Intelligent power module packaging structure

Abstract

An intelligent power module packaging structure includes an intelligent power integrated unit and an integrally formed packaging shell, wherein the intelligent power integrated unit includes a power circuit substrate, a built-in functional circuit board and a plurality of connecting columns; a plurality of first through holes corresponding to the plurality of connecting columns are provided on the built-in functional circuit board, the bottom ends of the plurality of connecting columns are fixed on the power circuit substrate, the top ends of the plurality of connecting columns pass through the built-in functional circuit board through the plurality of first through holes respectively, and are fixedly connected to the built-in functional circuit board at the first through holes corresponding thereto; the packaging shell includes an installation cavity with an opening at the bottom, the intelligent power integrated unit is installed in the installation cavity, and the power circuit substrate of the intelligent power integrated unit is sealed at the bottom opening position of the installation cavity, forming a closed packaging structure with the packaging shell. The structure reduces the investment cost of the production line, improves the space utilization rate and design freedom of the intelligent power integrated unit, and simplifies the packaging shell structure and packaging process.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of power module packaging, and in particular to an intelligent power module packaging structure. Background Art

[0002] Intelligent Power Module (IPM) integrates functional circuit units on the basis of traditional power modules. Due to its high integration, high reliability and simple external supporting circuits, it is widely used in home appliances, industrial transmission and other fields. There are two existing IPM packaging methods:

[0003] One packaging method is that IPM uses a copper wire frame with pins as the packaging frame, places the power circuit substrate and the functional circuit in the form of an integrated circuit chip on the packaging frame, and then wraps and solidifies it with a resin material to form a packaging structure with a hard plastic shell. In this packaging method, the functional circuit exists in the form of an integrated chip, resulting in high requirements for production line automation during the assembly process and low reuse. Minor changes in the IPM structure often require major changes in the production line, resulting in a scarcity of IPM types and high costs, making it difficult to meet the fiercely competitive and increasingly demanding industrial control product market.

[0004] Another packaging method is that the functional circuit exists in the form of a built-in functional circuit board. Its packaging structure often includes a power circuit substrate, a built-in functional circuit board, a packaging frame and a packaging cover. The packaging frame is first bonded to the power circuit substrate, and then the built-in functional circuit board is fixed to the packaging frame by bonding or mortise and tenon joints. After the glue is poured and cured, the packaging cover is fixed to the packaging shell by bonding or mortise and tenon joints to form a stacked packaging structure. This packaging method has a complex packaging process and high cost, and the built-in functional circuit board must be fixed to the packaging frame by bonding or mortise and tenon joints, so that the design of the built-in functional circuit board and the packaging frame must be coupled with each other, reducing the freedom of IPM design.

[0005] In summary, the existing IPM packaging methods have the following problems: the assembly process has high requirements for the production line and the reuse rate is low. Minor changes in the IPM structure often require major changes in the production line, resulting in scarce IPM types and high costs, which make it difficult to meet the needs of the highly competitive and increasingly demanding industrial control product market; or, the packaging process is complicated and costly, which reduces the freedom of IPM design. Summary of the invention

[0006] In view of this, an embodiment of the present invention aims to provide an intelligent power module packaging structure to solve the problems existing in the above-mentioned prior art, that the assembly process has high requirements on the production line, the reuse degree is low, and a slight change in the IPM structure often requires a major change in the production line, resulting in scarce IPM types and high costs, which are difficult to meet the fierce competition and increasingly demanding industrial control product market; or, the packaging process is complicated and the cost is high, which reduces the freedom of IPM design.

[0007] The technical solution adopted by the embodiment of the present invention to solve the above technical problems is as follows:

[0008] According to one aspect of an embodiment of the present invention, there is provided an intelligent power module packaging structure, comprising an intelligent power integrated unit and an integrally formed packaging shell, wherein:

[0009] The intelligent power integrated unit comprises a power circuit substrate, a built-in functional circuit board and a plurality of connecting columns; a plurality of first through holes corresponding to the plurality of connecting columns are provided on the built-in functional circuit board, the bottom ends of the plurality of connecting columns are fixed on the power circuit substrate, the top ends of the plurality of connecting columns respectively pass through the built-in functional circuit board through the plurality of first through holes, and are fixedly connected to the built-in functional circuit board at the first through holes corresponding thereto, so that the built-in functional circuit board is stacked on the power circuit substrate;

[0010] The packaging shell includes an installation cavity with an opening at the bottom, the intelligent power integrated unit is installed in the installation cavity, and the power circuit substrate of the intelligent power integrated unit is sealed at the bottom opening position of the installation cavity to form a closed packaging structure with the packaging shell.

