A highly integrated multi-channel tile-type T / R component and arrangement method

Abstract

The present invention discloses a highly integrated multi-channel tile-type T / R component and an arrangement method. The highly integrated multi-channel tile-type T / R component is square, and is surrounded by a base plate, a cover plate, a front plate, a rear plate, a left plate and a right plate as walls to form an installation cavity. The characteristics are as follows: n groups of first connectors are installed on the base plate, each group of first connectors is composed of two connectors, one for receiving and one for transmitting, and each group of first connectors is perpendicular to the base plate. A group of second connectors is installed on the cover plate, and the second connector is a combined port for receiving output and transmitting input. A through groove is provided on the cover plate, and three layers are provided in the installation cavity. The present invention integrates multiple radio frequency channels to achieve miniaturization, can effectively reduce the cross-sectional height of the active phased array antenna, and the heating device inside the T / R component is close to the heat sink to achieve the purpose of rapid heat conduction.

Description

Technical Field

[0001] The present invention relates to the field of aerospace, and more specifically, to a highly integrated multi-channel tile-type T / R component, an active phased array antenna and an arrangement method of the highly integrated multi-channel tile-type T / R component. Background Art

[0002] Active phased array antennas have been widely used in military and civilian fields such as radar and communications. T / R components are the most critical components of such antennas. The RF signal direction of traditional brick-type T / R components is parallel to the component installation direction, and has the advantages of simple circuit, mature process and low cost. However, on the one hand, with the increase of operating frequency, the array element spacing of active phased array antennas becomes very small. Generally, the array element spacing is about half the wavelength of the frequency. When the operating frequency is 1GHz, the array element spacing is about 150mm. When the operating frequency is increased to 10GHz, the array element spacing is about 15mm, which makes the thickness of the brick component very thin and even difficult to implement in engineering. On the other hand, the component is far away from the cold plate, the heat dissipation path is long, the thermal resistance is large, and the heat dissipation structure is complex. At the same time, the installation method determines its large longitudinal size, making it difficult to reduce the profile of the entire active antenna, and it is not suitable for active phased array antenna applications with low profile requirements such as limited space size, special loading platform or conformal array. Summary of the invention

[0003] In response to the above problems, on the one hand, the present invention provides a highly integrated multi-channel tile-type T / R component, which integrates multiple RF channels to achieve miniaturization, can effectively reduce the cross-sectional height of the active phased array antenna, and the heat-generating devices inside the T / R component are close to the heat sink to achieve the purpose of rapid heat conduction.

[0004] A highly integrated multi-channel tile-type T / R component, which is square and is surrounded by a mounting cavity with a bottom plate, a cover plate, a front plate, a rear plate, a left plate and a right plate as walls. The bottom plate is provided with n groups of first connectors, each group of first connectors is respectively composed of two connectors, one for receiving and one for transmitting, and each group of first connectors is perpendicular to the bottom plate. A group of second connectors is installed on the cover plate, and the second connector is a combined port for receiving output and transmitting input. A through groove is provided on the cover plate. Three layers are provided in the mounting cavity. The first layer A microwave printed circuit chip, a power amplifier module, and a limiting and low-noise amplifier circuit are provided. A multi-function module is provided on the second layer. A first adapter module is provided between the first layer and the second layer. A power division module is provided on the third layer. A second adapter module is provided between the second layer and the third layer. The microwave printed circuit chip is respectively connected to the first connector, the power amplifier module, and the limiting and low-noise amplifier circuit. The first adapter module is connected to the multi-function module, the multi-function module is connected to the second adapter module, the second adapter module is connected to the power division module, and the power division module is connected to the second connector.

[0005] Preferably, the n groups of first connectors are 4 groups of first connectors.

[0006] Preferably, the multifunctional module comprises multifunctional chips for the multifunctional modules, a control chip for the multifunctional modules and a first LTCC multilayer substrate, the number of which is equal to the number of channels, and the multifunctional chips for the multifunctional modules and the control chip for the multifunctional modules are respectively connected to the first LTCC multilayer substrate.

