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A chip and matching method from the perspective of udf application

A chip and angle technology, applied in the transmission system, electrical components, etc., can solve the problems of multi-cpu resources, long development cycle, chip cannot do security and statistics, etc., and achieve the effect of strong processing capacity and long life cycle

Active Publication Date: 2019-10-11
SUZHOU CENTEC COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional switch IC is hard-coded and has a long development cycle. First, the chip cannot recognize the specific variable protocol type, so it cannot directly meet these needs. The common method is to process these messages by sending them to the CPU. In the text, the software protocol stack on the cpu realizes the recognition processing of vxlan / nvgre, etc.
In the above solution, sending all the messages to the CPU, identifying and processing the messages through the software protocol stack will occupy a lot of CPU resources, and may lead to poor user experience for some applications, and the chip cannot do related security and statistics

Method used

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  • A chip and matching method from the perspective of udf application

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Embodiment Construction

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention.

[0014] see figure 1 , the chip disclosed by the present invention from the perspective of UDF application includes an interface information module, a virtual local area network module, a three-layer variable header module, a multi-protocol label module and a four-layer header module, the interface information module, the virtual local area network module, The three-layer variable header module, the multi-protocol label module and the four-layer header module are matched as key information, and several sets of offset positions and the number of bytes to be taken from each offset point are compiled for configuration, and user definitions are taken out based on these configurations The data, and finally use the access control list to match.

[0015] Further, the three-layer variable hea...

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Abstract

The invention provides a chip from the perspective of a UDF application, which comprises an interface information module, a virtual local area network module, a three-layer variable header module, a multi-protocol label module and a four-layer header module, wherein the interface information module, the virtual local area network module, the three-layer variable header module, the multi-protocol label module and the four-layer header module serve as key information for matching, several groups of offset positions and an initial byte number of each offset point are compiled, data defined by a user are taken out based on the configuration, a control list is accessed finally for matching. Network protocol message demands changing continuously on the current protocol surface can be flexibly supported, and the service life of the chip is longer.

Description

technical field [0001] The invention relates to the technical field of network processors, in particular to a chip and a matching method from the perspective of UDF application. Background technique [0002] Now with the development of the network and the development of cloud technology virtualization technology, many new protocol types will gradually appear. At present, the more popular protocols such as vxlan, nvgre, etc., these protocols generally use the third-layer information of the packet and then carry the second-layer The method of information is also a new tunneling technology. With the enhancement of switch capabilities, there will be more and more demands to pay attention to the header information above four layers. The traditional switch IC is hard-coded and has a long development cycle. First, the chip cannot recognize the specific variable protocol type, so it cannot directly meet these needs. The common method is to process these messages by sending them to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04L29/06H04L29/08
Inventor 蔡文俊周伟
Owner SUZHOU CENTEC COMM CO LTD
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