Handler for processing electronic components and tray for loading electronic components

Abstract

The present invention relates to a handler for processing electronic components. According to the present invention, the handler comprises: a first handling unit for handling a first loading element on which electronic components are held in place by adhesion; a second handling unit for handling a second loading element where the electronic components are seated in loading recesses to be held in place; and a moving hand for moving the electronic components on the first loading element to the second loading element. The present invention allows for a reduction in the costs required to construct a full system for testing electronic components.

Description

Handlers for handling electronic components and trays for loading electronic components

[0001] The present invention relates to a handler for handling electronic components.

[0002] Electronic components undergo various processing during the production process.

[0003] Various processing methods include testing and classification.

[0004] A handler is a piece of equipment that supports the processing required for electronic components.

[0005] For example, a handler for electronic component testing supports the electrical connection of electronic components requiring testing to the tester. Even handlers supporting testing must be equipped separately for each type of test.

[0006] For example, a handler for sorting electronic components supports the process of rearranging electronic components requiring sorting according to sorting criteria.

[0007] Typically, electronic components requiring handling are loaded onto trays and supplied to the handler.

[0008] The handler takes out electronic components loaded on a tray from the tray, performs the necessary processing, and loads the processed electronic components back onto the tray.

[0009] A tray is a loading element on which electronic components can be loaded, and there are various types.

[0010] The tray may be a ring frame (10) as shown in Fig. 1.

[0011] The ring frame (10) includes a support ring (11) and an adhesive film (12).

[0012] The support ring (10) is roughly circular in shape and has a notch (N1) formed to indicate direction.

[0013] The adhesive film (12) is fixed to the support ring (10) and supports the loaded electronic components. The electronic components are adhered to the adhesive film (12). The electronic components adhered to the adhesive film (12) can be maintained in a fixed position by the adhesion.

[0014] Fig. 2 shows, by way of example, a state in which several electronic components (ED) are adhered to an adhesive film (12).

[0015] The adhesive film (12) is damaged when the electronic component (ED) is removed. Therefore, it is used for one-time use and must be replaced continuously.

[0016] The tray may be a JEDEC tray designed and manufactured according to the standard specifications set by JEDEC.

[0017] The present invention relates particularly to a ring frame (10).

[0018] The ring frame (10) is mainly used to transport electronic components (ED) in a die state or in a state where dies are stacked for the production of HBM (High Bandwidth Memory).

[0019] Testing of the die is required to perform post-die operations.

[0020] Electronic components (EDs) in die state or in die-stacked state can be tested by electrically connecting the contact pads to the tester.

[0021] As microfabrication processes advance, the spacing between contact pads on a die becomes increasingly fine. This has presented a barrier to the development of handlers capable of supporting automated testing of electronic components (EDs) in die-state or stacked die states.

[0022] Omission of testing for electronic components (EDs) in die or stacked die states results in low yields and reduced reliability of final products. In response, the applicant has proposed Republic of Korea Patent Publication No. 10-2021-0088373 (hereinafter referred to as "prior art").

[0023] The handler proposed in the prior art is implemented to align the positions of electronic components (EDs) through a repositioning process before connecting the EDs to the tester.

[0024] The prior art uses a camera to scan an electronic component (ED) on a test table (called a 'chuck' in the prior art) to identify the location of the electronic component (ED), and then goes through a repositioning process to adjust it to the correct location.

[0025] According to prior art, the error range for electronic components (ED) positioning can be reduced, allowing for precise arrangement of EDs on a test table. This also enables automated testing of EDs in die or stacked die configurations.

[0026] According to the prior art, a ring frame (10) is used for transporting electronic components (ED) when bringing them into a handler or taking them out from a handler.

[0027] Electronic components (ED) are supplied to the handler while loaded onto a ring frame and are removed from the handler while loaded onto the ring frame.

[0028] Since the electronic component (ED) is adhered to the ring frame (10), the electronic component (ED) must be removed from the ring frame (10) for testing, and when recovered later, the electronic component (ED) must be adhered to the ring frame (10).

[0029] However, electronic components (EDs) must undergo various types of testing and processing, and must be supplied to different handlers each time. This results in excessive waste of disposable adhesive film (12) and damage to the electronic components (EDs) resulting from numerous adhesion and separation processes.

[0030] [Prior Art Literature]

[0031] [Patent Document]

[0032] (Patent Document 1) Republic of Korea Publication No. 10-2021-0088373

[0033] A technology is required to process electronic components while minimizing the use of ring frames.

[0034] A handler for processing electronic components according to a first aspect of the present invention comprises: a first handling unit for handling a first loading element on which electronic components can be loaded; a second handling unit for handling a second loading element on which electronic components can be loaded and having a different structure from the first loading element; a stacker unit disposed in front of the first handling unit and the second handling unit for supplying or retrieving the first loading element to or from the first handling unit and supplying or retrieving the second loading element to or from the second handling unit; and a moving hand for moving electronic components in the first loading element to the second loading element; wherein the first loading element handled by the first handling unit has a structure in which the loaded electronic components are maintained by adhesion, and the second loading element handled by the second handling unit has a structure in which the loaded electronic components are secured in a loading groove and maintained in position.

[0035] The above moving hand can move the electronic components in the second loading element to the first loading element.

[0036] The first handling unit has a separator for separating the electronic component from the first loading element when moving the electronic component loaded on the first loading element to the second loading element by the moving hand.

[0037] The first handling unit has an adhesive for adhering the electronic component loaded on the second loading element to the first loading element when moving the electronic component to the first loading element by the moving hand.

[0038] The loading capacity of the first loading element is N times (N is a natural number greater than or equal to 2) the loading capacity of the second loading element.

[0039] The second handling unit includes at least one support for supporting the second loading element; and a base plate on which the support is installed.

[0040] The above base plate is installed so as to be movable.

[0041] The above-mentioned supporters are installed in multiple numbers.

[0042] The support includes a support plate that supports the second loading element; a buffer plate that supports the second loading element and is positioned below the support plate; and an elevator that elevates the support plate and the buffer plate.

[0043] The second handling unit further includes a transfer unit that transfers the second loading element in the stacker unit to the support unit or transfers the second loading element in the support unit to the stacker unit.

[0044] The transfer includes a first gripper capable of gripping or releasing the second loading element; a first advance / retreat device that advances / retracts the first gripper; a second gripper capable of gripping or releasing the second loading element and positioned below the first gripper; a second advance / retreat device that advances / retracts the second gripper; and an elevator that elevates the first gripper and the second gripper.

[0045] An opening device for opening the second loading element is included.

[0046] The stacker section further includes a cassette transporter having a plurality of loading spaces in which cassettes capable of carrying the first loading element or the second loading element can be loaded, and capable of moving the cassettes between the plurality of loading spaces.

[0047] A handler for processing electronic components according to a second aspect of the present invention comprises: a handling section for handling a loading element on which electronic components can be loaded; a stacker section arranged in front of the handling section for supplying the loading element to the handling section or retrieving the loading element from the handling section; and a moving hand for moving the electronic component between loading elements in the handling section; wherein the handling section comprises a support for supporting the loading element; and a base plate on which the support is installed; wherein the base plate is installed so as to be movable.

[0048] The above support includes a support plate that supports the loading element; a buffer plate that supports the loading element and is positioned below the support plate; and an elevator (921c) that elevates the support plate and the buffer plate.

[0049] The handling unit further includes a transfer unit that transfers the loading element in the stacker unit to the support unit or transfers the loading element in the support unit to the stacker unit.

[0050] The transfer includes a first gripper capable of gripping or releasing the load element; a first advance / retreat device that advances / retracts the first gripper; a second gripper capable of gripping or releasing the load element and positioned below the first gripper; a second advance / retreat device that advances / retracts the second gripper; and an elevator (923e) that elevates the first gripper and the second gripper.

[0051] The above handling unit further includes an opening device for opening the loading element.

[0052] The stacker section further includes a cassette transporter having a plurality of loading spaces in which cassettes capable of carrying the loading elements can be loaded, and capable of moving the cassettes between the plurality of loading spaces.

[0053] A handler for processing electronic components according to a third aspect of the present invention comprises: a handling unit for handling a loading element on which electronic components can be loaded; a stacker unit disposed in front of the handling unit for supplying the loading element to the handling unit or retrieving the loading element from the handling unit; a moving hand for moving electronic components between loading elements in the handling unit; and a transfer unit for transferring the loading element in the stacker unit to the handling unit or transferring the loading element in the handling unit to the stacker unit; wherein the transfer unit comprises: a first gripper capable of gripping or releasing the loading element; a first advance / retreat unit for advancing / retracting the first gripper; a second gripper capable of gripping or releasing the loading element and disposed below the first gripper; a second advance / retreat unit for advancing / retracting the second gripper; and an elevator for elevating the first gripper and the second gripper.

[0054] The above handling unit includes an opener for opening the loading element.

[0055] The stacker section further includes a cassette transporter having a plurality of loading spaces in which cassettes capable of carrying the loading elements can be loaded, and capable of moving the cassettes between the plurality of loading spaces.

[0056] A handler for processing electronic components according to a fourth aspect of the present invention further comprises: a handling section for handling a loading element on which electronic components can be loaded; a stacker section arranged in front of the handling section and having a plurality of loading spaces in which cassettes capable of loading the loading elements can be loaded, the stacker section supplying the loading elements to the handling section or retrieving the loading elements from the handling section; a transfer section for transferring the loading elements in the stacker section to the handling section or transferring the loading elements in the handling section to the stacker section; and a cassette transfer section for moving cassettes between the plurality of loading spaces.

[0057] A handler for processing electronic components according to a fifth aspect of the present invention comprises: a handling section for handling a loading element on which electronic components can be loaded; a stacker section arranged in front of the handling section for supplying the loading element to the handling section or retrieving the loading element from the handling section; and a transfer section for transferring the loading element in the stacker section to the handling section or transferring the loading element in the handling section to the stacker section; wherein the handling section comprises an opening section for opening the loading element.

