Headband structure and headphone

A headband and head technology, applied in the field of headphones, can solve the problem that the headband does not meet the wearing comfort, and achieve the effect of improving the shape and wearing comfort, and reducing the clamping effect.

Active Publication Date: 2015-12-16
SHENZHEN GRANDSUN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a headband structure, which aims to solve the technical problem that the headband in the prior art does not satisfy the wearing comfort

Method used

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  • Headband structure and headphone
  • Headband structure and headphone
  • Headband structure and headphone

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Embodiment Construction

[0047] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0048] Please refer to Figure 1 to Figure 8 , the headband structure provided by the embodiment of the present invention includes:

[0049] Headband pad 10, close to the head;

[0050] The headband main body 20 is fixedly connected with the headband pad 10, and the headband main body 20 includes:

[0051] The first main body 22 is molded from soft rubber and forms an accommodating groove 220;

[0052] A pair of second main bodies 24 are integrally formed with the first main body 22 and are made of hard rubber. between the headband pads 10;

[0053] The supporting piece 30 is used to suppor...

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PUM

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Abstract

The invention is applicable to the technical field of headphones, and provides a headband structure. The headband structure comprises a headband pad leaning against the head, a headband body fixedly connected with the headband pad and a supporting sheet used for supporting the headband body, the headband body comprises a first body which is formed by flexible glue and is provided with a holding groove and a pair of second bodies, which is integrally formed with the first body and is formed by ebonite, the second bodies are symmetrically held in the holding groove and are located between the first body and the headband pad, and the supporting sheet is fixed on the second bodies and is located between the headband pad and the second bodies. The headband structure is integrally formed by the first body formed by the flexible glue and the second bodies formed by the ebonite, a headband body is obtained, the headband structure has certain elasticity, which greatly reduce the clamping function of the headband structure on the head to ensure comfortable wearing; and meanwhile, the supporting sheet plays a certain supporting role to perfect the outline and the wearing comfort of the entire headband structure.

Description

technical field [0001] The invention belongs to the technical field of earphones, and in particular relates to a headband structure and an earphone with the headband structure. Background technique [0002] Earphones are widely used in people's lives as an audio output device. For various audio playback devices, earphones have become a necessary device, especially earphones are favored by many consumers. [0003] Usually, the headphone can be put on the headband of the head and the sounding unit connected to the two ends of the headband. After wearing the headphone, the headband will have a certain pressure on the head, causing the problem of uncomfortable wearing. Contents of the invention [0004] The purpose of the present invention is to provide a headband structure, aiming at solving the technical problem that the headband in the prior art does not satisfy the wearing comfort. [0005] The present invention is achieved like this, a kind of headband structure, compris...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
Inventor 罗金伦余新吴海全师瑞文
Owner SHENZHEN GRANDSUN ELECTRONICS CO LTD
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