Multilayer ceramic capacitor

Abstract

Provided is a multilayer ceramic capacitor capable of suppressing the occurrence of electrochemical migration. In a multilayer ceramic capacitor (1) according to the present embodiment, a hydrophilic part (80) and a hydrophobic part (70) are disposed on the surface of a laminate (10), and the hydrophilic part (80) is provided with a first main surface-side hydrophilic part (81) having a hydroxyl group, a second main surface-side hydrophilic part (82) having a hydroxyl group, a first side surface-side hydrophilic part (83) having a hydroxyl group, and a second side surface-side hydrophilic part (84) having a hydroxyl group. The hydrophobic section (70) has a first main surface-side hydrophobic section (71) containing fluorine and / or silicone, a second main surface-side hydrophobic section (72) containing fluorine and / or silicone, a first side surface-side hydrophobic section (73) containing fluorine and / or silicone, and a second side surface-side hydrophobic section (74) containing fluorine and / or silicone.

Description

Technical Field

[0001] The present invention relates to a laminated ceramic capacitor. Background Art

[0002] In recent years, miniaturization and thinning have been developing in electronic devices such as mobile phones and portable music players. Along with this, for example, miniaturization of electronic components built into electronic devices is required. In addition, the environments in which such electronic devices are used are diversified, and it is desired to improve the reliability of electronic components in the diversified environments.

[0003] In this context, an electronic component having a pair of external electrodes has a problem of electrochemical migration. That is, condensation occurs on the surface of the electronic component due to the temperature difference or heat capacity difference between the electronic component and the outside air. Water droplets generated by the condensation form a water film connecting the external electrodes on the surface of the electronic component. If a voltage is applied between the external electrodes of the electronic component in this state, ionized metal species are dissolved and precipitated from the external electrodes in the water film, causing electrochemical migration.

[0004] As a method for solving the electrochemical migration, there is a method of coping with the problem of forming a silane coupling treatment film on the surface of the electronic component by silane coupling treatment. In order to exert high water resistance through the silane coupling agent, it is conceivable to lengthen the straight chain of the silane coupling agent. However, when the straight chain of the silane coupling agent is lengthened, the steric hindrance caused by the straight chain becomes larger, so the interval of the silane coupling agent disposed on the surface of the electronic component becomes wider, so its compactness will decrease. As a result, the condensation inhibition effect is insufficient, and condensation is generated on the surface of the electronic component between the silane coupling agents, which will cause the electrochemical migration caused by the above-mentioned generation process.

[0005] Therefore, a method of suppressing the above-mentioned ion migration by using a perfluoroalkyl-alkyl-silane-based water-repellent treatment agent, i.e., a silane coupling agent having F (fluorine) in its functional group, is proposed in Patent Document 1. This treatment agent is used to form a water-repellent film on the surface of a ceramic electronic component, thereby suppressing the continuous condensation and preventing the occurrence of electrochemical migration.

[0006] Prior Art Literature

[0007] Patent Literature

[0008] Patent Document 1: International Publication No. 2002 / 082480 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] However, in ceramic electronic components, the suppression of electrochemical migration is insufficient if the method described in Patent Document 1 is used. That is, when a silane coupling agent having F in the functional group is used, although the steric hindrance caused by the straight chain of the silane coupling agent can be reduced and higher water resistance can be exhibited, the compactness is insufficient.

[0011] Furthermore, in Patent Document 1, when only water repellent treatment is performed by adding a water repellent agent, since the hydrophilic treatment is not performed on the portion to which the water repellent agent is not added, the difference in the water contact angle between the portion to which the water repellent agent is added and the portion to which the water repellent agent is not added is small, and a sufficient water repellent effect may not be obtained.

[0012] An object of the present invention is to provide a multilayer ceramic capacitor capable of suppressing the occurrence of electrochemical migration.

[0013] Technical solutions to solve problems

[0014] The multilayer ceramic capacitor of the present invention comprises: a multilayer body including a plurality of stacked dielectric layers, having a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the height direction and the width direction; a first internal electrode layer arranged on the plurality of dielectric layers and exposed at the first end surface; a second internal electrode layer arranged on the plurality of dielectric layers and exposed at the second end surface; a first external electrode arranged on the first end surface; and a second external electrode arranged on the second end surface, wherein a hydrophilic portion and a hydrophobic portion are arranged on the surface of the multilayer body, and the hydrophilic portion has a hydrophobic portion arranged on the first main surface. The hydrophilic portion comprises a first main surface side hydrophilic portion which is arranged on at least a portion of the first main surface and has a hydroxyl group, a second main surface side hydrophilic portion which is arranged on at least a portion of the second main surface and has a hydroxyl group, a first side surface side hydrophilic portion which is arranged on at least a portion of the first side surface and has a hydroxyl group, and a second side surface side hydrophilic portion which is arranged on at least a portion of the second side surface and has a hydroxyl group, and the hydrophobic portion comprises a first main surface side hydrophobic portion which is arranged on at least a portion of the first main surface and contains fluorine or silicone, a second main surface side hydrophobic portion which is arranged on at least a portion of the second main surface and contains fluorine or silicone, a first side surface side hydrophobic portion which is arranged on at least a portion of the first side surface and contains fluorine or silicone, and a second side surface side hydrophobic portion which is arranged on at least a portion of the second side surface and contains fluorine or silicone.

[0015] Effects of the Invention

[0016] According to the present invention, it is possible to provide a multilayer ceramic capacitor capable of suppressing the occurrence of electrochemical migration. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an oblique view of the appearance of the multilayer ceramic capacitor according to the first embodiment.

[0018] Figure 2 It is along Figure 1 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line II-II shown in FIG.

[0019] Figure 3 It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line III-III.

[0020] Figure 4A It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line IVA-IVA shown in FIG.

[0021] Figure 4B It is along Figure 2 FIG. 1 is a cross-sectional view taken along line IVB-IVB of the multilayer ceramic capacitor shown.

[0022] Figure 5 It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line VV shown in FIG.

[0023] Figure 6 It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line VI-VI shown in FIG.

[0024] Figure 7 is for Figure 1 The illustrated multilayer ceramic capacitor is an arrow view when the first main surface side is viewed along the direction of arrow VII.

[0025] Fig. 8A FIG. 1 is a diagram showing a dual-structured multilayer ceramic capacitor.

[0026] Figure 8B FIG. 1 is a diagram showing a triple-structured multilayer ceramic capacitor.

[0027] Figure 8C FIG. 1 is a diagram showing a quadruple-structured multilayer ceramic capacitor.

[0028] Fig. 9 is a diagram showing a multilayer ceramic capacitor according to a second embodiment, and is Figure 7 The corresponding figure.

[0029] Fig.10 is a diagram showing a multilayer ceramic capacitor according to a second embodiment, and is a diagram showing a multilayer ceramic capacitor according to a second embodiment. Figure 1 This is a view when the second main surface side is viewed in the direction of arrow X shown.

[0030] Fig.11 is a diagram showing a multilayer ceramic capacitor according to a third embodiment, and is Figure 7 The corresponding figure.

[0031] Fig.12 is a diagram showing a laminated ceramic capacitor according to a fourth embodiment, and is Figure 7 The corresponding figure.

[0032] Fig.13 is for Fig.12 The illustrated multilayer ceramic capacitor is a virtual arrow view when the second end surface side is viewed along the direction of arrow XIII. DETAILED DESCRIPTION

[0033] Hereinafter, a multilayer ceramic capacitor 1 according to a first embodiment of the present disclosure will be described. Figure 1 It is a perspective view of the appearance of the multilayer ceramic capacitor 1 according to the present embodiment. Figure 2 It is along Figure 1 A cross-sectional view of the multilayer ceramic capacitor 1 taken along line II-II. Figure 3 It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line III-III. Figure 4A It is along Figure 2 A cross-sectional view of the multilayer ceramic capacitor 1 taken along line IVA-IVA is shown. Figure 4B It is along Figure 2 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line IVB-IVB.

[0034] The multilayer ceramic capacitor 1 includes a multilayer body 10 and external electrodes 40 .

[0035] exist Figure 1 to Figure 4B , an XYZ orthogonal coordinate system is shown. The length direction L of the laminated ceramic capacitor 1 and the laminated body 10 corresponds to the X direction. The width direction W of the laminated ceramic capacitor 1 and the laminated body 10 corresponds to the Y direction. The height direction T of the laminated ceramic capacitor 1 and the laminated body 10 corresponds to the Z direction. Here, Figure 2 The section shown is also referred to as the LT section. Figure 3 The section shown is also referred to as the WT section. Figure 4A as well as Figure 4B The section shown is also referred to as the LW section.

[0036] like Figure 1 to Figure 4B As shown, the stack 10 includes a first main surface TS1 and a second main surface TS2 opposite to each other in a height direction T, a first side surface WS1 and a second side surface WS2 opposite to each other in a width direction W perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 opposite to each other in a length direction L perpendicular to the height direction T and the width direction W.

[0037] like Figure 1As shown, the stack 10 has a substantially rectangular parallelepiped shape. In addition, the dimension of the stack 10 in the length direction L is not necessarily longer than the dimension in the width direction W. It is preferred that the corners and ridges of the stack 10 are rounded. The corner is the portion where three surfaces of the stack intersect, and the ridge is the portion where two surfaces of the stack intersect. In addition, it is also possible to form concave-convex portions on a portion or all of the surface constituting the stack 10. In addition, a hydrophilic portion 80 and a hydrophobic portion 70 are arranged on the surface of the stack 10. The hydrophilic portion 80 and the hydrophobic portion 70 will be described later. In addition, the surface of the stack 10 is formed by a first main surface TS1, a second main surface TS2, a first side surface WS1, a second side surface WS2, a first end surface LS1, and a second end surface LS2.

[0038] like Figure 2 as well as Figure 3 As shown, the laminate 10 includes an inner layer portion 11 , and a first main surface side outer layer portion 12 and a second main surface side outer layer portion 13 arranged in the height direction T so as to sandwich the inner layer portion 11 .

[0039] The inner layer portion 11 includes a plurality of dielectric layers 20 and a plurality of internal electrode layers 30. The inner layer portion 11 includes the internal electrode layer 30 located closest to the first main surface TS1 side to the internal electrode layer 30 located closest to the second main surface TS2 side in the height direction T. In the inner layer portion 11, the plurality of internal electrode layers 30 are arranged opposite to each other with the dielectric layer 20 interposed therebetween. The inner layer portion 11 is a portion that generates electrostatic capacitance and substantially functions as a capacitor.

[0040] The plurality of dielectric layers 20 are composed of dielectric materials. The dielectric material may be, for example, a dielectric ceramic containing BaTiO3, CaTiO3, SrTiO3, or CaZrO3. In addition, the dielectric material may be a material in which a secondary component such as a Mn compound, a Fe compound, a Cr compound, a Co compound, or a Ni compound is added to these main components. The dielectric material is particularly preferably a material containing BaTiO3 as a main component.

