Non-conductive films for electronic devices and encapsulation applications

Abstract

The disclosure relates relate to compositions for forming encapsulant films and the use of said films in coating electronic devices. In certain aspects, the disclosure relates to compositions comprising a binder resin having an average molecular weight from 10,000 to 800,000, and to B-stage films obtained from the disclosed compositions.

Description

2024P00033NON-CONDUCTIVE FILMS FOR ELECTRONIC DEVICES AND ENCAPSULATION APPLICATIONSFIELD

[0001] Aspects of the disclosure relate to compositions for forming encapsulant films and the use of said films in coating electronic devices. In certain aspects, the disclosure relates to compositions comprising a binder resin having an average molecular weight from 10,000 to 800,000, and to films obtained after B-staging of the disclosed compositions. In certain aspects, films obtained after B-staging of the disclosed compositions have particular physical properties and / or combinations of physical properties. Embodiments of the disclosed compositions are suitable for, for example, use in fabricating encapsulant films for electronic device such as, for example, printed circuit boards.BACKGROUND

[0002] Electronic devices such as printed circuit boards often require a coating to ensure long-term protection and improved performance. Encapsulant coatings promote electronic protection by, for example, creating environmental seals that protect against moisture and corrosion, providing high-temperature resistance, increasing mechanical shock and vibration-resistance, generating strong bonds toa variety of substrates, maintaining low shrinkage, and improving thermal conductivity. A conventional approach to coat an electronic device is to use an encapsulant paste. Encapsulant pastes are a one-part heat-cure epoxy material in liquid format, and there are two types of encapsulant paste that are conventionally used to coat an electronic device, such as printed circuit board (PCB). The first is a low-modulus paste material after cure, which can serve as a flexible, low glass translation temperature (low-Tg), reworkable material for encapsulating components on a PCB. The second type of encapsulant paste is a rigid, high-modulus material, which is mainly used for non-reworkable applications that requires high reliability. This type of encapsulant paste is formulated with high filler loading to enable a high modulus and high thixotropic property and thus reduce liquid migration after application onto a substrate. Both conventional types of encapsulant2024P00033 pasts provide stable electronic performance and physical protection to a PCB in temperature, humidity, and electrical testing.

[0003] However, problems have been encountered in using conventional encapsulant pastes to conformally coat electronic devices. The issues of using encapsulant pastes generally fall into three categories: excessive Z-height, lack of flowability control, and device comer exposure. Z-height is the maximum height of an encapsulant paste when coated on a substrate. Encapsulant pastes tend to aggregate when applied on top of a device, thus increasing the Z-height and total package height and limiting the ease of bonding another PCT board on the top of the encapsulated PCT board. Additionally, encapsulant pastes are composed of small molecule monomers for easy dispensability and rapid flowability. However, uncontrolled flowability of the encapsulant paste may result in the encapsulant paste encroaching into a keep out zone on the PCB. Furthermore, lack of flowability control adds to the device footprint, which is not beneficial for enabling the desired trend of shrinking device sizes. Finally, encapsulant pastes are prone to incomplete coverage of a device, particularly the corners. Corner exposure has a high risk of moisture penetration, which impacts longterm device reliability performance. During the dispensing process, encapsulant pastes tend to flow down along the sides of a device, leaving very little material to cover corners. Corner exposure thus may be a result of encapsulant pastes’ low viscosity characteristics. Additionally, the good affinity between epoxy material and the hydrophilic surface of the solder around a PCB device further draws the encapsulant paste down along the sides and exposes the corners of a device (e.g., a resistor). Thus, an encapsulant material that can obviate all three pitfalls of an encapsulant paste is desired.SUMMARY

[0004] In view of at least the considerations discussed above, there is an interest in encapsulant materials and compositions to address the pitfalls of encapsulant pastes. Embodiments of the present disclosure relate to a composition comprising a binder resin having an average molecular weight from 10,000 to 800,000, to a B-stage film2024P00033 prepared from the composition, wherein the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C, and to cured films obtained after cure of said compositions. As used herein, a melt viscosity for the B- stage film is measured by a Discovery Series Hybrid Rheometer-2 (DHR2) with a 5 °C / min ramping rate in N2. In some embodiments, the B-stage film has a softening point temperature below 50 °C, as measured by dynamical mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C. In some embodiments, compositions of the present disclosure may be used to form an encapsulant film on a substrate, wherein after lamination and cure the film has a Z-height from 10 microns to 200 microns. Additionally, embodiments of films prepared from disclosed compositions exhibit one or more of good die corner coverage, controllable flowability, gap filling, and reduced film Z-height.

[0005] In some embodiments, aspects of the present disclosure are directed to:1 . A composition comprising: from 10 to 90 wt. % of a binder resin, wherein the binder resin has an average molecular weight from 10,000 to 800,000, wherein the binder resin comprises a functionalized thermoplastic resin, and wherein the functionalized thermoplastic resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.1 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt.% of an inorganic filler; and from 0.5 to 20 wt.% of a curing agent; wherein after the composition forms a B-stage film, the B-stage film has a thickness from 10 to 250 microns; wherein the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C; and2024P00033 wherein the melt viscosity is measured by a DHR2 rheometer with a 5 °C / min ramping rate in N2.2. The composition of embodiment 1 , wherein the binder resin comprises a modified rubber and wherein the binder resin has an average molecular weight from 10,000 to 50,000.3. The composition of embodiment 1 , wherein the binder resin comprises an acrylic polymer and wherein the binder resin has an average molecular from 200,000 to 800,000.4. The composition of any of the previous embodiments, wherein the epoxy functional group comprises bisphenol A, bisphenol F, phenol-novolac, dicyclopentadiene-type epoxy, naphthalene-type epoxy, or any combination thereof.5. The composition of embodiment 4, wherein the epoxy functional group comprises diepoxide, hydrogenated bisphenol A, difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride, bisphenol F, dicyclopentadiene-type epoxy, or any combination thereof.6. The composition of any of the previous embodiments, wherein the inorganic filler comprises silicon dioxide, calcium silicate, alumina, aluminum nitride (AIN), aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, zinc oxide, magnesium oxide, boron nitride, a carbon nanotube, diamond, clay, aluminosilicate, or any combination thereof.7. The composition of any of the previous embodiments, wherein, after the composition forms a B-stage film, the B-stage film has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C.8. The composition of any of the previous embodiments, wherein, after the composition forms a B-stage film, the B-stage film has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C.9. The composition of any of the previous embodiments, wherein the binder resin has an average molecular weight from 400,000 to 800,000.2024P0003310. The composition of any of the previous embodiments, wherein the binder resin comprises an epoxidized carboxyl-term inated butadiene-acrylonitrile (CTBN) oligomer or polymer.11 . The composition of embodiment 10, wherein the epoxidized CTBN oligomer or polymer is an epoxy-containing derivative of an oligomeric or polymeric precursor having the structure:HOOC[(Bu)x(ACN)y]mCOOH wherein: each Bu is a butylene moiety; each ACN is an acrylonitrile moiety; the Bu units and the ACN units can be arranged randomly or in blocks; each of x and y are greater than zero, provided the total of x+y = 1 ; a ratio of x:y is from about 10:1 to 1 : 10; and m is from about 20 to about 100.12. The composition of any of the previous embodiments, wherein the B-stage film has a softening temperature of less than or equal to 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.13. The composition of embodiment 12, wherein the B-stage film has a softening temperature of less than or equal to 25 °C.14. The composition of any of the previous embodiments, wherein the B-staged film has a DMA modulus, at room temperature, from 350 GPa to 2,000 GPa.15. The composition of any of the previous embodiments, wherein after the composition forms a B-stage film, the B-stage film has a tensile elongation at room temperature of >300% before break, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.16. A composition comprising: from 10 to 90 wt. % of a first binder resin and a second binder resin; wherein the first binder resin has an average molecular weight from 10,000 to 50,000;2024P00033 wherein the first binder resin comprises a first functionalized thermoplastic resin; wherein the second binder resin has an average molecular weight from 200,000 to 800,000; wherein the second binder resin comprises a second functionalized thermoplastic resin; and wherein the first binder resin and / or the second binder resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.5 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent; wherein after the composition forms a B-stage film, the B-stage film has a thickness from 10 to 250 microns; wherein the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C; and wherein the melt viscosity is measured by a DHR2 rheometer with a 5 °C / min ramping rate in N2.17. The composition of embodiment 16, wherein the first binder resin comprises a rubber or elastomer-modified epoxy functional group.18. The composition of embodiment 16, wherein the first binder resin or the second binder resin comprises an acrylic polymer.19. The composition of any one of embodiments 16 to 18, wherein the epoxy functional group comprises bisphenol A, bisphenol F, phenol-novolac, dicyclopentadiene-type epoxy, naphthalene-type epoxy, or any combination thereof.20. The composition of embodiment 19, wherein the epoxy functional group comprises diepoxide, hydrogenated bisphenol A, difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride, bisphenol F, dicyclopentadiene-type epoxy, or any combination thereof.2024P0003321 . The composition of any one of embodiments 16 to 20, wherein the inorganic filler comprises silicon dioxide, calcium silicate, alumina, aluminum nitride (AIN), aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, zinc oxide, magnesium oxide, boron nitride, a carbon nanotube, diamond, clay, aluminosilicate, or any combination thereof.22. The composition of any one of embodiments 16 to 21 , wherein, after the composition forms the B-stage film, the B-stage film comprises two or more layers23. The composition of embodiment 22, wherein, after the composition forms the B- stage film comprising two or more layers, the B-stage film comprises an upper layer and a lower layer, wherein: the lower layer comprises the first binder resin; and the upper layer comprises the second binder resin.24. The composition of embodiment 23, wherein, after the composition forms the B- stage film, the upper layer has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C.25. The composition of embodiment 23 or 24, wherein, after the composition forms the B-stage film, the lower layer has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C.26. The composition of embodiment 23 or 24, wherein, after the composition forms the B-stage film, the lower layer has a melt viscosity from 1 ,000 Pa s to 6,000 Pa s at 70 °C, from 1 ,500 Pa s to 2,000 Pa s at 80 °C, from 100 Pa s to 1 ,000 Pa s at 90 °C, and / or from 10 Pa s to 500 Pa s at 100 °C.27. The composition of any one of embodiments 16 to 26, wherein the first binder resin comprises an epoxidized carboxyl-term inated butadiene-acrylonitrile (CTBN) oligomer or polymer.28. The composition of embodiment 27, wherein the epoxidized CTBN oligomer or polymer is an epoxy-containing derivative of an oligomeric or polymeric precursor having the structure:2024P00033HOOC[(Bu)x(ACN)y]mCOOH wherein: each Bu is a butylene moiety; each ACN is an acrylonitrile moiety; the Bu units and the ACN units can be arranged randomly or in blocks; each of x and y are greater than zero, provided the total of x+y = 1 ; a ratio of x:y is from about 10:1 to 1 : 10; and m is from about 20 to about 100.29. The composition of any one of embodiments 16 to 28, wherein the second binder resin has an average molecular weight from 400,000 to 800,000.30. The composition of any one of embodiments 16 to 29, wherein the second binder resin comprises an acrylic ester-based polymer that has an average molecular weight of 300,000 to 800,000.31 . The composition of any one of embodiments 16 to 30, wherein the B-stage film has a softening temperature of less than or equal to 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.32. The composition of embodiment 31 , wherein the B-stage film has a softening temperature of less than or equal to 25 °C.33. The composition of any one of embodiments 16 to 32, wherein the B-stage film has a DMA modulus, at room temperature, from 350 GPa to 2,000 GPa.34. The composition of any one of embodiments 16 to 33, wherein after the composition forms a B-stage film, the B-stage film has a tensile film elongation at room temperature of >300% before break, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.35. A method of preparing a film on a substrate, the method comprising: applying a composition onto the substrate, the composition comprising: from 10 to 90 wt. % of a binder resin, wherein the binder resin has an average molecular weight from 10,000 to 800,000, wherein the binder resin comprises a2024P00033 functionalized thermoplastic resin, and wherein the functionalized thermoplastic resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.1 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent; casting the composition into a film; and exposing the film to an elevated temperature to form a B-stage film.36. A method of preparing a film on a substrate, the method comprising: casting a first composition into a first film onto a substrate, the first composition comprising: from 10 to 90 wt. % of a first binder resin, wherein the first binder resin has an average molecular weight from 10,000 to 50,000, and wherein the first binder resin comprises a first functionalized thermoplastic resin; casting a second composition into a second film, wherein the second composition comprises: from 10 to 90 wt. % of a second binder resin, wherein the second binder resin has an average molecular weight from 200,000 to 800,000, and wherein the first binder resin and / or the second binder resin comprises an epoxy functional group; laminating the first film and the second film together to form a laminated film; laminating the laminated film onto a substrate, and exposing the laminated film to an elevated temperature to form a B-stage film; wherein the first composition and the second composition each further comprises: from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.5 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent.2024P0003337. The method of embodiment 36, wherein the B-stage film comprises a first film layer and a second film layer.38. The method of embodiment 37, wherein the first film layer comprises the first composition and the second film layer comprises the second composition.39. The method of any one of embodiments 35 to 38, wherein the B-stage film has a thickness from 10 to 250 microns.40. The method of any one of embodiments 35 to 39, wherein the B-stage film on the substrate has a Z-height from 10 pm to 200 pm.41 . The method of embodiment 39 or 40, wherein the thickness and Z-height vary by + / - 10%.42. The method of any one of embodiments 35 to 41 , wherein the B-stage film has a softening point temperature below 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.43. The method of any one of claims 35 to 42, wherein the B-stage film has a tensile elongation above 300% at room temperature, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.44. The composition of any one of embodiments 1 to 15, wherein after the B-stage film is cured to form a cured film, the cured film on the substrate has a Z-height from 10 pm to 200 pm.45. The composition of any one of embodiments 1 to 15 or 44, wherein after the B- stage film is cured to form a cured film, the cured film thickness and Z-height vary by + / - 10%.46. The composition of any one of embodiments 16 to 34, wherein after the B-stage film is cured to form a cured film, the cured film on the substrate has a Z-height from 10 pm to 200 pm.47. The composition of any one of embodiments 16 to 34 or 46, wherein after the B- stage film is cured to form a cured film, the cured film thickness and Z-height vary by + / -2024P00033BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 presents a cross-sectional view of an exemplary encapsulant film structure, consistent with embodiments of the present disclosure.

[0007] FIG. 2 presents a cross-sectional view of an exemplary encapsulant film structure, consistent with embodiments of the present disclosure.

