Electronic device including structure for improving heat dissipation performance

Abstract

An electronic device according to an embodiment may comprise: a printed circuit board; an electronic component mounted on the printed circuit board; and a shield can disposed on the printed circuit board. The electronic device may further comprise: a thermal conduction member which has elasticity, is in contact with the electronic component, and is positioned in the shield can; and a shielding sheet which covers an opening of the shield can and is in contact with the thermal conduction member. The electronic device may further comprise a thermally conductive bracket including: a portion corresponding to the printed circuit board; and a rib structure protruding from one surface of the portion toward the shielding sheet and configured to compress the thermal conduction member through the shielding sheet. The thermal conduction member may be configured to transfer heat generated from the electronic component to the outside of the shield can.

Description

Electronic device including a structure for improving heat dissipation performance

[0001] The present disclosure relates to an electronic device including a structure for improving heat dissipation performance.

[0002] Electronic devices may include electronic components to provide various functions. As the electronic device operates, heat may be generated from the electronic components. The electronic device may require a structure for dissipating the heat emitted from the electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a printed circuit board, an electronic component mounted on the printed circuit board, and a shield can disposed on the printed circuit board. The electronic component may be positioned within the shield can, and the shield can may define an opening disposed over the electronic component. The electronic device may include a thermally conductive member having elasticity and in contact with at least a portion of a top surface and a side surface of the electronic component and positioned within the shield can, and a shielding sheet covering the opening of the shield can and in contact with the thermally conductive member. The shield can and the shielding sheet may be configured to shield electromagnetic interference between the electronic component and other electronic components outside the shield can. The electronic device may include a thermally conductive bracket including a portion corresponding to the printed circuit board, and a rib structure protruding from one surface of the portion toward the shielding sheet and configured to compress the thermally conductive member through the shielding sheet. The above heat conducting member may be configured to transfer heat generated from the electronic component to the outside of the shield can.

[0005] An electronic device is disclosed. The electronic device may include a printed circuit board, an electronic component mounted on one surface of the printed circuit board, and a shield can disposed on the one surface of the printed circuit board and surrounding the electronic component. The shield can may define an opening disposed over the electronic component. The electronic device may include a thermally conductive member having elasticity and in contact with the electronic component and positioned within the shield can, a shielding sheet covering the opening of the shield can and in contact with the thermally conductive member, a thermally conductive bracket including a portion for receiving the printed circuit board, and a thermally conductive material at least partially interposed between the shielding sheet and the portion of the thermally conductive bracket, the thermally conductive material being in face-to-face contact with both the shielding sheet and the portion of the thermally conductive bracket to transfer heat from the electronic component to the thermally conductive bracket through the thermally conductive member.

[0006] An electronic device is disclosed. The electronic device may include a printed circuit board including an electronic component, a thermally conductive bracket accommodating the printed circuit board and including a heat dissipation portion disposed over the electronic component, a thermally conductive member having elasticity and in contact with the electronic component, a shielding sheet disposed over the thermally conductive member, and a thermally conductive material disposed at least partially between the heat dissipation portion of the thermally conductive bracket and the shielding sheet. The thermally conductive material may fill a space between the heat dissipation portion of the thermally conductive bracket and the shielding sheet to transfer heat emitted from the electronic component to the heat dissipation portion of the thermally conductive bracket through the shielding sheet.

[0007] An electronic device is disclosed. The electronic device may include a printed circuit board including an electronic component, a thermally conductive bracket accommodating the printed circuit board and defining a heat dissipation portion disposed over the electronic component, a thermally conductive member having elasticity and in contact with the electronic component, a shield can electrically connected to a ground of the electronic device, surrounding the electronic component to shield the electronic component through the ground, the shield can including a through hole penetrated by the thermally conductive member, and a shield sheet attached to the shield can to cover the through hole and in contact with the thermally conductive member through the through hole. The thermally conductive bracket may include one or more rib portions protruding from the heat dissipation portion toward the shield sheet to press the thermally conductive member.

[0008] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] Figure 2a is a drawing showing an exemplary electronic device.

[0011] Figure 2b is an exploded perspective view of an exemplary electronic device.

[0012] Figures 3a, 3b, and 3c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0013] Figures 4a, 4b, and 4c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0014] Figures 5a, 5b, and 5c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0015] Figures 6a and 6b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0016] Figures 7a and 7b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0017] Figures 8a and 8b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0018] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0019] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0020] In the following description, terms referring to parts of electronic devices (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to functions of parts (e.g., opening, shield can, thermally conductive member, shielding sheet, thermally conductive bracket), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), etc. are examples for convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... thing', '... body' used below may mean at least one shape structure or a unit that processes a function.

[0021] In the present disclosure, expressions such as “more than” or “less than” may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as “more than” or “less than.” A condition described as “more than” may be replaced with “more than,” a condition described as “less than” may be replaced with “less than,” and a condition described as “more than and less than” may be replaced with “more than and less than.” In addition, hereinafter, “A” to “B” mean at least one of the elements from A (including A) to B (including B). hereinafter, “C” and / or “D” mean at least one of “C” or “D,” that is, including {“C,” “D,” “C” and “D”}. hereinafter, the meaning of “about E” may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0022] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] Figure 2a is a drawing showing an exemplary electronic device.

[0046] Referring to FIG. 2A, an electronic device (101) according to one embodiment may include a housing (200) that forms an exterior of the electronic device (101). For example, the housing (200) may include a front surface (200A), a rear surface (200B), and a side surface (200C) that surrounds a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (200) may also refer to a structure that forms at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0047] An electronic device (101) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate including various coating layers or a polymer plate.

[0048] An electronic device (101) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0049] An electronic device (101) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a back plate (211) to form at least a portion of a side surface (200C) of the electronic device (101). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (101), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (101) together with the front plate (202) and / or the back plate (211).

[0050] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (101) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that is curved and extends seamlessly from its edge part toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0051] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0052] According to one embodiment, the electronic device (101) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

[0053] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0054] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0055] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed from the front, at least a portion of an edge part of the screen display area (201A) may substantially coincide with an edge part of the front surface (200A) (or the front plate (202)).

[0056] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0057] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge part of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0058] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0059] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0060] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0061] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0062] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0063] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown).

[0064] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] According to one embodiment, the camera module (205, 212, 213) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), a second camera (212) positioned to face the rear (200B), and a flash (213).

