Electrical / electronic component

Abstract

The invention relates to an electrical / electronic component (1) for a motor vehicle, comprising at least one electrical or electronic component (2) and a heat-conducting element (4) which is mounted on at least one component (2) surface (6) to be cooled and is designed to conduct heat away from the component (2), wherein the heat-conducting element (4) has a base (8) with a constant thermal conductivity, the base lying directly against the at least one component (2) surface (6) to be cooled.

Description

[0001] 24-3184 PIF

[0002] 1 1 19

[0003] Electrical / electronic component

[0004] Description

[0005] The disclosure relates to an electrical / electronic component for a motor vehicle, comprising at least one electrical or electronic component, in particular a high-performance chip, and a heat conducting element, which is arranged on at least one surface of the component to be cooled and is designed to conduct heat away from the component.

[0006] Background of the Revelation

[0007] In the automotive sector, electrical / electronic components are primarily used as electronic control units, voltage converters such as DC / DC converters, switching relay boxes, battery management systems for cell voltage monitoring, charging sockets (especially the vehicle-side housing housing of a charging plug for receiving a charging cable connector during charging), and high-voltage cables, particularly high-voltage charging cables including cable couplings. Such components are typically either not cooled at all, passively cooled, or cooled by cooling plates attached to the component housing, which are equipped with a flow channel for coolant. The coolant is cooled within the vehicle's coolant circuit.The transfer of heat from electrical / electronic components into an electrically conductive coolant, especially a water / glycol mixture, requires a physical electrical separation between the component and the coolant, while simultaneously ensuring thermal contact with the coolant. Electrically non-conductive materials are known to be poor thermal conductors, so this arrangement always presents a high thermal resistance.

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[0010] For this reason, a separate insulating and thermally conductive element is often required, and a large driving temperature difference between the electrical / electronic component and the coolant is necessary to overcome the thermal resistance. Consequently, the maximum permissible temperature of the coolant, required to cool the electrical / electronic component and prevent overheating, must be significantly reduced. This makes the design of a cooling plate complex, as the cooling plate usually needs to be large and heavily ribbed. Furthermore, the required coolant flow rate is significantly increased, and the diameter of the necessary coolant supply and return lines is particularly large. As a result of the high coolant flow rate, the proportion of electrical power required to operate a coolant pump is also particularly high.

[0011] Furthermore, a particularly large housing is necessary if several electrical / electronic components are to be accommodated within a single housing, as the individual components must be spaced further apart than their purely electrical interconnection would require. This is necessary to limit their local heat input into the cooling plate to such an extent that the required heat dissipation via the cooling plate into the coolant is possible. The cooling plate typically functions as a large, heavy heat exchanger plate, which is also multi-layered, consisting of electrical insulation / thermal bonding and metallic layers that serve to broaden and distribute the coolant flow over a larger area.

[0012] Passively cooled electrical / electronic components are often limited in their component-specific performance, as they could reach their operating temperature limit even at low electrical loads without active cooling. Furthermore, the waste heat generated during operation in passively cooled electrical / electronic components is lost to the environment and cannot be used for heat recovery.

[0013] It is also known from the state of the art that electrical / electronic components, especially within control units, can also be directly controlled by means of a

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[0016] (Highly) dielectric fluid, which is primarily single-phase and flows directly around the walls of electrical / electronic components or heat sinks mounted on them, is used for cooling. For example, the applicant's unpublished application DE 10 2024 118 149 discloses an electronic component for a motor vehicle, comprising a housing enclosing a receiving space, at least one electrical or electronic component which is received in the receiving space, a heat-conducting element which is arranged on a surface of the component to be cooled and is designed to conduct heat away from the component, and a coolant guide device which is configured to guide a dielectric coolant to the heat-conducting element, whereby the heat-conducting element can be approached and surrounded by the coolant, thereby transferring heat from the heat-conducting element to the coolant.The component is arranged in a heat distribution plate, which is permanently connected to the heat conducting element, in particular a base plate of the heat conducting element, via an adhesive connection.

[0017] However, the current state of the art has the inherent disadvantage that the thermal connection between the electronic components to be cooled and the coolant is systematically limited due to the relatively high thermal resistances in the area of ​​heat transfer to the heat-conducting element. In particular, significant thermal resistances occur in the area of ​​the adhesive bond between the heat distribution plate and the heat-conducting element, which reduces the specific cooling capacity. Therefore, an increased temperature difference between the electronic component and the coolant is required for cooling. Given a predetermined temperature limit for the electronic component, this necessitates the use of coolant at a low temperature level (e.g., 65°C), which a vehicle's cooling system cannot provide in all relevant operating conditions.Therefore, it can happen that the electronic components are only marginally or partially insufficiently cooled in certain operating situations.

