Vertical heating assembly, electronic atomizer and electronic atomization device

Abstract

The present application belongs to the technical field of electronic atomization. Disclosed are a vertical heating assembly, an electronic atomizer and an electronic atomization device. The heating assembly is vertically arranged in an electronic atomizer, and comprises a plate-shaped base and a heating element, wherein the direction of the thickness of the base intersects the direction of the depth of a liquid storage cavity of the electronic atomizer; the base has a liquid absorption surface and an atomization surface that are arranged by facing away from each other in the direction of the thickness of the base; the heating element is disposed on the atomization surface; the base is provided with a plurality of liquid guide through holes that run through same in the direction of the thickness thereof; and the liquid guide through holes bring the liquid storage cavity into communication with the heating element, and are configured to guide an atomization substrate from the liquid storage cavity, via the liquid absorption surface to the atomization surface, such that the atomization substrate is heated by the heating element, and in the direction from the bottom of the liquid storage cavity to the top thereof in the direction of the depth thereof, the diameters of adjacent liquid guide through holes are gradually increased.

Description

Vertical heating assembly, electronic atomizer and electronic atomization device

[0001] The present application claims priority to the Chinese patent application No. 202411284831.6, filed on September 12, 2024, and entitled "Vertical heating assembly, electronic atomizer and electronic atomization device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic atomization, in particular to a vertical heating assembly, an electronic atomizer and an electronic atomization device. BACKGROUND

[0003] Atomization technology is a process of changing liquid into aerosol by heating atomization. An electronic atomizer includes a liquid storage cavity and a heating assembly. The liquid storage cavity stores an atomization substrate, such as a flavor liquid. The heating assembly is in communication with the liquid in the liquid storage cavity. The atomization substrate is adsorbed on the surface of the heating assembly, and the heating of the heating assembly realizes the atomization of the liquid.

[0004] Compared with a cylindrical structure of the heating assembly, the installation of the heating assembly with a flat plate structure is more flexible. However, the design of the heating assembly with a flat plate structure often ignores the influence of gravity on liquid supply. The uneven supply of liquid from top to bottom will lead to inconsistent atomization effect, thereby affecting the user experience.

[0005] SUMMARY

[0006] The present application provides a vertical heating assembly, an electronic atomizer and an electronic atomization device to solve the problem of inconsistent atomization effect caused by uneven supply of liquid from top to bottom of the heating assembly.

[0007] In a first aspect, the present application discloses a vertical heating assembly, which is arranged in an electronic atomizer in a vertical manner. The heating assembly includes a plate-shaped base body and a heating element. The thickness direction of the base body intersects with the depth direction of the liquid storage cavity of the electronic atomizer. The base body has a liquid absorption surface and an atomization surface arranged opposite to each other in the thickness direction. The heating element is arranged on the atomization surface. The base body is provided with a plurality of liquid guide through holes penetrating through the thickness direction. The liquid guide through holes communicate the liquid storage cavity and the heating element. The liquid guide through holes are used to guide the atomization substrate from the liquid storage cavity to the atomization surface through the liquid absorption surface for heating by the heating element. In the direction from the bottom to the top of the depth direction of the liquid storage cavity, the hole diameter of adjacent liquid guide through holes gradually increases.

[0008] In an embodiment, the substrate is further defined with a first extending direction and a second extending direction, the thickness direction, the first extending direction and the second extending direction are perpendicular to each other, the first extending direction is parallel to the depth direction of the liquid storage cavity; the hole spacing in the first extending direction is a first hole spacing, and the hole spacing in the second extending direction is a second hole spacing; along the direction from the bottom to the top of the depth direction of the liquid storage cavity, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

[0009] In an embodiment, the substrate is further defined with a first extending direction and a second extending direction, the thickness direction, the first extending direction and the second extending direction are perpendicular to each other, the first extending direction is parallel to the depth direction of the liquid storage cavity; a plurality of the liquid guiding through holes are arranged in multiple rows, and the row direction is parallel to the second extending direction, the hole diameter of each of the liquid guiding through holes in the same row is the same, and along the direction from the bottom to the top of the depth direction of the liquid storage cavity, the hole diameter of the liquid guiding through holes of each row gradually increases.

[0010] In an embodiment, the spacing of adjacent rows in the first extending direction is a first hole spacing, the spacing of adjacent liquid guiding through holes in the same row is a second hole spacing, and the second hole spacing in the same row is the same; along the direction from the bottom to the top of the depth direction of the liquid storage cavity, the first hole spacing and the second hole spacing gradually increase; the liquid guiding through holes of adjacent two rows are arranged in a staggered manner in the first extending direction.

[0011] In an embodiment, the hole diameter of each of the liquid guiding through holes ranges from 10 to 120 microns.

[0012] In an embodiment, the substrate includes an intrinsic silicon substrate, the heating element is a doped conductive silicon substrate, and the intrinsic silicon substrate has a receiving groove on the atomization surface, and the conductive silicon substrate is embedded in the receiving groove.

[0013] In an embodiment, the substrate includes an intrinsic silicon substrate, and the heating element is a conductive silicon layer formed by doping on the atomization surface of the intrinsic silicon substrate.

[0014] In an embodiment, the substrate further includes a bonding substrate, the bonding substrate is made of glass, ceramic or quartz sheet; the bonding substrate is arranged on the surface of the intrinsic silicon substrate away from the heating element; the intrinsic silicon substrate is provided with a plurality of first liquid guiding holes, and the bonding substrate is provided with a plurality of second liquid guiding holes aligned with the plurality of first liquid guiding holes one by one, and a first liquid guiding hole and a second liquid guiding hole aligned with each other together constitute the liquid guiding through hole.

[0015] In a second aspect, the electronic atomizer is disclosed, which comprises a liquid storage cavity, an airflow channel and a heating assembly; the liquid storage cavity is used for storing an atomization substrate; the airflow channel extends along the depth direction of the liquid storage cavity; the heating assembly adopts the vertical heating assembly of the first aspect, and the heating assembly is arranged in the electronic atomizer in a vertical manner, and the thickness direction of the substrate intersects with the depth direction of the liquid storage cavity.

