A high-efficiency and low-cost chip debonding device and debonding process

Abstract

The present invention relates to the technical field of chip processing, and particularly relates to an efficient and low-cost chip degumming device and a degumming process. The device includes a U-shaped guide rail, and support panels are fixed at both ends of the U-shaped guide rail. A cross beam is fixed between the two support panels. A chassis is slidably connected inside the U-shaped guide rail. A support member is arranged on the top surface of the chassis. One end of the cross beam is fixed with a first square tube. A first connecting plate is slidably connected to the bottom end of the first square tube. Both ends of the first connecting plate are slidably sleeved with a first rectangular tube. A suction column is slidably connected inside the U-shaped clamping rail. In the present invention, by moving the overflow glue after cutting to the lower part of the sponge roller, the sponge roller first drips alcohol onto the cutting hole of the overflow glue, which is convenient for alcohol fine polishing of the overflow glue. Then, while the sponge roller and the sponge bumps rotate reciprocally, they also move reciprocally horizontally, realizing rolling wiping of the overflow glue that has been soaked in alcohol, which is beneficial to improving the efficiency of overflow glue removal.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a high-efficiency and low-cost chip debonding device and debonding process. Background Art

[0002] Bonding is a common chip packaging process, which uses conductive silver glue or insulating glue to fix the chip and the packaging substrate together. During the bonding process, the amount of bonding glue applied has a huge impact on the entire bonding process, and the dispensing process needs to be strictly controlled. Currently, there are automatic dispensing and manual dispensing. Among them, the manual bonding machine has a low cost and flexible operation. It is still in use, but the amount of glue used in manual dispensing is not easy to control. When too much conductive silver glue is applied, the overflow is too serious, and the glue climbing height is too high, it will directly cause a short circuit between the positive and negative electrodes on the upper and lower ends of the chip. At the least, it will introduce the defect of slow silver ion migration and short-circuit failure during long-term use. The long-term service life and reliability are affected, so the solid crystal glue overflowing from the periphery of the chip needs to be removed. Among them, the main ways to remove the overflowed glue are to soak it with acetone or ethanol, and then wipe it with a soft cloth (sponge), or scrape it with a knife on the solidified glue. First of all, ethanol can only wet the surface of the solid crystal glue when wiping the solid crystal glue with a sponge. The inside and bottom areas of the solid crystal glue are not easy to wipe and remove directly. It is necessary to apply alcohol multiple times to gradually remove it, which will consume a lot of time. Secondly, it is not easy to control the cutting depth and cutting range of the blade when directly scraping with a blade, resulting in damage to the substrate or the edge of the chip. In view of this, it is necessary to design a chip degumming device that combines alcohol soaking and wiping with blade cutting. Summary of the invention

