Integrated circuit chip packaging device

Abstract

The present invention belongs to the field of semiconductor packaging technology, and more particularly to an integrated circuit chip packaging device, including a packaging box, wherein the top of the packaging box is an open design, a glue storage tube is connected to one side of the bottom of the packaging box, a first piston plate is arranged in the glue storage tube, a glue inlet tube is inserted through the bottom of the first piston plate, and a first telescopic rod is vertically fixedly connected to the bottom of the first piston plate. In the process of chip packaging, the present invention can add the epoxy resin in the glue storage tube to the packaging box, thereby squeezing the epoxy resin containing bubbles out of the packaging box, thereby ensuring the reliability of the epoxy resin protecting the chip after drying. In addition, in the process of gradual curing of the epoxy resin, when the volume of the epoxy resin decreases due to curing, the epoxy resin in the glue storage tube can be automatically added to the packaging box, thereby ensuring the packaging effect of the epoxy resin on the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to an integrated circuit chip packaging device. Background Art

[0002] Chip packaging refers to the shell used to install semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits.

[0003] When encapsulating existing chips, epoxy resin is usually coated on the substrate on which the chip is mounted. When the epoxy resin is cured, a hard protective layer will be formed on the periphery of the chip to protect the chip from damage. However, when encapsulating the chip with epoxy resin, air may be mixed in the epoxy resin, and the existing encapsulation mold lacks a suitable exhaust device, which results in some air remaining in the epoxy resin during encapsulation. When the epoxy resin is dried, cavities will appear inside the epoxy resin, affecting the reliability of the epoxy resin shell in protecting the chip.

[0004] Therefore, it is necessary to invent an integrated circuit chip packaging device to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides an integrated circuit chip packaging device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An integrated circuit chip packaging device comprises a packaging box, the top of the packaging box is designed to be open, a glue storage tube is connected to one side of the bottom of the packaging box, a first piston plate is arranged in the glue storage tube, a glue inlet tube is inserted through the bottom of the first piston plate, a first telescopic rod is vertically fixedly connected to the bottom of the first piston plate, and a first spring is sleeved on the first telescopic rod, a glue inlet hole is opened on one side of the packaging box close to the glue storage tube, and the glue inlet hole is connected to the top of the glue storage tube, through holes matching the internal length of the packaging box are opened at positions close to the top on both sides of the packaging box, a conduit is connected between the glue inlet hole and the through hole at the top, and a first sealing component is arranged in the through hole at the top of the glue inlet hole, and another A guide tube is connected to the external opening of each through hole, and a second sealing assembly is arranged in the guide tube, a second piston plate is horizontally arranged in the packaging box, a plurality of limit rods are vertically fixedly connected to the bottom of the second piston plate, the bottom end of the limit rod vertically penetrates and is inserted into the bottom of the packaging box, a second telescopic rod is connected to the bottom end of the limit rod, and a second spring is sleeved on the second telescopic rod, a chip to be packaged is placed at the top opening of the packaging box, and a clamping assembly is arranged on the top of the chip, a vertical third telescopic rod is symmetrically installed on the front and back sides of the packaging box, and a third spring is sleeved on the third telescopic rod, a matching annular sealing gasket is fixedly connected to the top of the packaging box, and an exhaust valve is installed at the bottom of the packaging box.

[0008] Furthermore, the first sealing assembly includes a first sealing plate, the size of the first sealing plate matches the opening size of the through hole, and in an initial state, the side of the first sealing plate away from the conduit is flush with the inner wall of the corresponding side of the packaging box, and the side of the first sealing plate close to the conduit is vertically fixedly connected to a plurality of pull rods, the free sliding sleeve of the pull rod is connected to a first sleeve, the end of the first sleeve away from the pull rod is fixedly connected to the first fixing plate, the top and bottom ends of the first fixing plate are respectively fixedly connected to the top and bottom inner walls of the through hole, the end of the pull rod located in the first sleeve is fixedly connected to a pressure plate, the side of the pressure plate close to the first sealing plate is connected to a fourth spring, and the fourth spring is sleeved on the pull rod.