[0008] FIG. 3A and FIG. 3B present cross-sectional views of an exemplary encapsulant film structure, consistent with embodiments of the present disclosure.

[0009] FIG. 4 presents illustrations of exemplary film structures for an electronic device, consistent with embodiments of the present disclosure.DETAILED DESCRIPTION

[0010] The disclosed compositions and processes may be understood more readily by reference to the following detailed description taken in connection with the accompanying figures, which form a part of this disclosure.

[0011] In accordance with the disclosure, there are provided compositions comprising a binder resin having an average molecular weight from 10,000 to 800,000, a thermosetting resin, an adhesion promoter comprising an epoxy functionalized organosilane, an inorganic filler, and a curing agent. In some embodiments, the present disclosure provides compositions comprising a first binder resin having an average molecular weight from 10,000 to 50,000, a second binder resin having an average molecular weight from 200,000 to 800,000, a thermosetting resin, an adhesion promoter comprising an epoxy functionalized organosilane, an inorganic filler, and a curing agent.

[0012] In some embodiments, after the composition forms a B-stage film, the B- stage film has certain features and / or properties that make the B-stage film suitable for use in encapsulating an electronic device (e.g., a PCB or PCB element). For example, in some embodiments, after the composition forms a B-stage film, the B-stage film has a thickness from 10 to 250 microns. In some embodiments, after the composition forms a B-stage film, the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C, as measured by a DHR2 with a 5 °C / min2024P00033 ramping rate in N2. In the instant disclosure, references to a melt viscosity are to be understood as referring to a melt viscosity as measured by a DHR2 with a 5 °C / min ramping rate in N2 unless otherwise specified.

[0013] In some embodiments, after the composition forms a B-stage film, the B- stage film has a thickness from 10 microns to 240 microns, from 10 microns to 230 microns, from 10 microns to 220 microns, from 10 microns to 210 microns, from 10 microns to 200 microns, from 10 microns to 190 microns, from 10 microns to 180 microns, from 10 microns to 170 microns, from 10 microns to 160 microns, from 10 microns to 150 microns, from 10 microns to 140 microns, from 10 microns to 130 microns, from 10 microns to 120 microns, from 10 microns to 110 microns, from 10 microns to 100 microns, from 10 microns to 90 microns, from 10 microns to 80 microns, from 10 microns to 70 microns, from 10 microns to 60 microns, from 10 microns to 50 microns, from 10 microns to 40 microns, from 10 microns to 30 microns, or from 10 microns to 20 microns. In some embodiments, after the composition forms a B-stage film, the B-stage film has a thickness from 20 microns to 240 microns, from 30 microns to 240 microns, from 40 microns to 240 microns, from 50 microns to 240 microns, from 60 microns to 240 microns, from 70 microns to 240 microns, from 80 microns to 240 microns, from 90 microns to 240 microns, from 100 microns to 240 microns, from 110 microns to 240 microns, from 120 microns to 240 microns, from 130 microns to 240 microns, from 140 microns to 240 microns, from 150 microns to 240 microns, or from 160 microns to 240 microns.

[0014] In some embodiments, after the composition forms a cured film, the cured film has a Tg of > 30 °C, > 40 °C, > 50 °C, > 75 °C > 100 °C, > 125°C, > 150°C, > 160°C, > 165°C, > 170°C, each as measured by Dynamic mechanical analysis (DMA). In some embodiments, after the composition forms a cured film, the cured film has a Tg of from 30°C to 40°C, from 40°C to 50°C, from 50°C to 75°C, from 750°C to 100°C, from 100°C to 110°C, from 110°C to 120°C, from 120°C to 130°C, from 130°C to 140°C, from 140°C to 150°C, from 150°C to 160°C, from 160°C to 170°Ceach as measured by DMA. In some embodiments, after the composition forms a cured film, the cured film has a Tg of from 100°C to 200°C, such as 110°C to 190°C, 120°C to 180°C, 130°C to 170°C.2024P00033

[0015] In some embodiments, the binder resin has an average molecular weight from 15,000 to 800,000, from 20,000 to 800,000, from 25,000 to 800,000, from 30,000 to 800,000, from 35,000 to 800,000, from 40,000 to 800,000, from 45,000 to 800,000, from 50,000 to 800,000, from 55,000 to 800,000, from 60,000 to 800,000, from 65,000 to 800,000, from 70,000 to 800,000, from 75,000 to 800,000, from 80,000 to 800,000, from 85,000 to 800,000, from 90,000 to 800,000, from 95,000 to 800,000, from 100,000 to 800,000, from 110,000 to 800,000, from 120,000 to 800,000, from 130,000 to 800,000, from 140,000 to 800,000, from 150,000 to 800,000, from 160,000 to 800,000, from 170,000 to 800,000, from 180,000 to 800,000, from 190,000 to 800,000, from 200,000 to 800,000, from 210,000 to 800,000, from 220,000 to 800,000, from 230,000 to 800,000, from 240,000 to 800,000, from 250,000 to 800,000, from 260,000 to 800,000, from 270,000 to 800,000, from 280,000 to 800,000, from 290,000 to 800,000, from 300,000 to 800,000, from 310,000 to 800,000, from 320,000 to 800,000, from 330,000 to 800,000, from 340,000 to 800,000, from 350,000 to 800,000, from 360,000 to 800,000, from 370,000 to 800,000, from 380,000 to 800,000, from 390,000 to 800,000, from 400,000 to 800,000, from 410,000 to 800,000, from 420,000 to 800,000, from 430,000 to 800,000, from 440,000 to 800,000, from 450,000 to 800,000, from 460,000 to 800,000, from 470,000 to 800,000, from 480,000 to 800,000, from 490,000 to 800,000, from 500,000 to 800,000, from 510,000 to 800,000, from 520,000 to 800,000, from 530,000 to 800,000, from 540,000 to 800,000, from 550,000 to 800,000, from 560,000 to 800,000, from 570,000 to 800,000, from 580,000 to 800,000, from 590,000 to 800,000, from 600,000 to 800,000, from 610,000 to 800,000, from 620,000 to 800,000, from 630,000 to 800,000, from 640,000 to 800,000, from 650,000 to 800,000, from 660,000 to 800,000, from 670,000 to 800,000, from 680,000 to 800,000, from 690,000 to 800,000, from 700,000 to 800,000, from 710,000 to 800,000, from 720,000 to 800,000, from 730,000 to 800,000, from 740,000 to 800,000, or from 750,000 to 800,000.

[0016] In some embodiments, after the composition forms a cured film, the cured film has a coefficient of thermal expansion (CTE) below Tg < 50 ppm / °C, < 60 ppm / °C, < 70 ppm / °C, < 80 ppm / °C, < 90 ppm / °C, < 100 ppm / °C, < 110 ppm / °C, < 120 ppm / °C, <2024P00033130 ppm / °C, < 140 ppm / °C, < 150 ppm / °C, < 160 ppm / °C, < 170 ppm / °C, < 180 ppm / °C,< 190 ppm / °C, < 200 ppm / °C, < 210 ppm / °C, < 220 ppm / °C, < 230 ppm / °C, < 240 ppm / °C, or < 250 ppm / °C.

[0017] In some embodiments, after the composition forms a cured film, the cured film has a coefficient of thermal expansion (CTE) above Tg < 100 ppm / °C, < 110 ppm / °C, < 120 ppm / °C, < 130 ppm / °C, < 140 ppm / °C, < 150 ppm / °C, < 160 ppm / °C, < 170 ppm / °C, < 180 ppm / °C, < 190 ppm / °C, < 200 ppm / °C, < 210 ppm / °C, < 220 ppm / °C,< 230 ppm / °C, < 240 ppm / °C, or < 250 ppm / °C. In some embodiments, after the composition forms a cured film, the cured film has a coefficient of thermal expansion (CTE) above Tg from 100 ppm / °C to 150 ppm / °C. In some embodiments, after the composition forms a cured film, the cured film has a coefficient of thermal expansion (CTE) above Tg from 150 ppm / °C to 200 ppm / °C. In some embodiments, after the composition forms a cured film, the cured film has a coefficient of thermal expansion (CTE) above Tg from 200 ppm / °C to 250 ppm / °C.

[0018] In some embodiments, after the composition forms a B-stage film, the B- stage film has a film melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2. In some embodiments, the B-stage film has a melt viscosity from 2,000 Pa s to 45,000 Pa s at 70 °C, from 3,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 45,000 Pa s at 70 °C, from 5,000 Pa s to 45,000 Pa s at 70 °C, from 6,000 Pa s to 45,000 Pa s at 70 °C, from 7,000 Pa s to 45,000 Pa s at 70 °C, from 8,000 Pa s to 45,000 Pa s at 70 °C, from 9,000 Pa s to 45,000 Pa s at 70 °C, from 10,000 Pa s to 45,000 Pa s at 70 °C, from 15,000 Pa s to 45,000 Pa s at 70 °C, from 20,000 Pa s to 45,000 Pa s at 70 °C, from25,000 Pa s to 45,000 Pa s at 70 °C, from 30,000 Pa s to 45,000 Pa s at 70 °C, from35,000 Pa s to 45,000 Pa s at 70 °C, or from 40,000 Pa s to 45,000 Pa s at 70 °C. In some embodiments, the B-stage film has a melt viscosity from 1 ,000 Pa s to 40,000Pa s at 70 °C, from 1 ,000 Pa s to 35,000 Pa s at 70 °C, from 1 ,000 Pa s to 30,000 Pa s at 70 °C, from 1 ,000 Pa s to 25,000 Pa s at 70 °C, from 1 ,000 Pa s to 20,000 Pa s at 70 °C, from 1 ,000 Pa s to 15,000 Pa s at 70 °C, from 1 ,000 Pa s to 10,000 Pa s at 70 °C, from 1 ,000 Pa s to 9,500 Pa s at 70 °C, from 1 ,000 Pa s to 9,000 Pa s at 70 °C, from2024P000331 ,000 Pa s to 8,500 Pa s at 70 °C, from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 1 ,000 Pa s to 7,500 Pa s at 70 °C, from 1 ,000 Pa s to 7,000 Pa s at 70 °C, from 1 ,000 Pa s to 6,500 Pa s at 70 °C, from 1 ,000 Pa s to 6,000 Pa s at 70 °C, from 1 ,000 Pa s to 5,500 Pa s at 70 °C, from 1 ,000 Pa s to 4,000 Pa s at 70 °C, from 1 ,000 Pa s to 3,500 Pa s at 70 °C, from 1 ,000 Pa s to 3,000 Pa s at 70 °C, from 1 ,000 Pa s to 2,500 Pa s at 70 °C, or from 1 ,000 Pa s to 2,000 Pa s at 70 °C.

[0019] In some embodiments, after the composition forms a B-stage film, the B- stage film has a film melt viscosity from 500 Pa s to 32,000 Pa s at 80 °C as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2. In some embodiments, the B-stage film has a melt viscosity from 600 Pa s to 32,000 Pa s at 80 °C, from 700 Pa s to 32,000 Pa s at 80 °C, from 800 Pa s to 32,000 Pa s at 80 °C, from 900 Pa s to 32,000 Pa s at 80 °C, from 1 ,000 Pa s to 32,000 Pa s at 80 °C, from 1 ,100 Pa s to 32,000 Pa s at 80 °C, from 1 ,200 Pa s to 32,000 Pa s at 80 °C, from 1 ,300 Pa s to 32,000 Pa s at 80 °C, from 1 ,400 Pa s to 32,000 Pa s at 80 °C, from 1 ,500 Pa s to 32,000 Pa s at 80 °C, from 1 ,600 Pa s to 32,000 Pa s at 80 °C, from 1 ,700 Pa s to 32,000 Pa s at 80 °C, from 1 ,800 Pa s to 32,000 Pa s at 80 °C, from 1 ,900 Pa s to 32,000 Pa s at 80 °C, from 2,000 Pa s to 32,000 Pa s at 80 °C, from 2,500 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 32,000 Pa s at 80 °C, from 3,500 Pa s to 32,000 Pa s at 80 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 4,500 Pa s to 32,000 Pa s at 80 °C, from 5,000 Pa s to32,000 Pa s at 80 °C, from 5,500 Pa s to 32,000 Pa s at 80 °C, from 6,000 Pa s to32,000 Pa s at 80 °C, from 6,500 Pa s to 32,000 Pa s at 80 °C, from 7,000 Pa s to32,000 Pa s at 80 °C, from 7,500 Pa s to 32,000 Pa s at 80 °C, from 8,000 Pa s to32,000 Pa s at 80 °C, from 8,500 Pa s to 32,000 Pa s at 80 °C, from 9,000 Pa s to32,000 Pa s at 80 °C, from 9,500 Pa s to 32,000 Pa s at 80 °C, from 10,000 Pa s to 32,000 Pa s at 80 °C, from 15,000 Pa s to 32,000 Pa s at 80 °C, from 20,000 Pa s to 32,000 Pa s at 80 °C, from 25,000 Pa s to 32,000 Pa s at 80 °C, or from 30,000 Pa s to 32,000 Pa s at 80 °C. In some embodiments, the B-stage film has a melt viscosity from 500 Pa s to 30,000 Pa s at 80 °C, from 500 Pa s to 25,000 Pa s at 80 °C, from 500 Pa s to 20,000 Pa s at 80 °C, from 500 Pa s to 15,000 Pa s at 80 °C, from 500 Pa s to 10,000 Pa s at 80 °C, from 500 Pa s to 9,500 Pa s at 80 °C, from 500 Pa s to 9,000 Pa s at 802024P00033°C, from 500 Pa s to 8,500 Pa s at 80 °C, from 500 Pa s to 8,000 Pa s at 80 °C, from 500 Pa s to 7,500 Pa s at 80 °C, from 500 Pa s to 7,000 Pa s at 80 °C, from 500 Pa s to 6,500 Pa s at 80 °C, from 500 Pa s to 6,000 Pa s at 80 °C, from 500 Pa s to 5,500 Pa s at 80 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 500 Pa s to 4,500 Pa s at 80 °C, from 500 Pa s to 4,000 Pa s at 80 °C, from 500 Pa s to 3,500 Pa s at 80 °C, from 500 Pa s to 3,000 Pa s at 80 °C, from 500 Pa s to 2,500 Pa s at 80 °C, from 500 Pa s to 2,000 Pa s at 80 °C, from 500 Pa s to 1 ,900 Pa s at 80 °C, from 500 Pa s to 1 ,800 Pa s at 80 °C, from 500 Pa s to 1 ,700 Pa s at 80 °C, from 500 Pa s to 1 ,600 Pa s at 80 °C, from 500 Pa s to 1 ,500 Pa s at 80 °C, from 500 Pa s to 1 ,400 Pa s at 80 °C, from 500 Pa s to 1 ,300 Pa s at 80 °C, from 500 Pa s to 1 ,200 Pa s at 80 °C, from 500 Pa s to 1 ,100 Pa s at 80 °C, from 500 Pa s to 1 ,000 Pa s at 80 °C, from 500 Pa s to 900 Pa s at 80 °C, from 500 Pa s to 800 Pa s at 80 °C, from 500 Pa s to 700 Pa s at 80 °C, or from 500 Pa s to 600 Pa s at 80 °C.

