Heat exchange module and electronic device

Abstract

Disclosed in the embodiments of the present disclosure are a heat exchange module and an electronic device. The heat exchange module comprises a first circuit board, a second circuit board and at least one micropump, wherein the first circuit board and the second circuit board are stacked, the first circuit board comprises a first substrate layer, the second circuit board comprises a second substrate layer, the first substrate layer is internally provided with a first flow channel, the second substrate layer is internally provided with a second flow channel, and the first substrate layer and the second substrate layer are connected to seal the first flow channel and the second flow channel; and the at least one micropump is sealingly connected to one of the first circuit board and / or the second circuit board and is used for driving a working medium to flow in the first flow channel and / or the second flow channel. In this way, the flow channels can be formed inside the first circuit board and the second circuit board, and the micropump is used to drive the working medium to flow in the flow channels so as to achieve heat exchange, without the need for additionally designing a heat exchange plate, thereby reducing the production cost.

Description

Heat exchange module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411390734.5, filed on September 30, 2024, and entitled "Heat exchange module and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat transfer, and more particularly, to a heat exchange module and an electronic device. BACKGROUND

[0003] With the increasing integration of electronic devices, heat exchange has become one of the key factors restricting the performance improvement of electronic devices. At present, most electronic devices use built-in liquid cooling plates for heat exchange. The liquid cooling plate has a flow channel, and heat transfer is achieved by the flow of working medium, thereby cooling the electronic device.

[0004] However, the use of liquid cooling plates in electronic devices not only solves the heat dissipation problem, but also increases the production and processing costs, making the assembly of electronic devices more difficult. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a novel heat exchange module and an electronic device.

[0006] According to one aspect of the present application, a heat exchange module is provided.

[0007] The heat exchange module comprises:

[0008] a first circuit board and a second circuit board, the first circuit board and the second circuit board are stacked, the first circuit board comprises a first substrate layer, the second circuit board comprises a second substrate layer, the first substrate layer has a first flow channel, the second substrate layer has a second flow channel, and the first substrate layer is connected with the second substrate layer to seal the first flow channel and the second flow channel;

[0009] at least one micro-pump, the micro-pump is sealingly connected with one of the first circuit board and / or the second circuit board, and the micro-pump is used to drive the working medium to flow in the first flow channel and / or the second flow channel.

[0010] Optionally, the first flow channel and the second flow channel are at least partially staggered in the thickness direction of the heat exchange module.

[0011] Optionally, the first flow channel and the second flow channel are in communication.

[0012] Optionally, a first through hole is further included, the first through hole is located on the first substrate layer and the second substrate layer, one end of the first through hole is communicated with the first flow channel, and the other end of the first through hole is communicated with the second flow channel.

[0013] Optionally, one end of the first flow channel close to the second flow channel has a first opening, and one end of the second flow channel close to the first flow channel has a second opening, and the second opening is communicated with the first opening.

[0014] Optionally, along the thickness direction of the heat exchange module, the second opening is opposite to the first opening.

[0015] Optionally, the number of the micro pumps is one or more.

[0016] Optionally, the first flow channel and the second flow channel are not communicated.

[0017] Optionally, the number of the micro pumps is more, and part of the micro pumps are communicated with the first flow channel, and the other part of the micro pumps are communicated with the second flow channel.

[0018] Optionally, the first circuit board further includes a first functional layer, the second circuit board further includes a second functional layer, one side of the first substrate layer is connected with the first functional layer, one side of the second substrate layer is connected with the second functional layer, the other side of the first substrate layer is connected with the other side of the second substrate layer, one of the micro pumps is sealed with one of the first substrate layer and the second substrate layer, and a gap is formed between the first functional layer or the second functional layer and the micro pump.

[0019] Optionally, a connecting hole is further included, the connecting hole penetrates through the first circuit board and the second circuit board, and the first functional layer and the second functional layer are electrically connected.