[0058] An electronic component loading tray according to the present invention comprises: a loading plate having loading grooves formed to a predetermined depth for loading electronic components; and a support frame supporting the loading plate and on which the loading plate is fixedly installed; wherein the outer edge of the support frame protrudes further outward than the outer edge of the loading plate.

[0059] The above support frame has a notch formed to recognize the direction.

[0060] The above loading plate is detachably installed on the support frame.

[0061] The above support frame has a ring-shaped outer rib; and reinforcing ribs for maintaining rigidity on the inside of the outer rib; and the loading plate is integrally formed and connected to the reinforcing ribs.

[0062] It further includes a cover for preventing electronic components from falling out of the above loading slots.

[0063] It further includes a fixing device for detachably fixing the cover to the loading plate.

[0064] The electronic components mounted on the above cover and the above loading groove are spaced apart from each other at a certain interval.

[0065] The depth of the above loading groove is formed lower than the height of the electronic component.

[0066] The above loading groove is formed in a form in which the upper width is wider than the lower width, so that a picker for holding electronic components can be inserted to a certain extent into the loading groove, and the lower width of the picker is wider than the upper width of the electronic component.

[0067] According to the present invention, the following effects are achieved.

[0068] First, waste of adhesive film can be reduced because the use of ring frames is minimized.

[0069] Second, it can prevent damage to electronic components that occur during the bonding and separation process.

[0070] Third, it can reduce the cost of building the processing system required for the entire processing process.

[0071] Figures 1 and 2 are reference drawings for explaining a ring frame, which is a loading element on which electronic components can be loaded.

[0072] Figures 3 to 8 are reference drawings for explaining a ring tray, which is a loading element that can be handled by a handler for processing electronic components according to the present invention.

[0073] Figures 9 to 28 are reference drawings for explaining the first type handler according to the present invention.

[0074] Figures 29 and 30 are reference drawings for explaining a second type handler according to the present invention.

[0075] Figure 31 is a reference diagram for explaining a third type handler according to the present invention.

[0076] Figure 32 is a reference diagram for explaining the fourth type handler according to the present invention.

[0077] Figure 33 is a reference diagram for explaining the fifth type handler according to the present invention.

[0078] Figures 34 and 35 are reference drawings for explaining the sixth type handler according to the present invention.

[0079] Figures 36 to 40 are reference drawings for explaining application examples according to combinations of various types of handlers according to the present invention.

[0080] A preferred embodiment of the present invention is described with reference to the attached drawings, but for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0081] <Description of the ring tray>

[0082] When electronic components are brought in or taken out by a handler for electronic component processing (H, hereinafter abbreviated as “handler”), a ring frame or ring tray may be used.

[0083] Ring tray is a newly proposed loading element for transporting manufactured electronic components (ED).

[0084] When a manufacturer of electronic components (ED) uses a ring frame, a ring tray is manufactured as a loading element that replaces the ring frame in the subsequent processing.

[0085] FIG. 3 is a plan view of a ring tray (20) according to one embodiment of the present invention, FIG. 4 is a plan view of the ring tray (20) of FIG. 3 with the cover removed, and FIG. 5 is a conceptual side cross-sectional view conceptually simplifying the ring tray (20) of FIG. 3 and exaggerating its height.

[0086] The ring tray (20) includes a loading plate (21), a support frame (22), a cover (23), a fixture (24), etc.

[0087] The loading plate (2I) is installed fixedly to the support frame (22).

[0088] The loading plate (21) is connected to the support frame (22) by a fixing means (F) such as a screw or bolt.

[0089] The loading plate (21) has loading grooves (21a) formed into which electronic components (ED) can be loaded.

[0090] The loading groove (21a) is open upward and is formed by being dug to a certain depth.

[0091] The loading plate (21) is manufactured by cutting loading grooves (21a) into a metal plate and is formed as one piece.

[0092] The loading home (21a) is formed to fit the specifications of the electronic component (ED).

[0093] When the electronic component (ED) to be processed is changed, the worker separates the loading plate (21) and then attaches a new loading plate (21) to the support frame (22). For this purpose, the loading plate (21) is detachably installed on the support frame (22).

[0094] The loading plate (21) has installation grooves (21b) formed for installing fixtures (24), and an inwardly recessed retreat groove (21c) is formed in the outer area where the installation grooves (21b) are formed.

[0095] The support frame (22) is placed below the loading plate (21).

[0096] The support frame (22) supports the loading plate (21).

[0097] A loading plate (21) is fixedly installed on the support frame (22).

[0098] The outer edge of the support frame (22) protrudes further outward than the outer edge of the loading plate (21).

[0099] The support frame (22) has outer ribs (22a) and reinforcing ribs (22b).

[0100] The outer rib (22a) is ring-shaped and forms the outer edge of the support frame (22).

[0101] A notch (N2) is formed on the outer rib (22a) to recognize the direction of the support frame (22), and the position of the notch (N2) is the same as the position of the notch (N1) on the ring frame (10).

[0102] The width and outer shape of the outer rib (22a) are the same as the width and outer shape of the support ring (11) of the ring frame (10). Therefore, means (such as a holding means, a moving means, and a storage means) capable of handling the ring frame (10) can handle the ring tray (20).

[0103] The reinforcing bars (22b) are formed on the inside of the outer bars (22a) and maintain the rigidity of the inner part of the support frame (22).

[0104] The loading plate (21) is connected to the reinforcing bar (22b) by a fixing means (F).

[0105] When viewed from a flat surface, the outer rib (22a) is exposed to the outside of the loading plate (21).

[0106] The area excluding the outer ribs (22a) and the reinforcing ribs (22b) is perforated in the vertical direction.

[0107] The cover (23) prevents the electronic component (ED) from being detached from the loading groove (21a).

[0108] The cover (23) has catches (23a).

[0109] It is preferable that the cover (23) and the electronic component (ED) mounted on the loading groove (21a) be spaced apart from each other at a certain distance. By being spaced apart from each other, contact between the cover (23) and the electronic component (ED) due to small shaking, etc. is suppressed, and damage to the electronic component (ED) is thereby prevented.

[0110] The fixture (24) detachably fixes the cover (23) to the loading plate (21).

[0111] The fixture (24) is installed in the installation groove (21b).

[0112] As shown in the extract of FIG. 6, the fixture (24) includes a fixture (24a) and a spring (24b).

[0113] A catch groove (JH) is formed in the fixed member (24a).

[0114] A catch rod (23a) can be inserted into the catch groove (JH).

[0115] When the cover (23) is combined, the catch bar (23a) is inserted into the catch groove (JH).

[0116] The spring (24b) is an elastic member that applies elastic force to the fixed member (24a) in one direction (the right direction in the example of Fig. 6).

[0117] When no external force is applied while the catch rod (23a) is inserted into the catch groove (JH), the fixing member (24a) maintains the state of moving forward in the outward direction by the elastic force of the spring (24b).

[0118] When the fixed member (24a) is advanced outward, the catch bar (23a) is caught on the catch jaw (JJ). In this state, the cover (23) remains connected to the loading plate (21).

[0119] If the cover (23) is lifted upward by an external force, the catch (23a) applies an external force inward to the fixing member (24a), causing the fixing member (24a) to retreat inward. Accordingly, the cover (23) is removed from the loading frame (21), and the ring tray (20) is opened.

[0120] Opening of the ring tray (20) means that the loading groove (21a) is opened.

[0121] When the loading groove (21a) is opened, an electronic component (ED) can enter the loading groove (21a) or exit the loading groove (21a).

[0122] Since the cover (23) can be attached to or removed from the loading plate (21) by simply lowering or raising the cover (23), the configuration for opening and closing the ring tray (20) can be simplified.

[0123] Comparing FIGS. 3 and 4, the outer edge of the cover (23) protrudes further outward than the outer edge of the loading plate (21). Accordingly, when lifting or lowering the cover (23) during the opening and closing process of the ring tray (20), interference between the gripping means for gripping the cover (23) and the loading plate (21) can be prevented. Furthermore, by forming a retraction groove (21c) in the loading plate (21) and enabling the gripping means to grip the cover (23) in the area where the retraction groove (21c) is present, interference between the gripping means and the loading plate (21) is further prevented.

[0124] The ring frame (10) can stack electronic components (ED) very closely together, but the gap between the electronic components (ED) in the ring tray (20) is relatively far due to its structure. Therefore, the loading capacity of the ring frame (10) is greater than that of the ring tray (10). Preferably, in order to match the throughput, the loading capacity of the ring frame (10) is N (N is a natural number) times greater than that of the ring tray (10).

[0125] For example, 512 electronic components (ED) can be loaded on the ring frame (10), and 128 electronic components (ED) can be loaded on the ring tray (10).

[0126] Meanwhile, as shown in Fig. 7, the electronic component (ED) may be loaded on the ring frame (20) in a dead bug state with the terminal (contact pad, T) facing upward. In this case, the lower width (w2) of the picker (P) may be wider than the upper width (w1) of the electronic component (ED).

[0127] In the case of Fig. 7, a structure is required in which the picker (P) can properly grip the electronic component (ED) loaded in the loading groove (21a).

[0128] For example, as in (a) of Fig. 8, a structure may be adopted in which the depth (d1) of the loading groove (21a) is formed lower than the height (d2) of the electronic component (ED).

[0129] For example, as in (b) of Fig. 8, the upper width (w4) of the loading groove (21a) may be extended more than the lower width (w3), so that the picker (P) may be inserted to a certain extent into the loading groove (21a).

[0130] Various types of handlers (H) are possible by the ring tray (20) above. Representative types of handlers are examined below.

[0131] Description of the Type 1 Handler

[0132] Figure 9 is a conceptual plan view of a first type handler (H1).

[0133] The first type handler (H1) can be divided into a moving part (MP), an unloading part (LU), an arrangement part (AP), and a connecting part (CP), and includes a transport shuttle (100), a first moving hand (210), a second moving hand (220), a test table (300), a vacuum (400), a repositioning mechanism (500), a moving mechanism (600), a connecting device (700), and a controller (800).

