Performance detection equipment for electronic chip and use method

Abstract

The invention discloses performance detection equipment for an electronic chip and a use method, and relates to the technical field of chip detection.The performance detection equipment comprises a base, fixing frames, a lifting plate and a probe adjusting module, the fixing frames are symmetrically and fixedly connected to the top of the outer wall of the base, the lifting plate is installed on the side edges of the fixing frames, and the probe adjusting module is installed on the lifting plate; the probe adjusting module is used for automatically detecting the performance of electronic chips with different sizes; the probe adjusting module comprises a controller, a mounting card, a circuit board, an electromagnet, a probe and a reset spring. By installing the probe adjusting module, the automatic adjusting function of the probe during electronic chip performance detection is achieved, the speed and efficiency of the whole detection process are improved, and the universality and the application range of the detection equipment are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a performance detection device for electronic chips and a use method thereof. Background Art

[0002] With the rapid development of smart devices, the Internet of Things, and artificial intelligence, the market demand for high-quality, high-performance electronic chips continues to increase. In order to ensure the quality and reliability of electronic chips, the demand for electronic chip performance testing equipment has also increased.

[0003] The probe layout of existing electronic chip performance testing equipment is usually fixed, so the testing equipment cannot be flexibly adjusted according to the testing requirements of chips of different specifications. Therefore, when the testing equipment tests electronic chips of different sizes and pin arrangements, the equipment needs to be replaced frequently, which increases the complexity of the testing process. Therefore, a performance testing equipment for electronic chips and a method of using it are extremely important.

[0004] Patent document CN109870463B discloses an electronic chip fault detection device. The above patent realizes multi-faceted fault detection and evaluation of electronic chips, which meets the needs of comprehensive detection of electronic chips. However, the above patent cannot realize the automatic adjustment function of the probe during electronic chip performance detection.

[0005] Patent document CN114324161B discloses a visual inspection device for electronic chips. The above patent realizes distributed inspection within the entire plane and provides a visual inspection effect, but the above patent cannot realize the function of the inspection equipment to firmly clamp chips of different specifications.

[0006] Patent document CN114769165B discloses a high-performance single-photon detection chip detection device and method. The above patent realizes the diversion of qualified single-photon detection chips and unqualified single-photon detection chips, but the above patent cannot realize the detection and positioning functions of the detection device for chips of different specifications.

[0007] Patent document CN115027913B discloses an electronic chip visual inspection device with an adjustment mechanism. The above patent realizes convenient and fast chip inspection. By rotating the layered loading component, it can be adjusted to adapt to the size of various chips. However, the above patent cannot realize the automatic transmission function of the inspection equipment for electronic chips.

[0008] In summary, the above patents cannot realize the automatic adjustment function of the probe during the performance test of the electronic chip, cannot realize the stable clamping function of the test equipment for chips of different specifications, cannot realize the detection and positioning function of the test equipment for chips of different specifications, and cannot realize the automatic transmission function of the test equipment for electronic chips, resulting in the problems that the test equipment cannot detect electronic chips of different specifications, the chips are misaligned during the test, cannot identify electronic chips of different specifications, and cannot automatically transmit electronic chips; To this end, the present application proposes an electronic chip performance testing device and a method of use that realizes the automatic adjustment function of the probe during electronic chip performance testing, the stable clamping function of the testing equipment for chips of different specifications, the detection and positioning function of the testing equipment for chips of different specifications, and the automatic transmission function of the testing equipment for electronic chips. Summary of the invention

[0009] The purpose of the present invention is to provide a performance testing device for electronic chips and a method of use, so as to solve the technical problems raised in the above background technology that the automatic adjustment function of the probe during the performance testing of electronic chips cannot be realized, the stable clamping function of the testing device for chips of different specifications cannot be realized, the detection and positioning function of the testing device for chips of different specifications cannot be realized, and the automatic transmission function of the testing device for electronic chips cannot be realized, resulting in the testing device being unable to detect electronic chips of different specifications, chip misalignment during testing, inability to identify electronic chips of different specifications, and inability to automatically transmit electronic chips.

[0010] To achieve the above object, the present invention provides the following technical solutions: a performance testing device for electronic chips, comprising a base, a fixing frame, a lifting plate and a probe adjustment module, wherein the top of the outer wall of the base is symmetrically fixedly connected with the fixing frame, the side of the fixing frame is installed with the lifting plate, and the lifting plate is installed with the probe adjustment module, and the probe adjustment module is used to automatically detect the performance of electronic chips of different sizes; The probe adjustment module includes: a controller, a mounting card, a circuit board, an electromagnet, a probe and a return spring; A connecting column is fixedly connected to the bottom of the outer wall of the lifting plate, a controller is fixedly connected to the bottom of the outer wall of the connecting column, a circuit board is fixedly connected to the bottom of the outer wall of the controller, a plurality of electromagnets are fixedly connected to the bottom of the outer wall of the circuit board, a mounting card is fixedly connected to the circuit board and the outer wall of the electromagnet, a plurality of mounting holes are opened in the mounting card, the mounting hole is located below the electromagnet, the mounting hole is sleeved on the outer wall of the probe, the outer wall of the probe is fixedly connected to a limiting block, the mounting hole is sleeved on the outer wall of the limiting block, the outer wall of the limiting block is fixedly connected to one side of the reset spring, the other side of the reset spring is fixedly connected to the mounting card, and the reset spring is installed in the mounting hole.

[0011] Preferably, an automatic fixing module is installed on the base, the automatic fixing module is connected to the probe adjustment module via Bluetooth, and the automatic fixing module is used to automatically clamp and fix the electronic chip during the performance detection of the electronic chip; The automatic fixing module comprises: a mounting seat, a first rotating shaft, a clamping plate, a fourth motor, a first bevel gear and a second bevel gear; A mounting seat is fixedly connected to the bottom of the outer wall of the base, and the mounting seat is mounted on the outer wall of the fixing seat. A fourth motor is fixedly connected to the top of the inner wall of the fixing seat, and the fourth motor is connected to the controller via Bluetooth. A fourth rotating shaft is installed on the top of the outer wall of the fourth motor, and a first bevel gear is fixedly connected to the top of the outer wall of the fourth rotating shaft. A first rotating shaft is installed in the fixed seat, and a second bevel gear is fixedly connected to the center of the outer wall of the first rotating shaft. The first bevel gear is meshed with the second bevel gear, and the threads of the first rotating shaft on both sides of the second bevel gear are opposite. A clamping plate is symmetrically mounted on the outer wall of the first rotating shaft, and a first pressure sensor is fixedly connected to the side wall of the clamping plate, and a first rubber pad is fixedly connected to the side wall of the first pressure sensor, and the first pressure sensor is connected to the fourth motor via Bluetooth.