[0020] In some embodiments, after the composition forms a B-stage film, the B- stage film has a film melt viscosity from 100 Pa s to 25,000 Pa s at 90 °C as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2. In some embodiments, the B-stage film has a melt viscosity from 200 Pa s to 25,000 Pa s at 90 °C, from 300 Pa s to 25,000 Pa s at 90 °C, from 400 Pa s to 25,000 Pa s at 90 °C, from 500 Pa s to 25,000 Pa s at 90 °C, from 600 Pa s to 25,000 Pa s at 90 °C, from 700 Pa s to 25,000 Pa s at 90 °C, from 800 Pa s to 25,000 Pa s at 90 °C, from 900 Pa s to 25,000 Pa s at 90 °C, from 1 ,000 Pa s to 25,000 Pa s at 90 °C, from 1 ,100 Pa s to 25,000 Pa s at 90 °C, from 1 ,200 Pa s to 25,000 Pa s at 90 °C, from 1 ,300 Pa s to 25,000 Pa s at 90 °C, from 1 ,400 Pa s to 25,000 Pa s at 90 °C, from 1 ,500 Pa s to 25,000 Pa s at 90 °C, from 1 ,600 Pa s to 25,000 Pa s at 90 °C, from 1 ,700 Pa s to 25,000 Pa s at 90 °C, from 1 ,800 Pa s to 25,000 Pa s at 90 °C, from 1 ,900 Pa s to 25,000 Pa s at 90 °C, from 2,000 Pa s to25,000 Pa s at 90 °C, from 2,500 Pa s to 25,000 Pa s at 90 °C, from 3,000 Pa s to25,000 Pa s at 90 °C, from 3,500 Pa s to 25,000 Pa s at 90 °C, from 4,000 Pa s to25,000 Pa s at 90 °C, from 4,500 Pa s to 25,000 Pa s at 90 °C, from 5,000 Pa s to25,000 Pa s at 90 °C, from 5,500 Pa s to 25,000 Pa s at 90 °C, from 6,000 Pa s to25,000 Pa s at 90 °C, from 6,500 Pa s to 25,000 Pa s at 90 °C, from 7,000 Pa s to2024P0003325,000 Pa s at 90 °C, from 7,500 Pa s to 25,000 Pa s at 90 °C, from 8,000 Pa s to25,000 Pa s at 90 °C, from 8,500 Pa s to 25,000 Pa s at 90 °C, from 9,000 Pa s to25,000 Pa s at 90 °C, from 9,500 Pa s to 25,000 Pa s at 90 °C, from 10,000 Pa s to25,000 Pa s at 90 °C, from 15,000 Pa s to 25,000 Pa s at 90 °C, or from 20,000 Pa s to25,000 Pa s at 90 °C. In some embodiments, the B-stage film has a melt viscosity from 100 Pa s to 20,000 Pa s at 90 °C, from 100 Pa s to 15,000 Pa s at 90 °C, from 100 Pa s to 10,000 Pa s at 90 °C, from 100 Pa s to 9,500 Pa s at 90 °C, from 100 Pa s to 9,000 Pa s at 90 °C, from 100 Pa s to 8,500 Pa s at 90 °C, from 100 Pa s to 8,000 Pa s at 90 °C, from 100 Pa s to 7,500 Pa s at 90 °C, from 100 Pa s to 7,000 Pa s at 90 °C, from 100 Pa s to 6,500 Pa s at 90 °C, from 100 Pa s to 6,000 Pa s at 90 °C, from 100 Pa s to 5,500 Pa s at 90 °C, from 100 Pa s to 5,000 Pa s at 90 °C, from 100 Pa s to 4,500 Pa s at 90 °C, from 100 Pa s to 4,000 Pa s at 90 °C, from 100 Pa s to 3,500 Pa s at 90 °C, from 100 Pa s to 3,000 Pa s at 90 °C, from 100 Pa s to 2,500 Pa s at 90 °C, from 100 Pa s to 2,000 Pa s at 90 °C, from 100 Pa s to 1 ,900 Pa s at 90 °C, from 100 Pa s to1 ,800 Pa s at 90 °C, from 100 Pa s to 1 ,700 Pa s at 90 °C, from 100 Pa s to 1 ,600 Pa s at 90 °C, from 100 Pa s to 1 ,500 Pa s at 90 °C, from 100 Pa s to 1 ,400 Pa s at 90 °C, from 100 Pa s to 1 ,300 Pa s at 90 °C, from 100 Pa s to 1 ,200 Pa s at 90 °C, from 100 Pa s to 1 ,100 Pa s at 90 °C, from 100 Pa s to 1 ,000 Pa s at 90 °C, from 100 Pa s to 900Pa s at 90 °C, from 100 Pa s to 800 Pa s at 90 °C, from 100 Pa s to 700 Pa s at 90 °C, from 100 Pa s to 600 Pa s at 90 °C, from 100 Pa s to 500 Pa s at 90 °C, from 100 Pa s to 400 Pa s at 90 °C, from 100 Pa s to 300 Pa s at 90 °C, or from 100 Pa s to 200 Pa s at 90 °C.

[0021] In some embodiments, after the composition forms a B-stage film, the B- stage film has a melt viscosity from 10 Pa s to 20,000 Pa s at 100 °C as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2. In some embodiments, the B-stage film has a melt viscosity from 20 Pa s to 20,000 Pa s at 100 °C, from 30 Pa s to 20,000 Pa s at 100 °C, from 40 Pa s to 20,000 Pa s at 100 °C, from 50 Pa s to 20,000 Pa s at 100 °C, from 60 Pa s to 20,000 Pa s at 100 °C, from 70 Pa s to 20,000 Pa s at 100 °C, from 80 Pa s to 20,000 Pa s at 100 °C, from 90 Pa s to 20,000 Pa s at 100 °C, from 100 Pa s to 20,000 Pa s at 100 °C, from 110 Pa s to 20,000 Pa s at 100 °C, from2024P00033120 Pa s to 20,000 Pa s at 100 °C, from 130 Pa s to 20,000 Pa s at 100 °C, from 140Pa s to 20,000 Pa s at 100 °C, from 150 Pa s to 20,000 Pa s at 100 °C, from 160 Pa s to 20,000 Pa s at 100 °C, from 170 Pa s to 20,000 Pa s at 100 °C, from 180 Pa s to 20,000 Pa s at 100 °C, from 190 Pa s to 20,000 Pa s at 100 °C, from 200 Pa s to 20,000 Pa s at 100 °C, from 300 Pa s to 20,000 Pa s at 100 °C, from 400 Pa s to 20,000 Pa s at 100 °C, from 500 Pa s to 20,000 Pa s at 100 °C, from 600 Pa s to 20,000 Pa s at 100 °C, from 700 Pa s to 20,000 Pa s at 100 °C, from 800 Pa s to 20,000 Pa s at 100 °C, from 900 Pa s to 20,000 Pa s at 100 °C, from 1 ,000 Pa s to 20,000 Pa s at 100 °C, from 1 ,100 Pa s to 20,000 Pa s at 100 °C, from 1 ,200 Pa s to 20,000 Pa s at 100 °C, from1 ,300 Pa s to 20,000 Pa s at 100 °C, from 1 ,400 Pa s to 20,000 Pa s at 100 °C, from1 ,500 Pa s to 20,000 Pa s at 100 °C, from 1 ,600 Pa s to 20,000 Pa s at 100 °C, from1 ,700 Pa s to 20,000 Pa s at 100 °C, from 1 ,800 Pa s to 20,000 Pa s at 100 °C, fromI ,900 Pa s to 20,000 Pa s at 100 °C, from 2,000 Pa s to 20,000 Pa s at 100 °C, from3,000 Pa s to 20,000 Pa s at 100 °C, from 4,000 Pa s to 20,000 Pa s at 100 °C, from5,000 Pa s to 20,000 Pa s at 100 °C, from 6,000 Pa s to 20,000 Pa s at 100 °C, from7,000 Pa s to 20,000 Pa s at 100 °C, from 8,000 Pa s to 20,000 Pa s at 100 °C, from9,000 Pa s to 20,000 Pa s at 100 °C, from 10,000 Pa s to 20,000 Pa s at 100 °C, fromI I ,000 Pa s to 20,000 Pa s at 100 °C, from 12,000 Pa s to 20,000 Pa s at 100 °C, from13,000 Pa s to 20,000 Pa s at 100 °C, from 14,000 Pa s to 20,000 Pa s at 100 °C, from15,000 Pa s to 20,000 Pa s at 100 °C, from 16,000 Pa s to 20,000 Pa s at 100 °C, from17,000 Pa s to 20,000 Pa s at 100 °C, from 18,000 Pa s to 20,000 Pa s at 100 °C, or from 19,000 Pa s to 20,000 Pa s at 100 °C. In some embodiments, the B-stage film has a melt viscosity from 10 Pa s to 19,000 Pa s at 100 °C, from 10 Pa s to 18,000 Pa s at 100 °C, from 10 Pa s to 17,000 Pa s at 100 °C, from 10 Pa s to 16,000 Pa s at 100 °C, from 10 Pa s to 15,000 Pa s at 100 °C, from 10 Pa s to 14,000 Pa s at 100 °C, from 10 Pa s to 13,000 Pa s at 100 °C, from 10 Pa s to 12,000 Pa s at 100 °C, from 10 Pa s to11 ,000 Pa s at 100 °C, from 10 Pa s to 10,000 Pa s at 100 °C, from 10 Pa s to 9,000 Pa s at 100 °C, from 10 Pa s to 8,000 Pa s at 100 °C, from 10 Pa s to 7,000 Pa s at 100 °C, from 10 Pa s to 6,000 Pa s at 100 °C, from 10 Pa s to 5,000 Pa s at 100 °C, from 10 Pa s to 4,000 Pa s at 100 °C, from 10 Pa s to 3,000 Pa s at 100 °C, from 10 Pa s to2024P000332,000 Pa s at 100 °C, from 10 Pa s to 1 ,900 Pa s at 100 °C, from 10 Pa s to 1 ,800 Pa s at 100 °C, from 10 Pa s to 1 ,700 Pa s at 100 °C, from 10 Pa s to 1 ,600 Pa s at 100 °C, from 10 Pa s to 1 ,500 Pa s at 100 °C, from 10 Pa s to 1 ,400 Pa s at 100 °C, from 10 Pa s to 1 ,300 Pa s at 100 °C, from 10 Pa s to 1 ,200 Pa s at 100 °C, from 10 Pa s to 1 ,100 Pa s at 100 °C, from 10 Pa s to 1 ,000 Pa s at 100 °C, from 10 Pa s to 900 Pa s at 100 °C, from 10 Pa s to 800 Pa s at 100 °C, from 10 Pa s to 700 Pa s at 100 °C, from 10 Pa s to 600 Pa s at 100 °C, from 10 Pa s to 500 Pa s at 100 °C, from 10 Pa s to 400Pa s at 100 °C, from 10 Pa s to 300 Pa s at 100 °C, from 10 Pa s to 200 Pa s at 100 °C, from 10 Pa s to 190 Pa s at 100 °C, from 10 Pa s to 180 Pa s at 100 °C, from 10 Pa s to 170 Pa s at 100 °C, from 10 Pa s to 160 Pa s at 100 °C, from 10 Pa s to 150 Pa s at 100 °C, from 10 Pa s to 140 Pa s at 100 °C, from 10 Pa s to 130 Pa s at 100 °C, from 10Pa s to 120 Pa s at 100 °C, from 10 Pa s to 110 Pa s at 100 °C, from 10 Pa s to 100Pa s at 100 °C, from 10 Pa s to 90 Pa s at 100 °C, from 10 Pa s to 80 Pa s at 100 °C, from 10 Pa s to 70 Pa s at 100 °C, from 10 Pa s to 60 Pa s at 100 °C, from 10 Pa s to 50 Pa s at 100 °C, from 10 Pa s to 40 Pa s at 100 °C, from 10 Pa s to 30 Pa s at 100 °C, or from 10 Pa s to 20 Pa s at 100 °C.

[0022] In some embodiments, after the composition forms a B-stage film, the B- stage film has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C, as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2.

[0023] In some embodiments, the B-stage film has melt viscosity from 15,000 Pa s to 45,000 Pa s at 70 °C, from 20,000 Pa s to 45,000 Pa s at 70 °C, from 25,000Pa s to 45,000 Pa s at 70 °C, from 30,000 Pa s to 45,000 Pa s at 70 °C, from 31 ,000Pa s to 45,000 Pa s at 70 °C, from 32,000 Pa s to 45,000 Pa s at 70 °C, from 33,000Pa s to 45,000 Pa s at 70 °C, from 34,000 Pa s to 45,000 Pa s at 70 °C, from 35,000Pa s to 45,000 Pa s at 70 °C, from 36,000 Pa s to 45,000 Pa s at 70 °C, from 37,000Pa s to 45,000 Pa s at 70 °C, from 38,000 Pa s to 45,000 Pa s at 70 °C, from 39,000Pa s to 45,000 Pa s at 70 °C, from 40,000 Pa s to 45,000 Pa s at 70 °C, from 41 ,000Pa s to 45,000 Pa s at 70 °C, from 42,000 Pa s to 45,000 Pa s at 70 °C, from 43,0002024P00033Pa s to 45,000 Pa s at 70 °C, or from 44,000 Pa s to 45,000 Pa s at 70 °C. In some embodiments, the B-stage film has melt viscosity from 15,000 Pa s to 44,000 Pa s at 70 °C, from 15,000 Pa s to 43,000 Pa s at 70 °C, from 15,000 Pa s to 42,000 Pa s at 70 °C, from 15,000 Pa s to 41 ,000 Pa s at 70 °C, from 15,000 Pa s to 40,000 Pa s at 70 °C, from 15,000 Pa s to 39,000 Pa s at 70 °C, from 15,000 Pa s to 38,000 Pa s at 70 °C, from 15,000 Pa s to 37,000 Pa s at 70 °C, from 15,000 Pa s to 36,000 Pa s at 70 °C, from 15,000 Pa s to 35,000 Pa s at 70 °C, from 15,000 Pa s to 34,000 Pa s at 70 °C, from 15,000 Pa s to 33,000 Pa s at 70 °C, from 15,000 Pa s to 32,000 Pa s at 70 °C, from 15,000 Pa s to 31 ,000 Pa s at 70 °C, from 15,000 Pa s to 30,000 Pa s at 70 °C, from 15,000 Pa s to 25,000 Pa s at 70 °C, or from 15,000 Pa s to 20,000 Pa s at 70 °C.

