Health assessment of semiconductor fabrication equipment

Abstract

Techniques for assessing health of semiconductor fabrication system equipment by monitoring outputs of a sensing arrangement directed toward the semiconductor fabrication equipment are disclosed. The sensing arrangement includes one or both of an acoustic phased array and a radio frequency (RF) phased array. From the monitored outputs, a health assessment of the semiconductor fabrication equipment is made. The techniques, in some implementations, include sounding an alarm, signaling an operator, initiating a soft-shutdown or abort, and / or recommending further analysis and / or corrective action.

Description

Attorney Docket No. LAM1P041WO-11767-1WOHEALTH ASSESSMENT OF SEMICONDUCTOR FABRICATION EQUIPMENTINCORPORATION BY REFERENCE

[0000] A PCT Request Form is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed PCT Request Form is incorporated by reference herein in their entireties and for all purposes.BACKGROUND

[0001] Anomalous conditions in semiconductor fabrication equipment can lead to tool downtime, unusable processed wafers, and other events that are undesirable. However, it can be difficult to forecast and / or identify an anomalous condition, whether for a wafer undergoing processing or related to one or more components of the fabrication equipment.

[0002] The background description provided herein is for the purposes of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor implicitly admitted as prior art against the present disclosure.SUMMARY

[0003] Techniques for health assessment of semiconductor fabrication equipment are disclosed.

[0004] According to some implementations, a method of assessing health of semiconductor fabrication system equipment includes monitoring outputs of a sensing arrangement directed toward the semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array and, from the monitored outputs, making a health assessment of the semiconductor fabrication equipment.

[0005] In some examples, the method may further include, based on the health assessment, one or more of: sounding an alarm, signaling an operator, initiating a soft shutdown of the fabrication system equipment, aborting an operation of the fabrications system equipment, or recommending further analysis and / or corrective action.

[0006] In some examples, as a result of applying beamforming techniques, the acoustic phased array and / or the RF phased array may be configured for directional signal transmission and / or reception. In some examples, the semiconductor fabrication system equipment may include aAttorney Docket No. LAM1P041WO-11767-1WO plurality of components, the sensing arrangement may include an acoustic phased array configured to detect acoustic emissions from at least one of the plurality of components and the health assessment may include a determination, from the detected acoustic emissions, of whether or not the at least one component is in a serviceable condition. In some examples, the acoustic phased array may be configured to detect acoustic emissions from each of the plurality of components and the health assessment includes an individual assessment, from the detected acoustic emissions, of each of the plurality of components. In some examples, the health assessment may include a determination that one or more components has reached or is approaching an unserviceable condition. In some examples, the plurality of components may include at least one valve and the detected acoustic emissions result from actuation of the at least one valve. In some examples, the method may further include comparing the detected acoustic emissions with a baseline acoustic emission signature. In some examples, the baseline acoustic emission signature may correspond to an acoustic emission from actuation of a serviceable valve. In some examples, the plurality of components may include at least one fluid path or fluid storage device. In some examples, the detected acoustic emissions may result from a leakage of fluid from the fluid path or fluid storage device. In some examples, the detected acoustic emissions may result from fluid flow through the fluid path. In some examples, the method may further include comparing the detected acoustic emissions with a baseline acoustic emission signature. In some examples, the baseline acoustic emission signature may correspond to fluid flow through an unobstructed fluid path. In some examples, the plurality of components may include at least one fixture, and the detected acoustic emissions may result from vibration of the fixture. In some examples, the health assessment may include a determination of whether or not the detected acoustic emissions resulting from vibration of the fixture indicate a need for a remedial action. In some examples, the plurality of components may include at least one pump and the detected acoustic emissions result from operation of the at least one pump. In some examples, the method may further include comparing the detected acoustic emissions with a baseline acoustic emission signature. In some examples, the baseline acoustic emission signature may correspond to an acoustic emission from operation of a serviceable pump. In some examples, the plurality of components may include at least one pedestal and the detected acoustic emissions result from movement of the at least one pedestal. In some examples, the method may further include comparing the detected acoustic emissions with a baseline acoustic emission signature. In some examples, the baseline acoustic emission signature may correspond to an acoustic emission from operation of a serviceable pedestal. In some examples, the plurality of components may include at least one substrate handling mechanism and the detected acoustic emissions may result from operation of the at least one substrate handling mechanism. In some examples, the method may further include comparing the detected acousticAttorney Docket No. LAM1P041WO-11767-1WO emissions with a baseline acoustic emission signature. In some examples, the baseline acoustic emission signature may correspond to an acoustic emission from operation of a serviceable substrate handling mechanism. In some examples, the acoustic phased array may include a plurality of microphones.

[0007] In some examples, the semiconductor fabrication equipment may include a plurality of electrical and / or electromechanical components, the sensing arrangement may include an RF phased array configured to detect electromagnetic emissions from at least one of the components and the health assessment may include a determination, from the detected electromagnetic emissions, of whether or not the at least one component is in serviceable condition. In some examples, the RF phased array may be configured to detect electromagnetic emissions from each of the components and the health assessment may include an individual assessment, from the detected electromagnetic emissions, of each of the components. In some examples, the health assessment may include a determination that one or more of the components has reached or is approaching an unserviceable condition. In some examples, the RF phased array may include a plurality of antenna elements.

[0008] In some examples, the sensing arrangement may include an active sonar and / or radar capability. In some examples, the sensing arrangement may be configured to emit an acoustic or electromagnetic wavefront toward the semiconductor fabrication equipment and to receive a reflected wavefront from the semiconductor fabrication equipment.

[0009] According to some implementations, a system includes a sensing arrangement directed toward at least one component of a semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and a controller configured to monitor one or more outputs of the sensing arrangement and, from the one or more monitored outputs, make a health assessment of the at least one component.

[0010] In some examples, the controller, based on the health assessment, may be configured to sound an alarm, signal an operator, initiate a soft shutdown of the fabrication system equipment, abort an operation of the fabrications system equipment, or recommend further analysis and / or corrective action. In some examples, as a result of applying beamforming techniques, the acoustic phased array and / or the RF phased array may be configured for directional signal transmission and / or reception.