[0012] Preferably, a chip detection module is installed on the lifting plate, and the chip detection module is connected to the probe adjustment module via Bluetooth, and the chip detection module is used to detect the size and specification of the electronic chip; The chip detection module includes: an image analyzer, a first connecting frame and a first high-definition camera; An image analyzer is fixedly connected to the top of the outer wall of the lifting plate, and the image analyzer is connected to a controller via Bluetooth. A first connecting frame is fixedly connected to the bottom of the outer wall of the lifting plate, and a first high-definition camera is connected to the bottom of the outer wall of the first connecting frame via bolts, and the first high-definition camera is connected to the controller via Bluetooth. A third motor is symmetrically fixedly connected in the mounting seat, and the third motor is connected to the image analyzer via Bluetooth. A third rotating shaft is installed on the top of the outer wall of the third motor, and a first gear is fixedly connected to the outer wall of the third rotating shaft. A movable tooth plate is symmetrically fixedly connected to the outer wall of the fixed seat, and the first gear is meshed with the movable tooth plate.

[0013] Preferably, the base is equipped with an automatic transmission module, which is connected to the probe adjustment module via Bluetooth, and is used for conveying the electronic chip; The automatic transmission module includes: a second motor, a sliding block, a moving block, an electric push rod, a moving plate and a suction cup; A motor bracket is fixedly connected to the top of the outer wall of the base, a second motor is fixedly connected to the top of the outer wall of the motor bracket, the second motor is connected to a controller via Bluetooth, a second rotating shaft is installed on the side wall of the second motor, a side plate is symmetrically fixedly connected to the top of the outer wall of the base, a connecting block is fixedly connected to the side wall of the side plate, a connecting block is mounted on the side wall of the second rotating shaft, a sliding block is mounted on the outer wall of the second rotating shaft, a sliding plate is fixedly connected to the bottom of the outer wall of the sliding block, an installation groove is provided at the bottom of the sliding plate, a fifth motor is fixedly connected to the outer wall of the installation groove, a fifth rotating shaft is installed on the side wall of the fifth motor, a moving block is mounted on the fifth rotating shaft, an installation groove is provided on the outer wall of the moving block, a plurality of electric push rods are fixedly connected to the bottom of the outer wall of the moving block, a moving plate is fixedly connected to the bottom of the outer wall of the electric push rod, and a suction cup is fixedly connected to the bottom of the outer wall of the moving plate.

[0014] Preferably, a conveying frame is fixedly connected to the top of the outer wall of the base, a conveying slide is fixedly connected to the side wall of the conveying frame, a baffle is fixedly connected to the side wall of the conveying slide, a sixth motor is installed in the base, a sixth rotating shaft is installed on the top of the outer wall of the sixth motor, a rotating disk is fixedly connected to the outer wall of the sixth rotating shaft, the rotating disk is located below the baffle, a placement groove is opened on the top of the outer wall of the rotating disk, a rotating block is installed in the placement groove, and a second rubber pad is fixedly connected to the top of the outer wall of the rotating block.

[0015] Preferably, a second connecting frame is fixedly connected to the bottom of the outer wall of the connecting block, the second connecting frame is connected to the second high-definition camera by bolts, the second high-definition camera is above the rotating disk, a second rotating shaft is installed on the rotating disk, the second rotating shaft is installed in the placement groove, the outer wall of the second rotating shaft is fixedly connected to the rotating block, the outer wall of the rotating block is fixedly connected to the annular gear plate, a seventh motor is installed in the rotating disk, the seventh motor is connected to the second gear through the rotating shaft, the second gear is meshed with the annular gear plate, the second high-definition camera is connected to the image analyzer via Bluetooth, and the image analyzer is connected to the second motor and the seventh motor via Bluetooth.

[0016] Preferably, the top of the outer wall of the base is fixedly connected with the first conveyor belt and the second conveyor belt, the top of the outer wall of the base is fixedly connected with the first placement plate and the second placement plate, the side wall of the first placement plate is fixedly connected with the first placement block, the side wall of the second placement plate is fixedly connected with the second placement block, the fifth motor is connected to the controller via Bluetooth, the side wall of the movable plate is fixedly connected with the second pressure sensor, the side wall of the movable plate is fixedly connected with the vacuum pump, the vacuum pump is connected with the suction cup via the vacuum pipe, the second pressure sensor is connected to the vacuum pump via Bluetooth, the first conveyor belt is connected to the first transmission gear via a rotating shaft, the top of the outer wall of the base is fixedly connected with a fixed bracket, a driving motor is installed on the fixed bracket, the driving motor is connected to the second transmission gear via a rotating shaft, the first transmission gear is meshed with the second transmission gear, the second conveyor belt is connected to the third transmission gear via a rotating shaft, and the second transmission gear is meshed with the third transmission gear.

[0017] Preferably, a movable groove is opened on the side of the fixed frame, the outer wall of the lifting plate is symmetrically fixedly connected with a lifting block, the movable groove is mounted on the outer wall of the lifting block, the top of the outer wall of the lifting plate is fixedly connected with a first motor, the bottom of the outer wall of the first motor is installed with a first rotating shaft, the fixed frame is mounted on the outer wall of the first rotating shaft, and the outer wall of the first rotating shaft is mounted with a lifting block.

