plane 3101, so as to better transmit the pressure applied to the force-receiving layer 200M towards the pressure-sensing layer 30M. Exemplarily, the insulating layer 40M is a polyester (PET) or polyimide (PI) film.

[0060] It is worth noting that printed circuit boards (PCBs) are electronic components found in almost all electronic devices. Integrating the thin-film pressure sensing component onto a PCB to create an integrated thin-film pressure sensor PCB simplifies the manufacturing process and reduces the structural complexity of the thin-film pressure sensor. In particular, thin-film pressure sensors are relatively fragile; attaching them to a support surface and electrically connecting them to a signal processing module is difficult, inconsistent, and prone to damage. However, if the thin-film pressure sensing component is pre-integrated onto the PCB, only the PCB needs to be installed in the appropriate location; the thin-film pressure sensor does not need to be installed separately. Furthermore, the PCB is stronger and less prone to damage during installation.

[0061] As shown in Figures 12A to 12C and Figures 15A to 19, in the pressure detection device according to the second embodiment of the present invention, at least two conductive elements 20M of the thin-film pressure sensor assembly 100M are disposed on the preset surface 101M. The pressure sensing layer 30M is attached to the preset surface 101M and at least partially covered by the pressure sensing layer 30M to ensure electrical connection between the at least two conductive elements 20M and the pressure sensing layer 30M. The at least two conductive elements 20M are spaced apart from each other to avoid short circuits between the at least two conductive elements 20M and to avoid affecting the detection effect of the pressure detection device of the present invention. At least one vent 102M extends from the preset surface 101M, and at least one vent 102M is disposed between two conductive elements 20M of the at least two conductive elements 20M, so that the pressure sensing layer 30M can deform under external force and recover its original shape after the external force is removed. As shown in Figure 16, preferably, the insulating layer 40M completely covers the pressure sensing layer 30M to avoid the pressure sensing layer 30M from being electrically connected to conductors other than the at least two conductive elements 20M and affecting the detection effect of the pressure detection device of the present invention.

[0062] It is worth noting that, in the pressure detection device according to the second embodiment of the present invention, the pressure sensing layer 30M of the thin-film pressure sensor assembly 100M is directly attached to the preset surface 101M of the printed circuit board 10M. Therefore, the preset surface 101M of the printed circuit board 10M provides support for the pressure sensing layer 30M, and this support is not affected by the flatness of the preset surface 101M of the printed circuit board 10M. This solves the problem that existing thin-film pressure sensors are placed as independent components on the surface of the object being detected, and the uneven surface of the object makes it difficult to provide stable and continuous support for the existing thin-film pressure sensors. Furthermore, since the pressure sensing layer 30M of the thin-film pressure sensor assembly 100M of the pressure detection device of the present invention is directly attached to the preset surface 101M of the printed circuit board 10M, the manufacturing process of the printed circuit board 10M (e.g., circuit printing or soldering process) can be used to fix the at least two conductive elements 20M and the at least one pre-set vent 102M on the preset surface 101M of the printed circuit board 10M, thereby reducing the manufacturing difficulty of the entire thin-film pressure sensor assembly 100M. Accordingly, in the pressure sensing component 100M of the pressure detection device of the present invention, the pressure sensing layer 30M is directly attached to the preset surface 101M of the printed circuit board 10M, eliminating the need for it to be installed on the surface of the object being tested by a user or operator as a separate component. This avoids the impact of user or operator installation operations on the accuracy and consistency of the detection results. At least two conductive elements 20M are pre-fixed to the printed circuit board 10M through circuit printing or soldering processes, ensuring sufficient contact and electrical connection between the at least two conductive elements 20M and the pressure sensing layer 30M. Furthermore, it eliminates the need to consider how to ensure the fixation or positioning of the electrodes (or conductive elements) of the thin-film pressure sensor during the manufacturing process. Finally, in existing thin-film pressure sensors, when subjected to force, the electrodes mostly deform with the pressure sensing layer. After prolonged use, the electrodes and the pressure sensing layer easily separate, or the electrodes detach from the pressure sensing layer. In the pressure detection device of the present invention, the at least two conductive elements 20M of the thin-film pressure sensing component 100M are fixedly disposed on the printed circuit board 10M, and are substantially undeformed by the deformation of the pressure sensing layer 30M, thereby maintaining good contact with the pressure sensing layer 30M and ensuring electrical connection between the two. Furthermore, the printed circuit board 10M can be configured in various shapes as needed, such as circular, square, U-shaped, or other shapes.

[0063] As shown in Figures 15B to 18, the printed circuit board 10M of the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention forms at least one vent 102M, which extends from the preset surface 101M. As shown in Figures 16 to 18, preferably, the at least one vent 102M extends from the preset surface 101M toward the back surface 103M of the printed circuit board 10M. More preferably, the at least one vent 102M is a through hole extending from the preset surface 101M to the back surface 103M of the printed circuit board 10M. It can be understood that the preset surface 101M and the back surface 103M of the printed circuit board 10M are two opposing surfaces. As shown in Figure 21, optionally, the at least one vent 102M may also be a groove (or recess) extending on the preset surface 101M. As shown in Figures 16 to 18, more preferably, the printed circuit board 10M of the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention forms a plurality of vents 102M, and the plurality of vents 102M are respectively formed between every two conductive elements 20M. Those skilled in the art will understand that the vents 102M should have an appropriate inner diameter. Exemplarily, the vents 102M may have an inner diameter of 1 mm to 3 mm.

[0064] It is worth noting that, in the pressure detection device according to the second embodiment of the present invention, the at least one vent 102M of the thin-film pressure sensing component 100M can be formed from a circuit via of the printed circuit board 10M. Alternatively, the at least one vent 102M of the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention can be formed from a circuit via of the printed circuit board 10M.

[0065] As shown in Figures 15B to 19, the at least two conductive elements 20M of the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention are fixed to the printed circuit board 10M. As shown in Figures 16 to 19, optionally, the at least two conductive elements 20M extend from the preset surface 101M toward the back surface 103M of the printed circuit board 10M. In other words, the at least two conductive elements 20M are embedded in the printed circuit board 10M. Accordingly, the at least two conductive elements 20M of the thin-film pressure sensing component 100M form two electrodes of the thin-film pressure sensing component 100M. As shown in Figures 22A to 22B, optionally, the at least two conductive elements 20M may also extend on the preset surface 101M.

[0066] As shown in Figures 15B to 19, in the pressure detection device according to the second embodiment of the present invention, each of the at least two conductive elements 20M of the thin-film pressure sensing component 100M forms an electrical connection portion 21M and an electrical conduction portion 22M extending from the electrical connection portion 21M. The electrical connection portion 21M is fixedly disposed on the preset surface 101M of the printed circuit board 10M. The electrical conduction portion 22M protrudes outward from the preset surface 101M in a vertical direction from the electrical connection portion 21M, and the electrical connection portion 21M is completely covered by the pressure sensing layer 30M.

