A method for manufacturing an intelligent temperature-controlled COB light source

Abstract

The present invention belongs to the field of semiconductor intelligent lighting technology, and is used for semiconductor LED packaging technology, and specifically relates to a method for manufacturing an intelligent temperature-controlled COB light source. The present invention obtains an intelligent temperature-controlled COB light source by bonding multiple LED blue light chips to an LED substrate through solid crystal, wire bonding or eutectic, applying a first phosphor coating layer and a second phosphor coating layer, installing a dam glue layer and applying a transparent glue layer. The present invention arranges and installs LED blue light chips to achieve a spacing of less than 0.5 mm, and uses two bakings at different temperatures to achieve the effects of discharging bubbles and curing in the fluorescent glue. By first coating all LED chips with phosphors, and then coating local LED chips with phosphors, two light colors are mixed into other light colors, and the light spots are uniform and the light source is output at a high density, thereby quickly achieving the purpose of batch-producing COB light sources with high light density output.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor intelligent lighting, is used for semiconductor LED packaging technology, and specifically relates to a method for manufacturing an intelligent temperature-controlled COB light source. Background Art

[0002] COB light source is one of the LED lighting sources. It is a high-efficiency integrated surface light source formed by directly attaching LED chips to a high-reflectivity substrate. As the fourth-generation LED light source, it has replaced traditional lighting and is widely used in various lighting, display, backlight and other fields due to its unique advantages. One of the sub-sectors, smart light control lamps, is also developing rapidly: under the condition of controlling the color rendering index, the color temperature (color) can be adjusted accordingly according to people's preferences and needs, and the LED COB light source that meets this application has quickly entered people's field of vision and developed rapidly.

[0003] The manufacturing method of COB light source needs to adopt LED packaging process and fluorescent glue coating process. Since the light density divergence of COB light source is determined by the number of LED chip packages and the spacing of LED chip packages, and when the fluorescent glue is applied to the packaged LED chip, the thickness of the fluorescent glue and the bubbles in the fluorescent glue will directly affect the uniformity of the light spot of the COB light source. In the current two-color COB light source, a uniform cross-distribution composite package is adopted. The local LED chip is first artificially colored to achieve the first color temperature of the COB light source, and then all the LED chips are coated to achieve the second color temperature of the COB light source. The brightness ratio of the two different light color chips is adjusted to achieve the change of COB light color. However, the core components of the existing LED light source, the LED chips, are relatively spaced apart from each other in the two light colors, exceeding 0.5mm, and the high light density output of the light source cannot be achieved. Moreover, the two light colors are mixed into other light color spots that are not uniform enough. For LED chips with a spacing of less than 0.5mm between the LED chips of the two light color light emitting cores, the LED The above method cannot be used for COB light sources in batches, which results in the inability to achieve high light density output in batches and uneven light spots. Summary of the invention

[0004] The present invention provides a method for manufacturing an intelligent temperature-controlled COB light source, which solves the problem in the prior art that the COB light source cannot realize high light density output in batches and the light spot is not uniform enough.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A method for manufacturing an intelligent temperature-controlled COB light source comprises the following steps:

[0007] S1: independently select a high-density, high-reflection LED substrate, and set an insulating layer at the bottom;

[0008] S2: Fixing multiple LED blue light chips on the LED substrate by using a die-bonding material;

[0009] S3: pouring two fluorescent glues with different ratios into different stirring and mixing containers, pouring fluorescent powders with different ratios into the containers in small amounts for multiple times to mix with the fluorescent glues, and then forming a first fluorescent powder coating layer and a second fluorescent powder coating layer;

[0010] S4: Applying the first phosphor coating layer on all LED blue light chips to enable the LED blue light chips to emit light from five sides;

[0011] S5: performing a first baking on the LED blue light chip formed in step 4, so that the fluorescent glue on the first fluorescent powder coating layer flows to eliminate bubbles in the fluorescent glue, thereby achieving uniform mixing of the first fluorescent powder coating layer;