[0018] Preferably, the method of use comprises the following steps: S1, the electric push rod drives the moving plate and the suction cup to gradually approach the electronic chip, the suction cup absorbs the electronic chip, the second motor drives the second rotating shaft, and the second rotating shaft drives the sliding block to move the electronic chip to the detection position; S2, the electronic chip is placed on the fixed seat, the fourth motor drives the first bevel gear to rotate through the fourth rotating shaft, the first bevel gear drives the second bevel gear to rotate, the second bevel gear drives the clamping plate through the first rotating shaft, the clamping plate gradually approaches to clamp and fix the electronic chip; S3. The first high-definition camera captures the image of the electronic chip. The controller analyzes the specifications of the electronic chip based on the image information. The controller controls the electrical contact points at corresponding positions of the circuit board to be energized. The electromagnets at corresponding positions adsorb the probes. The probes that are not adsorbed contact with the pins of the electronic chip to perform a performance test on the electronic chip.

[0019] Preferably, the method of use further comprises the following steps: S11, the staff places the electronic chip on the conveying rack, and the electronic chip passes through the conveying slide and slides into the placement slot in the rotating disk. The sixth motor drives the rotating disk through the sixth rotating shaft, and the rotating disk moves the electronic chip to the transmission position; S31, the controller analyzes the position of the electronic chip according to the image information, and the controller controls the third motor to start, the third motor drives the first gear to rotate through the third shaft, the first gear drives the moving tooth plate to move, the moving tooth plate drives the fixed seat to move, and the fixed seat drives the electronic chip to adjust the position of the electronic chip; S32. After the electronic chip detection is completed, the first motor drives the lifting block and the lifting plate through the first rotating shaft, and the lifting plate moves back to the initial position. The second motor drives the sliding block through the second rotating shaft, and the sliding block drives the sliding plate and the moving plate to the top of the electronic chip. The suction cup absorbs the electronic chip, and the second motor starts again to move the electronic chip to the top of the first conveyor belt and the second conveyor belt.

[0020] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes the automatic adjustment function of the probe during the performance detection of the electronic chip by installing a probe adjustment module, thereby improving the speed and efficiency of the overall detection process and improving the versatility and application scope of the detection equipment; 2. The present invention realizes the function of firmly clamping chips of different specifications by installing an automatic fixing module, solves the problem of poor contact or misalignment between the probe of the equipment and the test point, and improves the accuracy and reliability of the test results; 3. The present invention realizes the detection and positioning functions of the detection equipment for chips of different specifications by installing a chip detection module, realizes automatic and accurate alignment of the probe and the test point on the electronic chip, and improves the accuracy of the detection result; 4. The present invention realizes the automatic transmission function of the detection equipment to the electronic chip by installing an automatic transmission module, thereby improving the flexibility and detection efficiency of the detection equipment and improving the continuity and stability of the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a partial structural schematic diagram of the probe adjustment module of the present invention; Figure 3 It is a partial structural schematic diagram of the automatic fixing module of the present invention; Figure 4 It is a partial structural schematic diagram of the automatic transmission module of the present invention; Figure 5 It is a schematic diagram of the structure of the first conveyor belt part of the present invention; Figure 6 It is a schematic diagram of the structure of the rotating disk part of the present invention; Figure 7 It is a schematic diagram of the structure of the placement slot part of the present invention; Figure 8 For the present invention Figure 2 Schematic diagram of part A.

[0022] In the figure: 1, base; 2, fixed frame; 3, first motor; 4, first rotating shaft; 5, moving slot; 6, lifting block; 7, lifting plate; 8, connecting column; 9, controller; 10, mounting card; 11, circuit board; 12, electromagnet; 13, mounting hole; 14, probe; 15, reset spring; 16, limit block; 17, image analyzer; 18, first connecting frame; 19, first high-definition camera; 20, second high-definition camera; 21, second connecting frame; 22, connecting block; 23, second rotating shaft; 24, second motor; 25, motor bracket; 26, side plate; 27, mounting seat; 28, third motor; 29, third rotating shaft; 30, first gear; 31, moving gear plate; 32, fixed seat; 33, first rotating shaft; 34, driving motor; 35, clamping plate; 36, first pressure sensor; 37, fourth motor; 38, fourth rotating shaft; 39, first bevel gear; 40. second bevel gear; 41. first rubber pad; 42. sliding block; 43. sliding plate; 44. fifth motor; 45. fifth rotating shaft; 46. moving block; 47. mounting groove; 48. electric push rod; 49. moving plate; 50. second pressure sensor; 51. vacuum pump; 52. vacuum pipe; 53. suction cup; 54. first conveyor belt; 55. second conveyor belt; 56. first placement plate; 57. second placement plate; 58. first placement block; 59. second placement block; 60. first transmission gear; 61. second transmission gear; 62. fixed bracket; 63. third transmission gear; 64. rotating disk; 65. placement groove; 66. sixth motor; 67. sixth rotating shaft; 68. rotating block; 69. conveying frame; 70. second rotating shaft; 71. second rubber pad; 72. seventh motor; 73. second gear; 74. annular gear plate; 75. baffle; 76. conveying slideway. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1 , Figure 2 and Figure 8 , an embodiment provided by the present invention: a performance detection device for electronic chips, comprising a base 1, a fixing frame 2, a lifting plate 7 and a probe adjustment module, wherein the fixing frame 2 is symmetrically fixedly connected to the top of the outer wall of the base 1, the lifting plate 7 is installed on the side of the fixing frame 2, and the lifting plate 7 is installed on the lifting plate 7, and the probe adjustment module is used to automatically detect the performance of electronic chips of different sizes; The probe adjustment module includes: a controller 9, a mounting card 10, a circuit board 11, an electromagnet 12, a probe 14 and a return spring 15; The bottom of the outer wall of the lifting plate 7 is fixedly connected to a connecting column 8, the bottom of the outer wall of the connecting column 8 is fixedly connected to a controller 9, the bottom of the outer wall of the controller 9 is fixedly connected to a circuit board 11, the bottom of the outer wall of the circuit board 11 is fixedly connected to a plurality of electromagnets 12, the outer walls of the circuit board 11 and the electromagnets 12 are fixedly connected to a mounting card 10, a plurality of mounting holes 13 are opened in the mounting card 10, the mounting holes 13 are located below the electromagnets 12, the mounting holes 13 are sleeved on the outer wall of the probe 14, the outer wall of the probe 14 is fixedly connected to a limiting block 16, the mounting holes 13 are sleeved on the outer wall of the limiting block 16, the outer wall of the limiting block 16 is fixedly connected to one side of a reset spring 15, the other side of the reset spring 15 is fixedly connected to the mounting card 10, and the reset spring 15 is installed in the mounting hole 13; Further, the controller 9 controls the electrical nodes at the corresponding positions of the circuit board 11 to be energized according to the size and specifications of the electronic chip. After the electromagnet 12 under the circuit board 11 is energized, the energized electromagnet 12 adsorbs the probe 14 in the mounting hole 13, and the probe 14 adsorbs on the electromagnet 12, so that the limit block 16 on the probe 14 compresses the reset spring 15, and the probe 14 moves to the top of the mounting hole 13; when the electromagnet 12 is not energized, the reset spring 15 is in its original state, the reset spring 15 drives the limit block 16 to move, and the limit block 16 drives the probe 14 to move to the top of the mounting hole 13, thereby making The layout of the probe 14 matches the test point or pin of the electronic chip, so that the probe 14 can accurately contact the test point or pin on the chip to detect the performance of the electronic chip. When the controller 9 recognizes that the size and specification of the electronic chip have changed, the controller 9 adjusts the power supply of the electrical node on the circuit board 11, thereby changing the layout of the probe 14, so that the probe 14 can make corresponding adjustments in real time according to the layout of the electronic chip test point, ensuring that the probe 14 is always in contact with the correct electronic chip test point, avoiding contact between the probe 14 and other areas of the electronic chip, causing damage to the probe 14 or the electronic chip.