[0067] As shown in Figures 15B to 19, optionally, the at least two conductive elements 20M of the thin-film pressure sensing assembly 100M of the pressure sensing device according to the second embodiment of the present invention extend along the predetermined surface 101M of the printed circuit board 10M. It is understood that the electrically conductive portion 22M of each of the at least two conductive elements 20M is adapted to be electrically connected to an external resistance detection device or instrument for detecting the resistance of the pressure sensing layer 30M. Accordingly, the electrically connected portion 21M of each of the at least two conductive elements 20M of the thin-film pressure sensing assembly 100M of the pressure sensing device according to the second embodiment of the present invention has an appropriate height and length to ensure sufficient contact with the pressure sensing layer 30M and to ensure electrical connection between the electrically connected portion 21M and the pressure sensing layer 30M.

[0068] As shown in Figures 15B to 19, optionally, the electrically conductive portion 22M of each of the at least two conductive elements 20M of the pressure sensing assembly 100M of the pressure sensing device according to the second embodiment of the present invention extends from the electrically connected portion 21M toward the back surface 103M of the printed circuit board 10M. As shown in Figures 22A to 22B, optionally, the electrically conductive portion 22M of each of the at least two conductive elements 20M of the pressure sensing assembly 100M of the pressure sensing device according to the second embodiment of the present invention extends from the electrically connected portion 21M along the outer surface of the printed circuit board 10M. Accordingly, the insulating layer 40M may extend outward from the pressure sensing layer 30M and further cover the electrically conductive portion 22M.

[0069] As shown in Figures 12A to 12C, the thin-film pressure sensor assembly 100M of the pressure detection device according to the second embodiment of the present invention further includes a pre-pressure member 32, wherein a force transmission member 31 is disposed between the insulating layer 40M and the pre-pressure member 32, wherein the pre-pressure member 32 is configured to apply a preset pressure toward the insulating layer 40M to the force transmission member 31. Accordingly, the preset pressure toward the insulating layer 40M applied by the pre-pressure member 32 to the force transmission member 31 is transmitted to the insulating layer 40M through the force transmission member 31 and forms a preset pressure applied to the insulating layer 40M. Therefore, the force transmission member 31 and the pre-pressure member 32 of the thin-film pressure sensor assembly 100M form a pre-pressure device 30. It is worth noting that the preset pressure applied to the insulating layer 40M (or the pressure sensing layer 30M) generated by the pre-pressure device 30 is a constant preset pressure. In other words, the preset pressure applied to the insulating layer 40M by the pre-pressure device 30 may change due to material aging of the pre-pressure member 32, but should always exist. Accordingly, the preset pressure applied to the insulating layer 40M by the pre-pressure device 30 has an appropriate magnitude, which should be greater than the lower detection limit of the pressure sensing layer 30M and less than the upper detection limit of the pressure sensing layer 30M. Those skilled in the art will understand that the force transmission member 31 of the thin-film pressure sensor assembly 100M of the second embodiment of the present invention has appropriate rigidity to transmit force to the insulating layer 40M. Preferably, the preset pressure applied to the insulating layer 40M by the pre-pressure device 30 originates at least partially from the pre-pressure member 32. For example, the pre-pressure member 32 can be fitted onto the force transmission member 31 by an interference fit. Alternatively, the pre-pressure member 32 can be injection molded onto the force transmission member 31 so that it can be bound to the force transmission member 31 after cooling. Optionally, the preset pressure generated by the pre-pressure device 30 and applied to the insulating layer 40M originates at least partially from the pressure pre-applied to the outer side 321 (or the side away from the force transmission member 31) of the pre-pressure member 32 of the pre-pressure device 30, and is transmitted to the insulating layer 40M via the pre-pressure member 32 and the force transmission member 31 of the pre-pressure device 30. For example, the preset pressure applied to the insulating layer 40M via the pre-pressure device 30 may originate partially from the pressure applied by the force-bearing layer 200M to the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30.

[0070] Generally, thin-film pressure sensors always have a detection lower limit (or sensing lower limit). When the pressure applied to the sensing side of the thin-film pressure sensor is less than the detection lower limit, the sensor will have difficulty detecting the pressure. For example, if the detection lower limit of a certain thin-film pressure sensor is 5 g / cm², this type of sensor will have difficulty detecting pressures less than 5 g / cm² applied to its sensing side. Different types of thin-film pressure sensors may have the same or different detection lower limits. However, even within the same type of thin-film pressure sensor, their detection lower limits may differ. When using thin-film pressure sensors to detect pressure, the existence of the detection lower limit leads to poor product consistency, requiring individual product calibration, which increases production costs.

[0071] To address the aforementioned problems with thin-film pressure sensors, the thin-film pressure sensor assembly 100M of the pressure detection device according to the second embodiment of the present invention applies a preset pressure greater than the detection lower limit of the pressure sensing layer 30M to the insulating layer 40M (corresponding to the force-bearing or sensing side of the thin-film pressure sensor) via the pre-pressure device 30. When a user uses the thin-film pressure sensor assembly 100M to detect the pressure on a product using the thin-film pressure sensor assembly 100M, it is only necessary to pre-detect the preset pressure on the thin-film pressure sensor assembly 100M before detection. Then, using this pressure as the dynamic zero value of the thin-film pressure sensor assembly 100M, the pressure applied to the product using the thin-film pressure sensor assembly 100M that is lower than the detection lower limit of the pressure sensing layer 30M can be detected (the actual force is obtained by subtracting the dynamic zero value from the detected pressure). Furthermore, since the actual pressure on the pressure sensing layer 30M is significantly higher than its detection lower limit, the detection result will be more accurate. In other words, the dynamic zero value of the thin-film pressure sensor assembly 100M is the result of detecting the pressure on the insulating layer 40M of the thin-film pressure sensor assembly 100M before detecting the pressure applied to the product using the thin-film pressure sensor assembly 100M. Therefore, the dynamic zero value of the thin-film pressure sensor assembly 100M also changes when the environment changes. For example, when the temperature of the product using the thin-film pressure sensor assembly 100M decreases, the pre-pressure element 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100M may shrink, causing the dynamic zero value of the thin-film pressure sensor assembly 100M to increase. Alternatively, after the product using the thin-film pressure sensor assembly 100M has been used for a long time, the pre-pressure element 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100M may age, causing the dynamic zero value of the thin-film pressure sensor assembly 100M to decrease. However, since the dynamic zero value of the thin-film pressure sensor assembly 100M is a real-time detection of the pressure on the insulating layer 40M of the thin-film pressure sensor assembly 100M before detecting the pressure applied to the product using the thin-film pressure sensor assembly 100M, the dynamic zero value of the thin-film pressure sensor assembly 100M changes accordingly with environmental changes. However, the change in the dynamic zero value of the thin-film pressure sensor assembly 100M does not affect the actual force detection result of the thin-film pressure sensor assembly 100M. Finally, since the dynamic zero value of the thin-film pressure sensor assembly 100M is detected in real time, its change does not affect the pressure detection result of the thin-film pressure sensor assembly 100M. Therefore, pressure detection devices using the thin-film pressure sensor assembly 100M do not require separate calibration at the factory.

