Chip anti-shake photosensor

Abstract

The present invention relates to an anti-shake camera module, which includes: a lens assembly and a chip anti-shake photosensitive assembly. The chip anti-shake photosensitive assembly includes: a cover body, a chip assembly, a lead frame, a chip OIS ball and a driving element; wherein the chip OIS ball is arranged between the cover body and the chip assembly and supports the cover body and the chip assembly in the z-axis direction. The lens assembly includes a lens driving assembly and an optical lens, wherein the lens driving assembly includes a second driving structure, which is used to drive the optical lens to move along the xoy plane to achieve shake correction, and the second driving structure drives the optical lens to move in a direction opposite to the direction of movement of the chip assembly. The present invention adopts a dual OIS solution to expand the anti-shake stroke without increasing the radial size of the camera module, and is particularly suitable for large-chip camera modules.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a chip anti-shake photosensitive component for a compact anti-shake camera module. Background Art

[0002] Compact camera modules are usually installed in portable electronic devices, such as mobile phones, tablet computers, etc. The compact camera module installed in the mobile phone can be called a mobile phone camera module. Mobile phone camera modules are one of the important components of smart equipment, and their application scope and application volume in the market are constantly growing. With the advancement of technology, both work and life are promoting intelligence, and one of the important prerequisites for achieving intelligence is to be able to achieve good interaction with the external environment. One of the important ways to achieve good interaction is visual perception, and visual perception mainly relies on camera modules. It can be said that the camera module has transformed from an obscure smart equipment accessory to one of the key components of smart equipment.

[0003] As consumers' demand for mobile phone photography increases, the functions of mobile phone camera modules are becoming more and more diverse. Functions such as portrait shooting, long-distance shooting, optical zoom, and optical image stabilization are all integrated into cameras of limited size. Among them, autofocus, optical image stabilization, optical zoom and other functions often need to rely on optical actuators (sometimes also called motors) to achieve.

[0004] A typical camera module with a motor usually includes a lens, a motor mechanism (which can be simply referred to as a motor) and a photosensitive component. When the camera module is in the shooting state, the light from the subject is focused through the lens onto the photosensitive element (usually a photosensitive chip) of the photosensitive component. Structurally, the lens is fixed to the motor carrier of the motor, which is a movable part. It can usually drive the lens to move in the direction of the optical axis under the action of the driving element of the motor to achieve the focusing function. For camera modules with optical image stabilization (OIS) function, their motors often have more complex structures. This is because in addition to driving the lens to move in the direction of the optical axis, the motor also needs to drive the lens to move in other degrees of freedom (such as in the direction perpendicular to the optical axis) to compensate for the shake during shooting. Generally speaking, the camera module's jitter includes translation in the direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (rotation in the xoy plane, the axis direction of which can be roughly the same as the optical axis), as well as tilt jitter (rotation around the x-axis and y-axis. In the field of camera modules, tilt jitter is also called tilt jitter). When the gyroscope (or other position sensing element) in the module detects jitter in a certain direction, it can issue a command to drive the motor to move a distance in the opposite direction, thereby compensating for the lens jitter.

[0005] However, as the imaging quality requirements of mobile phone camera modules become higher and higher, the size and weight of the lenses are getting larger and larger, and the driving force requirements for the motor are also getting higher and higher. However, current electronic devices (such as mobile phones) also have great restrictions on the size of camera modules, and the volume occupied by the motor increases accordingly with the increase of the lens. In other words, as the lens develops towards larger size and heavier weight, the driving force that the motor can provide is difficult to increase accordingly. Under the premise of limited driving force, the heavier the lens, the shorter the stroke that the motor can drive the lens to move, affecting the anti-shake ability. For this reason, a chip anti-shake solution has been proposed, which is to set a driving structure at the photosensitive chip end to achieve optical image stabilization by driving the photosensitive chip to move. Since the weight of the photosensitive chip is usually less than the weight of the lens, it helps to achieve a larger anti-shake stroke.

[0006] At present, in order to further improve the resolution of the camera module, the area of ​​the photosensitive chip is still increasing year by year, and the existing chip anti-shake technology has become increasingly difficult to apply to photosensitive chips with larger areas. For example, when the area of ​​the photosensitive chip is large, its moving distance is limited, resulting in insufficient anti-shake travel. On the other hand, a large-area photosensitive chip requires a larger lens to adapt to its photographic performance, resulting in the need to increase the drive components of the lens accordingly. On the other hand, there are strict restrictions on the thickness of mobile phones, resulting in mobile phone camera modules usually not exceeding 10mm. How to fit the increasingly complex drive components and their suspension structures required into the mobile phone under this strict thickness limit is a major problem that technicians in this field need to solve.

[0007] In summary, there is an urgent need for a large-chip anti-shake camera module solution that is easy to assemble, can effectively control the module height and has a large anti-shake travel. Summary of the invention

[0008] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a large-chip anti-shake camera module solution that is easy to assemble, can effectively control the module height and has a large anti-shake stroke.

[0009] In order to solve the above technical problems, the present invention provides an anti-shake camera module, which includes: a lens assembly and a chip anti-shake photosensitive assembly. Among them, the chip anti-shake photosensitive component includes: a cover body, which has a light-through hole; a chip assembly, which includes a circuit board and a photosensitive chip fixed to the circuit board; a lead frame, which includes an outer frame and an inner frame and a lead structure connecting the outer frame and the inner frame, the lead structure includes a plurality of strip elastic elements, each of the strip elastic elements is bent and extended along the xoy plane, wherein the xoy plane is a plane parallel to the photosensitive surface of the photosensitive chip, the two ends of the strip elastic element are respectively connected to the outer frame and the inner frame, and the strip elastic element is provided with an electrical conductor to electrically conduct the outer frame and the inner frame, the chip assembly is fixed to the inner frame, and the cover body is fixed to the outer frame together; a chip OIS ball, which is arranged between the cover body and the chip assembly and supports the cover body and the chip assembly in the z-axis direction, wherein the z-axis is a coordinate axis perpendicular to the xoy plane; and a driving element, which is arranged in a cavity formed by the cover body and the lead frame. The lens assembly includes a lens driving assembly and an optical lens, wherein the lens driving assembly includes a second driving structure, which is used to drive the optical lens to move along the xoy plane to achieve jitter correction, and the second driving structure drives the optical lens to move in a direction opposite to the moving direction of the chip assembly.

[0010] Wherein, the lens driving assembly further includes a first driving structure, which is used to drive the optical lens to move along the z-axis direction to achieve automatic focusing.

[0011] Among them, the chip anti-shake photosensitive component also includes a supporting seat, which is fixed to the chip assembly, the supporting seat has a light-through hole, and the supporting seat is located under the cover body; and the chip OIS ball is arranged between the cover body and the supporting seat and supports the cover body and the supporting seat in the z-axis direction.

[0012] The lens driving assembly includes a housing, a limit frame, a second carrier, a lens carrier, a focus ball and a lens OIS ball. The lens carrier is in a flat plate shape with a through hole in the center for mounting the optical lens; the second carrier includes a side portion and a flat plate portion, the flat plate portion is located above the lens carrier, and the lens OIS ball is arranged between the lower surface of the flat plate portion and the upper surface of the lens carrier; the side portion includes a focus guide column, the focus ball is arranged between the outer side surface of the focus guide column and the inner side surface of the limit frame; and the lens carrier is located on the inner side of the side portion.

[0013] Among them, the shell of the lens driving assembly is fixed to the cover body of the chip anti-shake photosensitive assembly, and the lens driving assembly and the optical lens are both arranged in a cavity formed by the shell and the top surface of the cover body.

