A back contact solar cell silicon wafer drying equipment

Abstract

The present invention relates to the field of solar cell technology, specifically to a back-contact solar cell silicon wafer drying equipment, including a drying box for drying cleaned solar cell silicon wafers, the top of the drying box is open, a servo motor is fixedly connected to the left side of the drying box, and a drying mechanism is rotatably connected to the inside of the drying box, an air inlet pipe is connected and fixed to the right side of the drying box, and a nozzle is connected and fixed to the corresponding position of the air inlet pipe in the drying box; the drying mechanism includes a bearing main board horizontally arranged inside the drying box, and the bearing main board is transmission-connected to the servo motor, and an outer sealing ring is fixed around the bearing main board. The drying mechanism designed in the present application can realize the rotation of the silicon wafer body to be dried, generate centrifugal force to remove water droplets or large-area water stains attached to the surface, realize the pretreatment work before the silicon wafer body is dried, and in the process of drying the silicon wafer body, the silicon wafer body is rotated to achieve uniform contact with hot gas and improve the drying effect.

Description

Technical Field

[0001] The invention relates to the technical field of solar cells, in particular to a back contact type solar cell silicon wafer drying device. Background Art

[0002] A back-contact solar cell refers to a solar cell in which electrodes are formed on the opposite side to the sunlight receiving side, thereby making it possible to increase the light receiving surface because no electrodes are formed on the light receiving surface;

[0003] The semi-finished raw material silicon wafers of back-contact solar cells in the production process need to be dried by drying equipment after being cleaned;

[0004] For example, the invention with the publication number CN113959204A specifically discloses a solar cell silicon wafer drying device, which solves the problem of how to use air flow to efficiently dry solar panels. When driven by the fan, dust carried in the air will enter the tank and affect the drying process, and how to effectively fix the solar panels and effectively improve the drying efficiency.

[0005] During the actual drying process of solar cell silicon wafers, a certain number of water stains and water droplets will be scattered and irregularly distributed on the surface of the solar cell silicon wafers after cleaning. The hot air flow blowing drying method used in the subsequent drying process cannot achieve uniform hot air flow blowing to various parts of the surface of the solar cell silicon wafer. Secondly, the water stains and water droplets attached to the surface of the solar cell silicon wafer have inconsistent evaporation times during the drying process. If the solar cell silicon wafers are to be completely dried, the drying temperature or drying time needs to be increased. Under this operation method, the surface of the solar cell silicon wafer is prone to excessive high temperature oxidation locally, which can damage the solar cell silicon wafer and affect product quality.

[0006] Therefore, a back-contact solar cell silicon wafer drying device is proposed. Summary of the invention

[0007] The purpose of the present invention is to provide a back-contact solar cell silicon wafer drying device. The drying mechanism designed in the present application can realize the rotation of the silicon wafer body to be dried, generate centrifugal force to remove water droplets or large-area water stains attached to the surface, and realize the pretreatment work of the silicon wafer body before drying. In addition, during the drying process of the silicon wafer body, the silicon wafer body is rotated to achieve uniform contact with the hot gas, thereby improving the drying effect, so as to solve the problems raised in the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a back-contact solar cell silicon wafer drying device, comprising a drying box for drying cleaned solar cell silicon wafers, the top of the drying box is open, a servo motor is fixedly connected to the left side of the drying box, and a drying mechanism is rotatably connected to the inside of the drying box, an air inlet pipe is connected and fixed to the right side of the drying box, and a nozzle is connected and fixed to the corresponding position of the air inlet pipe inside the drying box;

