Anisotropic conductive adhesive film with high capture rate as well as preparation method and application of anisotropic conductive adhesive film

Abstract

The invention belongs to the technical field of anisotropic conductive adhesive films, and relates to an anisotropic conductive adhesive film as well as a preparation method and application thereof. The anisotropic conductive adhesive film with the high capture rate is processed from the following raw materials in parts by weight: 20-40 parts of rubber, 5-20 parts of epoxy resin, 2-25 parts of an acrylate phosphate monomer, 1-10 parts of an initiator, 2-10 parts of insulating conductive particles and 5-40 parts of filling particles, the insulating conductive particles are conductive particles coated with a polymer insulating layer. According to the invention, the insulating conductive particle with a three-layer structure is adopted, and the outer layer is a polyacetylene polymer insulating layer. Due to the fact that double bonds exist in the polyacetylene outer layer, the polyacetylene outer layer can generate a synergistic effect with acrylate phosphate monomers introduced into a conductive adhesive formula system for linkage, the capture rate of conductive particles can be increased in the Bonding process, the poor appearance of a product is reduced, and performance improvement is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of anisotropic conductive adhesive films, and relates to an anisotropic conductive adhesive film with a high capture rate, a preparation method thereof and an application thereof. Background Art

[0002] Anisotropic Conductive Film (ACF) is mainly used for the interconnection of electronic components, especially the connection between flexible circuit boards (FPCs) and liquid crystal displays (LCDs), as well as other applications that require high-density, high-precision connections. Anisotropic conductive film is conductive in the vertical direction and insulating in the horizontal direction. This means that when pressure is applied in the vertical direction between two contact surfaces, the conductive particles form a conductive path at the contact point, while in other directions, the film itself remains insulating. Anisotropic conductive film plays an important role in the manufacture of modern electronic products due to its unique properties, especially in situations where high-density, high-reliability connections are required. ACF can achieve very fine pitch connections and is suitable for high-density circuit design. Due to its anisotropic characteristics, ACF can avoid unnecessary short circuits and improve the reliability of connections.

[0003] ACF is usually composed of an insulating resin substrate and conductive particles (such as gold balls, silver particles, carbon fibers, etc.) dispersed therein. The resin substrate provides the basic physical strength and adhesion of the film. The conductive particles are compressed when subjected to pressure, forming a conductive path at a specific contact point. When using ACF, it is usually placed between the two surfaces that need to be connected, and then the conductive particles are heated and pressurized to form a conductive connection at the contact point.

[0004] Therefore, the capture rate of ACF, that is, the probability of conductive particles successfully forming a conductive connection at a predetermined position when using ACF to connect electronic components, will directly affect the reliability of the connection and product quality. If the distribution of conductive particles in ACF is uneven, or if various parameters are not adjusted well during the hot pressing process, the compression degree and position stability of the conductive particles will be affected, resulting in insufficient conductive particles in some areas of the ACF to form an effective connection. At the same time, the ACF prepared in the prior art usually produces problems such as bubbles and uneven or even disappearing indentations caused by curing shrinkage during use.

[0005] In summary, those skilled in the art continue to develop a new type of anisotropic conductive adhesive film to improve the formulation and production technology of ACF to overcome the above problems. Summary of the invention

[0006] The present invention aims at the deficiencies of anisotropic conductive adhesive films in the prior art and provides an anisotropic conductive adhesive film with a high capture rate and a preparation method and application thereof.

[0007] One object of the present invention is achieved by the following technical solutions:

[0008] A high-capture rate anisotropic conductive adhesive film, which is processed from the following raw materials in parts by weight: 20-40 parts of rubber, 5-20 parts of epoxy resin, 2-25 parts of acrylate phosphate monomers, 1-10 parts of initiator, 2-10 parts of insulating conductive particles, and 5-40 parts of filling particles; the insulating conductive particles are conductive particles coated with a polymer insulating layer.

[0009] Acrylate phosphate is a compound containing phosphate groups and acrylate groups. The present invention cleverly utilizes acrylate phosphate monomers, which can stably coexist with epoxy resins under low temperature conditions, and react with epoxy resins under heating conditions to obtain new acrylic acid-containing epoxy ring-opening resins, which can improve the performance in high temperature and high humidity environments on the one hand, and have excellent performance compared with pure epoxy systems on the other hand; the entire process can effectively reduce shrinkage during cross-linking and curing due to the epoxy ring-opening reaction.

