Laser drilling and in-situ measuring device and using method thereof

Abstract

According to the laser drilling and in-situ measuring device and the using method thereof, during laser drilling, machining laser is focused through the long-focal-length focusing lens for the first time and then transmitted to the short-focal-length focusing lens for the second time through the three-dimensional scanning galvanometer to form smaller light spot machining laser; the smaller light spot machining laser ablates and removes the material of the part on the part through a machining moving path formed by the three-dimensional scanning galvanometer to form a small hole; when laser measurement is carried out, the integrated nozzle is removed, measurement laser is conducted to the small hole through the three-dimensional scanning galvanometer after being focused by the long-focal-length focusing lens for one time, acts on the small hole in a full covering mode through a measurement scanning graph formed by the three-dimensional scanning galvanometer and is reflected back to the optical coherence tomography measuring instrument through the second dichroscope. And performing interference imaging with reference laser of an optical coherence tomography measuring instrument to obtain the three-dimensional shape size of the small hole. According to the invention, in-situ measurement after laser drilling can be realized, and the operation is convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of laser hole making, and more specifically to a laser hole making and in-situ measurement device and a use method thereof. Background Art

[0002] Realizing the online measurement of the three-dimensional morphology and aperture of complexly distributed small holes in laser processing space has always been a technical challenge in the industry. In order to realize the online measurement of the three-dimensional morphology and size of complexly distributed air film holes on ultrafast laser processed blades, it is generally achieved through optical coherence tomography (OCT) technology. In the prior art, the existing ultrafast laser processing head and the OCT measurement device are arranged separately on the equipment. The OCT measurement device needs to be repeatedly translated and aligned, which is inconvenient to operate. In addition, the two sets of devices are arranged in parallel, occupying a large space, the Z-axis mechanism is large in size, and the workpiece translation movement mechanism is required to have a large stroke, which is not suitable for the miniaturization and compact design requirements of small-size workpiece laser hole making equipment. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] The technical problem to be solved by the present invention is that the existing ultrafast laser processing head and the OCT measuring device are separately arranged, which requires repeated translation and alignment, is inconvenient to operate, and does not meet the existing measurement requirements of small-sized workpieces.

[0005] (II) Technical solution

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] In a first aspect, the present invention provides a method comprising a first laser source, a first dichroic mirror, a second laser source, an optical coherence tomography measuring instrument, a second dichroic mirror, a long focal length focusing lens, a three-dimensional scanning galvanometer and an integrated nozzle, wherein the first laser source is used to output a processing laser, the second laser source is used to output a measuring laser, the second dichroic mirror is used to transmit the processing laser and reflect the measuring laser so that the processing laser and the measuring laser are output coaxially; a short focal length focusing lens is installed in the integrated nozzle, and when laser hole making is performed, the processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens by the three-dimensional scanning galvanometer, the The short focal length focusing lens focuses the processing laser twice to form a processing laser with a smaller spot, and the processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part to form a small hole; when performing laser measurement, the integrated nozzle is removed, and the measuring laser is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer, and the measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror, and the three-dimensional morphology size of the small hole is obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

[0008] Preferably, the focal length of the long focal length focusing lens is 400 mm.

[0009] Preferably, the focal length of the short focal length focusing lens can be selected within the range of 100 mm to 200 mm.

[0010] Preferably, a camera is also included. When laser hole making is performed, the first dichroic mirror can reflect the visible light generated in the processing area to the camera to realize video dynamic monitoring of the small hole processing process.

[0011] Preferably, it also includes a multi-optical wedge rotating mechanism, which is arranged on the optical path of the processing laser and is used to rotate the processing laser off-axis and emit it at a certain angle inclined to the rotation axis.

[0012] Preferably, the laser hole making and in-situ measuring device is mounted on a Z-direction slide, and the Z-direction slide can move along the Z direction to adjust the focal position of the processing laser and the measuring laser acting on the part.

[0013] Preferably, it also includes a mounting bracket and an adjustment mechanism, wherein the mounting bracket is used to mount and fix the integrated nozzle, the adjustment mechanism connects the mounting bracket and the Z-direction slide, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle.