[0018] At the same time, due to the aforementioned increased required temperature difference, there is a possibility that an electrical / electronic component may fail.

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[0020] 4 / 19 The given coolant operating temperature range is operated at an elevated, sometimes borderline temperature level, which contributes to premature degradation of component properties and / or a significantly increased failure rate. In other words, despite elaborate system-side cooling measures, the electrical / electronic components are operated at their respective limit temperatures (or temporarily beyond) in relevant operating conditions, which counteracts an increase in the service life of the electrical / electronic components or a reduction in failure rates.

[0021] Summary of Revelation

[0022] The tasks and objectives of the disclosure are to eliminate or at least reduce the disadvantages of the prior art and, in particular, to provide an electrical / electronic component which enables sufficient temperature control for almost all operating conditions in order to achieve an increase in service life or a reduction in failure rates.

[0023] The tasks and objectives with respect to a generic electrical / electronic component are solved, as disclosed, by the subject matter of claim 1. The disclosure is thus based on the realization that at least one electrical or electronic component, such as a high-performance chip, can be manufactured directly and immediately with the thermal interface element required for efficient cooling. In other words, the at least one electrical or electronic component and the thermal interface element are to be integrated into a single component, instead of attaching the thermal interface element separately in a subsequent step.

[0024] The electrical / electronic component is accordingly configured / adapted as disclosed such that the heat conducting element has a base plate with a constant thermal conductivity which is in direct contact with the at least one surface of the component to be cooled.

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[0027] This eliminates the need for a separating layer or adhesive bond, which is detrimental to high-performance heat transfer, allowing heat to be conducted evenly and without interruption away from the electrical or electronic component through the heat-conducting element.

[0028] Advantageous embodiments are claimed in the dependent claims and are explained below.

[0029] According to an advantageous embodiment, the electrical / electronic component can have a cooling fluid delivery device configured to deliver a dielectric cooling fluid, preferably a dielectric, to the heat-conducting element. The cooling fluid delivery device can, in particular, be configured to deliver the cooling fluid to the heat-conducting element in the form of a liquid flow. This allows the cooling fluid to flow onto and around the heat-conducting element, thereby transferring heat from the heat-conducting element to the cooling fluid.

[0030] In a further preferred embodiment, the heat-conducting element can have a surface structure, preferably a ribbing with a plurality of ribs / fins, to increase the heat transfer area for transferring heat to the environment, in particular a cooling fluid flowing towards and around the surface structure. In other words, the heat-conducting element can preferably have the surface structure which, according to a particularly preferred embodiment, can be configured as a ribbing comprising multiple ribs. Alternatively, the surface structure can also be composed of a plurality of pins / pins or a pin structure. The cooling fluid can be guided along the surface structure to impose a flow direction on the cooling fluid in a particularly simple manner.Furthermore, the surface structure allows for a particularly large heat exchange surface between the cooling fluid and the surface of the heat conducting element that has the surface structure, resulting in a particularly large heat transfer and consequently a particularly efficient cooling of the heat conducting element by means of the cooling fluid.

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[0033] In this context, it can be advantageous if the fins of the finning are aligned with their longitudinal direction in the predetermined flow direction of the cooling fluid. This makes it particularly easy to establish the predetermined flow direction in the cooling fluid flowing towards the fins. The fins thus allow the cooling fluid to be guided very easily and precisely, enabling it to be directed specifically to areas with increased cooling requirements. Furthermore, it is conceivable that the fins extend in a star-shaped pattern from a central flow point, and that the cooling fluid guidance system is configured to direct the coolant to this point, so that the heat transfer element at this point is exposed to the flow of cooling fluid.Starting from the point of inflow, the cooling fluid can then be distributed in a star shape along the surface of the heat-conducting element by means of the fins, which allows the surface of the heat-conducting element to be cooled particularly efficiently and over a large area by means of the cooling fluid.

[0034] Preferably, the base plate and the surface structure can be formed in one piece. That is, the base plate and the surface structure can be made of the same material, which ensures uniform heat transfer between the base plate and the surface structure, so that the heat from the at least one electrical or electronic component can be dissipated via the base plate and the surface structure.