[0010] More preferably, the acrylate phosphate monomer includes one or more of KM2110, KM2120, KM2130, KM2140, KM2160, SIPOMER PAM100, and SIPOMER PAM200.

[0011] Preferably, the polymer insulating layer is a polyacetylene insulating layer.

[0012] Preferably, the conductive particles are polymer microspheres with a metal conductive layer coated on the surface.

[0013] Preferably, the polymer microspheres include one or more of polymethyl methacrylate elastic microspheres, polyaniline elastic microspheres, polystyrene elastic microspheres, polyacrylamide elastic microspheres, polyvinyl chloride elastic microspheres, and polyacrylonitrile elastic microspheres, and more preferably polymethyl methacrylate elastic microspheres.

[0014] Preferably, the metal-plated conductive layer includes one or more of a nickel layer, a gold layer, a copper layer, and a cobalt layer.

[0015] Preferably, the particle size of the insulating conductive particles is 0.5 to 20 μm.

[0016] Preferably, the preparation method of the insulating conductive particles comprises the following steps: surface treating the polymer microspheres coated with a metal conductive layer; adding the surface treated polymer microspheres and the polymer insulating layer material into a solvent and dispersing them uniformly by ultrasonic vibration; then adding 1 to 10 wt % of an emulsifier and 1 to 5 wt % of a surfactant, stirring and heating at 40 to 60° C., and obtaining the insulating conductive particles after washing and drying.

[0017] In the preparation method of the insulating conductive particles, preferably, the surface treatment includes passivation treatment with 70-99wt% concentrated sulfuric acid for 5-30 minutes. The passivation treatment can chemically change the surface of the polymer microspheres to form hydrogen bonds to enhance the bonding force between the conductive particles and the outer coating.

[0018] In the method for preparing the insulating conductive particles, preferably, the polymer insulating layer material is polyacetylene.

[0019] In the method for preparing the insulating conductive particles, preferably, the mass ratio of the polymer microspheres to the polymer insulating layer material is 1:(0.01-0.5).

[0020] In the method for preparing the insulating conductive particles, preferably, the solvent can be one or more of acetone, dimethylformamide, N,N-dimethylacetamide, tetrahydrofuran, dioctyl phthalate, and dibutyl phthalate.

[0021] In the preparation method of the insulating conductive particles, preferably, functional monomers are added to the polymer microspheres and the polymer insulating layer material during ultrasonic oscillation, including one or more of hydroxyethyl acrylate, butyl acrylate, methyl acrylate, acrylic acid isocyanate, and glycidyl acrylate. The mass ratio of the polymer microspheres to the functional monomers is 1:(0.1-0.3).

[0022] The addition of functionalized monomers can improve the surface properties of polymer microspheres, enhance the bonding between polyacetylene and microspheres, provide a uniformly distributed polymer insulating layer, and give the final product good electrical properties.

[0023] In the method for preparing the insulating conductive particles, preferably, the emulsifier comprises an aqueous solution of one or more of gelatin, lecithin and polyvinyl alcohol, with a concentration of 1 to 5 wt %.

[0024] In the method for preparing the insulating conductive particles, preferably, the surfactant comprises an aqueous solution of one or more of sodium dodecylbenzene sulfonate, sodium dodecyl sulfate, and hexadecyltrimethylammonium bromide, with a concentration of 1 to 5 wt%.

[0025] Preferably, the rubber is one or more of styrene-butadiene rubber or its modified substance, nitrile-butadiene rubber or its modified substance, chloroprene rubber or its modified substance, butadiene rubber or its modified substance, isoprene rubber or its modified substance.

[0026] Preferably, the epoxy resin includes one or more of glycidyl ether epoxy resin, glycidyl amine epoxy resin, and glycidyl ester epoxy resin.

[0027] Preferably, the glycidyl ether epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, and phenolic resin.

[0028] Preferably, the initiator is a thermal initiator, and the thermal initiator includes one or more of a peroxide initiator and an azo initiator.