[0016] In an embodiment, the atomization surface is arranged in parallel with the axial direction of the airflow channel.

[0017] In an embodiment, the atomization surface is arranged in an inclined manner with respect to the axial direction of the airflow channel, and the axis of the liquid guiding through hole is arranged in an inclined manner with respect to the radial direction of the airflow channel.

[0018] In a third aspect, the electronic atomization device is disclosed, which comprises a power supply device and the electronic atomizer of the second aspect, and the power supply device is connected with the electronic atomizer.

[0019] The electronic atomization device provided by the application has the following beneficial effects:

[0020] The vertical heating assembly, the electronic atomizer and the electronic atomization device having the electronic atomizer provided by the application are different from the cylindrical heating assembly, the heating assembly is in a plate-shaped structure, and is arranged in the electronic atomizer in a vertical manner, the heating element generates heat and transmits the heat to the substrate, the atomization substrate is guided from the substrate to the position of the heating element through the capillary action of the liquid guiding through hole for atomization, so that the atomization gas such as aerosol is generated, and the aerosol is sprayed from the liquid guiding through hole for the user to inhale. Affected by the gravity of the atomization substrate itself, the atomization substrate in the liquid storage cavity is more likely to enter the liquid guiding through hole close to the bottom of the substrate, and in the application, the hole diameter of the adjacent liquid guiding through hole gradually increases along the direction from the bottom to the top of the depth direction of the liquid storage cavity. Through the gradient design of the hole diameter of the liquid guiding through hole, the consistency of the liquid supply on the substrate is increased, and the problem of uneven liquid supply on the substrate caused by the consistent hole diameter of the liquid guiding through hole in the related art is solved.

[0021] The above description is only a summary of the technical solutions of the application, in order to more clearly understand the technical means of the application, the specific embodiments of the application can be implemented according to the content of the description, and in order to make the above and other purposes, characteristics and advantages of the application more obvious and easy to understand, the following specific embodiments of the application are described. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0023] Fig. 1 is a perspective structural schematic view of an embodiment of the electronic atomizer provided by the present application;

[0024] Fig. 2 is a schematic view of the section A-A in Fig. 1;

[0025] Fig. 3 is a schematic view of the section B-B in Fig. 1;

[0026] Fig. 4 is a perspective structural schematic view of an embodiment of the heating assembly in the electronic atomizer provided by the present application;

[0027] Fig. 5 is a front view of the heating assembly in Fig. 4;

[0028] Fig. 6A is a schematic view of the exploded structure of an embodiment of the heating assembly in Fig. 4;

[0029] Fig. 6B is a schematic view of the exploded structure of another embodiment of the heating assembly in Fig. 4;

[0030] Fig. 7 is a structural schematic view of another embodiment of the electronic atomizer provided by the present application;

[0031] Fig. 8 is a perspective structural schematic view of yet another embodiment of the heating assembly in the electronic atomizer in Fig. 7;

[0032] Fig. 9 is a sectional view of the base body in the heating assembly in Fig. 8 along the axial direction of the electronic atomizer;

[0033] Fig. 10 is a simulation diagram of aerosol migration;

[0034] Fig. 11 is a perspective structural schematic view of still another embodiment of the heating assembly 100 in the electronic atomizer provided by the present application;

[0035] Fig. 12 is a schematic view of the exploded structure of the heating assembly in Fig. 11.

[0036] Explanation of reference signs:

[0037] Electronic atomizer 10; heating assembly 100; base body 110; accommodating groove 1100; liquid guiding through hole 111; liquid suction surface 110a; atomization surface 110b; intrinsic silicon substrate 112; first liquid guiding hole 1120; bonding substrate 113; second liquid guiding hole 1130; heating element 120; first electrode 131; second electrode 132; first end 11; second end 12; suction nozzle 13; shell 14; liquid storage cavity 200; liquid lower cavity 201; airflow channel 300; axial direction R1; axial direction R2; degree direction T; first extension direction E1; second extension direction E2. Specific embodiments

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0039] The present application provides a vertical heating assembly, which is arranged in an electronic atomizer in a vertical manner. Based on the heating assembly provided by the present application, the present application further provides an electronic atomizer. In some embodiments, referring to FIGS. 1 to 3, FIG. 1 is a perspective structural schematic view of an embodiment of the electronic atomizer provided by the present application, FIG. 2 is a schematic view of the A-A cross section in FIG. 1, and FIG. 3 is a schematic view of the B-B cross section in FIG. 1. The electronic atomizer 10 includes a liquid storage cavity 200, an airflow channel 300, and a heating assembly 100.

[0040] The liquid storage cavity 200 is used for storing an atomization substrate. The atomization substrate can be a flavor liquid. After being heated and atomized, the atomization substrate can generate flavor substances, such as aerosols, for a user to inhale. Specifically, the electronic atomizer 10 includes a shell 14, and the liquid storage cavity 200 is arranged in the shell 14.

[0041] The airflow passage 300 extends along the depth direction of the liquid storage cavity 200. In the field of electronic atomizers, the depth direction of the liquid storage cavity 200 is usually the axial direction R1 of the electronic atomizer 10. For the convenience of description, the axial direction R1 of the electronic atomizer 10 is uniformly referred to below. When a user inhales, airflow is generated in the airflow passage 300, and aerosol generated after the atomized substrate is heated and atomized can combine with the airflow in the airflow passage 300, thereby being inhaled by the user. Specifically, the airflow passage 300 can be located on the inner side of the liquid storage cavity 200. For example, the liquid storage cavity 200 can be an annular cavity, and the liquid storage cavity 200 is arranged around the airflow passage 300. Moreover, the central axis of the airflow passage 300 coincides with or is parallel to the central axis of the liquid storage cavity 200. FIGS. 2 and 3 show a case where the central axis of the airflow passage 300 coincides with the central axis of the liquid storage cavity 200. Of course, the relative positional relationship between the airflow passage 300 and the liquid storage cavity 200 is not limited to this, and FIGS. 2 and 3 are merely an example. The airflow passage 300 can also be located on the outer side of the liquid storage cavity 200.