[0003] In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide an efficient and low-cost chip degumming device and degumming process, which uses a transmission part to carry the suction tube on the suction column to be obliquely inserted into the overflowed glue, and then the suction tube is taken out to rotate the overflowed glue on the chip 180 degrees so that the suction tube is again inserted into the overflowed glue after the positions of the two sides of the chip are interchanged. After the overflowed glue is plugged in and cut on both sides, a vacuum cleaner is used to suck the cut glue block into the suction column so that the cut glue block is cut and removed. By moving the cut overflowed glue to the bottom of the sponge roller, the sponge roller first drips alcohol into the cut hole of the overflowed glue to facilitate alcohol polishing of the overflowed glue, and then the sponge roller and the sponge protrusion rotate back and forth while moving back and forth horizontally to achieve rolling wiping of the overflowed glue that has been soaked in alcohol, which is beneficial to improving the efficiency of removing the overflowed glue.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] An efficient and low-cost chip debonding device, comprising a U-shaped guide rail, both ends of the U-shaped guide rail are fixed with support panels, a cross beam is fixed between the two support panels, a chassis is slidably connected inside the U-shaped guide rail, a support member is arranged on the top surface of the chassis, one end of the cross beam is fixed with a square tube one, a connecting plate one is slidably connected to the bottom end of the square tube one, both ends of the connecting plate one are slidably sleeved with rectangular tubes one, a U-shaped clamping rail is fixed to the bottom surface of the rectangular tube one, a suction column is slidably connected inside the U-shaped clamping rail, a plurality of suction pipes are obliquely arranged on the bottom surface of the suction column, a suction chamber communicating and fixed with the tops of the plurality of suction pipes is opened inside the suction column, a dust collector is fixed to the top surface of one end of the suction column, the suction port of the dust collector is communicated with the suction chamber, a circular cutting knife is fixed to the bottom end of the suction pipe, a guide block is fixed to the outside of the square tube one, two moving plates are slidably clamped inside the guide block, a transmission member is fixed to the end of the moving plate背离 the guide block, a square tube two is fixed to the end of the cross beam背离 the square tube one, a connecting plate two is fixed to the bottom surface of the square tube two, both ends of the connecting plate two are slidably sleeved with rectangular tubes two, a cylinder two is fixed to both sides of the connecting plate two, the output end of the cylinder two is fixed to the corresponding rectangular tube two, a cylinder three is arranged on the top of the U-shaped frame, the output end of the cylinder three is fixed to the U-shaped frame, the fixed end of the cylinder three is fixed to the corresponding rectangular tube two, a roller is rotatably connected to the bottom of the U-shaped frame, a sponge roller is sleeved and fixed on the outside of the roller, an infusion tube is rotatably inserted into one end of the roller, an alcohol box is fixed to the outside of the U-shaped guide rail, the infusion tube is communicated with the alcohol box through a hose two, and a water pump is fixed and communicated to the bottom end of the hose two, a plurality of circular holes communicating with the roller are equally spaced on one side of the sponge roller, and a plurality of sponge bumps are equally spaced and fixed on the other side of the sponge roller.

[0006] Furthermore: The support member includes a sleeve and an electric push rod, the sleeve is rotatably connected to the chassis, the electric push rod is fixed to the chassis, a sliding rod is slidably clamped inside the sleeve, a suction cup is fixed to the top surface of the sliding rod, a collar rotatably sleeved on the outside of the sliding rod and fixed to the electric push rod, a motor one is fixed inside the chassis, and the output end of the motor one is fixed to the sleeve.

[0007] Furthermore: A column slidably connected to the square tube one is fixed to the top surface of the connecting plate one, the transmission member includes a sleeve fixed to the moving plate, a piston shaft fixed to the corresponding suction column is slidably clamped inside the sleeve, an air pump is fixed to the top end of the square tube one, one end of the sleeve背离 the piston shaft is communicated and fixed with the output end of the air pump through a hose one, and the middle of the hose one is stored inside the moving plate.

[0008] Further, on both sides of the first connecting plate, a first cylinder is fixed, and the output end of the first cylinder is fixedly connected to a first rectangular pipe at the corresponding position.

[0009] Further, a second motor is fixed inside one end of the C-shaped frame. One end of the roller is rotatably connected to the C-shaped frame through a rotating shaft. A pulley is sleeved and fixed on both the rotating shaft and the output end of the second motor, and a belt is drivingly connected between the two pulleys.

[0010] A debonding process for an efficient and low-cost chip debonding device, and the process specifically includes the following steps:

[0011] Step 1: Place the substrate and the chip on the suction cup. The suction cup adsorbs and fixes the clamping plate, and move the chip to the position between the two suction columns. The overflow glue corresponds to the suction pipes on the suction columns.

[0012] Step 2: The air pump conveys air to the first hose to make the piston shaft inside the sleeve push the suction column along the inclined direction of the suction pipe. Multiple suction pipes are inserted into the overflow glue by means of the annular cutters at their bottom ends.

[0013] Step 3: The air pump sucks air into the sleeve, and the piston shaft moves the suction column again to make multiple suction pipes leave the overflow glue.