[0014] Among them, in the chip anti-shake photosensitive component, the driving element includes a coil and a magnet, and the driving element is arranged outside the chip assembly.

[0015] Among them, in the chip anti-shake photosensitive component, the supporting seat is in a plate shape, and a plurality of ball grooves are arranged on its upper surface, and the ball is arranged in each of the ball grooves.

[0016] Wherein, the z-axis dimension of the side wall of the ball groove is greater than the thickness of the bearing seat, so that the ball groove is in an upward convex state on the upper surface of the bearing seat.

[0017] Wherein, the bearing seat has a plurality of accommodating holes for arranging coils or magnets.

[0018] Wherein, the magnet is fixed to the cover body, the coil is arranged in the accommodating hole of the bearing seat, and the magnet is arranged at a position corresponding to the coil.

[0019] The upper surface and side surfaces of the magnet are wrapped with a magnetic blocking shell, and the magnetic blocking shell is installed on the lower surface of the cover.

[0020] Among them, in the chip assembly, the circuit board and the photosensitive chip are electrically connected through a wire bonding process, and the circuit board is provided with a plurality of circuit board contacts; the inner frame is provided with a plurality of inner frame contacts, and the circuit board contacts are contacted and electrically connected with the inner frame contacts one by one, and the intervals between the circuit board contacts are greater than the intervals between the photosensitive chip contacts on the photosensitive chip.

[0021] Among them, the area of ​​a single circuit board contact is larger than the area of ​​a single photosensitive chip contact.

[0022] Among them, the chip assembly has multiple metal wires formed by a wire bonding process, which cross from the photosensitive chip to the circuit board, and the multiple metal wires are covered by a molding part, and the molding part is directly formed on the upper surface of the circuit board and the edge area of ​​the photosensitive chip through a molding process or an embedded injection molding process.

[0023] Wherein, the circuit board and the photosensitive chip are connected and fixed together through the molding part.

[0024] Wherein, a magnetic yoke is provided at the edge area of ​​the chip assembly or the cover body, and the magnetic yoke and the magnet attract each other to clamp the ball between the bearing seat and the cover body.

[0025] Among them, the top surface of the chip assembly is higher than the top surface of the inner frame, an FPC soft board is arranged between the lead structure and the supporting seat, the FPC soft board is located at the periphery of the circuit board, fixed to and electrically connected to the circuit board, and the coil is arranged on the upper surface of the FPC soft board and is electrically conductive with the FPC soft board.

[0026] Wherein, the coil includes two x coils, two y1 coils and two y2 coils. In a top view, the two x coils are respectively arranged on the first side and the second side, and the first side and the second side are two parallel sides on the left and right sides of the bearing seat; the two y1 coils are located at the upper and lower ends of the first side, and the two y2 coils are located at the upper and lower ends of the second side. When a driving current is input to the two x coils, the chip assembly moves along the x-axis direction; when a driving current is input to the two y1 coils and the two y2 coils, and the y1 coils and the y2 coils are subjected to electromagnetic forces in the same direction by setting the current direction, the chip assembly moves along the y-axis direction; when a driving current is input to the two y1 coils and the two y2 coils, and the y1 coils and the y2 coils are subjected to electromagnetic forces in opposite directions, the chip assembly rotates around the z-axis; wherein the x-axis and the y-axis are two mutually perpendicular coordinate axes on the xoy plane.

[0027] Among them, the chip anti-shake photosensitive component also includes a Hall element, and the Hall element is arranged in the area surrounded by the coil.

[0028] Among them, in the chip anti-shake photosensitive component, the cover body is fixed to a base plate, and the base plate is located below the outer frame.

[0029] Among them, in the lens driving assembly, the flat plate portion of the second carrier is provided with a yoke and a lens OIS coil, and the yoke and the lens OIS magnet provided on the lens carrier attract each other, so that the lens OIS ball is clamped up and down by the flat plate portion of the second carrier and the lens carrier.

[0030] Compared with the prior art, the present invention has at least one of the following technical effects:

[0031] 1. This application can realize the anti-shake function of a large chip with a smaller height.

[0032] 2. In some embodiments of the present application, a bearing seat with a receiving hole (such as a through hole) is provided, and a ball bearing is provided between the bearing seat and the cover body to achieve the anti-shake function of a large-area chip. The ball bearing not only reduces the driving force requirement for chip anti-shake, but also reduces the height of the photosensitive component.

[0033] 3. In some embodiments of the present application, the photosensitive chip and the circuit board (PCB board) are combined into a chip assembly through a molding or embedded injection molding process, the chip assembly is mounted on a lead frame and the chip assembly is moved as a whole to realize the chip anti-shake function. This design helps to improve the yield rate and production efficiency of the photosensitive components.

[0034] 4. In some embodiments of the present application, the photosensitive chip and the circuit board (PCB board) are fixed together through molding or embedded injection molding process. This design helps to further reduce the height of the photosensitive component.

[0035] 5. In some embodiments of the present application, the flying wires (i.e., the metal wires) formed by the wire bonding process are covered with a molding part to avoid damage to the metal wires during the anti-shake movement process and to avoid other problems caused by entanglement and knotting of the metal wires, thereby improving the reliability of the chip anti-shake photosensitive components.

[0036] 6. In some embodiments of the present application, by setting up a plurality of coils of different types and configuring the control units of these coils accordingly, it is possible to further realize the anti-shake function in the rotation direction around the z-axis on the basis of realizing the anti-shake function in the x-axis and y-axis translation.

[0037] 7. In some embodiments of the present application, the chip assembly and the cover can clamp the ball through the mutual attraction between the yoke and the magnet, thereby preventing the ball from slipping. At the same time, due to the effect of the yoke, the elastic lead structure of the lead frame is easier to maintain on the same plane (such as the xoy plane) in the natural state (non-anti-shake state), so that during long-term use, the elastic lead structure is not easy to fatigue or deteriorate, thereby helping to improve the accuracy of anti-shake movement.

[0038] 8. In some embodiments of the present application, a magnetic-blocking shell is provided on the magnet. This arrangement can avoid mutual interference between the magnets and improve the accuracy of their movement and adjustment.

[0039] 9. In some embodiments of the present application, a dual OIS solution is adopted, and chip anti-shake and lens anti-shake are combined. When the camera module shakes, the lens and the photosensitive chip move in opposite directions respectively, thereby expanding the anti-shake stroke without increasing the radial size of the camera module. This is particularly suitable for large-chip camera modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic longitudinal section diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown;

[0041] Figure 2 A three-dimensional exploded schematic diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown;

[0042] Figure 3 A three-dimensional schematic diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown with the cover removed;

[0043] Figure 4 A three-dimensional schematic diagram of a chip anti-shake driving structure including a cover body according to an embodiment of the present application is shown;

[0044] Figure 5 A schematic top view of a circuit board and a photosensitive chip is shown;

[0045] Figure 6 A schematic top view of a lead frame in one embodiment of the present application is shown;

[0046] Figure 7 A top view of a bearing seat in one embodiment of the present application is shown;

[0047] Figure 8 A schematic top view of a chip anti-shake driving structure bearing seat with a magnetic yoke piece is shown;

[0048] Fig. 9 A schematic top view of the coil position distribution in one embodiment of the present application is shown;

[0049] Fig.10 A cross-sectional stereoscopic schematic diagram of an anti-shake camera module according to an embodiment of the present application is shown;

[0050] Fig.11 A three-dimensional schematic diagram showing a housing of an anti-shake camera module separated in one embodiment of the present application is shown;

[0051] Fig.12 A schematic diagram showing the three-dimensional appearance of an anti-shake camera module according to an embodiment of the present application is shown;

[0052] Fig.13 A three-dimensional exploded schematic diagram of a lens assembly of an anti-shake camera module in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0053] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0055] In the drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The drawings are only examples and are not drawn strictly to scale.

