Heat exchange fluid for heat exchange plate, heat exchange plate, and electronic device

Abstract

The present application provides a heat exchange fluid for a heat exchange plate, a heat exchange plate, and an electronic device. The heat exchange fluid for a heat exchange plate comprises the following components: water, a surfactant, and a defoamer. In the heat exchange fluid, the mass ratio of the surfactant is 0.005-0.1%, and the mass ratio of the defoamer is 0.001-0.02%. In the heat exchange fluid of the present application, the flow resistance of the heat exchange fluid can be reduced by means of the surfactant, such that the heat exchange fluid can flow more quickly over the heat exchange surface in the heat exchange flow channel, which is beneficial for improving the heat exchange efficiency of the heat exchange plate. In addition, the generation of bubbles during the flow process of the heat exchange fluid can be effectively avoided by means of the surfactant, thereby ensuring the continuity and stability of the heat exchange process, which is beneficial for alleviating the problem of local overheating of an electronic product caused by an insufficient heat exchange efficiency.

Description

Heat exchange liquid for heat exchange plate, heat exchange plate and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411390604.1, filed on September 30, 2024, and entitled "Heat exchange liquid for heat exchange plate, heat exchange plate and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of electronic product heat dissipation technology, and more particularly, to a heat exchange liquid for a heat exchange plate, a heat exchange plate and an electronic device. BACKGROUND

[0003] With the continuous improvement of the performance of electronic products, the heat dissipation problem becomes increasingly prominent. The heat exchange liquid used by the traditional heat exchange plate has complex composition, which increases the cost, and at the same time, the resistance is large when flowing in the flow channel, which is easy to produce bubbles, reduces the heat exchange efficiency, and affects the normal operation and stability of the electronic device. SUMMARY

[0004] The present application provides a new technical solution of a heat exchange liquid for a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the heat exchange liquid, which easily leads to local overheating of the electronic product.

[0005] The present application also provides a new technical solution of a heat exchange plate.

[0006] The present application also provides a new technical solution of an electronic device.

[0007] According to a first aspect of the present application, a heat exchange liquid for a heat exchange plate is provided, comprising the following components:

[0008] water, a surfactant and a defoaming agent;

[0009] In the heat exchange liquid, the mass percentage of the surfactant is 0.005% to 0.1%, and the mass percentage of the defoaming agent is 0.001% to 0.02%.

[0010] Optionally, the mass ratio of the surfactant to the defoaming agent is 3 to 5:1.

[0011] Optionally, the mass ratio of the surfactant to the defoaming agent is 4:1.

[0012] Optionally, the heat exchange liquid further comprises an antifreeze agent, and in the heat exchange liquid, the mass percentage of the antifreeze agent is 0.01% to 5%.

[0013] Optionally, in the heat exchange liquid, the mass percentage of the antifreeze agent is 0.02% to 1%.

[0014] Optionally, the antifreeze agent is methanol and / or ethylene glycol.

[0015] Optionally, in the heat exchange liquid, the mass percentage of the water is 98% to 99.9%.

[0016] Optionally, in the heat exchange liquid, the mass percentage of the water is 98.5% to 99.5%.

[0017] Optionally, in the heat exchange liquid, the mass percentage of the defoaming agent is 0.002% to 0.01%.

[0018] Optionally, in the heat exchange liquid, the mass percentage of the surfactant is 0.01% to 0.05%.

[0019] Optionally, the heat exchange liquid comprises water with a mass percentage of 99.475%, a surfactant with a mass percentage of 0.02%, a defoaming agent with a mass percentage of 0.005%, and an antifreeze agent with a mass percentage of 0.5%.

[0020] According to a second aspect of the present application, a heat exchange plate is provided, which is filled with the heat exchange liquid of any one of the preceding aspects.

[0021] According to a third aspect of the present application, an electronic device is provided, which comprises the heat exchange plate.