[0009] Furthermore, the second sealing assembly includes a second sealing plate, the size of the second sealing plate matches the opening size of the through hole, and in an initial state, a side of the second sealing plate close to the first sealing plate is flush with the inner wall of the corresponding side of the packaging box, and the side of the second sealing plate away from the first sealing plate is vertically fixedly connected to two second sleeves, and the two second sleeves are respectively close to the two ends of the second sealing plate, and the free end of the second sleeve is slidably inserted with a push rod, and the end of the push rod located in the second sleeve is fixedly connected to a fifth spring, and the end of the fifth spring away from the push rod is fixedly connected to the inner wall of the corresponding end of the second sleeve, and the sum of the elastic forces of the two fifth springs is greater than the sum of the maximum elastic forces of multiple second springs, and a first electric push rod is arranged between the two second sleeves, the first electric push rod is vertically fixedly connected to the second sealing plate, and the first electric push rod and the end of the push rod away from the second sealing plate are both fixedly connected to the second fixing plate, and the top and bottom of the second fixing plate are respectively fixedly connected to the top and bottom inner walls of the guide pipe.

[0010] Furthermore, the clamping assembly includes a U-shaped frame, a second electric push rod is vertically fixedly connected to the inner side of the top of the U-shaped frame, a pressure plate is horizontally fixedly connected to the bottom of the second electric push rod, two positioning rods are vertically fixedly connected to the top of the pressure plate, and the top end of the positioning rods vertically slides through and is inserted into the top of the U-shaped frame.

[0011] Furthermore, a base is provided at the bottom of the packaging box, and the bottoms of both ends of the first telescopic rod, the second telescopic rod, the third telescopic rod and the U-shaped frame are vertically fixedly connected to the top of the base.

[0012] Furthermore, a plurality of elastic plates are vertically fixedly connected to the bottom of the second piston plate, a plurality of strip-shaped protrusions are horizontally fixedly connected to one side of the elastic plate, and the plurality of strip-shaped protrusions are evenly distributed from top to bottom, a fixing rod is vertically arranged on one side of the elastic plate close to the strip-shaped protrusions, the bottom end of the fixing rod is vertically fixedly connected to the bottom inner wall of the packaging box, a knocking ball is fixedly connected to the top end of the fixing rod, the knocking ball can contact the strip-shaped protrusions, and the diameter of the knocking ball is smaller than the distance between two adjacent strip-shaped protrusions.

[0013] Furthermore, the diameter of the flow guide tube gradually increases in the direction away from the through hole, the bottom inner wall of the flow guide tube is inclined downward, and when the fifth spring is fully contracted, the second sealing plate can enter the flow guide tube.

[0014] Furthermore, the volume of the rubber storage tube is larger than the volume of the space from the top of the second piston plate to the top of the packaging box in the initial state.

[0015] Furthermore, ultraviolet lamps are evenly installed on the inner wall of the bottom of the packaging box, and the second piston plate is made of transparent material.

[0016] Furthermore, a filter screen is arranged in the conduit, and the filter screen is close to the bottom opening of the conduit.

[0017] Technical effects and advantages of the present invention:

[0018] 1. In the process of chip packaging, the present invention can add the epoxy resin in the glue storage tube into the packaging box, thereby squeezing the epoxy resin containing bubbles out of the packaging box, thereby ensuring the reliability of the epoxy resin protecting the chip after drying. In addition, in the process of gradual curing of the epoxy resin, when the volume of the epoxy resin decreases due to curing, the epoxy resin in the glue storage tube can be automatically added into the packaging box, thereby ensuring the packaging effect of the epoxy resin on the chip;