[0066] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0067] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0068] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0069] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0070] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) so that a connector of an external device may be accommodated. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0071] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0072] Figure 2b is an exploded perspective view of an exemplary electronic device.

[0073] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0074] Referring to FIG. 2b, an electronic device (101) according to one embodiment may include a frame structure (240), a printed circuit board (250) including a first printed circuit board (251) and a second printed circuit board (252), a cover plate (260), and a battery (270).

[0075] According to one embodiment, the frame structure (240) may include a side bezel structure (218) forming an exterior of the electronic device (101) (e.g., side surface (200C) of FIG. 2A) and a support portion (243) extending inwardly from the side bezel structure (218). According to one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). According to one embodiment, the side bezel structure (218) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0076] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera (212) may each be mounted in a recess defined by the side bezel structure (218) and / or the support portion (243) of the frame structure (240).

[0077] According to one embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0078] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0079] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0080] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (251) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (251) via the joining member.

[0081] According to one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0082] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0083] According to one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, the present invention is not limited to the above-described example.

[0084] According to one embodiment, the first printed circuit board (251) and / or the second printed circuit board (252) may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. According to one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0085] In one embodiment, the battery (270) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0086] An electronic device (101) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0087] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support portion (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0088] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0089] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0090] According to one embodiment, the housing of the electronic device (101) (e.g., the housing (200) of FIG. 2A) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (200) of the electronic device (101).

[0091] Figures 3a, 3b, and 3c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0092] Referring to FIGS. 3A, 3B, and 3C, the electronic device (101) may include a printed circuit board (310) including an electronic component (301) (e.g., the printed circuit board (250) of FIG. 2B), a bracket (320), a thermally conductive member (330), a shielding sheet (340), and a shield can (350).

[0093] The bracket (320) may support a display of the electronic device (101) (e.g., the display (201) of FIG. 2A) and / or structures disposed under the display (201) to support the display (201). The bracket (320) may, for example, form at least a portion of the exterior of a housing (e.g., the housing (210) of FIG. 2A). For example, the bracket (320) may provide a space for accommodating electronic components within the electronic device (101). At least some of the electronic components may be electrically connected to the display (201). However, the embodiments supported in the present disclosure are not limited thereto.

[0094] The bracket (320) may include a heat dissipation portion (325). The heat dissipation portion (325) may be disposed below the display (201) of the electronic device (101). For example, the heat dissipation portion (325) may face at least a portion of the display (201). For example, at least a portion of electronic components of the electronic device (101) may be mounted or disposed on the heat dissipation portion (325). For example, the heat dissipation portion (325) may be positioned between the printed circuit board (310) and the display (201). The heat dissipation portion (325) may be a portion that receives heat emitted from electronic components (301) disposed on the printed circuit board (310). The bracket (320) can reduce damage to the display (201) (or other electronic components arranged around the electronic component (301)) by dissipating heat transferred from the electronic component (301) through the heat dissipation portion (325). For example, the heat dissipation portion (325) can define one side (325a) facing the printed circuit board (310) and the other side (325b) opposite to the one side (325a). For example, the heat dissipation portion (325) can be surrounded by a peripheral portion of the housing (210) (e.g., a side bezel structure (218) of FIG. 2A). The heat dissipation portion (325) and the peripheral portion can be formed of different materials, but the embodiments supported in the present disclosure are not limited thereto.

[0095] The printed circuit board (310) may be placed or mounted on the bracket (320) (or the heat dissipation portion (325)). Electronic components for driving and / or performing functions of the electronic device (101) may be coupled to the printed circuit board (310). For example, the printed circuit board (310) may be accommodated in the bracket (320) together with a battery (e.g., the battery (270) of FIG. 2B). For example, the printed circuit board (310) may be connected to the battery (270) to supply power to the electronic device (101) and / or electronic components within the electronic device (101) through the battery (270). For example, a power management integrated circuit (PMIC) in a printed circuit board (310) may be connected to a battery (270) through a flexible printed circuit board (FPCB) to supply power to the electronic device (101).

[0096] An electronic component (301) coupled to a printed circuit board (310) may emit heat while the electronic device (101) is operating. For example, the electronic component (301) may be a processor of the electronic device (101) having a relatively large amount of heat generation (e.g., the processor (120) of FIG. 1). For example, the electronic component (301) may be coupled on a first side (310a) of the printed circuit board (310) facing the heat dissipation portion (325). On a second side (310b) of the printed circuit board (310) opposite to the first side (310a), for example, a back plate of the electronic device (101) (e.g., the back plate (211) of FIG. 2a) may be disposed. For example, the electronic component (301) may perform data processing or calculations as the electronic device (101) operates. For example, the electronic component (301) may emit heat to the surroundings of the electronic component (301) as it performs data processing or calculation. The electronic component (301) may be referred to as a heat generating component or a heat generating body in that it is an element that generates heat, but the embodiments supported by the present disclosure are not limited thereto. For example, the electronic component (301) may be provided in the form of a chipset in which a first electronic component (301a) and a second electronic component (301b) are combined, but the embodiments are not limited thereto. The electronic device (101) may require a heat dissipation structure that forms a heat transfer path from the electronic component (301) to the heat dissipation portion (325) of the bracket (320) to reduce damage to the electronic component (301) and / or one or more other electronic components around the electronic component (301) due to heat emitted from the electronic component (301).

[0097] The heat conducting member (330) can be in contact with the electronic component (301). The heat conducting member (330) can have elasticity. For example, the heat conducting member (330) can cover at least a portion of the electronic component (301) (e.g., the second electronic component (301b)). The heat conducting member (330) is disposed between the electronic component (301) and the heat dissipation portion (325) of the bracket (320), thereby transferring heat emitted from the electronic component (301) to the heat dissipation portion (325) through conduction heat transfer.

[0098] The heat conducting member (330) has elasticity, and thus can provide a repulsive force to the heat dissipation portion (325) against pressure from the heat dissipation portion (325). For example, referring to FIGS. 3B and 3C, at least a portion of the heat conducting member (330) can be in contact with a shielding sheet (340) attached to the heat dissipation portion (325). The heat conducting member (330) can provide a repulsive force to the heat dissipation portion (325) by being compressed by the heat dissipation portion (325) while the shielding sheet (340) is attached to the heat dissipation portion (325) of the bracket (320). By the repulsive force, the shielding sheet (340) can be pressed against the heat dissipation portion (325). By pressing the shielding sheet (340) onto the heat dissipation portion (325), a relatively wide contact area can be formed between the shielding sheet (340) and the heat dissipation portion (325). By forming a relatively wide contact area between the shielding sheet (340) and the heat dissipation portion (325), the electronic device (101) can improve the thermal conductivity of a heat transfer path for conducting heat from the electronic component (301) to the heat dissipation portion (325) through the heat conducting member (330) and the shielding sheet (340).