[0011] According to some implementations, a system includes semiconductor fabrication equipment; a sensing arrangement directed toward at least one component of the semiconductorAttorney Docket No. LAM1P041WO-11767-1WO fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and a controller configured to monitor one or more outputs of the sensing arrangement and, from the monitored one or more outputs, make a health assessment of the at least one component.BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1A is a schematic diagram of an example apparatus in accordance with some implementations .

[0013] Figure IB is a schematic diagram of an example multi-station tool in accordance with some embodiments.

[0014] Figure 2 presents a flowchart of an example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0015] Figure 3 presents a flowchart of a further example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0016] Figure 4 presents a flowchart of another example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0017] Figure 5 presents a flowchart of a yet further example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0018] Figure 6 presents a flowchart of an example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0019] Figure 7 presents a flowchart of another example process for assessing health of semiconductor fabrication equipment, according to some implementations.

[0020] Figures 8A and 8B illustrate a use case of a sensing arrangement including an active sonar and / or radar capability.

[0021] Figure 9 illustrates a block diagram of a semiconductor fabrication system, according to some implementations.DETAILED DESCRIPTION

[0022] In the following description, numerous specific details are set forth to provide a thorough understanding of the presented embodiments. The disclosed embodiments may be practiced without some or all these specific details. In other instances, well-known processAttorney Docket No. LAM1P041WO-11767-1WO operations have not been described in detail to not unnecessarily obscure the disclosed embodiments. While the disclosed embodiments will be described in conjunction with the specific embodiments, it will be understood that it is not intended to limit the disclosed embodiments.

[0023] Figure 1A shows a highly simplified schematic of a semiconductor fabrication system with which the presently disclosed techniques may be implemented. The system 100 may be configured for depositing films on or over a semiconductor substrate utilizing any number of processes. For example, the system 100 may be adapted for performing chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD) and / or atomic layer epitaxy (ALE).

[0024] In the illustrated example, the system 100 includes a single process station 102 comprising a process chamber enclosing, in an interior volume, a single substrate holder 108 (that may be referred to hereinbelow as a pedestal) and a substrate 112, disposed on the pedestal 108. The interior volume may be maintained under vacuum by a vacuum pump 118. A gas distributor 106 (that may be referred to hereinbelow as a s showerhead) is fluidically coupled with a gas delivery system 101 and may be configured to permit delivery of film precursors, for example, as well as carrier and / or purge and / or process gases, secondary reactants, and / or cleaning agents, for example.

[0025] In the illustrated example, gas delivery system 101 includes a mixing vessel 104 for blending and / or conditioning process gases for delivery to showerhead 106. One or more mixing vessel inlet valves 120 may control introduction of process gases to mixing vessel 104. Particular reactants may be stored in liquid or solid form prior to vaporization and subsequent delivery to the process chamber of process station 102. The implementation of Figure 1 A includes a vaporization point 103 for vaporizing liquid reactant to be supplied to mixing vessel 104. In some implementations, vaporization point 103 may include a heated liquid injection module. In some other implementations, vaporization point 103 may include a heated vaporizer. In yet other implementations, vaporization point 103 may be eliminated from the process station. In some implementations, a liquid flow controller upstream of vaporization point 103 may be provided for controlling a mass flow of liquid for vaporization and delivery to process station 102. Alternatively, or in addition, some process chemicals (e.g., precursors) may be stored in solid or liquid form in ampoules, the ampoules being configured to facilitate vaporization of the chemicals and permit resulting precursor vapor to be mixed with the carrier gas which may carry the resulting precursor vapor to the process chamber 102.Attorney Docket No. LAM1P041WO-11767-1WO

[0026] The showerhead 106 may operate to distribute process gases and / or reactants (e.g., film precursors) toward the substrate 112, the flow of which may be controlled by one or more valves upstream from the showerhead (e.g., valves 105, 120, 125). In the implementation depicted in Figure 1A, the substrate 112 is depicted as located beneath showerhead 106 and is shown disposed on the pedestal 108. The showerhead 106 may include any suitable shape and may include any suitable number and arrangement of ports for distributing process gases to the substrate 1 12. In some implementations involving two or more stations, the gas delivery system 101 may include valves or other flow control structures upstream from the showerhead, which can independently control the flow of process gases and / or reactants to each station so as to permit gas flow to one station while preventing gas flow to one or more other stations. Moreover, the gas delivery system 101 may be configured to independently control process gases and / or reactants delivered to each station in a multi-station apparatus such that the gas composition provided to different stations is different; e.g., the partial pressure of a gas component may vary between stations at the same time.

[0027] In the implementation of Figure 1A, gas volume 107 is depicted as being located beneath showerhead 106. In some implementations, the pedestal 108 may be raised or lowered to expose the substrate 112 to gas volume 107 and / or to vary the size of the gas volume 107. A separation distance between the pedestal 108 and the showerhead 106 may be referred to as a “gap.” In some implementations, the pedestal 108 may be lowered and / or raised during portions of a deposition process to modulate process pressure, reactant concentration, etc., within the gas volume 107.

[0028] In the illustrated example, the showerhead 106 and the pedestal 108 are electrically coupled to a radio frequency (RF) signal generator 114 and a matching network 116 for coupling power to a plasma generator. For example, the showerhead 106 may function as an electrode for coupling radio frequency power into the process station 102. The RF signal generator 114 and the matching network 116 may be operated at any suitable RF power level and be configured to form plasma having a desired composition of radical species, ions, and electrons. In addition, RF signal generator 114 may provide RF power having more than one frequency component, such as a low- frequency component (e.g., less than about 2 MHz) as well as a high frequency component (e.g., greater than about 2 MHz). In some implementations, plasma ignition and maintenance conditions are controlled with appropriate hardware and / or appropriate machine-readable instructions in a system controller which may provide control instructions via a sequence of input / output control instructions.Attorney Docket No. LAM1P041WO-11767-1WO

[0029] For clarity of illustration, the processing apparatus 100 is depicted in Figure 1A as a standalone station (102) of a process chamber for maintaining a low-pressure environment. However, some fabrication tools employ a plurality of process stations such as shown in Figure IB, which schematically depicts an implementation of a multi-station fabrication tool 150. The fabrication tool 150 employs a process chamber 165 that includes multiple fabrication process stations, each of which may be used to perform processing operations on a substrate held in a wafer holder (such as, e.g., pedestal 108 of Figure 1A). In the implementation of Figure IB, the process chamber 165 is shown as having four process stations 151, 152, 153, and 154. However, in certain other implementations, multi-station processing apparatuses may have more or fewer process stations depending on the implementation and, for instance, the desired level of parallel wafer processing, size / space constraints, cost constraints, etc. Figure IB additionally shows substrate handler robot 175, which may operate under the control of system controller 190, configured to move substrates from a loading port 180, into multi-station process chamber 165, and onto one of process stations 151, 152, 153, and 154.