[0027] See also Figure 1 and Figure 3 , an embodiment provided by the present invention: a performance testing device for an electronic chip, wherein an automatic fixing module is installed on the base 1, the automatic fixing module is connected to a probe adjustment module via Bluetooth, and the automatic fixing module is used to automatically clamp and fix the electronic chip during the performance testing of the electronic chip; The automatic fixing module includes: a mounting seat 27, a first rotating shaft 33, a clamping plate 35, a fourth motor 37, a first bevel gear 39 and a second bevel gear 40; A mounting seat 27 is fixedly connected to the bottom of the outer wall of the base 1, and the mounting seat 27 is sleeved on the outer wall of the fixing seat 32. A fourth motor 37 is fixedly connected to the top of the inner wall of the fixing seat 32, and the fourth motor 37 is connected to the controller 9 via Bluetooth. A fourth rotating shaft 38 is installed on the top of the outer wall of the fourth motor 37, and a first bevel gear 39 is fixedly connected to the top of the outer wall of the fourth rotating shaft 38. A first rotating shaft 33 is installed in the fixing seat 32, and a second bevel gear 40 is fixedly connected to the center of the outer wall of the first rotating shaft 33. The first bevel gear 39 is meshed with the second bevel gear 40, and the threads of the first rotating shaft 33 on both sides of the second bevel gear 40 are opposite. A clamping plate 35 is symmetrically sleeved on the outer wall of the first rotating shaft 33, and a first pressure sensor 36 is fixedly connected to the side wall of the clamping plate 35. A first rubber pad 41 is fixedly connected to the side wall of the first pressure sensor 36, and the first pressure sensor 36 is connected to the fourth motor 37 via Bluetooth. Further, the electronic chip is placed on the fixing seat 32. After the controller 9 receives the size and specification signal of the electronic chip, the controller 9 controls the fourth motor 37 to start, the fourth motor 37 drives the fourth rotating shaft 38 to rotate, the fourth rotating shaft 38 drives the first bevel gear 39 to rotate, the first bevel gear 39 drives the second bevel gear 40 meshing therewith to rotate, the second bevel gear 40 drives the first rotating shaft 33 to rotate, the first rotating shaft 33 drives the clamping plate 35 to move, so that the two clamping plates 35 gradually approach, the clamping plate 35 drives the first pressure sensor 36 and the first rubber pad 41, the first rubber pad 41 gradually fits with the electronic chip, the first pressure sensor 36 detects the pressure data in real time, when the first pressure sensor 36 detects that the pressure reaches the threshold value, the first pressure sensor 36 controls the fourth motor 37 to turn off, stops the movement of the clamping plate 35, avoids the damage of the electronic chip caused by excessive clamping force, and the first rubber pad 41 provides a buffering effect, further avoiding damage to the electronic chip.

[0028] See also Figure 1 , Figure 2 and Figure 3 , an embodiment provided by the present invention: a performance testing device for electronic chips, a chip detection module is installed on the lifting plate 7, the chip detection module is connected to a probe adjustment module via Bluetooth, and the chip detection module is used to detect the size and specification of the electronic chip; The chip detection module includes: an image analyzer 17, a first connecting frame 18 and a first high-definition camera 19; An image analyzer 17 is fixedly connected to the top of the outer wall of the lifting plate 7, and the image analyzer 17 is connected to the controller 9 via Bluetooth. A first connecting frame 18 is fixedly connected to the bottom of the outer wall of the lifting plate 7, and a first high-definition camera 19 is bolted to the bottom of the outer wall of the first connecting frame 18, and the first high-definition camera 19 is connected to the controller 9 via Bluetooth. A third motor 28 is symmetrically fixedly connected inside the mounting seat 27, and the third motor 28 is connected to the image analyzer 17 via Bluetooth. A third rotating shaft 29 is installed on the top of the outer wall of the third motor 28, and a first gear 30 is fixedly connected to the outer wall of the third rotating shaft 29. A movable tooth plate 31 is symmetrically fixedly connected to the outer wall of the fixed seat 32, and the first gear 30 is meshed with the movable tooth plate 31; Furthermore, the electronic chip is placed on the fixed seat 32, and the first high-definition camera 19 captures the image of the electronic chip in real time. The first high-definition camera 19 transmits the image data to the image analyzer 17, and the image analyzer 17 analyzes the image data, determines the size and specification of the electronic chip, identifies the position and layout of the pins or test points of the electronic chip, and detects the position of the electronic chip. The image analyzer 17 transmits the position and layout of the pins or test points of the electronic chip to the controller 9, and the image analyzer 17 controls the third motor 28 to start according to the position of the electronic chip. The third motor 28 drives the third rotating shaft 29 to rotate, and the third rotating shaft 29 drives the first gear 30 to rotate, and the first gear 30 drives the moving tooth plate 31 to move, and the moving tooth plate 31 drives the fixed seat 32 to move, and the fixed seat 32 drives the electronic chip to move. After the electronic chip moves to the detection position, the image analyzer 17 controls the third motor 28 to turn off.