[0007] Preferably, the power division module includes a power division module driving chip with half the number of channels, 1 power division module control chip, 1 power division module power chip and a second LTCC multi-layer substrate, and the power division module driving chip, the power division module control chip and the power division module power chip are respectively connected to the second LTCC multi-layer substrate.

[0008] Preferably, the first adapter module comprises a first metal partition wall, in which a first hair button carrier unit, a second hair button carrier unit and a third hair button carrier unit are arranged, and hair buttons are respectively mounted on the first hair button carrier unit, the second hair button carrier unit and the third hair button carrier unit.

[0009] Preferably, the second adapter module comprises a second metal partition wall, in which a second button carrier unit, a third button carrier unit and a fourth button carrier unit are arranged, and buttons are respectively mounted on the second button carrier unit, the third button carrier unit and the fourth button carrier unit.

[0010] Preferably, the power amplifier module comprises a power amplifier chip, a power amplifier chip capacitor, a power amplifier chip resistor, a power amplifier chip capacitor and a molybdenum-copper carrier, and the power amplifier chip, the power amplifier chip capacitor, the power amplifier chip resistor and the power amplifier chip capacitor are mounted on the molybdenum-copper carrier.

[0011] Preferably, the limiting and low-noise discharge routing is composed of limiting and low-noise amplifier circuit units with the same number of channels, each limiting and low-noise amplifier circuit unit includes a limiting and low-noise amplifier driver chip, a limiter and a low-noise amplifier, each limiter and low-noise amplifier is connected to a microwave printed circuit chip, and each limiting and low-noise amplifier driver chip is connected to the microwave printed circuit chip.

[0012] In one aspect, the present invention also provides an active phased array antenna.

[0013] An active phased array antenna comprises an active phased array antenna front end, which comprises an antenna array surface layer, a circulator layer, a heat sink layer and a T / R component layer in sequence from top to bottom, wherein the T / R component is installed in the T / R component layer, each array element in the antenna array surface layer is connected to the circulator of the circulator layer, and the remaining two ports of the circulator are connected to the radio frequency transceiver port of the T / R component in the T / R component layer, and the heat sink layer is embedded with a liquid cooling heat conduction pipe, and the T / R component is the above-mentioned highly integrated multi-channel tile-type T / R component.

[0014] Preferably, the first connector is connected to the circulator, and the power amplifier module is adjacent to the heat sink layer.

[0015] On the one hand, the present invention also provides a method for arranging a highly integrated multi-channel tile-type T / R component.

[0016] A method for arranging a highly integrated multi-channel tile-type T / R component, wherein the highly integrated multi-channel tile-type T / R component is divided into three layers according to the plane where the radio frequency signal is located, wherein the first layer is a power amplifier and low noise amplifier layer, the second layer is a multifunctional module layer, and the third layer is a power splitter module layer. A first connector is vertically connected to a microwave printed circuit chip of the first layer, the microwave printed circuit chip is connected to the power amplifier module and the limiting low noise amplifier circuit with a gold belt or a gold wire, and then connected to the bottom surface contact of the multifunctional module of the second layer through a first adapter module, the front surface contact of the multifunctional module is connected to the front surface contact of the power splitter module of the third layer through a second adapter module, the power splitter module and the carrier board are sintered to a gold cover plate with alloy solder, and the bottom surface contact of the power splitter module is elastically connected to the inner conductor of the second connector to the port output.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The main circuits of the highly integrated multi-channel tile-type T / R component of the present invention are located in the power amplifier module, the multi-channel module and the power division module. Each module can be tested and debugged individually through a dedicated test fixture, so that the entire component has very good testability and debuggability.

[0019] 2. The multi-channel module and the power division module of the present invention are in elastic contact through the adapter module, so as to realize reliable connection between the radio frequency signal and the control power supply signal, facilitate disassembly and replacement, and make the T / R assembly easy to locate faults and repair.

