Strong electromagnetic pulse cumulative effect research method for communication interface chip

Abstract

The invention belongs to the technical field of electromagnetic environment effects. The invention provides a strong electromagnetic pulse cumulative effect research method for a communication interface chip. According to the embodiment of the invention, on the basis of ensuring the normal receiving and transmitting work of the communication interface circuit, a communication interface circuit which is suitable for various ports, high in repeatability, high in testability and convenient for observing the strong electromagnetic pulse effect phenomenon of the interface circuit and acquiring corresponding threshold data is designed and established; and moreover, sensitive weak links of the test platform can be further checked and positioned, and a test scheme of cumulative effects is provided, so that a foundation is laid for interface reinforcement protection of an interface circuit of communication equipment.

Description

Technical Field

[0001] The disclosed embodiments relate to the technical field of electromagnetic environment effects, and in particular to a method for studying the cumulative effects of strong electromagnetic pulses for communication interface chips. Background Art

[0002] As the primary information exchange module between the internal circuit of a single electronic device and the external transmission cable, the communication interface circuit is a crucial link in information acquisition and communication. The high-intensity, wide-band electromagnetic pulse energy released by strong electromagnetic pulses such as nuclear electromagnetic pulses and ultra-wideband high-power microwave electromagnetic pulses at the moment of irradiating the electronic system can easily couple through the field lines of the interconnected cables, causing short-term functional failure or permanent performance degradation or even damage to the electronic components inside the wired communication interface circuit, resulting in system dysfunction, degradation, or even damage to the communication system, posing an extremely serious threat to the communication and even the entire electronic system. In order to ensure that the communication system can operate smoothly and normally under the action of electromagnetic pulses, the study of effect sensitivity characteristics is the first basic research that needs to be completed.

[0003] In related technologies, the response characteristics of electronic systems, electronic devices or semiconductor devices are mainly studied through experiments. Based on different test methods and test devices, the damage threshold of electronic devices is obtained, and corresponding protection designs are carried out. However, there are few studies on the interference effect phenomenon of electronic devices, and there is currently no clear experimental method for the study of the cumulative effect of communication interface chips.

[0004] Experimental research in the field of communications at home and abroad is often conducted on the entire communication system, but the communication system is composed of many integrated circuits and electronic components, making it difficult to further locate the specific weak links. In addition, for different types of communication signals, researchers use dedicated communication systems or communication equipment to conduct experiments, which has high experimental costs and lacks an experimental system with wide applicability, high repeatability, and convenient for observing effect phenomena. Summary of the invention

[0005] In order to avoid the shortcomings of the prior art, the present application provides a method for studying the cumulative effects of strong electromagnetic pulses for communication interface chips, which is used to solve the problem that the prior art has wired communication interface circuits, lacks a test platform system with wide applicability, high test efficiency and the ability to accurately and reliably obtain the failure threshold without affecting the normal operation of the interface circuit; at the same time, there is no clear test method and test result for the cumulative effect.

[0006] According to an embodiment of the present disclosure, a method for studying the cumulative effect of strong electromagnetic pulses for a communication interface chip is provided, the method comprising: Construct an injection test platform for an interface chip, the injection test platform for the interface chip comprising a pulse injection source, a transmitting end signal acquisition control board and a receiving end signal acquisition control board; wherein the transmitting end signal acquisition control board is connected to the receiving end signal acquisition control board, the pulse injection source is respectively connected to the transmitting end signal acquisition control board and the receiving end signal acquisition control board to respectively inject pulse voltage into the transmitting end signal acquisition control board and the receiving end signal acquisition control board, the transmitting end signal acquisition control board comprises a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-computer interaction module and a first power supply module, and the receiving end signal acquisition control board comprises a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-computer interaction module and a second power supply module; Mounting a first interface chip and a second interface chip on the first serial communication module and the second serial communication module respectively, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain a threshold voltage; Based on the threshold voltage, respectively perform a cumulative effect test on the first interface chip and the second interface chip to obtain an injection number; Performing damage location analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain a damage location result; If the damage location result indicates that the interface chip is damaged, a damage analysis is performed on the interface chip to obtain an interface chip damage analysis result.

[0007] Further, in the signal acquisition control board at the transmitting end, the first information processing module is electrically connected to the first serial communication module, the first Ethernet communication module, the first human-computer interaction module and the first power supply module respectively, and the first power supply module is electrically connected to the first information processing module, the first serial communication module and the first Ethernet communication module respectively; wherein, The first information processing module is used to generate data information and send the data information to the first serial communication module. The first information processing module interacts with the first serial communication module, the first Ethernet communication module and the first human-computer interaction module, processes the interaction information sent by each module and controls each module; The first serial communication module is used to send the data information to the receiving end signal acquisition control board; The first Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data; The first human-computer interaction module is used for human-computer interaction; The first power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

[0008] Further, in the signal acquisition control board at the transmitting end, the second information processing module is electrically connected to the second serial communication module, the second Ethernet communication module, the second human-computer interaction module and the second power supply module respectively, and the second power supply module is electrically connected to the second information processing module, the second serial communication module and the second Ethernet communication module respectively; wherein, The second information processing module is used to receive the data information sent by the second serial communication module, the second information processing module interacts with the second serial communication module, the second Ethernet communication module and the second human-computer interaction module, processes the interaction information sent by each module and controls each module; The second serial communication module is used to receive the data information sent by the first serial communication module, and send the data information to the second information processing module; The second Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data; The second human-computer interaction module is used for human-computer interaction; The second power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

[0009] Furthermore, the first serial communication module includes a detachable first serial interface plug-in board and a first optical coupler isolator, wherein the first optical coupler isolator is used for signal isolation and is arranged between the first serial interface plug-in board and the first information processing module; The second serial communication module has the same structure as the first serial communication module.

