Semi-solid die-casting heat sink and preparation method thereof

Abstract

The present invention discloses a semi-solid die-casting heat sink and a preparation method thereof, the heat sink comprising a heat sink base and a plurality of heat sinks; the heat sink base comprises a substrate and a graphene coating; the substrate is made of heat dissipation metal material and is formed by semi-solid die-casting, the upper surface of the substrate is an arc-shaped concave structure, and the graphene coating completely covers the upper and lower surfaces and the peripheral side surfaces of the substrate; the plurality of heat sinks are distributed on the upper surface of the substrate in an array, and each heat sink comprises a barrel portion, a graphene core portion and a graphene shell; the substrate and the barrel portion are formed separately by semi-solid die-casting, and the barrel portion is combined with the upper surface of the substrate by hot pressing and welding, thereby replacing the traditional die-casting integrated forming method, effectively simplifying the forming process and reducing the cost, and at the same time, the graphene coating, the graphene core portion and the graphene shell are arranged in combination to effectively improve the heat dissipation effect of the product, and the overall performance of the product is better, which is worthy of popularization and use.

Description

Technical Field

[0001] The invention relates to the field of radiators, and in particular to a semi-solid die-casting radiator and a preparation method thereof. Background Art

[0002] Integrated circuits are widely used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten service life, but may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or from inside the integrated circuit. The function of the radiator is to absorb this heat and then dissipate it inside or outside the chassis to ensure the normal temperature of computer components. Most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air inside the chassis, and then the chassis transfers the hot air to the outside of the chassis to complete the heat dissipation of the computer. There are many types of radiators. CPUs, graphics cards, motherboard chipsets, hard drives, chassis, power supplies, and even optical drives and memory all need radiators. These different radiators cannot be mixed, and the most commonly used one is the CPU radiator. According to the way of taking away heat from the radiator, the computer radiator can be divided into active heat dissipation and passive heat dissipation. The former is commonly air-cooled radiators, while the latter is commonly heat sinks. Further subdividing the heat dissipation method, it can be divided into air cooling, heat pipes, liquid cooling, semiconductor cooling, compressor cooling, etc.

[0003] The current radiator mainly includes a base plate and a heat dissipation column arranged on the base plate. In the prior art, the base plate and the heat dissipation column are generally integrally formed by die casting, which has a complex molding process, high cost, and unsatisfactory heat dissipation effect. Therefore, it is necessary to improve the current radiator. Summary of the invention

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a semi-solid die-cast heat sink and a preparation method thereof, which can effectively solve the problems of the existing heat sink molding process being complex, high cost, and unsatisfactory heat dissipation effect.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A semi-solid die-casting heat sink comprises a heat dissipation base and a plurality of heat dissipation columns;

[0007] The heat dissipation base includes a substrate and a graphene coating; the substrate is made of heat dissipation metal material and is formed by semi-solid die casting, the upper surface of the substrate is an arc-shaped concave structure, and the graphene coating completely covers the upper and lower surfaces and peripheral side surfaces of the substrate;

[0008] The multiple heat dissipation columns are distributed in an array on the upper surface of the substrate, and each heat dissipation column includes a cylinder portion, a graphene core portion and a graphene shell; the cylinder portion is made of heat dissipation metal material and is formed by semi-solid die casting, the lower end of the cylinder portion is combined with the upper surface of the substrate by hot pressing and welding, the graphene core portion is formed in the cylinder portion, and the lower end surface of the graphene core portion is in contact with the upper surface of the substrate; the graphene shell portion is formed to cover the outer side surface of the cylinder portion, the upper end of the graphene shell is integrally connected with the upper end of the graphene core portion and completely covers the upper end surface of the cylinder portion, and the lower end of the graphene shell is combined with the graphene coating.

[0009] As a preferred embodiment, the lower surface of the substrate is a horizontal plane, and a first groove is formed on the lower surface of the substrate. The first groove extends laterally, and a plurality of recesses are formed on the bottom surface of the first groove. The plurality of recesses are arranged at intervals along the length direction of the first groove.

[0010] As a preferred solution, there are two first grooves symmetrically arranged front and back, and the two first grooves are each provided with the aforementioned multiple recessed positions, and each recessed position is a circular recessed position.

[0011] As a preferred solution, a second groove is formed on the lower surface of the substrate. The second groove extends transversely and is located on the lower surface of one end of the substrate. The second groove is located between the two first grooves.

[0012] As a preferred solution, two positioning columns extend downward from the front and rear edges of the substrate, the two positioning columns are respectively located at the left and right ends of the substrate, and each positioning column is provided with a positioning hole, and two fixing columns extend downward from the front and rear edges of the substrate, the two fixing columns are respectively located on the inner sides of the two positioning columns, and each fixing column is provided with a fixing hole.

[0013] As a preferred solution, the positioning column is a round column, and the fixing column is a square column.

[0014] As a preferred solution, both left and right side surfaces of the heat dissipation column are arc-shaped convex surfaces, and the width of the heat dissipation column gradually decreases from bottom to top.