[0019] 2. When the second piston plate gradually moves downward under the extrusion of the epoxy resin, the multiple strip-shaped protrusions on the elastic plate can contact and collide with the knocking ball on the top of the fixed rod in turn and generate vibrations. Then, the epoxy resin on the top of the second piston plate can be continuously vibrated, so that the air in the epoxy resin can continuously float upward and stick to the bottom of the chip. Then, when the epoxy resin in the glue storage tube is added to the packaging box, the epoxy resin containing bubbles can be quickly discharged from the packaging box from the through hole opposite to the second sealing plate, thereby ensuring the reliability of the epoxy resin in protecting the chip after drying. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a three-dimensional schematic diagram of all structures except the base and the pressing assembly in the present invention;

[0022] Figure 3 It is a schematic diagram of the internal structure of the packaging box in the present invention;

[0023] Figure 4 is a three-dimensional cross-sectional view of the packaging box of the present invention;

[0024] Figure 5 It is a three-dimensional schematic diagram of the second piston plate, the elastic plate and the strip-shaped protrusion in the present invention;

[0025] Figure 6 is a three-dimensional schematic diagram of the second sealing component in the present invention;

[0026] Figure 7 is a three-dimensional schematic diagram of the first sealing component in the present invention;

[0027] Figure 8 It is a three-dimensional schematic diagram of the conduit and the filter screen in the present invention.

[0028] In the figure: 1, packaging box; 2, glue storage tube; 3, first piston plate; 4, glue inlet tube; 5, first telescopic rod; 6, first spring; 7, glue inlet hole; 8, catheter; 9, guide tube; 10, second piston plate; 11, limit rod; 12, second telescopic rod; 13, second spring; 14, chip; 15, third telescopic rod; 16, third spring; 17, annular sealing gasket; 18, exhaust valve; 19, first sealing plate; 20, pull rod; 21, first set Tube; 22, first fixed plate; 23, pressure plate; 24, fourth spring; 25, second sealing plate; 26, second sleeve; 27, push rod; 28, fifth spring; 29, first electric push rod; 30, second fixed plate; 31, U-shaped frame; 32, second electric push rod; 33, pressure plate; 34, positioning rod; 35, base; 36, elastic plate; 37, strip-shaped protrusion; 38, fixed rod; 39, knocking ball; 40, ultraviolet lamp; 41, filter. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0030] The present invention provides Figures 1 to 8An integrated circuit chip packaging device shown in the figure comprises a packaging box 1, the top of the packaging box 1 is designed to be open, a glue storage tube 2 is connected to a side position of the bottom of the packaging box 1, a first piston plate 3 is arranged in the glue storage tube 2, a glue feed tube 4 is inserted through the bottom of the first piston plate 3, a first telescopic rod 5 is vertically fixedly connected to the bottom of the first piston plate 3, and a first spring 6 is sleeved on the first telescopic rod 5, a glue feed hole 7 is opened on one side of the packaging box 1 close to the glue storage tube 2, and the glue feed hole 7 is connected to the top of the glue storage tube 2, through holes matching the internal length of the packaging box 1 are opened near the top of both sides of the packaging box 1, a conduit 8 is connected between the glue feed hole 7 and the through hole at the top, and a first sealing component is arranged in the through hole at the top of the glue feed hole 7, a guide tube 9 is connected to the external opening of the other through hole, and a second sealing component is arranged in the guide tube 9, a second piston plate 10 is horizontally arranged in the packaging box 1, and the second piston plate A plurality of limiting rods 11 are vertically fixedly connected to the bottom of the packaging box 10, and the bottom ends of the limiting rods 11 are vertically penetrated and inserted into the bottom of the packaging box 1, and the bottom ends of the limiting rods 11 are connected to the second telescopic rod 12, and the second telescopic rod 12 is sleeved with a second spring 13, a chip 14 to be packaged is placed at the top opening of the packaging box 1, and a clamping assembly is arranged on the top of the chip 14, and a vertical third telescopic rod 15 is symmetrically installed on the front and rear sides of the packaging box 1, and the third telescopic rod 15 is sleeved with a third spring 16, and a matching annular sealing gasket 17 is fixedly connected to the top of the packaging box 1, and an exhaust valve 18 is installed at the bottom of the packaging box 1, the diameter of the guide tube 9 gradually increases in the direction away from the through hole, the bottom inner wall of the guide tube 9 is inclined downward, and when the fifth spring 28 is fully contracted, the second sealing plate 25 can enter the guide tube 9, and the volume of the rubber storage tube 2 is greater than the volume of the space from the top of the second piston plate 10 to the top of the packaging box 1 in the initial state;