[0014] Step 4: The first motor drives the sleeve to rotate, causing the sliding rod to rotate, so that the suction cup drives the substrate and the chip to rotate by 180 degrees, making the overflow glue that has been sheared and located on both sides of the chip exchange positions.

[0015] Step 5: The suction pipes are inserted into the overflow glue after the positions are exchanged again. The vacuum cleaner sucks the gas in the suction chamber of the suction column to generate negative pressure, so that the cut glue blocks are sucked and removed.

[0016] Step 6: Move the support member to the position between the two sponge rollers, so that the chip moves to the position between the two sponge rollers.

[0017] Step 7: The alcohol in the alcohol box is pumped into the roller through the second hose by the transfer pump, and then flows into the holes opened on the overflow glue through the circular holes.

[0018] Step 8: The second motor drives the roller to rotate, so that one side of the sponge bumps on the sponge roller rotates to the overflow glue area, and the second motor drives the sponge bumps to rotate reciprocally.

[0019] Step 9: The third cylinder drives the C-shaped frame to move reciprocally, so that the sponge bumps on the sponge roller rotate reciprocally and move reciprocally horizontally at the same time, and wipe and remove the overflow glue soaked by alcohol thoroughly.

[0020] The beneficial effects of the present invention:

[0021] 1. The substrate and the chip are supported between the bottoms of two suction columns through a support member, and the bottom end of the suction pipe is directed towards the overflow glue area. The air pump supplies air to hose 1 to push the piston shaft inside the sleeve along the inclined direction of the suction pipe, so that the plurality of suction pipes are inserted into the overflow glue (abbreviation for overflowing glue) by means of the annular cutters at their bottom ends. Then, the piston shaft moves again with the suction columns to make the plurality of suction pipes leave the overflow glue. Next, the motor 1 in the chassis drives the sleeve to rotate, and the slide rod drives the suction cup to rotate 180 degrees to swap the positions of the overflow glue that has been sheared and is located on both sides of the chip. Similarly, the suction pipes are inserted into the overflow glue at the swapped position again. The overflow glue on the same side of the chip is separated from the glue block at the position between the two insertions and cuts under the insertion and cutting action of the suction pipes. At the same time, the vacuum cleaner sucks air from the suction chamber of the suction column to generate negative pressure, so that the cut glue block is sucked and removed, realizing the preliminary removal of the overflow glue. Move the position of the support member to move the chip under the two sponge rollers and contact the circular holes on the sponge rollers. The alcohol in the alcohol box is pumped into the drum through hose 2 by a pump, and then flows into the holes opened in the overflow glue (these holes are the holes left after sucking the glue blocks) through the circular holes. The alcohol in the holes is convenient for soaking inside the overflow glue. At the same time, the sponge rollers can be pressed against the overflow glue for a period of time to prevent the alcohol from volatilizing and improve the effect of alcohol soaking the overflow glue. Finally, the motor 2 drives the drum to rotate, so that the sponge bump side on the sponge roller rotates to the overflow glue area. The motor 2 drives the sponge bumps to rotate reciprocally, and at the same time, the cylinder 3 drives the C-shaped frame to move reciprocally, so that the sponge bumps on the sponge roller rotate reciprocally and move reciprocally horizontally at the same time, which is convenient for fully wiping and removing the overflow glue soaked by alcohol. Among them, the overflow glue on the other two sides of the chip can also be removed in the above way. By combining the cutting of the overflow glue with a circular blade, the soaking of the overflow glue with alcohol, and the wiping of the overflow glue with a sponge, it is beneficial to improve the efficiency of removing the overflow glue;

[0022] 2. The output end of the cylinder 1 drives the rectangular pipe 1 to move in a direction away from the connecting plate 1, so that the two C-shaped card rails move synchronously in a direction away from each other, realizing an increase in the distance between the two suction columns, and further achieving an increase in the distance between the two relatively arranged suction pipes, so as to facilitate the removal of the overflow glue around chips of different sizes (chips with different lengths and widths). Moreover, the output end of the cylinder 2 can drive the rectangular pipe 2 to move in a direction away from the square pipe 2, realizing an increase in the distance between the two sponge rollers, so as to apply alcohol to chips of different sizes and use alcohol to wipe and remove the overflow glue. Description of the Drawings

[0023] The present invention will be further described below with reference to the drawings.