[0099] The shielding sheet (340) may be placed on the heat conducting member (330). The shielding sheet (340) may be interposed between the heat conducting member (330) and the heat dissipation portion (325) of the bracket (320). The shielding sheet (340) may be in contact with the heat conducting member (330) and the heat dissipation portion (325), thereby forming a heat transfer path for heat transferred from the electronic component (301) to the heat dissipation portion (325) together with the heat conducting member (330). For example, one surface (340a) of the shielding sheet (340) facing the bracket (320) may be in contact with the heat dissipation portion (325) of the bracket (320). The other side (340b) of the shielding sheet (340), which is opposite to the one side (340a) and faces the printed circuit board (310), can be in contact with the heat conducting member (330) (or shield can (350)). For example, since the heat conducting member (330) has elasticity, the shielding sheet (340) can be brought into close contact with the heat dissipation portion (325) by the heat conducting member (330).

[0100] The shield can (350) can surround the electronic component (301) (and the thermally conductive member (330)) together with the shielding sheet (340). For example, the electronic component (301) can be placed on a first surface (310a) of a printed circuit board (310) facing toward the bracket (320). The shield can (350) can surround the electronic component (301) by being placed on the first surface (310a). For example, the shield can (350) can be connected to a ground within the electronic device (101). For example, the shield can (350) can be electrically connected to the ground of the electronic device (101) through the printed circuit board (310). The shield can (350) can, by being connected to the ground, emit electromagnetic waves emitted from the electronic component (301) to the ground. By emitting the electromagnetic waves to the ground, the shield can (350) can reduce degradation of performance of one or more other electronic components (302) around the electronic component (301) due to the electromagnetic waves.

[0101] The shield can (350) may include a through hole (355) formed on the electronic component (301). For example, the shield can (350) may be coupled to one surface (310a) of a printed circuit board (310) to which the electronic component (301) is coupled, thereby shielding the electronic component (301). The through hole (355) of the shield can (350) may overlap with the electronic component (301) when the electronic component (301) is viewed from above (e.g., when viewed in the +z direction). The through hole (355) may allow a heat conducting member (330) attached to the electronic component (301) to pass therethrough. For example, the through hole (355) may be a path for at least a portion of the heat emitted from the electronic component (301) to be emitted to the heat dissipation portion (325) of the bracket (320) through the heat conducting member (330) disposed on the electronic component (301).

[0102] For example, the heat conductive member (330) may be interposed between the electronic component (301) and the shielding sheet (340) through the through hole (355). The shielding sheet (340) may be in contact with the heat conductive member (330) passing through the through hole (355). The shielding sheet (340) may be attached to the shield can (350) so as to cover the through hole (355), thereby being in contact with the heat conductive member (330) passing through the through hole (355). The shielding sheet (340) may be pressed against the heat dissipation portion (325) of the bracket (320) by being pressed by the heat conductive member (330) passing through the through hole (355). The shielding sheet (340) can shield the electronic component (301) together with the shield can (350) by covering the through hole (355). For example, the shielding sheet (340) can be electrically connected to the shield can (350) by including a conductive material. The shielding sheet (340) can be configured to transmit electromagnetic waves emitted from the electronic component (301) to the shield can (350) connected to the ground, but the embodiment is not limited thereto.

[0103] For example, the thermally conductive member (330) may include a material having relatively high thermal conductivity. The thermally conductive member (330) may be referred to as a TIM (thermal interface material) in that it is interposed between the electronic component (301) and the shielding sheet (340), but is not limited thereto. The electronic device (101) includes the thermally conductive member (330) that transfers at least a portion of the heat emitted from the electronic component (301) through the through hole (355) of the shielding can (350) to the shielding sheet (340), thereby reducing degradation of the performance of the electronic component (301) surrounded by the shielding can (350) due to the heat emitted from the electronic component (301).

[0104] The shielding sheet (340) may be pressed against the heat dissipation portion (325) of the bracket (320) by a heat-conducting member (330) having elasticity, thereby forming a wrinkle (C). If a space is formed between the shielding sheet (340) and the heat dissipation portion (325) by the wrinkle (C), or if poor contact occurs between the shielding sheet (340) and the heat dissipation portion (325), the heat dissipation performance of the electronic device (101) through the heat-conducting member (330) and the shielding sheet (340) from the electronic component (301) may be deteriorated. The electronic device (101) may require a structure to reduce the deterioration of the thermal conductivity between the shielding sheet (340) and the heat dissipation portion (325) by the heat-conducting member (330) having elasticity. The structure is described through exemplary drawings below in FIG. 4A.

[0105] Figures 4a, 4b, and 4c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0106] Referring to FIGS. 4A, 4B, and 4C, an electronic device (101) may include a printed circuit board (310) including an electronic component (301), a bracket (320) that accommodates the printed circuit board (310) and includes a heat dissipation portion (325) disposed on the electronic component (301), a heat conducting member (330) that is elastic and contacts the electronic component (301), and a shielding sheet (340) disposed on the heat conducting member (330). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIGS. 4A to 4C may include structures and / or configurations exemplarily illustrated and described in FIGS. 3A to 3C. Hereinafter, redundant descriptions of structures and / or configurations having the same reference numerals as the structures and / or configurations exemplarily illustrated and described in FIGS. 3a to 3c may be omitted.

[0107] The electronic device (101) may include a thermally conductive material (410) that is at least partially disposed between the heat dissipation portion (325) of the bracket (320) and the shielding sheet (340). For example, the thermally conductive material (410) may be at least partially interposed between the heat dissipation portion (325) and the shielding sheet (340). The thermally conductive material (410) may be in contact with the heat dissipation portion (325) and the shielding sheet (340), thereby forming a heat transfer path from the shielding sheet (340) to the heat dissipation portion (325). For example, the thermally conductive material (410) may fill a space between the heat dissipation portion (325) of the bracket (320) and the shielding sheet (340) to transfer heat emitted from the electronic component (301) to the heat dissipation portion (325) of the bracket (320) through the shielding sheet (340). For example, the thermally conductive material (410) may fill a space between one side (340a) of the shielding sheet (340) facing the bracket (320) and the heat dissipation portion (325). For example, the thermally conductive material (410) may fill a space between the shielding sheet (340) and one side (325a) of the heat dissipation portion (325) facing the shielding sheet (340). However, the embodiments supported in the present disclosure are not limited thereto.