[0020] Optionally, the micro pump has a working medium inlet and a working medium outlet, two second through holes are formed on at least one of the first circuit board and the second circuit board, one end of the second through hole is communicated with one of the first flow channel and the second flow channel, and the working medium inlet and the working medium outlet are respectively communicated with the other end of the two second through holes.

[0021] According to another aspect of the present application, an electronic device is provided, which includes the heat exchange module.

[0022] One technical effect of the embodiments of the present disclosure is that:

[0023] The heat exchange module comprises a first circuit board, a second circuit board and at least one micropump, the first circuit board and the second circuit board are arranged in a stack, the first circuit board comprises a first substrate layer, the second circuit board comprises a second substrate layer, the first substrate layer has a first flow channel therein, the second substrate layer has a second flow channel therein, and the first substrate layer is connected with the second substrate layer to seal the first flow channel and the second flow channel; the micropump is sealingly connected with one of the first circuit board and / or the second circuit board, and the micropump is used to drive the working medium to flow in the first flow channel and / or the second flow channel.

[0024] In this way, the flow channels can be formed inside the first circuit board and the second circuit board, and the working medium in the flow channels can be driven to flow by the micropump to achieve heat exchange. In this way, the flow channels are directly designed inside the first circuit board and the second circuit board, and no additional heat exchange plate needs to be designed, so that the production cost can be reduced, and the assembly difficulty of an electronic device using the heat exchange module can also be reduced.

[0025] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] The accompanying drawings, which form a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0027] FIG. 1 is a schematic view of a heat exchange module according to an embodiment of the present disclosure;

[0028] FIG. 2 is a sectional view of a heat exchange module according to an embodiment of the present disclosure;

[0029] FIG. 3 is a sectional view of another heat exchange module according to an embodiment of the present disclosure.

[0030] Reference Signs List: 1, circuit board; 11, first circuit board; 111, first substrate layer; 1111, first flow channel; 112, first functional layer; 12, second circuit board; 121, second substrate layer; 1211, second flow channel; 122, second functional layer; 14, connecting hole; 15, second through hole; 2, micropump. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps set forth in the embodiments, numerical expressions, and numerical values are not limiting to the scope of the present application unless otherwise specifically stated.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0033] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art(s) can not be discussed in any detail since they can be readily understood from the disclosure and are considered part of the present description.

[0034] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0035] It should be noted that like reference numerals and letters refer to like items throughout the attached drawings, and once an item is defined in one drawing, it is not necessary to discuss it further in subsequent drawings.

[0036] The heat exchange module provided by the embodiments of the present application can be applied to heat exchange of small electronic devices such as tablets, notebook computers, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, and the like.

[0037] As shown in FIGS. 1-3, the heat exchange module provided by the embodiments of the present application includes:

[0038] The first circuit board 11 and the second circuit board 12 are arranged in layers, the first circuit board 11 includes a first substrate layer 111, the second circuit board 12 includes a second substrate layer 121, the first substrate layer 111 has a first flow channel 1111 therein, the second substrate layer 121 has a second flow channel 1211 therein, and the first substrate layer 111 is connected with the second substrate layer 121 to seal the first flow channel 1111 and the second flow channel 1211.

[0039] At least one micro-pump 2 is sealingly connected with one of the first circuit board 11 and / or the second circuit board 12, and the micro-pump 2 is used to drive the working medium to flow in the first flow channel 1111 and / or the second flow channel 1211.

[0040] As shown in FIG. 1, in the present embodiment, the heat exchange module can include two circuit boards 1, i.e., the first circuit board 11 and the second circuit board 12. The circuit board 1 can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit), which can meet the use requirements of different electronic devices. Each circuit board 1 includes a substrate layer and a functional layer, and the substrate layer is used to provide stable support force. The functional layer is located on the substrate layer, and the functional layer includes conductive patterns, solder pads, and the like, which are used to form electrical connection with electronic devices.

