A chip and matching method from the perspective of udf application
A chip and angle technology, applied in the transmission system, electrical components, etc., can solve the problems of multi-cpu resources, long development cycle, chip cannot do security and statistics, etc., and achieve the effect of strong processing capacity and long life cycle
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention.
[0014] see figure 1 , the chip disclosed by the present invention from the perspective of UDF application includes an interface information module, a virtual local area network module, a three-layer variable header module, a multi-protocol label module and a four-layer header module, the interface information module, the virtual local area network module, The three-layer variable header module, the multi-protocol label module and the four-layer header module are matched as key information, and several sets of offset positions and the number of bytes to be taken from each offset point are compiled for configuration, and user definitions are taken out based on these configurations The data, and finally use the access control list to match.
[0015] Further, the three-layer variable hea...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com