[0108] For example, referring to FIGS. 4A and 4B, before the printed circuit board (310) is mounted on the heat dissipation portion (325) of the bracket (320), the heat conductive material (410) may be placed in a liquid state having flowability on the shielding sheet (340). Referring sequentially to FIGS. 4B and 4C, the heat conductive material (410) may be spread out so as to be applied on one side (340a) of the shielding sheet (340) facing the heat dissipation portion (325) by being compressed by the shielding sheet (340) being pressed toward the heat dissipation portion (325) by the heat conductive member (330) and the heat dissipation portion (325). By thinly applying the heat-conducting material (410) between the shielding sheet (340) and the heat-dissipating portion (325), the heat-conducting material (410) can fill the space formed between the shielding sheet (340) and the heat-dissipating portion (325) by the heat-conducting member (330). By filling the space, the heat-conducting material (410) can improve the heat dissipation performance of the electronic device (101) for transferring heat emitted from the electronic component (301) to the heat-dissipating portion (325) through the shielding sheet (340).

[0109] For example, the thermally conductive member (330) may be formed from a conformal type thermally conductive material. The thermally conductive material (410) may be formed from a gel type thermally conductive material. For example, the thermally conductive member (330) may be a rigid body whose shape is substantially maintained. The thermally conductive material (410) may be a fluid having flowability. However, the embodiments supported by the present disclosure are not limited thereto. The electronic device (101) may include a thermally conductive member (330) for pressing the shielding sheet (340) to the heat dissipation portion (325), and a thermally conductive material (410) for filling the space between the shielding sheet (340) and the heat dissipation portion (325), thereby increasing the thermal conductivity from the electronic component (301) to the heat dissipation portion (325).

[0110] The heat dissipation portion (325) of the bracket (320) may include a plurality of holes (420) filled with a heat conductive material (410). For example, the plurality of holes (420) may penetrate the heat dissipation portion (325). For example, the plurality of holes (420) may extend from one side (325a) of the heat dissipation portion (325) facing the shielding sheet (340) to another side (325b) opposite to the one side (325a) and facing the display (e.g., the display (201) of FIG. 2A). For example, referring to FIG. 4A, the plurality of holes (420) may be formed at positions corresponding to positions where the heat conductive material (410) is disposed such that the heat conductive material (410) penetrates into the plurality of holes (420). However, the embodiments supported in the present disclosure are not limited thereto. The heat dissipation portion (325) can increase the contact area between the heat conductive material (410) and the bracket (320) by including a plurality of holes (420) in which the heat conductive material (410) is received. By increasing the contact area, the electronic device (101) can improve the heat dissipation performance through the heat conductive material (410) and the bracket (320).

[0111] For example, the thermally conductive material (410) may include a first portion (411) interposed between the heat dissipation portion (325) of the bracket (320) and the shielding sheet (340), and a second portion (412) extending from the first portion (411) and penetrating into the plurality of holes (420). For example, the first portion (411) may be a portion of the thermally conductive material (410) disposed between one side (325a) of the heat dissipation portion (325) and one side (340a) of the shielding sheet (340) facing the one side (325a). The first part (411) may be in contact with one surface (325a) of the heat dissipation part (325) and one surface (340a) of the shielding sheet (340), thereby filling a space between the heat dissipation part (325) and the shielding sheet (340). For example, the second part (412) may be connected to the first part (411). The second part (412) may be a part that penetrates into the inside of the plurality of holes (420) by being compressed by the heat dissipation part (325) and the shielding sheet (340). The second part (412) may be in contact with, for example, the inner surface of each of the plurality of holes (420). For example, the second part (412) may occupy or fill the plurality of holes (420). The second portion (412) can increase the contact area between the heat conducting material (410) and the heat dissipation portion (325) by coming into contact with the inner surface of each of the plurality of holes (420). However, the embodiments supported in the present disclosure are not limited thereto.

[0112] At least some of the plurality of holes (420) may have an inclined shape with respect to the heat dissipation portion (325) to increase the contact area between the bracket (320) and the heat conducting material (410).

[0113] For example, referring to FIG. 4C, each of the plurality of holes (420) may be formed to be inclined with respect to the z-axis corresponding to the thickness direction of the heat dissipation portion (325). For example, the plurality of holes (420) may be formed such that, when the heat dissipation portion (325) is viewed from above (e.g., when viewed in the +z direction), one end (or opening) formed on one side (325a) of the heat dissipation portion (325) does not overlap with the other end (or opening) formed on the other side (325b) opposite to the one side (325a). For example, the plurality of holes (420) may have a relatively long length by being formed to be inclined with respect to the heat dissipation portion (325). The inner surface of each of the plurality of holes (420) may have a relatively long length, thereby increasing the contact area with the heat-conducting material (410) (or the second portion (412) of the heat-conducting material (410)). However, the embodiments supported in the present disclosure are not limited thereto.

[0114] Although the thermally conductive material (410) is described as penetrating into the plurality of holes (420) in FIGS. 4A to 4C , this is not a limitation. Instead of the plurality of holes (420), the heat dissipation portion (325) may be formed with recesses formed to accommodate the thermally conductive material (410). However, the embodiments supported by the present disclosure are not limited thereto.

[0115] Figures 5a, 5b, and 5c illustrate parts of an internal structure for heat dissipation of an exemplary electronic device.

[0116] Referring to FIGS. 5A, 5B, and 5C, an electronic device (101) may include a printed circuit board (310) including an electronic component (301), a bracket (320) that accommodates the printed circuit board (310) and includes a heat dissipation portion (325) disposed on the electronic component (301), a heat conducting member (330) that is elastic and contacts the electronic component (301), and a shielding sheet (340) disposed on the heat conducting member (330). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIGS. 5A to 5C may include structures and / or configurations exemplarily illustrated and described in FIGS. 3A to 3C. Hereinafter, redundant descriptions of structures and / or configurations having the same reference numerals as the structures and / or configurations exemplarily illustrated and described in FIGS. 3a to 3c may be omitted.