[0015] A method for preparing a semi-solid die-casting heat sink comprises the following steps:

[0016] (1) forming a plurality of cylinder parts by semi-solid die casting, and filling and coating the cylinder parts with graphene materials before they are solidified, so that a graphene core is formed inside the cylinder parts and a graphene shell is formed outside the cylinder parts, so as to obtain a plurality of heat dissipation columns, and maintaining the plurality of heat dissipation columns in an environment of 300-350°C;

[0017] (2) forming the substrate by semi-solid die casting, and fixing the substrate and the plurality of heat dissipation columns together by hot pressing and welding before the substrate is solidified;

[0018] (3) After the substrate and the plurality of heat dissipation columns are cooled, graphene coating is sprayed to form a graphene coating on the upper and lower surfaces and the outer peripheral side of the substrate.

[0019] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0020] The substrate and the cylinder are formed separately by semi-solid die casting, and then the cylinder is combined with the upper surface of the substrate by hot pressing and welding, which replaces the traditional one-piece die casting method, effectively simplifies the molding process and reduces the cost. At the same time, the graphene coating, graphene core and graphene shell are provided to effectively improve the heat dissipation effect of the product. The overall performance of the product is better and it is worthy of promotion and use.

[0021] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of a preferred embodiment of the present invention;

[0023] Figure 2 It is a three-dimensional schematic diagram of another angle of a preferred embodiment of the present invention;

[0024] Figure 3 It is a partial cross-sectional view of a preferred embodiment of the present invention.

[0025] Description of the accompanying drawings:

[0026] 10. Heat dissipation base 11. Substrate

[0027] 12. Graphene coating 101. First groove

[0028] 102, concave position 103, second groove

[0029] 104, positioning column 105, positioning hole

[0030] 106, fixing column 107, fixing hole

[0031] 20. Heat dissipation column 21. Cylinder

[0032] 22. Graphene core 23. Graphene shell. DETAILED DESCRIPTION

[0033] Please refer to Figures 1 to 3As shown, it shows the specific structure of a semi-solid die-cast heat sink of a preferred embodiment of the present invention, including a heat dissipation base 10 and a plurality of heat dissipation columns 20.

[0034] The heat dissipation base 10 includes a substrate 11 and a graphene coating 12; the substrate 11 is made of heat dissipation metal material and is formed by semi-solid die casting. The upper surface of the substrate 11 is an arc-shaped concave structure to cooperate with the cyclone of the external heat dissipation fan to effectively improve the heat dissipation efficiency. The graphene coating 12 completely covers the upper and lower surfaces and the peripheral side of the substrate 11. In this embodiment, the substrate 11 is made of aluminum alloy, the lower surface of the substrate 11 is a horizontal plane, the lower surface of the substrate 11 is concavely provided with a first groove 101, the first groove 101 extends horizontally, and the bottom surface of the first groove 101 is concavely provided with a plurality of concave positions 102, the plurality of concave positions 102 are arranged at intervals along the length direction of the first groove 101, and each concave position 102 is for an external small heating device to be embedded; and the first groove 101 is two symmetrically arranged front and back, and the aforementioned plurality of concave positions 102 are arranged in both first grooves 101, and each concave position 102 is a circular concave position. The lower surface of the substrate 11 is provided with a second groove 103, which extends horizontally and is located on the lower surface of one end of the substrate 11. The second groove 103 is located between the two first grooves 101. The second groove 103 is used for embedding an external large heating device. Also, two positioning columns 104 extend downward from the front and rear edges of the substrate 11. The positioning columns 104 are used for positioning with the outside. The two positioning columns 104 are respectively located at the left and right ends of the substrate 11. Each positioning column 104 is provided with a positioning hole 105. Two fixing columns 106 extend downward from the front and rear edges of the substrate 11. The fixing columns 106 are used for fixing with the outside. The two fixing columns 106 are respectively located on the inner sides of the two positioning columns 104. Each fixing column 106 is provided with a fixing hole 107. The positioning column 104 is a round column, and the fixing column 106 is a square column.

[0035] The plurality of heat dissipation columns 20 are distributed in an array on the upper surface of the substrate 11, and each heat dissipation column 20 includes a barrel portion 21, a graphene core portion 22 and a graphene shell 22; the barrel portion 21 is made of heat dissipation metal material and is formed by semi-solid die casting, the lower end of the barrel portion 21 is combined with the upper surface of the substrate 11 by hot pressing and welding, the graphene core portion 22 is formed in the barrel portion 21, and the lower end surface of the graphene core portion 22 is in contact with the upper surface of the substrate 11; the graphene shell 23 is formed to cover the outer side surface of the barrel portion 21, the upper end of the graphene shell 23 is integrally connected with the upper end of the graphene core portion 22 and completely covers the upper end surface of the barrel portion 21, and the lower end of the graphene shell 23 is combined with the graphene coating 12. In this embodiment, the barrel portion 21 is made of aluminum alloy, and the left and right side surfaces of the heat dissipation column 20 are both arc-shaped convex surfaces. The width of the heat dissipation column 20 gradually decreases from bottom to top to cooperate with the cyclone of the external heat dissipation fan to effectively improve the heat dissipation efficiency.