[0029] Peroxide initiators include one or more of dibenzoyl peroxide, diisopropylbenzene hydroperoxide, diisopropylbenzene peroxide, tert-butyl hydroperoxide, and di-tert-butyl peroxide. Azo initiators include azobisisobutyronitrile and azobisisoheptylnitrile.

[0030] Preferably, the filler particles are one or more of silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide, and magnesium oxide. The filler particles play a role in adjusting the room-temperature modulus, viscosity, and curing modulus in the entire formula. The particle size and type have different effects on the above three, which leads to different performances of ACF in subsequent applications. By introducing different filler particles, the room-temperature modulus, viscosity, and curing modulus can be adaptively adjusted for different usage scenarios; the addition of filler particles can reduce curing shrinkage.

[0031] Preferably, the raw materials also include other auxiliary agents, and other auxiliary agents are not particularly limited, and any auxiliary agent that can be used in the anisotropic conductive adhesive film to modify the function can be used, and can be listed as colorants, adhesion promoters, antioxidants, and the like.

[0032] The high capture rate anisotropic conductive adhesive film of the present invention does not include a curing agent.

[0033] Another object of the present invention is achieved by the following technical solutions:

[0034] A method for preparing anisotropic conductive adhesive film with high capture rate, the method comprising the following steps: adding acrylate phosphate monomer, epoxy resin and rubber into a mixer in sequence and stirring evenly; adding filler particles to disperse and stirring evenly; finally adding insulating conductive particles and initiator to stir evenly to obtain a coating liquid for anisotropic conductive adhesive film with high capture rate; filtering the coating liquid and then coating it, and drying it to obtain the anisotropic conductive adhesive film with high capture rate.

[0035] Preferably, the stirring temperature is 20-30°C, and the coating temperature is 60-80°C.

[0036] Preferably, the solid content of the coating liquid is 30 to 60 wt %.

[0037] Another object of the present invention is achieved by the following technical solutions:

[0038] An application of an anisotropic conductive adhesive film with a high capture rate, the application comprising: arranging the anisotropic conductive adhesive film with a high capture rate between two electronic components, and then achieving bonding of the two electronic components through a curing process.

[0039] Preferably, the curing equipment is a Bonder equipment, the curing temperature is 130-180° C., the curing pressure is 0.5-10 MPa, and the curing time is 2-10 s.

[0040] Further preferably, after a curing treatment at a curing temperature of 150°C, a curing pressure of 3MPa, and a curing time of 4s, the obtained high capture rate anisotropic conductive adhesive film has a curing rate ≥85%, a bonding strength ≥1600gf / cm, and an on-resistance ≤0.9Ω.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] 1. The present invention provides a high capture rate anisotropic conductive adhesive film, which adopts a three-layer structure of insulating conductive particles, wherein the inner layer is polymer microspheres, the middle layer is a metal-plated conductive layer, and the outer layer is a polyacetylene polymer insulating layer. Due to the presence of double bonds in the outer layer of polyacetylene, it will produce a synergistic effect with the acrylate phosphate monomer introduced into the conductive adhesive formula system. Under the action of the initiator, the outer layer of polyacetylene will link with the acrylate phosphate monomer, thereby improving the dispersibility of the conductive particles in the system and improving the capture rate of the conductive particles during the bonding process.

[0043] 2. The present invention provides a high capture rate anisotropic conductive adhesive film, which combines the synergistic effect of multiple raw materials. By adding acrylate phosphate monomers, it can react with epoxy resin by adjusting the temperature without a curing agent to obtain a new acrylic acid-containing epoxy open-ring resin, thereby reducing costs, improving adhesion, and enhancing the bonding strength with the electrode; secondly, the acrylate phosphate monomer can react with the polymer insulating outer layer of the conductive particles to increase the capture rate and reduce bubbles; by adding epoxy resin, the shrinkage during the curing process is reduced, the poor appearance of the product is reduced, the indentation is clear, and the conductive performance is improved.

[0044] 3. The high capture rate anisotropic conductive adhesive film provided by the present invention cleverly utilizes acrylate phosphate monomers, which can stably coexist with epoxy resins under low temperature conditions, and react with epoxy resins under heating conditions to obtain new acrylic acid-containing epoxy ring-opened resins. On the one hand, the resin can improve the performance in high temperature and high humidity environments, and on the other hand, compared with pure epoxy systems, it has excellent performance; the entire process can effectively reduce shrinkage during cross-linking and curing due to the epoxy ring-opening reaction.