[0010] Furthermore, the transmitting end signal acquisition control board also includes: The first reserved test point group is used to monitor the input and output status of each module on the signal acquisition control board of the transmitting end, and determine whether the module is working normally, so as to troubleshoot and locate the fault of the signal acquisition control board of the transmitting end; The receiving end signal acquisition control board also includes: The second reserved test point group is used to monitor the input and output status of each module on the receiving end signal acquisition control board to determine whether the module is working normally, thereby troubleshooting and locating the receiving end signal acquisition control board.

[0011] Further, the step of respectively mounting the first interface chip and the second interface chip on the first serial communication module and the second serial communication module, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain the threshold voltage includes: By direct injection, the core wire of the output wire of the pulse injection source is connected to the data transmission wire of the signal acquisition control board at the transmitting end and the data transmission wire of the signal acquisition control board at the receiving end, and the shielding layer of the output wire of the pulse injection source is connected to the ground wire of the signal acquisition control board at the transmitting end and the data transmission wire of the signal acquisition control board at the receiving end; Selecting the first interface chip and the second interface chip that match the first serial interface plug-in board and the second serial interface plug-in board according to the types of the first serial interface plug-in board and the second serial interface plug-in board, and installing the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board respectively to perform a threshold voltage test; Using a current caliper to monitor the injected current of the output line of the pulse injection source, using a voltage probe to monitor the port voltages of the signal acquisition control board at the transmitting end and the signal acquisition control board at the receiving end, respectively, and turning on the power supply so that the first power supply module and the second power supply module supply power to each module; Setting the corresponding communication rate, hardware inspection mode, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the signal acquisition control board at the sending end cyclically sends the data information, and the signal acquisition control board at the receiving end receives the data information; Connecting an oscilloscope, observing the data transmission status through the human-computer interaction module and the oscilloscope, and capturing the signal waveform, and judging whether the first interface chip and the second interface chip are in a normal working state according to the data transmission status and the signal waveform; Setting the charging voltage of the pulse injection source and triggering it, and recording the data transmission status, port voltage and injection current displayed by the first human-computer interaction module and the second human-computer interaction module; If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, the charging voltage of the pulse injection source is changed and triggered, and the data transmission status, the port voltage and the injection current displayed by the first human-computer interaction module and the second human-computer interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal; If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board are restarted. If they still cannot be restored, the injection voltage is recorded as the threshold voltage.

[0012] Further, based on the threshold voltage, the step of performing a cumulative effect test on the first interface chip and the second interface chip respectively to obtain the number of injections includes: Replacing the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board; Observe the data transmission status through the human-computer interaction module and capture the signal waveform, and judge whether the serial interface plug-in board is in a normal working state according to the data transmission status and the signal waveform; Setting the corresponding communication rate, hardware inspection mode, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the signal acquisition control board at the sending end cyclically sends the data information, and the signal acquisition control board at the receiving end receives the data information; Setting the test voltage of the pulse injection source to half of the threshold voltage and triggering it, and recording the data transmission status, port voltage and injection current displayed by the human-computer interaction module; If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, the charging voltage is kept unchanged and the triggering is continued, and the data transmission status, the port voltage and the injection current displayed by the first human-computer interaction module and the second human-computer interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal; If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the sending end signal acquisition control board and the receiving end signal acquisition control board are restarted. If they still cannot be restored, the injection times are recorded.

[0013] Further, the step of performing damage location analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain a damage location result includes: By checking the signal transmission link, the damage location analysis of the signal acquisition control board is performed to obtain the damage location result.

[0014] Furthermore, if the damage location result is that the interface chip is damaged, the step of performing damage analysis on the interface chip to obtain an interface chip damage analysis result includes: If the damage location result is that the interface chip is damaged, determining the functional pins of the first interface chip and the second interface chip according to the chip data sheet; Use a multimeter to measure the resistance of each pin end pair of the failed first interface chip and the second interface chip, and the first interface chip and the second interface chip with good performance. At the same time, use the diode gear of the multimeter to make auxiliary judgments, compare with normal chips, find damaged pin ends, determine the damage location and identify the damage mode.

[0015] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects: In the embodiments of the present disclosure, through the above-mentioned research method of the cumulative effect of strong electromagnetic pulses for communication interface chips, on the one hand, on the basis of ensuring the normal receiving and sending operation of the communication interface circuit, a miniaturized test platform suitable for multiple ports, with high repeatability and high measurability, is designed and built, which is convenient for observing the strong electromagnetic pulse effect phenomenon of the interface circuit and obtaining the corresponding threshold data, and can further investigate and locate its sensitive weak links, and a test scheme for the cumulative effect is proposed, laying the foundation for the interface reinforcement protection of the interface circuit of the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0017] Figure 1 A diagram showing the steps of a method for studying the cumulative effect of strong electromagnetic pulses for a communication interface chip in an exemplary embodiment of the present disclosure; Figure 2 A PCB diagram of a signal acquisition control board in an exemplary embodiment of the present disclosure is shown; Figure 3 A physical diagram showing a signal acquisition control board in an exemplary embodiment of the present disclosure; Figure 4 A minimum system diagram showing a main controller in an exemplary embodiment of the present disclosure; Figure 5 A schematic diagram of feedback in an exemplary embodiment of the present disclosure is shown; Figure 6 A schematic diagram of a UART interface isolation circuit in an exemplary embodiment of the present disclosure is shown; Figure 7 A schematic diagram showing a serial communication interface socket and a serial communication plug-in on a signal acquisition control board in an exemplary embodiment of the present disclosure; Figure 8 Shows a schematic diagram of an RS-232 circuit in an exemplary embodiment of the present disclosure; Fig. 9A schematic diagram of a liquid crystal module in an exemplary embodiment of the present disclosure is shown; Fig.10 The infrared remote control principle diagram in the exemplary embodiment of the present disclosure is shown; Fig.11 The data transmission setting interface of the sending end in the exemplary embodiment of the present disclosure is shown; Fig.12 The receiving end data transmission setting interface in the exemplary embodiment of the present disclosure is shown; Fig.13 The communication statistics interface in the exemplary embodiment of the present disclosure is shown; Fig.14 A flow chart showing a threshold voltage test in an exemplary embodiment of the present disclosure; Fig.15 A flow chart showing a cumulative effects test flow in an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0018] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the disclosure will be more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0019] In addition, the accompanying drawings are only schematic illustrations of the embodiments of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated descriptions will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities.