[0020] 3. The entire T / R component of the present invention integrates four transceiver channels, with a size of only 40mm×40mm×10mm (excluding the circulator), achieving multi-channel high-density integration, minimizing the component height, and realizing a low-profile active phased array antenna.

[0021] 4. The component of the present invention utilizes two LTCC multi-layer substrates to achieve high-density stacking of three-layer planar RF devices. RF power dividers are embedded inside the substrates. By reasonably dividing the multi-layer circuits and ground loops, the mutual interference problem of RF, power, digital and other signal routings is solved.

[0022] 5. The first adapter module, the second adapter module, the multi-function module and the power division module are placed in the aluminum alloy cavity, dividing the internal space of the cavity into multiple closed small spaces. The four channels are isolated from each other, which can effectively solve the electromagnetic compatibility problem between channels.

[0023] 6. The mounting surface of the power amplifier module of the present invention is in close contact with the heat sink, and the heat generated by the power amplifier is quickly discharged, which can reduce the temperature of the power amplifier chip and even the array surface of the entire active antenna array, thereby improving reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 It is a schematic top view of a highly integrated multi-channel tile-type T / R assembly of the present invention;

[0026] Figure 2 It is a schematic side view of a highly integrated multi-channel tile-type T / R assembly of the present invention;

[0027] Figure 3 It is a bottom view schematic diagram of a highly integrated multi-channel tile-type T / R assembly of the present invention;

[0028] Figure 4 It is a schematic cross-sectional structure diagram of a highly integrated multi-channel tile-type T / R assembly of the present invention;

[0029] Figure 5 A schematic top view of a multifunctional module in a preferred embodiment of the present invention;

[0030] Figure 6 It is a schematic side view of a multifunctional module in a preferred embodiment of the present invention;

[0031] Figure 7 It is a bottom view schematic diagram of a multifunctional module in a preferred specific embodiment of the present invention;

[0032] Figure 8 A schematic top view of a power division module in a preferred embodiment of the present invention;

[0033] Fig. 9 It is a schematic side view of a power division module in a preferred specific embodiment of the present invention;

[0034] Fig.10 It is a schematic bottom view of a power splitter module in a preferred specific embodiment of the present invention;

[0035] Fig.11 This is a schematic structural diagram of a first switching module in a preferred specific embodiment of the present invention;

[0036] Fig.12 It is a structural schematic diagram of a second switching module in a preferred specific embodiment of the present invention;

[0037] Fig.13 A schematic diagram of a power amplifier module in a preferred embodiment of the present invention;

[0038] Fig.14 A schematic diagram of a limiting and low noise amplifier circuit in a preferred specific embodiment of the present invention;

[0039] Fig.15 A schematic diagram of a limiting and low noise amplifier circuit unit in a preferred specific embodiment of the present invention;

[0040] Fig.16 The RF working principle diagram of the highly integrated multi-channel tile-type T / R component of the present invention;

[0041] Fig.17 It is a schematic diagram of the structure of the active phased array antenna of the present invention.

[0042] Description of the reference numerals: first connector 1, second connector 2, long strip through slot 3, contact 4, mounting cavity 5, power amplifier module 6, power amplifier chip 61, molybdenum copper carrier 62, power amplifier chip capacitor 63, power amplifier chip capacitor 64, power amplifier chip resistor 65, limiting and low noise amplifier circuit 7, limiting and low noise amplifier circuit unit 71, limiting and low noise amplifier driver chip 711, limiter 712, low noise amplifier 713, microwave printed circuit chip 8, multi-function module 9, multi-function chip for multi-function module 91, control chip for multi-function module 92, contacts on the front and back of the substrate 93, first LTCC multi-layer substrate 94, first transfer Module 10, first metal partition wall 101, first button carrier unit 102, second button carrier unit 103, third button carrier unit 104, button 105, power division module 11, driving chip 111 for power division module, control chip 112 for power division module, power supply chip 113 for power division module, second LTCC multilayer substrate 114, second adapter module 12, second metal partition wall 121, fourth button carrier unit 122, carrier plate 13, cover plate 14, conductive film 15, antenna array layer 16, circulator layer 17, heat sink layer 18, T / R component layer 19, liquid cooling heat conduction pipe 20. DETAILED DESCRIPTION

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In the description of the present invention, "plurality" means two or more, unless otherwise precisely and specifically specified.

