A test pressure head positioning mechanism

Abstract

The invention discloses a test pressure head positioning mechanism, which comprises a base (1), a horizontal positioning column (2), a test head positioning block (3), a positioning screw (4) and a positioning screw support seat (5), the test head The positioning block (3) is placed on the base (1), and a square groove (6) is opened on the lower surface of the test head positioning block (3) in contact with the base (1), and the horizontal positioning column (2) is set on the base (1) ) on the upper surface, and is connected with the square groove (6) by sliding fit, and the left and right sides of the positioning block (3) of the test head are provided with a set screw support seat (5), and the set screw support seat (5) is connected with an internal thread The set screw (4), the set screw support seat (5) is installed on the upper surface of the base (1) by screws. The beneficial effects of the invention are: it has the advantages of convenient position adjustment, avoiding the inclination of the test head and saving the production cost.

Description

technical field [0001] The invention relates to a positioning mechanism, in particular to a testing pressure head positioning mechanism. Background technique [0002] There are multiple contacts on the wafer, and the contacts need to be in contact with the contacts during the test. However, in the existing test device, the test head is prone to wear and tear after repeated use, resulting in the test being easy to appear during the moving process. Skew, so that when the test head presses down on the product, it cannot be vertically downward, resulting in the contact between the contact head and the contact to be tested on the wafer is not in place, affecting the accuracy of product testing, and in serious cases, it will cause scratches on the contacts, resulting in product scrapping , to increase production costs. Contents of the invention [0003] The object of the present invention is to overcome the disadvantages of the prior art, and provide a test pressure head positi...

AI Technical Summary

Problems solved by technology

[0002] There are multiple contacts on the wafer, and the contacts need to be in contact with the contacts during the test. However, in the existing test device, the test head is prone to wear and tear after repeated use, resulting in the test being easy to appear during the moving process. Skew, so that when the test head presses down on the product, it cannot be vertically downward, resulting in the contact between the contact head and the contact to be tested on the wafer is not in place, affecting the accuracy of product testing, and in serious cases, it will cause scratches on the contacts, resulting in product scrapping , increase production cost

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