[0024] In some embodiments, the B-stage film has a melt viscosity from 5,000 Pa s to 32,000 Pa s at 80 °C, from 10,000 Pa s to 32,000 Pa s at 80 °C, from 15,000Pa s to 32,000 Pa s at 80 °C, from 16,000 Pa s to 32,000 Pa s at 80 °C, from 17,000Pa s to 32,000 Pa s at 80 °C, from 18,000 Pa s to 32,000 Pa s at 80 °C, from 19,000Pa s to 32,000 Pa s at 80 °C, from 20,000 Pa s to 32,000 Pa s at 80 °C, from 21 ,000Pa s to 32,000 Pa s at 80 °C, from 22,000 Pa s to 32,000 Pa s at 80 °C, from 23,000Pa s to 32,000 Pa s at 80 °C, from 24,000 Pa s to 32,000 Pa s at 80 °C, from 25,000Pa s to 32,000 Pa s at 80 °C, from 26,000 Pa s to 32,000 Pa s at 80 °C, from 27,000Pa s to 32,000 Pa s at 80 °C, from 28,000 Pa s to 32,000 Pa s at 80 °C, from 29,000Pa s to 32,000 Pa s at 80 °C, from 30,000 Pa s to 32,000 Pa s at 80 °C, or from 31 ,000 Pa s to 32,000 Pa s at 80 °C. In some embodiments, the B-stage film has a melt viscosity from 4,000 Pa s to 30,000 Pa s at 80 °C, from 4,000 Pa s to 29,000 Pa s at 80 °C, from 4,000 Pa s to 28,000 Pa s at 80 °C, from 4,000 Pa s to 27,000 Pa s at 80 °C, from 4,000 Pa s to 26,000 Pa s at 80 °C, from 4,000 Pa s to 25,000 Pa s at 80 °C, from 4,000 Pa s to 24,000 Pa s at 80 °C, from 4,000 Pa s to 23,000 Pa s at 80 °C, from 4,000 Pa s to 22,000 Pa s at 80 °C, from 4,000 Pa s to 21 ,000 Pa s at 80 °C, from 4,000 Pa s to 20,000 Pa s at 80 °C, from 4,000 Pa s to 19,000 Pa s at 80 °C, from 4,000 Pa s to 18,000 Pa s at 80 °C, from 4,000 Pa s to 17,000 Pa s at 80 °C, from 4,000 Pa s to16,000 Pa s at 80 °C, from 4,000 Pa s to 15,000 Pa s at 80 °C, from 4,000 Pa s to10,000 Pa s at 80 °C, or from 4,000 Pa s to 5,000 Pa s at 80 °C.2024P00033

[0025] In some embodiments, the B-stage film has a melt viscosity from 4,000 Pa s to 25,000 Pa s at 90 °C, from 5,000 Pa s to 25,000 Pa s at 90 °C, from 6,000 Pa s to 25,000 Pa s at 90°C, from 7,000 Pa s to 25,000 Pa s at 90°C, from 8,000 Pa s to 25,000 Pa s at 90°C, from 9,000 Pa s to 25,000 Pa s at 90°C, from 10,000 Pa s to25,000 Pa s at 90°C, from 11 ,000 Pa s to 25,000 Pa s at 90°C, from 12,000 Pa s to25,000 Pa s at 90°C, from 13,000 Pa s to 25,000 Pa s at 90°C, from 14,000 Pa s to25,000 Pa s at 90°C, from 15,000 Pa s to 25,000 Pa s at 90 °C, from 16,000 Pa s to25,000 Pa s at 90 °C, from 17,000 Pa s to 25,000 Pa s at 90 °C, from 18,000 Pa s to 25,000 Pa s at 90 °C, from 19,000 Pa s to 25,000 Pa s at 90 °C, from 20,000 Pa s to 25,000 Pa s at 90 °C, from 21 ,000 Pa s to 25,000 Pa s at 90 °C, from 22,000 Pa s to 25,000 Pa s at 90 °C, from 23,000 Pa s to 25,000 Pa s at 90 °C, or from 24,000 Pa s to 25,000 Pa s at 90 °C. In some embodiments, the B-stage film has a melt viscosity from 4,000 Pa s to 24,000 Pa s at 90 °C, from 4,000 Pa s to 23,000 Pa s at 90 °C, from 4,000 Pa s to 22,000 Pa s at 90 °C, from 4,000 Pa s to 21 ,000 Pa s at 90 °C, from 4,000 Pa s to 20,000 Pa s at 90 °C, from 4,000 Pa s to 19,000 Pa s at 90 °C, from 4,000 Pa s to 18,000 Pa s at 90 °C, from 4,000 Pa s to 17,000 Pa s at 90 °C, from 4,000 Pa s to16,000 Pa s at 90 °C, from 4,000 Pa s to 15,000 Pa s at 90 °C, from 4,000 Pa s to14,000 Pa s at 90 °C, from 4,000 Pa s to 13,000 Pa s at 90 °C, from 4,000 Pa s to12,000 Pa s at 90 °C, from 4,000 Pa s to 11 ,000 Pa s at 90 °C, from 4,000 Pa s to10,000 Pa s at 90 °C, from 4,000 Pa s to 9,000 Pa s at 90 °C, from 4,000 Pa s to 8,000 Pa s at 90 °C, from 4,000 Pa s to 7,000 Pa s at 90 °C, from 4,000 Pa s to 6,000 Pa s at 90 °C, or from 4,000 Pa s to 5,000 Pa s at 90 °C.

[0026] In some embodiments, the B-stage film has a melt viscosity from 3,000 Pa s to 20,000 Pa s at 100 °C, from 4,000 Pa s to 20,000 Pa s at 100 °C, from 5,000Pa s to 20,000 Pa s at 100 °C, from 6,000 Pa s to 20,000 Pa s at 100 °C, from 7,000Pa s to 20,000 Pa s at 100 °C, from 8,000 Pa s to 20,000 Pa s at 100 °C, from 9,000Pa s to 20,000 Pa s at 100 °C, from 10,000 Pa s to 20,000 Pa s at 100 °C, from 11 ,000Pa s to 20,000 Pa s at 100 °C, from 12,000 Pa s to 20,000 Pa s at 100 °C, from 13,000Pa s to 20,000 Pa s at 100 °C, from 14,000 Pa s to 20,000 Pa s at 100 °C, from 14,500Pa s to 20,000 Pa s at 100 °C, from 15,000 Pa s to 20,000 Pa s at 100 °C, from 15,5002024P00033Pa s to 20,000 Pa s at 100 °C, from 16,000 Pa s to 20,000 Pa s at 100 °C, from 16,500Pa s to 20,000 Pa s at 100 °C, from 17,000 Pa s to 20,000 Pa s at 100 °C, from 17,500Pa s to 20,000 Pa s at 100 °C, from 18,000 Pa s to 20,000 Pa s at 100 °C, from 18,500Pa s to 20,000 Pa s at 100 °C, from 19,000 Pa s to 20,000 Pa s at 100 °C, or from19,500 Pa s to 20,000 Pa s at 100 °C. In some embodiments, the B-stage film has a melt viscosity from 2,000 Pa s to 19,500 Pa s at 100 °C, from 2,000 Pa s to 19,000 Pa s at 100 °C, from 2,000 Pa s to 18,500 Pa s at 100 °C, from 2,000 Pa s to 18,000 Pa s at 100 °C, from 2,000 Pa s to 17,500 Pa s at 100 °C, from 2,000 Pa s to 17,000 Pa s at100 °C, from 2,000 Pa s to 16,500 Pa s at 100 °C, from 2,000 Pa s to 15,000 Pa s at100 °C, from 2,000 Pa s to 14,500 Pa s at 100 °C, from 2,000 Pa s to 14,000 Pa s at100 °C, from 2,000 Pa s to 13,500 Pa s at 100 °C, from 2,000 Pa s to 13,000 Pa s at100 °C, from 2,000 Pa s to 12,000 Pa s at 100 °C, from 2,000 Pa s to 11 ,000 Pa s at100 °C, from 2,000 Pa s to 10,000 Pa s at 100 °C, from 2,000 Pa s to 9,000 Pa s at 100 °C, from 2,000 Pa s to 8,000 Pa s at 100 °C, from 2,000 Pa s to 7,000 Pa s at 100 °C, from 2,000 Pa s to 6,000 Pa s at 100 °C, from 2,000 Pa s to 5,000 Pa s at 100 °C, from 2,000 Pa s to 4,000 Pa s at 100 °C, or from 2,000 Pa s to 3,000 Pa s at 100 °C.

[0027] In some embodiments, after the composition forms a B-stage film, the B- stage film has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C, as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2.

[0028] In some embodiments, the B-stage film has a melt viscosity from 1 ,500 Pa s to 8,000 Pa s at 70 °C, from 2,000 Pa s to 8,000 Pa s at 70 °C, from 2,500 Pa s to 8,000 Pa s at 70 °C, from 3,000 Pa s to 8,000 Pa s at 70 °C, from 3,500 Pa s to 8,000 Pa s at 70 °C, from 4,000 Pa s to 8,000 Pa s at 70 °C, from 4,500 Pa s to 8,000 Pa s at 70 °C, from 5,000 Pa s to 8,000 Pa s at 70 °C, from 5,500 Pa s to 8,000 Pa s at 70 °C, from 6,000 Pa s to 8,000 Pa s at 70 °C, from 6,500 Pa s to 8,000 Pa s at 70 °C, from 7,000 Pa s to 8,000 Pa s at 70 °C, or from 7,500 Pa s to 8,000 Pa s at 70 °C. In some embodiments, the B-stage film has a melt viscosity from 1 ,000 Pa s to 7,500 Pa s at 70 °C, from 1 ,000 Pa s to 7,000 Pa s at 70 °C, from 1 ,000 Pa s to 6,500 Pa s at 70 °C, from2024P000331 ,000 Pa s to 6,000 Pa s at 70 °C, from 1 ,000 Pa s to 5,500 Pa s at 70 °C, from 1 ,000 Pa s to 5,000 Pa s at 70 °C, from 1 ,000 Pa s to 4,500 Pa s at 70 °C, from 1 ,000 Pa s to 4,000 Pa s at 70 °C, from 1 ,000 Pa s to 3,500 Pa s at 70 °C, from 1 ,000 Pa s to 3,000 Pa s at 70 °C, from 1 ,000 Pa s to 2,500 Pa s at 70 °C, from 1 ,000 Pa s to 2,000 Pa s at 70 °C, or from 1 ,000 Pa s to 1 ,500 Pa s at 70 °C.

[0029] In some embodiments, the B-stage film has a melt viscosity from 1 ,000 Pa s to 5,000 Pa s at 80 °C, from 1 ,500 Pa s to 5,000 Pa s at 80 °C, from 2,000 Pa s to 5,000 Pa s at 80 °C, from 2,500 Pa s to 5,000 Pa s at 80 °C, from 3,000 Pa s to 5,000 Pa s at 80 °C, from 3,500 Pa s to 5,000 Pa s at 80 °C, from 4,000 Pa s to 5,000 Pa s at 80 °C, or from 4,500 Pa s to 5,000 Pa s at 80 °C. In some embodiments, the B-stage film has a melt viscosity from 500 Pa s to 4,500 Pa s at 80 °C, from 500 Pa s to 4,000 Pa s at 80 °C, from 500 Pa s to 3,500 Pa s at 80 °C, from 500 Pa s to 3,000 Pa s at 80 °C, from 500 Pa s to 2,500 Pa s at 80 °C, from 500 Pa s to 2,000 Pa s at 80 °C, from 500 Pa s to 1 ,500 Pa s at 80 °C, or from 500 Pa s to 1 ,000 Pa s at 80 °C.

[0030] In some embodiments, the B-stage film has a melt viscosity from 200 Pa s to 2,000 Pa s at 90 °C, from 300 Pa s to 2,000 Pa s at 90 °C, from 400 Pa s to 2,000 Pa s at 90 °C, from 500 Pa s to 2,000 Pa s at 90 °C, from 600 Pa s to 2,000 Pa s at 90 °C, from 700 Pa s to 2,000 Pa s at 90 °C, from 800 Pa s to 2,000 Pa s at 90 °C, from 900 Pa s to 2,000 Pa s at 90 °C, from 1 ,000 Pa s to 2,000 Pa s at 90 °C, from 1 ,100 Pa s to 2,000 Pa s at 90 °C, from 1 ,200 Pa s to 2,000 Pa s at 90 °C, from 1 ,300 Pa s to 2,000 Pa s at 90 °C, from 1 ,400 Pa s to 2,000 Pa s at 90 °C, from 1 ,500 Pa s to 2,000 Pa s at 90 °C, from 1 ,600 Pa s to 2,000 Pa s at 90 °C, from 1 ,700 Pa s to 2,000 Pa s at 90 °C, from 1 ,800 Pa s to 2,000 Pa s at 90 °C, or from 1 ,900 Pa s to 2,000 Pa s at 90 °C. In some embodiments, the B-stage film has a melt viscosity from 100 Pa s to 1 ,900 Pa s at 90 °C, from 100 Pa s to 1 ,800 Pa s at 90 °C, from 100 Pa s to 1 ,700 Pa s at 90 °C, from 100 Pa s to 1 ,600 Pa s at 90 °C, from 100 Pa s to 1 ,500 Pa s at 90 °C, from 100 Pa s to 1 ,400 Pa s at 90 °C, from 100 Pa s to 1 ,300 Pa s at 90 °C, from 100 Pa s to 1 ,200 Pa s at 90 °C, from 100 Pa s to 1 ,100 Pa s at 90 °C, from 100 Pa s to 1 ,000 Pa s at 90 °C, from 100 Pa s to 900 Pa s at 90 °C, from 100 Pa s to 800 Pa s at 90 °C, from 100 Pa s to 700 Pa s at 90 °C, from 100 Pa s to 600 Pa s at 90 °C, from 100 Pa s to 5002024P00033Pa s at 90 °C, from 100 Pa s to 400 Pa s at 90 °C, from 100 Pa s to 300 Pa s at 90 °C, or from 100 Pa s to 200 Pa s at 90 °C.