[0009] The drying mechanism includes a bearing mainboard horizontally arranged inside the drying box, and the bearing mainboard is transmission-connected to the servo motor, outer sealing rings are fixed around the bearing mainboard, and the side of the bearing mainboard away from the servo motor is rotatably connected to the inner wall of the drying box through a connecting shaft, a through hole is opened at the corresponding position of the bearing mainboard and the output shaft of the servo motor, and a shaft rod is rotatably connected in the through hole, one end of the shaft rod is fixed to the output shaft of the servo motor, a turntable is rotatably connected to the inner wall of the drying box, and the turntable is sleeved on the outside of the shaft rod and rotatably connected to the shaft rod, an annular electromagnet 2 is embeddedly connected to the corresponding position of the outside of the shaft rod and the turntable, the turntable is fixedly connected to the side of the bearing mainboard, an annular electromagnet 1 is arranged between the outside of the turntable and the drying box, and the annular electromagnet 1 is fixed to the drying box, the turntable is fixed by magnetic metal, the bearing mainboard is rotatably connected to the drying box, passive docking parts are symmetrically distributed on the upper end face and the lower end face of the drying box, and detachable fixing parts are magnetically fixed in the passive docking parts, and silicon wafer bodies are distributed on the detachable fixing parts in an annular manner at equal distances.

[0010] Specifically, a rotation groove is opened through the carrier main board, and a roller is rotatably connected in the rotation groove, and a rubber ring is wrapped and fixed outside the roller. One of the rotation grooves is connected to the through hole, and the shaft in the through hole is connected and fixed to one side of the roller.

[0011] Specifically, the passive docking part includes a fixing ring fixed on the supporting main board, the roller is located inside the fixing ring, a sleeve one is fixedly connected to the center position of the fixing ring, a threaded airbag is arranged inside the sleeve one, and a pressure plate is movably connected to the upper side of the threaded airbag inside the sleeve one, an electromagnet disk is arranged on the upper end surface of the pressure plate, a rotating shaft is fixed to the lower end surface of the electromagnet disk, and the rotating shaft extends into the pressure plate and is rotatably connected to the pressure plate.

[0012] Specifically, a return spring is fixed in an annular manner at equal distances inside the threaded airbag, a sealing rubber ring is fixed on the upper end surface of the pressure plate located outside the electromagnet disk, the top of the threaded airbag is fixed to the pressure plate, and the bottom is fixed to the bearing main board.

[0013] Specifically, the removable fixing part includes a removable loading plate, and the outer diameter of the removable loading plate is consistent with the inner diameter of the fixing ring, a rectangular fixing frame is fixed with equal distances in a ring on the upper end surface of the removable loading plate, and a clamping airbag is fixed on the inner wall of the rectangular fixing frame, the bottom of the silicon wafer body is located inside the rectangular fixing frame and fits the inner wall of the clamping airbag, a sleeve 2 is fixed on the lower end surface of the removable loading plate at a position corresponding to the electromagnet sheet, and the inner diameter of the sleeve 2 is consistent with the outer diameter of the electromagnet disk, and the lower end surface of the sleeve 2 is in contact with the sealing rubber ring.

[0014] Specifically, an air channel 1 is opened through the interior of the rotating shaft, a plurality of air channels 2 connected with the air channel 1 are opened in the disassembly loading plate, the air channel 2 is connected with the clamping air bag, and the bottom of the air channel 1 is connected with the threaded air bag.

[0015] Specifically, a return air duct is opened inside the drying box, and the bottom of the return air duct is connected to a return air hole with a built-in valve, and the top of the return air duct is connected to an air jet grille hole. The return air hole is located at the bottom of the drying box, and the air jet grille hole is located on the upper side of the supporting mainboard.

[0016] Specifically, an exhaust hole is opened on the outside of the drying box, and the exhaust hole is located at the lower side of the bearing main board, and a valve is also fixed in the exhaust hole.

[0017] Specifically, a drainage valve pipe is connected and fixed to a position near the bottom of the outside of the drying box, and a drainage hole is opened in the drying box, and the drainage hole is in line with the upper end surface of the bearing mainboard.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The drying mechanism designed in the present application can realize the rotation of the silicon wafer body to be dried, generate centrifugal force to remove water droplets or large-area water stains attached to the surface, realize the pretreatment of the silicon wafer body before drying, and rotate the silicon wafer body during the drying process to achieve uniform contact with the hot gas, thereby improving the drying effect;

[0020] 2. This application further preheats and dries the silicon wafers to be dried by recycling the waste heat of the hot gas, thereby improving the drying efficiency, reducing energy waste, and improving the economic value of the device;