[0011] On the basis of the above technical solution, a stepped groove matching with the power circuit substrate is provided at the bottom of the side wall of the installation cavity, and the power circuit substrate is fixed at the position of the stepped groove by bonding.

[0012] On the basis of the above technical solution, the plurality of connecting pillars include a first short connecting pillar and a second long connecting pillar, wherein:

[0013] The bottom end of the first short connecting column is fixed on the power circuit substrate, the top end of the first short connecting column passes through the built-in functional circuit board through the first through hole corresponding thereto and no longer extends, and the first short connecting column is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto;

[0014] The bottom end of the second long connecting column is fixed on the power circuit substrate, the top end of the second long connecting column passes through the built-in functional circuit board through the first through hole corresponding thereto and has an extension portion, and the second long connecting column is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto;

[0015] The upper surface of the packaging shell is provided with a plurality of second through holes, the number of which is greater than or equal to the number of the second long connecting columns, and the extensions of the second long connecting columns pass through the upper surface of the packaging shell through the corresponding second through holes.

[0016] On the basis of the above technical solution, the plurality of connecting posts include a first short connecting post, the bottom end of the first short connecting post is fixed on the power circuit substrate, the top end of the first short connecting post passes through the built-in functional circuit board through the first through hole corresponding thereto and no longer extends, and the first short connecting post is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto;

[0017] The intelligent power module packaging structure further includes a plurality of third long connecting columns, the bottom ends of the third long connecting columns are fixed on the power circuit substrate, and the top ends of the third long connecting columns avoid the built-in functional circuit board and have an extension portion;

[0018] The upper surface of the packaging shell is provided with a plurality of second through holes, the number of which is greater than or equal to the number of the third long connecting columns, and the extensions of the third long connecting columns pass through the upper surface of the packaging shell through the corresponding second through holes.

[0019] On the basis of the above technical solution, a first glue pouring inlet is provided on the packaging shell, and the intelligent power packaging structure also includes insulating silicone. After the packaging shell and the intelligent power integrated unit are assembled, the insulating silicone is filled into the cavity formed by the assembly of the packaging shell and the intelligent power integrated unit through the first glue pouring inlet.

[0020] On the basis of the above technical solution, a second glue potting inlet is provided on the built-in functional circuit board, and the insulating silica gel is injected into the space between the built-in functional circuit board and the power circuit substrate through the second glue potting inlet.

[0021] Based on the above technical solution, there is a gap between the built-in functional circuit board and the inner surface of the side wall of the packaging shell, and the insulating silicone overflows through the gap to fill the sealed cavity formed by bonding the packaging shell and the intelligent power integrated unit.

[0022] Based on the above technical solution, a connector is welded on the built-in functional circuit board, a connector extension port is opened on the packaging shell, and the connector extends out of the packaging shell through the connector extension port to perform signal exchange with an external circuit.

[0023] On the basis of the above technical solution, both sides of the packaging shell are respectively provided with assembly holes for fixing the intelligent power module packaging structure on the external heat dissipation plane through locking pieces.

[0024] Based on the above technical solution, it also includes a deformation suppression column, the top end of which abuts against the central part of the top inner surface of the packaging shell, and the bottom end of which passes through the built-in functional circuit board and abuts against the upper surface of the power circuit substrate.

[0025] The beneficial effects of the embodiments of the present invention are as follows:

[0026] In the intelligent power module packaging structure provided by the embodiment of the present invention, the functional circuit exists in the form of a built-in functional circuit board, and its assembly process does not require special process treatment, and has low requirements on the production line, so that the production line has high reusability and reduces the investment cost of the production line; because the built-in functional circuit board is fixed above the power circuit substrate through the connecting column, there is no need for a coupling design between the built-in functional circuit board and the packaging shell, thereby increasing the freedom of design of the intelligent power integrated unit and improving the space utilization of the packaging structure, which is conducive to reducing the volume of the packaging structure and increasing the power density of the packaging structure; in addition, because there is no need for a coupling design between the built-in functional circuit board and the packaging shell, the shell of the intelligent functional module can be designed as an integrally formed packaging shell, reducing the number of shell components, simplifying the packaging process, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1 is an exploded diagram of the packaging structure of the intelligent power module provided by an embodiment of the present invention;