[0012] S6: baking the LED blue light chip formed in step 5 for the second time, and curing of the fluorescent glue can be achieved during the second baking, so that the first fluorescent powder coating layer is cured;

[0013] S7: Apply another second phosphor coating layer on the local LED blue light chip, one of which is LED blue light chip + first phosphor coating layer to achieve one light color; the other is LED blue light chip + first phosphor coating layer + second phosphor coating layer to achieve the second light color, thereby achieving two light colors of LED COB, and then repeat the baking process of step 5 and step 6;

[0014] S8: surrounding a dam glue layer around the two light color LED blue light chips, and all the LED blue light chips, the first phosphor coating layer, and the second phosphor coating layer are surrounded by the dam glue layer;

[0015] S9: Apply transparent fluorescent glue inside the dam glue layer to form a transparent glue layer.

[0016] Furthermore, the LED blue light chips are bonded to the LED substrate in a tightly arranged installation manner, so that the physical space size is only limited by the size of the LED blue light chips, further reducing the spacing between the LED blue light chips, and achieving a spacing of two light colors of LED blue light chips less than 0.5mm, thereby achieving a uniform mixing of the two light colors into other light color spots, and making the light source of the LED blue light chip have a high light density output.

[0017] Furthermore, the fluorescent glue is made of thermosetting material. Due to the characteristics of the thermosetting material, the first fluorescent powder coating layer and the second fluorescent powder coating layer are softened and flowed during the first heating and baking, and then heated to a higher temperature for a second time to produce a series of chemical reactions to solidify the first fluorescent powder coating layer and the second fluorescent powder coating layer, including but not limited to stirring the softened and flowed first fluorescent powder coating layer (4) and the second fluorescent powder coating layer (5) by a glass rod to expel bubbles, thereby improving the uniformity of the light spot produced after the two light colors are mixed.

[0018] Furthermore, the temperature of the first mixed phosphor coating layer and the second mixed phosphor coating layer is 100-120°C for the first heating, and the temperature of the second mixed phosphor coating layer is 160-200°C for the second heating.

[0019] Furthermore, the dam adhesive layer is made of high-reflective adhesive, and the reflectivity of the dam adhesive layer to radiated light within 150-1500nm is not less than 90%, and the reflectivity of the LED substrate is greater than 97%, thereby improving the light source output density of the LED blue light chip, and the thermally conductive substrate can dissipate the heat generated by the LED blue light chip during use, thereby increasing the service life of the LED blue light chip.

[0020] Furthermore, the first phosphor coating layer contains green phosphor, red phosphor and fluorescent glue, the content of green phosphor is 10-90%, the content of red phosphor is 5-40%, and the content of fluorescent glue is 5-30%; and the thickness of the first phosphor coating layer is 30-250um, the second phosphor coating layer contains green phosphor, red phosphor and fluorescent glue, the content of green phosphor is 10-90%, the content of red phosphor is 5-40%, and the content of fluorescent glue is 5-30%; and the thickness of the second phosphor coating layer is 30-250um, and the concentration of phosphor and the thickness of phosphor layer vary according to color temperature.

[0021] Furthermore, the LED blue light chip coated with the first phosphor coating layer produces a first light color temperature of 2000-20000K, and the LED blue light chip coated with the second phosphor coating layer produces a second light color temperature of 1800-10000K.

[0022] Furthermore, the dam adhesive layer and the transparent adhesive layer are made of high thermal conductivity materials, thereby increasing the service life of the LED blue light chip.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] 1. By adopting a closely arranged installation method for the chips, the physical space size is only affected by the size of the LED blue light chip itself, and the spacing between the LED blue light chips is less than 0.5mm, so that the two light colors are mixed into other light colors evenly, and the light source of the LED blue light chip has a high light density output.

[0025] 2. By adding different fluorescent powders to the fluorescent glue in small amounts and multiple times, the fluorescent powder and the fluorescent glue are evenly mixed, avoiding the uneven illumination of the light spot due to the uneven distribution of the fluorescent powder. Two baking times at different temperatures are used, and the fluorescent glue is stirred during the first baking to expel the bubbles in the fluorescent glue, further improving the uniformity of the generated light spot.

