Electronic component and manufacturing method therefor, circuit board, and packaging module and manufacturing method therefor

Abstract

Provided are an electronic component, a manufacturing method for an electronic component, a circuit board, a packaging module, a manufacturing method for a packaging module, and an electronic device. The electronic component comprises a component body and a plurality of pins arranged on a peripheral side of the component body, each pin comprising a first part and a second part, the first part being located on a bottom surface of the component body, and the second part being located on a side surface of the component body. In the technical solutions of embodiments of the present application, the mounting height of the electronic component can be reduced on the premise of meeting the mounting reliability requirements for the electronic component, thereby reducing the overall thickness of a packaging module.

Description

Electronic device and method of manufacturing the same, circuit board, package module and method of manufacturing the same

[0001] Cross-reference to Related Applications

[0002] This application claims priority to the Chinese Patent Application No. 202411366227.8, filed on September 27, 2024, and entitled “Electronic device and method of manufacturing the same, circuit board, package module and method of manufacturing the same”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] Embodiments of the present application relate to the packaging technology field, and in particular to an electronic device, a manufacturing method of the electronic device, a circuit board, a package module, a manufacturing method of the package module, and an electronic device. BACKGROUND

[0004] In related technologies, with the development trend of thinness of electronic devices such as mobile phones, smart watches, etc., higher requirements are put forward for the size of the package module inside the electronic devices for supporting the implementation of some functions. At present, the thickness of the package module has become a major aspect restricting the further development of electronic devices towards thinness. How to reduce the thickness size of the package module is a technical problem to be solved by those skilled in the art. SUMMARY

[0005] Embodiments of the present application provide an electronic device, a manufacturing method of the electronic device, a circuit board, a package module, a manufacturing method of the package module, and an electronic device, to reduce the overall thickness size of the package module.

[0006] According to an aspect of the present application, an electronic device is provided, which includes a device body and a plurality of pins, the plurality of pins being arranged on a peripheral side of the device body, wherein each pin includes a first part and a second part, the first part being located on a bottom surface of the device body, and the second part being located on a side surface of the device body.

[0007] According to the technical solutions of the embodiments of the present application, the following technical effects can be achieved: on the one hand, since the first part and the second part can be welded with the solder pads of the circuit board through the solder, the welding bonding area is large, thus reliable mounting of the electronic device on the circuit board can be achieved; on the other hand, under the premise of meeting the mounting reliability requirements, the amount of solder between the first part and the solder pad can be appropriately reduced, so that the mounting height of the electronic device is low, and the overall thickness size of the package module is small.

[0008] In some embodiments, the device body includes four edge portions and four corner portions, wherein the plurality of pins are distributed on the four edge portions; or the plurality of pins are distributed on two opposite edge portions of the four edge portions; or at least one pin of the plurality of pins is arranged in one-to-one correspondence with at least one corner portion of the four corner portions. The number and position of the pins can be designed according to the specific product type of the electronic device.

[0009] In some embodiments, the second portion is flush with the top surface of the device body; or the second portion has a spacing from the top surface of the device body. The specific size of the pin can be designed according to the product design requirement of the electronic device, the related production process, etc.

[0010] In some embodiments, the electronic device includes a capacitor device, a surface acoustic wave filter device, or a power amplifier device. Based on the foregoing design, the electronic device can have a lower mounting height on the circuit board.

[0011] According to an aspect of the present application, a method for manufacturing an electronic device is provided, which includes:

[0012] providing an electronic device wafer including a plurality of wafer units separated by a mesh-shaped separation groove;

[0013] forming a plating layer on a side surface of the electronic device wafer, the plating layer including a plurality of plating units separated from each other, wherein each plating unit is formed on a bottom surface and a side surface of the mesh-shaped separation groove and a surface of an adjacent wafer unit; and

[0014] cutting the electronic device wafer and the plating layer along the mesh-shaped separation groove to separate the plurality of wafer units from each other and form a plurality of pins on a peripheral side of each wafer unit, wherein each wafer unit serves as a device body of the electronic device, each pin is obtained by cutting the plating layer, and each pin includes a first portion and a second portion, the first portion being located on a bottom surface of the device body, and the second portion being located on a side surface of the device body.

[0015] The electronic device manufactured by the manufacturing method of the above embodiments of the present application not only can be reliably mounted on a circuit board, but also can achieve a lower mounting height, thereby making the overall thickness of the packaging module smaller.

[0016] According to an aspect of the present application, a circuit board is provided, which comprises a first surface and a second surface, and comprises: N metal layers arranged in sequence in a direction away from the first surface; at least one dielectric layer spacing the N metal layers from each other; a plurality of via metals electrically connecting the N metal layers; and a solder resist layer covering part of the surface of the first metal layer, the solder resist layer having a first opening window; wherein the first surface has a groove exposed to the first opening window, part of the metal of the mth metal layer is exposed to the bottom of the groove, at least two via metals located on the side of the mth metal layer close to the first surface are exposed to the side of the groove and serve as a first pad group with the part of the metal of the mth metal layer, the first pad group comprising a plurality of first pads, wherein N≥2 and 2≤m≤N.

[0017] In these embodiments, based on the design of the circuit board, the electronic device is partially sunk into the groove in the thickness direction, so that the mounting height of the electronic device is lower, and thus the overall thickness size of the packaging module is smaller.

[0018] In some embodiments, the solder resist layer further has a second opening window exposing part of the metal of the first metal layer, the part of the metal of the first metal layer serving as a second pad group, the second pad group comprising a plurality of second pads. In actual design of the circuit board, the thickness sizes of various electronic devices to be mounted thereon need to be considered comprehensively. For example, for an electronic device with the largest or relatively large thickness size, a first pad group can be designed on the circuit board for the electronic device, and the electronic device is designed with reference to the structure of the aforementioned electronic device; for an electronic device with a relatively small thickness size, a second pad group can be designed on the circuit board for the electronic device, and the electronic device can be a traditional electronic device. In this way, after the circuit board is assembled with various electronic devices, the overall thickness is small, so that the overall thickness of the packaging module is small.