[0029] Figure 2 It is a structural schematic diagram of an intelligent power integration unit in an intelligent power module packaging structure provided by an embodiment of the present invention in a specific implementation manner;

[0030] Figure 3is a structural schematic diagram of an intelligent power integration unit in an intelligent power module packaging structure provided by an embodiment of the present invention in another specific implementation manner;

[0031] Figure 4 It is a structural schematic diagram of a stepped groove opened at the bottom of the side wall of the packaging shell in the intelligent power module packaging structure provided by an embodiment of the present invention;

[0032] Figure 5 is a cross-sectional schematic diagram of the packaging structure of the intelligent power module provided by an embodiment of the present invention after packaging is completed;

[0033] Figure 6 This is a schematic diagram of the structure of the intelligent power module packaging structure provided by an embodiment of the present invention after packaging is completed;

[0034] Figure 7 is an exploded view of a smart power module packaging structure provided by another embodiment of the present invention;

[0035] Figure 8 is a schematic diagram of the matching relationship between the deformation suppression column and the packaging shell in the intelligent power module packaging structure provided by another embodiment of the present invention;

[0036] Fig. 9 It is a cross-sectional schematic diagram of an intelligent power module packaging structure after packaging provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the embodiments of the present invention and are not used to limit the embodiments of the present invention.

[0038] Embodiment 1

[0039] Figure 1 FIG. 1 is an exploded view of the packaging structure of the intelligent power module provided by the embodiment of the present invention. For the convenience of explanation, only the parts related to the present embodiment are shown.

[0040] See also Figure 1 As shown, the intelligent power module packaging structure provided in this embodiment includes an intelligent power integrated unit 1 and an integrally formed packaging shell 2, wherein:

[0041] The intelligent power integrated unit 1 includes a power circuit substrate 11, a built-in functional circuit board 12, and a plurality of connecting posts 13 for signal transmission and fixing the built-in functional circuit board 12; the built-in functional circuit board 12 is provided with a plurality of first through holes (not shown in the figure) corresponding to the plurality of connecting posts 13, the bottom ends of the plurality of connecting posts 13 are all fixed on the power circuit substrate 11, the top ends of the plurality of connecting posts 13 respectively pass through the built-in functional circuit board 12 through the plurality of first through holes, and are fixedly connected to the built-in functional circuit board 12 at the first through holes corresponding thereto, so that the built-in functional circuit board 12 is stacked on the power circuit substrate 11;

[0042] The packaging shell 2 includes an installation cavity with an opening at the bottom, the intelligent power integrated unit 1 is installed in the installation cavity, and the power circuit substrate 11 of the intelligent power integrated unit 1 is sealed at the bottom opening position of the installation cavity to form a closed packaging structure with the packaging shell 2.

[0043] The power circuit substrate 11 in the intelligent power integrated unit 1 includes but is not limited to an aluminum-based resin copper-clad laminate, a copper-based resin copper-clad laminate or a double-sided copper-clad ceramic substrate, and the power circuit substrate 11 is welded with power switch devices with functions not limited to inversion, rectification, braking, buffering, etc. and temperature and electrical signal sampling devices. The built-in functional circuit board 12 is welded with discrete functional devices with functions not limited to power supply, signal sampling and conditioning, protection, drive, microcontroller unit operation, etc.

[0044] The bottom ends of the multiple connection pillars 13 are fixed to the power circuit substrate 11 by welding, and the multiple connection pillars 13 are fixed and signal transmitted to the built-in functional circuit board 12 by welding and / or crimping at the corresponding first through holes. Preferably, in this embodiment, multiple built-in functional circuit substrates can be stacked on the multiple connection pillars.

[0045] In this embodiment, a plurality of connecting posts 13 are fixed to the power circuit substrate 11 by welding, and are fixed and signal transmitted with at least one built-in functional circuit board 12 by welding and / or crimping, so that the stability of the connection between the connecting posts and the power circuit substrate 11 and the built-in functional circuit board 12 can be achieved, and the power circuit substrate 11 and the built-in functional circuit board 12 can achieve signal multiplexing based on the connecting posts 13; in addition, since the power switching devices are all fixed to the power circuit substrate 11 by welding, the connecting posts can be assembled together with the power switching devices, thereby simplifying the assembly process.