[0031] In some embodiments, the B-stage film has a melt viscosity from 50 Pa s to 1 ,000 Pa s at 100 °C, from 100 Pa s to 1 ,000 Pa s at 100 °C, from 150 Pa s to 1 ,000 Pa s at 100 °C, from 200 Pa s to 1 ,000 Pa s at 100 °C, from 250 Pa s to 1 ,000 Pa s at 100 °C, from 300 Pa s to 1 ,000 Pa s at 100 °C, from 350 Pa s to 1 ,000 Pa s at 100 °C, from 400 Pa s to 1 ,000 Pa s at 100 °C, from 450 Pa s to 1 ,000 Pa s at 100 °C, from 500 Pa s to 1 ,000 Pa s at 100 °C, from 550 Pa s to 1 ,000 Pa s at 100 °C, from 600 Pa s to 1 ,000 Pa s at 100 °C, from 650 Pa s to 1 ,000 Pa s at 100 °C, from 700 Pa s to 1 ,000 Pa s at 100 °C, from 750 Pa s to 1 ,000 Pa s at 100 °C, from 800 Pa s to 1 ,000 Pa s at 100 °C, from 850 Pa s to 1 ,000 Pa s at 100 °C, from 900 Pa s to 1 ,000 Pa s at 100 °C, or from 950 Pa s to 1 ,000 Pa s at 100 °C. In some embodiments, the B-stage film has a melt viscosity from 10 Pa s to 950 Pa s at 100 °C, from 10 Pa s to 900 Pa s at 100 °C, from 10 Pa s to 850 Pa s at 100 °C, from 10 Pa s to 800 Pa s at 100 °C, from 10 Pa s to 750 Pa s at 100 °C, from 10 Pa s to 700 Pa s at 100 °C, from 10 Pa s to 650 Pa s at 100 °C, from 10 Pa s to 600 Pa s at 100 °C, from 10 Pa s to 550 Pa s at 100 °C, from 10 Pa s to 500 Pa s at 100 °C, from 10 Pa s to 450 Pa s at 100 °C, from 10 Pa s to 400 Pa s at 100 °C, from 10 Pa s to 350 Pa s at 100 °C, from 10 Pa s to 300 Pa s at 100 °C, from 10 Pa s to 250 Pa s at 100 °C, from 10 Pa s to 200 Pa s at 100 °C, from 10 Pa s to 150 Pa s at 100 °C, from 10 Pa s to 100 Pa s at 100 °C, or from 10 Pa s to 50 Pa s at 100 °C.

[0032] In some embodiments, the present disclosure provides a composition comprising a first binder resin having an average molecular weight from 10,000 to 50,000, a second binder resin having an average molecular weight from 200,000 to 800,000, wherein after the composition forms a B-stage film, the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C, and the B-stage film comprises two or more layers. In some embodiments, the first binder resin may have an average molecular weight in narrower ranges as described above (e.g., from 10,000 to 40,000). In some embodiments, the second binder resin2024P00033 may have an average molecular weight in narrow ranges as described above (e.g., from 200,000 to 700,000). In some embodiments, the B-stage film comprises a lower layer that contains the first binder resin and an upper layer that contains the second binder resin.

[0033] In some embodiments, after the composition forms a B-stage film, the upper layer has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C, as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2. In some embodiments, after the compositions form a B-stage film, the lower layer has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C, as measured using a DHR2 rheometer with a 5 °C / min ramping rate in N2.

[0034] In some embodiments, the upper layer of the B-stage film has melt viscosity from 15,000 Pa s to 45,000 Pa s at 70 °C, from 20,000 Pa s to 45,000 Pa s at 70 °C, from 25,000 Pa s to 45,000 Pa s at 70 °C, from 30,000 Pa s to 45,000 Pa s at 70 °C, from 31 ,000 Pa s to 45,000 Pa s at 70 °C, from 32,000 Pa s to 45,000 Pa s at 70 °C, from 33,000 Pa s to 45,000 Pa s at 70 °C, from 34,000 Pa s to 45,000 Pa s at 70 °C, from 35,000 Pa s to 45,000 Pa s at 70 °C, from 36,000 Pa s to 45,000 Pa s at 70 °C, from 37,000 Pa s to 45,000 Pa s at 70 °C, from 38,000 Pa s to 45,000 Pa s at 70 °C, from 39,000 Pa s to 45,000 Pa s at 70 °C, from 40,000 Pa s to 45,000 Pa s at 70 °C, from 41 ,000 Pa s to 45,000 Pa s at 70 °C, from 42,000 Pa s to 45,000 Pa s at 70 °C, from 43,000 Pa s to 45,000 Pa s at 70 °C, or from 44,000 Pa s to 45,000 Pa s at 70 °C. In some embodiments, the upper layer of the B-stage film has melt viscosity from 15,000 Pa s to 44,000 Pa s at 70 °C, from 15,000 Pa s to 43,000 Pa s at 70 °C, from15,000 Pa s to 42,000 Pa s at 70 °C, from 15,000 Pa s to 41 ,000 Pa s at 70 °C, from15,000 Pa s to 40,000 Pa s at 70 °C, from 15,000 Pa s to 39,000 Pa s at 70 °C, from15,000 Pa s to 38,000 Pa s at 70 °C, from 15,000 Pa s to 37,000 Pa s at 70 °C, from15,000 Pa s to 36,000 Pa s at 70 °C, from 15,000 Pa s to 35,000 Pa s at 70 °C, from15,000 Pa s to 34,000 Pa s at 70 °C, from 15,000 Pa s to 33,000 Pa s at 70 °C, from2024P0003315,000 Pa s to 32,000 Pa s at 70 °C, from 15,000 Pa s to 31 ,000 Pa s at 70 °C, from15,000 Pa s to 30,000 Pa s at 70 °C, from 15,000 Pa s to 25,000 Pa s at 70 °C, or from15,000 Pa s to 20,000 Pa s at 70 °C.

[0035] In some embodiments, the upper layer of the B-stage film has a melt viscosity from 5,000 Pa s to 32,000 Pa s at 80 °C, from 10,000 Pa s to 32,000 Pa s at 80 °C, from 15,000 Pa s to 32,000 Pa s at 80 °C, from 16,000 Pa s to 32,000 Pa s at 80 °C, from 17,000 Pa s to 32,000 Pa s at 80 °C, from 18,000 Pa s to 32,000 Pa s at 80 °C, from 19,000 Pa s to 32,000 Pa s at 80 °C, from 20,000 Pa s to 32,000 Pa s at 80 °C, from 21 ,000 Pa s to 32,000 Pa s at 80 °C, from 22,000 Pa s to 32,000 Pa s at 80 °C, from 23,000 Pa s to 32,000 Pa s at 80 °C, from 24,000 Pa s to 32,000 Pa s at 80 °C, from 25,000 Pa s to 32,000 Pa s at 80 °C, from 26,000 Pa s to 32,000 Pa s at 80 °C, from 27,000 Pa s to 32,000 Pa s at 80 °C, from 28,000 Pa s to 32,000 Pa s at 80 °C, from 29,000 Pa s to 32,000 Pa s at 80 °C, from 30,000 Pa s to 32,000 Pa s at 80 °C, or from 31 ,000 Pa s to 32,000 Pa s at 80 °C. In some embodiments, the upper layer of the B-stage film has a melt viscosity from 4,000 Pa s to 30,000 Pa s at 80 °C, from 4,000 Pa s to 29,000 Pa s at 80 °C, from 4,000 Pa s to 28,000 Pa s at 80 °C, from 4,000 Pa s to 27,000 Pa s at 80 °C, from 4,000 Pa s to 26,000 Pa s at 80 °C, from 4,000 Pa s to 25,000 Pa s at 80 °C, from 4,000 Pa s to 24,000 Pa s at 80 °C, from 4,000 Pa s to23,000 Pa s at 80 °C, from 4,000 Pa s to 22,000 Pa s at 80 °C, from 4,000 Pa s to21 ,000 Pa s at 80 °C, from 4,000 Pa s to 20,000 Pa s at 80 °C, from 4,000 Pa s to19,000 Pa s at 80 °C, from 4,000 Pa s to 18,000 Pa s at 80 °C, from 4,000 Pa s to17,000 Pa s at 80 °C, from 4,000 Pa s to 16,000 Pa s at 80 °C, from 4,000 Pa s to15,000 Pa s at 80 °C, from 4,000 Pa s to 10,000 Pa s at 80 °C, or from 4,000 Pa s to 5,000 Pa s at 80 °C.

[0036] In some embodiments, the upper layer of the B-stage film has a melt viscosity from 4,000 Pa s to 25,000 Pa s at 90 °C, from 5,000 Pa s to 25,000 Pa s at 90 °C, from 6,000 Pa s to 25,000 Pa s at 90°C, from 7,000 Pa s to 25,000 Pa s at 90°C, from 8,000 Pa s to 25,000 Pa s at 90°C, from 9,000 Pa s to 25,000 Pa s at 90°C, from 10,000 Pa s to 25,000 Pa s at 90°C, from 11 ,000 Pa s to 25,000 Pa s at 90°C, from 12,000 Pa s to 25,000 Pa s at 90°C, from 13,000 Pa s to 25,000 Pa s at 90°C, from2024P0003314,000 Pa s to 25,000 Pa s at 90°C, from 15,000 Pa s to 25,000 Pa s at 90 °C, from 16,000 Pa s to 25,000 Pa s at 90 °C, from 17,000 Pa s to 25,000 Pa s at 90 °C, from18,000 Pa s to 25,000 Pa s at 90 °C, from 19,000 Pa s to 25,000 Pa s at 90 °C, from20,000 Pa s to 25,000 Pa s at 90 °C, from 21 ,000 Pa s to 25,000 Pa s at 90 °C, from22,000 Pa s to 25,000 Pa s at 90 °C, from 23,000 Pa s to 25,000 Pa s at 90 °C, or from24,000 Pa s to 25,000 Pa s at 90 °C. In some embodiments, the at upper layer of the B- stage film has a melt viscosity from 4,000 Pa s to 24,000 Pa s at 90 °C, from 4,000 Pa s to 23,000 Pa s at 90 °C, from 4,000 Pa s to 22,000 Pa s at 90 °C, from 4,000 Pa s to 21 ,000 Pa s at 90 °C, from 4,000 Pa s to 20,000 Pa s at 90 °C, from 4,000 Pa s to19,000 Pa s at 90 °C, from 4,000 Pa s to 18,000 Pa s at 90 °C, from 4,000 Pa s to17,000 Pa s at 90 °C, from 4,000 Pa s to 16,000 Pa s at 90 °C, from 4,000 Pa s to15,000 Pa s at 90 °C, from 4,000 Pa s to 14,000 Pa s at 90 °C, from 4,000 Pa s to13,000 Pa s at 90 °C, from 4,000 Pa s to 12,000 Pa s at 90 °C, from 4,000 Pa s to11 ,000 Pa s at 90 °C, from 4,000 Pa s to 10,000 Pa s at 90 °C, from 4,000 Pa s to 9,000Pa s at 90 °C, from 4,000 Pa s to 8,000 Pa s at 90 °C, from 4,000 Pa s to 7,000 Pa s at 90 °C, from 4,000 Pa s to 6,000 Pa s at 90 °C, or from 4,000 Pa s to 5,000 Pa s at 90 °C.

[0037] In some embodiments, the upper layer of the B-stage film has a melt viscosity from 3,000 Pa s to 20,000 Pa s at 100 °C, from 4,000 Pa s to 20,000 Pa s at100 °C, from 5,000 Pa s to 20,000 Pa s at 100 °C, from 6,000 Pa s to 20,000 Pa s at100 °C, from 7,000 Pa s to 20,000 Pa s at 100 °C, from 8,000 Pa s to 20,000 Pa s at100 °C, from 9,000 Pa s to 20,000 Pa s at 100 °C, from 10,000 Pa s to 20,000 Pa s at100 °C, from 11 ,000 Pa s to 20,000 Pa s at 100 °C, from 12,000 Pa s to 20,000 Pa s at100 °C, from 13,000 Pa s to 20,000 Pa s at 100 °C, from 14,000 Pa s to 20,000 Pa s at100 °C, from 14,500 Pa s to 20,000 Pa s at 100 °C, from 15,000 Pa s to 20,000 Pa s at100 °C, from 15,500 Pa s to 20,000 Pa s at 100 °C, from 16,000 Pa s to 20,000 Pa s at100 °C, from 16,500 Pa s to 20,000 Pa s at 100 °C, from 17,000 Pa s to 20,000 Pa s at100 °C, from 17,500 Pa s to 20,000 Pa s at 100 °C, from 18,000 Pa s to 20,000 Pa s at100 °C, from 18,500 Pa s to 20,000 Pa s at 100 °C, from 19,000 Pa s to 20,000 Pa s at100 °C, or from 19,500 Pa s to 20,000 Pa s at 100 °C. In some embodiments, the upper2024P00033 layer of the B-stage film has a melt viscosity from 2,000 Pa s to 19,500 Pa s at 100 °C, from 2,000 Pa s to 19,000 Pa s at 100 °C, from 2,000 Pa s to 18,500 Pa s at 100 °C, from 2,000 Pa s to 18,000 Pa s at 100 °C, from 2,000 Pa s to 17,500 Pa s at 100 °C, from 2,000 Pa s to 17,000 Pa s at 100 °C, from 2,000 Pa s to 16,500 Pa s at 100 °C, from 2,000 Pa s to 15,000 Pa s at 100 °C, from 2,000 Pa s to 14,500 Pa s at 100 °C, from 2,000 Pa s to 14,000 Pa s at 100 °C, from 2,000 Pa s to 13,500 Pa s at 100 °C, from 2,000 Pa s to 13,000 Pa s at 100 °C, from 2,000 Pa s to 12,000 Pa s at 100 °C, from 2,000 Pa s to 11 ,000 Pa s at 100 °C, from 2,000 Pa s to 10,000 Pa s at 100 °C, from 2,000 Pa s to 9,000 Pa s at 100 °C, from 2,000 Pa s to 8,000 Pa s at 100 °C, from 2,000 Pa s to 7,000 Pa s at 100 °C, from 2,000 Pa s to 6,000 Pa s at 100 °C, from 2,000 Pa s to 5,000 Pa s at 100 °C, from 2,000 Pa s to 4,000 Pa s at 100 °C, or from 2,000 Pa s to 3,000 Pa s at 100 °C.

