A defoaming device and electroplating liquid recovery system

Abstract

The present invention provides a defoaming device and an electroplating liquid recovery system, comprising a buffer tank, a liquid level maintaining device, a defoaming body, an electroplating tank and a liquid storage tank. The defoaming device is connected to the electroplating tank and the liquid storage tank, and the diameter of the buffer tank in the defoaming device gradually decreases from the inlet to the outlet, thereby reducing the interaction force when the liquid rushes into the outlet in the buffer tank, and reducing the formation of vortices at the outlet to bring in air; the liquid is kept at a water surface in the buffer tank by the liquid level maintaining device, and the liquid is isolated from the outside air when it flows from the outlet into the lower connecting pipe, thereby reducing the introduction of air; the defoaming body is arranged in the buffer tank on the flow path of the liquid, and when the liquid passes through the defoaming body, the air bubbles entrained in the liquid collide with the defoaming body and break or are adsorbed on the defoaming body, thereby reducing the foam generated by the sputtering rebound caused by the drop, and the structure is simple and the stability is strong.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating, and in particular relates to a defoaming device and an electroplating liquid recovery system. Background Art

[0002] At present, common vertical electroplating equipment drives the circuit board along the plating tank filled with plating liquid through a circulating transmission device. The circuit board continuously enters the plating tank from one end and exits from the other end. The plating liquid in the plating tank is electroplated on the surface of the circuit board during this process.

[0003] The reflow section in the existing VCP electroplating line is equipped with a square trough to recycle the plating solution. The plating solution flows into the square trough and is introduced into the liquid storage tank from the square trough. In the process of plating solution recovery, firstly, there is a drop when the plating solution enters the square trough from the discharge port of the plating tank, which easily causes the plating solution to sputter and rebound, forming a large amount of foam on the water surface of the square trough. When the plating solution flows into the liquid storage tank from the connecting pipe below the square trough, the foam on the water surface is brought into the liquid storage tank; secondly, the outlet of the square trough is opened at the center of the bottom of the square trough. When the plating solution flows toward the outlet, the water pressure around the bottom of the trough interacts in the horizontal direction. The plating solution flows into the connecting pipe at the outlet of the square trough in a vortex, and brings in outside air into the liquid storage tank below. When the plating solution in the liquid storage tank is recycled and input into the plating tank for use again, the foam and air brought in by this part of the plating solution will form bubble points on the electroplating plate, affecting the uniformity of electroplating. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is that the electroplating solution in the existing electroplating tank is easily brought into foam and air during recovery. When it is reused, the foam and air in the electroplating solution form bubble points on the electroplating plate, affecting the electroplating effect.

[0005] To this end, the present invention provides a defoaming device, comprising

[0006] A buffer tank having an inlet and an outlet located below the inlet; the diameter of the buffer tank gradually decreases from the inlet toward the outlet;

[0007] A liquid level maintaining device is arranged at the outlet end of the bottom of the buffer tank; the liquid level maintaining device is suitable for controlling the liquid to maintain a water surface in the buffer tank when the liquid is injected into the buffer tank;

[0008] The defoaming body is arranged in the buffer tank and located on the flow path of the liquid.

[0009] Preferably, in the above-mentioned defoaming device, the inner wall surface of the buffer tank has at least one buffer surface inclined from the inlet toward the outlet, so that the diameter of the buffer tank gradually decreases from the inlet toward the outlet.

[0010] Preferably, in the above-mentioned defoaming device, the buffer surface is arranged along a circle of the buffer tank wall.

[0011] Preferably, in the above-mentioned defoaming device, the buffer tank is a pyramidal tank.

[0012] Preferably, in the above-mentioned defoaming device, the buffer tank is a square cone-shaped tank.

[0013] Preferably, the above-mentioned defoaming device, the liquid level maintaining device comprises

[0014] A connecting pipe, fixedly connected to the outlet end of the buffer tank;

[0015] A flow control valve is arranged on the connecting pipe.

[0016] Preferably, the defoaming device,

[0017] The defoaming body is arranged to float on the water cover or is installed on the groove wall of the buffer groove below the water cover.

[0018] Preferably, in the above-mentioned defoaming device, the defoaming body is a wire mesh and / or fiber cotton.

[0019] The present invention provides an electroplating solution recovery system, comprising

[0020] Plating tank, liquid storage tank and the above-mentioned defoaming device;

[0021] Any of the defoaming devices is vertically arranged between the electroplating tank and the liquid storage tank, and the discharge port of the electroplating tank is connected to the inlet of the buffer tank, and the liquid outlet of the liquid level maintaining device is connected to the inner cavity of the liquid storage tank.

[0022] Preferably, in the above-mentioned electroplating liquid recovery system, the drain port is arranged directly opposite to the inlet of the buffer tank.