[0045] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0046] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0048] Please refer to Figure 1-4 , Figure 1 A schematic top view of a highly integrated multi-channel tile-type T / R component provided in this embodiment, Figure 2 is a side view schematic diagram of a highly integrated multi-channel tile-type T / R assembly of the present invention, Figure 3 1 is a bottom view schematic diagram of a highly integrated multi-channel tile-type T / R assembly of the present invention, Figure 4 It is a schematic diagram of the cross-sectional structure of the highly integrated multi-channel tile-type T / R component of the present invention.

[0049] A highly integrated multi-channel tile-type T / R component, which is square and is surrounded by a mounting cavity 5 with a bottom plate, a cover plate 14, a front plate, a rear plate, a left plate and a right plate as walls. Four groups of first connectors 1 are installed on the bottom plate, each group of first connectors 1 is composed of two connectors, one for receiving and one for transmitting, and each group of first connectors 1 is perpendicular to the bottom plate. The four groups of first connectors 1 form mutually independent channels 1, 2, 3 and 4, respectively. A group of second connectors 2 is installed on the cover plate 14, and the second connector 2 is a combined port for receiving output and transmitting input. A long strip through groove 3 is provided on the cover plate 14. Three layers are provided in the mounting cavity 5. According to the plane where the radio frequency signal is located, the first layer is provided with a microwave printed circuit chip 8, a power amplifier module 6 and a limiting and low noise amplifier circuit 7, and the second layer is provided with a power amplifier module 6 and a power amplifier module 7. A multifunctional module 9 is arranged, a first adapter module 10 is arranged between the first layer and the second layer, a power division module 11 is arranged on the third layer, a second adapter module 12 is arranged between the second layer and the third layer, a first connector 1 is connected to a microwave printed circuit chip 8, the microwave printed circuit chip 8 is connected to the power amplifier module 6 and the limiting and low noise amplifier circuit 7 through a gold belt or a gold wire, the microwave printed circuit chip 8 is connected to the first adapter module 10, the first adapter module 10 is connected to the bottom surface contact of the multifunctional module 9, the front contact of the multifunctional module 9 is connected to the front contact of the power division module 11 through the second adapter module 12, the power division module 11 is installed on a carrier board 13, the power division module 11 and the carrier board 13 are sintered to an aluminum alloy cover plate 14 with alloy solder, and the bottom surface contact of the power division module 11 and the inner conductor of the second connector 2 are elastically connected to the port output.

[0050] The long strip through slot 3 is used to expose the contact 4 on the bottom of the power splitter module, and the external power control signal is elastically connected to the contact 4 through the wool button. During packaging, the cover plate 14 is sealed to the installation cavity 5 by laser welding to achieve airtight packaging.

[0051] Furthermore, in order to improve heat exchange efficiency and reduce weight, the box body is an aluminum alloy box body.

[0052] Furthermore, a conductive film 15 is provided between the microwave printed circuit chip 8 and the first adapter module 10 , between the first adapter module 10 and the multifunctional module 9 , between the multifunctional module 9 and the second adapter module 12 , and between the second adapter module 12 and the power division module 11 .

[0053] Furthermore, the connector may be a SMP, SSMP or glass sintered insulator connector, which is not particularly limited in the present invention.

[0054] For further information, please refer to Figure 5-7 , Figure 5 FIG. 1 is a schematic top view of a multifunctional module 7 in a preferred embodiment of the present invention. Figure 6 FIG. 1 is a schematic side view of a multifunctional module 7 in a preferred embodiment of the present invention. Figure 7 It is a schematic bottom view of the multifunctional module 7 in a preferred specific embodiment of the present invention.