[0020] This example embodiment provides a method for studying the cumulative effect of strong electromagnetic pulses on a communication interface chip. Figure 1 As shown in , the method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips may include: steps S101 to S105.

[0021] Step S101: constructing an injection test platform for an interface chip, the injection test platform for the interface chip comprising a pulse injection source, a transmitting end signal acquisition control board and a receiving end signal acquisition control board; wherein the transmitting end signal acquisition control board is connected to the receiving end signal acquisition control board, the pulse injection source is respectively connected to the transmitting end signal acquisition control board and the receiving end signal acquisition control board to respectively inject pulse voltage into the transmitting end signal acquisition control board and the receiving end signal acquisition control board, the transmitting end signal acquisition control board comprises a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-computer interaction module and a first power supply module, and the receiving end signal acquisition control board comprises a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-computer interaction module and a second power supply module; Step S102: installing a first interface chip and a second interface chip on the first serial communication module and the second serial communication module respectively, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain a threshold voltage; Step S103: Based on the threshold voltage, respectively perform a cumulative effect test on the first interface chip and the second interface chip to obtain an injection number; Step S104: performing damage location analysis on the signal acquisition control board at the transmitting end and the signal acquisition control board at the receiving end to obtain a damage location result; Step S105: If the damage location result is that the interface chip is damaged, then damage analysis is performed on the interface chip to obtain an interface chip damage analysis result.

[0022] Through the above-mentioned research method on the cumulative effect of strong electromagnetic pulses for communication interface chips, on the one hand, on the basis of ensuring the normal receiving and sending of the communication interface circuit, a miniaturized test platform suitable for a variety of ports, with high repeatability and high measurability, is designed and built, which is convenient for observing the strong electromagnetic pulse effect phenomenon of the interface circuit and obtaining the corresponding threshold data, and can further investigate and locate its sensitive weak links. A test plan for the cumulative effect is proposed, laying the foundation for the interface reinforcement protection of the interface circuit of communication equipment.

[0023] Next, we will refer to Figures 1 to 15 The various steps of the above-mentioned method for studying the cumulative effect of strong electromagnetic pulses on a communication interface chip in this example implementation are described in more detail.

[0024] In step S101, the test-specific signal acquisition control board is composed of modules such as an information processing module, a serial communication module, an Ethernet communication module, a human-computer interaction module, and a power supply module. Figure 2 and Figure 3They are the PCB diagram and physical diagram of the test-specific signal acquisition control board.

[0025] Information processing module: It is mainly responsible for information interaction with other modules and is the core unit of the information processing module. This application uses a high-performance 32-bit processor chip STM32F407VET6 as the main controller. Figure 4 This is the minimum system diagram of the main controller, which is mainly composed of SWD interface circuit, power supply circuit, system clock circuit, startup mode selection circuit, etc.

[0026] Serial communication module: Taking into account the diversity of interface circuits, in order to facilitate the change of different types of interface boards during the experiment, this application designs the serial communication interface part as an independently used detachable plug-in board. Each plug-in board shares the optocoupler isolation on the signal acquisition control board, and the plug-in uses an independent 5V power supply.

[0027] Various UART communication interfaces share the USART1 interface of the main controller. Different plug-ins are replaced to realize RS232, RS-485 and RS-422 communication. The CAN interface is independently connected to the socket of the connection plug-in. The UART transceiver signal line of the original main controller is changed to the plug-in ID identification signal on the socket. Figure 5 The feedback schematic is shown in Figure 1.

[0028] The ID of the plug-in board is read through two signal lines. [ID1:ID0] can form 4 different combinations. The ID definitions of each serial communication plug-in are shown in the following table: Table 1 ID definition of serial communication plug-in board

[0029] In order to reduce the impact of external electromagnetic interference on the main control chip, an isolation circuit is required between the serial interface plug-in board and the main control chip. Since this application focuses on the impact of external electromagnetic pulse interference on the communication interface circuit, the isolation circuit needs to have a faster on-off characteristic, so an optical coupler is used for signal isolation. The optical coupler not only isolates the interference signal, but also realizes the conversion between the 3.3VLVTTL level and the 5VTTL level. Figure 6 As shown, it is the schematic diagram of the UART interface isolation circuit.

[0030] In order to facilitate frequent plugging and unplugging during the experiment, the design uses PCB terminals with a spacing of 3.81mm that can meet the use requirements. Figure 7 The figure shows the serial communication interface socket and serial communication plug-in on the signal acquisition control board.

[0031] Since this application explores the HEMP effect phenomenon of a typical interface circuit, it is hoped that the injected HEMP interference will flow to the communication interface circuit to the greatest extent possible, so as to obtain more accurate threshold data. Therefore, there are no protective devices on the serial communication interface plug-in board used in the experiment. The RS-232 circuit schematic diagram is as follows: Figure 8 shown.