[0036] The present invention also discloses a method for preparing the aforementioned semi-solid die-casting heat sink, comprising the following steps:

[0037] (1) A plurality of cylindrical portions 21 are formed by semi-solid die casting. Before the cylindrical portions 21 are solidified, graphene material is used to fill and coat the cylindrical portions 21, so that a graphene core 22 is formed inside the cylindrical portions 21 and a graphene shell 23 is formed outside the cylindrical portions 21, so as to obtain a plurality of heat dissipating columns 20, and the plurality of heat dissipating columns 20 are maintained in an environment of 300-350°C.

[0038] (2) The substrate 11 is formed by semi-solid die casting, and before the substrate 11 is solidified, the substrate 11 and the plurality of heat dissipation columns 20 are fixed together by hot pressing and welding.

[0039] (3) After the strip substrate 11 and the plurality of heat dissipation pillars 20 are cooled, graphene coating is sprayed to form a graphene coating 12 on the upper and lower surfaces and the outer peripheral side surface of the substrate 11 .

[0040] The design focus of the present invention is: by separately forming the substrate and the cylinder part by semi-solid die casting, and then combining the cylinder part with the upper surface of the substrate by hot pressing and welding, it replaces the traditional die-casting one-piece molding method, effectively simplifies the molding process, and reduces the cost. At the same time, a graphene coating, a graphene core and a graphene shell are provided to effectively improve the heat dissipation effect of the product, and the overall performance of the product is better, which is worthy of popularization and use.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A semi-solid die-casting heat sink, characterized in that: It includes a heat dissipation base and a plurality of heat dissipation columns; The heat dissipation base includes a substrate and a graphene coating; the substrate is made of heat dissipation metal material and is formed by semi-solid die casting, the upper surface of the substrate is an arc-shaped concave structure, and the graphene coating completely covers the upper and lower surfaces and peripheral side surfaces of the substrate; The plurality of heat dissipation columns are distributed in an array on the upper surface of the substrate, and each heat dissipation column includes a barrel portion, a graphene core portion and a graphene shell; the barrel portion is made of heat dissipation metal material and is formed by semi-solid die casting, the lower end of the barrel portion is combined with the upper surface of the substrate by hot pressing and welding, the graphene core portion is formed in the barrel portion, and the lower end face of the graphene core portion is in contact with the upper surface of the substrate; the graphene shell is formed to cover the outer side surface of the barrel portion, the upper end of the graphene shell is integrally connected with the upper end of the graphene core portion and completely covers the upper end face of the barrel portion, and the lower end of the graphene shell is combined with the graphene coating; the lower surface of the substrate is horizontal The bottom surface of the substrate is provided with a first groove, the first groove extends horizontally, and the bottom surface of the first groove is provided with a plurality of recesses, and the plurality of recesses are arranged at intervals along the length direction of the first groove; two positioning posts extend downward from the front and rear edges of the substrate, the two positioning posts are respectively located at the left and right ends of the substrate, and each positioning post is provided with a positioning hole, and two fixing posts extend downward from the front and rear edges of the substrate, the two fixing posts are respectively located on the inner sides of the two positioning posts, and each fixing post is provided with a fixing hole; the left and right side surfaces of the heat dissipation post are both arc-shaped convex surfaces, and the width of the heat dissipation post gradually decreases from bottom to top; during preparation, the following steps are included: (1) forming a plurality of cylindrical parts by semi-solid die casting, and filling and coating the cylindrical parts with graphene materials before they are solidified, so that a graphene core is formed inside the cylindrical parts and a graphene shell is formed outside the cylindrical parts, so as to obtain a plurality of heat dissipation columns, and the plurality of heat dissipation columns are maintained in an environment of 300-350° C.; (2) forming the substrate by semi-solid die casting, and fixing the substrate and the plurality of heat dissipation columns together by hot pressing and welding before the substrate is solidified; (3) After the substrate and the plurality of heat dissipation columns are cooled, graphene coating is sprayed to form a graphene coating on the upper and lower surfaces and the outer peripheral side of the substrate.

2. The semi-solid die-cast heat sink according to claim 1, characterized in that: There are two first grooves symmetrically arranged front and back, and the two first grooves are each provided with the aforementioned multiple concave positions, and each concave position is a circular concave position.

3. The semi-solid die-cast heat sink according to claim 2, characterized in that: A second groove is concavely formed on the lower surface of the substrate. The second groove extends transversely and is located on the lower surface of one end of the substrate. The second groove is located between the two first grooves.

4. The semi-solid die-cast heat sink according to claim 1, characterized in that: The positioning column is a round column, and the fixing column is a square column.

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