[0055] Figure 5-7 In the embodiment, the multifunctional module 9 includes a multifunctional chip 91 for the multifunctional module, a control chip 92 for the multifunctional module, and a first LTCC multilayer substrate 94, which are equal in number to the number of channels. The multifunctional chip 91 for the multifunctional module and the control chip 92 for the multifunctional module are respectively bonded to the first LTCC multilayer substrate 94 with conductive adhesive, and the multifunctional chip 91 and the control chip 92 for the multifunctional module are cascaded with gold wires, and the multifunctional chip 91 and the control chip 92 for the multifunctional module are cascaded with the first LTCC multilayer substrate 94 respectively with gold wires. The contacts 93 on the front and back sides of the first LTCC multilayer substrate 94 are used to be elastically connected with the first adapter module 10 and the second adapter module 12.

[0056] The multifunctional chip 91 for the multifunctional module may be BWM245, or may be BWM243, NC1517C-812SD or WND0048H, and is not particularly limited here.

[0057] For further information, please refer to Figure 8-10 , Figure 8 FIG. 1 is a schematic top view of a power division module 11 in a preferred embodiment of the present invention. Fig. 9 FIG. 1 is a schematic side view of a power division module 11 in a preferred embodiment of the present invention. Fig.10 It is a bottom view schematic diagram of the power division module 11 in a preferred specific embodiment of the present invention.

[0058] Figure 8-10 In the embodiment, the power division module 11 includes a power division module driver chip 111 with half the number of channels, a power division module control chip 112, a power division module power chip 113 and a second LTCC multilayer substrate 114. The power division module driver chip 111, the power division module control chip 112 and the power division module power chip 113 are respectively bonded to the second LTCC multilayer substrate 114 with conductive adhesive, and the chip and the second LTCC multilayer substrate 114 are cascaded with gold wires. The contacts 93 on the front side of the second LTCC multilayer substrate 114 are used to connect to the second adapter module 12, and the contacts on the back side are connected to the second connector 2 and the external connector.

[0059] For further information, please refer to Fig.11 , Fig.11 FIG. 1 is a schematic structural diagram of a first adapter module 10 in a preferred specific embodiment of the present invention.

[0060] Fig.11In the figure, the first adapter module 10 includes a first metal partition wall 101, in which a first button carrier unit 102, a second button carrier unit 103 and a third button carrier unit 104 are arranged, and buttons 105 are respectively installed on the first button carrier unit 102, the second button carrier unit 103 and the third button carrier unit 104, and the first button carrier unit 102, the second button carrier unit 103 and the third button carrier unit 104 are all made of polytetrafluoroethylene, and the material of the button 105 is cylindrical beryllium copper wire.

[0061] For further information, please refer to Fig.12 , Fig.12 FIG. 1 is a schematic diagram of the structure of the second switching module 12 in a preferred specific embodiment of the present invention.

[0062] Fig.12 In the figure, the second adapter module 12 includes a second metal partition wall 121, in which a second button carrier unit 103, a third button carrier unit 104 and a fourth button carrier unit 122 are arranged, and buttons 105 are respectively installed on the second button carrier unit 103, the third button carrier unit 104 and the fourth button carrier unit 122. The second button carrier unit 103, the third button carrier unit 104 and the fourth button carrier unit 122 are all made of polytetrafluoroethylene, and the material of the button 105 is cylindrical beryllium copper wire.

[0063] For further information, please refer to Fig.13 , Fig.13 It is a schematic diagram of the structure of the power amplifier module 6 in a preferred specific embodiment of the present invention.

[0064] Fig.13 In the figure, the power amplifier module 6 includes a power amplifier chip 61, a power amplifier chip capacitor 63, a power amplifier chip resistor 65, a power amplifier chip capacitor 64 and a molybdenum copper carrier 62. The power amplifier chip 61 is sintered to the molybdenum copper carrier 62 with a gold-tin alloy eutectic, the power amplifier chip capacitor 63, the power amplifier chip resistor 65 and the power amplifier chip capacitor 64 are bonded to the molybdenum copper carrier 62 with conductive glue, and the chips are cascaded with gold wires.