[0032] Ethernet communication module: There are two commonly used design schemes for Ethernet. One is to transplant the TCP / IP protocol stack on the main controller, encapsulate or parse the data in the main controller, and the Ethernet chip only needs to send and receive data; the other is to integrate the TCP / IP protocol inside the Ethernet chip, and the Ethernet chip and the main controller are connected through the SPI communication interface. The main controller is responsible for data preparation, and the Ethernet chip encapsulates or parses the data and is responsible for sending and receiving data. Since the main controller of the second scheme does not need to process the network protocol, it can have more resource space to handle other tasks, so this application uses the second design scheme.

[0033] This application uses the Ethernet controller chip W5500 launched by WIZnet. The W5500 has an internal hardware-implemented TCP / IP protocol stack + MAC + PHY, supports multiple communication protocols, and has a speed of up to 80MHz, which can fully meet the maximum SPI rate of STM32, thereby achieving high-speed network communication.

[0034] Human-computer interaction module: In order to facilitate the operation of the signal acquisition control board, this paper designs a human-computer interaction module consisting of an infrared remote control and a TFT liquid crystal display module. The TFT liquid crystal module JLX350-019-PN with a resolution of 480×320 is used, which is connected to the main controller through a parallel bus and fixed to the signal acquisition control board with nylon studs. The signal is connected through a single-row SIP20-2.54 plug-in socket, which can be easily disassembled. Fig. 9 As shown in the figure, it is the principle diagram of the liquid crystal module. Fig.10 The figure shows the principle diagram of infrared remote control.

[0035] The communication interface circuit is a bidirectional transmission link with two channels, the sending end and the receiving end. Set one end as the sending end and the other end as the receiving end. Use the infrared remote control to set the communication rate, hardware inspection mode, stop bit, message length, message content and sending interval corresponding to the communication interface. Fig.11 As shown in the figure, it is the data transmission setting interface of the sending end; Fig.12 As shown, it is the receiving end data transmission setting interface; Use the pre-programmed communication serial port program to complete the construction of the corresponding signal communication channel, and judge the working status of the interface circuit under test by observing the data transmission between the sending end and the receiving end. Fig.13 The communication statistics interface is shown below.

[0036] This application is based on the pulse current injection method, which can not only load the interface circuit with a current that poses a greater threat, but also facilitate the one-by-one inspection of key components in the interface circuit, locate the characteristics of the weak links in the interface circuit, and use the pulse current injection method to conduct HEMP response characteristics research on the communication interface circuit.

[0037] Taking into account the problems of complex internal circuit structure, inability to locate sensitive weak links and poor test repeatability of general computer loading systems, as well as the requirements of the test on cost, scalability and development cycle, this paper uses an embedded loading system as the core to build a system hardware platform, designs the hardware of the peripheral circuit of the interface chip, realizes the loading of the communication interface circuit, and designs a test-specific signal acquisition control board that can realize normal communication of five communication circuits including RS-232, RS-485, RS-422, CAN and Ethernet, and is convenient for observing electromagnetic sensitivity effects and troubleshooting. The test-specific signal acquisition control board has the following characteristics: (1) Applicable to multiple interfaces: It can load five common interface circuits: RS-232, RS-485, RS-422, CAN and Ethernet, ensuring that the interface circuits are in normal working condition.

[0038] (2) Convenient for observing effect phenomena: With a human-computer interaction module, users can set the communication rate, hardware inspection method, message content and message length corresponding to the communication interface. The working status of the communication interface circuit can be judged by monitoring the bit error between the sending end and the receiving end, and the effect test phenomenon of the communication interface circuit can be observed.

[0039] (3) Facilitate troubleshooting and location: When designing the test-specific signal acquisition control board, test points are set near the pins of key components. By monitoring the input and output status of key components, it can be determined whether the components are working normally, thereby performing troubleshooting and location.

[0040] (4) High testability: Considering the diversity of interface circuits, in order to facilitate the replacement of different types of interface boards during the test, the serial communication interface part is designed as a detachable plug-in board during the design stage, which is convenient for test replacement and plug-in. It also avoids the situation where the interface circuit board and the main board are integrated and the entire board needs to be replaced if one interface circuit is damaged, thus reducing the test cost. At the same time, by monitoring the waveforms at the test points of key components, the superposition relationship between the normal working signal and the injected interference signal waveform and the change in the transmission level can be obtained.

[0041] (5) High repeatability: Through troubleshooting and positioning, the specific failed components can be locked. On the basis that the other components are working normally, only the failed components can be replaced, so that the test platform can work normally again and repeat the test many times. In order to reduce the impact of external electromagnetic interference on the main control chip, this application needs to use optical couplers for signal isolation between the serial interface plug-in board and the main control chip. The optical coupler isolator uses light as the transmission medium. There is no direct electrical connection between the input and output ends. The input circuit is a light-emitting diode, and its input impedance is very small, which significantly reduces the interference voltage fed to the input end, and can effectively suppress the pulse interference signal, thereby protecting the subsequent main control chip, so that the strong electromagnetic pulse acts accurately on the interface circuit, and repeated tests can be carried out by only replacing the interface chip.