[0026] 3. By coating all the LED chips first, the process of achieving the first color temperature of the COB light source is accelerated, and through the characteristics of the thermosetting glue, the COB light source that has achieved the first color temperature is quickly solidified, and then the local LED chips are coated, and then the second color temperature of the COB light source is achieved, thereby quickly achieving batch production of COB light sources with high light density output. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the finished product of LED COB.

[0028] Figure 2 Schematic diagram of the LED blue light chip die bonding.

[0029] Figure 3 Schematic diagram of the first phosphor coating of LED blue light chip.

[0030] Figure 4 Schematic diagram of the second phosphor coating of the LED blue light chip.

[0031] Figure numerals: 1-LED substrate; 2-crystal bonding material; 3-LED blue light chip; 4-first phosphor coating layer; 5-second phosphor coating layer; 6-dam adhesive layer; 7-transparent adhesive layer. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in conjunction with specific embodiments, but the present invention is not limited to these embodiments. It should be noted that, under the premise of not conflicting, the embodiments described below or the technical features can be arbitrarily combined to form new embodiments. In the present invention, unless otherwise specified, all parts and percentages are mass units, and the equipment and raw materials used can be purchased from the market or are commonly used in the art. The methods in the following embodiments, if not otherwise specified, are conventional methods in the art.

[0033] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figure 1-Figure 4 As shown, the intelligent temperature-controlled COB light source includes an LED substrate 1, a solid crystal material 2, an LED blue light chip 3, a first phosphor coating 4, a second phosphor coating layer 5, a dam glue 6 and a transparent glue layer 7. The LED substrate 1 is welded with an LED blue light chip 3 through the solid crystal material 2, all the LED blue light chips 3 are coated with the first phosphor coating 4, a second phosphor coating layer 5 is coated on a local portion of the LED blue light chips 3, and the second phosphor coating layer 5 is coated on the first phosphor coating 4, all the LED blue light chips 3, the first phosphor coating layer 4, and the second phosphor coating layer 5 are surrounded by the dam glue layer 6, and a transparent fluorescent glue is coated inside the dam glue layer 6 to form a transparent glue layer 7.

[0036] The manufacturing method of the above-mentioned intelligent temperature-controlled COB light source is as follows:

[0037] S1: According to the specific needs of making COB light source, a high-density, high-reflection LED substrate 1 can be selected independently to improve the reflectivity of the light source, and an insulating layer is provided at the bottom of the LED substrate 1;

[0038] S2: as needed, multiple LED blue light chips 3 are fixed and bonded to the LED substrate 1 through the solid crystal material 2, so that the electrical surface of the LED blue light chip 3 faces downward, and then the spacing between the LED blue light chips 3 can be reduced when the LED blue light chips 3 are installed. Since the physical space size of the LED blue light chip 3 is only limited by the size of the LED blue light chip, the spacing between the LED blue light chips of two light colors is further realized to be less than 0.5mm, and then the light spots of other light colors mixed from the two light colors are uniform, and the light source of the LED blue light chip 3 has a high light density output, and the serial-parallel logic of the LED blue light chip 3 is first connected in parallel and then in series, so as to improve the overall reliability of the COB light source and improve the impact resistance of the COB light source;

[0039] S3: The fluorescent glue selected is a thermosetting material, two fluorescent glues with different ratios are poured into different stirring and mixing containers, and fluorescent powders with different ratios are poured into the fluorescent glues with different ratios in small amounts for multiple times to mix, and the fluorescent powders and the fluorescent glue are uniformly mixed under the action of continuous stirring and mixing, and then the first fluorescent powder coating layer 4 and the second fluorescent powder coating layer 5 are formed, thereby avoiding the uneven illumination of the light spot due to the uneven distribution of the fluorescent powder;

[0040] S4: coating the first phosphor coating layer 4 on all the installed LED blue light chips 3, so that the LED blue light chips 3 can emit light from five sides;