[0014] In a second aspect, the present invention further provides a method for using the laser hole making and in-situ measurement device described in any one of the above technical solutions, comprising the following steps:

[0015] Laser hole making process: start the first laser source, the first laser source outputs processing laser, the processing laser is focused once by the long focal length focusing lens, and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer for secondary focusing to form a processing laser with a smaller spot, and the processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part to form a small hole;

[0016] Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle is removed, and the second laser source is started. The second laser source outputs a measuring laser, which is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measuring scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror, and the three-dimensional shape size of the small hole is obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

[0017] In a third aspect, the present invention further provides a method for using a laser hole making and in-situ measurement device, comprising the following steps:

[0018] The first laser source is started, and the first laser source outputs a processing laser. The multi-optical wedge rotating mechanism rotates the processing laser off-axis and emits it at a certain angle inclined to the rotating axis to form a deflected processing laser. The deflected processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer. The short focal length focusing lens focuses the deflected processing laser twice to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part, so as to form a positive conical hole, an inverted conical hole, or a non-conical hole on the part.

[0019] (III) Beneficial effects

[0020] The above technical solution of the present invention has at least the following advantages:

[0021] 1. In the present invention, both the processing laser and the measuring laser are focused by the same long focal length focusing lens. After the measuring laser is focused by the long focal length focusing lens, it can form a measuring laser with a large focal depth, so as to achieve the measurement of a deeper position of the small hole. After the processing laser is focused by the long focal length focusing lens, it is refocused by the short focal length focusing lens. The focal position of the processing laser after the second focusing is consistent with the focal position of the measuring laser focused by the long focal length focusing lens alone, which can solve the problem of a large light spot and insufficient energy density of the processing laser after being focused by the long focal length focusing lens.

[0022] 2. In the present invention, the processing laser is focused twice by a long focal length focusing lens and a short focal length focusing lens to form a processing laser with a smaller spot size. A short focal length focusing lens with a small aperture is selected, and a small-diameter nozzle is selected to form an integrated structure in combination with the short focal length focusing lens. The protective glass is eliminated, thereby realizing the miniaturization of the overall structure of the nozzle, thereby facilitating hole-making operations in a narrow space.

[0023] 3. In the present invention, the integrated structure formed by the short focal length focusing lens and the nozzle (i.e., the integrated nozzle) can be quickly and accurately positioned and installed. After the hole making of the part is completed, the short focal length focusing lens can be quickly removed, and the measurement function of the morphology and size of the small hole can be realized, thereby realizing the in-situ measurement of the processed small hole. There is no need to move the parts and perform measurement and alignment operations, which simplifies the operation process and improves the detection accuracy.

[0024] 4. In the present invention, the processing laser and the measuring laser share a three-dimensional scanning galvanometer. The processing laser cooperates with the three-dimensional scanning galvanometer through a multi-optical wedge rotation mechanism and a three-dimensional scanning galvanometer to realize the processing of the cylindrical segment and the diffusion segment of the special-shaped hole. The measuring laser is deflected by the three-dimensional scanning galvanometer to realize the measurement of various positions of the small holes on the parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a schematic structural diagram of a laser hole making and in-situ measurement device provided in an embodiment of the present invention.

[0027] Figure 2 It is a schematic diagram of the implementation principle of the multi-optical wedge rotation mechanism provided in an embodiment of the present invention.

[0028] Figure 3 It is a schematic structural diagram of a long focal length focusing lens provided by an embodiment of the present invention.

[0029] Figure 4 It is a schematic diagram of the structure of the special-shaped hole provided in an embodiment of the present invention.

[0030] Figure 5 It is a schematic structural diagram of an integrated nozzle provided in an embodiment of the present invention.

[0031] Figure 6 It is the three-dimensional morphology of the straight circular hole and the irregular-shaped hole obtained by fitting the point cloud data obtained by OCT provided in the embodiment of the present invention.

[0032] Figure 7 It is a numerical schematic diagram of the hole depth obtained by the data processing software provided in the embodiment of the present invention.

[0033] Figure 8 It is a numerical schematic diagram of the hole entrance obtained by data processing software provided in an embodiment of the present invention.

[0034] Fig. 9 It is a numerical schematic diagram of the hole outlet obtained by data processing software provided in an embodiment of the present invention.