[0065] For further information, please refer to Figure 14-15 , Fig.14 FIG. 1 is a schematic diagram of a limiting and low noise amplifier circuit 7 in a preferred embodiment of the present invention. Fig.15 It is a schematic diagram of a limiting and low noise amplifier circuit unit 71 in a preferred specific embodiment of the present invention.

[0066] Figure 14-15In the figure, the limiting and low noise amplifier circuit 7 is composed of limiting and low noise amplifier circuit units 71 equal to the number of channels, each limiting and low noise amplifier circuit unit 71 includes a limiting and low noise amplifier driver chip 711, a limiter 712 and a low noise amplifier 713, each limiter 712 and a low noise amplifier 713 are glued to the wall of the mounting cavity 5 with conductive glue, each limiting and low noise amplifier driver chip 711 is glued to the microwave printed circuit chip 8 with conductive glue, and the limiting and low noise amplifier driver chip 711, each limiter 712, and the low noise amplifier 713 chip are cascaded with the microwave printed circuit chip 8 with gold wires.

[0067] Please refer to Fig.16 , Fig.16 This is a diagram showing the RF operating principle of the highly integrated multi-channel tile-type T / R component of the present invention.

[0068] from Fig.16 It can be seen that the working principle of the highly integrated multi-channel tile-type T / R component of the present invention is as follows: the received four-channel signal is vertically transferred to the microstrip through the first connector 1, enters the limiter 712 and the low noise amplifier 713, and then transfers to the multi-function module 9 through the first adapter module 10, and then transfers to the power division module 11 through the second adapter module 12, and after completing the synthesis of the four channels, it is vertically transferred to the second connector 2 for output. The transmission signal is input from the second connector 2 and transferred to the power division module 11, and after being divided into four channels, it reaches the multi-function module 9 through the second adapter module 12, and then reaches the power amplifier module 6 through the first adapter module 10, and finally transfers to the first connector 1 for output to the four transmission channels.

[0069] Based on the above, the present invention also provides an active phased array antenna.

[0070] Please refer to Fig.17 , Fig.17 It is a schematic diagram of the structure of the highly integrated multi-channel tile-type T / R component of the present invention installed in the front end of the active phased array antenna array.

[0071] An active phased array antenna includes an active phased array antenna front end, which includes an antenna array surface layer 16, a circulator layer 17, a heat sink layer 18 and a T / R component layer 19 from top to bottom. The T / R component layer 19 contains a T / R component. Each array element in the antenna array surface layer 16 is connected to the circulator of the circulator layer 17. The remaining two ports of the circulator are connected to the radio frequency transceiver port of the T / R component in the T / R component layer 19. The heat sink layer 18 is a metal flat plate, and the heat sink layer 18 is embedded with a liquid cooling heat conduction pipe 20. The T / R component is the above-mentioned highly integrated multi-channel tile-type T / R component.