[0030] The system controller 190 may be configured to control process conditions and hardware states of fabrication tool 150. It may interact with one or more sensors, gas flow subsystems, temperature subsystems, and / or plasma subsystems — collectively represented as block 191 — to control process gas flow, thermal conditions, and plasma conditions as appropriate for controlling a fabrication process. System controller 190 and subsystems 191 may act to implement a recipe or other process conditions in the stations of process chamber 165.

[0031] In multi-station fabrication tools, an RF signal generator may be coupled to an RF signal distribution unit, which is configured to divide the power of the input signal into, for example, four output signals. Output signals from an RF signal distribution unit may possess similar levels of RF voltage and RF current, which may be conveyed to individual stations of a multi-station fabrication tool.

[0032] From the foregoing description, it will be appreciated that semiconductor fabrication systems contemplated by the present disclosure may include numerous electrical, mechanical, and electromechanical equipment elements or components, many of which may be expected to operate at elevated temperatures, undergo numerous operating and temperature cycles, and / or operate in the presence of corrosive chemicals. As a result, these components experience undergo wear that may lead to reduced quality performance or complete failure. In the absence of the presently disclosed techniques, problem identification and troubleshooting may only occur after an actual failure of a valve, pump, electrical component, etc., or a significant drop in product yield.Attorney Docket No. LAM1P041WO-11767-1WO

[0033] The present inventors have appreciated that many of these components may exhibit a measurable acoustic and / or RF signature during normal or maintenance operations. As such components degrade, these signatures may exhibit changes that can either signify deterioration characteristics used for predictive maintenance (e.g., time to failure) or an actual failure. The presently disclosed techniques enable near real-time assessment (i.e., “health assessment”) of these degradation characteristics. As a result, preventative maintenance may be planned prior to an impending failure, or impacts of a failed component may be promptly mitigated. In some instances, system maintenance can be done in a planned fashion, or an operational mode changed to enable longer operations while waiting for maintenance actions.

[0034] As a further example, measured acoustic / vibration signatures may be used to identify when components are not properly assembled (e.g., a vibrational noise may be caused by improper mounting or installation of screws). In some implementations, a health assessment may be based on an RF signature by e.g., sensing arcing, or RF leaks in the system or within the space where RF is present or RF outputs, such as those from a transformer or generator.

[0035] Thus, a sensing arrangement directed toward the semiconductor fabrication equipment is contemplated that detects characteristics of acoustic and / or RF signals associated with the equipment. The sensing arrangement may include one or more of an acoustic phased array (e.g., a 2-D or 3-D microphone phased array), and / or a radio frequency (RF) phased array with which spatial filtering (e.g., beamforming) techniques may be applied. As such, detected characteristics obtained by the sensing arrangement may, advantageously, include location information. In some implementations, the location information may be complemented by visual information obtained by (e.g., cameras) and / or obtained by design drawings, (e.g., computer assisted design (CAD) drawings indicating the location of various components of the semiconductor fabrication equipment. Alternatively, or in addition, the sensing arrangement may include a sonar emitter / detector and / or a radar emitter / detector.

[0036] A controller may be configured to operate the sensing arrangement and analyze outputs of the sensing arrangement so as to obtain the location information. The outputs may include, for example, electrical or RF signals. The controller may be configured to compare the detected characteristics with a baseline set of characteristics so as to enable identification of changes that may result, for example from degradation of a component. Thus, a health assessment of the semiconductor fabrication equipment may be performed.

[0037] Advantageously, the sensing arrangement may be configured as more than a single acoustic sensor (microphone) or RF detector. As indicated above, for example, the sensingAttorney Docket No. LAM1P041WO-11767-1WO arrangement may include one or both of an acoustic phased array and a radio frequency (RF) phased array configured to obtain directional and / or range data of sensed acoustic and / or RF signals. As a result, quality control and routine health check of discrete individual mechanical and electrical parts (especially, for example, those that are subject to degradation) may be performed continuously or at convenient intervals. In some implementations, changes in acoustic and / or RF signatures may be observed, and issues identified automatically. Once an issue, or a higher probability that an issue may occur, is identified due to observed changes the controller may cause the sensing arrangement to monitor those regions more frequently than the rest of the system without human intervention. The controller may be further configured to take decisions to mitigate issues by initiating an abort or soft shutdown procedure of the semiconductor fabrication system.

[0038] Figure 2 presents a flowchart of an example process 200 for assessing health of semiconductor fabrication equipment. Blocks of process 200 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0039] At block 202, process 200 may monitor outputs of a sensing arrangement directed toward the semiconductor fabrication equipment. As described hereinabove, the sensing arrangement may include one or both of an acoustic phased array and a radio frequency (RF) phased array.

[0040] At block 204, process 200 may form a health assessment of the semiconductor fabrication equipment from the monitored outputs.

[0041] Optionally, at block 206, process 200 may, based on the health assessment, execute one or more of: sounding an alarm, signaling an operator, initiating a soft shutdown of the fabrication system equipment, aborting an operation of the fabrications system equipment, or recommending further analysis and / or corrective action.

[0042] A number of use cases for the presently disclosed techniques will now be described. In a first example, acoustic characteristics of one or more components (e.g., process station 102, valves 105, 120, and / or 125, mixing vessel 104, vaporization point 103, and / or vacuum pump 118 of Figure 1A and flow lines disposed therebetween and / or shows substrate handler robot 175 of Figure IB) of the semiconductor fabrication equipment may be monitored with an acoustic phased array. The acoustic phased array may include a number of microphones that may be omnidirectional, in some implementations, or have a directionality or polar pattern (e.g., cardioid, subcardioid, bidirectional, supercardiod, hypercardiod, lobar, etc.). Outputs of the acoustic phasedAttorney Docket No. LAM1P041WO-11767-1WO array may be monitored (by, for example, system controller 190 of Figure IB) in order to form a health assessment of the semiconductor fabrication equipment. The acoustic phased array may be configured to detect acoustic emissions from at least one of the plurality of components, health assessment includes a determination, from the detected acoustic emissions, of whether or not the at least one component is in serviceable condition and the health assessment may include a determination, from the detected acoustic emissions, of whether or not the at least one component is operating normally (i.e., is in a serviceable condition).