[0035] Furthermore, it can be advantageous if the heat-conducting element is made of a thermally conductive plastic or metal. Alternatively, the heat-conducting element can also be designed as a potting compound / adhesive. In other words, the heat-conducting element can preferably be cast around the at least one electrical or electronic component. This allows the at least one electrical or electronic component to be cooled particularly effectively without having to integrate it into a heat-distributing plate in a previously known electrical / electronic component. In particular, this eliminates the need for a thermally disadvantageous separating layer / adhesive bond between the base plate and the heat-distributing plate, which is required according to the prior art.

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[0038] In a further advantageous embodiment, the surface structure can be formed on one side of the base plate facing away from the at least one surface of the component to be cooled, so that the waste heat of the at least one electrical or electronic component can be dissipated to the environment, in particular the cooling fluid, via the base plate and the surface structure.

[0039] In an advantageous embodiment, the electrical / electronic component can have at least one fluid channel through which a cooling fluid flows to the at least one electrical or electronic component. For this purpose, it can be advantageous if the at least one fluid channel defines a first fluid channel opening and a second fluid channel opening, such that the cooling fluid flows into the fluid channel through the first fluid channel opening and out of the fluid channel through the second fluid channel opening. In particular, it can be especially advantageous if the first fluid channel opening and the second fluid channel opening are formed on different surfaces of the electrical / electronic component. In other words, the first fluid channel opening and the second fluid channel opening can be designed such that they open in different directions.The different orientations of the cooling channels allow for a high degree of freedom and flexibility in designing the flow direction around the at least one electrical or electronic component. Furthermore, the cooling fluid can also be brought into thermal contact with internal walls / parts, such as electrical contact wires, of the electrical / electronic component via the at least one fluid channel, thus cooling them by absorbing heat. In this way, the cooling fluid flow within an electrical / electronic component can also be thermohydraulically integrated into an immersion circuit, particularly one located within the housing of the electrical / electronic component.

[0040] According to a preferred embodiment as disclosed, the base plate can have a plurality of plate sections, wherein the plurality of plate sections are aligned to each other such that adjacent

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[0043] Plate sections can each enclose an angle other than 0°. In other words, the plate sections can be angled relative to each other at their connection points where adjacent plate sections meet. Put another way, the plate sections can be provided in at least two different orientations. In particular, the plate sections can be arranged in an open form, such as an L-shape or an I-shape, or in a closed form, such as a square tube. Furthermore, it can be advantageous in this context if the surface structure is formed on each of the plurality of plate sections. In addition, in an advantageous embodiment, the electrical or electronic component can have at least two surfaces to be cooled, and a plate section can be arranged on each of these at least two surfaces to be cooled, so that a base plate in an L-shape can be formed.Alternatively or additionally, at least one electrical or electronic component can be arranged on each of the multiple plate sections. This means the base plate can accommodate several electrical or electronic components, with each component located on at least one assigned plate section. Consequently, such a complex arrangement of multiple electrical or electronic components, which could no longer be achieved with a volumetric and thermally dense design using adhesive pads for the separation planes / adhesive connections, can be effectively cooled.

[0044] In this context, a (wire) mesh or grid, for example with a mesh size of a few tenths of a millimeter, can also be provided, so that locally evaporated cooling fluid essentially condenses back into the mesh or grid immediately. The mesh or grid can preferably be arranged on one side of the base plate on which the surface structure is formed. In particular, the mesh or grid can be arranged in an outlet area of ​​the cooling fluid flow. Thus, locally or briefly increased heat flux densities compared to single-phase immersion cooling, which can lead to local evaporation of the cooling fluid, can be realized particularly effectively by allowing local gas formation to essentially dissolve back into the cooling fluid through condensation using a (wire) mesh or grid with a mesh size of, for example, a few tenths of a millimeter.

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[0047] According to an advantageous embodiment, it can be provided that at least one bulk filling element, in particular a molded part or a bed of multiple bulk filling elements, is arranged within a housing of the electrical / electronic component as a cooling fluid guide. The at least one bulk filling element can be configured to define a fluid channel / flow channel leading to the at least one electrical or electronic component. For example, the bulk filling element can be made of a closed-cell foam, which effectively prevents the cooling fluid from flowing into the bulk filling element and simultaneously keeps its weight particularly low. The fluid channel can be defined or formed particularly easily by means of the at least one bulk filling element, thus ensuring effective and simple flow guidance for the cooling fluid.