[0023] The technical solution of the present invention has the following advantages:

[0024] 1. In the defoaming device provided by the present invention, the diameter of the buffer tank gradually decreases from the inlet toward the outlet, thereby reducing the interaction force when the liquid flows into the outlet in the buffer tank, reducing the formation of vortices at the outlet and bringing in air; the liquid is kept at a water surface in the buffer tank by a liquid level maintaining device, and the liquid is isolated from the outside air when flowing from the outlet into the lower connecting pipe, thereby reducing the introduction of air; the defoaming body is arranged in the buffer tank on the flow path of the liquid, and when the liquid passes through the defoaming body, the air bubbles entrained in the liquid collide with the defoaming body and burst or are adsorbed on the defoaming body, thereby reducing the foam generated by splashing rebound due to the drop, and the structure is simple and the stability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of the defoaming device in the present invention;

[0027] Figure 2 It is a schematic diagram of the structure of the buffer tank in the defoaming device of the present invention;

[0028] Figure 3 It is a structural schematic diagram of the electroplating solution recovery system in the present invention.

[0029] Description of reference numerals:

[0030] 1-buffer tank; 11-export; 12-inlet; 13-buffer surface; 2-defoaming body; 3-liquid level maintaining device; 31-connecting pipe; 310-liquid outlet; 32-flow control valve; 4-electroplating tank; 5-liquid storage tank. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Example 1

[0035] This embodiment provides a defoaming device, such as Figure 1 As shown, it includes a buffer tank 1, a liquid level maintaining device 3 and a defoaming body 2. Figure 2 As shown, the buffer tank 1 has an inlet 12 and an outlet 11 located below the inlet 12. The diameter of the buffer tank 1 gradually decreases from the inlet 12 toward the outlet 11. The inner wall surface of the buffer tank 1 has at least one buffer surface 13 inclined from the inlet 12 toward the outlet 11. Figure 2 As shown, in this embodiment, the buffer tank 1 is a square cone-shaped tank, the inlet 12 of the square cone-shaped tank is square, the bottom outlet 11 is circular, and four inclined buffer surfaces 13 are arranged around the outlet 11, i.e., the circular outlet 11. The buffer surfaces 13 are all planes. The interaction force in the horizontal direction of the liquid is reduced in the process of flowing into the buffer tank 1 and rushing to the outlet 11, thereby avoiding the formation of vortices on the liquid surface in the buffer tank 1, thereby reducing the air brought in from the outside. The buffer tank 1 can also be other pyramid-shaped tanks, such as pentagonal pyramid tanks, hexagonal pyramid tanks, etc., depending on specific needs. Of course, the outlet 11 of the buffer tank 1 can also be other shapes, such as a square outlet, etc., depending on specific needs.

[0036] like Figure 1 As shown, the outlet 11 end of the buffer tank 1 is connected to the liquid level maintaining device 3. In this embodiment, the liquid level maintaining device 3 is composed of a connecting pipe 31 and a flow control valve 32. Among them, the connecting pipe 31 is fixedly connected to the outlet 11 end of the buffer tank 1. The connecting pipe 31 is connected by multiple sections of pipelines to form a U-shaped connecting pipe. The end of the connecting pipe 31 is a liquid outlet 310. The flow control valve 32 is arranged on the connecting pipe 31 near the liquid outlet 310. When the liquid is continuously injected into the buffer tank 1 and flows out from the outlet 11, the liquid flow rate is adjusted by the flow control valve 32, so that a certain height of the liquid water cover is always maintained in the buffer tank 1. The water cover can close the outlet of the buffer tank 1 and isolate the external environment, reducing the air brought in when the liquid flows from the outlet into the lower connecting pipe 31.

[0037] The defoamer 2 is disposed in the buffer tank 1 and is located on the flow path of the liquid. The defoamer 2 can be floated on the water cover in the buffer tank 1, or can be fixed on the wall around the buffer tank 1 between the water cover and the outlet 11 of the buffer tank 1. Figure 2 As shown, in this embodiment, in order to minimize the drop when the liquid flows into the buffer tank 1, the defoamer 2 is arranged at the inlet 12 end of the buffer tank 1. When the liquid passes through the defoamer 2, the air bubbles entrained in the liquid collide with the defoamer 2 and break or are adsorbed on the defoamer 2, thereby reducing the foam generated by the splashing rebound caused by the drop. When in use, the water cover can be maintained at the defoamer 2 close to the inlet 12 end of the buffer tank 1. In this embodiment, the defoamer 2 adopts a wire mesh, and the wire mesh is stacked and covers the inlet 12 end of the buffer tank 1. The defoamer 2 can also adopt fiber cotton or a combination of wire mesh and fiber cotton. The fiber cotton can be embedded in the mesh of the wire mesh, or the fiber cotton and the wire mesh are stacked.