[0043] In some implementations, the sensing arrangement includes an acoustic phased array configured to detect acoustic emissions from each of the plurality of components and the health assessment may include an individual assessment, from the detected acoustic emissions, of each of the plurality of components. The health assessment may include a determination that one or more of the plurality of components has reached, or is approaching, an unserviceable condition.

[0044] For example, valves 105, 120, and / or 125, as well as other valves (not illustrated) of the semiconductor fabrication equipment may undergo numerous open / close cycles during operation of the semiconductor fabrication equipment. These or other valves may also be throttleable. Valve actuations (throttling and / or opening / closing a valve) may produce detectable acoustic emissions. As valves deteriorate over time, the characteristics of these acoustic emissions may change. In some implementations, the detected acoustic emissions may be compared with a baseline acoustic emission signature where the baseline acoustic emission signature corresponds to an acoustic emission from actuation of a serviceable valve. Advantageously, as a result of beamforming techniques enabled by the acoustic phased array, acoustic emissions from each of multiple valves may be independently detected and monitored. As a result, a change in acoustic emission characteristics may be associated with a particular one of multiple valves. Thus, the present techniques enable a determination, from the detected acoustic emissions, of whether or not each valve is in serviceable condition and prompt identification, repair, or replacement of any particular failed or failing valve,

[0045] Figure 3 presents a flowchart of an example process 300 for assessing health of a plurality of valves included in a semiconductor fabrication equipment. Blocks of process 300 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0046] At block 302, process 300 may monitor outputs of an acoustic phased array directed toward at least one valve of the plurality of valves. At block 304, process 300 may form a health assessment of the at least one valve from the monitored outputs. Advantageously, making theAttorney Docket No. LAM1P041WO-11767-1WO health assessment of the at least one valve may include comparing the detected acoustic emissions with a baseline acoustic emission signature, where the baseline acoustic emission signature corresponds to an acoustic emission from actuation of a serviceable valve.

[0047] Additionally, the acoustic phased array may be configured to detect acoustic emissions characteristic of fluid leaks from one or more components or flow lines. For example, a gas leak from, for example, a gas connection region or a gas storage container may exhibit an acoustic signature detectable by the acoustic phased array. Advantageously, as a result of beamforming techniques enabled by the acoustic phased array, the acoustic phased array may be caused to focus on a region of a suspected leak while suppressing detection of noise from other sources. Similarly, anomalous fluid flow conditions may be detected by the acoustic phased array. For example, liquid lines (e.g., cooling lines) accumulate minerals over time resulting in reduced flow. This reduces cooling efficiency and may lead to failure of the tubing resulting in fluid leaks. Acoustic emissions associated with liquid flow through these systems changes as a result, and the acoustic phased array may be configured to detect occurrence and location of such changes. In some implementations, the detected acoustic emissions may be compared with a baseline acoustic emission signature where the baseline acoustic emission signature corresponds to fluid flow through an unobstructed fluid path.

[0048] Figure 4 presents a flowchart of an example process 400 for assessing health of a at least one fluid path or fluid storage device included in a semiconductor fabrication equipment. Blocks of process 400 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0049] At block 402, process 400 may monitor outputs of an acoustic phased array directed toward the at least one fluid path or fluid storage device. At block 404, process 400 may form a health assessment of the least one fluid path or fluid storage device from the monitored outputs. Advantageously, making the health assessment of the least one fluid path or fluid storage device may include comparing the detected acoustic emissions with a baseline acoustic emission signature, where the baseline acoustic emission signature corresponds to fluid flow through an unobstructed fluid path.

[0050] A yet further use case of the acoustic phased array includes detection of acoustic emissions resulting from a loose fixture. A loose fixture may result from improper installation or fastener wear (e.g., fatigue) and lead to vibrations that produce characteristic acoustic emissions. The acoustic phased array may be configured to detect the occurrence and location of such emissions. Thus, the present techniques enable a determination, from the detected acousticAttorney Docket No. LAM1P041WO-11767-1WO emissions, of whether or not the detected acoustic emissions resulting from vibration of the fixture indicate a need for a remedial action such as, for example, repair or replacement of the fixture and / or fastener.

[0051] In some implementations, the acoustic phased array may be configured to detect acoustic emissions from a pump (e.g., the vacuum pump 118 of Figure 1A, or a pump configured to transport gaseous or liquid fluids) and the health assessment may include a determination of whether or not the pump operation is satisfactory. It will be appreciated that performance of a pump may change over time as a function of normal wear and / or if maintenance is inadequate, and each factor may lead to reduced efficiency and / or increased risk of sudden complete failure. Acoustic emissions likewise change over time as a function of normal wear and / or if maintenance is inadequate. The contemplated acoustic phased array may be configured to isolate other sounds in the region and focus on any specific pump. As a result of electronic steering of the beam formed by the acoustic phased array, multiple pumps may be surveyed sequentially. In some implementations, the detected acoustic emissions may be compared with a baseline acoustic emission signature where the baseline acoustic emission signature corresponds to operation of a serviceable pump.

[0052] Figure 5 presents a flowchart of an example process 500 for assessing health of a at least one pump included in a semiconductor fabrication equipment. Blocks of process 500 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0053] At block 502, process 500 may monitor outputs of an acoustic phased array directed toward the at least one pump. At block 504, process 500 may form a health assessment of the least one pump from the monitored outputs. Advantageously, making the health assessment of the least one pump may include comparing the detected acoustic emissions with a baseline acoustic emission signature, where the baseline acoustic emission signature corresponds an acoustic emission of a serviceable pump.