[0041] The thickness of the dielectric layer 20 is preferably 0.5 μm or more and 10 μm or less. The number of laminated dielectric layers 20 is preferably 15 or more and 1200 or less. The number of dielectric layers 20 is the sum of the number of dielectric layers of the inner layer portion 11 and the number of dielectric layers of the first main surface side outer layer portion 12 and the second main surface side outer layer portion 13.

[0042] The plurality of internal electrode layers 30 include a plurality of first internal electrode layers 31 and a plurality of second internal electrode layers 32. The plurality of first internal electrode layers 31 are arranged on the plurality of dielectric layers 20. The plurality of second internal electrode layers 32 are arranged on the plurality of dielectric layers 20. The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are alternately arranged in the height direction T of the laminate 10 with the dielectric layers 20 interposed therebetween. The first internal electrode layers 31 and the second internal electrode layers 32 are arranged so as to sandwich the dielectric layer 20.

[0043] The first internal electrode layer 31 includes a first opposing portion 31A opposing the second internal electrode layer 32 and a first lead portion 31B led out from the first opposing portion 31A to the first end surface LS1. The first lead portion 31B is exposed at the first end surface LS1.

[0044] The second internal electrode layer 32 includes a second opposing portion 32A opposing the first internal electrode layer 31 and a second lead portion 32B led out from the second opposing portion 32A to the second end surface LS2. The second lead portion 32B is exposed at the second end surface LS2.

[0045] In the present embodiment, the first opposing portion 31A and the second opposing portion 32A are opposed to each other via the dielectric layer 20 , thereby forming capacitance and exhibiting capacitor characteristics.

[0046] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be formed obliquely. The shapes of the first lead-out portion 31B and the second lead-out portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be formed obliquely.

[0047] The dimension of the first opposing portion 31A in the width direction W and the dimension of the first lead portion 31B in the width direction W may be formed to be the same dimension, or one of the dimensions may be formed to be smaller. The dimension of the second opposing portion 32A in the width direction W and the dimension of the second lead portion 32B in the width direction W may be formed to be the same dimension, or one of the dimensions may be formed to be smaller.

[0048] The first internal electrode layer 31 and the second internal electrode layer 32 are made of a suitable conductive material such as a metal such as Ni, Cu, Ag, Pd, Au, or an alloy containing at least one of these metals. When an alloy is used, the first internal electrode layer 31 and the second internal electrode layer 32 may be made of, for example, an Ag-Pd alloy.

[0049] The thickness of each of the first internal electrode layer 31 and the second internal electrode layer 32 is preferably about 0.2 μm or more and 2.0 μm or less, for example. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 15 or more and 1000 or less.

[0050] The first main surface side outer layer portion 12 is located on the first main surface TS1 side of the stacked body 10. The first main surface side outer layer portion 12 is an aggregate of a plurality of dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 closest to the first main surface TS1. The dielectric layer 20 used in the first main surface side outer layer portion 12 may be the same as the dielectric layer 20 used in the internal layer portion 11.

[0051] The second main surface side outer layer portion 13 is located on the second main surface TS2 side of the stacked body 10. The second main surface side outer layer portion 13 is an aggregate of a plurality of dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. The dielectric layer 20 used in the second main surface side outer layer portion 13 may be the same as the dielectric layer 20 used in the internal layer portion 11.

[0052] Thus, the laminated body 10 includes a plurality of laminated dielectric layers 20 and a plurality of internal electrode layers 30 laminated on the dielectric layers 20. That is, the laminated ceramic capacitor 1 includes the laminated body 10 in which the dielectric layers 20 and the internal electrode layers 30 are alternately laminated.

[0053] The laminate 10 also includes an opposing electrode portion 11E. The opposing electrode portion 11E is a portion where the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 face each other. The opposing electrode portion 11E is configured as a part of the inner layer portion 11. Figure 4A as well as Figure 4B , the range of the opposing electrode portion 11E in the width direction W and the length direction L is shown. In addition, the opposing electrode portion 11E is also referred to as a capacitor effective portion.

[0054] In addition, the stacked body 10 has a side outer layer portion. The side outer layer portion has a first side outer layer portion WG1 and a second side outer layer portion WG2. The first side outer layer portion WG1 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the first side WS1. The second side outer layer portion WG2 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the second side WS2. Figure 3 , Figure 4A as well as Figure 4B , the range of the first side outer layer portion WG1 and the second side outer layer portion WG2 in the width direction W is shown. In addition, the side outer layer portion is also called a W gap or a side gap.

[0055] In addition, the stacked body 10 has an end face side outer layer portion. The end face side outer layer portion has a first end face side outer layer portion LG1 and a second end face side outer layer portion LG2. The first end face side outer layer portion LG1 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the first end face LS1. The second end face side outer layer portion LG2 is a portion including the dielectric layer 20 located between the opposing electrode portion 11E and the second end face LS2. Figure 2 , Figure 4A as well as Figure 4B , the range of the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2 in the length direction L is shown. In addition, the end surface side outer layer portion is also called an L gap or an end gap.

[0056] The external electrode 40 includes a first external electrode 40A disposed on the first end surface LS1 side and a second external electrode 40B disposed on the second end surface LS2 side.

[0057] The first external electrode 40A is arranged on the first end surface LS1. The first external electrode 40A is connected to the first internal electrode layer 31. The first external electrode 40A may also be arranged on a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2. In the present embodiment, the first external electrode 40A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0058] The second external electrode 40B is arranged on the second end surface LS2. The second external electrode 40B is connected to the second internal electrode layer 32. The second external electrode 40B may also be arranged on a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2. In the present embodiment, the second external electrode 40B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0059] As described above, in the laminate 10, the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 are opposed to each other via the dielectric layer 20, thereby forming a capacitor. Therefore, the first external electrode 40A connected to the first internal electrode layer 31 and the second external electrode 40B connected to the second internal electrode layer 32 exhibit capacitor characteristics.

[0060] The first external electrode 40A includes a first foundation electrode layer 50A and a first plating layer 60A disposed on the first foundation electrode layer 50A.

[0061] The second external electrode 40B includes a second foundation electrode layer 50B and a second plating layer 60B disposed on the second foundation electrode layer 50B.

[0062] The first foundation electrode layer 50A is arranged on the first end surface LS1. The first foundation electrode layer 50A is connected to the first internal electrode layer 31. In the present embodiment, the first foundation electrode layer 50A is formed to extend from the first end surface LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0063] The second base electrode layer 50B is arranged on the second end surface LS2. The second base electrode layer 50B is connected to the second internal electrode layer 32. In the present embodiment, the second base electrode layer 50B is formed to extend from the second end surface LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0064] The first base electrode layer 50A and the second base electrode layer 50B of the present embodiment are sintered layers. The sintered layer preferably contains either a metal component and a glass component or a ceramic component, or contains both of them. The metal component, for example, contains at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The glass component, for example, contains at least one selected from B, Si, Ba, Mg, Al, Li, etc. The ceramic component can use the same type of ceramic material as the dielectric layer 20, or a ceramic material of a different type from the dielectric layer 20. The ceramic component, for example, contains at least one selected from BaTiO3, CaTiO3, (Ba, Ca)TiO3, SrTiO3, CaZrO3, etc.

[0065] The sintered layer is, for example, a sintered layer obtained by applying a conductive paste containing glass and metal to the laminate and sintering it. The sintered layer may be a sintered layer obtained by simultaneously sintering a laminated chip having an internal electrode and a dielectric layer and a conductive paste applied to the laminated chip, or a sintered layer obtained by sintering a laminated chip having an internal electrode and a dielectric layer and then applying a conductive paste to the laminate and sintering it. In addition, when the laminated chip having an internal electrode and a dielectric layer and the conductive paste applied to the laminated chip are sintered simultaneously, the sintered layer is preferably formed by sintering a paste to which a ceramic material is added instead of a glass component. In this case, as the added ceramic material, it is particularly preferred to use a ceramic material of the same type as the dielectric layer 20. The sintered layer may also be a multilayer.

[0066] The thickness of the first foundation electrode layer 50A in the longitudinal direction located at the first end surface LS1 is preferably about 10 μm or more and 150 μm or less in the center portion in the height direction T and the width direction W of the first foundation electrode layer 50A, for example.

[0067] The thickness of the second foundation electrode layer 50B in the longitudinal direction located at the second end surface LS2 is preferably about 10 μm or more and 150 μm or less in the center of the second foundation electrode layer 50B in the height direction T and the width direction W, for example.

[0068] When the first base electrode layer 50A is also provided on a portion of at least one surface of the first main surface TS1 or the second main surface TS2, the thickness of the first base electrode layer 50A provided on the portion in the height direction T is preferably, for example, greater than 10 μm and less than 100 μm in the central portion of the first base electrode layer 50A provided on the portion in the length direction L and the width direction W.

[0069] When the first base electrode layer 50A is also provided on a portion of at least one surface of the first side surface WS1 or the second side surface WS2, the thickness in the width direction of the first base electrode layer 50A provided on the portion is preferably, for example, greater than 10 μm and less than 100 μm in the central portion in the length direction L and the height direction T of the first base electrode layer 50A provided on the portion.

[0070] When the second base electrode layer 50B is also provided on a portion of at least one surface of the first main surface TS1 or the second main surface TS2, the thickness of the second base electrode layer 50B provided on the portion in the height direction T is preferably, for example, greater than 10 μm and less than 100 μm in the central portion in the length direction L and the width direction W of the second base electrode layer 50B provided on the portion.

[0071] When the second base electrode layer 50B is also provided on a portion of at least one surface of the first side surface WS1 or the second side surface WS2, the thickness in the width direction of the second base electrode layer 50B provided on the portion is preferably, for example, greater than 10 μm and less than 100 μm in the central portion in the length direction L and the height direction T of the second base electrode layer 50B provided on the portion.

[0072] In addition, the first base electrode layer 50A and the second base electrode layer 50B are not limited to sintered layers. The first base electrode layer 50A and the second base electrode layer 50B include at least one selected from a sintered layer, a conductive resin layer, a thin film layer, etc. For example, the first base electrode layer 50A and the second base electrode layer 50B may also be a thin film layer. The thin film layer is formed by a thin film forming method such as a sputtering method or a vapor deposition method. The thin film layer is a layer of less than 10 μm on which metal particles are deposited.

[0073] The first plating layer 60A is arranged to cover the first base electrode layer 50A.

[0074] The second plating layer 60B is arranged to cover the second base electrode layer 50B.

[0075] The first plating layer 60A and the second plating layer 60B may include, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, Ag-Pd alloy, Au, etc. The first plating layer 60A and the second plating layer 60B may also be formed of multiple layers. The first plating layer 60A and the second plating layer 60B are preferably a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0076] The first plating layer 60A is arranged to cover the first base electrode layer 50A. In the present embodiment, the first plating layer 60A includes a first Ni plating layer 61A and a first Sn plating layer 62A located on the first Ni plating layer 61A.