[0029] See also Figure 1 and Figure 4 , an embodiment provided by the present invention: a performance detection device for electronic chips, the base 1 is equipped with an automatic transmission module, the automatic transmission module is connected to a probe adjustment module via Bluetooth, and the automatic transmission module is used for the transmission of electronic chips; The automatic transmission module includes: a second motor 24, a sliding block 42, a moving block 46, an electric push rod 48, a moving plate 49 and a suction cup 53; A motor bracket 25 is fixedly connected to the top of the outer wall of the base 1, and a second motor 24 is fixedly connected to the top of the outer wall of the motor bracket 25. The second motor 24 is connected to the controller 9 via Bluetooth, and a second rotating shaft 23 is installed on the side wall of the second motor 24. A side plate 26 is symmetrically fixedly connected to the top of the outer wall of the base 1, and a connecting block 22 is fixedly connected to the side wall of the side plate 26. The connecting block 22 is sleeved on the side wall of the second rotating shaft 23, and a sliding block 42 is sleeved on the outer wall of the second rotating shaft 23. A sliding plate 43 is fixedly connected to the bottom of the outer wall of the sliding block 42. A mounting groove 47 is opened at the bottom of the sliding plate 43. A fifth motor 44 is fixedly connected to the outer wall of the mounting groove 47. A fifth rotating shaft 45 is installed on the side wall of the fifth motor 44. A moving block 46 is sleeved on the fifth rotating shaft 45. The outer wall of the moving block 46 is sleeved with a mounting groove 47. A plurality of electric push rods 48 are fixedly connected to the bottom of the outer wall of the moving block 46. A moving plate 49 is fixedly connected to the bottom of the outer wall of the electric push rod 48, and a suction cup 53 is fixedly connected to the bottom of the outer wall of the moving plate 49. Further, the second motor 24 is started, the second motor 24 drives the second rotating shaft 23 to rotate, the second rotating shaft 23 drives the sliding block 42 to move, the sliding block 42 drives the sliding plate 43 to move, the sliding plate 43 drives the fifth motor 44 and the fifth rotating shaft 45 to move, thereby driving the moving block 46 to move, the moving block 46 drives the electric push rod 48 and the moving plate 49 to move, the moving plate 49 drives the suction cup 53 to move, after the suction cup 53 moves to above the electronic chip, the electric push rod 48 is started, the electric push rod 48 drives the moving plate 49 and the suction cup 53 to move downward, so that the suction cup 53 absorbs the electronic chip, the electric push rod 48 is started again, the electric push rod 48 drives the moving plate 49 and the suction cup 53 to move back to the original position, the second motor 24 is started again, and the electronic chip is moved to a suitable position, thereby realizing the automatic transportation of the electronic chip.

[0030] See also Figure 1 , Figure 6 and Figure 7 , an embodiment of the present invention: a performance testing device for electronic chips, wherein the top of the outer wall of the base 1 is fixedly connected with a conveying frame 69, the side wall of the conveying frame 69 is fixedly connected with a conveying slide 76, the side wall of the conveying slide 76 is fixedly connected with a baffle 75, a sixth motor 66 is installed in the base 1, a sixth rotating shaft 67 is installed on the top of the outer wall of the sixth motor 66, a rotating disk 64 is fixedly connected to the outer wall of the sixth rotating shaft 67, the rotating disk 64 is located below the baffle 75, a placement groove 65 is opened on the top of the outer wall of the rotating disk 64, a rotating block 68 is installed in the placement groove 65, and a second rubber pad 71 is fixedly connected to the top of the outer wall of the rotating block 68; Further, the staff places the electronic chips that need to be tested on the conveying rack 69, and the electronic chips pass through the conveying slide 76 one by one. The electronic chips are moved to the rotating disk 64, and the baffle 75 prevents the electronic chips from moving to other positions. The sixth motor 66 is started, and the sixth motor 66 drives the sixth rotating shaft 67 to rotate, and the sixth rotating shaft 67 drives the rotating disk 64 to rotate, so that the placement slots 65 on the rotating disk 64 move one by one to below the baffle 75, so that the electronic chips fall into the placement slots 65. Under the action of the rotation of the rotating disk 64, the electronic chips fall into the placement slots 65 one by one. The second rubber pad 71 at the bottom of the placement slot 65 provides a buffering effect for the electronic chip to avoid damage to the electronic chip. The rotating disk 64 drives the electronic chip to rotate, thereby moving the electronic chip to the transmission position, thereby ensuring the continuity of the electronic chip transportation.

[0031] See also Figure 1 , Figure 6 and Figure 7, an embodiment of the present invention: a performance detection device for an electronic chip, wherein the bottom of the outer wall of the connecting block 22 is fixedly connected to a second connecting frame 21, the second connecting frame 21 is connected to a second high-definition camera 20 by bolts, the second high-definition camera 20 is above a rotating disk 64, a second rotating shaft 70 is installed on the rotating disk 64, the second rotating shaft 70 is installed in a placement groove 65, the outer wall of the second rotating shaft 70 is fixedly connected to a rotating block 68, the outer wall of the rotating block 68 is fixedly connected to an annular gear plate 74, a seventh motor 72 is installed in the rotating disk 64, the seventh motor 72 is connected to a second gear 73 through a rotating shaft, the second gear 73 is meshed with the annular gear plate 74, the second high-definition camera 20 is connected to an image analyzer 17 via Bluetooth, and the image analyzer 17 is connected to the second motor 24 and the seventh motor 72 via Bluetooth; Furthermore, the second high-definition camera 20 captures the image of the electronic chip in the placement slot 65 in real time, and the second high-definition camera 20 transmits the image information to the image analyzer 17. The image analyzer 17 analyzes the position information of the electronic chip. The image analyzer 17 controls the seventh motor 72 to start according to the analysis result. The seventh motor 72 drives the second gear 73 through the rotating shaft, the second gear 73 drives the annular gear plate 74, the annular gear plate 74 drives the rotating block 68 to rotate, the rotating block 68 drives the second rotating shaft 70 to rotate, and the rotating block 68 drives the electronic chip to rotate, and rotates the electronic chip to a suitable position. After the image analyzer 17 determines that the electronic chip has moved to a suitable position, the image analyzer 17 controls the second motor 24 to move the electronic chip to the detection position.