[0048] Brief description of the characters

[0049] The disclosure is explained in more detail below with reference to preferred embodiments and the figures. These show:

[0050] Fig. 1 shows a perspective view of an electrical / electronic component according to a first embodiment as disclosed;

[0051] Fig. 2 shows a perspective view of the electrical / electronic component as disclosed, according to a first modification of the first embodiment;

[0052] Fig. 3 shows a perspective view of the electrical / electronic component according to a second modification of the first embodiment.

[0053] Fig. 4 shows a perspective view of the electrical / electronic component as disclosed, according to a third modification of the first embodiment.

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[0056] Fig. 5 shows a schematic view of an electrical / electronic component according to a second embodiment as disclosed;

[0057] Fig. 6 shows a schematic view of an electrical / electronic component as disclosed, according to a third embodiment;

[0058] Fig. 7 shows a schematic view of an electrical / electronic component as disclosed, according to a modification of the third embodiment;

[0059] Fig. 8 shows a schematic view of an electrical / electronic component as disclosed, according to a fourth embodiment;

[0060] Fig. 9 shows a schematic view of an electrical / electronic component according to a fifth embodiment as disclosed; and

[0061] Fig. 10 shows a schematic view of an electrical / electronic component as disclosed, according to a modification of the fifth embodiment;

[0062] The figures are schematic and serve only to illustrate the revelation. Identical elements are marked with the same reference symbols. The features of the different versions are interchangeable.

[0063] Detailed description of preferred embodiments

[0064] Fig. 1 shows a perspective view of an electrical / electronic component 1 according to a first embodiment. The electrical / electronic component 1 is designed as an electronic control unit for a motor vehicle, in particular an electric vehicle, as disclosed. Of course, the electrical / electronic component 1 can also be, for example, a voltage converter such as a DC / DC converter, a switching relay box or battery management system for cell voltage control, a charging socket, in particular a vehicle-side charging socket.

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[0066] 11 1 19

[0067] Housing housing of a charging plug for receiving a charging cable plug during charging or a high-voltage line, in particular a high-voltage charging line including cable couplings.

[0068] For this purpose, the electrical / electronic component 1 includes at least one high-performance chip 2. This high-performance chip 2 is configured to perform a multitude of calculations to regulate and control the electric vehicle and its components, such as a battery storage system. In doing so, the high-performance chip 2 heats up, and this heat must be dissipated for safe and reliable operation. The high-performance chip 2 is therefore an example of an electrical or electronic component.

[0069] To dissipate the waste heat from the high-performance chip 2, the electrical / electronic component 1 also includes a thermal conductivity element 4. The thermal conductivity element 4 is in direct contact with a surface 6 of the high-performance chip 2 that needs to be cooled. In other words, no other component, in particular no heat distribution plate, is arranged between the thermal conductivity element 4 and the surface 6 that needs to be cooled.

[0070] As shown in Fig. 1, the heat-conducting element 4 has a base plate 8 from which a plurality of parallel ribs 10 extend. The base plate 8 is in direct contact with the surface 6 of the high-performance chip 2 to be cooled, so that the waste heat from the high-performance chip 2 can flow into the base plate 8 via the cooling surface 6. According to the disclosure, the base plate 8 is manufactured in one piece from a material, for example aluminum or copper, with a constant thermal conductivity, so that the waste heat is conducted undisturbed and continuously through the base plate 8 to the ribs 10.

[0071] As disclosed, the fins 10 are surrounded by a cooling fluid, in particular a dielectric fluid, in order to exchange heat with the cooling fluid. In particular, the fins 10 increase the heat transfer surface area, thus increasing the amount of heat that can be dissipated from the high-performance chip 2.

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[0073] 12 / 19 can. Ribs 10 are therefore an example of a revealed surface structure.

[0074] As can be seen in Fig. 1, a fluid channel 12 is also formed on the electrical / electronic component 1. The fluid channel 12 extends from a first fluid channel opening 14 into the interior of the electrical / electronic component 1 to a second fluid channel opening 16, so that the cooling fluid can flow into the interior of the electrical / electronic component 1 via the first fluid channel opening 14 and flow out of the electrical / electronic component 1 again via the second fluid channel opening 16. In this way, sections inside the electrical / electronic component 1 can also be cooled.