[0045] 4. The present invention provides a high capture rate anisotropic conductive adhesive film, which eliminates the use of thermosetting resin by adding acrylate phosphate monomers, thereby improving the curing rate, increasing the crosslinking density, and reducing the poor conduction caused by the increase of the Gap value after reliability. In addition, the use of acrylate phosphate monomers instead of thermosetting resin can make the false pressure adhesion better. The conductive adhesive film prepared in this way maintains excellent performance after reliability and has a wide range of applicability. DETAILED DESCRIPTION

[0046] The technical solution of the present invention is further described below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

[0047] The raw material sources of the following examples and comparative examples are as follows:

[0048] Conductive particles: nickel-plated polystyrene microspheres, average particle size 5 μm, Zhenjiang Aibang Ni-500;

[0049] The carboxyl-modified butadiene rubber was purchased from Sinopec, and the degree of carboxyl substitution was about 25%.

[0050] Example 1

[0051] The high capture rate anisotropic conductive film of this embodiment is made of raw materials including the following mass percentages: 30 parts of carboxyl-modified butadiene rubber, 13 parts of bisphenol A epoxy resin, 15 parts of acrylate phosphate monomer (KM2120), 30 parts of filler particles (aluminum oxide), 5 parts of initiator (dibenzoyl peroxide), and 6 parts of insulating conductive particles.

[0052] The preparation method of the insulating conductive particles of this embodiment includes the following steps: adding the conductive particles to concentrated sulfuric acid for passivation for 10 minutes, washing and drying with ethanol; adding 1g of the passivated conductive particles, 0.1g of polyacetylene and 0.1g of hydroxyethyl acrylate to 100ml of acetone for ultrasonic vibration and uniform dispersion; slowly adding 50ml of gelatin aqueous solution (1wt%), emulsifying under an anchor stirring paddle to obtain a uniform and stable emulsion; then slowly adding 50ml of sodium dodecylbenzene sulfonate aqueous solution (1wt%) and continuing to stir, heating to 55°C until the solvent is completely volatilized; after washing and drying, the polyacetylene-coated insulating conductive particles are obtained.

[0053] The preparation method of the high capture rate anisotropic conductive film of this embodiment includes the following steps: at room temperature, firstly, acrylate phosphate monomer, bisphenol A epoxy resin and carboxyl modified butadiene rubber are added to a mixer in sequence and stirred evenly; filler particles are added for dispersion and stirred evenly; finally, insulating conductive particles and initiator are added and stirred evenly to obtain a high capture rate anisotropic conductive film coating liquid (solid content is 50wt%); the coating liquid is filtered with a filter element, and then coated on a coater at a coating temperature of 70°C, and the ACF is dried to obtain a final high capture rate anisotropic conductive film with a thickness of 20μm.

[0054] Example 2

[0055] The high capture rate anisotropic conductive adhesive film of this embodiment is made of raw materials including the following mass percentages: 25 parts of carboxyl-modified butadiene rubber, 18 parts of bisphenol F epoxy resin, 10 parts of acrylate phosphate monomer (KM2110), 20 parts of filling particles (silicon dioxide), 4 parts of initiator (4 parts of diisopropylbenzene hydroperoxide), and 5 parts of insulating conductive particles.

[0056] The preparation method of the insulating conductive particles in this embodiment is the same as that in embodiment 1.

[0057] The preparation method of the high capture rate anisotropic conductive film of this embodiment includes the following steps: at room temperature, firstly, acrylate phosphate monomer, bisphenol F epoxy resin and carboxyl modified butadiene rubber are added to a mixer in sequence and stirred evenly; filler particles are added for dispersion and stirred evenly; finally, insulating conductive particles and initiator are added and stirred evenly to obtain a high capture rate anisotropic conductive film coating liquid (solid content is 45wt%); the coating liquid is filtered with a filter element, and then coated on a coater at a coating temperature of 70°C, and the ACF is dried to obtain a final high capture rate anisotropic conductive film with a thickness of 20μm.