[0022] According to the heat exchange liquid for heat exchange plate of the present application, the heat exchange liquid mainly comprises water, a surfactant and a defoaming agent, which has simple components and low cost. Moreover, the surfactant can reduce the flow resistance of the heat exchange liquid, so that the heat exchange liquid can flow through the heat exchange surface more quickly in the heat exchange flow channel, which is beneficial to improve the heat exchange efficiency of the heat exchange plate. Meanwhile, the surfactant can effectively avoid the generation of bubbles during the flow of the heat exchange liquid, which ensures the continuity and stability of the heat exchange process, thereby reducing the problem of local overheating of the electronic product caused by insufficient heat exchange efficiency.

[0023] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. DETAILED DESCRIPTION

[0024] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments are illustrative only and do not limit the scope of the present application unless otherwise specifically stated.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting of the scope of the application or its applications or uses.

[0026] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, the techniques, methods, and apparatus should be considered as being part of the specification.

[0027] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0028] It should be noted that like reference numerals and letters refer to like items throughout the attached drawings, and as a result, further discussion of such items is not necessary in the subsequent drawings.

[0029] The embodiments of the present application provide a heat exchange plate, which is provided with at least one heat exchange flow channel for flowing heat exchange liquid.

[0030] The embodiments of the present application also provide a heat exchange liquid for heat exchange plate, which comprises the following components: water, surfactant and defoaming agent; in the heat exchange liquid, the mass percentage of the surfactant is 0.005% to 0.1%, and the mass percentage of the defoaming agent is 0.001% to 0.02%.

[0031] In other words, the main components of the heat exchange liquid for heat exchange plate according to the embodiments of the present application include water, surfactant and defoaming agent, wherein the surfactant can be selected from one or more of self-polyether and polyesters, and the heat exchange liquid can significantly reduce the surface tension under the action of the surfactant, so that the heat exchange liquid can form a more continuous and smooth flow interface during the flow process, thereby effectively reducing the flow resistance of the heat exchange liquid in the heat exchange flow channel, so that the heat exchange liquid can flow faster through the heat exchange surface in unit time in the heat exchange flow channel, thereby improving the efficiency of heat transfer; the defoaming agent can be selected from one or more of organic silicon and polyether, and by adding an appropriate amount of defoaming agent, the bubbles generated during the flow process of the heat exchange liquid can be effectively inhibited, thereby avoiding the negative impact of the bubbles on the heat exchange performance of the heat exchange liquid.

[0032] In the embodiments, the mass percentage of the surfactant is 0.005% to 0.1% (including the end point value), and the mass percentage of the defoaming agent is 0.001% to 0.02% (including the end point value). For example, the mass percentage of the surfactant can be 0.005%, 0.025%, 0.045%, 0.065%, 0.085% and 0.1%, etc. For example, the mass percentage of the defoaming agent can be 0.001%, 0.003%, 0.005%, 0.007%, 0.009% and 0.02%, etc.

[0033] The surfactant and the defoaming agent in the heat exchange liquid can not only effectively reduce the flow resistance of the heat exchange liquid in the heat exchange flow channel, but also effectively avoid the generation of bubbles in the flow process of the heat exchange liquid, thereby significantly improving the heat exchange performance of the heat exchange plate.

[0034] Therefore, the heat exchange liquid for the heat exchange plate provided by the embodiment can effectively reduce the flow resistance of the heat exchange liquid through the surfactant, so that the heat exchange liquid can flow through the heat exchange surface more quickly in the heat exchange flow channel, which is conducive to improving the heat exchange efficiency of the heat exchange plate. At the same time, the surfactant can effectively avoid the generation of bubbles in the flow process of the heat exchange liquid, thereby ensuring the continuity and stability of the heat exchange process, and reducing the problem of local overheating of the electronic product caused by insufficient heat exchange efficiency.