[0019] According to an aspect of the present application, a packaging module is provided, which comprises: a first circuit board comprising a plurality of pad groups, wherein each pad group comprises a plurality of pads; and a plurality of electronic devices corresponding to the plurality of pad groups one by one, wherein each electronic device comprises a plurality of pins, the plurality of pins are welded to the plurality of pads of the corresponding pad group one by one, and the plurality of electronic devices comprises a first electronic device, the first electronic device being an electronic device designed according to the aforementioned embodiments.

[0020] According to the packaging module of the embodiments of the present application, the pins of at least one electronic device comprise a first part and a second part, both of which can be welded to the pads by solder, so that the at least one electronic device can be reliably mounted on the first circuit board, and since the amount of solder between the first part of the pin and the pad can be appropriately reduced, the mounting height of the at least one electronic device is lower, thereby facilitating reduction of the overall thickness of the packaging module.

[0021] In some embodiments, the first circuit board comprises a first surface and a second surface, and comprises: N metal layers arranged in sequence in a direction away from the first surface, at least one dielectric layer spacing the N metal layers, a plurality of via metals electrically connecting the N metal layers, and a solder mask layer covering part of the surface of the first metal layer, the solder mask layer having a first opening, wherein the first surface has a groove exposed to the first opening, part of the metal of the mth metal layer is exposed to the bottom of the groove, and at least two via metals located on the side of the mth metal layer close to the first surface are exposed to the side of the groove and serve as a pad group corresponding to the first electronic device, wherein N≥2, 2≤m≤N. In these embodiments, the first electronic device is partially sunk into the groove in the thickness direction, so that the mounting height is lower, which is beneficial to further reduce the overall thickness of the packaging module.

[0022] In some embodiments, the plurality of electronic devices further comprises a second electronic device; the solder mask layer further has a second opening exposing part of the metal of the first metal layer, and the part of the metal of the first metal layer serves as a pad group corresponding to the second electronic device. In actual design, the thickness size of each electronic device needs to be considered comprehensively, so that after the circuit board is assembled with each electronic device, the overall thickness is small, so that the overall thickness of the packaging module is small.

[0023] In some embodiments, the first electronic device and the second electronic device are arranged in sequence in a direction away from the second surface, and the orthographic projection of the first electronic device on the second surface is located within the orthographic projection of the second electronic device on the second surface. Since the mounting height of the first electronic device is low, under the premise of meeting the design requirements of the module thickness, the first electronic device and the second electronic device can have multiple arrangement schemes, for example, they can be arranged flat or in the thickness direction.

[0024] In some embodiments, the packaging module further comprises a second circuit board, which is welded to the first surface by solder balls.

[0025] In some embodiments, at least one electronic device in the plurality of electronic devices is arranged on the second surface, and the packaging module further comprises a second circuit board, which is welded to the second surface of the first circuit board by solder balls.

[0026] Since the mounting height of the first electronic device is low, under the premise of meeting the design requirements of the module thickness, the packaging module can comprise multiple circuit boards, and the design can be more flexible, for example, one of which serves as a main board and the other serves as a secondary board.

[0027] According to one aspect of the present application, a packaging module manufacturing method is provided, which comprises:

[0028] providing a circuit board according to the foregoing embodiments;

[0029] providing a stepped steel mesh, and aligning the stepped steel mesh with the first surface of the circuit board to define a filling recess, wherein the stepped steel mesh comprises a planar shielding region, a stepped shielding region, and a hollowed region, a portion of the stepped shielding region is sunken into the recess and has a gap between the portion of the stepped shielding region and a portion of the surface of the recess to expose the first pad set to the filling recess;

[0030] filling the filling recess with solder;

[0031] separating the stepped steel mesh from the circuit board; and

[0032] providing an electronic device according to the foregoing embodiment, and soldering the plurality of pins of the electronic device to the first pad set by the solder left on the first pad set.

[0033] The packaging module manufactured according to the manufacturing method of the foregoing embodiment of the present application has at least one electronic device with a portion sunken into the recess in the thickness direction, which can reduce the mounting height, and thus the packaging module can have a smaller thickness size.

[0034] According to an aspect of the present application, an electronic device is provided, which includes a housing and a packaging module according to the foregoing embodiment disposed in the housing.

[0035] Since the packaging module has a smaller thickness size, it occupies less space in the electronic device, which provides a wide design space for further optimization of the internal structure of the electronic device and thin design of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0036] FIG. 1 is a schematic diagram of a partial cross-sectional structure of a radio frequency module according to some related art;

[0037] FIG. 2 is a schematic diagram of a partial cross-sectional structure of an electronic device applied to a packaging module according to some embodiments of the present application;

[0038] FIG. 3A is a schematic diagram of a top view structure and a cross-sectional structure along A-A of an electronic device according to some embodiments of the present application;

[0039] FIG. 3B is a schematic diagram of a top view structure and a cross-sectional structure along B-B of an electronic device according to some embodiments of the present application;

[0040] FIG. 3C is a schematic diagram of a top view structure and a cross-sectional structure along C-C of an electronic device according to some embodiments of the present application;

[0041] FIG. 4A is a schematic diagram of a flow of a manufacturing method of an electronic device according to some embodiments of the present application;

[0042] FIG. 4B is a graphical schematic diagram of a method of manufacturing an electronic device according to some embodiments of the present application;

[0043] FIG. 5A is a partial cross-sectional structural schematic diagram of a packaging module according to some embodiments of the present application;

[0044] FIG. 5B is a partial cross-sectional structural schematic diagram of a packaging module according to some embodiments of the present application;

[0045] FIG. 5C is a partial cross-sectional structural schematic diagram of a packaging module according to some embodiments of the present application;

[0046] FIG. 6A is a flow schematic diagram of a method of manufacturing a packaging module according to some embodiments of the present application;

[0047] FIG. 6B is a graphical schematic diagram of a method of manufacturing a packaging module according to some embodiments of the present application;

[0048] FIG. 7 is a structural block diagram of an electronic device according to some embodiments of the present application.