[0058] Example 3

[0059] The high capture rate anisotropic conductive adhesive film of this embodiment is made of raw materials including the following mass percentages: 35 parts of carboxyl-modified butadiene rubber, 10 parts of bisphenol A epoxy resin, 18 parts of acrylate phosphate monomer (SIPOMER PAM100), 35 parts of filler particles (titanium dioxide), initiator (4 parts of dibenzoyl peroxide, 2 parts of diisopropylbenzene hydroperoxide), and 7 parts of insulating conductive particles.

[0060] The preparation method of the insulating conductive particles in this embodiment is the same as that in embodiment 1.

[0061] The preparation method of the high capture rate anisotropic conductive film of this embodiment includes the following steps: at room temperature, firstly, acrylate phosphate monomer, bisphenol A epoxy resin and carboxyl modified butadiene rubber are added to a mixer in sequence and stirred evenly; filler particles are added for dispersion and stirred evenly; finally, insulating conductive particles and initiator are added and stirred evenly to obtain a high capture rate anisotropic conductive film coating liquid (solid content is 55wt%); the coating liquid is filtered with a filter element, and then coated on a coater at a coating temperature of 70°C, and the ACF is dried to obtain a final high capture rate anisotropic conductive film with a thickness of 20μm.

[0062] Comparative Example 1

[0063] The difference between this comparative example and Example 1 is that no acrylate phosphate monomer is added, bisphenol A type epoxy resin and carboxyl modified butadiene rubber are added to the mixer in sequence and stirred evenly, and the rest is the same as Example 1.

[0064] Comparative Example 2

[0065] The difference between this comparative example and Example 1 is that no epoxy resin is added, and the acrylate phosphate monomer and the carboxyl-modified butadiene rubber are added to the mixer in sequence and stirred evenly, and the rest is the same as Example 1.

[0066] Comparative Example 3

[0067] The difference between this comparative example and Example 1 is that conductive particles without an outer polymer insulating layer are used, and the rest is the same as Example 1.

[0068] Comparative Example 4

[0069] The difference between this comparative example and Example 1 is that no acrylate phosphate monomer is added and conductive particles without an outer polymer insulating layer are used. The rest is the same as Example 1.

[0070] The anisotropic conductive adhesive films prepared in the examples and comparative examples were subjected to relevant performance tests, and the specific test results are shown in Table 1.

[0071] Table 1 Performance data of anisotropic conductive adhesive films of examples and comparative examples

[0072]

[0073]

[0074] *The higher the bubble score, the smaller the number of bubbles and the smaller the volume of bubbles. Bubbles >3 points are qualified, and no bubbles are 5 points;

[0075] *The higher the indentation score, the more uniform and stronger the indentation mark.

[0076] As shown in Table 1, it can be seen from Examples 1 to 3 and Comparative Examples 1 to 2 that the high capture rate anisotropic conductive adhesive film prepared within the technical solution of the present invention can effectively reduce the generation of bubbles during the curing process, reduce the poor appearance of the product, and make the indentation clearer, and has good bonding strength and on-resistance and excellent curing rate, and the stability and reliability are effectively improved.

[0077] It can be seen from Examples 1 to 3 and Comparative Examples 3 to 4 that the high capture rate anisotropic conductive adhesive film prepared by using polyacetylene-coated insulating conductive particles of the present invention has excellent particle capture performance, while the anisotropic conductive adhesive film prepared by using conventional conductive particles in Comparative Example 3 not only has a slight decrease in overall performance, but also has a very low capture capacity for conductive particles; in Comparative Example 4, when conventional conductive particles are used and there is no acrylate phosphate monomer, the overall performance is very poor.

[0078] It can be seen from Comparative Example 1 and Comparative Examples 3 to 4 that, compared with Comparative Example 4, although conductive particles containing an outer polymer insulating layer are added in Comparative Example 1, the conductive adhesive system does not contain acrylate phosphate monomers, and the double bonds in the outer layer of polyacetylene cannot react with the monomers, resulting in little or no improvement in the performance of the anisotropic conductive adhesive film even if conductive particles containing an outer polymer insulating layer are added. This further proves that the acrylate phosphate monomer introduced in the present invention can produce a synergistic effect with the conductive particles containing an outer polymer insulating layer to improve the comprehensive performance of the anisotropic conductive adhesive film.

[0079] The various aspects, embodiments, and features of the present invention should be considered to be illustrative in all aspects and not limiting of the present invention, the scope of which is defined solely by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.