[0041] The first circuit board 11 and the second circuit board 12 are stacked. Specifically, the first substrate layer 111 and the second substrate layer 121 can be connected, and the first functional layer 112 and the second functional layer 122 are exposed, so that the first substrate layer 111 and the second substrate layer 121 are located on the inner side, and the first functional layer 112 and the second functional layer 122 are located on the outer side. The first functional layer 112 and the second functional layer 122 on the outer side can be electrically connected to electronic devices respectively, so as to expand the function of the circuit board 1.

[0042] In addition, by stacking the two circuit boards 1, the size of the heat exchange module in the horizontal direction can be reduced, so as to reduce the occupation of the internal horizontal space of the electronic device using the heat exchange module, and facilitate the miniaturization of the electronic device.

[0043] In this way, the first flow channel groove can be etched in the first substrate layer 111, and the second flow channel groove can be etched in the second substrate layer 121. The two flow channels are formed by the sealing connection of the first substrate layer 111 and the second substrate layer 121 at the two flow channel grooves, so as to increase the total length of the flow channel formed by the circuit board 1, so as to increase the heat exchange path of the working medium, and facilitate the improvement of the heat exchange capacity of the heat exchange module. The sealing connection of the first substrate layer 111 and the second substrate layer 121 can be achieved by bonding, hot pressing, ultrasonic welding and the like.

[0044] In this way, the first circuit board 11 and the second circuit board 12 can also be reused. On the one hand, electronic devices can be arranged on the first circuit board 11 and the second circuit board 12 respectively to realize corresponding functions; on the other hand, by designing flow channel grooves in the two substrate layers to realize heat exchange effect, the heat exchange plate needs to be set again, so as to save processing cost and production cost, and also reduce the assembly difficulty of the electronic device using the heat exchange module.

[0045] In addition, since the heat exchange plate or other heat exchange structure does not need to be designed again, the internal space of the electronic device using the heat exchange module can also be reduced, and the miniaturization of the electronic device can be facilitated.

[0046] In this way, the internal space of each substrate layer can be fully utilized to design the specific structure of the flow channel, so as to increase the total length of the flow channel, thereby increasing the heat exchange path and facilitating the improvement of the heat exchange effect of the heat exchange module.

[0047] According to actual needs, one or more micropumps 2 can be arranged, and one micropump 2 is sealingly connected to the first substrate layer 111 or the second substrate layer 121. When one micropump 2 is used, two second through holes 15 can be formed in the first substrate layer 111 or the second substrate layer 121, and the two second through holes 15 are in communication with the flow channel. The working medium inlet and the working medium outlet of the micropump 2 are connected to the two second through holes 15, so that the micropump 2 is in communication with the flow channel, and the micropump 2 can drive the working medium to circulate in the flow channel, thereby ensuring the heat exchange effect of the heat exchange module.

[0048] The micropump 2 can be electrically connected to the functional layer of the circuit board 1 by a solder pad. The micropump 2 includes but is not limited to a piezoelectric pump and an electromagnetic pump, and the thickness of the micropump 2 can be between 0.3 mm and 3 mm, so as to facilitate the development of the thin and light heat exchange module.

[0049] When multiple micropumps 2 are used, the second through holes 15 can be formed in the first substrate layer 111 and the second substrate layer 121, and the micropumps 2 are sealingly connected to the first substrate layer 111 or the second substrate layer 121 on the same side, which can improve the driving capacity of the micropump 2 and ensure the heat exchange stability of the heat exchange module.

[0050] Optionally, the first flow channel 1111 and the second flow channel 1211 are at least partially staggered along the thickness direction of the heat exchange module.

[0051] In this embodiment, the first flow channel groove and the second flow channel groove are etched on the two sides of the first substrate layer 111 and the second substrate layer 121, and the first flow channel groove and the second flow channel groove are partially staggered or completely staggered, so that the first flow channel 1111 and the second flow channel 1211 are formed at the two flow channel grooves by the sealing connection of the first substrate layer 111 and the second substrate layer 121, thereby increasing the total length of the flow channel formed on the circuit board 1, increasing the heat exchange path of the working medium, and improving the heat exchange effect of the heat exchange module.