[0042] The heating assembly 100 is used to convert the atomized substrate into aerosol. The heating assembly 100 provided in the embodiments of the present application can be a heating assembly based on a micro-electro-mechanical system (MEMS). MEMS is based on microelectronics, micro-mechanics and material science to research, design and manufacture micro devices with specific functions, including micro structure devices, micro sensors, micro actuators, micro mechanical optical devices and micro systems. The MEMS processing technology is developed on the basis of traditional microelectronic processing technology (also known as integrated circuit IC technology), and some unique technologies for manufacturing micro-mechanics are developed. These unique technologies and conventional integrated circuit technology are combined to realize MEMS, which are collectively referred to as micro-machining technology. The heating assembly 100 of the present application is manufactured based on the MEMS technology, is miniaturized, has a small volume, and can rapidly increase the temperature.

[0043] Please refer to FIGS. 4 to 6B. FIG. 4 is a perspective structural schematic view of an embodiment of the heating assembly 100 in the electronic atomizer 10 provided in the present application. FIG. 5 is a front view of the heating assembly 100 of FIG. 4. FIG. 6A is a split structural schematic view of an embodiment of the heating assembly 100 of FIG. 4. FIG. 6B is a split structural schematic view of another embodiment of the heating assembly 100 of FIG. 4. The heating assembly 100 includes a substrate 110 and a heating element 120. The substrate 110 can adopt a dense substrate, for example, a silicon, glass, ceramic or quartz sheet or the like.

[0044] The base body 110 defines a thickness direction T, and the thickness direction T of the base body 110 intersects the axial direction R1 of the electronic atomizer 10. The meaning that the thickness direction T of the base body 110 intersects the axial direction R1 of the electronic atomizer 10 is that the thickness direction T of the base body 110 and the axial direction R1 of the electronic atomizer 10 are not parallel, but have an included angle greater than zero, for example, the thickness direction T of the base body 110 and the axial direction R1 of the electronic atomizer 10 can be perpendicular to each other, and the following is described by taking the thickness direction T of the base body 110 and the axial direction R1 of the electronic atomizer 10 as perpendicular.

[0045] The base body 110 has a liquid absorption surface 110a and an atomization surface 110b arranged opposite in the thickness direction T, the heating element 120 is arranged on the atomization surface 110b, and the base body 110 is provided with a plurality of liquid guiding through holes 111, which can be circular holes. The liquid guiding through holes 111 communicate the liquid storage cavity 200 and the heating element 120, and are used to guide the atomization substrate from the liquid storage cavity 200 to the atomization surface 110b through the liquid absorption surface 110a for heating by the heating element 120. Therefore, the function of the base body 110 in the heating assembly 100 is mainly to absorb and guide the atomization substrate in the liquid storage cavity 200. The liquid guiding through holes 111 are micropores with a pore size of microns, which can absorb the atomization substrate in the liquid storage cavity 200 into the inside of the base body 110 through capillary action and guide it to the atomization surface 110b of the base body 110.

[0046] The shell 14 can also be provided with a lower liquid cavity 201, and the atomization substrate in the liquid storage cavity 200 can flow into the lower liquid cavity 201 to be absorbed by the base body 110.

[0047] The heating element 120 is arranged on the atomization surface 110b, which means that the heating element 120 and the base body 110 are independent components, and the heating element 120 is connected to the atomization surface 110b of the base body 110 (as shown in FIG. 6A), or the base body 110 has an electrically conductive heating capability at least part of the atomization surface 110b to serve as the heating element 120 (as shown in FIG. 6B), and the heating element 120 is used to heat the atomization substrate guided to the atomization surface 110b. The heating element can be powered by a power supply device, and when the heating element 120 is powered on, the heating element 120 generates heat by itself, and the atomization substrate is guided from the base body 110 to the position of the heating element 120 by the capillary action of the liquid guiding through holes 111 for atomization.

[0048] The hole diameter of the adjacent liquid guiding through hole 111 gradually increases along the direction from the bottom to the top of the depth direction of the liquid storage cavity 200. Generally, the electronic atomizer 10 has opposite first and second ends 11 and 12 along the axial direction R1 of the electronic atomizer 10, and the first end 11 has a suction nozzle 13 for a user to perform a suction action, the suction nozzle 13 can be in communication with the airflow passage 300, the bottom of the depth direction of the liquid storage cavity 200 is the end of the liquid storage cavity 200 close to the second end 12, the top of the depth direction of the liquid storage cavity 200 is the end of the liquid storage cavity 200 close to the first end 11, and the direction from the bottom to the top of the depth direction of the liquid storage cavity 200 is the direction from the second end 12 to the first end 11. When using the electronic atomizer 10 of the present application, generally, the first end 11 of the electronic atomizer 10 of the present application faces upward, and the second end 12 faces downward, so the gravity of the atomized substrate at different positions in the electronic atomizer 10 is also different, the gravity is smaller near the first end 11 of the electronic atomizer 10, and the gravity is larger near the second end 12 of the electronic atomizer 10.

[0049] In the related art, the hole diameters of the liquid guiding through holes 111 of the heating assembly 100 are mostly uniform, and in actual use, especially when the heating assembly 100 is placed vertically, that is, the heating assembly 100 is placed parallel to the axial direction R1 of the electronic atomizer 10, the lower hole positions not only supply liquid due to capillary action, but also are affected by gravity, so that the lower liquid supply is more sufficient, resulting in a difference between the upper and lower liquid supplies. This design can easily lead to insufficient liquid supply at the upper part, thereby affecting the stability of the entire atomization process.

[0050] The hole diameters of the liquid guiding through holes 111 are designed to be gradient distributed, and the hole diameters of the liquid guiding through holes 111 are gradient distributed in a large upper and small lower direction along the direction from the bottom to the top of the depth direction of the liquid storage cavity 200, which can solve the problem of uneven upper and lower liquid supply caused by the uniform upper and lower hole diameters of the liquid guiding through holes 111 on the substrate 110 in the related art.