[0024] Figure 1-2 is a schematic diagram of the overall structure of the present invention from different perspectives;

[0025] Figure 3It is a schematic structural diagram of the support member in the present invention;

[0026] Figure 4 It is a schematic structural diagram of the bottom of the square tube and the moving plate in the present invention;

[0027] Figure 5 It is a schematic structural diagram of the suction column in the present invention;

[0028] Figure 6 It is a schematic structural diagram of the suction pipe in the present invention;

[0029] Figure 7 It is a schematic overall external structure diagram of the first connecting plate in the present invention;

[0030] Figure 8 It is a schematic overall bottom structure diagram of the second square tube in the present invention;

[0031] Fig. 9 It is a schematic overall bottom structure diagram of the C-shaped frame in the present invention;

[0032] Fig.10 It is a schematic structural diagram of the roller in the present invention;

[0033] Fig.11 It is a schematic structural diagram of the substrate, overflow glue, and chip body in the present invention.

[0034] In the figure: 100, C-shaped guide rail; 110, support panel; 111, cross beam; 120, alcohol box; 200, chassis; 210, support member; 211, sleeve; 212, electric push rod; 213, sliding rod; 214, suction cup; 300, first square tube; 310, air pump; 320, moving plate; 400, first connecting plate; 410, first rectangular tube; 411, C-shaped clamping rail; 412, first cylinder; 420, column; 500, suction column; 510, suction pipe; 511, annular cutting knife; 520, suction chamber; 530, vacuum cleaner; 600, transmission member; 610, sleeve; 620, piston shaft; 700, second square tube; 710, second connecting plate; 711, second rectangular tube; 720, second cylinder; 800, C-shaped frame; 810, belt pulley; 820, third cylinder; 900, roller; 910, sponge roller; 911, sponge bump; 912, circular hole; 920, infusion tube; A, substrate; B, overflow glue; C, chip body. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0036] Please refer to Figure 1-11 As shown in the figure, a high-efficiency and low-cost chip debonding device includes a U-shaped guide rail 100. Support panels 110 are fixed at both ends of the U-shaped guide rail 100. A cross beam 111 is fixed between the two support panels 110. A chassis 200 is slidably connected inside the U-shaped guide rail 100. A support member 210 is arranged on the top surface of the chassis 200. One end of the cross beam 111 is fixed with a square tube one 300. A connecting plate one 400 is slidably connected to the bottom end of the square tube one 300. Rectangular tubes one 410 are slidably sleeved at both ends of the connecting plate one 400. A U-shaped clamping rail 411 is fixed to the bottom surface of the rectangular tube one 410. A suction column 500 is slidably connected inside the U-shaped clamping rail 411. A plurality of suction pipes 510 are obliquely arranged on the bottom surface of the suction column 500. A guide block is fixed to the outside of the square tube one 300. Two moving plates 320 are slidably clamped inside the guide block. A transmission member 600 is fixed to the end of the moving plate 320 facing away from the guide block. A square tube two 700 is fixed to the end of the cross beam 111 facing away from the square tube one 300. A connecting plate two 710 is fixed to the bottom surface of the square tube two 700. Rectangular tubes two 711 are slidably sleeved at both ends of the connecting plate two 710. A roller 900 is rotatably connected to the bottom of the U-shaped frame 800. A sponge roller 910 is sleeved and fixed on the outside of the roller 900.