[0075] Figure 2 shows the electrical / electronic component 1 according to the first embodiment in a first modification. It can be seen that the electrical / electronic component 1, according to the first modification of the first embodiment, has a first fluid channel opening 14 and a second fluid channel opening 16 on each of two side surfaces. Consequently, the electrical / electronic component 1 has two fluid channels 12.

[0076] Figures 3 and 4 show electrical / electronic components 1 according to a second and third modification of the first embodiment, respectively. In the electrical / electronic component 1 shown in Figure 3 according to the second modification, two fluid channels 12 are formed, wherein the first fluid channel openings 14 and the second fluid channel openings 16 of the two fluid channels 12 open in different orientations towards the environment. In particular, the first fluid channel opening 14 of one fluid channel 12A is oriented towards a side surface, whereas the second fluid channel opening 16 of one fluid channel 12A opens towards the ribs 10. Furthermore, the second fluid channel opening 14 of the other fluid channel 12B is oriented towards a side surface, whereas the first fluid channel opening 16 of the other fluid channel 12B opens towards the ribs 10.

[0077] As can be seen in Fig. 4, the electrical / electronic component 1 according to the third modification of the first embodiment has two fluid channels 12 formed,

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[0079] 13 / 19 wherein in one fluid channel 12A the first fluid channel opening 14 opens towards the side surface and the second fluid channel opening 16 opens towards a bottom surface facing away from the ribs 10, whereas in the other fluid channel 12B the first fluid channel opening 14 opens towards the bottom surface and the second fluid channel opening 16 opens towards the side surface.

[0080] Fig. 5 schematically shows an electrical / electronic component 1 according to a second embodiment. The following discussion focuses solely on the differences compared to the electrical / electronic component 1 shown in Figs. 1 to 4 according to the first embodiment.

[0081] As can be seen in Fig. 5, the heat-conducting element 4 of the electrical / electronic component 1, according to the second embodiment, is in direct heat-transferring contact with two surfaces 6 of the high-performance chip 2 that are to be cooled. For this purpose, the base plate 8 is designed with an L-shaped cross-section, such that a first plate section 18 is in contact with one surface 6 to be cooled and a second plate section 20 rests against the other surface 6 to be cooled. The aforementioned one-piece construction of the base plate 8, or the absence of a separating plane or heat distribution plate, allows for any design of the base plate 8 or any orientation of the plate sections 18 and 20 relative to each other.

[0082] Fig. 6 schematically shows an electrical / electronic component 1 according to a third embodiment. The following discussion focuses solely on the differences between this component and the electrical / electronic components 1 shown in Figs. 1 to 5 according to the first and second embodiments.

[0083] The electrical / electronic component 1 according to the third embodiment has, as can be seen in Fig. 6, two high-performance chips 2. One high-performance chip 2 is arranged on the first plate section 18, whereas the other high-performance chip 2 is in direct, heat-transferring contact with the second plate section 20. The two high-performance chips 2 are furthermore arranged on the same side of the base plate 8, so that the ribs 10 extend outwards from the base plate 8.

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[0086] In contrast, in the electrical / electronic component 1 shown in Fig. 7, according to a modification of the third embodiment, the high-performance chips 2 are arranged on different sides of the base plate 8. The ribs 10 extend away from the sides of the corresponding plate sections 18, 20 facing away from the respective high-performance chip 2. That is, the ribs 10 on the first plate section 18 extend into the area of ​​one high-performance chip 2, whereas the ribs 10 on the second plate section 20 lie on a side with the other high-performance chip 2.

[0087] Fig. 8 schematically shows an electrical / electronic component 1 according to a fourth embodiment. The following discussion focuses solely on the differences compared to the electrical / electronic components 1 shown in Figs. 1 to 7 according to the first to third embodiments.

[0088] As shown in Fig. 8, the base plate 8 of the heat-conducting element 4 of the electrical / electronic component 1 according to the fourth embodiment is designed in cross-section as a closed profile. That is, the base plate 8 has four plate sections 18, 20, wherein two abutting plate sections 18, 20 each form an angle of 90°.

[0089] A plurality of high-performance chips 2 are arranged on an outer surface of the base plate 8. The ribs 10 of the individual plate sections 18, 20 each extend into a cavity defined by the base plate 8. A free space within the cavity not occupied by the ribs 10 is filled with a solid body 22. The solid body 22 is preferably made of a foam and can be configured for fluid flow. For this purpose, the solid body 22 can have at least one flow channel that allows the cooling fluid to flow towards the ribs 10.