[0077] The second plating layer 60B is arranged to cover the second base electrode layer 50B. In the present embodiment, the second plating layer 60B includes a second Ni plating layer 61B and a second Sn plating layer 62B located on the second Ni plating layer 61B.

[0078] The Ni plating layer prevents the first base electrode layer 50A and the second base electrode layer 50B from being corroded by the solder when mounting the multilayer ceramic capacitor 1. In addition, the Sn plating layer improves the wettability of the solder when mounting the multilayer ceramic capacitor 1. Thus, the mounting of the multilayer ceramic capacitor 1 becomes easy. The thickness of each of the first Ni plating layer 61A, the first Sn plating layer 62A, the second Ni plating layer 61B, and the second Sn plating layer 62B is preferably 1 μm or more and 15 μm or less.

[0079] In addition, the first external electrode 40A and the second external electrode 40B of the present embodiment may also have a conductive resin layer containing a conductive filler and a thermosetting resin, for example. When a conductive resin layer is provided as a base electrode layer (the first base electrode layer 50A, the second base electrode layer 50B), the conductive resin layer may be configured to cover the sintered layer, or may be directly provided on the stacked body 10 without providing the sintered layer. When the conductive resin layer is configured to cover the sintered layer, the conductive resin layer is provided between the sintered layer and the plating layer (the first plating layer 60A, the second plating layer 60B). The conductive resin layer may completely cover the sintered layer, or may cover a portion of the sintered layer.

[0080] The conductive resin layer including a thermosetting resin is more flexible than, for example, a conductive layer including a plated film or a fired product of a conductive paste. Therefore, even when a physical impact or an impact caused by a thermal cycle is applied to the multilayer ceramic capacitor 1, the conductive resin layer functions as a buffer layer. Therefore, the conductive resin layer suppresses cracks in the multilayer ceramic capacitor 1.

[0081] The metal constituting the conductive filler may also be Ag, Cu, Ni, Sn, Bi or an alloy containing them. The conductive filler preferably contains Ag. The conductive filler is, for example, Ag metal powder. Ag has the lowest resistivity among metals and is therefore suitable for electrode materials. In addition, Ag is a noble metal and is therefore not easily oxidized and has high weather resistance. Therefore, Ag metal powder is suitable as a conductive filler.

[0082] In addition, the conductive filler may be a metal powder coated with Ag on the surface of the metal powder. When using a metal powder coated with Ag on the surface of the metal powder, the metal powder is preferably Cu, Ni, Sn, Bi or an alloy powder thereof. In order to make the metal of the base material a cheap metal while maintaining the characteristics of Ag, it is preferred to use a metal powder coated with Ag.

[0083] Furthermore, the conductive filler may be a conductive filler in which Cu or Ni has been subjected to an oxidation prevention treatment. In addition, the conductive filler may be a metal powder in which Sn, Ni or Cu is coated on the surface of the metal powder. When a metal powder in which Sn, Ni or Cu is coated on the surface of the metal powder is used, the metal powder is preferably Ag, Cu, Ni, Sn, Bi or an alloy powder thereof.

[0084] The shape of the conductive filler is not particularly limited. The conductive filler may be a spherical or flat conductive filler, but it is preferred to use a mixture of spherical metal powder and flat metal powder.

[0085] The average particle size of the conductive filler is not particularly limited, and may be, for example, 0.3 μm or more and 10 μm or less.

[0086] The conductive filler contained in the conductive resin layer preferably accounts for 35 vol % or more and 75 vol % or less relative to the volume of the entire conductive resin layer.

[0087] The conductive filler contained in the conductive resin layer mainly plays a role in ensuring the conductivity of the conductive resin layer. Specifically, a plurality of conductive fillers are in contact with each other, thereby forming a conductive path inside the conductive resin layer.

[0088] The resin constituting the conductive resin layer may also include at least one selected from various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, polyimide resin, etc. Among them, epoxy resin having excellent heat resistance, moisture resistance, adhesion, etc. is one of the most suitable resins. In addition, the resin of the conductive resin layer preferably includes a curing agent together with the thermosetting resin. When epoxy resin is used as the base resin, the curing agent of the epoxy resin may also be various known compounds such as phenolic, amine, anhydride, imidazole, active ester, and amide-imide.

[0089] The conductive resin layer may be formed of a plurality of layers. The thickness of the thickest portion of the conductive resin layer is preferably 10 μm or more and 200 μm or less.

[0090] Alternatively, the following structure may be adopted, that is, instead of providing the first base electrode layer 50A and the second base electrode layer 50B, the first plated layer 60A and the second plated layer 60B described later may be directly disposed on the laminate 10. That is, the laminated ceramic capacitor 1 may also have a structure including a plated layer that is directly electrically connected to the first internal electrode layer 31 and the second internal electrode layer 32. In such a case, the plated layer may be formed after a catalyst is disposed on the surface of the laminate 10 as a pretreatment.

[0091] In this case, the plating layer is also preferably a multilayer. The lower plating layer and the upper plating layer are preferably respectively, for example, preferably containing at least one metal selected from Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi or Zn, or an alloy containing these metals. The lower plating layer is more preferably formed using Ni with solder resistance. The upper plating layer is more preferably formed using Sn or Au with good solder wettability. In addition, for example, when Ni is used to form the first internal electrode layer 31 and the second internal electrode layer 32, the lower plating layer is preferably formed using Cu with good bonding properties with Ni. In addition, the upper plating layer can be formed as needed, and the external electrode 40 can also be composed of only the lower plating layer. In addition, the plating layer can use the upper plating layer as the outermost layer, and other plating layers can also be further formed on the surface of the upper plating layer.

[0092] The thickness of each plating layer arranged without providing a base electrode layer is preferably 1 μm or more and 15 μm or less. In addition, the plating layer preferably does not contain glass. The metal ratio per unit volume of the plating layer is preferably 99 volume % or more.

[0093] In addition, when the plating layer is directly formed on the laminated body 10, the thickness of the base electrode layer can be reduced. Therefore, the dimension of the height direction T of the laminated ceramic capacitor 1 can be reduced in accordance with the reduction of the thickness of the base electrode layer, thereby seeking to reduce the height of the laminated ceramic capacitor 1. Alternatively, the thickness of the dielectric layer 20 sandwiched between the first internal electrode layer 31 and the second internal electrode layer 32 can be increased in accordance with the reduction of the thickness of the base electrode layer, thereby seeking to increase the thickness of the body. In this way, by directly forming the plating layer on the laminated body 10, the degree of freedom in design of the laminated ceramic capacitor can be improved.

[0094] In addition, if the dimension in the length direction of the multilayer ceramic capacitor 1 including the stacked body 10 and the external electrode 40 is set to L dimension, the L dimension is preferably 0.2 mm or more and 10 mm or less. In addition, if the dimension in the height direction of the multilayer ceramic capacitor 1 is set to T dimension, the T dimension is preferably 0.1 mm or more and 5 mm or less. In addition, if the dimension in the width direction of the multilayer ceramic capacitor 1 is set to W dimension, the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0095] Here, when a voltage is applied between the external electrodes 40 in a state where water droplets generated by condensation, for example, wet and spread between the external electrodes 40 on the surface of the stacked body 10 without interruption, ionized metal species are dissolved and precipitated from the external electrodes 40, and electrochemical migration occurs. In this embodiment, in order to suppress the occurrence of this electrochemical migration, a hydrophobic portion 70 and a hydrophilic portion 80 are arranged on the surface of the stacked body 10.

[0096] Next, refer to Figure 1 , Figure 2 , Figure 4A to Figure 7 The structures of the hydrophobic portion 70 and the hydrophilic portion 80 will be described. Figure 5 It is along Figure 2 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line VV. Figure 6 It is along Figure 2 1 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line VI-VI. Figure 7 is for Figure 1 The multilayer ceramic capacitor 1 shown in FIG. 1 is a view of the first main surface TS1 side when viewed along the direction of arrow VII. Figure 7 In FIG. 1 , the outline of the stacked body 10 covered with the hydrophobic portion 70 , the hydrophilic portion 80 , and the external electrode 40 is shown by the dotted line.

[0097] The hydrophobic portion 70 is a hydrophobic layer disposed on the surface of the laminate 10. The hydrophobic portion 70 is formed by, for example, applying a fluorinated silane coupling material or the like to the laminate 10. In the present embodiment, one hydrophobic portion 70 is disposed on the surface of the laminate 10.

[0098] like Figure 1 , Figure 2 , Figure 4A , Figure 4B , Figure 5 ,as well as Figure 7 As shown, the hydrophobic portion 70 includes a first main surface side hydrophobic portion 71 , a second main surface side hydrophobic portion 72 , a first side surface side hydrophobic portion 73 , and a second side surface side hydrophobic portion 74 .

[0099] The first main surface side hydrophobic portion 71 is a hydrophobic layer containing at least one of fluorine and silicone. The first main surface side hydrophobic portion 71 is disposed on at least a portion of the first main surface TS1. Specifically, Figure 2 As shown in FIG. 1 , the first main surface side hydrophobic portion 71 is disposed in a region TE1 located between the first external electrode 40A and the second external electrode 40B in the first main surface TS1. In the present embodiment, the first main surface side hydrophobic portion 71 is disposed in the central portion in the length direction L of the stacked body 10 so as to extend in a strip-like manner along the width direction W. Figure 1 , Figure 5 ,as well as Figure 7 As shown, the first main surface side water-repellent portion 71 is arranged from the end portion on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2 side.

[0100] The second main surface side hydrophobic portion 72 is a hydrophobic layer containing at least one of fluorine and silicone. The second main surface side hydrophobic portion 72 is disposed on at least a portion of the second main surface TS2. Specifically, Figure 2 As shown in FIG. 1 , the second main surface side hydrophobic portion 72 is arranged in the region TE2 between the first external electrode 40A and the second external electrode 40B in the second main surface TS2. In the present embodiment, the second main surface side hydrophobic portion 72 is arranged in the central portion in the length direction L of the stacked body 10 so as to extend elongatedly in a strip shape along the width direction W. Figure 5 As shown, the second main surface side water-repellent portion 72 is arranged from the end portion on the first side surface WS1 side in the width direction W on the second main surface TS2 to the end portion on the second side surface WS2 side.

[0101] The first side hydrophobic portion 73 is a hydrophobic layer containing at least one of fluorine and silicone. The first side hydrophobic portion 73 is disposed on at least a portion of the first side surface WS1. Figure 4A as well as Figure 4BAs shown, the first side surface hydrophobic portion 73 is arranged in the area WE1 between the first external electrode 40A and the second external electrode 40B in the first side surface WS1. That is, the first side surface hydrophobic portion 73 is arranged between the first external electrode 40A and the second external electrode 40B in the first side surface WS1. In the present embodiment, the first side surface hydrophobic portion 73 is arranged in the central part of the length direction L of the stacked body 10 to extend in a strip-like elongated manner along the height direction T. The first side surface hydrophobic portion 73 is arranged from the end of the first main surface TS1 side in the height direction T on the first side surface WS1 to the end of the second main surface TS2 side.