[0072] During installation, the first connector 1 is connected to the circulator, and the power amplifier module 6 is close to the heat sink layer 18, which shortens the distance between the power amplifier module 6 and the heat sink layer 18 and timely transfers the heat generated by the T / R component in operation.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An active phased array antenna, comprising an active phased array antenna front end, the active phased array antenna front end sequentially comprising an antenna array surface layer, a circulator layer, a heat sink layer and a T / R component layer from top to bottom, the T / R component layer is equipped with a T / R component, each array element in the antenna array surface layer is connected to the circulator of the circulator layer, the remaining two ports of the circulator are connected to the radio frequency transceiver port of the T / R component in the T / R component layer, the heat sink layer is embedded with a liquid cooling heat conduction pipe, characterized in that: The T / R component is a highly integrated multi-channel tile-type T / R component. The highly integrated multi-channel tile-type T / R component is square, and is surrounded by a mounting cavity with a bottom plate, a cover plate, a front plate, a rear plate, a left plate and a right plate as walls. The bottom plate is equipped with n groups of first connectors, each group of first connectors is composed of two connectors, one for receiving and one for transmitting, and each group of first connectors is perpendicular to the bottom plate. A group of second connectors is installed on the cover plate, and the second connector is a combined port for receiving output and transmitting input. A through groove is provided on the cover plate, and three layers are provided in the mounting cavity. The first layer is provided with a microwave printed circuit chip, a power amplifier module, and a limiting and low-noise amplifier circuit, the second layer is provided with a multifunctional module, a first adapter module is provided between the first layer and the second layer, a power division module is provided on the third layer, and a second adapter module is provided between the second layer and the third layer, the microwave printed circuit chip is respectively connected to the first connector, the power amplifier module, and the limiting and low-noise amplifier circuit, the first adapter module is connected to the multifunctional module, the multifunctional module is connected to the second adapter module, the second adapter module is connected to the power division module, and the power division module is connected to the second connector; The first adapter module comprises a first metal partition wall, in which a first hair button carrier unit, a second hair button carrier unit and a third hair button carrier unit are arranged, and hair buttons are respectively installed on the first hair button carrier unit, the second hair button carrier unit and the third hair button carrier unit; The second adapter module includes a second metal partition wall, in which a second button carrier unit, a third button carrier unit and a fourth button carrier unit are arranged, and buttons are respectively installed on the second button carrier unit, the third button carrier unit and the fourth button carrier unit; The first connector is vertically connected to the microwave printed circuit chip of the first layer, the microwave printed circuit chip is connected to the power amplifier module and the limiting low noise amplifier circuit with a gold belt or a gold wire, and then connected to the bottom surface contact of the multi-function module of the second layer through the first adapter module, the front contact of the multi-function module is connected to the front contact of the power division module of the third layer through the second adapter module, the power division module and the carrier board are sintered to the aluminum alloy cover plate with alloy solder, and the bottom surface contact of the power division module is elastically connected to the inner conductor of the second connector to the port output.

2. The active phased array antenna according to claim 1, characterized in that: The first connector is connected to the circulator, and the power amplifier module is adjacent to the heat sink layer.

3. The active phased array antenna according to claim 1, characterized in that: The n groups of first connectors are 4 groups of first connectors.

4. The active phased array antenna according to any one of claims 1 or 3, characterized in that: The multifunctional module comprises multifunctional chips for the multifunctional module, a control chip for the multifunctional module and a first LTCC multilayer substrate, the number of which is equal to the number of channels. The multifunctional chips for the multifunctional module and the control chip for the multifunctional module are respectively connected to the first LTCC multilayer substrate.

5. The active phased array antenna according to any one of claims 1 or 3, characterized in that: The power division module includes a power division module driving chip with half the number of channels, a power division module control chip, a power division module power chip and a second LTCC multi-layer substrate. The power division module driving chip, the power division module control chip and the power division module power chip are respectively connected to the second LTCC multi-layer substrate.

6. The active phased array antenna according to any one of claims 1 or 3, characterized in that: The power amplifier module comprises a power amplifier chip, a power amplifier chip capacitor, a power amplifier chip resistor, a power amplifier patch capacitor and a molybdenum copper carrier, and the power amplifier chip, the power amplifier chip capacitor, the power amplifier chip resistor and the power amplifier patch capacitor are mounted on the molybdenum copper carrier; or / and The limiting and low-noise discharge circuit is composed of limiting and low-noise amplifier circuit units with the same number of channels, each limiting and low-noise amplifier circuit unit includes a limiting and low-noise amplifier driver chip, a limiter and a low-noise amplifier, each limiter and low-noise amplifier is connected to a microwave printed circuit chip, and each limiting and low-noise amplifier driver chip is connected to the microwave printed circuit chip.

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