[0049] Reference Signs:

[0050] Related Art: 001 - Radio frequency module; 010 - Circuit board; 011 - Capacitor device; 012 - Surface acoustic wave filter device; 013 - Power amplifier device; 014 - Metal layer; 015 - Dielectric layer; 016 - Via metal; 017 - Pin; 018 - Pad; 019 - Solder.

[0051] Embodiments of the Present Application: 100, 430 - Electronic device; 430a - First electronic device; 430b - Second electronic device; 110 - Device body; 120 - Pin; 121 - First portion; 122 - Second portion; 210 - Electronic device wafer; 211 - Mesh isolation groove; 2100 - Wafer unit; 212 - Electroplated layer; 2120 - Electroplated unit; 300, 130 - Circuit board; 300a - First face; 300b - Second face; 301 - Metal layer; 302 - Dielectric layer; 303 - Via metal; 304 - Solder resist layer; 305 - First window; 306 - Groove; 307 - First pad group; 3070 - First pad; 308 - Second pad group; 3080 - Second pad; 309 - Second window; 400 - Packaging module; 410 - First circuit board; 420 - Pad group; 131, 421 - Pad; 450 - Solder ball; 440 - Second circuit board; 200, 500 - Method of manufacturing; S11-S13, S21-S25 - Step; 501 - Ladder steel mesh; 502 - Filling recess; 503 - Planar shielding area; 504 - Ladder shielding area; 505 - Hollowed area; 506 - Solder; 600 - Electronic device; 610 - Enclosure. DETAILED DESCRIPTION

[0052] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0053] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and the appended claims of the application, the singular forms “a,” “an” and “the” are intended to include both the singular and the plural forms, unless the context clearly indicates otherwise.

[0054] In this specification, the reference to “one embodiment” or “the embodiment” or “specific embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases “in one embodiment” or “in the embodiment” or “in specific embodiments” in various places in the specification are not necessarily all referring to the same embodiment.

[0055] With the development trend of thinness of some electronic devices, higher requirements are put forward for the size of the packaging modules inside the electronic devices for supporting the implementation of some functions. For example, a mobile phone generally has a radio frequency module inside, which is mainly used for processing wireless signal transmission between the mobile phone and the communication network. The radio frequency module is a kind of packaging module and is made through packaging process.

[0056] As shown in FIG. 1, it is a schematic diagram of a partial cross-sectional structure of a radio frequency module 001 according to some related technologies. The main structure of the radio frequency module 001 includes a circuit board 010, and a capacitor device 011 (a kind of passive device, 010015 is the specification type number thereof), a surface acoustic wave filter device 012 (surface acoustic wave, SAW), and a power amplifier device 013, etc. of 010015 specification type, which are surface mounted on the surface of the circuit board 010 by surface mount technology (SMT). The circuit board 010 includes multiple metal layers 014 which are spaced by a dielectric layer 015 and electrically connected by a via metal 016. The capacitor device 011, the surface acoustic wave filter device 012, and the power amplifier device 013 are electrically connected with the metal layer 014 closest to the surface of the circuit board 010.

[0057] SMT is a processing technology for mounting electronic devices on the surface of a circuit board, and is an important process of packaging technology. Compared with the traditional through-hole technology (THT), SMT can significantly simplify the process, reduce production time and cost, and improve production efficiency and product quality. The basic working principle of the surface acoustic wave filter device 012 is to convert a wireless signal into an acoustic signal on the surface of a medium through a piezoelectric effect at the input end, and convert the acoustic signal into a wireless signal through an inverse piezoelectric effect at the output end. The basic working principle of the power amplifier device 013 is to convert the power of a power supply into a current that varies according to an input signal by using the current control action of a transistor or the voltage control action of a field effect transistor.

[0058] As can be seen from FIG. 1, in these related technologies, the capacitor device 011 has a larger thickness size H1 than the surface acoustic wave filter device 012 and the power amplifier device 013, which makes it the main factor restricting the further thinning development of the radio frequency module 001.

[0059] Therefore, the embodiments of the present application provide an electronic device, a manufacturing method of an electronic device, a circuit board, a packaging module, a manufacturing method of a packaging module, and an electronic device, to reduce the overall thickness of the packaging module. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0060] As shown in FIGS. 2 and 3A, FIG. 2 is a partial cross-sectional structure schematic diagram of a packaging module 400 after an electronic device 100 is applied to the packaging module 400 according to some embodiments of the present application, and FIG. 3A is a top view structure and cross-sectional structure schematic diagram of the electronic device 100 according to some embodiments of the present application. In these embodiments, the electronic device 100 includes a device body 110 and a plurality of pins 120, wherein the device body 110 is used to implement the basic function of the device, and the pins 120 are used as ports of the electronic device 100 and are used to be electrically connected to the corresponding pads 131 on the circuit board 130 by soldering. In these embodiments of the present application, the plurality of pins 120 are arranged on the side of the device body 110, and each pin 120 includes a first part 121 and a second part 122, wherein the first part 121 is located on the bottom surface of the device body 110, and the second part 122 is located on the side surface of the device body 110.

[0061] In the embodiments of the present application, the specific product types of the electronic device 100 can include but are not limited to capacitor devices, surface acoustic wave filter devices, or power amplifier devices, etc. The specific product types of the packaging module 400 can include but are not limited to radio frequency modules.

[0062] In the embodiments of the present application, the "bottom surface of the device body 110" can be understood as the surface of the device body 110 facing the circuit board 130 after the electronic device 100 is assembled with the circuit board 130. The "side surface of the device body 110" can be perpendicular to or at an angle with the "bottom surface of the device body 110". The pins 120 and the corresponding pads 131 provided on the circuit board 130 can be electrically connected by soldering.

[0063] Soldering refers to a welding method in which a filler metal is used to fill the gap between the welding parts after the filler metal and the welding parts are heated to the melting temperature of the filler metal, so that the welding parts are connected. According to the welding temperature, soldering can be divided into two categories. The soldering with a welding temperature not exceeding 450°C is called soft soldering, and the soldering with a welding temperature exceeding 450°C is called hard soldering. In the embodiments of the present application, the welding between the pins 120 and the corresponding pads 131 can be achieved by soft soldering, and the filler metal can be, for example, a tin-lead alloy or the like.