[0021] 3. The present application can further rotate the dried silicon wafer body to accelerate the cooling process of the dried silicon wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is the overall structural view of the present invention;

[0024] Figure 2 An exploded view of the drying mechanism of the present invention;

[0025] Figure 3 For the present invention Figure 2 Stereoscopic image of

[0026] Figure 4 An exploded view of the drying mechanism and the drying box of the present invention;

[0027] Figure 5 For the present invention Figure 3 Enlarged view of point A in the middle;

[0028] Figure 6 For the present invention Figure 4 A top view of

[0029] Figure 7 It is a combined view of the bearing main board and the disassembly loading board of the present invention;

[0030] Figure 8 For the present invention Figure 7 Enlarged view of point B in the middle;

[0031] Fig. 9 This is a combined view of the drying box and the turntable of the present invention;

[0032] Fig.10 It is a structural view of the drying box and the return air holes of the present invention.

[0033] Description of reference numerals:

[0034] 1. Drying box; 11. Drain valve pipe; 12. Air inlet pipe; 121. Air jet head; 13. Air jet grille hole; 131. Return air duct; 132. Return air hole; 14. Turntable; 141. Ring electromagnet 1; 142. Ring electromagnet 2; 15. Exhaust hole; 2. Servo motor; 21. Shaft; 3. Silicon wafer body; 4. Drying mechanism; 41. Carrying motherboard; 42. Outer sealing ring; 43. Fixing Ring; 44, fixing part; 45, roller; 46, through hole; 47, rotating groove; 48, disassembly loading plate; 481, sleeve two; 49, rectangular fixing frame; 491, clamping airbag; 441, sleeve one; 442, threaded airbag; 443, pressure plate; 444, electromagnet disk; 445, sealing rubber ring; 446, reset spring; 447, rotating shaft; 448, airway one; 449, airway two. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figures 1 to 10 , the present invention provides a technical solution:

[0037] A back-contact solar cell silicon wafer drying device comprises a drying box 1 for drying cleaned solar cell silicon wafers, the top of the drying box 1 is open, a servo motor 2 is fixedly connected to the left side of the drying box 1, and a drying mechanism 4 is rotatably connected inside the drying box 1, an air inlet pipe 12 is connected and fixed to the right side of the drying box 1, and an air jet 121 is connected and fixed to the corresponding position of the air inlet pipe 12 inside the drying box 1;

[0038] The drying mechanism 4 includes a bearing mainboard 41 horizontally arranged inside the drying box 1, and the bearing mainboard 41 is transmission-connected to the servo motor 2, an outer sealing ring 42 is fixed around the bearing mainboard 41, and the side of the bearing mainboard 41 away from the servo motor 2 is rotatably connected to the inner wall of the drying box 1 through a connecting shaft, a through hole 46 is opened at a position corresponding to the output shaft of the servo motor 2, and a shaft rod 21 is rotatably connected in the through hole 46, one end of the shaft rod 21 is fixed to the output shaft of the servo motor 2, and a turntable 14 is rotatably connected to the inner wall of the drying box 1, and the turntable 14 is sleeved on the outside of the shaft rod 21 and connected to the shaft rod 2 1 is rotatably connected, an annular electromagnet 2 142 is embedded and connected with the corresponding position of the rotating disk 14 on the outside of the shaft 21, the rotating disk 14 is fixedly connected to the side of the supporting mainboard 41, an annular electromagnet 141 is arranged between the outer side of the rotating disk 14 and the drying box 1, and the annular electromagnet 141 is fixed to the drying box 1, the rotating disk 14 is fixed by magnetic metal, the supporting mainboard 41 is rotatably connected to the drying box 1, the upper end surface and the lower end surface of the drying box 1 are symmetrically distributed with passive docking parts, and the passive docking parts are all magnetically fixed with detachable fixing parts 44, and the detachable fixing parts 44 are annularly distributed with silicon wafer bodies 3 at equal distances.