[0134] In the moving section (MF), electronic components (ED) can be moved between the unloading section (LU) and the array section (AP) to exchange them. For this purpose, a transport shuttle (100) for transporting the electronic components (ED) is installed in the moving section (MP).

[0135] A transport shuttle (100) is provided to transport electronic components (ED) between the unloading section (LU) and the arrangement section (AP).

[0136] The transport shuttle (100) has a movable transport table (110).

[0137] The transport shuttle (100) has at least one transport table (110).

[0138] The transport table (110) can move back and forth in one direction. In the example of Fig. 9, the transport table (110) moves back and forth in the X-axis direction.

[0139] In the case where there are multiple transport tables (110), multiple transport tables (110) can be provided in parallel in the Y-axis direction and can be implemented to move back and forth in the X-axis direction independently of each other.

[0140] The transport table (110) can move between the first area (A1) on the unloading section (LU) side and the second area (A2) on the arrangement section (AP) side. The first area (A1) and the second area (A2) are separated from each other.

[0141] Electronic components (ED) can be loaded on the transport table (110).

[0142] The transport table (110) has a vacuum structure that fixes the electronic component (ED) mounted on a flat surface by vacuum pressure, rather than a pocket structure having a mounting groove in which the electronic component (ED) can be mounted.

[0143] As shown in the schematic plan view of Fig. 10, the transport table (110) is formed with vacuum holes (VH) for vacuum-absorbing electronic components (ED) and vacuum grooves (VG) connected to the vacuum holes (VH).

[0144] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0145] On a plane, vacuum grooves (VG) surround vacuum holes (VH).

[0146] The vacuum pressure coming through the vacuum hole (VH) is evenly distributed in all directions through the vacuum groove (VG) and acts on the electronic component (ED). For example, the vacuum hole (VH) applies vacuum pressure near the center of the electronic component (ED), and the vacuum groove (VG) applies vacuum pressure near the edge of the electronic component (ED).

[0147] Since the electronic component (ED) can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component (ED) occurs during the process of being loaded onto the transport table (110) and moving in the X-axis direction. Accordingly, if the electronic component (ED) is precisely placed on the transport table (110), the operational error due to misalignment of the electronic component (ED) during the movement of the transport table (110) can be minimized.

[0148] For example, vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix. However, the loading capacity of the transport table (110) can be increased or decreased as desired.

[0149] Electronic components (ED) to be tested are brought into the first-class handler (H1) through the unloading section (LU), and electronic components (ED) that have completed testing are taken out from the first-class handler (H1) through the unloading section (LU).

[0150] Electronic components (ED) are supplied to the first type handler (H1) in a state loaded on a ring frame (10) and can be recovered from the first type handler (H1) in a state loaded on a ring tray (20).

[0151] The ring frame (10) or ring tray (20) can be brought into or taken out from the unloading section (LU) by an automated logistics device (OHT or AGV).

[0152] The unloading section (LU) includes a first handling section (910) that handles a ring frame (10), which is a first loading element, and a second handling section (20) that handles a ring tray (920), which is a second loading element.

[0153] The unloading section (LU) is equipped with a first moving hand (210).

[0154] Electronic components (ED) to be tested loaded on the ring frame (10) are moved to the transport table (110) in the first area (A1) by the first moving hand (210).

[0155] The electronic components (ED) that have completed testing and are loaded on the transport table (110) of the first area (A1) are moved to the ring tray (20) by the first moving hand (210).

[0156] In order to perform unloading work using the first moving hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0157] The first moving hand (210) has one or more pickers (P) capable of picking up or releasing electronic components (ED).

[0158] The picker (P) can pick up electronic components (ED) by vacuum pressure.

[0159] The first moving hand (210) may be equipped with multiple pickers (P) to increase the work capacity in one operation.

[0160] For example, as in the schematic diagram of Fig. 11, the first moving hand (210) may have four pickers (P) arranged in a 2x2 matrix form. The number of pickers (P) provided in the first moving hand (210) may be increased or decreased.

[0161] The first moving hand (210) may have elevators (E) for independently elevating the pickers (P). By means of the elevators (E), the pickers (P) can be positioned at a height at which they can selectively grip or release the electronic components (ED).

[0162] Electronic components (ED) moved to the transport table (110) by the first moving hand (210) can be individually placed on the transport table (110) while their positions are precisely controlled.

[0163] Electronic components (ED) that are transferred from the transport table (110) by the first moving hand (210) can be loaded onto the ring tray (20) while being classified according to the test grade.

[0164] The first moving hand (210) may further include a camera (C).

[0165] The first moving hand (210) can be controlled to analyze the image captured by the camera (C) to accurately calculate the position of the electronic component (ED) and then pick up the electronic component (ED) with the picker (P). The picker (P) can pick up the electronic component (ED) more precisely, and can thereby place the electronic component (ED) at the exact position on the transport table (110).

[0166] The picker (P) can be controlled to pick up electronic components (ED) of various heights.

[0167] For example, it can be implemented to determine the lifting height of the picker (P) according to the height of the electronic component (ED) preset by the administrator.

[0168] For example, it can be implemented to calculate the height of an electronic component (ED) from an image captured by a camera (C) and determine the lifting height of a picker (P) to pick up or release the electronic component (ED).

[0169] The first moving hand (210) may further include rotators (R).

[0170] The rotator (R) rotates the electronic component (ED) in the Θ-axis direction with the vertical line in the Z-axis direction as the rotation axis, as shown in Fig. 12.

[0171] The rotators (R) can individually rotate each picker (P).

[0172] The first moving hand (210) not only moves the electronic component (ED) in the X, Y, and Z axes directions, but also individually rotates the electronic component (ED) in the Θ-axis direction.

[0173] By having a rotator (R), the first moving hand (210) can correct the misalignment of the electronic component (ED) before being photographed by the camera (C) and place it on the transport table (110).

[0174] The electronic component (ED) placed in a precise position on the transport table (110) by the first moving hand (210) is fixed in position by vacuum pressure.

[0175] In the process of moving the electronic component (ED) by the first moving hand (210), the position of the electronic component (ED) in the X, Y, Z, and Θ-axis directions can be precisely controlled and maintained.

[0176] It is entirely possible to provide a rotation means for rotating the electronic component (ED) separately from the first moving hand (210).

[0177] For example, when the first moving hand (210) grips an electronic component (ED) from a ring frame (10) and supplies it to a rotating means, the rotating means may be implemented to correct the misalignment of the electronic component (ED) by rotating it after fixing it with vacuum pressure. The electronic component (ED) whose misalignment has been corrected by the rotating means may be gripped again by the first moving hand (210) and then moved to the transport table (110).

[0178] The first moving hand (210) according to the example of Fig. 11 is equipped with four pickers (P). In the case where multiple pickers (P) are equipped, the target of gripping can be different for each picker (P).

[0179] Some of the pickers (P) may be implemented to grip electronic components (ED) in a live bug state (with terminals facing downwards), and the remaining pickers (P) may be implemented to grip electronic components (ED) in a dead bug state (with terminals facing upwards). In this case, since all electronic components (ED) loaded on the ring frame (10) and supplied to the first type handler (H1) can be processed regardless of their loading state, the usability of the first type handler (H1) is increased.

[0180] For reference, if an electronic component (ED) is supplied to the first type handler (H1) in a live bug state, a separate reversing means may need to be additionally provided to convert the electronic component (ED) in a live bug state to a dead bug state.

[0181] The unloading section (LU) will be explained in more detail later.

[0182] In the array section (AP), electronic components (ED) to be tested are unloaded from the transport table (110), and the unloaded electronic components (ED) are arranged.

[0183] According to this embodiment, two array portions (AP) are symmetrically arranged on both sides with a connecting portion (CP) between them. By having two array portions (AP), the processing capacity of the first type handler (H1) and the tester is improved.

[0184] The array part (AP) is equipped with a second moving hand (220).

[0185] The second moving hand (220) removes the electronic component (ED) to be tested from the transport table (110) or loads the electronic component (ED) for which testing has been completed onto the transport table (110).

[0186] In order to perform unloading work using the second moving hand (220), the transport table (110) must be moved toward the arrangement portion (AP) and placed in the second area (A2).

[0187] The second moving hand (220) carries an electronic component (ED) to be tested from the transport table (110) in the second area (A2) or loads an electronic component (ED) that has been tested from the transport table (110) in the second area (A2).

[0188] Likewise, the second moving hand (220) has one or more pickers (P) capable of grasping or releasing electronic components (ED). Preferably, the second moving hand (220) may be equipped with multiple pickers (P) to increase the working capacity in a single operation.

[0189] For example, the second moving hand (220) may have four pickers (P) arranged in a 2x2 matrix. The number of pickers (P) provided in the second moving hand (220) may also be increased or decreased.

[0190] The pickers (P) of the second moving hand (220) can also be independently lifted to selectively pick up or release electronic components (ED).

[0191] The second moving hand (220) may be equipped with the same operating structure as the first moving hand (210).

[0192] The number of pickers (P) provided in the first moving hand (210) and the number of pickers (P) provided in the second moving hand (220) may be different. However, in order to lower the production cost of the second moving hand (220), individual lifting or rotating means for the pickers (P) may not be applied to the second moving hand (220).

[0193] All pickers (P) of the second moving hand (220) are equipped to be able to pick up electronic components in a dead bug state.

[0194] A test table (300) is provided to load electronic components (ED) that are transferred from a transport table (110) by a second moving hand (220). Electronic components (ED) to be tested are arranged on the test table (300) by the second moving hand (220).

[0195] The second moving hand (220) moves the electronic components (ED) to be tested from the transport table (110) in the second area (A2) and arranges them on the test table (300) that has been moved to the arrangement section (AP).

[0196] The second moving hand (220) loads the tested electronic components (ED) loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0197] As shown in the schematic excerpt of Fig. 13, the test table (300) is provided with a flat upper surface. Therefore, electronic components (ED) are loaded onto the test table (300) in a form that they are placed on the flat upper surface of the test table (300).