[0064] With the electronic device designed in the conventional manner, such as the capacitor device 011, the surface acoustic wave filter device 012, and the power amplifier device 013 in the related art described above, referring to FIG. 1, a plurality of pins 017 are provided at the bottom thereof. In order to reliably weld the pins 017 with the corresponding pads 018 provided on the circuit board 010, a sufficient amount of filler metal 019 needs to be filled between the pins 017 and the pads 018, resulting in a high mounting height of the electronic device. For example, the capacitor device 011 of the 010015 specification has a higher mounting height H1 than the surface acoustic wave filter device 012 and the power amplifier device 013 due to its larger thickness dimension, and is a key factor determining the overall thickness of the radio frequency module 001. In this document, the "mounting height of the electronic device" can be understood as the height dimension of the electronic device protruding from the surface of the circuit board after mounting.

[0065] As shown in FIG. 2, according to the technical solutions of the embodiments of the present application, the first part 121 of each pin 120 is located on the bottom surface of the device body 110, and the second part 122 of each pin 120 is located on the side surface of the device body 110. In this way, at least the following technical effects can be achieved:

[0066] On the one hand, since the first part 121 and the second part 122 can be welded with the pads 131 by the filler metal 506, the welding bonding area is large, and thus reliable mounting of the electronic device 100 on the circuit board 130 can be achieved.

[0067] On the other hand, under the premise of meeting the mounting reliability requirement, the amount of filler metal between the first part 121 and the pads 131 can be appropriately reduced. In this way, compared with the electronic device designed in the conventional manner, the mounting height H2 of the electronic device 100 is lower, and the overall thickness dimension of the packaging module 400 is smaller.

[0068] In some embodiments of the present application, the device body 110 can be substantially rectangular, such as square (as shown in FIG. 3A) or rectangular, which includes four edge portions and four corner portions. The number of pins 120 included in the electronic device 100 is not limited, for example, can be two, four, six, or eight, etc., and the number and position of the pins 120 can be designed according to the specific product type of the electronic device 100. As shown in FIGS. 3A, 3B and 3C, which show the top view structure and cross-sectional structure schematic diagram of some electronic devices 100 with different design forms.

[0069] As shown in FIG. 3A, in some embodiments of the present application, the plurality of pins 120 can be distributed on the four edge portions of the device body 110, for example, eight pins 120 are distributed in pairs on the four edge portions of the device body 110.

[0070] As shown in FIG. 3B, in some embodiments of the present application, the plurality of pins 120 can be distributed on two opposite edge portions of the four edge portions, for example, four pins 120 are distributed in pairs on two opposite edge portions of the device body 110.

[0071] In some embodiments of the present application, at least one pin 120 of the plurality of pins 120 can be provided one-to-one in at least one corner portion of the four corner portions. As shown in FIG. 3C, in these embodiments, four pins 120 are provided one-to-one in the four corner portions.

[0072] It can be understood that based on the number and position of the pins 120 of the electronic device 100, the number and position of the pads 131 provided on the circuit board 130 corresponding to the electronic device 100 should be designed accordingly.

[0073] As shown in FIGS. 3A and 3B, in some embodiments of the present application, the second portion 122 of the pin 120 can be flush with the top surface of the device body 110. In this way, on the one hand, there can be more solder between the second portion 122 and the pad 131, so that the amount of solder between the first portion 121 and the pad 131 can be reduced accordingly, to further reduce the mounting height of the electronic device 100. In addition, such design also facilitates soldering operation.

[0074] As shown in FIG. 3C, in some other embodiments of the present application, the second portion 122 of the pin 120 can also have a spacing with the top surface of the device body 110, which can be designed according to the product design requirements, related production process, etc. of the electronic device 100.

[0075] According to some embodiments of the present application, a manufacturing method of the electronic device 100 is also provided. As shown in FIG. 4A and FIG. 4B, wherein FIG. 4A shows a flowchart of the manufacturing method of the electronic device 100 according to some embodiments of the present application, and FIG. 4B shows a graphical illustration of the manufacturing method 200. The manufacturing method 200 can include the following steps S11-S13.

[0076] At step S11, an electronic device wafer 210 (a partial structure of which is shown in FIG. 4B) is provided, which includes a plurality of wafer units 2100 separated by a reticular separation groove 211. Each wafer unit 2100 will eventually be manufactured into a device body 110 of the electronic device 100, for realizing the basic functions of the electronic device 100.

[0077] At step S12, a plating layer 212 is formed on a side surface of the electronic device wafer 210, which includes a plurality of plating units 2120 separated from each other, wherein each plating unit 2120 is formed on the bottom surface and side surface of the reticular separation groove 211, and the surface of the adjacent wafer unit 2100. The plating layer 212 is used to form the pin 120 of the electronic device 100, thereby serving as a port of the electronic device 100.

[0078] At step S13, the electronic device wafer 210 and the plating layer 212 are cut along the reticular separation groove 211, so as to separate the plurality of wafer units 2100 from each other and form a plurality of pins 120 on the peripheral side of each wafer unit 2100, wherein each wafer unit 2100 serves as the device body 110 of the electronic device 100, each pin 120 is cut from the plating layer 212, and each pin 120 includes a first portion 121 located on the bottom surface of the device body 110 and a second portion 122 located on the side surface of the device body 110.

[0079] In some embodiments of the present application, the manufacturing method 200 described above can include other manufacturing steps in addition to the steps S11-S13 described above, such as thickness thinning or support layer peeling of the electronic device wafer 210, edge processing of the cut electronic device wafer 210, etc., which are not limited in the present application.

[0080] As shown in FIG. 2, the electronic device 100 manufactured according to the manufacturing method 200 described above of the present application can not only be reliably mounted on the circuit board 130, but also can realize a lower mounting height compared to the electronic device of the conventional design, thereby making the overall thickness of the packaging module 400 smaller.