[0051] Specific analysis is as follows:

[0052] The base body 110 absorbs the atomized substrate into the base body 110 through the capillary action of each liquid guiding through hole 111. When the hole diameters of the liquid guiding through holes 111 of the base body 110 are the same from top to bottom, for the lower liquid guiding through holes 111, i.e., the liquid guiding through holes 111 close to the second end 12, the atomized substrate is more likely to enter the lower liquid guiding through holes 111 under the action of the gravity of the atomized substrate itself, so that the liquid supply of the lower liquid guiding through holes 111 is sufficient, while the liquid supply of the upper liquid guiding through holes 111, i.e., the liquid guiding through holes 111 close to the first end 11, is insufficient, which affects the stability of the entire atomization process. When the hole diameters of the liquid guiding through holes 111 are increased under the condition that the gravity of the atomized substrate itself is the same, the liquid supply capacity of the liquid guiding through holes 111 is increased, so that the hole diameters of the liquid guiding through holes 111 of the base body 110 are set to be distributed in a gradient from large at the top to small at the bottom, which solves the problem of uneven liquid supply from top to bottom caused by the same hole diameters of the liquid guiding through holes 111 of the base body 110 in the related art, and ensures uniform liquid supply from top to bottom of the heating assembly 100, so that the atomization process is more stable.

[0053] Further, the hole diameters of the liquid guiding through holes 111 on the base body 110 range from 10 to 120 microns, i.e., along the direction from the second end 12 to the first end 11, the hole diameters of the liquid guiding through holes 111 gradually increase from 10 microns to 120 microns.

[0054] In addition to the liquid guiding effect of the liquid guiding through holes 111 on the atomized substrate through the capillary action, the liquid guiding through holes 111 also have another important function of liquid locking. The meniscus formed by the liquid surface tension at the edge of the liquid guiding through hole 111 is the key force for locking the atomized substrate, so theoretically, the smaller the hole diameter of the liquid guiding through hole 111, the stronger the liquid locking capacity and the capillary action, and the stronger the capillary action, the more difficult the gas exchange, and the smaller the hole diameter, the lower the liquid supply capacity. Therefore, in some embodiments, on the one hand, the minimum hole diameter of the liquid guiding through hole 111 is required to be small enough to enhance the liquid locking capacity, and on the other hand, the hole diameter of the liquid guiding through hole 111 is required not to be too small to affect the liquid supply capacity and the gas exchange efficiency. Therefore, in this embodiment, the minimum hole diameter of the lower liquid guiding through hole 111 is set to 10 microns, so that the lower liquid guiding through hole 111 of the base body 110 can achieve a relatively strong liquid locking capacity to avoid liquid leakage, and can also maintain sufficient liquid supply, and the maximum hole diameter of the upper liquid guiding through hole 111 is set to 120 microns to ensure sufficient liquid supply of the upper liquid guiding through hole 111 and the gas exchange efficiency, and also to avoid insufficient capillary action due to the too large hole diameter to affect the transportation of the atomized substrate in the liquid guiding through hole 111.

[0055] The pore size of each liquid guiding through hole 111 on the base body 110 is set to a range of 10-120 microns, and the pore size of each liquid guiding through hole 111 on the base body 110 is in a gradient distribution of large at the top and small at the bottom, which ensures the uniformity of the up and down liquid supply, and ensures that the lower small hole can lock the atomized substrate to avoid liquid leakage, and the upper large hole improves the gas exchange efficiency. The gradient design of the pore size of each liquid guiding through hole 111 of the base body 110 in this embodiment adjusts the capillary force, so that the base body 110 can not only maintain sufficient liquid supply, but also avoid the problem of difficult gas exchange caused by excessive capillary force.

[0056] In the related art, when the same pore size is used for each liquid guiding through hole 111 on the base body 110, in order to ensure the liquid supply capacity and gas exchange efficiency, the pore size of the liquid guiding through hole 111 is usually set to about 35 microns, and the hole spacing is about twice the pore size. However, in this application, the pore size of each liquid guiding through hole 111 on the base body 110 gradually increases from 10 microns to 120 microns in the direction from the second end 12 to the first end 11. The minimum pore size of the lower liquid guiding through hole 111 is smaller than the same pore size of 35 microns in the related art, and the maximum pore size of the upper liquid guiding through hole 111 is larger than the same pore size of 35 microns in the related art. Therefore, the problem of liquid leakage of the lower liquid guiding through hole 111 can be avoided, and the upper liquid guiding through hole 111 can also improve the gas exchange efficiency. The overall liquid supply of the base body 110 is more sufficient, and the gas exchange efficiency is higher.

[0057] In some embodiments, the base body 110 is also defined with a first extension direction E1 and a second extension direction E2, the thickness direction T, the first extension direction E1 and the second extension direction E2 are perpendicular to each other, and the first extension direction E1 is parallel to the axial direction R1 of the electronic atomizer 10; the hole spacing in the first extension direction E1 is the first hole spacing, and the hole spacing in the second extension direction E2 is the second hole spacing; in the direction from the second end 12 to the first end 11, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

[0058] In some embodiments, the first hole spacing and / or the second hole spacing between the liquid guiding through holes 111 with larger pore sizes are also larger, which avoids the problem of uneven liquid supply caused by too large porosity difference between the large-pore and small-pore areas of the base body 110. Therefore, the liquid supply uniformity of the base body 110 can be further increased. In some embodiments, each liquid guiding through hole 111 on the base body 110 can be distributed in rows or not in rows, as long as the pore size of each liquid guiding through hole 111 on the base body 110 gradually increases in the direction from the second end 12 to the first end 11.

[0059] In some embodiments, the base body 110 further defines a first extension direction E1 and a second extension direction E2, the thickness direction T, the first extension direction E1 and the second extension direction E2 are perpendicular to each other, and the first extension direction E1 is parallel to the axial direction R1 of the electronic atomizer 10; the plurality of liquid guiding through holes 111 are arranged in multiple rows, and the row direction is parallel to the second extension direction E2; the hole diameters of the liquid guiding through holes 111 in the same row are the same; and the hole diameters of the liquid guiding through holes 111 in each row gradually increase in the direction from the second end 12 to the first end 11. FIGS. 4 and 5 show the arrangement of the liquid guiding through holes 111 on the base body 110.