[0042] The present application decomposes the serial communication interface into two parts, namely, a detachable plug-in board for independent use and a design using optical coupling isolation between the plug-in board and the main control chip. While facilitating test plug-in and unplugging, it reduces the test cost of replacing the board when an interface circuit is damaged, further improving the test efficiency and test repeatability. At the same time, separating the interface circuit from the acquisition control board is also convenient for troubleshooting and positioning. When the tested interface circuit has an effect phenomenon, the serial communication interface plug-in board can be replaced, and the failure link can be roughly located by observing whether the transmitting end and the receiving end resume normal operation at this time. If the transmitting and receiving ends still cannot resume normal communication after replacing the same type of serial communication plug-in board with good performance, the failure link can be located on the signal acquisition control board responsible for signal loading and processing; if the transmitting and receiving ends resume normal communication after replacing the same type of serial communication plug-in board with good performance, the failure link can be located on the serial communication interface plug-in board. Subsequently, the voltage probe can be used to observe the input and output status of key components on the transmission link to further locate the failed components.

[0043] The test-specific signal acquisition control board has the following protection properties: (1) Signal isolation: The UART communication receiving and control signals cannot be directly given to the serial signal modulation chip to prevent external interference signals from entering through the signal loop. Therefore, an isolation device must be installed between the main control chip and the serial signal modulation chip. Since the focus is on the impact of external electromagnetic pulse interference on the communication interface circuit, the isolation circuit needs to have a faster on-off characteristic, so an optical coupler is used for signal isolation; (2) Power isolation: Since isolation measures are applied between the UART communication and serial signal modulation chips, the two sides of the isolation area cannot share power and ground. Therefore, an independent power supply with a certain isolation strength must be provided in the isolation area; (3) Reserved test points: When designing the test-specific signal acquisition control board, test points are set near the pins of key components. By monitoring the input and output status of key components, it can be determined whether the components are working normally, thereby troubleshooting and locating faults.

[0044] Since the HEMP effect phenomenon of a typical interface circuit is being explored, it is hoped that the injected HEMP interference will flow to the communication interface circuit to the greatest extent possible in order to obtain more accurate threshold data. Therefore, there are no protective devices on the serial communication interface plug-in board used in the experiment.

[0045] In step S102, Fig.14 The specific test steps are as follows: (1) Using direct injection, connect the core wire of the pulse injection source output line to the data transmission line of the RS-232 interface communication cable, and connect the shielding layer of the pulse injection source output line to the ground wire of the RS-232 interface communication cable; (2) Install the serial communication interface plug-in board used in the test on the signal acquisition control board, use the current caliper to monitor the injected current flowing to the receiving end and the transmitting end respectively on the data transmission line, use the voltage probe to monitor the port voltage of the receiving end and the transmitting end, and turn on the power supply to supply power to each electrical device; (3) Set the corresponding communication rate, hardware check mode, stop bit, message length, message content and data transmission interval of the serial port so that one end can send data cyclically and the other end can only receive but not send; (4) Observe the data transmission status displayed on the communication statistics interface at both ends of the transmitter and receiver and the signal waveform captured on the oscilloscope, and judge whether the communication interface circuit is in normal working condition based on the data transmission status and signal waveform; (5) Set the charging voltage of the HEMP pulse source and trigger it, and record the data transmission status, port voltage and injection current displayed on the communication statistics interface at this time; (6) If the data transmission of the communication interface circuit is normal and the communication is not interrupted, it is considered that the interface circuit is not damaged under the HEMP injection of this intensity, and step (5) is performed. If data errors, transmission interruptions and other effects occur at both ends of the transmitter and receiver, restart the signal acquisition control board. If it still cannot be restored, record the pulse injection voltage, and perform fault diagnosis on the test platform to locate the faulty components.

[0046] Determination of test sample size:

[0047] n is the sample size, is the significance level, 1- is the desired confidence level, Corresponds to The quantile of the standard normal distribution of probability. For large sample sizes and a 95% confidence level, it is typically close to 1.96; for a 99% confidence level, it is typically close to 2.576. e is the margin of error.

[0048] When the confidence level is 95%, e Pick hour, n The number of chips is 10. Therefore, the chips of the same model, batch and manufacturer are selected, and the initial sample size is 10.

[0049] In step S103, Fig.14 The specific test steps are as follows: (1) Using direct injection, connect the core wire of the pulse injection source output line to the data transmission line of the RS-232 interface communication cable, and connect the shielding layer of the pulse injection source output line to the ground wire of the RS-232 interface communication cable; (2) Install the serial communication interface plug-in board used in the test on the signal acquisition control board, use the current caliper to monitor the injected current flowing to the receiving end and the transmitting end respectively on the data transmission line, use the voltage probe to monitor the port voltage of the receiving end and the transmitting end, and turn on the power supply to supply power to each electrical device; (3) Set the corresponding communication rate, hardware check mode, stop bit, message length, message content and data transmission interval of the serial port so that one end can send data cyclically and the other end can only receive but not send. (4) Observe the data transmission status displayed on the communication statistics interface at both ends of the transmitter and receiver and the signal waveform captured on the oscilloscope, and judge whether the communication interface circuit is in normal working condition based on the data transmission status and signal waveform; (5) Set the test voltage of the HEMP pulse source and trigger it, and record the data transmission status, port voltage and injection current displayed on the communication statistics interface at this time; If the data transmission of the communication interface circuit is normal and the communication is not interrupted, it is considered that the interface circuit is not damaged under the HEMP injection of this intensity, and the voltage is kept unchanged to proceed to step (5). If data transmission errors, transmission interruptions and other effects occur at both ends of the transmitter and receiver, restart the signal acquisition control board. If it still cannot be restored, record the number of pulse injections, and perform fault diagnosis on the test platform to locate the faulty components.

[0050] In step S104, it can be found by checking the signal transmission link: the main controller, isolation optocoupler and serial communication interface plug-in board on the receiving end signal acquisition control board can all work normally; the main controller and isolation optocoupler on the sending end signal acquisition control board can still work normally, and the DOUT2 pin of the sending end interface chip has no signal output. When working normally, it outputs RS-232 level signal, thereby judging that the sending end interface chip is damaged.