[0081] According to some embodiments of the present application, a circuit board is also provided. As shown in FIG. 5A, which is a schematic diagram of a partial cross-sectional structure of a circuit board 300 applied to a packaging module 400 according to some embodiments of the present application. The circuit board 300 includes a first surface 300a and a second surface 300b, and includes: N metal layers 301 (N=4 is shown in the figure) arranged in sequence in a direction away from the first surface 300a, at least one dielectric layer 302 spacing the N metal layers 301 from each other, a plurality of via metals 303 electrically connecting the N metal layers 301, and a solder resist layer 304 covering part of the surface of the first metal layer, the solder resist layer 304 having a first window 305, wherein the first surface 300a has a groove 306 exposed to the first window 305, part of the mth (m=2 is shown in the figure) metal layer is exposed to the bottom of the groove 306, at least two via metals 303 located on the side of the mth metal layer close to the first surface 300a are exposed to the side of the groove 306 and are used as a first pad group 307 together with the part of the mth metal layer, the first pad group 307 includes a plurality of first pads 3070, wherein N≥2, 2≤m≤N.

[0082] In the embodiments of the present application, the circuit board can be a hard printed circuit board (PCB) or a flexible printed circuit (FPC). The metal layer 301 can be, for example, copper, used as the circuit structure of the circuit board 300. The dielectric layer 302 can be, for example, a prepreg (PP) or a core, used as an interlayer insulating layer. The material of the via metal 303 can be, for example, copper, used to realize the electrical connection of different metal layers 301. The material of the solder resist layer 304 can be, for example, acrylic oligomer (also known as green oil), used as a protective layer.

[0083] As shown in FIG. 5A, according to the circuit board 300 of the embodiments of the present application, the part of the metal of the mth metal layer and the at least two via metals 303 on the side of the mth metal layer close to the first surface 300a together form the first pad group 307, which can be soldered with the plurality of pins 120 of the electronic device 100 of the above embodiments or the electronic device made according to the manufacturing method 200 of the above embodiments. In this case, the part of the metal of the mth metal layer is used to solder with the first part 121 of the plurality of pins 120, and the at least two via metals 303 on the side of the mth metal layer close to the first surface 300a are used to solder with the second part 122 of the plurality of pins 120. In this way, the electronic device 100 has a part sunken into the groove 306 in the thickness direction, so that the mounting height of the electronic device 100 is lower, and the overall thickness size of the package module 400 is smaller. In some embodiments, the mounting height of the electronic device 100 can be reduced by 25-40 microns by using the circuit board 300 and the electronic device 100 of the above design.

[0084] In the embodiments of the present application, the parameters N and m take values within the above defined ranges, and the embodiments of the present application do not limit the specific values thereof. For example, in some embodiments, the structure of the circuit board can be designed as follows: the part of the metal of the 3rd metal layer and the plurality of via metals 303 on the side of the 3rd metal layer close to the first surface 300a together form the first pad group 307, which can be soldered with the plurality of pins 120 of the electronic device 100 of the above embodiments or the electronic device made according to the manufacturing method 200 of the above embodiments. These embodiments are not shown in the drawings.

[0085] As shown in FIG. 5A, in some embodiments of the present application, the solder resist layer 304 can also have a second window 309, which exposes the part of the metal of the 1st metal layer, which is used as the second pad group 308 including a plurality of second pads 3080. The second pad group 308 can be used to mount the electronic device of the conventional design described above. In order to distinguish from the conventional electronic device, in some descriptions below, the electronic device 100 designed according to the embodiments of the present application is referred to as the first electronic device 430a, and the conventional electronic device is referred to as the second electronic device 430b.

[0086] In the embodiments of the present application, the specific number and specific arrangement position of the first pad group 307 and the second pad group 308 are not limited. In actual design, the thickness dimension of each electronic device to be mounted on the circuit board 300 should be considered. For example, for the electronic device with the largest or relatively large thickness dimension, the first pad group 307 can be designed on the circuit board 300 for the electronic device, and the electronic device can be designed according to the structure of the first electronic device 430a. For the electronic device with relatively small thickness dimension, the second pad group 308 can be designed on the circuit board 300 for the electronic device, and the electronic device can be a conventional electronic device, i.e., the second electronic device 430b. In this way, after the circuit board 300 is assembled with each electronic device, the overall thickness is relatively small, so that the overall thickness of the packaging module 400 is relatively small.

[0087] In some embodiments of the present application, the second surface 300b of the circuit board 300 can also be designed with the structure of the first pad group 307 according to the above-mentioned embodiments, so that the first pad group 307 is arranged on both surfaces of the circuit board 300. In addition, when the circuit board 300 includes a plurality of second pad groups 308, the plurality of second pad groups 308 can be arranged on both surfaces or one surface of the circuit board 300, and for any second pad group 308, it can be located on the same surface or different surface of the first pad group 307. These embodiments are not shown in the drawings.

[0088] In some embodiments of the present application, as shown in FIG. 5A, the first pad group 307 and the second pad group 308 are located on the same surface of the circuit board 300, and the areas where they are located do not overlap. In this way, after the first electronic device 430a and the second electronic device 430b are mounted, the first electronic device 430a and the second electronic device 430b are arranged in a flat manner, and do not overlap in the thickness direction of the circuit board 300.

[0089] In some embodiments of the present application, as shown in FIG. 5B, it is a partial cross-sectional structure schematic view of the packaging module 400 after the circuit board 300 according to another embodiment of the present application is applied to the packaging module 400. The first pad group 307 and the second pad group 308 of the circuit board 300 are located on the same surface of the circuit board 300, and the plurality of second pads 3080 of the second pad group 308 are distributed outside the first pad group 307. In this way, after the first electronic device 430a and the second electronic device 430b are mounted, the first electronic device 430a is closer to the circuit board 300, and the second electronic device 430b is located on the side of the first electronic device 430a away from the circuit board 300.