[0052] The first flow channel 1111 and the second flow channel 1211 can be in communication, so that the working medium can flow between the first flow channel 1111 and the second flow channel 1211. Alternatively, the first flow channel 1111 and the second flow channel 1211 can be not in communication, so that the working medium flows independently in the first flow channel 1111 and the second flow channel 1211, which can adapt to different heat exchange needs.

[0053] Optionally, the first flow channel 1111 and the second flow channel 1211 are communicated. As shown in FIG. 1, the working medium can flow between the communicated first flow channel 1111 and the second flow channel 1211. At this time, one micropump 2 can be arranged to drive the working medium to flow between the two flow channels, thereby reducing the production cost and simplifying the assembly process; or multiple micropumps 2 can be arranged to enhance the driving capacity.

[0054] Optionally, a first through hole is further arranged on the first substrate layer 111 and the second substrate layer 121, one end of the first through hole is communicated with the first flow channel 1111, and the other end of the first through hole is communicated with the second flow channel 1211.

[0055] In the embodiment, when the first flow channel groove and the second flow channel groove are completely staggered, a first through hole can be arranged in the first substrate layer 111 and the second substrate layer 121, one end of the first through hole is communicated with the first flow channel 1111, and the other end of the first through hole is communicated with the second flow channel 1211, so that the two flow channels are communicated by the first through hole, and the working medium can flow between the two flow channels.

[0056] Optionally, one end of the first flow channel 1111 close to the second flow channel 1211 has a first opening, and one end of the second flow channel 1211 close to the first flow channel 1111 has a second opening, and the second opening is communicated with the first opening.

[0057] As shown in FIG. 2, in the embodiment, when the first flow channel groove and the second flow channel groove are partially staggered, openings (not shown in the figure) can be arranged at the opposite ends of the first flow channel groove and the second flow channel groove, the first opening is communicated with the first flow channel 1111, and the second opening is communicated with the second flow channel 1211, so that the two flow channels are communicated by the opposite first opening and second opening, and the working medium can flow between the two flow channels.

[0058] The first opening and the second opening can be arranged at the end of the flow channel groove, i.e. the end of each flow channel, so as to increase the total length of the two flow channels formed, thereby increasing the heat exchange path of the working medium and facilitating the improvement of the heat exchange effect of the heat exchange module.

[0059] Optionally, along the thickness direction of the heat exchange module, the second opening is opposite to the first opening, so as to communicate the two flow channels by the first opening and the second opening, and the working medium can flow between the two flow channels.

[0060] Optionally, the number of the micropump 2 is one or more.

[0061] As shown in Fig. 2, in the embodiment, the first flow channel 1111 and the second flow channel 121 are communicated, so that the working medium can flow between the first flow channel 1111 and the second flow channel 121. At this time, one micropump 2 can be arranged, which is connected with the first substrate layer 111 or the second substrate layer 121, and the working medium can be driven to flow between the two flow channels by one micropump 2, so as to reduce the production cost and simplify the assembly process.

[0062] In another embodiment, as shown in Fig. 3, a plurality of micropumps 2 can also be arranged, part of the micropumps 2 are connected with the first substrate layer 111, and the other part of the micropumps 2 are connected with the second substrate layer 121, and the driving force of the working medium flowing between the two flow channels can be enhanced by the plurality of micropumps 2. In addition, backup can be formed between the plurality of micropumps 2, so that when part of the micropumps 2 are damaged or fail, the driving ability of the other micropumps 2 can be ensured, thereby improving the reliability and stability of the heat exchange module.

[0063] Optionally, the first flow channel 1111 and the second flow channel 1211 are not communicated.

[0064] In the embodiment, since the first flow channel 1111 and the second flow channel 1211 are not communicated, the working medium can flow independently in the two flow channels, so as to adapt to different heat exchange requirements. At this time, at least two micropumps 2 need to be arranged, at least one micropump 2 is communicated with the first flow channel 1111, and at least one micropump 2 is connected with the second flow channel 1211, so as to independently drive the working medium in the two flow channels, and also to reduce the resistance of the working medium flowing, thereby ensuring the heat exchange effect of the heat exchange module.