[0035] According to an embodiment of the present application, the mass ratio of the surfactant to the defoaming agent is 3-5:1, which includes the end point values 3:1 and 5:1. It should be noted that the mass ratio of the surfactant to the defoaming agent is closely related to the heat exchange performance of the heat exchange liquid. If the mass ratio of the surfactant to the defoaming agent is less than 3:1, the flowability and heat conductivity of the heat exchange liquid may be reduced, because an excessive amount of defoaming agent may increase the viscosity of the liquid, which is not conducive to the flow of the heat exchange liquid in the heat exchange system. If the mass ratio of the surfactant to the defoaming agent is greater than 5:1, the defoaming ability of the heat exchange liquid may be insufficient, so that bubbles are more likely to form and accumulate, reducing the heat exchange efficiency, because the bubbles will form an insulating layer on the heat exchange surface, hindering the effective transfer of heat.

[0036] That is, by controlling the mass ratio of the surfactant to the defoaming agent within the range of 3:1 to 5:1 (including the end point values), the heat exchange liquid can not only reduce the flow resistance and effectively control the bubbles, but also maintain good heat exchange efficiency and heat exchange stability.

[0037] In some specific embodiments of the present application, the mass ratio of the surfactant to the defoaming agent is 4:1. When the mass ratio of the surfactant to the defoaming agent is less than 4:1, although increasing the amount of defoaming agent can more effectively suppress bubbles, it may increase the viscosity of the liquid, thereby increasing the flow resistance and being not conducive to the flow of the heat exchange liquid. When the mass ratio of the surfactant to the defoaming agent is greater than 4:1, the lack of defoaming agent may not be sufficient to control bubbles, thereby reducing the heat exchange efficiency.

[0038] Therefore, by controlling the mass ratio of the surfactant to the defoaming agent to be 4:1, the defoaming effect and flowability can be balanced, so that the heat exchange liquid can effectively control bubbles while maintaining low flow resistance and high heat exchange performance.

[0039] According to one embodiment of the present application, the heat exchange liquid further comprises an antifreeze agent, and the mass percentage of the antifreeze agent in the heat exchange liquid is 0.01% to 5%.

[0040] That is, the heat exchange liquid further comprises an antifreeze agent, and the antifreeze agent can lower the freezing point of the heat exchange liquid, ensure that the system will not freeze in a low-temperature environment, and can also increase the boiling point of the heat exchange liquid to prevent boiling in a high-temperature operating condition, effectively avoid the heat exchange liquid in a thermal saturation state, and maintain stable heat exchange efficiency of the heat exchange liquid in an extreme temperature condition.

[0041] In the embodiment, the mass percentage of the antifreeze agent is 0.01% to 5% (including the end point value). For example, the mass percentage of the antifreeze agent can be 0.01%, 0.3%, 0.5%, 1%, 2%, 3%, 4%, and 5%, etc. The antifreeze agent in the heat exchange liquid in the ratio can not only effectively expand the working temperature range of the heat exchange liquid, but also reduce the surface tension of the heat exchange liquid to some extent, so that the use of the surfactant can be reduced. At the same time, under the joint action of the surfactant, the defoaming agent, and the antifreeze agent, the flow resistance of the heat exchange liquid can be reduced, and the generation of bubbles in the flow process of the heat exchange liquid can be effectively prevented.

[0042] In some specific embodiments of the present application, the mass percentage of the antifreeze agent in the heat exchange liquid is 0.02% to 1%, and in this range, the working temperature range of the heat exchange liquid can be effectively expanded, and the heat exchange liquid can have a lower flow resistance and better heat exchange capacity.

[0043] For example, the mass percentage of the antifreeze agent can be 0.02%, 0.04%, 0.06%, 0.07%, and 0.1%, etc. The above values can effectively expand the working temperature range of the heat exchange liquid, and ensure that the heat exchange liquid has a lower flow resistance and better heat exchange capacity.

[0044] According to one embodiment of the present application, the antifreeze agent is one or more of methanol and ethylene glycol. Methanol and ethylene glycol can not only expand the working temperature range of the heat exchange liquid, but also have relatively low cost, which can effectively reduce the production cost of the heat exchange liquid.

[0045] In some specific embodiments of the present application, the mass percentage of water in the heat exchange liquid is 98% to 99.9%, and in this range, the heat exchange liquid can have good heat transfer efficiency.