[0035] The reference numerals in the figures are:

[0036] 1. First dichroic mirror; 2. Second dichroic mirror; 3. Long focal length focusing lens; 4. Short focal length focusing lens; 5. Camera; 6. Processing laser; 7. Measuring laser; 8. Parts; 9. Multi-optical wedge rotation mechanism; 10. Three-dimensional scanning galvanometer; 11. Optical path adjustment structure; 12. Z-axis slide; 13. Integrated nozzle; 14. Workbench; 15. Guide rail; 17. Colored light; 81. Diffusive hole section; 82. Circular hole section; 131. Shielding gas outlet. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly located on the other element or indirectly located on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0039] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, and do not indicate that a device or element must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or indicating the number of technical features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The specific implementation of the present invention is described in more detail below in conjunction with specific embodiments:

[0041] like Figure 1The embodiment of the present invention provides a laser hole making and in-situ measurement device, including a first laser source (not shown), a first dichroic mirror 1, a second laser source (not shown), an optical coherence tomography measuring instrument (not shown), a second dichroic mirror 2, a long focal length focusing lens 3, a three-dimensional scanning galvanometer 10 and an integrated nozzle 13. The first laser source is used to output a processing laser 6, and the second laser source is used to output a measuring laser 7. The second dichroic mirror 2 is used to transmit the processing laser 6 and reflect the measuring laser 7 so that the processing laser 6 and the measuring laser 7 are output coaxially. A short focal length focusing lens 4 is installed in the integrated nozzle 13. When laser hole making is performed, the processing laser 6 is focused once by the long focal length focusing lens 3 and then passes through the three-dimensional scanning galvanometer 10. The scanning galvanometer 10 transmits the laser to the short focal length focusing lens 4, which refocuses the processing laser to form a smaller spot processing laser. The smaller spot processing laser ablates and removes the material of the part 8 through the processing moving path formed by the three-dimensional scanning galvanometer 10 on the part 8 to form a small hole. When performing laser measurement, the integrated nozzle 13 is removed, and the measuring laser 7 is only focused once by the long focal length focusing lens 3 and then transmitted to the small hole through the three-dimensional scanning galvanometer 10, and the measurement scanning pattern formed by the three-dimensional scanning galvanometer 10 fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror 2, and the three-dimensional shape size of the small hole is obtained by interfering imaging with the reference laser of the optical coherence tomography measuring instrument. Further, the laser hole making and in-situ measurement device also includes an optical path adjustment structure 11, and the processing laser 6 is vertically injected into the optical path adjustment structure 11. The optical path adjustment structure 11 deflects the processing laser 6, thereby making the optical path of the processing laser 6 coaxial with the optical path of the measuring laser 7. Specifically, the optical path adjustment structure 11 can be a 45° reflector. More specifically, the first dichroic mirror 1 and the second dichroic mirror 2 are both 45° dichroic mirrors, and the second dichroic mirror 2 can transmit the processing laser 6 and reflect the measuring laser 7, so that the optical path of the processing laser 6 is coaxial with the optical path of the measuring laser 7. The processing laser 6 uses a high-power laser with a wavelength of 1064nm, and the measuring laser uses a low-power laser with a wavelength of 800nm.

[0042] Specifically, since the laser spot of the processing laser 6 is already small after being focused by the long focal length focusing lens 3, even if the multi-optical wedge rotating mechanism 9 is used to rotate the laser off-axis, the required aperture is not large. The diameter or aperture of the short focal length focusing lens 4 can be very small, and a small focusing lens with a diameter of 20 mm or even 10 mm can be selected. The diameter of the corresponding integrated nozzle 13 can be made thinner and longer, so that the integrated nozzle 13 can be inserted into a relatively narrow space for hole making operations, and the problem of spatial interference at the front end of the processing head is small. Also, since ultrafast laser processing has less molten material splashing, the integrated nozzle 13 can be combined with the short focal length focusing lens 4 to form a Figure 5 The integrated airtight structure shown eliminates the protective glass that is usually installed at the lower end of the focusing lens.