[0056] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0057] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0058] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this article have the same meaning as commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0059] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0060] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0061] The present application provides a photosensitive component with an improved chip anti-shake drive structure to adapt to the current trend of large chip development of camera modules. In order to improve the imaging quality of the camera module, the area of ​​the photosensitive chip arranged inside the module is also increased accordingly, and the volume of the optical lens arranged above the photosensitive chip also needs to be increased accordingly, so as to give full play to the advantages of large-area photosensitive chips. However, on the other hand, the market expects the camera module to have a smaller overall size in order to adapt to the miniaturization requirements of portable electronic devices such as mobile phones. In particular, portable electronic devices such as mobile phones have greater limitations in the thickness direction, so the present application provides a photosensitive component with an improved chip anti-shake drive structure, which realizes the chip anti-shake function of the large chip photosensitive component at a lower thickness cost. Specifically, according to one embodiment of the present application, the photosensitive component includes a chip assembly 30 and a chip anti-shake drive structure equipped with the chip assembly. Among them, the chip assembly includes at least a photosensitive chip and a circuit board (the circuit board here is a hard board, usually a PCB board). The photosensitive chip can be attached or installed on the circuit board in other forms, and the photosensitive chip can be electrically connected to the circuit board through a wire bonding process (i.e., a "wire bonding" process, sometimes also called a bonding process). After the chip assembly is mounted on the chip anti-shake drive structure, the chip assembly can be moved on the xoy plane under the action of a driving element. The movement on the xoy plane can include x-axis translation, y-axis translation, and can also include rotation around the z-axis. The xoy plane is a reference plane parallel to the photosensitive surface of the photosensitive chip, the z-axis is a coordinate axis perpendicular to the xoy plane, and the x-axis and y-axis are perpendicular to each other. The following is a further description of the details of various aspects of the chip anti-shake drive structure and the chip assembly in conjunction with the accompanying drawings and a series of embodiments.

[0062] Figure 1 A schematic longitudinal section diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown; Figure 2 A three-dimensional exploded schematic diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown; Figure 3 A three-dimensional schematic diagram of a chip anti-shake driving structure according to an embodiment of the present application is shown with the cover removed; Figure 4 A three-dimensional schematic diagram of a chip anti-shake driving structure including a cover body according to an embodiment of the present application is shown. Figure 1-Figure 4 In one embodiment of the present application, the chip anti-shake driving structure includes a bearing seat 10, a lead frame 20, an FPC soft board 34, a magnetic yoke sheet 38, a plurality of coil magnet pairs and a magnetic blocking shell 37, and a plurality of balls 14. The lead frame 20 includes an inner frame 21 and an outer frame 22, and the inner frame 21 and the outer frame 22 are connected by an elastic element. The elastic element can provide a relatively stable initial state for the movable part arranged thereon, and can also play a role in line conduction on the other hand.

[0063] Combined with reference Figure 1-Figure 4 In some embodiments of the present application, the lead frame 20 is disposed at the bottom of the FPC soft board 34. At the same time, the center of the movable part of the lead frame 20 is consistent with the center line of the FPC soft board 34. A corresponding light hole 12 is disposed at the center of the FPC soft board 34 so that the light can reach the upper surface of the photosensitive chip 31 through its through hole. At the same time, in order to adapt to the size of the photosensitive chip 31, the opening shape of the FPC soft board 34 can be adapted to the shape of the photosensitive chip 31. For example, when the shape of the photosensitive chip 31 is rectangular, the middle opening shape of the FPC soft board 34 is also rectangular, and the area of ​​the FPC middle opening is greater than or equal to the area of ​​the photosensitive area of ​​the photosensitive chip 31.

[0064] Still reference Figure 1-Figure 4 In some embodiments of the present application, the lead frame 20 includes an inner frame 21, an outer frame 22 and a lead structure 23, and the lead structure 23 can be composed of a plurality of strip elastic elements. The inner frame 21 and the outer frame 22 are connected by the elastic element. A mounting position for the photosensitive chip 31 is reserved on the inner frame 21. The FPC soft board 34 can be fixedly connected to the inner frame 21 on the lead frame 20, and the two can be fixed by bonding, or by other methods, such as welding. No corresponding restrictions are made on the specific fixing method here. A coil 35 is provided on the FPC soft board 34, and the coil 35 is arranged around the periphery of the FPC soft board 34. The coil is electrically conductive with the FPC soft board to ensure that a driving current is provided to the coil in a working state. In order to achieve multi-degree-of-freedom correction of the photosensitive chip 31, the number of the coils 35 is multiple. Reference Figure 2 and Figure 3 In order to realize the translation of the photosensitive chip 31 in the x direction, y direction and the rotation correction in the Rz direction (referring to the rotation around the z axis), the number of the coils 35 can be six, and its distribution method and control principle will be described below. The coil 35 is arranged on the FPC soft board 34, and the position sensing element is arranged in the area surrounded by the coil 35. This design can ensure the stability of the coil 35 being energized on the one hand, and on the other hand, it can make full use of the internal space of the module.

[0065] Still reference Figure 1-Figure 4In some embodiments of the present application, in order to further reduce the resistance during the movement of the photosensitive chip 31, a ball 14 is used for corresponding assistance. The ball 14 is arranged on the bearing seat 10, and the bearing seat 10 is integrally formed by a molding process. The ball groove 13 is arranged at the four corners of the bearing seat 10. In a specific embodiment, a light hole 12 is arranged in the middle of the bearing seat 10. The light hole 12 is mainly used to allow external light to pass through the light hole 12 thereon to reach the photosensitive chip 31. A corresponding opening is reserved at the position corresponding to the coil 35, and the opening is used to accommodate the coil 35 on the FPC soft board 34. In order to provide a larger driving force, the coil 35 has a certain thickness. Accommodating the coil 35 in the opening reserved in the bearing seat 10 can further reduce the overall height of the photosensitive component.

[0066] Further, Figure 5 A schematic top view of a circuit board and a photosensitive chip is shown. In some embodiments of the present application, in the chip assembly 30, the metal wire (i.e., the metal wire formed by the lead structure 23 process, such as a gold wire) connecting the circuit board 32 and the photosensitive chip 31 can be encapsulated in the molding part through a molding process, and the circuit board 32 and the photosensitive chip 31 are fixed together through the molding part. In one example, a through hole for accommodating the photosensitive chip 31 can be provided in the center of the circuit board 32, and the photosensitive chip 31 is placed in the through hole, and then the photosensitive chip 31 is electrically connected to the circuit board 32 through a wire bonding process, and finally the photosensitive chip 31 and the circuit board 32 are connected together through the molding part based on the molding process, and the molding part covers the metal wire. In this solution, on the one hand, it helps to reduce the thickness of the chip assembly 30 (i.e., the size in the z-axis direction), and on the other hand, the flying wire (i.e., the metal wire) formed by the wire bonding process between the circuit board 32 and the photosensitive chip 31 can be encapsulated by the molding part to avoid damage to the metal wire during the anti-shake movement process, and also avoid other problems caused by entanglement and knotting of the metal wire, thereby improving the reliability of the chip anti-shake photosensitive component. Furthermore, in this embodiment, electronic components 33, such as capacitors, resistors, etc., can also be arranged on the circuit board 32. These electronic components 33 can be arranged on the upper surface of the circuit board 32 and located in the area outside the metal wire. Figure 5 The wire connection area 32a on the circuit board 32 is shown. The wire connection area 32a is a connection area where the metal wire is connected to one end of the circuit board 32 (a large number of circuit board contacts can be arranged in this area to achieve wire bonding), and the other end of the metal wire is connected to the photosensitive chip 31 ( Figure 5The connection area of ​​the photosensitive chip end is not shown in the figure). In this embodiment, the electronic component 33 can be arranged on the periphery of the wire connection area 32a. The molded part can be formed on the circuit board 32 by an integrated molding process, and extends to and covers the upper surface of the edge area of ​​the photosensitive chip 31, thereby connecting and fixing the circuit board 32 and the photosensitive chip 31, and covering the metal wire at the same time.