[0038] In some embodiments, the B-stage film has a melt viscosity from 1 ,500 Pa s to 8,000 Pa s at 70 °C, from 2,000 Pa s to 8,000 Pa s at 70 °C, from 2,500 Pa s to 8,000 Pa s at 70 °C, from 3,000 Pa s to 8,000 Pa s at 70 °C, from 3,500 Pa s to 8,000 Pa s at 70 °C, from 4,000 Pa s to 8,000 Pa s at 70 °C, from 4,500 Pa s to 8,000 Pa s at 70 °C, from 5,000 Pa s to 8,000 Pa s at 70 °C, from 5,500 Pa s to 8,000 Pa s at 70 °C, from 6,000 Pa s to 8,000 Pa s at 70 °C, from 6,500 Pa s to 8,000 Pa s at 70 °C, from 7,000 Pa s to 8,000 Pa s at 70 °C, or from 7,500 Pa s to 8,000 Pa s at 70 °C. In some embodiments, the B-stage film has a melt viscosity from 1 ,000 Pa s to 7,500 Pa s at 70 °C, from 1 ,000 Pa s to 7,000 Pa s at 70 °C, from 1 ,000 Pa s to 6,500 Pa s at 70 °C, from 1 ,000 Pa s to 6,000 Pa s at 70 °C, from 1 ,000 Pa s to 5,500 Pa s at 70 °C, from 1 ,000 Pa s to 5,000 Pa s at 70 °C, from 1 ,000 Pa s to 4,500 Pa s at 70 °C, from 1 ,000 Pa s to 4,000 Pa s at 70 °C, from 1 ,000 Pa s to 3,500 Pa s at 70 °C, from 1 ,000 Pa s to 3,000 Pa s at 70 °C, from 1 ,000 Pa s to 2,500 Pa s at 70 °C, from 1 ,000 Pa s to 2,000 Pa s at 70 °C, or from 1 ,000 Pa s to 1 ,500 Pa s at 70 °C.

[0039] In some embodiments, the lower layer of the B-stage film has a melt viscosity from 1 ,000 Pa s to 5,000 Pa s at 80 °C, from 1 ,500 Pa s to 5,000 Pa s at 80 °C, from 2,000 Pa s to 5,000 Pa s at 80 °C, from 2,500 Pa s to 5,000 Pa s at 80 °C, from 3,000 Pa s to 5,000 Pa s at 80 °C, from 3,500 Pa s to 5,000 Pa s at 80 °C, from 4,0002024P00033Pa s to 5,000 Pa s at 80 °C, or from 4,500 Pa s to 5,000 Pa s at 80 °C. In some embodiments, the lower layer of the B-stage film has a melt viscosity from 500 Pa s to 4,500 Pa s at 80 °C, from 500 Pa s to 4,000 Pa s at 80 °C, from 500 Pa s to 3,500 Pa s at 80 °C, from 500 Pa s to 3,000 Pa s at 80 °C, from 500 Pa s to 2,500 Pa s at 80 °C, from 500 Pa s to 2,000 Pa s at 80 °C, from 500 Pa s to 1 ,500 Pa s at 80 °C, or from 500 Pa s to 1 ,000 Pa s at 80 °C.

[0040] In some embodiments, the lower layer of the B-stage film has a melt viscosity from 200 Pa s to 2,000 Pa s at 90 °C, from 300 Pa s to 2,000 Pa s at 90 °C, from 400 Pa s to 2,000 Pa s at 90 °C, from 500 Pa s to 2,000 Pa s at 90 °C, from 600 Pa s to 2,000 Pa s at 90 °C, from 700 Pa s to 2,000 Pa s at 90 °C, from 800 Pa s to 2,000 Pa s at 90 °C, from 900 Pa s to 2,000 Pa s at 90 °C, from 1 ,000 Pa s to 2,000 Pa s at 90 °C, from 1 , 100 Pa s to 2,000 Pa s at 90 °C, from 1 ,200 Pa s to 2,000 Pa s at 90 °C, from 1 ,300 Pa s to 2,000 Pa s at 90 °C, from 1 ,400 Pa s to 2,000 Pa s at 90 °C, from 1 ,500 Pa s to 2,000 Pa s at 90 °C, from 1 ,600 Pa s to 2,000 Pa s at 90 °C, from 1 ,700 Pa s to 2,000 Pa s at 90 °C, from 1 ,800 Pa s to 2,000 Pa s at 90 °C, or from 1 ,900 Pa s to 2,000 Pa s at 90 °C. In some embodiments, the lower layer of the B-stage film has a melt viscosity from 100 Pa s to 1 ,900 Pa s at 90 °C, from 100 Pa s to 1 ,800 Pa s at 90 °C, from 100 Pa s to 1 ,700 Pa s at 90 °C, from 100 Pa s to 1 ,600 Pa s at 90 °C, from 100 Pa s to 1 ,500 Pa s at 90 °C, from 100 Pa s to 1 ,400 Pa s at 90 °C, from 100 Pa s to 1 ,300 Pa s at 90 °C, from 100 Pa s to 1 ,200 Pa s at 90 °C, from 100 Pa s to 1 ,100 Pa s at 90 °C, from 100 Pa s to 1 ,000 Pa s at 90 °C, from 100 Pa s to 900 Pa s at 90 °C, from 100 Pa s to 800 Pa s at 90 °C, from 100 Pa s to 700 Pa s at 90 °C, from 100 Pa s to 600 Pa s at 90 °C, from 100 Pa s to 500 Pa s at 90 °C, from 100 Pa s to 400 Pa s at 90 °C, from 100 Pa s to 300 Pa s at 90 °C, or from 100 Pa s to 200 Pa s at 90 °C.

[0041] In some embodiments, the lower layer of the B-stage film has a melt viscosity from 50 Pa s to 1 ,000 Pa s at 100 °C, from 100 Pa s to 1 ,000 Pa s at 100 °C, from 150 Pa s to 1 ,000 Pa s at 100 °C, from 200 Pa s to 1 ,000 Pa s at 100 °C, from 250 Pa s to 1 ,000 Pa s at 100 °C, from 300 Pa s to 1 ,000 Pa s at 100 °C, from 350 Pa s to 1 ,000 Pa s at 100 °C, from 400 Pa s to 1 ,000 Pa s at 100 °C, from 450 Pa s to 1 ,0002024P00033Pa s at 100 °C, from 500 Pa s to 1 ,000 Pa s at 100 °C, from 550 Pa s to 1 ,000 Pa s at 100 °C, from 600 Pa s to 1 ,000 Pa s at 100 °C, from 650 Pa s to 1 ,000 Pa s at 100 °C, from 700 Pa s to 1 ,000 Pa s at 100 °C, from 750 Pa s to 1 ,000 Pa s at 100 °C, from 800 Pa s to 1 ,000 Pa s at 100 °C, from 850 Pa s to 1 ,000 Pa s at 100 °C, from 900 Pa s to 1 ,000 Pa s at 100 °C, or from 950 Pa s to 1 ,000 Pa s at 100 °C. In some embodiments, the lower layer of the B-stage film has a melt viscosity from 10 Pa s to 950 Pa s at 100°C, from 10 Pa s to 900 Pa s at 100 °C, from 10 Pa s to 850 Pa s at 100 °C, from 10Pa s to 800 Pa s at 100 °C, from 10 Pa s to 750 Pa s at 100 °C, from 10 Pa s to 700 Pa s at 100 °C, from 10 Pa s to 650 Pa s at 100 °C, from 10 Pa s to 600 Pa s at 100 °C, from 10 Pa s to 550 Pa s at 100 °C, from 10 Pa s to 500 Pa s at 100 °C, from 10 Pa s to 450 Pa s at 100 °C, from 10 Pa s to 400 Pa s at 100 °C, from 10 Pa s to 350 Pa s at 100 °C, from 10 Pa s to 300 Pa s at 100 °C, from 10 Pa s to 250 Pa s at 100 °C, from 10Pa s to 200 Pa s at 100 °C, from 10 Pa s to 150 Pa s at 100 °C, from 10 Pa s to 100Pa s at 100 °C, or from 10 Pa s to 50 Pa s at 100 °C.

[0042] In some embodiments, the B-stage film has a softening temperature of less than or equal to 50 °C, less than or equal to 45°C, less than or equal to 40 °C, less than or equal to 35 °C, less than or equal to 30 °C, less than or equal to 25 °C, less than or equal to 20 °C, less than or equal to 15 °C, or less than or equal to 10 °C. In some embodiments, the B-stage film has a softening temperature from 10 °C to 50 °C, from 10 °C to 45 °C, from 10 °C to 40 °C, from 10 °C to 35 °C, from 10 °C to 30 °C, from 10 °C to 25 °C, from 10 °C to 20 °C, or from 10 °C to 15 °C. In some embodiments, the B-stage film has a softening temperature from 15 °C to 50 °C, from 20 °C to 50 °C, from 25 °C to 50 °C, from 30 °C to 50 °C, from 35 °C to 50 °C, from 40 °C to 50 °C, or from 45 °C to 50 °C.

[0043] In some embodiments, the B-stage film has a DMA modulus, at room temperature, from 350 GPa to 2,000 GPa, from 350 GPa to 1 ,900 GPa, from 350 GPa to 1 ,800 GPa, from 350 GPa to 1 ,700 GPa, from 350 GPa to 1 ,600 GPa, from 350 GPa to 1 ,500 GPa, from 350 GPa to 1 ,400 GPa, from 350 GPa to 1 ,300 GPa, from 350 GPa to 1 ,200 GPa, from 350 GPa to 1 , 100 GPa, from 350 GPa to 1 ,000 GPa, from 350 GPa to 950 GPa, from 350 GPa to 900 GPa, from 350 GPa to 850 GPa, from 350 GPa to2024P00033800 GPa, from 350 GPa to 750 GPa, from 350 GPa to 700 GPa, from 350 GPa to 650 GPa, from 350 GPa to 600 GPa, from 350 GPa to 550 GPa, from 350 GPa to 500 GPa, from 350 GPa to 450 GPa, or from 350 GPa to 400 GPa. In some embodiments, the B- stage film has a DMA modulus, at room temperature, from 400 GPa to 2,000 GPa, from 450 GPa to 2,000 GPa, from 500 GPa to 2,000 GPa, from 550 GPa to 2,000 GPa, from600 GPa to 2,000 GPa, from 650 GPa to 2,000 GPa, from 700 GPa to 2,000 GPa, from750 GPa to 2,000 GPa, from 800 GPa to 2,000 GPa, from 850 GPa to 2,000 GPa, from900 GPa to 2,000 GPa, from 950 GPa to 2,000 GPa, from 1 ,000 GPa to 2,000 GPa, from 1 ,100 GPa to 2,000 GPa, from 1 ,200 GPa to 2,000 GPa, from 1 ,300 GPa to 2,000 GPa, from 1 ,400 GPa to 2,000 GPa, from 1 ,500 GPa to 2,000 GPa, from 1 ,600 GPa to 2,000 GPa, from 1 ,700 GPa to 2,000 GPa, from 1 ,800 GPa to 2,000 GPa, or from 1 ,900 GPa to 2,000 GPa.

[0044] The present disclosure refers to certain organic groups as being, in some embodiments, “substituted.” The term “substituted” means that the subject organic group bears one or more substituents, where a substituent is an atom or a group of atoms that replaces a hydrogen atom on the subject organic group. Where an organic group is substituted, a substituent may replace one or more hydrogen atoms, ranging from replacement of exactly one hydrogen atom to the replacement of all hydrogen atoms on the subject organic group. Where an organic group may bear multiple substituents, the substituents are selected independently and can be, but need not be, identical.

[0045] The present disclosure refers to certain organic groups as being, in some embodiments, “unsubstituted.” The term “unsubstituted” means that the subject organic group bears no substituents (as that term is described above).

[0046] In some embodiments, the binder resin in compositions of the present disclosure comprises a functionalized thermoplastic resin, wherein the functionalized thermoplastic resin comprises an epoxy functional group. In some embodiments, the epoxy functional group comprises bisphenol A, bisphenol F, phenol-novolac, dicyclopentadiene-type epoxy, naphthalene-type epoxy, or any combination thereof. In some embodiments, the epoxy functional group comprises diepoxide, hydrogenated2024P00033 bisphenol A, difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride, bisphenol F, dicyclopentadiene-type epoxy, or any combination thereof.

[0047] In some embodiments, the epoxy functional group comprises a bisphenol epoxy. In some embodiments, the epoxy functional group comprises the combination of two or more different bisphenol epoxies. These bisphenol epoxies may be selected from bisphenol A, bisphenol F, or bisphenol S epoxies, or combinations thereof. In addition, two or more different bisphenol epoxies within the same type of resin (such A, F or S) may be used.

[0048] Commercially available examples of bisphenol epoxies contemplated for use herein include bisphenol-F type epoxies (such as RE-404-S from Nippon Kayaku, Japan, and EPICLON 830 (RE1801 ), 830S (RE1815), 830A (REI 826) and 830Wfrom Dai Nippon Ink & Chemicals, Inc., and RSL 1738 and YL-983U from Resolution) and bisphenol-A-type epoxies (such as YL-979 and 980 from Resolution).

[0049] In addition to bisphenol epoxies, other epoxy compounds are contemplated for use as the epoxy functional group of the disclosed compositions. For instance, cycloaliphatic epoxies, such as 3,4-epoxycyclohexylmethyl-3,4- epoxycyclohexylcarbonate, can be used. Epoxies suitable for use herein also include polyglycidyl derivatives of phenolic compounds, such as those available commercially under the tradename EPON, such as EPON 828, EPON 1001 , EPON 1009, and EPON 1031 from Resolution; DER 331 , DER 332, DER 334, and DER 542 from Dow Chemical Co.; and BREN-S from Nippon Kayaku. Other suitable epoxies include polyepoxides prepared from polyols and the like and polyglycidyl derivatives of phenol-formaldehyde novolacs, the latter of such as DEN 431 , DEN 438, and DEN 439 from Dow Chemical. Cresol analogs are also available commercially under the tradename ARALDITE, such as ARALDITE ECN 1235, ARALDITE ECN 1273, and ARALDITE ECN 1299 from Ciba Specialty Chemicals Corporation. SU-8 is a bisphenol A-type epoxy novolac available from Resolution. Polyglycidyl adducts of amines, aminoalcohols and polycarboxylic acids are also useful in this invention, commercially available resins of which include GLYAMINE 135, GLYAMINE 125, and GLYAMINE 115 from F.I.C. Corporation;2024P00033ARALDITE MY-720, ARALDITE 0500, and ARALDITE 0510 from Ciba Specialty Chemicals and PGA-X and PGA-C from the Sherwin-Williams Co.