[0031] The clamping assembly includes a U-shaped frame 31, a second electric push rod 32 is vertically fixedly connected to the inner side of the top of the U-shaped frame 31, a pressing plate 33 is horizontally fixedly connected to the bottom of the second electric push rod 32, two positioning rods 34 are vertically fixedly connected to the top of the pressing plate 33, the top of the positioning rod 34 vertically slides through and is plugged into the top of the U-shaped frame 31, a base 35 is provided at the bottom of the packaging box 1, and the first telescopic rod 5, the second telescopic rod 12, the third telescopic rod 15 and the bottoms of both ends of the U-shaped frame 31 are vertically fixedly connected to the top of the base 35;

[0032] When packaging the chip 14, the chip 14 is placed upside down on the top of the packaging box 1, so that the substrate of the chip 14 is kept in contact with the annular sealing gasket 17 on the top of the packaging box 1, and the chip 14 is opposite to the inside of the packaging box 1. Then, the second electric push rod 32 is started to drive the pressing plate 33 to gradually move downward and press on the top of the chip 14 substrate, thereby achieving the fixing and pressing operation of the chip 14.

[0033] Then, epoxy resin is injected into the glue inlet hole 7 through the glue inlet pipe 4, and then the epoxy resin can enter the conduit 8. As the conduit 8 is gradually filled with epoxy resin, the epoxy resin can push open the first sealing component and enter the packaging box 1. As the space on the top of the second piston plate 10 is gradually filled, the epoxy resin can press the second piston plate 10 downward, so that the second telescopic rod 12 and the second spring 13 are gradually compressed. During this process, the second sealing component is in a locked state. When the epoxy resin injection operation is completed in the packaging box 1, the second sealing component is unlocked. At this time, as the second electric push rod 32 continues to extend, the packaging box 1 can be pressed downward. At this time, the first telescopic rod 5, the second telescopic rod 12, The third telescopic rod 15 and the corresponding first spring 6, second spring 13, and third spring 16 are gradually compressed, and as the first spring 6 is compressed, the reaction force of the first spring 6 on the first piston plate 3 can push the first piston plate 3 downward, so that the epoxy resin in the glue storage tube 2 can be squeezed into the packaging box 1 through the conduit 8, and then the epoxy resin entering the packaging box 1 can push the epoxy resin containing bubbles at the bottom of the chip 14 to move in the direction of the second sealing component, and then the epoxy resin containing bubbles can push open the second sealing component and flow out of the packaging box 1, thereby avoiding the epoxy resin containing air remaining in the packaging box 1, thereby ensuring the reliability of the epoxy resin protecting the chip 14 after drying;

[0034] In addition, during the gradual solidification of the epoxy resin in the packaging box 1, the volume of the epoxy resin will gradually decrease, thereby reducing the volume of the chip 14 protective shell after packaging. However, due to the presence of the glue storage tube 2, when the volume of the epoxy resin decreases, since the first spring 6 is always in a compressed state, the first spring 6 can automatically push the first piston plate 3 upward, so that the epoxy resin in the glue storage tube 2 can be automatically replenished into the packaging box 1, thereby ensuring the packaging effect of the epoxy resin on the chip 14;

[0035] When packaging is completed, as the second electric push rod 32 returns upward, the pressing plate 33 gradually separates from the chip 14 , and the packaged chip 14 can be taken out of the packaging box 1 .