[0072] As shown in Figures 12A to 12C, preferably, the force-bearing layer 200M of the pressure detection device according to the second embodiment of the present invention is integrally formed on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, so that the pressure applied to the force-bearing layer 200M of the pre-pressure device 30 of the thin-film pressure sensor assembly 100M is better transmitted to the insulating layer 40M through the pre-pressure member 32 and the force transmission member 31, and can be sensed and detected by the thin-film pressure sensor assembly 100M. Further, the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100M can isolate the insulating layer 40M from the force-bearing layer 200M disposed on the outer side 321 of the pre-pressure member 32, thereby allowing the force-bearing layer 200M to be integrally formed on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30 by injection molding. Due to the isolating effect of the pre-pressure member 32 of the pre-pressure device 30 of the thin-film pressure sensor assembly 100M, the injection molding material, such as silicone, will not leak into the insulating layer 40M during the injection molding of the force-bearing layer 200M. Furthermore, the pre-pressure member 32 of the pre-pressure device 30 can also be made of silicone. It is worth noting that when the force-bearing layer 200M is integrally molded on the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, by controlling the molding of the force-bearing layer 200M, it is also possible to cause the force-bearing layer 200M to contract and bind to the outer side 321 of the pre-pressure member 32 of the pre-pressure device 30, so that the force-bearing layer 200M generates at least part of a preset pressure transmitted to the insulating layer 40M via the pre-pressure device 30. Therefore, the preset pressure applied to the insulating layer 40M via the pre-pressure device 30 may also originate partly or even entirely from the force-bearing layer 200M.

[0073] As shown in Figures 12A to 12C, the pressure detection device according to the second embodiment of the present invention further includes an inner layer 10, which forms a through groove 104. A printed circuit board 10M is disposed inside the inner layer 10, and the predetermined surface 101M of the printed circuit board 10M is positioned directly opposite the through groove 104, allowing it to be exposed through the through groove 104. Further, the pressure sensing layer 30M and the insulating layer 40M are disposed within the through groove 104, and the at least two conductive elements 20M and the force transmitting element 31 are partially disposed within the through groove 104. Correspondingly, the pressure sensing layer 30M and the insulating layer 40M are integrally disposed within the through groove 104, providing them with protection. Furthermore, the force transmission member 31 is partially disposed within the through groove 104, thereby partially protruding from the through groove 104, so that the force transmission member 31 transmits the preset pressure generated (or transmitted) by the pre-pressing member 32 and the external pressing pressure received by the pre-pressing member 32 to the insulating layer 40M. The partial placement of the force transmission member 31 within the through groove 104 also facilitates its positioning. Preferably, the inner layer 10 is made of a rigid material for fixing the printed circuit board 10M. Additionally, if the electrical connection portions 21M of the at least two conductive members 20M are disposed on the preset surface 101M of the printed circuit board 10M, then the electrical connection portions 21M of the at least two conductive members 20M are disposed within the through groove 104. Preferably, the pre-pressing member 32 covers the entire through groove 104 from the outside. Preferably, the inner layer 10 of the pressure detection device according to the second embodiment of the present invention has an inner cavity, and other components or parts, such as batteries or circuit boards for fixing signal processing modules, can be placed in the inner cavity of the inner layer 10.

[0074] As shown in Figure 14, optionally, the pressure detection device according to the second embodiment of the present invention further includes an inner layer 10, which forms a groove 104M, wherein the printed circuit board 10M is disposed within the groove 104M of the inner layer 10. Further, the pressure sensing layer 30M and the insulating layer 40M are disposed within the groove 104M, and the at least two conductive elements 20M and the force transmission element 31 are partially disposed within the groove 104M. Correspondingly, the pressure sensing layer 30M and the insulating layer 40M are integrally disposed within the groove 104M, which provides protection for them. Further, the force transmission element 31 is partially disposed within the groove 104M, such that the force transmission element 31 partially protrudes from the groove 104M, so that the force transmission element 31 transmits the preset pressure generated (or transmitted) by the pre-pressing element 32 and the external pressing pressure received by the pre-pressing element 32 to the insulating layer 40M. The force transmission element 31 is partially disposed within the groove 104M, which also facilitates the positioning of the force transmission element 31. Preferably, the inner layer 10 is made of a rigid material to provide support for the printed circuit board 10M. Furthermore, if the electrical connection portions 21M of the at least two conductive elements 20M are disposed on the preset surface 101M of the printed circuit board 10M, then the electrical connection portions 21M of the at least two conductive elements 20M are disposed within the groove 104M. Preferably, the pre-pressure member 32 covers the entire groove 104M from the outside. Preferably, the inner layer 10 of the pressure detection device according to the second embodiment of the present invention forms an inner cavity, within which other components or parts, such as batteries or circuit boards for fixing signal processing modules, can be placed.

[0075] Figure 13A shows a specific example of the pre-pressure device 30 of the pressure detection device according to the second embodiment of the present invention. The pre-pressure device 30C has a force transmission member 31C further having an outer edge 311C, wherein the outer edge 311C forms a convex arcuate surface 3110C, wherein the arcuate surface 3110C extends outward and upward from the periphery 3102C of the pressure application plane 3101C of the force transmission member 31C. Preferably, the pressure application plane 3101C of the force transmission member 31C is integrally overlapped on the insulating layer 40M, the size of the pressure application plane 3101C of the force transmission member 30C is smaller than the pressure sensing layer 30M, and the projection of the pressure application plane 3101C of the force transmission member 31C toward the insulating layer 40M is directly above the pressure sensing layer 30M. The pressure-applying plane 3101C of the force transmission element 31C is integrally overlapped with the insulating layer 40M. The pressure-applying plane 3101C of the force transmission element 31C is smaller than the pressure-sensing layer 30M, and the projection of the pressure-applying plane 3101C of the force transmission element 31C toward the insulating layer 40M is directly above the pressure-sensing layer 30M. This ensures that the external force applied to the corresponding part of the pre-pressure device 30C is transmitted to the insulating layer 40M and the pressure-sensing layer 30M, and is promptly and sensitively detected by the pressure-sensing layer 30M. It is worth noting that when the outer edge 311C forms an edge, the sharp edge pressing on the insulating layer 40M for a long time can easily damage the insulating layer 40M. Therefore, the pressure-applying plane 3101C of the force transmission element 31C is placed on the insulating layer 40M in an integral overlapping manner. The pressure-applying plane 3101C of the force transmission element 31C is smaller than the pressure sensing layer 30M. The arc-shaped surface 3110C of the outer edge 311C extends outward and upward from the periphery 3102C of the pressure-applying plane 3101C. The projection of the pressure-applying plane 3101C of the force transmission element 31C toward the insulating layer 40M is directly above the pressure sensing layer 30M. This can prevent the sharp edges formed by the force transmission element 31C of the pre-pressure device 30C from pressing on the insulating layer 40M for a long time under the action of the preset pressure, thus damaging the insulating layer 40M.

[0076] Figure 13B shows a specific example of the pre-pressure device 30 of the pressure detection device according to the second embodiment of the present invention. The pre-pressure device 30D has a force transmission member 31D whose pressure application plane 3101D is larger than the area of ​​the insulating layer 40M. The insulating layer 40M is integrally overlapped on the inner side of the outer edge 311D of the pressure application plane 3101D of the force transmission member 31D, so as to prevent the preset pressure of the pre-pressure member 32D of the pre-pressure device 30D from pressing on the force transmission member 31D for a long time, causing the edge of the outer edge 311D of the force transmission member 31D to press against the insulating layer 40M for a long time, thus damaging the insulating layer 40M.