[0060] In some embodiments, the liquid guiding through holes 111 on the base body 110 are arranged in rows, and it can be understood that in other embodiments, the liquid guiding through holes 111 on the base body 110 can also not be arranged in rows. In addition, the present embodiment can ensure that the liquid supply capacity at each position in the same row remains consistent, and the gradient distribution of the hole diameters in the upper and lower directions makes the liquid supply uniform in the upper and lower directions, so that the liquid supply capacity of the base body 110 on the entire atomization surface 110b remains consistent.

[0061] Further, the spacing between adjacent rows in the first extension direction E1 is a first hole spacing, the spacing between adjacent liquid guiding through holes 111 in the same row is a second hole spacing, and the second hole spacing in the same row is the same; the first hole spacing and the second hole spacing gradually increase in the direction from the second end 12 to the first end 11; and the liquid guiding through holes 111 of adjacent two rows are at least partially misaligned in the first extension direction E1.

[0062] In some embodiments, the liquid guiding through holes 111 are arranged in rows and not arranged in columns, so that the first hole spacing / second hole spacing between the liquid guiding through holes 111 with large hole diameters is larger, and the first hole spacing / second hole spacing between the liquid guiding through holes 111 with small hole diameters is smaller, thereby maintaining the uniformity of the liquid supply of the base body 110. It can be understood that in other embodiments, the first hole spacing and the second hole spacing can remain consistent, but it can be understood that the first hole spacing and the second hole spacing gradually increase in the direction from the second end 12 to the first end 11, and compared to the case where the first hole spacing and the second hole spacing remain consistent, the liquid supply capacity of the base body 110 on the entire atomization surface 110b is more consistent.

[0063] In some embodiments, in the first extension direction E1, the first hole spacing gradually increases from 20 microns to 100 microns in the direction from the second end 12 to the first end 11; and in the second extension direction E2, the second hole spacing can be set to a value between one time and two times the hole diameter.

[0064] In the present application, the structure of the base body 110 can be various, and the arrangement of the base body 110 relative to the axial direction R1 of the electronic atomizer 10 can also be various, which will be specifically introduced below.

[0065] Please refer to Fig. 3 again, in some embodiments, the thickness direction T is perpendicular to the axial direction R1 of the sub-atomizer 10, and the liquid suction surface 110a and the atomization surface 110b are both arranged parallel to the axial direction R1 of the electronic atomizer 10. This embodiment shows a first case of the structure of the substrate 110 and the arrangement of the substrate 110 relative to the axial direction R1 of the electronic atomizer 10. In some embodiments, the substrate 110 has a uniform size in the thickness direction T, the substrate 110 has a flat structure, and the substrate 110 is arranged parallel to the axial direction R1 of the electronic atomizer 10.

[0066] In some embodiments, the thickness direction T is arranged obliquely relative to the axial direction R1 of the sub-atomizer 10, and the liquid suction surface 110a and the atomization surface 110b are both arranged obliquely relative to the axial direction R1 of the electronic atomizer 10. This embodiment shows a second case of the structure of the substrate 110 and the arrangement of the substrate 110 relative to the axial direction R1 of the electronic atomizer 10. In some embodiments, the substrate 110 has a uniform size in the thickness direction T, the substrate 110 has a flat structure, and the substrate 110 is arranged obliquely relative to the axial direction R1 of the electronic atomizer 10.

[0067] In some embodiments, please refer to Fig. 7 and Fig. 8, Fig. 7 is a structural schematic diagram of another embodiment of the electronic atomizer 10 provided by the present application, and Fig. 8 is a three-dimensional structural schematic diagram of another embodiment of the heating assembly 100 in the electronic atomizer 10 of Fig. 7. In some embodiments, the thickness direction T is perpendicular to the axial direction R1 of the sub-atomizer 10, the liquid suction surface 110a is arranged parallel to the axial direction R1 of the electronic atomizer 10, the atomization surface 110b is arranged obliquely relative to the axial direction R1 of the electronic atomizer 10, and along the axial direction R1 of the electronic atomizer 10, the size of the substrate 110 in the thickness direction T increases with the increase of the hole diameter of each liquid guide through hole 111. This embodiment shows a third case of the structure of the substrate 110 and the arrangement of the substrate 110 relative to the axial direction R1 of the electronic atomizer 10. In some embodiments, the substrate 110 has a wedge-shaped plate structure.

[0068] It can be understood that, in other embodiments, the liquid suction surface 110a can be arranged obliquely relative to the axial direction R1 of the electronic atomizer 10, the atomization surface 110b can be arranged parallel to the axial direction R1 of the electronic atomizer 10, or the liquid suction surface 110a and the atomization surface 110b can both be arranged obliquely relative to the axial direction R1 of the electronic atomizer 10. As for the size of the substrate 110 in the thickness direction T, the size of the substrate 110 in the thickness direction T can also decrease along the axial direction R1 of the electronic atomizer 10 with the increase of the hole diameter of each liquid guide through hole 111.

[0069] Based on the various structures of the substrate 110 and the various arrangements of the substrate 110 relative to the axial direction R1 of the electronic atomizer 10, the liquid absorption surface 110a and the atomizing surface 110b can both be arranged parallel to or inclined relative to the axial direction R1 of the electronic atomizer 10. The liquid absorption surface 110a and the atomizing surface 110b can both be planar or curved. As long as the aperture of each liquid guiding hole 111 of the substrate 110 is set to a gradient distribution with larger aperture at the top and smaller aperture at the bottom, regardless of the structure of the substrate 110 or the arrangement of the substrate 110 relative to the axial direction R1 of the electronic atomizer 10, the uniform liquid supply effect of the heating component 100 in this application will not be affected.