[0117] The bracket (320) may include one or more rib portions (510) that protrude from the heat dissipation portion (325) toward the shielding sheet (340) to press the heat conductive member (330). For example, the one or more rib portions (510) may press the heat conductive member (330) that is in contact with the shielding sheet (340) by pressing the shielding sheet (340) toward the printed circuit board (310). For example, the one or more rib portions (510) may at least partially overlap the heat conductive member (330) when the heat dissipation portion (325) is viewed from above (e.g., when viewed in the +z direction). For example, one or more rib portions (510) can increase the rigidity of a portion of the heat dissipation portion (325) where the one or more rib portions (510) are formed by protruding from one side (325a) of the heat dissipation portion (325) facing the shielding sheet (340). The one or more rib portions (510) can reduce the formation of wrinkles in a display (e.g., the display (201) of FIG. 2A) placed on the heat dissipation portion (325) due to a repulsive force by the heat conducting member (330) by increasing the rigidity of the heat dissipation portion (325).

[0118] The shielding sheet (340) may include one or more recesses (520) corresponding to one or more rib portions (510) of the bracket (320) and configured to receive the one or more rib portions (510). For example, the one or more recesses (520) may have a shape corresponding to the one or more rib portions (510) so as to receive the one or more rib portions (510). For example, the one or more recesses (520) may be formed by recessing from one side (340a) of the shielding sheet (340) facing the bracket (320) toward the printed circuit board (310). For example, the one or more recesses (520) may be formed by the shielding sheet (340) and the thermally conductive member (330) in contact with the shielding sheet (340). However, the embodiments supported in the present disclosure are not limited thereto.

[0119] For example, one or more rib portions (510) and one or more recesses (520) accommodating the one or more rib portions (510) can increase the contact area between the heat dissipation portion (325) and the shielding sheet (340). By increasing the contact area, the electronic device (101) can increase the thermal conductivity from the shielding sheet (340) to the heat dissipation portion (325).

[0120] For example, referring to FIG. 5A, one or more rib portions (510) may include rib portions (511, 512) extending in different directions and intersecting each other. One or more recesses (520) of the shielding sheet (340) may include recesses (521, 522) corresponding to and intersecting each of the rib portions (511, 512).

[0121] For example, referring to FIG. 5B, one or more rib portions (510) may include rib portions (513, 514, 515) extending in a first direction, and rib portions (516, 517, 518) extending in a direction perpendicular to the first direction to intersect the rib portions (513, 514, 515), respectively. One or more recesses (520) of the shielding sheet (340) may include recesses (523, 524, 525) extending in the first direction and accommodating the rib portions (513, 514, 515), respectively, and recesses (526, 527, 528) extending in the second direction and accommodating the rib portions (516, 517, 518), respectively. However, the embodiments supported in this disclosure are not limited thereto.

[0122] For example, unlike the illustrated embodiment, the shielding sheet (340) may include one or more protrusions that protrude toward the heat dissipating portion (325) of the bracket (320). The bracket (320) may include one or more grooves that correspond to the one or more protrusions of the shielding sheet (340) and accommodate the one or more protrusions.

[0123] For example, in contrast to FIGS. 5A to 5C, a positive structure corresponding to one or more rib portions (510) may be formed on the shielding sheet (340), and a negative structure corresponding to one or more recesses (520) may be formed on the heat dissipation portion (325). For example, one or more grooves may have a shape corresponding to one or more protrusions so as to accommodate one or more protrusions. For example, one or more grooves may be formed by being recessed from one side (325a) of the heat dissipation portion (325) facing the shielding sheet (340) toward the display (e.g., the display (201) of FIG. 2A). For example, one or more grooves may increase the contact area between the heat dissipation portion (325) and the shielding sheet (340) by accommodating one or more protrusions.

[0124] Figures 6a and 6b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0125] Referring to FIGS. 6A and 6B, an electronic device (101) may include a printed circuit board (310) including an electronic component (301), a bracket (320) that accommodates the printed circuit board (310) and includes a heat dissipation portion (325) disposed on the electronic component (301), a heat conducting member (330) that has elasticity and is in contact with the electronic component (301), and a shielding sheet (340) disposed on the heat conducting member (330). The electronic device (101) may include a heat conducting material (410) that is at least partially disposed between the heat dissipation portion (325) of the bracket (320) and the shielding sheet (340). The heat conductive material (410) may fill a space between the heat dissipation portion (325) of the heat conductive bracket (320) and the shielding sheet (340) to transfer heat emitted from the electronic component (301) to the heat dissipation portion (325) of the heat conductive bracket (320) through the shielding sheet (340). The heat dissipation portion (325) of the bracket (320) may include a plurality of holes (420) filled by the heat conductive material (410). The bracket (320) may include one or more rib portions (510) protruding from the heat dissipation portion (325) toward the shielding sheet (340) to press the heat conductive member (330).

[0126] Referring to FIGS. 6A and 6B, the internal structure of the electronic device (101) exemplarily illustrated and described in FIGS. 4A to 4C and the internal structure of the electronic device (101) exemplarily illustrated and described in FIGS. 5A to 5C can be provided in a combined form.

[0127] For example, the heat dissipation portion (325) of the bracket (320) may include a plurality of holes (420) for receiving a heat-conducting material (410). The bracket (320) may include one or more rib portions (510) that protrude from the heat dissipation portion (325) toward the shielding sheet (340). The shielding sheet (340) may be formed with one or more recesses (520) for receiving the one or more rib portions (510). A heat-conducting material (410) may be applied to one surface (340a) of the shielding sheet (340) facing the heat dissipation portion (325).

[0128] For example, the thermally conductive material (410) may be pressed into the plurality of holes (420) of the thermally conductive portion (325) by being pressed by one or more rib portions (510) of the thermally conductive portion (325). For example, the shielding sheet (340) may include one or more recesses (520) corresponding to one or more rib portions (510) of the bracket (320) and accommodating the one or more rib portions (510) and a portion of the thermally conductive material (410). For example, a portion of the thermally conductive material (410) may be interposed between the one or more rib portions (510) and the shielding sheet (340) (or one surface (340a) of the shielding sheet (340)) by being disposed within the one or more recesses (520). However, the embodiments supported by the present disclosure are not limited thereto.