[0090] Figures 9 and 10 schematically show an electrical / electronic component 1 according to a fifth embodiment. The following discussion focuses solely on the differences compared to...

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[0092] 15 / 19 the electrical / electronic components 1 shown in Figs. 1 to 8 according to the first to fourth embodiments.

[0093] In the electrical / electronic component 1 according to the fifth embodiment, the base plate 8 of the heat-conducting element 4, as shown by way of example in Fig. 9, has three plate sections 18, 20, resulting in a U-shaped cross-section for the base plate 8. Of course, as disclosed, the base plate 8 can also have any other cross-section. Furthermore, it is also conceivable to arrange two opposing base plates 8, so that a channel is formed between these base plates 8 through which the cooling fluid can flow.

[0094] A plurality of high-performance chips 2 are arranged on each of the opposing plate sections 18, 20. The high-performance chips 2 can be in contact with only one of the two plate sections 18, 20 or with both plate sections 18, 20. That is, the high-performance chips 2 can have one or more surfaces 6 to be cooled.

[0095] The ribs 10 of the electrical / electronic component 1 according to the fifth embodiment extend outwards from the base plate 8, as shown in Fig. 9. Alternatively, it is also conceivable to orient the ribs 10 inwards, as shown in the electrical / electronic component 1 according to the modification of the fifth embodiment shown in Fig. 10, so that the high-performance chips 2 are mounted on the outside of the U-shaped base plate 8.

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[0098] Reference symbol list

[0099] 1 electrical / electronic component

[0100] 2 high-performance chips

[0101] 4 Heat conducting element

[0102] 6 Surface

[0103] 8 Base plate

[0104] 10th rib

[0105] 12 Fluid channel

[0106] 14 first fluid channel opening

[0107] 16 second fluid channel opening

[0108] 18 first plate section

[0109] 20 second plate section

[0110] 22 volume molded bodies 11.2024

Claims

24-3184 PIF 17 / 19 Claims 1. Electrical / electronic component (1) for a motor vehicle, comprising at least one electrical or electronic component (2) and a heat conducting element (4) which is arranged on at least one surface (6) of the component (2) to be cooled and is designed to conduct heat away from the component (2), characterized in that the heat conducting element (4) has a base plate (8) with a constant thermal conductivity which is in direct contact with the at least one surface (6) of the component (2) to be cooled.

2. Electrical / electronic component (1) according to claim 1, characterized in that the heat conducting element (4) has a surface structure, preferably a ribbing with a plurality of ribs (10), in order to increase a heat transfer surface for transferring heat to the environment, in particular to a cooling fluid flowing on and around the surface structure.

3. Electrical / electronic component (1 ) according to claim 2, characterized in that the base plate (8) and the surface structure (10) are formed in one piece.

4. Electrical / electronic component (1) according to one of the preceding claims 1 to 3, further characterized by at least one fluid channel (12) through which a cooling fluid flows towards the at least one component (2).

5. Electrical / electronic component (1 ) according to claim 4, characterized in that the at least one fluid channel (12) defines a first fluid channel opening (14) and a second fluid channel opening (16), such that the cooling fluid flows into the fluid channel (12) via the first fluid channel opening (14) and flows out of the fluid channel (12) via the second fluid channel opening (16).

6. Electrical / electronic component (1) according to claim 5, characterized in that the first fluid channel opening (14) and the second November 6, 2024 24-3184 PIF 18 / 19 Fluid channel openings (16) are formed on different surfaces of the electrical / electronic component (1).

7. Electrical / electronic component (1 ) according to any one of the preceding claims 1 to 6, characterized in that the base plate (8) has a plurality of plate sections (18, 20), wherein the plurality of plate sections (18, 20) are aligned to each other such that adjacent plate sections (18, 20) each enclose an angle other than 0°.

8. Electrical / electronic component (1 ) according to claim 7, characterized in that the surface structure (10) is formed on each of the plurality of plate sections (18, 20).

9. Electrical / electronic component (1) according to claim 7 or 8, characterized in that the electrical or electronic component (2) has at least two surfaces (6) to be cooled and a plate section (18, 20) is arranged on each of these at least two surfaces (6) to be cooled.

10. Electrical / electronic component (1) according to one of the preceding claims 7 to 9, characterized in that at least one electrical or electronic component (2) is arranged on each of the plurality of plate sections (18, 20). November 6, 2024

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