[0070] Please refer to Figure 9, which is a cross-sectional view of the substrate 110 in the heating component 100 of Figure 8 along the axial direction R1 of the electronic atomizer 10. In the above embodiment, when the atomizing surface 110b is inclined relative to the axial direction R2 of the airflow channel 300, and the axis of the liquid guiding hole 111 is inclined relative to the radial direction of the airflow channel 300, the direction of the aerosol ejected from the liquid guiding hole 111 is also inclined. Let α be the inclination angle of the axis of the liquid guiding hole 111 relative to the radial direction of the airflow channel 300, β be the inclination angle of the atomizing surface 110b relative to the axial direction R2 of the airflow channel 300, and v be the total velocity of the aerosol ejected along the liquid guiding hole 111. total The tilting speed v total It has a radial component (lateral velocity v_horizontal) along the airflow channel 300 and an axial component R2 (vertical velocity v_t) along the airflow channel 300. vertical ), and the tilting speed v total Horizontal velocity vhorizontal and vertical velocity vt vertical The relationship between them is: And vhorizontal = cosα*v total Therefore, the lateral velocity v_horizontal is smaller than the tilt velocity v_t. total .

[0071] In related technologies, the axis of the liquid guiding hole 111 is arranged parallel to the radial direction of the airflow channel 300. Therefore, the lateral velocity of the aerosol ejected from the liquid guiding hole 111 is the total velocity. However, in this application, the axis of the liquid guiding hole 111 is arranged inclined relative to the radial direction of the airflow channel 300. Therefore, the lateral velocity of the aerosol ejected from the liquid guiding hole 111 is the radial component of the total velocity. Thus, the lateral velocity is smaller than the total velocity. Therefore, this application can effectively reduce the lateral velocity of the aerosol, making the generated aerosol easier to be carried by the airflow, thereby reducing the possibility of wall collision.

[0072] Referring to FIG. 10, which is a simulation diagram of aerosol migration, FIG. 10(a) shows a case where the direction of the aerosol sprayed by the liquid guide through hole 111 is parallel to the radial direction of the airflow channel 300, FIG. 10(b) shows a case where the direction of the aerosol sprayed by the liquid guide through hole 111 is inclined to the radial direction of the airflow channel 300, and the lines in FIG. 10 represent the airflow direction, and the black particles in FIG. 10 represent the aerosol solid particles. It can be seen that by arranging the liquid guide through hole 111 to be inclined to the radial direction of the airflow channel 300, the risk of aerosol collision is reduced.

[0073] Further, referring again to FIG. 9, the distance between the atomization surface 110b and the axis of the airflow channel 300 gradually decreases in the direction from the second end 12 to the first end 11. In some embodiments, the base body 110 has a wedge-shaped structure that is large in thickness at the bottom and small at the top, so that when the user inhales, the airflow in the airflow channel 300 can fully contact the atomization surface 110b, and at the same time, the atomization surface 110b does not affect the movement of the airflow in the airflow channel 300. It can be understood that in other embodiments, the distance between the atomization surface 110b and the axis of the airflow channel 300 can also gradually increase in the direction from the second end 12 to the first end 11, and the direction of the aerosol sprayed by the liquid guide through hole 111 is also inclined, which reduces the risk of aerosol collision.

[0074] Further, referring again to FIG. 9, in some embodiments, the inclination angle β of the atomization surface 110b relative to the axial direction R2 of the airflow channel 300 is 5°-15°, and / or the inclination angle α of the axis of the liquid guide through hole 111 relative to the radial direction of the airflow channel 300 is 5°-15°. Within the inclination angle range of 5°-15°, the transverse velocity of the aerosol sprayed by the liquid guide through hole 111 can be effectively reduced, and at the same time, the atomization surface 110b does not excessively block the airflow in the airflow channel 300. It can be understood that in other embodiments, the inclination angle β of the atomization surface 110b relative to the axial direction R2 of the airflow channel 300, and the inclination angle α of the axis of the liquid guide through hole 111 relative to the radial direction of the airflow channel 300 can also be other values.

[0075] Further, referring to FIG. 9 again, the liquid guiding through hole 111 is perpendicular to the atomization surface 110b, and thus the inclination angle β of the atomization surface 110b relative to the axial direction R2 of the airflow channel 300 is the same as the inclination angle α of the axis of the liquid guiding through hole 111 relative to the radial direction of the airflow channel 300. In some embodiments, in the case where the liquid absorbing surface 110a is arranged parallel to the axial direction R1 of the electronic atomizer 10, and the atomization surface 110b is arranged inclined to the axial direction R1 of the electronic atomizer 10, the liquid guiding through hole 111 is arranged perpendicular to the atomization surface 110b, which is more convenient for processing the liquid guiding through hole 111, and can also avoid the influence of the atomization surface 110b on the aerosol ejected by the liquid guiding through hole 111. It can be understood that in other embodiments, the liquid guiding through hole 111 can also not be perpendicular to the atomization surface 110b, as long as the axis of the liquid guiding through hole 111 is arranged inclined to the axial direction of the airflow channel 300, which can reduce the risk of the aerosol ejected by the liquid guiding through hole 111 colliding with the wall.

[0076] Referring to FIGS. 4 and 5 again, the heating element 120 in the present application can be a sheet structure covering part of the atomization surface 110b, and the thickness thereof can be 0-10 microns. It can be understood that, since the aerosol generated by the atomization substrate in the base body 110 after being heated by the heating element 120 needs to escape from the atomization surface 110b, the heating element 120 should not block the liquid guiding through hole 111, so that the aerosol can escape from the liquid guiding through hole 111. When the heating element 120 is a sheet structure, the liquid guiding through hole 111 can pass through the heating element 120. Of course, the heating element 120 can also adopt other shapes, such as a strip shape, a wire shape, a mesh shape, etc.

[0077] The heating element 120 can be substantially a rectangular sheet structure, and further can be an octagonal structure formed by cutting the corners of the rectangular sheet structure. Of course, the heating element 120 can also adopt other shapes other than a rectangle, such as a polygon, a circle, etc.

[0078] Corresponding to the shape of the heating element 120, the base body 110 can be substantially a rectangular plate structure, the length of the long side of the rectangle can be 4.7 mm, the length of the short side of the rectangle can be 3 mm, and the thickness of the base body 110 can be 0.8 mm. The size of the base body 110 can also be other values, and the base body 110 can also adopt other shapes other than a rectangle, such as a polygon, a circle, etc.