[0046] For further information, see Figure 2As shown, in a specific implementation, the plurality of connecting pillars 13 include a first short connecting pillar 131 and a second long connecting pillar 132, wherein:

[0047] The bottom end of the first short connecting column 131 is fixed on the power circuit substrate 11, and the top end of the first connecting column 131 passes through the built-in functional circuit board 12 through the first through hole corresponding thereto and does not extend any further, and the first connecting column 131 is fixedly connected to the built-in functional circuit board 12 at the first through hole corresponding thereto;

[0048] The bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11, the top end of the second long connecting column 132 passes through the built-in functional circuit board 12 through the first through hole corresponding thereto and has an extension portion, and the second long connecting column 132 is fixedly connected to the built-in functional circuit board 12 at the first through hole corresponding thereto;

[0049] The upper surface of the packaging shell 2 is provided with a plurality of second through holes 21 , the number of which is greater than or equal to the number of the second long connecting columns 132 , and the extensions of the second long connecting columns 132 pass through the upper surface of the packaging shell 2 through the corresponding second through holes 21 .

[0050] Preferably, in this embodiment, the bottom end of the first short connecting column 131 is fixed to the power circuit substrate 11 by welding, and the first short connecting column 131 is welded or crimped at its corresponding first through hole to achieve functional multiplexing of signal transmission and structural fixation with the built-in functional circuit board 12.

[0051] Preferably, in this embodiment, the bottom end of the second long connecting column 132 is fixed to the power circuit substrate 11 by welding, and the top end of the second long connecting column 132 is welded or crimped at its corresponding through hole with the built-in functional circuit board 12 to achieve functional multiplexing of signal transmission and structural fixation.

[0052] Preferably, in this embodiment, the top ends of the first short connecting column 131 and the second long connecting column 132 can be set to a needle-like shape, so that the first short connecting column 131 and the second long connecting column 132 can quickly pass through the first through hole on the built-in functional circuit board 12 to facilitate assembly.

[0053] Preferably, in this embodiment, the appearance of the first short connecting column 131 and the second long connecting column 132 is not limited to a fixed shape. In specific implementation, the specific implementation forms of the first short connecting column 131 and the second long connecting column 132 include but are not limited to cylindrical terminals, regular polygonal terminals and / or flat terminals.

[0054] Preferably, in this embodiment, the number of the second through holes 21 opened on the upper surface of the packaging shell 2 is greater than the number of the second long connecting pillars 132, so that the packaging shell 2 can be compatible with the extension requirements of the long terminals of multiple different types of power circuit substrates 11. Of course, in other application scenarios with low compatibility with the packaging shell 2, the number of the second through holes 21 opened on the upper surface of the packaging shell 2 can also be equal to the number of the second long connecting pillars 132 welded on the power circuit substrate 11.

[0055] For further information, see Figure 3 As shown, in another specific implementation, the plurality of connecting posts 13 include a first short connecting post 131, the bottom end of the first short connecting post 131 is fixed on the power circuit substrate 11, the top end of the first short connecting post 131 passes through the built-in functional circuit board 12 through the first through hole corresponding thereto and no longer extends, and the first short connecting post 131 is fixedly connected to the built-in functional circuit board 12 at the first through hole corresponding thereto;

[0056] The intelligent power module packaging structure further includes a plurality of third long connecting pillars 133 for signal transmission, the bottom ends of the third long connecting pillars 133 are fixed on the power circuit substrate 11, and the top ends of the third long connecting pillars 133 avoid the built-in functional circuit board 12 and have an extension portion;

[0057] The upper surface of the packaging shell 2 is provided with a plurality of second through holes 21 , the number of which is greater than or equal to the number of the third long connecting columns 133 , and the extensions of the third long connecting columns 133 pass through the upper surface of the packaging shell 2 through the corresponding second through holes 21 .

[0058] Preferably, in this embodiment, the bottom end of the first short connecting column 131 is fixed to the power circuit substrate 11 by welding, and the first short connecting column 131 is welded or crimped at its corresponding first through hole to achieve functional multiplexing of signal transmission and structural fixation with the built-in functional circuit board 12.

[0059] Preferably, in this embodiment, the area of ​​the built-in functional circuit board 12 is smaller than the area of ​​the power circuit substrate 11, and the third long connecting column 133 is respectively arranged at positions near the four sides of the power circuit substrate 11, and the bottom end of the third long connecting column 133 is fixed to the power circuit substrate 11 by welding, and the top end of the third long connecting column 133 avoids the built-in functional circuit board 12 and extends out of the packaging shell 2 through the second through hole 21 on the packaging shell 2 to interact with the external circuit for signals.