[0054] In some implementations, the acoustic phased array may be configured to detect acoustic emissions associated with motion of a workpiece (e.g., a semiconductor substrate or wafer). For example, the acoustic phased array may be configured to detect acoustic emissions resulting from movement of a pedestal (e.g., pedestal 108 of Figure 1 A) or operation of a substrate handling mechanism (e.g., substrate handler robot 175 of Figure IB). It will be appreciated that performance of pedestal and / or a substrate handling mechanism may change over time as a function of normal wear and / or if maintenance is inadequate, and each factor may lead to reducedAttorney Docket No. LAM1P041WO-11767-1WO efficiency and / or increased risk of sudden complete failure. Acoustic emissions likewise change over time as a function of normal wear and / or if maintenance is inadequate. The contemplated acoustic phased array may be configured to isolate other sounds in the region and focus on any specific pedestal or substrate handling mechanism. In some implementations, the detected acoustic emissions may be compared with a baseline acoustic emission signature where the baseline acoustic emission signature corresponds to operation of a serviceable pedestal or substrate handling mechanism.

[0055] Figure 6 presents a flowchart of an example process 600 for assessing health of a at least one pedestal included in a semiconductor fabrication equipment. Blocks of process 600 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0056] At block 602, process 600 may monitor outputs of an acoustic phased array directed toward the at least one pedestal. At block 604, process 600 may form a health assessment of the least one pedestal from the monitored outputs. Advantageously, making the health assessment of the least one pump may include comparing the detected acoustic emissions resulting from movement of the pedestal with a baseline acoustic emission signature, where the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable pedestal.

[0057] Figure 7 presents a flowchart of an example process 700 for assessing health of a at least one substrate handling mechanism included in a semiconductor fabrication equipment. Blocks of process 700 may be implemented by one or more processors of a computing device that may be included in or communicatively coupled with system controller 190, for example.

[0058] At block 702, process 700 may monitor outputs of an acoustic phased array directed toward the at least one substrate handling mechanism. At block 704, process 700 may form a health assessment of the least one substrate handling mechanism from the monitored outputs. Advantageously, making the health assessment of the least one pump may include comparing the detected acoustic emissions resulting from movement of the substrate handling mechanism with a baseline acoustic emission signature, where the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable substrate handling mechanism.

[0059] In conjunction with or as an alternative to the foregoing examples, the sensing arrangement may include an RF phased array antenna configured to monitor RF emissions associated with operation of the semiconductor fabrication equipment, particularly emissions from electrical components such as transformers, the RF signal generator 114 and the matching networkAttorney Docket No. LAM1P041WO-11767-1WO 116, for example. The RF phased array antenna may also detect the presence of any electrical arcing between components of the semiconductor fabrication equipment. Advantageously, as a result of beamforming techniques enabled by the RF phased array antenna, a detected anomalous condition may be located, so as to facilitate diagnosis and repair of any faulty component. The RF phased array antenna may include a number of antenna elements. For example, one or more antenna elements may be cardioid, a cosine element, dipole, gaussian, isotropic or a sine element, for example. In some implementations the RF phased array antenna may be or include a multi input, multi output (MIMO) array, for example. In some implementations, the RF phased array antenna may be disposed in or near an active electromagnetic environment, e.g., in a plasma processing chamber or near an RF plasma generator.

[0060] In conjunction with or as an alternative to the foregoing examples, the sensing arrangement may include an active sonar and / or radar capability. For example, the acoustic phased array, in addition to microphones, may include an array of acoustic emitters (e.g., speakers). As a further example, antenna elements of the RF phased array may be coupled with an RF transmitter as well as a receiver. As a result, the acoustic and RF phased arrays may detect, respectively, reflections of directed beams of acoustic and RF emissions. Figures 8A and 8B illustrate an example use case for such an active phased array. In Figure 8A, a phased array 830 emits a wavefront toward a fluid line assembly 840. The fluid line assembly 840 includes a fluid line 842 and insulating sleeve 844A, which produce a first reflected wavefront, characteristics of which may be detected by the phased array 830. In Figure 8B, the phased array 830 likewise emits a wavefront toward a fluid line assembly 840. The fluid line assembly 840 includes a fluid line 842 and insulating sleeve 844B, which produce a second reflected wavefront. In Figure 8B, the insulating sleeve 844B is illustrated as having a flaw or gap at location 846, as a result of which characteristics of the second reflected wavefront differ from those of the first reflected wavefront. As a result, outputs of the phased array 830 may be used to detect and locate a damaged component, whether or not the damage is detectable using a passive (non-emitting) phased array.

[0061] In any of the above described use cases, the acoustic sensing techniques may be complemented by use of camera-obtained information or computer aided design (CAD) information from which a location of a component of interest may be obtained.

[0062] Figure 9 illustrates a block diagram of a semiconductor fabrication system, according to some implementations. The system 9000 includes semiconductor fabrication equipment 900 including, in the illustrated example, a gas delivery system 901 controller, a process station 102, an RF signal generator 914 and a vacuum pump 918. A controller 990 is communicatively coupledAttorney Docket No. LAM1P041WO-11767-1WO with the semiconductor fabrication equipment 900 and with a sensing arrangement 903. The sensing arrangement may be or include one or both of an acoustic phased array and an (RF) phased array. Advantageously, the controller 990 may be configured to control the semiconductor fabrication equipment 900 and the sensing arrangement 903. The controller 990 may be configured to monitor and analyze outputs of the sensing arrangement and form a health assessment of the semiconductor fabrication equipment based on those outputs. Based on the health assessment, the controller may be configured to sound an alarm, signal an operator, initiate a soft-shutdown or abort, recommend further analysis and / or corrective action.

[0063] Without limitation, the semiconductor fabrication equipment 900 may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a deposition chamber or module, an etch chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0064] As noted above, depending on the process step or steps to be performed by the tool, the controller 990 might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

[0065] The controller 990, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0066] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs),Attorney Docket No. LAM1P041WO-11767-1WO and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0067] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0068] As noted above, depending on the process step or steps to be performed by the semiconductor fabrication system, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.Attorney Docket No. LAM1P041WO-11767-1WOCONCLUSION

[0069] In the description, numerous specific details were set forth in order to provide a thorough understanding of the presented embodiments. The disclosed embodiments may be practiced without some or all of these specific details. In other instances, well-known process operations were not described in detail to not unnecessarily obscure the disclosed embodiments. While the disclosed embodiments were described in conjunction with the specific embodiments, it will be understood that the specific embodiments are not intended to limit the disclosed embodiments.