[0043] Furthermore, the three-dimensional scanning galvanometer 10 can cooperate with the measuring laser 7 to generate a scanning measurement path of the measuring laser 7 according to the measurement requirements, and can also cooperate with the processing laser 6 to generate a hole-making path of the processing laser 6 according to the hole-making requirements, and can process round holes or special-shaped holes. Figure 4 As shown in the figure, it is a schematic diagram of the structure of a special-shaped hole, which includes a circular hole segment 82 and a diffusion hole segment 81 connected to each other. Since there is an obvious taper when processing a deeper circular hole through the three-dimensional scanning galvanometer 10, in order to avoid the taper, a multi-light wedge rotation mechanism 9 can be used to generate the processed circular hole segment 82. The lens of the three-dimensional scanning galvanometer 10 only serves as a reflector. After processing the circular hole segment 82, the three-dimensional scanning galvanometer 10 is used to scan and process the diffusion hole segment 81.

[0044] In one embodiment, the focal length of the long focal length focusing lens 3 is 400 mm. Figure 3 As shown, the long focal length focusing lens 3 can be selected as a combination lens with adjustable focus. The long focal length focusing lens 3 includes a concave lens 31 and a convex lens 32. By adjusting the distance between the concave lens 31 and the convex lens 32, the focal position of the measuring laser 7 after focusing can be adjusted. Due to the addition of the multi-optical wedge rotating mechanism 9, a larger aperture is required after the spot is rotated. The diameter of the long focal length focusing lens 3 is usually selected to be 50 mm or larger to ensure that the aperture is greater than 40 mm. The apertures of the first dichroic mirror 1, the second dichroic mirror 2 and the optical path adjustment structure 11 should also be greater than 40 mm.

[0045] In one embodiment, the focal length of the short focal length focusing lens 4 can be selected within the range of 100 mm to 200 mm. In order to obtain the three-dimensional morphology of the small hole with sufficient depth, it is necessary to increase the imaging focal depth of the measuring laser 7. For this purpose, a long focal length focusing lens 3 with a focal length of 400 mm is selected; and the actual pulse energy of the processing laser 6 used is less than 1 mJ. If the focal length is longer than 200 mm, the focused spot of the processing laser will increase significantly. Correspondingly, its energy density is insufficient, and the problem of non-uniformity of energy density will be more prominent. Moreover, when laser drilling, the laser spot of the processing laser 6 after being focused by the long focal length focusing lens 3 is an elongated ellipse with a greater difference between the long and short axes. When drilling holes on the part 8, this shape of laser spot will seriously affect the morphology, depth and quality of the hole. Through experiments, it was found that it was very difficult to process small holes deeper than 2 mm, and the taper of the hole was very large. The roundness of the small hole could not be guaranteed by rotary cutting, and the heat affected zone around the hole was obvious. In this embodiment, under the premise that the long focal length focusing lens 3 can focus the measuring laser 7 to increase the focal depth of the measuring laser 7, it is ensured that the processing laser 6 can achieve normal laser hole making. The processing laser 6 focused by the long focal length focusing lens 3 is further focused by the short focal length focusing lens 4 to ensure that the spot of the processing laser 6 after the secondary focusing is small enough, which can not only significantly improve the energy density, but also reduce the negative impact of the ellipticity and energy non-uniformity of the laser spot itself on the processing of small holes, thereby achieving accurate processing of small holes on small-sized parts. The short focal length focusing lens 4 can be a detachable structure. When laser hole making is performed, the short focal length focusing lens 4 is used to perform secondary focusing on the processing laser 6; when laser measurement is performed, the short focal length focusing lens 4 is removed, and the measuring laser is only focused by the long focal length focusing lens 3, or the short focal length focusing lens 4 can be connected to the XY axis motion structure of the machine tool, and when laser measurement is performed, the short focal length focusing lens 4 is driven to move away by the XY axis motion structure.

[0046] In one embodiment, a camera 5 is further included. When laser drilling is performed, the first dichroic mirror 1 can reflect the visible light generated in the processing area to the camera 5, so as to realize video dynamic monitoring of the process of drilling the small hole. Specifically, the first dichroic mirror 1 can transmit the processing laser 6 and reflect the colored light 17, so that the colored light 17 can be injected into the camera 5. The camera 5 can monitor the drilling process in real time, observe the surface of the part and the condition of the small hole through video magnification, and realize accurate alignment of the secondary processing of the processed small hole.