[0079] In some embodiments, the base 110 comprises an intrinsic silicon substrate, which means that the silicon single crystal is complete in crystal lattice and does not contain impurities, and the heating element 120 is a doped conductive silicon substrate. Intrinsic silicon has weak conductivity, while doped conductive silicon has high conductivity. As shown in FIG. 6A, the intrinsic silicon substrate has a receiving groove 1100 on the atomization surface 110b, and the conductive silicon substrate is embedded in the receiving groove 1100; or, as shown in FIG. 6B, the heating element 120 is a conductive silicon layer formed by doping on the atomization surface 110b of the intrinsic silicon substrate. The conductive silicon layer can be formed by ion implantation.

[0080] In some embodiments, when the heating element 120 is a conductive silicon layer formed by doping on the atomization surface 110b of the intrinsic silicon substrate, the base 110 with the liquid guide through hole 111 is processed as follows: first, ion implantation is performed on the designated area of the atomization surface 110b of the intrinsic silicon substrate to form the heating element 120 with high conductivity, and then each liquid guide through hole 111 is processed to form the intrinsic silicon substrate with the liquid guide through hole 111.

[0081] In some embodiments, since the heating element 120 is a doped conductive silicon substrate, it is a non-metallic material. Compared with metal materials, since metal materials are usually exposed and in direct contact with the atomization substrate, due to the complexity of high temperature and atomization substrate composition during the heating process, these exposed metal elements are prone to oxidation or metal migration. The results of oxidation or metal migration not only lead to a decrease in heating efficiency, but also cause the atomization substrate composition to be contaminated and may cause the risk of heavy metal exceeding the standard. When the heating element 120 is a doped conductive silicon substrate, the risk of metal precipitation is greatly reduced, thereby reducing the possibility of contamination of the atomization substrate composition during the use of the electronic atomizer 10.

[0082] In some embodiments, referring to FIG. 11 and FIG. 12, FIG. 11 is a perspective structural schematic diagram of another embodiment of the heating assembly 100 in the electronic atomizer 10 provided by the present application, and FIG. 12 is an exploded structural schematic diagram of the heating assembly 100 in FIG. 11. In some embodiments, the substrate 110 includes a bonded substrate 113 in addition to the intrinsic silicon substrate 112. The intrinsic silicon substrate 112 and the bonded substrate 113 can both be substantially rectangular plate structures, and of course other shapes are not excluded. The bonded substrate 113 is made of glass, ceramic or quartz sheet. The bonded substrate 113 is arranged on the surface of the intrinsic silicon substrate 112 away from the heating element 120, and the bonded substrate 113 can be fixed to the intrinsic silicon substrate 112 by bonding. The intrinsic silicon substrate 112 is provided with a plurality of first liquid guiding holes 1120, and the bonded substrate 113 is provided with a plurality of second liquid guiding holes 1130 aligned with the plurality of first liquid guiding holes 1120. A first liquid guiding hole 1120 and a second liquid guiding hole 1130 aligned with each other together form a liquid guiding through hole 111. In some embodiments, the substrate 110 includes two substrates, and the bonded substrate 113 is made of glass, ceramic or quartz sheet and other materials with smaller thermal conductivity. Therefore, the bonded substrate 113 can play a role of heat insulation to avoid the temperature of the atomization substrate close to the liquid absorbing surface 110a of the substrate 110 being too high.

[0083] When the intrinsic silicon substrate 112 is substantially a rectangular plate structure, the bonded substrate 113 can also be substantially a rectangular plate structure, and the bonded substrate 113 can completely cover the intrinsic silicon substrate 112. The shape and size of the bonded substrate 113 and the intrinsic silicon substrate 112 can be set to be the same, so that the bonded substrate 113 and the intrinsic silicon substrate 112 just fit together. The length of the long side of the rectangle of the intrinsic silicon substrate 112 and the bonded substrate 113 can be 4.7 mm, the length of the short side of the rectangle can be 3 mm, the thickness of the intrinsic silicon substrate 112 can be 0.3 mm, and the thickness of the bonded substrate 113 can be 0.5 mm. The size of the intrinsic silicon substrate 112 and the bonded substrate 113 can also be other values, and the intrinsic silicon substrate 112 and the bonded substrate 113 are not excluded from other shapes such as polygon, circle and the like.

[0084] In some embodiments, when the heating element 120 is a conductive silicon layer formed by doping the surface of the intrinsic silicon substrate 112 away from the bonding substrate 113, the step of processing the base 110 with the liquid guide through hole 111 is as follows: first, ion implantation is performed on the designated area of the atomized surface 110b of the intrinsic silicon substrate 112 to form the heating element 120 with high electrical conductivity, and then each first liquid guide hole 1120 is processed to form the intrinsic silicon substrate 112 with the first liquid guide hole 1120; then each second liquid guide hole 1130 is processed on the bonding substrate 113; finally, the intrinsic silicon substrate 112 and the bonding substrate 113 are connected and fixed by bonding, each first liquid guide hole 1120 is aligned with each second liquid guide hole 1130, and each liquid guide through hole 111 is formed.

[0085] Referring again to FIGS. 4 and 5, in some embodiments, the heating assembly 100 further includes a first electrode 131 and a second electrode 132, which are respectively electrically connected to the opposite sides of the heating element 120. In some embodiments, the first electrode 131 and the second electrode 132 are provided to facilitate electrical connection between the power supply device and the heating element 120, thereby achieving power supply to the heating element 120.

[0086] In summary, in the present application, the hole diameter of the liquid guide through hole 111 gradually increases in the direction from the second end 12 to the first end 11, which can improve the uniformity of the up and down liquid supply of the heating assembly 100, and the atomization process is more stable. Moreover, the hole diameter of each liquid guide through hole 111 gradually increases from 10 microns to 120 microns in the direction from the second end 12 to the first end 11, compared with the related art in which each liquid guide through hole 111 has a hole diameter of 35 microns, the present application has a significantly sufficient liquid supply amount, higher atomization efficiency, and lower overall air exchange pressure, and the air exchange is smoother.

[0087] The following compares the hole diameters of each liquid guide through hole 111 on the flat base 110 in the related art, which are the same, with the gradient distribution of the hole diameters of each liquid guide through hole 111 on the flat base 110 in the present application, which are large at the top and small at the bottom, under the condition that the resistance value (unit: ohm) of the heating assembly 100 is substantially the same, the parameters such as "0-100 puffs TPM", "300-400 puffs TPM", and "average air exchange pressure" are detected, and the following table is obtained.