[0037] The support member 210 includes a sleeve 211 and an electric push rod 212. The sleeve 211 is rotatably connected to the chassis 200. The electric push rod 212 is fixed to the chassis 200. A sliding rod 213 is slidably clamped inside the sleeve 211. A suction cup 214 is fixed to the top surface of the sliding rod 213. A collar fixedly connected to the electric push rod 212 is rotatably sleeved on the outside of the sliding rod 213. A motor one is fixed inside the chassis 200. The output end of the motor one is fixed to the sleeve 211. A keyway is arranged between the sliding rod 213 and the sleeve 211, enabling the sliding rod 213 to slide along the sleeve 211 and rotate synchronously with the sleeve 211. The electric push rod 212 facilitates adjusting the height of the suction cup 214 to move the overflow glue to a suitable position. A column 420 slidably connected to the square tube one 300 is fixed to the top surface of the connecting plate one 400. The transmission member 600 includes a sleeve 610 fixedly connected to the moving plate 320. A piston shaft 620 fixedly connected to the corresponding suction column 500 is slidably clamped inside the sleeve 610. An air pump 310 is fixed to the top end of the square tube one 300. One end of the sleeve 610 facing away from the piston shaft 620 is communicated and fixed with the output end of the air pump 310 through a first hose. The middle of the first hose is stored inside the moving plate 320. The air pump 310 sucks air or blows air into the sleeve 610 to enable the piston shaft 620 to reciprocate along the sleeve 610, so that the suction column 500 drives a plurality of suction pipes 510 to move along the inclined direction to realize plugging and cutting the overflow glue.

[0038] The interior of the suction column 500 is provided with a suction chamber 520 that is fixedly connected to the tops of multiple suction pipes 510. A vacuum cleaner 530 is fixed to the top surface of one end of the suction column 500. The suction port of the vacuum cleaner 530 is connected to the suction chamber 520. A ring cutter 511 is fixed to the bottom end of the suction pipe 510. The vacuum cleaner 530 can also use an external negative pressure supply device, mainly to generate negative pressure in the suction chamber 520, which is convenient for removing the glued blocks cut by insertion and cutting, reducing the volume of overflow glue, and also facilitating the addition of alcohol to the overflow glue in the later stage. On both sides of the first connecting plate 400, a first cylinder 412 is fixed. The output end of the first cylinder 412 is fixedly connected to the corresponding rectangular pipe 410. The first cylinder 412 drives the rectangular pipe 410 to move to adjust the distance between the two suction columns 500. On both sides of the second connecting plate 710, a second cylinder 720 is fixed. The output end of the second cylinder 720 is fixedly connected to the corresponding rectangular pipe 711. A third cylinder 820 is arranged on the top of the C-shaped frame 800. The output end of the third cylinder 820 is fixedly connected to the C-shaped frame 800. The fixed end of the third cylinder 820 is fixedly connected to the corresponding rectangular pipe 711. The second cylinder 720 drives the rectangular pipe 711 to move to adjust the distance between the two C-shaped frames 800.

[0039] One end of the roller 900 is rotatably inserted with an infusion pipe 920. An alcohol box 120 is fixed to the outside of the C-shaped guide rail 100. The infusion pipe 920 is connected to the alcohol box 120 through a second hose, and a water pump is fixedly connected to the bottom end of the second hose. The water pump is convenient for transporting alcohol through the infusion pipe 920 into the circular holes 912 of the sponge roller 910, and then adding it to the overflow glue from the circular holes 912. On one side of the sponge roller 910, a plurality of circular holes 912 communicating with the roller 900 are equidistantly arranged. On the other side of the sponge roller 910, a plurality of sponge bumps 911 are equidistantly fixed. The circular holes 912 are convenient for dripping alcohol, and the sponge bumps 911 are convenient for fully contacting the holes on the overflow glue. A second motor is fixed inside one end of the C-shaped frame 800. One end of the roller 900 is rotatably connected to the C-shaped frame 800 through a rotating shaft. A belt pulley 810 is sleeved and fixed on both the rotating shaft and the output end of the second motor. A belt is传动连接 between the two belt pulleys 810, so that the second motor drives the roller 900 to rotate through the belt pulley 810 and the belt, causing the sponge roller 910 to rotate.