[0065] Optionally, the number of the micropumps 2 is a plurality, part of the micropumps 2 are communicated with the first flow channel 1111, and the other part of the micropumps 2 are communicated with the second flow channel 1211, so as to independently drive the working medium in the two flow channels, and also to reduce the resistance of the working medium flowing, thereby ensuring the heat exchange effect of the heat exchange module. In addition, backup can be formed between the plurality of micropumps 2, so that when part of the micropumps 2 are damaged or fail, the driving ability of the other micropumps 2 can be ensured, thereby improving the reliability and stability of the heat exchange module.

[0066] Optionally, the first circuit board 11 further comprises a first functional layer 112, the second circuit board 12 further comprises a second functional layer 122, one side of the first substrate layer 111 is connected with the first functional layer 112, one side of the second substrate layer 121 is connected with the second functional layer 122, the other side of the first substrate layer 111 is connected with the other side of the second substrate layer 121, one micropump 2 is sealingly connected with one of the first substrate layer 111 and the second substrate layer 121, and the first functional layer 112 or the second functional layer 122 has a gap with the micropump 2.

[0067] As shown in FIG. 1, in the embodiment, the first substrate layer 111 and the second substrate layer 121 are connected, and the first functional layer 112 and the second functional layer 122 are exposed, so that the first substrate layer 111 and the second substrate layer 121 are located at the inner side, and the first functional layer 112 and the second functional layer 122 are located at the outer side, and the first functional layer 112 and the second functional layer 122 can be respectively electrically connected with electronic devices, thereby expanding the function of the circuit board 1.

[0068] According to the actual arrangement position, one micro-pump 2 can be sealingly connected with the first substrate layer 111, or one micro-pump 2 can be sealingly connected with the second substrate layer 121, so as to drive the working medium in the flow channel.

[0069] Further, on the first substrate layer 111, the first functional layer 112 is staggered with the micro-pump 2; and on the second substrate layer 121, the second functional layer 122 is staggered with the micro-pump 2, so as to avoid interference between the first functional layer 112 and the second functional layer 122 and the micro-pump 2, thereby ensuring the working reliability of the heat exchange module.

[0070] Optionally, the circuit board 1 further comprises a connecting hole 14 penetrating through the first circuit board 11 and the second circuit board 12 and electrically connecting the first functional layer 112 and the second functional layer 122. As shown in FIG. 1, in the embodiment, the connecting hole 14 is a through hole, and the connecting hole 14 can electrically connect the first functional layer 112 and the second functional layer 122, so as to electrically connect the first functional layer 112 and the second functional layer 122 with electronic devices, thereby expanding the function of the circuit board 1.

[0071] Optionally, the micro-pump 2 has a working medium inlet and a working medium outlet, and at least one of the first circuit board 11 and the second circuit board 12 is provided with two second through holes 15, one end of the second through hole 15 is in communication with one of the first flow channel 1111 and the second flow channel 1211, and the working medium inlet and the working medium outlet are respectively in communication with the other end of the two second through holes 15.

[0072] According to actual needs, one or more micro-pumps 2 can be provided, and one micro-pump 2 is sealingly connected to the first substrate layer 111 or the second substrate layer 121. When one micro-pump 2 is used, two second through holes 15 can be provided on the first substrate layer 111 or the second substrate layer 121, and the two second through holes 15 are in communication with the corresponding flow channels. The working medium inlet and the working medium outlet of the micro-pump 2 are connected with the two second through holes 15, thereby realizing the communication between the micro-pump 2 and the flow channel, so that the micro-pump 2 can drive the working medium to circulate in the flow channel, thereby ensuring the heat exchange effect of the heat exchange module.

[0073] Wherein, when the first flow channel 1111 and the second flow channel 1211 are communicated, two second through holes 15 can be arranged to be communicated with the same flow channel, or two second through holes 15 can be arranged to be communicated with different flow channels.