[0129] For example, the plurality of holes (420) may be formed adjacent to one or more rib portions (510). For example, the plurality of holes (420) may be arranged to bypass one or more rib portions (510) or may be formed in a portion where the one or more rib portions (510) are not formed. For example, the plurality of holes (420) may be formed around one or more rib portions (510) to accommodate a thermally conductive material (410) pressed by the one or more rib portions (510). However, the embodiments supported by the present disclosure are not limited thereto.

[0130] According to the above-described embodiment, the electronic device (101) can improve the heat dissipation performance of the electronic device (101) for heat transfer from the shielding sheet (340) to the heat dissipation portion (325) by including a heat conducting material (410) that fills a space between the shielding sheet (340) and the heat dissipation portion (325). The heat dissipation portion (325) can include one or more rib portions (510) configured to press the heat conducting member (330), thereby reducing the formation of wrinkles in a display (e.g., the display (201) of FIG. 2A) placed on the bracket (320) by the heat conducting member (330) and increasing the contact area for heat transfer between the heat dissipation portion (325) and the shielding sheet (340).

[0131] Figures 7a and 7b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0132] Referring to FIGS. 7A and 7B , an electronic device (101) may include a printed circuit board (310) including an electronic component (301), a bracket (320) that accommodates the printed circuit board (310) and includes a heat dissipation portion (325) disposed on the electronic component (301), a heat conducting member (330) that is elastic and contacts the electronic component (301), and a shielding sheet (340) disposed on the heat conducting member (330). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIGS. 7A and 7B may include structures and / or configurations exemplarily illustrated and described in FIGS. 3A to 3C . Hereinafter, redundant descriptions of structures and / or configurations having the same reference numerals as the structures and / or configurations exemplarily illustrated and described in FIGS. 3a to 3c may be omitted.

[0133] The bracket (320) may include a plurality of grooves (710) that accommodate at least a portion of the heat-conducting material (410). For example, unlike FIGS. 4A to 4C , instead of the plurality of holes (420), the plurality of grooves (710) may be formed in the heat-dissipating portion (325) of the bracket (320). For example, the plurality of grooves (710) may be recessed from the heat-dissipating portion (325) toward the display (e.g., the display (201) of FIG. 2A). By including the plurality of grooves (710), the bracket (320) may provide a space for accommodating the heat-conducting material (410) and prevent the heat-conducting material (410) from contacting the display (201).

[0134] For example, the thermally conductive material (410) may include a first portion (411) interposed between the shielding sheet (340) and the heat dissipation portion (325), and a second portion (412) connected to the first portion (411) and accommodated within a plurality of grooves (710).

[0135] For example, the plurality of grooves (710) may have an inclined shape within the heat dissipation portion (325) of the bracket (320) to increase the contact area between the bracket (320) and the heat conducting material (410). However, the embodiments supported in the present disclosure are not limited thereto.

[0136] Figures 8a and 8b illustrate a portion of an internal structure for heat dissipation of an exemplary electronic device.

[0137] Referring to FIGS. 8A and 8B, an electronic device (101) may include a printed circuit board (310) including an electronic component (301), a bracket (320) that accommodates the printed circuit board (310) and includes a heat dissipation portion (325) positioned over the electronic component (301), and a heat conducting member (330) that has elasticity and is in contact with the electronic component (301).

[0138] The bracket (320) may include a shielding wall (800) that protrudes from the heat dissipation portion (325) of the bracket (320) toward the printed circuit board (310) and surrounds the electronic component (301). For example, unlike as illustrated in FIGS. 3A to 7B , the shielding sheet (340) and the shielding can (350) for shielding the electronic component (301) may be omitted. Instead of the shielding can (350), the shielding wall (800) of the bracket (320) may surround the electronic component (301) to shield the electronic component (301). For example, the shielding wall (800) may be protruded from one side (325a) of the heat dissipation portion (325) facing the printed circuit board (310), thereby contacting or welding the first side (310a) on which the electronic component (301) of the printed circuit board (310) is disposed. The shielding wall (800) may be configured to be electrically connected to the ground of the printed circuit board (310), thereby emitting noise generated from the electronic component (301) to the ground.

[0139] For example, since the shielding sheet (340) is omitted, the heat conducting member (330) can be in direct contact with the heat dissipation portion (325) of the bracket (320). For example, the heat dissipation portion (325) can include one or more rib portions (510) for pressing the heat conducting member (330). The heat conducting member (330) can include one or more recesses (520) corresponding to the one or more rib portions (510) and accommodating the one or more rib portions (510). The heat dissipation part (325) of the electronic device (101) can simplify the internal structure of the electronic device (101) for shielding the electronic component (301) and the internal structure of the electronic device (101) for transferring heat emitted from the electronic component (301) to the heat dissipation part (325) by including a shielding wall (800) surrounding the electronic component (301) and the heat conducting member (330).

[0140] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0141] As described above, an electronic device (e.g., an electronic device (101) of FIG. 1) may include a printed circuit board (e.g., a printed circuit board (250) of FIG. 2b, a printed circuit board (310) of FIG. 3a), an electronic component mounted on the printed circuit board (e.g., a processor (120) of FIG. 1, an electronic component (301) of FIG. 3b), and a shield can (e.g., a shield can (350) of FIG. 3a) disposed on the printed circuit board. The electronic component may be positioned within the shield can, and the shield can may define an opening (e.g., a through hole (355) of FIG. 3b) disposed over the electronic component. The electronic device may include a thermally conductive member (e.g., a thermally conductive member (330) of FIG. 3B) having elasticity and in contact with at least a portion of a top surface and a side surface of the electronic component and positioned within the shield can, and a shielding sheet (e.g., a shielding sheet (340) of FIG. 3A) covering the opening of the shield can and in contact with the thermally conductive member. The shield can and the shielding sheet may be configured to shield electromagnetic interference between the electronic component and other electronic components outside the shield can. The electronic device may include a thermally conductive bracket including a portion corresponding to the printed circuit board (e.g., a heat dissipation portion (325) of FIG. 3A), and a rib structure (e.g., one or more rib portions (510) of FIG. 5A) protruding from one side of the portion toward the shielding sheet and configured to compress the thermally conductive member through the shielding sheet. The above heat conducting member may be configured to transfer heat generated from the electronic component to the outside of the shield can.

[0142] For example, the thermally conductive member may be formed from a conformal type thermally conductive material including a polymer.