[0051] In step S104, after damage location, it can be determined that the interface chip is damaged. Since the internal circuit structure of the interface chip is complex and involves the manufacturer's production secrets, it is impossible to obtain the internal circuit diagram of the chip, and the complex process of interface chip damage cannot be simulated and replaced by simulation software. Therefore, this application proposes a method that can use a multimeter to test the resistance change of the pin end to quickly determine the damage location and distinguish the damage mode, which can indicate the focus of subsequent research without destroying the chip and reduce the analysis cost.

[0052] It can be seen from the test data that the injected current and voltage at the transmitting and receiving ports are not linearly related, that is, when different amplitudes of HEMP are injected, the port impedance will also change accordingly. Z is the total impedance of the RS-232 interface loop, which is:

[0053] In the formula, is the receiving port voltage, is the voltage at the transmitting port, Inject current into the HEMP on the data transmission line at the receiving end, Inject current into the HEMP on the data transmission line at the sending end.

[0054] The experiment found that the total impedance of the interface loop continued to decrease during the HEMP injection process. When the injection source voltage reached a certain voltage, the total impedance of the interface loop became significantly lower, and the injection current also increased significantly at this time. The main reason for this phenomenon is: when the injected external interference is small, the pulse signal has not yet affected the internal circuit structure of the interface chip. At this time, the internal impedance of the chip is large and the amplitude of the injected current is small; as the injected external interference continues to increase, the semiconductor structure of the internal circuit of the interface chip changes, forming a low-resistance channel, causing excessive energy deposition inside the circuit, thereby damaging the internal circuit of the chip.

[0055] From the above analysis, it can be seen that a strong electromagnetic pulse of a certain amplitude will change the internal circuit structure of the interface chip, thereby affecting the total impedance of the interface loop. The impedance change trend of the pin end pairs with different damage forms is different. Therefore, the damage position and damage mode can be preliminarily located by detecting the change in resistance of the device pin end pairs before and after the damage. According to the chip data sheet, the functional pins of the chip are determined, and the resistance of each pin end pair of the failed interface chip and the interface chip with good performance is measured by a multimeter. At the same time, the diode position of the multimeter is used for auxiliary judgment, and compared with the normal chip to find the damaged pin end. In the primary performance verification stage of the chip or when the conditions for chip failure analysis are not available, the multimeter can be used to test the change in resistance of the pin end pair to preliminarily determine the damage position and determine the damage mode. It can point out the focus of subsequent research without destroying the chip and reduce the analysis cost.

[0056] In a specific embodiment, based on a typical RS232 interface circuit, the damage threshold voltage of the interface chip under HEMP injection is tested; then the threshold voltage is derated by 3dB according to the measured threshold voltage to obtain a test voltage, a cumulative test is performed, and the number of injection pulses from normal communication to damage of the interface chip under the test voltage is recorded.

[0057] In a specific embodiment, a direct injection method is adopted to connect the core wire of the pulse injection source output line to the data transmission line of the RS232 interface communication cable, and connect the shielding layer of the pulse injection source output line to the ground wire of the RS-232 interface communication cable to form a complete signal transmission loop; the voltage and current of the interface chip under normal operation and pulse injection are measured by current calipers and voltage probes, and the communication status of the input and output ends can be observed through an oscilloscope and a liquid crystal display panel of a special test signal acquisition board; when the interface chip is damaged, the RS232 plug-in board can be unplugged and the chip replaced.

[0058] In a specific embodiment, based on the designed and constructed test platform, the HEMP interface circuit coupling effect is further subdivided into the following five levels according to the changes in the working state of the interface circuit under HEMP interference, namely: no pulse interference, weak pulse interference, strong pulse interference, strong pulse damage and strong pulse destruction.

[0059] (1) No pulse interference: After HEMP injection, the interface circuit works normally, the transmission data of the sending and receiving ends are consistent, and no effect phenomenon occurs. That is, HEMP does not affect the communication of the interface circuit at this time.

[0060] (2) Weak pulse interference: After HEMP is injected, there are bit errors in the received data, which reduces the quality of data transmission. However, the communication between devices still proceeds normally. In other words, HEMP affects the quality of data transmission.

[0061] (3) Strong pulse interference: After the HEMP is injected, data transmission between the transmitter and the receiver stops, communication is interrupted, and the initialization of the transceiver control program is invalid. After the acquisition control board is restarted, the driver reloads the interface circuit and communication returns to normal. That is, at this time, the HEMP intensity is too large to paralyze the transceiver control program, but it does not damage the interface circuit.

[0062] (4) Strong pulse damage: After HEMP injection, garbled characters or interrupted transmission appear in the transmission. After initializing the transceiver control program and restarting the acquisition control board, the data transmission still appears garbled characters and is intermittent. That is, HEMP causes certain damage to the interface circuit at this time, resulting in irreversible effects.

[0063] (5) Strong pulse damage: After the HEMP is injected, data transmission between the transmitter and the receiver stops, communication is terminated, the circuit is burnt, and there is a burnt smell. Through inspection and investigation, it is found that the hardware is damaged by breakdown and burning. After initializing the transceiver control program and restarting the acquisition control board, the device still cannot communicate. That is, at this time, the high current and high voltage of the HEMP will break down and burn the interface circuit, causing irreversible impact, making the interface circuit permanently invalid.