[0032] See also Figure 1 , Figure 4 and Figure 5, an embodiment of the present invention: a performance detection device for electronic chips, the base 1 is equipped with an automatic transmission module, the automatic transmission module includes: a second motor 24, a sliding block 42, a moving block 46, an electric push rod 48, a moving plate 49 and a suction cup 53; the top of the outer wall of the base 1 is fixedly connected to a motor bracket 25, the top of the outer wall of the motor bracket 25 is fixedly connected to a second motor 24, the second motor 24 is connected to a controller 9 via Bluetooth, a second rotating shaft 23 is installed on the side wall of the second motor 24, the top of the outer wall of the base 1 is symmetrically fixedly connected to a side plate 26, and the side wall of the side plate 26 is fixedly connected to a connecting block 22, The side wall of the second rotating shaft 23 is sleeved with a connecting block 22, the outer wall of the second rotating shaft 23 is sleeved with a sliding block 42, the outer bottom of the sliding block 42 is fixedly connected with a sliding plate 43, the bottom of the sliding plate 43 is provided with a mounting groove 47, the outer wall of the mounting groove 47 is fixedly connected with a fifth motor 44, the side wall of the fifth motor 44 is installed with a fifth rotating shaft 45, the fifth rotating shaft 45 is sleeved with a moving block 46, the outer wall of the moving block 46 is sleeved with a mounting groove 47, the outer bottom of the moving block 46 is fixedly connected with a plurality of electric push rods 48, the outer bottom of the electric push rod 48 is fixedly connected with a moving plate 49, and the outer bottom of the moving plate 49 is fixedly connected with a suction cup 53; The top of the outer wall of the base 1 is fixedly connected to a first conveyor belt 54 and a second conveyor belt 55, the top of the outer wall of the base 1 is fixedly connected to a first placement plate 56 and a second placement plate 57, the side wall of the first placement plate 56 is fixedly connected to a first placement block 58, the side wall of the second placement plate 57 is fixedly connected to a second placement block 59, the fifth motor 44 is connected to a controller 9 via Bluetooth, the side wall of the moving plate 49 is fixedly connected to a second pressure sensor 50, the side wall of the moving plate 49 is fixedly connected to an air pump 51, and the air pump 51 is connected to the air pump 51 via an air extraction pipe 52. There is a suction cup 53, the second pressure sensor 50 is connected to the air pump 51 via Bluetooth, the first conveyor belt 54 is connected to the first transmission gear 60 via a rotating shaft, the top of the outer wall of the base 1 is fixedly connected to a fixed bracket 62, and a driving motor 34 is installed on the fixed bracket 62. The driving motor 34 is connected to the second transmission gear 61 via a rotating shaft, and the first transmission gear 60 is meshed with the second transmission gear 61. The second conveyor belt 55 is connected to the third transmission gear 63 via a rotating shaft, and the second transmission gear 61 is meshed with the third transmission gear 63; Further, the controller 9 determines whether the performance of the electronic chip is qualified. When it is detected that the electronic chip is qualified, the controller 9 controls the fifth motor 44 to start, and the fifth motor 44 drives the fifth rotating shaft 45 to rotate forward, so that the moving block 46 drives the electric push rod 48 and the moving plate 49 to approach the first placement plate 56. When the second pressure sensor 50 on the moving plate 49 contacts the first placement block 58, the second pressure sensor 50 detects the pressure, and the second pressure sensor 50 controls the vacuum pump 51 to start, and the vacuum pump 51 inflates the suction cup 53 through the vacuum pipe 52, so that the suction cup 53 no longer absorbs the electronic chip, and the electronic chip falls onto the first conveyor belt 54; when it is detected that the electronic chip is unqualified, the controller 9 controls the fifth motor 44 to drive The fifth rotating shaft 45 rotates in the opposite direction to make the movable plate 49 approach the second placement plate 57. When the second pressure sensor 50 on the movable plate 49 contacts the second placement block 59 and detects the pressure, the second pressure sensor 50 controls the vacuum pump 51 to start, so that the electronic chip falls onto the second conveyor belt 55. The driving motor 34 drives the second transmission gear 61 through the rotating shaft. The second transmission gear 61 drives the first transmission gear 60 and the third transmission gear 63. The first transmission gear 60 and the third transmission gear 63 drive the first conveyor belt 54 and the second conveyor belt 55 respectively, so that the first conveyor belt 54 and the second conveyor belt 55 rotate in opposite directions, thereby transmitting qualified and unqualified electronic chips to different areas.

[0033] Working principle: the electronic chip passes through the conveying frame 69 and the conveying slide 76, and the electronic chip moves to the placement slot 65 in the rotating disk 64. The sixth motor 66 drives the rotating disk 64 to rotate, and moves the electronic chip to the transmission position. The seventh motor 72 rotates the rotating block 68 to rotate the electronic chip to a suitable position to prevent the pins of the electronic chip from contacting the clamping plate 35 when the electronic chip is clamped later; The second motor 24 is started to move the moving plate 49 and the suction cup 53 to the top of the electronic chip, the suction cup 53 absorbs the electronic chip, the air pump 51 evacuates the air in the suction cup 53, so that the suction effect of the suction cup 53 is stronger, the second motor 24 is started to move the electronic chip to the top of the fixed seat 32, the air pump 51 fills the suction cup 53 with air, the electronic chip falls to the top of the fixed seat 32, and the fourth motor 37 is started to clamp the clamping plate 35 to fix the electronic chip; The controller 9 analyzes the data based on the image analyzer 17, and controls the electrical nodes at the corresponding positions of the circuit board 11 to be energized, so that some probes 14 move into the mounting holes 13, thereby adjusting the layout of the probes 14 on the mounting card 10, so that the layout of the probes 14 matches the test points or pins of the electronic chip, and the first motor 3 drives the first rotating shaft 4, the first rotating shaft 4 drives the lifting block 6 to move in the moving groove 5, the lifting block 6 drives the lifting plate 7, and the lifting plate 7 drives the connecting column 8, the controller 9, and the mounting card 10 to approach the chip, so that the probes 14 accurately contact the test points or pins on the chip.