[0143] For example, the electronic device may further include a thermally conductive material (e.g., thermally conductive material (410) of FIG. 4A) that is at least partially interposed between the portion of the thermally conductive bracket and the shielding sheet and is in contact with both the portion of the thermally conductive bracket and the shielding sheet.

[0144] For example, the thermally conductive material may be formed from a gel-type thermally conductive material.

[0145] For example, the portion of the thermally conductive bracket may include holes (e.g., a plurality of holes (420) in FIG. 4A) filled with the thermally conductive material.

[0146] For example, at least some of the holes may have an inclined shape within the portion of the thermally conductive bracket to increase the contact area between the thermally conductive bracket and the thermally conductive material.

[0147] For example, the portion of the thermally conductive bracket may include grooves (e.g., a plurality of grooves (710) of FIG. 7A) that accommodate at least a portion of the thermally conductive material.

[0148] For example, at least some of the grooves may have an inclined shape within the portion of the thermally conductive bracket to increase the contact area between the thermally conductive bracket and the thermally conductive material.

[0149] For example, the shielding sheet may include wrinkles formed around the heat conducting member.

[0150] For example, the rib structure may include a first rib portion extending in a first direction (e.g., the first rib portion (511) of FIG. 5A), and a second rib portion extending in a second direction different from the first direction and intersecting the first rib portion (e.g., the second rib portion (512) of FIG. 5A).

[0151] For example, the first direction and the second direction may be perpendicular to each other.

[0152] For example, the shielding sheet may include a recess (e.g., one or more recess portions (520) of FIG. 5A) corresponding to the rib structure of the thermally conductive bracket and accommodating the rib structure.

[0153] For example, at least a portion of the thermally conductive member may be recessed toward the printed circuit board to form the recess in the shielding sheet.

[0154] For example, the opening of the shield can may be penetrated by the heat conducting member such that the shielding sheet contacts the heat conducting member through the opening.

[0155] For example, the electronic device may further include a display (e.g., display (201) of FIG. 2A) disposed on the thermally conductive bracket and separated from the electronic component by the portion of the thermally conductive bracket.

[0156] An electronic device according to the above may include a printed circuit board, an electronic component mounted on one surface of the printed circuit board, and a shield can disposed on the one surface of the printed circuit board and surrounding the electronic component. The shield can define an opening disposed over the electronic component. The electronic device may include a thermally conductive member having elasticity and in contact with the electronic component and positioned within the shield can, a shielding sheet covering the opening of the shield can and in contact with the thermally conductive member, a thermally conductive bracket including a portion for receiving the printed circuit board, and a thermally conductive material at least partially interposed between the shielding sheet and the portion of the thermally conductive bracket, the thermally conductive material being in face-to-face contact with both the shielding sheet and the portion of the thermally conductive bracket to transfer heat from the electronic component to the thermally conductive bracket through the thermally conductive member.

[0157] For example, the thermally conductive member may be formed from a conformal type thermally conductive material, and the thermally conductive material may be formed from a gel type thermally conductive material. At least a portion of the thermally conductive material may be applied as a thin layer between the shielding sheet and the portion of the thermally conductive bracket by a force according to the elasticity of the thermally conductive member.

[0158] For example, said portion of said thermally conductive bracket may include grooves that accommodate at least a portion of said thermally conductive material.

[0159] For example, the thermally conductive bracket may further include a rib structure formed adjacent to the grooves and protruding from the portion of the thermally conductive bracket toward the shielding sheet to compress the thermally conductive member through the shielding sheet.

[0160] For example, at least some of the grooves may have an inclined shape within the portion of the thermally conductive bracket to increase the contact area between the thermally conductive bracket and the thermally conductive material.

[0161] According to the above, an electronic device (e.g., an electronic device (101) of FIG. 1) may include a printed circuit board (e.g., a printed circuit board (250) of FIG. 2b, a printed circuit board (310) of FIG. 3a) including an electronic component (e.g., a processor (120) of FIG. 1), a thermally conductive bracket (e.g., a bracket (320) of FIG. 3a) that accommodates the printed circuit board and includes a heat dissipation portion (e.g., a heat dissipation portion (325) of FIG. 3a) disposed on the electronic component, a thermally conductive member (e.g., a thermally conductive member (330) of FIG. 3b) that has elasticity and is in contact with the electronic component, a shielding sheet (e.g., a shielding sheet (340) of FIG. 3a) disposed on the thermally conductive member, and a thermally conductive material (e.g., a thermally conductive material (410) of FIG. 4a) that is at least partially disposed between the heat dissipation portion of the thermally conductive bracket and the shielding sheet. The above thermally conductive material can fill a space between the heat dissipation portion of the thermally conductive bracket and the shielding sheet to transfer heat emitted from the electronic component to the heat dissipation portion of the thermally conductive bracket through the shielding sheet.

[0162] For example, the thermally conductive member may be formed from a conformal type thermally conductive material. The thermally conductive material may be formed from a gel type thermally conductive material.

[0163] For example, the heat dissipation portion of the thermally conductive bracket may include a plurality of holes (e.g., a plurality of holes (410) in FIG. 4A) filled with the thermally conductive material.

[0164] For example, at least some of the plurality of holes may have an inclined shape with respect to the heat dissipation portion to increase the contact area between the heat conductive bracket and the heat conductive material.

[0165] For example, the thermally conductive material may include a first portion (e.g., a first portion (411) of FIG. 4c) interposed between the heat-dissipating portion of the thermally conductive bracket and the shielding sheet, and a second portion (e.g., a second portion (412) of FIG. 4c) extending from the first portion and penetrating into the plurality of holes.

[0166] For example, the electronic device may further include a shield can (e.g., a shield can (350) of FIG. 3A) that is disposed on the printed circuit board, is electrically connected to the ground of the electronic device, and surrounds the electronic component together with the shielding sheet to shield the electronic component through the ground.

[0167] For example, the shield can may include a through hole (e.g., through hole (355) of FIG. 3B) formed over the electronic component so as to be penetrated by the heat conductive member. The shield sheet may cover the through hole so as to be in contact with the heat conductive member through the through hole.

[0168] For example, the thermally conductive bracket may further include one or more rib portions (e.g., one or more rib portions (510) of FIG. 5A) protruding from the heat dissipating portion toward the shielding sheet to pressurize the thermally conductive member.