[0041] S5: putting the LED blue light chip 3 formed in step 4 into a baking machine, preheating the baking machine to a certain temperature, and performing the first baking. The temperature of the first baking allows the fluorescent glue on the first fluorescent powder coating layer 4 to soften and flow. The softened and flowing first fluorescent powder coating layer 4 is stirred with a glass rod to achieve the effect of removing bubbles in the fluorescent glue, thereby achieving uniform mixing of the first fluorescent powder coating layer 4, and further improving the uniformity of the generated light spot;

[0042] S6: After the drying machine is continuously heated to a certain temperature, the LED blue light chip 3 formed in step 5 is baked for the second time. During the second baking, a series of chemical reactions are generated to solidify the first phosphor coating layer 4, thereby completing the coating process of the first phosphor coating layer 4;

[0043] S7: coating a second phosphor coating layer 5 on the local LED blue light chips 3 (i.e., the cross-arranged LED blue light chips 3), wherein one path is the LED blue light chip 3 + the first phosphor coating layer 4 to realize one light color; the other path is the LED blue light chip 3 + the first phosphor coating layer 4 + the second phosphor coating layer 5 to realize the second light color, thereby realizing two light colors of LED COB, and then repeating the baking process of step 5 and step 6 to complete the coating process of the second phosphor coating layer 5, so that the light spots generated by the mixed two light colors are evenly illuminated;

[0044] S8: surrounding the two-color LED blue light chips 3 with a dam glue layer 6, all the LED blue light chips 3, the first phosphor coating layer 4, and the second phosphor coating layer 5 are surrounded by the dam glue layer 6;

[0045] S9: Apply transparent fluorescent glue inside the dam glue layer 6 to form a transparent glue layer 7.

[0046] After the above series of steps, the spacing between the LED blue light chips is less than 0.5mm, and then the light spot generated when the two light colors are mixed into other light colors is uniform, and the light source of the LED blue light chip has a high light density output. By first painting all the LED chips, the process of realizing the first color temperature of the COB light source is accelerated, and through the characteristics of the thermosetting glue, the production and curing of the COB light source with the first color temperature is quickly realized, and the bubbles in the fluorescent glue are discharged to improve the uniformity of the light spot, and then the local LED chips are painted, and then the second color temperature of the COB light source is realized, so as to quickly achieve batch production of COB light sources with high light density output.

[0047] Example 2

[0048] The manufacturing method of the above-mentioned intelligent temperature-controlled COB light source is as follows:

[0049] S1: According to the specific needs of making COB light sources, a substrate with high reflectivity is selected as the LED substrate 1, and the reflectivity of the reflective layer is 98%, which further improves the light source output density of the LED blue light chip 3, and the high reflectivity substrate can remove the heat generated by the LED blue light chip 3 when it is used, thereby increasing the service life of the LED blue light chip 3 and improving the reflectivity of the light source;

[0050] S2: as needed, multiple LED blue light chips 3 are bonded to the LED substrate 1 by bonding wires through bonding materials 2, and the spacing between the LED blue light chips of two light colors is less than 0.5 mm according to the arrangement of the chips and the control of the precision of the bonding machine, so that the light spots of other light colors are uniformly mixed from the two light colors, and the light source of the LED blue light chip 3 has a high light density output, and the serial-parallel logic of the LED blue light chip 3 is first connected in parallel and then in series, so as to improve the overall reliability of the COB light source and improve the impact resistance of the COB light source;

[0051] S3: The selected fluorescent glue is a thermosetting material, and the fluorescent glue with a content of 15% and 25% is poured into different stirring and mixing containers respectively, and a green fluorescent powder with a content of 50% and a red fluorescent powder with a content of 20% are added to the fluorescent glue with a content of 15% in small amounts for multiple times to mix, and a green fluorescent powder with a content of 40% and a red fluorescent powder with a content of 25% are added to the fluorescent glue with a content of 25% in small amounts for multiple times to mix, and under the action of continuous stirring and mixing, the fluorescent powder and the fluorescent glue are uniformly mixed, and then the first fluorescent powder coating layer 4 and the second fluorescent powder coating layer 5 are formed, thereby avoiding the uneven illumination of the light spot due to the uneven distribution of the fluorescent powder;