[0067] The chip assembly 30 may also be implemented in other ways. For example, in another embodiment, the circuit board 32 may be a flat circuit board without a central through hole, and the photosensitive chip is attached to the upper surface of the circuit board. The photosensitive chip and the circuit board are electrically connected by a wire bonding process. Electronic components are arranged on the upper surface of the circuit board, and the electronic components can be arranged on the periphery of the metal wire, that is, arranged on the periphery of the wire connection area 32a, such as Figure 5 As shown. Furthermore, in this embodiment, the metal wire can be encapsulated in the molding part through a molding process. The molding part can be formed on the circuit board through an integrated molding process, and extend to and cover the upper surface of the edge area of ​​the photosensitive chip. This design can encapsulate the flying wire (i.e., the metal wire) formed by the wire bonding process between the circuit board and the photosensitive chip through the molding part, avoid damaging the metal wire during the anti-shake movement process, and avoid other problems caused by entanglement and knotting of the metal wire, thereby improving the reliability of the chip anti-shake photosensitive component.

[0068] In other embodiments of the present application, the chip assembly 30 may also adopt other structures. For example, the chip assembly 30 may include a circuit board, a photosensitive chip, a filter holder and a filter. The photosensitive chip is mounted on the circuit board, and the filter holder is mounted on the upper surface of the circuit board and surrounds the photosensitive chip. The filter is mounted on the filter holder. The filter, the filter holder and the circuit board can encapsulate the photosensitive chip in a cavity, thereby preventing dust or other tiny particles from adhering to the photosensitive surface. The photosensitive chip and the circuit board are electrically connected by a wire bonding process. In one embodiment, the filter holder can be formed separately and then mounted on the circuit board, and the metal wire formed by the wire bonding process can be set below the filter holder, that is, set in the cavity for encapsulating the photosensitive chip. Under this design, the filter holder can protect the metal wire. In another embodiment, the filter holder can be directly formed on the surface of the circuit board (for example, directly formed by a molding process) and extends to the photosensitive chip and covers the metal wire and the upper surface of the edge area of ​​the photosensitive chip. This design can encapsulate the flying wires (i.e., the metal wires) formed by the wire bonding process between the circuit board and the photosensitive chip through the molding part, so as to avoid damage to the metal wires during the anti-shake movement process and avoid other problems caused by entanglement and knotting of the metal wires, thereby improving the reliability of the chip anti-shake photosensitive components.

[0069] Further, Figure 6 FIG. 1 is a schematic top view of a lead frame in one embodiment of the present application. Figure 6 In one embodiment of the present application, the lead frame 20 includes an outer frame 22, an inner frame 21, and a lead structure 23 connecting the outer frame 22 and the inner frame 21. The lead structure 23 includes a plurality of strip-shaped elastic elements, on which an electrical conductor can be arranged so as to electrically connect the outer frame 22 and the inner frame 21. In this way, as long as the static outer frame 22 is electrically connected to the mainboard of a portable electronic device (such as a mobile phone mainboard), power can be supplied to the photosensitive chip, various functional circuits of the circuit board, and the chip anti-shake driving circuit. In the present application, the outer frame 22 and the inner frame 21 are both plate-shaped, and the inner frame 21 is rectangular in a top view, and the bottom surface of the chip assembly 30 is attached to (or otherwise mounted on) the upper surface of the inner frame 21. The outer frame 22 is arranged on the periphery of the inner frame 21, and the lead structure 23 is arranged in the square-shaped gap between the outer frame 22 and the inner frame 21. The two parallel sides of the outer frame 22 have a first extension 24 extending inwards, and the first extension 24 is located in the square-shaped gap between the inner frame 21 and the outer frame 22. The two parallel sides of the inner frame 21 have a second extension 25 extending outwards, and the second extension 25 is also located in the square-shaped gap between the inner frame 21 and the outer frame 22. And the two first extensions 24 and the two second extensions 25 are staggered, so that each side of the square-shaped gap is provided with an extension (i.e., the first extension 24 or the second extension 25). The lead structure 23 may include four groups of elastic elements, each group of elastic elements is arranged at a corner of the square-shaped gap, and each group of elastic elements connects a first extension 24 and a second extension 25. Each group of elastic elements includes a plurality of strip elastic elements arranged in parallel, and each strip elastic element has a bend, which is arranged at a position corresponding to the corner of the square-shaped gap. One side of the outer frame 22 also has an extension portion 26 extending outward, and the extension portion 26 can be provided with a conductive circuit so as to be electrically connected to the outside, for example, to be electrically connected to a mainboard of a portable electronic device (such as a mobile phone mainboard).

[0070] Further, Figure 7 FIG. 1 shows a top view of a bearing seat in one embodiment of the present application. Figure 7 In one embodiment of the present application, the support seat 10 is in the shape of a plate, and has a light-through hole 12 in the center so that the photosensitive chip can receive light. The support seat 10 also has a plurality of coil accommodating holes 11, and the FPC soft board 34 is arranged below the support seat 10, and the coil 35 on the upper surface of the FPC soft board 34 extends into the coil accommodating hole 11. A plurality of ball grooves 13 are also provided on the support seat 10. In this embodiment, the number of the ball grooves 13 is four. The ball groove 13 can be a cylindrical groove (that is, the bottom surface of the ball groove 13 is a plane, and the side surface of the groove is circular, such as Figure 7As shown). In other embodiments, the bottom surface of the ball groove 13 can also be a spherical arc surface (such as a hemispherical surface) that matches the shape of the ball. A ball 14 is arranged in each ball groove 13. A cover body 40 is arranged above the bearing seat 10, and the ball 14 is clamped between the lower surface of the cover body 40 and the bearing seat 10, so as to support the cover body 40 and the bearing seat 10 in the z-axis direction. In this embodiment, the bearing seat 10 can be fixed to the chip assembly 30, so that the ball 14 can support the chip assembly 30 and the cover body 40 in the z-axis direction, so that the chip assembly 30 can move relative to the cover body 40 in the xoy plane. The movement may include x-axis translation and y-axis translation, and in some embodiments may further include Rz rotation (i.e. rotation around the z-axis). A plurality of magnets 36 (i.e., magnets) are arranged on the lower surface of the cover 40, and the magnets 36 are arranged at positions corresponding to the coil accommodating holes 11, that is, the magnets 36 are arranged corresponding to the coils 35 of the FPC soft board 34. The cover 40 can be fixed to the outer frame 22 of the lead frame 20. Alternatively, the cover 40 (also referred to as the top cover) can be fixed to a bottom plate 41. The bottom plate 41 can be located below the outer frame 22, and the outer frame 22 is fixed to the bottom plate 41. The top cover and the bottom plate can accommodate other components such as the chip assembly in the space formed by the two. Under this design, the stability of the overall structure of the photosensitive component can be enhanced, and the components such as the chip assembly accommodated inside can also be protected. In the above embodiment, in order to reduce the resistance during the movement of the photosensitive chip, a corresponding auxiliary movement is performed by setting a ball structure. Since the movement of multiple degrees of freedom can be realized, the ball groove 13 can be set to a circular hole shape so that the ball 14 can move in multiple directions, thereby realizing the multi-directional movement of the photosensitive chip. The ball groove 13 may be configured to protrude upward along the surface of the bearing seat 10 to accommodate the ball 14 in the space formed by the ball groove 13. In another embodiment, the ball groove 13 may be a concave hemispherical hole, the surface of the ball groove 13 is lower than the upper surface of the bearing seat 10, and the ball 14 is accommodated in the concave hemispherical hole.