[0036] like Figure 4 and Figure 7As shown, the first sealing assembly includes a first sealing plate 19, the size of the first sealing plate 19 matches the opening size of the through hole, and in the initial state, the side of the first sealing plate 19 away from the conduit 8 is flush with the inner wall of the corresponding side of the packaging box 1, and the side of the first sealing plate 19 close to the conduit 8 is vertically fixedly connected with a plurality of tie rods 20, and the free sliding sleeve of the tie rod 20 is connected with a first sleeve 21, and the end of the first sleeve 21 away from the tie rod 20 is fixedly connected with a first fixing plate 22, and the top and bottom ends of the first fixing plate 22 are respectively fixedly connected to the top and bottom inner walls of the through hole, and the end of the tie rod 20 located in the first sleeve 21 is fixedly connected with a pressure plate 23, and the side of the pressure plate 23 close to the first sealing plate 19 is connected with a fourth spring 24, and the fourth spring 24 is sleeved on the tie rod 20;

[0037] When the epoxy resin enters the conduit 8 through the glue storage tube 2, as the conduit 8 is filled, the epoxy resin can push the first sealing plate 19 to move toward the inside of the packaging box 1, and as the first sealing plate 19 moves, the first sealing plate 19 can pull the pressure plate 23 through the pull rod 20, so that the fourth spring 24 is gradually compressed, and as the first sealing plate 19 continues to move, when the first sealing plate 19 enters the packaging box 1, the through hole opposite to the first sealing plate 19 can be opened, and the epoxy resin in the conduit 8 can smoothly enter the packaging box 1 at this time, and when the injection operation of the epoxy resin in the packaging box 1 is completed, the first sealing plate 19 can re-close the corresponding through hole under the action of the fourth spring 24, thereby ensuring the flatness of both sides of the shell formed by the epoxy resin after curing.

[0038] like Figure 4 and Figure 6As shown, the second sealing assembly includes a second sealing plate 25, the size of the second sealing plate 25 matches the opening size of the through hole, and in the initial state, the side of the second sealing plate 25 close to the first sealing plate 19 is flush with the inner wall of the corresponding side of the packaging box 1, and the side of the second sealing plate 25 away from the first sealing plate 19 is vertically fixedly connected with two second sleeves 26, and the two second sleeves 26 are respectively close to the two ends of the second sealing plate 25, and the free end of the second sleeve 26 is slidably inserted with a push rod 27, and the end of the push rod 27 located in the second sleeve 26 is fixedly connected with a fifth spring 28, one end of the fifth spring 28 away from the push rod 27 is fixedly connected to the inner wall of the corresponding end of the second sleeve 26, and the sum of the elastic forces of the two fifth springs 28 is greater than the sum of the maximum elastic forces of the plurality of second springs 13, a first electric push rod 29 is arranged between the two second sleeves 26, the first electric push rod 29 is vertically fixedly connected to the second sealing plate 25, the first electric push rod 29 and the end of the push rod 27 away from the second sealing plate 25 are fixedly connected to the second fixing plate 30, the top and bottom of the second fixing plate 30 are respectively fixedly connected to the top and bottom inner walls of the guide tube 9;