[0046] According to one embodiment of the present application, the mass percentage of water in the heat exchange liquid is 98.5% to 99.5%, and in this range, the heat exchange liquid can have good heat transfer efficiency.

[0047] Optionally, the mass percentage of water can be 98.5%, 98.8%, 99.1%, 99.5%, etc. The above values can ensure that the heat exchange liquid has good heat transfer efficiency.

[0048] In some embodiments of the present application, the mass percentage of defoaming agent in the heat exchange liquid is 0.002%-0.01%, for example, the mass percentage of defoaming agent can be 0.002%, 0.004%, 0.006%, 0.008% and 0.01%, etc. When the mass percentage of defoaming agent is less than 0.002%, the lack of defoaming agent may not be sufficient to control bubbles, reducing heat exchange efficiency; when the mass percentage of defoaming agent is greater than 0.01%, although increasing the defoaming agent can more effectively suppress bubbles, it may lead to an increase in liquid viscosity, thereby increasing flow resistance, which is not conducive to the flow of heat exchange liquid.

[0049] Therefore, by controlling the mass percentage of defoaming agent in the range of 0.002%-0.01%, the defoaming effect and flowability can be balanced, ensuring that the heat exchange liquid effectively controls bubbles while maintaining low flow resistance and high heat exchange performance.

[0050] According to one embodiment of the present application, the mass percentage of surfactant in the heat exchange liquid is 0.01%-0.05%, for example, the mass percentage of surfactant can be 0.01%, 0.02%, 0.03%, 0.04% and 0.05%, etc. Within this range, the heat exchange liquid can ensure good flowability in the heat exchange channel.

[0051] In some embodiments of the present application, the heat exchange liquid includes water with a mass percentage of 99.475%, 0.02% surfactant, 0.005% defoaming agent and 0.5% antifreeze.

[0052] The effects of the heat exchange liquid of the embodiments of the present application are described in detail below in combination with specific experimental groups.

[0053] Experimental group 1

[0054] The heat exchange liquid contains 99.4713% water, 0.02% surfactant, 0.0067% defoaming agent and 0.5% antifreeze.

[0055] Experimental group 2

[0056] The heat exchange liquid contains 99.4713% water, 0.02% surfactant, 0.0067% defoaming agent and 0.5% antifreeze.

[0057] Experimental group 3

[0058] The heat exchange liquid comprises: 99.476% water, 0.02% surfactant, 0.004% defoaming agent and 0.5% antifreeze.

[0059] Control group 1

[0060] The heat exchange liquid is 100% water.

[0061] Experimental steps:

[0062] The heat exchange liquid is injected into the heat exchange plate of the heat exchange module.

[0063] The heat exchange module is installed on the electronic device, ensuring that the hot end of the heat exchange plate is in contact with the high heat area of the electronic device (for example, the area where the processor of the electronic device is located), and the cold end of the heat exchange plate is in contact with the low heat area of the electronic device (i.e., the area that is not hot when the electronic device is working, such as the area where the battery is located, or the area that does not generate heat).

[0064] The electronic device is operated at rated power until the temperature of the heat exchange plate reaches a steady state.

[0065] The temperature is measured at the hot end (first detection site) and cold end (second detection site) of the heat exchange plate.

[0066] The temperature difference between the two detection sites is calculated.

[0067] It should be noted that in this experiment, the electronic device used is a mobile phone, and the heat exchange plate transfers the heat from the high heat area of the mobile phone to the low heat area through the heat exchange liquid circulating inside, thereby achieving the cooling effect.

[0068] The distance between the first detection site and the second detection site is about 120mm, and the smaller the temperature difference between the first detection site and the second detection site, the higher the heat exchange efficiency of the heat exchange plate, because the heat is more evenly distributed on the heat exchange plate, reducing the temperature difference.