[0039] Specifically, if Figure 2 and Figure 7 As shown, a rotation groove 47 is opened through the supporting main board 41, and a roller 45 is rotatably connected in the rotation groove 47. A rubber ring is wrapped and fixed on the outside of the roller 45. One of the rotation grooves 47 is connected to the through hole 46, and the shaft 21 in the through hole 46 is connected and fixed to one side of the roller 45.

[0040] By adopting the above technical solution, since the adjacent surfaces of the disassembly and loading plates 48 installed in the fixing ring 43 on the upper and lower sides of the carrier main board 41 are tightly fitted to the surface of the roller 45, when the roller 45 rotates, the two sets of disassembly and loading plates 48 on the upper and lower sides of the carrier main board 41 will be driven to rotate synchronously in opposite directions.

[0041] Specifically, if Figure 3 , Figure 5 , Figure 7 and Figure 8As shown, the passive docking part includes a fixing ring 43 fixed on the bearing main board 41, the roller 45 is located in the fixing ring 43, a sleeve 441 is fixedly connected to the center position of the fixing ring 43, a threaded air bag 442 is arranged inside the sleeve 441, and a pressure plate 443 is movably connected inside the sleeve 441 and located on the upper side of the threaded air bag 442, an electromagnet disk 444 is arranged on the upper end surface of the pressure plate 443, a rotating shaft 447 is fixed on the lower end surface of the electromagnet disk 444, and the rotating shaft 447 extends into the pressure plate 443 and is rotatably connected to the pressure plate 443, a return spring 446 is fixed in an annular manner at equal distances inside the threaded air bag 442, a sealing rubber ring 445 is fixed on the upper end surface of the pressure plate 443 and located on the outer side of the electromagnet disk 444, the top of the threaded air bag 442 is fixed to the pressure plate 443, and the bottom is fixed to the bearing main board 41.

[0042] The detachable fixing part 44 includes a disassembly loading plate 48, and the outer diameter of the disassembly loading plate 48 is consistent with the inner diameter of the fixing ring 43, a rectangular fixing frame 49 is fixed in an annular manner at equal distances on the upper end surface of the disassembly loading plate 48, and a clamping airbag 491 is fixed on the inner wall of the rectangular fixing frame 49, the bottom of the silicon wafer body 3 is located inside the rectangular fixing frame 49 and fits the inner wall of the clamping airbag 491, a sleeve 2 481 is fixed at the corresponding position of the lower end surface of the disassembly loading plate 48 and the electromagnet sheet, and the inner diameter of the sleeve 2 481 is consistent with the outer diameter of the electromagnet disk 444, and the lower end surface of the sleeve 2 481 is in contact with the sealing rubber ring 445, an airway 1 448 is opened through the interior of the rotating shaft 447, and several airways 2 449 connected to the airway 1 448 are opened in the disassembly loading plate 48, the airway 2 449 is connected to the clamping airbag 491, and the bottom of the airway 1 448 is connected to the threaded airbag 442.

[0043] By adopting the above technical solution, the disassembly loading plate 48 and the silicon wafer body 3 on the disassembly loading plate 48 are transported to the top of the opening of the drying box 1, corresponding to the fixing ring 43 on the supporting main board 41, and then the robot arm pushes the disassembly loading plate 48 downward to place the disassembly loading plate 48 inside the fixing ring 43. At this time, the bottom of sleeve 2 481 corresponds to the electromagnet disk 444, and the electromagnet disk 444 is plugged into the interior of sleeve 2 481, and then the electromagnet disk 444 is controlled to guide the electromagnetic suction sleeve 2 481 and the disassembly loading plate 48, and then the disassembly loading plate 48 continues to move downward, pressing down the pressure plate 443 which is rotatably connected to the electromagnet disk 444 through the rotating shaft 447. At this time, the pressure plate 443 moves downward inside sleeve 1 441, and squeezes the threaded airbag 442 between sleeve 1 441 and the pressure plate 443. Since the threaded airbag 442 between sleeve 1 441 and the pressure plate 443 is squeezed, the internal return spring 446 is also compressed. At this time, the gas in the threaded airbag 442 is further transported to airway 2 449 through airway 1 448, and then transported to the inside of the clamping airbag 491, further expanding and wrapping the silicon wafer body 3 in the clamping airbag 491, and flexibly squeezing and fixing it.