[0102] The second side hydrophobic portion 74 is a hydrophobic layer containing at least one of fluorine and silicone. The second side hydrophobic portion 74 is disposed on at least a portion of the second side surface WS2. Figure 4A as well as Figure 4B As shown, the second side surface hydrophobic portion 74 is arranged in the area WE2 between the first external electrode 40A and the second external electrode 40B in the second side surface WS2. In the present embodiment, the second side surface hydrophobic portion 74 is arranged in the central part of the length direction L of the stacked body 10 to extend elongatedly in a strip shape along the height direction T. The second side surface hydrophobic portion 74 is arranged from the end on the first main surface TS1 side in the height direction T on the second side surface WS2 to the end on the second main surface TS2 side.

[0103] The hydrophobic portion 70 of this embodiment is as follows Figure 5 As shown in FIG. 1 , the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 are continuously arranged via the first side surface side hydrophobic portion 73, and are continuously arranged via the second side surface side hydrophobic portion 74. The first side surface side hydrophobic portion 73 and the second side surface side hydrophobic portion 74 are continuously arranged via the first main surface side hydrophobic portion 71, and are continuously arranged via the second main surface side hydrophobic portion 72. That is, the hydrophobic portion 70 is annular as a whole, and is arranged over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the stack 10. According to this structure, since the hydrophobic portion 70 is arranged on the surface of the stack 10, when water droplets W are generated due to condensation, it is possible to suppress the water droplets from wetting and spreading on the surface of the stack 10. Therefore, it is possible to suppress the formation of a water droplet path as a water film across the first external electrode 40A and the second external electrode 40B.

[0104] The hydrophilic portion 80 is a hydrophilic layer disposed on the surface of the stack 10. The hydrophilic portion 80 is formed by, for example, applying a silane coupling material containing a hydroxyl group to the stack 10. In the present embodiment, two hydrophilic portions 80, namely, hydrophilic portions 80a and 80b, are disposed on the surface of the stack 10. Specifically, the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 in the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2. The hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B in the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2. That is, the hydrophobic portion 70 is sandwiched by the hydrophilic portions 80 in the length direction L.

[0105] like Figure 1 , Figure 2 , Figure 4A , Figure 4B , Figure 6 ,as well as Figure 7 As shown, each hydrophilic portion 80 includes a first main surface side hydrophilic portion 81 , a second main surface side hydrophilic portion 82 , a first side surface side hydrophilic portion 83 , and a second side surface side hydrophilic portion 84 .

[0106] The first main surface side hydrophilic portion 81 is a hydrophilic layer having hydroxyl groups. The first main surface side hydrophilic portion 81 is disposed on at least a portion of the first main surface TS1. Specifically, Figure 2 As shown, the first main surface side hydrophilic portion 81 is arranged in the area TE1 located between the first external electrode 40A and the second external electrode 40B in the first main surface TS1. In the present embodiment, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the first main surface TS1. Specifically, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the first main surface TS1. That is, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80a is arranged to be in contact with the first main surface side hydrophobic portion 71 of the hydrophobic portion 70. In addition, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the first main surface TS1. Specifically, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80b is configured to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the first main surface TS1. That is, the first main surface side hydrophilic portion 81 of the hydrophilic portion 80b is configured to be in contact with the first main surface side hydrophobic portion 71 of the hydrophobic portion 70. Figure 6 as well as Figure 7 As shown, the first main surface side hydrophilic portion 81 is arranged from the end portion on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2 side.

[0107] The second main surface side hydrophilic portion 82 is a hydrophilic layer having hydroxyl groups. The second main surface side hydrophilic portion 82 is disposed on at least a portion of the second main surface TS2. Figure 2 As shown, the second main surface side hydrophilic portion 82 is arranged in the area TE2 located between the first external electrode 40A and the second external electrode 40B in the second main surface TS2. In the present embodiment, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the second main surface TS2. Specifically, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the second main surface TS2. That is, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a is arranged to be in contact with the second main surface side hydrophobic portion 72 of the hydrophobic portion 70. In addition, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the second main surface TS2. Specifically, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b is configured to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the second main surface TS2. That is, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b is configured to contact the second main surface side hydrophobic portion 72 of the hydrophobic portion 70. Figure 6 As shown, the second main surface side hydrophilic portion 82 is arranged from the end portion on the first side surface WS1 side in the width direction W on the second main surface TS2 to the end portion on the second side surface WS2 side.

[0108] The first side hydrophilic portion 83 is a hydrophilic layer having a hydroxyl group. The first side hydrophilic portion 83 is disposed on at least a portion of the first side surface WS1. Specifically, Figure 4A as well as Figure 4B As shown, the first side surface hydrophilic portion 83 is arranged in the area WE1 located between the first external electrode 40A and the second external electrode 40B in the first side surface WS1. In the present embodiment, the first side surface hydrophilic portion 83 of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the first side surface WS1. Specifically, the first side surface hydrophilic portion 83 of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the first side surface WS1. That is, the first side surface hydrophilic portion 83 of the hydrophilic portion 80a is arranged to be in contact with the first side surface hydrophobic portion 73 of the hydrophobic portion 70. In addition, the first side surface hydrophilic portion 83 of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the first side surface WS1. Specifically, the first side hydrophilic portion 83 of the hydrophilic portion 80b is configured to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the first side WS1. That is, the first side hydrophilic portion 83 of the hydrophilic portion 80b is configured to contact the first side hydrophobic portion 73 of the hydrophobic portion 70. Figure 6As shown in FIG. 8 , the first side surface hydrophilic portion 83 is arranged from the end portion on the first main surface TS1 side in the height direction T on the first side surface WS1 to the end portion on the second main surface TS2 side.

[0109] The second side hydrophilic portion 84 is a hydrophilic layer having a hydroxyl group. The second side hydrophilic portion 84 is disposed on at least a portion of the second side surface WS2. Figure 4A as well as Figure 4B As shown, the second side hydrophilic portion 84 is arranged in the area WE2 between the first external electrode 40A and the second external electrode 40B in the second side WS2. In the present embodiment, the second side hydrophilic portion 84 of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the second side WS2. Specifically, the second side hydrophilic portion 84 of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the second side WS2. That is, the second side hydrophilic portion 84 of the hydrophilic portion 80a is arranged to be in contact with the second side hydrophobic portion 74 of the hydrophobic portion 70. In addition, the second side hydrophilic portion 84 of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the second side WS2. Specifically, the second side hydrophilic portion 84 of the hydrophilic portion 80b is configured to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the second side WS2. That is, the second side hydrophilic portion 84 of the hydrophilic portion 80b is configured to contact the second side hydrophobic portion 74 of the hydrophobic portion 70. Figure 6 As shown in FIG. 8 , the second side surface hydrophilic portion 84 is arranged from the end portion on the first main surface TS1 side in the height direction T on the second side surface WS2 to the end portion on the second main surface TS2 side.

[0110] The hydrophilic portion 80 of this embodiment is as follows Figure 6 As shown in the figure, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 are continuously arranged via the first side surface side hydrophilic portion 83, and are continuously arranged via the second side surface side hydrophilic portion 84. The first side surface side hydrophilic portion 83 and the second side surface side hydrophilic portion 84 are continuously arranged via the first main surface side hydrophilic portion 81, and are continuously arranged via the second main surface side hydrophilic portion 82. That is, the hydrophilic portion 80 is annular as a whole, and is arranged over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the stacked body 10.

[0111] Here, when a water repellent is added to the surface of the laminate 10 and only a hydrophobic treatment is performed, but a hydrophilic treatment is not performed on the portion without the water repellent added, the difference in the contact angle of water between the portion with the water repellent added and the portion without the water repellent added is small, and sometimes a sufficient water repellent effect cannot be obtained.

[0112] In contrast, according to the multilayer ceramic capacitor 1 of the present embodiment, not only the hydrophobic portion 70 but also the hydrophilic portion 80 are arranged on the surface of the multilayer body 10 as the ceramic body. Figure 7 As shown, the water droplets W can be guided from the hydrophobic portion 70 to the hydrophilic portion 80. Thus, the formation of a water droplet path between the first external electrode 40A and the second external electrode 40B can be suppressed. Therefore, it becomes more difficult to form an inter-electrode path caused by the water droplets W, and thus the degradation caused by electrochemical migration can be greatly suppressed.

[0113] The thickness of the hydrophobic portion 70 is preferably not less than 5 nm and not more than 1000 nm. Thus, water droplets W generated by condensation can be guided to the hydrophilic portion 80, and the formation of a water droplet path across the first external electrode 40A and the second external electrode 40B can be more effectively suppressed. In addition, if the thickness of the hydrophobic portion 70 becomes less than 5 nm, the contact angle with water decreases, and the waterproof effect decreases. If the thickness of the hydrophobic portion 70 becomes greater than 1000 nm, when the stacked ceramic capacitor 1 is transported, the adsorption nozzle when the stacked ceramic capacitor 1 is inserted into the taping will adhere to the hydrophobic material forming the hydrophobic portion 70, which is likely to cause adsorption errors. In addition, the thickness of the hydrophobic portion 70 is obtained by measuring the weight, specific gravity and surface area of ​​the stacked ceramic capacitor 1 and converting them.

[0114] The thickness of the hydrophilic portion 80 is preferably greater than or equal to 10 nm and less than or equal to 500 nm.

[0115] Next, the contact angles of water of the hydrophobic portion 70 and the hydrophilic portion 80 are described. The difference between the contact angle of water in the hydrophobic portion 70 and the contact angle of water in the hydrophilic portion 80 is preferably 30° or more. The difference between the contact angle of water in the hydrophobic portion 70 and the contact angle of water in the hydrophilic portion 80 is more preferably 40° or more.

[0116] Next, a method for manufacturing the multilayer ceramic capacitor 1 according to the present embodiment will be described.

[0117] A dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste for the internal electrode contain a binder and a solvent. The binder and the solvent may be known binders and solvents.

[0118] On the dielectric sheet, a conductive paste for the internal electrode layer 30 is printed in a predetermined pattern by, for example, screen printing or gravure printing. Thus, a dielectric sheet having a pattern of the first internal electrode layer 31 and a dielectric sheet having a pattern of the second internal electrode layer 32 are prepared.

[0119] By stacking a predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed, a portion of the first main surface side outer layer portion 12 on the first main surface TS1 side is formed. By stacking a dielectric sheet on which the pattern of the first internal electrode layer 31 is printed and a dielectric sheet on which the pattern of the second internal electrode layer 32 is printed in sequence, a portion of the inner layer portion 11 is formed. By stacking a predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed on the portion of the inner layer portion 11, a portion of the second main surface side outer layer portion 13 on the second main surface TS2 side is formed. In this way, a laminated sheet is produced.