[0198] When viewed from a flat surface, the test table (300) may be in the shape of a circular plate as in (a) of Fig. 13 or in the shape of a square plate as in (b) of Fig. 13.

[0199] The shape on the plane of the test table (300) is dependent on the shape on the plane of the test board (TB) to be described later.

[0200] The test table (300) can be moved in the X-axis and Y-axis directions.

[0201] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the rotation axis.

[0202] The test table (300) can be raised and lowered by a connector (700) to be described later.

[0203] In general, when an electronic component (ED) is moved to a test table (300), shock or inertia occurs along with the movement.

[0204] The position of the electronic components (ED) loaded on the test table (300) may be disturbed due to impact or inertia. To prevent this, vacuum holes (h) are formed in the area where the electronic components (ED) are loaded on the test table (300).

[0205] When vacuum pressure is applied through the vacuum holes (h), the electronic component (ED) can be fixed to the test table (300).

[0206] When electronic components (ED) are placed on the test table (300) by the second moving hand (220), the electronic components (ED) can be placed in the same position by vacuum pressure.

[0207] The vacuum structure of the test table (300) may be the same as the vacuum structure of the transport table (110).

[0208] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0209] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic component (ED) through the vacuum hole (h).

[0210] Electronic components (ED) loaded on the test table (300) can be fixed in position by vacuum pressure.

[0211] The vacuum holes (h) can be implemented to be selectively opened and closed according to controlling the vacuum circuit.

[0212] Electronic components (EDs) can optionally be fixedly loaded onto the test table (300) or removed from the test table (300).

[0213] The electronic components (ED) to be tested loaded on the test table (300) are then precisely rearranged in the array portion (AP).

[0214] At the connection part (CP), an electrical connection is made between the electronic components (ED) loaded on the test table (300) that have been moved to the connection part (CP) and the tester.

[0215] For electrical connection between the electronic components (ED) and the tester, the tester is equipped with a test board (TB).

[0216] The test board (TB) is connected to the first type handler (TH1). More specifically, the test board (TB) is connected to the connection part (CP).

[0217] Electronic components (ED) loaded on the test table (300) are electrically connected to a test board (TB). The electronic components (ED) can ultimately be electrically connected to a tester through the test board (TB).

[0218] Let's take a brief look at the test board (TB).

[0219] As shown in the bottom view of Fig. 14, test zones (TZ) each corresponding to one electronic component (ED) are arranged on the test board (TB). The test zones (TZ) correspond one-to-one with the electronic components (ED) loaded on the test table (300).

[0220] One test zone (TZ) is equipped with test pins (t) for electrical connection to one electronic component (ED).

[0221] Test pins (t) in one test zone (TZ) form a single group to form a test zone (TZ) and are electrically connected to an electronic component (ED).

[0222] The test zone (TZ) and the electronic components (ED) must be aligned.

[0223] If the coordinates of the electronic component (ED) on the test table (300) and the coordinates of the test zone (TZ) on the XY plane do not match, a defect occurs in the electrical connection between the electronic component (ED) and the tester.

[0224] As in the conceptual example of Fig. 15, if the electronic component (ED) on the test table (300) is at an angular position having a twisted rotation angle (Θ1) in the Θ-axis direction with respect to the test zone (TZ), a defect occurs in the electrical connection between the electronic component (ED) and the tester.

[0225] All test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned with each other.

[0226] A rearrangement mechanism (500) is provided to ensure precise alignment between the test zone (TZ) and the electronic components (ED). If the electronic components (ED) can be precisely arranged during the process of the second moving hand (220) arranging the electronic components (ED) on the test table (300), a separate rearrangement mechanism (500) may not be required.

[0227] Electronic components (ED) are moved from the transport table (110) to the test table (300) by the second moving hand (220). During this process, errors in the positions of the electronic components (ED) may occur due to operational errors or operational shocks of the second moving hand (220). Accordingly, the positions or angular positions of the electronic components (ED) loaded onto the test table (300) by the second moving hand (220) on the XY plane may be different. In other words, the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not match each other.

[0228] Of course, if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide, the repositioning mechanism (500) can be omitted. However, the electronic component (ED) that has been packaged requires a precision of within 30㎛, and in the case of the dyna HBM, a precision of within 5㎛ is required. To solve this, in the present invention, when the second moving hand (220) moves the electronic component (ED) from the transport table (110) to the test table (300), the electronic component (ED) is first arranged in temporary zones. Then, by using the repositioning mechanism (500) to reposition the electronic component (ED) from the temporary zones to the fixed position zones, the electronic component (ED) can be precisely arranged on the test table (300).

[0229] The temporary area may not be a set location, but may be an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second moving hand (220).

[0230] The temporary zone is not set or fixed by the controller (900), but may be a location arbitrarily determined by the second moving hand (220) loading the electronic component (ED) onto the test table (300). For example, when the second moving hand (220) places the electronic component (ED) onto the test table (300), the zone where the electronic component (ED) is placed becomes the temporary zone (BZ).

[0231] Exaggerated Figure 16 shows an example of a temporary zone (BZ) on a test table (300).

[0232] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) are aligned. Exaggerated Fig. 17 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0233] The test zones (RZ) may be preset, but may also be set to match the positions and arrangements of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0234] The relocation mechanism (500) is provided to relocate the position of the electronic component (ED) loaded on the test table (300) from the temporary zone (BZ) to the fixed position zone (RZ) by the second moving hand (220).

[0235] According to the present embodiment, the second moving hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into the temporary zone (BZ). Then, the relocation mechanism (500) operates to move the electronic components (ED) in the temporary zone (BZ) to the fixed position zone (RZ).

[0236] The temporary zone (BZ) includes not only the position in the X-axis and Y-axis directions, but also the angular position in the Θ-axis direction according to the twisted rotational state of the electronic component (ED).

[0237] As shown in the schematic diagram of Fig. 18, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), an elevator (530), and a buffer (540).

[0238] The repositioning mechanism (500) may have a fixed position. For example, the repositioning mechanism (500) may be fixedly mounted on a frame forming the skeleton of the first type handler (H1).

[0239] The repositioning picker (510) can grip or release electronic components (ED). The repositioning picker (510) can grip electronic components (ED) by vacuum pressure.

[0240] In this embodiment, the repositioning picker (510) is fixed in position in the horizontal direction, i.e., the X-axis and Y-axis directions.

[0241] The relocation camera (520) is placed apart from the relocation picker (510).

[0242] The repositioning camera (520) is provided to photograph electronic components (ED). In particular, as in the example of FIG. 19, the repositioning camera (520) is provided to photograph the first identification mark (D1) or the second identification mark (D2) located near the square corner of the electronic component (ED). Here, the first identification mark (D1) and the second identification mark (D2) face each other diagonally.

[0243] According to a preferred example of the present invention, the distance between the repositioning camera (520) and the electronic component (ED) is maintained closer than in the prior art. Therefore, as in the example of FIG. 20, when the repositioning camera (520) is assumed to take a picture with the center (O) of the electronic component (ED) as the shooting center, the entirety or at least a portion of the edge of the electronic component (ED) is outside the field of view.

[0244] The repositioning camera (520) is installed so that the entire electronic component (ED) cannot be placed completely within the image (I) captured by the repositioning camera (520).

[0245] The focal length of the relocation camera (520) is set to the distance between the lens of the relocation camera (520) and the electronic component (ED). Therefore, in the image captured by the relocation camera (520), the first identification mark (D1) and the second identification mark (D2) of the electronic component (ED) can be distinguished more clearly compared to the prior art.

[0246] Fig. 21 (a) shows an image (I1) taken by a camera according to the prior art, and Fig. 21 (b) and (c) show images (I2, I3) taken by a relocation camera (520) to which the present invention is applied. Fig. 22 (b) is an image (I2) taken of a first identification mark (D1) of an electronic component (ED), and Fig. 22 (c) is an image (I3) taken of a second identification mark (D2) of an electronic component (ED).

[0247] If the number of pixels of the images (I1, I2, I3) of (a), (b), and (c) of FIG. 22 is the same, the identification marks (D1, D2) and borders of the electronic components (ED) can be distinguished more clearly in the captured images (I2, I3) of (b) and (c) than in the captured image (I1) of (a).

[0248] According to the present invention, processing and analysis of images (I2, I3) can be easily performed, thereby reducing the time required.

[0249] According to the present invention, processing and analysis of images (I2, I3) can be performed more precisely.

[0250] According to the present invention, the current location (coordinates and angular location on the XY plane) of an electronic component (ED) in a temporary zone (BZ) can be more precisely identified.

[0251] Identification marks (D1, D2) are formed during the production stage of electronic components (ED). Therefore, the positions of the identification marks (D1, D2) are precisely determined.

[0252] Since the position and degree of misalignment of the identification marks (D1, D2) can be accurately identified through the captured images (I2, I3), it becomes possible to accurately correct the position of the electronic component (ED).

[0253] The identification mark (D1, D2) that is the target captured by the relocation camera (520) can be replaced with a corner of the electronic component (ED), a special type of identification pad on the electronic component (ED), a special type of identification pattern on the electronic component (ED), etc.

[0254] It is preferable that the relocation picker (510) and the relocation camera (520) be combined into one module.

[0255] The placement positions between the relocation picker (510) and the relocation camera (520) are fixed.

[0256] The elevator (530) elevates the relocation picker (510).

[0257] The relocation picker (510) can be raised and lowered by an elevator (530).

[0258] According to this example, the relocation picker (510) is fixed in position in the horizontal direction, but can be raised and lowered in the vertical direction by the elevator (530).

[0259] When the repositioning picker (510) is lowered, the electronic component (ED) can be picked up from the test table (300) or the electronic component (ED) can be placed on the test table (300).

[0260] In the array section (AP), the vertical position of the test table (300) is fixed, and as the relocation picker (510) is lowered, electronic components (ED) can be exchanged between the test table (300) and the relocation picker (510).