[0070] Numeric ranges are inclusive of the numbers defining the range. It is intended that every maximum numerical limitation given throughout this specification includes every lower numerical limitation, as if such lower numerical limitations were expressly written herein. Every minimum numerical limitation given throughout this specification will include every higher numerical limitation, as if such higher numerical limitations were expressly written herein. Every numerical range given throughout this specification will include every narrower numerical range that falls within such broader numerical range, as if such narrower numerical ranges were all expressly written herein.

[0071] The headings provided herein are not intended to limit the disclosure.

[0072] As used herein, the singular terms “a,” “an,” and “the” include the plural reference unless the context clearly indicates otherwise. The term “or” as used herein, refers to a nonexclusive or, unless otherwise indicated.

[0073] Various computational elements including processors, memory, instructions, routines, models, or other components may be described or claimed as “configured to” perform a task or tasks. In such contexts, the phrase “configured to” is used to connote structure by indicating that the component includes structure (e.g., stored instructions, circuitry, etc.) that performs the task or tasks during operation. As such, the unit / circuit / component can be said to be configured to perform the task even when the specified component is not necessarily currently operational (e.g., is not on).

[0074] The components used with the “configured to” language may refer to hardware — for example, circuits, memory storing program instructions executable to implement the operation, etc. Additionally, “configured to” can refer to generic structure (e.g., generic circuitry) that is manipulated by software and / or firmware (e.g., an FPGA or a general-purpose processor executing software) to operate in manner that is capable of performing the recited task(s). Additionally,Attorney Docket No. LAM1P041WO-11767-1WO “configured to” can refer to one or more memories or memory elements storing computer executable instructions for performing the recited task(s). Such memory elements may include memory on a computer chip having processing logic. In some contexts, “configured to” may also include adapting a manufacturing process (e.g., a semiconductor fabrication facility) to fabricate devices (e.g., integrated circuits) that are adapted to implement or perform one or more tasks.

[0075] It is to be understood that the above disclosure, while focusing on a particular example implementation or implementations, is not limited to only the discussed example, but may also apply to similar variants and mechanisms as well, and such similar variants and mechanisms are also considered to be within the scope of this disclosure. For example, the above disclosure is directed to at least, but not exclusively, the following numbered implementations.

[0076] Implementation 1 : A method of assessing health of semiconductor fabrication system equipment, the method comprising: monitoring outputs of a sensing arrangement directed toward the semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and, from the monitored outputs, making a health assessment of the semiconductor fabrication equipment.

[0077] Implementation 2: The method of implementation 1 further comprising, based on the health assessment, one or more of: sounding an alarm, signaling an operator, initiating a soft shutdown of the fabrication system equipment, aborting an operation of the fabrications system equipment, or recommending further analysis and / or corrective action.

[0078] Implementation 3: The method of implementations 1 or 2, wherein, as a result of applying beamforming techniques, the acoustic phased array, and / or the RF phased array are configured for directional signal transmission and / or reception.

[0079] Implementation 4: The method of implementations 1-3, wherein the health assessment includes determining whether one or components of the semiconductor fabrication system has reached or is approaching an unserviceable condition.

[0080] Implementation 5: The method of implementations 1-4, wherein: the semiconductor fabrication system equipment comprises a plurality of components; the sensing arrangement comprises an acoustic phased array configured to detect acoustic emissions from at least one of the plurality of components; andAttorney Docket No. LAM1P041WO-11767-1WO the health assessment includes a determination, from the detected acoustic emissions, of whether the at least one component is in a serviceable condition.

[0081] Implementation 6: The method of implementation 5, wherein the acoustic phased array is configured to detect acoustic emissions from each of the plurality of components and the health assessment includes an individual assessment, from the detected acoustic emissions, of each of the plurality of components.

[0082] Implementation 7: The method of implementation 5, wherein the plurality of components includes at least one valve and the detected acoustic emissions result from actuation of the at least one valve.

[0083] Implementation 8: The method implementation 7, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

[0084] Implementation 9: The method of implementation 8, wherein the baseline acoustic emission signature corresponds to an acoustic emission from actuation of a serviceable valve.

[0085] Implementation 10: The method of implementation 5, wherein the plurality of components includes at least one fluid path or fluid storage device.

[0086] Implementation 11: The method of implementation 10, wherein the detected acoustic emissions result from a leakage of fluid from the fluid path or fluid storage device.

[0087] Implementation 12: The method of implementation 10, wherein the detected acoustic emissions result from fluid flow through the fluid path.

[0088] Implementation 13: The method of implementation 12, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

[0089] Implementation 14: The method of implementation 13, wherein the baseline acoustic emission signature corresponds to fluid flow through an unobstructed fluid path.

[0090] Implementation 15: The method of implementation 5, wherein the plurality of components includes at least one fixture, and the detected acoustic emissions result from vibration of the fixture.

[0091] Implementation 16: The method of implementation 15, wherein the health assessment includes a determination of whether or not the detected acoustic emissions resulting from vibration of the fixture indicate a need for a remedial action.Attorney Docket No. LAM1P041WO-11767-1WO

[0092] Implementation 17: The method of implementation 5, wherein the plurality of components includes at least one pump and the detected acoustic emissions result from operation of the at least one pump.

[0093] Implementation 18: The method implementation 17, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

[0094] Implementation 19: The method of implementation 18, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable pump.

[0095] Implementation 20: The method of implementation 5, wherein the plurality of components includes at least one pedestal and the detected acoustic emissions result from movement of the at least one pedestal.

[0096] Implementation 21 : The method implementation 20, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

[0097] Implementation 22: The method of implementation 21, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable pedestal.

[0098] Implementation 23: The method of implementation 5, wherein the plurality of components includes at least one substrate handling mechanism and the detected acoustic emissions result from operation of the at least one substrate handling mechanism.

[0099] Implementation 24: The method implementation 23, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

[0100] Implementation 25: The method of implementation 24, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable substrate handling mechanism.

[0101] Implementation 26: The method of implementation 5, wherein the acoustic phased array includes a plurality of microphones.