[0120] The laminated sheets are pressed in the height direction by isostatic pressing or the like, thereby producing a laminated block.

[0121] The stacked blocks are cut into predetermined sizes to produce stacked small pieces. At this time, the corners and ridges of the stacked small pieces may be rounded by barrel grinding or the like.

[0122] The stacked small pieces are fired to produce the stacked body 10. The firing temperature depends on the materials of the dielectric layer 20 and the internal electrode layer 30, but is preferably 900°C or higher and 1400°C or lower.

[0123] A conductive paste that becomes a base electrode layer (a first base electrode layer 50A and a second base electrode layer 50B) is applied to both end surfaces of the stack 10. In the present embodiment, the base electrode layer is a sintered layer. For example, a conductive paste containing a glass component and a metal is applied to the stack 10 by a method such as dipping. Then, a sintering treatment is performed to form the base electrode layer. The temperature of the sintering treatment at this time is preferably 700° C. or higher and 900° C. or lower.

[0124] In addition, when the stacked small pieces before firing and the conductive paste applied to the stacked small pieces are fired at the same time, the sintered layer is preferably formed by firing a paste to which a ceramic material is added instead of a glass component. In this case, as the added ceramic material, it is particularly preferred to use a ceramic material of the same type as the dielectric layer 20. In this case, the conductive paste is applied to the stacked small pieces before firing, and the stacked small pieces and the conductive paste applied to the stacked small pieces are fired at the same time, thereby forming a stacked body 10 formed with a sintered layer.

[0125] Then, a plating layer is formed on the surface of the base electrode layer. In the present embodiment, a first plating layer 60A is formed on the surface of the first base electrode layer 50A. In addition, a second plating layer 60B is formed on the surface of the second base electrode layer 50B. In the present embodiment, a Ni plating layer and a Sn plating layer are formed as plating layers. When performing the plating process, either electrolytic plating or electroless plating can also be used. However, regarding electroless plating, in order to increase the plating deposition speed, it is necessary to perform pretreatment using a catalyst, etc., so there is a disadvantage that the process is complicated. Therefore, it is usually preferred to use electrolytic plating. The Ni plating layer and the Sn plating layer are formed in sequence, for example, by roller plating.

[0126] In addition, when the base electrode layer is formed by a thin film layer, a thin film layer as the base electrode layer is formed in a portion where an external electrode is to be formed by masking, etc. The thin film layer is formed by a thin film forming method such as sputtering or evaporation. The thin film layer is a layer of 1.0 μm or less in which metal particles are deposited.

[0127] In addition, when a conductive resin layer is provided as a base electrode layer, the conductive resin layer can be configured to cover the sintered layer, or it can be directly configured on the laminate 10 without providing the sintered layer. When a conductive resin layer is provided, a conductive resin paste containing a thermosetting resin and a metal component is applied on the sintered layer or the laminate 10, and then heat-treated at a temperature of 250° C. to 550° C. or above. Thus, the thermosetting resin is heat-cured to form a conductive resin layer. The atmosphere during the heat treatment is preferably an N2 atmosphere. In addition, in order to prevent the scattering of the resin and to prevent the oxidation of various metal components, the oxygen concentration is preferably 100 ppm or less.

[0128] In addition, the base electrode layer may not be provided and the plating layer may be directly arranged on the exposed portion of the internal electrode layer 30 of the stack 10. In this case, the first end face LS1 and the second end face LS2 of the stack 10 are plated to form a plating layer on the exposed portion of the internal electrode layer 30. When the plating process is performed, any one of electrolytic plating and electroless plating may be used. However, regarding electroless plating, in order to increase the plating deposition speed, it is necessary to utilize a catalyst etc. for pretreatment, so there is a disadvantage that the process is complicated. Therefore, it is usually preferred to use electrolytic plating. As a plating method, it is preferred to use drum plating. In addition, it is also possible to form an upper plating layer by the same method as the lower plating layer as needed, and the upper plating layer is formed on the surface of the lower plating layer.

[0129] Next, the laminated body having the plated layer formed thereon is immersed in a hydrophobic agent using a dipping method or the like, thereby forming a hydrophobic portion on the entire surface of the laminated body. After trimming the portion where the hydrophilic portion is formed in the laminated body having the hydrophobic portion formed thereon using a laser or the like, the trimmed laminated body is immersed in a hydrophilic agent using a dipping method or the like, thereby forming a hydrophilic portion only in the portion where the hydrophobic portion is not formed. As the hydrophobic agent, for example, a fluorine-based silane coupling agent can be used. As the hydrophilic agent, for example, a silane coupling agent containing a hydroxyl group can be used.

[0130] In addition, by processing the first main surface TS1, the second main surface TS2, the first side surface WS1 and the second side surface WS2 of the stacked body to form a convex portion and arranging a hydrophobic portion on the convex portion, it is also possible to manufacture the laminated ceramic capacitor 1 of the fourth embodiment described later. The convex portion of a given thickness is formed by trimming the first main surface TS1, the second main surface TS2, the first side surface WS1 and the second side surface WS2 of the stacked body using a laser.

[0131] Through such manufacturing steps, the multilayer ceramic capacitor 1 can be manufactured.

[0132] The structure of the laminated body 10 of the laminated ceramic capacitor 1 is not limited to Figure 1 to Figure 6 For example, the multilayer ceramic capacitor 1 may also be as follows Fig. 8A , Figure 8B ,as well as Figure 8C The following are the multilayer ceramic capacitors with a 2-cell structure, a 3-cell structure, and a 4-cell structure.

[0133] Fig. 8A The multilayer ceramic capacitor 1 shown is a dual-structure multilayer ceramic capacitor 1, and includes, as the internal electrode layer 30, in addition to the first internal electrode layer 33 and the second internal electrode layer 34, a floating internal electrode layer 35 that is not extended to either the first end surface LS1 or the second end surface LS2. Figure 8B The illustrated multilayer ceramic capacitor 1 is a multilayer ceramic capacitor 1 having a triple structure including a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as the floating internal electrode layer 35 . Figure 8CThe stacked ceramic capacitor 1 shown is a stacked ceramic capacitor 1 of a four-connection structure having a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C as floating internal electrode layers 35. In this way, the floating internal electrode layer 35 is provided as the internal electrode layer 30, so that the stacked ceramic capacitor 1 has a structure in which the opposing electrode portion is divided into a plurality of parts. As a result, a plurality of capacitance components are formed between the opposing internal electrode layers 30, and the capacitance components are connected in series. Therefore, the voltage applied to each capacitance component becomes lower, and the stacked ceramic capacitor 1 can be made to have a high withstand voltage. In addition, it is self-evident that the stacked ceramic capacitor 1 of this embodiment can also be a multi-connection structure of more than four connections.

[0134] According to the multilayer ceramic capacitor 1 of the present embodiment, the following effects are achieved.

[0135] (1) A multilayer ceramic capacitor 1 according to the present embodiment comprises: a multilayer body 10 including a plurality of stacked dielectric layers 20, the multilayer body 10 having a first main surface TS1 and a second main surface TS2 opposite to each other in a height direction T, a first side surface WS1 and a second side surface WS2 opposite to each other in a width direction W perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 opposite to each other in a length direction L perpendicular to the height direction T and the width direction W; a first internal electrode layer 31 arranged on the plurality of dielectric layers 20 and exposed at the first end surface LS1; a second internal electrode layer 32 arranged on the plurality of dielectric layers 20 and exposed at the second end surface LS2; a first external electrode 40A arranged on the first end surface LS1; and a second external electrode 40B arranged on the second end surface LS2, wherein a hydrophilic portion 80 and a hydrophobic portion 70 are arranged on a surface of the multilayer body 10, the hydrophilic portion 80 having a first main surface arranged on the first main surface The hydrophilic portion 81 on the first main surface side which is at least partially arranged on the second main surface TS1 and has hydroxyl groups, the hydrophilic portion 82 on the second main surface side which is at least partially arranged on the second main surface TS2 and has hydroxyl groups, the hydrophilic portion 83 on the first side surface which is at least partially arranged on the first side surface WS1 and has hydroxyl groups, and the hydrophilic portion 84 on the second side surface which is at least partially arranged on the second side surface WS2 and has hydroxyl groups, the hydrophobic portion 70 has the hydrophilic portion 71 on the first main surface side which is at least partially arranged on the first main surface TS1 and contains at least one of fluorine and silicone, the hydrophobic portion 72 on the second main surface side which is at least partially arranged on the second main surface TS2 and contains at least one of fluorine and silicone, the hydrophobic portion 73 on the first side surface which is at least partially arranged on the first side surface WS1 and contains at least one of fluorine and silicone, and the hydrophobic portion 74 on the second side surface which is at least partially arranged on the second side surface WS2 and contains at least one of fluorine and silicone. Thus, by forming the hydrophobic portion 70 and the hydrophilic portion 80 on the surface of the laminate 10 as the ceramic main body, water droplets W generated by condensation can be guided to the hydrophilic portion 80. Therefore, the formation of a water droplet path between the first external electrode 40A and the second external electrode 40B can be suppressed, and the occurrence of electrochemical migration can be suppressed more reliably.

[0136] (2) The first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the multilayer ceramic capacitor 1 according to the present embodiment are continuously arranged via the first side surface side hydrophilic portion 83 and continuously arranged via the second side surface side hydrophilic portion 84, and the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 are continuously arranged via the first side surface side hydrophobic portion 73 and continuously arranged via the second side surface side hydrophobic portion 74. Thus, by continuously arranging the hydrophilic portion 80 over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the multilayer body 10, and continuously arranging the hydrophobic portion 70, water droplets W generated by condensation can be more reliably guided to the hydrophilic portion 80. Therefore, the formation of a water droplet path between the first external electrode 40A and the second external electrode 40B can be suppressed.

[0137] (3) The hydrophobic portion 70 of the multilayer ceramic capacitor 1 according to the present embodiment is sandwiched between the hydrophilic portions 80 in the longitudinal direction L. This further increases the effect of suppressing electrochemical migration.

[0138] Next, a multilayer ceramic capacitor 1 according to a second embodiment will be described. In the following description, detailed descriptions of the same structures as those of the first embodiment will be omitted. Fig. 9 is a diagram showing a multilayer ceramic capacitor 1 according to a second embodiment. Figure 7 The corresponding figure. Fig.10 is a diagram showing a multilayer ceramic capacitor 1 according to a second embodiment, and is a diagram showing a multilayer ceramic capacitor 1 according to a second embodiment. Figure 1 This figure corresponds to the arrow view when the second main surface TS2 side is viewed from the direction of the arrow X shown.

