Aluminum housing stamping mould for capacitor and aluminum housing stamping formation method
A technology for stamping dies and aluminum casings, applied in the field of capacitors, can solve the problems of difficult adjustment of the matching size of the punch and the die, the inability to automatically form chamfering of the mold, and the inability to guarantee the quality of the chamfer, so as to avoid cable scratches, The effect of reducing labor costs and simplifying production operations
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[0052] The present invention will be further described below in combination with specific embodiments. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
[0053] see Figure 5 to Figure 8 , the present invention provides a stamping die for an aluminum case of a capacitor, which includes a punch 2 and a die 3, the lower end of the punch body 21 of the punch 2 is provided with a hole post 22, and the connection between the hole post 22 and the lower end of the punch body 21 The hole column chamfer 221 is arranged on the upper part, and the shape and size of the hole column ...
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