[0060] Preferably, in this embodiment, the size of the second through hole 21 opened on the upper surface of the packaging shell 2 is equal to the cross-sectional area of ​​the extension portion of the third column, so that the extension portion of the third column just extends out of the packaging shell 2 through the corresponding second through hole 21 to interact with the external circuit for signals.

[0061] Preferably, in this embodiment, the number of the second through holes 21 opened on the upper surface of the packaging shell 2 is greater than the number of the third long connecting pillars 133, so that the packaging shell 2 can be compatible with the extension requirements of the long terminals of multiple different types of power circuit substrates 11. Of course, in other application scenarios with low compatibility with the packaging shell 2, the number of the second through holes 21 opened on the upper surface of the packaging shell 2 can also be equal to the number of the third long connecting pillars 133 welded on the power circuit substrate 11.

[0062] Preferably, in this embodiment, the appearance of the first short connecting column 131 and the third long connecting column 133 is not limited to a fixed shape. In specific implementation, the specific implementation forms of the first short connecting column 131 and the third long connecting column 133 include but are not limited to cylindrical terminals, regular polygonal terminals and / or flat terminals.

[0063] For further information, see Figure 2 As shown, the packaging shell 2 is provided with a first glue injection port 22, and the intelligent power packaging structure further includes insulating silica gel. After the packaging shell 2 and the intelligent power integrated unit 1 are assembled, the insulating silica gel is injected into the cavity formed by the assembly of the packaging shell 2 and the intelligent power integrated unit 1 through the first glue injection port 22. The built-in functional circuit board 12 is provided with a second glue injection port 122, and the insulating silica gel fills the space between the built-in functional circuit board 12 and the power circuit substrate 11 through the second glue injection port 122. There is a gap between the built-in functional circuit board 12 and the inner surface of the side wall of the packaging shell 2, and the insulating silica gel overflows through the gap to fill the sealed cavity formed after the packaging shell 2 and the intelligent power integrated unit 1 are bonded. In this embodiment, the insulating silica gel can overflow the space in the sealed cavity formed after the packaging shell 2 and the intelligent power integrated module are packaged through the first glue injection port 22, the second glue injection port 122 and the gap, and play the role of insulation protection and dust prevention for the functional circuit substrate and the built-in functional circuit board 12.

[0064] For further information, see Figure 2 As shown, a connector 123 is welded on the built-in functional circuit board 12 , and a connector extension opening 23 is opened on the packaging shell 2 . The connector 123 extends out of the packaging shell 2 through the connector extension opening 23 to perform signal exchange with an external circuit.

[0065] For further information, see Figure 2 As shown, the two sides of the packaging shell 2 are respectively provided with assembly holes 24 for fixing the intelligent power module packaging structure on the external heat dissipation plane through locking elements. Preferably, in this embodiment, the locking elements are screws.

[0066] For further information, see Figure 4 As shown, the bottom of the side wall of the installation cavity is provided with a stepped groove 25 that matches the power circuit substrate 11, and the power circuit substrate 11 is fixed at the position of the stepped groove 25 by bonding. Preferably, in this embodiment, the surface of the stepped groove 25 is coated with silicone rubber, and the power circuit substrate 11 is bonded to the stepped groove 25 by the silicone rubber. Figure 5 and Figure 6 shown.

[0067] It can be seen from the above that the intelligent power module packaging structure provided in this embodiment, since the functional circuit is in the form of a built-in functional circuit board 12, its assembly process does not require special process treatment, and has low requirements on the production line, making the production line highly reusable and reducing the investment cost of the production line; since the built-in functional circuit board 12 is fixed above the power circuit substrate 11 through the connecting column, there is no need for a coupling design between the built-in functional circuit board 12 and the packaging shell 2, thereby increasing the freedom of design of the intelligent power integrated unit 1 and improving the space utilization of the packaging structure, which is beneficial to reducing the volume of the packaging structure and increasing the power density of the packaging structure; in addition, since there is no need for a coupling design between the built-in functional circuit board 12 and the packaging shell 2, the shell of the intelligent functional module can be designed as an integrally formed packaging shell 2, reducing the number of shell components, simplifying the packaging process, and reducing costs.

