Unlock instant, AI-driven research and patent intelligence for your innovation.

Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate

A technology for optical components and substrates, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems that the suction components cannot be completely prevented from being slightly unfolded, and the productivity of semiconductor die bonders is reduced.

Active Publication Date: 2014-10-22
BESI SWITZERLAND AG
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Despite optimized technology in light construction, this inevitably results in a relatively large mass
Due to the bulky construction, the productivity of the semiconductor die bonder is significantly reduced in combination with a given driving force
Furthermore, even in the case of a pick-and-place system and a large-mass construction of the substrate base, a slight unfolding of the suction member during pressing on the substrate cannot be completely prevented

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate
  • Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate
  • Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The method according to the invention for mounting electronic or optical components, in particular semiconductor chips, on a substrate is carried out by automated semiconductor mounting equipment, in particular by die bonders or pick-and-place machines, comprising bonding Head 2 and suction member 3 . image 3 An embodiment of a semiconductor mounting device is shown, as required for understanding the method according to the invention. The semiconductor mounting apparatus includes a first movement shaft and a second movement shaft for moving the bonding head 2 within a predetermined plane relative to the substrate 6 . The XY plane generated by the two axes of movement is a horizontal plane in this example. Via a third movement axis extending perpendicularly to the XY plane, the bonding head 2 and / or the suction member 3 can be displaced in the Z direction. The three movement axes are electrically and / or pneumatically driven and are part of a pick-and-place system and / or...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for mounting components on a substrate includes receiving a component with a suction member which is mounted on a bonding head, displacing the bonding head relative to the substrate by means of a first movement axis and a second movement axis in order to position the component in a target position above the substrate, lowering the suction member by means of a third movement axis until the component touches the substrate, producing a predetermined bonding force with which the suction member presses the component against the substrate, and displacing at least one of the bonding head and the substrate by means of at least one of the first movement axis by a corrective value W1 and the second movement axis by a corrective value W2 in order to correct an inclined position of the suction member produced during the build-up of the bonding force.

Description

technical field [0001] The invention relates to a method for mounting electronic or optical components, in particular semiconductor chips, also called die, on a substrate. Background technique [0002] In the semiconductor industry, mounting of components is performed by automated semiconductor mounting machines known in the art as die bonders or pick and place machines. The components are often semiconductor chips placed and bonded on different types of substrates. The components are picked up by the chip gripper, in particular the suction means, moved to a placement position above the substrate, and placed on the substrate at precisely defined positions. A chip gripper or suction member is typically mounted rotatably about its longitudinal axis on the bond head. The bonding head is fixed to a pick-and-place system which realizes the required movement in three spatial directions X, Y, Z. The Z direction corresponds in this case and hereinafter with reference to the verti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/50
CPCH01L21/68H01L21/67144H01L24/75H01L2224/75823H01L2224/7592Y10T156/17Y10T156/10
Inventor 翰尼斯·科斯特纳安德鲁斯·迈尔哈拉尔德·迈克斯纳雨果·普里斯陶茨
Owner BESI SWITZERLAND AG