[0052] S4: coating the first phosphor coating layer 4 on all the installed LED blue light chips 3, controlling the thickness of the first phosphor coating layer 4 to be 200 um, so that the LED blue light chips 3 can emit light from five sides;

[0053] S5: putting the LED blue light chip 3 formed in step 4 into a baking machine, preheating the baking machine to 100° C., and continuously maintaining the temperature for the first baking. The temperature of the first baking allows the fluorescent glue on the first fluorescent powder coating layer 4 to soften and flow. A glass rod is used to stir the softened and flowing first fluorescent powder coating layer 4 to achieve the effect of removing bubbles in the fluorescent glue, thereby achieving uniform mixing of the first fluorescent powder coating layer 4, further improving the uniformity of the generated light spot, and the first light color temperature generated by the LED blue light chip 3 coated with the first fluorescent powder coating layer 4 is 18000K;

[0054] S6: After the drying machine is continuously heated to 180° C., the LED blue light chip 3 formed in step 5 is baked for the second time. During the second baking, a series of chemical reactions are generated to solidify the first phosphor coating layer 4, thereby completing the coating process of the first phosphor coating layer 4;

[0055] S7: coating a second phosphor coating layer 5 on the local LED blue light chip 3 (i.e., the LED blue light chip 3 arranged crosswise), wherein one path is the LED blue light chip 3 + the first phosphor coating layer 4 to realize one light color; the other path is the LED blue light chip 3 + the first phosphor coating layer 4 + the second phosphor coating layer 5 to realize the second light color, thereby realizing two light colors of LED COB, and then repeating the baking process of step 5 and step 6 to complete the coating process of the second phosphor coating layer 5, controlling the thickness of the second phosphor coating layer 5 to be 180um, so that the light spot generated by the mixed two light colors is evenly irradiated, and the second light color temperature of the LED blue light chip 3 coated with the second phosphor coating layer 5 is 9500K;

[0056] S8: surround the two-color LED blue light chips 3 with a dam glue layer 6, the dam glue layer 6 is made of high-reflective glue, and the reflectivity of the dam glue layer 6 to the radiated light within 150-1500nm is 90%, all LED blue light chips 3, the first phosphor coating layer 4, and the second phosphor coating layer 5 are surrounded by the dam glue layer 6, and the dam glue layer 6 reflects the light generated by the side of all LED blue light chips 3 to pass through the transparent glue layer 7, so that the light is further concentrated, and the dam glue layer 6 is made of high thermal conductivity material, so as to increase the service life of the LED blue light chip 3;

[0057] S9: transparent fluorescent glue is applied inside the dam glue layer 6 to form a transparent glue layer 7, and the transparent glue layer 7 is made of a high thermal conductive material, which can conduct away the heat generated by the LED blue light chip 3 when in use, thereby increasing the service life of the LED blue light chip 3.

[0058] Through the above series of steps, the reflectivity of the LED blue light chip is improved, and the light source output density of the LED blue light chip is further improved. In addition, the heat generated by the LED blue light chip during use can be discharged through the thermal conductive substrate, the dam adhesive layer and the transparent adhesive layer, thereby increasing the service life of the LED blue light chip.