[0077] Figure 13C shows a specific example of the pre-pressure device 30 of the pressure detection device according to the second embodiment of the present invention. The pre-pressure member 30B includes a force transmission part 31B and a pressure generating part 32B, wherein the pressure generating part 32B and the force transmission part 31B are integrally formed, and the force transmission part 31B extends from the inner side 322B of the pressure generating part 32B. The force transmission part 31B is disposed between the insulating layer 40M and the pressure generating part 32B. The force transmission part 31B forms a pressure application plane 3101B, which is disposed facing the insulating layer 40M. The pre-pressure member 30B is configured to generate a pressure toward the insulating layer 40M, which is applied to the insulating layer 40M through the force transmission part 31B, thereby enabling the pre-pressure member 30B to generate a preset pressure applied to the insulating layer 40M. Furthermore, the pre-compression member 30B is configured to isolate the insulating layer 40M from the stress-bearing layer 200M disposed on the outer side 321B of the pressure generating part 32B. Furthermore, the stress-bearing layer 200M is integrally formed on the outer side 321B of the pressure generating part 32B of the pre-compression member 30B. It can be understood that the pre-compression member 30B isolates the insulating layer 40M from the stress-bearing layer 200M disposed on the outer side 321B of the pressure generating part 32B, thereby allowing the stress-bearing layer 200M to be integrally formed on the outer side 321B of the pressure generating part 32B by injection molding. Due to the isolation effect of the pre-compression member 30B, during the injection molding of the stress-bearing layer 200M, the injection molding material, such as silicone, will not leak into the insulating layer 40M.

[0078] As shown in Figure 13C, in the pressure detection device of the second embodiment of the present invention, the size of the pressure-applying plane 3101B of the force transmission part 31B of the pre-pressure member 30B is smaller than that of the pressure-sensing layer 30M. The force transmission part 31B further has an outer edge 311B, which forms a convex arcuate surface 3110B extending outward and upward from the periphery 3102B of the pressure-applying plane 3101B. Further, the size of the pressure-applying plane 3101B of the force transmission part 31B is smaller than that of the pressure-sensing layer 30M, and the projection of the pressure-applying plane 3101B of the force transmission member 31B toward the insulating layer 40M is directly above the pressure-sensing layer 30M, ensuring that the external force applied to the pre-pressure member 30B is transmitted to the insulating layer 40M and the pressure-sensing layer 30M, and is promptly and sensitively detected by the pressure-sensing layer 30M. Furthermore, the arcuate surface 3110B of the outer edge 311B extends outward and upward from the periphery 3102B of the pressure-applying plane 3101B, and the projection of the pressure-applying plane 3101B of the force transmission member 31B toward the insulating layer 40M is directly above the pressure-sensing layer 30M. This can prevent the sharp edges formed by the force transmission member 31B of the pre-pressure device 30B from pressing on the insulating layer 40M for a long time under the action of the preset pressure, thereby damaging the insulating layer 40M.

[0079] Figure 13D of the accompanying drawings shows a specific example of the pre-pressure device 30 of the pressure detection device according to the first embodiment of the present invention. The pre-pressure device 30A includes a force transmission member 31A and a pre-pressure member 32A. The force transmission member 31A is disposed between the insulating layer 40M and the pre-pressure member 32A. The force transmission member 31A forms a pressure application plane 3101A, which is positioned directly opposite the insulating layer 40M. The pre-pressure member 32A is configured to generate a pressure applied to the force transmission member 31A towards the insulating layer 40M (or the pressure sensing layer 30M), thereby enabling the pre-pressure device 30A to generate a preset pressure applied to the insulating layer 40M. Further, the pre-pressure member 32A is configured to isolate the insulating layer 40M from the force-receiving layer 200M disposed on the outer side 321A of the pre-pressure member 32A.

[0080] As shown in Figure 13D, the force-bearing layer 200M of the pressure detection device according to the second embodiment of the present invention is integrally formed on the outer side 321A of the pre-pressure member 32A of the pre-pressure device 30A. It can be understood that the pre-pressure member 32A of the pre-pressure device 30A can isolate the insulating layer 40M from the force-bearing layer 200M disposed on the outer side 321A of the pre-pressure member 32A, thereby allowing the force-bearing layer 200M to be integrally formed on the outer side 321A of the pre-pressure member 32A of the pre-pressure device 30A by injection molding. Due to the isolation effect of the pre-pressure member 32A of the pre-pressure device 30A, during the injection molding of the force-bearing layer 200M, the injection molding material, such as silicone, will not leak into the insulating layer 40M.

[0081] As shown in Figure 13D, in the pressure detection device of the second embodiment of the present invention, the size of the pressure-applying plane 3101A of the force-transmitting member 31A of the pressure-transmitting device 30A is smaller than that of the pressure-sensing layer 30M, and the projection of the pressure-applying plane 3101A of the force-transmitting member 31A toward the insulating layer 40M is directly above the pressure-sensing layer 30M. The force-transmitting member 31A further has an outer edge 311A, wherein the outer edge 311A ​​forms an outwardly convex arcuate surface 3110A, wherein the arcuate surface 3110A extends outward and upward from the periphery 3102A of the pressure-applying plane 3101A. Furthermore, the size of the pressure-applying plane 3101A of the force transmission element 31A is smaller than that of the pressure-sensing layer 30M, and the projection of the pressure-applying plane 3101A of the force transmission element 31A toward the insulating layer 40M is directly above the pressure-sensing layer 30M. This ensures that the external force applied to the insulating layer 40M is transmitted to the insulating layer 40M and the pressure-sensing layer 30M, and is promptly and sensitively detected by the pressure-sensing layer 30M. In addition, the arcuate surface 3110A of the outer edge 311A ​​extends outward and upward from the periphery 3102A of the pressure-applying plane 3101A, and the projection of the pressure-applying plane 3101A of the force transmission element 31A toward the insulating layer 40M is directly above the pressure-sensing layer 30M. This prevents the sharp edges formed by the force transmission element 31A of the pre-pressure device 30A from pressing on the insulating layer 40M for an extended period under a preset pressure, thus preventing damage to the insulating layer 40M.

[0082] As shown in Figure 13D, in the pressure detection device of the second embodiment of the present invention, the top end 312A of the force transmission member 31A of the pressure detection device 30A forms an outward protrusion 3121A, wherein the shape and size of the outward protrusion 3121A are configured to adapt to the inner side 322A of the pre-pressure member 32A of the pressure detection device 30A, so that the force transmission member 31A and the pre-pressure member 32A of the pressure detection device 30A can fit together tightly.

[0083] As shown in Figures 15B to 18, the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention further includes a protective layer 50M, wherein the protective layer 50M is disposed on the outer surface 401M of the insulating layer 40M and covers the insulating layer 40M to provide protection for the insulating layer 40M and the pressure sensing layer 30M. Preferably, the insulating layer 40M is completely covered by the protective layer 50M. It is understood that the protective layer 50M is a polyester (PET) or polyimide (PI) film, which can be adhered to the outer surface 401M of the insulating layer 40M by adhesive. It is understood that when the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention further includes the protective layer 50M, the force transmission member 31 and the pre-pressing member 32 are both disposed between the protective layer 50M and the force-receiving layer 200M, for transmitting the pressure applied to the force-receiving layer 200M toward the pressure sensing layer 30M to the protective layer 50M and further to the pressure sensing layer 30M via the insulating layer 40M. Preferably, at least one vent 102M is disposed between the two conductive members 20M of the at least two conductive members 20M.