[0071] Furthermore, when the ball 14 is accommodated in the ball groove 13, in order to stably accommodate the ball 14 in the ball groove 13, in one embodiment of the present application, a structure is provided to keep the ball 14 stable, namely, a yoke structure. Figure 8A schematic top view of a chip anti-shake driving structure bearing seat with a yoke piece is shown. In this embodiment, the yoke piece 38 is arranged directly below the magnet 36 and is fixed to the bearing seat 10. The yoke piece 38 is arranged on the lower surface of the bearing seat 10. In order to further reduce the internal space occupied by the yoke piece 38, the yoke piece 38 is arranged on the side of the lower surface of the bearing seat 10. The yoke piece 38 and the magnet 36 (i.e., magnet) generate a pre-attractive force to clamp the ball 14 to prevent the ball 14 from slipping. According to the setting position of the magnet 36, the yoke piece 38 can be integrally formed into an integral structure, interacting with the magnet 36 arranged on the same side of the bearing seat 10, so as to limit the movement of the ball 14 by using the magnetic force generated between the two. The yoke piece 38 can also be arranged in multiples, and each position corresponding to the magnet 36 and the bearing seat 10 is provided with a corresponding yoke piece 38, and a one-to-one correspondence is formed between the yoke piece 38 and the magnet 36.

[0072] In the present application, in order to realize the movement of the photosensitive chip position, a certain driving force needs to be provided, and the driving force is mainly provided by the coil magnet 36 structure. In the previous series of embodiments, the coil 35 is arranged on the FPC soft board 34, and the corresponding magnet 36 is arranged at the corresponding position. There is a certain gap between the coil 35 and the magnet 36. In order to further save the internal space of the photosensitive component, the magnet 36 is arranged on the inner side of the photosensitive component housing, and its setting position corresponds to the position of the coil 35, such as Figure 2 and Figure 3 The magnet 36 is disposed in a magnetic resistance shell, and the magnetic resistance shell is fixed to the lower surface of the cover body 40 . The magnetic resistance shell is mainly used to isolate the magnetic force from leaking out and increase the magnetic thrust, while preventing the magnets 36 from interfering with each other.

[0073] Furthermore, in some embodiments of the present application, the number of the magnets 36 is consistent with the number of the coils 35, and the magnets 36 are indirectly fixed to the cover 40 through the mediation of the magnetic resistance shell, and correspond to the position where the coils 35 are set. When the coils 35 are powered on, an interaction force is generated between the magnets 36 and the coils 35. Since the magnets 36 are fixed on the cover 40 (the cover 40 is a part of the outer shell of the photosensitive component), the coils 35 move relative to the cover 40, and the coils 35 are fixed on the FPC soft board 34, and the FPC soft board 34 is connected to the inner frame 21 of the lead frame 20 and the photosensitive chip, so the position of the photosensitive chip moves. Since there is an elastic element between the inner frame 21 and the outer frame 22 of the lead frame 20, when the coils 35 are powered off, the force between them and the magnets 36 disappears. Under the action of the elastic element, the photosensitive chip can return to its initial position, providing a relatively stable initial state of the photosensitive component.

[0074] Fig. 9 FIG. 1 is a top view schematic diagram showing the coil position distribution in one embodiment of the present application. Fig. 9 In one embodiment of the present application, in the chip anti-shake driving structure, the number of coils 35 is six. Fig. 9The left and right sides are defined as the first side and the second side. The coils 35 are divided into three groups, the first group is two x coils 35a connected in series, the second group is two y1 coils 35b connected in series, and the third group is two y2 coils 35c connected in series. The two x coils 35a are respectively arranged at the middle position of the first side and the second side. The two y1 coils 35b are arranged at the two ends of the first side, i.e., the upper left corner and the lower left corner of the FPC soft board 34, and the two y2 coils 35c are arranged at the two ends of the second side, i.e., the upper right corner and the lower right corner of the FPC soft board 34. When a driving current is input to the first group of coils (i.e., the x coil 35a), the chip assembly moves along the x-axis direction. When a driving current is input to the third group of coils (i.e., the y1 coil 35b and the y2 coil 35c) of the second combination, and the electromagnetic force directions of the y1 coil 35b and the y2 coil 35c are the same by setting the current direction, the chip assembly moves along the y-axis direction. When a driving current is input to the third group of coils in the second combination (i.e., the y1 coil 35b and the y2 coil 35c), and the electromagnetic forces on the y1 coil 35b and the y2 coil 35c are in opposite directions by setting the current direction, the chip assembly rotates around the z-axis. Furthermore, a Hall element 39 can be provided on the FPC soft board 34. Specifically, an x-displacement Hall element and a y-displacement Hall element can be provided. The x-displacement Hall element is provided in an area surrounded by an x-coil 35a. There can be two y-displacement Hall elements, which are respectively provided in an area surrounded by a y1 coil 35b and an area surrounded by a y2 coil 35c. The x-displacement Hall element is sensitive to displacement in the x-axis direction (i.e., a significant magnetic field change can be sensed when the x-axis direction moves), and is insensitive to the position in the y-axis direction (i.e., a significant magnetic field change cannot be sensed when the y-axis direction moves). The y-displacement Hall element is sensitive to displacement in the y-axis direction (i.e., it can sense obvious magnetic field changes when the y-axis moves), and is insensitive to the position in the x-axis direction (i.e., it cannot sense obvious magnetic field changes when the x-axis moves). In this embodiment, the sum and average of the sensing values ​​of the two y-displacement Hall elements can be used as the y-axis displacement of the chip assembly, and the difference between the sensing values ​​of the two y-displacement Hall elements divided by 2 can be used as the Rz rotation amount of the chip assembly. According to the sensed x-axis displacement, y-axis displacement and Rz rotation amount, the current of each coil can be adjusted to drive the chip assembly to translate along the x-axis, translate along the y-axis, or perform Rz rotation to compensate for the jitter of the camera module and achieve chip anti-shake.