[0261] The elevator (530) may be omitted, and the test table (300) may be implemented to be raised and lowered for exchanging electronic components (ED) between the test table (300) and the relocation picker (510).

[0262] The buffer (540) buffers the pressure applied to the electronic component (ED) that the repositioning picker (510) is holding or intends to hold.

[0263] The buffer (540) may be equipped with a spring or pneumatic cylinder, etc.

[0264] When exchanging electronic components (ED) between the relocation picker (510) and the test table (300), the electronic components (ED) must not be damaged or misplaced due to excessive pressure.

[0265] Even if a somewhat excessive downward force is applied to the repositioning picker (510), a portion of the pressure applied to the electronic component (ED) is absorbed as the buffer (530) is compressed. Accordingly, the electronic component (ED) can be exchanged without changing its position between the repositioning picker (510) and the test table (300), while minimizing damage to the electronic component (ED).

[0266] For reference, the repositioning mechanism (500) may further include a rotator for rotating the repositioning picker (510). In this case, the electronic component (ED) held by the repositioning picker (510) can have its angular position adjusted by the rotator.

[0267] Referring again to FIG. 9, a moving mechanism (600) is provided to move the test table (300) between the array area (AD) and the test area (TD).

[0268] The array area (AD) is a space formed in the array portion (AP), and the test area (TD) is a space formed in the connection portion (CP). Therefore, the array area (AD) and the test area (TD) are separated from each other.

[0269] In this embodiment, the moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0270] In this embodiment, the moving mechanism (600) can move the test table (300) horizontally.

[0271] As shown in the schematic excerpt of FIG. 22, the moving mechanism (600) includes a rotary moving unit (610) and a horizontal moving unit (620).

[0272] The rotary mover (610) can rotate the test table (300) in the forward and reverse directions with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the rotation axis.

[0273] The reason why the rotational movement of the test table (300) is necessary is to correct the angular position of the electronic component (ED) in the temporary zone (BZ) in the Θ-axis direction and relocate it to the fixed position zone (RZ).

[0274] Since the repositioning picker (510) is fixed in the Θ-axis direction, the test table (300) is rotated by the rotational movement (610) instead to correct the angular position of the electronic component (ED) held on the repositioning picker (510).

[0275] The horizontal mover (620) moves the test table (300) horizontally on the XY plane.

[0276] The horizontal mover (620) can be divided into an X-axis mover (621) and a Y-axis mover (622).

[0277] The X-axis mover (621) can move the test table (300) horizontally in the X-axis direction.

[0278] The Y-axis mover (622) can move the test table (300) horizontally in the Y-axis direction.

[0279] According to the present invention, the moving mechanism (600) has two functions.

[0280] The first function of the moving mechanism (600) is to move the test table (300) horizontally to selectively position the test table (300) in the array area (AD) of the array portion (AP) and the test area (TD) of the connection portion (CP).

[0281] The second function of the moving mechanism (600) is to move the test table (300) to rearrange electronic components (ED) using the relocation mechanism (500). Under the second function, the moving mechanism (600) moves the test table (300) in the X-axis, Y-axis, and Θ-axis directions.

[0282] By the second function of the moving mechanism (600), the electronic component (ED) in the temporary zone (BZ) can be moved to the fixed position zone (RZ).

[0283] The connector (700) electrically connects the electronic component (ED) loaded on the test table (300) moved to the connection part (CP) to the tester.

[0284] The connector (700) can press the test table (300) toward the test board (TB) located above the test table (300). Thus, the electronic components (ED) loaded on the test table (300) are electrically connected to the test board (TB), ultimately, the electronic components (ED) are electrically connected to the tester.

[0285] Testing of electronic components (ED) is performed with the electronic components (ED) electrically connected to the tester by a connector (700).

[0286] In this embodiment, the test table (300) is positioned below the test board (TB). Therefore, the connector (700) is provided to move the test table (300) up and down.

[0287] According to this embodiment, the connector (700) electrically connects the electronic component (ED) on the test table (300) to the test board (TB) by raising the test table (300) toward the test board (TB) located above.

[0288] Electronic components (EDs) are electrically connected to a test board (TB) in a corresponding test zone (TZ).

[0289] The lifting height of the test table (300) is preset according to the type of electronic component (ED) to be tested.

[0290] The connector (700) raises the test table (300) by a preset lifting height.

[0291] The connector (700) operates to electrically connect or disconnect an electronic component (ED) on the test table (300) to the tester.

[0292] If the elevator (530) is omitted from the relocation mechanism (500), the connector (700) operates to elevate the test table (300) even during the relocation process of the electronic components (ED).

[0293] Let's take a closer look at the relocation process of electronic components (ED).

[0294] To relocate electronic components (ED), the test table (300) first moves horizontally so that the relocation camera (510) can capture the electronic components (ED) in the temporary zone (BZ).

[0295] The repositioning camera (520) photographs electronic components (ED) on the test table (300), and the test table (300) can be moved horizontally by a predetermined distance to sequentially photograph both identification marks (D1, D2) in two steps.

[0296] When the shooting by the relocation camera (520) is completed, the test table (300) moves horizontally so that the electronic component (ED) in the temporary zone (BZ) can be picked up by the relocation picker (510). Then, the relocation picker (510) is lowered by the elevator (530) to pick up the electronic component (ED) in the temporary zone (BZ).

[0297] When the relocation picker (510) picks up the electronic component (ED), the relocation picker (510) is raised by the elevator (530), and the moving mechanism (600) is operated to horizontally and rotationally move the test table (300) so that the electronic component (ED) picked up by the relocation picker (510) aligns with the fixed position zone (RZ). When the electronic component (ED) picked up by the relocation picker (510) aligns with the fixed position zone (RZ), the relocation picker (510) is lowered again by the elevator (530), so that the relocation picker (510) can place the electronic component (ED) in the fixed position zone (RZ) of the test table (300).

[0298] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure provided through the vacuum hole (h) while the test table (300) supports the electronic component (ED), the repositioning picker (510) releases the grip of the electronic component (ED).

[0299] When the relocation picker (510) releases the grip of the electronic component (ED), the elevator (530) raises the relocation picker (510).

[0300] As in this embodiment, if the test table (300) is implemented to move horizontally instead of the relocation picker (510) in the process of moving the electronic component (ED) from the temporary zone (BZ) to the fixed location zone (RZ), the production cost can be reduced.

[0301] If the elevator (530) is omitted, the test table (300) is raised and lowered by the connector (700) during the relocation process.

[0302] The controller (800) controls all components necessary for proper operation of the first type handler (H1), including the transport shuttle (100), the first moving hand (210), the second moving hand (220), the vacuum device (400), the repositioning mechanism (500), the moving mechanism (600), and the connector (700).

[0303] Meanwhile, as shown in the extract of FIG. 23, the unloading section (LU) further includes a first handling section (910), a second handling section (920), a stacker section (930), an opener (940), and a cassette conveyor (950).

[0304] The first handling unit (910) handles the ring frame (10), which is the first loading element.

[0305] The first handling unit (910) includes a separator (911) and a frame transporter (913).

[0306] The separator (911) contributes to separating the electronic component (ED) adhered to the adhesive film (12) from the adhesive film (12) when the first moving hand (210) moves the electronic component (ED) adhered to the ring frame (10) to the transport table (110).

[0307] As an example, the separator (911) can be implemented to apply heat to an area where an electronic component (ED) to be moved is located to weaken the adhesive force of the adhesive film (12).

[0308] The frame transporter (913) transports the ring frame (10) in the stacker section (930) to the upper side of the separator (911), or transports the ring frame (10) in the upper side of the separator (911) to the stacker section (930).

[0309] The second handling unit (920) handles the ring tray (20), which is the second loading element.

[0310] The second handling unit (920) includes six supports (921), a base plate (922), and a transfer (923).

[0311] The support (921) supports the ring tray (20).

[0312] It is desirable to have multiple supports (921) to increase processing capacity.

[0313] As shown in the conceptual diagram of Fig. 24, the support includes a support plate (921a), a buffer plate (921b), and an elevator (921c).

[0314] The support plate (921a) supports the ring tray (20).

[0315] The first moving hand (210) moves the electronic component (ED) that has completed the test on the transport table (110) to the ring tray (20) supported on the support plate (921a).

[0316] The buffer plate (921b) is placed below the support plate (921a).

[0317] The ring tray (20) is temporarily stored in a supported state on the buffer plate (921b).

[0318] The elevator (921c) elevates the support plate (921a) and the buffer plate (921b).

[0319] When the support plate (921a) and the buffer plate (921b) are raised by the elevator (921c), the support frame (22) of the ring tray (20) supported on the support plate (921a) is fixed by being sandwiched between the base plate (922) and the support plate (921a).

[0320] The base plate (922) is provided for installing the support (921).

[0321] The support (921) is installed on the base plate (922).

[0322] The base plate (922) has exposed holes (EH) formed in areas where the support (921) is located.

[0323] The cover (23) and loading plate (21) of the ring tray (20) supported on the support plate (921a) are exposed upward through the exposure hole (EH).

[0324] Since the support (921) has a buffer plate (921b), the first type handler (H1) can accommodate a larger number of ring trays (20), thereby improving the processing capacity.

[0325] The support (921) may have one or more buffer plates (921b) in the vertical direction.

[0326] As shown in Fig. 25, the base plate (922) is installed so as to be movable toward the rear.

[0327] When the base plate (922) moves toward the rear, repair or replacement of various components, such as the support (921) installed on the base plate (922), becomes easier.

[0328] The transfer (923) transfers the ring tray (20) in the stacker (930) to the supporter (921), or transfers the ring tray (20) in the supporter (921) to the stacker (930).

[0329] The transfer (923) transfers the ring tray (20) in the stacker section (930) to the support plate (921a) or the buffer plate (921b), or transfers the ring tray (20) supported by the support plate (921a) or the buffer plate (921b) to the stacker section (930). Furthermore, the transfer (923) can remove the ring tray (20) supported by the support plate (921a) and then transfer the ring tray (20) supported by the buffer plate (921b) to the support plate (921a).