[0084] As shown in Figures 15B to 18, the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention further includes an adhesive layer 60M, wherein the adhesive layer 60M is disposed on the outer periphery 1011M of the preset surface 101M of the printed circuit board 10M to adhere the pressure sensing layer 30M to the preset surface 101M of the printed circuit board 10M and to reinforce the fixation of the pressure sensing layer 30M. The adhesive layer 60M may be formed by adhesive.

[0085] Those skilled in the art will recognize that, according to the second embodiment of the pressure detection device of the present invention, the pressure sensing layer 30M of the thin-film pressure sensing component 100M is tightly attached to the preset surface 101M of the printed circuit board 10M, the insulating layer 40M is tightly attached to the pressure sensing layer 30M, the protective layer 50M (if present) is tightly attached to the insulating layer 40M, and the pre-pressure device 30 presses against the insulating layer 40M or the protective layer 50M (if present) so that force can be transmitted from the pre-pressure device 30 to the pressure sensing layer 30M.

[0086] As shown in Figure 20 of the accompanying drawings, according to a second embodiment of the present invention, the present invention further provides a method for manufacturing a thin-film pressure sensing component, which includes the following steps:

[0087] (a) Apply pressure-sensitive material paste to a preset surface of a printed circuit board;

[0088] (b) Dry the pressure-sensitive material slurry to solidify the pressure-sensitive material slurry to form a pressure-sensitive layer, and make at least two conductive elements physically contact the pressure-sensitive layer respectively, wherein the at least two conductive elements are pre-fixed on a preset surface of the printed circuit board.

[0089] (c) Applying an insulating material paste to the outer surface of the pressure-sensitive layer; and

[0090] (d) Drying the insulating material slurry to cure it into an insulating layer, wherein the printed circuit board forms at least one pore, and at least one pore of the at least one pore is formed between two conductive elements.

[0091] It is worth noting that the conductive element in the method for manufacturing a thin-film pressure sensing component according to the present invention, as shown in Figure 20, can be fixed to a predetermined surface of the printed circuit board in various ways, for example, formed on the predetermined surface of the printed circuit board by metal deposition. Alternatively, the conductive element for manufacturing a thin-film pressure sensing component according to the present invention may also be a printed circuit pre-printed on the predetermined surface of the printed circuit board. Alternatively, the conductive element for manufacturing a thin-film pressure sensing component according to the present invention may also be a solder line pre-soldered on the predetermined surface of the printed circuit board.

[0092] Exemplarily, the pressure-sensing material slurry used in the method for manufacturing a thin-film pressure-sensing component of the present invention contains an elastic polymer, a conductive filler, and a liquid medium. The elastic polymer may contain a polymeric resin, the conductive filler may contain carbon-based materials such as carbon black or graphite, and the liquid medium may or may not participate in the formation of the pressure-sensing layer, but may only be used to slurry the elastic polymer and conductive filler. The conductive material may also contain conductive metal particles, such as gold, copper, or silver particles, to enhance the conductivity of the conductive filler. After the pressure-sensing material slurry is coated onto a predetermined surface of a printed circuit board, it is dried and cured to form a pressure-sensing layer. The curing temperature of the pressure-sensing material slurry may be 80°C or other suitable curing temperatures. It is understood that the prepolymer of the elastic polymer matrix may be other materials, and the curing temperature of the pressure-sensing material slurry may vary depending on the composition of the elastic polymer. Generally, the curing temperature of the pressure-sensing material slurry is between 60°C and 150°C. Alternatively, the pressure-sensing material slurry may be coated (or applied) onto the predetermined surface of the printed circuit board by screen printing. Alternatively, the pressure-sensitive material paste is applied to the preset surface of the printed circuit board by means of a coating machine.

[0093] Exemplarily, the insulating slurry used in the method of manufacturing a thin-film pressure sensing component according to the present invention may contain a precursor of polydimethylsiloxane (PDMS) and a curing agent, which is cured after being coated on the outer surface of the pressure sensing layer to obtain the insulating layer. It is understood that the insulating slurry used in the method of manufacturing a thin-film pressure sensing component according to the present invention may also use other suitable insulating materials. For example, the insulating slurry may contain an insulating material and a liquid medium, which may or may not participate in the formation of the insulating layer, but only be used to slurry the insulating material components. Alternatively, the insulating slurry is coated on the outer surface of the pressure sensing layer by screen printing. Alternatively, the insulating slurry is coated on the outer surface of the pressure sensing layer by a coating machine.

[0094] It is worth noting that when the insulating material slurry is coated onto the outer surface of the pressure sensing layer, multiple coatings can be applied to ensure that the amount of insulating material coated on the outer surface of the pressure sensing layer is sufficient and that the insulating layer formed by the insulating material slurry is sufficiently thick, thereby allowing the insulating layer to further function as a protective layer. Accordingly, as shown in Figures 15B to 18, the insulating layer 40M and the protective layer 50M of the thin-film pressure sensing component 100M of the pressure detection device according to the second embodiment of the present invention are integrally formed and made of the same material.

[0095] Alternatively, the insulating material paste is applied to the outer surface of the pressure-sensitive layer by screen printing. Alternatively, the insulating material paste is applied to the outer surface of the pressure-sensitive layer by a coating machine.

[0096] According to a second embodiment of the present invention, the method for manufacturing a thin-film pressure sensing component further includes the following steps:

[0097] (e) Attach the protective layer to the outer surface of the insulating layer.

[0098] It is understood that the protective layer used in the method for manufacturing a thin-film pressure sensing component of the present invention may also be made of other suitable materials. It is also understood that the protective layer used in the method for manufacturing a thin-film pressure sensing component of the present invention may be formed on the outer surface of the insulating layer by coating a polymer precursor onto the outer surface of the insulating layer and curing it, thereby improving the adhesion between the protective layer and the insulating layer. Accordingly, step (e) above includes the steps of coating the polymer precursor onto the outer surface of the insulating layer and drying the polymer precursor to cure it and form the protective layer.

[0099] Alternatively, the protective layer used in the method of manufacturing the thin-film pressure sensing component of the present invention may be a thin film made of polyester (PET) or polyimide (PI) material and adhered to the outer surface of the insulating layer by adhesive. Accordingly, step (e) above includes the steps of applying adhesive to the outer surface of the insulating layer and attaching the protective layer to the insulating layer by adhesive to ensure that the protective layer is tightly adhered to the insulating layer. Alternatively, the adhesive may be applied to the outer surface of the insulating layer by screen printing. Alternatively, the adhesive may be applied to the outer surface of the insulating layer by a coating machine.

[0100] Figure 23 of the accompanying drawings shows an optional embodiment of the pressure detection device according to the second embodiment of the present invention, which includes a printed circuit board 10MA, a substrate 40MA, a pressure sensing layer 30MA, and at least two conductive elements 20MA. One side of the pressure sensing layer 30MA is cured on the substrate 40MA, and the other side is adhered to a predetermined surface 101MA of the printed circuit board 10MA. The at least two conductive elements 20MA are in physical contact with the pressure sensing layer 30MA. Accordingly, the pressure sensing layer 30MA is cured on the substrate 40MA, thereby forming a pressure sensing film.