[0050] In some embodiments, the epoxy functional group is novolac epoxy EEW 200, novolac epoxy EEW 300, or novolac epoxy EEW 140.

[0051] In some embodiments, the epoxy functional group is a compound represented bywherein n is 0, 1 , 2, 3, 4, or 5, and m is 0, 1 , 2, 3, 4, or 5.

[0052] In some embodiments, the binder resin comprises a rubber or elastomer- modified epoxy functional group. In some embodiments, the binder resin comprises an acrylic polymer.

[0053] In some embodiments, the binder resin comprises an epoxidized carboxyl- terminated butadiene-acrylonitrile (CTBN) oligomer or polymer. In some embodiments, the epoxidized CTBN oligomer or polymer comprises an epoxy-containing derivative of an oligomeric or polymeric precursor having the structure:HOOC[(Bu)x(ACN)y]mCOOH wherein: each Bu is a butylene moiety (e.g., 1 ,2-butadienyl or 1 ,4-butadienyl); each ACN is an acrylonitrile moiety; the Bu units and the ACN units can be arranged randomly or in blocks; each of x and y are greater than zero, provided the total of x+y = 1 ; a ratio of x:y is from about 10:1 to 1 : 10; and2024P00033 m is from about 20 to about 100.

[0054] As readily recognized by those of skill in the art, epoxidized CTBN oligomers or polymers can be made in a variety of ways, e.g., from a carboxyl terminated butadiene / acrylonitrile copolymer, an epoxy resin, and bisphenol A by reaction between the carboxylic acid group of CTBN and epoxies (e.g., via chainextension reactions), and the like:R-Carboxyl Groups wherein R is independently selected from hydrogen, alkyl, and substituted alkyl.

[0055] Non-limiting examples of the binder resin include epoxidized CTBN oligomers or polymers made from a carboxyl terminated butadiene / acrylonitrile2024P00033 copolymer, an epoxy resin, and bisphenol A, as described above, Hypro™ EpoxyFunctional Butadiene-Acrylonitrile Polymers (formerly Hycar® ETBN), epoxy resins based on bisphenol A (e.g., Epon Resin 834), epoxy resins based on bisphenol F (e.g., RSL-1739), multifunctional epoxy resins based on phenol-novolac resin, dicyclopentadiene-type epoxy resins (e.g., Epicion HP-7200L), naphthalene-type epoxy resins, the diepoxide of the cycloaliphatic alcohol, hydrogenated bisphenol A (commercially available as Epalloy 5000), a difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride (commercially available as Epalloy 5200), Epicion EXA- 835LV, and the like, as well as mixtures of any two or more thereof.

[0056] In some embodiments, rubber or elastomer-modified epoxies may include, but are not limited to:(a) homopolymers or copolymers of conjugated dienes, as described in U.S. Pat. No. 4,020,036 (the contents of which are hereby incorporated by reference herein), having an average molecular weight from 10,000 to 800,000, in which conjugated dienes contain from 4-11 carbon atoms per molecule (e.g., 1 ,3-butadiene, isoprene, and the like);(b) epihalohydrin homopolymers, a copolymer of two or more epihalohydrin monomers, or a copolymer of an epihalohydrin monomer(s) with an oxide monomer(s), as described in U.S. Pat. No. 4,101 ,604 (the contents of which are hereby incorporated by reference herein), having an average molecular weight from 10,000 to 50,000;(c) hydrocarbon polymers including ethylene / propylene copolymers and copolymers of ethylene / propylene and at least one nonconjugated diene, such as ethylene / propylene / hexadiene / norbornadiene, as described in U.S. Pat. No. 4,161 ,471 (the contents of which are hereby incorporated by reference herein); and / or(d) Conjugated diene butyl elastomers, such as copolymers comprising from 85 to 99.5% by weight of a C4-C5 olefin combined with about 0.5 to 15% by weight of a conjugated multi-olefin having 4 to 14 carbon atoms, copolymers of isobutylene and isoprene where a major portion of the isoprene units combined therein have conjugated diene unsaturation (see, e.g., U.S. Pat. No. 4, 160,759, the contents of which are hereby incorporated by reference herein).2024P00033

[0057] In some embodiments, the binder resin comprises:

[0058] In some embodiments, the binder resin comprisesor2024P00033wherein n is the same as defined above.

[0059] In some embodiments, the present disclosure provides a composition comprising a first binder resin having an average molecular weight from 10,000 to 50,000 and a second binder resin having an average molecular weight from 200,000 to 800,000. In some embodiments, after the composition forms a B-stage film, the B-stage film comprises a lower layer that contains the first binder resin and an upper layer that contains the second binder resin.

[0060] In some embodiments, the first binder resin comprises a rubber or elastomer-modified epoxy functional group, such as, but not limited to, those described above.

[0061] In some embodiments, the first binder resin comprises an epoxidized carboxyl-term inated butadiene-acrylonitrile (CTBN) oligomer or polymer, such as, but not limited to, those described above.

[0062] Non-limiting examples of the first binder resin include epoxidized CTBN oligomers or polymers made from a carboxyl terminated butadiene / acrylonitrile copolymer, an epoxy resin, and bisphenol A, as described above; HyproTM EpoxyFunctional Butadiene-Acrylonitrile Polymers (formerly Hycar® ETBN), epoxy resins based on bisphenol A (e.g., Epon Resin 834), epoxy resins based on bisphenol F (e.g., RSL-1739), multifunctional epoxy resins based on phenol-novolac resin, dicyclopentadiene-type epoxy resins (e.g., Epicion HP-7200L), naphthalene-type epoxy resins, the diepoxide of the cycloaliphatic alcohol, hydrogenated bisphenol A2024P00033(commercially available as Epalloy 5000), a difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride (commercially available as Epalloy 5200), Epicion EXA- 835LV, Epicion HP-7200L, and the like, as well as mixtures of any two or more thereof.

[0063] In some embodiments, the second binder resin comprises an epoxidized polybutadiene diglycidylether oligomer or polymer, such as, but not limited to, those described above. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 85 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 75 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 70 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 65 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 60 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 55 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 50 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 45 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 40 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 35 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 30 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 25 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 10 wt. % to about 20 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 15 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 20 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 25 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging2024P00033 from about 30 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 35 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 40 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 45 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 50 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 55 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 60 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 65 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 70 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 75 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 80 wt. % to about 90 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 15 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 20 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 25 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 30 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 35 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 40 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 45 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 50 wt. % to about 80 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 55 wt. % to about 85 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 60 wt. % to about 85 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 65 wt. % to about 85 wt. %. In some embodiments, the binder resin is included in amounts ranging from about 70 wt. % to about 85 wt. %. In some2024P00033 embodiments, bind resin is included in about 10 wt. %, about 15 wt. %, about 20 wt. %, about 25 wt. %, about 30 wt. %, about 35 wt. %, about 40 wt. %, about 45 wt. %, about 50 wt. %, about 55 wt. %, about 60 wt. %, about 65 wt. %, about 70 wt. %, about 75 wt. %, about 80 wt. %, about 85 wt. %, or about 90 wt. %. In some embodiments, a composition comprising a first binder resin and second binder resin may be as described above (e.g., the first binder resin and the second binder resin may individually have the same wt.% amounts and ranges as above).

[0064] Compositions of the disclosure, as noted above, comprise a curing agent. Non-limiting examples of curing agents include ureas, aliphatic and aromatic amines, polyamides, imidazoles, dicyandiamides, hydrazides, urea-amine hybrid curing systems, free radical initiators, organic bases, transition metal catalysts, phenols, acid anhydrides, Lewis acids, Lewis bases, and combinations thereof. In some embodiments, the curing agent is an imidazole, a dicyandiamide, or a combination of one or more imidazoles and / or one or more dicyandiamides.

[0065] Compositions of the disclosure, as noted above, comprise an inorganic filler. In some embodiments, the filler is an electrically non-conductive filler, such as silicon dioxide. In some embodiments, the filler is (or comprises) silicon dioxide, calcium silicate, alumina, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, aluminum oxide (AI2O3), zinc oxide (ZnO), magnesium oxide (MgO), aluminum nitride (AIN), boron nitride (BN), a carbon nanotube, diamond, clay, aluminosilicate, and the like, as well as any combination thereof.

[0066] In some embodiments, the inorganic filler is an inorganic non-conductive filler comprising particles having a maximum particle size of 5 pm or less than 5 pm. For example, in some embodiments, the filler has a particle size in the from about 0.1 pm to about 5 pm or from 0.1 pm to 5 pm. In some embodiments, filler loadings are sufficient to meet underfill material requirements. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 1 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 1 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 5 wt.2024P00033% to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 10 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 15 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 20 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 25 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 30 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 35 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 40 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 45 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 50 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 55 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 60 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 65 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 70 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 75 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 80 wt. % to about 85 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 80 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 75 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 70 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 65 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 60 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 55 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 50 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 45 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about2024P0003340 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 35 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 30 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 25 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 20 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 15 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 10 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 5 wt. %. In some embodiments, fillers are included in an amount ranging from about 0.5 wt. % to about 1 wt. %.

[0067] Compositions of the disclosure, as noted above, comprise an adhesion promoter comprising an epoxy functionalized organosilane. As used herein, the term “adhesion promoter” refers to a compound that enhances the adhesive properties of the formulation to which they are introduced. Adhesion promoters can be organic or inorganic compounds and can include combinations thereof. Non-limiting examples of adhesion promoters include organo-zirconate compounds, organo-titanate compounds, and silane coupling agents. In some embodiments, the adhesion promoter is Z6040 from Dow.

[0068] In some embodiments, adhesion promoters are included in an amount ranging from about 0.1 wt. % to about 5 wt. %. In some embodiments, adhesion promoters are included in an amount ranging from about 0.1 wt. % to about 1 .0 wt. %. In some embodiments, adhesion promoters are included in an amount ranging from about 0.5 wt. % to about 1 .0 wt. %. In some embodiments, adhesion promoters are included in an amount ranging from about 0.5 wt. % to about 1 .5 wt. %. In some embodiments adhesion promoters are included in an amount ranging from about 1 wt. % to about 2 wt. %, about 2 wt. % to about 3 wt. %, about 3 wt. % to about 4 wt. %, or about 4 wt. % to about 5 wt. %.

[0069] Compositions of the disclosure, as noted above, include a thermosetting resin comprising an epoxy resin. The epoxy resin may be as described above.2024P00033

[0070] In some embodiments, the methods of preparing film comprise: applying a composition onto a substrate, the composition comprising from 10 to 90 wt. % of a binder resin, wherein the binder resin has an average molecular weight from 10,000 to 800,000, wherein the binder resin comprises a functionalized thermoplastic resin, and wherein the functionalized thermoplastic resin comprises an epoxy functional group, from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin, from 0.1 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane, from 0.5 to 85 wt.% of an inorganic filler, and from 0.5 to 20 wt.% of a curing agent, casting the composition into a film, and exposing the film to an elevated temperature to form a B-stage film.

[0071] In some embodiments, the methods of preparing a B-stage film comprise: casting a first composition into a first film onto a substrate, wherein the first composition comprises from 10 to 90 wt. % of a first binder resin, wherein the first binder resin has an average molecular weight from 10,000 to 50,000, and wherein the first binder resin comprises a first functionalized thermoplastic resin, casting a second composition into a second film, wherein the second composition comprises from 10 to 90 wt. % of a second binder resin, wherein the second binder resin has an average molecular weight from 200,000 to 800,000, and wherein the first binder resin and / or the second binder resin comprises an epoxy functional group, laminating the first film and the second film together to form a laminated film, laminating the laminated film onto the substrate, and exposing the laminated film to an elevated temperature to form a B-stage film, wherein the first composition and the second composition each further comprises from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin;2024P00033 from 0.5 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent.

[0072] In some embodiments, casting the first composition and the second composition into a film on the substrate and exposing the film to an elevated layer comprises: casting the first composition into a first film layer, casting the second composition into a second film layer, laminating the first film layer onto the substrate, laminating the second film layer onto the substrate, exposing the first and second film layers to an elevated temperature to from a B-stage film.

[0073] In the methods of preparing a B-stage film, the components of the compositions are those disclosed elsewhere herein and, optionally, are present in the amounts disclosed elsewhere herein. In the methods of preparing B-stage films, the B- stage films have the physical properties of B-stage films disclosed elsewhere herein.EXAMPLES

[0074] Exemplary embodiments of compositions according to the disclosure, including components thereof, are presented in Table 1.2024P00033Table 12024P00033

[0075] Properties of certain exemplary embodiments of B-stage films according to the disclosure are presented in Table 2.Table 2

[0076] The components of exemplary compositions according to the disclosure are presented in Table 1 , and properties of those compositions when formed into a B- stage film are presented in Table 2. Table 2 indicates that each B-stage film exhibits desirable properties that a conventional encapsulant paste lacks. For example, the melt viscosities at each temperature of 70 °C, 80°C, 90 °C, and 100 °C suggest a desirable2024P00033 material flowability and film forming capability for each B-stage film containing Composition A, B, or C.

[0077] Compositions A-C as seen in Tables 1 and 2 were applied to a single resistor device and formed into a B-stage film to encapsulate the single resistor device. The encapsulation testing results are summarized in Table 3 below.Table 3

[0078] As shown in Table 3, a B-stage film containing any of Compositions A-C exhibits a satisfactory flowability and full coverage of a top surface of a resistor.

[0079] The B-stage films presented in Table 2 were cured into cured films. The cured film derived from Composition A exhibited a Tg of 152 °C, a coefficient of thermal expansion of 93 ppm / °C below the Tg, and a coefficient of thermal expansion of 218 ppm / °C above the Tg. The cured film derived from Composition B exhibited a Tg of 162 °C, a coefficient of thermal expansion of 40 ppm / °C below the Tg, and a coefficient of thermal expansion of 120 ppm / °C above the Tg. The cured film derived from Composition C exhibited a Tg of 46 °C, a coefficient of thermal expansion of 58 ppm / °C below the Tg, and a coefficient of thermal expansion of 182 ppm / °C above the Tg.