[0074] When a plurality of micropumps 2 are adopted, the second through holes 15 can be respectively arranged on the first substrate layer 111 and the second substrate layer 121, and the micropump 2 is sealed and connected with the first substrate layer 111 or the second substrate layer 121 on the same side, so that the driving capacity of the micropump 2 can be improved, and the heat exchange stability of the heat exchange module can be ensured.

[0075] Wherein, when the first flow channel 1111 and the second flow channel 1211 are communicated, two second through holes 15 can be arranged to be communicated with the same flow channel, or two second through holes 15 can be arranged to be communicated with different flow channels.

[0076] The embodiment of the present application further provides an electronic device comprising the heat exchange module.

[0077] In the above embodiments, the differences between the various embodiments are mainly described, and the optimization features different between the various embodiments can be combined to form a more optimal embodiment without contradiction.

[0078] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchange module, characterized in that, include: A first circuit board (11) and a second circuit board (12) are stacked together. The first circuit board (11) includes a first substrate layer (111), and the second circuit board (12) includes a second substrate layer (121). The first substrate layer (111) has a first flow channel (1111), and the second substrate layer (121) has a second flow channel (1211). The first substrate layer (111) and the second substrate layer (121) are connected to seal the first flow channel (1111) and the second flow channel (1211). At least one micropump (2) is hermetically connected to one of the first circuit board (11) and / or the second circuit board (12), the micropump (2) being used to drive the working fluid to flow within the first flow channel (1111) and / or the second flow channel (1211).

2. The heat exchange module of claim 1, wherein, Along the thickness direction of the heat exchange module, the first flow channel (1111) and the second flow channel (1211) are at least partially offset.

3. The heat exchange module of claim 2, wherein, The first flow channel (1111) and the second flow channel (1211) are connected.

4. The heat exchange module of claim 3, wherein, It also includes a first through hole, which is located on the first substrate layer (111) and the second substrate layer (121). One end of the first through hole is connected to the first flow channel (1111), and the other end of the first through hole is connected to the second flow channel (1211).

5. The heat exchange module of claim 3, wherein, The first flow channel (1111) has a first opening at one end near the second flow channel (1211), and the second flow channel (1211) has a second opening at one end near the first flow channel (1111), and the second opening communicates with the first opening.

6. The heat exchange module of claim 5, wherein, Along the thickness direction of the heat exchange module, the second opening is opposite to the first opening.

7. The heat exchange module of claim 3, wherein, The number of micropumps (2) is one or more.

8. The heat exchange module of claim 2, wherein, The first flow channel (1111) and the second flow channel (1211) are not connected.

9. The heat exchange module of claim 8, wherein, The number of micropumps (2) is multiple, some of which are connected to the first flow channel (1111) and others are connected to the second flow channel (1211).

10. The heat exchange module of claim 1, wherein, The first circuit board (11) further includes a first functional layer (112), and the second circuit board (12) further includes a second functional layer (122). One side of the first substrate layer (111) is connected to the first functional layer (112), one side of the second substrate layer (121) is connected to the second functional layer (122), and the other side of the first substrate layer (111) is connected to the other side of the second substrate layer (121). A micropump (2) is sealed to one of the first substrate layer (111) and the second substrate layer (121), and there is a gap between the first functional layer (112) or the second functional layer (122) and the micropump (2).

11. The heat exchange module of claim 10, wherein, Also included is a connecting hole (14) that penetrates the first circuit board (11) and the second circuit board (12) and forms an electrical connection between the first functional layer (112) and the second functional layer (122).

12. The heat exchange module of claim 1, wherein, The micro-pump (2) has a working medium inlet and a working medium outlet, at least one of the first circuit board (11) and the second circuit board (12) has two second through holes (15), one end of the second through hole (15) is in communication with one of the first flow channel (1111) and the second flow channel (1211), and the working medium inlet and the working medium outlet are in one-to-one communication with the other ends of the two second through holes (15).

13. An electronic device, comprising: The heat exchange module comprises the heat exchange module according to any one of claims 1 to 12.

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