[0038] The defoaming process of the defoaming device in this embodiment is as follows:

[0039] The liquid flows into the buffer tank 1 from the inlet 12 end of the buffer tank 1, and penetrates into the inner cavity below the buffer tank 1 through the defoamer 2. The penetration process avoids the liquid from splashing and rebounding into the air to form bubbles when it is directly poured into the buffer tank 1, and the bubbles inside the liquid collide with the defoamer 2 and burst or are adsorbed on the defoamer 2.

[0040] The flow control valve 32 adjusts the liquid outflow rate and maintains a water surface between the defoaming body 2 in the buffer tank 1 and the outlet 11. The square cone buffer tank has four buffer surfaces 13, so that when the liquid in the buffer tank 1 flows downward to the outlet 11, the interaction force of the liquid in the buffer tank 1 in the horizontal direction is reduced, and no vortex is formed on the liquid surface in the buffer tank 1 when flowing out of the outlet 11 of the buffer tank 1 to bring in external air.

[0041] The liquid always fills the connecting tube 31 and flows out from the liquid outlet 310 of the connecting tube 31 into the liquid storage tank below.

[0042] As a first alternative implementation of Example 1, the buffer surface 13 may also be an arc-shaped surface or a wavy surface, so that the diameter of the buffer groove 1 gradually decreases from the inlet 12 toward the outlet 11.

[0043] As a second alternative implementation of Example 1, the liquid level maintaining device 3 can be a separate U-shaped tube, which satisfies that the highest water level in the vertical direction in the U-shaped tube is higher than the height of the outlet 11 of the buffer tank 1 and lower than the height of the inlet 12 of the buffer tank 1.

[0044] Example 2

[0045] This embodiment provides a plating solution recovery system, including a plating tank 4, a liquid storage tank 5 and at least one defoaming device in Embodiment 1. In this embodiment, Figure 3 As shown, two defoaming devices are arranged in parallel between the electroplating tank 4 and the liquid storage tank 5, and the drainage port of the electroplating tank 4 is connected to the inlet 12 of the buffer tank 1. In this embodiment, the buffer tank 1 is directly arranged at the bottom of the last section of the electroplating tank 4, that is, the bottom of the electroplating tank 4 of this section is used as the drainage port, which is connected to the inner cavity of the electroplating tank 4 of this section, and the electroplating liquid flows directly from the bottom to the buffer tank 1 below. The liquid outlet 310 of the connecting pipe 31 in the liquid level holding device 3 is connected to the inner cavity of the liquid storage tank 5 below, and the electroplating liquid in the electroplating tank 4 is defoamed by the defoaming device and then recovered to the liquid storage tank 5. A pipeline can be set in the liquid storage tank 5 to extract the electroplating liquid and pass it into the electroplating tank 4 again for recycling.

[0046] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A defoaming device, characterized in that: include A buffer tank (1) has an inlet (12) and an outlet (11) located below the inlet (12); the diameter of the buffer tank (1) gradually decreases from the inlet (12) toward the outlet (11); A liquid level maintaining device (3) is arranged at the outlet (11) end of the bottom of the buffer tank (1); the liquid level maintaining device (3) is suitable for controlling the liquid to maintain a water surface in the buffer tank (1) when the liquid is injected into the buffer tank (1); A defoaming body (2) is arranged in the buffer tank (1) and is located on the flow path of the liquid; the defoaming body (2) is arranged to float on the water cover or is installed on the tank wall of the buffer tank (1) below the water cover; The liquid level maintaining device (3) comprises: A connecting pipe (31) fixedly connected to the outlet (11) end of the buffer tank (1); A flow control valve (32) is arranged on the connecting pipe (31).

2. The defoaming device according to claim 1, characterized in that: The inner wall surface of the buffer groove (1) has at least one buffer surface (13) inclined from the inlet (12) toward the outlet (11), so that the diameter of the buffer groove (1) gradually decreases from the inlet (12) toward the outlet (11).

3. The defoaming device according to claim 2, characterized in that: The buffer surface (13) is arranged along a circle of the groove wall of the buffer groove (1).

4. The defoaming device according to claim 3, characterized in that: The buffer groove (1) is a pyramid-shaped groove.

5. The defoaming device according to claim 4, characterized in that: The buffer groove (1) is a square cone-shaped groove.

6. The defoaming device according to claim 1, characterized in that: The defoaming body (2) is a silk screen and / or fiber cotton.

7. A plating solution recovery system, characterized in that: include An electroplating tank (4), a liquid storage tank (5) and at least one defoaming device according to any one of claims 1 to 6; Any of the defoaming devices is arranged vertically between the electroplating tank (4) and the liquid storage tank (5), and the discharge port of the electroplating tank (4) is connected to the inlet (12) of the buffer tank (1), and the liquid outlet (310) of the liquid level maintaining device (3) is connected to the inner cavity of the liquid storage tank (5).

8. The electroplating solution recovery system according to claim 7, characterized in that: The liquid discharge port is arranged opposite to the inlet (12) of the buffer tank (1).

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