[0080] Reference is now made to FIG. 1 , which presents a resistor encapsulated with an exemplary, B-stage film containing Composition A, consistent with embodiments of the present disclosure. FIG. 1 illustrates resistor 101 encapsulated with B-stage film2024P00033102. Line 103 represents an interface between B-stage film 102 and material 104 used to mount the sample for inspection. B-stage film 102 comprising composition A was prepared as described above and laminated onto resistor 101 using a vacuum laminator (MEIKI). The lamination was carried out at 50 °C, 10 seconds after vacuum exposure, and a 0.5 MPa pressure was applied to resistor 101 for 20 seconds. FIG. 1 illustrates that B-stage film 102 covers a top surface of resistor 101 and exhibits a Z-height 105 of about 70 microns and a film thickness of about 160 microns. In comparison, a conventional encapsulant paste normally exhibits a Z-height of around 300 microns. Therefore, B-stage film 102 in FIG. 1 exhibits a lower Z-height and may provide superior encapsulation than a conventional encapsulant paste.

[0081] Reference is now made to FIG. 2, which presents a resistor 201 encapsulated with an exemplary, B-stage film 202 containing Composition B, consistent with embodiments of the present disclosure. Line 203 represents an interface between B-stage film 202 and material 204 used to mount the sample for inspection. B-stage film 202 comprising composition B was prepared as described above and laminated onto resistor 201 using a vacuum laminator (MEIKI). The lamination was carried out at 50 °C, 40 seconds after vacuum exposure, and a 0.5 MPa pressure was applied to resistor 201 for 60 seconds. FIG. 2 illustrates that B-stage film 202 covers a top surface of resistor 201 and exhibits a Z-height 205 of 78.89 microns and a film thickness of about 240 microns. Therefore, B-stage film 202 in FIG. 2 exhibits a lower Z-height and may provide superior encapsulation than a conventional encapsulant paste.

[0082] Reference is now made to FIG. 3A and FIG. 3B, which present cross- sectional views of a resistor array encapsulated with an exemplary, aB-stage film containing Composition A and Composition C, consistent with some embodiments of the present disclosure. FIG. 3A illustrates a resistor array 301 comprising a plurality of resistors is completely encapsulated by B-stage film structure. FIG. 3B illustrates a zoomed-in view of resistor 302, resistor 303, and a gap 304 between resistor 302 and resistor 303. FIG. 3B illustrates that resistor 302 and resistor 303 are completely encapsulated with a B-stage film structure, wherein the B-stage film contains a first film layer 305 and a second film layer 306. First film layer 305 may be a B-stage film2024P00033 containing Composition A, and second film layer 306 may be a B-stage film containing Composition C. As seen in FIG. 3B, the B-stage film structure exhibits a Z-height 307 of 287 microns on resistor 302 and 303. Additionally, the top corners of resistor 302 and resistor 303 are encapsulated by 93 microns. By adjusting the thickness of first film layer 305 and second film layer 306, respectively, Z-height 307 may be further reduced without significantly affecting the top corner encapsulation. FIG. 3B also illustrates that gap 304 between resistor 302 and resistor 303 is filled by the B-stage film structure, and almost completely filled by first film layer 305. This result demonstrates that a B-stage film comprising a composition of the present disclosure encapsulates an electronic device and avoids the negative attributes associated with a conventional encapsulant paste.

[0083] Reference is now made to FIG. 4, which presents illustrations of exemplary arrangements for a B-stage cured film comprising compositions of the present disclosure. It is appreciated that FIG. 4 is for illustrative purposes only and should not be construed as limiting.

Claims

2024P00033CLAIMS1 . A composition comprising: from 10 to 90 wt. % of a binder resin, wherein the binder resin has an average molecular weight from 10,000 to 800,000, wherein the binder resin comprises a functionalized thermoplastic resin, and wherein the functionalized thermoplastic resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.1 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt.% of an inorganic filler; and from 0.5 to 20 wt.% of a curing agent; wherein after the composition forms a B-stage film, the B-stage film has a thickness from 10 to 250 microns; wherein the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C; and wherein the melt viscosity is measured by a DHR2 rheometer with a 5 °C / min ramping rate in N2.

2. The composition of claim 1 , wherein the binder resin comprises a modified rubber and wherein the binder resin has an average molecular weight from 10,000 to 50,000.

3. The composition of claim 1 , wherein the binder resin comprises an acrylic polymer and wherein the binder resin has an average molecular weight from 200,000 to 800,000.

4. The composition of any one of claims 1 to 3, wherein the epoxy functional group comprises bisphenol A, bisphenol F, phenol-novolac, dicyclopentadiene-type epoxy, naphthalene-type epoxy, or any combination thereof.

5. The composition of claim 4, wherein the epoxy functional group comprises diepoxide, hydrogenated bisphenol A, difunctional cycloaliphatic glycidyl ester of2024P00033 hexahydrophthallic anhydride, bisphenol F, dicyclopentadiene-type epoxy, or any combination thereof.

6. The composition of any one of claims 1 to 5, wherein the inorganic filler comprises silicon dioxide, calcium silicate, alumina, aluminum nitride (AIN), aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, zinc oxide, magnesium oxide, boron nitride, a carbon nanotube, diamond, clay, aluminosilicate, or any combination thereof.

7. The composition of any one of claims 1 to 6, wherein, after the composition forms a B-stage film, the B-stage film has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from 4,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C.

8. The composition of any one of claims 1 to 7, wherein, after the composition forms a B-stage film, the B-stage film has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C.

9. The composition of any one of claims 1 to 8, wherein the binder resin has an average molecular weight from 400,000 to 800,000.

10. The composition of any one of claims 1 to 8, wherein the binder resin comprises an epoxidized carboxyl-term inated butadiene-acrylonitrile (CTBN) oligomer or polymer.11 . The composition of claim 10, wherein the epoxidized CTBN oligomer or polymer is an epoxy-containing derivative of an oligomeric or polymeric precursor having the structure:HOOC[(Bu)x(ACN)y]mCOOH wherein: each Bu is a butylene moiety; each ACN is an acrylonitrile moiety; the Bu units and the ACN units can be arranged randomly or in blocks; each of x and y are greater than zero, provided the total of x+y = 1 ; a ratio of x:y is from about 10:1 to 1 : 10; and m is from about 20 to about 100.2024P0003312. The composition of any one of claims 1 to 11 , wherein the B-stage film has a softening temperature of less than or equal to 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.

13. The composition of claim 12, wherein the B-stage film has a softening temperature of less than or equal to 25 °C.

14. The composition of any one of claims 1 to 13, wherein the B-stage film has a DMA modulus, at room temperature, from 350 GPa to 2,000 GPa.

15. The composition of any one of claims 1 to 14, wherein after the composition forms a B-stage film, the B-stage film has a tensile elongation at room temperature of >300% before break, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.

16. A composition comprising: from 10 to 90 wt. % of a first binder resin and a second binder resin; wherein the first binder resin has an average molecular weight from 10,000 to 50,000; wherein the first binder resin comprises a first functionalized thermoplastic resin; wherein the second binder resin has an average molecular weight from 200,000 to 800,000; wherein the second binder resin comprises a second functionalized thermoplastic resin; and wherein the first binder resin and / or the second binder resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.5 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent; wherein after the composition forms a B-stage film, the B-stage film has a thickness from 10 to 250 microns;2024P00033 wherein the B-stage film has a melt viscosity from 1 ,000 Pa s to 45,000 Pa s at 70 °C, from 500 Pa s to 32,000 Pa s at 80 °C, from 100 Pa s to 25,000 Pa s at 90 °C, and / or from 10 Pa s to 20,000 Pa s at 100 °C; and wherein the melt viscosity is measured by a DHR2 rheometer with a 5 °C / min ramping rate in N2.

17. The composition of claim 16, wherein the first binder resin comprises a rubber or elastomer-modified epoxy functional group.

18. The composition of claim 16, wherein the first binder resin or the second binder resin comprises an acrylic polymer.

19. The composition of any one of claims 16 to 18, wherein the epoxy functional group comprises bisphenol A, bisphenol F, phenol-novolac, dicyclopentadiene-type epoxy, naphthalene-type epoxy, or any combination thereof.

20. The composition of claim 19, wherein the epoxy functional group comprises diepoxide, hydrogenated bisphenol A, difunctional cycloaliphatic glycidyl ester of hexahydrophthallic anhydride, bisphenol F, dicyclopentadiene-type epoxy, or any combination thereof.21 . The composition of any one of claims 16 to 20, wherein the inorganic filler comprises silicon dioxide, calcium silicate, alumina, aluminum nitride (AIN), aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, zinc oxide, magnesium oxide, boron nitride, a carbon nanotube, diamond, clay, aluminosilicate, or any combination thereof.

22. The composition of any one of claims 16 to 21 , wherein, after the composition forms the B-stage film, the B-stage film comprises two or more layers.

23. The composition of claim 22, wherein, after the composition forms a B-stage film comprising two or more layers, the B-stage film comprises an upper layer and a lower layer, wherein: the lower layer comprises the first binder resin; and the upper layer comprises the second binder resin.

24. The composition of claim 23, wherein, after the composition forms the B-stage film, the upper layer has a melt viscosity from 10,000 Pa s to 45,000 Pa s at 70 °C, from2024P000334,000 Pa s to 32,000 Pa s at 80 °C, from 3,000 Pa s to 25,000 Pa s at 90 °C, and / or from 2,000 Pa s to 20,000 Pa s at 100 °C.

25. The composition of claim 23 or 24, wherein, after the composition forms the B- stage film, the lower layer has a melt viscosity from 1 ,000 Pa s to 8,000 Pa s at 70 °C, from 500 Pa s to 5,000 Pa s at 80 °C, from 100 Pa s to 2,000 Pa s at 90 °C, and / or from 10 Pa s to 1 ,000 Pa s at 100 °C.

26. The composition of claim 23 or 24, wherein, after the composition forms the B- stage film, the lower layer has a melt viscosity from 1 ,000 Pa s to 6,000 Pa s at 70 °C, from 1 ,500 Pa s to 2,000 Pa s at 80 °C, from 100 Pa s to 1 ,000 Pa s at 90 °C, and / or from 10 Pa s to 500 Pa s at 100 °C.

27. The composition of any one of claims 16 to 26, wherein the first binder resin comprises an epoxidized carboxyl-term inated butadiene-acrylonitrile (CTBN) oligomer or polymer.

28. The composition of claim 27, wherein the epoxidized CTBN oligomer or polymer is an epoxy-containing derivative of an oligomeric or polymeric precursor having the structure:HOOC[(Bu)x(ACN)y]mCOOH wherein: each Bu is a butylene moiety; each ACN is an acrylonitrile moiety; the Bu units and the ACN units can be arranged randomly or in blocks; each of x and y are greater than zero, provided the total of x+y = 1 ; a ratio of x:y is from about 10:1 to 1 : 10; and m is from about 20 to about 100.

29. The composition of any one of claims 16 to 28, wherein the second binder resin has an average molecular weight from 400,000 to 800,000.

30. The composition of any one of claims 16 to 29, wherein the second binder resin comprises an acrylic ester-based polymer that has an average molecular weight from 300,000 to 800,000.2024P0003331 . The composition of any one of claims 16 to 30, wherein the B-stage film has a softening temperature of less than or equal to 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.

32. The composition of claim 31 , wherein the B-stage film has a softening temperature of less than or equal to 25 °C.

33. The composition of any one of claims 16 to 32, wherein the B-stage film has a DMA modulus, at room temperature, from 350 GPa to 2,000 GPa.

34. The composition of any one of claims 16 to 33, wherein after the composition forms a B-stage film, the B-stage film has a tensile film elongation at room temperature of >300% before break, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.

35. A method of preparing a film on a substrate, the method comprising: applying a composition onto the substrate, the composition comprising: from 10 to 90 wt. % of a binder resin, wherein the binder resin has an average molecular weight from 10,000 to 800,000, wherein the binder resin comprises a functionalized thermoplastic resin, and wherein the functionalized thermoplastic resin comprises an epoxy functional group; from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.1 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent; casting the composition into a film; and exposing the film to an elevated temperature to form a B-stage film.

36. A method of preparing a film onto a substrate, the method comprising: casting a first composition into a first film onto a substrate, the first composition comprising:2024P00033 from 10 to 90 wt. % of a first binder resin, wherein the first binder resin has an average molecular weight from 10,000 to 50,000, and wherein the first binder resin comprises a first functionalized thermoplastic resin; casting a second composition into a second film, wherein the second composition comprises: from 10 to 90 wt. % of a second binder resin, wherein the second binder resin has an average molecular weight from 200,000 to 800,000, and wherein the first binder resin and / or the second binder resin comprises an epoxy functional group; laminating the first film and the second film together to form a laminated film; laminating the laminated film onto the substrate; and exposing the film to an elevated temperature to form a B-stage film; wherein the first composition and the second composition each further comprises: from 0.1 to 50 wt. % of a thermosetting resin comprising an epoxy resin; from 0.5 to 5 wt. % of an adhesion promoter comprising an epoxy functionalized organosilane; from 0.5 to 85 wt. % of an inorganic filler; and from 0.5 to 20 wt. % of a curing agent.

37. The method of claim 36, wherein the B-stage film comprises a first film layer and a second film layer.

38. The method of claim 37, wherein the first film layer comprises the first composition and the second film layer comprises the second composition.

39. The method of any one of claims 35 to 38, wherein the B-stage film has a thickness from 10 to 250 microns.

40. The method of any one of claims 35 to 39, wherein the B-stage film on the substrate has a Z-height from 10 pm to 200 pm.2024P0003341 . The method of claim 39 or 40, wherein the thickness and Z-height vary by + / - 10%.

42. The method of any one of claims 35 to 41 , wherein the B-stage film has a softening point temperature below 50 °C, and wherein the softening point temperature is measured by dynamic mechanical analysis (DMA) at a ramp rate of 5.0 °C / min, starting at -85 °C and rising to 300 °C.

43. The method of any one of claims 35 to 42, wherein the B-stage film has a tensile elongation above 300% at room temperature, and wherein the tensile elongation is measured by an Instron tensile stress-strain test carried out at a pulling speed of 5 mm / min at room temperature.

44. The composition of any one of claims 1 to 15, wherein after the B-stage film is cured to form a cured film, the cured film on the substrate has a Z-height from 10 pm to 200 pm.

45. The composition of any one of claims 1 to 15 or 44, wherein after the B-stage film is cured to form a cured film, the cured film thickness and Z-height vary by + / - 10%.

46. The composition of any one of claims 16 to 34, wherein after the B-stage film is cured to form a cured film, the cured film on the substrate has a Z-height from 10 pm to 200 pm.

47. The composition of any one of claims 16 to 34 or 46, wherein after the B-stage film is cured to form a cured film, the cured film thickness and Z-height vary by + / - 10%.

Images