[0080] In the preparation method of the present invention, the order of each step is not limited to the order listed. For those skilled in the art, without creative work, the order of each step is also within the protection scope of the present invention. In addition, two or more steps or actions can be performed simultaneously.

[0081] Finally, it should be noted that the specific embodiments described herein are merely examples of the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art of the present invention may make various modifications or supplements to the specific embodiments described, or replace them in a similar manner. It is not necessary and impossible to provide all examples of all implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still fall within the scope of protection of the present invention, and interpreting them as any additional limitation is contrary to the spirit of the present invention.

Claims

1. A high capture rate anisotropic conductive film, characterized in that: The high capture rate anisotropic conductive adhesive film is processed from the following raw materials in parts by weight: 20-40 parts of rubber, 5-20 parts of epoxy resin, 2-25 parts of acrylate phosphate monomer, 1-10 parts of initiator, 2-10 parts of insulating conductive particles, and 5-40 parts of filling particles; The insulated conductive particles are conductive particles coated with a polymer insulating layer.

2. The high capture rate anisotropic conductive adhesive film according to claim 1, characterized in that: The polymer insulating layer is a polyacetylene insulating layer; the conductive particles are polymer microspheres with a metal conductive layer plated on the surface.

3. The high capture rate anisotropic conductive adhesive film according to claim 1, characterized in that: The preparation method of the insulating conductive particles comprises the following steps: surface treating polymer microspheres coated with a metal conductive layer; adding the surface treated polymer microspheres and the polymer insulating layer material into a solvent and dispersing them uniformly by ultrasonic vibration; then adding 1 to 10 wt % of an emulsifier and 1 to 5 wt % of a surfactant, stirring and heating at 40 to 60° C., and washing and drying to obtain the insulating conductive particles.

4. The high capture rate anisotropic conductive adhesive film according to claim 3, characterized in that: The mass ratio of the polymer microspheres to the polymer insulating layer material is 1:(0.01-0.5).

5. The high capture rate anisotropic conductive adhesive film according to claim 3, characterized in that: Functionalized monomers are added to the polymer microspheres and the polymer insulating layer materials during ultrasonic oscillation, including one or more of hydroxyethyl acrylate, butyl acrylate, methyl acrylate, acrylic isocyanate, and glycidyl acrylate; the mass ratio of the polymer microspheres to the functionalized monomers is 1:(0.1-0.3).

6. The high capture rate anisotropic conductive adhesive film according to claim 1, characterized in that: The acrylate phosphate monomer includes one or more of KM2110, KM2120, KM2130, KM2140, KM2160, SIPOMER PAM100, and SIPOMER PAM200.

7. The high capture rate anisotropic conductive adhesive film according to claim 1, characterized in that: The rubber is one or more of styrene-butadiene rubber or its modified substance, nitrile-butadiene rubber or its modified substance, chloroprene rubber or its modified substance, butadiene rubber or its modified substance, isoprene rubber or its modified substance; And / or, the epoxy resin includes one or more of glycidyl ether epoxy resin, glycidyl amine epoxy resin, and glycidyl ester epoxy resin; And / or, the initiator is a thermal initiator, and the thermal initiator includes one or more of a peroxide initiator and an azo initiator; And / or, the filling particles are one or more of silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide, and magnesium oxide.

8. The method for preparing a high capture rate anisotropic conductive adhesive film according to any one of claims 1 to 7, characterized in that: The preparation method comprises the following steps: adding acrylate phosphate monomer, epoxy resin and rubber into a mixer in sequence and stirring evenly; adding filler particles to disperse and stirring evenly; finally adding insulating conductive particles and initiator to stir evenly to obtain a high capture rate anisotropic conductive adhesive film coating liquid; filtering the coating liquid and then coating it, and drying it to obtain the high capture rate anisotropic conductive adhesive film.

9. The use of a high capture rate anisotropic conductive film according to any one of claims 1 to 7, characterized in that: The application includes: arranging the anisotropic conductive adhesive film between two electronic components, and then achieving the bonding of the two electronic components through a curing process.

10. The use according to claim 9, characterized in that: The curing temperature is 130-180° C., the curing pressure is 0.5-10 MPa, and the curing time is 2-10 seconds.

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