[0047] In one embodiment, it also includes a multi-optical wedge rotating mechanism 9, which is arranged on the optical path of the processing laser 6. The multi-optical wedge rotating mechanism 9 is used to rotate the processing laser 6 off-axis and emit it at a certain angle inclined to the rotation axis.

[0048] In one embodiment, the laser hole making and in-situ measurement device is installed on the Z-direction slide 12, and the Z-direction slide 12 can move in the Z direction to adjust the focal position of the processing laser and the measuring laser acting on the part 8. By driving the Z-direction slide 12 to move, the entire laser hole making and in-situ measurement device can be driven to move in the Z-axis direction, and the focal position of the processing laser 6 or the measuring laser 7 acting on the part 8 can be adjusted to achieve hole making of the part or measurement along the depth direction of the small hole.

[0049] In one embodiment, it also includes a mounting bracket (not shown) and an adjustment mechanism (not shown), the mounting bracket is used to install and fix the integrated nozzle 13, the adjustment mechanism connects the mounting bracket and the Z-direction slide 12, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle 13. Specifically, the integrated nozzle 13 is installed on the adjustment mechanism that can move in three directions X / Y / Z, so that the focal position of the processing laser 6 after being focused by the long focal length focusing lens 3 is as consistent as possible with the focal position of the measurement laser 7 focused by the long focal length focusing lens 3 alone when the short focal length focusing lens 4 is removed for OCT measurement; the short focal length focusing lens 4 and the integrated nozzle 13 can be installed and connected using positioning pins, which is easy to manually and quickly position, fix or remove from the adjustment mechanism. Furthermore, a protective gas outlet 131 is provided on the integrated nozzle 13, and the protective gas outlet 131 is connected to the protective gas source to form a protective gas atmosphere to prevent oxidation and nitridation of the parts when the processing laser acts on the parts. At the same time, the protective gas can prevent splashes from splashing into the integrated nozzle 13 when the parts are holed.

[0050] The embodiment of the present invention further provides a method for using any one of the laser hole making and in-situ measurement devices in the above embodiments, comprising the following steps:

[0051] Laser hole making process: start the first laser source, the first laser source outputs the processing laser 6, the processing laser 6 is focused once by the long focal length focusing lens 3, and then transmitted to the short focal length focusing lens 4 through the three-dimensional scanning galvanometer 10 for secondary focusing to form a smaller spot processing laser, and the smaller spot processing laser ablates and removes the material of the part 8 to form a small hole on the part 8 through the processing moving path formed by the three-dimensional scanning galvanometer 10;

[0052] Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle 13 is removed, and the second laser source is started. The second laser source outputs a measuring laser. The measuring laser is focused only once by the long focal length focusing lens 3 and then transmitted to the small hole through the three-dimensional scanning galvanometer 10. The measuring scanning pattern formed by the three-dimensional scanning galvanometer 10 fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror 2. The three-dimensional morphology size of the small hole is obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

[0053] The optical coherence tomography measuring instrument analyzes the reflected light of the measuring laser based on the optical coherence tomography (OCT) technology. Optical coherence tomography is a technology that uses the basic principle of weak coherence light interferometer to detect the back reflection or several scattered signals of the incident weak coherence light at different depths of the part, and obtains a two-dimensional or three-dimensional structural image of the small hole on the part 8 by scanning. The data obtained by the optical coherence tomography technology can be fitted to obtain the following Figure 6 The image shown, where Figure 6 The left side shows the three-dimensional morphology of the straight circular hole embodiment. Figure 6 The right side shows the three-dimensional morphology of the special-shaped hole embodiment. The data obtained by the optical coherence tomography technology will be processed by the data processing software to obtain the following Figure 7 , Figure 8 as well as Fig. 9 Data image shown. Figure 7 shows the depth data of the hole, Figure 8 The dimensional data of the hole entrance are shown, Fig. 9 The dimensional data of the hole outlet are shown.