[0040] A debonding process for a high-efficiency and low-cost chip debonding device specifically includes the following steps:

[0041] Step 1: Place the substrate and the chip on the suction cup 214. The suction cup 214 adsorbs and fixes the clamping plate, and move the chip to the position between the two suction columns 500. The overflow glue corresponds to the suction pipes 510 on the suction columns 500.

[0042] Step 2: The air pump 310 delivers air to the hose 1 so that the piston shaft 620 in the sleeve 610 pushes the suction column 500 along the inclined direction of the suction tube 510, and the multiple suction tubes 510 are inserted into the overflow glue with the help of the annular cutter 511 at the bottom thereof;

[0043] Step 3: The air pump 310 sucks air into the sleeve 610, and the piston shaft 620 moves again with the suction column 500 to make the multiple suction tubes 510 leave the overflowed glue;

[0044] Step 4: The motor 1 rotates the sleeve 211 to rotate the slide bar 213, so that the suction cup 214 rotates the substrate and the chip by 180 degrees, so that the overflow glue that has been cut and located on both sides of the chip is exchanged;

[0045] Step 5: The suction tube 510 is inserted into the overflowed glue after the exchanged position again, and the vacuum cleaner 530 sucks gas into the suction chamber 520 of the suction column 500 to generate negative pressure, so that the cut glue block is sucked away;

[0046] Step 6: Move the support member 210 to the position between the two sponge rollers 910 to move the chip to the position between the two sponge rollers 910;

[0047] Step 7: The alcohol in the alcohol box 120 is pumped into the drum 900 through the second hose pump by the delivery pump, and then flows into the hole opened on the overflow glue through the circular hole 912;

[0048] Step 8: The second motor drives the roller 900 to rotate so that one side of the sponge protrusion 911 on the sponge roller 910 rotates to the glue overflow area, and the second motor drives the sponge protrusion 911 to reciprocate;

[0049] Step nine: The cylinder three 820 drives the mold frame 800 to move back and forth, causing the sponge protrusion 911 on the sponge roller 910 to rotate back and forth while moving back and forth horizontally, fully wiping and removing the overflowed glue after being soaked in alcohol.

[0050] Working principle: During use, place the substrate and the chip on the suction cup 214. The suction cup 214 adsorbs and fixes the clamping plate. At this time, the chip is pasted on the clamping plate using die bonding glue. At this time, the chip is located between the lower parts of the two suction columns 500. The overflow glue corresponds to the suction pipes 510 on the suction columns 500. The air pump 310 conveys air to the first hose to make the piston shaft 620 inside the sleeve 610 push the suction column 500 along the inclined direction of the suction pipe 510, so that the plurality of suction pipes 510 are inserted into the overflow glue by means of the annular cutter 511 at their bottom ends. At this time, the upright column 420 on the first connecting plate 400 moves downward along the first square tube 300, and the suction column 500 slides inside the corresponding C-shaped rail 411. Then, the air pump 310 sucks air into the sleeve 610, and the piston shaft 620 moves again with the suction column 500 to make the plurality of suction pipes 510 leave the overflow glue. The first motor drives the sleeve 211 to rotate, causing the slide bar 213 to rotate, so that the suction cup 214 drives the substrate and the chip to rotate by 180 degrees, making the overflow glue that has been sheared and located on both sides of the chip swap positions. Similarly, the suction pipes 510 are inserted into the overflow glue at the swapped position again. The overflow glue on the same side of the chip is under the insertion and cutting action of the suction pipes 510, causing the glue block between the two insertions and cuts to separate from the overflow glue. At the same time, the vacuum cleaner 530 sucks air from the suction chamber 520 of the suction column 500 to generate negative pressure, so that the cut glue block is sucked and removed, realizing the preliminary removal of the overflow glue. Then, the electric push rod 212 drives the slide bar 213 to move downward, causing the suction cup 214 to drive the chip to move downward, and then move the support member 210 to the position between the two sponge rollers 910, so that the chip moves to the position between the lower parts of the two sponge rollers 910. The second motor drives the belt pulley 810 to rotate, causing the roller 900 to drive the sponge rollers 910 to rotate so that the circular holes 912 on their outer sides rotate to the position facing the overflow glue. Then, the electric push rod 212 drives the suction cup 214 to move upward, causing the overflow glue to move to the position below the circular hole 912. The alcohol in the alcohol box 120 is pumped into the roller 900 through the second hose by the transfer pump, and then flows through the circular hole 912 into the hole opened on the overflow glue (this hole is the hole left after the glue block is sucked out between the two times). The alcohol in the hole is convenient for soaking inside the overflow glue. At the same time, the sponge rollers 910 can be pressed against the overflow glue for a period of time to prevent the alcohol from volatilizing and improve the effect of alcohol soaking the overflow glue. Finally, the second motor drives the roller 900 to rotate, causing the sponge bump 911 on the sponge roller 910 to rotate to the overflow glue area. The second motor drives the sponge bump 911 to rotate reciprocally. At the same time, the cylinder three 820 drives the C-shaped frame 800 to move reciprocally, so that the sponge bump 911 on the sponge roller 910 rotates reciprocally and moves reciprocally horizontally at the same time, facilitating the full wiping and removal of the overflow glue soaked by alcohol. Among them, the overflow glue on the other two sides of the chip can also be removed in the above manner.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] The above contents are merely examples and explanations of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the invention or exceed the scope defined by the claims, they shall all fall within the protection scope of the present invention.