[0044] Specifically, if Figure 6 and Fig. 9 , Fig.10 As shown, a return air duct 131 is provided inside the drying box 1, and a return air hole 132 is connected to the bottom of the return air duct 131, and a valve is built into the return air hole 132. The top of the return air duct 131 is connected to an air jet grille hole 13, and the return air hole 132 is located at the bottom of the drying box 1, and the air jet grille hole 13 is located on the upper side of the supporting main board 41.

[0045] An exhaust hole 15 is provided outside the drying box 1 , and the exhaust hole 15 is located at the lower side of the supporting main board 41 , and a valve is also fixed inside the exhaust hole 15 .

[0046] By adopting the above technical solution, the upper disassembly loading plate 48 and the silicon wafer body 3 also rotate synchronously. During the rotation process, the centrifugal force is used to remove the water stains attached to the surface first. At the same time, the valve at the return air hole 132 is controlled to open during the rotation process. The hot gas between the lower side of the main board 41 and the drying box 1 enters the return air duct 131 through the return air hole 132, and then blows on the upper disassembly loading plate 48 and the surface of the silicon wafer body 3 through the jet grille hole 13, so as to preheat and pre-dry the silicon wafer body 3, realize the waste heat recovery of the hot gas, improve the drying effect and reduce energy consumption. Source consumption, when the lower side disassembly loading plate 48 and the silicon wafer main body 3 are dried, similarly, the servo motor 2 drives the supporting main board 41 to flip 180 degrees, and flips the lower side disassembly loading plate 48 and the dried silicon wafer main body 3 to the upper side, and then controls the valve in the reflux air hole 132 to close, and controls the valve in the exhaust hole 15 to open. At this time, there is no need to recover the waste heat of the hot gas, and it is necessary to cool the dried silicon wafer main body 3, which is mainly achieved by disassembling the loading plate 48 and the silicon wafer main body 3 in a rotating state to accelerate the flow of air inside the silicon wafer main body 3, so as to achieve accelerated cooling of the dried silicon wafer main body 3.

[0047] Specifically, if Figure 1 As shown, a drain valve pipe 11 is connected and fixed to the outside of the drying box 1 near the bottom end, and a drainage hole is opened in the drying box 1, and the drainage hole is consistent with the upper end surface of the supporting main board 41.

[0048] By adopting the above technical solution, the water generated by centrifugal dehydration of the silicon wafer body 3 on the carrier main board 41 is mainly discharged for use.

[0049] Working principle:

[0050] The pre-processing steps for the silicon wafer body 3 in this application are:

[0051] A. The main body 3 of the silicon wafer to be dried is rotated and centrifuged for dehydration, and the silicon wafer main body 3 is preheated and dried during the centrifugal dehydration process by utilizing the waste heat of hot gas;

[0052] B. The preheated and dried silicon wafer body 3 is placed in a drying chamber by flipping the carrier main board 41, i.e., between the lower side of the carrier main board 41 and the bottom of the drying box 1, for further hot gas drying treatment;

[0053] C. The flipping of the carrier main board 41 will flip the silicon wafer bodies 3 after the previous gas drying process to the upper side of the carrier main board 41. At this time, the silicon wafer bodies 3 after the gas drying are further rotated to be cooled by rotary air cooling. Subsequently, the cooled silicon wafer bodies 3 are unloaded by a robotic arm, and then the robotic arm grabs the next group of silicon wafer bodies 3 to be processed for preheating and drying. The above steps are repeated to achieve non-stop cyclic loading and unloading operations.