[0330] In the process of transferring the ring tray (923), the support (921) must be in a state where the support plate (921a) and the buffer plate (921b) are lowered.

[0331] As shown in the conceptual diagram of FIG. 26, the transfer (923) includes a first gripper (922a), a first advance / retreat device (922b), a second gripper (922c), a second advance / retreat device (922d), an elevator (922e), and a horizontal mover (922f).

[0332] The first gripper (922a) can grip or release the ring tray (20).

[0333] The first advance / retreat device (922b) advances / retreats the first wave device (922a).

[0334] The second phase holder (922c) is placed below the first phase holder (922a).

[0335] The second holder (922c) can hold or release the ring tray (20).

[0336] The second advance / retreat device (922d) advances / retreats the second wave device (922c).

[0337] When both the first waveguide (922a) and the second waveguide (922c) are retired, the first waveguide (922a) and the second waveguide (922c) are located on the same plane.

[0338] As in Fig. 27, when only one of the second gripper (922a) and the second gripper (922c) is advanced, the positions of the first gripper (922a) and the second gripper (922c) on the plane change.

[0339] The positions of the first holder (922a) and the second holder (922c) on the plane may vary depending on the situation in which the ring tray (20) is transported.

[0340] The elevator (922e) elevates the first pedestal (922a), the first advance / retreat device (922b), the second pedestal (922c), and the second advance / retreat device (922d).

[0341] By operating the elevator (922e), the transfer (922) can pick up or release the ring tray at various heights.

[0342] The horizontal mover (922f) moves the first gripper (922a), the first advance / retreater (922b), the second gripper (922c), the second advance / retreater (922d), and the elevator (922e) in the X-axis and Y-axis directions.

[0343] The stacker (930) accommodates ring frames (10) and ring trays (20).

[0344] The stacker unit (930) is positioned in front of the first handling unit (910) and the second handling unit (920).

[0345] Ring frames (10) or ring trays (20) can be transported in a state stored in a cassette.

[0346] Since the outer dimensions of the ring frame (10) and the ring tray (20) are the same, the cassette that stores the ring frame (10) and the ring tray (20) has the same dimensions and structure.

[0347] Cassettes brought in from outside the first type handler (H1) store ring frames (10) loaded with electronic components (ED) to be tested, and are accommodated in the stacker section (930).

[0348] Cassettes brought in from outside the first type handler (H1) are stored in empty ring trays (20) and are accommodated in the stacker section (930).

[0349] Ring trays (20) loaded with electronic components (ED) that have completed testing are recovered from the second handling unit (920), stored in the stacker unit (930), and then taken out of the first type handler (H1).

[0350] As shown in Fig. 28, the stacker section (930) has a plurality of stackers (931) arranged in multiple rows in the X-axis direction while being multi-layered in the vertical direction.

[0351] Each stacker (931) has a loading space capable of accommodating a cassette (CS).

[0352] The stacker (931) can be moved in the Y-axis direction to move forward or backward.

[0353] When the stacker (931) is advanced, cassettes (CS) can be brought in or taken out by an external automated logistics device.

[0354] The opener (940) opens the ring tray (20) by removing the cover (23) from the ring tray (20), or closes the ring tray (20) by attaching the cover (23) to the ring tray (20).

[0355] If only one support (921) is provided, the opener (940) can be implemented to continuously hold the removed cover (23).

[0356] When multiple supports (921) are provided, the covers (23) removed by the opener (940) are stacked in a separate space. The separate space may be equipped with a stacking shelf, a cover-only stacker, or a cover-only cassette.

[0357] The cassette transporter (950) transports cassettes (CS) between each stacker (931). The cassettes (CS) are transported between multiple loading spaces by the cassette transporter (950).

[0358] The cassette transporter (950) can transport the empty cassette (CS) to another stacker (931).

[0359] The cassette transporter (950) can transport a cassette (CS) brought in by an automated logistics device to another stacker (CS).

[0360] The cassette transporter (950) can transport a cassette (CS) to be removed by an automated logistics device to another stacker (CS).

[0361] When a cassette transporter (950) is provided, movement control of the transfer (922) or movement control of the automated logistics device becomes simpler.

[0362] The operation of the first type handler (H1) as described above is described.

[0363] With the stacker (931) moving forward, a cassette (CS) containing a ring frame (10) or a cassette (CS) containing an empty ring tray (20) is brought into the stacker (931) by an automated logistics device.

[0364] When the stacker (931) moves backward, the frame transporter (913) transports the ring frame (10) to the upper side of the separator (911).

[0365] The separator (911) and the first moving hand (210) operate to move the electronic components (ED) to be tested, which are adhered to the ring frame (10), to the transport table (110) in the first area (A1).

[0366] When all electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates to move the transport table (110) to the second area (A2). Then, the second moving hand (220) unloads the electronic components (ED) from the transport table (110) and moves them to the test table (300) in the arrangement section (AP). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second moving hand (220) are temporary zones (BZ).

[0367] When all electronic components (ED) to be tested are loaded on the test table (300), the controller (900) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from temporary zones (BZ) to fixed zones (RZ).

[0368] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the connection part (CP). Thereafter, the connector (700) raises the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0369] When the test on the electronic components (ED) is completed, the connector (700) lowers the test table (300), and the moving mechanism (600) moves the test table (300) to the array portion (AP).

[0370] After this, the second moving hand (220) moves the electronic components (ED) that have completed testing to the transport table (110) in the second area (A2), and the transport table (110) filled with the electronic components (ED) that have completed testing is moved to the first area (A1).

[0371] The first moving hand (210) loads the tested electronic components (ED) from the transport table (110) onto an empty ring tray (20) supported by a support (921).

[0372] When the ring tray (20) is filled with tested electronic components (ED), the support (921) lowers the support plate (921a) and the buffer plate (921b).

[0373] The transfer (922) holds the ring tray (20) supported on the lowered support plate (921a), transfers the empty ring tray (20) supported on the buffer plate (921b) to the support plate (921a), and then transfers the ring tray (20) being held to the empty cassette (CS).

[0374] To support smooth logistics, whenever there is a gap, the transfer (923) transfers the empty ring tray (20) in the stacker section (930) to the supporter (921), and the cassette transferor (950) transfers the cassette (CS) between the stackers (931).

[0375] When the cassette (CS) is filled with a ring tray (20) loaded with electronic components (ED) that have completed testing, the stacker (931) that accommodates the cassette (CS) moves forward, and the cassette (CS) is removed from the first type handler (H1) by the automated logistics device.

[0376] Description of the 2nd type handler

[0377] Figure 29 is a conceptual plan view of a second type handler (H2).

[0378] The second type handler (H2) can be divided into a moving part (MP), an unloading part (LU), an array part (AP), and a connecting part (CP).

[0379] The moving part (MP), array part (AP), and connection part (CP) of the second type handler (H2) are identical in configuration and function to those of the first type handler (H1).

[0380] In the second type handler (H2), electronic components (ED) to be tested are loaded onto a ring tray (20) and brought in, and electronic components (ED) for which testing has been completed are loaded onto a ring frame (10) and taken out.

[0381] As shown in the extract of FIG. 30, the unloading section (LU) of the second type handler (H2) includes a first moving hand (210), a first handling section (910), a second handling section (920), a stacker section (930), an opener (940), and a cassette conveyor (950).

[0382] The first moving hand (210) moves the electronic components (ED) to be tested loaded on the ring tray (20) to the transport table (110) in the first area (A1).

[0383] The first moving hand (210) moves the tested electronic components (ED) loaded on the transport table (110) of the first area (A1) to the ring frame (10).

[0384] The first handling unit (910) handles the ring frame (10), which is the first loading element.

[0385] The first handling unit (910) includes an adhesive device (912) and a frame transporter (913).

[0386] The adhesive (912) contributes to the adhesion of the electronic component (ED) to the adhesive film (12) when the first moving hand (210) moves the electronic component (ED) from the transport table (110) to the ring frame (10).

[0387] According to one example, the adhesive (912) can be implemented to receive an adhesive film (12) so that an electronic component (ED) is properly adhered to the adhesive film (12).

[0388] The second handling section (920), stacker section (930), opener (940), and cassette conveyor (950) are the same as those of the first type handler (H1).

[0389] The main operation of the second type handler (H2) as described above is explained.

[0390] With the stacker (931) moving forward, a cassette (CS) containing an empty ring frame (10) or a cassette (CS) containing a ring tray (20) loaded with electronic components to be tested is brought into the stacker (931) by an automated logistics device.

[0391] When the stacker (931) moves backward, the frame transporter (913) transports the empty ring frame (10) to the upper side of the adhesive device (912).

[0392] The transfer (923) transfers the ring tray (20) loaded with electronic components (ED) to be tested to the support (921).

[0393] The first moving hand (210) operates to move the electronic components (ED) to be tested loaded on the ring tray (20) to the transport table (110) in the first area (A1).

[0394] When the electronic components (ED) that have completed testing are loaded onto the transport table (110) and moved to the first area (A1), the first moving hand (210) takes the electronic components (ED) that have completed testing from the transport table (110) and attaches them to the ring frame (10).

[0395] When the ring frame (10) is filled with tested electronic components (ED), the frame transporter (913) transports the ring frame (10) to an empty cassette (CS) in the stacker section (930).

[0396] When the cassette (CS) is filled with the ring frame (10) loaded with the electronic components (ED) that have completed testing, the stacker (931) that accommodates the cassette (CS) moves forward, and the cassette (CS) is removed from the second type handler (H2) by the automated logistics device.

[0397] Description of the Third-Class Handler

[0398] Figure 31 is a conceptual plan view of a third type handler (H3).

[0399] The third type handler (H3) does not have a moving part (MP), an array part (AP), and a connecting part (CP).

[0400] The third type handler (H3) is implemented so that the electronic components (ED) to be tested are loaded onto a ring frame (10) and are transported out of the ring tray (20).