[0068] Embodiment 2

[0069] Figure 7 FIG. 1 is a schematic diagram of a smart power module packaging structure provided by another embodiment of the present invention. For ease of explanation, only the parts related to this embodiment are shown.

[0070] See also Figure 7 As shown, relative to the previous embodiment, the intelligent power module packaging structure provided in this embodiment also includes a deformation suppression column 14, the top end of the deformation suppression column 14 abuts against the center of the top inner surface of the packaging shell 2, and the bottom end of the deformation suppression column 14 passes through the built-in functional circuit board 12 and abuts against the upper surface of the power circuit substrate 11.

[0071] In this embodiment, the built-in functional circuit board 12 is provided with an extension opening of a deformation suppression column 14, the bottom end of the deformation suppression column 14 abuts against the upper surface of the power circuit substrate 11, and the top end of the deformation suppression column 14 passes through the built-in functional circuit board 12 through the deformation suppression column extension opening 124 and abuts against the inner surface of the top shell of the packaging shell 2 (such as Figure 8 As shown in FIG. 1 , when the smart power package structure is fixed to the external heat dissipation plane by means of screws or other fasteners, the deformation suppression column 14 can suppress the deformation of the power circuit substrate 11. The cross-sectional diagram of the deformation suppression column 14, the power circuit substrate 11, the built-in functional circuit board 12 and the package shell 2 after packaging is completed is shown in FIG. Fig. 9 shown.

[0072] Furthermore, relative to the previous embodiment, the intelligent power integrated unit 1 in this embodiment also includes a plurality of limit support columns with limit support platforms, and the built-in functional circuit board 12 is provided with third through holes corresponding to the plurality of limit support columns one by one; the bottom ends of the plurality of limit support columns are fixed on the power circuit substrate 11, and the top ends of the plurality of limit support columns respectively pass through the built-in functional circuit board 12 through the corresponding third through holes, so that the limit support platforms of the plurality of limit support columns are respectively abutted against the bottom surface of the built-in functional circuit board 12 to limit and support the built-in functional circuit board 12, and the plurality of limit support columns are respectively fixedly connected to the built-in functional circuit board 12 at the corresponding third through holes.

[0073] The position-limiting support columns play a role in limiting, supporting and fixing the built-in power circuit board. Preferably, in this embodiment, the bottom ends of the plurality of position-limiting support columns are welded to the power circuit substrate 11, and the plurality of position-limiting support columns are respectively fixed to the built-in functional circuit board 12 at their corresponding second through holes 21 by welding and / or crimping.

[0074] Preferably, in this embodiment, the intelligent power integrated unit 1 includes four limit support columns, and the four limit support columns are respectively distributed at the four corner positions of the power circuit substrate 11, and the bottom ends of the four limit support columns are respectively welded at the four corner positions of the upper surface of the power circuit substrate 11, and the top ends respectively pass through the built-in functional circuit board 12 through four third through holes opened on the built-in functional circuit board 12, and the limit support platforms of the four limit support columns are respectively abutted against the bottom surface of the built-in functional circuit board 12 to limit and support the built-in functional circuit board 12, and the four limit support columns are respectively fixed to the built-in functional circuit board 12 at the corresponding third through holes by welding and / or crimping.

[0075] The circuit board packaging structure of the intelligent power integrated unit 1 provided in this embodiment is provided with a limiting support column between the power circuit substrate 11 and the built-in functional circuit substrate for limiting, supporting and fixing the built-in functional circuit board 12, which can further improve the stability of the packaging of the built-in functional circuit board 12.

[0076] It should be noted that since other parts of the structure of the intelligent power module packaging structure provided in this embodiment are completely the same as those in the previous embodiment, they will not be described in detail here.

[0077] Compared with the previous embodiment, the intelligent power module packaging structure provided in this embodiment is also provided with a deformation suppression column 14, and the bottom end of the deformation suppression column 14 is abutted against the upper surface of the power circuit substrate 11, and the top end passes through the built-in functional circuit board 12 and abuts against the inner surface of the top shell of the packaging shell 2, so that when the intelligent power module packaging structure is installed on the external heat dissipation plane through the locking fixture, the power circuit substrate 11 can be suppressed from deformation, thereby further improving the reliability of the intelligent power module packaging structure; in addition, since a limiting support column for limiting, supporting and fixing the built-in functional circuit board 12 is also provided between the power circuit substrate 11 and the built-in functional circuit substrate, the stability of the packaging of the built-in functional circuit board 12 can be further improved.