[0039] In the initial state, the first electric push rod 29 is in an extended state, so that it can restrict the second sealing plate 25. Then, when the epoxy resin in the conduit 8 pushes the first sealing plate 19 to enter the packaging box 1, the top space of the second sealing plate 25 is gradually filled with the epoxy resin. At this time, as the epoxy resin continues to be injected, the epoxy resin can squeeze the second piston plate 10 downward. At this time, the air in the bottom space of the second piston plate 10 can be discharged from the packaging box 1 through the exhaust valve 18, and the second telescopic rod 12 and the second spring 13 are gradually compressed. When the epoxy resin completes the injection operation into the packaging box 1, the first electric push rod 29 is closed, thereby releasing the restriction on the second sealing plate 25. However, since the sum of the elastic forces of the two fifth springs 28 is greater than the sum of the maximum elastic forces of the plurality of second springs 13, the second sealing plate 25 can be , the through hole is kept closed under the action of the second electric push rod 32. At this time, as the second electric push rod 32 continues to extend, the epoxy resin originally located in the glue storage tube 2 can flow into the conduit 8 under the extrusion of the first piston plate 3. Then, the epoxy resin entering the packaging box 1 through the conduit 8 can push the second sealing plate 25 to move it into the guide tube 9. As the second sealing plate 25 moves, the fifth spring 28 is gradually squeezed by the push rod 27. When the second sealing plate 25 enters the guide tube 9, the through hole is gradually opened. At this time, the epoxy resin added from the conduit 8 can gradually fill the space at the bottom of the chip 14. The air remaining in the space at the bottom of the chip 14 can be discharged from the through hole at the second sealing plate 25 along with the epoxy resin, thereby reducing the air content in the epoxy resin, thereby ensuring the reliability of the epoxy resin protecting the chip 14 after drying;

[0040] When the epoxy resin in the glue storage tube 2 is fully replenished, the first sealing plate 19 and the second sealing plate 25 can re-seal the corresponding through holes under the action of the fourth spring 24 and the fifth spring 28, thereby ensuring the flatness of both sides of the shell formed by the cured epoxy resin.

[0041] like Figures 3 to 5 As shown, a plurality of elastic plates 36 are vertically fixedly connected to the bottom of the second piston plate 10, a plurality of strip-shaped protrusions 37 are horizontally fixedly connected to one side of the elastic plate 36, and the plurality of strip-shaped protrusions 37 are evenly distributed from top to bottom, a fixing rod 38 is vertically arranged on one side of the elastic plate 36 close to the strip-shaped protrusions 37, the bottom end of the fixing rod 38 is vertically fixedly connected to the bottom inner wall of the packaging box 1, a knocking ball 39 is fixedly connected to the top end of the fixing rod 38, the knocking ball 39 can contact the strip-shaped protrusions 37, and the diameter of the knocking ball 39 is smaller than the distance between two adjacent strip-shaped protrusions 37;

[0042] By arranging an elastic plate 36 at the bottom of the second piston plate 10, when the second piston plate 10 gradually moves downward under the extrusion of the epoxy resin, the multiple strip protrusions 37 on the elastic plate 36 can contact and collide with the knocking ball 39 on the top of the fixing rod 38 in turn, and as the strip protrusions 37 on the elastic plate 36 continuously hit the knocking ball 39, the vibration generated can be continuously transmitted to the second piston plate 10 through the elastic plate 36. At this time, the epoxy resin located on the top of the second piston plate 10 can be continuously vibrated, so that the air in the epoxy resin can continuously float upward and stick to the bottom of the chip 14. When the epoxy resin injection operation is completed, the first electric push rod 29 is closed, and the chip 14 is ejected from the first electric push rod 29. The restriction on the second sealing plate 25 is released. At this time, as the second electric push rod 32 continues to extend, the epoxy resin originally located in the glue storage tube 2 can flow into the conduit 8 under the squeezing of the first piston plate 3, and then the epoxy resin entering the conduit 8 can push open the first sealing plate 19 and enter the packaging box 1 in the horizontal direction, and then the epoxy resin entering the packaging box 1 can push the epoxy resin containing bubbles to move in the direction of the second sealing plate 25, and then the epoxy resin containing bubbles can push open the second sealing plate 25 and flow out of the packaging box 1, thereby avoiding the epoxy resin containing air remaining in the packaging box 1, thereby ensuring the reliability of the epoxy resin protecting the chip 14 after drying.