[0101] As shown in Figure 23, an optional embodiment of the pressure detection device according to the second embodiment of the present invention further forms at least one vent 102MA. Preferably, the at least one vent 102MA is formed from the pressure sensing membrane. Optionally, the at least one vent 102MA is formed on the printed circuit board 10MA.

[0102] Figure 24 of the accompanying drawings shows an optional embodiment of a method for manufacturing a thin-film pressure sensing component according to the present invention, which includes the following steps:

[0103] (a2) Apply pressure-sensitive material paste to the inner surface of the substrate;

[0104] (b2) Drying the pressure-sensitive material slurry to solidify it into a pressure-sensitive layer, thereby obtaining a pressure-sensitive film; and

[0105] (c2) The pressure sensing layer of the pressure sensing membrane is attached to a preset surface of a printed circuit board, wherein at least two conductive elements are in physical contact with the pressure sensing layer.

[0106] Furthermore, the thin-film pressure sensing component 100M of the pressure detection device according to the manufacturing method of the second embodiment of the present invention shown in FIG. 24 has at least one pore, and at least one pore is formed between two conductive elements of the at least two conductive elements. It can be understood that the at least one pore can be formed by the printed circuit board or by the pressure sensing membrane.

[0107] It is worth noting that the conductive element in the method for manufacturing a thin-film pressure sensing assembly according to the present invention, as shown in Figure 24, can be pre-fixed to a predetermined surface of the printed circuit board in various ways. For example, it can be formed on the predetermined surface of the printed circuit board by metal deposition, or a printed circuit can be pre-printed on the predetermined surface of the printed circuit board by a circuit printing process. Accordingly, when the pressure-sensing film is adhered to the predetermined surface of the printed circuit board, adhesive can be applied to the portion of the predetermined surface of the printed circuit board other than the conductive element, and then the pressure-sensing film is adhered to the predetermined surface of the printed circuit board to ensure electrical connection between the pressure-sensing layer and the electrical connection portion of the conductive element. Alternatively, the conductive element in the method for manufacturing a thin-film pressure sensing assembly according to the present invention, as shown in Figure 24, may be an electrode provided on the pressure-sensing layer by an additional step. Accordingly, when the pressure-sensing film is adhered to the predetermined surface of the printed circuit board, adhesive can be applied to the predetermined surface of the printed circuit board or the outer surface of the pressure-sensing layer, and then the pressure-sensing film is further adhered to the predetermined surface of the printed circuit board.

[0108] According to a second embodiment of the present invention, the substrate of the method for manufacturing a thin-film pressure sensing component of the present invention forms a protective layer and an insulating layer, wherein the pressure-sensing material slurry is coated on the inner surface of the insulating layer. Accordingly, the protective layer and the insulating layer may be made of the same material or different materials. For example, the insulating layer may be formed by coating the inner surface of the protective layer with an insulating material slurry and drying the insulating material slurry to cure it and form an insulating layer.

[0109] It is worth noting that the force-bearing layer 200 (or the force-bearing layer 200M) of the pressure detection device of the present invention can be a single-layer structure or a multi-layer structure integrally formed together.

[0110] Those skilled in the art should understand that the embodiments described above and illustrated in the figures are merely illustrative of the invention and not intended to limit it. All equivalent implementations, modifications, and improvements within the spirit of this invention should be included within the scope of protection of this invention.

Claims

1. A pressure detection device, characterized in that, include: The load-bearing layer forms a cavity; and A thin-film pressure sensing assembly disposed within the receiving cavity includes a printed circuit board, at least two conductive elements, a pressure sensing layer, an insulating layer, and a force transmitting element. The printed circuit board forms a predetermined surface and at least one vent. The at least two conductive elements are disposed on the predetermined surface. The pressure sensing layer is attached to the predetermined surface. The insulating layer is disposed on the outer surface of the pressure sensing layer. The at least one vent extends from the predetermined surface. The at least two conductive elements are spaced apart from each other and are respectively and at least partially covered by the pressure sensing layer. The force transmitting element is disposed between the insulating layer and the force-bearing layer.

2. The pressure detection device according to claim 1, characterized in that, The device further includes a pre-compression member disposed between the force-bearing layer and the force-transmitting member, wherein the pre-compression member is configured to apply a preset pressure toward the force-transmitting member, wherein the preset pressure is a constant preset pressure and the preset pressure is not less than the detection lower limit of the pressure-sensing layer.

3. The pressure detection device according to claim 2, characterized in that, The stress-bearing layer is integrally formed on the outside of the pre-compression component.

4. The pressure detection device according to claim 2, characterized in that, The preload element is configured to isolate the insulating layer from the stress layer.

5. The pressure detection device according to claim 1, characterized in that, The at least two conductive elements are fixedly disposed on the preset surface.

6. The pressure detection device according to claim 1, characterized in that, Each of the at least two conductive elements forms an electrical connection portion and an electrical conduction portion extending from the electrical connection portion, wherein the electrical connection portion is fixedly disposed on the preset surface of the printed circuit board, the electrical conduction portion protrudes outward from the preset surface in a vertical direction from the electrical connection portion, and the electrical connection portion is completely covered by the pressure sensing layer.

7. The pressure detection device according to claim 1, characterized in that, Each of the at least two conductive elements forms an electrical connection portion and an electrical conduction portion extending from the electrical connection portion, wherein the electrical connection portion is fixedly disposed on the predetermined surface of the printed circuit board, and wherein the electrical conduction portion of each of the at least two conductive elements extends from the electrical connection portion along the outer surface of the printed circuit board.

8. The pressure detection device according to claim 2, characterized in that, The force transmitting element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane, wherein the size of the pressure-applying plane of the force transmitting element is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmitting element toward the insulating layer is directly above the pressure-sensing layer.

9. The pressure detection device according to claim 2, characterized in that, The size of the pressure-applying plane of the force-transmitting element is larger than the size of the pressure-sensing layer, and the insulating layer is integrally overlapped on the inner side of the outer edge of the pressure-applying plane of the force-transmitting element.

10. The pressure detection device according to claim 1, characterized in that, The device further includes a pre-compression member, wherein the pre-compression member includes a force transmission part and a pressure generating part, wherein the pressure generating part and the force transmission part are integrally formed, and the force transmission part extends from the inside of the pressure generating part, wherein the force transmission part is disposed between the insulating layer and the pressure generating part, and wherein the pre-compression member is configured to generate a pressure toward the pressure sensing layer.

11. The pressure detection device according to claim 10, characterized in that, The pre-compression member is configured to isolate the insulating layer from the stress-bearing layer disposed on the outside of the pressure generating part, wherein the stress-bearing layer is integrally formed on the outside of the pre-compression member.

12. The pressure detection device according to claim 11, characterized in that, The force transmission part further has an outer edge, wherein the outer edge forms an outwardly convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission part, wherein the size of the pressure-applying plane of the force transmission part is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmission part toward the insulating layer is directly above the pressure-sensing layer.

13. The pressure detection device according to claim 2, characterized in that, The force transmitting element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmitting element, wherein the size of the pressure-applying plane of the force transmitting element is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmitting element toward the insulating layer is directly above the pressure-sensing layer.