[0075] Further, in one embodiment of the present application, in the chip assembly, the circuit board and the photosensitive chip are electrically connected through a wire bonding process, and the circuit board is provided with a plurality of circuit board contacts. The inner frame is provided with a plurality of inner frame contacts, and the circuit board contacts are in contact and electrically connected to the inner frame contacts one by one. Moreover, the intervals between the circuit board contacts may be greater than the intervals between the photosensitive chip contacts on the photosensitive chip. The area of ​​a single circuit board contact is greater than the area of ​​a single photosensitive chip contact. Further, the chip assembly has a plurality of metal wires formed by a wire bonding process, which cross from the photosensitive chip to the circuit board, and the plurality of metal wires are covered by a molding part, and the molding part is directly molded on the upper surface of the circuit board and the edge area of ​​the photosensitive chip by a molding process or an embedded injection molding process. The circuit board may be a PCB board. The PCB board includes a plurality of wiring layers and insulating layers arranged alternately, and these wiring layers and insulating layers are combined together by a lamination process to form the PCB board. In this embodiment, the photosensitive chip contacts are led out to the PCB board based on the wire bonding process. Since the size (i.e., length and width) of the PCB board at a top-view angle is larger than that of the photosensitive chip, there is a larger area for arranging the contacts. Therefore, the interval between the contacts of the circuit board can be larger than the interval between the contacts of the photosensitive chip on the photosensitive chip. The area of ​​a single contact of the circuit board is larger than the area of ​​a single contact of the photosensitive chip. In this way, when the circuit board is assembled with the inner frame of the lead frame 20, the assembly of the chip assembly and the dynamic component of the inner frame is greatly facilitated due to the large area of ​​the contacts and the large intervals between the contacts. Compared with the solution in which the photosensitive chip is directly installed on the inner frame, the solution of this embodiment can significantly improve the process capability index (i.e., CPK), thereby improving the yield and production efficiency of the product in large-scale production. In this embodiment, the photosensitive chip and the circuit board in the chip assembly can be combined together by molding or embedded injection molding. Among them, the molded part directly molded on the surface of the circuit board and the surface of the edge area of ​​the photosensitive chip by molding or embedded injection molding can serve as a connecting member connecting the circuit board and the photosensitive chip. Furthermore, the molded part can cover multiple metal wires formed by the wire bonding process, which cross from the photosensitive chip and connect to the circuit board, thereby protecting these metal wires, avoiding damage to the metal wires during the anti-shake movement process, and avoiding other problems caused by entanglement of the metal wires, thereby improving the reliability of the chip anti-shake photosensitive component.

[0076] Furthermore, the present application also provides an anti-shake camera module equipped with the above-mentioned chip anti-shake photosensitive component. In some embodiments, the anti-shake camera module includes a lens assembly and an anti-shake photosensitive component. The lens assembly is provided with a lens end drive structure, and the lens end drive structure can be a ball motor, an SMA motor or an AF (autofocus) motor, etc. The lens end drive structure can be used to achieve shake correction during shooting or the autofocus function of the camera module to obtain high-quality imaging pictures. For large-area photosensitive chips, the drive structure inside the camera module needs to provide a greater driving force to drive the heavier optical lens 50 to move during shooting.

[0077] Fig.10 FIG. 2 is a cross-sectional perspective diagram of an anti-shake camera module according to an embodiment of the present application. Fig.10 In this embodiment, the anti-shake camera module includes a lens assembly and an anti-shake photosensitive assembly, wherein the lens assembly includes an optical lens 50 and a lens drive assembly, and the lens drive assembly includes a first drive structure and a second drive structure, wherein the first drive structure is mainly used to drive the lens to move along the direction of the optical axis to achieve focusing during shooting; the second drive structure is used to drive the lens to move along a direction perpendicular to the optical axis to achieve shake correction during shooting. The chip anti-shake photosensitive assembly can adopt the photosensitive assembly described in any of the above embodiments. Through the cooperation of the lens assembly and the chip anti-shake photosensitive assembly, the optical lens 50 and the photosensitive chip can move synchronously and in opposite directions during shooting. In this way, not only can anti-shake of a large stroke be achieved, but also the response speed of shake correction can be improved to improve the imaging efficiency of the camera module. Further, in this embodiment, the drive structure of the lens assembly can have a ball and be driven by the ball. In this way, the lens assembly and the chip assembly can use the ball bearings to assist in corresponding movement to reduce the resistance of movement. The lens assembly and the photosensitive assembly can also be assembled using the same process to facilitate mass production and save the cost of module production.

[0078] Fig.11 A three-dimensional schematic diagram showing the separation of the outer shell of an anti-shake camera module in one embodiment of the present application is shown. Fig.12 The figure shows a three-dimensional appearance diagram of an anti-shake camera module according to an embodiment of the present application. Fig.11 and Fig.12In this embodiment, the chip anti-shake photosensitive component is bonded and fixed to the housing of the lens drive component of the lens assembly through the top surface of its shell (i.e., the top surface of the top cover), thereby forming the camera module. Among them, the optical axis of the lens assembly is consistent with the center position of the photosensitive chip on the photosensitive component. When the camera module shakes during shooting, the optical lens 50 of the lens assembly and the photosensitive chip can move synchronously in opposite directions to correct the shaking during shooting. Since the optical lens 50 and the photosensitive chip can move synchronously in opposite directions to achieve anti-shake, the distance required for the photosensitive chip to move during the anti-shake correction process can be reduced, thereby adapting to the current development trend of large-chip camera modules. A large-chip camera module is a camera module in which the photosensitive chip uses a large-size chip. For the sake of distinction, a large-size chip is defined herein as a photosensitive chip with a CCD (i.e., photosensitive area) diagonal of more than 1 / 1.6 inches (including chips with a CCD diagonal of 1 / 1.6 inches and greater than 1 / 1.6 inches). The anti-shake camera module based on a large-size chip faces the problem of limited chip movement space and insufficient anti-shake travel. To this end, this embodiment adopts a dual OIS solution, that is, the chip anti-shake and lens anti-shake are combined. When the camera module shakes, the lens and the photosensitive chip move in opposite directions, thereby expanding the anti-shake travel without increasing the radial size of the camera module.

[0079] In some embodiments of the present application, the dual OIS camera module optimizes the space occupied by each internal component, so that the internal space of the camera module is fully utilized to achieve the miniaturization of the overall structure. At the same time, the photosensitive chip and the optical lens 50 perform jitter correction synchronously, and the corresponding jitter correction is quickly performed to improve the imaging efficiency of the camera module, thereby catering to the current trend of increasing the size of the camera module. When it is adapted to electronic terminal devices (such as mobile phones, tablet computers and other portable electronic devices), it conforms to the trend of thinness and lightness of the terminal device development. A corresponding driving structure is set at the end of the photosensitive chip so that the photosensitive chip moves during the shooting process to achieve jitter correction during the shooting process. The photosensitive chip itself is light in weight, and its own movement requires less driving force, which can meet the anti-shake trend of large chip development and solve some problems encountered by the anti-shake of the optical lens 50. However, the photosensitive chip itself needs to provide current during operation, and it needs to be connected to the circuit board accordingly. The wire structure connecting the photosensitive chip and the circuit board is unstable. When encountering external forces, it is easy to be damaged or poorly contacted, which seriously affects the imaging of the photosensitive chip. Based on this, in some embodiments of the present application, a photosensitive component structure supported by a lead frame with anti-shake function is provided, in which the photosensitive chip uses the lead frame to conduct the photosensitive chip and uses ball bearings to assist in its movement, thereby achieving multi-degree-of-freedom movement of the photosensitive chip while reducing the driving force requirements and ensuring the stability of the circuit structure during the operation of the photosensitive chip.