[0078] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the present invention is not limited thereby. Any modification, equivalent substitution and improvement made by those skilled in the art without departing from the scope and essence of the present invention shall be within the scope of the present invention.

Claims

1. An intelligent power module packaging structure, characterized in that: It includes an intelligent power integrated unit and an integrally formed packaging shell, wherein: The intelligent power integrated unit comprises a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts for signal transmission and fixing the built-in functional circuit board; a plurality of first through holes corresponding to the plurality of connecting posts are provided on the built-in functional circuit board, the bottom ends of the plurality of connecting posts are fixed on the power circuit substrate, the top ends of the plurality of connecting posts pass through the built-in functional circuit board through the plurality of first through holes respectively, and are fixedly connected to the built-in functional circuit board at the first through holes corresponding thereto, so that the built-in functional circuit board is stacked on the power circuit substrate; The packaging shell comprises an installation cavity with an opening at the bottom, the intelligent power integrated unit is installed in the installation cavity, and the power circuit substrate of the intelligent power integrated unit is sealed at the bottom opening position of the installation cavity to form a closed packaging structure with the packaging shell; The bottom of the side wall of the installation cavity is provided with a stepped groove matched with the power circuit substrate, and the power circuit substrate is fixed at the position of the stepped groove by bonding; The packaging shell is provided with a first glue injection port, and the intelligent power module packaging structure further includes insulating silica gel. After the packaging shell and the intelligent power integrated unit are assembled, the insulating silica gel is filled into the cavity formed by assembling the packaging shell and the intelligent power integrated unit through the first glue injection port; A second glue potting inlet is provided on the built-in functional circuit board, and the insulating silica gel fills the space between the built-in functional circuit board and the power circuit substrate through the second glue potting inlet; There is a gap between the built-in functional circuit board and the inner surface of the side wall of the packaging shell, and the insulating silica gel overflows through the gap to fill the sealed cavity formed by bonding the packaging shell and the intelligent power integrated unit.

2. The intelligent power module packaging structure according to claim 1, characterized in that: The plurality of connecting pillars include a first short connecting pillar and a second long connecting pillar, wherein: The bottom end of the first short connecting column is fixed on the power circuit substrate, the top end of the first short connecting column passes through the built-in functional circuit board through the first through hole corresponding thereto and no longer extends, and the first short connecting column is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto; The bottom end of the second long connecting column is fixed on the power circuit substrate, the top end of the second long connecting column passes through the built-in functional circuit board through the first through hole corresponding thereto and has an extension portion, and the second long connecting column is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto; The upper surface of the packaging shell is provided with a plurality of second through holes, the number of which is greater than or equal to the number of the second long connecting columns, and the extensions of the second long connecting columns pass through the upper surface of the packaging shell through the corresponding second through holes.

3. The intelligent power module packaging structure according to claim 1, characterized in that: The plurality of connecting posts include a first short connecting post, the bottom end of which is fixed on the power circuit substrate, the top end of which passes through the built-in functional circuit board through the first through hole corresponding thereto and does not extend any further, and the first short connecting post is fixedly connected to the built-in functional circuit board at the first through hole corresponding thereto; The intelligent power module packaging structure further includes a plurality of third long connecting columns, the bottom ends of the third long connecting columns are fixed on the power circuit substrate, and the top ends of the third long connecting columns avoid the built-in functional circuit board and have an extension portion; The upper surface of the packaging shell is provided with a plurality of second through holes, the number of which is greater than or equal to the number of the third long connecting columns, and the extensions of the third long connecting columns pass through the upper surface of the packaging shell through the corresponding second through holes.

4. The intelligent power module packaging structure according to claim 1, characterized in that: A connector is welded on the built-in functional circuit board, and a connector extension opening is provided on the packaging shell. The connector extends out of the packaging shell through the connector extension opening to perform signal exchange with an external circuit.

5. The intelligent power module packaging structure according to claim 1, characterized in that: Both sides of the packaging shell are respectively provided with assembly holes for fixing the intelligent power module packaging structure on an external heat dissipation plane through locking pieces.

6. The intelligent power module packaging structure according to claim 5, characterized in that: It also includes a deformation suppression column, the top end of which abuts against the center of the top inner surface of the packaging shell, and the bottom end of which passes through the built-in functional circuit board and abuts against the upper surface of the power circuit substrate.

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