[0054] The embodiment of the present invention further provides a method for using the laser hole making and in-situ measurement device, comprising the following steps:

[0055] The first laser source is started and outputs a processing laser. The multi-optical wedge rotating mechanism 9 rotates the processing laser off-axis and emits it at a certain angle to the rotating axis to form a deflected processing laser. The deflected processing laser is focused once by the long-focal-length focusing lens 3 and then transmitted to the short-focal-length focusing lens 4 through the three-dimensional scanning galvanometer 10. The short-focal-length focusing lens 4 focuses the deflected processing laser for a second time to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes the material of the part 8 through the processing moving path formed by the three-dimensional scanning galvanometer 10 on the part 8, thereby forming a positive conical hole, an inverted conical hole, or a non-conical hole on the part 8.

[0056] In one embodiment, the laser drilling and in-situ measurement device further includes a workbench 14 and a guide rail 15, the workbench 14 is slidably connected to the guide rail 15, and the part 8 is clamped on the workbench 14. The workbench 14 can move on the guide rail 15, thereby controlling the movement of the part 8, so that the processing laser can act on different positions on the part, and realize the drilling processing of different positions of the part.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser hole making and in-situ measurement device, It is characterized in that The invention comprises a first laser source, a first dichroic mirror, a second laser source, an optical coherence tomography measuring instrument, a second dichroic mirror, a long focal length focusing lens, a three-dimensional scanning galvanometer and an integrated nozzle, wherein the first laser source is used to output a processing laser, the second laser source is used to output a measuring laser, the second dichroic mirror is used to transmit the processing laser and reflect the measuring laser so that the processing laser and the measuring laser are output coaxially; a short focal length focusing lens is installed in the integrated nozzle, and when laser hole making is performed, the processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens by the three-dimensional scanning galvanometer, and the short focal length focusing lens The focusing lens focuses the processing laser twice to form a processing laser with a smaller spot, and the processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part to form a small hole; when performing laser measurement, the integrated nozzle is removed, and the measuring laser is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer, and the measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror, and the three-dimensional morphology size of the small hole is obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

2. The laser drilling and in-situ measurement device according to claim 1, It is characterized in that The focal length of the long focal length focusing lens is 400 mm.

3. The laser drilling and in-situ measurement device according to claim 1, It is characterized in that The focal length of the short focal length focusing lens can be selected within the range of 100 mm to 200 mm.

4. The laser drilling and in-situ measurement device according to claim 1, It is characterized in that It also includes a camera. When laser hole making is performed, the first dichroic mirror can reflect the visible light generated in the processing area to the camera, thereby realizing video dynamic monitoring of the small hole processing process.

5. The laser drilling and in-situ measurement device according to claim 1, It is characterized in that It also includes a multi-optical wedge rotating mechanism, which is arranged on the optical path of the processing laser and is used to rotate the processing laser off-axis and emit it at a certain angle inclined to the rotation axis.

6. The laser drilling and in-situ measurement device according to claim 1, It is characterized in that The laser hole making and in-situ measuring device is installed on a Z-direction slide, and the Z-direction slide can move along the Z direction to adjust the focal position of the processing laser and the measuring laser acting on the part.

7. The laser drilling and in-situ measurement device according to claim 6, It is characterized in that It also includes a mounting bracket and an adjustment mechanism, wherein the mounting bracket is used to mount and fix the integrated nozzle, the adjustment mechanism connects the mounting bracket and the Z-direction slide, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle.

8. A method for using the laser hole making and in-situ measurement device according to any one of claims 1 to 7, It is characterized in that The following steps are involved: Laser hole making process: start the first laser source, the first laser source outputs processing laser, the processing laser is focused once by the long focal length focusing lens, and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer for secondary focusing to form a processing laser with a smaller spot, and the processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part to form a small hole; Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle is removed, and the second laser source is started. The second laser source outputs a measuring laser, which is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measuring scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror, and the three-dimensional shape size of the small hole is obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

9. A method for using the laser hole making and in-situ measurement device as claimed in claim 5, It is characterized in that The following steps are involved: The first laser source is started, and the first laser source outputs a processing laser. The multi-optical wedge rotating mechanism rotates the processing laser off-axis and emits it at a certain angle inclined to the rotating axis to form a deflected processing laser. The deflected processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer. The short focal length focusing lens focuses the deflected processing laser twice to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes the material of the part through the processing moving path formed by the three-dimensional scanning galvanometer on the part, so as to form a positive conical hole, an inverted conical hole, or a non-conical hole on the part.

Images