Claims

1. An efficient and low-cost chip debonding device, including a U-shaped guide rail (100), characterized in that, Both ends of the U-shaped guide rail (100) are fixed with support panels (110). A cross beam (111) is fixed between the two support panels (110). A chassis (200) is slidably connected inside the U-shaped guide rail (100). A support member (210) is arranged on the top surface of the chassis (200). One end of the cross beam (111) is fixed with a square tube one (300). A connecting plate one (400) is slidably connected to the bottom end of the square tube one (300). Both ends of the connecting plate one (400) are slidably sleeved with rectangular tubes one (410). A U-shaped clamping rail (411) is fixed to the bottom surface of the rectangular tube one (410). A suction column (500) is slidably connected inside the U-shaped clamping rail (411). A plurality of suction pipes (510) are obliquely arranged on the bottom surface of the suction column (500). A suction chamber (520) communicating and fixed with the tops of the plurality of suction pipes (510) is opened inside the suction column (500). A dust collector (530) is fixed to the top surface of one end of the suction column (500). The suction port of the dust collector (530) is communicated with the suction chamber (520). A ring cutter (511) is fixed to the bottom end of the suction pipe (510). A guide block is fixed to the outside of the square tube one (300). Two moving plates (320) are slidably clamped inside the guide block. A transmission member (600) is fixed to the end of the moving plate (320) facing away from the guide block. One end of the cross beam (111) facing away from the square tube one (300) is fixed with a square tube two (700). A connecting plate two (710) is fixed to the bottom surface of the square tube two (700). Both ends of the connecting plate two (710) are slidably sleeved with rectangular tubes two (711). Two cylinders two (720) are fixed to both sides of the connecting plate two (710). The output end of the cylinder two (720) is fixed to the corresponding rectangular tube two (711). A cylinder three (820) is arranged at the top of the U-shaped frame (800). The output end of the cylinder three (820) is fixed to the U-shaped frame (800). The fixed end of the cylinder three (820) is fixed to the corresponding rectangular tube two (711). A roller (900) is rotatably connected to the bottom of the U-shaped frame (800). A sponge roller (910) is sleeved and fixed on the outside of the roller (900). An infusion tube (920) is rotatably inserted into one end of the roller (900). An alcohol box (120) is fixed to the outside of the U-shaped guide rail (100). The infusion tube (920) is communicated with the alcohol box (120) through a hose two, and a water pump is fixed and communicated to the bottom end of the hose two. A plurality of circular holes (912) communicating with the roller (900) are equidistantly opened on one side of the sponge roller (910). A plurality of sponge bumps (911) are equidistantly fixed on the other side of the sponge roller (910).