[0090] According to some embodiments of the present application, a packaging module is also provided. As shown in FIG. 2, the packaging module 400 includes a first circuit board 410 and a plurality of electronic devices 430 (only one of which is shown in the figure). The first circuit board 410 includes a plurality of pad groups 420, each of which includes a plurality of pads 421. The plurality of electronic devices 430 are arranged one-to-one with the plurality of pad groups 420, wherein each electronic device 430 includes a plurality of pins that are welded one-to-one with the plurality of pads 421 of the corresponding pad group 420. Among the plurality of electronic devices 430, at least one electronic device 430 is a first electronic device 430a (i.e., the aforementioned electronic device 100), the pins 120 of which include a first portion 121 and a second portion 122, wherein the first portion 121 is located at the bottom surface of the device body 110, and the second portion 122 is located at the side surface of the device body 110.

[0091] According to the packaging module 400 of the embodiments of the present application, the pins 120 of the at least one electronic device 430 include the first portion 121 and the second portion 122, both of which can be welded with the pads 421 through the solder 506, so that they can be reliably attached on the first circuit board 410. Moreover, as described above, since the amount of solder between the first portion 121 of the pins 120 and the pads 421 can be reduced compared to conventional electronic devices, the attachment height of these electronic devices (i.e., the electronic device 100) is lower, thereby facilitating the reduction of the overall thickness of the packaging module 400.

[0092] As shown in FIG. 5A, in some embodiments of the present application, the first circuit board 410 of the packaging module 400 can adopt the design concept of the aforementioned circuit board 300. The first circuit board 410 includes a first surface 300a and a second surface 300b, and includes: N metal layers 301 (N = 4 is shown in the figure) arranged in sequence in a direction away from the first surface 300a, at least one dielectric layer 302 spacing the N metal layers 301 from each other, a plurality of via metals 303 electrically connecting the N metal layers 301, and a solder mask layer 304 covering part of the surface of the first metal layer, the solder mask layer 304 having a first window 305, wherein the first surface 300a has a groove 306 exposed to the first window 305, part of the mth (m = 2 is shown in the figure) metal layer is exposed to the bottom of the groove 306, at least two via metals 303 located at the side of the mth metal layer close to the first surface 300a are exposed to the side of the groove 306 and are used as a first pad group 307 together with part of the mth metal layer, the first pad group 307 including a plurality of first pads 3070, wherein N ≥ 2 and 2 ≤ m ≤ N.

[0093] In some embodiments of the present application (not shown in the drawings), the plurality of electronic devices 430 can all be the first electronic devices 430a.

[0094] Continuing to refer to FIG. 5A, in some embodiments of the present application, the plurality of electronic devices 430 can also include conventional electronic devices with pins on the bottom of the devices, i.e., the aforementioned second electronic devices 430b. In these embodiments, the solder mask layer 304 of the first circuit board 410 can also have a second window 309 exposing a portion of the first metal layer that serves as the corresponding pad group 420 for the second electronic devices 430b.

[0095] When the packaging module 400 includes both the first electronic devices 430a and the second electronic devices 430b, the specific number and specific placement of the first electronic devices 430a and the second electronic devices 430b are not limited. In actual design, the thickness dimensions of the various electronic devices 430 need to be considered. For example, for electronic devices 430 with the largest or relatively large thickness dimensions, the first pad group 307 can be designed on the first circuit board 410 for them, and accordingly, the electronic devices 430 are designed with reference to the aforementioned first electronic devices 430a (i.e., the electronic devices 100); for electronic devices 430 with relatively small thickness dimensions, the second pad group 308 can be designed on the first circuit board 410 for them, and the electronic devices 430 can be conventional electronic devices (i.e., the second electronic devices 430b). In this way, the packaging module 400 as a whole has a relatively small thickness dimension.

[0096] In some embodiments of the present application (not shown in the drawings), the number of first electronic devices 430a is multiple, and they are distributed and attached on both sides of the first circuit board 410. In addition, when the first circuit board 410 includes multiple second electronic devices 430b, the multiple second electronic devices 430b can be attached on both sides or one side of the first circuit board 410, and for any second electronic device 430b, it can be located on the same side or different side of the first circuit board 410 as the first electronic devices 430a.

[0097] In some embodiments of the present application, as shown in FIG. 5A, the first electronic devices 430a and the second electronic devices 430b are located on the same side of the first circuit board 410 and are arranged in a tiled manner.

[0098] In some embodiments of the present application, as shown in FIG. 5B, the first electronic device 430a and the second electronic device 430b are located on the first surface 300a of the first circuit board 410, and the first electronic device 430a and the second electronic device 430b are arranged in sequence in a direction away from the second surface 300b, that is, the first electronic device 430a is closer to the circuit board 300, and the second electronic device 430b is located on a side of the first electronic device 430a away from the circuit board 300, so that the orthographic projection of the first electronic device 430a on the second surface 300b is located within the orthographic projection of the second electronic device 430b on the second surface 300b.

[0099] As shown in FIG. 5C, it is a schematic diagram of the partial cross-sectional structure of the packaging module 400 according to some other embodiments of the present application. In some embodiments, the first electronic device 430a is arranged on the first surface 300a of the first circuit board 410, and the packaging module 400 can further include a second circuit board 440 (the second circuit board 440 is simplified in the figure, and the layer structure thereof is not shown), which is welded to the first surface 300a of the first circuit board 410 by solder balls 450. The solder ball is a kind of welding material, which is usually used for the connection and repair of metal materials. The solder ball can be made of carbon steel or stainless steel and has the characteristics of waterproof and corrosion resistance.

[0100] Compared with some packaging modules in the related art which adopt a multi-layer circuit board design, the packaging module 400 of the embodiments of the present application has a smaller thickness size based on the design of the first electronic device 430a and the first pad group 307, so that the space occupied in the electronic device is smaller, and the further thin development of the electronic device is more beneficial.

[0101] One or more electronic devices can be arranged on the second circuit board 440. In some embodiments, the second circuit board 440 and the electronic devices arranged thereon can be used as the main board of the electronic device, and the first circuit board 410 and the electronic devices 430 arranged thereon can be used as the auxiliary board of the electronic device; or, the second circuit board 440 and the electronic devices arranged thereon can be used as the auxiliary board of the electronic device, and the first circuit board 410 and the electronic devices 430 arranged thereon can be used as the main board of the electronic device.