[0139] The multilayer ceramic capacitor 1 according to the second embodiment differs from the above-described embodiment in the configurations of the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70 and the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80 .

[0140] The hydrophobic portion 70 of the second embodiment will be described. The first main surface side hydrophobic portion 71 is arranged at the center of the laminate 10 in the longitudinal direction L so as to extend along the width direction W. Fig. 9 As shown, the first main surface side water-repellent portion 71 is arranged from the first side surface WS1 side to the second side surface WS2 side in the width direction W of the first main surface TS1 . The first main surface side water-repellent portion 71 has a first width direction side surface portion 711 and a first width direction center portion 712 .

[0141] The first widthwise side surface portion 711 is located on the first main surface TS1 on the first side surface WS1 and the second side surface WS2 in the widthwise direction W. Specifically, the first widthwise side surface portion 711 is located on the first main surface TS1 intersecting with the first side surface WS1 and the second side surface WS2.

[0142] The first width direction central portion 712 is located on the central portion side of the first main surface TS1 in the width direction W. The dimension d1 of the length direction L of the first main surface side hydrophobic portion 71 increases from the first width direction side portion 711 toward the first width direction central portion 712. That is, the dimension d1 of the length direction L of the first main surface side hydrophobic portion 71 increases from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the first main surface TS1 toward the central portion side in the width direction W.

[0143] The second main surface side water-repellent portion 72 is arranged in the central portion in the longitudinal direction L of the laminate 10 so as to extend along the width direction W. Fig.10 As shown, the second main surface side water repellent portion 72 is arranged from the first side surface WS1 side to the second side surface WS2 side in the width direction W in the second main surface TS2 . The second main surface side water repellent portion 72 has a second width direction side surface portion 721 and a second width direction center portion 722 .

[0144] The second widthwise side surface portion 721 is located on the second main surface TS2 on the first side surface WS1 and the second side surface WS2 in the widthwise direction W. Specifically, the second widthwise side surface portion 721 is located on the second main surface TS2 intersecting with the first side surface WS1 and the second side surface WS2.

[0145] The second width direction central portion 722 is located on the central portion side of the second main surface TS2 in the width direction W. The dimension d2 of the length direction L of the second main surface side hydrophobic portion 72 increases from the second width direction side portion 721 toward the second width direction central portion 722. That is, the dimension d2 of the length direction L of the second main surface side hydrophobic portion 72 increases from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the second main surface TS2 toward the central portion side in the width direction W.

[0146] The first side surface hydrophobic portion 73 and the second side surface hydrophobic portion 74 of the present embodiment have the same structure as the first embodiment, but may also have the same structure as the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the present embodiment. The first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70 of the present embodiment are continuously arranged via the first side surface hydrophobic portion 73, and are continuously arranged via the second side surface hydrophobic portion 74.

[0147] The hydrophilic portion 80 of the second embodiment will be described. Two hydrophilic portions 80 , 80 a and 80 b , are disposed on the surface of the laminate 10 .

[0148] like Fig. 9 As shown in FIG. 1 , the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the first main surface TS1. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the first main surface TS1. In addition, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the first main surface TS1. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b is arranged to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the first main surface TS1. That is, the dimension d3 of the length direction L of the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a, 80b decreases as it moves from the first side surface WS1 side or the second side surface WS2 side in the width direction W in the first main surface TS1 toward the center side in the width direction W.

[0149] like Fig.10 As shown in the figure, the hydrophilic portion 82 on the second main surface side of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70 in the second main surface TS2. Specifically, the hydrophilic portion 82 on the second main surface side of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 in the second main surface TS2. In addition, the hydrophilic portion 82 on the second main surface side of the hydrophilic portion 80b is arranged between the hydrophobic portion 70 and the second external electrode 40B in the second main surface TS2. Specifically, the hydrophilic portion 82 on the second main surface side of the hydrophilic portion 80b is arranged to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B in the second main surface TS2. That is, the dimension d4 of the length direction L of the hydrophilic portion 82 on the second main surface side of the hydrophilic portion 80a, 80b becomes smaller as it moves from the first side surface WS1 side or the second side surface WS2 side in the width direction W in the second main surface TS2 toward the central portion side in the width direction W.

[0150] The first side surface hydrophilic portion 83 and the second side surface hydrophilic portion 84 of the present embodiment have the same structure as those of the first embodiment, but may also have the same structure as the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the present embodiment. The first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80 of the present embodiment are continuously arranged via the first side surface hydrophilic portion 83, and are continuously arranged via the second side surface hydrophilic portion 84.

[0151] According to the multilayer ceramic capacitor 1 of the present embodiment, in addition to the above-mentioned (1) to (3), the following effects are achieved.

[0152] (4) The first main surface side hydrophobic portion 71 of the multilayer ceramic capacitor 1 involved in this embodiment includes a first width direction side portion 711 located on the first side surface WS1 side and the second side surface WS2 side in the width direction W of the first main surface TS1, and a first width direction central portion 712 located on the central portion side of the width direction W. The second main surface side hydrophobic portion 72 includes a second width direction side portion 721 located on the first side surface WS1 side and the second side surface WS2 side in the width direction W of the second main surface TS2, and a second width direction central portion 722 located on the central portion side of the width direction W. The dimension d1 of the first main surface side hydrophobic portion 71 in the length direction L increases from the first width direction side portion 711 toward the first width direction central portion 712, and the dimension d2 of the second main surface side hydrophobic portion 72 in the length direction L increases from the second width direction side portion 721 toward the second width direction central portion 722. Thus, the dimension d1 of the first main surface side hydrophobic portion 71 in the length direction L and the dimension d2 of the second main surface side hydrophobic portion 72 in the length direction L increase toward the center portion side in the width direction W. Fig. 9 as well as Fig.10 As shown, water droplets W generated by condensation are guided to the hydrophilic portion 80 and are easily removed from the surface of the laminate 10. Therefore, the formation of a water droplet path between the first external electrode 40A and the second external electrode 40B can be more effectively suppressed.

[0153] Next, a multilayer ceramic capacitor 1 according to a third embodiment will be described. In the following description, detailed descriptions of the same structures as those of the first embodiment will be omitted. Fig.11 is a diagram showing a multilayer ceramic capacitor 1 according to a third embodiment. Figure 7 The corresponding figure.

[0154] The multilayer ceramic capacitor 1 according to the third embodiment is different from the first embodiment in the configurations of the hydrophobic portion 70 and the hydrophilic portion 80 .

[0155] The hydrophobic portion 70 of the third embodiment is disposed in plurality on the surface of the laminate 10. Fig.11 As shown, between the first external electrode 40A and the second external electrode 40B on the surface of the laminate 10, three hydrophobic portions 70, namely, hydrophobic portions 70a, 70b, and 70c are arranged at intervals from each other in the longitudinal direction L. Specifically, as shown in FIG. Fig.11 As shown in the figure, the hydrophobic portion 70a is arranged in the central portion in the longitudinal direction L, the hydrophobic portion 70b is arranged between the first external electrode 40A and the hydrophobic portion 70a, and the hydrophobic portion 70c is arranged between the hydrophobic portion 70a and the second external electrode 40B. Each hydrophobic portion 70 is annular as a whole and is arranged over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the stacked body 10.

[0156] Each hydrophobic portion 70 has a first main surface side hydrophobic portion 71 configured at least in part on the first main surface TS1, a second main surface side hydrophobic portion 72 configured at least in part on the second main surface TS2, a first side surface side hydrophobic portion 73 configured at least in part on the first side surface WS1, and a second side surface side hydrophobic portion 74 configured at least in part on the second side surface WS2.

[0157] like Fig.11 As shown, the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a is configured to extend elongatedly in a strip shape along the width direction W at the central portion in the length direction L of the stack 10. The first main surface side hydrophobic portion 71 extends from the end portion on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2 side. In the present embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70a are configured to extend elongatedly in a strip shape along the width direction W at the central portion in the length direction L of the stack 10 similarly to the first main surface side hydrophobic portion 71. In addition, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70a are continuously configured via the first side surface side hydrophobic portion 73, and are continuously configured via the second side surface side hydrophobic portion 74.

[0158] like Fig.11 As shown in FIG. 1 , the first main surface side hydrophobic portion 71 of the hydrophobic portion 70b is arranged between the first external electrode 40A and the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a so as to extend elongatedly in a strip shape along the width direction W. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70b extends substantially parallel to the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a from the end portion on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2 side. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70b is arranged with a gap with respect to the first external electrode 40A and the hydrophobic portion 70a. In the present embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70b are arranged between the first external electrode 40A and the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a so as to extend elongatedly in a strip shape along the width direction W. In addition, the first main surface side water repellent portion 71 and the second main surface side water repellent portion 72 of the water repellent portion 70 b are continuously arranged via the first side surface side water repellent portion 73 , and are continuously arranged via the second side surface side water repellent portion 74 .

[0159] like Fig.11As shown in FIG. 1 , the first main surface side hydrophobic portion 71 of the hydrophobic portion 70c is arranged between the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a and the second external electrode 40B to extend in a strip-like elongated manner along the width direction W. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70c extends substantially parallel to the first main surface side hydrophobic portion 71 of the hydrophobic portion 70c from the end portion on the first side surface WS1 in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70c is arranged with a gap between the hydrophobic portion 70c and the second external electrode 40B. In the present embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70c are arranged between the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a and the second external electrode 40B so as to extend elongatedly in a strip shape along the width direction W. Furthermore, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70c are arranged continuously via the first side surface side hydrophobic portion 73, and are arranged continuously via the second side surface side hydrophobic portion 74.

[0160] The hydrophilic portion 80 of the third embodiment is disposed in plurality on the surface of the laminate 10. Fig.11 As shown, between the first external electrode 40A and the second external electrode 40B on the surface of the laminate 10, four hydrophilic portions 80, namely, hydrophilic portions 80a, 80b, 80c, and 80d are arranged at intervals from each other in the longitudinal direction L. Specifically, as shown in FIG. Fig.11 As shown in FIG. 1 , the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70b, the hydrophilic portion 80b is arranged between the hydrophobic portion 70b and the hydrophobic portion 70a, the hydrophilic portion 80c is arranged between the hydrophobic portion 70a and the hydrophobic portion 70c, and the hydrophilic portion 80d is arranged between the hydrophobic portion 70c and the second external electrode 40B. That is, the hydrophobic portion 70 is sandwiched by the hydrophilic portions 80 in the longitudinal direction L. Each hydrophilic portion 80 is annular as a whole and is arranged over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the stacked body 10.

[0161] Each hydrophilic portion 80 has a first main surface side hydrophilic portion 81 which is arranged at least in part on the first main surface TS1, a second main surface side hydrophilic portion 82 which is arranged at least in part on the second main surface TS2, a first side surface side hydrophilic portion 83 which is arranged at least in part on the first side surface WS1, and a second side surface side hydrophilic portion 84 which is arranged at least in part on the second side surface WS2.