2. The high-efficiency and low-cost chip degumming device according to claim 1 is characterized in that: The support member (210) comprises a sleeve (211) and an electric push rod (212); the sleeve (211) is rotatably connected to the chassis (200); the electric push rod (212) is fixedly connected to the chassis (200); a slide rod (213) is slidably engaged inside the sleeve (211); a suction cup (214) is fixed to the top surface of the slide rod (213); a sleeve ring fixedly connected to the electric push rod (212) is rotatably engaged outside the slide rod (213); a motor 1 is fixed inside the chassis (200); and an output end of the motor 1 is fixedly connected to the sleeve (211).

3. The high-efficiency and low-cost chip degumming device according to claim 2 is characterized in that: A column (420) slidably connected to a square tube (300) is fixed on the top surface of the connecting plate (400); the transmission member (600) includes a sleeve (610) fixedly connected to the movable plate (320); a piston shaft (620) fixedly connected to a suction column (500) at a corresponding position is slidably engaged inside the sleeve (610); an air pump (310) is fixed to the top of the square tube (300); an end of the sleeve (610) facing away from the piston shaft (620) is connected and fixed to an output end of the air pump (310) via a hose; and a middle portion of the hose is received and stored inside the movable plate (320).

4. The high-efficiency and low-cost chip degumming device according to claim 3 is characterized in that: Cylinder one (412) is fixed on both sides of the connecting plate one (400), and the output end of the cylinder one (412) is fixedly connected to the rectangular tube one (410) at the corresponding position.

5. The high-efficiency and low-cost chip degumming device according to claim 4 is characterized in that: A second motor is fixed inside one end of the molded frame (800), and one end of the roller (900) is rotatably connected to the molded frame (800) via a rotating shaft. A pulley (810) is sleeved and fixed to the output end of the rotating shaft and the second motor, and a belt is connected between the two pulleys (810) for transmission.

6. The debonding process of the high-efficiency and low-cost chip debonding device according to claim 5, characterized in that: The process specifically comprises the following steps: Step 1: Place the substrate and the chip on the suction cup (214), the suction cup (214) absorbs and fixes the clamp, and move the chip to a position between the two suction columns (500), and the overflow glue corresponds to the suction tube (510) on the suction column (500); Step 2: The air pump (310) delivers air to the hose 1 so that the piston shaft (620) in the sleeve (610) pushes the suction column (500) along the tilted direction of the suction tube (510), and the plurality of suction tubes (510) are inserted into the overflowed glue with the aid of the annular cutter (511) at the bottom thereof; Step 3: The air pump (310) sucks air into the sleeve (610), and the piston shaft (620) moves again with the suction column (500) to move the multiple suction tubes (510) away from the overflowed glue; Step 4: The motor 1 rotates the sleeve (211) to rotate the slide bar (213), so that the suction cup (214) rotates the substrate and the chip by 180 degrees, so that the overflowed glue that has been cut and located on both sides of the chip is exchanged; Step 5: The suction tube (510) is inserted again into the overflowed glue after the exchanged positions, and the vacuum cleaner (530) sucks gas into the suction chamber (520) of the suction column (500) to generate negative pressure, thereby allowing the cut glue blocks to be sucked away; Step 6: Move the support member (210) to a position between the two sponge rollers (910), so that the chip moves to a position between the two sponge rollers (910); Step 7: The alcohol in the alcohol box (120) is pumped into the roller (900) through the second hose pump by the delivery pump, and then flows into the hole opened on the overflow glue through the circular hole (912); Step 8: The second motor drives the roller (900) to rotate so that one side of the sponge protrusion (911) on the sponge roller (910) rotates to the glue overflow area, and the second motor drives the sponge protrusion (911) to reciprocate; Step 9: The cylinder 3 (820) drives the mold frame (800) to move back and forth, causing the sponge protrusion (911) on the sponge roller (910) to rotate back and forth while moving back and forth horizontally, fully wiping and removing the overflowed glue after being soaked in alcohol.

Images