This utility model discloses a
temperature control device suitable for
semiconductor equipment, including a temperature-controlled mixing mechanism and a heating device installed at the bottom of the temperature-controlled mixing mechanism. A circulating mixing mechanism is provided on the outside of the temperature-controlled mixing mechanism, and a
circulating pump is located on the outside of the circulating mixing mechanism. The temperature-controlled mixing mechanism includes a meshing gear ring, and a mixing rotating disk is rotatably connected to the bottom of the meshing gear ring. Several meshing gears are meshed on the inner side of the meshing gear ring, wherein the number of meshing gears is three. A rotating motor is provided on the top of the meshing gear ring, wherein a drive gear is fixedly connected to the output end of the rotating motor. The drive gear meshes with the meshing gears, so that the meshing gears drive the mixing rotating disk and three vertical stirring rods to revolve, and at the same time, the vertical stirring rods drive the vertical
auger to rotate, thereby realizing the up-and-down stirring of the cleaning liquid, which can not only improve the mixing efficiency of the cleaning liquid, but also achieve uniform heating of the cleaning liquid.