[0162] like Fig.11As shown in the figure, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70b to extend in a strip-like elongated manner along the width direction W. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a is arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70b in the first main surface TS1. That is, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a is arranged to be in contact with the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70b. The hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80a extends from the end on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end on the second side surface WS2 side. In the present embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80a are arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70b, similarly to the first main surface side hydrophilic portion 81. In addition, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a are arranged continuously via the first side surface side hydrophilic portion 83, and are arranged continuously via the second side surface side hydrophilic portion 84.

[0163] like Fig.11 As shown, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b is arranged between the hydrophobic portion 70b and the hydrophobic portion 70a to extend in a strip-like slender manner along the width direction W. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b is arranged to cover the entire surface between the hydrophobic portion 70b and the hydrophobic portion 70a in the first main surface TS1. That is, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b is arranged to be in contact with both the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70a and the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70b. The hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80b extends from the end on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end on the second side surface WS2 side. In the present embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80b are arranged to cover the entire surface between the hydrophobic portion 70b and the hydrophobic portion 70a, similarly to the first main surface side hydrophilic portion 81. In addition, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b are arranged continuously via the first side surface side hydrophilic portion 83, and are arranged continuously via the second side surface side hydrophilic portion 84.

[0164] like Fig.11As shown, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80c is arranged between the hydrophobic portion 70a and the hydrophobic portion 70c to extend in a strip-like elongated manner along the width direction W. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80c is arranged to cover the entire surface between the hydrophobic portion 70a and the hydrophobic portion 70c in the first main surface TS1. That is, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80c is arranged to be in contact with both the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70a and the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70c. The hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80c extends from the end on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end on the second side surface WS2 side. In the present embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80c are arranged to cover the entire surface between the hydrophobic portion 70a and the hydrophobic portion 70c, similarly to the first main surface side hydrophilic portion 81. In addition, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80c are arranged continuously via the first side surface side hydrophilic portion 83, and are arranged continuously via the second side surface side hydrophilic portion 84.

[0165] like Fig.11 As shown in FIG. 1 , the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80d is arranged between the hydrophobic portion 70c and the second external electrode 40B to extend in a strip-like elongated manner along the width direction W. Specifically, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80d is arranged to cover the entire surface between the hydrophobic portion 70c and the second external electrode 40B in the first main surface TS1. That is, the hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80d is arranged to be in contact with the hydrophobic portion 71 on the first main surface side of the hydrophobic portion 70c. The hydrophilic portion 81 on the first main surface side of the hydrophilic portion 80d extends from the end on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end on the second side surface WS2 side. In the present embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80d are arranged to cover the entire surface between the hydrophobic portion 70c and the second external electrode 40B, similarly to the first main surface side hydrophilic portion 81. In addition, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80d are arranged continuously via the first side surface side hydrophilic portion 83, and are arranged continuously via the second side surface side hydrophilic portion 84.

[0166] According to the multilayer ceramic capacitor 1 of the present embodiment, in addition to the above-mentioned (1) to (3), the following effects are achieved.

[0167] (5) The multilayer ceramic capacitor 1 according to the present embodiment has a plurality of hydrophobic portions 70. Thus, by adopting a structure in which a plurality of hydrophobic portions 70 are arranged, water droplets W generated by condensation can be guided to the hydrophilic portion 80, and the formation of a water droplet path across the first external electrode 40A and the second external electrode 40B can be more effectively suppressed. In addition, the plurality of hydrophobic portions 70 are sandwiched by the hydrophilic portion 80 in the length direction L, so that Fig.11 As shown, the water droplets W can be guided from each hydrophobic portion 70 to the hydrophilic portion 80 , and can be efficiently removed from the surface of the laminate 10 .

[0168] Next, a multilayer ceramic capacitor 1 according to a fourth embodiment will be described. In the following description, detailed descriptions of the same structures as those of the first embodiment will be omitted. Fig.12 is a diagram showing a laminated ceramic capacitor 1 according to a fourth embodiment. Figure 7 The corresponding figure. Fig.13 is a hypothetical arrow view showing a state in which the second external electrode 40B is removed from the multilayer ceramic capacitor 1 and along the Fig.12 The second end face LS2 is viewed from the imaginary XIII direction of the multilayer ceramic capacitor 1 shown in FIG. Fig.12 In FIG. 1 , the outline of the stacked body 10 covered by the hydrophobic portion 70, the hydrophilic portion 80, and the external electrode 40 is shown by a dotted line. Fig.13 In FIG. 1 , the outline of the laminate 10 covered with the hydrophobic portion 70 is shown by a dotted line.

[0169] The multilayer ceramic capacitor 1 according to the fourth embodiment is different from the first embodiment in the configurations of the multilayer body 10 and the water-repellent portion 70 .

[0170] The laminated body 10 of the present embodiment is different from the laminated body 10 of the first embodiment in that it has first main surface side protrusions 91 , second main surface side protrusions 92 , first side surface side protrusions 93 , and second side surface side protrusions 94 on its surface.

[0171] The first main surface side protrusion 91 protrudes in a direction away from the stacked body 10 at the center of the first main surface TS1 in the longitudinal direction L. The first main surface side protrusion 91 is formed to extend continuously in the width direction W. The first main surface side protrusion 91 is arranged with a gap relative to the first external electrode 40A and the second external electrode 40B. The first main surface side protrusion 91 is arranged from the end of the first side surface WS1 side in the width direction W on the first main surface TS1 to the end of the second side surface WS2 side.

[0172] The second main surface side protrusion 92 protrudes in a direction away from the stacked body 10 at the center portion of the second main surface TS2 in the longitudinal direction L. The second main surface side protrusion 92 is formed to extend continuously in the width direction W. The second main surface side protrusion 92 is arranged with a gap relative to the first external electrode 40A and the second external electrode 40B. The second main surface side protrusion 92 is arranged from the end on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end on the second side surface WS2 side.

[0173] The first side convex portion 93 protrudes in a direction away from the stacked body 10 at the center of the first side surface WS1 in the length direction L. The first side convex portion 93 is formed to extend continuously in the height direction T. The first side convex portion 93 is arranged with a gap relative to the first external electrode 40A and the second external electrode 40B. The first side convex portion 93 is arranged from the end portion on the first main surface TS1 side in the height direction T on the first side surface WS1 to the end portion on the second main surface TS2 side.

[0174] The second side convex portion 94 protrudes in a direction away from the stacked body 10 at the center of the first side WS1 in the length direction L. The second side convex portion 94 is formed to extend continuously in the height direction T. The second side convex portion 94 is arranged with a gap relative to the first external electrode 40A and the second external electrode 40B. The second side convex portion 94 is arranged from the end portion on the first main surface TS1 side in the height direction T on the first side WS1 to the end portion on the second main surface TS2 side.

[0175] The laminate 10 of this embodiment is as follows Fig.13 As shown, the first main surface side convex portion 91 and the second main surface side convex portion 92 are continuously arranged via the first side surface side convex portion 93 , and are continuously arranged via the second side surface side convex portion 94 .

[0176] The water-repellent portion 70 of the present embodiment includes a first main-surface-side water-repellent portion 71 , a second main-surface-side water-repellent portion 72 , a first side-surface-side water-repellent portion 73 , and a second side-surface-side water-repellent portion 74 .

[0177] The first main surface side hydrophobic portion 71 is arranged on the first main surface side convex portion 91. Specifically, the first main surface side hydrophobic portion 71 is arranged to cover the first main surface side convex portion 91. That is, the first main surface side hydrophobic portion 71 is arranged in the central portion of the length direction L of the first main surface TS1 to extend along the width direction W. The first main surface side hydrophobic portion 71 is arranged from the end portion on the first side surface WS1 side in the width direction W on the first main surface TS1 to the end portion on the second side surface WS2 side.

[0178] The second main surface side hydrophobic portion 72 is arranged on the second main surface side convex portion 92. Specifically, the second main surface side hydrophobic portion 72 is arranged to cover the second main surface side convex portion 92. That is, the second main surface side hydrophobic portion 72 is arranged in the central portion in the length direction L of the second main surface TS2 to extend along the width direction W. The second main surface side hydrophobic portion 72 is arranged from the end portion on the first side surface WS1 side in the width direction W on the second main surface TS2 to the end portion on the second side surface WS2 side.

[0179] The first side hydrophobic portion 73 is arranged on the first side convex portion 93. Specifically, the first side hydrophobic portion 73 is arranged to cover the first side convex portion 93. That is, the first side hydrophobic portion 73 is arranged in the central portion of the length direction L of the first side surface WS1 to extend along the height direction T. The first side hydrophobic portion 73 is arranged from the end portion on the first main surface TS1 side in the height direction T on the first side surface WS1 to the end portion on the second main surface TS2 side.

[0180] The second side hydrophobic portion 74 is arranged on the second side convex portion 94. Specifically, the second side hydrophobic portion 74 is arranged to cover the second side convex portion 94. That is, the second side hydrophobic portion 74 is arranged in the central portion of the length direction L of the second side surface WS2 to extend along the height direction T. The second side hydrophobic portion 74 is arranged from the end portion on the first main surface TS1 side in the height direction T on the second side surface WS2 to the end portion on the second main surface TS2 side.

[0181] The hydrophobic portion 70 of this embodiment is as follows Fig.13 As shown, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 are continuously arranged via the first side surface side hydrophobic portion 73, and are continuously arranged via the second side surface side hydrophobic portion 74. That is, the hydrophobic portion 70 is annular as a whole, and is arranged over the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the stacked body 10.

[0182] The hydrophilic portion 80 of this embodiment is configured with two hydrophilic portions 80a and 80b as in the first embodiment. The hydrophilic portion 80a is configured to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70. The hydrophilic portion 80b is configured to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B. That is, the hydrophobic portion 70 is sandwiched by the hydrophilic portions 80 in the longitudinal direction L and is in contact with both the hydrophilic portion 80a and the hydrophilic portion 80b.

[0183] According to the multilayer ceramic capacitor 1 of the present embodiment, in addition to the above-mentioned (1) to (3), the following effects are achieved.