[0034] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A performance testing device for electronic chips, characterized in that: The invention comprises a base (1), a fixing frame (2), a lifting plate (7) and a probe adjustment module, wherein the fixing frame (2) is symmetrically fixedly connected to the top of the outer wall of the base (1), the lifting plate (7) is installed on the side of the fixing frame (2), and the lifting plate (7) is installed on the probe adjustment module, and the probe adjustment module is used to automatically detect the performance of electronic chips of different sizes; The probe adjustment module comprises: a controller (9), a mounting card (10), a circuit board (11), an electromagnet (12), a probe (14) and a return spring (15); The bottom of the outer wall of the lifting plate (7) is fixedly connected to a connecting column (8), the bottom of the outer wall of the connecting column (8) is fixedly connected to a controller (9), the bottom of the outer wall of the controller (9) is fixedly connected to a circuit board (11), the bottom of the outer wall of the circuit board (11) is fixedly connected to a plurality of electromagnets (12), the outer walls of the circuit board (11) and the electromagnets (12) are fixedly connected to a mounting card (10), a plurality of mounting holes (13) are provided in the mounting card (10), the mounting holes (13) are located below the electromagnets (12), the mounting holes (13) are sleeved on the outer wall of the probe (14), the outer wall of the probe (14) is fixedly connected to a limiting block (16), the mounting holes (13) are sleeved on the outer wall of the limiting block (16), the outer wall of the limiting block (16) is fixedly connected to one side of a return spring (15), the other side of the return spring (15) is fixedly connected to the mounting card (10), and the return spring (15) is mounted in the mounting holes (13).

2. The electronic chip performance testing device according to claim 1, characterized in that: An automatic fixing module is installed on the base (1), the automatic fixing module is connected to the probe adjustment module via Bluetooth, and the automatic fixing module is used to automatically clamp and fix the electronic chip during the performance test of the electronic chip; The automatic fixing module comprises: a mounting seat (27), a first rotating shaft (33), a clamping plate (35), a fourth motor (37), a first bevel gear (39), and a second bevel gear (40); The bottom of the outer wall of the base (1) is fixedly connected to a mounting seat (27), the mounting seat (27) is sleeved on the outer wall of the fixing seat (32), the top of the inner wall of the fixing seat (32) is fixedly connected to a fourth motor (37), the fourth motor (37) is connected to a controller (9) via Bluetooth, a fourth rotating shaft (38) is installed on the top of the outer wall of the fourth motor (37), the top of the outer wall of the fourth rotating shaft (38) is fixedly connected to a first bevel gear (39), a first rotating shaft (33) is installed in the fixing seat (32), and the outer wall of the first rotating shaft (33) is fixedly connected to the first bevel gear (39). A second bevel gear (40) is fixedly connected to the center, the first bevel gear (39) meshes with the second bevel gear (40), the threads of the first rotating shaft (33) on both sides of the second bevel gear (40) are opposite, the outer wall of the first rotating shaft (33) is symmetrically sleeved with a clamping plate (35), the side wall of the clamping plate (35) is fixedly connected to a first pressure sensor (36), the side wall of the first pressure sensor (36) is fixedly connected to a first rubber pad (41), and the first pressure sensor (36) is connected to a fourth motor (37) via Bluetooth.

3. The electronic chip performance testing device according to claim 1, characterized in that: A chip detection module is installed on the lifting plate (7), the chip detection module is connected to the probe adjustment module via Bluetooth, and the chip detection module is used to detect the size and specification of the electronic chip; The chip detection module comprises: an image analyzer (17), a first connecting frame (18) and a first high-definition camera (19); The top of the outer wall of the lifting plate (7) is fixedly connected to an image analyzer (17), and the image analyzer (17) is connected to a controller (9) via Bluetooth. The bottom of the outer wall of the lifting plate (7) is fixedly connected to a first connecting frame (18), and the bottom of the outer wall of the first connecting frame (18) is connected to a first high-definition camera (19) via bolts, and the first high-definition camera (19) is connected to the controller (9) via Bluetooth. A third motor (28) is symmetrically fixedly connected inside the mounting seat (27), and the third motor (28) is connected to the image analyzer (17) via Bluetooth. A third rotating shaft (29) is installed at the top of the outer wall of the third motor (28), and the outer wall of the third rotating shaft (29) is fixedly connected to a first gear (30). The outer wall of the fixed seat (32) is symmetrically fixedly connected to a movable tooth plate (31), and the first gear (30) is meshed with the movable tooth plate (31).

4. The electronic chip performance testing device according to claim 1, characterized in that: The base (1) is equipped with an automatic transmission module, which is connected to a probe adjustment module via Bluetooth, and is used for transporting electronic chips; The automatic transmission module comprises: a second motor (24), a sliding block (42), a moving block (46), an electric push rod (48), a moving plate (49) and a suction cup (53); The top of the outer wall of the base (1) is fixedly connected to a motor bracket (25), the top of the outer wall of the motor bracket (25) is fixedly connected to a second motor (24), the second motor (24) is connected to a controller (9) via Bluetooth, a second rotating shaft (23) is installed on the side wall of the second motor (24), a side plate (26) is symmetrically fixedly connected to the top of the outer wall of the base (1), a connecting block (22) is fixedly connected to the side wall of the side plate (26), the side wall of the second rotating shaft (23) is sleeved with the connecting block (22), the outer wall of the second rotating shaft (23) is sleeved with a sliding block (42), and the bottom of the outer wall of the sliding block (42) is fixedly connected to the side wall of the second rotating shaft (23). A sliding plate (43) is fixedly connected, a mounting groove (47) is provided at the bottom of the sliding plate (43), a fifth motor (44) is fixedly connected to the outer wall of the mounting groove (47), a fifth rotating shaft (45) is installed on the side wall of the fifth motor (44), a moving block (46) is sleeved on the fifth rotating shaft (45), a mounting groove (47) is sleeved on the outer wall of the moving block (46), a plurality of electric push rods (48) are fixedly connected to the bottom of the outer wall of the moving block (46), a moving plate (49) is fixedly connected to the bottom of the outer wall of the electric push rod (48), and a suction cup (53) is fixedly connected to the bottom of the outer wall of the moving plate (49).