[0102] Implementation 27: The method of implementations 1-26, wherein: the semiconductor fabrication equipment comprises a plurality of electrical and / or electromechanical components; the sensing arrangement comprises an RF phased array configured to detect electromagnetic emissions from at least one of the components; andAttorney Docket No. LAM1P041WO-11767-1WO the health assessment includes a determination, from the detected electromagnetic emissions, of whether or not the at least one component is in serviceable condition.

[0103] Implementation 28: The method of implementation 27, wherein the RF phased array is configured to detect electromagnetic emissions from each of the components and the health assessment includes an individual assessment, from the detected electromagnetic emissions, of each of the components.

[0104] Implementation 29: The method of implementation 28, wherein the health assessment includes a determination that one or more of the components has reached or is approaching an unserviceable condition.

[0105] Implementation 30: The method of implementation 27, wherein the RF phased array includes a plurality of antenna elements.

[0106] Implementation 31: The method of implementations 1-30, wherein the sensing arrangement includes an active sonar and / or radar capability.

[0107] Implementation 32: The method of implementation 31, wherein the sensing arrangement is configured to emit an acoustic or electromagnetic wavefront toward the semiconductor fabrication equipment and to receive a reflected wavefront from the semiconductor fabrication equipment.

[0108] Implementation 33: A system comprising: a sensing arrangement directed toward at least one component of a semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and a controller configured to monitor one or more outputs of the sensing arrangement and, from the one or more monitored outputs, make a health assessment of the at least one component.

[0109] Implementation 34: The system of implementation 33, wherein the controller, based on the health assessment, is configured to sound an alarm, signal an operator, initiate a soft shutdown of the fabrication system equipment, abort an operation of the fabrications system equipment, or recommend further analysis and / or corrective action.

[0110] Implementation 35: The system of implementations 33 or 34, wherein, as a result of applying beamforming techniques, the acoustic phased array and / or the RF phased array are configured for directional signal transmission and / or reception.Attorney Docket No. LAM1P041WO-11767-1WO

[0111] Implementation 36: The system of implementations 33-35, wherein the health assessment includes a determination that one or more of the plurality of components has reached or is approaching an unserviceable condition.

[0112] Implementation 37: The system of implementations 33-36, wherein: the semiconductor fabrication system equipment comprises a plurality of components; the sensing arrangement comprises an acoustic phased array configured to detect acoustic emissions from at least one of the plurality of components; and the health assessment includes a determination, from the detected acoustic emissions, of whether or not the at least one component is in a serviceable condition.

[0113] Implementation 38: The system of implementation 37, wherein the acoustic phased array is configured to detect acoustic emissions from each of the plurality of components and the health assessment includes an individual assessment, from the detected acoustic emissions, of each of the plurality of components.

[0114] Implementation 39: The system of implementation 37, wherein the plurality of components includes at least one valve and the detected acoustic emissions result from actuation of the at least one valve.

[0115] Implementation 40: The system implementation 39, wherein the controller is configured to compare the detected acoustic emissions with a baseline acoustic emission signature.

[0116] Implementation 41: The system of implementation 40, wherein the baseline acoustic emission signature corresponds to an acoustic emission from actuation of a serviceable valve.

[0117] Implementation 42: The system of implementation 37, wherein the plurality of components includes at least one fluid path or fluid storage device.

[0118] Implementation 43: The system of implementation 42, wherein the detected acoustic emissions result from a leakage of fluid from the fluid path or fluid storage device.

[0119] Implementation 44: The system of implementation 42, wherein the detected acoustic emissions result from fluid flow through the fluid path.

[0120] Implementation 45: The system of implementation 44, wherein the controller is configured to compare the detected acoustic emissions with a baseline acoustic emission signature.Attorney Docket No. LAM1P041WO-11767-1WO

[0121] Implementation 46: The system of implementation 45, wherein the baseline acoustic emission signature corresponds to fluid flow through an unobstructed fluid path.

[0122] Implementation 47: The system of implementation 37, wherein the plurality of components includes at least one fixture, and the detected acoustic emissions result from vibration of the fixture.

[0123] Implementation 48: The system of implementation 47, wherein the health assessment includes a determination of whether or not the detected acoustic emissions resulting from vibration of the fixture indicate a need for a remedial action.

[0124] Implementation 49: The system of implementation 37, wherein the plurality of components includes at least one pump and the detected acoustic emissions result from operation of the at least one pump.

[0125] Implementation 50: The system implementation 49, wherein the controller is configured to compare the detected acoustic emissions with a baseline acoustic emission signature.

[0126] Implementation 51: The system of implementation 50, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable pump.

[0127] Implementation 52: The system of implementation 37, wherein the plurality of components includes at least one pedestal and the detected acoustic emissions result from movement of the at least one pedestal.

[0128] Implementation 53: The system implementation 52, wherein the controller is configured to compare the detected acoustic emissions with a baseline acoustic emission signature.

[0129] Implementation 54: The system of implementation 53, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable pedestal.

[0130] Implementation 55: The system of implementation 37, wherein the plurality of components includes at least one substrate handling mechanism and the detected acoustic emissions result from operation of the at least one substrate handling mechanism.

[0131] Implementation 56: The system implementation 55, wherein the controller is configured to compare the detected acoustic emissions with a baseline acoustic emission signature.Attorney Docket No. LAM1P041WO-11767-1WO

[0132] Implementation 57: The system of implementation 56, wherein the baseline acoustic emission signature corresponds to an acoustic emission from operation of a serviceable substrate handling mechanism.

[0133] Implementation 58: The system of implementation 37, wherein the acoustic phased array includes a plurality of microphones.

[0134] Implementation 59: The system of implementations 33-58, wherein: the semiconductor fabrication equipment comprises a plurality of electrical and / or electromechanical components; the sensing arrangement comprises an RF phased array configured to detect electromagnetic emissions from at least one of the components; and the health assessment includes a determination, from the detected electromagnetic emissions, of whether or not the at least one component is in serviceable condition.

[0135] Implementation 60: The system of implementation 59, wherein the RF phased array is configured to detect electromagnetic emissions from each of the components and the health assessment includes an individual assessment, from the detected electromagnetic emissions, of each of the components.

[0136] Implementation 61: The system of implementation 60, wherein the health assessment includes a determination that one or more of the components has reached or is approaching an unserviceable condition.