[0054] During operation, the user inserts the bottom of the silicon wafer body 3 to be dried into the rectangular fixing frame 49 on the disassembly loading plate 48, and initially clamps and fixes the bottom of the silicon wafer body 3 through the clamping airbag 491 inside the rectangular fixing frame 49. Then, the robot arm uses magnetic attraction to fix the middle position of the disassembly loading plate 48, and transports the disassembly loading plate 48 and the silicon wafer body 3 on the disassembly loading plate 48 to the top of the opening of the drying box 1, corresponding to the fixing ring 43 on the main board 41. Then, the robot arm pushes the disassembly loading plate 48 downward, and places the disassembly loading plate 48 inside the fixing ring 43. At this time, the bottom of the sleeve 481 corresponds to the electromagnet disk 444. At this time, the electromagnet disk 444 is inserted into the inside of the sleeve 481, and then the electromagnet disk 44 is controlled. 4, the electromagnetic suction sleeve 2 481 is connected to the disassembly loading plate 48, and then the disassembly loading plate 48 continues to move downward, pressing the pressure plate 443 which is rotatably connected to the electromagnetic disk 444 through the rotating shaft 447. At this time, the pressure plate 443 moves downward inside the sleeve 1 441, and squeezes the threaded airbag 442 between the sleeve 1 441 and the pressure plate 443. Since the threaded airbag 442 between the sleeve 1 441 and the pressure plate 443 is squeezed, the internal return spring 446 is also compressed. At this time, the gas in the threaded airbag 442 is further transported to the airway 2 449 through the airway 1 448, and then transported to the inside of the clamping airbag 491, further expanding and wrapping the silicon wafer body 3 in the clamping airbag 491, flexibly squeezing and fixing it, and then the robotic arm controls the magnetic suction to disconnect the disassembly. The connection of the unloading and loading plate 48 is realized. At this time, the user controls the servo motor 2 to rotate, and the annular electromagnet 142 is controlled to be conductive to generate magnetic force, so that the shaft 21 and the turntable 14 are magnetically fixed, and the annular electromagnet 141 between the turntable 14 and the drying box 1 is powered off, and the magnetic force disappears. Therefore, when the servo motor 2 rotates, the shaft 21 and the turntable 14 are magnetically fixed, and the turntable 14 is further driven to rotate on the inner wall of the drying box 1. Then, since the turntable 14 is fixedly connected to the supporting main board 41, when the servo motor 2 rotates 180 degrees, the disassembly and loading plate 48 installed on the supporting main board 41 will be moved to the drying area between the lower side of the supporting main board 41 and the drying box 1, and the lower end surface of the original supporting main board 41 will be flipped to the upper side, waiting for the next group of mechanical arms to The next set of disassembly loading plates 48 and silicon wafer body 3 are installed on the carrier main board 41, and then the annular electromagnet 141 between the drying box 1 and the turntable 14 is conductive to generate magnetic force to fix the carrier main board 41, and the annular electromagnet 142 between the shaft 21 and the turntable 14 is disconnected and the electromagnetic force disappears. After the next set of disassembly loading plates 48 and silicon wafer body 3 are installed, the servo motor 2 drives the shaft 21 to rotate, driving the roller 45 to rotate in the rotating groove 47. Since the adjacent surfaces of the disassembly loading plates 48 installed in the fixing ring 43 on the upper and lower sides of the carrier main board 41 are tightly attached to the surface of the roller 45, when the roller 45 rotates, it will simultaneously drive the upper and lower sets of disassembly loading plates 48 of the carrier main board 41 to rotate synchronously in opposite directions.During the rotation process, the sleeve 441 is slidably connected to the pressing plate 443 through a slide rail to limit the rotation of the pressing plate 443, ensuring that the disassembly loading plate 48 is rotatably connected to the pressing plate 443 through the rotating shaft 447. The lower disassembly loading plate 48 and the silicon wafer body 3 can cooperate with the air inlet pipe 12 and the nozzle 121 to blow hot gas to dry the passing silicon wafer body 3 during the rotation process. The air inlet pipe 12 is connected to the external hot gas generating equipment, so that the hot gas is evenly in contact with the silicon wafer body 3 at each position for drying, avoiding the uneven drying temperature caused by the continuous drying of the silicon wafer body 3 in the traditional equipment, and the oxidation damage of the silicon wafer body 3, and the centrifugal force generated by the silicon wafer body 3 during the rotation process can further remove the water stains attached to the surface, accelerating the drying effect;,