[0069] Table 1 Experimental results of experimental groups 1-3 and control group 1

[0070] As can be seen from Table 1, the heat exchange liquid for the heat exchange plate of the present application has a higher heat exchange efficiency when the mass fraction of the surfactant is 0.005% to 0.1% and the mass fraction of the defoaming agent is 0.001% to 0.02%; when the mass ratio of the surfactant to the defoaming agent is 3 to 5:1, the heat exchange efficiency is better, especially when the mass ratio of the surfactant to the defoaming agent is 4:1.

[0071] To sum up, the heat exchange liquid for the heat exchange plate provided by the embodiment mainly comprises water, a surfactant and a defoaming agent, the components are simple, the cost is low, the flow resistance of the heat exchange liquid can be reduced by the surfactant, the heat exchange liquid can flow through the heat exchange surface more quickly in the heat exchange flow channel, the heat exchange efficiency of the heat exchange plate is improved, the generation of bubbles in the flow process of the heat exchange liquid can be effectively avoided by the surfactant, the continuity and stability of the heat exchange process are ensured, and the problem of local overheating of the electronic product caused by insufficient heat exchange efficiency is reduced.

[0072] The embodiment of the present application also provides a heat exchange plate, the heat exchange flow channel of the heat exchange plate is filled with the heat exchange liquid described in any one of the above embodiments. Since the heat exchange liquid according to the embodiment of the present application has the above technical effects, the heat exchange plate according to the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described again.

[0073] The embodiment of the present application also provides an electronic device, for example, but not limited to, a mobile phone, a tablet computer and a VR device, etc., the electronic device comprises the heat exchange plate described in the above embodiments. Since the heat exchange liquid according to the embodiment of the present application has the above technical effects, the heat exchange plate according to the embodiment of the present application also has corresponding technical effects, and the embodiment will not be described again.

[0074] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, but not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchange liquid for heat exchange plates, characterized by Comprise the following components: Water, surfactant and defoaming agent; In the heat exchange liquid, the mass percentage of the surfactant is 0.005%-0.1%, and the mass percentage of the defoaming agent is 0.001%-0.02%.

2. The heat exchange liquid for heat exchange plates according to claim 1, characterized in that, The mass ratio of the surfactant to the defoaming agent is 3-5:

1.

3. The heat exchange fluid for heat exchange plates according to claim 2, characterized by The mass ratio of the surfactant to the defoaming agent is 4:

1.

4. The heat exchange fluid for heat exchange plates according to claim 1, characterized by The heat exchange liquid further comprises an antifreeze agent, and in the heat exchange liquid, the mass percentage of the antifreeze agent is 0.01%-5%.

5. The heat exchange fluid for heat exchange plates according to claim 4, wherein In the heat exchange liquid, the mass percentage of the antifreeze agent is 0.02%-1%.

6. The heat exchange fluid for heat exchange plates according to claim 4, wherein The antifreeze agent is methanol and / or ethylene glycol.

7. The heat exchange fluid for heat exchange plates according to claim 1, characterized by In the heat exchange liquid, the mass percentage of the water is 98%-99.9%.

8. The heat exchange fluid for heat exchange plates according to claim 7, characterized by In the heat exchange liquid, the mass percentage of the water is 98.5%-99.5%.

9. The heat exchange fluid for heat exchange plates according to claim 1, characterized by In the heat exchange liquid, the mass percentage of the defoaming agent is 0.002%-0.01%.

10. The heat exchange fluid for heat exchange plates according to claim 1, characterized by In the heat exchange liquid, the mass percentage of the surfactant is 0.01%-0.05%.

11. The heat exchange fluid for heat exchange plates according to claim 1, characterized by The heat exchange liquid comprises water with a mass percentage of 99.475%, surfactant with a mass percentage of 0.02%, defoaming agent with a mass percentage of 0.005%, and antifreeze agent with a mass percentage of 0.5%.

12. A heat exchange plate, characterized by The heat exchange plate is filled with the heat exchange liquid as claimed in any one of claims 1-11.

13. An electronic device, comprising: The heat exchange plate comprises the heat exchange plate as claimed in claim 12.

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