[0080] Further, Fig.13 The figure shows a three-dimensional exploded schematic diagram of the lens assembly of the anti-shake camera module in one embodiment of the present application. Figure 10-13 In one embodiment of the present application, the lens assembly includes an optical lens 50, a housing 60, a second carrier 61, a limit frame 62, a focus ball 63, a lens OIS ball 63a, a lens carrier 64, a lens OIS ball groove 65, a lens OIS magnet 66, a lens OIS coil 67, a spring 68, a buffer pad 69, a lens assembly base 60a, and a lens assembly circuit board 62a. Among them, the optical lens 50 is fixed to the lens carrier 64, and the lens carrier 64 can be generally flat, and a through hole is set in the center. The optical lens 50 can be fixed in the through hole. The second carrier 61 may include a flat plate and a side portion arranged on the side of the flat plate. In this embodiment, the side portion is arranged on one side of the lens assembly, and a ball accommodating structure is arranged at two corner positions for placing the focus ball 63. For ease of description, in this embodiment, the ball accommodating structure arranged at the corner position is called a focus guide column, and the focus guide column cooperates with the limit frame 62 located outside it to form a ball suspension structure of the focus module. Specifically, the outer side of the focus guide column is provided with a groove recessed inwardly, such as Fig.10As shown, in the present embodiment, two grooves may be provided on each focus guide column, and the two grooves are arranged along the z-axis (i.e., arranged along the optical axis direction of the lens assembly), and may be respectively referred to as an upper groove and a lower groove. In this article, the inner side refers to the side close to the optical axis of the camera module, and the outer side refers to the side away from the optical axis of the camera module. The limit frame 62 is a static component, and its height is greater than the height of the side of the second carrier 61, and the top and bottom of the limit frame 62 both extend inward to form a frame top seat and a frame base, and the frame top seat may be fixed to the lower surface of the outer shell 60, and the frame base may be fixed to the top cover of the photosensitive component 70. When the lens assembly has an independent lens assembly base 60a, the frame base may be fixed to the lens assembly base 60a, and the lens assembly base 60a is fixed to the top cover of the photosensitive component 70 (i.e., the cover body 40, which may be combined with reference Figure 1-Figure 4). The focus ball 63 is arranged between the inner side of the limit frame 62 and the outer side of the focus guide column, and the focus ball 63 supports the limit frame 62 and the second carrier 61 in the radial direction, so that the relative movement of the limit frame 62 and the second carrier 61 is limited in the z-axis direction, thereby realizing the focus movement. In this embodiment, the focus guide columns arranged at the two corners extend and close along the side walls of the housing 60 to form the side portion. This design can improve the structural strength of the second carrier 61, ensure the reliability of the device and the accuracy of the anti-shake movement and the focus movement. At the same time, since it only occupies the space of a single side of the lens assembly, this design also helps to reduce the radial size of the camera module. Here, the radial direction refers to the direction perpendicular to the optical axis, which will not be repeated below. In this embodiment, the limit frame 62 is arranged relative to the side of the second carrier 61, and also only occupies the space of a single side of the lens assembly, thereby reducing the radial size of the camera module. A lens assembly circuit board 62a is arranged on the outside of the limit frame 62 to arrange the driving circuit of the focus module. In some embodiments, the lens assembly circuit board 62a may further arrange the driving circuit of the lens OIS module. The limit frame 62 may also be provided with a through hole or a groove to arrange and install the coil or magnet of the focus module. Correspondingly, the side of the second carrier 61 may also be provided with a through hole or a groove to correspondingly install the magnet or coil of the focus module, thereby driving the second carrier 61 to move along the z-axis relative to the limit frame 62. A spring 68 is also installed on the top of the limit frame 62, and the spring 68 extends along the xoy plane (i.e., the reference plane perpendicular to the optical axis). The lower surface of the spring 68 is fixed to (for example, attached to) the upper surface of the flat plate portion of the second carrier 61, so as to flexibly connect the limit frame 62 with the second carrier 61. The spring 68 can also realize the electrical conduction between the limit frame 62 and the second carrier 61, so as to energize the coil installed on the second carrier 61 and / or the lens carrier 64. In this embodiment, the flat plate portion of the second carrier 61 is located above the lens carrier 64. The lens OIS ball 63a is disposed between the lower surface of the flat plate portion of the second carrier 61 and the upper surface of the lens carrier 64. The lens OIS coil 67 may be fixed to the flat plate portion, and the lens OIS magnet 66 may be fixed to the lens carrier 64. The flat plate portion may also be provided with a yoke, and when the lens OIS coil 67 is not energized, the yoke and the lens OIS magnet 66 attract each other, so that the lens OIS ball 63a is clamped between the flat plate portion of the second carrier 61 and the lens carrier 64. The lens OIS ball 63a may support the second carrier 61 and the lens carrier 64 in the z-axis direction.Moreover, during the focusing movement of the focusing module, due to the effect of the magnetic yoke of the flat plate portion of the second carrier 61, the lens carrier 64 and the optical lens 50 carried thereon can be adsorbed on the second carrier 61. Therefore, during the focusing movement, the up and down movement of the second carrier 61 (i.e., the z-axis movement) can drive the lens carrier 64 and the optical lens 50 carried thereon to move up and down together, thereby realizing the focusing movement of the optical lens 50. Further, in this embodiment, the lens OIS ball 63a can be arranged in a cross-guiding structure. The cross-guiding structure can be composed of a first strip groove arranged on the upper surface of the lens carrier 64 and a second strip groove (not shown in the figure) arranged on the lower surface of the flat plate portion of the second carrier 61, and the guiding direction of the first strip groove and the guiding direction of the second strip groove are perpendicular to each other. For example, the guiding direction of the first strip groove can be the x-axis direction (i.e., the ball moves along the x-axis direction), and the guiding direction of the second strip groove can be the y-axis direction (i.e., the ball moves along the y-axis direction). In order to reduce the movement resistance of the lens OIS ball 63a, the first strip groove can be a "v"-shaped groove, that is, the groove side wall of the first strip groove can be inclined. Further, the second strip groove can also be a "v"-shaped groove, that is, the groove side wall of the second strip groove can also be inclined. In this embodiment, four groups of lens OIS coil magnets can be provided, of which two groups of lens OIS coil magnets are arranged on the two sides of the flat plate portion of the lens carrier 64 and the second carrier 61, and the other two groups of lens OIS coil magnets are arranged at the two corner positions of the flat plate portion of the lens carrier 64 and the second carrier 61. The lens assembly is generally rectangular when viewed from a top view. For the entire lens assembly, focus guide columns and their corresponding focus balls 63 are arranged at two corner positions, and two groups of lens OIS coil magnets are arranged at the other two corner positions, thereby rationally utilizing the space in the four corners and improving space utilization. The four groups of lens OIS coil magnets cooperate with each other, which can not only realize the x-axis translation and y-axis translation of the optical lens 50, but also realize the Rz rotation (i.e., rotation around the z-axis). The working principle can refer to the x-axis translation, y-axis translation and Rz rotation of the chip assembly of the photosensitive component 70, which will not be repeated here. Furthermore, a sheet-like bracket can be set below the lens carrier 64, and the bracket can be movably connected with the second carrier 61 (for example, movably connected through an elastic element). The lower surface of the lens carrier 64 can be fixed to the bracket. Under the joint action of the bracket and the yoke, the movable connection between the lens carrier 64 and the second carrier 61 can be made more stable and reliable. In this embodiment, the lens OIS ball 63a is set between the upper surface of the lens carrier 64 and the lower surface of the flat plate portion of the second carrier 61, so that the lens OIS magnet 66 can be kept away from the chip OIS magnet of the photosensitive component 70, thereby avoiding mutual interference between the magnetic fields of the two, thereby improving the reliability of the device.

[0081] Furthermore, in some embodiments of the present application, a buffer pad 69 may be provided on the upper surface of the flat plate portion of the second carrier 61 to prevent the housing 60 from colliding with the second carrier 61 when the focus is moved. Similarly, a buffer pad 69 may also be provided on the side of the lens carrier 64 to prevent the lens carrier 64 from colliding with the housing 60 or other static components when the lens OIS moves.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that any modification or equivalent replacement of the technical solutions of the present invention does not depart from the spirit and scope of the technical solutions of the present invention and should be included in the scope of the claims of the present invention.