[0169] For example, the one or more rib portions may include a first rib portion extending in a first direction (e.g., rib portion (511) of FIG. 5A), and a second rib portion extending in a second direction different from the first direction and intersecting the first rib portion (e.g., rib portion (512) of FIG. 5A).

[0170] For example, the shielding sheet may include one or more recesses (e.g., one or more recesses (520) of FIG. 5A) corresponding to one or more rib portions of the thermally conductive bracket and accommodating the one or more rib portions and a portion of the thermally conductive material.

[0171] For example, the heat dissipating portion of the thermally conductive bracket may be formed adjacent to the one or more rib portions and may include a plurality of holes for accommodating a portion of the thermally conductive material.

[0172] For example, the shielding sheet may include one or more protrusions (e.g., one or more protrusions (710) of FIG. 7A) protruding toward the heat dissipating portion of the thermally conductive bracket. The thermally conductive bracket may include one or more grooves (e.g., one or more grooves (720) of FIG. 7A) corresponding to the one or more protrusions of the shielding sheet and accommodating the one or more protrusions and a portion of the thermally conductive material.

[0173] For example, the one or more protrusions may include a first protrusion having a length in a first direction (e.g., protrusion (711) of FIG. 7A), and a second protrusion having a length in a second direction different from the first direction and intersecting the first protrusion (e.g., protrusion (712) of FIG. 7A).

[0174] For example, the thermally conductive bracket may further include a shielding wall (e.g., shielding wall (800) of FIG. 8A) protruding from the heat dissipation portion toward the printed circuit board and surrounding the electronic component and the thermally conductive member.

[0175] For example, the electronic device may further include a display (e.g., display (201) of FIG. 2A) disposed on the thermally conductive bracket and separated from the electronic component by the heat dissipating portion of the thermally conductive bracket.

[0176] According to the above, an electronic device may include a printed circuit board including an electronic component, a thermally conductive bracket accommodating the printed circuit board and defining a heat dissipation portion disposed on the electronic component, a thermally conductive member having elasticity and in contact with the electronic component, a shield can electrically connected to a ground of the electronic device, surrounding the electronic component to shield the electronic component through the ground, and including a through hole penetrated by the thermally conductive member, and a shielding sheet attached to the shield can to cover the through hole and in contact with the thermally conductive member through the through hole. The thermally conductive bracket may include one or more rib portions protruding from the heat dissipation portion toward the shield sheet to press the thermally conductive member.

[0177] For example, the electronic device may further include a thermally conductive material that is in contact with the heat dissipation portion of the thermally conductive bracket and the shielding sheet. The thermally conductive member may be formed from a conformal type thermally conductive material. The thermally conductive material may be formed from a gel type thermally conductive material.

[0178] For example, the heat dissipation portion of the thermally conductive bracket may include a plurality of holes filled with the thermally conductive material, each of which has a shape inclined with respect to the heat dissipation portion of the thermally conductive bracket, in order to increase a contact area between the thermally conductive material and the thermally conductive bracket.

[0179] For example, the shielding sheet may include one or more recesses corresponding to the one or more rib portions of the thermally conductive bracket and accommodating the one or more rib portions.

[0180] For example, the one or more rib portions may include a first rib portion extending in a first direction, and a second rib portion extending in a second direction different from the first direction and intersecting the first rib portion.

[0181] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0182] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0183] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0184] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0185] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0186] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0187] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separately arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, printed circuit board; Electronic components mounted on the printed circuit board; A shield can disposed on the printed circuit board, the electronic component being positioned within the shield can, and the shield can defining an opening disposed over the electronic component; A heat conducting member having elasticity and in contact with at least a portion of the upper surface and side surface of the electronic component and positioned within the shield can; A shielding sheet covering the opening of the shield can and in contact with the heat conducting member, the shield can and the shielding sheet being configured to shield electromagnetic interference between the electronic component and other electronic components outside the shield can; and A thermally conductive bracket comprising a portion corresponding to the printed circuit board and a rib structure protruding from the portion toward the shielding sheet and configured to compress the thermally conductive member through the shielding sheet, The above heat conducting member is, configured to transfer heat generated from the electronic component to the outside of the shield can, Electronic devices.

2. In paragraph 1, The above heat conducting member is, Formed from a conformal type thermally conductive material containing a polymer, Electronic devices.

3. In paragraph 1 or 2, Further comprising a thermally conductive material at least partially interposed between the portion of the thermally conductive bracket and the shielding sheet, and in contact with both the portion of the thermally conductive bracket and the shielding sheet. Electronic devices.

4. In paragraph 3, The above heat conducting material is, Formed from a gel-type thermally conductive material, Electronic devices.

5. In paragraph 3, The above part of the above thermal conductive bracket, comprising holes filled by the heat conducting material, Electronic devices.

6. In paragraph 5, At least some of the above holes, Having an inclined shape within the portion of the thermally conductive bracket to increase the contact area between the thermally conductive bracket and the thermally conductive material, Electronic devices.

7. In paragraph 3, The above part of the above thermal conductive bracket, comprising grooves accommodating at least a portion of the heat conducting material; Electronic devices.

8. In paragraph 7, At least some of the above homes, Having an inclined shape within the portion of the thermally conductive bracket to increase the contact area between the thermally conductive bracket and the thermally conductive material, Electronic devices.

9. In any one of paragraphs 1 to 8, The above shielding sheet, Including wrinkles formed around the heat conducting member, Electronic devices.

10. In any one of paragraphs 1 to 9, The above rib structure is, a first rib portion extending in the first direction; and A second rib portion extending in a second direction different from the first direction and intersecting the first rib portion, Electronic devices.

11. In paragraph 10, The above first direction and the above second direction are, Perpendicular to each other, Electronic devices.

12. In any one of paragraphs 1 to 11, The above shielding sheet, Corresponding to the rib structure of the thermally conductive bracket, and including a recess for accommodating the rib structure, Electronic devices.

13. In paragraph 12, At least a portion of the heat conducting member is recessed toward the printed circuit board to form the recess of the shielding sheet, Electronic devices.

14. In any one of paragraphs 1 to 13, The above opening of the above shield can is penetrated by the heat conducting member so that the shielding sheet comes into contact with the heat conducting member through the opening. Electronic devices.

15. In any one of paragraphs 1 to 14, Further comprising a display disposed on the thermally conductive bracket and separated from the electronic component by the portion of the thermally conductive bracket; Electronic devices.

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