[0184] (6) The laminated body 10 of the laminated ceramic capacitor 1 according to the present embodiment comprises: a first main surface side protrusion 91 which protrudes in a direction away from the surface of the laminated body 10 at a center portion in the longitudinal direction L of the first main surface TS1; a second main surface side protrusion 92 which protrudes in a direction away from the surface of the laminated body 10 at a center portion in the longitudinal direction L of the second main surface TS2; a first side surface side protrusion 93 which protrudes in a direction away from the surface of the laminated body 10 at a center portion in the longitudinal direction L of the first side surface WS1; and a second side surface side protrusion 94 which protrudes in a direction away from the surface of the second side surface WS2. The center portion of WS2 in the length direction L protrudes in the direction away from the surface of the stack 10, the first main surface side protrusion 91 and the second main surface side protrusion 92 are continuously arranged via the first side surface protrusion 93 and continuously arranged via the second side surface protrusion 94, the first main surface side hydrophobic portion 71 is arranged on the first main surface side protrusion 91, the second main surface side hydrophobic portion 72 is arranged on the second main surface side protrusion 92, the first side surface side hydrophobic portion 73 is arranged on the first side surface side protrusion 93, and the second side surface side hydrophobic portion 74 is arranged on the second side surface side protrusion 94. Thus, the first external electrode 40A side and the second external electrode 40B side in the length direction L of the stack 10 protrude from the surface of the stack 10 and are divided by the portion where the hydrophobic portion 70 is arranged, so that the formation of a water droplet path across the first external electrode 40A and the second external electrode 40B can be suppressed. Furthermore, since the hydrophobic portion 70 is sandwiched between the hydrophilic portions 80 , water droplets W generated by condensation can be guided to the hydrophilic portions 80 , and formation of a water droplet path across the first external electrode 40A and the second external electrode 40B can be more effectively suppressed.

[0185] The present invention is not limited to the configuration of the above-described embodiment, and can be applied with appropriate changes within the scope of the present invention. In addition, a combination of two or more of the preferred configurations described in the above-described embodiment also constitutes the present invention.

[0186] The multilayer ceramic capacitor 1 of the present invention can also be described as follows.

[0187] <1>

[0188] A multilayer ceramic capacitor comprising:

[0189] A laminated body comprising a plurality of laminated dielectric layers, having a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the height direction and the width direction;

[0190] a first internal electrode layer disposed on the plurality of dielectric layers and exposed at the first end surface;

[0191] a second internal electrode layer disposed on the plurality of dielectric layers and exposed at the second end surface;

[0192] a first external electrode disposed on the first end surface; and

[0193] a second external electrode disposed on the second end surface,

[0194] in,

[0195] A hydrophilic portion and a hydrophobic portion are arranged on the surface of the laminate,

[0196] The hydrophilic portion has:

[0197] The first main surface side hydrophilic portion is disposed on at least a portion of the first main surface and has a hydroxyl group;

[0198] The second main surface side hydrophilic portion is disposed on at least a portion of the second main surface and has a hydroxyl group;

[0199] The first side surface hydrophilic portion, at least a portion of which is disposed on the first side surface, has a hydroxyl group; and

[0200] The second side hydrophilic portion, at least a portion of which is disposed on the second side, has a hydroxyl group.

[0201] The hydrophobic portion has:

[0202] The first main surface side hydrophobic portion is disposed on at least a portion of the first main surface and contains at least one of fluorine and silicone;

[0203] The second main surface side hydrophobic portion is disposed on at least a portion of the second main surface and contains at least one of fluorine and silicone;

[0204] a first side surface hydrophobic portion, at least a portion of which is disposed on the first side surface and contains at least one of fluorine and silicone; and

[0205] At least a portion of the second-side surface hydrophobic portion disposed on the second side surface contains at least one of fluorine and silicone.

[0206] <2>

[0207] according to <1> The multilayer ceramic capacitor, wherein:

[0208] The first main surface side hydrophilic portion and the second main surface side hydrophilic portion are continuously arranged via the first side surface side hydrophilic portion, and are continuously arranged via the second side surface side hydrophilic portion,

[0209] The first main-surface-side water-repellent portion and the second main-surface-side water-repellent portion are continuously arranged via the first side-surface-side water-repellent portion, and are continuously arranged via the second side-surface-side water-repellent portion.

[0210] <3>

[0211] according to <1> or <2> The multilayer ceramic capacitor, wherein:

[0212] The hydrophobic portion is sandwiched by the hydrophilic portion in the longitudinal direction.

[0213] <4>

[0214] according to <1> to <3> The multilayer ceramic capacitor according to any one of the preceding claims, wherein:

[0215] The first main surface side water-repellent portion includes a first width direction side portion located on the first side surface and the second side surface in the width direction of the first main surface, and a first width direction central portion located on the central portion side in the width direction.

[0216] The second main surface side water-repellent portion has a second width direction side portion located on the first side surface and the second side surface in the width direction of the second main surface, and a second width direction central portion located on the central portion side in the width direction.

[0217] The dimension of the first main surface side hydrophobic portion in the longitudinal direction increases from the first width direction side portion toward the first width direction center portion.

[0218] A dimension of the second main-surface-side water-repellent portion in the longitudinal direction increases from the second width-direction side portion toward the second width-direction center portion.

[0219] <5>

[0220] according to <1> to <4> The multilayer ceramic capacitor according to any one of the preceding claims, wherein:

[0221] The hydrophobic portion is provided in plurality.

[0222] <6>

[0223] according to <1> to <5> The multilayer ceramic capacitor according to any one of the preceding claims, wherein:

[0224] The laminated body has:

[0225] A first main surface side protrusion protrudes in a direction away from the surface of the stacked body at a center portion of the first main surface in the longitudinal direction;

[0226] A second main surface side protrusion protrudes in a direction away from the surface of the stacked body at a center portion of the second main surface in the longitudinal direction;

[0227] a first side convex portion protruding in a direction away from the surface of the stacked body at a center portion of the first side in the longitudinal direction; and

[0228] The second side convex portion protrudes in a direction away from the surface of the stacked body at a center portion of the second side in the longitudinal direction.

[0229] The first main surface side convex portion and the second main surface side convex portion are continuously arranged via the first side surface side convex portion, and are continuously arranged via the second side surface side convex portion,

[0230] The first main surface side hydrophobic portion is arranged on the first main surface side convex portion,

[0231] The second main surface side hydrophobic portion is arranged on the second main surface side convex portion,

[0232] The first side hydrophobic portion is disposed on the first side convex portion.

[0233] The second side surface water-repellent portion is disposed on the second side surface convex portion.

[0234] Description of Reference Numerals

[0235] 1: Multilayer ceramic capacitor;

[0236] 10: laminate;

[0237] 11: inner layer;

[0238] 12: first main surface side outer layer portion;

[0239] 13: outer layer portion on the second main surface side;

[0240] 20: dielectric layer;

[0241] 31: first internal electrode layer;

[0242] 32: second internal electrode layer;

[0243] 40A: 1st external electrode;

[0244] 40B: second external electrode;

[0245] 70, 70a, 70b, 70c: hydrophobic portion;

[0246] 71: first main surface side hydrophobic portion;

[0247] 72: hydrophobic portion on the second main surface side;

[0248] 73: first side hydrophobic portion;

[0249] 74: second side hydrophobic portion;

[0250] 80, 80a, 80b, 80c, 80d: hydrophilic part;

[0251] 81: first main surface side hydrophilic portion;

[0252] 82: hydrophilic portion on the second main surface side;

[0253] 83: first side hydrophilic portion;

[0254] 84: second side hydrophilic portion;

[0255] L: length direction;

[0256] LS1: 1st end face;

[0257] LS2: 2nd end face;

[0258] T: stacking direction;

[0259] TS1: 1st main surface;

[0260] TS2: 2nd main surface;

[0261] W: width direction;

[0262] WS1: side 1;

[0263] WS2: Side 2.

Claims

1. A multilayer ceramic capacitor comprising: A laminated body comprising a plurality of laminated dielectric layers, having a first main surface and a second main surface opposite to each other in a height direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the height direction and the width direction; a first internal electrode layer disposed on the plurality of dielectric layers and exposed at the first end surface; a second internal electrode layer disposed on the plurality of dielectric layers and exposed at the second end surface; a first external electrode disposed on the first end surface; and a second external electrode disposed on the second end surface, in, A hydrophilic portion and a hydrophobic portion are arranged on the surface of the laminate, The hydrophilic portion has: The first main surface side hydrophilic portion is disposed on at least a portion of the first main surface and has a hydroxyl group; The second main surface side hydrophilic portion is disposed on at least a portion of the second main surface and has a hydroxyl group; The first side surface hydrophilic portion, at least a portion of which is disposed on the first side surface, has a hydroxyl group; and The second side hydrophilic portion, at least a portion of which is disposed on the second side, has a hydroxyl group. The hydrophobic portion has: The first main surface side hydrophobic portion is disposed on at least a portion of the first main surface and contains at least one of fluorine and silicone; The second main surface side hydrophobic portion is disposed on at least a portion of the second main surface and contains at least one of fluorine and silicone; a first side surface hydrophobic portion, at least a portion of which is disposed on the first side surface and contains at least one of fluorine and silicone; and At least a portion of the second-side surface hydrophobic portion disposed on the second side surface contains at least one of fluorine and silicone.

2. The multilayer ceramic capacitor according to claim 1, wherein The first main surface side hydrophilic portion and the second main surface side hydrophilic portion are continuously arranged via the first side surface side hydrophilic portion, and are continuously arranged via the second side surface side hydrophilic portion, The first main-surface-side water-repellent portion and the second main-surface-side water-repellent portion are continuously arranged via the first side-surface-side water-repellent portion, and are continuously arranged via the second side-surface-side water-repellent portion.

3. The multilayer ceramic capacitor according to claim 1 or 2, wherein: The hydrophobic portion is sandwiched by the hydrophilic portion in the longitudinal direction.

4. The multilayer ceramic capacitor according to any one of claims 1 to 3, wherein The first main surface side water-repellent portion has a first width direction side portion located on the first side surface and the second side surface in the width direction of the first main surface, and a first width direction central portion located on the width direction central portion side. The second main surface side water-repellent portion has a second width direction side portion located on the first side surface and the second side surface in the width direction of the second main surface, and a second width direction central portion located on the width direction central portion side. The dimension of the first main surface side hydrophobic portion in the longitudinal direction increases from the first width direction side portion toward the first width direction center portion. A dimension of the second main-surface-side water-repellent portion in the longitudinal direction increases from the second width-direction side portion toward the second width-direction center portion.

5. The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein The hydrophobic portion is provided in plurality.

6. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein The laminated body has: A first main surface side protrusion protrudes in a direction away from the surface of the stacked body at a center portion of the first main surface in the longitudinal direction; A second main surface side protrusion protrudes in a direction away from the surface of the stacked body at a center portion of the second main surface in the longitudinal direction; A first side convex portion protrudes in a direction away from the surface of the stacked body at a center portion of the first side in the longitudinal direction; and The second side convex portion protrudes in a direction away from the surface of the stacked body at a center portion of the second side in the longitudinal direction. The first main surface side convex portion and the second main surface side convex portion are continuously arranged via the first side surface side convex portion, and are continuously arranged via the second side surface side convex portion, The first main surface side hydrophobic portion is arranged on the first main surface side convex portion, The second main surface side hydrophobic portion is arranged on the second main surface side convex portion, The first side hydrophobic portion is disposed on the first side convex portion. The second side surface water-repellent portion is disposed on the second side surface convex portion.

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