[0043] like Figure 3 and Figure 4 As shown, ultraviolet lamps 40 are evenly installed on the bottom inner wall of the packaging box 1, and the second piston plate 10 is made of transparent material;

[0044] By providing the ultraviolet lamp 40 , when the epoxy resin fills the top of the second piston plate 10 and is bonded to the chip 14 , as the ultraviolet lamp 40 is turned on, the ultraviolet lamp 40 can accelerate the curing of the epoxy resin, thereby improving the packaging efficiency of the epoxy resin for the chip 14 .

[0045] like Figure 8 As shown, a filter screen 41 is disposed in the conduit 8, and the filter screen 41 is close to the bottom opening of the conduit 8;

[0046] By providing the filter 41, when the epoxy resin enters the packaging box 1 through the conduit 8, the filter 41 can filter the epoxy resin, thereby preventing impurities from entering the packaging box 1 and forming a passivation layer inside the dried epoxy resin, thereby ensuring the reliability of the dried epoxy resin in protecting the chip 14.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. An integrated circuit chip packaging device, comprising a packaging box (1), characterized in that: The top of the packaging box (1) is designed to be open. A rubber storage tube (2) is connected to one side of the bottom of the packaging box (1). A first piston plate (3) is arranged in the rubber storage tube (2). A rubber inlet tube (4) is inserted through the bottom of the first piston plate (3). A first telescopic rod (5) is vertically fixedly connected to the bottom of the first piston plate (3), and a first spring (6) is sleeved on the first telescopic rod (5). A rubber inlet hole (7) is provided on one side of the packaging box (1) close to the rubber storage tube (2), and the rubber inlet hole (7) is connected to the top of the rubber storage tube (2). Through holes matching the internal length of the packaging box (1) are provided at positions close to the top of both sides of the packaging box (1). A conduit (8) is connected between the rubber inlet hole (7) and the through hole at the top thereof. A first sealing component is arranged in the through hole at the top of the rubber inlet hole (7). A guide tube (9) is connected to the external opening of the other through hole. , and a second sealing assembly is arranged in the guide tube (9); a second piston plate (10) is horizontally arranged in the packaging box (1); a plurality of limit rods (11) are vertically fixedly connected to the bottom of the second piston plate (10); the bottom ends of the limit rods (11) vertically penetrate and are inserted into the bottom of the packaging box (1); the bottom ends of the limit rods (11) are connected to second telescopic rods (12), and a second spring (13) is sleeved on the second telescopic rod (12); a chip (14) to be packaged is placed at the top opening of the packaging box (1), and a pressing assembly is arranged on the top of the chip (14); vertical third telescopic rods (15) are symmetrically installed on the front and rear sides of the packaging box (1), and a third spring (16) is sleeved on the third telescopic rods (15); a matching annular sealing gasket (17) is fixedly connected to the top of the packaging box (1); and an exhaust valve (18) is installed at the bottom of the packaging box (1).

2. The integrated circuit chip packaging device according to claim 1, characterized in that: The first sealing assembly comprises a first sealing plate (19), the size of the first sealing plate (19) matches the size of the opening of the through hole, and in an initial state, the side of the first sealing plate (19) away from the conduit (8) is flush with the inner wall of the corresponding side of the packaging box (1), and the side of the first sealing plate (19) close to the conduit (8) is vertically fixedly connected to a plurality of tie rods (20), the free sliding sleeve of the tie rod (20) is connected to a first sleeve (21), the end of the first sleeve (21) away from the tie rod (20) is fixedly connected to a first fixing plate (22), the top and bottom ends of the first fixing plate (22) are respectively fixedly connected to the top and bottom inner walls of the through hole, and the end of the tie rod (20) located in the first sleeve (21) is fixedly connected to a pressure plate (23), and the side of the pressure plate (23) close to the first sealing plate (19) is connected to a fourth spring (24), and the fourth spring (24) is sleeved on the tie rod (20).