Claims

1. An anti-shake camera module, comprising: A lens assembly and a chip anti-shake photosensitive assembly, wherein the lens assembly is fixed to the top surface of the chip anti-shake photosensitive assembly; characterized in that the chip anti-shake photosensitive assembly includes: A cover body having a light-through hole; A chip assembly, comprising a circuit board and a photosensitive chip fixed to the circuit board; A lead frame, comprising an outer frame and an inner frame and a lead structure connecting the outer frame and the inner frame, wherein the lead structure comprises a plurality of strip elastic elements, each of which is bent and extended along an xoy plane, wherein the xoy plane is a plane parallel to the photosensitive surface of the photosensitive chip, two ends of the strip elastic element are respectively connected to the outer frame and the inner frame, and the strip elastic element is provided with an electrical conductor to electrically connect the outer frame and the inner frame, the chip assembly is fixed to the inner frame, and the cover body is fixed to the outer frame; a chip OIS ball disposed between the cover and the chip assembly and supporting the cover and the chip assembly in a z-axis direction, wherein the z-axis is a coordinate axis perpendicular to the xoy plane; and a driving element disposed in a cavity formed by the cover and the lead frame; The lens assembly includes a lens driving assembly and an optical lens, wherein the lens driving assembly includes a second driving structure, which is used to drive the optical lens to move along the xoy plane to achieve jitter correction, and the second driving structure drives the optical lens to move in a direction opposite to the moving direction of the chip assembly.

2. The anti-shake camera module according to claim 1, characterized in that: The lens driving assembly also includes a first driving structure, which is used to drive the optical lens to move along the z-axis direction to achieve automatic focusing.

3. The anti-shake camera module according to claim 1, characterized in that: The chip anti-shake photosensitive component also includes a bearing seat, which is fixed to the chip assembly, the bearing seat has a light-through hole, and the bearing seat is located below the cover body; and The chip OIS ball is disposed between the cover body and the bearing seat and supports the cover body and the bearing seat in the z-axis direction.

4. The anti-shake camera module according to claim 1, characterized in that: The lens driving assembly comprises a housing, a limit frame, a second carrier, a lens carrier, a focus ball and a lens OIS ball; Wherein, the lens carrier is in the shape of a flat plate, and has a through hole in the center for mounting the optical lens; The second carrier includes a side portion and a flat plate portion, the flat plate portion is located above the lens carrier, and the lens OIS ball is arranged between a lower surface of the flat plate portion and an upper surface of the lens carrier; The side portion includes a focus guide column, the focus ball is arranged between the outer side surface of the focus guide column and the inner side surface of the limit frame; and the lens carrier is located on the inner side of the side portion.

5. The anti-shake camera module according to claim 4, characterized in that: The housing of the lens driving assembly is fixed to the cover of the chip anti-shake photosensitive assembly, and the lens driving assembly and the optical lens are both arranged in a cavity formed by the housing and the top surface of the cover.

6. The anti-shake camera module according to claim 3, characterized in that: In the chip anti-shake photosensitive component, the driving element includes a coil and a magnet, and the driving element is arranged outside the chip assembly.

7. The anti-shake camera module according to claim 3, characterized in that: In the chip anti-shake photosensitive component, the supporting seat is in a plate shape, and a plurality of ball grooves are arranged on the upper surface thereof, and the ball is arranged in each of the ball grooves.

8. The anti-shake camera module according to claim 7, characterized in that: The z-axis dimension of the side wall of the ball groove is greater than the thickness of the bearing seat, so that the ball groove is in an upward convex state on the upper surface of the bearing seat.

9. The anti-shake camera module according to claim 7, characterized in that: The bearing seat has a plurality of accommodating holes for arranging coils or magnets.

10. The anti-shake camera module according to claim 9, characterized in that: The magnet is fixed to the cover body, the coil is arranged in the receiving hole of the bearing seat, and the magnet is arranged at a position corresponding to the coil.

11. The anti-shake camera module according to claim 10, characterized in that: The upper surface and side surfaces of the magnet are wrapped with a magnetic blocking shell, and the magnetic blocking shell is installed on the lower surface of the cover.

12. The anti-shake camera module according to claim 1, characterized in that: In the chip assembly, the circuit board and the photosensitive chip are electrically connected through a wire bonding process, and the circuit board is provided with a plurality of circuit board contacts; The inner frame is provided with a plurality of inner frame contacts, the circuit board contacts are in one-to-one contact with and electrically connected to the inner frame contacts, and the intervals between the circuit board contacts are greater than the intervals between the photosensitive chip contacts on the photosensitive chip.

13. The anti-shake camera module according to claim 12, characterized in that: The area of ​​a single circuit board contact is larger than the area of ​​a single photosensitive chip contact.

14. The anti-shake camera module according to claim 12, characterized in that: The chip assembly has a plurality of metal wires formed by a wire bonding process, which cross from the photosensitive chip to the circuit board, and the plurality of metal wires are covered by a molding part, and the molding part is directly formed on the upper surface of the circuit board and the edge area of ​​the photosensitive chip by a molding process or an embedded injection molding process.

15. The anti-shake camera module according to claim 14, characterized in that: The circuit board and the photosensitive chip are connected and fixed together through the molding part.

16. The anti-shake camera module according to claim 6, characterized in that: A magnetic yoke is disposed at the edge area of ​​the chip assembly or the cover body, and the magnetic yoke and the magnet attract each other to clamp the ball between the bearing seat and the cover body.

17. The anti-shake camera module according to claim 10, characterized in that: The top surface of the chip assembly is higher than the top surface of the inner frame, an FPC soft board is arranged between the lead structure and the supporting seat, the FPC soft board is located at the periphery of the circuit board, fixed to and electrically connected to the circuit board, and the coil is arranged on the upper surface of the FPC soft board and is electrically connected to the FPC soft board.

18. The anti-shake camera module according to claim 6, characterized in that: The coils include two x coils, two y1 coils and two y2 coils; In a top view, the two x coils are respectively arranged on a first side and a second side, and the first side and the second side are two parallel sides on the left and right sides of the supporting seat; the two y1 coils are located at the upper and lower ends of the first side, and the two y2 coils are located at the upper and lower ends of the second side; When driving current is input to the two x coils, the chip assembly moves along the x-axis direction; when driving current is input to the two y1 coils and the two y2 coils, and the current direction is set so that the y1 coils and the y2 coils are acted upon by electromagnetic forces in the same direction, the chip assembly moves along the y-axis direction; when driving current is input to the two y1 coils and the two y2 coils, and the y1 coils and the y2 coils are acted upon by electromagnetic forces in opposite directions, the chip assembly rotates around the z-axis; wherein the x-axis and the y-axis are two mutually perpendicular coordinate axes on the xoy plane.

19. The anti-shake camera module according to claim 6, characterized in that: The chip anti-shake photosensitive component also includes a Hall element, and the Hall element is arranged in the area surrounded by the coil.

20. The anti-shake camera module according to claim 6, characterized in that: In the chip anti-shake photosensitive component, the cover body is fixed to a base plate, and the base plate is located below the outer frame.

21. The anti-shake camera module according to claim 4, characterized in that: In the lens driving assembly, the flat plate portion of the second carrier is provided with a yoke and a lens OIS coil, and the yoke and the lens OIS magnet provided on the lens carrier attract each other, so that the lens OIS ball is clamped up and down by the flat plate portion of the second carrier and the lens carrier.

Images