[0055] At the same time, the upper disassembly loading plate 48 and the silicon wafer body 3 also rotate synchronously. During the rotation process, the centrifugal force is used to remove the water stains attached to the surface first. At the same time, the valve at the return air hole 132 is controlled to open during the rotation process. The hot gas between the lower side of the carrier main board 41 and the drying box 1 enters the return air duct 131 through the return air hole 132, and then blows on the upper disassembly loading plate 48 and the surface of the silicon wafer body 3 through the air jet grille hole 13, so as to preheat and pre-dry the silicon wafer body 3, realize the waste heat recovery of the hot gas, improve the drying effect and reduce energy consumption;

[0056] When the lower disassembly loading plate 48 and the silicon wafer body 3 are dried, similarly, the servo motor 2 drives the main carrier board 41 to flip 180 degrees, flip the lower disassembly loading plate 48 and the silicon wafer body 3 after drying to the upper side, and then control the valve in the reflux air hole 132 to close, and control the valve in the exhaust hole 15 to open. At this time, there is no need to recycle the waste heat of the hot gas, and it is necessary to realize the cooling of the silicon wafer body 3 after drying, which is mainly achieved by accelerating the flow of air inside the silicon wafer body 3 through the disassembly loading plate 48 and the silicon wafer body 3 in the rotating state, so as to realize the accelerated cooling of the silicon wafer body 3 after drying. Then, the electromagnetic iron disk 444 is powered off, and the robot arm disassembles the disassembly loading plate 48 and the silicon wafer body 3 after drying and cooling, and transports them to the next process, and then the robot arm installs the next set of disassembly loading plates 48 and the silicon wafer body 3. The above steps are realized repeatedly to realize the pretreatment, drying and cooling of the silicon wafer.

[0057] The present application adopts a PLC controller to control the operation and control of each live component in the device, such as the servo motor 2, the electromagnet disk 444, the annular electromagnet 141, the annular electromagnet 2 142, etc., and realizes the automatic operation of the equipment through the internal program of the controller.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A back-contact solar cell silicon wafer drying device, comprising a drying box (1) for drying cleaned solar cell silicon wafers, the top of the drying box (1) being open, characterized in that: The left side of the drying box (1) is fixedly connected to a servo motor (2), and the interior of the drying box (1) is rotatably connected to a drying mechanism (4); the right side of the drying box (1) is connected to and fixed with an air intake pipe (12), and a nozzle (121) is connected to and fixed at a position corresponding to the air intake pipe (12) inside the drying box (1); The drying mechanism (4) comprises a supporting main board (41) horizontally arranged inside the drying box (1), and the supporting main board (41) is drivingly connected to the servo motor (2), an outer sealing ring (42) is fixed around the supporting main board (41), a side of the supporting main board (41) away from the servo motor (2) is rotatably connected to the inner wall of the drying box (1) via a connecting shaft, a through hole (46) is provided at a position corresponding to the output shaft of the servo motor (2), and a shaft (21) is rotatably connected in the through hole (46), one end of the shaft (21) is fixed to the output shaft of the servo motor (2), a rotating disk (14) is rotatably connected to the inner wall of the drying box (1), and the rotating disk (14) is sleeved on the outside of the shaft (21) and connected to the shaft The shaft (21) is rotatably connected, the outer portion of the shaft (21) is embedded with an annular electromagnet 2 (142) at a position corresponding to the rotating disk (14), the rotating disk (14) is fixedly connected to the side of the carrier mainboard (41), an annular electromagnet 1 (141) is arranged between the outer portion of the rotating disk (14) and the drying box (1), and the annular electromagnet 1 (141) is fixed to the drying box (1), the rotating disk (14) is fixed by magnetic metal, the carrier mainboard (41) is rotatably connected to the drying box (1), the upper end surface and the lower end surface of the drying box (1) are symmetrically distributed with passive docking parts, and detachable fixing parts (44) are magnetically fixed in the passive docking parts, and silicon wafer bodies (3) are equidistantly distributed in an annular manner on the detachable fixing parts (44); The passive docking member comprises a fixing ring (43) fixed on the bearing main board (41); The detachable fixing member (44) includes a detachable loading plate (48); The supporting main board (41) is provided with a rotation groove (47) extending therethrough, and a roller (45) is rotatably connected in the rotation groove (47), and a rubber ring is wrapped and fixed on the outside of the roller (45), one of the rotation grooves (47) is connected to a through hole (46), and a shaft (21) in the through hole (46) is connected and fixed to one side of the roller (45), and the roller (45) is located in a fixing ring (43); The adjacent surfaces of the disassembly and loading plates (48) installed in the fixing ring (43) on the upper and lower sides of the bearing main plate (41) are tightly fitted on the surface of the roller (45).