3. The integrated circuit chip packaging device according to claim 2, characterized in that: The second sealing assembly comprises a second sealing plate (25), the size of the second sealing plate (25) matches the size of the opening of the through hole, and in an initial state, a side of the second sealing plate (25) close to the first sealing plate (19) is flush with the inner wall of a corresponding side of the packaging box (1), and a side of the second sealing plate (25) away from the first sealing plate (19) is vertically fixedly connected to two second sleeves (26), and the two second sleeves (26) are respectively close to two ends of the second sealing plate (25), and a push rod (27) is slidably inserted at the free end of the second sleeve (26), and one end of the push rod (27) located in the second sleeve (26) is fixedly connected to a fifth spring (28) ), one end of the fifth spring (28) away from the push rod (27) is fixedly connected to the inner wall of the corresponding end of the second sleeve (26), and the sum of the elastic forces of the two fifth springs (28) is greater than the sum of the maximum elastic forces of the plurality of second springs (13), a first electric push rod (29) is arranged between the two second sleeves (26), the first electric push rod (29) is vertically fixedly connected to the second sealing plate (25), the first electric push rod (29) and the end of the push rod (27) away from the second sealing plate (25) are both fixedly connected to the second fixing plate (30), and the top and bottom of the second fixing plate (30) are respectively fixedly connected to the top and bottom inner walls of the guide tube (9).

4. The integrated circuit chip packaging device according to claim 3, characterized in that: The clamping assembly comprises a U-shaped frame (31), a second electric push rod (32) is vertically fixedly connected to the inner side of the top of the U-shaped frame (31), a pressing plate (33) is horizontally fixedly connected to the bottom of the second electric push rod (32), two positioning rods (34) are vertically fixedly connected to the top of the pressing plate (33), and the top ends of the positioning rods (34) are vertically slidably penetrated and inserted into the top of the U-shaped frame (31).

5. The integrated circuit chip packaging device according to claim 4, characterized in that: A base (35) is provided at the bottom of the packaging box (1), and the bottoms of both ends of the first telescopic rod (5), the second telescopic rod (12), the third telescopic rod (15) and the U-shaped frame (31) are vertically fixedly connected to the top of the base (35).

6. The integrated circuit chip packaging device according to claim 5, characterized in that: A plurality of elastic plates (36) are vertically fixedly connected to the bottom of the second piston plate (10), a plurality of strip-shaped protrusions (37) are horizontally fixedly connected to one side of the elastic plate (36), and the plurality of strip-shaped protrusions (37) are evenly distributed from top to bottom, a fixing rod (38) is vertically arranged on one side of the elastic plate (36) close to the strip-shaped protrusions (37), the bottom end of the fixing rod (38) is vertically fixedly connected to the bottom inner wall of the packaging box (1), and a knocking ball (39) is fixedly connected to the top end of the fixing rod (38), the knocking ball (39) is capable of contacting the strip-shaped protrusions (37), and the diameter of the knocking ball (39) is smaller than the distance between two adjacent strip-shaped protrusions (37).

7. The integrated circuit chip packaging device according to claim 6, characterized in that: The diameter of the flow guide tube (9) gradually increases in a direction away from the through hole, the bottom inner wall of the flow guide tube (9) is inclined downward, and when the fifth spring (28) is fully contracted, the second sealing plate (25) can enter the flow guide tube (9).

8. The integrated circuit chip packaging device according to claim 7, characterized in that: The volume of the rubber storage tube (2) is greater than the volume of the space from the top of the second piston plate (10) to the top of the packaging box (1) in the initial state.

9. The integrated circuit chip packaging device according to claim 8, characterized in that: Ultraviolet lamps (40) are evenly mounted on the inner wall of the bottom of the packaging box (1), and the second piston plate (10) is made of a transparent material.

10. The integrated circuit chip packaging device according to claim 9, characterized in that: A filter screen (41) is arranged in the conduit (8), and the filter screen (41) is close to the bottom opening of the conduit (8).

Images