[0102] In some embodiments (which are not shown in the drawings), the packaging module 400 can also be designed as follows: the first electronic device 430a is arranged on the first surface 300a of the first circuit board 410, and the second electronic device 430b (or the first electronic device 430a) is arranged on the second surface 300b of the first circuit board 410, and the packaging module 400 further includes a second circuit board 440, which is welded to the second surface 300b of the first circuit board 410 by solder balls 450.

[0103] Similarly, compared with some packaging modules 400 in the related art which employ a multi-layer circuit board design, the packaging module 400 according to the embodiments of the present application has a smaller thickness size based on the design of the first electronic device 430a and the first land group 307, thereby occupying less space inside the electronic device and being more conducive to the further thinning development of the electronic device.

[0104] The specific product type of the packaging module 400 described above is not limited, for example, the packaging module 400 can be a radio frequency module. The specific product type of the first electronic device 430a is not limited, for example, the first electronic device 430a can be a capacitor device which has a relatively large thickness size; the specific product type of the second electronic device 430b is not limited, for example, the second electronic device 430b can be a surface acoustic wave filter device or a power amplifier device, etc., which has a thickness size smaller than that of the first electronic device 430a.

[0105] According to some embodiments of the present application, a manufacturing method of a packaging module is also provided, as shown in FIGS. 6A and 6B. FIG. 6A is a flowchart of a manufacturing method 500 of a packaging module according to some embodiments of the present application, and FIG. 6B is a graphical schematic diagram of the manufacturing method 500. The manufacturing method 500 can include the following steps S21 to S25.

[0106] At step S21, a circuit board 300 is provided. The circuit board is the circuit board 300 designed according to the foregoing embodiments, as shown in FIG. 6B, which includes a first surface 300a and a second surface 300b, and includes N metal layers 301 (N=4 is shown in the figure) arranged in sequence in a direction away from the first surface 300a, at least one dielectric layer 302 spacing the N metal layers 301 from each other, a plurality of via metals 303 electrically connecting the N metal layers 301, and a solder mask layer 304 covering part of the surface of the first metal layer, the solder mask layer 304 having a first window 305, wherein the first surface 300a has a groove 306 exposed to the first window 305, part of the metal of the mth (m=2 is shown in the figure) metal layer is exposed to the bottom of the groove 306, and at least two via metals 303 located on the side of the mth metal layer close to the first surface 300a are exposed to the side of the groove 306 and are used as a first land group 307 together with the part of the metal of the mth metal layer, the first land group 307 including a plurality of first lands 3070, wherein N≥2 and 2≤m≤N.

[0107] At step S22, a stepped steel mesh 501 is provided, and the stepped steel mesh 501 is aligned with the first surface 300a of the circuit board 300 to jointly define a filling recess 502 with the circuit board 300, the filling recess 502 being used to fill the solder 506, wherein the stepped steel mesh 501 comprises a planar shielding area 503, a stepped shielding area 504, and a hollowed area 505, a part of the stepped shielding area 504 is sunken into the groove 306 and has a gap with a part of the groove surface of the groove 306, so that the first pad group 307 can be exposed to the filling recess 502.

[0108] The stepped steel mesh 501 is used as a mask, and the filling of the solder 506 in unnecessary areas can be avoided in the subsequent step S23. The specific structure of the stepped steel mesh 501 needs to be designed according to the specific structure of the circuit board 300, the specific structure of the to-be-mounted electronic device, the amount and depth of the solder 506 to be filled, and the like.

[0109] At step S23, the solder 506 is filled in the filling recess 502. For example, a soldering blade can be used to move a sufficient amount of the solder 506 along the surface of the stepped steel mesh 501 under a certain pressure, so as to fill the solder 506 in the filling recess 502.

[0110] At step S24, the stepped steel mesh 501 is separated from the circuit board 300. In this step, the stepped steel mesh 501 is lifted up, and the solder 506 can be left on each pad.

[0111] At step S25, the electronic device 100 is provided, and the multiple pins 120 of the electronic device 100 are soldered to the first pad group 307 through the solder 506 left on the first pad group 307. Thus far, the surface mounting assembly of the electronic device 100 on the circuit board 300 can be achieved.

[0112] Continuing to refer to FIG. 6B, in some embodiments, the first surface 300a of the circuit board 300 is further provided with a second pad group 308, so that at step S23, the solder 506 can be filled in the filling recess 502 corresponding to each second pad 3080, at step S24, the solder 506 can be left on each second pad 3080, and thus at step S25, the surface mounting assembly of the electronic device 100 on the second pad group 308, or the surface mounting assembly of a second electronic device (not shown in the figure) on the second pad group 308 can be achieved.

[0113] In some embodiments of the present application, as shown in FIG. 6B, the above-mentioned step S25 can comprise:

[0114] Sub-step one, aligning and assembling the multiple pins of one electronic device 100 with the first pad group 307, and aligning and assembling the multiple pins of another electronic device 100 with the second pad group 308;

[0115] Sub-step two, soldering the multiple pins of one of the electronic devices 100 to the first pad group 307 and soldering the multiple pins of the other electronic device 100 to the second pad group 308 by a reflow soldering process. The reflow soldering is a surface mount technology which uses high temperature for a short time to act on the pad parts provided with solder on the electronic devices and the circuit board to realize soldering.

[0116] In the embodiments of the present application, the specific product type of the packaging module 400 is not limited, for example, it can be a radio frequency module. The specific product type of the electronic device 100 is not limited, for example, it can be a capacitor device, and the thickness dimension of the capacitor device is relatively large. The specific product type of the second electronic device is not limited, for example, it can be a surface acoustic wave filter device or a power amplifier device, and the thickness dimension of the surface acoustic wave filter device or the power amplifier device is smaller than the thickness dimension of the electronic device 100.

[0117] In some embodiments of the present application, the circuit board of the packaging module needs to be mounted with electronic devices on both sides, and the packaging module can be manufactured by first mounting the related electronic devices on one side of the circuit board and then mounting the related electronic devices on the other side of the circuit board.

[0118] According to the manufacturing method of the packaging module 400 in the embodiments of the present application, at least one electronic device has a part of the thickness dimension sinking into the groove 306, which can reduce the mounting height, and thus the packaging module 400 manufactured has a smaller thickness dimension.