[0088] Wherein, TPM refers to Total Particulate Matter; the meaning of "0-100 puffs TPM" is that the average atomization amount within 0 to 100 puffs of the electronic atomizer is a commonly used parameter for evaluating the atomization effect of the electronic atomizer, and the unit is milligrams (mg); similarly, the meaning of "300-400 puffs TPM" is that the average atomization amount within 300 to 400 puffs of the electronic atomizer is a commonly used parameter for evaluating the atomization effect of the electronic atomizer, and the unit is milligrams (mg).

[0089] From the above table, it can be seen that the pore size gradient distribution of the present application has higher TPM compared with the uniform pore size in the related art, so that the liquid supply is more sufficient, and the ventilation pressure is lower, and the ventilation is smoother.

[0090] The present application also provides an electronic atomization device, which comprises a power supply device and the electronic atomizer 10, wherein the power supply device is connected with the electronic atomizer 10 and used for supplying power for the electronic atomizer 10. The specific structure of the electronic atomizer 10 is referred to the above-mentioned embodiments. Since the electronic atomization device adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0091] The device embodiments described above are only schematic, and the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e., may be located in one place, or may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the present embodiment. Those skilled in the art can understand and implement without creative labor.

[0092] As used herein, the terms "one embodiment", "an embodiment" or "one or more embodiments” mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.

[0093] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combination thereof. In a unit claim, several elements can be presented - the use of "comprising" does not exclude the presence of other elements that are not listed in a claim. The word "first", "second", "third", and the like, when used in the description orders these features during the recitation of a device or method, but does not preclude there from being third or a fourth feature, nor preclude that a feature can be both a first and second feature. The terms "first", "second", "third", etc. are mainly used to name different components.

Claims

1. A vertical heat generating component, wherein, The heating assembly is arranged in an erected manner in the electronic atomizer, the heating assembly comprises a plate-shaped base body and a heating element, a thickness direction of the base body intersects with a depth direction of a liquid storage cavity of the electronic atomizer, the base body has a liquid suction surface and an atomization surface arranged opposite to each other in the thickness direction, the heating element is arranged on the atomization surface, the base body is provided with a plurality of liquid guiding through holes penetrating through the thickness direction, the liquid guiding through holes communicate the liquid storage cavity and the heating element, and the liquid guiding through holes are used for guiding an atomization substrate from the liquid storage cavity to the atomization surface through the liquid suction surface for heating by the heating element. In a direction from a bottom to a top of the depth direction of the liquid storage cavity, hole diameters of adjacent liquid guiding through holes gradually increase.

2. The vertical heat generating component according to claim 1, wherein The base body further defines a first extension direction and a second extension direction, the thickness direction, the first extension direction and the second extension direction are perpendicular to each other in pairs, and the first extension direction is parallel to the depth direction of the liquid storage cavity. A hole spacing in the first extension direction is a first hole spacing, and a hole spacing in the second extension direction is a second hole spacing. In a direction from a bottom to a top of the depth direction of the liquid storage cavity, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

3. The vertical heat generating component of claim 1, wherein, A hole diameter of each of the liquid guiding through holes ranges from 10 microns to 120 microns.

4. The vertical heat generating component of claim 1, wherein, The base body comprises an intrinsic silicon substrate, the heating element is a doped conductive silicon substrate, and the intrinsic silicon substrate has a receiving groove at the atomization surface, and the conductive silicon substrate is embedded in the receiving groove.

5. The vertical heat generating component according to any one of claims 1 to 4, wherein The base body further defines a first extension direction and a second extension direction, the thickness direction, the first extension direction and the second extension direction are perpendicular to each other in pairs, and the first extension direction is parallel to the depth direction of the liquid storage cavity. The plurality of liquid guiding through holes are arranged in multiple rows, a row direction is parallel to the second extension direction, hole diameters of each of the liquid guiding through holes in a same row are the same, and hole diameters of the liquid guiding through holes of each row gradually increase in a direction from a bottom to a top of the liquid storage cavity.

6. The vertical heat generating component of claim 5, wherein, A spacing of adjacent rows in the first extension direction is a first hole spacing, a spacing of adjacent liquid guiding through holes in each of the liquid guiding through holes in a same row is a second hole spacing, and each of the second hole spacings in the same row is the same. In a direction from a bottom to a top of the depth direction of the liquid storage cavity, the first hole spacing and the second hole spacing gradually increase. The liquid guiding through holes of adjacent two rows are arranged in a staggered manner in the first extension direction.

7. The vertical heat generating component according to any one of claims 1 to 4, wherein The base body comprises an intrinsic silicon substrate, and the heating element is a conductive silicon layer formed by doping on the atomization surface of the intrinsic silicon substrate.

8. The vertical heat generating component according to claim 6 or 7, wherein The base body further comprises a bonding substrate, the bonding substrate is made of glass, ceramic or quartz sheet, the bonding substrate is arranged on a surface of the intrinsic silicon substrate away from the heating element, the intrinsic silicon substrate is provided with a plurality of first liquid guiding holes, the bonding substrate is provided with a plurality of second liquid guiding holes aligned with the plurality of first liquid guiding holes one by one, and one first liquid guiding hole and one second liquid guiding hole aligned with each other jointly form the liquid guiding through hole.

9. An electronic atomizer, wherein, The electronic atomizer comprises: a liquid storage cavity for storing an atomization substrate; An airflow channel extending along a depth direction of the liquid storage cavity; The heating assembly is arranged in the electronic atomizer in a standing manner, and a thickness direction of the base body intersects with a depth direction of the liquid storage cavity.

10. The electronic atomizer of claim 9, wherein, The atomization surface is arranged in parallel with respect to an axial direction of the airflow channel.

11. The electronic atomizer of claim 9, wherein, The atomization surface is arranged in an inclined manner with respect to an axial direction of the airflow channel, and an axis of the liquid guiding through hole is arranged in an inclined manner with respect to a radial direction of the airflow channel.

12. An electronic atomizing device, wherein, The power supply device is connected with the electronic atomizer.

Images