14. The pressure detection device according to claim 13, characterized in that, The top of the force transmission member has an outward protrusion, the shape and size of which are configured to fit the inner side of the preload member.

15. The pressure detection device according to any one of claims 1 to 15, characterized in that, The stress layer generates a preset pressure that is at least partially transmitted to the insulation layer via the pre-pressure device.

16. The pressure detection device according to any one of claims 1 to 15, characterized in that, The at least one vent is formed from a circuit via on the printed circuit board.

17. The pressure detection device according to any one of claims 1 to 15, characterized in that, The at least two conductive elements of the thin-film pressure sensing component form the two electrodes of the thin-film pressure sensing component.

18. The pressure detection device according to any one of claims 1 to 15, characterized in that, The inner layer forms a through slot, wherein the printed circuit board is disposed inside the inner layer, and the preset surface of the printed circuit board is disposed facing the through slot so that it is exposed through the through slot, wherein the pressure sensing layer and the insulating layer are disposed within the through slot, wherein at least two conductive elements and the force transmitting element are partially disposed within the through slot so that the force transmitting element partially protrudes from the through slot.

19. The pressure detection device according to any one of claims 1 to 15, characterized in that, The inner layer forms a groove, wherein the printed circuit board is disposed within the groove of the inner layer, wherein the pressure sensing layer and the insulating layer are disposed within the groove, and wherein the force transmission element is partially disposed within the groove such that the force transmission element partially protrudes from the groove.

20. The pressure detection device according to any one of claims 1 to 15, characterized in that, At least one vent is disposed between the two conductive elements of the at least two conductive elements.

21. A thin-film pressure sensing component, characterized in that, include: A printed circuit board; At least two conductive components; A pressure-sensitive layer; and An insulating layer, wherein the printed circuit board forms a predetermined surface and at least one pore, wherein at least two conductive elements are disposed on the predetermined surface, the pressure-sensing layer is attached to the predetermined surface, the insulating layer is disposed on the outer side of the pressure-sensing layer, the at least one pore extends from the predetermined surface, wherein the at least two conductive elements are disposed spaced apart from each other, and the at least two conductive elements are respectively and at least partially covered by the pressure-sensing layer.

22. The thin-film pressure sensing component according to claim 21, characterized in that, The at least two conductive elements are fixedly disposed on the preset surface.

23. The thin-film pressure sensing component according to claim 21, characterized in that, It further includes a force transmission element and a pre-compression element, wherein the force transmission element is disposed between the pre-compression element and the insulating layer, wherein the pre-compression element is configured to apply a preset pressure toward the insulating layer on the force transmission element, wherein the preset pressure is a constant preset pressure and the preset pressure is not less than the detection lower limit of the pressure sensing layer.

24. The thin-film pressure sensing component according to claim 23, characterized in that, The pressure-applying plane of the force-transmitting element is positioned directly opposite the pressure-sensing layer, wherein the dimension of the side of the force-transmitting element opposite to the pressure-applying plane is not smaller than the dimension of the pressure-applying plane.

25. The thin-film pressure sensing component according to claim 23, characterized in that, The preload member is disposed outside the force transmitter and covers the force transmitter.

26. The thin-film pressure sensing component according to claim 21, characterized in that, Each of the at least two conductive elements forms an electrical connection portion and an electrical conduction portion extending from the electrical connection portion, wherein the electrical connection portion is fixedly disposed on the preset surface of the printed circuit board, the electrical conduction portion protrudes outward from the preset surface in a vertical direction from the electrical connection portion, and the electrical connection portion is completely covered by the pressure sensing layer.

27. The thin-film pressure sensing component according to claim 21, characterized in that, Each of the at least two conductive elements forms an electrical connection portion and an electrical conduction portion extending from the electrical connection portion, wherein the electrical connection portion is fixedly disposed on the predetermined surface of the printed circuit board, and wherein the electrical conduction portion of each of the at least two conductive elements extends from the electrical connection portion along the outer surface of the printed circuit board.

28. The thin-film pressure sensing component according to claim 22, characterized in that, The force transmitting element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane, wherein the size of the pressure-applying plane of the force transmitting element is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmitting element toward the insulating layer is directly above the pressure-sensing layer.

29. The thin-film pressure sensing component according to claim 22, characterized in that, The size of the pressure-applying plane of the force-transmitting element is larger than the size of the pressure-sensing layer, and the insulating layer is integrally overlapped on the inner side of the outer edge of the pressure-applying plane of the force-transmitting element.

30. The thin-film pressure sensing component according to claim 21, characterized in that, The device further includes a pre-compression member, wherein the pre-compression member includes a force transmission part and a pressure generating part, wherein the pressure generating part and the force transmission part are integrally formed, and the force transmission part extends from the inside of the pressure generating part, wherein the force transmission part is disposed between the insulating layer and the pressure generating part, and wherein the pre-compression member is configured to generate a pressure toward the pressure sensing layer.

31. The thin-film pressure sensing component according to claim 30, characterized in that, The pre-compression member is configured to isolate the insulating layer from the stress-bearing layer disposed on the outside of the pressure generating part, wherein the stress-bearing layer is integrally formed on the outside of the pre-compression member.

32. The thin-film pressure sensing component according to claim 31, characterized in that, The force transmission part further has an outer edge, wherein the outer edge forms an outwardly convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission part, wherein the size of the pressure-applying plane of the force transmission part is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmission part toward the insulating layer is directly above the pressure-sensing layer.

33. The thin-film pressure sensing component according to claim 22, characterized in that, The force transmitting element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmitting element, wherein the size of the pressure-applying plane of the force transmitting element is smaller than the size of the pressure-sensing layer, and the projection of the pressure-applying plane of the force transmitting element toward the insulating layer is directly above the pressure-sensing layer.

34. The thin-film pressure sensing component according to claim 33, characterized in that, The top of the force transmission member has an outward protrusion, the shape and size of which are configured to fit the inner side of the preload member.

35. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, The stress layer generates a preset pressure that is at least partially transmitted to the insulation layer via the pre-pressure device.

36. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, The at least one vent is formed from a circuit via on the printed circuit board.

37. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, The at least two conductive elements of the thin-film pressure sensing component form the two electrodes of the thin-film pressure sensing component.

38. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, The inner layer forms a through slot, wherein the printed circuit board is disposed inside the inner layer, and the preset surface of the printed circuit board is disposed facing the through slot so that it is exposed through the through slot, wherein the pressure sensing layer and the insulating layer are disposed within the through slot, wherein at least two conductive elements and the force transmitting element are partially disposed within the through slot so that the force transmitting element partially protrudes from the through slot.

39. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, The inner layer forms a groove, wherein the printed circuit board is disposed within the groove of the inner layer, wherein the pressure sensing layer and the insulating layer are disposed within the groove, and wherein the force transmission element is partially disposed within the groove such that the force transmission element partially protrudes from the groove.

40. The thin-film pressure sensing component according to any one of claims 21 to 35, characterized in that, At least one vent is disposed between the two conductive elements of the at least two conductive elements.

41. A pressure detection device, characterized in that, include: The load-bearing layer forms a cavity; and A thin-film pressure sensing assembly disposed within the receiving cavity, wherein the thin-film pressure sensing assembly includes an inner layer, a thin-film pressure sensor, and a force transmitter, wherein the inner layer forms a support plane, the support side of the thin-film pressure sensor is placed on the support plane of the inner layer, and wherein the force transmitter is disposed between the thin-film pressure sensor and the force-bearing layer.