[0401] The third type handler (H3) includes a first moving hand (210), a first handling unit (910), a second handling unit (920), a stacker unit (930), an opener (940), and a cassette conveyor (950).

[0402] The first moving hand (210) moves the electronic components (ED) to be tested loaded on the ring frame (10) to the ring tray (20).

[0403] The first handling section (910), second handling section (920), stacker section (930), opener (940), and cassette conveyor (950) of the third type handler (H3) are the same as those of the first type handler (H1).

[0404] The operation of the third type handler (H3) as described above is explained.

[0405] With the stacker (931) moving forward, a cassette (CS) containing a ring frame (10) or a cassette (CS) containing an empty ring tray (20) is brought into the stacker (931) by an automated logistics device.

[0406] When the stacker (931) moves backward, the frame transporter (913) transports the ring frame (10) to the upper side of the separator (911).

[0407] The separator (911) and the first moving hand (210) operate to move the electronic components (ED) to be tested, which are attached to the ring frame (10), to the ring tray (10).

[0408] When the electronic components (ED) to be tested are filled in the ring tray (20), the support (921) lowers the support plate (921a) and the buffer plate (921b).

[0409] The transfer (922) holds the ring tray (20) supported on the lowered support plate (921a), transfers the empty ring tray (20) supported on the buffer plate (921b) to the support plate (921a), and then transfers the ring tray (20) being held to the empty cassette (CS).

[0410] When the cassette (CS) is filled with a ring tray (20) loaded with electronic components (ED) to be tested, the stacker (931) that accommodates the cassette (CS) moves forward, and the cassette (CS) is removed from the third-class handler (H3) by the automated logistics device.

[0411] Description of the 4th type handler

[0412] Figure 32 is a conceptual plan view of a fourth type handler (H4).

[0413] The fourth type handler (H4) also does not have a moving part (MP), an array part (AP), or a connecting part (CP).

[0414] In the 4th type handler (H4), the electronic components (ED) that have completed testing are loaded onto a ring tray (20) and transported, and the electronic components (ED) that have completed testing are loaded onto a ring frame (10) and transported.

[0415] The fourth type handler (H4) includes a first moving hand (210), a first handling unit (910), a second handling unit (920), a stacker unit (930), an opener (940), and a cassette conveyor (950).

[0416] The first moving hand (210) moves the tested electronic components (ED) loaded on the ring tray (20) to the ring frame (10).

[0417] The first handling section (910), the second handling section (920), the stacker section (930), the opener (940), and the cassette conveyor (950) of the fourth type handler (H4) are the same as those of the second type handler (H2).

[0418] The main operation of the fourth type handler (H4) as above is explained.

[0419] With the stacker (931) moving forward, a cassette (CS) containing an empty ring frame (10) or a cassette (CS) containing a ring tray (20) loaded with tested electronic components is brought into the stacker (931) by an automated logistics device.

[0420] When the stacker (931) moves backward, the frame transporter (913) transports the empty ring frame (10) to the upper side of the adhesive device (912).

[0421] The transfer (923) transfers the ring tray (20) loaded with the tested electronic components (ED) to the support (921).

[0422] The first moving hand (210) operates to move the tested electronic components (ED) loaded on the ring tray (20) to the ring frame (10).

[0423] When the ring frame (10) is filled with tested electronic components (ED), the frame transporter (913) transports the ring frame (10) to an empty cassette (CS) in the stacker section (930).

[0424] When the cassette (CS) is filled with the ring frame (10) loaded with the electronic components (ED) that have completed testing, the stacker (931) that accommodates the cassette (CS) moves forward, and the cassette (CS) is removed from the 4th type handler (H2) by the automated logistics device.

[0425] Description of the 5th type handler

[0426] Figure 33 is a conceptual plan view of the fifth type handler (H5).

[0427] The fifth type handler (H5) also does not have a moving part (MP), an array part (AP), or a connecting part (CP).

[0428] In the fifth type handler (H5), the electronic components (ED) to be tested are loaded onto a ring frame (10) and brought in, and the electronic components (ED) to be tested are loaded onto a ring tray (20) and taken out.

[0429] In addition, in the fifth type handler (H5), the electronic components (ED) that have completed testing are loaded onto a ring tray (20) and transported, and the electronic components (ED) that have completed testing are loaded onto a ring frame (10) and transported.

[0430] The fifth type handler (H4) includes a first moving hand (210), a first handling unit (910), a second handling unit (920), a stacker unit (930), an opener (940), and a cassette conveyor (950).

[0431] The first moving hand (210) moves the electronic components (ED) to be tested loaded on the ring frame (10) to the ring tray (20).

[0432] Additionally, the first moving hand (210) moves the tested electronic components (ED) loaded on the ring tray (20) to the ring frame (10).

[0433] The first handling section (910) of the fifth type handler (H5) includes a separator (911), an adhesive (912), and a frame transporter (913).

[0434] The separator (911) is the same as that of the first type handler (H1), and the adhesive (912) is the same as that of the second type handler (H2).

[0435] The frame transporter (913) transports the ring frame (10) in the stacker section (930) to the upper side of the separator (911) or the adhesive (912), or transports the ring frame (10) in the upper side of the separator (911) or the adhesive (912) to the stacker section (930).

[0436] The second handling section (920), stacker section (930), opener (940), and cassette conveyor (950) of the fifth type handler (H5) are the same as those of the second type handler (H2).

[0437] The fifth type handler (H5) as above has two main operations.

[0438] The first main operation of the fifth type handler (H5) is to move the electronic components (ED) to be tested loaded on the ring frame (10) to an empty ring tray (20).

[0439] The second main operation of the fifth type handler (H5) is to move the tested electronic components (ED) loaded on the ring tray (20) to the empty ring frame (10).

[0440] Description of the 6th type handler

[0441] Figure 34 is a conceptual plan view of the sixth type handler (H6).

[0442] The 6th class handler (H6) can be divided into a moving part (MP), an unloading part (LU), an array part (AP), and a connecting part (CP).

[0443] The moving part (MP), array part (AP), and connecting part (CP) of the 6th type handler (H6) are identical in configuration and function to those of the 1st type handler (H1).

[0444] In the 6th type handler (H2), electronic components (ED) to be tested are loaded onto a ring tray (20) and brought in, and electronic components (ED) for which testing has been completed are loaded onto a ring tray (20) and taken out.

[0445] As shown in the extract of FIG. 35, the unloading section (LU) of the 6th type handler (H6) includes a first moving hand (210), a second handling section (920), a stacker section (930), an opener (940), and a cassette conveyor (950).

[0446] The 6th type handler (H6) does not have a first handling unit (910) for handling the ring frame (10).

[0447] The first moving hand (210) moves the electronic components (ED) to be tested loaded on the ring tray (20) to the transport table (110) in the first area (A1).

[0448] The first moving hand (210) moves the tested electronic components (ED) loaded on the transport table (110) of the first area (A1) to an empty ring tray (20).

[0449] The main operation of the 6th type handler (H6) as above is explained.

[0450] With the stacker (931) moving forward, a cassette (CS) containing an empty ring tray (20) or a cassette (CS) containing a ring tray (20) loaded with electronic components to be tested is brought into the stacker (931) by an automated logistics device.

[0451] When the stacker (931) moves backward, the transfer (923) transfers the ring tray (20) loaded with electronic components (ED) to be tested and the empty ring tray to the supporters (921).

[0452] The first moving hand (210) operates to move the electronic components (ED) to be tested loaded on the ring tray (20) to the transport table (110) in the first area (A1).

[0453] When the electronic components (ED) that have completed testing are loaded onto the transport table (110) and moved to the first area (A1), the first moving hand (210) takes the electronic components (ED) that have completed testing from the transport table (110) and moves them to an empty ring tray (20).

[0454] When the empty ring tray (20) is filled with tested electronic components (ED), the transfer (923) transfers the ring tray (20) to the empty cassette (CS) of the stacker section (90).

[0455] Cassettes (CS) filled with ring trays (20) loaded with electronic components (ED) that have completed testing are removed from six handlers (H6) by an automated logistics device.

[0456] Next, we will look at several application examples combined with various types of handlers (H1 to H6) as above.

[0457] 1. Example of application 1

[0458] In Fig. 36, M sixth-type handlers (H6) are arranged between the first-type handler (H1) and the second-type handler (H2).

[0459] After the ring frame (10) loaded with electronic components (ED) to be processed is supplied to the first type handler (H1), and the ring tray (20) loaded with the processed electronic components (ED) is removed from the first type handler (H1), only the ring tray (20) is imported and exported to the M number of sixth type handlers (H6).

[0460] The ring tray (20) loaded with electronic components (ED) that have undergone various processing by passing through all M type 6 handlers (H6) is brought into the type 2 handler (H2) for final processing.

[0461] The second type handler (H2) loads the electronic components (ED) that have undergone the final processing onto the ring frame (10) and carries them out.

[0462] 2. Second application example

[0463] In Fig. 37, M sixth-type handlers (H6) are arranged between the third-type handler (H3) and the second-type handler (H2).

[0464] When a ring frame (10) loaded with electronic components (ED) to be processed is supplied to a third-class handler (H3), the third-class handler (H3) moves the electronic components (ED) to be processed from the ring frame (10) to a ring tray (20) and then removes the ring tray (20) filled with electronic components (ED) to be processed.

[0465] The ring tray (20) taken out from the third type handler (H3) is sequentially taken in and taken out to M sixth type handlers (H6) and then taken in to the second type handler (H2) for final processing.

[0466] The second type handler (H2) loads the electronic components (ED) that have undergone the final processing onto the ring frame (10) and carries them out.

[0467] 3. Third application example

[0468] In Fig. 38, M sixth-type handlers (H6) are arranged between the first-type handler (H1) and the fourth-type handler (H4).

[0469] When a ring frame (10) loaded with electronic components (ED) to be processed is supplied to a first-class handler (H1), the first-class handler (H1) loads the processed electronic components (ED) onto a ring tray (20) and removes them.