[0119] As shown in FIG. 7, according to some embodiments of the present application, an electronic device 600 is also provided, which includes a housing 610 and the packaging module 400 of any of the preceding embodiments disposed in the housing 610. The specific product type of the packaging module 400 is not limited, for example, it can be a radio frequency module. The specific product type of the electronic device 600 is not limited, for example, it can be a mobile phone, a tablet computer, a notebook computer, a smart wearable device, a vehicle-mounted computer, a medical electronic device, a server, a router, a switch, etc.

[0120] Since the packaging module 400 has a smaller thickness dimension, it occupies a smaller space inside the electronic device 600, which provides a wide design space for the further optimization of the internal structure of the electronic device 600 and the thin design of the electronic device 600.

[0121] The above merely describes some embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises: a device body; and a plurality of pins arranged on a peripheral side of the device body, wherein each pin comprises a first part and a second part, the first part is located on a bottom surface of the device body, and the second part is located on a side surface of the device body.

2. The electronic device according to claim 1, wherein the device body comprises four edge portions and four corner portions, and the plurality of pins are arranged on the four edge portions; or the plurality of pins are arranged on opposite two edge portions of the four edge portions; or at least one pin of the plurality of pins is arranged in one-to-one correspondence with at least one corner portion of the four corner portions.

3. The electronic device according to claim 1 or 2, wherein the second part is flush with a top surface of the device body; or a spacing is provided between the second part and the top surface of the device body.

4. The electronic device according to any one of claims 1 to 3, wherein the electronic device comprises a capacitor device, a surface acoustic wave filter device, or a power amplifier device. The method comprises:

5. A method for manufacturing an electronic device, characterized by providing an electronic device wafer, the electronic device wafer comprising a plurality of wafer units separated by a mesh-shaped separation groove; forming an electroplating layer on a side surface of the electronic device wafer, the electroplating layer comprising a plurality of electroplating units separated from each other, wherein each electroplating unit is formed on a bottom surface and a side surface of the mesh-shaped separation groove and a surface of an adjacent wafer unit; and cutting the electronic device wafer and the electroplating layer along the mesh-shaped separation groove to separate the plurality of wafer units from each other and form a plurality of pins on a peripheral side of each wafer unit, wherein each wafer unit serves as a device body of the electronic device, each pin is obtained by cutting the electroplating layer, and each pin comprises a first part and a second part, the first part is located on a bottom surface of the device body, and the second part is located on a side surface of the device body. The electronic device comprises a first surface and a second surface, and comprises:

6. A circuit board, characterized by N metal layers arranged in sequence in a direction away from the first surface; at least one dielectric layer separating the N metal layers from each other; a plurality of via metals electrically connecting the N metal layers; and a solder mask layer covering part of a surface of the first metal layer, the solder mask layer having a first opening window; wherein the first surface has a groove exposed to the first opening window, part of a metal of an mth metal layer is exposed to a bottom of the groove, and at least two via metals located on a side of the mth metal layer close to the first surface are exposed to a side of the groove and serve as a first pad group with part of the metal of the mth metal layer, the first pad group comprising a plurality of first pads, wherein N≥2 and 2≤m≤N.

7. The circuit board according to claim 6, wherein the solder mask layer further has a second opening window, the second opening window exposing part of a metal of the first metal layer, the part of the metal of the first metal layer serving as a second pad group, the second pad group comprising a plurality of second pads. The method comprises:

8. A packaging module, characterized by providing a first circuit board comprising a plurality of pad groups, wherein each pad group comprises a plurality of pads; and ​ a plurality of electronic devices, which are arranged one-to-one corresponding to the plurality of pad groups, wherein each electronic device comprises a plurality of pins, which are welded one-to-one corresponding to the plurality of pads of the corresponding pad group, and the plurality of electronic devices comprises a first electronic device, which is the electronic device according to any one of claims 1 to 4.

9. The package module according to claim 8, wherein the first circuit board comprises a first surface and a second surface, and comprises: N metal layers arranged in sequence in a direction away from the first surface, at least one dielectric layer spacing the N metal layers from each other, a plurality of via metals electrically connecting the N metal layers, and a solder mask layer covering part of the surface of the first metal layer, the solder mask layer having a first opening window, wherein the first surface has a groove exposed to the first opening window, part of the metal of the mth metal layer is exposed to the bottom of the groove, and at least two via metals located on the side of the mth metal layer close to the first surface are exposed to the side of the groove and serve as the pad group corresponding to the first electronic device with part of the metal of the mth metal layer, wherein N≥2 and 2≤m≤N.

10. The package module according to claim 9, wherein the plurality of electronic devices further comprises a second electronic device; the solder mask layer further has a second opening window, which exposes part of the metal of the first metal layer, and part of the metal of the first metal layer serves as the pad group corresponding to the second electronic device.

11. The package module according to claim 10, wherein the first electronic device and the second electronic device are arranged in sequence in a direction away from the second surface, and the orthographic projection of the first electronic device on the second surface is located within the orthographic projection of the second electronic device on the second surface.

12. The package module of claim 9, wherein, further comprising: a second circuit board welded to the first surface by solder balls.

13. The package module according to claim 9, wherein at least one electronic device of the plurality of electronic devices is arranged on the second surface, and the package module further comprises a second circuit board welded to the second surface of the first circuit board by solder balls.

14. A method for fabricating a package module, the method comprising: comprising: providing a circuit board according to claim 6; providing a stepped steel mesh, aligning the stepped steel mesh with the first surface of the circuit board to define a filling recess, wherein the stepped steel mesh comprises a planar shielding area, a stepped shielding area, and a hollowed area, part of the stepped shielding area is sunken into the groove and has a gap with part of the groove surface, so as to expose the first pad group to the filling recess; filling the filling recess with solder; separating the stepped steel mesh from the circuit board; and providing an electronic device according to claim 1, and welding the plurality of pins of the electronic device to the first pad group by the solder left on the first pad group.

15. An electronic device, comprising: comprising: a housing and the package module according to any one of claims 8 to 13 arranged in the housing.

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