42. The pressure detection device according to claim 41, characterized in that, It further includes a pre-compression member disposed between the force-bearing layer and the force-transmitting member, wherein the pre-compression member is configured to apply a preset pressure toward the sensing side of the thin-film pressure sensor on the force-transmitting member.

43. The pressure detection device according to claim 42, characterized in that, The stress-bearing layer is integrally formed on the outside of the pre-compression component.

44. The pressure detection device according to claim 42, characterized in that, The pre-compression element is configured to isolate the thin-film pressure sensor from the stress layer.

45. The pressure detection device according to claim 44, characterized in that, The signal transmission circuit of the thin-film pressure sensing component is covered by the pre-compression component.

46. ​​The pressure detection device according to claim 42, characterized in that, The preload member is disposed outside the force transmitter and covers the force transmitter.

47. The pressure detection device according to claim 42, characterized in that, The inner layer forms a groove, wherein the support plane is formed at the bottom of the groove, wherein the thin-film pressure sensor is integrally disposed within the groove, and the force transmission element is partially disposed within the groove, thereby causing the force transmission element to partially protrude from the groove.

48. The pressure detection device according to claim 42, characterized in that, The force transmission element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission element, wherein the size of the pressure-applying plane of the force transmission element is smaller than the size of the sensing side of the thin-film pressure sensor, and the pressure-applying plane of the force transmission element is integrally overlapped and placed inside the periphery of the sensing side of the thin-film pressure sensor.

49. The pressure detection device according to claim 42, characterized in that, The size of the pressure-applying plane of the force transmission element is larger than the size of the sensing side of the thin-film pressure sensor, and the sensing side of the thin-film pressure sensor is integrally overlapped and placed inside the outer edge of the pressure-applying plane of the force transmission element.

50. The pressure detection device according to claim 41, characterized in that, The device further includes a pre-compression member, wherein the pre-compression member includes a force transmission part and a pressure generating part, wherein the pressure generating part and the force transmission part are integrally formed, and the force transmission part extends from the inside of the pressure generating part, wherein the force transmission part is disposed between the thin-film pressure sensor and the pressure generating part, and wherein the pre-compression member is configured to generate a pressure toward the sensing side of the thin-film pressure sensor.

51. The pressure detection device according to claim 50, characterized in that, The pressure-applying plane of the force transmission unit is positioned directly opposite the sensing side of the thin-film pressure sensor.

52. The pressure detection device according to claim 50, characterized in that, The pre-compression member is configured to isolate the thin-film pressure sensor from the force-bearing layer disposed on the outside of the pressure generating part, wherein the force-bearing layer is integrally formed on the outside of the pre-compression member.

53. The pressure detection device according to claim 52, characterized in that, The force transmission part further has an outer edge, wherein the outer edge forms an outwardly convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission part, wherein the size of the pressure-applying plane of the force transmission part is smaller than the size of the sensing side of the thin film pressure sensor, and the pressure-applying plane of the force transmission part is integrally overlapped and placed inside the periphery of the sensing side of the thin film pressure sensor.

54. The pressure detection device according to claim 42, characterized in that, The force transmission element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission element, wherein the size of the pressure-applying plane of the force transmission element is smaller than the size of the sensing side of the thin-film pressure sensor, and the pressure-applying plane of the force transmission element is integrally overlapped and placed inside the periphery of the sensing side of the thin-film pressure sensor.

55. The pressure detection device according to claim 54, characterized in that, The top of the force transmission member has an outward protrusion, the shape and size of which are configured to fit the inner side of the preload member.

56. A thin-film pressure sensing component, characterized in that, include: An inner layer; A thin-film pressure sensor; and A force transmitter, wherein the inner layer forms a support plane, the support side of the thin-film pressure sensor is placed on the support plane of the inner layer, and wherein the force transmitter is disposed on the sensing side of the thin-film pressure sensor.

57. The thin-film pressure sensing component according to claim 56, characterized in that, The device further includes a pre-compression element, wherein the force transmission element is disposed between the pre-compression element and the thin-film pressure sensor, wherein the pre-compression element is configured to apply a preset pressure toward the sensing side of the thin-film pressure sensor on the force transmission element, wherein the preset pressure is a constant preset pressure and the preset pressure is not less than the detection lower limit of the thin-film pressure sensor.

58. The thin-film pressure sensing component according to claim 56, characterized in that, The signal transmission circuit of the thin-film pressure sensing component is covered by the pre-compression component.

59. The thin-film pressure sensing component according to claim 56, characterized in that, The dimension of the side of the force transmission element opposite to the pressure-applying plane is not smaller than the dimension of the pressure-applying plane.

60. The thin-film pressure sensing component according to claim 56, characterized in that, The preload member is disposed outside the force transmitter and covers the force transmitter.

61. The thin-film pressure sensing assembly according to claim 57, characterized in that, The force transmission element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane, wherein the size of the pressure-applying plane of the force transmission element is smaller than the size of the sensing side of the thin-film pressure sensor, and the pressure-applying plane of the force transmission element is integrally overlapped and placed inside the periphery of the sensing side of the thin-film pressure sensor.

62. The thin-film pressure sensing component according to claim 57, characterized in that, The size of the pressure-applying plane of the force transmission element is larger than the size of the sensing side of the thin-film pressure sensor, and the sensing side of the thin-film pressure sensor is integrally overlapped and placed inside the outer edge of the pressure-applying plane of the force transmission element.

63. The thin-film pressure sensing component according to claim 56, characterized in that, The device further includes a pre-compression member, wherein the pre-compression member includes a force transmission part and a pressure generating part, wherein the pressure generating part and the force transmission part are integrally formed, and the force transmission part extends from the inside of the pressure generating part, wherein the force transmission part is disposed between the thin-film pressure sensor and the pressure generating part, and wherein the pre-compression member is configured to generate a pressure toward the sensing side of the thin-film pressure sensor.

64. The thin-film pressure sensing component according to claim 63, characterized in that, The pre-compression member is configured to isolate the thin-film pressure sensor from the force-bearing layer disposed on the outside of the pressure generating part, wherein the force-bearing layer is integrally formed on the outside of the pre-compression member.

65. The thin-film pressure sensing component according to claim 64, characterized in that, The force transmission part further has an outer edge, wherein the outer edge forms an outwardly convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission part, wherein the size of the pressure-applying plane of the force transmission part is smaller than the size of the sensing side of the thin film pressure sensor, and the pressure-applying plane of the force transmission part is integrally overlapped and placed inside the periphery of the sensing side of the thin film pressure sensor.

66. The thin-film pressure sensing component according to claim 65, characterized in that, The force transmission element further has an outer edge, wherein the outer edge forms a convex arcuate surface, wherein the arcuate surface extends outward and upward from the periphery of the pressure-applying plane of the force transmission element, wherein the size of the pressure-applying plane of the force transmission element is smaller than the size of the sensing side of the thin-film pressure sensor, and the pressure-applying plane of the force transmission element is integrally overlapped and placed inside the periphery of the sensing side of the thin-film pressure sensor.

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