5. The electronic chip performance testing device according to claim 1, characterized in that: The top of the outer wall of the base (1) is fixedly connected to a conveying frame (69), the side wall of the conveying frame (69) is fixedly connected to a conveying slideway (76), the side wall of the conveying slideway (76) is fixedly connected to a baffle (75), a sixth motor (66) is installed in the base (1), a sixth rotating shaft (67) is installed at the top of the outer wall of the sixth motor (66), a rotating disk (64) is fixedly connected to the outer wall of the sixth rotating shaft (67), the rotating disk (64) is located below the baffle (75), a placement groove (65) is opened at the top of the outer wall of the rotating disk (64), a rotating block (68) is installed in the placement groove (65), and a second rubber pad (71) is fixedly connected to the top of the outer wall of the rotating block (68).

6. The electronic chip performance testing device according to claim 4, characterized in that: The bottom of the outer wall of the connecting block (22) is fixedly connected to a second connecting frame (21), the second connecting frame (21) is connected to a second high-definition camera (20) via bolts, the second high-definition camera (20) is located above the rotating disk (64), a second rotating shaft (70) is mounted on the rotating disk (64), the second rotating shaft (70) is mounted in the placement groove (65), the outer wall of the second rotating shaft (70) is fixedly connected to a rotating block (68), the outer wall of the rotating block (68) is fixedly connected to an annular gear plate (74), a seventh motor (72) is mounted in the rotating disk (64), the seventh motor (72) is connected to a second gear (73) via a rotating shaft, the second gear (73) is meshed with the annular gear plate (74), the second high-definition camera (20) is connected to an image analyzer (17) via Bluetooth, and the image analyzer (17) is connected to the second motor (24) and the seventh motor (72) via Bluetooth.

7. The electronic chip performance testing device according to claim 1, characterized in that: The top of the outer wall of the base (1) is fixedly connected to a first conveyor belt (54) and a second conveyor belt (55); the top of the outer wall of the base (1) is fixedly connected to a first placement plate (56) and a second placement plate (57); the side wall of the first placement plate (56) is fixedly connected to a first placement block (58); the side wall of the second placement plate (57) is fixedly connected to a second placement block (59); the fifth motor (44) is connected to a controller (9) via Bluetooth; the side wall of the movable plate (49) is fixedly connected to a second pressure sensor (50); the side wall of the movable plate (49) is fixedly connected to an air pump (51); the air pump (51) is connected to the air pump via an air extraction pipe (52). A suction cup (53) is connected, the second pressure sensor (50) is connected to an air pump (51) via Bluetooth, the first conveyor belt (54) is connected to a first transmission gear (60) via a rotating shaft, a fixed bracket (62) is fixedly connected to the top of the outer wall of the base (1), a driving motor (34) is installed on the fixed bracket (62), the driving motor (34) is connected to a second transmission gear (61) via a rotating shaft, the first transmission gear (60) is meshed with the second transmission gear (61), the second conveyor belt (55) is connected to a third transmission gear (63) via a rotating shaft, the second transmission gear (61) is meshed with the third transmission gear (63).

8. The electronic chip performance testing device according to claim 1, characterized in that: The fixed frame (2) is provided with a movable groove (5) on the side, the outer wall of the lifting plate (7) is symmetrically fixedly connected with a lifting block (6), the movable groove (5) is sleeved on the outer wall of the lifting block (6), the top of the outer wall of the lifting plate (7) is fixedly connected with a first motor (3), the bottom of the outer wall of the first motor (3) is installed with a first rotating shaft (4), the fixed frame (2) is sleeved on the outer wall of the first rotating shaft (4), and the outer wall of the first rotating shaft (4) is sleeved with the lifting block (6).

9. A method for using a performance testing device for an electronic chip, applicable to the performance testing device for an electronic chip according to any one of claims 1 to 8, characterized in that: The method of use comprises the following steps: S1, the electric push rod (48) drives the moving plate (49) and the suction cup (53) to gradually approach the electronic chip, the suction cup (53) absorbs the electronic chip, the second motor (24) drives the second rotating shaft (23), and the second rotating shaft (23) drives the sliding block (42) to move the electronic chip to the detection position; S2, the electronic chip is placed on the fixing seat (32), the fourth motor (37) drives the first bevel gear (39) to rotate via the fourth rotating shaft (38), the first bevel gear (39) drives the second bevel gear (40) to rotate, the second bevel gear (40) drives the clamping plate (35) via the first rotating shaft (33), and the clamping plate (35) gradually approaches to clamp and fix the electronic chip; S3, the first high-definition camera (19) captures the image of the electronic chip, the controller (9) analyzes the specifications of the electronic chip based on the image information, the controller (9) controls the electrical nodes at the corresponding positions of the circuit board (11) to be energized, the electromagnets (12) at the corresponding positions adsorb the probes (14), the probes (14) that are not adsorbed come into contact with the pins of the electronic chip, and the performance test of the electronic chip is performed.

10. The method for using the electronic chip performance testing device according to claim 9, characterized in that: The method of use also includes the following steps: S11, a staff member places an electronic chip on a conveying rack (69), and the electronic chip passes through a conveying slideway (76) and slides into a placement slot (65) in a rotating disk (64), and a sixth motor (66) drives the rotating disk (64) via a sixth rotating shaft (67), and the rotating disk (64) moves the electronic chip to a transmission position; S31, the controller (9) analyzes the position of the electronic chip according to the image information, the controller (9) controls the third motor (28) to start, the third motor (28) drives the first gear (30) to rotate through the third rotating shaft (29), the first gear (30) drives the movable tooth plate (31) to move, the movable tooth plate (31) drives the fixed seat (32) to move, and the fixed seat (32) drives the electronic chip to adjust the position of the electronic chip; S32, after the electronic chip detection is completed, the first motor (3) drives the lifting block (6) and the lifting plate (7) through the first rotating shaft (4), and the lifting plate (7) moves back to the initial position. The second motor (24) drives the sliding block (42) through the second rotating shaft (23), and the sliding block (42) drives the sliding plate (43) and the moving plate (49) to the top of the electronic chip. The suction cup (53) absorbs the electronic chip, and the second motor (24) is started again to move the electronic chip to the top of the first conveyor belt (54) and the second conveyor belt (55).

Images