[0059] The above embodiments are merely preferred implementations of the present invention. Any simple modification, amendment and substitution of the above embodiments based on the technical essence of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A method for manufacturing an intelligent temperature-controlled COB light source, characterized in that: The steps include: S1: independently selecting an LED substrate (1) with a high density and high reflective layer, and arranging an insulating layer at the bottom thereof; S2: fixing a plurality of LED blue light chips (3) on an LED substrate (1) by using a die-bonding material (2); S3: pouring two fluorescent glues of different proportions into different stirring and mixing containers, pouring fluorescent powders of different proportions into the containers in small amounts for multiple times to mix with the fluorescent glues, thereby forming a first fluorescent powder coating layer (4) and a second fluorescent powder coating layer (5); S4: applying a first phosphor coating layer (4) on all the LED blue light chips (3) to enable the LED blue light chips (3) to emit light from five sides; S5: performing a first baking on the LED blue light chip (3) formed in step 4, so that the fluorescent glue on the first fluorescent powder coating layer (4) flows to remove bubbles in the fluorescent glue, thereby achieving uniform mixing of the first fluorescent powder coating layer (4); S6: performing a second baking on the LED blue light chip (3) formed in step 5, and curing of the fluorescent glue can be achieved during the second baking, so that the first fluorescent powder coating layer (4) is cured; S7: coating another second phosphor coating layer (5) on the cross-arranged LED blue light chips (3), wherein one path is LED blue light chip (3) + first phosphor coating layer (4) to achieve one light color; and the other path is LED blue light chip (3) + first phosphor coating layer (4) + second phosphor coating layer (5) to achieve a second light color, thereby achieving two light colors of LED COB, and repeating the baking process of step 5 and step 6; S8: surrounding the two-color LED blue light chips (3) with a dam glue layer (6), so that all the LED blue light chips (3), the first phosphor coating layer (4), and the second phosphor coating layer (5) are surrounded by the dam glue layer (6); S9: applying transparent fluorescent glue inside the dam glue layer (6) to form a transparent glue layer (7); the LED blue light chips (3) are bonded to the LED substrate (1) in a tightly arranged installation manner, so that the physical space size is only limited by the size of the LED blue light chips (3), further reducing the spacing between the LED blue light chips (3), achieving a spacing of less than 0.5 mm between the LED blue light chips (3) of two light colors, and achieving a uniform light spot of other light colors when the two light colors are mixed, and making the light source of the LED blue light chip (3) output high light density; The fluorescent glue is made of thermosetting material. Due to the characteristics of the thermosetting material, the first fluorescent powder coating layer (4) and the second fluorescent powder coating layer (5) are softened and flowed during the first heating and baking, and then heated to a higher temperature for a second time to generate a series of chemical reactions to achieve the solidification of the first fluorescent powder coating layer (4) and the second fluorescent powder coating layer (5), including stirring the softened and flowed first fluorescent powder coating layer (4) and the second fluorescent powder coating layer (5) by a glass rod to expel bubbles, thereby improving the uniformity of the light spot generated after the two light colors are mixed; The temperature of the first mixed phosphor coating layer (4) and the second mixed phosphor coating layer (5) is 40-120° C., and the temperature of the second mixed phosphor coating layer (4) and the second mixed phosphor coating layer (5) is 120-200° C.; The dam glue layer (6) is made of a highly reflective glue, and the reflectivity of the dam glue layer (6) to radiated light within a wavelength of 150-1500 nm is not less than 90%. The LED substrate (1) is a heat-conductive substrate having a reflective layer, and the reflectivity of the substrate is greater than 90%, thereby further improving the light source output density of the LED blue light chip (3). The substrate can also conduct heat generated by the LED blue light chip (3) when in use, thereby increasing the service life of the LED blue light chip (3). The first phosphor coating layer (4) contains green phosphor, red phosphor and phosphor glue, the content of green phosphor is 10-90%, the content of red phosphor is 5-40%, and the content of phosphor glue is 5-30%; and the thickness of the first phosphor coating layer (4) is 30-250um. The second phosphor coating layer (5) contains green phosphor, red phosphor and phosphor glue, the content of green phosphor is 10-90%, the content of red phosphor is 5-40%, and the content of phosphor glue is 5-30%; and the thickness of the second phosphor coating layer (5) is 30-250 um, and the concentration of phosphor and the thickness of phosphor layer vary according to color temperature; The LED blue light chip (3) coated with the first phosphor coating layer (4) generates a first light color with a color temperature of 2000-20000K, and the LED blue light chip (3) coated with the second phosphor coating layer (5) generates a second light color with a color temperature of 1800-10000K.

2. The method for manufacturing an intelligent temperature-controlled COB light source according to claim 1, characterized in that: The dam glue layer (6) and the transparent glue layer (7) are made of high thermal conductivity materials, thereby increasing the service life of the LED blue light chip (3).

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