2. The back-contact solar cell silicon wafer drying equipment according to claim 1, characterized in that: The fixing ring (43) is fixedly connected to a sleeve 1 (441) at the center position, a threaded air bag (442) is arranged inside the sleeve 1 (441), and a pressure plate (443) is movably connected to the upper side of the threaded air bag (442) inside the sleeve 1 (441), an electromagnet disk (444) is arranged on the upper end surface of the pressure plate (443), a rotating shaft (447) is fixed to the lower end surface of the electromagnet disk (444), and the rotating shaft (447) extends into the pressure plate (443) and is rotatably connected to the pressure plate (443).

3. The back-contact solar cell silicon wafer drying device according to claim 2, characterized in that: A return spring (446) is fixed in an annular manner at equal distances inside the threaded airbag (442); a sealing rubber ring (445) is fixed to the upper end surface of the pressure plate (443) located outside the electromagnet disk (444); the top of the threaded airbag (442) is fixed to the pressure plate (443), and the bottom is fixed to the supporting main board (41).

4. The back-contact solar cell silicon wafer drying equipment according to claim 3, characterized in that: The outer diameter of the disassembly loading plate (48) matches the inner diameter of the fixing ring (43); a rectangular fixing frame (49) is fixed to the upper end surface of the disassembly loading plate (48) at equal distances in an annular manner, and a clamping airbag (491) is fixed to the inner wall of the rectangular fixing frame (49); the bottom of the silicon wafer body (3) is located inside the rectangular fixing frame (49) and fits the inner wall of the clamping airbag (491); a sleeve 2 (481) is fixed to the lower end surface of the disassembly loading plate (48) at a position corresponding to the electromagnet sheet, and the inner diameter of the sleeve 2 (481) matches the outer diameter of the electromagnet disk (444), and the lower end surface of the sleeve 2 (481) is in contact with the sealing rubber ring (445).

5. The back-contact solar cell silicon wafer drying equipment according to claim 4, characterized in that: An air channel 1 (448) is provided inside the rotating shaft (447), and a plurality of air channels 2 (449) connected to the air channel 1 (448) are provided inside the disassembly loading plate (48). The air channels 2 (449) are connected to the clamping airbag (491), and the bottom of the air channel 1 (448) is connected to the threaded airbag (442).

6. The back-contact solar cell silicon wafer drying equipment according to claim 5, characterized in that: The drying box (1) is provided with a return air duct (131) at the bottom of the return air duct (131) and a return air hole (132) is connected thereto, and a valve is built into the return air hole (132). The top of the return air duct (131) is provided with an air jet grille hole (13). The return air hole (132) is located at the bottom of the drying box (1), and the air jet grille hole (13) is located on the upper side of the supporting main board (41).

7. The back-contact solar cell silicon wafer drying equipment according to claim 6, characterized in that: An exhaust hole (15) is provided on the outside of the drying box (1), and the exhaust hole (15) is located on the lower side of the supporting main board (41), and a valve is also fixed in the exhaust hole (15).

8. The back-contact solar cell silicon wafer drying equipment according to claim 7, characterized in that: A drainage valve pipe (11) is connected and fixed to a position near the bottom of the drying box (1). A drainage hole is provided inside the drying box (1), and the drainage hole is aligned with the upper end surface of the supporting main board (41) in level.

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