[0064] The experiment found that: when the data packets displayed on the communication statistics interface were no longer updated, the real-time communication was interrupted; and the voltage waveform captured by the oscilloscope showed that the signal transmission level did not alternate between positive and negative, which was inconsistent with the working level of normal communication; normal communication could not be restored after restarting. The test phenomenon was consistent with the fifth level - strong pulse damage, so it was determined that the interface circuit had irreversible damage.

[0065] In a specific embodiment, the present application proposes that the damage position and damage mode can be initially located by detecting the change in resistance of the device pin end pair before and after the damage, based on the continuous decrease in the interface loop impedance during the HEMP injection process. The functional pins of the chip are determined according to the chip data sheet, and the resistance of each pin end pair of the failed interface chip and the interface chip with good performance is measured with a multimeter. At the same time, the diode position of the multimeter is used for auxiliary judgment, and compared with the normal chip to find the damaged pin end.

[0066] In a specific embodiment, the chip threshold voltage is determined by selecting chips of the same model, the same batch and the same manufacturer, and initially selecting a sample size of 10. The experiment finds that the measured data is a normal distribution centered on a certain threshold voltage and decreasing to the left and right sides. The center voltage is taken as the threshold voltage of the chip.

[0067] Determination of chip test voltage: Based on the derating design principle, the threshold voltage of the chip is derated by 3dB (half of the threshold voltage) to obtain the test voltage. The stress borne by the components in the test will be lower than the rated value of their design. The purpose is to increase the service life of the device and improve the reliability of use, and observe the number of pulse injections that the device can withstand compared with the device working under the threshold voltage.

[0068] Through the above-mentioned research method on the cumulative effect of strong electromagnetic pulses for communication interface chips, this application, on the basis of ensuring the normal receiving and sending of the communication interface circuit, designs and builds a miniaturized test platform that is suitable for multiple ports, has high repeatability and high measurability, is easy to observe the strong electromagnetic pulse effect phenomenon of the interface circuit, obtains the corresponding threshold data, and can further investigate and locate its sensitive weak links. A test plan for the cumulative effect is proposed, laying the foundation for interface reinforcement protection of the interface circuit of communication equipment.

[0069] This application has the following advantages: (1) Applicable to multiple interfaces: It can load five common interface circuits: RS-232, RS-485, RS-422, CAN and Ethernet, ensuring that the interface circuits are in normal working condition.

[0070] (2) Convenient for observing effect phenomena: With a human-computer interaction module, users can set the communication rate, hardware inspection method, message content and message length corresponding to the communication interface. The working status of the communication interface circuit can be judged by monitoring the bit error between the sending end and the receiving end, and the effect test phenomenon of the communication interface circuit can be observed.

[0071] (3) Facilitate troubleshooting and location: By monitoring the input and output status of key components, it is possible to determine whether the components are working properly, thereby performing troubleshooting and location.

[0072] High testability: Considering the diversity of interface circuits, in order to facilitate the replacement of different types of interface boards during the test, the serial communication interface part is designed as a detachable plug-in board, which is convenient for experimental replacement and plug-in, and avoids the situation where the interface circuit board and the main board are integrated and the entire board needs to be replaced if one interface circuit is damaged, thus reducing the test cost. At the same time, by monitoring the waveforms at the test points of key components, the superposition relationship between the normal working signal and the injected interference signal waveform and the change in the transmission level can be obtained.

[0073] (4) High repeatability: In order to reduce the impact of external electromagnetic interference on the main control chip, this application requires the use of optical couplers for signal isolation between the serial interface plug-in board and the main control chip. Optical couplers use light as the transmission medium, and there is no direct electrical connection between the input and output ends. The input circuit is a light-emitting diode, and its input impedance is very small, which significantly reduces the interference voltage fed to the input end, thereby effectively suppressing the pulse interference signal, thereby protecting the subsequent main control chip, so that the strong electromagnetic pulse acts accurately on the interface circuit, and the test can be repeated by only replacing the interface chip.

[0074] Rapid detection and location of damage: This application proposes that the damage location can be initially located and the damage mode can be determined by detecting the change in resistance of the device pin end before and after the damage. Determine the functional pins of the chip according to the chip data sheet, use a multimeter to measure the resistance of each pin end of the failed interface chip and the interface chip with good performance, and use the diode position of the multimeter to assist in judgment, compare with the normal chip, find the damaged pin end, and determine the chip damage location and damage mode.

[0075] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0076] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0078] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A method for studying the cumulative effect of strong electromagnetic pulses on communication interface chips, characterized in that: The method includes: Construct an injection test platform for an interface chip, the injection test platform for the interface chip comprising a pulse injection source, a transmitting end signal acquisition control board and a receiving end signal acquisition control board; wherein the transmitting end signal acquisition control board is connected to the receiving end signal acquisition control board, the pulse injection source is respectively connected to the transmitting end signal acquisition control board and the receiving end signal acquisition control board to respectively inject pulse voltage into the transmitting end signal acquisition control board and the receiving end signal acquisition control board, the transmitting end signal acquisition control board comprises a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-computer interaction module and a first power supply module, and the receiving end signal acquisition control board comprises a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-computer interaction module and a second power supply module; Mounting a first interface chip and a second interface chip on the first serial communication module and the second serial communication module respectively, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain a threshold voltage; Based on the threshold voltage, respectively perform a cumulative effect test on the first interface chip and the second interface chip to obtain an injection number; Performing damage location analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain a damage location result; If the damage location result indicates that the interface chip is damaged, a damage analysis is performed on the interface chip to obtain an interface chip damage analysis result.

2. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 1, characterized in that: In the transmitting end signal acquisition control board, the first information processing module is electrically connected to the first serial communication module, the first Ethernet communication module, the first human-computer interaction module and the first power supply module respectively, and the first power supply module is electrically connected to the first information processing module, the first serial communication module and the first Ethernet communication module respectively; wherein, The first information processing module is used to generate data information and send the data information to the first serial communication module. The first information processing module interacts with the first serial communication module, the first Ethernet communication module and the first human-computer interaction module, processes the interaction information sent by each module and controls each module; The first serial communication module is used to send the data information to the receiving end signal acquisition control board; The first Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data; The first human-computer interaction module is used for human-computer interaction; The first power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

3. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 2, characterized in that: In the transmitting end signal acquisition control board, the second information processing module is electrically connected to the second serial communication module, the second Ethernet communication module, the second human-computer interaction module and the second power supply module respectively, and the second power supply module is electrically connected to the second information processing module, the second serial communication module and the second Ethernet communication module respectively; wherein, The second information processing module is used to receive the data information sent by the second serial communication module, the second information processing module interacts with the second serial communication module, the second Ethernet communication module and the second human-computer interaction module, processes the interaction information sent by each module and controls each module; The second serial communication module is used to receive the data information sent by the first serial communication module, and send the data information to the second information processing module; The second Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data; The second human-computer interaction module is used for human-computer interaction; The second power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

4. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 3 is characterized in that: The first serial communication module includes a detachable first serial interface plug-in board and a first optical coupler isolator, wherein the first optical coupler isolator is used for signal isolation and is arranged between the first serial interface plug-in board and the first information processing module; The second serial communication module has the same structure as the first serial communication module.

5. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 4, characterized in that: The transmitting end signal acquisition control board also includes: The first reserved test point group is used to monitor the input and output status of each module on the signal acquisition control board of the transmitting end, and determine whether the module is working normally, so as to troubleshoot and locate the fault of the signal acquisition control board of the transmitting end; The receiving end signal acquisition control board also includes: The second reserved test point group is used to monitor the input and output status of each module on the receiving end signal acquisition control board to determine whether the module is working normally, thereby troubleshooting and locating the receiving end signal acquisition control board.

6. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 5, characterized in that: The step of respectively mounting the first interface chip and the second interface chip on the first serial communication module and the second serial communication module, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain a threshold voltage includes: By direct injection, the core wire of the output wire of the pulse injection source is connected to the data transmission wire of the signal acquisition control board at the transmitting end and the data transmission wire of the signal acquisition control board at the receiving end, and the shielding layer of the output wire of the pulse injection source is connected to the ground wire of the signal acquisition control board at the transmitting end and the data transmission wire of the signal acquisition control board at the receiving end; Selecting the first interface chip and the second interface chip that match the first serial interface plug-in board and the second serial interface plug-in board according to the types of the first serial interface plug-in board and the second serial interface plug-in board, and installing the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board respectively to perform a threshold voltage test; Using a current caliper to monitor the injected current of the output line of the pulse injection source, using a voltage probe to monitor the port voltages of the signal acquisition control board at the transmitting end and the signal acquisition control board at the receiving end, respectively, and turning on the power supply so that the first power supply module and the second power supply module supply power to each module; Setting the corresponding communication rate, hardware inspection mode, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the signal acquisition control board at the sending end cyclically sends the data information, and the signal acquisition control board at the receiving end receives the data information; Connecting an oscilloscope, observing the data transmission status through the human-computer interaction module and the oscilloscope, and capturing the signal waveform, and judging whether the first interface chip and the second interface chip are in a normal working state according to the data transmission status and the signal waveform; Setting the charging voltage of the pulse injection source and triggering it, and recording the data transmission status, port voltage and injection current displayed by the first human-computer interaction module and the second human-computer interaction module; If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, the charging voltage of the pulse injection source is changed and triggered, and the data transmission status, the port voltage and the injection current displayed by the first human-computer interaction module and the second human-computer interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal; If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board are restarted. If they still cannot be restored, the injection voltage is recorded as the threshold voltage.

7. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 6, characterized in that: Based on the threshold voltage, the step of performing a cumulative effect test on the first interface chip and the second interface chip respectively to obtain the number of injections includes: Replacing the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board; Observe the data transmission status through the human-computer interaction module and capture the signal waveform, and judge whether the serial interface plug-in board is in a normal working state according to the data transmission status and the signal waveform; Setting the corresponding communication rate, hardware inspection mode, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the signal acquisition control board at the sending end cyclically sends the data information, and the signal acquisition control board at the receiving end receives the data information; Setting the test voltage of the pulse injection source to half of the threshold voltage and triggering it, and recording the data transmission status, port voltage and injection current displayed by the human-computer interaction module; If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, the charging voltage is kept unchanged and the triggering is continued, and the data transmission status, the port voltage and the injection current displayed by the first human-computer interaction module and the second human-computer interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal; If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the sending end signal acquisition control board and the receiving end signal acquisition control board are restarted. If they still cannot be restored, the injection times are recorded.

8. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 7, characterized in that: The step of performing damage location analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain a damage location result includes: By checking the signal transmission link, the damage location analysis of the signal acquisition control board is performed to obtain the damage location result.

9. The method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips according to claim 8, characterized in that: If the damage location result is that the interface chip is damaged, the step of performing damage analysis on the interface chip to obtain an interface chip damage analysis result includes: If the damage location result is that the interface chip is damaged, determining the functional pins of the first interface chip and the second interface chip according to the chip data sheet; Use a multimeter to measure the resistance of each pin end pair of the failed first interface chip and the second interface chip, and the first interface chip and the second interface chip with good performance. At the same time, use the diode gear of the multimeter to make auxiliary judgments, compare with normal chips, find damaged pin ends, determine the damage location and identify the damage mode.

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