[0470] The ring trays (20) taken out from the first type handler (H1) are sequentially taken in and taken out to M number of sixth type handlers (H6), and the ring trays (20) loaded with electronic components (ED) that have completed all processing are taken in to the fourth type handler (H4).

[0471] The fourth type handler (H4) moves all processed electronic components (ED) from the ring tray (10) to the ring frame (10) and then removes them.

[0472] 4. Example of application of the fourth clause

[0473] In Fig. 39, M sixth-type handlers (H6) are placed between the third-type handler (H3) and the fourth-type handler (H2).

[0474] When a ring frame (10) loaded with electronic components (ED) to be processed is supplied to a third-class handler (H3), the third-class handler (H3) moves the electronic components (ED) to be processed from the ring frame (10) to a ring tray (20) and then removes the ring tray (20) filled with electronic components (ED) to be processed.

[0475] The ring tray (20) taken out from the third type handler (H3) is sequentially taken in and taken out from the M sixth type handlers (H6), thereby completing all processing of electronic components (ED).

[0476] The ring tray (20) taken out from the 6th type handler (H6) in the last turn is brought into the 4th type handler (H4).

[0477] The fourth type handler (H4) moves the electronic components (ED) in the ring tray (20) to the ring frame (10) and then removes the ring frame (10) loaded with the electronic components (ED) that have completed all processing.

[0478] 4. Example of application of Article 5

[0479] In Fig. 40, a fifth type handler (H5) and M sixth type handlers (H6) are arranged.

[0480] When a ring frame (10) loaded with electronic components (ED) to be processed is supplied to a fifth-class handler (H5), the fifth-class handler (H3) moves the electronic components (ED) to be processed from the ring frame (10) to a ring tray (20) and then removes the ring tray (20) filled with electronic components (ED) to be processed.

[0481] The ring tray (20) taken out from the 5th type handler (H3) is sequentially taken in and taken out to M 6th type handlers (H6), thereby completing all processing of electronic components (ED).

[0482] The ring tray (20) taken out from the 6th type handler (H6) in the last turn is brought into the 5th type handler (H5).

[0483] The fifth type handler (H5) moves the electronic components (ED) in the ring tray (20) to the ring frame (10) and then removes the ring frame (10) loaded with the electronic components (ED) that have completed all processing.

[0484] The above-described embodiments merely illustrate preferred examples of the present invention, and it may have various applications. Therefore, the present invention should not be construed as being limited to the above-described content. Instead, the scope of the present invention should be construed within the scope of the separately described claims and their equivalents.

Claims

1. A first handling section that handles a first loading element on which electronic components can be loaded; A second handling unit capable of loading electronic components and handling a second loading element having a different structure from the first loading element; A stacker unit disposed in front of the first handling unit and the second handling unit, for supplying or retrieving the first loading element to the first handling unit and for supplying or retrieving the second loading element to the second handling unit; and A moving hand for moving electronic components in the first loading element to the second loading element; The first loading element handled by the first handling section has a structure in which the loaded electronic components are maintained by adhesion, The second loading element handled by the second handling section has a structure in which the loaded electronic component is placed in the loading groove and its position is maintained. Handler for handling electronic components.

2. In paragraph 2, The above moving hand can move the electronic components in the second loading element to the first loading element. Handler for handling electronic components.

3. In paragraph 1, The above first handling part When moving the electronic components loaded on the first loading element to the second loading element by the moving hand, a separator for separating the electronic components from the first loading element; Handler for handling electronic components.

4. In paragraph 1, The above first handling part When moving the electronic components loaded on the second loading element to the first loading element by the moving hand, an adhesive device for attaching the electronic components to the first loading element; Handler for handling electronic components.

5. In paragraph 1 The loading capacity of the first loading element is N times (N is a natural number greater than or equal to 2) times the loading capacity of the second loading element. Handler for handling electronic components.

6. In paragraph 1 The above second handling part At least one support supporting the second loading element; and A base plate on which the above-mentioned support is installed; Handler for handling electronic components.

7. In paragraph 6 The above base plate is installed so as to be movable. Handler for handling electronic components.

8. In paragraph 6 The above support is installed in multiple numbers. Handler for handling electronic components.

9. In paragraph 6 The above support A support plate supporting the second loading element; A buffer plate that supports the second loading element and is placed below the support plate; and An elevator for elevating the support plate and the buffer plate; Handler for handling electronic components.

10. In paragraph 6 The above second handling part A transfer device that transfers the second loading element in the stacker section to the supporter or transfers the second loading element in the supporter to the stacker section; Handler for handling electronic components.

11. In Article 10 The above transfer is A first gripper capable of gripping or releasing the second loading element; A first advance / retreat device that advances / retreats the first wave generator; A second gripper, which can grip or release the second loading element, and is positioned below the first gripper; A second advance / retreat device that advances / retreats the second phase device; and An elevator that elevates the first and second phasors; Handler for handling electronic components.

12. In paragraph 1 An opener for opening the second loading element; Handler for handling electronic components.

13. In paragraph 1 The above stacker section has a plurality of loading spaces in which cassettes capable of carrying the first loading element or the second loading element can be loaded, Further comprising a cassette transporter capable of moving cassettes between the plurality of loading spaces; Handler for handling electronic components.

14. Handling section that handles loading elements on which electronic components can be loaded; A stacker unit disposed in front of the handling unit and configured to supply the loading element to the handling unit or retrieve it from the handling unit; and A moving hand for moving electronic components between loading elements in the above handling section; The above handling part A support supporting the above loading element; and including a base plate on which the above-mentioned support is installed; The above base plate is installed so as to be movable. Handler for handling electronic components.

15. In Article 14 The above support A support plate supporting the above loading element; A buffer plate that supports the above loading element and is placed below the support plate; and An elevator (921c) that elevates the above support plate and the above buffer plate; Handler for handling electronic components.

16. In Article 14 The above handling part A transfer device that transfers the loading element in the stacker section to the supporter or transfers the loading element in the supporter to the stacker section; Handler for handling electronic components.

17. In Article 16 The above transfer is A first gripper capable of gripping or releasing the above-mentioned loading element; A first advance / retreat device that advances / retreats the first wave generator; A second gripper, which can grip or release the above-mentioned loading element, and is positioned below the first gripper; A second advance / retreat device that advances / retreats the second phase device; and An elevator (923e) that elevates the first and second phasors; Handler for handling electronic components.

18. In Article 14 The above handling part further comprising an opener for opening the above loading element; Handler for handling electronic components.

19. In Article 14 The above stacker section has a plurality of loading spaces in which cassettes capable of carrying the above loading elements can be loaded, Further comprising a cassette transporter capable of moving cassettes between the plurality of loading spaces; Handler for handling electronic components.

20. Handling section that handles loading elements on which electronic components can be loaded; A stacker unit disposed in front of the handling unit and configured to supply the loading element to the handling unit or retrieve it from the handling unit; A moving hand for moving electronic components between loading elements in the above handling section; and A transfer unit that transfers the loading element in the stacker unit to the handling unit or transfers the loading element in the handling unit to the stacker unit; The above transfer is A first gripper capable of gripping or releasing the above-mentioned loading element; A first advance / retreat device that advances / retreats the first wave generator; A second gripper, which can grip or release the above-mentioned loading element, and is positioned below the first gripper; A second advance / retreat device that advances / retreats the second phase device; and An elevator that elevates the first and second phasors; Handler for handling electronic components.

21. In Article 20 The above handling part An opener for opening the above loading element; Handler for handling electronic components.

22. In Article 20 The above stacker section has a plurality of loading spaces in which cassettes capable of carrying the above loading elements can be loaded, Further comprising a cassette transporter capable of moving cassettes between the plurality of loading spaces; Handler for handling electronic components.

23. Handling section that handles loading elements on which electronic components can be loaded; A stacker unit disposed in front of the handling unit and having a plurality of loading spaces in which cassettes capable of carrying the loading elements can be loaded, and for supplying the loading elements to the handling unit or retrieving them from the handling unit; A transfer that transfers the loading element in the stacker section to the handling section or transfers the loading element in the handling section to the stacker section; and Further comprising a cassette transporter capable of moving cassettes between the plurality of loading spaces; Handler for handling electronic components.

24. Handling section that handles loading elements on which electronic components can be loaded; A stacker unit disposed in front of the handling unit and configured to supply the loading element to the handling unit or retrieve it from the handling unit; and A transfer unit that transfers the loading element in the stacker unit to the handling unit or transfers the loading element in the handling unit to the stacker unit; The above handling part An opener for opening the above loading element; Handler for handling electronic components.

25. A loading plate formed with loading grooves of a predetermined depth for loading electronic components; and A support frame that supports the loading plate and on which the loading plate is fixedly installed; The outer edge of the above support frame protrudes further outward than the outer edge of the above loading plate. Tray for loading electronic components.

26. In paragraph 25, The above support frame has a notch formed to recognize the direction. Tray for loading electronic components.

27. In paragraph 25, The above loading plate is detachably installed on the support frame. Tray for loading electronic components.

28. In paragraph 25, The above support frame Ring-shaped outer ring; and It has reinforcing bars to maintain rigidity on the inside of the outer ribs; The above loading plate is formed as one piece and is connected to the above reinforcing bars. Tray for loading electronic components.

29. In paragraph 25, A cover for preventing electronic components from falling out of the above loading slots; Tray for loading electronic components.

30. In paragraph 29, Further comprising a fixing device for detachably fixing the cover to the loading plate; Tray for loading electronic components.

31. In paragraph 29, The electronic components mounted on the above cover and the above loading groove are spaced apart from each other at a certain interval.

32. In paragraph 25, The depth of the above loading groove is formed lower than the height of the electronic component. Tray for loading electronic components.

33. In paragraph 25, The above loading groove has an upper width that is wider than the lower width, so that a picker for holding electronic components can be inserted to a certain extent into the above loading groove. The bottom width of the above picker is wider than the top width of the above electronic component. Tray for loading electronic components.

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