[0137] Implementation 62: The system of implementation 59, wherein the RF phased array includes a plurality of antenna elements.

[0138] Implementation 63: The system of implementations 33-62, wherein the sensing arrangement includes an active sonar and / or radar capability.

[0139] Implementation 64: The system of implementation 63, wherein the sensing arrangement is configured to emit an acoustic or electromagnetic wavefront toward the semiconductor fabrication equipment and to receive a reflected wavefront from the semiconductor fabrication equipment.

[0140] Implementation 65: A system comprising: semiconductor fabrication equipment;Attorney Docket No. LAM1P041WO-11767-1WO a sensing arrangement directed toward at least one component of the semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and a controller configured to monitor one or more outputs of the sensing arrangement and, from the monitored one or more outputs, make a health assessment of the at least one component.

Claims

Attorney Docket No. LAM1P041WO-11767-1WOCLAIMSWhat is claimed is:

1. A method of assessing health of semiconductor fabrication system equipment, the method comprising: monitoring outputs of a sensing arrangement directed toward the semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and, from the monitored outputs, making a health assessment of the semiconductor fabrication equipment.

2. The method of claim 1 further comprising, based on the health assessment, one or more of: sounding an alarm, signaling an operator, initiating a soft shutdown of the fabrication system equipment, aborting an operation of the fabrications system equipment, or recommending further analysis and / or corrective action.

3. The method of claim 1, wherein, as a result of applying beamforming techniques, the acoustic phased array, and / or the RF phased array are configured for directional signal transmission and / or reception.

4. The method of claim 1, wherein the health assessment includes determining whether one or components of the semiconductor fabrication system has reached or is approaching an unserviceable condition.

5. The method of claim 1, wherein: the semiconductor fabrication system equipment comprises a plurality of components; the sensing arrangement comprises an acoustic phased array configured to detect acoustic emissions from at least one of the plurality of components; and the health assessment includes a determination, from the detected acoustic emissions, of whether the at least one component is in a serviceable condition.

6. The method of claim 5, wherein the acoustic phased array is configured to detect acoustic emissions from each of the plurality of components and the health assessment includes anAttorney Docket No. LAM1P041WO-11767-1WO individual assessment, from the detected acoustic emissions, of each of the plurality of components.

7. The method of claim 5, wherein: the plurality of components includes at least one valve, at least one fluid path or fluid storage device, at least one fixture, at least one pump, at least one pedestal, at least one substrate handling mechanism, or a combination thereof, and the detected acoustic emissions result from one or more of actuation of the at least one valve, a leakage of fluid from the fluid path or fluid storage device, fluid flow through the fluid path, vibration of the fixture, operation of the at least one pump, movement of the at least one pedestal, operation of the at least one substrate handling mechanism, or a combination thereof.

8. The method of claim 7, further comprising comparing the detected acoustic emissions with a baseline acoustic emission signature.

9. The method of claim 8, wherein the baseline acoustic emission signature corresponds to one or more of fluid flow through an unobstructed fluid path, operation of a serviceable pump, an acoustic emission from actuation of a serviceable valve, operation of a serviceable pedestal, operation of a serviceable substrate handling mechanism, or a combination thereof.

10. The method of claim 1, wherein: the semiconductor fabrication equipment comprises a plurality of electrical and / or electromechanical components; the sensing arrangement comprises an RF phased array configured to detect electromagnetic emissions from at least one of the components; and the health assessment includes a determination, from the detected electromagnetic emissions, of whether or not the at least one component is in serviceable condition.

11. The method of claim 10, wherein the RF phased array is configured to detect electromagnetic emissions from each of the components and the health assessment includes an individual assessment, from the detected electromagnetic emissions, of each of the components.

12. A system comprising:Attorney Docket No. LAM1P041WO-11767-1WO a sensing arrangement directed toward at least one component of a semiconductor fabrication equipment, the sensing arrangement comprising one or both of an acoustic phased array and a radio frequency (RF) phased array; and a controller configured to monitor one or more outputs of the sensing arrangement and, from the one or more monitored outputs, make a health assessment of the at least one component.

13. The system of claim 12, wherein, as a result of applying beamforming techniques, the acoustic phased array and / or the RF phased array are configured for directional signal transmission and / or reception.

14. The system of claim 12, wherein the health assessment includes a determination that one or more of the plurality of components has reached or is approaching an unserviceable condition.

15. The system of claim 12, wherein: the semiconductor fabrication system equipment comprises a plurality of components; the sensing arrangement comprises an acoustic phased array configured to detect acoustic emissions from at least one of the plurality of components; and the health assessment includes a determination, from the detected acoustic emissions, of whether or not the at least one component is in a serviceable condition.

16. The system of claim 15, wherein the acoustic phased array is configured to detect acoustic emissions from each of the plurality of components and the health assessment includes an individual assessment, from the detected acoustic emissions, of each of the plurality of components.

17. The system of claim 15, wherein: the plurality of components includes at least one valve, at least one fluid path or fluid storage device, at least one fixture, at least one pump, at least one pedestal, at least one substrate handling mechanism, or a combination thereof, and the detected acoustic emissions result from one or more of actuation of the at least one valve, a leakage of fluid from the fluid path or fluid storage device, fluid flow through the fluid path, vibration of the fixture, operation of the at least one pump, movement of the at least one pedestal, operation of the at least one substrate handling mechanism, or a combination thereof.Attorney Docket No. LAM1P041WO-11767-1WO18. The system of claim 15, wherein the acoustic phased array includes a plurality of microphones.

19. The system of claim 12, wherein: the semiconductor fabrication equipment comprises a plurality of electrical and / or electromechanical components; the sensing arrangement comprises an RF phased array configured to detect electromagnetic emissions from at least one of the components; and the health assessment includes a determination, from the detected electromagnetic emissions, of whether or not the at least one component is in serviceable condition.

20. The system of claim 19, wherein the RF phased array includes a plurality of antenna elements.

21. The system of claim 12, wherein the sensing arrangement includes an active sonar and / or radar capability.

22. The system of claim 21, wherein the sensing arrangement is configured to emit an acoustic or electromagnetic wavefront toward the semiconductor fabrication equipment and to receive a reflected wavefront from the semiconductor fabrication equipment.

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